Memory heat dissipation apparatus and method

Abstract

The present application discloses a memory heat dissipation apparatus and method, which are applied to the field of storage devices. The apparatus comprises: a heat conducting bottom shell provided with a heat conducting surface, wherein the heat conducting bottom shell is used for being fitted with a memory and conducting heat of the memory to the heat conducting surface; a ventilating housing provided on the heat conducting bottom shell, the ventilating housing being internally provided with a ventilating cavity, and the bottom of the ventilating housing being provided with a plurality of air injection ports; and a plurality of vibration assemblies mounted in the ventilating cavity, wherein the vibration assemblies correspond to the air injection ports in a one-to-one correspondence manner, each vibration assembly comprises a first piezoelectric vibration sheet assembly and a second piezoelectric vibration sheet assembly spaced apart from each other, the first piezoelectric vibration sheet assembly is used for vibrating to provide an air flow, the second piezoelectric vibration sheet assembly is used for vibrating to open or close the air injection port, and when the air injection ports are opened, the air flow flows out in a direction perpendicular to the heat conducting surface. The memory heat dissipation apparatus provided by the present application can enhance the heat dissipation effect on the heat conducting surface, mitigate the problem of low heat exchange efficiency caused by a boundary layer of the heat conducting surface in the case of advection, improve the overall heat dissipation efficiency, and reduce noise.

Description

A memory heat dissipation device and method

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410986482.6, filed on July 23, 2024, entitled "A Memory Heat Dissipation Device and Method", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of storage devices, and in particular to a memory heat dissipation device and method. Background Technology

[0004] With the rapid development of information technology, server performance has continuously improved, and hard drives, as the core component of data storage, have also seen significant increases in capacity, read / write speed, and data transfer rate. However, with the increase in hard drive performance and density, the heat generated during operation has also increased dramatically.

[0005] In related technologies, active cooling, which has a better heat dissipation effect, is generally used to achieve heat dissipation of hard drives. It mainly relies on built-in fans or external cooling systems to quickly remove heat from the hard drive and the surrounding environment through forced airflow, ensuring that the hard drive operates within a suitable temperature range.

[0006] However, in active cooling technologies, the airflow direction is parallel to the hard drive surface. Because air has viscous forces, an air boundary layer forms, where the airflow slows down closer to the hard drive surface and eventually becomes almost stationary. While the air within this boundary layer is in contact with the heat source, convection is slow. The only way to increase cooling speed is to increase fan speed, thereby accelerating the movement of the boundary layer and improving heat exchange efficiency. However, this method does not significantly improve cooling performance. On the contrary, the increased fan speed generates higher noise and vibration, negatively impacting the operating environment and hard drive stability, resulting in low overall heat exchange efficiency. Summary of the Invention

[0007] The purpose of this application is to provide a memory heat dissipation device and method to improve the heat dissipation efficiency of the memory and facilitate assembly.

[0008] To achieve the above objectives, this application provides the following technical solution:

[0009] A memory heat dissipation device, comprising:

[0010] The thermally conductive bottom shell has a thermally conductive surface. The thermally conductive bottom shell is used to fit with the memory and conduct the heat of the memory to the thermally conductive surface.

[0011] The ventilation housing is mounted on the heat-conducting bottom shell. The ventilation housing contains a ventilation cavity and has several air jets at the bottom.

[0012] Several vibration components are installed in the air exchange chamber, with each vibration component corresponding to a jet nozzle; including a first piezoelectric vibrating plate assembly and a second piezoelectric vibrating plate assembly arranged at intervals; the first piezoelectric vibrating plate assembly is used to vibrate to provide airflow, and the second piezoelectric vibrating plate assembly is used to vibrate to open or close the jet nozzle; when the jet nozzle is open, the airflow flows out in a direction perpendicular to the heat conduction surface.

[0013] On the other hand, the thermally conductive base is a metal casing, or the part of the thermally conductive base that contacts the memory is made of metal.

[0014] On the other hand, the first piezoelectric vibrator assembly is located on the side of the second piezoelectric vibrator assembly away from the nozzle; the first piezoelectric vibrator assembly is used to bend toward the direction close to or away from the nozzle when an alternating voltage is applied to provide airflow; the second piezoelectric vibrator assembly is used to bend toward the direction away from the nozzle to open the nozzle or reset to close the nozzle when a pulsed unidirectional voltage is applied; the first piezoelectric vibrator assembly and the second piezoelectric vibrator assembly periodically and synchronously deform in opposite directions.

[0015] On the other hand, the vibration assembly also includes at least two bases, which are installed at the bottom of the ventilation housing. The first piezoelectric vibrator assembly includes a first metal vibrator and a first piezoelectric ceramic, and the second piezoelectric vibrator assembly includes a second metal vibrator and a second piezoelectric ceramic. The first piezoelectric ceramic is disposed on the side of the first metal vibrator away from the air outlet, and the second piezoelectric ceramic is disposed on the side of the second metal vibrator away from the air outlet. The first end of the first metal vibrator and the first end of the second metal vibrator are mounted on one base, and the second end of the first metal vibrator and the second end of the second metal vibrator are mounted on another base.

[0016] On the other hand, the first piezoelectric ceramic is disposed at the top of the middle position of the first metal oscillator, and the second piezoelectric ceramic is disposed at the top of the middle position of the second metal oscillator.

[0017] On the other hand, the base is provided with slots, and the first metal diaphragm and the second metal diaphragm are movably installed in the corresponding slots. The slots have a preset depth to prevent the first metal diaphragm and the second metal diaphragm from coming out of the slots when bending.

[0018] On the other hand, the thickness of the slot is greater than the thickness of the first metal diaphragm and the second metal diaphragm, and the base is made of rubber, plastic or resin.

[0019] On the other hand, the jet nozzle is a jet groove, the width of the second metal diaphragm is greater than the width of the jet groove, and the width of the first metal diaphragm is 2-3 times the width of the second metal diaphragm.

[0020] On the other hand, it also includes a filter top cover, which is installed on the heat-conducting bottom shell; a heat-conducting cavity is formed between the heat-conducting bottom shell and the filter top cover, and the air exchange shell is located in the heat-conducting cavity; the filter top cover is provided with a first air inlet, the side wall of the heat-conducting bottom shell is provided with a first exhaust outlet, and the bottom of the heat-conducting bottom shell is in contact with the surface of the memory.

[0021] On the other hand, it also includes an air filter, which is installed on the first air intake. The number of air filters is the same as the number of first air intakes and they correspond one-to-one. The air filter is used to filter the air entering the heat conduction cavity.

[0022] On the other hand, a recess is provided on the side of the air exchange housing near the first air inlet, and the second air inlet is opened on the recess; after the air exchange housing is assembled into the heat-conducting housing, the thickness of the air filter is greater than the thickness of the filter top cover, and part of the structure of the air filter is embedded in the recess.

[0023] On the other hand, the heat-conducting bottom shell is a metal shell, and a first exhaust section is provided on the side of the heat-conducting bottom shell. Furthermore, a flow-gathering slope is provided on the side of the heat-conducting bottom shell where the first exhaust section is located, so that the first exhaust section gradually gathers from the side closest to the ventilation chamber to the other side.

