Curable resin composition, thin layer manufactured using same, and color conversion panel and display device including thin layer

Abstract

Provided are a curable resin composition, a thin layer manufactured using the resin composition, a color conversion panel including the thin layer, and a display device including the color conversion panel, the curable resin composition comprising a solvent and a hydrolysis-condensation reaction product of a reactant including hollow particles and a silane compound represented by chemical formula 1. [Chemical formula 1] (R1)a(R2)b(R3)c-Si-(OR4)4-a-b-c The definition of chemical formula 1 is the same as that described in the specification.

Description

Curable resin composition, thin film manufactured therefrom, and color conversion panel and display device including the thin film

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0093202, filed July 15, 2024, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to a curable resin composition, a thin film manufactured therefrom, and a color conversion panel and display device including the thin film.

[0003] As the display industry develops, various display devices utilizing displays are diversifying, and there is a continuous demand for technologies that increase the luminous efficiency of self-luminous materials, such as OLEDs or displays containing quantum dots. Incorporating low-refractive-index materials between the thin films forming the display panel can increase luminous efficiency by recycling the amount of light lost as it travels within the panel. Furthermore, because low-refractive-index materials produce a low-reflectivity effect, they can be used in anti-reflective layers on the external lenses of light sensors, or as anti-reflection (AR) films on the outermost layers of displays or solar cells.

[0004] Recently, display devices are required to be thinner, lighter, and more bendable and rollable. To achieve these characteristics, the introduction of thin and flexible films is being considered. The lower the refractive index of the low-refractive-index coating layer, the thinner the coating layer can be, thus expanding the coating film's margin and increasing the efficiency for the device's intended purpose. However, in addition to the challenge of lowering the refractive index of the low-refractive-index material, there are still issues to be improved, such as thermal stability during the manufacturing or use of display devices and excellent adhesion between the upper and lower films.

[0005] One embodiment provides a curable resin composition having a low refractive index, excellent mechanical properties, and improved adhesion to a substrate or adjacent film.

[0006] Another embodiment provides a thin film prepared by curing the composition.

[0007] Another embodiment provides a color conversion panel comprising the above thin film.

[0008] Another embodiment provides a display device including the color conversion panel.

[0009] The technical problems to be solved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0010] A curable resin composition according to one embodiment comprises a hydrolysis condensation reaction product of a reactant including a silane compound and hollow particles represented by the following chemical formula 1, and a solvent:

[0011] [Chemical Formula 1]

[0012] (R 1 ) a (R 2 ) b (R 3 ) c -Si-(OR 4 ) 4-a-b-c

[0013] In the above chemical formula 1,

[0014] R 1 Inland R 3are each independently hydrogen, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, R x (C=O)-(where, R x is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, or a substituted or unsubstituted C6 to C30 aryl group), an epoxy group, a (meth)acrylate group, a (meth)acryloyloxy group, or a combination thereof,

[0015] R 4 is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, or a combination thereof,

[0016] a, b, and c are, independently, real numbers greater than or equal to 0, and 0 ≤ a+b+c < 4.

[0017] The hollow particles may be fine particles of a hollow metal oxide including TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, or a combination thereof.

[0018] The above reactant may further comprise fine particles of a metal oxide including TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, or a combination thereof, which do not contain hollow particles.

[0019] The above reactant may further include an organic polymer having a boiling point of 100°C to 250°C.

[0020] The organic polymer may include a polyalkylene oxide copolymer, a polyarylene oxide copolymer, a glycol copolymer, or a combination thereof.

[0021] The above silane compound may include a compound of chemical formula 1 where a+b+c=0 and a compound of chemical formula 1 where a+b+c=1.

[0022] The weight ratio of the compound of chemical formula 1 in which a+b+c=0 and the compound of chemical formula 1 in which a+b+c=1 may be 0:10 to 5:5.

[0023] The weight ratio of the silane compound and the hollow particle in the above reactant may be 3:7 to 8:2.

[0024] The average diameter of the above hollow particles may be 50 nm to 100 nm.

[0025] The average diameter of the metal oxide fine particles not including the above hollow particles may be 50 nm to 150 nm.

[0026] The fine particles of the metal oxide not including the hollow body may be included in an amount of 0 to 30 wt% based on the total weight of the reactant.

[0027] The fine particles of the metal oxide not including the hollow particles and the hollow particles may be included in an amount of 20 wt% to 70 wt% based on the total weight of the hydrolysis condensation reaction product.

[0028] The organic polymer may be included in an amount of 0 to 30 wt% based on the total weight of the curable resin composition.

[0029] The above hydrolysis condensation reaction product may be included in an amount of 30 wt% to 80 wt% based on the total weight of the curable resin composition.

[0030] The weight average molecular weight (Mw) of the above hydrolysis condensation reaction product may be 500 g / mol to 100,000 g / mol.

[0031] According to another embodiment, a thin film is manufactured by curing the curable resin composition.

[0032] A color conversion panel according to another embodiment includes the thin film.

[0033] According to another embodiment, a display device includes the color conversion panel.

[0034] A curable resin composition according to one embodiment and a thin film manufactured therefrom have a low refractive index, excellent mechanical properties, and excellent adhesion to a substrate or an adjacent film, and thus can be advantageously used in various display devices.

[0035] Figure 1 is a plan view schematically illustrating a color conversion panel according to an embodiment.

[0036] Figure 2 is a cross-sectional view schematically illustrating a cross-section taken along line II-II of Figure 1.

[0037] Fig. 3 is a cross-sectional view according to a modified example of Fig. 2.

[0038] Fig. 4 is a cross-sectional view according to a modified example of Figs. 2 and 3.

[0039] Fig. 5 is a cross-sectional view according to a modified example of Fig. 2.

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. However, in describing this disclosure, descriptions of functions or configurations already known will be omitted to clarify the gist of this disclosure.

[0041] To clarify this description, irrelevant parts have been omitted, and identical or similar components are designated by the same reference numerals throughout the specification. Furthermore, the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and this description is not necessarily limited to what is shown.

[0042] To clearly represent multiple layers and regions in the drawings, their thicknesses are enlarged. Furthermore, for convenience of explanation, the thicknesses of some layers and regions are exaggerated in the drawings. When a layer, membrane, region, plate, or other part is said to be "over" or "on" another part, this includes not only cases where it is "directly over" another part, but also cases where there is another part in between.

[0043] Unless otherwise defined herein, 'substituted' means a compound in which a hydrogen atom is substituted with a halogen atom (F, Br, Cl, or I), a hydroxy group, an alkoxy group, a nitro group, a cyano group, an amino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a vinyl group, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C30 aryl group, a C7 to C30 arylalkyl group, a C9 to C30 allylaryl group, a C1 to C30 alkoxy group, a C1 to C20 heteroalkyl group, a C3 to C20 heteroarylalkyl group, a C3 to C30 cycloalkyl group, a C3 to C15 It means substituted with a substituent selected from a cycloalkenyl group, a C6 to C15 cycloalkynyl group, a C3 to C30 heterocycloalkyl group, and combinations thereof.

[0044] In addition, two adjacent groups among the substituted halogen atom (F, Br, Cl, or I), hydroxy group, nitro group, cyano group, amino group, azido group, amidino group, hydrazino group, hydrazono group, carbonyl group, carbamyl group, thiol group, ester group, carboxyl group or salt thereof, sulfonic acid group or salt thereof, phosphoric acid or salt thereof, C1 to C30 alkyl group, C2 to C30 alkenyl group, C2 to C30 alkynyl group, C6 to C30 aryl group, C7 to C30 arylalkyl group, C1 to C30 alkoxy group, C1 to C20 heteroalkyl group, C3 to C20 heteroarylalkyl group, C3 to C30 cycloalkyl group, C3 to C15 cycloalkenyl group, C6 to C15 cycloalkynyl group, or C2 to C30 heterocyclic group Substituents may also be fused to form rings.

[0045] Unless otherwise defined herein, “weight average molecular weight” is the value obtained by dissolving a powder sample in dimethylformamide (DMF) and measuring it using Tosoh’s HLC-8220GPC Gel Permeation Chromatography (GPC) (using Shodex KF-G as the column and Shodex polystyrene as the standard sample).

[0046] One embodiment relates to a curable resin composition having a low refractive index, excellent mechanical properties, and improved adhesion to an adjacent film or substrate.

