Double-sided plating jig and substrate through-hole filling device including same

Abstract

The present invention relates to: a double-sided plating jig that can simultaneously fill a through-hole of a substrate with a conductive metal from both surfaces of the substrate; and a substrate through-hole filling device including the double-sided plating jig. The double-sided plating jig according to an embodiment of the present invention may comprise: a first jig base that faces a first surface of the substrate; a second jig base that faces a second surface opposite the first surface of the substrate, and is secured to the first jig base, while the substrate is disposed therebetween, to press and fix the substrate; and a power connection unit provided on at least one of the first jig base or the second jig base and connected to the substrate.

Description

Jig for double-sided plating and device for filling a substrate through-hole having the same

[0001] The present invention relates to a double-sided plating jig and a substrate through-hole filling device having the same, and more particularly, to a double-sided plating jig capable of simultaneously filling a conductive metal into a through-hole of a substrate on both sides of the substrate, and a substrate through-hole filling device having the double-sided plating jig.

[0002] Recently, with the high integration of semiconductor devices, the demand for miniaturization and high performance of semiconductor devices is increasing. However, the fine pattern technology of tens of nm or less has reached its physical limit, and it is difficult to satisfy the above demands with only the technological advancement of equipment.

[0003] To overcome these limitations, methods for vertically connecting multiple substrates have been developed, and among them, Through-Silicon-Via (TSV) technology is a technology that electrically connects copper-filled substrates by vertically stacking them in through-vias formed in silicon wafers, and is being applied in actual semiconductor processing fields.

[0004] Recently, active research has been conducted on Through-Glass-Via (TGV) technology to improve the heat resistance, insulation properties, and expansion issues of TSVs. TGV technology electrically connects copper-filled substrates by vertically stacking them through glass-formed through-vias.

[0005] Glass substrates offer a smooth surface, high resistance to temperature-related deformation, and superior signal characteristics, making them ideal for overcoming the shortcomings of conventional plastic substrates. In particular, with the miniaturization of chip circuitry, substrate circuits can be drawn in fine detail, and larger surfaces can be expanded for larger designs.

[0006] However, it is very difficult to fill copper into the through-holes of a glass substrate, and therefore, commercialization of glass substrates has not yet been achieved.

[0007] Therefore, in order to commercialize glass substrates, development of technology and equipment capable of filling copper into the through-holes of the glass substrate is required.

[0008] The present invention is intended to solve the above problems, and provides a double-sided plating jig capable of simultaneously filling a conductive metal into a through hole of a substrate on both sides of the substrate.

[0009] In addition, the present invention provides a substrate through-hole filling device capable of filling a conductive metal into a through-hole of a substrate using the double-sided plating jig.

[0010] A double-sided plating jig according to one embodiment of the present invention may include: a first jig base facing a first side of the substrate; a second jig base facing a second side of the substrate, which is the opposite side of the first side, and fixed to the first jig base while the substrate is interposed therebetween to press-fix the substrate; and a power connection unit provided on at least one of the first jig base and the second jig base and connected to the substrate.

[0011] According to one embodiment of the present invention, a substrate through-hole filling device may include: a double-sided plating jig for fixing the substrate; a bath for receiving an electrolyte in which the double-sided plating jig is immersed, and a pair of anode plates immersed in the received electrolyte so as to face each other at a predetermined distance from each other; a power supply unit for applying power to the substrate and the pair of anode plates; a jig fixing unit for fixing the double-sided plating jig; a moving unit for moving the jig fixing unit; and a control unit for controlling the moving unit to position the double-sided plating jig between the pair of anode plates.

[0012] According to an embodiment of the present invention, a double-sided plating jig and a substrate through-hole filling device having the above-described configuration, a conductive metal can be uniformly filled into the through-hole of the substrate simultaneously on both sides of the substrate.

[0013] The effects according to the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention pertains from the description of the claims and detailed description.

[0014] FIG. 1 is a drawing showing a method for filling a substrate through-hole according to one embodiment of the present invention.

[0015] Figure 2 is a schematic plan view of a substrate through-hole filling device according to one embodiment of the present invention.

[0016] Fig. 3 is a schematic vertical cross-sectional view of a filling device according to Fig. 2, schematically showing a state in which a double-sided plating jig with a substrate fixed thereon is immersed in an electrolyte contained in a bath.

[0017] Figure 4 is a drawing schematically showing a moving part according to one embodiment of the present invention.

[0018] Fig. 5 is a drawing schematically showing the arrangement of a substrate fixed by a double-sided plating jig illustrated in Fig. 3.

[0019] Figure 6 is a perspective view showing a state in which a double-sided plating jig according to one embodiment of the present invention is fixed to a jig fixing part.

[0020] Figure 7 is a schematic exploded perspective view of Figure 6,

[0021] Figure 8 is a schematic front view of Figure 6,

[0022] Figure 9 is a schematic cross-sectional view taken along line AA of Figure 8,

[0023] Figure 10 is a schematic cross-sectional view taken along line BB of Figure 8,

[0024] Figure 11 is a schematic perspective view of a cleaning unit according to one embodiment of the present invention.

[0025] Fig. 12 is a schematic vertical cross-sectional view showing a state in which a double-sided plating jig is inserted into the cleaning section according to Fig. 11.

[0026] FIG. 13 is a front view of a cleaning module according to an embodiment of the present invention, viewed from the outside.

[0027] Figure 14 is a drawing schematically showing a storage tank unit according to one embodiment of the present invention.

