Charging device

Abstract

Disclosed in the present application is a charging device, comprising a mounting bracket, and a charging assembly and a fan assembly which are mounted on the mounting bracket, wherein the mounting bracket has a front surface and a back surface opposite each other, the charging assembly being arranged on the side of the mounting bracket close to the front surface, and the fan assembly being arranged on the side of the mounting bracket close to the back surface; and the mounting bracket is provided with an air exhaust outlet on the side close to the back surface. The fan assembly can accelerate airflow velocity, thereby enhancing the effect of convective heat transfer, improving the heat dissipation capacity of the charging device and reducing the impact of heat generation on the charging efficiency of the charging device. In addition, the charging assembly is arranged close to the front surface, which is configured to come into contact with an electronic device, and the mounting bracket is provided with an air exhaust outlet on the side close to the back surface; during operation, the fan assembly can drive airflow to be discharged out of the charging device through the air exhaust outlet, thereby preventing hot air after heat exchange from blowing to the electronic device and affecting the charging efficiency thereof, and also preventing the hot air from blowing to the user's hand holding the electronic device, improving the user experience.

Description

charging equipment Technical Field

[0001] This application relates to the field of electronic device accessories technology, and more particularly to a charging device. Background Technology

[0002] When charging electronic products using charging equipment, both the charging equipment and the electronic products will generate heat. If the heat is not dissipated in time, it will affect the charging efficiency of the electronic devices.

[0003] Existing wireless chargers primarily use electromagnetic induction technology for charging, which generates more heat during operation. Furthermore, they are usually in close contact with electronic products during use. Therefore, the heat generated by wireless chargers during operation can affect the heat dissipation of electronic products, thereby impacting the charging efficiency of electronic devices. Summary of the Invention

[0004] In view of this, this application provides a new charging device to improve the problem of heat generation during the charging process of existing wireless chargers, which affects charging efficiency.

[0005] In a first aspect, embodiments of this application provide a charging device, including a mounting frame and a charging assembly and a fan assembly respectively mounted on the mounting frame. The mounting frame has a front and a back facing each other. The charging assembly is disposed on the side of the mounting frame near the front, and the fan assembly is disposed on the side of the mounting frame near the back. The mounting frame has an exhaust vent on the side near the back.

[0006] The charging device provided in this application embodiment has a fan assembly that can accelerate airflow, thereby enhancing the effect of convective heat transfer and improving the heat dissipation capacity of the charging device, reducing the impact of heat generation on charging efficiency. At the same time, the charging assembly is positioned close to the front, which is used to contact the electronic device, while the fan assembly is positioned close to the back, and the mounting bracket has an exhaust vent on the side close to the back. When the fan assembly is working, it can drive airflow from the exhaust vent to the outside of the charging device, preventing the hot air after heat exchange from blowing onto the electronic device and affecting its charging efficiency. It can also prevent the hot air from blowing onto the user's hand holding the electronic device, improving the user experience.

[0007] In one possible implementation, the mounting bracket is provided with an air inlet that communicates with the exhaust port, and the air inlet and the exhaust port are respectively located on different sides of the mounting bracket.

[0008] In one possible implementation, the fan assembly includes a fan located between the air inlet and the air outlet, with the air outlet located on the axial side of the fan and the air inlet located on the radial side of the fan.

[0009] In one possible implementation, the fan assembly further includes a fan shroud mounted on the mounting bracket. The fan shroud has a receiving cavity and an inlet and an outlet respectively connected to the receiving cavity. The fan is received in the receiving cavity, the inlet is connected to the air inlet, and the outlet is connected to the air outlet.

[0010] In one possible implementation, the fan shroud includes a flow guide that is arc-shaped and whose radial dimension gradually increases along the direction from the inlet to the outlet.

[0011] In one possible implementation, the fan includes fan blades, the side of the fan blades away from the exhaust port being flush with the side of the inlet away from the exhaust port, or the side of the fan blades away from the exhaust port being lower than the side of the inlet away from the exhaust port.

[0012] In one possible implementation, the charging device further includes a cooling component that is thermally connected to the charging component and is at least partially located between the air inlet and the air outlet.

[0013] In one possible implementation, the mounting frame includes a first frame, a second frame spaced apart from the first frame, and a connecting column connecting the first frame and the second frame. The front and the back are located on opposite sides of the first frame and the second frame, respectively. The charging component is located on the first frame, and the fan component and the exhaust vent are located on the second frame.

[0014] In one possible implementation, the air inlet and the heat dissipation channel are formed between the first frame and the second frame. The air inlet surrounds the outer periphery of the heat dissipation channel and communicates with the exhaust port through the heat dissipation channel. The charging device also includes a cooling component that is thermally connected to the charging component. The cooling component is at least partially located within the heat dissipation channel.

[0015] In one possible implementation, the cooling component includes a cooling element and a heat sink, with opposite sides of the cooling element being thermally connected to the charging component and the heat sink, respectively, and the heat sink being at least partially located within the heat dissipation channel.

[0016] In one possible implementation, the heat sink includes a heat dissipation base that is thermally connected to the cooling component and a plurality of heat dissipation elements disposed on the side of the heat dissipation base away from the cooling component, wherein the plurality of heat dissipation elements are located within the heat dissipation channel and spaced apart from each other.

[0017] In one possible implementation, the mounting bracket has a protrusion on one side near the back side, the protrusion protruding from the front side to the back side, and the protrusion being positioned relative to the exhaust vent near the center area of ​​the back side.

[0018] In one possible implementation, the exhaust vent is located on the back side, or the exhaust vent is located at the connection between the back side and the protrusion.

[0019] In a second aspect, a charging device is provided, including a first frame, a circuit board, and a coil assembly, wherein the coil assembly is connected to the circuit board, the first frame has a mounting cavity, a first substrate is provided on the first frame, the first substrate divides the mounting cavity into a first cavity and a second cavity, the coil assembly is disposed in the first cavity, and the circuit board is disposed in the second cavity.

[0020] The charging device provided in this application embodiment reduces the heat generated by the circuit board from the circuit board to the first cavity where the coil assembly is located by setting a partition between the coil assembly and the circuit board, thereby reducing the heat between the charging device and the device to be charged, lowering the temperature of the device to be charged during wireless charging, and thus improving the user's charging and usage experience.

[0021] In one possible implementation, the first frame includes a first perimeter that surrounds and forms the mounting cavity, and the first substrate is connected to the first perimeter to form the first cavity and the second cavity arranged along the height direction of the first perimeter.

[0022] In one possible implementation, a cooling component is further included, which is electrically connected to the circuit board, and the first substrate has a receiving portion, in which the cooling component is disposed.

[0023] In one possible implementation, the first substrate extends toward the second cavity to form a surrounding wall, the surrounding wall having an open structure at both ends, and the receiving portion is formed within the surrounding wall and communicates with the first cavity and the second cavity.

[0024] In one possible implementation, the circuit board is provided with a clearance hole, which is fitted outside the enclosure.

[0025] In one possible implementation, a heat sink is further included, which is disposed in the second cavity and located on the side of the circuit board away from the first substrate; the cooling element includes a cold end and a hot end disposed opposite to each other, the cold end being connected to the coil assembly and the hot end being connected to the heat sink.

[0026] In one possible implementation, a fan assembly is also included, the fan assembly comprising a second frame and a fan electrically connected to the circuit board; the fan assembly is located on the side of the radiator away from the cooling component, and / or the second frame is fixedly connected to the first frame and spaced apart.

[0027] In one possible implementation, a support is also included, wherein the second frame has a second receiving position on the side opposite to the first frame, and the support is rotatably disposed in the second receiving position.

[0028] In one possible implementation, a panel is further included, which covers the coil assembly on the side away from the first substrate, the panel being connected to the first frame and the coil assembly.

[0029] Thirdly, a charging device is provided, including a mounting frame, a charging module, a heat sink, and a cooler. The charging module is disposed on the mounting frame and connected to the heat sink. The mounting frame includes a first frame and a second frame, which are spaced apart to form an open space. The heat sink is disposed in the open space and is at least partially exposed to the outside. The first frame includes a first substrate, and the cooler is disposed on the side of the first substrate near the open space. The heat sink includes a heat dissipation substrate and a plurality of heat sinks, which are connected to the side of the heat dissipation substrate opposite to the cooler.

[0030] The charging device provided in this application embodiment is designed to connect the charging components to the heat sink, with at least part of the heat sink exposed to the outside. This eliminates the need for a traditional outer shell, allowing the heat sink to be directly connected to the outside of the charging device through an open space. The heat absorbed by the heat sink can be directly dissipated to the outside, greatly improving heat dissipation efficiency and thus enhancing the user's charging and usage experience.

