Production method for device connected body, and device connected body

Abstract

Provided is a device connected body having a complex curved surface such as a spherical surface that cannot be formed from a flat surface without expansion and contraction. This production method for a device connected body includes: a step A for preparing a first laminate including, in the given order, an inorganic substrate, a resin layer, and a plurality of devices mounted on the resin layer with gaps therebetween; a step B for obtaining a second laminate by forming a thermoplastic elastomer layer on the first laminate so as to cover the plurality of devices and the gap portions; and a step C for peeling off the inorganic substrate.

Description

Method for manufacturing a device assembly, and device assembly

[0001] The present invention relates to a method for manufacturing an array of devices, and to an array of devices.

[0002] In recent years, there has been an increasing demand for flexible and stretchable sheets on which multiple devices are mounted at intervals. Such sheets are intended to be worn on curved surfaces, such as the human body. They are also intended to be attached without wrinkles to complex curved surfaces, such as spherical surfaces, that cannot be formed from flat surfaces without stretching. They are also intended to be used in electronic devices with bendable sections or rollable electronic devices.

[0003] Patent Document 1 discloses a circuit board device in which a plurality of electronic components are provided on a stretchable circuit board. As a method for manufacturing a stretchable circuit board, Patent Document 1 describes etching the copper foil on a copper-plated polyimide substrate to form a meandering pattern, and then laser-cutting the polyimide portion so that the polyimide has a width of 250 μm, centered on the wiring, to obtain a stretchable circuit board (paragraph

[0136] , Figure 19).

[0004] Japanese Patent Application Laid-Open No. 2018-116959

[0005] However, the circuit board manufacturing method described in Patent Document 1 requires laser processing of the polyimide substrate to conform to the meandering wiring pattern, resulting in poor productivity. In particular, when the wiring pattern has a narrow pitch, high precision is required for laser processing, making it unsuitable for mass production. Although polyimide substrates are flexible, they are not stretchable. Therefore, if the polyimide substrate is not laser processed, the circuit board cannot be made stretchable. Furthermore, when a circuit board is to be attached without wrinkles to a complex curved surface, such as a spherical surface, which cannot be formed from a flat surface without stretching, it must be deformed to approximately this shape and fixed in order to be fixed in the shape once attached to the curved surface.

[0006] The present invention has been made in view of the above-mentioned problems, and because a thermoplastic elastomer is used as a substrate, it is easy to deform into a required curved shape by heating it. An object of the present invention is to provide a method for manufacturing a device assembly that is easy to manufacture and can be mass-produced. Another object of the present invention is to provide such a device assembly.

[0007] The present inventors have conducted extensive research into a method for manufacturing an integrated device assembly, and as a result have found that the adoption of the following configuration makes it possible to easily manufacture an integrated device assembly and to mass-produce it, thereby completing the present invention.

[0008] That is, the method for manufacturing a device-connected body according to the present invention includes the following configurations: [1] A method for manufacturing a device-connected body, comprising: Step A of preparing a first laminate having, in this order, an inorganic substrate, a resin sheet, and a plurality of devices mounted at intervals on the resin sheet; Step B of forming a thermoplastic elastomer layer on the first laminate so as to cover the plurality of devices and the intervals, thereby obtaining a second laminate; and Step C of peeling the inorganic substrate from the second laminate. [2] A method for manufacturing a device-connected body according to [1] above, comprising: prior to Step B or after Step C, removing a portion of the resin sheet, thereby forming a plurality of resin layers at positions corresponding to at least the plurality of devices. [3] A method for manufacturing a device-connected body according to [1] above, comprising: prior to Step B, forming cutting lines in the resin sheet by laser irradiation to remove a portion of the resin sheet. [4] The method for producing a device-connected body according to any one of [1] to [3] above, wherein step B includes step B-1 of laminating a thermoplastic elastomer layer with a supporting substrate on the first laminate, and wherein the method for producing a device-connected body further includes step D of peeling off the supporting substrate. [5] The method for producing a device-connected body according to any one of [1] to [4] above, wherein the thermoplastic elastomer layer has a stretchable wiring pattern on its surface for connecting the devices. [6] The method for producing a device-connected body according to any one of [1] to [4] above, wherein, prior to step B, step G of forming a stretchable wiring pattern for connecting the plurality of devices on the first laminate. [7] The method for producing a device-connected body according to [5] or [6] above, wherein the wiring pattern is bellows-type metal wiring or stretchable metal paste wiring. [8] The method for manufacturing a device connected body according to any one of the above [1] to [7], further comprising, after step C of peeling off the inorganic substrate, step E of forming cutting lines in the resin sheet by laser irradiation to remove portions of the resin sheet, and step F of removing the portions to form a plurality of resin layers at positions corresponding to at least the plurality of devices.[9] The method for producing a device assembly according to any one of [1] to [8] above, wherein the device is a sensor element or a light-emitting element.

[0009] The device assembly according to the present invention also includes the following configuration:

[10] A device assembly comprising: a thermoplastic elastomer layer, a plurality of resin layers attached to the thermoplastic elastomer layer, a plurality of devices interposed between the thermoplastic elastomer layer and the plurality of resin layers, and an elastic wiring pattern connecting the plurality of devices.

[11] The device assembly according to

[10] above, wherein the thermoplastic elastomer layer is continuous to the surface of spaces between the plurality of resin layers, and the surface of the thermoplastic elastomer layer is formed without any step relative to the surface of the resin layer in the spaces.

[0010] According to the configuration [1], a thermoplastic elastomer layer is formed on the first laminate so as to cover the plurality of devices and the gaps (step B), and then the inorganic substrate is peeled off (step C), so that a device assembly in which a plurality of devices are mounted at intervals on the stretchable thermoplastic elastomer layer can be obtained, thereby achieving excellent productivity.

[0011] According to the configuration [2], prior to step B or after step C, a portion of the resin sheet is removed to form a plurality of resin layers at least at positions corresponding to the plurality of devices. That is, although a resin layer is laminated on each device, the resin layers corresponding to the respective devices are not continuous. Therefore, one device is connected to the other devices only by a thermoplastic elastomer layer. As a result, the device assembly obtained by the manufacturing method according to the present invention has stretchability.

[0012] In the configuration [3], if a cutting line for removing a portion of the resin sheet is formed in the resin sheet by laser irradiation prior to step B of obtaining the second laminate, when the laser irradiation dose is large, the laser may be irradiated onto the inorganic substrate, but the thermoplastic elastomer layer is not irradiated with the laser. Therefore, a device assembly can be stably manufactured. Furthermore, if a cutting line for removing a portion of the resin sheet is formed in the resin sheet by laser irradiation prior to step B of obtaining the second laminate, the laser irradiation is performed on the inorganic substrate, making it easier to ensure the positional accuracy of the laser irradiation on the resin sheet.

