Integrated structure of discrete power devices and capacitor, motor controller, and automobile

Abstract

The present invention provides an integrated structure of discrete power devices and a capacitor, a motor controller, and an automobile. The integrated structure of discrete power devices and a capacitor comprises: a capacitor assembly, wherein a capacitor positive electrode plate and a capacitor negative electrode plate are provided at one end of a capacitor bottom shell of the capacitor assembly, a capacitor positive input busbar and at least one capacitor positive output busbar are connected to the capacitor positive electrode plate, and a capacitor negative input busbar and at least one capacitor negative output busbar are connected to the capacitor negative electrode plate; a water channel housing assembly, mounted on top of the capacitor bottom shell; an array of discrete power devices, the array comprising a plurality of power device units distributed in the water channel housing assembly; and a laminated busbar assembly, comprising AC-side output busbar stack plates, a positive busbar stack plate, and a negative busbar stack plate, wherein the stack plates are connected to corresponding power pins of the power device units via a plurality of connection pins, and the positive busbar stack plate and the negative busbar stack plate are connected to the capacitor positive output busbar and the capacitor negative output busbar via capacitor positive connection pins and capacitor negative connection pins, respectively.

Description

Discrete power device and capacitor integrated structure, motor controller and automobile TECHNICAL FIELD

[0001] The present application relates to the technical field of motor controller, in particular to a discrete power device and capacitor integrated structure, a motor controller and an automobile applying the same. BACKGROUND

[0002] The motor controller (MCU) is also called as inverter, which is one of the key components (core three-electricity) of the pure electric or hybrid vehicle. The power device and bus capacitor are both key parts of the MCU, and the discrete power device occupies a large share in the MCU application market due to its high cost performance, stable source and high flexibility. However, the integration of the discrete power device and the bus capacitor has always been difficult, which leads to the fact that the current existing discrete power device and bus capacitor integration layout scheme cannot fully play its advantages.

[0003] The discrete power device is arranged dispersedly, which brings certain challenges to the integration of the discrete power device and the bus capacitor in terms of installation process, thermal stress, creepage distance and electrical clearance, stray inductance (ESL), voltage stress, current sharing, thermal coupling and the like.

[0004] In terms of installation process, thermal stress, creepage distance and electrical clearance, in the current common integration scheme, the discrete power device with external insulation is usually installed on the insulating layer (copper-clad ceramic carrier), and the discrete power device and the insulating layer are coated with thermal interface material (TIM). The copper-clad ceramic carrier usually adopts Direct Copper Bonding (DCB copper-clad ceramic carrier), which mainly includes aluminum oxide and aluminum nitride types. The discrete power device and DCB small assembly are pressed on the water-cooled plate, and the water-cooled plate and the discrete power device and DCB small assembly are coated with thermal interface material (TIM). The discrete power device with internal insulation only needs to coat a layer of TIM material between the water-cooled plate and the device, but the cost of the discrete power device with internal insulation is usually higher than that of the discrete power device with external insulation, and the pins and the water-cooled plate still need to be insulated or the creepage distance needs to be increased.

[0005] The above-mentioned arrangement schemes of the discrete power device with internal and external insulation both bypass the soldered connection, which can effectively reduce the thermal stress inside the chip, but there are two obvious shortcomings:

[0006] 1. Additional components are required to fix the discrete power devices, and the installation process is complex. 2. Although TIM effectively reduces the thermal resistance of the air gap interface, its thermal conductivity is still very low compared to other layers in the heat dissipation path (typically 1-6 W / (m*k)). Its thermal resistance and thermal resistance ratio are both relatively large, which significantly limits the losses of discrete power devices, thus limiting their output power.

[0007] Regarding ESL and voltage stress (Vstray), due to the discrete positions of discrete power devices, complex copper busbars are typically used to connect them. These complex busbars generally have a high ESL, and according to the voltage stress calculation formula: Vstray = ESL * di / dt, this arrangement generally carries a significant risk of voltage stress. To mitigate this risk, the traditional approach is to increase the gate drive resistor (Rg) to reduce di / dt, thereby reducing Vstray and mitigating the voltage stress risk caused by increased ESL. However, increasing Rg leads to increased heat generation (loss) of the discrete power devices, placing higher demands on heat dissipation, requiring a lower system thermal resistance.

[0008] Regarding current sharing, the complex shape of the copper busbar connecting discrete power devices can easily lead to uneven current distribution among the devices.

[0009] In terms of thermal coupling, the connection of multiple discrete power devices in series and parallel, the direction of the cooling water path and the distance between the devices will also have a certain impact on thermal coupling. Summary of the Invention

[0010] This invention proposes an integrated structure of discrete power devices and capacitors, and motor controllers and automobiles using the same structure, to solve the technical problem of integrating discrete power devices and bus capacitors in the prior art.

[0011] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0012] This invention provides a discrete power device and capacitor integrated structure, comprising:

[0013] A capacitor assembly includes a capacitor base and a capacitor body disposed within the capacitor base; a positive electrode plate and a negative electrode plate are disposed at one end of the capacitor base and respectively connected to the capacitor body; a positive input copper busbar and at least one positive output copper busbar are connected to the positive electrode plate; a negative input copper busbar and at least one negative output copper busbar are connected to the negative electrode plate.

[0014] The waterway housing assembly is fixedly installed on the top of the capacitor base shell;

[0015] The discrete power device array comprises a plurality of power device units, which are distributed on the water channel shell assembly in a spaced manner;

[0016] The laminated copper bar assembly comprises an alternating current side output copper bar stack, a positive electrode copper bar stack and a negative electrode copper bar stack which are arranged in a laminated manner.

[0017] The alternating current side output copper bar stack, the positive electrode copper bar stack and the negative electrode copper bar stack are respectively electrically connected to the corresponding power pins of the plurality of power device units through a plurality of stack connecting pins, and the positive electrode copper bar stack is electrically connected to the positive electrode output copper bar of the capacitor through a capacitor positive electrode connecting pin, and the negative electrode copper bar stack is electrically connected to the negative electrode output copper bar of the capacitor through a capacitor negative electrode connecting pin.

[0018] Further, the laminated copper bar assembly comprises:

[0019] The alternating current side output copper bar stack, the positive electrode copper bar stack and the negative electrode copper bar stack are arranged in a laminated manner from bottom to top.

[0020] The first insulating film is attached to the bottom surface of the alternating current side output copper bar stack away from the negative electrode copper bar stack.