[0028] Hereinafter, embodiments according to the present invention will be described with reference to the attached drawings.

[0029] While the present invention is susceptible to numerous modifications and variations, specific embodiments thereof are illustrated in the drawings and will be described in detail below. However, the invention is not intended to be limited to the particular forms disclosed; rather, the invention includes all modifications, equivalents, and alternatives consistent with the spirit of the invention as defined by the claims.

[0030] When explaining with reference to the attached drawings, identical components are given the same drawing reference numerals, and duplicate explanations thereof are omitted.

[0031] The thickness or size of each layer (film), area, pattern or structure in the drawings may be modified or exaggerated for clarity and convenience of explanation, and the present invention is not limited by the relative sizes or thicknesses shown in the attached drawings.

[0032] Meanwhile, each embodiment may be implemented independently or together, and some components may be excluded in accordance with the purpose of the invention.

[0033] Additionally, directional terms such as 'upper', 'lower', 'upper side', 'lower side', 'one side', 'the other side', 'top', 'bottom', 'upper', 'lower', 'front', 'rear', and the like may be used in connection with the orientation of the disclosed drawings. Since the components of embodiments of the present invention may be positioned in various orientations, directional terms are used for illustrative purposes and not for limitation.

[0034] Additionally, terms such as first, second, etc. may be used to describe various components, but the components are not limited to the terms and may be used for the purpose of distinguishing one component from another.

[0035] FIG. 1 is a drawing showing a method for filling a substrate through-hole according to one embodiment of the present invention.

[0036] Referring to FIG. 1, a substrate through-hole filling method (S10) according to one embodiment of the present invention may include a through-hole forming step (S11), a seed layer forming step (S12), and a through-hole conductive metal filling step (S13).

[0037] The above through hole forming step (S11) is a step of forming a through hole penetrating a substrate. The substrate may be a substrate made of a material such as ceramic, polymer, silicon, or glass, and the through hole may be formed using etching, laser, or the like.

[0038] The above seed layer forming step (S12) is a step of forming a seed layer on the surface of the substrate in which the through hole is formed, and the seed layer can be formed by a method such as deposition, sputtering, or electroless plating.

[0039] The above through-hole conductive metal filling step (S13) is a step of filling a conductive metal into the through-hole of the substrate on which the seed layer is formed, and the filling step (S13) can be performed by an electroplating method.

[0040] Here, the conductive metal may be copper. For example, in the through-hole filling step (S13), when the substrate on which the seed layer is formed is immersed in an electrolyte containing copper ions, and power is applied with the substrate as a cathode and the electrolyte as an anode, copper ions are deposited in the through-holes of the substrate on which the seed layer is formed, so that the through-holes can be filled with copper.

[0041] FIG. 2 is a schematic plan view of a substrate penetration hole filling device according to an embodiment of the present invention, FIG. 3 is a schematic vertical cross-sectional view of the filling device according to FIG. 2, and is a drawing schematically showing a state in which a double-sided plating jig with a substrate fixed thereon is immersed in an electrolyte contained in a bath, and FIG. 4 is a drawing schematically showing a moving part according to an embodiment of the present invention.

[0042] A substrate through-hole filling device (10) according to one embodiment of the present invention is a device used in the through-hole conductive metal filling step (S13), and is a device for filling a through-hole of a substrate with a conductive metal using an electroplating method.

[0043] Referring to FIGS. 2 to 4, a substrate penetration hole filling device (10) according to one embodiment of the present invention may include a bath (11), a pair of anode plates (12), a double-sided plating jig (100) for fixing a substrate (20), a jig fixing unit (40), a moving unit (30), a power unit (13), and a controller (15).

[0044] An electrolyte (14) is contained in the above bath (11), and the pair of positive electrode plates (12) can be immersed in the electrolyte (14) contained in the bath (11) so as to face each other at a predetermined interval.

[0045] The above power supply unit (13) may be a rectifier that converts alternating current into direct current, and the substrate (20) may be connected to the cathode of the power supply unit (13), and the pair of positive electrode plates (12) may be connected to the anode of the power supply unit (13).

[0046] A fixing bracket (16) for fixing the pair of bipolar plates (12) may be provided on one side of the above-mentioned bath (11), and a bipolar power connection unit (19) for connecting the pair of bipolar plates (12) to the bipolar of the power supply unit (13) may be provided.

[0047] The above double-sided plating jig (100), as shown in Fig. 3, can fix the substrate (20) so that both sides of the substrate (20) can be exposed to the electrolyte (14) when immersed in the electrolyte (14) contained in the bath (11). A detailed description thereof will be provided later.

[0048] The above jig fixing part (40) is a configuration in which the double-sided plating jig (100) is fixed, and as shown in FIG. 3, the double-sided plating jig (100) can be fixed vertically to the jig fixing part (40) so that the substrate (20) is vertically arranged when immersed in the electrolyte (14) contained in the bath (11).

[0049] In addition, the double-sided plating jig (100) and the jig fixing part (40) may be provided so that the substrate (20) can be connected to the negative electrode of the power supply (13) when the double-sided plating jig (100) is fixed to the jig fixing part (40). A detailed description thereof will be provided later.

[0050] The above moving part (30) is configured to move the jig fixing part (40). For example, the moving part (30) may be provided so as to move the jig fixing part (40) in the x-axis direction, the y-axis direction, and the z-axis direction.

