Heat exchange unit and substrate processing apparatus having same

Abstract

One embodiment of the present invention provides a heat exchange unit and a substrate processing apparatus having same, the heat exchange unit comprising: a heating casing having a cleaning fluid flow path formed therein and in which a cleaning fluid introduced through a cleaning fluid inlet is heated while moving along the cleaning fluid flow path, and then discharged through a cleaning fluid outlet; a heater unit which is coupled to the outer surface of the heating casing and transfers heat to the heating casing to heat the cleaning fluid; and a heat insulation unit surrounding the heating casing and the heater unit, wherein the cleaning fluid flow path is formed to have a flow path shape meandering in the width direction of the heating casing.

Description

Heat exchanger and substrate processing device having the same

[0001] The present invention relates to a heat exchange unit and a substrate processing device having the same, and more particularly, to a heat exchange unit and a substrate processing device having the same, which is configured to heat the chemical liquid to a required temperature by selectively operating a heating mode according to the type of the chemical liquid, and to supply the chemical liquid contained in a chemical liquid tank to a process processing unit through a compressible gas.

[0002] Typically, during the substrate manufacturing process, a cleaning process is essential to increase substrate yield. This process removes foreign substances from the substrate surface. Specifically, after processes such as the deposition of insulating films and metal materials, etching, and the application of photoresists, various impurities may remain on the substrate surface. These impurities are a critical factor influencing substrate performance and yield, making the substrate cleaning process crucial.

[0003] This type of substrate cleaning operation involves spraying a chemical solution from the top and bottom of the substrate toward the center while the substrate is rotating. In other words, the chemical solution sprayed onto the substrate moves from the center to the edge of the substrate due to the centrifugal force of the rotating substrate, allowing the entire upper and lower surfaces of the substrate to be cleaned.

[0004] In these substrate cleaning operations, the temperature, concentration, and flow rate of the cleaning solution must be precisely controlled. Precise flow rate control is particularly crucial in miniaturized semiconductor processes.

[0005] Figure 1 is a schematic illustration of a conventional substrate processing device viewed from the front and the plane.

[0006] Referring to Fig. 1, a conventional substrate processing device (10) is provided with a chemical solution supply unit (20) equipped with a plurality of chemical solution tanks for storing chemical solutions, and a process processing unit (30) for cleaning a substrate using the chemical solution supplied from the chemical solution supply unit (20).

[0007] Semiconductor cleanrooms have a high operating cost per unit area, so compact equipment, i.e., equipment with a minimal footprint, is required. However, the chemical supply unit (20) provided in a conventional substrate processing device (10) takes up a lot of space, making it difficult to place it within a cleanroom. Therefore, it tends to be installed separately in a server fab, a location separate from the cleanroom.

[0008] And the chemical supply unit (20) supplies the chemical to the process treatment unit (30), and while maintaining the required concentration and temperature of the chemical, circulates the chemical at a constant pressure through a pump, a pressure regulator, etc., and supplies the required chemical to each process treatment unit (30). And the chemical remaining after being used in the process treatment unit (30) is returned to the chemical supply unit (20) through a circulation line.

[0009] However, since the conventional substrate treatment device (10) has the process treatment unit (30) and the chemical supply unit (20) arranged in separate locations, when reusing the chemical used in the process treatment unit (30), there is an inconvenience in that the chemical must be recovered to the chemical supply unit (20) through a pump due to the difference in water head or recovered to a separate auxiliary tank.

[0010] In addition, the conventional substrate processing device (10) requires two or more chemical liquid tanks for continuous use, and requires a unit operation that requires prior preparation by filling the chemical liquid in the chemical liquid tank.

[0011] In a conventional substrate processing device (10), as the number of process chambers provided in the process processing unit (30) increases, the capacity of the chemical tank must increase, a separate circulation pump must be provided, and the capacity of the chemical heating unit for heating the chemical must also increase. In addition, since the process processing unit (30) and the chemical supply unit (20) are arranged in separate locations, there is a problem that the length of the supply piping line and the recovery piping line become long. In the structure of the conventional substrate processing device (10), there is a problem that the overall cost of the substrate processing device (10) increases, and the structure of the device also becomes large and complicated.

[0012] In addition, since the circulation pump equipped in the conventional substrate processing device (10) generally uses a bellows pump, pulsation may occur during operation, and to prevent this, a damper must be additionally installed. This causes the overall size of the device to increase, and the air exhaust noise generated during the operation of the bellows pump is considerably high, which may cause fatigue to the operator.

[0013] In addition, since the conventional substrate processing device (10) has a large distance between the chemical supply unit (20) and the process processing unit (30), the temperature of the chemical may drop during the process of supplying the chemical from the chemical supply unit (20) to the process processing unit (30). Accordingly, there is a problem in that an insulating material must be used to maintain the temperature of the chemical supplied to the process processing unit (30) or the chemical must be supplied after being heated by the amount of the lowered temperature of the chemical.

[0014] Meanwhile, the heating temperature conditions of the chemical liquid must vary depending on the type of chemical liquid sprayed onto the substrate. Accordingly, a conventional substrate processing device (10) is equipped with a chemical liquid heating unit that heats the chemical liquid that must be heated to a low temperature, and a chemical liquid heating unit that heats the chemical liquid that must be heated to a high temperature, respectively, to control the temperature of the chemical liquid sprayed onto the substrate.