[0024] On the other hand, the heat-conducting base is a flat metal shell, and the other three sides of the heat-conducting base are closed.

[0025] On the other hand, the filter top cover includes a top part and side parts located on both sides of the top part. The first air intake is located on the top part, and the side parts are fitted to both sides of the heat-conducting bottom shell. The side parts and the first exhaust part are located on different sides of the heat-conducting bottom shell.

[0026] On the other hand, the ventilation housing includes a ventilation bottom shell and a ventilation cover plate. The ventilation cover plate is installed on the ventilation bottom shell, and the ventilation cavity is located between the ventilation bottom shell and the ventilation cover plate. A second air inlet is provided on the ventilation cover plate.

[0027] Both the second air intake and the jet nozzle are strip-shaped, and the extension direction of the second air intake is the same as that of the jet nozzle. Furthermore, each vibration component is arranged sequentially along the extension direction of the jet nozzle, and the second air intake is located between adjacent vibration components, so that the projections of the second air intake and the vibration components in the direction perpendicular to the heat-conducting surface are staggered.

[0028] On the other hand, the jet nozzles are several rows of long strip nozzles set at the bottom of the ventilation base. The extension direction of the jet nozzles is parallel to the extension direction of the second piezoelectric vibrator assembly, and adjacent jet nozzles in each row are spaced apart.

[0029] On the other hand, the bottom of the air-suspension shell is provided with several air guide grooves on the side opposite to the air-suspension cavity. The extension direction of the air guide grooves is parallel to the heat-conducting surface, and the end of the air guide grooves is close to the jet nozzle. The jet nozzle is connected to the air guide grooves.

[0030] On the other hand, the bottom of the ventilation base is provided with at least three air guide grooves, and at least one air guide groove is located in the middle of the bottom of the ventilation base. The air guide grooves are arranged in parallel, and the bottom of the ventilation base is fitted with the heat-conducting surface so that an exhaust channel is formed between the air guide groove and the heat-conducting surface.

[0031] On the other hand, it also includes a snap-fit ​​component, which includes a fixing part and a snap-fit ​​part. The fixing part is mounted on the heat-conducting housing, and the movable part of the snap-fit ​​part is detachably snapped into the memory.

[0032] A memory heat dissipation method, employing the aforementioned memory heat dissipation device, includes:

[0033] Assemble the heat-conducting housing with the memory;

[0034] An alternating voltage is applied to the first piezoelectric vibrator assembly, and a pulsed unidirectional voltage is applied to the second piezoelectric vibrator assembly, causing the first and second piezoelectric vibrator assemblies to periodically and synchronously deform in opposite directions.

[0035] While the first piezoelectric vibrator assembly is bent toward the direction of the jet nozzle, the second piezoelectric vibrator assembly is bent toward the direction of the jet nozzle away from the jet nozzle, so that the jet nozzle opens and the airflow is ejected in a direction perpendicular to the heat-conducting surface;

[0036] While controlling the first piezoelectric vibrator assembly to bend in a direction away from the jet nozzle, the second piezoelectric vibrator assembly resets and closes the jet nozzle.

[0037] The memory heat dissipation device provided in this application has the following advantages: By setting a heat-conducting base shell, rapid heat conduction with the memory is achieved, transferring the memory's heat to the heat-conducting base shell; by installing a ventilation shell on the heat-conducting base shell, and by setting several air jets on the ventilation shell and several vibration components inside the ventilation cavity, the first piezoelectric vibrating plate assembly bends towards the direction close to the air jets, thus pushing the airflow inside the ventilation cavity; when the first piezoelectric vibrating plate assembly bends towards the direction close to the air jets, the second piezoelectric vibrating plate assembly bends towards the direction away from the air jets, opening the air jets and ejecting the airflow through them. Since the air jets are located in the ventilation cavity... The bottom of the housing is close to the heat-conducting surface of the heat-conducting bottom shell. Therefore, after the airflow passes through the nozzle, it will be ejected towards the heat-conducting surface, that is, the ejection direction of the airflow is perpendicular to the heat-conducting surface. At the same time, fresh air will pass through and enter the air exchange cavity. When the first piezoelectric vibrator assembly bends away from the nozzle, the second piezoelectric vibrator assembly is de-energized, which will close the nozzle and prevent gas from flowing back into the air exchange cavity. The first piezoelectric vibrator assembly bends upward, which will push the gas located at the top of the air exchange cavity to the periphery of the air exchange cavity, realizing the flow of gas in the air exchange cavity. The gas is ejected from the nozzle towards the heat-conducting surface, carrying away the heat from the heat-conducting surface and ensuring the heat dissipation effect.

[0038] This memory heat dissipation device utilizes the deformation of the first and second piezoelectric vibrating plate assemblies to achieve regular vibration under the application of alternating voltage, causing forced airflow in the surrounding environment. Under the vibration of several vibrating components, the airflow is ejected from the nozzle onto the heat-conducting surface of the heat-conducting housing and finally discharged from the nozzle of the heat-conducting housing, achieving forced heat exchange with the memory surface. By ejecting high-frequency airflow from the nozzle, the heat dissipation effect on the heat-conducting surface can be enhanced, effectively alleviating the problem of low heat transfer efficiency caused by the boundary layer under advection conditions, improving the overall heat dissipation efficiency, facilitating layout, simplifying the structure, and reducing manufacturing cost.

[0039] In some embodiments of this application, by setting a ventilation bottom shell and a ventilation cover plate, and setting a second air inlet on the ventilation cover plate, and by setting the second air inlet and the vibration component to be staggered in the direction perpendicular to the heat conduction surface, it is possible to prevent airflow from flowing out of the second air inlet plate when the first piezoelectric vibrator assembly bends upward, thereby ensuring that the airflow can flow smoothly from the top of the heat conduction cavity to the surrounding area of ​​the heat conduction cavity, realizing the circulation of airflow and improving heat dissipation efficiency.

[0040] The memory heat dissipation method provided in this application applies an alternating voltage to a first piezoelectric vibrator assembly and a pulsed unidirectional voltage to a second piezoelectric vibrator assembly. By adjusting the application time and frequency of the alternating voltage and the pulsed unidirectional voltage, the method controls the first piezoelectric vibrator assembly to bend towards the direction close to the nozzle, while the second piezoelectric vibrator assembly bends away from the nozzle, opening the nozzle. Under the action of the first piezoelectric vibrator assembly, airflow flows out through the nozzle and is ejected in a direction perpendicular to the heat-conducting surface. When the first piezoelectric vibrator assembly is controlled to bend away from the nozzle, the second piezoelectric vibrator assembly resets and closes the nozzle. At this time, the first piezoelectric vibrator assembly bends away from the nozzle. When the airflow curves, it pushes the gas at the top of the ventilation chamber to the bottom, enabling gas flow within the chamber. At this time, the second piezoelectric vibrator assembly is de-energized, closing the jet nozzle and preventing gas from flowing back into the ventilation chamber. This heat dissipation method applies an alternating voltage to the first piezoelectric vibrator assembly and a pulsed unidirectional voltage to the second piezoelectric vibrator assembly within a target time. The alternating voltage and the pulsed unidirectional voltage work together to achieve continuous airflow within the ventilation housing. The high-frequency airflow from the jet nozzle enhances the heat dissipation effect on the heat-conducting surface, effectively alleviating the problem of low heat transfer efficiency caused by the boundary layer under advection conditions. This results in high heat dissipation efficiency and reduced noise. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 is an exploded structural diagram of some embodiments of the memory heat dissipation device provided in this application;

[0043] Figure 2 is a schematic diagram of the vibration component in the memory heat dissipation device shown in Figure 1;

[0044] Figure 3 is a schematic diagram of the ventilation bottom shell in the memory heat dissipation device shown in Figure 1.