[0051] Then, the moving part (30) can move the jig fixing part (40) in the x, y, and z-axis directions, respectively, and immerse the double-sided plating jig (100) in the electrolyte (14) stored in the bath (11) so that the substrate (20) is positioned between the pair of anode plates (12).

[0052] Referring to FIG. 4, the moving part (30) may include a first moving guide part (31) that guides the movement of the jig fixing part (40) in the up-and-down direction (z-axis direction in the drawing), a second moving guide part (32) that guides the movement of the first moving guide part (31) in the left-right direction (x-axis direction in the drawing), a third moving guide part (33) that guides the movement of the second moving guide part (32) in the longitudinal direction (y-axis direction in the drawing), and a support part (34) that supports the third moving guide part (33).

[0053] The above control unit (15) can control the power unit (13) and the moving unit (30).

[0054] For example, when a user fixes the double-sided plating jig (100) to the jig fixing part (40) in the loading & unloading zone (35), the control part (15) controls the moving part (30) to move the jig fixing part (40) in the x-axis direction and the y-axis direction, respectively, and then lowers it, thereby allowing the double-sided plating jig (100) to be immersed in the electrolyte (14) stored in the bath (11) in the state shown in FIG. 4, that is, in a state in which it is positioned between the pair of anode plates (12).

[0055] Thereafter, the control unit (15) can turn on the power of the power unit (13) while the moving unit (30) is stopped. Then, since the substrate (20) is connected to the negative pole of the power unit (13) and the pair of positive plates (12) are connected to the positive pole of the power unit (13), a conductive metal can be filled in the through hole of the substrate (20).

[0056] Meanwhile, referring to FIG. 3, the filling device (10) may further include a magnetic stirrer (17) provided at the bottom of the bath (11) to stir the electrolyte (14) contained in the bath (11).

[0057] The magnetic stirrer (17) may include a magnet provided inside and rotating when power is supplied, and a magnetic bar (18) provided inside the bath (11) and rotating according to the rotation of the magnet to stir the electrolyte contained in the bath (11).

[0058] Fig. 5 is a drawing schematically showing the arrangement of a substrate fixed by the double-sided plating jig illustrated in Fig. 3.

[0059] Referring to FIG. 5, a substrate (20) according to one embodiment of the present invention may include a first surface (21), a second surface (22) opposite to the first surface, and a plurality of through holes (23) penetrating the first surface (21) and the second surface (22).

[0060] The above through hole (23) may have a shape that is narrowest at the center (24) and gradually widens from the center (24) toward the first surface (21) and the second surface (22).

[0061] A seed layer (26) can be formed on the entire surface of the substrate (20), that is, the first surface (21), the second surface (22) and the side surface (25) of the through hole (23).

[0062] As shown in Fig. 5, the substrate (20) can be fixed in a vertically arranged state. Then, the through hole (23) of the substrate (20) becomes horizontal.

[0063] At this time, when power of the power supply unit (13) is applied while both sides of the substrate (20), that is, the first side (21) and the second side (22), are exposed to the electrolyte (14), the conductive metal is first filled from the center (24) of the narrowest through hole (23), and as the conductive metal is filled on both sides centered on the conductive metal filled in the center (24), that is, in the direction of the first side (21) and the second side (22), the through hole (23) can be evenly filled with the conductive metal on both sides (21, 22) of the substrate (20) at the same time.

[0064] Therefore, in order to ensure that the through hole (23) is evenly filled with the conductive metal on both sides (21, 22) of the substrate (20) at the same time, it is necessary to maintain the substrate (20) in a vertically arranged state so that both sides (21, 22) of the substrate (20) are exposed to the electrolyte (14) contained in the bath (11).

[0065] To this end, the double-sided plating jig (100) fixes the substrate (20) in a state where both sides (21, 22) of the substrate (20) are exposed to the electrolyte (14) contained in the bath (11), and the substrate (20) can be fixed in a state vertically arranged on the jig fixing part (40) so that it is immersed in the electrolyte (14) in a vertically arranged state.

[0066] FIG. 6 is a perspective view showing a state in which a double-sided plating jig according to one embodiment of the present invention is fixed to a jig fixing part, FIG. 7 is a schematic exploded perspective view of FIG. 6, FIG. 8 is a schematic front view of FIG. 6, FIG. 9 is a schematic cross-sectional view taken along line AA of FIG. 8, and FIG. 10 is a schematic cross-sectional view taken along line BB of FIG. 8.

[0067] Referring to FIGS. 6 to 10, the double-sided plating jig (100) can be fixed in a vertical position to the jig fixing part (40).

[0068] For example, the double-sided plating jig (100) may be fixed by a predetermined fixing member (45) after the upper portion of the double-sided plating jig (100) is inserted into an insertion groove (41) formed at the front end of the jig fixing member (40) while being placed vertically.

[0069] In addition, the jig fixing part (40) may be provided with a contact part (42) connected to the negative pole of the power supply part (13), and the double-sided plating jig (100) may be provided with a power connection part (150) that connects the substrate (20) to the contact part (42) when fixed to the jig fixing part (40).

[0070] Then, it is convenient because the substrate (20) can be connected to the negative electrode of the power supply unit (13) simply by fixing the double-sided plating jig (100) to which the substrate (20) is fixed to the jig fixing unit (40).

[0071] The power connection part (150) may include a first contact part (110) that contacts the surface of the substrate (20), a second contact part (160) that contacts the contact part (42) when the double-sided plating jig (100) is fixed to the jig fixing part (40), and a wiring part (120) that connects the first contact part (110) and the second contact part (160).