[0031] In one possible implementation, the second frame includes a second substrate, the open space is formed between the first substrate and the second substrate, the charging module includes a circuit board disposed on the side of the first substrate near the open space, and the heat sink is connected to the circuit board.

[0032] In one possible implementation, one end of the heat dissipation substrate is connected to the circuit board, and the other end is provided with a plurality of heat sinks, which are spaced apart, and at least some of the heat sinks are connected to the second substrate.

[0033] In one possible implementation, the charger further includes a fan assembly, wherein a plurality of heat sinks are arranged along the periphery of the heat sink substrate and enclose a mounting space, and the fan assembly is mounted in the mounting space.

[0034] In one possible implementation, a heat dissipation gap is formed between the plurality of heat sinks, and the heat dissipation gap forms a first vent for the fan assembly, and the second substrate is provided with a second vent for the fan assembly; the first vent is an air inlet and the second vent is an air outlet; or, the first vent is an air outlet and the second vent is an air inlet.

[0035] In one possible implementation, the first substrate is provided with a first fixing connection portion, and the second substrate is provided with a second fixing connection portion; the second fixing connection portion is connected and fixed to the first fixing connection portion, and the second fixing connection portion passes through the interior of the heat sink.

[0036] In one possible implementation, the charging module further includes a charging coil electrically connected to the circuit board, the cooler is disposed between the charging coil and the heat sink, the circuit board is disposed between the charging coil and the heat sink, the circuit board has a clearance hole in the middle, and the cooler is embedded in the clearance hole.

[0037] In one possible implementation, the plurality of heat sinks are equidistantly arranged, and / or the plurality of heat sinks are arranged along the periphery of the heat dissipation substrate and arranged in multiple layers from the periphery of the heat dissipation substrate toward the center.

[0038] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0039] Figure 1 is a schematic diagram of the structure of the charging device provided in the first embodiment of this application.

[0040] Figure 2 is a schematic diagram of the charging device shown in Figure 1 from another perspective.

[0041] Figure 3 is a cross-sectional view of the charging device shown in Figure 1 with the charging cable removed.

[0042] Figure 4 is an exploded view of the charging device shown in Figure 1 with the charging cable removed.

[0043] Figure 5 is a schematic diagram of the charging device shown in Figure 1 with the charging cable and heat sink removed.

[0044] Figure 6 is an exploded view of the fan assembly shown in Figure 4.

[0045] Figure 7 is a cross-sectional view of the fan assembly shown in Figure 6 when assembled together.

[0046] Figure 8 is a three-dimensional schematic diagram of the charging device provided in the second embodiment of this application at one angle.

[0047] Figure 9 is a three-dimensional schematic diagram of the charging device shown in Figure 8 from another angle.

[0048] Figure 10 is a perspective sectional view of the charging device shown in Figure 8.

[0049] Figure 11 is an exploded view of the charging device shown in Figure 8 at one angle.

[0050] Figure 12 is an exploded view of the charging device shown in Figure 8 from another angle.

[0051] Figure 13 is another perspective sectional view of the charging device shown in Figure 8.

[0052] Figure 14 is an exploded view of the charging device shown in Figure 8 from another angle.

[0053] Figure 15 is an exploded view of the charging device shown in Figure 9.

[0054] Figure 16 is an exploded view of the first frame and its mounting components in the charging device shown in Figure 15. Detailed Implementation

[0055] The present application will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0056] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, top, bottom, etc.) in the embodiments of this application are only used to explain the relative positional relationship between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0057] It should also be noted that when a component is referred to as "fixed to" or "set on" another component, the component may be directly on the other component or there may be an intervening component present. When a component is referred to as "connected to" another component, it may be directly connected to the other component or there may be an intervening component present.

[0058] [First Embodiment]

[0059] Please refer to Figures 1 to 7. The first embodiment of this application provides a charging device 100 for charging electronic devices such as mobile phones and tablets. This application uses a mobile phone as an example for specific description. The charging device 100 can be a charger requiring an external power source or a portable power bank with its own power supply. Furthermore, the charging method of the charging device 100 can be wired charging or wireless charging. In this application, the charging device 100 is a wireless charger, which connects to an external power source via a charging cable 200 to charge the mobile phone.

[0060] The charging device 100 includes a mounting frame 1 and a charging component 2 and a fan component 3 respectively mounted on the mounting frame 1. The charging component 2 is used to charge the mobile phone, and the fan component 3 is used to accelerate the airflow speed, thereby improving the convective heat exchange efficiency between the charging device 100 and the air, so as to enhance the heat dissipation capacity of the charging device 100 and reduce the impact of the heat generated by the charging device 100 during the charging process on the charging efficiency of the mobile phone.

[0061] The charging component 2 includes a charging coil 21 and a magnetic component 22. The magnetic component 22 is used to attract the magnetic components inside the mobile phone, so that the mobile phone and the charging device 100 are tightly attached together. The charging coil 21 cooperates with the corresponding coil inside the mobile phone to form a wireless charging effect.

[0062] The mounting bracket 1 has a front side 101 and a back side 102. The front side 101 is used to contact the mobile phone. The charging component 2 is located on the side of the mounting bracket 1 near the front side 101 to reduce the distance between the charging component 2 and the mobile phone, thereby improving charging efficiency. The back side 102 is located on the side of the mounting bracket 1 away from the mobile phone. The fan assembly 3 is located on the side of the mounting bracket 1 near the back side 102, and the mounting bracket 1 has an exhaust vent 103 on the side near the back side 102. It is understood that the exhaust vent 103 is located on the side of the mounting bracket 1 near the back side 102. For example, the mounting bracket 1 may have one end near the front side 101 or one end near the back side 102. Here, "one end" can also be understood as "one end." The exhaust vent 103 can be located on the back side 102 or near the back side 102 on other components. When the fan assembly 3 is working, it can drive the airflow inside the charging device 100 to be discharged from the exhaust vent 103 to the outside of the charging device 100. That is, it drives the airflow to blow out from the exhaust vent 103 in a direction away from the front side 101. Before the airflow is discharged from the exhaust vent 103, it will first exchange heat with the charging component 2 to reduce the temperature of the charging component 2 and reduce the heat transferred from the charging component 2 to the mobile phone during the charging process. Moreover, the hot air after heat exchange with the charging component 2 is discharged in a direction away from the mobile phone, which can prevent the hot air after heat exchange from blowing towards the mobile phone, reduce the impact of the charging device 100 on the heat dissipation of the mobile phone, and also prevent the hot air from blowing towards the user's hand holding the mobile phone, thus improving the user experience.

[0063] Understandably, the heat exchange between the airflow and the charging component 2 can be achieved by the airflow directly passing through the charging component 2, thereby carrying away the heat generated by the charging component 2 during operation, or by setting a heat-conducting element connected to the charging component 2, the heat-conducting element absorbing the heat generated by the charging component 2, and the airflow then passing through the heat-conducting element, carrying away the heat on the heat-conducting element, thereby indirectly carrying away the heat generated by the charging component 2 during operation.

[0064] Preferably, the mounting bracket 1 has a protrusion 14 on one side near the back surface 102. The protrusion 14 protrudes from the front surface 101 to the back surface 102 and is positioned relative to the exhaust vent 103 near the center of the back surface 102. For example, there are multiple exhaust vents 103, which are positioned near the periphery of the back surface 102 and arranged circumferentially. The protrusion 14 is located on the side of the exhaust vent 103 near the center of the back surface 102, that is, the protrusion 14 is located within the inner circle formed by the multiple exhaust vents 103, so that a height difference is formed between the protrusion 14 and the back surface 102. The exhaust vent 103 can be located on the back surface 102, the side of the protrusion 14, or at the connection between the back surface 102 and the protrusion 14. When the charging device 100 is placed on a support surface such as a table, the protrusion 14 contacts the table, and a gap is formed between the back 102 of the mounting bracket 1 and the table. The exhaust port 103 communicates with the gap, so that the airflow can flow outward through the gap after being discharged from the exhaust port 103, making the airflow discharge more smooth.

[0065] In this embodiment, the protrusion 14 is located in the middle of the mounting bracket 1 on the side near the back surface 102, and the exhaust port 103 surrounds the outer periphery of the protrusion 14.

[0066] Understandably, the protrusion 14 and the mounting bracket 1 can be integrally formed or assembled separately.

[0067] In one embodiment, the mounting bracket 1 is provided with an air inlet 104, which is connected to an air outlet 103. The fan assembly 3 includes a fan 31, which is at least partially located between the air inlet 104 and the air outlet 103. That is, during the process of the fan 31 driving the airflow from the air inlet 104 to the air outlet 103, the airflow will pass through the fan 31.