[0045] Figure 4 is an assembly diagram of the memory heat dissipation device and the memory provided in this application;

[0046] Figure 5 is a schematic diagram of the snap-fit ​​component in the memory heat dissipation device provided in this application;

[0047] Figure 6 is a cross-sectional view of the memory heat dissipation device and the memory shown in Figure 4;

[0048] Figure 7 is a schematic diagram of the memory heat dissipation device provided in this application;

[0049] Figure 8 is a flowchart of the memory heat dissipation method provided in this application.

[0050] Reference numerals: 100-Memory; 1-Heat-conducting housing; 11-Heat-conducting bottom housing; 111-First exhaust section; 112-Heat-conducting surface; 113-Converging slope; 12-Filter top cover; 121-First air inlet; 122-Top section; 123-Side section; 13-Air filter; 2-Ventilation housing; 21-Ventilation bottom housing; 211-Air jet; 212-Ventilation cavity; 213-Air guide groove; 22-Ventilation cover plate; 221-Second air inlet; 222-Recess; 3-Vibration assembly; 31-First piezoelectric vibrator assembly; 311-First metal vibrator; 312-First piezoelectric ceramic; 32-Second piezoelectric vibrator assembly; 321-Second metal vibrator; 322-Second piezoelectric ceramic; 33-Base; 331-Slot; 4-Snap-on component. Specific Implementation

[0051] The core of this application is to provide a memory heat dissipation device and method, which has a compact structure, low noise, high heat dissipation efficiency, and is easy to clean and maintain.

[0052] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0053] In some embodiments of this application, referring to FIG1, the memory heat dissipation device includes:

[0054] The heat-conducting bottom shell 11 is provided with a heat-conducting surface 112. The heat-conducting bottom shell 11 is used to fit with the memory 100 and conduct the heat of the memory 100 to the heat-conducting surface 112.

[0055] The ventilation housing 2 is disposed on the heat-conducting bottom shell 11. The ventilation housing 2 has a ventilation cavity 212 inside and several jet nozzles 211 at the bottom.

[0056] Several vibration components 3 are installed inside the ventilation chamber 212, and each vibration component 3 corresponds to a jet nozzle 211. The vibration components 3 include a first piezoelectric vibrating plate assembly 31 and a second piezoelectric vibrating plate assembly 32 arranged at intervals. The first piezoelectric vibrating plate assembly 31 is used to vibrate to provide airflow, and the second piezoelectric vibrating plate assembly 32 is used to vibrate to open or close the jet nozzle 211. When the jet nozzle 211 is open, the airflow flows out in a direction perpendicular to the heat-conducting surface 112.

[0057] Specifically, the memory 100 can be a hard disk or other storage device. Of course, this device can also be applied to other structural components that require heat dissipation, suitable for the heat dissipation needs of high-power, high-density hard disks in server space. The bottom of the heat-conducting shell 11 is in contact with the surface of the hard disk, conducting heat generated by the hard disk. In order to increase the heat exchange efficiency between the heat-conducting shell 11 and the memory 100, the heat-conducting shell 11 can be a metal shell, or the contact position between the heat-conducting shell 11 and the memory 100 can be made of metal, such as copper, which has good thermal conductivity. The ventilation shell 2 can also be made of metal, which can absorb some of the heat from the heat-conducting shell 11, and then use the flow of gas in the ventilation shell 2 to carry away the heat in the ventilation shell 2. There are multiple air jets 211, and the number of vibration components 3 is the same as the number of air jets 211, and they correspond one-to-one. Each vibration component 3 includes a first piezoelectric vibrator assembly 31 and a second piezoelectric vibrator assembly 32, with the first piezoelectric vibrator assembly 31 directly above the second piezoelectric vibrator assembly 32.

[0058] Furthermore, the first piezoelectric vibrator assembly 31 is located on the side of the second piezoelectric vibrator assembly 32 away from the jet nozzle 211; the first piezoelectric vibrator assembly 31 is used to bend toward or away from the jet nozzle 211 when an alternating voltage is applied to provide airflow; the second piezoelectric vibrator assembly 32 is used to bend toward or away from the jet nozzle 211 to open the jet nozzle 211, or to reset to close the jet nozzle 211 when a pulsed unidirectional voltage is applied; the first piezoelectric vibrator assembly 31 and the second piezoelectric vibrator assembly 32 periodically and synchronously deform in opposite directions.

[0059] The memory heat dissipation device achieves rapid heat conduction with the memory 100 through the heat-conducting base shell 11, transferring heat from the memory 100 to the heat-conducting base shell 11. Simultaneously, by installing several vibration components 3 within the ventilation housing 2, the first piezoelectric vibrator assembly 31 bends towards the nozzle 211, thus pushing the airflow within the ventilation chamber 212. An alternating voltage is applied to the first piezoelectric vibrator assembly 31, and a pulsed unidirectional voltage is applied to the second piezoelectric vibrator assembly 32. The first and second piezoelectric vibrator assemblies 31 and 32 periodically and synchronously deform in opposite directions. When the first piezoelectric vibrator assembly 31 bends towards the nozzle 211, the second piezoelectric vibrator assembly 32 bends away from the nozzle 211. Opening the nozzle 211 allows airflow to pass through it. Air is ejected from nozzle 211. Since nozzle 211 is located at the bottom of the ventilation housing 2, and the bottom of the ventilation housing 2 is close to the heat-conducting surface 112 of the heat-conducting bottom shell 11, the airflow will be ejected towards the heat-conducting surface 112 after passing through nozzle 211. That is, the ejection direction of the airflow is perpendicular to the heat-conducting surface 112. At the same time, fresh air will enter the ventilation cavity 212 through the second air intake 221. When the first piezoelectric vibrator assembly 31 bends in the direction away from nozzle 211, the second piezoelectric vibrator assembly 32 is de-energized and will close nozzle 211, preventing gas from flowing back into the ventilation cavity 212 from nozzle 211. When the first piezoelectric vibrator assembly 31 is fully upward, it will push the gas located at the top of the ventilation cavity 212 to the periphery of the ventilation cavity 212, realizing the flow of gas in the ventilation cavity 212 and ensuring the heat dissipation effect.