[0072] In addition, the double-sided plating jig (100) may include a mounting groove (170) in which the wiring portion (120) is mounted, and a sealing portion (130) that seals the mounting groove (170) in which the wiring portion (120) is mounted.

[0073] Then, not only can the wiring section (120) be stably fixed, but also the wiring section (120) can be prevented from being exposed to the electrolyte (14) and corroded.

[0074] The above sealing portion (130) may be formed of a sealing member (130) that is injected into the mounting groove (170) and hardened while the wiring portion (120) is mounted in the mounting groove (170).

[0075] The sealing member (130) is a material that can be injected into the mounting groove (170) and hardened, and any material that can fix and seal the wiring portion (120) mounted in the mounting groove (170) is not relevant. For example, a thermosetting resin such as epoxy, silicone, an adhesive, etc. can be used as the sealing member (130).

[0076] Additionally, a downwardly inclined inclined portion (180) may be provided at the lower portion of the double-sided plating jig (100).

[0077] Then, when the double-sided plating jig (100) is lifted upward by the moving part (30) while being immersed in the electrolyte (14) contained in the bath (11), the electrolyte applied to the double-sided plating jig (100) can flow down smoothly.

[0078] Meanwhile, the double-sided plating jig (100) may include a first jig base (101) facing the first side (21) of the substrate (20) and a second jig base (102) facing the second side (22) of the substrate (20).

[0079] The above substrate (20) can be fixed in a state of being interposed between the first jig base (101) and the second jig base (102).

[0080] For example, the second jig base (102) can be fixed to the first jig base (101) while the substrate (20) is interposed therebetween to press and fix the substrate (20).

[0081] At this time, the first jig base (101) and the second jig base (102) may be provided so that the through hole (23) on both sides (21, 22) of the substrate (20) can be exposed to the electrolyte.

[0082] For example, the first jig base (101) and the second jig base (102) may each include a frame (103) that presses the edge of the substrate (20) and a hollow hole (104) formed on the inside of the frame (103) to expose the through hole (23).

[0083] In the drawing, one embodiment of the first jig base (101) and the second jig base (102) is shown in which the shape of the frame (103) has a roughly rectangular shape, but the present invention is not limited thereto, and the shape of the frame (103) may have a circular or polygonal shape in addition to a rectangular shape.

[0084] Likewise, although the drawing shows one embodiment of the first jig base (101) and the second jig base (102) in which the shape of the hollow hole (104) has a circular shape, the present invention is not limited thereto, and the shape of the hollow hole (104) may have a square or larger polygonal shape in addition to a circular shape.

[0085] That is, the frame (103) can be formed in any shape for fixing the substrate (20) by pressing the edge of the substrate (20), and the hollow hole (104) can be formed in any shape for exposing the through hole (23) of the substrate (20), and the present invention is not limited by the shape of the frame (103) and the shape of the hollow hole (104).

[0086] The above double-sided plating jig (100) may include a fixing member (107) that fixes the first jig base (101) and the second jig base (102) while the substrate (20) is interposed between the first jig base (101) and the second jig base (102).

[0087] For example, the fixing member (107) may be formed in a screw shape, and a fixing hole (108) to which the fixing member (107) is coupled may be formed in the frame (103) of each of the first jig base (101) and the second jig base (102).

[0088] Then, by connecting and fixing the fixing member (107) through the fixing hole (108) while the substrate (20) is interposed between the first jig base (101) and the second jig base (102), the first jig base (101) and the second jig base (102) can be connected and fixed to each other, and accordingly, the substrate (20) can be press-fixed while being interposed between the first jig base (101) and the second jig base (102).

[0089] Additionally, the first jig base (101) and the second jig base (102) may include an extension portion (109) extending upward from one side of the frame (103).

[0090] Meanwhile, the first contact portion (110) may be provided on the frame (103), and the second contact portion (160) may be provided on the upper portion of the extension portion (109).

[0091] The above-mentioned settling groove (170) may be provided in the frame (103) and the extension (109). For example, the above-mentioned settling groove (170) may be provided from the upper portion of the first contact portion (110) along the frame (103) and the extension (109) to the upper portion of the extension (109).

[0092] A fixing groove (165) may be formed on the upper portion of the extension (109) to which the second contact portion (160) is seated and fixed, and the second contact portion (160) may be fixed by a fixing member such as a predetermined screw while seated in the fixing groove (165).

[0093] The above-mentioned slope (180) may be provided at the lower part of the frame (103).

[0094] As shown in FIGS. 6 and 7, since a predetermined step (183) is formed between the frame (103) and the substrate (20), when the double-sided plating jig (100) is lifted upward by the moving part (30) while being immersed in the electrolyte (14) stored in the bath (11), the electrolyte on the double-sided plating jig (100) accumulates in the step (183) and does not flow down smoothly.

[0095] Accordingly, when the inclined portion (180) is formed on the step portion (183) at the bottom of the frame (103), when the double-sided plating jig (100) is lifted upward by the moving portion (30) while being immersed in the electrolyte (14) contained in the bath (11), the electrolyte accumulated in the step portion (183) can flow smoothly downward along the inclined portion (180).

[0096] The first contact portion (110) and the second contact portion (160) are configured to connect the surface of the substrate (20) to the cathode of the power supply portion (13), and may be made of a metal material so that electricity can be conducted.