[0068] Preferably, the air inlet 104 and the air outlet 103 are located on different sides of the mounting bracket 1 to prevent the air inlet and outlet from interfering with each other.

[0069] The specific location of the air inlet 104 is not limited. For example, it can be located on the side of the mounting bracket 1 near the front 101, or it can be located on the circumferential outer side of the mounting bracket 1. In this embodiment, the exhaust vent 103 is located on the axial side of the fan 31, and the air inlet 104 is located on the radial side of the fan 31, that is, the air inlet 104 is located on the circumferential outer side of the mounting bracket 1, and the air intake direction is perpendicular to the air outlet direction. Since the front 101 of the mounting bracket 1 needs to be in contact with devices such as mobile phones that need to be charged, placing the air inlet 104 on the circumferential outer side of the mounting bracket 1 can reduce the impact of the mobile phone on the air intake. At the same time, when the airflow flows towards the air inlet 104, part of the airflow will pass through the side of the mobile phone that is in contact with the charging device 100, thereby carrying away some of the heat from the mobile phone and playing a role in assisting the heat dissipation of the mobile phone.

[0070] It should be noted that the fan blades of the fan 31 rotate relative to the mounting frame 1 around a rotation axis. The axial direction of the fan 31 is the direction of the rotation axis, and the radial direction of the fan 31 is the direction perpendicular to the rotation axis.

[0071] The specific type of fan 31 is not limited, such as centrifugal fan 31, axial fan 31, etc. In this embodiment, the fan 31 is a centrifugal fan 31, which has the advantages of larger air volume and lower noise compared to other types of fans 31.

[0072] The fan assembly 3 also includes a fan shroud 32, which is mounted on the mounting bracket 1. The fan shroud 32 has a receiving cavity 321 and an inlet 322 and an outlet 323 respectively communicating with the receiving cavity 321. The fan 31 is housed in the receiving cavity 321. The inlet 322 communicates with the air inlet 104, and the outlet 323 communicates with the air outlet 103. When the fan 31 is working, outside air flows towards the fan 31 through the air inlet 104 and enters the fan shroud 32 through the inlet 322, and is finally discharged from the air outlet 103 through the outlet 323. Since the fan 31 inside the fan shroud 32 is a centrifugal fan 31, the centrifugal fan 31 drives the airflow to flow radially. During the flow, the airflow is blocked by the fan shroud 32, thereby changing the flow direction, and finally causing the airflow to be discharged from the air outlet 103 located on the axial side of the fan 31.

[0073] The fan 31 includes a fan blade 311. The side of the fan blade 311 away from the exhaust port 103 is flush with the side of the inlet 322 away from the exhaust port 103. Alternatively, the side of the fan blade 311 away from the exhaust port 103 is lower than the side of the inlet 322 away from the exhaust port 103. That is, the side of the fan blade 311 away from the exhaust port 103 does not protrude outward from the inlet 322, so as to prevent the fan blade 311 from protruding outward from the inlet 322 and affecting the air intake.

[0074] Preferably, the outer side of the fan blade 311 near the inlet 322 is provided with a clearance notch 3111 to allow the part of the fan cover 32 near the inlet 322 to be cleared, preventing the fan blade 311 from contacting the fan cover 32 and improving the overall structural compactness.

[0075] The fan cover 32 includes a cover body 324, a support portion 325, and a connecting portion 326. The cover body 324 is connected to the mounting bracket 1. The support portion 325 is spaced apart from the cover body 324. The connecting portion 326 connects the cover body 324 and the support portion 325, thus fixing the cover body 324, the support portion 325, and the connecting portion 326 together. The fan 31 is installed on the support portion 325. The gap between the cover body 324 and the support portion 325 forms an outlet 323, and the inlet 322 is located on the side of the cover body 324 away from the support portion 325.

[0076] The outer surface of the fan shroud 32 is provided with a first guide surface 3201, which extends along an arc-shaped trajectory toward the inlet 322 near the central axis of the fan 31. By providing an arc-shaped first guide surface 3201 on the outer side of the fan shroud 32, when the airflow moves to the outer side of the fan shroud 32 under the action of the fan 31, the airflow will move toward the inlet 322 under the guidance of the first guide surface 3201, reducing the flow rate of the airflow moving in the opposite direction after being blocked by the fan shroud 32, thereby increasing the intake air volume.

[0077] The inner surface of the fan shroud 32 is provided with a second guide surface 3202, which extends from the inlet 322 along an arc-shaped trajectory toward a direction away from the central axis of the fan 31. By providing an arc-shaped second guide surface 3202 on the inner side of the fan shroud 32, when the airflow flows inside the fan shroud 32, the fan 31 assembly will obstruct the airflow toward the inlet 322, reducing the flow rate of the airflow discharged from the inlet 322 inside the fan shroud 32, thereby increasing the air volume.

[0078] Specifically, the fan cover 324 includes an arc-shaped airflow guide 3241. The airflow guide 3241 is generally shaped like an inverted bowl, so that the radial dimension of the airflow guide 3241 increases from the inlet 322 to the outlet 323. The inner and outer surfaces of the airflow guide 3241 are both arc-shaped, and form a first airflow guide surface 3201 and a second airflow guide surface 3202, respectively.

[0079] In one embodiment, the charging device 100 further includes a cooling component 4, which is thermally connected to the charging component 2 and is at least partially located between the air inlet 104 and the air outlet 103. The cooling component 4 absorbs the heat generated by the charging component 2 during operation, thereby reducing the temperature of the charging component 2. Since the cooling component 4 is at least partially located between the air inlet 104 and the air outlet 103, the airflow passing from the air inlet 104 to the air outlet 103 passes through the cooling component 4, thus carrying away the heat from the cooling component 4 and enhancing its heat absorption effect on the charging component 2. After the temperature of the charging component 2 is reduced by the cooling component 4, the heat generated during charging makes its temperature higher than the temperature of the charging device 100, allowing the phone to transfer heat to the charging device 100, thus assisting in heat dissipation and improving charging efficiency.

[0080] The mounting frame 1 includes a first frame 11, a second frame 12, and a connecting column 13. The connecting column 13 is a connecting column. The first frame 11 and the second frame 12 are arranged opposite each other at intervals. The connecting column 13 connects the first frame 11 and the second frame 12, so that the mounting frame 1 is in the shape of "I".

[0081] The front side 101 is located on the side of the first frame 11 away from the second frame 12, and the back side 102 is located on the side of the second frame 12 away from the first frame 11. The charging component 2 and the cooling component 4 are located on the first frame 11, and the fan component 3 and the exhaust vent 103 are located on the second frame 12. The cooling component 4 is at least partially located between the first frame 11 and the second frame 12. By arranging the mounting bracket 1 as the first frame 11 and the second frame 12 spaced apart from each other, the cooling component 4 is partially located between the first frame 11 and the second frame 12, that is, partially exposed to the external environment, which is beneficial to enhancing the heat dissipation effect of the cooling component 4.

[0082] An air inlet 104 and a heat dissipation channel 105 are formed between the first frame 11 and the second frame 12. The air inlet 104 is located on the outer periphery of the heat dissipation channel 105, surrounding the outer periphery of the heat dissipation channel 105 and communicating with the exhaust port 103 through the heat dissipation channel 105. That is, the heat dissipation channel 105 is connected to the inlet 322 of the fan shroud 32. The cooling component 4 is at least partially located inside the heat dissipation channel 105. When the fan 31 is working, outside air enters the heat dissipation channel 105 through the air inlet 104 between the first frame 11 and the second frame 12. When the airflow flows in the heat dissipation channel 105, it passes through the cooling component 4, then moves to the fan shroud 32 through the inlet 322, and finally is discharged through the outlet 323 and the exhaust port 103.

[0083] The cooling component 4 includes a cooling element 41 and a heat sink 42. The cooling element 41 is thermally connected to the charging component 2 and the heat sink 42 on opposite sides, respectively. The heat sink 42 is at least partially located within the heat dissipation channel 105. Specifically, the cooling element 41 is a thermoelectric cooler, with one side of the thermoelectric cooler thermally connected to the charging coil 21 of the charging component 2. When the cooling element 41 is in operation, the temperature of the side closer to the charging component 2 decreases, allowing the charging component 2 to transfer heat to the cooling element 41. The temperature of the side of the cooling element 41 furthest from the charging component 2 increases, transferring heat to the heat sink 42. This creates the effect of transferring heat from the charging component 2 to the heat sink 42, thereby reducing the temperature of the charging component 2. The fan 31 drives airflow to further reduce the temperature of the heat sink 42, ensuring the cooling effect of the heat sink 42 on the charging component 2.

