Telematics module and control method therefor

Abstract

The telematics module installed in a vehicle comprises: a PCB disposed in a space between an upper cover and a protruding surface of a lower cover; a NAD module disposed in a first region, which corresponds to the protruding surface, of the PCB, the NAD module having a modem, a memory, and an RF transmission / reception unit; and a heat dissipation module which is disposed between the NAD module and the protruding surface, and transfers, by operating in accordance with a driving voltage, heat generated in the NAD module to the protruding surface and a frame.

Description

Telematics module and control method thereof

[0001] The present invention relates to a telematics module and a control method thereof. A specific embodiment relates to a telematics module comprising a plurality of communication modules and a heat dissipation structure, and a control method thereof.

[0002] Recently, the need to provide communication services through vehicles has been increasing. To provide these services, vehicles must be equipped with telematics modules. As vehicle telematics modules become increasingly high-performance, the communication modules used in these modules also need to be implemented with high performance and high integration.

[0003] The high performance and high integration of communication modules in vehicle telematics modules lead to increased heat generation within these components. When in operation, the telematics module mounted on a vehicle generates extremely high temperatures. Furthermore, the telematics module installed in a vehicle can be exposed to high-temperature ambient conditions. This increased temperature significantly impacts the reliability of the communication modules and components within the telematics module.

[0004] Meanwhile, when using fans to dissipate heat generated by components, the noise generated by the fan may cause sensitivity in vehicle occupants, depending on its installation location. Furthermore, when installed in an electric vehicle, the fan noise may be perceived as even louder.

[0005] Therefore, there is a need to apply fanless thermoelectric coolers (TECs) to communication modules and components of telematics modules to eliminate fan noise and ensure the longevity, operation, and temperature reliability of these modules and components. In this regard, there is a need to provide a heat dissipation control method that operates in different heat dissipation modes depending on the temperatures of the electronic components located in the telematics module.

[0006] The present specification aims to solve the aforementioned problems and other problems. The purpose of the present specification is to provide an antenna module for a vehicle equipped with multiple communication modules and a heat dissipation structure.

[0007] The purpose of this specification is to implement an optimal heat dissipation structure by considering the layout structure of electronic components placed on different substrates.

[0008] The purpose of this specification is to provide a heat dissipation control method that operates in different heat dissipation modes depending on the temperatures of electronic components placed on a substrate.

[0009] An object of this specification is to provide a heat dissipation control method that operates in different heat dissipation modes according to different operating modes in a vehicle.

[0010] The purpose of this specification is to ensure the lifespan, operation, and temperature reliability of the module and its components through optimal heat dissipation according to each operating situation of the telematics module.

[0011] To achieve the above or other purposes, a telematics module mounted on a vehicle according to the present specification includes a PCB disposed in a space between a protruding surface of a lower cover and an upper cover; an NAD module disposed in a first area of ​​the PCB corresponding to the protruding surface and having a modem, memory, and RF transceiver; and a heat dissipation module disposed between the NAD module and the protruding surface and operating in accordance with a driving voltage to transfer heat generated in the NAD module to the protruding surface and the frame.

[0012] According to an embodiment, a telematics module mounted on a vehicle includes a lower cover including at least one protruding surface protruding from a bottom surface coupled to a metal frame of the vehicle into an enclosure; an upper cover coupled to the lower cover; a PCB disposed in a space between the protruding surface of the lower cover and the upper cover; an NAD module disposed in a first area of ​​the PCB corresponding to the protruding surface, the NAD module including a modem, a memory, and an RF transceiver; and a heat dissipation module disposed between the NAD module and the protruding surface, the heat dissipation module operating according to a driving voltage to transfer heat generated in the NAD module to the protruding surface and the frame. The NAD module may assign priorities to a plurality of communication modes and variably control the driving voltage of the heat dissipation module according to the priorities.

[0013] According to an embodiment, the protruding surface may include a first protruding surface corresponding to a first area of ​​the PCB and a second protruding surface corresponding to a second area of ​​the PCB. The telematics module may further include a V2X module arranged in a second area of ​​the PCB corresponding to the second protruding surface. The NAD module may be arranged in the first area of ​​the PCB corresponding to the first protruding surface.

[0014] According to an embodiment, a plurality of integrated circuits including the memory and the RF transceiver of the NAD module and the electronic components of the V2X module may be configured to have different TEC driving reference temperatures.

[0015] According to an embodiment, when the plurality of integrated circuits are driven simultaneously, the NAD module can drive the heat dissipation module based on an integrated circuit having a lower reference temperature for heat dissipation among the plurality of integrated circuits.

[0016] According to an embodiment, the NAD module can drive the heat dissipation module at a first voltage value based on a boot signal, and drive the heat dissipation module by changing the voltage value to a second voltage value different from the first voltage value based on a call order.

[0017] According to an embodiment, the NAD module may drive the heat dissipation module by changing the third voltage value lower than the second voltage value when the call is connected in response to the call command based on the second voltage value.

[0018] According to an embodiment, the heat dissipation module includes a first heat dissipation module disposed in a first sub-area of ​​the NAD module in which the modem and the memory adjacent to the modem are disposed; and a second heat dissipation module disposed in a second sub-area of ​​the NAD module in which the RF transceiver is disposed. The NAD module may control the first heat dissipation module and the second heat dissipation module to be driven simultaneously when the temperature due to heat generated from the NAD module is higher than a first threshold temperature, and may control the first heat dissipation module to be driven and the second heat dissipation module not to be driven when the temperature due to heat generated from the NAD module is lower than the second threshold temperature.

[0019] The technical effects of the antenna module mounted on such a vehicle and the vehicle including the same are described as follows.

[0020] According to the present specification, an antenna module having a plurality of communication modules and a heat dissipation structure can be provided in a vehicle.

[0021] According to the present specification, an antenna module having a plurality of communication modules and a heat dissipation structure can be provided in a vehicle by assigning priorities to each of a plurality of communication modes and variably controlling the driving voltage of the heat dissipation structure according to the priorities.

[0022] According to this specification, an optimal heat dissipation structure and heat dissipation control method can be implemented by considering the arrangement structure of electronic components placed on different substrates corresponding to the protruding surfaces of the lower cover.

[0023] According to the present specification, a heat dissipation control method can be provided that operates in different heat dissipation modes by driving a heat dissipation module with different driving voltages according to the temperatures of electronic components placed on a substrate.

[0024] According to the present specification, a heat dissipation control method can be provided in which a heat dissipation module is driven with different driving voltages according to different operation modes in a vehicle, thereby operating in different heat dissipation modes.

[0025] According to this specification, by applying a heat dissipation structure to a communication module and components within a telematics module, the lifespan, operation, and temperature reliability of the module and components can be secured through optimal heat dissipation by changing the operation algorithm of the heat dissipation structure according to each operating situation.

[0026] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0027] FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0028] FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted within a vehicle including an antenna module mounted on a vehicle according to the present specification.

[0029] Figure 3 is a configuration diagram of a vehicle according to an embodiment of the present specification.

[0030] FIG. 4 shows a cross-sectional structure of a telematics module mounted on a vehicle according to one embodiment of the present specification.

[0031] Fig. 5 shows a cross-sectional structure of a telematics module mounted on a vehicle according to another embodiment of the present specification.

[0032] Fig. 6 shows the structure of the lower cover of Fig. 4 or Fig. 5.

[0033] Fig. 7 shows a structure in which electronic components are arranged in the NAD module and V2X module of Figs. 4 and 5.

[0034] Figure 8 shows the structure and embodiment of the heat dissipation module of this specification.

[0035] Figure 9 shows a flowchart of a control method of a telematics module entering boot mode.

