Electrical connection apparatus and manufacturing process therefor

Abstract

The present disclosure relates to the technical field of electrical connection, and in particular to an electrical connection apparatus and a manufacturing process therefor. The electrical connection apparatus comprises: a contact portion and a connection portion connected to each other, wherein at least part region of the contact portion is a contact region connected to an electrical apparatus, and at least part region of the connection portion is a connection region connected to a wire; a surface of the electrical connection apparatus is electroplated with a bottom plating, a surface of the contact region on the bottom plating is electroplated with a surface plating, and the region of the electrical connection apparatus other than the surface of the contact region and the surface of the connection region is provided with an insulating coating. In the technical solution, by using a partial-plating method instead of electroplating the entire surface of an apparatus with a surface plating, the usage amount of precious metals is significantly reduced, and the production costs are effectively reduced, thereby solving the problem of excessive waste of precious metals and relatively high production costs caused by plating the entire surface of an electrical connection apparatus.

Description

An electrical connection device and a manufacturing process thereof

[0001] Related applications

[0002] The present application claims priority to Chinese Patent Application No. 202410964033.1, filed on July 18, 2024, and incorporates by reference the entire disclosure of the aforementioned patent application as part of the present application. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of electrical connection, and in particular to an electrical connection device and a manufacturing process thereof. BACKGROUND

[0004] Generally, an electrical connection device is provided with a plating layer on its surface by means of overall electroplating or chemical plating before use, so as to meet the needs of electrical connection with an electrical device and wire connection.

[0005] The conventional method is to provide a plating layer on the surface of the electrical connection device as a whole, but this method causes the non-functional area or the area without a plating layer of the electrical connection device to also be provided with a plating layer, and the area is large, which results in serious waste of noble metal and high production cost. SUMMARY

[0006] The embodiments of the present disclosure provide an electrical connection device and a manufacturing process thereof to at least partially solve the problem of serious waste of noble metal and high production cost caused by overall plating on the surface of the electrical connection device.

[0007] The specific technical solutions provided by the embodiments of the present disclosure are as follows:

[0008] The first aspect of the embodiments of the present disclosure provides an electrical connection device for connecting an electrical device and a wire and transmitting electrical energy, comprising a contact part and a connection part connected to each other, at least part of the area of the contact part is a contact area for connecting with the electrical device, and at least part of the area of the connection part is a connection area for connecting with the wire; the surface of the electrical connection device is electroplated with a bottom layer plating layer, the surface of the contact area is electroplated with a surface layer plating layer on the surface of the bottom layer plating layer, and the area of the electrical connection device except the surface of the contact area and the surface of the connection area is provided with an insulating coating.

[0009] Optionally, the melting point of the insulating coating is greater than the working environment temperature during electroplating.

[0010] Optionally, when the surface layer plating layer and the insulating coating are located on the same surface of the electrical connection device, the surface of the surface layer plating layer is higher than the surface of the insulating coating.

[0011] Optionally, a corrosion-resistant coating is arranged on the boundary between the surface layer and the insulating coating.

[0012] Optionally, the contact part is a plate structure, and a connecting hole is arranged through the plate structure, and the contact area is at least part of the surface of the inner wall of the connecting hole and the contact part near both ends of the connecting hole.

[0013] Optionally, the connecting part is a plate structure, and the connecting area is one side in contact with the wire or one end in contact with the wire.

[0014] Optionally, the contact part is a cylindrical structure, and the contact area is at least part of the inner wall surface of the cylindrical structure.

[0015] Optionally, the connecting part is a cylindrical structure or a U-shaped structure, and the connecting area is at least part of the inner wall surface of the cylindrical structure or at least part of the inner surface of the U-shaped structure.

[0016] Optionally, a transition part is arranged between the contact part and the connecting part, and the insulating coating includes a general coating and a temperature-resistant coating, and the temperature-resistant coating is arranged on the surface of the transition part and / or part of the surface of the connecting part.

[0017] Optionally, the melting point of the temperature-resistant coating is greater than the melting point of the general coating.

[0018] According to a second aspect of the present disclosure, a manufacturing process of an electrical connection device is provided, including the following steps:

[0019] S10, electroplating, electroplating the base layer on the surface of the electrical connection device;

[0020] S20, determining a contact area on the electrical connection device, and arranging a first shielding layer on the contact area and a second shielding layer on the connecting area;

[0021] S30, arranging the insulating coating on the surface of the electrical connection device;

[0022] S40, removing the first shielding layer to expose the contact area, and retaining the second shielding layer

[0023] S50, electroplating, electroplating the surface layer on the surface of the contact area;

[0024] S60, removing the second shielding layer to expose the connecting area.

[0025] Optionally, before the step S10, there is a step S05: a pretreatment process, and the pretreatment process includes ultrasonic degreasing, alkali etching and acid etching performed on the electrical connection device in sequence.

[0026] Optionally, the first shielding layer has a melting point lower than 100℃, and the first shielding layer is removed by placing the electrical connection device in hot water in step S40.

[0027] Optionally, the second shielding layer and the insulating coating have a melting point greater than the working environment temperature during electroplating.

[0028] Optionally, the insulating coating has a melting point greater than the melting point of the second shielding layer, and the second shielding layer is melted and removed by placing the electrical connection device in an environment with a temperature greater than the melting point of the second shielding layer but less than the melting point of the insulating coating in step S60.

[0029] Optionally, a transition portion is further arranged between the contact portion and the connection portion, and a third shielding layer is arranged on the surface of the transition portion in step S10, and the third shielding layer is removed to expose the surface of the transition portion in step S25 after step S20, and a temperature-resistant coating is arranged on the surface of the transition portion.

[0030] Optionally, the third shielding layer has a melting point greater than the working environment temperature during electroplating and less than the melting point of the ordinary coating.

[0031] Optionally, a corrosion-resistant coating is further arranged on the boundary between the surface layer plating layer and the insulating coating in step S70 after step S60.