[0013] In the above-mentioned configuration [4], if a thermoplastic elastomer layer with a supporting substrate is used, a thermoplastic elastomer layer can be easily formed on the first laminate to obtain a second laminate.

[0014] In the configuration [5], if the thermoplastic elastomer layer has an elastic wiring pattern on its surface for connecting the devices, when the thermoplastic elastomer layer is formed on the first laminate, wiring between the devices can be performed simultaneously while maintaining elasticity between the devices.

[0015] In the configuration [6], if a stretchable wiring pattern that connects the plurality of devices is formed on the first laminate prior to step B of obtaining the second laminate, the electrical connection between the devices and the wiring pattern can be ensured.

[0016] In the configuration [7] above, if the wiring pattern is a bellows-type metal wiring or an elastic metal paste wiring, it is possible to maintain suitable elasticity between devices while maintaining electrical connection between the devices.

[0017] In the configuration [8], after step C of peeling off the inorganic substrate, by forming cutting lines in the resin sheet by laser irradiation for removing portions of the resin sheet (step E), and by removing the portions, forming a plurality of resin layers at positions corresponding to at least the plurality of devices (step F), it is possible to remove unnecessary resin layers after confirming the shapes of the devices after embedding in the thermoplastic elastomer layer. That is, although there is a possibility that the thermoplastic elastomer layer or the first laminate (particularly the resin sheet or resin layer) may be deformed in step B, the above configuration makes it possible to selectively remove unnecessary resin sheet portions after confirming these deformations.

[0018] In the configuration of [9], if the device is a sensor element, it can be attached to a surface whose shape changes (for example, skin) to measure biological information, etc. Furthermore, if the device is a light-emitting element, it can be a stretchable display.

[0019] In the configuration

[10] , although a resin layer is laminated on each device, the resin layers corresponding to each device are not continuous. Therefore, one device is connected to another device only by a thermoplastic elastomer layer, or only by a thermoplastic elastomer layer and a stretchable wiring pattern. As a result, the device assembly according to the present invention has stretchability. In other words, the device assembly according to the present invention is configured such that it stretches as a whole, but the device-mounted portion does not stretch. Furthermore, the device assembly according to the present invention can be manufactured, for example, by the manufacturing method described above. Therefore, it has excellent productivity.

[0020] In the case of the configuration

[11] , the device formation surface is flat, so that the device formation surface can be attached to the attachment target surface without any gaps, for example.

[0021] According to the present invention, it is possible to provide a method for manufacturing an integrated device assembly that is easy to manufacture and allows mass production, and also to provide the integrated device assembly.

[0022] FIG. 2B is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3C is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3D is a plan view of FIG. 2A; FIG. 3E is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3F is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3G is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3H is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3I is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3J is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3J is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3I is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3J is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the first embodiment; FIG. 3J is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the second embodiment; FIG. 3J is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to the second embodiment; FIG. 3 FIG. 17A is a schematic cross-sectional view for explaining the method for manufacturing an associated device body according to the third embodiment. FIG. 18A is a plan view of FIG. 19A. FIG. 19A is a schematic cross-sectional view for explaining the method for manufacturing an associated device body according to the third embodiment. FIG. 20A is a plan view of FIG. 20A. FIG. 20A is a schematic cross-sectional view for explaining the method for manufacturing an associated device body according to the third embodiment. FIG. 23A is a schematic cross-sectional view for explaining the method for manufacturing an associated device body according to the third embodiment.25A is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to a third embodiment. FIG. 25B is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to a fourth embodiment. FIG. 25C is a plan view of FIG. 25A. FIG. 25D is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to a fourth embodiment. FIG. 25E is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to a fourth embodiment. FIG. 25F is a schematic cross-sectional view illustrating a method for manufacturing an associated device body according to a fourth embodiment.

[0023] Hereinafter, an embodiment of the present invention will be described.

[0024] The method for manufacturing a device assembly according to this embodiment includes the steps of: step A: preparing a first laminate having, in this order, an inorganic substrate, a resin sheet, and a plurality of devices mounted at intervals on the resin sheet; step B: forming a thermoplastic elastomer layer on the first laminate so as to cover the plurality of devices and the intervals, thereby obtaining a second laminate; and step C: peeling off the inorganic substrate from the second laminate.

[0025] When the device assembly is finally formed, it is preferable that no resin layer is formed on a portion of the surface of the inorganic substrate, and that multiple resin layers are present on the inorganic substrate. Therefore, it is preferable to remove portions of the resin sheet prior to step B or after step C and form multiple resin layers at positions corresponding to at least the multiple devices. That is, the resin layer is preferably formed in advance in multiple positions corresponding to at least the multiple devices (by removing portions of the resin sheet before starting step B, multiple resin layers are formed on the inorganic substrate, and one or more devices are formed on each resin layer), or it is preferable to form multiple resin layers at positions corresponding to at least the multiple devices by removing portions of the resin sheet after step C, in which the inorganic substrate is peeled off. In this specification, the term "resin sheet" refers to a sheet of resin formed on an inorganic substrate, and each region of the resin sheet divided into multiple parts by laser irradiation or incision is referred to as a "resin layer." The "resin sheet" may be a single sheet of resin or multiple sheets of resin. However, a single sheet of resin is preferable, and a single sheet of resin formed over substantially the entire surface of the inorganic substrate is more preferable. Furthermore, "formed as a plurality of resin layers at positions corresponding to the plurality of devices" means that one or more devices are formed on each resin layer, but some resin layers may not have devices formed on them.

[0026] The method for forming the thermoplastic elastomer layer is not particularly limited, but for example, it can be formed by attaching a sheet made of a separately produced thermoplastic elastomer. The method for producing the thermoplastic elastomer sheet is not particularly limited, but it can be produced, for example, by melt extrusion. More specifically, melt extrusion methods include inflation, T-die, biaxial stretching, and casting, and film formation by the T-die method is particularly preferred. Furthermore, the thermoplastic elastomer sheet may be a stretched sheet, but an unstretched sheet is preferred.