[0047] As the display industry develops, various display devices using displays are diversifying, and there is a continuous demand for technology that increases the luminous efficiency of self-luminous materials, such as OLEDs or displays containing quantum dots. Low-refractive index materials have low-reflection characteristics, so they can be used as low-reflection layers on the outside of lenses for light sensors, anti-reflection (AR) films on the outermost layers of displays or solar cells, or layers that reduce light loss and increase efficiency within devices where light moves. Meanwhile, the lower the refractive index of a low-refractive index coating layer, the thinner the coating layer can be, which expands the coating film margin and increases efficiency according to the purpose of the device.

[0048] Among the existing methods for obtaining low-refractive index materials, when using thermosetting resins, it is known that the resin must be cured at a high temperature of approximately 350℃ or higher, or at least approximately 300℃ or higher, to form nanopores. Methods such as chemical vapor deposition (CVD) not only require expensive equipment, but also have difficulty forming a thick coating film. Furthermore, it is difficult to create nanopores, making it difficult to manufacture a thin film with a low refractive index. When using fluorine compounds or epoxy polymers, it is difficult to achieve a low refractive index, and even if it is achieved, there is a high possibility of cracking when the thickness increases to the micrometer level. Meanwhile, while silicon materials are known to be easy to achieve a low refractive index, there is the problem that the adhesion between the upper and lower layers decreases as the thickness increases. In particular, if a layer with a pattern, such as a color filter layer, exists beneath the layer that implements the low refractive index, the pattern may cause the substrate to be uneven and have steps. At this time, if the gap between the lower patterns is large and a coating material implementing a low refractive index is filled, the thickness of the low refractive index layer in that area may become very thick, and cracks may occur in this area. Therefore, it is difficult to implement a thick film with a low refractive index, without cracking, and with good adhesion to the upper and lower films.

[0049] In one embodiment, a curable resin composition comprising a product formed by hydrolysis-condensation reaction of a reactant including a silane compound and a hollow particle together, and a solvent is provided, thereby enabling a film having a low refractive index, excellent mechanical properties, and excellent adhesion to upper and lower films to be implemented.

[0050] Hereinafter, each component of the curable resin composition according to one embodiment will be described in detail.

[0051] (a) Hydrolysis condensation reaction product

[0052] A curable resin composition according to one embodiment comprises a hydrolysis-condensation reaction product and a solvent. The hydrolysis-condensation reaction product can be obtained by a hydrolysis-condensation reaction of a reactant including a silane compound and a hollow particle.

[0053] The above silane compound can be expressed by the following chemical formula 1.

[0054] [Chemical Formula 1]

[0055] (R 1 ) a (R 2 ) b (R 3 ) c -Si-(OR 4 ) 4-a-b-c

[0056] In the above chemical formula 1, R 1 Inland R 3 are each independently hydrogen, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, R x (C=O)-(where, R x is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, or a substituted or unsubstituted C6 to C30 aryl group), an epoxy group, a (meth)acrylate group, a (meth)acryloyloxy group, or a combination thereof,

[0057] R 4is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, or a combination thereof,

[0058] a, b, and c are, independently, real numbers greater than or equal to 0, and 0 ≤ a+b+c < 4.

[0059] By using the above silane compound as one reactant to form a hydrolysis condensation reaction product, the curable resin composition including the hydrolysis condensation reaction product and the thin film produced therefrom can have a low refractive index.

[0060] In the above chemical formula 1, R 1 Inland R 3 are each independently hydrogen, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, an epoxy group, a (meth)acrylate group, a (meth)acryloyloxy group, or a combination thereof, and may be, for example, hydrogen, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, or a combination thereof, but are not limited thereto.

[0061] In the above chemical formula 1, R 4 is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C6 to C30 aryl group, or a combination thereof, and may be, for example, a substituted or unsubstituted C1 to C20 alkyl group, for example, a C1 to C10 alkyl group, and may be, for example, a methyl group, an ethyl group, a propyl group, or a butyl group, but is not limited thereto.

[0062] In the above chemical formula 1, a, b, and c are each independently a real number greater than or equal to 0, and 0 ≤ a+b+c < 4, and for example, a+b+c can be a real number from 0 to 3, a real number from 0 to 2, or an integer from 0 to 2, and for example, a+b+c=0 or a+b+c=1, but is not limited thereto.

[0063] For example, the silane compound where a+b+c=1 may include, but is not limited to, methyltrimethoxy silane (MTMS), ethyltrimethoxy silane (ETMS), propyltrimethoxy silane, butyltrimethoxy silane, and phenyltrimethoxy silane (PTMS).

[0064] As an example, the silane compound where a+b+c=0 may include, but is not limited to, tetraethyl orthosilicate (TEOS).

[0065] In one embodiment, the weight ratio of the compound of formula 1 where a+b+c=0 and the compound of formula 1 where a+b+c=1 in the silane compound may be 0:10 to 5:5. For example, the weight ratio of the compound of formula 1 where a+b+c=0 and the compound of formula 1 where a+b+c=1 may be 1:9 to 5:5, 2:8 to 5:5, or 3:7 to 5:5. In one embodiment, the compound of formula 1 where a+b+c=0 may not be included, but is not limited thereto.

[0066] The above hydrolysis condensation reaction product is formed by a hydrolysis condensation reaction of a reactant including the silane compound and the hollow particle. Accordingly, the hydrolysis condensation reaction product may be a single polymer in which the polymer formed by the hydrolysis condensation reaction of the silane compound and the hollow particle are chemically bonded, i.e., linked by a hydrolysis condensation reaction. Since the hollow particle is used as a single reactant forming the hydrolysis condensation reaction product, the refractive index of the curable resin composition including the hydrolysis condensation reaction product and the thin film manufactured therefrom can be further reduced, and the adhesion between the thin film and other thin films or substrates existing on the upper and lower portions of the thin film can be improved. In addition, since the hydrolysis condensation reaction product has hollow particles that exist integrally with the polymer formed by the hydrolysis condensation reaction, the hollow particles can be uniformly distributed within the hydrolysis condensation reaction product, and accordingly, a thin film manufactured from a curable resin composition including the hydrolysis condensation reaction product can exhibit better optical properties, such as low refractive index and haze, without the phenomenon of clumping of hollow particles, and can also exhibit superior mechanical properties. For example, a thin film manufactured from the curable resin composition can have crack resistance that is unlikely to crack even when manufactured into a film having a thickness on the order of several nanometers to several tens of micrometers.

[0067] In one embodiment, the hollow particles may be fine particles of a hollow metal oxide including, but not limited to, titanium oxide, silicon oxide, barium oxide, zinc oxide, zirconium oxide, or a combination thereof. For example, the hollow particles may be fine particles of a hollow metal oxide including, but not limited to, TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, or a combination thereof. In one example, the hollow particles may be, but are not limited to, hollow silica (SiO2).

[0068] The average diameter (D) of the above hollow particles 50 ) may be, but is not limited to, 50 nm to 100 nm, for example, 55 nm to 100 nm, for example, 60 nm to 100 nm, for example, 50 nm to 95 nm, for example, 50 nm to 90 nm, for example, 60 nm to 90 nm. When the average diameter size of the hollow particles satisfies the above range, it can efficiently react with the silane compound, and can further reduce the refractive index of the curable resin composition including the same.

[0069] The porosity of the hollow particles may be, but is not limited to, 40% to 90%, for example, 40% to 80%, for example, 40% to 70%, for example, 40% to 60%, for example, 40% to 50%, for example, 50% to 90%, for example, 60% to 90%, for example, 70% to 90%, for example, 80% to 90%, for example, 50% to 70%. When the porosity of the hollow particles exceeds the above range, the size of the internal space of the hollow particles increases and the thickness of the outer space decreases, so that the durability of the hollow particles may be weakened, and when the porosity of the hollow particles is less than the above range, the refractive index reducing effect of the curable resin composition may be minimal.

[0070] The hollow particles may be included in an amount of 20 wt% to 70 wt% based on the total weight of the hydrolysis condensation reaction product, for example, 25 wt% to 70 wt%, 30 wt% to 70 wt%, 35 wt% to 70 wt%, 40 wt% to 70 wt%, 20 wt% to 65 wt%, 20 wt% to 60 wt%, 20 wt% to 55 wt%, 20 wt% to 50 wt%, but are not limited thereto. When the hollow particles are included in the above content range, the refractive index of the curable resin composition including the hydrolysis condensation reaction product can be lowered.

[0071] In one embodiment, the weight ratio of the silane compound and the hollow particle in the reactant is 3:7 to 8:2, and may be, for example, 4:6 to 8:2, 5:5 to 8:2, or 6:4 to 8:2, but is not limited thereto. When the silane compound and the hollow particle in the reactant have a weight ratio within the above range, the silane compound and the hollow particle can efficiently undergo a hydrolysis-condensation reaction. In addition, a curable resin composition including a hydrolysis-condensation reaction product formed thereby can have a low refractive index and excellent crack resistance.