[0021] The second insulating film is connected between the alternating current side output copper bar stack and the positive electrode copper bar stack.

[0022] The third insulating film is connected between the positive electrode copper bar stack and the negative electrode copper bar stack.

[0023] The fourth insulating film is attached to the top surface of the negative electrode copper bar stack away from the alternating current side output copper bar stack.

[0024] Further, the water channel shell assembly comprises:

[0025] The water channel body is mounted on the top of the capacitor bottom shell.

[0026] The heat dissipation plate is fixedly mounted on the water channel body, and the plurality of copper injection bosses are uniformly and spacedly arranged on the heat dissipation plate in one-to-one correspondence with the plurality of power device units.

[0027] The discrete power device and capacitor integrated structure further comprises:

[0028] The DCB carrier plate array comprises a plurality of DCB carrier plate units, and the plurality of DCB carrier plate units are welded between the copper injection bosses and the power device units in a one-to-one correspondence.

[0029] Preferably, the discrete power device array comprises three columns of power device units arranged in parallel and spaced manner; the top end of the positive electrode plate of the capacitor is spacedly provided with three positive electrode output copper bars of the capacitor, and the top end of the negative electrode plate of the capacitor is spacedly provided with three negative electrode output copper bars of the capacitor.

[0030] The power device unit comprises a device main body, and the power pin comprises a gate pin, a source pin and a drain pin which are arranged on the device main body in a spaced manner;

[0031] The positive copper bus stack, the negative copper bus stack, the first insulating film, the second insulating film, the third insulating film and the fourth insulating film are each provided with a plurality of accommodation holes matched with the gate pin, the source pin and the drain pin of the corresponding power device unit;

[0032] The AC side output copper bus stack is a strip-shaped plate and is provided in parallel and in a spaced manner with three, and an axial end of the AC side output copper bus stack is provided with a switching pin for connecting the three-phase output copper bus of the motor controller and the three-phase input copper bus of the motor; an axial end of the positive copper bus stack away from the switching pin is provided in a spaced manner with three positive capacitor connection pins, and an axial end of the negative copper bus stack away from the switching pin is provided in a spaced manner with three negative capacitor connection pins;

[0033] The stack connection pin comprises:

[0034] The plurality of AC side first connection pins and the plurality of AC side second connection pins are arranged in a spaced manner at the side end of the AC side output copper bus stack, and each AC side first connection pin and each AC side second connection pin are respectively matched and connected with the source pin and the drain pin of each power device unit;

[0035] The drain copper bus connection pin is arranged at the positive copper bus stack corresponding to each power device unit and is matched and connected with the corresponding drain pin of the power device unit;

[0036] The source copper bus connection pin is arranged at the negative copper bus stack corresponding to each power device unit and is matched and connected with the corresponding source pin of the power device unit.

[0037] Preferably, the DCB carrier board unit comprises:

[0038] The lower copper layer, the ceramic base layer and the upper copper layer are arranged in a stacked manner from bottom to top;

[0039] The lower solder layer is connected between the corresponding copper spraying boss and the lower copper layer;

[0040] and the upper solder layer is connected between the corresponding power device unit and the upper copper layer.

[0041] Preferably, the lower copper layer and the upper copper layer are uniformly and spacedly provided with a plurality of small holes around the periphery.

[0042] Preferably, the lower solder layer and the upper solder layer are both solder layers, and the power device unit is a discrete IGBT unit.

[0043] Preferably, the heat dissipation plate and the water channel body are connected by a sealing ring or sealing glue, the capacitor body is arranged in the accommodating cavity of the capacitor bottom shell, the bottom ends of the capacitor positive plate and the capacitor negative plate extend into the accommodating cavity and are electrically connected to the capacitor body, the accommodating cavity is filled with potting glue to fix the capacitor body, the capacitor positive plate and the capacitor negative plate, and the water channel body is connected to the potting glue through heat-conducting glue to provide heat dissipation conduction for the capacitor body, the capacitor positive plate and the capacitor negative plate.

[0044] The application further provides an electric machine controller, which comprises an electric machine shell and the integrated structure of discrete power devices and capacitors.

[0045] The application further provides an automobile, which uses the electric machine controller.

[0046] Compared with the prior art, the application has the following beneficial effects:

[0047] The integrated structure of discrete power devices and capacitors provided by the application realizes insulation and heat dissipation of each power device unit of the discrete power device array through twice welding of the discrete power device array between the DCB carrier array and the water channel shell assembly, and the thermal resistance is significantly reduced compared with the existing integrated scheme. Moreover, the cooling water channel of the water channel shell assembly is optimized to achieve better temperature equalization of each power device unit of the discrete power device array.

[0048] The application adopts the laminated copper bar assembly to be welded with the discrete power device array and the capacitor assembly respectively, and the water channel shell assembly is arranged in the middle part as a mounting base, so that heat dissipation of both ends of the laminated copper bar assembly and the film capacitor can be realized at the same time, and the temperature rise of the copper bar and the temperature rise of the capacitor chip are effectively reduced. The AC side output copper bar stack of the laminated copper bar assembly and the capacitor output positive copper bar stack and negative copper bar stack effectively reduce the stray inductance in the circuit.

[0049] The copper spraying boss of the water-cooled heat dissipation plate of the integrated structure of discrete power devices and capacitors is subjected to copper spraying treatment, and the upper copper layer and the lower copper layer of each DCB carrier unit of the DCB carrier array are perforated and optimized, so that the welding and high-low temperature working thermal stress are reduced, and the life of the whole machine temperature and cold-heat cycle is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0050] In order to more clearly illustrate the technical solutions of the present application, the following will be described in detail in combination with the embodiments and the drawings, and it should be understood that the drawings described below are only some embodiments of the present application, and those skilled in the art can make changes to these drawings under the concept of the present application.