[0027] The details of this embodiment will be described below in separate sections, namely, first to fourth embodiments. In the first to fourth embodiments, the term "resin layer" refers not only to the resin sheet after a portion of the resin sheet has been removed by irradiating the resin sheet with a laser or making cuts, but also to each of the regions of the resin sheet that have been divided into multiple parts by irradiating the resin sheet with a laser or making cuts, as shown in FIG. 3A, which will be described later, and that can be easily removed.

[0028] 1, 2A, 3A, and 4 to 8 are schematic cross-sectional views for explaining a method for manufacturing a connected device body according to a first embodiment. Fig. 2B is a plan view of Fig. 2A. Fig. 3B is a plan view of Fig. 3A.

[0029] In the method for manufacturing a device-connected body according to the first embodiment, first, a first laminate 10 (see Figures 2A and 2B) having, in this order, an inorganic substrate 12, a resin sheet 13, and a plurality of devices 16 mounted at intervals on the resin sheet 13 is prepared (Step A).

[0030] There are no particular limitations on the method for preparing the first laminate 10. The first laminate 10 can be obtained by preparing a laminate 11 in which a resin sheet 13 is laminated on an inorganic substrate 12 (see FIG. 1 ), and then forming a plurality of devices 16 on the laminate 11 using existing equipment and processes for manufacturing electronic devices. Alternatively, the first laminate 10 may be directly obtained, having, in this order, the inorganic substrate 12, the resin sheet 13, and a plurality of devices 16 mounted at intervals on the resin sheet 13.

[0031] The first laminate 10 can be manufactured by a known method (see, for example, JP 2010-283262 A, JP 2011-011455 A, JP 2011-245675 A, etc.). The first laminate 10 will be briefly described below.

[0032] <First Laminate> The first laminate 10 has, in this order, an inorganic substrate 12, a resin sheet 13, and a plurality of devices 16 mounted on the resin sheet 13 at intervals.

[0033] <Inorganic Substrate> The inorganic substrate 12 serves as a support when devices are formed on the resin sheet 13. The inorganic substrate 12 is peeled off from the resin layer 14, which will be described later, at any stage before the device assembly is completed.

[0034] The inorganic substrate 12 may be any plate-like material that can be used as a substrate made of an inorganic material, and examples thereof include those that are primarily made of glass plates, ceramic plates, semiconductor wafers, metals, etc., and composites of these glass plates, ceramic plates, semiconductor wafers, and metals, such as laminates of these plates, dispersed plates, or composites containing fibers.

[0035] Examples of the glass plate include quartz glass, high silicate glass (96% silica), soda-lime glass, lead glass, aluminoborosilicate glass, borosilicate glass (Pyrex (registered trademark)), borosilicate glass (alkali-free), borosilicate glass (microsheet), and aluminosilicate glass.

[0036] The semiconductor wafer is not particularly limited, but examples include wafers of silicon wafers, germanium, silicon-germanium, gallium-arsenic, aluminum-gallium-indium, nitrogen-phosphorus-arsenic-antimony, SiC, InP (indium phosphide), InGaAs, GaInNAs, LT, LN, ZnO (zinc oxide), CdTe (cadmium telluride), ZnSe (zinc selenide), etc. Among these, the wafers that are preferably used are silicon wafers, and particularly preferred are mirror-polished silicon wafers having a size of 8 inches or more.

[0037] Examples of the metal include single element metals such as W, Mo, Pt, Fe, Ni, and Au, and alloys such as Inconel, Monel, Nimonic, carbon copper, Fe-Ni based Invar alloys, and Super Invar alloys. Also included are multilayer metal plates formed by adding other metal layers or ceramic layers to these metals.

[0038] <Resin Sheet> The resin sheet 13 is not particularly limited as long as it is a sheet made of resin, but is preferably a heat-resistant polymer film. If the resin sheet 13 is a heat-resistant polymer film, it can withstand the heat that is generated when the device 16 is formed on the heat-resistant polymer film.

[0039] In this specification, a heat-resistant polymer is a polymer having a melting point of 400°C or higher, preferably 500°C or higher, and a glass transition temperature of 250°C or higher, preferably 320°C or higher, and more preferably 380°C or higher. Hereinafter, to avoid complication, it will also be referred to simply as a polymer. In this specification, the melting point and glass transition temperature are determined by differential scanning calorimetry (DSC). When the melting point exceeds 500°C, it may be determined whether the melting point has been reached by visually observing the thermal deformation behavior when heated at the relevant temperature.

[0040] Examples of the heat-resistant polymer film (hereinafter also simply referred to as polymer film) include films of polyimide resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (e.g., aromatic polyimide resins, alicyclic polyimide resins); copolymer polyesters such as polyethylene, polypropylene, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene-2,6-naphthalate (e.g., wholly aromatic polyesters, semi-aromatic polyesters); copolymer (meth)acrylates typified by polymethyl methacrylate; polycarbonate; polyamides (e.g., aromatic polyamides); polysulfone; polyethersulfone; polyetherketone; cellulose acetate; cellulose nitrate; polyvinyl chloride; polyphenol; polyarylate; polyphenylene sulfide; polyphenylene oxide; and polystyrene. However, the polymer films are often used in processes involving heat treatment at 450°C or higher. Among the polymer films, preferred are films using so-called super engineering plastics, and more specific examples thereof include aromatic polyimide films, aromatic polyamide films, aromatic polyamideimide films, aromatic benzoxazole films, aromatic benzothiazole films, and aromatic benzimidazole films.

[0041] The thickness of the polymer film is preferably 3 μm or more, more preferably 11 μm or more, even more preferably 24 μm or more, and even more preferably 45 μm or more. There is no particular upper limit to the thickness of the polymer film, but for use as a flexible electronic device, it is preferably 250 μm or less, more preferably 150 μm or less, and even more preferably 90 μm or less.

[0042] The inorganic substrate 12 and the resin layer 14 preferably have an initial 90° peel strength of 0.05 N / cm or more. When the initial 90° peel strength is 0.05 N / cm or more, it is possible to prevent the resin layer 14 from peeling off from the inorganic substrate 12 before or during device formation. In this specification, the initial 90° peel strength refers to the 90° peel strength between the inorganic substrate and the resin layer after the first laminate is heat-treated at 200°C for 1 hour in an air atmosphere.