[0060] This memory cooling device utilizes the deformation of the first piezoelectric vibrator assembly 31 and the second piezoelectric vibrator assembly 32 to achieve regular vibration under the application of an alternating voltage, causing forced airflow in the surrounding environment. Under the vibration of several vibrating components 3, airflow is drawn into the heat exchange chamber from the second intake section, then ejected from the jet nozzle 211 onto the heat-conducting surface 112 of the heat-conducting base shell 11, and finally discharged from the jet nozzle 211 of the heat-conducting base shell 11, achieving forced heat exchange with the hard drive surface. The high-frequency airflow ejected from the jet nozzle 211 enhances the heat dissipation effect on the heat-conducting surface 112, effectively alleviating the problem of low heat transfer efficiency caused by the boundary layer of the heat-conducting surface 112 under advection conditions, improving the overall heat dissipation efficiency, facilitating layout, simplifying the structure, and reducing manufacturing costs. The device has a compact structure, can be used modularly, has a smaller volume ratio than traditional fans, and can adapt to high-density, high-power hard drive cooling scenarios.

[0061] In some embodiments of this application, referring to FIG2, the vibration assembly 3 further includes at least two bases 33, which are installed at the bottom of the ventilation housing 2. The first piezoelectric vibrator assembly 31 includes a first metal vibrator 311 and a first piezoelectric ceramic 312, and the second piezoelectric vibrator assembly 32 includes a second metal vibrator 321 and a second piezoelectric ceramic 322. The first piezoelectric ceramic 312 is disposed on the side of the first metal vibrator 311 away from the jet nozzle 211, and the second piezoelectric ceramic 322 is disposed on the side of the second metal vibrator 321 away from the jet nozzle 211. The first end of the first metal vibrator 311 and the first end of the second metal vibrator 321 are mounted on one base 33, and the second end of the first metal vibrator 311 and the second end of the second metal vibrator 321 are mounted on another base 33. Specifically, each vibration component 3 includes two bases 33, two flexible metal vibrators, and two piezoelectric ceramics. The first piezoelectric ceramic 312 is disposed at the upper part of the middle position of the first metal vibrator 311, and the second piezoelectric ceramic 322 is disposed at the upper part of the middle position of the second metal vibrator 321. A flexible metal vibrator passes through the upper and lower ends of each base 33, and a piezoelectric ceramic is attached to the top of the middle of each metal vibrator. When the piezoelectric ceramic shortens and thickens, it drives the metal vibrator to bend downward to adapt to the shape change of the piezoelectric ceramic. When the piezoelectric ceramic stretches and thins, it drives the metal vibrator to bend upward to adapt to the shape change of the piezoelectric ceramic.

[0062] In some embodiments of this application, the base 33 is provided with a slot 331, and the first metal diaphragm 311 and the second metal diaphragm 321 are movably installed in the corresponding slot 331. The slot 331 has a preset depth to prevent the first metal diaphragm 311 and the second metal diaphragm 321 from coming out of the slot 331 when bending. Specifically, the thickness of the slot 331 can be slightly greater than the thickness of the metal diaphragm, and the depth of the slot 331 can be appropriately increased to accommodate the positional changes of the first metal diaphragm 311 and the second metal diaphragm 321 after bending. The base 33 can be made of rubber, plastic or resin material, with low hardness to reduce wear on the first metal diaphragm 311 and the second metal diaphragm 321.

[0063] In some embodiments of this application, the jet nozzle 211 is a jet groove, the width of the second metal vibrator 321 is greater than the width of the jet groove, and the width of the first metal vibrator 311 is 2-3 times the width of the second metal vibrator 321. This configuration, by setting the width of the second metal vibrator 321 to be greater than the width of the jet groove, ensures that the second metal vibrator 321 can fully close the jet nozzle 211. Setting the width of the first metal vibrator 311 to be 2-3 times the width of the second metal vibrator 321 increases the airflow generated by the first metal vibrator 311 during vibration, while reducing the obstruction of airflow by the second metal vibrator 321, ensuring that sufficient gas is ejected from the jet nozzle 211.

[0064] In some embodiments of this application, a filter top cover 12 is also included, which is mounted on a heat-conducting bottom shell 11; a heat-conducting cavity is formed between the heat-conducting bottom shell 11 and the filter top cover 12, and the ventilation shell 2 is located in the heat-conducting cavity; a first air inlet 121 is provided on the filter top cover 12, a first exhaust 111 is provided on the side wall of the heat-conducting bottom shell 11, and the bottom of the heat-conducting bottom shell 11 is in contact with the surface of the memory 100. Specifically, the heat-conducting bottom shell 11 is a flat copper shell with three closed sides and a first exhaust section 111 on the other side. The first air intake section 121 is located on the filter top cover 12. The filter top cover 12 can be flat, and the first air intake section 121 can be a strip structure, which is suitable for the shape of the filter top cover 12 and ensures sufficient air intake. The first air intake section 121 and the first exhaust section 111 are used to realize the air intake and exhaust of the heat-conducting cavity. Then, by installing the ventilation shell 2 in the heat-conducting cavity of the heat-conducting shell 1, the ventilation shell 2 is provided with a second air intake section 221 and several jet ports 211 to realize the air intake and exhaust of the ventilation cavity 212.

[0065] In some embodiments of this application, an air filter 13 is also included. The air filter 13 is installed on the first air inlet 121. The number of air filters 13 is the same as the number of first air inlets 121 and they correspond one-to-one. The air filter 13 is used to filter the air entering the heat-conducting cavity. A recess 222 is provided on the side of the ventilation housing 2 near the first air inlet 121, and the second air inlet 221 is formed on the recess 222. After the ventilation housing 2 is assembled into the heat-conducting housing 1, the thickness of the air filter 13 is greater than the thickness of the filter top cover 12, and part of the structure of the air filter 13 is embedded in the recess 222. With this arrangement, the recess 222 allows part of the structure of the air filter 13 to be embedded in the first air inlet 121 and part of the structure to be embedded in the recess 222. Furthermore, after the ventilation housing 2 is assembled into the heat-conducting housing 1, the top inner wall of the heat-conducting housing 1 is fitted to the top outer wall of the ventilation housing 2, so that the gas filtered by the air filter 13 immediately enters the second air inlet 221. This arrangement can minimize the size of the device and simplify the structure. The first air intake 121 can be a number of narrow air intake slots provided on the filter top cover 12. Air is drawn in through the air filter 13 attached to the filter top cover 12 and dust and impurities are filtered out. The air filter 13 effectively solves the problem of dust accumulation.

[0066] In some embodiments of this application, the heat-conducting bottom shell 11 is a metal shell, and a first exhaust portion 111 is provided on the side of the heat-conducting bottom shell 11. Specifically, the heat-conducting bottom shell 11 is a metal shell, such as a shell made of copper or other materials with good thermal conductivity. A converging slope 113 is also provided on the side of the heat-conducting bottom shell 11 where the first exhaust portion 111 is provided, so that the first exhaust portion 111 gradually converges from the side near the ventilation cavity 212 to the other side. By providing the converging slope 113, the airflow speed can be increased, thereby improving the heat dissipation efficiency.