[0036] Figure 10 shows a flowchart of a control method for controlling a telematics module that has entered boot mode to operate in one of a plurality of operation modes.

[0037] Figures 11 to 13 show flowcharts of a control method of a telematics module according to a first operation mode to a third operation mode.

[0038] Figure 14 shows a flowchart of a control method for controlling the operation of a heat dissipation module based on the temperature difference between the two ends of the heat dissipation module.

[0039] Figure 15 shows a flowchart of a control method for controlling the operation of a heat dissipation module based on the operation time of the heat dissipation module.

[0040] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of this specification.

[0041] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0042] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0043] Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprises" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood not to preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0044] Below, an antenna module according to the present specification is described in detail. In this regard, FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0045] Referring to FIG. 1, a vehicle (1) may be equipped with at least one communication antenna. The vehicle (1) may transmit and / or receive signals of various frequency bands using the communication antenna. The vehicle (1) may perform communication such as V2V (Vehicle-to-Vehicle), V2I (Vehicle to Infrastructure), V2P (Vehicle-to-Pedestrian), and V2N (vehicle-to-network).

[0046] The above antenna may be composed of a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna may be a transparent antenna.

[0047] The above antenna may be placed on the glass of the vehicle (1). The antenna may be coupled or attached to a front windshield (101), door glass (102, 103), quarter glass (104), rear windshield (not shown), side mirror (not shown), sunroof (105), or lamp glass (106). For example, the antenna may be a transparent antenna. As another example, the antenna may be placed in an area where a roof (110) is formed on the upper portion of the vehicle (1).

[0048] Meanwhile, FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted in a vehicle including an antenna module mounted in a vehicle according to the present specification.

[0049] Referring to Figures 2a and 2b, the present specification proposes a planar antenna that does not protrude, replacing the existing shark fin antenna, to improve the appearance of an automobile (vehicle) and preserve telematics performance in the event of a collision. Furthermore, the present specification proposes an antenna that integrates an LTE antenna and a 5G antenna, taking into account 5th generation (5G) communications, along with the provision of existing mobile communication services (LTE).

[0050] Referring to Fig. 2a, an antenna module (1000) is placed on a formed roof of a vehicle (1). In Fig. 2a, a radome (110a) may surround the antenna system (1000) to protect the antenna module (1000) from the external environment and external impacts during vehicle operation. The radome (110a) may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure structures such as base stations or other vehicles may be transmitted.

[0051] Referring to FIG. 2b, the antenna module (1000) may be arranged within the roof structure (110b) of the vehicle (1), and may be configured such that at least a portion of the roof structure (110b) is implemented as a non-metal. At this time, at least a portion of the roof structure (110b) of the vehicle may be implemented as a non-metal, and may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure such as a base station or other vehicles may be transmitted.

[0052] Meanwhile, referring to FIGS. 2a and 2b, the region where a beam pattern is formed by an antenna provided in an antenna module (1000) mounted on a vehicle needs to be formed from a horizontal region to an upper region by a predetermined angle.

[0053] In this regard, the peak of the elevation beam pattern of the antenna provided in the antenna module (1000) does not need to be formed at the bore site. Therefore, the peak of the elevation beam pattern of the antenna needs to be formed from the horizontal region to an upper region by a predetermined angle. For example, the elevation beam pattern of the antenna may be formed in a hemisphere shape as shown in FIGS. 2A and 2B. In addition, since the beam peak is formed within a low elevation angle range (e.g., 30 degrees), the elevation beam pattern of the antenna may be referred to as a low elevation beam pattern.

[0054] FIG. 3 is a configuration diagram of a vehicle according to an embodiment of the present specification. Referring to FIG. 3, the vehicle (1) may include an object detection device (410), a communication device (420), a user interface device (431), a driving operation device (432), a vehicle driving device (433), a driving system (434), a navigation system (435), a sensing unit (436), an interface unit (437), a memory (438), a power supply unit (439), and / or a control unit (440). Alternatively, the vehicle (1) may include additional configurations in addition to the above configurations, or may omit some of the above configurations.

[0055] The object detection device (410) may be a device for detecting an object located outside the vehicle (1). For example, the object detection device (410) may include a processor (411), a camera (412), a radar (413), a lidar (414), an ultrasonic sensor (415), and / or an infrared sensor (416).

[0056] The communication device (420) may be a device for performing communication with an external device. The communication device (420) may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit or an RF element capable of implementing various communication protocols for performing communication. For example, the communication device (420) may include a processor (421), a short-range communication unit (422), a location information unit (423), a V2X communication unit (424), an optical communication unit (425), a broadcast transceiver unit (426), and / or an ITS communication unit (427).

[0057] The user interface device (431) may be a device for interaction between the vehicle (1) and a user. The vehicle (1) may implement a UI (User Interface) or UX (User Experience) through the user interface device (431).

[0058] The driving control device (432) may be a device that receives user input for driving. The vehicle driving device (433) may be a device that electrically controls the operation of various devices within the vehicle (1). The driving system (434) may be a system that controls various operations of the vehicle (1). The navigation system (435) may provide navigation information. The sensing unit (436) may sense the status of the vehicle (1).

[0059] The interface unit (437) can serve as a passageway for various types of external devices connected to the vehicle (1). The memory (438) can store basic data for the units of the vehicle (1), control data for controlling the operation of the units, input / output data, etc. The power supply unit (439) can supply power required for the operation of each component. The control unit (440) can control the overall operation of each unit within the vehicle (1). The control unit (440) can be implemented as an ECU (Electronic Control Unit) and / or a TCU (Telematics Control Unit).

[0060] Meanwhile, referring to FIGS. 1 to 3, the antenna system mounted on a vehicle may be positioned inside the vehicle, on the vehicle roof, inside the roof, or inside the roof frame. In this regard, the antenna system disclosed in this specification may be configured to operate in the low band (LB), mid band (MB), and high band (HB) of a 4G LTE system and the SUB6 band of a 5G NR system.

[0061] Meanwhile, a telematics module mounted on a vehicle according to the present specification and a control method thereof are described. The purpose of the present specification is to provide an antenna module equipped with a plurality of communication modules and a heat dissipation structure in a vehicle. The purpose of the present specification is to implement an optimal heat dissipation structure by considering the arrangement structure of electronic components arranged on different boards. The purpose of the present specification is to provide a heat dissipation control method that operates in different heat dissipation modes according to the temperatures of electronic components arranged on the board. The purpose of the present specification is to provide a heat dissipation control method that operates in different heat dissipation modes according to different operating modes in a vehicle. The purpose of the present specification is to secure the lifespan, operation, and temperature reliability of the module and components through optimal heat dissipation according to each operating situation of the telematics module.

[0062] The substrates placed inside the vehicle antenna module can have electronic components placed on both the first and second surfaces, thereby reducing the size of the substrates. In particular, the NAD (Network Access Device) substrate, which contains electronic components for 5G wireless communication, can be implemented as a double-sided substrate. The NAD substrate implemented as a double-sided substrate can be formed with a double-sided heat dissipation structure. Meanwhile, the reduced-size NAD substrate can be placed on the main PCB in an optimal layout.

[0063] In this regard, FIG. 4 illustrates a cross-sectional structure of a telematics module mounted on a vehicle according to one embodiment of the present specification. Referring to FIG. 4, an NAD module (1300) may be placed in a first area of ​​a PCB (1200) corresponding to a first protruding surface (PS1). A heat dissipation module (1500) may be placed between the NAD module (1300) and the first protruding surface (PS1). A V2X module (1400) may be placed in a second area of ​​the PCB (1200) corresponding to a second protruding surface (PS2).