[0072] The above hydrolysis condensation reaction product may be included in an amount of 30 wt% to 80 wt% based on the total weight of the curable resin composition, for example, 35 wt% to 80 wt%, 40 wt% to 80 wt%, 45 wt% to 80 wt%, 50 wt% to 80 wt%, 55 wt% to 80 wt%, 60 wt% to 80 wt%, 30 wt% to 75 wt%, 30 wt% to 70 wt%, 30 wt% to 65 wt%, but is not limited thereto. By including the above-mentioned curable resin composition in the hydrolysis condensation reaction product, a thin film manufactured therefrom has a low refractive index while reducing the possibility of cracking, thereby ensuring excellent mechanical properties of the thin film.

[0073] The weight average molecular weight (Mw) of the above hydrolysis condensation reaction product is 500 g / mol to 90,000 g / mol, for example, 500 g / mol to 80,000 g / mol, 500 g / mol to 70,000 g / mol, 500 g / mol to 60,000 g / mol, 500 g / mol to 50,000 g / mol, 500 g / mol to 40,000 g / mol, 500 g / mol to 30,000 g / mol, 500 g / mol to 20,000 g / mol, 500 g / mol to 10,000 g / mol, 500 g / mol to 9,000 g / mol, 500 g / mol to 8,000 g / mol, 500 g / mol to It may be 7,000 g / mol, 500 g / mol to 6,000 g / mol, 500 g / mol to 5,000 g / mol, but is not limited thereto.

[0074] (b) Fine particles of metal oxide that do not contain hollow particles

[0075] According to one embodiment, the hydrolysis condensation reaction product included in the curable resin composition can be obtained by reacting a silane compound with fine particles of a metal oxide that do not contain hollow particles as an additional reactant in addition to the hollow particles. By including the fine particles of the metal oxide that do not contain hollow particles, the high unit cost of the hollow particles can be reduced, and the mechanical properties of the curable resin composition can be further improved.

[0076] In one embodiment, the metal oxide fine particles that do not include a hollow body can be metal oxide fine particles that include TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, or a combination thereof, and for example, can be TiO2 or SiO2 that do not include a hollow body, but are not limited thereto.

[0077] In one embodiment, the average diameter of the fine particles of the metal oxide not including hollow pores is 50 nm to 150 nm, for example, 55 nm to 150 nm, 60 nm to 150 nm, 65 nm to 150 nm, 70 nm to 150 nm, 60 nm to 145 nm, 60 nm to 140 nm, 60 nm to 135 nm, 60 nm to 130 nm, but is not limited thereto. When the average diameter of the fine particles of the metal oxide not including hollow pores satisfies the above range, mixing with the hollow particles is easy, so that the mechanical properties of the composition can be further improved.

[0078] In one embodiment, the metal oxide fine particles that do not include hollow portions may be included in an amount of 0 to 30 wt% based on the total weight of the metal oxide fine particles that do not include hollow portions and the hollow particles, for example, 0 to 25 wt%, 0 to 20 wt%, 0 to 15 wt%, 0 to 10 wt%, but are not limited thereto. When the metal oxide fine particles that do not include hollow portions are included in an amount within the above range relative to the hollow particles, the refractive index reduction effect of the curable resin composition can be maximized while improving the mechanical properties.

[0079] In one embodiment, the content of the metal oxide fine particles that do not include hollow particles and the hollow particles may be comprised in an amount of 20 wt% to 70 wt% based on the total weight of the hydrolysis-condensation reaction product, for example, 25 wt% to 70 wt%, 30 wt% to 70 wt%, 35 wt% to 70 wt%, 40 wt% to 70 wt%, 20 wt% to 65 wt%, 20 wt% to 60 wt%, 20 wt% to 55 wt%, 20 wt% to 50 wt%, but is not limited thereto. When the metal oxide fine particles that do not include hollow particles are comprised in the above content range, the refractive index reduction effect of the curable resin composition can be maximized while the mechanical properties can be improved.

[0080] (c) Organic polymers with a boiling point of 100°C to 250°C

[0081] The curable resin composition according to one embodiment may further include an organic polymer having a boiling point of 100°C to 250°C.

[0082] When the curable resin composition further includes an organic polymer having a boiling point of 100°C to 250°C and is heated to cure, as the temperature rises to 100°C to 250°C, the organic polymer having a boiling point of 100°C to 250°C evaporates from the resin being cured by the heating. Accordingly, nanopores are formed in the location where the organic polymer exists in the resin, and the cured film may have a lower refractive index than a cured film that does not include such nanopores.

[0083] In one embodiment, the organic polymer having a boiling point of 100°C to 250°C may include a polyalkylene oxide copolymer, a polyarylene oxide copolymer, a glycol copolymer, or a combination thereof.

[0084] For example, the polyalkylene oxide copolymer or the polyarylene oxide-based copolymer may be polyethylene oxide, polypropylene oxide, or poly(phenylene) oxide, and the glycol-based copolymer may be polyethylene glycol or poly(propylene) glycol, but is not limited thereto.

[0085] In one embodiment, the number average molecular weight (Mn) of the organic polymer having a boiling point of 100°C to 250°C is 100 g / mol to 10,000 g / mol, for example, 100 g / mol to 8,000 g / mol, for example, 200 g / mol to 7,000 g / mol, for example, 300 g / mol to 6,000 g / mol, for example, 400 g / mol to 5,500 g / mol, for example, 400 g / mol to 5,000 g / mol, for example, 500 g / mol to 5,000 g / mol, for example, 500 g / mol to 4,500 g / mol, for example, 600 g / mol to 5,000 g / mol, for example, 600 g / mol to 4,500 g / mol, For example, 700 g / mol to 5,000 g / mol, for example, 700 g / mol to 4,500 g / mol, for example, 800 g / mol to 5,000 g / mol, for example, 800 g / mol to 4,500, g / mol, for example, 900 g / mol to 5,000 g / mol, for example, 900 g / mol to 4,500, g / mol, for example, 1,000 g / mol to 5,000 g / mol, for example, 1,000 g / mol to 4,500 g / mol, for example, 1,000 g / mol to 4,000 g / mol, for example, 1,000 g / mol to 3,500 g / mol, for example, 1,000 g / mol to 3,000 g / mol, for example, It may be from 1,000 g / mol to 2,500 g / mol, for example, from 1,000 g / mol to 2,000 g / mol, but is not limited thereto.

[0086] In one embodiment, the organic polymer having a boiling point of 100°C to 250°C may be included in an amount of 0 to 30 wt% based on the total weight of the curable resin composition, for example, 0 to 25 wt%, 0 to 20 wt%, 0 to 15 wt%, 0 to 10 wt%, 0.1 to 30 wt%, 0.5 to 30 wt%, 0.1 to 25 wt%, 0.1 to 20 wt%, but is not limited thereto.

[0087] (d) solvent

[0088] The solvent included in the curable resin composition according to one embodiment may be any solvent capable of dispersing the hydrolysis-condensation reaction product, either alone or in combination of two or more. For example, the solvent may include an aprotic solvent and a protic solvent.