[0051] Fig. 1 is a three-dimensional schematic view of the overall assembly structure of the integrated structure of discrete power devices and capacitors provided by the application;

[0052] Fig. 2 is an overall exploded perspective view of the discrete power device and capacitor integrated structure in Fig. 1;

[0053] Fig. 3 is an exploded perspective view of the laminated copper bar assembly in Fig. 2;

[0054] Fig. 4 is a top view of the assembly structure of the laminated copper bar assembly of the discrete power device and capacitor integrated structure provided by the present application;

[0055] Fig. 5 is a sectional view of the laminated copper bar assembly in Fig. 4 along the direction of A-A;

[0056] Fig. 6 is a perspective view of one power device unit of the discrete power device array in Fig. 2;

[0057] Fig. 7 is an exploded perspective view of one DCB carrier plate unit of the water channel housing assembly in Fig. 2;

[0058] Fig. 8 is an exploded perspective view of the laminated copper bar assembly in Fig. 2;

[0059] Fig. 9 is a perspective view of the capacitor assembly in Fig. 2;

[0060] Fig. 10 is a perspective view of the assembly structure of the discrete power device array and the laminated copper bar assembly in Fig. 2 with the third insulating film, the negative copper bar stack and the fourth insulating film hidden.

[0061] In the drawings, the main reference signs are as follows:

[0062] 1, Laminated copper bar assembly; 11, AC side output copper bar stack; 111, AC side first connection pin; 112, AC side second connection pin; 113, Adapter pin; 12, Positive copper bar stack; 121, Drain copper bar connection pin; 122, Capacitor positive connection pin; 13, Negative copper bar stack; 131, Source copper bar connection pin; 132, Capacitor negative connection pin; 14, Letting hole; 2, Discrete power device array; 21, Power device unit; 211, Device main body; 212, Gate pin; 213, Source pin; 214, Drain pin; 3, DCB carrier array; 31, DCB carrier unit; 311, Lower copper layer; 312, Ceramic base layer; 313, Upper copper layer; 314, Lower solder layer; 315, Upper solder layer; 4, Water channel housing assembly; 41, Water channel main body; 42, Radiator plate; 421, Copper spray boss; 5, Capacitor assembly; 51, Capacitor bottom shell; 511, Containing cavity; 512, Mounting foot; 513, Mounting hole; 514, Top opening; 515, Encapsulating glue; 52, Capacitor negative input copper bar; 53, Capacitor positive input copper bar; 54, Capacitor positive plate; 541, Capacitor positive output copper bar; 542, Insulating paper; 55, Capacitor negative plate; 551, Capacitor negative output copper bar; 56, Screw via hole; 6, Fourth insulating film; 7, Third insulating film; 8, Second insulating film; 9, First insulating film.

[0063] Wherein, other reference signs in the figure:

[0064] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0065] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects more clear and explicit, the following will be further detailed in combination with the accompanying drawings 1-10 and examples.

[0066] Please refer to figures 1-10, the discrete power device and capacitor integrated structure provided by the present application, comprising:

[0067] The capacitor assembly 5 includes a capacitor bottom shell 51 and a capacitor body (not shown) arranged in the capacitor bottom shell 51; a capacitor positive plate 54 and a capacitor negative plate 55 arranged at one end of the capacitor bottom shell 51 and connected to the capacitor body respectively; a capacitor positive input copper bar 53 and at least one capacitor positive output copper bar 541 connected to the capacitor positive plate 54; a capacitor negative input copper bar 52 and at least one capacitor negative output copper bar 551 connected to the capacitor negative plate 55; a water channel housing assembly 4 fixedly installed on the top of the capacitor bottom shell 51; a discrete power device array 2 including a plurality of power device units 21 uniformly and fixedly distributed on the water channel housing assembly 4; and a laminated copper bar assembly 1 including an alternating current side output copper bar stack 11, a positive copper bar stack 12 and a negative copper bar stack 13 arranged in layers.

[0068] The alternating current side output copper bar stack 11, the positive copper bar stack 12 and the negative copper bar stack 13 are electrically connected to corresponding power pins of the plurality of power device units 21 through a plurality of stack connecting pins respectively, and the positive copper bar stack 12 is electrically connected to the capacitor positive output copper bar 541 through a capacitor positive connecting pin 122, and the negative copper bar stack 13 is electrically connected to the capacitor negative output copper bar 551 through a capacitor negative connecting pin 132.

[0069] In the embodiment, the capacitor bottom shell 51 of the capacitor assembly 5 is a rectangular (cuboid) plastic or metal shell or box body with a first direction X as a length direction (longer axis extending front to back) and a second direction Y (shorter axis extending left to right) perpendicular to the first direction X as a width direction, and the capacitor bottom shell 51 has an accommodating cavity 511 (i.e. an inner cavity) arranged inside, the top of the accommodating cavity 511 penetrates through the top of the capacitor bottom shell 51 and forms a top end opening 514 on the top of the capacitor bottom shell 51, the capacitor body of the capacitor assembly 5 is arranged in the accommodating cavity 511, the capacitor positive plate 54 and the capacitor negative plate 55 are arranged at one end of the accommodating cavity 511 in the first direction X, and the bottom end (lower end) of the capacitor positive plate 54 and the capacitor negative plate 55 in the third direction Z is electrically connected to the capacitor body, the top end (upper end) of the capacitor positive plate 54 and the capacitor negative plate 55 in the third direction Z extends upward from the accommodating cavity 511 to the top of the capacitor bottom shell 51 and is located at the end of the top of the capacitor bottom shell 51 connected to the top end opening 514, and the capacitor positive plate 54 and the capacitor negative plate 55 are arranged in parallel to each other perpendicular to the first direction X (i.e. the planes in which the capacitor positive plate 54 and the capacitor negative plate 55 are arranged are parallel to the second direction Y and perpendicular to the first direction X).

[0070] The waterway shell assembly 4 is matched in size with the capacitor bottom shell 51, and is fixedly installed on the top of the capacitor bottom shell 51 and overlaps the top opening 514, so that the projection of the waterway shell assembly 4 in a third direction Z (a height direction extending upward and downward) perpendicular to the first direction X and the second direction Y covers the capacitor bottom shell 51.

[0071] Please refer to FIGS. 1-5 and 10, in the embodiment, the laminated copper bar assembly 1 comprises:

[0072] The AC side output copper bar stack 11, the positive copper bar stack 12 and the negative copper bar stack 13 are sequentially stacked from bottom to top; the first insulating film 9 is attached to the bottom surface of the AC side output copper bar stack 11 away from the negative copper bar stack 13; the second insulating film 8 is connected between the AC side output copper bar stack 11 and the positive copper bar stack 12; the third insulating film 7 is connected between the positive copper bar stack 12 and the negative copper bar stack 13; and the fourth insulating film 6 is attached to the top surface of the negative copper bar stack 13 away from the AC side output copper bar stack 11.