[0043] The conditions for measuring the 90° initial peel strength are as follows: The resin layer is peeled off from the inorganic substrate at an angle of 90°. The measurement is carried out five times, and the average value is taken as the measured value. Measurement temperature: room temperature (25°C); Peel speed: 100 mm / min; Atmosphere: air; Measurement sample width: 2.5 cm

[0044] The 90° peel strength between the inorganic substrate 12 and the resin layer 14 after heat treatment at 200°C for 1 hour in an air atmosphere and then further heating at 500°C for 1 hour (hereinafter also referred to as "post-heating 90° peel strength") is preferably 0.50 N / cm or less, more preferably 0.20 N / cm or less. Furthermore, the 90° peel strength is preferably 0.05 N / cm or more. When the 90° peel strength is 0.50 N / cm or less, the inorganic substrate 12 and the resin layer 14 are easily peeled off after device formation. Furthermore, when the 90° peel strength is 0.05 N / cm or more, unintended peeling between the inorganic substrate 12 and the resin layer 14 can be prevented, such as during device formation.

[0045] The conditions for measuring the 90° peel strength are the same as the conditions for measuring the initial peel strength.

[0046] In order to achieve the above-mentioned 90° initial peel strength and the above-mentioned 90° peel strength after heating, it is preferable to provide an adhesive layer between the inorganic substrate and the resin layer.

[0047] <Adhesive Layer> The adhesive layer is not particularly limited as long as it satisfies the above-mentioned 90° initial peel strength and 90° peel strength after heating, but is preferably a silane coupling agent layer.

[0048] Details of the silane coupling agent layer are disclosed in, for example, JP 2010-283262 A, JP 2011-011455 A, JP 2011-245675 A, etc., and therefore detailed description here is omitted. The silane coupling agent is physically or chemically present between the inorganic substrate and the resin layer, and has the effect of increasing the adhesive strength between them (the 90° initial peel strength). It also has the effect of preventing the 90° peel strength from becoming too high after heating.

[0049] <Device> In this specification, the term "device" refers to a wiring substrate having a single-sided, double-sided, or multilayer structure that carries electrical wiring, an electronic circuit including active elements such as transistors and diodes, and passive devices such as resistors, capacitors, and inductors, as well as sensor elements that sense pressure, temperature, light, humidity, etc., biosensor elements, light-emitting elements, image display elements such as liquid crystal displays, electrophoretic displays, and self-luminous displays, wireless and wired communication elements, computing elements, memory elements, MEMS elements, power generation elements such as solar cells, power storage elements, thin film transistors, etc. The device is preferably a sensor element or a light-emitting element. In this specification, the device assembly may have a configuration including multiple devices of the same type, or multiple types of devices. The combination of multiple types of devices is not particularly limited, and, for example, multiple devices selected from the above may be appropriately combined.

[0050] The step of preparing the first laminate (step A) has been described above.

[0051] 3A and 3B, after step A, cutting lines 18 for removing portions of the resin sheet 13 are formed in the resin sheet 13 by laser irradiation to form a plurality of resin layers 14 (step X). As described above, in all the drawings, the resin sheet 13 after laser irradiation is illustrated as being made up of a plurality of resin layers 14.

[0052] 4, the resin layer 14 on which the devices 16 are not laminated is removed along the cutting lines 18. This results in a configuration having a plurality of resin layers 14 formed at positions corresponding to the devices 16. In other words, a configuration is obtained in which a plurality of laminates 20 of the resin layers 14 and the devices 16 are arranged on the inorganic substrate 12.

[0053] On the other hand, a thermoplastic elastomer layer 32 with a supporting substrate 30 is prepared separately from the first laminate 10 (see FIG. 5).

[0054] <Supporting Base> The supporting base 30 is for supporting the thermoplastic elastomer layer 32 .

[0055] Examples of materials for the support substrate 30 include polyolefin resins such as polyethylene and polypropylene; polyamide resins such as nylon 6 and nylon 66; and polyester resins such as polyethylene terephthalate, polytrimethylene terephthalate, polybutylene terephthalate, polyethylene-2,6-naphthalate, and polytrimethylene terephthalate. The polyester resin may be a polyester resin copolymerized with, as a copolymerization component, a diol component such as diethylene glycol, neopentyl glycol, or polyalkylene glycol, or a dicarboxylic acid component such as adipic acid, sebacic acid, phthalic acid, isophthalic acid, or 2,6-naphthalenedicarboxylic acid. Among these, polyester resins are preferred in terms of mechanical strength, chemical resistance, and heat resistance.

[0056] Among the polyester resins, polyethylene terephthalate is most preferable in terms of the balance between physical properties and cost.

[0057] <Thermoplastic elastomer layer> The thermoplastic elastomer layer 32 has elasticity when the device connected body is completed. The thermoplastic elastomer layer 32 is made of a thermoplastic material. The thermoplastic elastomer layer 32 does not need to have elasticity before the device connected body is completed.

[0058] Examples of materials for the thermoplastic elastomer layer 32 include thermoplastic urethane rubber, olefin-based thermoplastic elastomer, polyester-based thermoplastic elastomer, polyamide-based thermoplastic elastomer, styrene-based thermoplastic elastomer, and vinyl chloride-based thermoplastic elastomer.

[0059] Next, the thermoplastic elastomer layer 32 with the support substrate 30 is laminated on the first laminate 10 to obtain a second laminate 36 (see FIG. 7) (step B, step B-1). In this embodiment, the thermoplastic elastomer layer 32 and the device 16 mounting surface are placed opposite each other as shown in FIG. 6, and then the devices 16 and the resin layer 14 are laminated so that they are embedded in the thermoplastic elastomer layer 32, as shown in FIG. 7, to obtain the second laminate 36.

[0060] Next, the inorganic substrate 12 is peeled off (step C). Furthermore, the support substrate 30 is peeled off (step D). The inorganic substrate 12 and the support substrate 30 may be peeled off in either order. However, it is preferable to peel off the inorganic substrate 12 first. Peeling off the inorganic substrate 12 first and transporting the product with the support substrate 30 still attached is advantageous in that the product can be transported with the stretchable portion (thermoplastic elastomer layer 32) stretched as little as possible.

[0061] In this way, a connected device assembly 40 is obtained (see FIG. 8). Thereafter, the devices 16 may be electrically connected to each other as needed. In this case, it is preferable to use a stretchable wiring pattern for the connection. A method for forming the stretchable wiring pattern will be described later.

[0062] 8 , in the device assembly 40, the thermoplastic elastomer layer 32 is continuous up to the surfaces 15a of the spaces 15 between the resin layers 14, and the surfaces 32a of the thermoplastic elastomer layer 32 are formed without any steps relative to the surfaces 14a of the resin layers 14 in the spaces 15. In the device assembly 40, the device formation surface (the surface on the surface 32a side of the thermoplastic elastomer layer 32) is flat without any steps, so that the device formation surface (the surface on the surface 32a side of the thermoplastic elastomer layer 32) can be attached to a surface to be attached without any gaps, for example.