[0089] For example, aprotic solvents usable in the curable resin composition according to one embodiment include diethyl ether, methyl ethyl ether, methyl-n-di-n-propyl ether, di-iso-propyl ether, tetrahydrofuran, methyl tetrahydrofuran, dioxane, dimethyldioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol di-n-propyl ether, ethylene glycol dibutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol methyl mono-n-propyl ether, diethylene glycol methyl mono-n-butyl ether, diethylene glycol di-n-propyl ether, diethylene glycol di-n-butyl ether, diethylene glycol methyl mono-n-hexyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol methyl ethyl ether, Triethylene glycol methyl mono-n-butyl ether, triethylene glycol di-n-butyl ether, triethylene glycol methyl mono-n-hexyl ether, tetraethylene glycol dimethyl ether, tetraethylene glycol diethyl ether, tetradiethylene glycol methyl ethyl ether, tetraethylene glycol methyl mono-n-butyl ether, diethylene glycol di-n-butyl ether, tetraethylene glycol methyl mono-n-hexyl ether, tetraethylene glycol di-n-butyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol di-n-propyl ether, propylene glycol dibutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol methyl ethyl ether, dipropylene glycol methyl mono-n-butyl ether, dipropylene glycol di-n-propyl ether, dipropylene glycol di-n-butyl Ether, dipropylene glycol methyl mono-n-hexyl ether, tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol methyl ethyl ether, tripropylene glycol methyl mono-n-butyl ether, tripropylene glycol di-n-butyl ether, tripropylene glycol methyl mono-n-hexyl ether,Ether solvents such as tetrapropylene glycol dimethyl ether, tetrapropylene glycol diethyl ether, tetradipropylene glycol methyl ethyl ether, tetrapropylene glycol methyl mono-n-butyl ether, dipropylene glycol di-n-butyl ether, tetrapropylene glycol methyl mono-n-hexyl ether, and tetrapropylene glycol di-n-butyl ether; Methyl acetate, ethyl acetate, n-propyl acetate, i-propyl acetate, n-butyl acetate, i-butyl acetate, sec-butyl acetate, n-pentyl acetate, sec-pentyl acetate, 3-methoxybutyl acetate, methyl pentyl acetate, 2-ethyl butyl acetate, 2-ethylhexyl acetate, benzyl acetate, cyclohexyl acetate, methyl cyclohexyl acetate, nonyl acetate, methyl acetoacetate, ethyl acetoacetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, glycol diacetate, methoxytriglycol acetate, ethyl propionate, n-butyl propionate, i-amyl propionate, diethyl oxalate, Ester solvents such as di-n-butyl oxalate; ether acetate solvents such as ethylene glycol methyl ether propionate, ethylene glycol ethyl ether propionate, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol methyl ether acetate, diethylene glycol ethyl ether acetate, diethylene glycol-n-butyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, dipropylene glycol methyl ether acetate, and dipropylene glycol ethyl ether acetate, but are not limited thereto.

[0090] For example, protic solvents usable in the curable resin composition according to one embodiment include methanol, ethanol, n-propanol, i-propanol, n-butanol, i-butanol, sec-butanol, t-butanol, n-pentanol, i-pentanol, 2-methylbutanol, sec-pentanol, t-pentanol, 3-methoxybutanol, n-hexanol, 2-methylpentanol, sec-hexanol, 2-ethyl butanol, sec-heptanol, n-octanol, 2-ethyl hexanol, sec-octanol, n-nonyl alcohol, n-decanol, sec-undecyl alcohol, trimethyl nonyl alcohol, sec-tetradecyl alcohol, sec-heptadecyl alcohol, phenol, cyclohexanol, methylcyclohexanol, benzyl alcohol, ethylene glycol, 1,2-propylene glycol, Alcohol solvents such as 1,3-butylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, and tripropylene glycol; Ether solvents such as ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol mono-n-hexyl ether, ethoxytriglycol, tetraethylene glycol mono-n-butyl ether, propylene glycol monomethyl ether, propylene glycol propyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and tripropylene glycol monomethyl ether; Ester solvents such as methyl lactate, ethyl lactate, n-butyl lactate, and n-amyl lactate, etc. Among these, alcohol solvents can be used from the viewpoint of storage stability.

[0091] The solvent may be included in an amount of 20 wt% to 70 wt% based on the total weight of the curable composition, for example, 20 wt% to 65 wt%, 20 wt% to 60 wt%, 25 wt% to 70 wt%, 30 wt% to 70 wt%, 35 wt% to 70 wt%, or 40 wt% to 70 wt%, and may be appropriately adjusted depending on the total solid content.

[0092] (e) Other additives

[0093] The curable resin composition according to one embodiment may further include various additives known in the art. Such additives may further include, but are not limited to, surfactants for improving coatability and preventing defect formation during coating of the composition, such as fluorinated surfactants.

[0094] These additives may be included in an amount of 10 parts by weight or less, for example, 8 parts by weight or less, for example, 5 parts by weight or less, for example, 3 parts by weight or less, for example, 2 parts by weight or less, for example, 1 part by weight or less, based on 100 parts by weight of the hydrolysis condensation reaction product.

[0095]

[0096] Another embodiment provides a thin film manufactured by curing the curable resin composition. The thin film may have a refractive index of 1.35 or less, for example, 1.30 or less, for example, 1.28 or less, for example, 1.25 or less, for example, 1.20 or less, for example, 1.18 or less, for example, 1.15 or less, for a wavelength of 500 nm to 550 nm, and an average light transmittance value of 90% or more, for example, 92% or more, for example, 95% or more, for a wavelength of 400 nm to 800 nm.

[0097] In another embodiment, a color conversion panel comprising the above thin film is provided.

[0098] The above color conversion panel is,

[0099] substrate;

[0100] A low refractive index layer disposed on one surface of the above substrate;

[0101] A color conversion layer including a color conversion member disposed on the low-refractive-index layer or between the low-refractive-index layer and the substrate; and

[0102] Including a planarizing layer covering the low refractive index layer and the color conversion layer,

[0103] The above low refractive index layer can be manufactured from a curable resin composition according to one embodiment.

[0104] Here, the curable resin composition is the same as described above, so detailed description thereof is omitted.

[0105] In one embodiment, the low-refractive-index layer of the color conversion panel can be manufactured by coating and curing a curable resin composition according to one embodiment on the substrate or the color conversion layer. Specifically, the curable resin composition can be manufactured by coating the curable resin composition on the substrate or the color conversion layer formed on the substrate, and then drying and curing at a temperature of about 150°C to 250°C, for example, 170°C to 250°C, for example, 180°C to 250°C, for example, 180°C to 240°C, for example, 190°C to 240°C, for example, 200°C to 240°C, for example, 210°C to 240°C, for example, 220°C to 240°C, for a time period of about 10 minutes to about 1 hour.

[0106] The method for coating the composition on the substrate or the color conversion layer may use any of various methods known in the art, including, but not limited to, spin coating, slit and spin coating, slit coating, roll coating, or die coating. In one embodiment, the composition may be spin coated on the substrate or the color conversion layer.

[0107] The low-refractive-index layer manufactured as described above may have a thickness of about 100 nm to 10 μm. For example, the thin film may have a thickness of about 1 μm to about 10 μm, for example, about 1 μm to about 8 μm, for example, about 1 μm to about 7 μm, for example, about 1 μm to about 5 μm.

[0108] Hereinafter, a color conversion panel according to one embodiment will be described in detail with reference to the drawings.

[0109] FIG. 1 is a plan view schematically illustrating a color conversion panel (100) according to one embodiment, and FIGS. 2 and 3 are cross-sectional views schematically illustrating a cross-section cut along line II-II of FIG. 1, respectively.

[0110] Referring to FIGS. 2 and 3 together, a color conversion panel (100) according to one embodiment includes a substrate (110), a low-refractive-index layer (120), a color conversion layer (130), and a planarization layer (140). The color conversion layer (130) may include color conversion layers that emit light of two or more different wavelengths, such as a first color conversion layer (132) that emits light of a first wavelength and a second color conversion layer (134) that emits light of a second wavelength. For example, the first color conversion layer (132) may emit red (R) light, and the second color conversion layer (134) may emit green (G) light, but is not limited thereto. In addition, the color conversion panel (100) may further include a third region (C) that emits blue (B) light or white light.

[0111] The substrate (110) is made of a transparent and electrically insulating material, and may further include a protective layer (112) at a position corresponding to the region where the first color conversion layer (132) and the second color conversion layer (134) are positioned. The protective layer (112) is formed on one surface of the substrate (110), so that when the color conversion layer (130) is formed on the substrate (110) later, patterning of the color conversion layer is smoothly performed, and protects the color conversion member within the color conversion layer.

[0112] The low-refractive-index layer (120) may cover a portion of the substrate (110) and the protective layer (112) on one side of the substrate (110), for example, a surface of the substrate (110) on which the protective layer (112) is formed, or, as shown in FIG. 3, the color conversion layer (130) may be first laminated on the protective layer (112), and then laminated on the color conversion layer (130), thereby covering all of the color conversion layer (130), a portion of the substrate (110), and a portion of the protective layer (112). That is, FIGS. 2 and 3 differ only in that the low-refractive-index layer (120) is positioned below the color conversion layer (130) (in the case of FIG. 2) or the low-refractive-index layer (120) is positioned above the color conversion layer (130) (in the case of FIG. 3), and all other components are the same.