[0084] Understandably, the specific way in which the cooling component 41 forms a thermal conduction connection with the heat sink 42 and the charging component 2 is not limited. For example, they can be directly attached together to form a thermal conduction effect, or a thermally conductive metal part or thermally conductive grease or other thermally conductive part can be provided between the cooling component 41, the heat sink 42 and the charging component 2 to indirectly form a thermal conduction effect.

[0085] The radiator 42 includes a heat dissipation base 421 that is thermally connected to the cooling component 41, and a plurality of heat dissipation elements 422 disposed on the side of the heat dissipation base 421 away from the cooling component 41. The plurality of heat dissipation elements 422 are located within the heat dissipation channel 105 and are spaced apart from each other. After the airflow enters the heat dissipation channel 105 through the air inlet 104, the airflow flows between adjacent heat dissipation elements 422, prolonging the movement time of the airflow within the heat dissipation channel 105, so that the airflow can fully contact the heat dissipation elements 422, so as to remove more heat and improve the heat dissipation effect. It can be understood that the air inlet 104 and the heat dissipation channel 105 are located between the first frame 11 and the second frame 12. For example, the heat dissipation channel 105 is formed between the plurality of heat dissipation elements 422 of the radiator 42, and the air inlet 104 is, for example, the gap between the plurality of heat dissipation elements 422 of the outermost ring of the radiator 42. The air inlet 104 is arranged around the outer periphery of the heat dissipation channel 105 and communicates with the heat dissipation channel 105. In this scheme, the airflow passes through the radiator 42 and the fan 31 in sequence to exhaust the hot airflow. Compared with the existing technology where the airflow passes through the fan 31 first and then to the radiator 42 before being finally dissipated, the cold airflow has a higher contact with the radiator 42, resulting in better heat dissipation efficiency.

[0086] Since the heat sink 422 is located inside the heat dissipation channel 105, the user's fingers may come into contact with the heat sink 422 when holding the phone, posing a risk of burns. This application forms an air inlet 104 on the circumferential outer side of the mounting bracket 1, so that when the airflow enters the heat dissipation channel 105 through the air inlet 104, the airflow first exchanges heat with the heat sink 422 located on the outer side, i.e., the heat sink 422 that may come into contact with the fingers. At this time, the temperature of the airflow is the lowest, so the heat exchange effect with the heat sink 422 is better, that is, the cooling effect of the heat sink 422 on the outer side is better, thereby reducing the risk of finger burns.

[0087] Preferably, the heat sink 422 is cylindrical with an arc-shaped outer surface. When the airflow comes into contact with the heat sink 422, the arc-shaped surface generates less wind resistance, which helps to reduce noise.

[0088] [Second Embodiment]

[0089] Please refer to Figures 8 to 12 simultaneously. The second embodiment of this application provides a charging device 100, which can be used to charge mobile terminal electronic devices such as mobile phones and tablets. The charging device 100 can be a charging head, power bank, wireless charger, etc. This application will use a wireless charger as an example for detailed description. The main difference between this embodiment and the first embodiment lies in the different structures of the first frame and the charging component. Specifically, the charging device 100 includes a first frame 11 and a charging component. The charging component includes a circuit board 23 and a coil assembly. The coil assembly is connected to the circuit board 23. An installation cavity is formed within the first frame 11. A first substrate 111 is provided on the first frame 11. The first substrate 111 is a partition, dividing the installation cavity into a first cavity 112 and a second cavity 113. The coil assembly is located in the first cavity 112, and the circuit board 23 is located in the second cavity 113. This application reduces the heat generated by the circuit board 23 being transferred to the first cavity 112 where the coil assembly is located by setting a first substrate 111 between the coil assembly and the circuit board 23, thereby reducing the heat between the charging device 100 and the device to be charged, lowering the temperature of the device to be charged during wireless charging, and thus improving the user's charging and usage experience.

[0090] Furthermore, the first frame 11 includes a first perimeter 114, which is a tubular frame and can be cylindrical or polygonal, etc., without limitation. The internal space enclosed by the first perimeter 114 is a mounting cavity. The first substrate 111 is connected to the inner wall of the first perimeter 114 and divides the mounting cavity into a first cavity 112 and a second cavity 113. The first cavity 112 and the second cavity 113 are arranged along the height direction of the first perimeter 114. The periphery of the first substrate 111 is connected to the first perimeter 114, so that the first cavity 112 and the second cavity 113 are not interconnected, to prevent the heat generated by the circuit board 23 from being transferred to the first cavity 112.

[0091] Preferably, the first frame 11 can be made of a material with poor thermal conductivity, such as plastic, so that the first substrate 111 can isolate the heat generated by the circuit board 23 and reduce the heat generated by the circuit board 23 from being transferred to the coil assembly side through the first substrate 111.

[0092] The device to be charged is a mobile terminal electronic device such as a mobile phone or tablet computer. This application uses a mobile phone as an example for detailed description. In this embodiment, the charging device 100 is cylindrical in shape. Specifically, the first frame 11 is cylindrical, and the circuit board 23 and coil assembly are both designed to be circular. In other embodiments, it can also be designed in other shapes. This application does not limit the specific shape of the charging device 100. The first perimeter 114 is an annular structure. The first substrate 111 is connected to the middle of the inner sidewall of the first perimeter 114, and the inner sidewall of the first perimeter 114 is the radially inward side of the first perimeter 114. The first substrate 111 divides the first perimeter 114 into upper and lower parts along its length. The upper part of the first perimeter 114 and the first substrate 111 enclose a first cavity 112, and the lower part of the first perimeter 114 and the first substrate 111 enclose a second cavity 113. The first substrate 111 and the first perimeter 114 are, for example, integrally formed structures.

[0093] In the illustrated embodiment, the coil assembly includes a charging coil 21 and a magnetic shielding sheet disposed at the bottom of the charging coil 21. The charging coil 21 is electrically connected to the circuit board 23. The charging device 100 also includes a magnetic suction component 22. The magnetic suction component 22 can be a single structure formed by a single magnetic suction component, or it can be an assembly structure composed of multiple magnetic suction components. The charging coil 21 and the magnetic suction component 22 can be fixed in the first cavity 112 by snapping, pasting, or other means, and are fixed on the first substrate 111. The circuit board 23 can be fixed in the second cavity 113 by snapping, pasting, or other means, for example, it can be pasted on the first substrate 111. The charging coil 21 is electrically connected to the circuit board 23 for wireless charging of the mobile phone. The magnetic suction component 22 includes multiple magnets arranged in a ring structure. The magnetic suction component 22 is used to magnetically cooperate with the magnetic array built into the mobile phone, so that when the mobile phone is placed on the charging device 100 for wireless charging, the magnetic suction component 22 can magnetically fix the mobile phone on the charging device 100, so that the user can use the mobile phone while charging. The charging coil 21 is located at the center of the first cavity 112, and the magnetic attractor 22 is arranged around the periphery of the charging coil 21.

[0094] Specifically, the first cavity 112 includes a first mounting area 1121 and a second mounting area 1122. The second mounting area 1122 surrounds the circumferential periphery of the first mounting area 1121. The charging coil 21 is mounted and fixed to the first mounting area 1121, for example, by adhesive bonding to the first substrate 111. The magnetic suction member 22 is mounted and fixed to the second mounting area 1122, for example, by adhesive bonding to the first substrate 111. In this embodiment, a separator 115 is provided inside the first cavity 112. The separator 115 extends circumferentially and is located radially inside the first periphery 114 to divide the first cavity 112 into the first mounting area 1121 and the second mounting area 1122. The separator 115 can be a single plate structure or multiple separate plate structures spaced apart circumferentially.

[0095] In the illustrated embodiment, the charging device 100 further includes a panel 5 and a cooling element 41. The panel 5 covers one side of the first frame 11 located in the first cavity 112, i.e., the panel 5 covers the side of the coil assembly away from the first substrate 111, and the panel 5 completely covers the upper opening of the first frame 11 to shield the coil assembly. The panel 5 is connected to the top of the first frame 11, for example, by a snap-fit ​​mechanism, and the panel 5 is in contact with the charging coil 21. The cooling element 41 is a semiconductor cooler. During wireless charging, the back of the mobile phone is placed on the panel 5, so that the receiving coil of the mobile phone corresponds to the charging coil 21, and the built-in magnet array of the mobile phone corresponds to and magnetically attracts the magnetic attractor 22. The panel 5 serves as both the contact panel and the charging panel of the charging device 100 when wirelessly charging the device to be charged. Preferably, panel 5 is made of a superconducting thermal material to rapidly transfer the cold energy generated by the cooling component 41 to the mobile phone for heat dissipation, quickly dissipating heat from the contact area between the mobile phone and panel 5, thereby reducing the temperature of the mobile phone and charging device 100. The superconducting thermal material can be, for example, a high thermal conductivity insulating material, such as a composition of polycarbonate, graphite, and a phosphorus-containing flame retardant. The concentration (i.e., mass fraction) of polycarbonate is 70%-80%, the concentration of graphite is less than or equal to 25%, and the concentration of the phosphorus-containing flame retardant is less than or equal to 5%. The phosphorus-containing flame retardant can be, for example, a phosphate ester flame retardant. Panel 5 can also be made of glass to improve the aesthetics of the charging device 100.