[0032] The beneficial effects of the embodiments of the present disclosure are as follows:

[0033] By electroplating the surface layer plating layer on the contact area of the electrical connection device, the stability of signal transmission and power transmission between the electrical connection device and the electrical device is improved, the insulating coating arranged on the area other than the contact area and the connection area can effectively prevent electrical short circuit, electric leakage and corrosion of the electrical connection device, and by adopting the local plating manner instead of electroplating the surface layer plating layer on the entire device, the use amount of noble metal is significantly reduced, and the production cost is effectively reduced, thereby solving the problem of serious waste of noble metal and high production cost caused by electroplating the surface layer plating layer on the entire surface of the electrical connection device. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0035] FIG. 1 is a structural schematic view of a chip-type electrical connection device in an embodiment of the present disclosure;

[0036] Fig. 2 is a schematic diagram of a partial cross-sectional structure of a chip electric connection device according to an embodiment of the present disclosure;

[0037] Fig. 3 is a schematic diagram of an enlarged structure of part A in Fig. 2;

[0038] Fig. 4 is a schematic diagram of a top view of a chip electric connection device according to an embodiment of the present disclosure;

[0039] Fig. 5 is a schematic diagram of an overall structure of a contact part in a cylindrical structure according to an embodiment of the present disclosure;

[0040] Fig. 6 is a schematic diagram of a structure in which a transition part of a chip electric connection device cooperates with a temperature-resistant coating;

[0041] Fig. 7 is a flowchart of a manufacturing process of an electric connection device;

[0042] Fig. 8 is a flowchart of a manufacturing process of a connection part in which an entire surface is a connection area;

[0043] Fig. 9 is a flowchart of a manufacturing process of a connection part in which a partial surface is a connection area;

[0044] Fig. 10 is a flowchart of a manufacturing process of a connection part in which an entire surface is a connection area and a transition part is provided;

[0045] Fig. 11 is a flowchart of a manufacturing process of a connection part in which a partial surface is a connection area and a transition part is provided.

[0046] Reference signs: 1, contact part; 101, contact area; 102, connection hole; 2, connection part; 201, connection area; 3, bottom layer plating; 4, surface layer plating; 5, insulating coating; 501, ordinary coating; 502, temperature-resistant coating; 6, anticorrosion coating; 7, transition part. DETAILED DESCRIPTION

[0047] The preferred embodiments of the present disclosure are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure, and the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0048] A first aspect of the present embodiment provides an electric connection device for connecting an electrical device and a wire and transmitting electric energy, as shown in Figs. 1 to 7, which comprises a contact part 1 and a connection part 2 connected to each other. At least part of the contact part 1 is a contact area 101 for connecting with the electrical device, and at least part of the connection part 2 is a connection area 201 for connecting with the wire. The surface of the electric connection device is plated with a bottom layer plating 3, the surface of the contact area 101 is plated with a surface layer plating 4 on the surface of the bottom layer plating 3, and an area other than the surface of the contact area 101 and the surface of the connection area 201 on the electric connection device is provided with an insulating coating 5.

[0049] In this embodiment, the material of the electrical connection device is generally copper or copper alloy, aluminum or aluminum alloy. The contact part 1 and the connecting part 2 can be integrally formed, which improves the structural stability and reliability of the entire electrical connection device; at the same time, it also helps to maintain good contact between the contact part 1 and the connecting part 2, reducing the contact resistance caused by poor contact. Low contact resistance means more efficient transmission of electrical energy, reducing energy loss and heating phenomenon. Among them, the contact area 101 on the contact part 1 is the part that directly contacts the electrical device in the electrical connection device, responsible for transmitting electrical energy from the electrical device to the electrical connection device; the connecting area 201 is the area for connecting the wire, ensuring that the wire can be firmly and reliably connected to the device, thereby realizing the transmission of electrical energy. The connecting area 201 can be connected with the wire in various ways such as threading, crimping, welding, etc., and the specific design can be made according to actual needs, which is not limited here.

[0050] The bottom layer plating layer 3 plated on the entire surface of the electrical connection device provides a protective barrier for the entire electrical connection device, and the bottom layer plating layer 3 is usually made of metals such as nickel (Ni) and copper (Cu) that have good corrosion resistance and electrical conductivity. It can prevent the electrical connection device from being directly contacted with air, moisture or other corrosive substances, thereby slowing down the corrosion process and prolonging the service life of the electrical connection device. It should be noted that the thickness of the bottom layer plating layer 3 can be set between 20-30 μm, and the plating layer within this thickness range can provide good corrosion resistance, wear resistance, heat resistance and other properties. In other embodiments, the thickness of the plating layer can be set according to actual needs, which is not limited here.

[0051] The surface layer plating layer 4 plated on the surface of the bottom layer plating layer 3 of the contact area 101 not only has the advantages of the above-mentioned bottom layer plating layer 3, but also improves the hardness and wear resistance of the contact surface to reduce the contact resistance and prevent poor contact caused by friction and wear. The surface layer plating layer 4 can be made of noble metals such as silver (Ag) and platinum (Pt), which have excellent electrical conductivity and corrosion resistance, can significantly improve the contact performance, and further reduce the contact resistance, thereby improving the transmission efficiency of electrical energy. It should be noted that the thickness of the surface layer plating layer 4 can be set between 3-6 μm, and the plating layer within this thickness range can provide higher electrical connection and mechanical connection performance, while also meeting certain cost requirements. In other embodiments, the thickness of the plating layer can be set according to actual needs, which is not limited here.

[0052] For electrical safety considerations, an insulating coating 5 is provided on the electrical connection device in areas other than the contact region 101 and the connection region 201. The insulating coating 5 should be made of a material with good insulating properties, weather resistance and mechanical strength to ensure the stability and reliability of the electrical connection. The specific selection can refer to the materials of the insulating coating 5 to be proposed below. It can be coated on the electrical connection device by various process methods such as spraying, dipping, etc., which is simple to operate and can improve work efficiency.