[0097] Referring to FIG. 10, the first contact portion (110) may include a base (111) fixed to the frame (103), a head (112) movably coupled to the base (111), and an elastic member (113) provided between the base (111) and the head (112) to provide elasticity so that the head (112) contacts the surface of the substrate (20).

[0098] The above base (111) can be fixed to the frame (103) in various forms. For example, the base (111) can be fixed by being pressed into a press-fit hole (105) formed in the frame (103).

[0099] Meanwhile, the power connection part (150) may be provided in at least one of the first jig base (101) and the second jig base (102), and accordingly, the first contact part (110) may also be provided in at least one of the first jig base (101) and the second jig base (102).

[0100] For example, when the first contact portion (110) is provided on the first jig base (101), the first contact portion (110) can contact the first surface (21) of the substrate (20) facing the first jig base (101), and when the first contact portion (110) is provided on the second jig base (102), the first contact portion (110) can contact the second surface (22) of the substrate (20) facing the second jig base (102).

[0101] Since the seed layer (26) is formed on the surface of the substrate (20), that is, the first surface (21), the second surface (22) of the substrate (20) and the side surface (25) of the through hole (23), when the first contact portion (110) contacts one of the first surface (21) and the second surface (22) of the substrate (20), electricity can also be conducted to the remaining surface, that is, the other surface and the side surface (25).

[0102] Preferably, as shown in the drawing, the power connection part (150) may be provided on each of the first jig base (101) and the second jig base (102), and accordingly, the first contact part (110), the wiring part (120), and the second contact part (160) may also be provided on each of the first jig base (101) and the second jig base (102).

[0103] As described above, when the conductive metal is filled in the through hole (23), the conductive metal is first filled from the center (24) of the narrowest through hole (23), and the conductive metal is filled on both sides with the conductive metal filled in the center (24) as the center, that is, in the direction of the first surface (21) and the second surface (22). At this time, when the first contact portion (110) comes into contact with both sides (21, 22) of the substrate (20), the amount of current applied to each of the first surface (21) and the second surface (22) becomes constant, and accordingly, the conductive metal can be uniformly filled in the direction of each of the first surface (21) and the second surface (22) with the center (24) as the standard.

[0104] Referring to FIG. 7, the contact portion (42) provided on the jig fixing portion (40) may include an upper portion (47) to which a wire (46) connected to the negative pole of the power supply portion (13) is connected, a first extension portion (43) extending downward from one side of the upper portion (47) so that the second contact portion (161) of the first jig base (101) comes into contact when the double-sided plating jig (100) is fixed to the jig fixing portion (40), and a second extension portion (44) extending downward from the other side of the upper portion (47) so that the second contact portion (162) of the second jig base (102) comes into contact when the double-sided plating jig (100) is fixed to the jig fixing portion (40).

[0105] Then, when the double-sided plating jig (100) is fixed to the jig fixing part (40), the second contact part (161) of the first jig base (101) and the second contact part (162) of the second jig base (102) can smoothly come into contact with the contact part (42).

[0106] In addition, the first contact portion (110) may be provided in plurality at predetermined intervals on each of the first jig base (101) and the second jig base (102). Then, current can be evenly applied to the entire first surface (21) and the entire second surface (22), and accordingly, the conductive metal can be evenly filled in the entire plurality of through holes (23).

[0107] The drawing shows a form of a mounting groove (120) in which four first contact portions (110) are provided on each of the first jig base (101) and the second jig base (102), one second contact portion (160) is provided on each of the first jig base (101) and the second jig base (102), and a wiring portion (120) that connects the four first contact portions (110) to the one second contact portion (160) is mounted.

[0108] Meanwhile, referring to FIG. 9, the double-sided plating jig (100) may include a first sealing member (140) interposed between the frame (1031) of the first jig base (101) and the first surface (21) of the substrate (20) to press the first surface (21) when the first jig base (101) and the second jig base (102) are fixed, and a second sealing member (141) interposed between the frame (1032) of the second jig base (102) and the second surface (22) of the substrate (20) to press the second surface (22) when the first jig base (101) and the second jig base (102) are fixed.

[0109] Then, the substrate (20) can be prevented from being damaged by the compression fixation by the first sealing member (140) and the second sealing member (141).

[0110] In particular, when the substrate (20) is a glass substrate, the glass substrate may be broken by compression fixation. However, when the first sealing member (140) and the second sealing member (141) are provided, the glass substrate can be prevented from being broken.

[0111] In addition, the double-sided plating jig (100) may include a third sealing member (142) that is interposed between the frame (1031) of the first jig base (101) and the frame (1032) of the second jig base (102) and is pressed when the first jig base (101) and the second jig base (102) are fixed.

[0112] At this time, the first contact portion (110) may be provided in an area between at least one of the first sealing member (140) and the second sealing member (141) and the third sealing member (142).

[0113] Since the area between the first sealing member (140), the second sealing member (141), and the third sealing member (142) is an area where electrolyte inflow is prevented, if the first contact portion (110) is provided in the area, electrolyte inflow into the first contact portion (110) can be prevented.

[0114] For example, when the first contact portion (110) is provided on the frame (1031) of the first jig base (101), the first contact portion (110) may be provided in an area between the first sealing member (140) and the third sealing member (142), and when the first contact portion (110) is provided on the frame (1032) of the second jig base (102), the first contact portion (110) may be provided in an area between the second sealing member (141) and the third sealing member (142).