[0067] In some embodiments of this application, the filter top cover 12 includes a top portion 122 and side portions 123 located on both sides of the top portion 122. The first air inlet 121 is located on the top portion 122, and the side portions 123 are fitted onto both sides of the heat-conducting bottom shell 11, with the side portions 123 and the first exhaust portion 111 located on different sides of the heat-conducting bottom shell 11. Specifically, the filter top cover 12 can be made of plastic, and the filter top cover 12 is made of flexible material. It is pasted on the top of the ventilation chamber 212 to seal the entire device except for the first air inlet 121 and the exhaust port 211, preventing air leakage and affecting heat dissipation.

[0068] In some embodiments of this application, the ventilation housing 2 includes a ventilation bottom shell 21 and a ventilation cover plate 22, with a recess 222 disposed on the ventilation cover plate 22; the ventilation cover plate 22 is mounted on the ventilation bottom shell 21, and the ventilation cavity 212 is located between the ventilation bottom shell 21 and the ventilation cover plate 22. The ventilation cover plate 22 is provided with a second air inlet 221, and the jet nozzle 211 is located on the ventilation bottom shell 21; gas enters the heat-conducting cavity through the first air inlet 121 on the heat-conducting housing 1, and then enters the heat-conducting cavity through the second air inlet 221. After being acted upon by the vibration component 3, the gas is ejected from the jet nozzle 211 toward the heat-conducting surface 112 and re-enters the heat-conducting surface 112. Inside the heat-conducting cavity, the gas then passes through the first exhaust section 111 of the heat-conducting shell 1 and exits the heat-conducting cavity, thereby carrying away the heat inside the heat-conducting cavity, mainly carrying away the heat of the heat-conducting surface 112; of course, in some cases, the air exchange shell 2 can be an open structure, that is, the heat exchange shell is cylindrical, surrounded on all four sides, and open at the top, and the gas can directly enter the air exchange cavity 212 of the air exchange shell 2 from the first air inlet 121 of the heat-conducting shell 1; or, the heat-conducting shell 1 can be an open structure, that is, the heat-conducting shell 1 is cylindrical, surrounded on all four sides, and open at the top, and the gas can directly enter the second air inlet 221 of the air exchange shell 2 from the opening of the heat-conducting shell 1.

[0069] Furthermore, both the second air intake 221 and the jet nozzle 211 are strip-shaped, and both the second air intake 221 and the jet nozzle 211 can be strip-shaped grooves, and the extension direction of the second air intake 221 is the same as the extension direction of the jet nozzle 211; the projection of the vibration component 3 in the direction perpendicular to the heat-conducting surface 112 covers the projection of the jet nozzle 211 in the direction perpendicular to the heat-conducting surface 112, that is, the vibration component 3 is located directly above the jet nozzle 211. Specifically, the first piezoelectric vibrator assembly 31 and the second piezoelectric vibrator assembly 32 are located directly above the jet nozzle 211 by installing the base 33 on both sides of the jet nozzle 211.

[0070] Furthermore, each vibration component 3 is arranged sequentially along the extension direction of the jet nozzle 211, and the second air intake 221 is located between adjacent vibration components 3, so that the projections of the second air intake 221 and the vibration components 3 in the direction perpendicular to the heat conduction surface 112 are staggered.

[0071] The above configuration, by setting up the ventilation bottom shell 21 and the ventilation cover plate 22, with the second air inlet 221 set on the ventilation cover plate 22, and by setting the projection of the vibration component 3 in the direction perpendicular to the heat-conducting surface 112 to cover the projection of the jet nozzle 211 in the direction perpendicular to the heat-conducting surface 112, is to ensure that the vibration component 3 can block the jet nozzle 211, thereby ensuring that the second piezoelectric vibrator assembly 32 can open or close the jet nozzle 211. At the same time, by setting the second air inlet 221 and the projection of the vibration component 3 in the direction perpendicular to the heat-conducting surface 112 to be staggered, is to prevent airflow from flowing out of the second air inlet 221 when the first piezoelectric vibrator assembly 31 bends upward, thereby ensuring that the airflow can flow smoothly from the top of the heat-conducting cavity to the periphery of the heat-conducting cavity, realizing the circulation of airflow and improving heat dissipation efficiency.

[0072] In some embodiments of this application, the jet nozzles 211 are several rows of elongated nozzles disposed at the bottom of the ventilation base 21. The extending direction of the jet nozzles 211 is parallel to the extending direction of the second piezoelectric vibrator assembly 32, and adjacent jet nozzles 211 in each row are spaced apart. Specifically, several rows of jet nozzles 211 are evenly distributed at the bottom of each ventilation base 21, and the number of jet nozzles 211 in each row is multiple. Adjacent jet nozzles 211 in each row are spaced apart to facilitate the installation of the base 33. For example, two rows of a total of eight elongated nozzles can be disposed at the bottom of the ventilation base 21, and the airflow is sprayed with cold air through the elongated nozzles onto the heat-conducting surface 112 of the heat-conducting base 11. At the same time, a total of 16 tiny vibration components 3 are disposed inside the ventilation cavity 212, and each vibration component 3 is evenly distributed directly above the corresponding nozzle.

[0073] In some embodiments of this application, please refer to Figures 3 and 6. A plurality of air guide grooves 213 are provided on the bottom side of the ventilation base shell 21 away from the heat exchange cavity. The extension direction of the air guide grooves 213 is parallel to the heat conduction surface 112, and the end of the air guide grooves 213 is close to the jet nozzle 211. The jet nozzle 211 is connected to the air guide grooves 213 so that the airflow can flow smoothly from the air guide grooves 213 to the jet nozzle 211, and then flow out from the heat conduction shell 1. For example, a plurality of air guide grooves 213 are provided on both sides of the bottom surface of the ventilation base shell 21 to guide the airflow, so as to facilitate the airflow from the heat conduction shell 1 and improve the heat dissipation efficiency.

[0074] In some embodiments of this application, the bottom of the ventilation base 21 is provided with at least three air guide grooves 213, and at least one air guide groove 213 is located in the middle of the bottom of the ventilation base 21. The air guide grooves 213 are arranged in parallel, and the bottom of the ventilation base 21 is fitted to the heat-conducting surface 112 so that an exhaust channel is formed between the air guide grooves 213 and the heat-conducting surface 112. Specifically, by providing at least one air guide groove 213 in the middle of the bottom of the ventilation base 21, as shown in FIG6, it means that a set of arrayed air jets 211 and vibration components 3 are correspondingly provided, thereby solving the technical problem of high temperature and difficult heat dissipation in the middle of the memory 100. Of course, the air guide grooves 213 can also be provided only on both sides of the ventilation base 21, as shown in FIG3. The air guide grooves 213 can be provided according to actual needs.