[0113] According to one embodiment, the low-refractive layer (120) has a relatively low refractive index of 1.35 or less, for example, 1.32 or less, for example, 1.31 or less, for example, 1.30 or less, for example, 1.29 or less, for example, 1.28 or less, for example, 1.27 or less, for example, 1.26 or less, for example, 1.25 or less, for example, 1.24 or less, for example, 1.23 or less, for example, 1.22 or less, for example, 1.21 or less, for example, 1.20 or less, for example, 1.19 or less, for example, 1.18 or less, for example, 1.17 or less, for example, 1.16 or less, for example, 1.15 or less, for a wavelength of 500 nm to 550 nm. When the low-refractive-index layer (120) is formed above or below, or both above and below, the color conversion layer (130), it is possible to prevent light emitted from the color conversion layer (130) from being reflected toward the substrate (110). That is, when light passes through the low-refractive-index layer (120), it is reflected or refracted due to the difference in refractive index and moves back to the color conversion layer (130), thereby having the effect of reusing the lost light. Accordingly, the luminous efficiency of the color conversion panel (100) according to one embodiment in which the low-refractive-index layer (120) is formed above, below, or on both sides of the color conversion layer (130) can be further improved. The refractive index mentioned herein refers to the absolute refractive index representing the ratio of the speed of light in a vacuum and in a medium.

[0114] In addition, the low-refractive-index layer may have an average value of light transmittance for a wavelength of 400 nm to 800 nm of 90% or more, for example, 91% or more, for example, 92% or more, for example, 93% or more, for example, 94% or more, for example, 95% or more, for example, 96% or more, for example, 97% or more, for example, 98% or more, for example, 99% or more, but is not limited thereto. When the average value of light transmittance for a wavelength of 400 nm to 800 nm of the low-refractive-index layer satisfies the above range, the optical properties of the low-refractive-index layer can be further improved.

[0115] In addition, the low-refractive-index layer may have an average reflectance (SCE value) of 10% or less, for example, 7% or less, for example, 5% or less, for example, 3% or less, across the entire wavelength range of 400 nm to 800 nm corresponding to the visible light range. Therefore, the color conversion panel (100) according to one embodiment may have high light transmittance even in a low wavelength range, and may further improve optical characteristics by maintaining low reflectance across the entire wavelength range corresponding to visible light.

[0116] The first color conversion layer (132) and the second color conversion layer (134) each include a first color conversion member (133) that emits light of a first wavelength and a second color conversion member (135) that emits light of a second wavelength, and each of the first color conversion member (133) and the second color conversion member (135) may include quantum dots that convert the wavelength of incident light into light of a different wavelength. These color conversion members may be formed by applying a composition for forming a color conversion layer including quantum dots onto the substrate or the low-refractive-index layer (120) formed on the substrate. The composition for forming the color conversion layer may include quantum dots, a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a solvent, and other additives.

[0117] In one embodiment, the color conversion layer (130) is formed by coating a composition for forming a color conversion layer including a color conversion member (133, 135) including quantum dots on a substrate (110) or a low-refractive-index layer (120) formed on the substrate (110) and then performing a patterning process. The patterning process may be carried out through processes such as, for example, a step of applying the composition for forming the color conversion layer onto a substrate (110) or a low-refractive-index layer (120) by a spin or slit coating method, a roll coating method, a screen printing method, an applicator method, etc., and drying it to form a film, an exposure step of forming a pattern having a shape corresponding to the first color conversion layer (132) and the second color conversion layer (134) using a mask, a development step of removing unnecessary parts, and a post-treatment step of curing by reheating or irradiating with active rays, etc., in order to obtain a pattern having excellent heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc., but is not limited thereto.

[0118] The first and second color conversion layers (132, 134) may further include a light scattering body (not shown) in addition to the color conversion member (133, 135) including quantum dots. The light scattering body may be dispersed within the color conversion layer (130) together with the quantum dots. The light scattering body may induce incident light to be incident on the quantum dots, or may induce a radiation direction so that the radiation light emitted from the quantum dots can be emitted outside the color conversion layer (130). Through this, the decrease in the light efficiency of the color conversion layer (130) can be minimized. The light transmitting member (136) may also include a light scattering body.

[0119] A planarization layer (140) is formed on the low-refractive-index layer (120) and the color conversion layer (130). The planarization layer (140) covers and protects the low-refractive-index layer (120) and the color conversion layer (130), and makes the surface of the color conversion panel (100) planar. The planarization layer (140) may be made of a material that is transparent and electrically insulating so that light can be transmitted therethrough. At this time, the planarization layer (140) according to the present embodiment may be made of a polymer matrix that is the same as or different from that of the low-refractive-index layer (120). For example, the planarization layer (140) may be made of a low-refractive-index material including a carbosilane-siloxane copolymer like the low-refractive-index layer (120), thereby further improving the luminous efficiency of the color conversion panel (100). In addition, by minimizing cases where light incident on the low refractive index layer (120) is reflected or scattered when incident on the flattening layer (140), it is possible to provide a color conversion panel (100) with improved light efficiency by minimizing optical loss at the interface.

[0120] Meanwhile, the color conversion layer (130) may further include a transparent member (136) arranged to correspond to the third region (C). The transparent member (136) may emit light received from a light source as is without a separate color conversion. To this end, for example, the transparent member (136) may be formed to have the same height as the color conversion layer (130), or, as shown in FIGS. 2 and 3, may exist as an empty space that is not filled with anything to a certain extent up to the height where the color conversion layers (132, 134) and the planarization layer (140) formed thereon exist. However, the present invention is not limited thereto, and the transparent member (136) may further include quantum dots to emit light converted to a specific wavelength, like the first color conversion layer (132) and the second color conversion layer (134), and may further include the light scattering material described above.

[0121] Fig. 4 is a cross-sectional view according to a variation of Figs. 2 and 3. Fig. 4 is a cross-sectional view showing an example in which the low-refractive-index layer (120) is formed on both the upper and lower portions of the color conversion layer (130). Except for the fact that the low-refractive-index layer (120) is formed on both the upper and lower portions of the color conversion layer (130), the remaining components are all the same as those described in Figs. 2 and 3, and therefore, a detailed description thereof will be omitted. When the low-refractive-index layer (120) is present on both the upper and lower portions of the color conversion layer (130) as shown in Fig. 4, the luminous efficiency of the color conversion panel (100) can be further improved.

[0122] Fig. 5 is a cross-sectional view according to a variation of Fig. 2. Referring to Fig. 5, a color conversion panel (100) according to a variation may further include a first capping layer (150) and a second capping layer (160). Fig. 5 illustrates a variation that includes both the first capping layer (150) and the second capping layer (160), but either one of them may be omitted.

[0123] The first capping layer (150) is formed on the planarization layer (140) and covers the planarization layer (140). Therefore, it can be formed after the step of forming the planarization layer (140). The first capping layer (150) can be formed over the entire surface of the substrate (110).

[0124] The second capping layer (160) is formed between the low-refractive-index layer (120) and the color conversion layer (130), and like the first capping layer (150), can be formed over the entire surface of the substrate (110). Therefore, the second capping layer (160) can be formed between the low-refractive-index layer (120) forming step and the color conversion layer (130) forming step.

[0125] The first capping layer (150) and the second capping layer (160) may also be made of a material having a low refractive index, similar to the low refractive index layer (120), and for example, SiN. xIt may include a material such as . The first capping layer (150) forming an interface with the planarization layer (140), and the second capping layer (160) positioned between the low-refractive-index layer (120) and the planarization layer (140), or between the low-refractive-index layer (120) and the color conversion layer (130) to form an interface therewith are also made of a material having a low refractive index, thereby minimizing cases where light incident on the first capping layer (150) and the second capping layer (160) is reflected or scattered. As a result, a color conversion panel (100) with improved light efficiency can be provided by minimizing optical loss at the interface.

[0126] In the case of a color conversion panel (100) including a first capping layer (150) and a second capping layer (160), a luminous efficiency increase effect of 150% or more can be exhibited compared to a color conversion panel (100) that does not include a low-refractive-index layer (120), a first capping layer (150), and a second capping layer (160) at all.

[0127] Above, a color conversion panel (100) according to one embodiment of the present invention and a method for manufacturing the same have been described. According to this, a color conversion panel (100) including quantum dots or the like can be provided in which luminous efficiency by quantum dots is improved.

[0128] Another embodiment of the present invention provides a display device including a color conversion panel according to the above embodiment.

[0129] The above display device may be a display device using quantum dots, OLEDs, mini LEDs, micro LEDs, nanorod LEDs, etc., or a flexible display device, but is not limited thereto.

[0130] Hereinafter, preferred embodiments of the present invention are described. However, the following examples are only preferred embodiments of the present invention, and the present invention is not limited to the following examples.