[0064] FIG. 5 illustrates a cross-sectional structure of a telematics module mounted on a vehicle according to another embodiment of the present specification. Referring to FIG. 5, an NAD module (1300) may be placed in a first area of ​​a PCB (1200) corresponding to a first protruding surface (PS1). A heat dissipation module (1500) may be placed between the NAD module (1300) and the first protruding surface (PS1). A V2X module (1400) may be placed in a second area of ​​the PCB (1200) corresponding to a second protruding surface (PS2). A processor (1350) may be placed in a third area of ​​the PCB (1200) corresponding to a third protruding surface (PS3).

[0065] Referring to FIGS. 4 and 5, a telematics module (1000) mounted on a vehicle according to the present specification will be described. The telematics module (1000) may be placed between a metal frame (9) of the vehicle and a non-metallic roof cover (1030). Electronic components of the telematics module (1000) may be placed in the space between the lower cover (1010) and the upper cover (1020).

[0066] The telematics module (1000) can implement a fanless heat dissipation structure in high-temperature outdoor air. Accordingly, the telematics module (1000) can control the operation of a thermoelectric radiator (TEC) without a fan in high-temperature outdoor air. The operation control method of the TEC varies depending on each operation mode, i.e., call mode, and the operation algorithm may vary depending on the outdoor temperature, the temperature of the component, the temperature difference between the hot side and the cold side of the TEC, the TEC operation time, and the TEC driving voltage and current.

[0067] A heat dissipation structure including a heat dissipation module (1500) may be configured to include a TEC and a heatsink. The heat dissipation structure may include a heatsink and a heat spreader as an external structure. In the present specification, the heatsink may be formed as a structure in which a lower cover (1010) is applied. The operation of the TEC applied to the telematics module (1000) can be performed from the moment the vehicle's power (start) is applied, and the operation is stopped when the power (start) is turned off. The telematics module mounted on a vehicle according to the present specification may have a different mounting position depending on the vehicle. The telematics module mounted on a vehicle according to the present specification and the control method thereof include a reserve algorithm for an abnormal operation of the call mode due to an unexpected abnormal operation of the TEC.

[0068] The telematics module (1000) may be configured to include a lower cover (1010), an upper cover (1020), a PCB (1200), an NAD module (1300), a V2X module (1400), and a heat dissipation module (1500). The telematics module (1000) of FIG. 5 may be configured to further include a processor (1350). The processor (1350) may be implemented as an MCU (Micro Controller Unit) that controls the operation of the vehicle. The lower cover (1010) and the upper cover (1020) may be referred to as a first cover and a second cover, respectively. The NAD module (1300) and the V2X module (1400) may be implemented as PCBs. The NAD module (1300) and the V2X module (1400) may be referred to as a first PCB and a second PCB.

[0069] The lower cover (1010) may be formed as a heat sink structure so that heat generated within the telematics module (1000) can be discharged to the outside through a metal frame (9). The lower cover (1010) may include a bottom surface that is coupled to the metal frame (9) of the vehicle and at least one protruding surface that protrudes from the bottom surface in an enclosure shape. The enclosure shape refers to an area surrounded by a wall or a fence so that a substrate including electronic components can be placed in the area. At least one protruding surface may be formed as a first protruding surface (PS1).

[0070] At least one protruding surface may be configured to include a first protruding surface (PS1) and a second protruding surface (PS2). Meanwhile, the lower cover (1010) may be configured to include a bottom surface coupled to a metal frame (9) of the vehicle, a first protruding surface (PS1) protruding from the bottom surface, a second protruding surface (PS2), and a third protruding surface (PS3) between the first protruding surface (PS1) and the second protruding surface (PS2).

[0071] Since the heat generated in the NAD module (1300) is greater than the heat generated in other modules, the first protruding surface (PS1) may be formed with a structure in which the interior is filled with a metal structure. The first protruding surface (PS1) may be formed integrally with a lower cover (1020) made of a metal material. The second protruding surface (PS2) and the third protruding surface (PS3) may be formed with a structure in which the interior is hollow. One end and the other end of the second protruding surface (PS2) may be formed with a structure in which the lower cover (1020) is connected. One end and the other end of the third protruding surface (PS3) may be formed with a structure in which the lower cover (1020) is connected.

[0072] The first protruding surface (PS1), the second protruding surface (PS2), and the third protruding surface (PS3) of the lower cover (1020) may be implemented as a coating area of ​​a thermoelectric material to release heat generated from electronic components to the metal frame (9) and the external area. To improve heat dissipation performance, a heat dissipation module (1500) of the TEC may be applied. In addition, the front surface of the protruding surfaces of the lower cover (1020) that come into contact with electronic components may be configured as a coating area of ​​a material capable of absorbing heat. The front surface of the protruding surfaces of the lower cover (1020) may be implemented as a coating area of ​​a material capable of absorbing heat. The front surface of the protruding surfaces of the lower cover (1020) may be implemented as a coating area of ​​a material having an emissivity of a critical value, for example, 0.8 or higher.

[0073] Fig. 6 illustrates the structure of the lower cover of Fig. 4 or Fig. 5. Referring to Figs. 4 to 6, a heat dissipation module (1500) may be placed between the NAD module (1300) and the first protruding surface (PS1) of the lower cover (1020). The first protruding surface (PS1) may be formed in the first region (1020R1) of the lower cover (1020), and the heat dissipation module (1500) may be placed so as to be in contact with the first protruding surface (PS1).

[0074] As the heat dissipation module (1500) is applied, the second thickness of the second region (1020R2) of the lower cover (1020) may be formed to be smaller than the first thickness of the first region (1020R1) in order to minimize the heat generated in the heat dissipation module (1500) from being transferred to the MCU and V2X components. The second region (1020R2) of the lower cover (1020) may be referred to as a reduced region with a reduced thickness. As the thickness of the second region (1020R2) of the lower cover (1020) is reduced, the heat generated in the heat dissipation module (1500) from being transferred to the surroundings can be minimized, and the product weight can also be reduced.

[0075] A second protruding surface (PS2) may be formed in a reduced area of ​​the lower cover (1020). A second protruding surface (PS2) may be formed in a second area of ​​the lower cover (1020). A second protruding surface (PS2) may be formed in a sub-area (1020R2a) of the second area of ​​the lower cover (1020). A processor (1350), such as an MCU, may be placed on the second protruding surface (PS2).

[0076] The third thickness of the third region (1030R3) of the lower cover (1020) may be formed to be greater than the second thickness of the second region (1020R2) of the lower cover (1020). The third thickness of the third region (1030R3) of the lower cover (1020) may be formed to be the same as the first thickness of the first region (1020R1) of the lower cover (1020). A third protruding surface (PS3) may be formed in the third region (1030R3) of the lower cover (1020). A processor (1350), such as an MCU, may be placed on the third protruding surface (PS3).

[0077] FIG. 7 shows the structure in which electronic components are arranged in the NAD module and V2X module of FIGS. 4 and 5. FIG. 7(a) shows the second side, which is the back surface, of the NAD module (1300) of FIGS. 4 and 5. The first side, which is the front surface, of the NAD module (1300) may be arranged to face the second side, which is the back surface, of the PCB (1200). FIG. 7(b) shows the second side, which is the back surface, of the V2X module (1400) of FIGS. 4 and 5. The first side, which is the front surface, of the V2X module (1400) may be arranged to face the second side, which is the back surface, of the PCB (1200).

[0078] Referring to FIGS. 4 to 7, a telematics module (1000) according to the present specification will be described. The telematics module (1000) may be configured to include a lower cover (1010), an upper cover (1020), a PCB (1200), an NAD module (1300), a V2X module (1400), and a heat dissipation module (1500). The upper cover (1020) may be coupled to the lower cover (1010). The upper cover (1020) may be formed of a non-metallic material so that a wireless signal may be transmitted through an antenna disposed therein.