[0096] The cooling component 41 is electrically connected to the circuit board 23. The first substrate 111 has a receiving portion 1111, and the cooling component 41 is disposed in the receiving portion 1111. In this embodiment, the center portion of the first substrate 111 extends toward the second cavity 113 to form a surrounding wall 1112. The surrounding wall 1112 has an opening structure at both the top and bottom. The receiving portion 1111 is formed inside the surrounding wall 1112 and communicates with the first cavity 112 and the second cavity 113, that is, the receiving portion 1111 has a through-hole structure. The circuit board 23 has a clearance hole 231, which is sleeved around the periphery of the surrounding wall 1112. For example, the circuit board 23 is arranged around the outside of the surrounding wall 1112 and attached to the first substrate 111. By providing the receiving portion 1111 for housing the cooling component 41 on the first substrate 111, component stacking can be avoided, and the thickness of the entire charging device 100 can be reduced.

[0097] In the illustrated embodiment, the charging device 100 further includes a heat sink 42, which is disposed on one side of the first frame 11 located in the second cavity 113. The cooling component 41 includes a cold end 411 near the first cavity 112 and a hot end 412 near the second cavity 113, located at opposite ends of the cooling component 41. The cold end 411 is connected to the charging coil 21, and the hot end 412 is connected to the heat sink 42, which dissipates heat from the hot end 412 of the cooling component 41. When the cooling component 41 is working, the heat generated by the mobile phone, the heat between the mobile phone and the panel 5, and the heat generated by the charging coil 21 can all be transferred from the cold end 411 to the hot end 412 via the charging coil 21, and finally dissipated via the heat sink 42, achieving a better heat dissipation effect. The cold energy generated by the cold end 411 can also be transferred to the coil assembly, the panel 5, and the mobile phone to achieve a cooling effect on the mobile phone. Since the heat sink 42 and the circuit board 23 are located on the same side of the first substrate 111, the heat generated by the circuit board 23 can be directly dissipated through the heat sink 42, further preventing the heat generated by the circuit board 23 from entering the first cavity 112 through the first substrate 111.

[0098] Preferably, a first heat-conducting element 43 is provided between the cold end 411 and the charging coil 21, and a second heat-conducting element 44 is provided between the hot end 412 and the heat sink 42. The first heat-conducting element 43 and the second heat-conducting element 44 help the heat conduction between the charging coil 21, the cooling element 41, and the heat sink 42, which can improve the heat conduction efficiency and enhance the heat dissipation effect. The first heat-conducting element 43 and the second heat-conducting element 44 are, for example, thermally conductive silicone.

[0099] Furthermore, the heat sink 42 includes a heat dissipation base 421 and a plurality of heat dissipation bodies 422 connected to the side of the heat dissipation base 421 facing away from the cooling component 41. The heat dissipation base 421 is preferably a plate-shaped structure. The hot end 412 is connected to the heat dissipation base 421 through a second heat-conducting member 44, for example, connected to the center of the heat dissipation base 421. The heat dissipation base 421 is located, for example, at the lower opening of the first frame 11, and can serve to shield the internal components. Heat dissipation gaps 423 are formed between the plurality of heat dissipation bodies 422, and the heat dissipation gaps 423 form heat dissipation channels on the heat sink 42. The heat dissipation bodies 422 are, for example, cylindrical structures, and the heat dissipation bodies 422 and the heat dissipation base 421 are, for example, integrally formed structures. By designing the heat sink 42 as a heat dissipation base 421 and multiple heat dissipation bodies 422, the heat dissipation area of ​​the heat sink 42 can be increased, and the heat dissipation efficiency can be enhanced. Designing the heat dissipation body 422 as a small cylinder allows the external airflow to stay on the heat sink 42 for a longer time when it flows through multiple cylinders, resulting in higher thermal conductivity and lower noise.

[0100] In the illustrated embodiment, the charging device 100 further includes a fan assembly located on the side of the heat dissipation base 421 away from the cooling component 41. The fan assembly is used to quickly blow away the heat from the heat sink 42 by enhancing airflow, further improving heat dissipation efficiency, enhancing the heat dissipation effect of the charging device 100, reducing the internal temperature of the charging device 100, and preventing the charging efficiency of the charging device 100 from decreasing and becoming too hot to handle. Specifically, the fan assembly includes a second frame 12 and a fan 31 electrically connected to the circuit board 23. The second frame 12 is fixedly connected to the first frame 11 and forms a gap 104 between them. The gap 104 is similar to the air inlet structure located on the radial side of the fan in the first embodiment. The second frame 12 is located below the first frame 11, and the second frame 12 is fixed to the first frame 11, for example, by screws. The structure of the second frame 12 is similar to that of the first frame 11. The frame structure formed by the second frame 12 and the first frame 11 is similar to the mounting frame in the first embodiment. Specifically, the second frame 12 includes a second base plate 121 and a second perimeter 122 connected to the outer periphery of the second base plate 121. The second base plate 121 serves as a fixing plate, for example. The second base plate 121 and the second perimeter 122 are integrally formed, for example. The second base plate 121 is connected to the middle part of the inner sidewall of the second perimeter 122, such that the second base plate 121 divides the second perimeter 122 into two parts. The upper part and the second base plate 121 enclose a first receiving position 123, which is located on the side of the second frame 12 closer to the first frame 11. The lower part and the second base plate 121 enclose a second receiving position 124, which is located on the side of the second frame 12 away from the first frame 11.

[0101] A plurality of heat sinks 422 are arranged in a ring around the circumference of the heat sink base 421 and enclose an installation space 424. A fan 31 is disposed within the installation space 424 and is connected and fixed to the heat sink base 421, for example by screws. The heat sink gap 423 and the spacer 104 together form the air inlet of the fan 31. The air inlet connects the outside to the installation space 424, so that the heat sink 42 is in direct contact with the outside air, thereby improving the heat dissipation effect. The second frame 12 is provided with an air outlet 103 corresponding to the fan 31. The air outlet 103 is similar to the exhaust port structure in the first embodiment. Specifically, the ends of the plurality of heat sinks 422 away from the heat sink base 421 are accommodated in the first accommodating position 123. The portion of the second substrate 121 corresponding to the installation space 424 protrudes to the side away from the installation space 424 to form a protrusion 14. The air outlet 103 is disposed on the protrusion 14. The protrusion 14 and the second substrate 121 are, for example, integrally formed. Optionally, the center of the second substrate 121 is a through hole structure, and the protrusion 14 includes an intermediate support 141 and a plurality of connecting ribs 142 connected to the intermediate support 141 and the inner wall of the through hole structure. The plurality of connecting ribs 142 are spaced apart, so that the air outlet 103 is formed between the plurality of connecting ribs 142.

[0102] Preferably, an air outlet gap 125 is formed between the intermediate support portion 141 and the second frame 12, allowing the air outlet 103 to communicate with the outside through the air outlet gap 125. For example, the intermediate support portion 141 protrudes beyond the bottom surface of the second frame 12, meaning the height of the second frame 12 is lower than the height of the intermediate support portion 141, thus creating a height difference between the intermediate support portion 141 and the second frame 12 when the charging device 100 is placed on a surface, thereby forming the air outlet gap 125; or, a bottom cover 143 is provided at the bottom of the intermediate support portion 141, and the bottom cover 143 is connected to the intermediate support portion 141 by a snap-fit ​​connection, for example. The bottom cover 143 can raise the intermediate support portion 141, creating the air outlet gap 125 between the intermediate support portion 141 and the second frame 12, while also preventing foreign objects such as hair from entering the air outlet 103.

[0103] The second frame 12 is fixedly connected to the first frame 11 by screws. Specifically, the second base plate 121 has a second fixing connection part 13 on the side facing the first frame 11. The second fixing connection part 13 is, for example, a connecting post in the first embodiment. The first base plate 111 has a corresponding first fixing connection part 1113. The second fixing connection part 13 passes through the heat dissipation base 421, and the circuit board 23 is connected to the first fixing connection part 1113. Screws are threaded through the first fixing connection part 1113 and threaded to the second fixing connection part 13 to achieve the connection and fixation between the first frame 11 and the second frame 12. Preferably, a support block 15 is also provided between the circuit board 23 and the heat dissipation base 421. The support block 15 is sleeved on the second fixing connection part 13 and supports and limits the circuit board 23, so that the circuit board 23 is clamped and fixed between the first base plate 111 and the heat dissipation base 421.