[0063] In the above-described embodiment, a thermoplastic elastomer layer with a supporting substrate is used, and a thermoplastic elastomer layer is formed on a first laminate to obtain a second laminate. However, the present invention is not limited to this example. For example, a device assembly 40 (see FIG. 8 ) may be obtained having a thermoplastic elastomer layer 32 formed by applying a liquid thermoplastic elastomer layer-forming composition to the resin layer 14 of the first laminate 10.

[0064] [Second Embodiment] The method for manufacturing a device assembly according to the second embodiment is the same as that of the first embodiment, except that the timing for forming a cutting line in the resin sheet and the timing for removing the resin layer on which devices are not laminated along the cutting line are different. Therefore, in the following, the description of the common parts will be omitted or simplified, and the different parts will be mainly described. Furthermore, the same reference numerals will be used for the components common to the first embodiment.

[0065] 9 to 14 are schematic cross-sectional views for explaining the method for manufacturing the connected device body according to the second embodiment.

[0066] In the method for manufacturing the connected-device body according to the second embodiment, first, a first stack 10 (see FIGS. 2A and 2B) is prepared (step A).

[0067] Next, a thermoplastic elastomer layer 32 (see FIG. 5) with a support substrate 30 is laminated on the first laminate 10 to obtain a second laminate 37 (see FIG. 10) (step B, step B-1). In this embodiment, the thermoplastic elastomer layer 32 and the device 16 mounting surface are placed opposite each other as shown in FIG. 9, and then the devices 16 are laminated so as to be embedded in the thermoplastic elastomer layer 32 as shown in FIG. 10 to obtain the second laminate 37.

[0068] Next, as shown in FIG. 11, the inorganic substrate 12 is peeled off (step C).

[0069] Next, as shown in FIG. 12, cutting lines 18 for removing parts of the resin sheet 13 are formed in the resin sheet 13 by laser irradiation to form a plurality of resin layers 14 (step E).

[0070] Next, as shown in FIG. 13 , the resin layer 14 on which the devices 16 are not laminated is removed along the cutting lines 18 (step F). This results in a configuration having a plurality of resin layers 14 formed at positions corresponding to the devices 16. In the second embodiment, after step C of peeling off the inorganic substrate 12, cutting lines 18 for removing portions of the resin sheet 13 are formed in the resin sheet 13 by laser irradiation to form a plurality of resin layers 14 (step E). By removing some of the resin layers 14, the resin layers 14 are formed at positions corresponding to the devices 16 (step F). Therefore, it is possible to remove unnecessary resin layers 14 after confirming the shape of the devices 16 embedded in the thermoplastic elastomer layer 32. That is, although there is a possibility that the thermoplastic elastomer layer 32 and the first laminate 10 (particularly the resin layer 14) may be deformed in step B, in the second embodiment, it is possible to selectively remove unnecessary resin layer portions after confirming such deformation.

[0071] Thereafter, the support substrate 30 is peeled off.

[0072] In this way, a device assembly 42 according to the second embodiment is obtained (see FIG. 14 ). The second embodiment is characterized in that, after step C of peeling off the inorganic substrate, step E of forming cutting lines in the resin sheet by laser irradiation to remove portions of the resin sheet, and step F of removing the portions to form a plurality of resin layers at positions corresponding to at least a plurality of devices, are included.

[0073] [Third Embodiment] The method for manufacturing a device assembly according to the third embodiment differs in that wiring is provided to connect the devices. Therefore, in the following, the description of the parts common to the first embodiment will be omitted or simplified, and the differences will be mainly described. Furthermore, the same reference numerals will be used for the components common to the first embodiment.

[0074] 15, 16, 17A, 18A, 19A, 20A, 21, 22, 23A, and 24 are schematic cross-sectional views illustrating a method for manufacturing a connected device body according to the third embodiment. Fig. 17B is a plan view of Fig. 17A, Fig. 18B is a plan view of Fig. 18A, Fig. 19B is a plan view of Fig. 19A, Fig. 20B is a plan view of Fig. 20A, and Fig. 23B is a bottom view of Fig. 23A.

[0075] In the method for manufacturing a device-connected body according to the third embodiment, first, a laminate 11 is prepared in which a resin sheet 13 is laminated on an inorganic substrate 12 (see FIG. 1).

[0076] Next, electrode lead wires 54 are formed on the resin sheet 13 (see FIG. 16 ). The method for forming the electrode lead wires 54 is not particularly limited, and any conventionally known method can be used. For example, as shown in FIG. 15 , a metal layer 52 is formed on the resin sheet 13, and then a photosensitive resist is applied to the metal layer 52, followed by exposure, development, and etching to form the electrode lead wires 54.

[0077] Next, as shown in FIGS. 17A and 17B, bumps 56 are formed on the electrode lead wires 54 at locations where the devices 16 are to be bonded.

[0078] Next, as shown in FIGS. 18A and 18B, the device 16 is placed on the bumps 56, and the device 16 and the electrode lead-out wiring 54 are bonded via the bumps 56 by reflow or the like.

[0079] Next, as shown in FIGS. 19A and 19B, cutting lines 18 for removing parts of the resin sheet 13 are formed in the resin sheet 13 by laser irradiation to form a plurality of resin layers 14 (step X).

[0080] Thereafter, bumps 58 are formed to connect the electrode lead wires 54 to the wiring pattern 34 on the thermoplastic elastomer layer 32 (described later) (see FIGS. 19A and 19B). In this manner, a first laminate 60 is obtained.

[0081] Separately from the first laminate 60, a thermoplastic elastomer layer 32 with a support substrate 30 is prepared (see FIGS. 20A and 20B ). A wiring pattern 34 and circuit lead-out wiring 35 are formed on the thermoplastic elastomer layer 32. The wiring pattern 34 is a conventionally known stretchable wiring pattern. The method for forming the wiring pattern 34 and circuit lead-out wiring 35 on the thermoplastic elastomer layer 32 is not particularly limited, and conventionally known methods can be used. For example, sputtering is performed using a metal mask on the thermoplastic elastomer layer 32 to form the shapes of the wiring pattern 34 and circuit lead-out wiring 35, and then electrolytic plating is performed on the sputtered portion to increase the thickness, thereby producing the wiring pattern 34 and circuit lead-out wiring 35. The wiring pattern 34 is preferably a bellows-shaped metal wiring as in this embodiment. Alternatively, the wiring pattern 34 may be a stretchable metal paste wiring formed by, for example, applying a conductive composition containing a conductive filler. For example, the conductive pattern described in International Publication No. 2015 / 005204 can be used as the wiring pattern 34. If the wiring pattern 34 is bellows-type metal wiring or stretchable metal paste wiring, suitable stretchability between the devices 16 can be maintained while maintaining electrical connection between the devices 16. Therefore, the wiring pattern 34 is preferably bellows-type metal wiring or stretchable metal paste wiring.