[0075] In some embodiments of this application, referring to FIG5, a snap-fit ​​component 4 is also included. The fixed portion of the snap-fit ​​component 4 is mounted on the heat-conducting housing 1, and the movable portion of the snap-fit ​​component is detachably snapped into the memory 100. Specifically, by setting the snap-fit ​​component 4, the heat-conducting housing 1 and the memory 100 can be quickly assembled and disassembled, improving installation efficiency. At the same time, it can also ensure close contact between the heat-conducting housing 1 and the memory 100, ensuring the heat conduction effect. Furthermore, both sides of the heat-conducting housing 1 are provided with latching components 4. There can be one or more latching components 4 on the same side of the heat-conducting housing 1, including two. By providing at least two latching components 4 on both sides of the heat-conducting housing 1, the connection between the heat-conducting housing 1 and the memory 100 can be more stable. The end of the latching component 4 can have a latching platform. When the latching component 4 moves towards the memory 100, the latching platform will deform under the action of the memory 100. When the latching platform of the latching component 4 moves to the bottom of the memory 100, the latching platform resets and latches with the bottom of the memory 100. When it is necessary to separate the heat dissipation device from the memory 100, push the latching platform to detach it from the memory 100 to complete the separation of the heat dissipation device from the memory 100, making disassembly and assembly convenient. Of course, for better adaptation, the latching component 4 can also be replaced with a strap-type latching structure for easy disassembly and suitability for the heat dissipation requirements of memory 100s of different sizes.

[0076] In some embodiments of this application, each micro-vibration component 3 has the same structure and is evenly distributed above the jet nozzle 211. It can be regarded as a ventilation unit and can be made into a modular ventilation component. According to the actual hard drive size and heat dissipation requirements, the ventilation unit modules in the ventilation cavity 212 are arranged in a targeted manner, which facilitates design and targeted heat dissipation and improves the applicability.

[0077] In some embodiments of this application, the ventilation housing 2 can be modularized. By setting multiple ventilation housings 2 and distributing them evenly within the heat-conducting housing 1, that is, multiple ventilation housings 2 can be set within the heat-conducting cavity of the same heat-conducting housing 1, thereby improving heat dissipation efficiency and meeting the higher heat dissipation requirements of the server's hard drive.

[0078] In some embodiments of this application, the memory heat dissipation device is based on the piezoelectric effect and includes a heat-conducting bottom shell 11, a ventilation bottom shell 21, a ventilation top cover, a vibration component 3, an air filter 13, and a filter top cover 12. The entire device is installed on the top surface of the memory 100, which is exemplified by a hard disk. The heat-conducting bottom shell 11 is made of copper, which has a high thermal conductivity and is in contact with the surface of the hard disk to conduct the heat generated by the hard disk. The heat-conducting bottom shell 11 is closed on three sides, with a first exhaust section 111 only on one side. Inside the heat-conducting bottom shell 11, there is a metal ventilation bottom shell 21 and a ventilation top cover, which are the core components of the device. The ventilation top cover has a narrow air inlet groove, i.e., a second air inlet 221, which draws in air through the air filter 13 attached to the filter top cover 12. The bottom of the ventilation bottom shell 21 has an air guide groove 213 for guiding air. Several elongated nozzles, or jet nozzles 211, are distributed inside the slot 213. Airflow passes through the jet nozzles 211 and sprays cold air onto the heat-conducting surface 112 of the heat-conducting bottom shell 11. The ventilation cavity 212 between the ventilation bottom shell 21 and the ventilation top cover has multiple tiny vibration components 3, which are neatly installed above the jet nozzles 211. The jet nozzle 211 is taken as an example. The vibration component 3 includes two bases 33, two metal vibrators, and two piezoelectric ceramics. A flexible metal vibrator passes through the upper and lower parts of the bases 33, and a piezoelectric ceramic is attached to the top of the metal vibrator in the middle. A filter top cover 12 is attached to the top of the ventilation top cover to seal the entire device except for the second air inlet 221 and the first exhaust 111. An air filter 13 is attached to the filter top cover 12 to filter out dust and impurities in the air, prevent dust accumulation inside, and facilitate cleaning and maintenance.

[0079] The working process of this memory heat dissipation device is described in detail below:

[0080] Referring to Figure 7, in the vibration assembly 3, when voltage is applied to both the top and bottom surfaces of the first piezoelectric ceramic 312 and the second piezoelectric ceramic 322, the first piezoelectric ceramic 312 deforms, shortening and thickening, forcing the bonded first metal vibrator 311 to bend downwards. Meanwhile, the second piezoelectric ceramic 322 deforms and elongates, thinning, causing the second metal vibrator 321 to bend upwards. At this moment, the voltage to the first piezoelectric ceramic 312 is reversed, causing it to deform in the opposite direction and elongate, again causing the first metal vibrator 311 to arch upwards. Simultaneously, the second piezoelectric ceramic 322 is de-energized and returns to its normal state. Thus, when alternating voltage is applied to the first piezoelectric ceramic 312 and a pulsed unidirectional voltage is applied to the second piezoelectric ceramic 322, both will periodically and synchronously deform in opposite directions. The vibration assembly 3 is then placed in the ventilation chamber 212. Above the nozzle 211, taking the nozzle as an example, when the first metal vibrator 311 bends downward, it pushes the air, increasing the static pressure near the nozzle and forming an airflow ejected from the nozzle. At the same time, the upper space of the air exchange chamber expands continuously, the air pressure decreases, and air is drawn in from the second air inlet 221 of the air exchange top cover to fill it. After the first metal vibrator 311 is deformed to its position, the voltage of the first piezoelectric ceramic 312 reverses, and the first metal vibrator 311 arches upward, creating a high-pressure area in the upper space of the first metal vibrator 311 and a low-pressure area in the lower space. The second piezoelectric ceramic 322 is de-energized and blocks the nozzle, preventing air from being drawn in from the nozzle. Therefore, the high-pressure area above the first metal vibrator 311 pushes the fresh air that was just drawn in to the vicinity of the nozzle, thus completing a working cycle of air jetting and air intake.

[0081] When several micro-vibration components 3 work simultaneously, due to the misaligned arrangement of the second air intake 221 and the vibration component 3, most of the air in the upper high-pressure zone of the ventilation chamber 212 will disperse to the surroundings and be transported towards the lower nozzle, while a small portion will flow towards the low-pressure zone created by the nearby device. This allows the air drawn in by the second air intake 221 to flow in a coordinated manner and will not escape from the second air intake 221. Therefore, the second air intake 221 of the entire ventilation chamber 212 will only draw in air, while the lower nozzle will use high-frequency pulse jets to cool the heat-conducting bottom shell 11.

[0082] Compared to the advection cooling of traditional air cooling, the nozzle below the air exchange housing 2 in this device blows a uniformly distributed jet vertically onto the heat-conducting surface 112 of the heat-conducting base 11. The gap between the two is very small, and the high-speed airflow directly impacts the heat source, forming convection for heat dissipation and increasing the static pressure inside the heat-conducting base 11. This then pushes the hot air out through the first exhaust section 111 on the side. This forced convection of close-range vertical jets significantly improves heat dissipation compared to the slow boundary layer created by fans. The power consumption and noise during the entire operation are much lower than those of traditional fans. The complete airflow path is shown by the arrow in Figure 1.