[0131]

[0132] Example

[0133] Synthetic example: Preparation of hydrolysis condensation reaction products

[0134] Synthesis Example 1

[0135] In a 2,000 ml three-necked flask, 55.62 g (0.5 mol) of methyltrimethoxy silane (MTMS) and 85.07 g (0.5 mol) of tetraethoxy orthosilicate (TEOS) were added, 212.14 g of hollow particles dispersed in methanol (Suhyun Advanced Materials TSM60M, 20%) were added, and while stirring at room temperature, 147.14 g of water and 0.03 g of 36% HCl aqueous solution were added dropwise. After stirring for 30 minutes, reflux reaction was performed at 70°C for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (A). The solid content (A) of the solution thus obtained was 19.15%. The polystyrene-converted weight-average molecular weight (Mw) of the obtained solid content (A) was 1,420 g / mol. The weight-average molecular weight was measured using gel permeation chromatography (GPC: HLC-8220GPC, Tosoh Corporation).

[0136]

[0137] Synthesis Example 2

[0138] In a 2,000 ml three-necked flask, add 56.83 g (0.5 mol) of Methyltrimethoxy silane (MTMS) and 86.91 g (0.5 mol) of Teteraethoxy orthosilicate (TEOS), add 184.23 g of hollow particles dispersed in methanol (Suhyun Advanced Materials TSM60M, 20%) and 21.67 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 30%), and stir at room temperature, and dropwise add 150.33 g of water and 0.03 g of 36% HCl aqueous solution. After stirring for 30 minutes and refluxing for about 4 hours at 70℃, 500g of PGMEA was added, and by-products such as methanol and ethanol were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (B). The solid content (B) of the solution thus obtained was 20.55%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (B) was 1,650g / mol.

[0139]

[0140] Synthesis Example 3

[0141] In a 2,000 ml three-necked flask, add 58.08 g (0.5 mol) of Methyltrimethoxy silane (MTMS) and 88.83 g (0.5 mol) of Teteraethoxy orthosilicate (TEOS), add 155.08 g of hollow particles dispersed in methanol (Suhyun Advanced Materials TSM60M, 20%) and 44.31 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 30%), and stir at room temperature, and dropwise add 153.65 g of water and 0.04 g of 36% HCl aqueous solution. After stirring for 30 minutes and refluxing for about 4 hours at 70℃, 500g of PGMEA was added, and by-products such as methanol and ethanol were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (C). The solid content (C) of the solution thus obtained was 21.05%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (C) was 1,850g / mol.

[0142]

[0143] Synthesis Example 4

[0144] In a 2,000 ml three-necked flask, add 59.85 g (0.50 mol) of Methyltrimethoxy silane (MTMS) and 91.54 g (0.5 mol) of Teteraethoxy orthosilicate (TEOS), add 114.14 g of hollow particles dispersed in methanol (Suhyun Advanced Materials TSM60M, 20%) and 76.10 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 30%), and stir at room temperature, and dropwise add 158.33 g of water and 0.04 g of 36% HCl aqueous solution. After stirring for 30 minutes and refluxing for about 4 hours at 70℃, 500g of PGMEA was added, and by-products such as methanol and ethanol were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (D). The solid content (D) of the solution thus obtained was 20.65%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (D) was 1,410g / mol.

[0145]

[0146] Synthesis Example 5

[0147] In a 2,000 ml three-necked flask, 77.79 g (0.75 mol) of Methyltrimethoxy silane (MTMS) and 39.66 g (0.25 mol) of Teteraethoxy orthosilicate (TEOS) were added, and 245.33 g of hollow particles dispersed in methanol (TSM60M, 100%, Suhyun Advanced Materials) were added dropwise. While stirring at room temperature, 137.19 g of water and 0.03 g of 36% HCl aqueous solution were added dropwise. After stirring for 30 minutes, reflux reaction was performed at 70℃ for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to perform solvent replacement to obtain a solution of hydrolysis condensation reaction products (E). The solid content (E) of the solution thus obtained was 19.35%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid (E) was 1,420 g / mol.

[0148]

[0149] Synthesis Example 6

[0150] In a 2,000 ml three-necked flask, 87.55 g (0.75 mol) of Methyltrimethoxy silane (MTMS) and 44.63 g (0.25 mol) of Teterethoxy orthosilicate (TEOS) are added, and 190.62 g of hollow particles dispersed in methanol (Suhyun Advanced Materials TSM60M, 85%) and 22.77 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 15%) are added. While stirring at room temperature, 154.40 g of water and 0.03 g of 36% HCl aqueous solution are added dropwise. After stirring for 30 minutes and refluxing for about 4 hours at 70℃, 500g of PGMEA was added, and by-products such as methanol and ethanol were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (F). The solid content (F) of the solution thus obtained was 20.35%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (F) was 1,630g / mol.

[0151]

[0152] Synthesis Example 7

[0153] In a 2,000 ml three-necked flask, 89.49 g (0.75 mol) of Methyltrimethoxy silane (MTMS) and 45.62 g (0.25 mol) of Teteraethoxy orthosilicate (TEOS) are added, and 160.48 g of hollow particles dispersed in methanol (Suhyun Advanced Materials TSM60M, 70%) and 46.55 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 30%) are added, and while stirring at room temperature, 157.82 g of water and 0.04 g of 36% HCl aqueous solution are added dropwise. After stirring for 30 minutes, reflux reaction was carried out at 70℃ for about 4 hours, 500g of PGMEA was added, and by-products such as methanol and ethanol were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (G). The solid content (G) of the solution thus obtained was 20.62%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (G) was 1,750g / mol.

[0154]

[0155] Synthesis Example 8

[0156] In a 2,000 ml three-necked flask, add 92.23 g (0.75 mol) of Methyltrimethoxy silane (MTMS) and 47.02 g (0.25 mol) of Teteraethoxy orthosilicate (TEOS), add 118.12 g of hollow particles dispersed in methanol (Suhyun Advanced Materials TSM60M, 50%) and 79.95 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 50%), and stir at room temperature, and dropwise add 162.65 g of water and 0.04 g of 36% HCl aqueous solution. After stirring for 30 minutes and refluxing for about 4 hours at 70℃, 500g of PGMEA was added, and by-products such as methanol and ethanol were removed using a vacuum pump to replace the solvent, thereby obtaining a hydrolysis condensation reaction product (H). The solid content (H) of the solution thus obtained was 20.17%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (H) was 1,680g / mol.

[0157]

[0158] Synthesis Example 9

[0159] In a 2,000 ml three-necked flask, 46 g (0.4 mol) of methyltrimethoxy silane (MTMS) and 105.52 g (0.6 mol) of tetraethoxy orthosilicate (TEOS) were added, and 196.35 g of hollow silica dispersed in methanol (Suhyun TSM60M 100%) was added, and while stirring at room temperature, 152.10 g of water and 0.03 g of 36% HCl aqueous solution were added dropwise. After stirring for 30 minutes, a reflux reaction was performed at 70°C for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent and obtain a solution of hydrolysis condensation reaction product (I). The solid content (I) of the solution thus obtained was 20.54%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid (I) was 1,580 g / mol.

[0160]

[0161] Comparative synthesis example 1

[0162] In a 2,000 ml three-necked flask, 101.55 g (0.50 mol) of Methyltrimethoxy silane (MTMS) and 155.30 g (0.5 mol) of Teterethoxy orthosilicate (TEOS) were added, and 149.09 g of PGMEA was added, and while stirring at room temperature, 93.99 g of water and 0.06 g of 36% HCl aqueous solution were added dropwise. After stirring for 30 minutes, reflux reaction was performed at 70°C for about 4 hours, 200 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (a). The solid content (a) of the solution thus obtained was 19.85%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid (a) was 2,350 g / mol.

[0163]

[0164] Comparative synthesis example 2

[0165] In a 2000 ml three-necked flask, 22.20 g (0.25 mol) of Methyltrimethoxy silane (MTMS), 24.29 g (0.15 mol) of Methacryloxypropyl trimethoxysilane (MAPTMS), and 81.49 g (0.6 mol) of Teterethoxy orthosilicate (TEOS) were added, and 254.52 g of non-hollow nano-silica dispersed in methanol (Nissan MA-ST 100%) was added, and 117.47 g of water and 36% HCl aqueous solution were added dropwise while stirring at room temperature. After stirring for 30 minutes, reflux reaction was performed at 70°C for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of hydrolysis condensation reaction product (b). The solid content of the solution (b) thus obtained was 20.45%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (b) was 1,450 g / mol.