[0073] As a preferred embodiment of the present embodiment, the thermal compression is used between each layer of the copper bar stack and the insulating film of the laminated copper bar assembly 1, which ensures the adhesion between the insulating film and the copper bar stack and the overall structural strength of the laminated copper bar assembly 1, and guarantees the three requirements of insulation, high overlap and small distance between each layer of the copper bar stack, realizes the mutual cancellation of the circuit inductance of each layer of the copper bar stack, and reduces the ESL of each layer of the copper bar stack.

[0074] The fourth insulating film 6 and the first insulating film 9 are respectively arranged in the upper and lower end directions of the laminated copper bar assembly 1, which guarantees the insulation and creepage distance requirements of the overall laminated copper bar assembly 1 and peripheral devices; and the second insulating film 8 and the third insulating film 7 guarantee the insulation and creepage distance requirements between each copper bar stack (the AC side output copper bar stack 11, the positive copper bar stack 12 and the negative copper bar stack 13). In summary, the laminated copper bar assembly 1 of the discrete power device and capacitor integrated structure provided by the present application is optimized in shape, size and installation layout, and compared with the conventional connection of each discrete power device through a complex structure of copper bar, the ESL in the copper bar circuit is significantly reduced.

[0075] Please refer to Fig. 3, 10, as a more preferred embodiment of the present embodiment, the top surface of the positive copper bar stack 12 is provided with four mounting through slots respectively at the four corners, the top surface of the negative copper bar stack 13 is provided with four mounting through slots with screw holes respectively at the four corners, eight insulating pads are respectively embedded and mounted in the mounting through slots of the positive copper bar stack 12 and the negative copper bar stack 13, and the insulating pads are provided with screw holes, the third insulating film 7 is connected between the four insulating pads protruding upward on the top surface of the positive copper bar stack 12 and the negative copper bar stack 13, the fourth insulating film 6 is attached to the four insulating pads protruding upward on the top surface of the negative copper bar stack 13 away from the AC side output copper bar stack 11, the second insulating film 8, the third insulating film 7 and the fourth insulating film 6 are provided with corresponding screw connection holes; by passing the connecting screws through the corresponding screw holes and screw connection holes respectively, the second insulating film 8, the positive copper bar stack 12, the third insulating film 7, the negative copper bar stack 13 and the fourth insulating film 6 are sequentially connected as a whole from bottom to top, and the insulating pads improve the insulation effect between the positive copper bar stack 12, the negative copper bar stack 13 and the connecting screws.

[0076] Please refer to Fig. 1, 2, 8, in the present embodiment, the water channel housing assembly 4 includes: a water channel body 41 fixedly mounted on the top of the capacitor bottom shell 51; a heat dissipation plate 42 fixedly mounted on the water channel body 41; and a plurality of copper sprayed protrusions 421 matched with the plurality of power device units 21 and uniformly and spacedly fixedly distributed on the heat dissipation plate 42 by copper spraying treatment; the discrete power device and capacitor integrated structure further includes: a DCB carrier plate array 3 including a plurality of DCB carrier plate units 31, the plurality of DCB carrier plate units 31 being welded between the copper sprayed protrusions 421 and the power device units 21 one by one.

[0077] Please refer to Fig. 1, 2, 8, as a preferred embodiment of the present embodiment, the heat dissipation plate 42 and the water channel housing are connected by bolt fastening, and the heat dissipation plate 42 and the water channel body 41 are connected by a sealing ring or sealing glue (not shown in the figure).

[0078] Please refer to Fig. 1, 2, 8, as a preferred embodiment of the present embodiment, the pouring sealing glue 515 is filled in the receiving cavity 511 of the capacitor bottom shell 51, the water channel body 41 is connected to the inner side surface of the receiving cavity 511 and the capacitor body in the receiving cavity 511 and realizes heat dissipation conduction, fixation and insulation of the capacitor body by coating the heat conducting glue (i.e. heat dissipation glue, not shown in the figure) between the top surface of the pouring sealing glue 515 and the bottom surface of the water channel body 41, and the pouring sealing glue 515 in the receiving cavity 511 also plays the roles of fixation, heat conduction (achieved by the pouring sealing glue 515, the heat conducting glue and the water channel body 41) and insulation of other various devices (such as the capacitor positive plate 54 and the capacitor negative plate 55).

[0079] Please refer to Figures 1, 2, when the discrete power device and capacitor integrated structure is applied to a motor controller (MCU), the water channel body 41 (water channel shell assembly 4) can be first fixed and connected to the capacitor bottom shell 51 (capacitor assembly 5) by bolts, and then the capacitor bottom shell 51 (capacitor assembly 5) is fixed and connected to the controller shell of the motor controller (not shown in the figure) by bolts; or the water channel body 41 (water channel shell assembly 4) and the capacitor bottom shell 51 (capacitor assembly 5) can be respectively fixed and connected to the controller shell by bolts.

[0080] Please refer to Figures 1, 2, 8, in this embodiment, the flow direction of the internal cooling water channel of the water channel body 41 is preferably perpendicular to the length direction of the water channel (i.e. along the width direction), and the number of power device units 21 cooled along the water flow path of the cooling water channel in the width direction is less than the number of power device units 21 cooled along the length direction, which ensures the uniformity of each power device unit 21.

[0081] Please refer to Figures 1, 2, 7, 8, as a preferred embodiment of the present embodiment, the heat sink plate 42 is a water-cooled plate. The DCB carrier plate unit 31 comprises:

[0082] a lower copper layer 311, a ceramic base layer 312 and an upper copper layer 313 are sequentially stacked from bottom to top; a lower solder layer 314 connected between the corresponding copper spray boss 421 and the lower copper layer 311; and an upper solder layer 315 connected between the corresponding power device unit 21 and the upper copper layer 313.

[0083] Please refer to Figure 7, as a preferred embodiment of the present embodiment, a plurality of small holes are uniformly and spacedly distributed around the periphery of the lower copper layer 311 and the upper copper layer 313, which is used to reduce the risk of cracking of the ceramic base layer 312 or delamination of the upper solder layer 315 and the lower solder layer 314 due to thermal expansion stress. In particular, the discrete power device and capacitor integrated structure provided by the present application adopts the DCB carrier plate array 3 composed of a plurality of DCB carrier plate units 31 partitioned and blocked, which is matched with the plurality of copper spray bosses 421 of the water channel heat sink plate 42 and the discrete power device array 2 composed of a plurality of power device units 21, thereby significantly reducing the thermal expansion stress, which is obviously superior to the traditional layout scheme of using a whole DCB plate and a solder layer assembly to respectively solder discrete power devices.