[0115] In addition, a first mounting groove (1034) for mounting the first sealing member (140) may be formed in the frame (1031) of the first jig base (101), a second mounting groove (1035) for mounting the second sealing member (141) may be formed in the frame (1032) of the second jig base (102), and a third mounting groove (1036) for mounting the third sealing member (142) may be formed in at least one of the frame (1031) of the first jig base (101) and the frame (1032) of the second jig base (102).

[0116] Meanwhile, after the double-sided plating jig (100) is immersed in the electrolyte (14) contained in the bath (11) and the through hole (23) of the substrate (20) is filled with a conductive metal, the double-sided plating jig (100) is raised to the upper part of the bath (11). At this time, it is necessary to wash away the electrolyte that has accumulated on the double-sided plating jig (100).

[0117] To this end, the filling device (10) according to one embodiment of the present invention may include a cleaning unit (50) for cleaning the double-sided plating jig (100).

[0118] As shown in Fig. 2, the cleaning unit (50) may be provided at a position adjacent to the bath (11), and the moving unit (30) may be provided so as to move the jig fixing unit (40) to the cleaning unit (50).

[0119] In addition, the filling device (10) according to one embodiment of the present invention may include a storage tank unit (80) in which cleaning liquid to be supplied to the cleaning unit (50) is stored, and an air compressor (79) for supplying air to the cleaning unit (50).

[0120] FIG. 11 is a schematic perspective view of a cleaning unit according to an embodiment of the present invention, FIG. 12 is a schematic vertical cross-sectional view showing a state in which a double-sided plating jig is inserted into the cleaning unit according to FIG. 11, FIG. 13 is a front view of a cleaning module according to an embodiment of the present invention as viewed from the outside, and FIG. 14 is a drawing schematically showing a storage tank unit according to an embodiment of the present invention.

[0121] Referring to FIGS. 11 to 13, a cleaning unit (50) according to one embodiment of the present invention may include a cleaning base (52) having an internal space (51) into which the double-sided plating jig (100) is inserted, and a cleaning module (60) provided in the cleaning base (52) to spray at least one of a cleaning solution and air into the internal space (51).

[0122] The cleaning module (60) may include a plate (61) provided on the cleaning base (52), an injection passage (70) formed inside the plate (61), an inlet (73) formed on the outer surface (62) of the plate (61) through which at least one of a cleaning liquid and air is introduced into the injection passage (70), and an injection port (76) formed on the inner surface (63) of the plate (61) through which at least one of the cleaning liquid and air introduced into the injection passage (70) is injected into the internal space (51).

[0123] The above injection path (70), the inlet (73) and the injection port (76) may be provided so as to evenly clean the double-sided plating jig (100) inserted into the internal space (51) of the cleaning base (52).

[0124] For example, the injection path (70) may be formed to be long in the vertical direction, and may be provided in multiple numbers spaced apart at predetermined intervals in the horizontal direction. In addition, two inlets (73) may be provided at the upper and lower portions of the injection path (70), and a plurality of injection holes (76) may be provided spaced apart at predetermined intervals in the vertical direction of the injection path (70).

[0125] For example, the injection path (70) may include a cleaning solution injection path (71), the inlet (73) may include a cleaning solution inlet (74) through which cleaning solution flows into the cleaning solution injection path (71), and the injection port (76) may include a cleaning solution injection port (77) through which the cleaning solution flowing into the cleaning solution injection path (71) is sprayed.

[0126] In addition, as shown in FIG. 14, the storage tank unit (80) may include a first storage cartridge (81) in which a new cleaning solution for cleaning the double-sided plating jig (100) is stored, and a first pump (82) that supplies the new cleaning solution stored in the first storage cartridge (81) to the cleaning solution inlet (74).

[0127] The above-mentioned washing liquid inlet (74) may be provided with a washing pipe joint (741) to which a pipe connected to the first pump (82) is connected.

[0128] Then, the control unit (15) controls the moving unit (30) to insert the double-sided plating jig (100) into the internal space (51) of the cleaning base (52), and then operates the first pump (82) to wash the double-sided plating jig (100), thereby removing the electrolyte that has adhered to the double-sided plating jig (100).

[0129] In addition, a drain (53) for discharging the waste cleaning solution used to wash the double-sided plating jig (100) may be provided at the bottom of the cleaning base (52), and the storage tank (80) may include a second storage cartridge (83) for storing the waste cleaning solution, and a second pump (84) for collecting the waste cleaning solution into the second storage cartridge (83).

[0130] In another embodiment, the injection path (70) may include an air injection path (72), the inlet (73) may include an air inlet (75) through which air is introduced into the air injection path (72), and the injection port (76) may include an air injection port (78) through which air introduced into the air injection path (72) is injected.

[0131] At this time, the air compressor (79) may be provided to supply air to the air inlet (75), and the air inlet (75) may be provided with an air pipe joint (751) to which a pipe connected to the air compressor (79) is connected.

[0132] Then, the control unit (15) controls the moving unit (30) to insert the double-sided plating jig (100) into the internal space (51) of the cleaning base (52), and then operates the air compressor (79) to wash the double-sided plating jig (100), thereby removing the electrolyte or cleaning solution on the double-sided plating jig (100).

[0133] In another embodiment, as shown in FIG. 13, the cleaning unit (50) can clean the double-sided plating jig (100) using both a cleaning solution and air.

[0134] That is, the injection path (70) may include the cleaning solution injection path (71) and the air injection path (72), the inlet (73) may include the cleaning solution inlet (74) and the air inlet (75), and the injection port (76) may include the cleaning solution injection port (77) and the air injection port (78).