[0166]

[0167] Comparative synthesis example 3

[0168] In a 2,000 ml three-necked flask, 22.04 g (0.25 mol) of Methyltrimethoxy silane (MTMS), 24.11 g (0.15 mol) of Methacryloxypropyl trimethoxysilane (MAPTMS), and 80.90 g (0.6 mol) of Teterethoxy orthosilicate (TEOS) were added, and 256.30 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N5 100%) was added dropwise while stirring at room temperature. After stirring for 30 minutes, 116.61 g of water and 0.03 g of 36% HCl aqueous solution were added dropwise. After refluxing at 70°C for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent, thereby obtaining a solution of the hydrolysis condensation reaction product (c). The solid content (c) of the solution thus obtained was 21.03%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (c) was 1,510 g / mol.

[0169]

[0170] Comparative synthesis example 4

[0171] In a 2,000 ml three-necked flask, 77.48 g (0.75 mol) of Methyltrimethoxy silane (MTMS) and 39.50 g (0.25 mol) of Teterethoxy orthosilicate (TEOS) were added, and 246.34 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N5 100%) was added dropwise. After stirring at room temperature, 136.65 g of water and 0.03 g of 36% HCl aqueous solution were added dropwise. After stirring for 30 minutes, reflux reaction was performed at 70℃ for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent and obtain a solution of hydrolysis condensation reaction product (d). The solid content (d) of the solution thus obtained was 21.60%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid (d) was 1,630 g / mol.

[0172]

[0173] Comparative synthesis example 5

[0174] In a 2,000 ml three-necked flask, 77.48 g (0.75 mol) of methyltrimethoxy silane (MTMS) and 39.50 g (0.25 mol) of tetraethoxy orthosilicate (TEOS) were added, and 246.34 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 100%) was added, and while stirring at room temperature, 136.65 g of water and 0.03 g of 36% HCl aqueous solution were added dropwise. After stirring for 30 minutes, a reflux reaction was performed at 70°C for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent and obtain a solution of the hydrolysis condensation reaction product (e). The solid content (e) of the solution thus obtained was 20.42%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid (e) was 1,570 g / mol.

[0175]

[0176] Comparative synthesis example 6

[0177] In a 2,000 ml three-necked flask, 30.69 g (0.75 mol) of methyltrimethoxy silane (MTMS) and 15.65 g (0.25 mol) of tetraethoxy orthosilicate (TEOS) were added, and 399.53 g of non-hollow nano-silica dispersed in methanol (Suhyun LSM430N9 100%) was added, and while stirring at room temperature, 54.12 g of water and 0.01 g of HCl (36%) were added dropwise. After stirring for 30 minutes, a reflux reaction was performed at 70°C for about 4 hours, 500 g of PGMEA was added, and methanol and ethanol, which are reaction by-products, were removed using a vacuum pump to replace the solvent and obtain a solution of the hydrolysis condensation reaction product (f). The solid content (f) of the solution thus obtained was 21.23%. The polystyrene-converted weight average molecular weight (Mw) of the obtained solid content (f) was 1,850 g / mol.

[0178]

[0179] The specific components and their contents in the reactants used to manufacture the hydrolysis condensation reaction products according to the above Synthesis Examples 1 to 9 and Comparative Synthesis Examples 1 to 6 are summarized in Table 1 below.

[0180] Silane compound (mol) Hollow particle ratio Hollow nano silica MTMSTEOSMAPTMS Weight % Diameter (nm) Weight % Diameter (nm) Weight % Synthesis example 10.5 0.5 0 4 0 7 0 6 0-0 Synthesis example 20.5 0.5 0 4 1 7 0 5 3 9 0 6 Synthesis example 30.5 0.5 0 4 2 7 0 4 5 9 0 1 3 Synthesis example 40.5 0.5 0 4 4 7 0 3 3 9 0 2 2 Synthesis example 50.7 5 0.25 0 3 2 7 0 6 8 0-0 Synthesis example 60.7 5 0.25 0 3 8 7 0 5 5 9 0 7 Synthesis example 70.7 5 0.25 0 3 9 7 0 4 7 9 0 1 4 Synthesis example 80.7 5 0.25 0 4 1 7 0 3 5 9 0 2 4 Synthesis example 90.4 0.6 0 4 4 7 0 5 6 9 0 Comparative synthesis example 10.50.50100----Comparative Synthesis Example 20.250.150.1533-015100Comparative Synthesis Example 30.250.150.1533-050100Comparative Synthesis Example 40.750.25032-050100Comparative Synthesis Example 50.750.25032-090100Comparative Synthesis Example 60.750.25010-090100

[0181] In the above Table 1, the content (weight%) means the content based on the total weight of the reactants used to obtain the hydrolysis condensation reaction product.

[0182]

[0183] Example: Preparation of curable resin composition

[0184] Example 1

[0185] A curable resin composition is prepared by mixing 79 wt% of the solid content of Synthesis Example 1, 1 wt% of a fluorinated surfactant (F-563, DIC), and 20 wt% of a porogen (PPG-2000) and stirring for about 30 minutes.

[0186]

[0187] Examples 2 to 9

[0188] Curable resin compositions according to Examples 2 to 9 are each prepared in the same manner as Example 1, except that Synthesis Examples 2 to 9 are used instead of Synthesis Example 1.

[0189]

[0190] Comparative Example 1

[0191] A curable resin composition is prepared by mixing 39 wt% of the solid content of Comparative Synthesis Example 1, 40 wt% of hollow silica particles (LD-20, Nano New Materials Co.), 1 wt% of a fluorinated surfactant (F-563, DIC Co.), and 20 wt% of a porogen (PPG-2000) and stirring for about 30 minutes.

[0192]

[0193] Comparative Example 2

[0194] A curable resin composition is prepared by mixing 39 wt% of solid content of Comparative Synthesis Example 1, 34 wt% of hollow silica particles (LD-20, Nano New Materials Co., Ltd.), 6 wt% of non-hollow nano-silica (Soohyun Advanced Materials SSA350U5), 1 wt% of fluorinated surfactant (F-563, DIC Co., Ltd.), and 20 wt% of porogen (PPG-2000) and stirring for about 30 minutes.

[0195]

[0196] Comparative Example 3

[0197] A curable resin composition is prepared by mixing 39 wt% of solid content of Comparative Synthesis Example 1, 28 wt% of hollow silica particles (LD-20, Nano New Materials Co.), 12 wt% of non-hollow nano-silica (Soohyun Advanced Materials SSA350U5), 1 wt% of fluorinated surfactant (F-563, DIC Co.), and 20 wt% of porogen (PPG-2000) and stirring for about 30 minutes.

[0198]

[0199] Comparative Example 4

[0200] A curable resin composition is prepared by mixing 39 wt% of the solid content of Comparative Synthesis Example 2, 30 wt% of hollow silica particles (LD-20, Nano New Materials Co., Ltd.), 1 wt% of a fluorinated surfactant (F-563, DIC Co., Ltd.), and 30 wt% of a porogen (PPG-2000) and stirring for about 30 minutes.

[0201]

[0202] Comparative Examples 5 to 7

[0203] A curable resin composition is prepared in the same manner as in Comparative Example 4, except that the solid content of Comparative Synthesis Examples 3 to 5 is used instead of Comparative Synthesis Example 2.

[0204]

[0205] Comparative Example 8

[0206] A curable resin composition is prepared in the same manner as in Comparative Example 1, except that Comparative Synthesis Example 6 is used instead of Comparative Synthesis Example 1.

[0207]

[0208] The components and contents of the curable resin compositions according to Examples 1 to 9 and Comparative Examples 1 to 8 are summarized in Table 2 below.

[0209] Hydrolysis Condensation Reaction Product Hollow Particles (Wt%) Non-hollow Nano Silica (Wt%) PPG-2000 (Wt%) F-563 (Wt%) Type Content (Wt%) Example 1 Synthesis Example 179--201 Example 2 Synthesis Example 279--201 Example 3 Synthesis Example 379--201 Example 4 Synthesis Example 479--201 Example 5 Synthesis Example 579--201 Example 6 Synthesis Example 679--201 Example 7 Synthesis Example 779--201 Example 8 Synthesis Example 879--201 Example 9 Synthesis Example 979--201 Comparative Example 1 Comparative Synthesis Example 13940-201 Comparative Example 2 Comparative Synthesis Example 139346201 Comparative Example 3 Comparative Synthesis Example 1392812201Comparative Example 4Comparative Synthesis Example 23930-301Comparative Example 5Comparative Synthesis Example 33930-301Comparative Example 6Comparative Synthesis Example 43930-301Comparative Example 7Comparative Synthesis Example 53930-301Comparative Example 8Comparative Synthesis Example 63940-201

[0210]

[0211] Manufacturing and evaluation of cured films

[0212] The compositions according to the above examples and comparative examples were spin-coated on a glass substrate measuring 100 mm x 100 mm in length and width using a spin coater (Mikasa, Opticoat MS-A100) at 200 rpm / 5 s for 10 minutes, and then pre-baked using a hot plate at 100°C for 2 minutes to form a film. Thereafter, the film was cured and dried at 230°C for 20 minutes to obtain a cured film having a thickness of 1.2 μm, and the thickness of the cured coating film was measured using Alpha-step (Surface profiler KLA, Tencor).