[0084] As a preferred embodiment of the present embodiment, the lower solder layer 314 and the upper solder layer 315 are both solder layers, preferably composed of vehicle-grade solder material.

[0085] The power device unit 21 of the discrete power device and capacitor integrated structure is connected with the heat dissipation plate 42 through the copper spray boss 421, so that the thermal stress of the lower solder layer 314 (lower solder) of the DCB carrier unit 31 of the DCB carrier array 3 in the working process is effectively reduced, and the thermal fatigue life of the discrete power device and capacitor integrated structure is effectively improved.

[0086] As a preferred embodiment of the present embodiment, the melting point of the solder material used in the upper solder layer 315 is less than or equal to the melting point of the solder material used in the lower solder layer 314, and the melting point of the material used in the upper solder layer 315 is much smaller than the melting point of the solder layer inside the power device unit 21, so that the lower solder layer 314 and the upper solder layer 315 are simultaneously or sequentially soldered, and the influence of the re-melting and delamination of the solder layer inside the power device unit 21 on the chip thermal resistance and reliability in the soldering process is avoided.

[0087] As a preferred embodiment of the present embodiment, the lower solder layer 314 and the upper solder layer 315 use solder materials with a thermal conductivity ≥40 W / (m*k), which is much larger than the thermal conductivity of ordinary 1-6 W / (m*k) thermal interface materials, so as to significantly reduce the system thermal resistance of the discrete power device and capacitor integrated structure.

[0088] Please refer to FIGS. 1-6, 9 and 10, in the present embodiment, the discrete power device array 2 includes three columns of power device units 21 arranged in parallel and at intervals; the top end of the capacitor positive plate 54 is provided with three capacitor positive output copper bars 541 arranged at intervals, and the top end of the capacitor negative plate 55 is provided with three capacitor negative output copper bars 551 arranged at intervals; the power device unit 21 is a discrete IGBT unit, and the power device unit 21 includes a plastic encapsulated device body 211, and the power pins include a gate pin 212, a source pin 213 and a drain pin 214 arranged at intervals on the device body 211; the positive copper bar stack 12, the negative copper bar stack 13, the first insulating film 9, the second insulating film 8, the third insulating film 7 and the fourth insulating film 6 are all provided with a plurality of accommodation holes 14 matched with the gate pin 212, the source pin 213 and the drain pin 214 of the corresponding power device unit 21, so that the gate pin 212, the source pin 213 and the drain pin 214 of the power device unit 21 extend from the accommodation hole 14 downward to the top of the discrete power device and capacitor integrated structure.

[0089] The AC side output copper bar stack plate 11 is a strip-shaped plate, and three of the AC side output copper bar stack plates 11 are arranged in parallel and at intervals to match the three columns of power device units 21 of the discrete power device array 2, and an axial end of the AC side output copper bar stack plate 11 is provided with two adapter pins 113 for connecting three-phase output copper bars of the motor controller and three-phase input copper bars of the motor; the positive copper bar stack plate 12 is provided with three positive capacitor connection pins 122 at an axial end away from the adapter pins 113, and the negative copper bar stack plate 13 is provided with three negative capacitor connection pins 132 at an axial end away from the adapter pins 113, as shown in FIGS. 1-3 and 10.

[0090] The stack plate connection pins include:

[0091] A plurality of AC side first connection pins 111 and AC side second connection pins 112 are arranged at the side ends of the AC side output copper bar stack plate 11, and each of the AC side first connection pins 111 and the AC side second connection pins 112 is respectively connected to the source pin 213 and the drain pin 214 of each power device unit 21; a plurality of drain copper bar connection pins 121 are arranged at the positive copper bar stack plate 12 corresponding to each power device unit 21 and are electrically connected to the corresponding drain pin 214 of the power device unit 21; a plurality of source copper bar connection pins 131 are arranged at the negative copper bar stack plate 13 corresponding to each power device unit 21 and are electrically connected to the corresponding source pin 213 of the power device unit 21, as shown in FIGS. 1-6 and 10.

[0092] Please refer to FIGS. 1-5, 9 and 10, as a preferred embodiment of the present embodiment, the discrete power device array 2 includes three columns of power device units 21 arranged in parallel and at intervals and extending along the first direction X, and each column of power device units 21 is composed of six power device units 21 arranged uniformly and at intervals along the first direction X; the side ends of the AC side output copper bar stack plate 11 are provided with a column of AC side first connection pins 111 and a column of AC side second connection pins 112 at intervals in the first direction X, wherein the column of AC side first connection pins 111 in front (away from the adapter pins 113) includes three AC side first connection pins 111 arranged uniformly and at intervals along the first direction X, the column of AC side second connection pins 112 at the rear (close to the adapter pins 113) includes three second connection pins 112 arranged uniformly and at intervals along the first direction X, and the first end AC side second connection pin 112 of the column of AC side second connection pins 112 in the first direction X is arranged at the rear of the tail end first connection pin 111 of the column of AC side first connection pins 111 in the first direction X.

[0093] Correspondingly, the power pins include gate pins 212, source pins 213 and drain pins 214 arranged in a row from back to front along the first direction X on the device body 211, that is, in the power pins of each power device unit 21, the source pin 213 is arranged in the middle in the first direction X, and the drain pin 214 and the gate pin 212 are respectively located on the front and back of the source pin 213 in the first direction X, and the drain pin 214 and the gate pin 212 of each power device unit 21 are respectively arranged adjacent to the gate pin 212 and the drain pin 214 of the previous each power device unit 21 in the first direction X, as shown in FIG. 6.

[0094] Correspondingly, the positive copper bar stack 12, the negative copper bar stack 13, the first insulating film 9, the second insulating film 8, the third insulating film 7 and the fourth insulating film 6 are all provided with two rows of spacing holes 14 arranged uniformly along the first direction X, each row of spacing holes 14 includes six spacing holes 14 matched with each row of six power device units 21, so that the power pins (gate pins 212, source pins 213 and drain pins 214) and the stack connecting pins (AC side first connecting pins 111, AC side second connecting pins 112, drain copper bar connecting pins 121 and source copper bar connecting pins 131) can be upwardly passed through, as shown in FIGS. 1-3 and 10.