[0083] Based on existing air-cooling technology, this device utilizes the inverse piezoelectric effect of piezoelectric ceramics. By applying regular alternating voltage and pulsed unidirectional voltage to the first piezoelectric ceramic 312 and the second piezoelectric ceramic 322, the first metal diaphragm 311 and the second metal diaphragm 321 attached to them vibrate periodically up and down, forcing the surrounding air to flow and completing the intake and exhaust cycle within the ventilation chamber 212. The vertically ejected high-speed pulsed airflow can maximally disrupt the boundary layer of the heat-conducting surface 112 of the heat-conducting bottom shell 11, forming turbulent flow. The forced convection effect far exceeds that of traditional fans, and the heat dissipation rate is significantly improved. As shown in Figure 4, the device has a compact structure and small size, which can meet the heat dissipation requirements of high power consumption and high-density hard drives in the limited space of servers. At the same time, the power consumption is low, and the noise level is much lower than that of blade fans. It is easy to assemble and highly efficient. In addition, the air filter 13 on the top can filter out dust and impurities in the air, ensuring the cleanliness of the inside of the device and facilitating cleaning and maintenance.

[0084] It should be noted that the orientations "above" and "below" referred to in this article are the positions on which the device is installed on the memory 100 when the memory 100 is placed horizontally, i.e., above the memory 100. When the orientation of the memory 100 changes, or when the installation position of the device changes, the orientations "above" and "below" will change accordingly.

[0085] In addition to the aforementioned memory heat dissipation device, this application also provides a memory heat dissipation method that can employ the aforementioned memory heat dissipation device. Please refer to Figure 8. The memory heat dissipation method includes the following steps:

[0086] Step S1: Assemble the heat-conducting housing 1 with the memory 100;

[0087] Step S2: Apply an alternating voltage to the first piezoelectric vibrator assembly 31 and apply a pulsed unidirectional voltage to the second piezoelectric vibrator assembly 32. The first piezoelectric vibrator assembly 31 and the second piezoelectric vibrator assembly 32 periodically and synchronously deform in opposite directions.

[0088] Step S3: While controlling the first piezoelectric vibrator assembly 31 to bend toward the direction close to the jet nozzle 211, the second piezoelectric vibrator assembly 32 bends toward the direction away from the jet nozzle 211, so that the jet nozzle 211 opens and the airflow is ejected in a direction perpendicular to the heat-conducting surface 112.

[0089] Step S4: While controlling the first piezoelectric vibrator assembly 31 to bend in the direction away from the jet nozzle 211, the second piezoelectric vibrator assembly 32 resets and closes the jet nozzle 211.

[0090] This memory heat dissipation method applies an alternating voltage to the first piezoelectric vibrator assembly 31 and a pulsed unidirectional voltage to the second piezoelectric vibrator assembly 32. By adjusting the application time and frequency of the alternating voltage and the pulsed unidirectional voltage, the method controls the first piezoelectric vibrator assembly 31 to bend towards the nozzle 211 while the second piezoelectric vibrator assembly 32 bends away from the nozzle 211, opening the nozzle 211. Under the action of the first piezoelectric vibrator assembly 31, airflow flows out through the nozzle 211 and is ejected in a direction perpendicular to the heat-conducting surface 112. When the first piezoelectric vibrator assembly 31 is controlled to bend away from the nozzle 211, the second piezoelectric vibrator assembly 32 resets and closes the nozzle 211. At this time, the first piezoelectric vibrator assembly 31 bends away from the nozzle 211. When the direction of 11 bends, it will push the gas at the top of the ventilation cavity 212 to the bottom of the ventilation cavity 212, realizing the flow of gas in the ventilation cavity 212. At this time, the second piezoelectric vibrator assembly 32 is de-energized, which will close the jet nozzle 211 and prevent the gas from flowing back into the ventilation cavity 212 from the jet nozzle 211. This heat dissipation method applies an alternating voltage to the first piezoelectric vibrator assembly 31 and a pulsed unidirectional voltage to the second piezoelectric vibrator assembly 32 within a target time. The alternating voltage and the pulsed unidirectional voltage are coordinated to realize the continuous flow of air in the ventilation housing 2. By spraying high-frequency air from the jet nozzle 211, the heat dissipation effect on the heat-conducting surface 112 can be enhanced, effectively alleviating the problem of low heat transfer efficiency caused by the boundary layer of the heat-conducting surface 112 under advection conditions, and the heat dissipation efficiency is high.

[0091] The memory heat dissipation device and method provided in this application utilize a vibration component 3 made of piezoelectric ceramics with the inverse piezoelectric effect. By applying an alternating voltage to the first piezoelectric ceramic 312 and a pulsed unidirectional voltage to the second piezoelectric ceramic 322, the first metal diaphragm 311 and the second metal diaphragm 321 attached thereto vibrate up and down periodically, forcing the surrounding air to flow. This, combined with the air inlet groove on the upper side of the ventilation chamber 212, i.e., the second air inlet 221, and the lower nozzle, i.e. the air outlet 211, completes the full working cycle of air intake and exhaust. The high-speed pulsed airflow injected vertically enhances the convection effect of the heat-conducting surface 112, thereby increasing the heat dissipation rate.

[0092] The memory heat dissipation device and method provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A memory heat dissipating device, characterized by, The application relates to a heat-conducting bottom shell (11) provided with a heat-conducting surface (112), which is configured to be attached to a storage device (100) and to conduct heat from the storage device (100) to the heat-conducting surface (112); an air exchange shell (2) arranged on the heat-conducting bottom shell (11), wherein an air exchange cavity (212) is arranged in the air exchange shell (2) and a plurality of air injection ports (211) are arranged at the bottom of the air exchange shell (2); and a plurality of vibration assemblies (3) arranged in the air exchange cavity (212), wherein the vibration assemblies (3) correspond to the air injection ports (211) one by one; the vibration assemblies (3) comprise a first piezoelectric vibration plate assembly (31) and a second piezoelectric vibration plate assembly (32) arranged at intervals; the first piezoelectric vibration plate assembly (31) is configured to vibrate to provide air flow; the second piezoelectric vibration plate assembly (32) is configured to vibrate to open or close the air injection port (211); when the air injection port (211) is opened, the air flow flows out in a direction perpendicular to the heat-conducting surface (112). The heat-conducting bottom shell (11) is a metal shell, or the position of the heat-conducting bottom shell (11) in contact with the storage device (100) is made of metal. The first piezoelectric vibration plate assembly (31) is arranged on the side of the second piezoelectric vibration plate assembly (32) away from the air injection port (211); the first piezoelectric vibration plate assembly (31) is configured to bend towards the air injection port (211) or away from the air injection port (211) to provide air flow when an alternating voltage is applied; the second piezoelectric vibration plate assembly (32) is configured to bend away from the air injection port (211) to open the air injection port (211) or reset to close the air injection port (211) when a pulse unidirectional voltage is applied; the first piezoelectric vibration plate assembly (31) and the second piezoelectric vibration plate assembly (32) periodically and synchronously deform in opposite directions. The vibration assembly (3) further comprises at least two abutments (33) arranged at the bottom of the air exchange shell (2); the first piezoelectric vibration plate assembly (31) comprises a first metal vibration plate (311) and a first piezoelectric ceramic (312); the second piezoelectric vibration plate assembly (32) comprises a second metal vibration plate (321) and a second piezoelectric ceramic (322); the first piezoelectric ceramic (312) is arranged on the side of the first metal vibration plate (311) away from the air injection port (211); the second piezoelectric ceramic (322) is arranged on the side of the second metal vibration plate (321) away from the air injection port (211); the first end of the first metal vibration plate (311) and the first end of the second metal vibration plate (321) are arranged on one abutment (33); and the second end of the first metal vibration plate (311) and the second end of the second metal vibration plate (321) are arranged on another abutment (33).