[0053] In actual production, the contact region 101 and the connection region 201 of the electrical connection device are first determined, then the surface of the electrical connection device is electroplated with a base layer 3, then the surface of the contact region 101 is electroplated with a surface layer 4, and finally the insulating coating 5 is provided in areas other than the surface of the contact region 101 and the surface of the connection region 201, thereby completing the production of the electrical connection device.

[0054] Through the above technical solution, by electroplating the surface layer 4 on the contact region 101 of the electrical connection device, the stability of signal transmission and electrical energy transmission between the electrical device is improved. The insulating coating 5 provided in areas other than the contact region 101 and the connection region 201 can effectively prevent electrical short circuit, electric leakage and corrosion of the electrical connection device. By using a local plating method instead of electroplating the surface layer 4 on the entire device surface, the use of precious metals is significantly reduced, and the production cost is effectively reduced, thereby solving the problem of serious waste of precious metals and high production cost caused by plating the entire surface of the electrical connection device.

[0055] In some embodiments, the melting point of the insulating coating 5 is greater than the working environment temperature during electroplating. During the electroplating process, the temperature of the working environment may increase due to equipment operation, chemical reaction and other factors. The working temperature during electroplating is generally 60-70°C. If the melting point of the insulating coating 5 is lower than this temperature, the insulating coating 5 may soften, fall off, melt or even fail, thereby failing to effectively protect the plating layer and the electrical connection device from high temperature damage. Therefore, the insulating coating 5 can be made of a material with a melting point much higher than the working environment temperature. In this way, the insulating properties of the insulating coating 5 can be ensured at high temperatures, preventing insulation failure due to temperature rise. At the same time, process fluctuations caused by temperature changes can be reduced, improving the stability and reliability of the electroplating process. In addition, the insulating coating 5 with high melting point has better durability and stability, which can reduce the cost of equipment maintenance and replacement caused by failure of the insulating coating 5.

[0056] In some embodiments, referring to Figures 1-3, when the surface plating layer 4 and the insulating coating layer 5 are located on the same side of the electrical connection device, the surface of the surface plating layer 4 is higher than the surface of the insulating coating layer 5. The surface plating layer 4 generally has good electrical conductivity, and by designing it to be higher than the insulating coating layer 5, the main contact points and conductive parts of the electrical connection device can be ensured not to be covered by the insulating coating layer 5, thereby maintaining high efficiency of electrical conduction. In addition, by making the surface plating layer 4 higher than the insulating coating layer 5, the conductive and non-conductive parts can be clearly defined, which can avoid accidental contact with the conductive parts for operating and maintenance personnel, thereby improving work safety. At the same time, it is also helpful to more easily identify and adjust the connection points during assembly and debugging, thereby improving work efficiency. It should be noted that a boss structure can be designed in the contact area 101 when the electrical connection device is punched, so that during plating, the surface of the surface plating layer 4 can be more accurately made higher than the surface of the insulating coating layer 5.

[0057] In some embodiments, referring to Figures 1-3, at the interface area between the surface plating layer 4 and the insulating coating layer 5, a corrosion-resistant coating layer 6 is further provided to cover the boundary between the surface plating layer 4 and the insulating coating layer 5, in other words, the position where the surface plating layer 4 contacts the insulating coating layer 5 is covered by the corrosion-resistant coating layer 6. The interface area is often the starting point of coating failure, because there may be differences in physical and chemical properties between the coating and the plating. The corrosion-resistant coating layer 6 can act as a "bridge" between the surface plating layer 4 and the insulating coating layer 5, which can reduce interface problems such as peeling and blistering caused by mismatch between the coating and the plating, and through its good adhesion and compatibility, it can enhance the bonding force between the insulating coating layer 5 and the surface plating layer, making the entire coating system more stable and reliable. Moreover, the corrosion-resistant coating layer 6 also provides an effective protective layer for the surface plating layer 4 and the insulating coating layer 5, which can effectively block water, oxygen, corrosive gases and other media from directly contacting the electrical connection device, thereby slowing down or preventing the corrosion process from occurring. It can significantly enhance the corrosion resistance of the entire electrical connection device and prolong its service life. In addition, the provision of the corrosion-resistant coating layer 6 makes it easier to detect potential problems at the interface area during inspection and maintenance. Once signs of coating damage or corrosion are found, timely repair or replacement can be performed to avoid the problem from getting worse. The presence of the corrosion-resistant coating layer 6 enhances the durability of the entire coating system, thereby extending the replacement cycle of the electrical connection device and reducing maintenance costs.

[0058] It should be noted that in this embodiment, the material of the corrosion-resistant coating layer 6 can be epoxy resin, which has excellent mechanical properties and adhesion strength to metal substrates, and can effectively block water, oxygen, corrosive gases and other media from directly contacting the electrical connection device, thereby slowing down or preventing the corrosion process from occurring. In other embodiments, isocyanate or silyl ester materials can also be used, which can be set according to actual needs without any limitation.

[0059] In some embodiments, referring to FIG. 1, FIG. 2 and FIG. 4, the contact part 1 can be a plate structure with connection holes 102 passing through it, and the contact area 101 is the inner wall of the connection holes 102 and at least part of the surface of the contact part 1 near both ends of the connection holes 102. The plate structure of the contact part 1 is more mechanically stable and can withstand greater stress and pressure. In dynamic working conditions such as plugging and vibration, such design can reduce the risk of deformation and damage of the contact part 1, ensuring the stability and durability of the electrical connection. The inner wall of the connection hole 102 and the surface of the contact part 1 at both ends form the contact area 101, which significantly increases the contact area compared to a single contact surface. The increase in contact area means more current channels and more stable electrical contact, thereby improving the reliability of the contact. At the same time, the contact area 101 is convenient for visual inspection and maintenance, and when problems are found, it is easier to locate the fault point and take appropriate maintenance measures.