[0079] The PCB (1200) may be placed in the space between the first protruding surface (PS1) of the lower cover (1010) and the upper cover (1020). The PCB (1200) may be placed in the space between the first and second protruding surfaces (PS1, PS2) of the lower cover (1010) and the upper cover (1020). The PCB (1200) may be placed in the space between the protruding surfaces (PS1, PS2, PS3) of the lower cover (1010) and the upper cover (1020).

[0080] The NAD module (1300) may be placed in a first area of ​​the PCB (1200) corresponding to the first protruding surface (PS1). The NAD module (1300) may be provided with a modem (1310), a memory (1320), and an RF transceiver (1330) on one surface. The memory (1320) may be implemented as an MCP LPDDR (Multi Chip Package Low-Power Double Data Rate), but is not limited thereto and may be changed depending on the application.

[0081] The modem (1310), memory (1320), and RF transceiver (1330) may be disposed on the lower surface of the NAD module (1300). Heat generated from the modem (1310), memory (1320), and RF transceiver (1330) disposed on the lower surface of the NAD module (1300) may be cooled through the heat dissipation module (1500) and transferred to the lower cover (1020) and the frame (9).

[0082] Heat generated in the modem (1310) may be transferred to the memory (1320). A first temperature sensor may be placed in an area adjacent to an area where the memory (1320) is placed to measure a first temperature (TI) of the memory (1320). The first temperature sensor may be placed between the modem (1310) and the memory (1320). A second temperature sensor may be placed in an area adjacent to an area where the RF transceiver (1330) is placed to measure a second temperature (T2) of the RF transceiver (1330).

[0083] The V2X module (1400) may be placed in a second region of the PCB (1200) corresponding to the second protruding surface (PS2). A third temperature sensor may be placed in a region adjacent to the region where the electronic component (1410) is placed to measure a third temperature (T3) of the electronic component (1410) of the V2X module (1400). The processor (1350) may be placed in a third region of the PCB (1200) corresponding to the third protruding surface (PS3). The third region of the PCB (1200) may be a region between the first region and the second region of the PCB (1200).

[0084] Accordingly, at least one protruding surface may include a first protruding surface (PS1) corresponding to a first area of ​​the PCB (1200) and a second protruding surface (PS2) corresponding to a second area of ​​the PCB (1200). In this regard, an NAD module (1300) may be placed in a first area of ​​the PCB corresponding to the first protruding surface (PS1). A V2X module (1400) may be placed in a second area of ​​the PCB (1200) corresponding to the second protruding surface (PS2).

[0085] A heat dissipation module (1500) may be placed between the NAD module (1300) and a first region of the PCB (1200) corresponding to the first protruding surface (PS1) of the PCB (1200). The heat dissipation module (1500) may be configured to operate according to a driving voltage to transfer heat generated in the NAD module (1300) to the first protruding surface (PS1) and the metal frame (9) of the vehicle. The heat dissipation module (1500) may be implemented as a thermoelectric cooler (TEC).

[0086] In this regard, FIG. 8 illustrates a structure and an embodiment of a heat dissipation module of the present specification. Referring to FIG. 8(a), a first side (S1) and a second side (S2) of a heat dissipation module (1500) may be implemented as a cool side and a hot side, respectively. The heat dissipation module (1500) may include a p-type semiconductor pellet (1501) formed between the first side (S1) and the second side (S2), an n-type semiconductor pellet (1502), and a conducting tab (1503) formed on the second side (S2). A lead wire (1504) is connected to the conducting tab (1503) so that a driving voltage can be applied to the heat dissipation module (1500).

[0087] Referring to FIG. 8(b), the heat dissipation module (1500) may be configured to selectively cool heat generated from part or all of the NAD module (1300). To this end, the heat dissipation module (1500) may be configured to include a first heat dissipation module (1510) and a second heat dissipation module (1520). The first heat dissipation module (1510) may include a first surface (1510S1) and a second surface (1510S2) implemented as a cool side and a hot side. The second heat dissipation module (1520) may include a first surface (152S1) and a second surface (152S2) implemented as a cool side and a hot side. A first driving voltage (V1) may be applied to operate the first heat dissipation module (1510) in a first heat dissipation mode. A second driving voltage (V2) can be applied to operate the second heat dissipation module (152) in the second heat dissipation mode.

[0088] Referring to FIGS. 4 to 8, the first heat dissipation module (1510) may be placed in a first sub-area (1300R1) of the NAD module (1300) where the modem (1310) and the memory (1320) adjacent to the modem (1310) are placed. The second heat dissipation module (1520) may be placed in a second sub-area (1300R2) of the NAD module (1300) where the RF transceiver (330) is placed.

[0089] The NAD module (1300) can control the first heat dissipation module (1510) and the second heat dissipation module (1520) to be operated simultaneously when the temperature due to heat generated from the NAD module (1300) is higher than a first threshold temperature. The NAD module (1300) can control the first heat dissipation module (1510) to be operated and the second heat dissipation module (1520) to not be operated when the temperature due to heat generated from the NAD module (1300) is lower than a second threshold temperature that is lower than the first threshold temperature.

[0090] Whether or not the second heat dissipation module (1520) operates can be determined by determining whether the second temperature of the RF transceiver (1330) is higher than the threshold temperature when the output power output from the RF transceiver (1330) is higher than the threshold temperature. If the second temperature of the RF transceiver (1330) is higher than the first threshold temperature, the NAD module (1300) can control the first heat dissipation module (1510) and the second heat dissipation module (1520) to operate simultaneously. If the second temperature of the RF transceiver (1330) is lower than the second threshold temperature, which is lower than the first threshold temperature, the NAD module (1300) can control the first heat dissipation module (1510) to operate and the second heat dissipation module (1520) to not operate.

[0091] The NAD module (1300) may be configured to control the driving voltage applied to the heat dissipation module (1500). The modem (1310) of the NAD module (1300) may be configured to control the driving voltage applied to the heat dissipation module (1500). The NAD module (1300) may be configured to assign priorities to a plurality of communication modes and variably control the driving voltage of the heat dissipation module (1500) according to the priorities.

[0092] A plurality of components and integrated circuits of the PCB (1200) may be implemented to have different TEC driving reference temperatures. A plurality of integrated circuits including the memory (1320) and RF transceiver (1330) of the NAD module and the electronic components (1410) of the V2X module (1400) may be configured to have different TEC driving reference temperatures.

[0093] When multiple integrated circuits are driven simultaneously, the NAD module (1300) can control the heat dissipation module (1500) to be driven based on an integrated circuit having a lower reference temperature for heat dissipation among the multiple integrated circuits.

[0094] The NAD module (1300) can control the heat dissipation module (1500) to be driven at a first voltage value based on a boot signal. The NAD module (1300) can control the heat dissipation module (1500) to be driven at a second voltage value different from the first voltage value based on a call order. When a call is connected in response to a call order based on the second voltage value, the NAD module (1300) can control the heat dissipation module (1500) to be driven at a third voltage value lower than the second voltage value. In this regard, the first voltage value and the first current value corresponding thereto may be, but are not limited to, 10 V and 1.3 A, and may be changed according to the application. The second voltage value and the second current value corresponding thereto may be, but are not limited to, 7 V and 1.0 A, and may be changed according to the application.

[0095] Meanwhile, a telematics module mounted on a vehicle according to the present specification may be configured to operate in one of a plurality of operating modes in a boot mode by measuring an internal temperature and a first temperature of a memory. In this regard, Fig. 9 illustrates a flowchart of a control method for a telematics module entering a boot mode. Fig. 10 illustrates a flowchart of a control method for controlling a telematics module entering a boot mode to operate in one of a plurality of operating modes.