[0095] Please refer to FIG. 3, as the preferred embodiment of the present embodiment, the spacing holes 14 arranged on the positive copper bar stack 12 and the negative copper bar stack 13 have relatively the largest area, the spacing holes 14 arranged on the third insulating film 7 and the fourth insulating film 6 have the second largest area, and the spacing holes 14 arranged on the first insulating film 9 and the second insulating film 8 have the relatively smallest area.

[0096] The drain copper bar connecting pins 121 are provided with three columns of parallel and spaced apart drain copper bar connecting pins 121 extending along the first direction X, each column of the drain copper bar connecting pins 121 includes three drain copper bar connecting pins 121, and each three drain copper bar connecting pins 121 of two columns are arranged at the edges of the corresponding two columns of three each of the corresponding clearance holes 14 at the front end of the positive copper bar stack 12 in the first direction X (away from one end of the adapter pin 113), and the corresponding drain pins 214 of each three power device units 21 at the front end of the two columns of power device units 21 in the first direction X (away from one end of the adapter pin 113) pass through the corresponding clearance holes 14 of the positive copper bar stack 12, the negative copper bar stack 13, the first insulating film 9, the second insulating film 8, the third insulating film 7 and the fourth insulating film 6 upward and extend to the top of the discrete power device and capacitor integrated structure, and are matched and electrically connected with each three drain copper bar connecting pins 121 of the corresponding two columns; the three drain copper bar connecting pins 121 of the other column are arranged at one side end of the positive copper bar stack 12 in the first direction X (away from one end of the adapter pin 113) in the second direction Y. The corresponding drain pins 214 of the three power device units 21 at the front end of the other column of power device units 21 in the first direction X (away from one end of the adapter pin 113) extend upward to one side end of the positive copper bar stack 12 in the second direction Y, and are matched and electrically connected with the three drain copper bar connecting pins 121 of the corresponding column, as shown in FIGS. 1-5 and 10.

[0097] The source copper bar connecting pins 131 are provided with three columns of parallel and spaced apart source copper bar connecting pins 131 extending along the first direction X, each column of the source copper bar connecting pins 131 includes three source copper bar connecting pins 131, and each three source copper bar connecting pins 131 of two columns are arranged at the edges of the corresponding two columns of three each of the corresponding clearance holes 14 at the rear end of the negative copper bar stack 13 in the first direction X (close to one end of the adapter pin 113), and each three power device units 21 of the two columns of power device units 21 at the rear end in the first direction X (close to one end of the adapter pin 113) pass through the corresponding clearance holes 14 of the positive copper bar stack 12, the negative copper bar stack 13, the first insulating film 9, the second insulating film 8, the third insulating film 7 and the fourth insulating film 6 upward and extend to the top of the discrete power device and capacitor integrated structure, and are matched and electrically connected with each three source copper bar connecting pins 131 of the corresponding two columns; the three source copper bar connecting pins 131 of the other column are arranged at one side end of the negative copper bar stack 13 in the first direction X (close to one end of the adapter pin 113) in the second direction Y. The corresponding source pins 213 of the three power device units 21 at the rear end of the other column of power device units 21 in the first direction X (close to one end of the adapter pin 113) extend upward to one side end of the negative copper bar stack 13 in the second direction Y, and are matched and electrically connected with the three source copper bar connecting pins 131 of the corresponding column, as shown in FIGS. 1-5 and 10.

[0098] Correspondingly, the corresponding three AC side first connecting pins 111 of the two columns of AC side output copper busbar stacks 11 in front (away from the adapter pins 113) respectively pass through the corresponding accommodation holes 14 of the positive copper busbar stack 12, the negative copper busbar stack 13, the first insulating film 9, the second insulating film 8, the third insulating film 7 and the fourth insulating film 6 upwards and extend to the top of the discrete power device and capacitor integrated structure, and are matched and electrically connected with the three source pins 213 of the two columns of power device units 21 which also pass through the corresponding accommodation holes 14 upwards; the corresponding three AC side second connecting pins 112 of the other column of AC side output copper busbar stacks 11 in front (away from the adapter pins 113) respectively extend to one side end of the top of the discrete power device and capacitor integrated structure in the second direction Y and are matched and electrically connected with the three drain pins 214 of the other column of power device units 21 which also extend upwards, as shown in FIGS. 1-5 and 10.

[0099] Correspondingly, the corresponding three AC side first connecting pins 111 of the two columns of AC side output copper busbar stacks 11 in front (away from the adapter pins 113) respectively pass through the corresponding accommodation holes 14 of the positive copper busbar stack 12, the negative copper busbar stack 13, the first insulating film 9, the second insulating film 8, the third insulating film 7 and the fourth insulating film 6 upwards and extend to the top of the discrete power device and capacitor integrated structure, and are matched and electrically connected with the three source pins 213 of the two columns of power device units 21 which also pass through the corresponding accommodation holes 14 upwards; the corresponding three AC side second connecting pins 112 of the other column of AC side output copper busbar stacks 11 in front (away from the adapter pins 113) respectively extend to one side end of the top of the discrete power device and capacitor integrated structure in the second direction Y and are matched and electrically connected with the three drain pins 214 of the other column of power device units 21 which also extend upwards, as shown in FIGS. 1-5 and 10.

[0100] In other embodiments (not shown in the drawings), the discrete power device array 2 can also include two, four or more columns of power device units 21 arranged in parallel and at intervals, and then the top end of the capacitor positive electrode plate 54 is correspondingly provided with two, four or more capacitor positive electrode output copper buses 541 arranged at intervals, the top end of the capacitor negative electrode plate 55 is correspondingly provided with two, four or more capacitor negative electrode output copper buses 551 arranged at intervals, and the AC side output copper busbar stacks 11 are provided with two, four or more in parallel and at intervals according to the number of columns of power device units 21 of the discrete power device array 2.

[0101] Please refer to Figs. 1, 2 and 9, as the preferred embodiment of the present embodiment, the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 are arranged in the first direction X in front of each other on the top of the capacitor bottom shell 51, and are located at the top of the capacitor bottom shell 51 in the first direction X at the front end connection top opening 514, and the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 are perpendicular to the first direction X (parallel to the second direction Y and the third direction Z); The bottom of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 (the lower side end of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 in the third direction Z) extends downward along the third direction Z and extends into the receiving cavity 511 of the capacitor bottom shell 51, while the bottom of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 is electrically connected to the capacitor body in the receiving cavity 511, and the potting glue 515 plays a fixing, heat conducting and insulating role on the part of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 extending into the receiving cavity 511 of the capacitor bottom shell 51 (i.e. the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 are connected to the bottom end of the capacitor body), so that the top of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 is fixedly installed on the top of the capacitor bottom shell 51 in the first direction X at the front end.