[0104] In the illustrated embodiment, the charging device 100 further includes a bracket 6, which is rotatably disposed in the second receiving position 124. For example, the bracket 6 can rotate relative to the second frame 12 between a supporting position and a storage position. In the supporting position, the bracket 6 rotates away from the second receiving position 124 and forms a supporting angle with the second frame 12 to support the charging device 100 upright. In the storage position, the bracket 6 is stored in the second receiving position 124. Furthermore, the bracket 6 can rotate relative to the second frame 12 to adjust the supporting position of the bracket 6, so that the bracket 6 can rotate 360°. Users can adjust the support angle of the mobile phone to use the mobile phone, bringing convenience.

[0105] In the illustrated embodiment, the outer wall of the first frame 11 is provided with buttons and a data interface. The buttons and the data interface are electrically connected to the circuit board 23 respectively. For example, the buttons and the data interface are respectively located on opposite sides of the first frame 11. The data interface can be connected to an external power source to power the charging device 100. The buttons can be used to control the starting or stopping of the charging device 100.

[0106] In summary, the charging device provided in the second embodiment of this application includes a first frame and a charging assembly. The charging assembly includes a circuit board and a coil assembly. The charging coil of the coil assembly is electrically connected to the circuit board. The first frame includes a first perimeter and a first substrate. The first substrate is connected to the inner wall of the first perimeter and divides the space enclosed by the first perimeter into a first cavity and a second cavity. The coil assembly is disposed in the first cavity, and the circuit board is disposed in the second cavity. By placing the first substrate between the coil assembly and the circuit board, this application can reduce the heat generated by the circuit board from being transferred to the first cavity where the coil assembly is located, thereby reducing the heat between the charging device and the device to be charged, lowering the temperature of the device to be charged during wireless charging, and thus improving the user's charging and usage experience.

[0107] [Third Embodiment]

[0108] Please refer to Figures 8, 9, and 13 to 18 simultaneously. The third embodiment of this application provides a charging device 100, which differs from the second embodiment mainly in the mounting frame structure formed by the first and second frames. Specifically, the charging device 100 includes a mounting frame, a heat sink 42, and a charging component. The charging component is mounted on the mounting frame and connected to the heat sink 42. The heat sink 42 is mounted on the charging component or the mounting frame, so that at least part of the heat sink 42 is exposed to the outside, that is, directly in contact with the external space of the charging device 100. The charging device 100 of this application abandons the traditional outer casing, allowing the heat sink 42 to directly communicate with the outside of the charging device 100 through the open space 16. The heat absorbed by the heat sink 42 can be directly dissipated to the outside, greatly improving heat dissipation efficiency and thus enhancing the user's charging and usage experience.

[0109] The mounting frame includes a first frame 11 and a second frame 12, which are spaced apart to form an open space 16. A heat sink 42 is disposed within the open space 16, and a charging component is disposed on either the first frame 11 or the second frame 12 and connected to the heat sink 42. It should be noted that the open space 16 refers to the space formed between the spaced-apart first frame 11 and the second frame 12, which is in fluid communication with the outside of the charging device 100 without any obstruction, thus allowing the heat sink 42 installed within the open space 16 to also be directly connected to the outside of the charging device 100. In this embodiment, the charging device 100 is generally a vertically hollowed-out circular columnar structure. Specifically, the first frame 11, the second frame 12, the heat sink 42, and the charging component are all designed to be circular. In other embodiments, they can also be designed in other shapes. This application does not limit the specific shape of the charging device 100.

[0110] In the illustrated embodiment, the first frame 11 includes a first substrate 111 and a first perimeter 114 connected to the outer periphery of the first substrate 111. The first substrate 111 is a partition. The first perimeter 114 includes a first lower sidewall 1141 extending from the outer periphery of the first substrate 111 toward the side closer to the second frame 12 and a first upper sidewall 1142 extending from the outer periphery of the first substrate 111 toward the side away from the second frame 12. The first upper sidewall 1142, the first lower sidewall 1141 and the first substrate 111 are, for example, integrally formed structures. Similarly, the second frame 12 includes a second base plate 121 and a second perimeter 122 connected to the outer periphery of the second base plate 121. The second base plate 121 serves as a fixing plate, for example. The second perimeter 122 includes a second upper sidewall 1221 extending from the outer periphery of the second base plate 121 toward the side closer to the first frame 11 and a second lower sidewall 1222 extending from the outer periphery of the second base plate 121 toward the side away from the first frame 11. The second upper sidewall 1221, the second lower sidewall 1222 and the second base plate 121 are, for example, integrally formed structures.

[0111] An open space 16 is formed between the first substrate 111 and the second substrate 121. A spacer 104 is formed between the first lower sidewall 1141 and the second upper sidewall 1221. One side of the spacer 104 connects to the open space 16, and the other side connects to the outside of the charging device 100, thereby enabling the heat sink 42 to be directly connected to the outside air through the spacer 104. In this embodiment, the charging component is disposed on the first frame 11. Specifically, the charging component is disposed on the side of the first substrate 111 opposite to the open space 16. In the illustrated embodiment, the charging device 100 also includes a cooling component 41, which is disposed on the side of the first substrate 111 near the open space 16. The charging component includes a circuit board assembly and a charging coil 21. The circuit board assembly is disposed on the side of the first substrate 111 near the open space 16, and the heat sink 42 is connected to the circuit board assembly. Further, the circuit board assembly includes a circuit board 23, which is disposed between the charging coil 21 and the heat sink 42, and the charging coil 21 is electrically connected to the circuit board 23. Preferably, the cooling component 41 is disposed between the charging coil 21 and the heat sink 42 to quickly conduct the heat generated by the charging component to the heat sink 42. Optionally, a clearance hole 231 is provided in the middle of the circuit board 23, and the cooling component 41 is embedded in the clearance hole 231.

[0112] Specifically, the first upper sidewall 1142 and the first substrate 111 enclose a first mounting position 112, which is similar to the first cavity structure in the second embodiment. The charging coil 21 is installed in the first mounting position 112. The second lower sidewall 1222 and the second substrate 121 enclose a second mounting position 124, which is similar to the second accommodating position structure in the second embodiment. The charging device 100 also includes a bracket 6, which is rotatably disposed in the second mounting position 124. For example, the bracket 6 can rotate relative to the second frame 12 between a supporting position and a storage position. In the supporting position, the bracket 6 rotates away from the second mounting position 124 and forms a supporting angle with the second frame 12 to support the charging device 100 upright. In the storage position, the bracket 6 is stored in the second mounting position 124. Furthermore, the bracket 6 can rotate relative to the second frame 12 to adjust the supporting position of the bracket 6, so that the bracket 6 can rotate 360°. Users can adjust the support angle of the mobile phone to use the mobile phone, which brings convenience.

[0113] In this embodiment, the open space 16 is composed of three interconnected parts. Specifically, the open space 16 includes a first part 113 formed by the first lower sidewall 1141 and the first substrate 111, a second part 123 formed by the second upper sidewall 1221 and the second substrate 121, and a third part 105 connecting the first part 113 and the second part 123. The third part 105 corresponds to the spacer 104. The first part 113 is similar to the second cavity structure in the second embodiment, the second part 123 is similar to the first accommodating position structure in the second embodiment, and the third part 105 forms a heat dissipation channel between the first part 113 and the second part 123 and communicates with the spacer 104. The circuit board 23 is disposed in the first part 113, that is, the circuit board 23 is located between the first substrate 111 and the heat sink 42. The circuit board 23 is fixed in the first part 113, for example, by snap-fit ​​or adhesive. The charging coil 21 and the cooling component 41 are electrically connected to the circuit board 23. This application separates the charging coil 21 and the circuit board 23 on opposite sides of the first substrate 111 by using the first substrate 111 to separate the charging coil 21 and the circuit board 23. This reduces the heat generated by the circuit board 23 from being transferred to the first placement position 112 where the charging coil 21 is located, thereby reducing the heat between the charging device 100 and the mobile phone, lowering the temperature of the mobile phone during wireless charging, and thus improving the charging efficiency.

[0114] In the illustrated embodiment, the charging device 100 also includes a magnetic attractor 22. The magnetic attractor 22 in this embodiment is the same as that in the second embodiment, and will not be described again here.

[0115] Specifically, the first mounting position 112 includes a first mounting area 1121, a second mounting area 1122, and a separator 115 disposed between the two areas. The first mounting area 1121, the second mounting area 1122, and the separator 115 in this embodiment are the same as those in the second embodiment, and will not be described again here.