[0060] In some embodiments, referring to FIG. 1, FIG. 2 and FIG. 4, the connection part 2 can be a plate structure, and the connection area 201 is the side or end that contacts the wire. The plate structure can provide a larger contact area, which helps to reduce contact resistance, improve current transmission efficiency, and reduce energy loss in electrical connections. The plate structure design also has good rigidity and stability, which can resist deformation and displacement under external forces. In working conditions that require certain mechanical stress or vibration, such design can ensure stable connection between the wire and the connection part 2, preventing failure due to loosening or falling off. In addition, when current passes through, the connection part 2 will generate some heat, and the plate structure has a large surface area that can effectively dissipate heat to the surrounding environment, thereby maintaining a lower operating temperature and extending the service life.

[0061] In some embodiments, as shown in FIG. 5, the contact part 1 can be a cylindrical structure, and the contact area 101 is at least part of the inner wall surface of the cylindrical structure. The inner wall surface of the cylindrical structure provides a longer contact path, thereby increasing the contact area with the wire or other connecting parts. This helps to reduce contact resistance, improve the efficiency and stability of current or signal transmission, and reduce energy loss and heat generation. The cylindrical structure can better wrap around the plug-in part of the electrical device, forming a kind of "male and female terminal" matching relationship. This matching method can increase the tightness and stability of the connection, preventing loosening or falling off due to external factors such as vibration, impact or temperature changes. In addition, the cylindrical structure has good guidance, making it easier to achieve accurate alignment during installation, reducing installation difficulty and improving work efficiency. Moreover, in some working conditions that require waterproof and dustproof, the cylindrical structure can be sealed (such as using a sealing ring, sealing glue, etc.) to prevent water and dust from entering the contact part 1, thereby protecting the safety and reliability of the electrical connection.

[0062] In some embodiments, the connecting portion 2 can be a cylindrical structure or a U-shaped structure, and the connecting area 201 is at least part of the inner wall surface of the cylindrical structure or the inner surface of the U-shaped structure. Both the cylindrical structure and the U-shaped structure have strong adaptability and flexibility, and can be adapted to connect wires of various shapes and sizes. The cylindrical structure can provide a wrapped tight connection as mentioned above, while the U-shaped structure can provide a more flexible connection direction and spatial layout under certain working conditions. Moreover, by setting the connecting area 201 as the inner wall surface or inner surface part of the cylindrical structure and the U-shaped structure, the contact area and contact quality of the electrical connection can be more effectively controlled. This helps to reduce the contact resistance, improve the transmission efficiency of the current or signal, and reduce the problems of energy loss and heating caused by poor contact.

[0063] In some embodiments, referring to FIGS. 5 and 6, a transition portion 7 can also be provided between the contact portion 1 and the connecting portion 2, and the insulating coating 5 includes a general coating 501 and a temperature-resistant coating 502, and the temperature-resistant coating 502 is arranged on the surface of the transition portion 5 and / or part of the surface of the connecting portion 2. The provision of the transition portion 7 helps to disperse and withstand the stress deformation from the connecting portion 2 and the contact portion 1, reduces the structural damage that may be caused by direct connection, and increases the stability and reliability of the overall structure. At the same time, it is also helpful to flexibly adjust the connection direction.

[0064] In this embodiment, based on its good insulation performance and cost-effectiveness considerations, the general coating 501 is used on the contact portion 1, which is usually in direct contact with the electrical device, and therefore requires good insulation performance to ensure the safe operation of the circuit. The general coating 501 can meet this demand while keeping a low cost. Since instant high temperature will be generated during the spot welding connection between the connecting portion 2 and the wire, such high temperature will cause damage or melting to the adjacent general coating 501, thereby affecting the insulation and overall safety of the connection. Therefore, the temperature-resistant coating 502 is used on the connecting portion 2, which not only provides basic insulation performance, but also effectively isolates the direct effect of high temperature on the general coating 501, prevents the melting of the general coating 501, and ensures the insulation of the connection.

[0065] Because the integrity of the insulating coating 5 is crucial to prevent safety problems such as electrical short circuit and electric shock. Once the insulating coating 5 is damaged, it will cause serious safety hazards. The protective effect of the temperature-resistant coating 502 on the general coating 501 makes these problems avoidable, thereby prolonging the service life of the entire connection structure.

[0066] It should be noted that in the present embodiment, referring to FIGS. 5 and 6, the connecting area 201 can be the entire surface of the connecting portion 2, at this time, the temperature-resistant coating 502 is arranged on the transition portion 7, which can avoid the high temperature generated when the wire is welded to the connecting portion 2 from affecting the ordinary coating 501 arranged on the contact portion 1. Referring to FIGS. 4 and 5, the connecting area 201 can also be part of the surface of the connecting portion 2. If the connecting area 201 is arranged in this way, the temperature-resistant coating 502 on the transition portion 7 should extend to the area on the connecting portion 2 except the surface of the connecting area 201, which further avoids the direct action of the high temperature during welding on the ordinary coating 501, preventing the melting of the ordinary coating 501. At the same time, in the electrical connection, additional insulation protection can also be provided to prevent current leakage in unintended paths, ensuring the safety and stability of the electrical system.

[0067] In some embodiments, the melting point of the temperature-resistant coating 502 is greater than that of the ordinary coating 501. In the present embodiment, the material of the ordinary coating 501 can be epoxy vinyl alcohol resin, which has a melting point of 130-150°C, good insulation performance, weather resistance and mechanical strength, can prevent current from flowing in unintended paths, reduce the risk of short circuit and electric shock; has high hardness and wear resistance, ensuring the stability and reliability of the electrical connection. In addition, the epoxy vinyl alcohol resin also has good fluidity and processability, which can be coated on the electrical connection device through various process methods such as spraying and dipping, simple operation, which can improve work efficiency. The material of the temperature-resistant coating 502 can be polytetrafluoroethylene, which has high temperature resistance, excellent insulation and corrosion resistance, with a melting point of 327°C, which can meet the requirements in high temperature environment; can maintain stable insulation performance in high temperature and high humidity environment; and can resist the corrosion of corrosive substances such as acid, alkali and salt. In other embodiments, the temperature-resistant coating 502 can also be made of other materials, which can be set according to actual needs, without any limitation. The high melting point of the temperature-resistant coating 502 makes it stable in high temperature environment and not easy to melt or fail. The temperature-resistant coating 502 can effectively isolate the direct action of the instantaneous high temperature generated during the spot welding connection of the connecting portion 2 and the wire on the ordinary coating 501, preventing the melting of the ordinary coating 501.