[0102] Three capacitor positive electrode output copper bars 541 are spaced apart and welded at the top end of the capacitor positive electrode plate 54, and one end of the capacitor positive electrode input copper bar 53 is welded to one side end of the capacitor positive electrode plate 54; Three capacitor negative electrode output copper bars 551 are spaced apart and welded at the top end of the capacitor negative electrode plate 55, and one end of the capacitor negative electrode input copper bar 52 is welded to one side end of the capacitor negative electrode plate 55, and the three capacitor positive electrode output copper bars 541 and the three capacitor negative electrode output copper bars 551 are staggered and spaced apart. Two fixed nuts (not shown in the figure) are embedded in the top of the capacitor bottom shell 51 in the first direction X at the front end, and the two fixed nuts are arranged in front of each other in the first direction X. The opposite end of the capacitor positive electrode input copper bar 53 and the opposite end of the capacitor negative electrode input copper bar 52 are respectively provided with screw through holes 56 matched with the fixed nuts, and the opposite end of the capacitor positive electrode input copper bar 53 and the opposite end of the capacitor negative electrode input copper bar 52 are respectively fixedly connected to the top of the capacitor bottom shell 51 in the first direction X at the front end by passing through the corresponding screw through holes 56 and the fixed nuts with the fixed screws (not shown in the figure), as shown in Figs. 1, 2 and 9.

[0103] Please refer to Figs. 1, 2 and 9, as the preferred embodiment of the present embodiment, the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 are arranged in the first direction X in front of each other on the top of the capacitor bottom shell 51, and are located at the top of the capacitor bottom shell 51 in the first direction X at the front end connection top opening 514, and the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 are perpendicular to the first direction X (parallel to the second direction Y and the third direction Z); The bottom of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 (the lower side end of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 in the third direction Z) extends downward along the third direction Z and extends into the receiving cavity 511 of the capacitor bottom shell 51, while the bottom of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 is electrically connected to the capacitor body in the receiving cavity 511, and the potting glue 515 plays a fixing, heat conducting and insulating role on the part of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 extending into the receiving cavity 511 of the capacitor bottom shell 51 (i.e. the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 are connected to the bottom end of the capacitor body), so that the top of the capacitor positive electrode plate 54 and the capacitor negative electrode plate 55 is fixedly installed on the top of the capacitor bottom shell 51 in the first direction X at the front end.

[0104] The insulating paper 542 is attached to the side of the capacitor positive electrode plate 54 away from the capacitor negative electrode plate 55 (i.e. the side of the capacitor positive electrode plate 54 in the first direction X), so as to realize the insulation of the capacitor positive electrode plate 54.

[0105] In the embodiment, the capacitor bottom shell 51 is further provided with an extended mounting foot 512 outside the four corners, and the mounting foot 512 is provided with a mounting hole 513 for fixed connection with the motor shell of the motor controller.

[0106] Please refer to Figs. 1, 2, 7-9, in the preferred embodiment of the present application, the discrete power device and capacitor integrated structure is arranged from top to bottom as a laminated copper bar assembly 1, a discrete power device array 2, a DCB carrier array 3, a water channel housing assembly 4 and a capacitor assembly 5, wherein the laminated copper bar assembly 1 is electrically connected with the corresponding power pins of the discrete power device array 2 through a plurality of connecting pins, and is correspondingly electrically connected with the capacitor positive output copper bar 541 and the capacitor negative output copper bar 551 of the capacitor assembly 5 through the capacitor positive connecting pin 122 and the capacitor negative connecting pin 132, respectively, to realize current intercommunication of the discrete power device and capacitor integrated structure, and the laminated copper bar assembly 1 is fixedly connected with the water channel housing assembly 4 through bolts.

[0107] The corresponding power device unit 21 of the discrete power device array 2 is welded on the upper welding layer 315 of the corresponding DCB carrier unit 31 of the DCB carrier array 3, so that the discrete power device array 2 and the DCB carrier array 3 are fixedly connected in one-to-one matching; the corresponding DCB carrier unit 31 of the DCB carrier array 3 is welded on each copper spraying boss 421 at the top end of the heat dissipation plate 42 of the water channel housing assembly 4, so that the DCB carrier array 3 is fixedly connected on the water channel housing assembly 4. The water channel housing assembly 4 is fixedly connected with the capacitor bottom shell 51 of the capacitor assembly 5 through the water channel body 41 by bolts, so that the water channel housing assembly 4 is fixedly connected on the capacitor assembly 5; at the same time, the capacitor assembly 5 is also fixedly connected with the motor shell of the motor controller through the mounting foot 512 of the capacitor bottom shell 51 by bolts, so that the capacitor assembly 5 is fixedly connected on the motor controller.

[0108] The present application also provides a motor controller (inverter) comprising a motor shell (not shown in the figure), which applies the discrete power device and capacitor integrated structure described above, and the water channel housing assembly 4 is fixedly connected on the motor shell, and the capacitor body is a bus capacitor.

[0109] The present application also provides an automobile (not shown in the figure), which applies the motor controller described above.

[0110] As a preferred embodiment, the automobile is a pure electric vehicle, and the motor controller described above is a three-phase (U, V, W) motor controller suitable for a pure electric vehicle, each phase of the motor controller comprising an upper bridge arm and a lower bridge arm, each upper bridge arm and lower bridge arm being composed of a plurality of discrete power devices described above in parallel.

[0111] In other embodiments, the automobile can also be a hybrid electric vehicle.