[0116] In the illustrated embodiment, the charging device 100 further includes a panel 5, which covers the port of the first mounting position 112 of the first frame 11, i.e., the panel 5 covers the outside of the charging assembly, and the panel 5 completely covers the upper opening of the first frame 11 to shield the charging coil 21 and the magnetic attractor 22. The panel 5 is connected to the end of the first upper sidewall 1142, for example, by a snap-fit, and the panel 5 is in contact with the charging coil 21. During wireless charging, the back of the mobile phone is placed on the panel 5, so that the receiving coil of the mobile phone corresponds to the charging coil 21, and the built-in magnet array of the mobile phone corresponds to and magnetically attracts the magnetic attractor 22. The panel 5 serves as both the contact panel and the charging panel of the charging device 100 when wirelessly charging the device to be charged.

[0117] The first substrate 111 has a receiving portion 1111, and a cooling component 41 is disposed in the receiving portion 1111. The cooling component 41 is a semiconductor cooler. In this embodiment, the central portion of the first substrate 111 extends toward the open space 16 to form a surrounding wall 1112. The surrounding wall 1112 has an opening structure at both the top and bottom. The receiving portion 1111 is formed inside the surrounding wall 1112 and communicates with the first placement position 112 and the open space 16. That is, the receiving portion 1111 has a through-hole structure, and the circuit board 23 is arranged around the outside of the surrounding wall 1112 through its clearance hole 231. By providing the receiving portion 1111 for housing the cooling component 41 on the first substrate 111, component stacking can be avoided, and the thickness of the entire charging device 100 can be reduced.

[0118] Specifically, the cooling component 41 includes a cold end 411 near the first mounting position 112 and a hot end 412 near the open space 16. The cold end 411 is connected to the charging coil 21, and the hot end 412 is connected to the heat sink 42. The heat sink 42 is used to dissipate the heat from the hot end 412 of the cooling component 41. A first heat-conducting element 43 is provided between the cold end 411 and the charging coil 21, and a second heat-conducting element 44 is provided between the hot end 412 and the heat sink 42. When the cooling component 41 is working, the heat generated by the mobile phone, the heat between the mobile phone and the panel 5, and the heat generated by the charging coil 21 can all be transferred from the cold end 411 to the hot end 412 through the charging coil 21, and finally dissipated through the heat sink 42, achieving a better heat dissipation effect. Since the heat sink 42 and the circuit board 23 are located on the same side of the first substrate 111, the heat generated by the circuit board 23 can be directly dissipated through the heat sink 42, further preventing the heat generated by the circuit board 23 from entering the first mounting position 112 through the first substrate 111.

[0119] Furthermore, the heat sink 42 includes a heat dissipation base 421 and a plurality of heat sinks 422 connected to the side of the heat dissipation base 421 away from the cooling component 41. The hot end 412 is connected to the heat dissipation base 421 through a second heat-conducting component 44, for example, connected to the center of the heat dissipation base 421. The heat dissipation base 421 covers the port of the first lower sidewall 1141 and is connected and fixed to the first frame 11, which can serve to shield the internal components. The heat dissipation base 421 is fixedly connected to the first substrate 111 or the first lower sidewall 1141, for example, by means of snap-fit ​​or other means. The end of the heat sink 422 away from the heat dissipation base 421 protrudes into the second part 123, and at least part of the heat sink 422 is connected to the second substrate 121, for example, by means of snap-fit ​​or adhesive. Multiple heat sinks 422 are spaced apart to form heat dissipation gaps 423, which are located in the third part 105 of the open space 16. The heat sinks 422 are, for example, cylindrical structures, and the heat sinks 422 and the heat dissipation base 421 are, for example, integrally formed structures. By designing the heat sink 42 as a structure with a heat dissipation base 421 and multiple heat sinks 422, the heat dissipation area of ​​the heat sink 42 can be increased, enhancing heat dissipation efficiency. Designing the heat sinks 422 as small cylinders allows the airflow channels between the multiple cylinders to intersect, resulting in a longer residence time of the external airflow on the heat sink 42 when it flows through the multiple cylinders. Simultaneously, the airflow can fully contact the surface area of ​​the cylinders, increasing the heat dissipation area and improving thermal conductivity. Furthermore, the airflow impacts the cylinders smoothly, resulting in less noise. In one embodiment, the multiple heat sinks 422 are spaced equidistantly to make the airflow smoother and less prone to turbulence. Multiple heat sinks 422 are arranged along the periphery of the heat sink base 421, and are arranged in multiple layers from the periphery of the heat sink base 421 toward the center. The more layers of heat sinks 422 are arranged from the periphery of the heat sink base 421 toward the center, the more heat sinks 422 there are, the more heat conduction area there is, and the better the heat dissipation effect.

[0120] In the illustrated embodiment, multiple heat sinks 422 are arranged in a ring around the periphery of the heat sink base 421, forming an installation space 424. Specifically, multiple spaced heat sinks 422 are provided around the periphery of the heat sink base 421, but no heat sinks 422 are provided in the middle area of ​​the heat sink base 421. The outer heat sinks 422 then form the installation space 424. The fan assembly 3 is disposed within the installation space 424 and connected and fixed to the heat sink base 421, for example, by screws. In other embodiments, the fan assembly 3 can also be connected and fixed to the second frame 12. The heat dissipation gap 423 forms the first ventilation port of the fan assembly 3, allowing the heat sink 42 to directly contact the outside air, thereby improving the air intake and heat dissipation effect. The second base plate 121 is provided with a second ventilation port 103 corresponding to the fan assembly 3. The first ventilation port and the second ventilation port 103 can serve as the air inlet and air outlet of the fan assembly 3, that is, when the first ventilation port serves as the air inlet of the fan assembly 3, the second ventilation port 103 serves as the air outlet of the fan assembly 3, or when the first ventilation port serves as the air outlet of the fan assembly 3, the second ventilation port 103 serves as the air inlet of the fan assembly 3. Setting the fan assembly 3 inside the heat sink 42 can reduce the overall volume of the charging device 100. Preferably, when the fan assembly 3 is running, the external air enters the heat dissipation gap 423 through the partition 104. When the air passes through the heat sink 422 and the heat dissipation base 421, it begins to absorb heat and form hot air. Part of the hot air flows out through the heat dissipation gap 423 and the partition 104, and another part of the air is drawn in by the fan assembly 3 and blown out from the second vent 103, resulting in better heat dissipation.

[0121] Specifically, the portion of the second substrate 121 corresponding to the fan assembly 3 protrudes to the side opposite to the first frame 11, forming a protrusion 14. The protrusion 14 extends beyond the side of the second frame 12 away from the first frame 11. A second ventilation opening 103 is provided on the protrusion 14. The protrusion 14 and the second substrate 121 are, for example, integrally formed. Optionally, the central portion of the second substrate 121 has a through-hole structure. The protrusion 14 includes a central support portion 141 and multiple connecting ribs 142 connecting the central support portion 141 to the inner wall of the through-hole structure. The multiple connecting ribs 142 are spaced apart, such that the second ventilation opening 103 is formed between the multiple connecting ribs 142. An air outlet gap 125 is formed between the central support portion 141 and the second frame 12. A bottom cover 143 is provided at the bottom of the central support portion 141. The structures of the central support portion 141, the air outlet gap 125, and the bottom cover 143 are the same as in the second embodiment and will not be described again here.

[0122] The second frame 12 and the first frame 11 can be fixedly connected by screws. Specifically, the first base plate 111 is provided with a first fixing connection part 1113, and the second base plate 121 is provided with a second fixing connection part 13. The second fixing connection part 13 is a columnar structure, and the second fixing connection part 13 is connected and fixed to the first fixing connection part 1113. Further, the first fixing connection part 1113 and the second fixing connection part 13 pass through the inside of the heat sink 42 to ensure that the outermost ring of the heat sink 42 is not obstructed, so that the airflow is smoother and the heat dissipation effect is better. Preferably, the first fixing connection part 1113 is a fixing hole, and the second fixing connection part 13 is a fixing post. The fixing post is located on the side of the second base plate 121 facing the first base plate 111 and passes through the heat sink base 421, the circuit board 23 and the multiple heat sinks 422, connecting to the fixing hole. The fixing post can play a role in positioning the heat sink 42 and the circuit board 23. The screw passes through the fixing hole and is threaded to the fixing post to realize the connection and fixation of the first frame 11 and the second frame 12.

[0123] In summary, the charging device provided in the third embodiment of this application includes a mounting bracket, a charging component, and a heat sink. The charging component is mounted on the mounting bracket and connected to the heat sink, with at least a portion of the heat sink exposed to the outside. This embodiment, by designing the charging component to connect to the heat sink and exposing at least a portion of the heat sink to the outside, eliminates the traditional outer casing. This allows the heat sink to directly communicate with the outside of the charging device through an open space, enabling the heat absorbed by the heat sink to be directly dissipated to the outside, greatly improving heat dissipation efficiency and thus enhancing the user's charging and usage experience.