[0096] Referring to FIGS. 4 to 10, a control method performed in an NAD module (1300) of a telematics module mounted on a vehicle according to the present specification and a telematics module (1000) performing the same will be described in detail. The NAD module (1300) can determine a heat dissipation mode based on the internal temperature (Ta) of the telematics module (1300). In this regard, power is supplied to the NAD module (1300) (S10), and the first temperature (T1) of the memory (1320) and the NAD module (1300) can measure the internal temperature (Ta) (S20). In addition, the NAD module (1300) can determine whether the internal temperature (Ta) or the first temperature (T1) of the memory (1320) is equal to or higher than a first threshold temperature (Tset_a, Tset1) (S30).

[0097] The NAD module (1300) can control (S40) the heat dissipation module (1500) to operate in a first heat dissipation mode in which the heat dissipation module operates at maximum heat dissipation capability when the internal temperature (Ta) is higher than the first threshold temperature (Tset_a). In addition, the NAD module (1300) can control (S40) the heat dissipation module (1500) to operate in a first heat dissipation mode in which the heat dissipation module operates at maximum heat dissipation capability when the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1). In this regard, the first threshold temperature (Tset_a) and the first threshold temperature (Tset1) can be set to the same temperature, for example, 85 degrees. In the first heat dissipation mode, a first voltage value can be applied to the heat dissipation module (1500). To operate in the first heat dissipation mode, a first voltage value of 10 V is applied to the heat dissipation module (1500), and a first current value of 1.3 A can be measured.

[0098] The NAD module (1300) starts a boot mode (S50) in which the operation of the telematics module (1300) begins when the internal temperature (Ta) is lower than the first threshold temperature (Tset_a). In addition, the NAD module (1300) starts a boot mode (S50) in which the operation of the telematics module (1300) begins when the first temperature (T1) of the memory (1320) is lower than the first threshold temperature (Tset1).

[0099] If the internal temperature (Ta) is higher than the first threshold temperature (Tset_a) or the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1), a process of controlling operation in the first heat dissipation mode (S40) is performed. Thereafter, the first temperature (T1) of the memory (1320) and the NAD module (1300) can measure the internal temperature (Ta) again (S20b). Thereafter, it can be determined (S30b) whether the internal temperature (Ta) and the first temperature (T1) of the memory (1320) are lower than the first threshold temperature (Tset_a, Tset1).

[0100] When the boot mode (S50) starts, the NAD module (1300) can check the operation mode (call mode) (S100) and perform one of the plurality of operation modes. In this regard, the NAD module (1300) can control to perform one of the first operation mode, the second operation mode, and the third operation mode among the plurality of operation modes based on the boot signal and the operation mode. The first operation mode may be an emergency call mode, the second operation mode may be a remote start mode, and the third operation mode may be a trip mode.

[0101] As described above, the telematics module mounted on a vehicle according to the present specification may be configured to operate in one of a plurality of operation modes based on the temperatures of a plurality of components and the internal temperature. In this regard, FIGS. 11 to 13 illustrate flowcharts of a method for controlling a telematics module according to a first operation mode to a third operation mode. FIG. 11 illustrates a flowchart of a method for controlling a telematics module operating in a first operation mode, which is an emergency call mode. FIG. 12 illustrates a flowchart of a method for controlling a telematics module operating in a second operation mode, which is a remote start mode. FIG. 13 illustrates a flowchart of a method for controlling a telematics module operating in a third operation mode, which is a trip mode.

[0102] Referring to FIGS. 4 to 13, a control method performed in an NAD module (1300) of a telematics module mounted on a vehicle according to the present specification and a telematics module (1000) performing the same will be described in detail. Depending on the operation mode, the NAD module (1300) can perform a first operation mode (S200). Depending on the operation mode, the NAD module (1300) can perform a second operation mode (S300). Depending on the operation mode, the NAD module (1300) can perform a third operation mode (S400). In each operating mode, a first temperature (T1) of the memory (1310), a second temperature (T2) of the RF transceiver (1320), a third temperature (T3) of the electronic component (1410) of the V2X module (1400), and an internal temperature (Ta) of the telematics module (1000) can be measured (S210, S310, S410).

[0103] A first heat dissipation mode may be performed in which the heat dissipation module (1500) is driven at a first voltage value in each operation mode based on a boot signal. A second heat dissipation mode may be performed in which the heat dissipation module (1500) is driven at a second voltage value lower than the first voltage value in each operation mode based on a call command.

[0104] The first operation mode is e-call mode and the operation condition is a mode that operates in an emergency situation. The first operation mode is a mode that can maintain normal operation for 300 seconds without failure in an environment where the internal temperature (Ta) of the telematics module (1000) is 105 degrees. In the first operation mode, the first temperature (T1) of the memory (1310) is compared with the first and second threshold temperatures (Tset1, Tset2) (S220a, S230a, 240a), and the heat dissipation operation can be stopped (S220), or the first heat dissipation mode (S230) or the second heat dissipation mode (S240) can be performed.

[0105] Even if the heat dissipation module (1500) does not operate at 85 degrees, which is 20 degrees lower than the temperature specification of 105 degrees for the memory (1310) implemented with MCP LPDDR4, the memory (1310) can operate for about 5 minutes. Accordingly, the first critical temperature (Tset1) can be set to 85 degrees. Although there may be differences depending on the actual vehicle situation, since the memory (1310) can operate for about 5 minutes even if the heat dissipation module (1500) does not operate, the operating condition of the first operating mode, which is the e-call mode, can be satisfied.

[0106] In order to maintain component operation and temperature reliability with a temperature margin of 10 degrees or more than 105 degrees, which is the temperature specification of the memory (1310) implemented with MCP LPDDR4, the second critical temperature (Tset2) may be set to 95 degrees. In the first operation mode, which is the e-call mode, the third critical temperature (Tset_a3) of the internal temperature (Ta) of the telematics module (1300) may be set to 105 degrees. The NAD module (1300) may measure (S210) the first temperature (T1) of the memory (1310) and the internal temperature (Ta) of the telematics module (1300) in the first operation mode.

[0107] The NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1500) to be stopped (S220) when the first temperature (T1) of the memory (1310) measured in the first operation mode is lower than or equal to the first threshold temperature (Tset1) (S220a). The NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1500) to be stopped (S220) when the first temperature (T1) of the memory (1310) is higher than the first threshold temperature (Tset1) and lower than or equal to the second threshold temperature (Tset2) (S230a). The NAD module (1300) can drive the heat dissipation module (1500) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S230). The NAD module (1300) can be controlled to operate in a first heat dissipation mode (S240) when the first temperature (T1) of the memory (1310) is greater than the second threshold temperature (Tset2) or the internal temperature (Ta) of the telematics module (1300) is greater than the third threshold temperature (Tset_a3) (S240a). The NAD module (1300) can drive the heat dissipation module (1500) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S240).

[0108] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S210b) the first temperature (T1) of the memory (1310) and the internal temperature (Ta) of the telematics module (1300). Thereafter, the process of comparing (S220a, S230a, S240a) the first temperature (T1) of the memory (1310) with the first and second threshold temperatures (Tset1, Tset2) can be repeated.

[0109] The second operation mode is a remote start mode and is a mode in which normal operation can be maintained for 60 seconds without failure in an environment in which the internal temperature (Ta) of the telematics module (1000) is 105 degrees. In the second operation mode, the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is compared with the first and second threshold temperatures (Tset1, Tset2) (S220a, S230a, 240a), and the heat dissipation operation can be stopped (S320) or the first heat dissipation mode (S330) or the second heat dissipation mode (S340) can be performed. The NAD module (1300) can measure (S310) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), and the internal temperature (Ta) of the telematics module (1300) in the second operation mode.