[0112] The above merely provides the preferred embodiment of the present application, and is not used to limit the present application. Any modification, equivalent replacement, and improvement made in the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A discrete power device and capacitor integrated structure, characterized in that, The application relates to a discrete power device and capacitor integrated structure. The capacitor assembly (5) comprises a capacitor bottom shell (51) and a capacitor body arranged in the capacitor bottom shell (51); a capacitor positive plate (54) and a capacitor negative plate (55) are arranged at one end of the capacitor bottom shell (51) and are respectively connected to the capacitor body; a capacitor positive input copper bar (53) and at least one capacitor positive output copper bar (541) are connected to the capacitor positive plate (54); a capacitor negative input copper bar (52) and at least one capacitor negative output copper bar (551) are connected to the capacitor negative plate (55); The water channel shell assembly (4) is arranged on the top of the capacitor bottom shell (51); The discrete power device array (2) comprises a plurality of power device units (21) which are arranged on the water channel shell assembly (4) at intervals; The laminated copper bar assembly (1) comprises an alternating current side output copper bar stack plate (11), a positive copper bar stack plate (12) and a negative copper bar stack plate (13) which are arranged in layers; The alternating current side output copper bar stack plate (11), the positive copper bar stack plate (12) and the negative copper bar stack plate (13) are respectively electrically connected to corresponding power pins of the plurality of power device units (21) through a plurality of stack plate connecting pins, and the positive copper bar stack plate (12) is electrically connected to the capacitor positive output copper bar (541) through a capacitor positive connecting pin (122), and the negative copper bar stack plate (13) is electrically connected to the capacitor negative output copper bar (551) through a capacitor negative connecting pin (132).

2. The discrete power device and capacitor integrated structure of claim 1, wherein, The laminated copper bar assembly (1) comprises: The alternating current side output copper bar stack plate (11), the positive copper bar stack plate (12) and the negative copper bar stack plate (13) are arranged in layers from bottom to top; A first insulating film (9) is attached to the bottom surface of the alternating current side output copper bar stack plate (11) which faces away from the negative copper bar stack plate (13); A second insulating film (8) is connected between the alternating current side output copper bar stack plate (11) and the positive copper bar stack plate (12); A third insulating film (7) is connected between the positive copper bar stack plate (12) and the negative copper bar stack plate (13); A fourth insulating film (6) is attached to the top surface of the negative copper bar stack plate (13) which faces away from the alternating current side output copper bar stack plate (11).

3. The discrete power device and capacitor integrated structure of claim 2, wherein, The water channel shell assembly (4) comprises: A water channel main body (41) is arranged on the top of the capacitor bottom shell (51); A heat dissipation plate (42) is fixedly arranged on the water channel main body (41); and a plurality of copper jet bosses (421) are matched with the plurality of power device units (21) and are fixedly arranged on the heat dissipation plate (42) at intervals; The discrete power device and capacitor integrated structure further comprises: A DCB carrier plate array (3) comprises a plurality of DCB carrier plate units (31), and the plurality of DCB carrier plate units (31) are welded between the copper jet bosses (421) and the power device units (21) one by one.

4. The discrete power device and capacitor integrated structure of claim 3, wherein, The discrete power device array (2) comprises three columns of the power device units (21) arranged in parallel and at intervals; the top end of the positive electrode plate (54) is provided with three positive electrode output copper bars (541) at intervals, and the top end of the negative electrode plate (55) is provided with three negative electrode output copper bars (551) at intervals; The power device unit (21) comprises a device main body (211), and the power pin comprises a gate pin (212), a source pin (213) and a drain pin (214) arranged at intervals on the device main body (211); The positive copper bar stack (12), the negative copper bar stack (13), the first insulating film (9), the second insulating film (8), the third insulating film (7) and the fourth insulating film (6) are all provided with a plurality of accommodation holes (14) matched with the gate pin (212), the source pin (213) and the drain pin (214) of the corresponding power device unit (21). The AC side output copper bar stack (11) is a strip-shaped plate and is provided in parallel and at intervals with three AC side output copper bar stacks (11). The axial end of the AC side output copper bar stack (11) is provided with a switching pin (113) for connecting the three-phase output copper bar of the motor controller and the three-phase input copper bar of the motor. The axial end of the positive copper bar stack (12) away from the switching pin (113) is provided with three positive electrode connection pins (122) at intervals, and the axial end of the negative copper bar stack (13) away from the switching pin (113) is provided with three negative electrode connection pins (132) at intervals. The stack connection pin comprises: A plurality of AC side first connection pins (111) and a plurality of AC side second connection pins (112) are arranged at intervals at the side end of the AC side output copper bar stack (11), and each AC side first connection pin (111) and AC side second connection pin (112) is respectively matched and connected with the source pin (213) and the drain pin (214) of each power device unit (21); A plurality of drain copper bar connection pins (121) are arranged at the corresponding positions of the positive copper bar stack (12) and are matched and connected with the corresponding drain pin (214) of the power device unit (21); A plurality of source copper bar connection pins (131) are arranged at the corresponding positions of the negative copper bar stack (13) and are matched and connected with the corresponding source pin (213) of the power device unit (21).

5. The discrete power device and capacitor integrated structure of claim 3, wherein, The DCB carrier plate unit (31) comprises: A lower copper layer (311), a ceramic base layer (312) and an upper copper layer (313) are sequentially stacked from bottom to top; A lower soldering layer (314) is connected between the corresponding copper spraying boss (421) and the lower copper layer (311); And an upper soldering layer (315) is connected between the corresponding power device unit (21) and the upper copper layer (313).

6. The discrete power device and capacitor integrated structure of claim 5, wherein, The lower copper layer (311) and the upper copper layer (313) are uniformly and interval distributed with a plurality of small holes around the periphery.

7. The discrete power device and capacitor integrated structure of claim 5, wherein, The lower solder layer (314) and the upper solder layer (315) are both solder layers, and the power device unit (21) is a discrete IGBT unit.

8. The discrete power device and capacitor integrated structure of claim 3, wherein, The heat dissipation plate (42) and the water channel body (41) are connected by a sealing ring or sealing glue, the capacitor body is arranged in a containing cavity (511) of the capacitor bottom shell (51), the bottom ends of the capacitor positive plate (54) and the capacitor negative plate (55) extend into the containing cavity (511) and are electrically connected to the capacitor body, the containing cavity (511) is filled with potting glue (515) to fix the capacitor body, the capacitor positive plate (54) and the capacitor negative plate (55), and the water channel body (41) is connected to the potting glue (515) through heat-conducting glue to provide heat dissipation conduction for the capacitor body, the capacitor positive plate (54) and the capacitor negative plate (55).

9. An electric machine controller comprising an electric machine housing, characterized in that The discrete power device and capacitor integrated structure as claimed in any one of claims 1-8 is applied, and the water channel shell assembly (4) is fixedly connected to the motor shell.

10. An automobile characterized by comprising: The motor controller as claimed in claim 9 is applied.

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