[0124] The above embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of protection of this application. Any non-substantial changes and substitutions made by those skilled in the art based on this application shall fall within the scope of protection claimed by this application.

Claims

1. A charging device, characterized by, The charging device comprises a mounting frame, a charging assembly and a fan assembly, the mounting frame has opposite front and back surfaces, the charging assembly is arranged on one side of the mounting frame close to the front surface, the fan assembly is arranged on the other side of the mounting frame close to the back surface, and the mounting frame is provided with an air inlet close to the back surface.

2. The charging device according to claim 1, characterized in that, The mounting frame is provided with an air inlet communicated with the air outlet, and the air inlet and the air outlet are arranged on different sides of the mounting frame.

3. The charging device according to claim 2, characterized in that, The fan assembly comprises a fan located between the air inlet and the air outlet, the air outlet is located on one side of the fan in the axial direction, and the air inlet is located on one side of the fan in the radial direction.

4. The charging apparatus according to claim 3, characterized by, The fan assembly further comprises a fan cover arranged on the mounting frame, the fan cover is provided with a receiving cavity and an inlet and an outlet communicated with the receiving cavity respectively, the fan is received in the receiving cavity, the inlet is communicated with the air inlet, and the outlet is communicated with the air outlet.

5. The charging apparatus according to claim 4, characterized by, The fan cover comprises a flow guide part, the flow guide part is in an arc shape, and the radial dimension of the flow guide part gradually increases in the direction from the inlet to the outlet.

6. The charging apparatus according to claim 4, characterized by, The fan comprises a fan blade, one side of the fan blade away from the air outlet is flush with one side of the inlet away from the air outlet, or one side of the fan blade away from the air outlet is lower than one side of the inlet away from the air outlet.

7. The charging device according to any one of claims 2 to 6, characterized in that, The charging device further comprises a cooling assembly, the cooling assembly is in thermal conduction connection with the charging assembly and at least partially located between the air inlet and the air outlet.

8. The charging device according to any one of claims 2 to 6, characterized in that, The mounting frame comprises a first frame body, a second frame body opposite to the first frame body, and a connecting column connecting the first frame body and the second frame body, the front surface and the back surface are located on two opposite sides of the first frame body and the second frame body respectively, the charging assembly is arranged on the first frame body, and the fan assembly and the air outlet are arranged on the second frame body.

9. The charging apparatus according to claim 8, characterized by, The first frame body and the second frame body form the air inlet and a heat dissipation channel therebetween, the air inlet surrounds the outer periphery of the heat dissipation channel and is communicated with the air outlet through the heat dissipation channel, the charging device further comprises a cooling assembly in thermal conduction connection with the charging assembly, and the cooling assembly is at least partially located in the heat dissipation channel.

10. The charging apparatus according to claim 9, characterized by, The cooling assembly comprises a refrigeration part and a heat sink, opposite sides of the refrigeration part are in thermal conduction connection with the charging assembly and the heat sink respectively, and the heat sink is at least partially located in the heat dissipation channel.

11. The charging apparatus according to claim 10, characterized by, The heat sink comprises a heat dissipation base in thermal conduction connection with the refrigeration part and a plurality of heat dissipation bodies arranged on one side of the heat dissipation base away from the refrigeration part, and the plurality of heat dissipation bodies are located in the heat dissipation channel and spaced apart from each other.

12. The charging apparatus according to claim 1, characterized by, The mounting frame is provided with a protruding part close to the back surface, the protruding part protrudes in the direction from the front surface to the back surface, and the protruding part is arranged close to the center area of the back surface relative to the air outlet.

13. The charging apparatus according to claim 12, characterized by, The air outlet is arranged on the back surface, or the air outlet is arranged at the connection between the back surface and the protruding part.

14. A charging device, characterized by The first frame, the circuit board and the coil assembly, the coil assembly is connected with the circuit board, the first frame is formed with installation cavity, the first frame is equipped with the first base plate, the first base plate separates the installation cavity into first cavity and second cavity, the coil assembly is equipped in the first cavity, the circuit board is equipped in the second cavity.

15. The charging apparatus according to claim 14, characterized by, The first frame includes a first surrounding edge, the first surrounding edge forms the installation cavity, the first base plate is connected with the first surrounding edge, forming the first cavity and the second cavity arranged along the height direction of the first surrounding edge.

16. The charging apparatus according to claim 14, wherein Also including refrigeration, the refrigeration is electrically connected with the circuit board, the first base plate is equipped with a receiving portion, the refrigeration is equipped in the receiving portion.

17. The charging apparatus according to claim 16, characterized by The first base plate extends towards the second cavity to form a surrounding wall, the surrounding wall is an open structure at both ends, the receiving portion is formed in the surrounding wall and communicates with the first cavity and the second cavity.

18. The charging apparatus according to claim 17, characterized by, The circuit board is provided with an avoiding hole, the avoiding hole is sleeved outside the surrounding wall.

19. The charging apparatus of claim 16, wherein, Also including a heat sink, the heat sink is located in the second cavity and is located on the side of the circuit board away from the first base plate; the refrigeration includes oppositely arranged cold end and hot end, the cold end is connected to the coil assembly, and the hot end is connected to the heat sink.

20. The charging apparatus according to claim 19, wherein Also including a fan assembly, the fan assembly includes a second frame and a fan electrically connected to the circuit board; the fan assembly is arranged on the side of the heat sink away from the refrigeration, and / or the second frame is fixedly connected with the first frame and is arranged in a spaced manner.

21. The charging apparatus according to claim 20, wherein Also including a bracket, the side of the second frame away from the first frame is provided with a second receiving position, and the bracket is rotatably arranged in the second receiving position.

22. The charging apparatus of claim 14, wherein, Also including a panel, the panel is arranged on the side of the coil assembly away from the first base plate, the panel is connected with the first frame, and the panel is connected with the coil assembly.

23. A charging device, comprising: Including a mounting frame, a charging module, a heat sink and a refrigeration device, the charging module is arranged on the mounting frame, the charging module is connected with the heat sink, the mounting frame includes a first frame and a second frame, the first frame and the second frame are arranged in a spaced manner and form an open space, the heat sink is arranged in the open space, and the heat sink is at least partially exposed to the outside; the first frame includes a first base plate, the refrigeration device is arranged on the side of the first base plate close to the open space, and the heat sink includes a heat dissipation base plate and a plurality of heat dissipation bodies, and the plurality of heat dissipation bodies are connected to the side of the heat dissipation base plate away from the refrigeration device.

24. The charging apparatus according to claim 23, characterized by, The second frame includes a second base plate, the open space is formed between the first base plate and the second base plate, the charging module includes a circuit board, the circuit board is arranged on the side of the first base plate close to the open space, and the heat sink is connected with the circuit board.

25. The charging apparatus according to claim 24, wherein, One end of the heat dissipation base plate is connected with the circuit board, and the other end is provided with a plurality of heat dissipation bodies, the plurality of heat dissipation bodies are arranged in a spaced manner, and at least part of the heat dissipation bodies are connected with the second base plate.

26. The charging apparatus according to claim 25, wherein The charger further comprises a fan assembly, a plurality of the heat sinks are arranged along the periphery of the heat dissipation substrate and enclosed to form a mounting space, and the fan assembly is mounted in the mounting space.

27. The charging apparatus according to claim 26, wherein, A heat dissipation gap is formed between the plurality of heat sinks, the heat dissipation gap forms a first air vent of the fan assembly, and the second substrate is provided with a second air vent corresponding to the fan assembly; the first air vent is an air inlet, and the second air vent is an air outlet; or, the first air vent is an air outlet, and the second air vent is an air inlet.

28. The charging apparatus of claim 24, wherein, The first substrate is provided with a first fixed connection part, the second substrate is provided with a second fixed connection part, the second fixed connection part is connected and fixed with the first fixed connection part, and the second fixed connection part is arranged in the heat sink.

29. The charging apparatus according to any one of claims 24-28, wherein, The charging module further comprises a charging coil electrically connected with the circuit board, the refrigerator is arranged between the charging coil and the heat sink, the circuit board is arranged between the charging coil and the heat sink, a avoiding hole is arranged in the middle of the circuit board, and the refrigerator is embedded in the avoiding hole.

30. The charging apparatus of claim 25, wherein, The plurality of heat sinks are equidistantly arranged, and / or the plurality of heat sinks are arranged along the periphery of the heat dissipation substrate and arranged in multiple layers from the periphery of the heat dissipation substrate to the center.

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