[0110] The NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1500) to be stopped (S320) if the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) measured in the second operation mode is lower than or equal to the first threshold temperature (Tset1) (S320a). The NAD module (1300) can control the operation in the second heat dissipation mode (S330) if the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is higher than the first threshold temperature (Tset1) and lower than or equal to the second threshold temperature (Tset2) (S330a). The NAD module (1300) can drive the heat dissipation module (1500) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in a second heat dissipation mode (S330).

[0111] The NAD module (1300) can be controlled to operate in a first heat dissipation mode (S340) when the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2) or the internal temperature (Ta) of the telematics module (1300) is greater than the third threshold temperature (Tset_a3) (S340a). The NAD module (1300) can drive the heat dissipation module (1500) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S340).

[0112] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S310b) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), and the internal temperature (Ta) of the telematics module (1300). Thereafter, the process of comparing (S320a, S330a, S340a) the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) with the first and second threshold temperatures (Tset1, Tset2) can be repeated.

[0113] The third operation mode is a trip mode, and is a mode in which normal operation can be maintained for 1500 seconds without failure in an environment in which the internal temperature (Ta) of the telematics module (1000) decreases from 105 degrees to 75 degrees. In the third operation mode, the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is compared with the first and second threshold temperatures (Tset1, Tset2), and the third temperature (T3) of the electronic component (1410) is compared with the third threshold temperature (Tset3) (S220a, S230a, 240a), whereby the heat dissipation operation can be stopped (S320), or the first heat dissipation mode (S330) or the second heat dissipation mode (S340) can be performed. The NAD module (1300) can measure (S410) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), and the internal temperature (Ta) of the telematics module (1300) in the third operation mode.

[0114] The NAD module (1300) determines (S420a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) measured in the third operation mode is lower than or equal to the first threshold temperature (Tset1) and whether the third temperature (T3) of the electronic component (1410) of the V2X module (1400) is lower than or equal to the second threshold temperature (Tset2). Accordingly, the NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1500) to be stopped (S420). The NAD module (1300) determines (S430a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the first threshold temperature (Tset1) and less than or equal to the second threshold temperature (Tset2), and whether the third temperature (T3) of the electronic component (1410) is greater than the second threshold temperature (Tset2) and less than or equal to the third threshold temperature (Tset3). Accordingly, the NAD module (1300) can control the heat dissipation module (1500) to operate in the second heat dissipation mode (S430). The NAD module (1300) can drive the heat dissipation module (1500) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S430).

[0115] The NAD module (1300) determines (S440a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2) and less than or equal to the third threshold temperature (Tset3), and whether the third temperature (T3) of the electronic component (1410) is greater than the third threshold temperature (Tset3). In addition, the NAD module (1300) determines (S440a) whether the internal temperature (Ta) of the telematics module (1000) is greater than the third threshold temperature (Tset_a3). Accordingly, the NAD module (1300) can control the heat dissipation module (1500) to operate in the first heat dissipation mode (S440). The NAD module (1300) can drive the heat dissipation module (1500) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S440).

[0116] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S410b) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), and the internal temperature (Ta) of the telematics module (1300). Thereafter, the process of comparing the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) with the first and second threshold temperatures (Tset1, Tset2) and comparing the third temperature (T3) of the electronic component (1410) with the third threshold temperature (Tset3) (S420a, S430a, 440a) can be repeated.

[0117] As described above, the telematics module mounted on a vehicle according to the present specification may be configured to operate in one of a plurality of operating modes based on the temperatures of a plurality of components and the internal temperature. Meanwhile, the temperatures of a plurality of components and the internal temperature of the telematics module may not be measured or may be measured in an abnormal temperature range outside the normal operating range. Therefore, if the temperatures of a plurality of components and the internal temperature of the telematics module are not measured or are measured in an abnormal temperature range outside the normal operating range, it is necessary to control the operation of the heat dissipation module by another method.

[0118] In this regard, Fig. 14 illustrates a flowchart of a control method for controlling the operation of a heat dissipation module based on a temperature difference between the two ends of the heat dissipation module. Referring to Figs. 4 to 14, a method for controlling the operation of a heat dissipation module based on a temperature difference between the two ends of the heat dissipation module according to the present specification is described.

[0119] When the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), or the internal temperature (Ta) of the telematics module (1300) is not measured or an abnormal temperature is measured, the operation of the heat dissipation module (1500) can be controlled based on the temperature difference between the two ends of the heat dissipation module. Here, the abnormal temperature includes a case where the temperature difference between the two ends of the heat dissipation module (1500) is 30 degrees or more, the temperature is not measured, or the temperature is outside the normal temperature measurement range.

[0120] In this regard, the NAD module (1300) can perform a boot mode (S50) based on a boot signal. The NAD module (1300) can measure (S510) a first temperature (Ttec_c) of a first surface (S1) of a heat dissipation module (1500) and a second temperature (Ttec_h) of a second surface (S2). The first surface (S1) of the heat dissipation module (1500) can be coupled with the NAD module (1300) and formed to have a lower temperature than the second surface (S2). The second surface (S2) of the heat dissipation module (1500) can be coupled with the lower cover (1020) and formed to have a higher temperature than the first surface (S1). The first surface (S1) and the second surface (S2) of the heat dissipation module (1500) can be referred to as a cool side and a hot side, respectively.

[0121] In this regard, a process of applying power to the NAD module (1300) (S10) and measuring the first temperature (T1) and the internal temperature (Ta) of the memory (1320) (S20) may be performed. In addition, a process of determining (S30) whether the internal temperature (Ta) or the first temperature (T1) of the memory (1320) is higher than or equal to a first threshold temperature (Tset_a, Tset1) may be performed. In addition, if the internal temperature (Ta) is higher than the first threshold temperature (Tset_a) or the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1), a process of controlling (S40) operation in the first heat dissipation mode may be performed. Thereafter, a process of re-measuring (S20b) the first temperature (T1) of the memory (1320) and the internal temperature (Ta) of the NAD module (1300) may be performed. Thereafter, a process of determining (S30b) whether the internal temperature (Ta) and the first temperature (T1) of the memory (1320) are lower than the first threshold temperature (Tset_a, Tset1) may be performed. Thereafter, a boot mode (S50) based on a boot signal may be performed.

[0122] The NAD module (1300) can determine (S520a) whether the temperature difference (DelT_tec) between the first side (S1) and the second side (S2) of the heat dissipation module (1500) is greater than the first threshold temperature difference (Tset_tec1) in the boot mode based on the boot signal. If the temperature difference (DelT_tec) is greater than the first threshold temperature difference (Tset_tec1), the NAD module (1300) can control (S520) the heat dissipation operation of the heat dissipation module (1500) to be stopped. The NAD module (1300) can determine (S530a) whether the temperature difference (DelT_tec) between the first side (S1) and the second side (S2) of the heat dissipation module (1500) is less than or equal to the first threshold temperature difference (Tset_tec1) and greater than the second threshold temperature difference (Tset_tec2). In this regard, the first critical temperature difference (Tset_tec1) may be set to 40 degrees, but is not limited thereto, and may be changed depending on the application. The second critical temperature difference (Tset_tec2) may be set to 30 degrees, but is not limited thereto, and may be changed depending on the application.