[0213]

[0214] Evaluation 1: Refractive Index and Haze Evaluation

[0215] For each cured film manufactured according to the above examples and comparative examples, the refractive index at 550 nm was measured using a spectroscopic ellipsometer (Ellipsometer Base-160, JAWoollam Co.), and the haze was measured at a wavelength of 650 nm using a hazemeter (NDH-2000(N)), and the results are shown in Table 3 below.

[0216]

[0217] Evaluation 2: Indentation hardness and indentation modulus

[0218] Each cured film manufactured according to the above examples and comparative examples was placed on top on a 2T thick soda lime glass plate at 25℃. The cured film was pressed with a Vickers particle in the shape of a straight diamond pyramid with a square base at a constant force of 3 mN for 15 seconds at a loading speed, then creeped for 5 seconds and relaxed for 15 seconds to measure the indentation hardness and indentation modulus. The indentation hardness and indentation modulus were measured using an HM2000LT Micro Indentor (Fisher), and the results are shown in Table 3 below.

[0219]

[0220] Evaluation 3: Adhesion Evaluation

[0221] A SiOx upper film is formed on each of the cured films manufactured according to the above examples and comparative examples using a chemical vapor deposition (PE-CVD). Thereafter, this upper film is cross-cut to a depth of about 100 ㎛ and a final cutting area of ​​about 15 mm X 15 mm in accordance with the ASTM D3359 international standard test method, and a taping test is performed using a 4.5 N / m tape, and the results are shown in Table 3 below. According to the definition of the evaluation value disclosed in the ASTM D3359 international standard test method, the ratio of the area torn off by the tape in the cut area is expressed as an adhesion evaluation index as follows:

[0222] (Adhesion evaluation index)

[0223] 0B: 100% peeling (entire surface peeled)

[0224] 1B: 80% peeling

[0225] 2B: 60% peeling

[0226] 3B: 40% peeling

[0227] 4B: 20% peeling

[0228] 5B: 0% peeling (no peeling)

[0229]

[0230] Evaluation 4: Luminous Efficiency Characteristics

[0231] After spin-coating 2 ml of the curable resin composition according to the above examples and comparative examples at 1,500 rpm on a glass substrate, the cured film formed by exposing it to 5 J for 9 seconds in a nitrogen UV exposure device was measured for the initial blue light conversion rate using a light efficiency meter (QE-2100, Otsuka). The results are shown in Table 3 below.

[0232] Refractive index haze indentation hardness (Hv) modulus (Mpa) adhesion light efficiency (%) Example 11.27 0.125 56 445 5 B 100 Example 21.28 0.105 87 55 0 5 B 100 Example 31.28 0.156 0 85 0 0 5 B 100 Example 41.38 0.086 21 00 0 5 B 90 Example 51.27 0.42 53 7 6 0 0 5 B 98 Example 61.29 0.20 59 86 0 0 5 B 96 Example 71.31 0.156 0 88 0 0 5 B 89 Example 81.32 0.30 61 89 0 0 5 B 88 Example 91.21 0.40 50 52 0 0 B 100 Comparative example 11.262.102555000B100Comparative Example 21.292.502656000B95Comparative Example 31.302.902761000B90Comparative Example 41.240.153252000B100Comparative Example 51.240.363152500B97Comparative Example 61.240.503054005B79Comparative Example 71.260.802556005B96Comparative Example 81.330.324265005B90

[0233]

[0234] Referring to Table 3 above, it was confirmed that a curable resin composition including a product obtained by condensation reaction of a reactant containing both a silane compound and a hollow particle had a relatively low refractive index and a small haze value compared to a curable resin composition obtained by separately adding hollow particles to a product obtained by condensation reaction of only a silane compound. In addition, it was confirmed that the mechanical properties were excellent because the indentation hardness and indentation modulus were relatively high, and the optical properties were confirmed to be excellent because the optical efficiency was excellent. In addition, in the evaluation of adhesion with a deposited film, it was confirmed that the adhesion was generally excellent without peeling, confirming that the cured film according to one embodiment had very high adhesion with the upper film.

[0235] While specific embodiments of the present invention have been described and illustrated above, it will be apparent to those skilled in the art that the present invention is not limited to the described embodiments, and that various modifications and variations can be made without departing from the spirit and scope of the present invention. Accordingly, such modifications or variations should not be understood individually from the technical spirit or perspective of the present invention, and such modified embodiments should fall within the scope of the claims of the present invention.

[0236] [Explanation of symbols]

[0237] 100: Color conversion panel 110: Substrate

[0238] 112: Protective layer 120: Low refractive index layer

[0239] 130: Color conversion layer 132: First color conversion member

[0240] 133: First quantum dot 134: Second color conversion member

[0241] 135: Second quantum dot 136: Transmitting element

[0242] 140: Flattening layer 150: First capping layer

[0243] 160: Second capping layer A: First region

[0244] B: Area 2 C: Area 3

Claims

A curable resin composition comprising a hydrolysis condensation reaction product of a reactant including a silane compound and hollow particles represented by the following chemical formula 1, and a solvent: [Chemical Formula 1] (R 1 ) a (R 2 ) b (R 3 ) c -Si-(OR 4 ) 4-a-b-c In the above chemical formula 1, R 1 Inland R 3 are each independently hydrogen, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, R x (C=O)-(where, R x is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, or a substituted or unsubstituted C6 to C30 aryl group), an epoxy group, a (meth)acrylate group, a (meth)acryloyloxy group, or a combination thereof, R 4 is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, or a combination thereof, a, b, and c are, independently, real numbers greater than or equal to 0, and 0 ≤ a+b+c < 4. In the first paragraph, the hollow particles are fine particles of a hollow metal oxide including TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, or a combination thereof, a curable resin composition. In the first paragraph, a curable resin composition further comprising fine particles of a metal oxide including TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, or a combination thereof, which do not include hollow spaces. In the first paragraph, a curable resin composition further comprising an organic polymer having a boiling point of 100°C to 250°C. In the fourth paragraph, the organic polymer is a curable resin composition comprising a polyalkylene oxide copolymer, a polyarylene oxide copolymer, a glycol copolymer, or a combination thereof. In the first paragraph, the curable resin composition includes a compound of chemical formula 1 wherein a+b+c=0 and a compound of chemical formula 1 wherein a+b+c=1. In the sixth paragraph, a curable resin composition in which the weight ratio of the compound of chemical formula 1 in which a+b+c=0 and the compound of chemical formula 1 in which a+b+c=1 is 0:10 to 5:

5. In the first paragraph, a curable resin composition in which the weight ratio of the silane compound and the hollow particles in the reactant is 3:7 to 8:

2. In the first paragraph, a curable resin composition wherein the average diameter of the hollow particles is 50 nm to 100 nm. In the third paragraph, a curable resin composition wherein the average diameter of the fine particles of the metal oxide not including the hollow space is 50 nm to 150 nm. In the third paragraph, a curable resin composition in which the fine particles of the metal oxide that do not include the hollow portion are included in an amount of 0 to 30 wt% based on the total weight of the reactants. In the third paragraph, a curable resin composition comprising 20 to 70 wt% of the fine particles of the metal oxide that do not include the hollow particles and the hollow particles based on the total weight of the hydrolysis condensation reaction product. In the fourth paragraph, a curable resin composition comprising 0 to 30 wt% of the organic polymer based on the total weight of the curable resin composition. In the first paragraph, a curable resin composition comprising 30 wt% to 80 wt% of the hydrolysis condensation reaction product based on the total weight of the curable resin composition. In the first paragraph, a curable resin composition wherein the weight average molecular weight (Mw) of the hydrolysis condensation reaction product is 500 g / mol to 100,000 g / mol. A thin film manufactured by curing a curable resin composition according to any one of claims 1 to 15. A color conversion panel comprising a thin film according to Article 16. A display device comprising a color conversion panel according to Article 17.

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