2. The memory heat dissipating device according to claim 1, wherein The first piezoelectric ceramic (312) is arranged on the top of the middle position of the first metal vibration plate (311); and the second piezoelectric ceramic (322) is arranged on the top of the middle position of the second metal vibration plate (321).

3. The memory heat dissipating device of claim 1, wherein, ​ 4. The memory heat dissipating device of claim 1, wherein, ​ 5. The memory heat dissipating device according to claim 4, wherein, ​ 6. The memory heat dissipating device of claim 4, wherein, The base (33) is provided with a slot (331), the first metal vibrating plate (311) and the second metal vibrating plate (321) are movably installed in the corresponding slot (331), and the slot (331) has a preset depth to prevent the first metal vibrating plate (311) and the second metal vibrating plate (321) from being separated from the slot (331) when being bent.

7. The memory heat dissipating device according to claim 6, wherein, The thickness of the slot (331) is greater than the thickness of the first metal vibrating plate (311) and the second metal vibrating plate (321), and the base (33) is made of rubber, plastic or resin.

8. The memory heat dissipating device according to claim 4, wherein The air injection port (211) is an air injection groove, the width of the second metal vibrating plate (321) is greater than the width of the air injection groove, and the width of the first metal vibrating plate (311) is 2-3 times the width of the second metal vibrating plate (321).

9. The memory heat dissipating device of claim 1, wherein, It also includes a filter top cover (12) installed on the heat-conducting bottom shell (11); the heat-conducting bottom shell (11) and the filter top cover (12) form a heat-conducting cavity, and the air exchange shell (2) is located in the heat-conducting cavity; the filter top cover (12) is provided with a first air inlet portion (121), and the side wall of the heat-conducting bottom shell (11) is provided with a first air outlet portion (111), and the bottom of the heat-conducting bottom shell (11) is in contact with the surface of the storage (100).

10. The memory heat dissipating device of claim 9, wherein, It also includes an air filter (13) installed on the first air inlet portion (121), the air filter (13) has the same number as the first air inlet portion (121) and one-to-one correspondence, and the air filter (13) is configured to filter the air entering the heat-conducting cavity.

11. The memory heat dissipating device of claim 10, wherein, The air filter (13) has a thickness greater than that of the filter top cover (12), and part of the structure of the air filter (13) is embedded in the recess (222).

12. The memory heat dissipating device of claim 9, wherein, The heat-conducting bottom shell (11) is a metal shell, the first air outlet portion (111) is arranged on the side of the heat-conducting bottom shell (11), and the side of the heat-conducting bottom shell (11) provided with the first air outlet portion (111) is also provided with a flow-converging inclined surface (113) to gradually converge the first air outlet portion (111) from the side close to the air exchange cavity (212) to the other side.

13. The memory heat dissipating device of claim 12, wherein, The heat-conducting bottom shell (11) is a flat metal shell, and the other three sides of the heat-conducting bottom shell (11) are closed.

14. The memory heat dissipating device of claim 9, wherein, The filter top cover (12) includes a top surface portion (122) and side surface portions (123) located on both sides of the top surface portion (122), the first air inlet portion (121) is located on the top surface portion (122), the side surface portions (123) are arranged on the two sides of the heat-conducting bottom shell (11), and the side surface portions (123) and the first air outlet portion (111) are located on different sides of the heat-conducting bottom shell (11).

15. The memory heat dissipating device according to any one of claims 1 to 14, wherein The air exchange shell (2) comprises an air exchange bottom shell (21) and an air exchange cover plate (22), the air exchange cover plate (22) is installed on the air exchange bottom shell (21), the air exchange cavity (212) is located between the air exchange bottom shell (21) and the air exchange cover plate (22), and the air exchange cover plate (22) is provided with a second air inlet part (221); The second air inlet part (221) and the air jet port (211) are both strip-shaped, the extension direction of the second air inlet part (221) is the same as that of the air jet port (211), each vibration assembly (3) is arranged in sequence along the extension direction of the air jet port (211), and the second air inlet part (221) is located between adjacent vibration assemblies (3), so that the second air inlet part (221) and the vibration assembly (3) are arranged in a staggered manner in the direction perpendicular to the heat conduction surface (112).

16. The memory heat dissipating device of claim 15, wherein, The air jet port (211) is a plurality of rows of strip-shaped air outlets arranged at the bottom of the air exchange bottom shell (21), the extension direction of the air jet port (211) is parallel to the extension direction of the second piezoelectric vibration piece assembly (32), and adjacent two air jet ports (211) in each row are arranged at intervals.

17. The memory heat dissipating device of claim 15, wherein, A plurality of air guide grooves (213) are formed in the bottom of the air exchange bottom shell (21) and away from the air exchange cavity (212), the extension direction of the air guide groove (213) is parallel to the heat conduction surface (112), and the end of the air guide groove (213) is close to the air jet port (211); the air jet port (211) is in communication with the air guide groove (213).

18. The memory heat dissipating device of claim 17, wherein, At least three air guide grooves (213) are formed in the bottom of the air exchange bottom shell (21), at least one air guide groove (213) is located at the middle position of the bottom of the air exchange bottom shell (21), the air guide grooves (213) are arranged in parallel, and the bottom of the air exchange bottom shell (21) is arranged in close contact with the heat conduction surface (112), so that an exhaust passage is formed between the air guide groove (213) and the heat conduction surface (112).

19. The memory heat dissipating device of claim 1, wherein, Further comprising a buckle component (4), the buckle component (4) comprises a fixed part and a buckle part, the fixed part is installed on the heat conduction shell (1), and the movable part of the buckle part is detachably connected with the memory (100).

20. A memory heat dissipation method using the memory heat dissipation device according to any one of claims 1 to 19. Comprising: Assembling the memory heat dissipation device with the memory (100); Applying an alternating voltage to the first piezoelectric vibration piece assembly (31) and a unidirectional pulse voltage to the second piezoelectric vibration piece assembly (32), and periodically and synchronously deforming the first piezoelectric vibration piece assembly (31) and the second piezoelectric vibration piece assembly (32) in opposite directions; Controlling the first piezoelectric vibration piece assembly (31) to bend towards the direction close to the air jet port (211), while the second piezoelectric vibration piece assembly (32) bends away from the direction of the air jet port (211), so that the air jet port (211) is opened, and the airflow is jetted in the direction perpendicular to the heat conduction surface (112); The second piezoelectric vibrating piece assembly (32) resets and closes the air jet port (211) while the first piezoelectric vibrating piece assembly (31) is controlled to bend in a direction away from the air jet port (211).

Images