[0123] If the temperature difference (DelT_tec) is greater than the second threshold temperature difference (Tset_tec2), the NAD module (1300) can drive the heat dissipation module (1500) with a second voltage value to operate in the second heat dissipation mode (S530). The NAD module (1300) can determine (S540a) whether the temperature difference (DelT_tec) between the first surface (S1) and the second surface (S2) of the heat dissipation module (1500) is less than or equal to the second threshold temperature difference (Tset_tec2). If the temperature difference (DelT_tec) is less than or equal to the second threshold temperature difference (Tset_tec2), the NAD module (1300) can drive the heat dissipation module (1500) with a first voltage value to operate in the first heat dissipation mode (S540).

[0124] In this regard, the NAD module (1300) can determine whether the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), and the third temperature (T3) of the electronic component (1410) of the V2X module (1400) are not measured or are abnormal temperatures in the boot mode. The NAD module (1300) can determine whether the first temperature (T1) to the third temperature (T3) are not measured or are abnormal temperatures, and whether the temperature difference (DelT_tec) between the first surface (S1) and the second surface (S2) of the heat dissipation module (1500) is greater than the first threshold temperature difference (Tset_tec1). Accordingly, the NAD module (1300) can control (S520) to stop the heat dissipation operation of the heat dissipation module (1500).

[0125] The NAD module (1300) can determine whether the first temperature (T1) to the third temperature (T3) are not measured or are determined to be abnormal temperatures and the temperature difference (DelT_tec) is greater than the second threshold temperature difference (Tset_tec2). Accordingly, the NAD module (1300) can drive the heat dissipation module (1500) with a second voltage value to operate in a second heat dissipation mode. The NAD module (1300) can determine whether the first temperature (T1) to the third temperature (T3) are not measured or are determined to be abnormal temperatures and the temperature difference (DelT_tec) is less than or equal to the second threshold temperature difference (Tset_tec2). Accordingly, the NAD module (1300) can drive the heat dissipation module (1500) with a first voltage value to operate in a first heat dissipation mode.

[0126] Meanwhile, the telematics module according to the present specification can control the operation of the heat dissipation module based on the operating time of the heat dissipation module. Fig. 15 is a flowchart of a control method for controlling the operation of the heat dissipation module based on the operating time of the heat dissipation module. Referring to Figs. 4 to 15, a method for controlling the operation of the heat dissipation module based on the operating time of the heat dissipation module according to the present specification will be described.

[0127] When the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), or the internal temperature (Ta) of the telematics module (1300) is not measured or an abnormal temperature is measured, the operation of the heat dissipation module (1500) can be controlled based on the operation time of the heat dissipation module. Here, the abnormal temperature includes a case where the temperature of the heat dissipation module (1500) is not measured or is outside the normal temperature measurement range.

[0128] In this regard, a process of applying power to the NAD module (1300) (S10) and measuring the first temperature (T1) of the memory (1320) and the internal temperature (Ta) of the NAD module (1300) (S20) may be performed. In addition, a process of determining (S30) whether the internal temperature (Ta) or the first temperature (T1) of the memory (1320) is higher than or equal to a first threshold temperature (Tset_a, Tset1) may be performed. In addition, a process of controlling (S40) the NAD module (1300) to operate in a first heat dissipation mode may be performed when the internal temperature (Ta) is higher than the first threshold temperature (Tset_a) or the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1). Thereafter, a process of determining (S30b) whether the internal temperature (Ta) and the first temperature (T1) of the memory (1320) are lower than the first threshold temperature (Tset_a, Tset1) may be performed. Thereafter, a boot mode (S50) based on a boot signal may be performed.

[0129] The NAD module (1300) can drive the heat dissipation module (1500) with a second voltage value to operate in a second heat dissipation mode when the operating time of the heat dissipation module (1500) in the boot mode based on the boot signal is greater than the first threshold operating time (Ttec_set_t1). The NAD module (1300) can drive the heat dissipation module (1500) with a first voltage value to operate in the first heat dissipation mode when the operating time of the heat dissipation module (1500) in the boot mode is greater than the second threshold operating time (Ttec_set_t2). The second threshold operating time (Ttec_set_t2) can be set to be greater than the first threshold operating time (Ttec_set_t1).

[0130] In this regard, the NAD module (1300) can determine (S610) whether the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), and the internal temperature (Ta) of the telematics module (1300) are not measured or are abnormal temperatures in the boot mode. If the first temperature (T1), the second temperature (T2), the third temperature (T3), and the internal temperature (Ta) are measured within a normal range, one of the first operation mode to the third operation mode can be performed (S220, S300, S400).

[0131] The NAD module (1300) can measure (S620) the operating time (Time_tec) of the heat dissipation module (1500) in a boot mode based on a boot signal. The NAD module (1300) can determine (S630a) whether the operating time (Time_tec) of the heat dissipation module (1500) is greater than a first threshold operating time (Ttec_set_t1). If the operating time (Time_tec) of the heat dissipation module (1500) is greater than the first threshold operating time (Ttec_set_t1), the NAD module (1300) can drive the heat dissipation module (1500) with a second voltage value to operate in a second heat dissipation mode (S630).

[0132] The NAD module (1300) can determine (S640a) whether the operating time (Time_tec) of the heat dissipation module (1500) is greater than the second threshold operating time (Ttec_set_t2). If the operating time of the heat dissipation module (1500) is greater than the second threshold operating time (Ttec_set_t2), the NAD module (1300) can drive the heat dissipation module (1500) at the first voltage value to operate in the first heat dissipation mode (S640).

[0133] If the first temperature (T1) to the third temperature (T3) are not measured or are determined to be abnormal temperatures, and the operating time (Time_tec) of the heat dissipation module (1500) in the boot mode is greater than the first threshold operating time (Ttec_set_t1), the NAD module (1300) may operate in the second heat dissipation mode (S630). The NAD module (1300) may operate the heat dissipation module (1500) with a second voltage value to operate in the second heat dissipation mode (S630). If the first temperature (T1) to the third temperature (T3) are not measured or are determined to be abnormal temperatures, and the operating time (Time_tec) of the heat dissipation module (1500) in the boot mode is greater than the second threshold operating time (Ttec_set_t2), the NAD module (1300) may operate in the first heat dissipation mode (S640). The NAD module (1300) can drive the heat dissipation module (1500) at the first voltage value to operate in the second heat dissipation mode (S640).

[0134] The above describes a telematics module installed in a vehicle and its control method. The technical benefits of this vehicle-mounted telematics module and its control method are as follows.

[0135] According to the present specification, an antenna module having a plurality of communication modules and a heat dissipation structure can be provided in a vehicle by assigning priorities to each of a plurality of communication modes and variably controlling the driving voltage of the heat dissipation structure according to the priorities.

[0136] According to this specification, an optimal heat dissipation structure and heat dissipation control method can be implemented by considering the arrangement structure of electronic components placed on different substrates corresponding to the protruding surfaces of the lower cover.

[0137] According to the present specification, a heat dissipation control method can be provided that operates in different heat dissipation modes by driving a heat dissipation module with different driving voltages according to the temperatures of electronic components placed on a substrate.

[0138] According to the present specification, a heat dissipation control method can be provided in which a heat dissipation module is driven with different driving voltages according to different operation modes in a vehicle, thereby operating in different heat dissipation modes.

[0139] According to this specification, by applying a heat dissipation structure to a communication module and components within a telematics module, the lifespan, operation, and temperature reliability of the module and components can be secured through optimal heat dissipation by changing the operation algorithm of the heat dissipation structure according to each operating situation.

[0140] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0141] Accordingly, the above detailed description should not be construed as limiting in all respects, but rather as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are intended to be included within the scope of the present invention.