[0068] The second aspect of the present disclosure provides a manufacturing process of an electrical connection device, as shown in FIG. 7, which includes the following steps:

[0069] S10, electroplating, electroplating a base layer 3 on the surface of the electrical connection device;

[0070] S20, determining the contact area 101 on the electrical connection device, and arranging a first shielding layer on the contact area 101 and a second shielding layer on the connecting area 201;

[0071] S30, setting an insulating coating 5 on the surface of the electrical connection device;

[0072] S40, removing the first shielding layer to expose the contact area 101, and retaining the second shielding layer

[0073] S50, electroplating a surface layer plating layer 4 on the surface of the contact area 101;

[0074] S60, removing the second shielding layer to expose the connection area 201.

[0075] In S10, a bottom layer plating layer 3 is electroplated on the entire surface of the electrical connection device by electroplating process, providing excellent protection performance for the electrical connection device. The bottom layer plating layer 3 has excellent passivation ability, can quickly form an extremely thin passivation film on the surface of the substrate, can resist corrosion of atmosphere, alkali and some acids, and can ensure the basic conductivity, corrosion resistance and weldability of the entire device, providing a good foundation for subsequent processing.

[0076] It should be noted that the electroplating process is to attach a metal film to the entire surface of the electrical connection device by electrolysis to form a bottom layer plating layer 3, which can prevent the electrical connection device from being rusted, improve its wear resistance, conductivity, reflectivity, corrosion resistance and aesthetics, etc.

[0077] In S20, after the contact area 101 and the connection area 201 are determined, first and second shielding layers are respectively set on the contact area 101 and the connection area 201. The setting of the shielding layer can accurately control the application area of the plating layer, avoid unnecessary waste of the plating layer, and at the same time ensure the protection and function realization of the key area.

[0078] In S30, an insulating coating 5 is set on the entire surface of the electrical connection device (except the part covered by the shielding layer), which is used to protect the non-conductive area, prevent safety hazards such as short circuit and electric shock, improve the safety of the device, and ensure the insulation performance of the non-conductive area.

[0079] In S40, the first shielding layer on the contact area 101 is removed to expose the area that needs to be electroplated with a surface layer plating layer 4, so that the contact area 101 can be electroplated in the next step, and the surface layer plating layer 4 can be directly attached to the contact area 101. The second shielding layer is retained to avoid forming a surface layer plating layer 4 on the connection area 201, which causes waste.

[0080] In S50, a surface layer plating layer 4 is electroplated on the surface of the contact area 101 by electroplating process, which can further improve the conductivity efficiency, wear resistance and corrosion resistance of the contact area 101, and prolong its service life.

[0081] In S60, the second shielding layer on the connecting area 201 is removed, and the area needing to be connected with other components is exposed, thus providing a clear connecting interface for the connecting area 201 and ensuring reliable connection with other components.

[0082] Specifically, referring to FIGS. 1 and 2, taking a chip-type electrical connecting device as an example, in S10, an electroplating process is adopted to design a bottom layer plating layer 3 of electroplated nickel (Ni) on the entire surface of the electrical connecting device, and the thickness of the bottom layer plating layer 3 is 25-30 μm. It should be understood that, if the electrical connecting device is a charging base slot electrical connecting device, as shown in FIG. 5, the inner and outer surfaces thereof are designed with the bottom layer plating layer 3, and the thickness of the bottom layer plating layer 3 is 3-5 μm.

[0083] In S20, the first shielding layer can be paraffin wax, and the melting point thereof is 47-64℃. The coating process of the first shielding layer includes:

[0084] (1) The electrical connecting device is placed in an A mold and fixed, and only the contact area 101 to be electroplated is exposed in the A mold;

[0085] (2) The paraffin wax is injected into the A mold and coated on the exposed contact area 101;

[0086] (3) The paraffin wax is cooled for 10 minutes to make it solidify;

[0087] (4) The paraffin wax overflowing from the A mold is removed by using a knife, so that the entire first shielding layer is evenly covered;

[0088] (5) The A mold is removed.

[0089] Thus, the covering of the first shielding layer is completed.

[0090] The second shielding layer can be epoxy vinyl ether resin, and the melting point thereof is 90-110℃. The coating process of the second shielding layer includes:

[0091] (1) The electrical connecting device is placed in a B mold and fixed, and the entire contact part 1 is shielded by the B mold, so that the entire connecting part 2 is exposed;

[0092] (2) The epoxy vinyl ether resin powder is sprayed on the exposed connecting area 201 in the B mold;

[0093] (3) After the spraying is completed, the B mold is removed;

[0094] (4) A hanging point is set at the side ridge position of the connecting part 2, and the epoxy vinyl ether resin at the hanging point position is removed;

[0095] (5) The electrical connecting device is placed in a curing oven, and after being baked at 115℃ for 30 minutes, the temperature is lowered to 60℃ to make the second shielding layer solidify for 1 hour, and then the temperature is lowered to room temperature.

[0096] At this point, the covering of the second shielding layer is completed.

[0097] It should be noted that before the electrical connection device is placed into the curing oven, the contact area 101 needs to be protected by using a mold to avoid the first shielding layer from melting and flowing away during the melting and curing of the second shielding layer, thus causing the first shielding layer to lose its effect.

[0098] In S30, the insulating coating 5 includes a common coating 501 and a temperature-resistant coating 502. When the contact area 201 of the electrical connection device is the entire surface of the connecting portion 2, as shown in FIG. 8, in step S30', the common coating 501 is provided on the contact portion 1 except for the surface of the contact area 101. The coating process of the common coating 501 includes:

[0099] (1) The electrical connection device with the first shielding layer coated is placed into a C mold and fixed, the C mold shields the entire contact area 201, so that the entire contact portion 1 and the connecting portion 2 except for the contact area 201 are completely exposed;

[0100] (2) The exposed contact portion 1 of the C mold is sprayed with the common coating 501;

[0101] (3) The C mold is removed;

[0102] (4) The electrical connection device is placed into a curing oven, and after being baked at 155°C for 30 minutes, it is cooled to 60°C for curing for 1 hour, and then cooled to room temperature, so that the insulating coating 5 is cured.