[0135] Then, the control unit (15) controls the moving unit (30) to insert the double-sided plating jig (100) into the internal space (51) of the cleaning base (52), then operates the first pump (82) to remove the electrolyte on the double-sided plating jig (100), and then operates the air compressor (79) to remove the cleaning solution on the double-sided plating jig (100).

[0136] At this time, the cleaning solution injection path (71) and the air injection path (72) may be provided in multiple alternate configurations. Then, the effect of cleaning using the cleaning solution and air can be maximized.

[0137] Meanwhile, the cleaning module (60) can be detachably mounted on the cleaning base (52).

[0138] For example, the side of the cleaning base (52) may be provided with a side frame (54) and a side hole (55) formed on the inside of the side frame, and the plate (61) may include a rim portion (64) that is fixedly joined to the side frame (54), and a protrusion portion (65) that protrudes from the rim portion (64) and is inserted into the side hole (55) when the rim portion (64) is fixed to the side frame (54).

[0139] The above-mentioned frame portion (64) can be detachably fixed to the side frame (54) by screw connection using a predetermined fixing member (66), and a sealing member (67) can be provided on the inner surface of the above-mentioned frame portion (64).

[0140] When the double-sided plating jig (100) is washed, the electrolyte on the double-sided plating jig (100) flies and gets on the inner surface of the cleaning module (60) and the inside of the cleaning base (52). Therefore, it is necessary to periodically wash the inside of the cleaning base (52) and the cleaning module (60).

[0141] Therefore, if the cleaning module (60) is detachably provided on the cleaning base (52), it is convenient to be able to wash the cleaning base (52) and the cleaning module (60) after detaching the cleaning module (60) from the cleaning base (52).

[0142] As shown in Fig. 12, the cleaning module (60) may be formed as a pair that are detachably mounted on two facing side portions of the cleaning base (52).

[0143] For example, as shown in FIG. 11, the cleaning base (52) may have a shape of a roughly rectangular parallelepiped having four side portions, and the side frame (54) and the side hole (55) may be formed on two side portions that face each other among the four side portions, and the cleaning module (60) may be provided on two side portions that face each other among the four side portions.

[0144] At this time, a viewing window (56) may be provided on the other two of the four side portions to allow viewing of the internal space (51) of the cleaning base (52).

[0145] In addition, an insertion hole (57) into which the double-sided plating jig (100) is inserted may be formed on the upper part of the cleaning base (52), and a scattering prevention part (58) detachably coupled to the upper part of the cleaning base (52) may be provided around the insertion hole (57).

[0146] In this way, if the anti-spray part (58) is provided around the insertion hole (57), the electrolyte remaining on the double-sided plating jig (100) can be prevented from splattering to the outside of the cleaning base (52) when the double-sided plating jig (100) is cleaned.

[0147] Meanwhile, as shown in FIG. 14, the storage tank unit (80) may further include, in addition to the first storage cartridge (81), the first pump (82), the second cartridge (83), and the second pump (84), a third cartridge (85) in which fresh electrolyte to be supplied to the bath (11) is stored, a third pump (86) in which fresh electrolyte stored in the third cartridge (85) is supplied to the bath (11), a fourth cartridge (87) in which spent electrolyte stored in the bath (11) is stored, and a fourth pump (88) in which spent electrolyte stored in the bath (11) is collected by the fourth cartridge (87).

[0148] In addition, the storage tank section (80) may be provided with a cartridge frame (89) that detachably fixes the first storage cartridge (81), the second storage cartridge (83), the third storage cartridge (85), and the fourth storage cartridge (87). Then, the storage cartridges can be easily replaced.

[0149] At this time, the first pump (82), the second pump (84), the third pump (86), and the fourth pump (88) may be provided at the bottom of the cartridge frame (89).

[0150] As described above, the present invention relates to a double-sided plating jig capable of simultaneously filling a conductive metal into a through-hole of a substrate on both sides of the substrate, and a substrate through-hole filling device having the double-sided plating jig, and the embodiment thereof may be modified in various ways. Therefore, the present invention is not limited to the embodiments disclosed in this specification, and all forms that can be modified by a person of ordinary skill in the art to which the present invention pertains are also within the scope of the present invention.

Claims

1. In a double-sided plating jig that fixes a substrate having multiple through holes and a seed layer formed on the surface, A first jig base facing the first surface of the above substrate; A second jig base facing the second side of the substrate, which is the opposite side of the first side, and fixed to the first jig base while the substrate is interposed therebetween to press and fix the substrate; and A double-sided plating jig comprising a power connection part provided on at least one of the first jig base and the second jig base and connected to the substrate.

2. A double-sided plating jig, characterized in that in the first paragraph, the first jig base and the second jig base include a frame for pressing the edge of the substrate, a hollow hole formed on the inside of the frame to expose the through hole, and an extension portion extending upward from one side of the frame.

3. A double-sided plating jig characterized in that in the second paragraph, the power connection part includes a first contact part provided in the frame and in contact with the surface of the substrate, a second contact part provided on the upper portion of the extension part, and a wiring part connecting the first contact part and the second contact part.

4. A double-sided plating jig according to claim 3, characterized in that the first contact portion includes a base fixed to the frame, a head movably coupled to the base, and an elastic member provided between the base and the head to provide elasticity so that the head contacts the surface of the substrate.