Claims

1. In a telematics module installed in a vehicle, A lower cover comprising at least one protruding surface protruding from the bottom surface to the enclosure, wherein the protruding surface is joined to the metal frame of the vehicle; An upper cover coupled with the lower cover; A PCB disposed in the space between the protruding surface of the lower cover and the upper cover; An NAD module disposed in a first area of ​​the PCB corresponding to the protruding surface and having a modem, memory, and RF transceiver; A heat dissipation module is disposed between the NAD module and the protruding surface, and operates according to the driving voltage to transfer heat generated from the NAD module to the protruding surface and the frame. The above NAD module, A telematics module that assigns priorities to multiple communication modes and variably controls the driving voltage of the heat dissipation module according to the priorities.

2. In paragraph 1, The protruding surface includes a first protruding surface corresponding to a first region of the PCB and a second protruding surface corresponding to a second region of the PCB, Further comprising a V2X module arranged in a second area of ​​the PCB corresponding to the second protruding surface, A telematics module, wherein the NAD module is placed in a first area of ​​the PCB corresponding to the first protruding surface.

3. In paragraph 2, A telematics module, wherein a plurality of integrated circuits including the memory and the RF transceiver of the NAD module and the electronic components of the V2X module have different TEC driving reference temperatures.

4. In paragraph 3, The above NAD module, A telematics module that operates the heat dissipation module based on an integrated circuit having a lower reference temperature for heat dissipation among the plurality of integrated circuits when the plurality of integrated circuits are operated simultaneously.

5. In paragraph 3, The above NAD module, Drive the heat dissipation module to a first voltage value based on the boot signal, A telematics module that drives the heat dissipation module by changing the first voltage value to a second voltage value different from the first voltage value based on a call order.

6. In paragraph 5, The above NAD module, A telematics module that, when a call is connected in response to the call command based on the second voltage value, drives the heat dissipation module by changing to a third voltage value lower than the second voltage value.

7. In paragraph 2, The above heat dissipation module, A first heat dissipation module disposed in a first sub-area of ​​the NAD module in which the modem and the memory adjacent to the modem are disposed; and A second heat dissipation module is disposed in the second sub-area of ​​the NAD module in which the RF transceiver is disposed, The above NAD module, When the temperature due to heat generated from the NAD module is higher than the first critical temperature, the first heat dissipation module and the second heat dissipation module are controlled to operate simultaneously, A telematics module that controls the operation of the first heat dissipation module and not to operate the second heat dissipation module when the temperature generated by the heat from the NAD module is below the second critical temperature.

8. In paragraph 5, The above NAD module, Control to perform one of the first operation mode, the second operation mode, and the third operation mode among a plurality of operation modes based on the above boot signal and operation mode, Based on the above boot signal, a first heat dissipation mode is performed to drive the heat dissipation module to a first voltage value in each operation mode, A second heat dissipation mode is performed in which the heat dissipation module is driven by changing the second voltage value lower than the first voltage value in each operation mode based on a call order, A telematics module wherein the first operation mode is an emergency call mode, the second operation mode is a remote start mode, and the third operation mode is a trip mode.

9. In paragraph 8, The above NAD module, If the internal temperature of the telematics module is higher than the first threshold temperature or the first temperature of the memory is higher than the first threshold temperature, the heat dissipation module is controlled to operate in a first heat dissipation mode in which it operates at maximum heat dissipation capability. A telematics module in which the first voltage value is applied to the heat dissipation module in the first heat dissipation mode.

10. In paragraph 9, The above NAD module, If the first temperature of the memory measured in the first operation mode is lower than or equal to the first threshold temperature, the heat dissipation operation of the heat dissipation module is controlled to stop, A telematics module that drives the heat dissipation module with the second voltage value to operate in a second heat dissipation mode when the first temperature of the memory is greater than the first threshold temperature and less than or equal to the second threshold temperature.

11. In paragraph 10, The above NAD module, A telematics module that drives the heat dissipation module with the first voltage value higher than the second voltage value to operate in the first heat dissipation mode when the first temperature of the memory is higher than the second threshold temperature or the internal temperature of the telematics module is higher than a third threshold temperature higher than the second threshold temperature.

12. In paragraph 11, The above NAD module, If the first temperature of the memory or the second temperature of the RF transceiver measured in the second operation mode is lower than or equal to the first threshold temperature, the heat dissipation operation of the heat dissipation module is controlled to stop, If the first temperature or the second temperature is greater than the first threshold temperature and less than or equal to the second threshold temperature, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode; A telematics module that drives the heat dissipation module with the first voltage value to operate in the first heat dissipation mode when the first temperature or the second temperature is greater than the second threshold temperature, or when the internal temperature is greater than the third threshold temperature.

13. In paragraph 12, The above NAD module, When the first temperature of the memory or the second temperature of the RF transceiver measured in the third operation mode is lower than or equal to the first threshold temperature, and the third temperature of the electronic component of the V2X module is lower than or equal to the second threshold temperature, the heat dissipation operation of the heat dissipation module is controlled to stop. If the first temperature or the second temperature is greater than the first threshold temperature and less than or equal to the second threshold temperature, and the third temperature is greater than the second threshold temperature and less than or equal to the third threshold temperature, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode. A telematics module that drives the heat dissipation module with the first voltage value to operate in the first heat dissipation mode when the first temperature or the second temperature is greater than the second threshold temperature, the third temperature is greater than the third threshold temperature, and the internal temperature is greater than the third threshold temperature.

14. In paragraph 10, The above NAD module, In the boot mode based on the above boot signal, if the temperature difference between the first side and the second side of the heat dissipation module is greater than the first threshold temperature difference, the heat dissipation operation of the heat dissipation module is controlled to stop, When the temperature difference between the first and second surfaces of the heat dissipation module is less than or equal to the first threshold temperature difference and greater than the second threshold temperature difference, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode. A telematics module that drives the heat dissipation module with the first voltage value to operate in the first heat dissipation mode when the temperature difference between the first and second surfaces of the heat dissipation module is less than or equal to the second threshold temperature difference.

15. In paragraph 14, The above NAD module, In the above boot mode, it is determined whether the first temperature, the second temperature of the RF transceiver, and the third temperature of the electronic component of the V2X module are not measured or are abnormal temperatures, If the first temperature to the third temperature are not measured or are determined to be abnormal temperatures, and the temperature difference between the first and second surfaces of the heat dissipation module is greater than the first threshold temperature difference, the heat dissipation operation of the heat dissipation module is controlled to stop. If the first temperature to the third temperature are not measured or are determined to be abnormal temperatures, and the temperature difference is greater than the second threshold temperature difference, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode, A telematics module that drives the heat dissipation module with the second voltage value to operate in the first heat dissipation mode when the first temperature to the third temperature is not measured or is determined to be an abnormal temperature and the temperature difference is less than or equal to the second threshold temperature difference.

16. In paragraph 10, The above NAD module, If the operating time of the heat dissipation module in the boot mode based on the boot signal is greater than the first threshold operating time, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode, A telematics module that drives the heat dissipation module with the first voltage value to operate in a third heat dissipation mode when the operating time of the heat dissipation module in the boot mode based on the boot signal is greater than a second threshold operating time that is greater than the first threshold operating time.

17. In paragraph 10, The above NAD module, In the boot mode based on the boot signal, it is determined whether the first temperature, the second temperature of the RF transceiver, and the third temperature of the electronic component of the V2X module are not measured or are abnormal temperatures, If the first temperature to the third temperature are not measured or are determined to be abnormal temperatures, and the operating time of the heat dissipation module in the boot mode is greater than the first threshold operating time, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode. A telematics module that drives the heat dissipation module to operate in a third heat dissipation mode when the first temperature to the third temperature are not measured or are determined to be abnormal temperatures, and the operating time of the heat dissipation module in the boot mode is greater than the second threshold operating time.

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