[0103] At this point, the covering of the common coating 501 is completed.

[0104] It should be noted that before the electrical connection device is placed into the curing oven, the contact area 101 and the connecting area 201 need to be protected by using different molds to avoid the first shielding layer and the second shielding layer from melting and flowing away during the melting and curing of the common coating 501, thus causing the shielding layers to lose their effects.

[0105] In S40, the process of removing the first shielding layer includes:

[0106] (1) The electrical connection device is placed into a D mold, and only the contact area 101 to be electroplated is exposed, while the insulating coating 5 thereon is exposed;

[0107] (2) The insulating coating 5 material and part of the thickness of the first shielding layer on the contact area 101 are removed using a knife, at this time, only the first shielding layer is on the contact area 101, and the part of the contact portion 1 except for the contact area 101 is the insulating coating 5 material;

[0108] (3) The D mold is removed;

[0109] (4) Put the electrical connection device into hot water at 70-80°C to melt and detach the first shielding layer;

[0110] (5) Dry the terminal with the first shielding layer detached at room temperature and at 60°C to prepare for electroplating.

[0111] Thus, the first shielding layer is removed.

[0112] In S50, the surface of the contact area 101 is electroplated with a surface layer 4:

[0113] Referring to FIG. 1 and FIG. 2, taking a chip electrical connection device as an example, the surface of the contact area 101 is designed to be plated with Ni (nickel) 25-30 μm as a base layer and Ag (silver) 3-6 μm as a surface layer; the rest is a non-plated area.

[0114] As shown in FIG. 5, taking a charging base slot electrical connection device as an example, the inner surface, i.e. the contact area 101, is designed to be plated with Ni (nickel) 3-5 μm as a base layer and Ag (silver) 10-15 μm as a surface layer; the rest is a non-plated area.

[0115] In S60, the process of removing the second shielding layer includes:

[0116] (1) Put the electrical connection device into boiling water at 100°C to soak;

[0117] (2) The second shielding layer has a melting point of 90-110°C, so it is melted and detached in boiling water at 100°C;

[0118] (3) Dry the terminal with the second shielding layer detached at room temperature and at 60°C, and the final state of the electrical connection device is obtained.

[0119] Thus, the electrical connection device is completed.

[0120] Through the above-mentioned precise control of shielding and electroplating, the contact area 101 of the electrical connection device can be precisely electroplated, which not only improves the overall performance and reliability of the electrical connection device, but also significantly reduces the use of precious metals and production costs. Thus, the problem of serious waste of precious metals and high production costs in the overall plating of the surface of the electrical connection device is solved.

[0121] In another embodiment, when the connection area 201 of the electrical connection device is part of the surface of the connection part 2, as shown in FIG. 9, in step S30", a normal coating 501 is provided on the contact part 1 except the surface of the contact area 101, and a temperature-resistant coating 502 is provided on the connection part 2 except the surface of the connection area 201. And respectively bake and cure, complete the coverage of the insulating coating 5.

[0122] In some embodiments, for example, for a chip-type electrical connecting device, step S10 is preceded by step S05: a pretreatment process, which includes ultrasonic degreasing, alkaline etching and acid etching of the electrical connecting device in sequence.

[0123] Ultrasonic degreasing accelerates the removal of oil and impurities on the surface of the electrical connecting device by cavitation, stirring and strong emulsification effects of ultrasonic waves in the solvent. This process effectively removes contaminants such as oil and dirt adhering to the surface of the device, providing a clean, oil-free surface for subsequent processing steps. Ultrasonic degreasing can significantly shorten the degreasing time and improve the degreasing efficiency. For electrical connecting devices with high precision requirements, ultrasonic degreasing can avoid damage that may be caused by traditional mechanical degreasing. Ultrasonic degreasing reduces the use of chemical solvents, reduces environmental pollution, and also saves energy.

[0124] The material of the general chip terminal is aluminum or aluminum alloy. The ultrasonic degreasing plating solution is composed of sodium carbonate 40-50 g / L, trisodium phosphate 40-50 g / L, sodium silicate 20-30 g / L, temperature 50-70 °C, ultrasonic wave frequency greater than 26 kHz, and electrical connecting device ultrasonic degreasing time 8-16 min, based on the total volume of the plating solution.

[0125] Alkaline etching is a process in which the electrical connecting device is placed in an alkaline solution to remove the oxide layer, passivation layer and part of the contaminants on its surface through chemical reaction, further cleaning and activating the surface. This step helps the subsequent electroplating process, allowing the plating layer to better adhere to the device surface. Alkaline etching can deeply clean the small pores and recesses on the surface of the device, removing contaminants that are difficult to reach. By removing the oxide layer and passivation layer, alkaline etching can activate the device surface, improve the adhesion and bonding force of the plating layer. Alkaline etching can also change the texture and gloss of the device surface to some extent to meet the appearance requirements.

[0126] The alkaline etching plating solution is composed of sodium hydroxide 50-70 g / L, trisodium phosphate 30-40 g / L, sodium carbonate 20-30 g / L, and sodium silicate 5-10 g / L, based on the total volume of the plating solution. The temperature is 60-80 °C, and the time is 60-120 s.

[0127] Acid etching is a step that follows alkaline etching. It uses an acidic solution to further clean and micro-etch the surface of the device. Acid etching can remove any residues that may have been left over from the alkaline etching process and create tiny pits or bumps on the surface of the device. This helps to increase the area of attachment for the plating layer and improve the adhesion of the plating layer. Acid etching can thoroughly remove residues and impurities from the surface of the device, providing a cleaner base for electroplating. Through micro-etching, acid etching can increase the contact area between the plating layer and the surface of the device, thereby improving the adhesion and bonding of the plating layer. Acid etching can also adjust the topography and roughness of the device surface to some extent to meet specific process requirements.