[0082] Next, the resin layer 14 of the first laminate 60 (see FIGS. 19A and 19B ) that does not have the device 16 laminated thereon is removed along the cutting line 18. Thereafter, a thermoplastic elastomer layer 32 with a support substrate 30 (see FIGS. 20A and 20B ) is laminated on the first laminate 60 to obtain a second laminate (step B, step B-1). In this embodiment, as shown in FIG. 21 , the thermoplastic elastomer layer 32 and the device 16 mounting surface are oriented opposite each other, and then, as shown in FIG. 22 , the two are brought closer together and laminated so that the device 16 is embedded in the thermoplastic elastomer layer 32, thereby obtaining a second laminate. This electrically connects the circuit lead-out wiring 35 on the thermoplastic elastomer layer 32 to the bumps 58 on the resin layer 14.

[0083] Next, the inorganic substrate 12 is peeled off (step C), resulting in a structure having a plurality of resin layers 14 formed at positions corresponding to the devices 16 (see FIGS. 23A and 23B).

[0084] Thereafter, the support substrate 30 is peeled off.

[0085] As a result, a device connection body 44 according to the third embodiment is obtained (see FIG. 24 ). The third embodiment is characterized in that the thermoplastic elastomer layer has, on its surface, an elastic wiring pattern for connecting the devices. In addition, in the present invention, as in the third embodiment, it is preferable to peel off the support base 30 after the step of peeling off the inorganic substrate 12 (step C). This makes it possible to prevent the thermoplastic elastomer layer 32 and the wiring pattern 34 on the thermoplastic elastomer layer 32 from stretching or deforming before the second laminate is obtained.

[0086] [Fourth Embodiment] The method for manufacturing a device assembly according to the fourth embodiment differs from the third embodiment in that a wiring pattern and circuit lead-out wiring are formed on the resin layer 14. Therefore, in the following, the description of the parts common to the third embodiment will be omitted or simplified, and the differences will be mainly described. Furthermore, the same reference numerals will be used for the components common to the third embodiment.

[0087] 25A and 26 to 28 are schematic cross-sectional views for explaining a method for manufacturing a connected device body according to the fourth embodiment. Fig. 25B is a plan view of Fig. 25A.

[0088] In the method for manufacturing an integrated device body according to the fourth embodiment, first, a first stack 60 is obtained in the same manner as in the third embodiment (see FIGS. 19A and 19B).

[0089] 25A and 25B , a wiring pattern 74 and circuit lead-out wiring 75 are formed on the first laminate 60 (step G). Specifically, the wiring pattern 74 and circuit lead-out wiring 75 are formed so that the bumps 58 of one device 16 are electrically connected to the bumps 58 of the other device 16. The wiring pattern 74 and circuit lead-out wiring 75 can be formed in the same manner as the wiring pattern 34 and circuit lead-out wiring 35.

[0090] Next, the thermoplastic elastomer layer 32 (see FIG. 5) with the support substrate 30 is laminated on the first laminate 60 (see FIGS. 25A and 25B) to obtain a second laminate 76 (step B, step B-1). In this embodiment, as shown in FIG. 26, the thermoplastic elastomer layer 32 and the device 16 mounting surface are placed opposite each other, and then the two are brought close to each other and laminated so that the devices 16 are embedded in the thermoplastic elastomer layer 32, as shown in FIG. 27, to obtain the second laminate 76.

[0091] Next, the inorganic substrate 12 is peeled off (step C). After that, the resin layer 14 on which the devices 16 are not laminated is removed along the cutting lines 18. This results in a structure having a plurality of resin layers 14 formed in positions corresponding to the devices 16 (see FIG. 28 ).

[0092] Thereafter, the support substrate 30 is peeled off.

[0093] In this way, a device assembly 78 according to the fourth embodiment is obtained (see FIG. 24). The fourth embodiment is characterized in that, prior to step B, step G is performed to form, on the first laminate, an elastic wiring pattern and circuit lead-out wiring that connects the plurality of devices.

[0094] As described above, according to the present embodiment (first to fourth embodiments, and their modified examples), simply by forming a thermoplastic elastomer layer on a first laminate so as to cover the plurality of devices (step B) and then peeling off the inorganic substrate (step C), a device assembly can be obtained in which the plurality of devices are mounted at intervals on the stretchable thermoplastic elastomer layer. Specifically, a device assembly can be obtained that includes a thermoplastic elastomer layer, a plurality of resin layers attached to the thermoplastic elastomer layer, a plurality of devices interposed between the thermoplastic elastomer layer and the plurality of resin layers, and a stretchable wiring pattern connecting the plurality of devices. This results in excellent productivity. Furthermore, although a resin layer is laminated on each device, the resin layers corresponding to the devices are not continuous. Therefore, one device is connected to the other devices only by the thermoplastic elastomer layer. As a result, the device assembly obtained by the manufacturing method according to this embodiment is stretchable.

[0095] This application claims the benefit of priority based on Japanese Patent Application No. 2024-118880, filed on July 24, 2024. The entire contents of the specification of Japanese Patent Application No. 2024-118880, filed on July 24, 2024, are incorporated herein by reference.

[0096] The present invention will be described in detail below using examples, but the present invention is not limited to the following examples as long as it does not depart from the gist of the invention.

[0097] (Measurement Method) <Thickness> Using a Mitutoyo micrometer, measurements were taken at five points across the width of the sheet, and the average value was taken as the sheet thickness.

[0098] <5% Mod> A test piece 10 mm wide and 150 mm long was cut out so that the winding direction of the sheet was the longitudinal direction. Using an autograph AGS-X manufactured by Shimadzu Corporation, the stress was measured when the sheet was elongated to a strain of 5% at a tensile speed of 50 mm / min with an initial chuck distance of 100 mm.