5. A double-sided plating jig, characterized in that in the third paragraph, the frame and the extension are provided with a mounting groove in which the wiring portion is mounted, and a sealing portion that seals the mounting groove in which the wiring portion is mounted.

6. A double-sided plating jig, characterized in that in the second paragraph, a downwardly inclined inclined portion is provided at the step portion of the frame and the substrate at the lower portion of the frame.

7. In the third paragraph, the power connection part is provided in each of the first jig base and the second jig base, The first contact part provided on the frame of the first jig base and the first contact part provided on the frame of the second jig base are each provided in multiple numbers at predetermined intervals. A double-sided plating jig, characterized in that the extension of the first jig base is provided with one second contact portion to which the first contact portions of the plurality of first jig bases are connected, and the extension of the second jig base is provided with one second contact portion to which the first contact portions of the plurality of second jig bases are connected.

8. In the third paragraph, the double-sided plating jig includes a first sealing member interposed between the frame of the first jig base and the first surface of the substrate to press the first surface when the first jig base and the second jig base are fixed, a second sealing member interposed between the frame of the second jig base and the second surface of the substrate to press the second surface when the first jig base and the second jig base are fixed, and a third sealing member interposed between the frame of the first jig base and the frame of the second jig base. A double-sided plating jig, characterized in that the first contact portion is provided in an area between at least one of the first sealing member and the second sealing member and the third sealing member.

9. In a substrate through-hole filling device that fills a conductive metal into the through-holes of a substrate having a plurality of through-holes and a seed layer formed on the surface, A jig for double-sided plating that fixes the above substrate; A bath that receives an electrolyte in which the above-described double-sided plating jig is immersed, and is equipped with a pair of anode plates that are immersed in the received electrolyte so as to face each other at a predetermined interval; A power supply unit that supplies power to the above substrate and the pair of positive electrode plates; A jig fixing part to which the above double-sided plating jig is fixed; A moving part that moves the above jig fixing part; and A substrate through-hole filling device comprising a control unit for controlling the moving unit to position the double-sided plating jig between the pair of anode plates.

10. In the 9th paragraph, the double-sided plating jig is characterized in that it fixes the substrate in a state where both sides of the substrate are exposed to the electrolyte, and is fixed in a state where the substrate is vertically arranged to the jig fixing part so that the substrate is immersed in the electrolyte in a vertically arranged state. A substrate through-hole filling device.

11. A substrate through-hole filling device, characterized in that in paragraph 9, the jig fixing part is provided with a contact part connected to the negative pole of the power supply part, and the double-sided plating jig is provided with a power connection part that connects the substrate to the contact part when fixed to the jig fixing part.

12. A substrate through-hole filling device, characterized in that in the 11th paragraph, the power connection part includes a first contact part that contacts the surface of the substrate, a second contact part that contacts the contact part when the double-sided plating jig is fixed to the jig fixing part, and a wiring part that connects the first contact part and the second contact part.

13. A substrate through-hole filling device, characterized in that in the 12th paragraph, the double-sided plating jig is provided with a mounting groove in which the wiring portion is mounted, and a sealing portion that seals the mounting groove in which the wiring portion is mounted.

14. A substrate through-hole filling device, characterized in that, in the 10th paragraph, a downwardly inclined inclined portion is provided at the lower portion of the double-sided plating jig.

15. In the 9th paragraph, the substrate through-hole filling device includes a cleaning unit for cleaning the double-sided plating jig, and the control unit controls the moving unit to move the double-sided plating jig to the bath and the cleaning unit. A substrate through-hole filling device.

16. A substrate through-hole filling device according to claim 15, wherein the cleaning unit comprises a cleaning base having an internal space into which the double-sided plating jig is inserted, and a cleaning module provided in the cleaning base and spraying at least one of a cleaning solution and air into the internal space.

17. In the 16th paragraph, the cleaning module is characterized in that it includes a plate provided on the cleaning base, a spray path formed inside the plate, an inlet formed on the outer surface of the plate through which at least one of a cleaning liquid and air is introduced into the spray path, and a spray port formed on the inner surface of the plate through which at least one of the cleaning liquid and air introduced into the spray path is injected into the internal space.

18. A substrate penetration hole filling device according to claim 17, characterized in that the cleaning module is detachably provided on a side surface of the cleaning base.

19. A substrate through-hole filling device according to claim 18, wherein the side portion of the fraud cleaning base is provided with a side frame and a side hole formed on the inside of the side frame, and the plate includes a frame that is fixedly joined to the side frame and a protrusion that protrudes from the frame portion and is inserted into the side hole when the frame is fixed to the side frame.

20. In the 15th paragraph, the substrate penetration hole filling device includes a storage tank section having a first storage cartridge storing a new cleaning solution for cleaning the double-sided plating jig, a second storage cartridge storing a used cleaning solution for cleaning the double-sided plating jig, a third cartridge storing a new electrolyte to be supplied to the bath, and a fourth cartridge storing a used electrolyte stored in the bath. The above storage tank section includes a cartridge frame that detachably fixes the first storage cartridge, the second storage cartridge, the third storage cartridge, and the fourth storage cartridge, A substrate through-hole filling device characterized in that a first pump for supplying fresh cleaning solution stored in the first storage cartridge to the cleaning unit, a second pump for collecting spent cleaning solution discharged from the cleaning unit to the second storage cartridge, a third pump for supplying fresh electrolyte stored in the third cartridge to the bath, and a fourth pump for collecting spent electrolyte stored in the bath to the fourth cartridge are provided at the lower portion of the cartridge frame.

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