[0128] The acid etching plating solution is composed of concentrated nitric acid 750-800 g / L and 40% hydrofluoric acid 250-300 g / L, with a temperature of room temperature and a time of 50-90 seconds, based on the total volume of the plating solution.

[0129] Alternatively, in some embodiments, for example, the electrical connection device in the form of a charging base slot, step S10 also has step S05: pretreatment process, which includes ultrasonic degreasing, electrolytic degreasing and acid etching of the electrical connection device in sequence.

[0130] The method of ultrasonic degreasing is the same as that of ultrasonic degreasing of the sheet-type electrical connection device.

[0131] Electrolytic degreasing involves immersing the part in an alkaline degreasing agent, with the terminal acting as the cathode. During electrolysis, polarization and hydrogen gas are generated to tear and detach the oil stains on the surface of the product.

[0132] The electrolytic degreasing plating solution is composed of sodium hydroxide 10-15 g / L, sodium carbonate 20-30 g / L, sodium phosphate 50-70 g / L and sodium silicate 10-15 g / L, with a temperature of 50-70°C, a current density of 3-8 A / dm2 and a time of 10-15 minutes, based on the total volume of the plating solution.

[0133] Acid etching involves immersing the terminal in a dilute sulfuric acid solution for cleaning, which removes the oxide scale on the surface of the terminal and activates the terminal.

[0134] The acid pickling plating solution is composed of sulfuric acid 10%-20% (by volume), with a time of 60-90 seconds, based on the total volume of the plating solution.

[0135] This deep cleaning and activation of the device surface provides a good base condition for subsequent electroplating steps. This design not only improves the quality and performance of the electroplating layer, but also prolongs the service life and reliability of the electrical connection device.

[0136] In some embodiments, the first shielding layer has a melting point lower than 100℃, and the first shielding layer is removed by placing the electrical connection device in hot water in step S40. By setting the melting point of the first shielding layer to be lower than 100℃, the first shielding layer can be easily removed at a slightly higher temperature. Moreover, the temperature of hot water is usually much higher than 65℃, which can quickly and effectively soften and remove the shielding layer, and also ensure that the first shielding layer can be removed without damaging other coating layers. Meanwhile, this method does not require complex equipment or chemicals, only a container that can accommodate the electrical connection device and be heated to an appropriate temperature, which reduces production costs and simplifies the process.

[0137] In some embodiments, the second shielding layer and the insulating coating layer 5 have a melting point higher than the working environment temperature during plating. During the plating process, the temperature of the working environment may

[0138] In some embodiments, the insulating coating layer 5 has a melting point higher than that of the second shielding layer, and the second shielding layer is melted and removed by placing the electrical connection device in an environment with a temperature higher than the melting point of the second shielding layer but lower than the melting point of the insulating coating layer 5 in step S60. By precisely controlling the temperature of the environment, the second shielding layer can be accurately melted and removed, while avoiding damage to the insulating coating layer 5. At the same time, since the temperature of the environment is lower than the melting point of the insulating coating layer 5, it can avoid thermal damage to the insulating coating layer 5 or other components due to overheating, which helps to maintain the quality and reliability of the product. Moreover, this method is usually more efficient than manual removal or the use of chemical solvents, and precise control of the removal process can be achieved by adjusting the temperature of the environment, which helps to improve production efficiency and product consistency.

[0139] In some embodiments, a transition portion 7 is further provided between the contact portion 1 and the connection portion 2, and a third shielding layer is further provided on the surface of the transition portion 7 in step S10. After step S20, step S25 is further included, which removes the third shielding layer to expose the surface of the transition portion 7, and a temperature-resistant coating layer 502 is further provided on the surface of the transition portion 7.

[0140] Specifically, in step S10, a third shielding layer needs to be provided on the surface of the transition portion 7 before electroplating the base layer plating 3 to ensure that the transition portion 7 is protected during subsequent processing. In step S25, after removing the third shielding layer, a temperature-resistant coating 502 can be provided on the surface of the transition portion 7. The temperature-resistant coating 502 can be uniformly and firmly attached to the surface of the transition portion 7 and achieve the desired protective effect.

[0141] The transition portion 7 helps to disperse and bear the stress deformation from the connecting portion 2 and the contact portion 1, reduces the structural damage that may be caused by direct connection, and increases the stability and reliability of the overall structure; at the same time, it also helps to flexibly adjust the connection direction. The third shielding layer can prevent the electroplating solution, chemical solvent or other harmful substances from directly contacting the surface of the transition portion 7, thereby avoiding corrosion, contamination or other adverse effects. The temperature-resistant coating 502 is mainly to prevent the high temperature generated during the welding connection of the connecting portion 2 and the wire from damaging or melting the adjacent ordinary coating 501, effectively isolating the direct effect of high temperature on the ordinary coating 501, and preventing the ordinary coating 501 from melting.

[0142] It can be understood that in the present embodiment, the third shielding layer can be made of a high molecular polymer material (such as polyphenylene sulfide, polyimide, polyether ether ketone, etc.), which can be selected according to actual needs, and is not limited herein.

[0143] It is worth mentioning that, if the electrical connection device contains the transition portion 7, and the connecting area 201 is the entire surface of the connecting portion 2, as shown in FIG. 10, the third shielding layer can also be removed in step S20, and the ordinary coating 501 can be provided on the contact portion 1 except the surface of the contact area 101 in step S30”’; and the temperature-resistant coating 502 can be provided on the surface of the transition portion 7.

[0144] Alternatively, when the electrical connection device contains the transition portion 7, and the connecting area 201 is part of the surface of the connecting portion 2, as shown in FIG. 11, the third shielding layer can also be removed in step S20, and the ordinary coating 501 can be provided on the contact portion 1 except the surface of the contact area 101 in step S30””, and the temperature-resistant coating 502 can be provided on the surface of the transition portion 7 and the connecting portion 2 except the surface of the connecting area 201.