[0099] <Restoration Rate after 10% Stretching> A test piece 10 mm wide and 150 mm long was cut out so that the winding direction of the sheet was the longitudinal direction. Using an autograph AGS-X manufactured by Shimadzu Corporation, the sheet was stretched to a strain of 10% at a tensile speed of 50 mm / min with an initial chuck distance of 100 mm. The sheet was then returned to the initial position at a tensile speed of 50 mm / min, and the strain at which the stress became zero was measured as the permanent strain (%). The restoration rate was calculated using the following formula: restoration rate (%) = (1 - permanent strain / 10) x 100

[0100] <Surface roughness Ra> Using a Hitachi High-Technologies nano 3D optical interference measurement system VS1800, the surface shape of the sheet was observed with a 10x objective lens. Cross-sectional profiles with a width of 1 mm were obtained at three arbitrary locations, and the average value of Ra was calculated.

[0101] <Haze> Each sheet was cut into a size of 30 mm width x 30 mm length, and the haze was measured three times using a haze meter NDH8000 manufactured by Nippon Denshoku Industries Co., Ltd., and the average value was calculated.

[0102] (Average transmittance of light with wavelengths of 400 nm to 700 nm) Measurement was performed by ultraviolet-visible spectroscopy under the following measurement conditions. Using a Shimadzu Corporation ultraviolet-visible-near-infrared (UV-Vis-NIR) spectrophotometer SolidSpec-3700 (software: UVProve ver. 2.7135), transmittance was measured using an integrating sphere. <Measurement conditions> Measurement wavelength: 400 nm to 700 nm Scan speed: Medium Slit width: (12 nm) Sampling pitch: 0.5 nm Standard white plate: Spectralon standard reflector A transmission spectrum of light with wavelengths of 400 nm to 700 nm was obtained. From this, the average transmittance of light in the wavelength range of 400 nm to 700 nm was calculated and shown in Table 1.

[0103] Note that Example 1 below corresponds to the third embodiment, and will be described below with reference to the drawings used in the description of the third embodiment.

[0104] <Preparation of Pelprene Sheet> Pelprene manufactured by Toyobo MC Co., Ltd. was used as the pellet material. The pellet material was melt-extruded into a film using a T-die extruder, brought into contact with a mirror-cooled roll at 20°C, and wound up with an interleaving sheet to produce a Pelprene sheet. The barrel temperature and die temperature during extrusion were set at the melting point + 30°C. The sheet was unstretched. The thickness of the sheet was adjusted by changing the rotation speed of the mirror-cooled roll.

[0105] <Production of a Device Assembly> (Example 1) A glass substrate having a diameter of 200 mm and a thickness of 0.7 mm was prepared. The glass substrate was subjected to ultrasonic water cleaning and ultraviolet / ozone cleaning (UV / O ３ The ultraviolet / ozone cleaning was carried out using a UV ozone cleaning and modification device (SKR1102N-03, manufactured by Lantechnical Services Co., Ltd.) at a distance of 30 mm from the lamp for 1 minute.

[0106] A solution containing 1% by mass of 3-aminopropyltrimethoxysilane (KBM-903, manufactured by Shin-Etsu Chemical Co., Ltd.) diluted with isopropanol was prepared.

[0107] The glass substrate was placed on a spin coater (MSC-500S, manufactured by Japan Create Co., Ltd.). The solution was dropped onto the glass substrate, and the substrate was rotated at a rotation speed of 5000 rpm, and then at a rotation speed of 2000 rpm to coat the solution onto the glass substrate. The substrate was then left to dry on a clean bench for 1 minute, forming a silane coupling agent layer on the glass substrate.

[0108] A polyimide film (XENOMAX (registered trademark) manufactured by Toyobo Co., Ltd.) having a diameter of 196 mm and a thickness of 38 μm was attached onto the silane coupling agent layer. The attachment was performed so that the center of the glass substrate and the center of the polyimide film were aligned. The attachment was performed using a laminator (MRK-1000 manufactured by MCK Corporation) in a clean room under conditions of 22°C and 55% RH at a lamination speed of 50 mm / sec and an original air pressure of 0.55 MPa.

[0109] Next, a NiCr layer was deposited to a thickness of about 15 nm on the polyimide film surface using a dual magnetron sputtering device, and then a Cu layer was deposited to a thickness of about 250 nm, after which the Cu layer was grown to a thickness of 5 μm by electrolytic plating.

[0110] Next, a photosensitive resist was applied onto the Cu layer, and electrode lead-out wiring (corresponding to the electrode lead-out wiring 54 in FIG. 16) was fabricated by exposure, development, and etching.

[0111] Next, solder paste (manufactured by Tamura Corporation, product name TLF-801-17) was printed on the electrode lead wiring at the location where the chip was to be joined (corresponding to bump 56 in FIG. 17A). The solder paste became the bump that electrically connected the chip and the electrode lead wiring.

[0112] Next, chip thermistors (Murata Manufacturing Co., Ltd., product name PRF15AR102RB6RC, size 1 mm × 0.5 mm) were placed on the solder paste as devices. Then, solder joints were formed by reflow (see FIG. 18A). The chip thermistors were spaced 10 mm apart.

[0113] Next, the polyimide film was laser-cut to separate one device from the other (see Figure 19A). Laser cutting was performed using a nano-UV laser (Takei Electric Co., Ltd.) at 8.5 W and 100 Hz, scanning the same location three times. Cutting lines were made vertically and horizontally in the polyimide film at predetermined distances above, below, left, and right from the center of the chip-type thermistor.

[0114] Thereafter, solder paste for joining the electrode lead wiring to the circuit on the Pelprene (registered trademark) sheet, which will be described later, was printed at predetermined locations (corresponding to bumps 58 in FIG. 19A). The solder paste serves as bumps that electrically connect the electrode lead wiring to the circuit on the Pelprene sheet, which will be described later.

[0115] As a result of the above, a first laminate was obtained, which had a glass substrate, a polyimide film (product name: XENOMAX manufactured by XENOMAX JAPAN, 38 μm thick), and a plurality of devices mounted at intervals on the polyimide film.

[0116] In addition to the first laminate, a Pelprene sheet (product name: P-40H manufactured by Toyobo MC Co., Ltd.) / PET film laminate was prepared. The PET film used was a protective film HG2-50EX manufactured by Fujicopian Co., Ltd.

[0117] An epoxy adhesive was applied to the Pelprene sheet as a base layer and cured. The base layer was formed only on the area corresponding to the electrode lead-out wiring (circuit lead-out wiring area) and the circuit formation area. Next, the area other than the circuit lead-out wiring area and the circuit formation area was covered with a metal mask, and a Cu layer was formed on the base layer by sputtering to form a circuit. Thereafter, the Cu layer was grown to a thickness of 10 μm by electroplating (see FIG. 20A).