[0145] In some embodiments, the melting point of the third shielding layer is greater than the working environment temperature during electroplating and less than the melting point of the ordinary coating 501. This design can ensure that the third shielding layer does not melt due to the increase of the working environment temperature during electroplating, thereby maintaining its integrity and effectively preventing the penetration of the electroplating solution. At the same time, the melting point of the third shielding layer is set to be less than the melting point of the ordinary coating 501, so that the shielding layer can be easily removed in subsequent steps for the next processing or treatment. This ensures the feasibility and efficiency of the removal process.

[0146] In some embodiments, after step S60, there is further a step S70: at the interface area between the surface plating layer 4 and the insulating coating layer 5, there is further provided a corrosion protection coating layer 6 covering the boundary between the surface plating layer 4 and the insulating coating layer 5. The corrosion protection coating layer 6 directly covers the interface between the surface plating layer 4 and the insulating coating layer 5, providing an additional protective barrier. Since the interface is often a point prone to corrosion, this design can significantly improve the overall corrosion resistance. The corrosion protection coating layer 6 has good electrical insulation and water resistance, which can effectively isolate the corrosion medium (such as moisture, oxygen, acid and alkali substances, etc.) from direct contact with the plating layer or coating layer, thereby slowing down or preventing the occurrence of the corrosion process. By adding the corrosion protection coating layer 6, the damage to the surface plating layer 4 and the insulating coating layer 5 caused by corrosion can be reduced, thereby prolonging the service life of the entire component or product and further improving the overall performance of the product.

[0147] Although preferred embodiments of the present disclosure have been described, those skilled in the art who are informed of the basic inventive concept can make additional changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present disclosure.

[0148] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if these modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure also intends to include these modifications and variations.

Claims

1. An electrical connection device for connecting an electrical device to a conductor and transferring electrical energy, characterized in that The electric connection device comprises contact parts and connection parts connected with each other, the contact parts have contact areas for connecting with the electric device, and the connection parts have connection areas for connecting with the wires; the surface of the electric connection device is plated with a bottom layer, the surface of the contact areas is plated with a surface layer, and the surface of the electric connection device except the surface of the contact areas and the surface of the connection areas is provided with an insulating coating.

2. The electrical connection device of claim 1, wherein, The melting point of the insulating coating is higher than the working temperature of the plating environment.

3. The electrical connection device of claim 1, wherein, When the surface layer and the insulating coating are on the same surface of the electric connection device, the surface of the surface layer is higher than the surface of the insulating coating.

4. The electrical connection device of claim 1, wherein, A corrosion-proof coating is arranged at the boundary between the surface layer and the insulating coating.

5. The electrical connection device of claim 1, wherein, The contact parts are plate-shaped structures, and the contact areas are the inner wall of the connection holes and at least part of the surface of the contact parts near the two ends of the connection holes.

6. The electrical connection device of claim 1, wherein, The connection parts are plate-shaped structures, and the connection areas are the surface of the connection parts in contact with the wires or the end of the connection parts in contact with the wires.

7. The electrical connection device of claim 1, wherein, The contact parts are cylindrical structures, and the contact areas are at least part of the inner wall surface of the cylindrical structures.

8. The electrical connection device of claim 1, wherein, The connection parts are cylindrical structures or U-shaped structures, and the connection areas are at least part of the inner wall surface of the cylindrical structures or at least part of the inner surface of the U-shaped structures.

9. The electrical connection device of claim 1, wherein, The transition parts are arranged between the contact parts and the connection parts, and the insulating coating comprises a general coating and a temperature-resistant coating, and the temperature-resistant coating is arranged on the surface of the transition parts and / or part of the surface of the connection parts.

10. The electrical connection device of claim 9, wherein, The melting point of the temperature-resistant coating is higher than the melting point of the general coating.

11. A process for manufacturing an electrical connection device as claimed in any one of the claims 1-10, characterized in that, The method comprises the following steps: S10, plating, plating the bottom layer on the surface of the electric connection device; S20, determining the contact areas on the electric connection device, arranging a first shielding layer on the contact areas, and arranging a second shielding layer on the connection areas; S30, arranging the insulating coating on the surface of the electric connection device; S40, removing the first shielding layer to expose the contact areas, and retaining the second shielding layer S50, plating, plating the surface layer on the surface of the contact areas; S60, removing the second shielding layer to expose the connection areas.

12. The manufacturing process of an electrical connection device according to claim 11, characterized in that, Before the step S10, the method further comprises a pretreatment process, which comprises sequentially performing ultrasonic degreasing, alkali etching, and acid etching on the electric connection device.

13. The manufacturing process of an electrical connection device according to claim 11, characterized in that, The melting point of the first shielding layer is lower than 100°C, and in the step S40, the electric connection device is placed in hot water to remove the first shielding layer.

14. The manufacturing process of an electrical connection device according to claim 11, wherein, The melting points of the second shielding layer and the insulating coating are higher than the working temperature of the plating environment.

15. The manufacturing process of an electrical connection device according to claim 11, wherein, The melting point of the insulating coating is higher than the melting point of the second shielding layer, and in the step S60, the electric connection device is placed in an environment with a temperature higher than the melting point of the second shielding layer but lower than the melting point of the insulating coating, so that the second shielding layer melts and is removed.

16. The manufacturing process of an electrical connection device according to claim 11, wherein, The transition part is further arranged between the contact part and the connecting part, and a third shielding layer is arranged on the surface of the transition part in step S10; after step S20, step S25 is further included, in which the third shielding layer is removed to expose the surface of the transition part, and a temperature-resistant coating is arranged on the surface of the transition part.

17. The manufacturing process of an electrical connection device according to claim 16, characterized in that, The third shielding layer has a melting point greater than the working temperature of the electroplating environment and less than the melting point of the ordinary coating.

18. The manufacturing process of an electrical connection device according to claim 11, wherein, After step S60, step S70 is further included, in which a corrosion-resistant coating covering the boundary between the surface layer plating layer and the insulating coating is arranged on the boundary between the surface layer plating layer and the insulating coating.

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