[0118] Next, to bond the polyimide film, a cut-out piece of adhesive sheet TSU0080 (manufactured by Toyo Ink Co., Ltd.) was roll-laminated onto the Pelprene sheet at 100° C. so that only the non-circuited areas would be bonded.

[0119] Next, while aligning by image processing, a PET / Pelprene resin laminate was bonded to the first laminate using a laminator (HAL550, manufactured by Sankyo Co., Ltd.) to obtain a second laminate. This was then heated at 150°C for 2 minutes. This connected the circuit lead-out wiring on the Pelprene sheet to the solder paste on the polyimide film.

[0120] Thereafter, the glass substrate and the polyimide film cut by the laser were manually peeled off. Furthermore, the PET film was manually removed. In this manner, the connected device assembly according to Example 1 was obtained (see FIG. 23A).

[0121] A watch glass made of borosilicate glass (DURAN) with a diameter C of 50 mm and a depth h of 5 mm was purchased. Since the surface is approximately spherical, the radius of curvature R is R = h / 2 + C ２ Using the equation R = 65 mm, the thermal expansion coefficient of borosilicate glass is 33 x 10 －７ / °C (20°C to 300°C), the change in diameter of 50 mm for a temperature change of 10°C is 1.7 μm, and deformation due to heating can be ignored. By stretching the device assembly according to Example 1 along this, it was confirmed that it could be fitted without wrinkles. Calculating the arc L of the watch glass at this time, it is 51.32 mm from L = Rα (where α (radian) = sin －１ (C / 2R) Therefore, L / C = 1.026, which means that the film is stretched by more than 2.6%. This is well below 10%, and can be achieved with a film that can stretch by about 10%.

[0122] A silane coupling agent (KBM903 manufactured by Shin-Etsu Silicone Co., Ltd. diluted to 1% with isopropyl alcohol) was applied to the convex surface of one of the watch glasses using a spin coater (MSC200D manufactured by Japan Creative Co., Ltd.) at 1000 rpm for 30 seconds, and then a Pelprene sheet was sandwiched between two watch glasses and pressed at 120°C.The Pelprene sheet adhered to the watch glass on which the silane coupling agent had been applied, but was easily peeled off from the other watch glass on which the silane coupling agent had not been applied, allowing it to be attached to the convex surface.

[0123] In the resulting device assembly, although a polyimide film was laminated on each device, the polyimide films corresponding to each device were not continuous. Therefore, one device was connected to the other devices only by the Pelprene sheet. As a result, the device assembly of Example 1 had flexibility. Furthermore, in the device assembly of Example 1, the devices were connected to each other by a flexible wiring pattern formed on the surface of the Pelprene sheet, so it was also possible to supply power to each device.

[0124] (Examples 2, 3, and 4) In Example 1, a Pelprene sheet (product name: P-30B manufactured by Toyobo MC Co., Ltd.) / PET film laminate was prepared. The PET film used was a protective film HG2-50EX manufactured by Fujicopian Co., Ltd. Here, experiments were carried out in the same manner as in Example 1, except that the Pelprene sheet product name was changed from P-30B manufactured by Toyobo MC Co., Ltd. to P-40H, P-75M, or P-55B, respectively. The physical properties of these Pelprene sheets are summarized in Table 1.

[0125]

[0126] As is clear from the above explanation, according to the present invention, it is possible to attach without wrinkles to complex curved surfaces, such as spherical surfaces, which cannot be formed from flat surfaces without stretching, and it is possible to manufacture device assemblies having complex shapes.

[0127] REFERENCE SIGNS LIST 10, 60 First laminate 12 Inorganic substrate 13 Resin sheet 14 Resin layer 14a Surface 15 Gap portion 15a Surface 16 Device 18 Cutting line 30 Support substrate 32 Thermoplastic elastomer layer 32a Surface 34, 74 Wiring pattern 35, 75 Circuit lead-out wiring 36, 37, 76 Second laminate 40, 42, 44, 78 Device connecting body 52 Metal layer 54 Electrode lead-out wiring 56 Bump 58 Bump

Claims

1. A method for manufacturing a device assembly, comprising: step A of preparing a first laminate having, in this order, an inorganic substrate, a resin sheet, and a plurality of devices mounted at intervals on the resin sheet; step B of forming a thermoplastic elastomer layer on the first laminate so as to cover the plurality of devices and the intervals, thereby obtaining a second laminate; and step C of peeling off the inorganic substrate from the second laminate.

2. A method for manufacturing a device assembly as described in claim 1, characterized in that, prior to step B or after step C, a portion of the resin sheet is removed and multiple resin layers are formed at least in positions corresponding to the multiple devices.

3. The method for manufacturing a device assembly according to claim 2, further comprising, prior to step B, step X of forming a cutting line in the resin sheet by laser irradiation to remove a portion of the resin sheet.

4. The method for manufacturing a device assembly according to claim 1, wherein step B includes step B-1 of laminating a thermoplastic elastomer layer with a supporting substrate onto the first laminate, and the method for manufacturing a device assembly further includes step D of peeling off the supporting substrate.

5. The method for manufacturing a device assembly according to claim 4, wherein the thermoplastic elastomer layer has on its surface an elastic wiring pattern for connecting the devices together.

6. A method for manufacturing a device assembly as described in claim 1, characterized in that it includes, prior to step B, step G of forming an elastic wiring pattern on the first laminate that connects the devices together.

7. The method for manufacturing a device assembly according to claim 5 or 6, wherein the wiring pattern is a bellows-type metal wiring or an elastic metal paste wiring.

8. A method for manufacturing a device assembly as described in claim 2, characterized in that it comprises, after step C of peeling off the inorganic substrate, step E of forming cutting lines in the resin sheet by laser irradiation to remove portions of the resin sheet, and step F of forming a plurality of resin layers at positions corresponding to at least the plurality of devices by removing the portions.

9. The method for manufacturing a device assembly according to claim 1 or 2, wherein the device is a sensor element or a light-emitting element.

10. A device assembly comprising: a thermoplastic elastomer layer; a plurality of resin layers attached to the thermoplastic elastomer layer; a plurality of devices interposed between the thermoplastic elastomer layer and the plurality of resin layers; and an elastic wiring pattern connecting the plurality of devices.

11. A device assembly as described in claim 10, characterized in that the thermoplastic elastomer layer is continuous to the surface of the gaps between the multiple resin layers, and the surface of the thermoplastic elastomer layer is formed without any steps relative to the surface of the resin layer in the gaps.

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