[0015] For example, in the case of a medicinal liquid that is heated to a high temperature of 100℃ or higher, the medicinal liquid is heated through a heating wire that generates heat by an electric current. However, in the case of a medicinal liquid heating unit that heats the medicinal liquid through a heating wire, when heating the medicinal liquid to a low temperature of 20 to 30℃, the medicinal liquid heating unit has difficulty in precise temperature control because the temperature is controlled by a repeated on / off disconnection method.

[0016] Therefore, there is a problem that a liquid heating unit equipped with a heating wire for heating the liquid to a high temperature and a liquid heating unit such as a double boiler for heating the liquid to a low temperature must be provided.

[0017] In this way, since the substrate processing device (10) must be equipped with a chemical heating unit that heats the chemical solution to a high temperature and a chemical heating unit that heats the chemical solution to a low temperature, there is a problem that the configuration of the substrate processing device is complicated and the size of the substrate processing device becomes large.

[0018] Therefore, various research and development are required for a heat exchanger having a compact structure that can simplify the structure of the device and minimize the footprint, and a substrate processing device having the heat exchanger.

[0019] The technical problem of the present invention to solve the above problem is to provide a heat exchange unit and a substrate processing device having the same, which heats the chemical liquid to a required temperature by selectively operating a heating mode according to the type of chemical liquid and supplies the chemical liquid contained in the chemical liquid tank to a process processing unit through a compressible gas.

[0020] In order to achieve the above technical task, one embodiment of the present invention provides a heat exchanger comprising: a heating casing having a cleaning fluid path formed therein, in which cleaning fluid introduced through a cleaning fluid inlet is heated in the process of moving along the cleaning fluid path and then discharged through a cleaning fluid discharge port; a heater unit coupled to an outer surface of the heating casing and transferring heat to the heating casing to heat the cleaning fluid; and an insulating unit surrounding the heating casing and the heater unit, wherein the cleaning fluid path is formed in the form of a meandering path in the width direction of the heating casing.

[0021] In one embodiment of the present invention, the heating casing includes a first casing having a first coupling base and a first flow path forming portion protruding from the first coupling base and having first peaks and first valleys alternately formed along a width direction; and a second casing forming a pair with the first casing and having a second coupling base and a second flow path forming portion protruding from the second coupling base and having second peaks and second valleys alternately formed along a width direction; and when the first casing and the second casing are coupled, a second peak formed in the second flow path forming portion is inserted into the first valley formed in the first flow path forming portion, and a cleaning fluid flow path spaced apart from the first flow path forming portion and the second flow path forming portion can be formed.

[0022] In one embodiment of the present invention, the cross sections of the peaks and valleys alternately formed along the width direction of the first flow path forming portion and the second flow path forming portion are formed in a trapezoidal shape, and the gap between the first valley and the second valley forming the cleaning fluid flow path and between the first valley and the second valley may be formed in a range of 0.1 to 3 mm.

[0023] In one embodiment of the present invention, the inner surfaces of the first casing and the second casing facing each other are coated with a fluororesin to prevent corrosion caused by a cleaning fluid, and the first casing and the second casing may be made of aluminum or stainless steel.

[0024] In one embodiment of the present invention, the heater unit is configured to selectively heat the heating casing through operation of a first heating mode and a second heating mode, in the first heating mode, a heat transfer fluid supplied into the heater unit heats the heating casing, and in the second heating mode, a heating wire provided in the heater unit heats the heating casing, and the heater unit may be configured to selectively operate either the first heating mode or the second heating mode depending on the type of cleaning fluid sprayed onto the substrate.

[0025] One embodiment of the present invention provides a substrate processing device including: a chemical supply unit having a chemical tank containing a chemical for cleaning a substrate; a process treatment unit having a process chamber for cleaning a substrate using the chemical supplied from the chemical supply unit; and a chemical delivery unit having a chemical supply line for supplying the chemical from the chemical supply unit to the process treatment unit and a chemical recovery line for recovering or draining the chemical from the process treatment unit; wherein a heat exchange unit according to claim 1 is provided on the chemical supply line to heat the chemical supplied to the process treatment unit to a required temperature, and a compressible gas is supplied into the chemical tank, and the chemical supply unit having at least one pair of the chemical tanks supplies the chemical to the process treatment unit.

[0026] In one embodiment of the present invention, the chemical supply unit and the process treatment unit are provided in a cleaning chamber having an upper space and a lower space divided into upper and lower parts, the process treatment unit is disposed in the upper space, and the chemical supply unit is disposed in the lower space, so that when the chemical is recovered from the process treatment unit to the chemical supply unit, gravity recovery can be enabled.

[0027] In one embodiment of the present invention, the chemical supply unit includes: a first chemical tank containing the chemical; a second chemical tank paired with the first chemical tank; a first pressurizing valve coupled to the first chemical tank and supplying a compressible gas into the first chemical tank; a first vent valve coupled to the first chemical tank and controlling the pressure inside the first chemical tank; a second pressurizing valve coupled to the second chemical tank and supplying a compressible gas into the second chemical tank; and a second vent valve coupled to the second chemical tank and controlling the pressure inside the second chemical tank; wherein, when the compressible gas is supplied to the first chemical tank and the chemical is supplied from the first chemical tank to the process treatment unit, the second chemical tank may be configured to maintain an atmospheric pressure state.

[0028] In one embodiment of the present invention, the chemical delivery unit includes: a chemical supply line for supplying the chemical to an upper nozzle and a lower nozzle, which spray the chemical from the chemical supply unit to a substrate fixedly installed in the process chamber; a filter unit provided on the chemical supply line and which removes particles present in the chemical supplied from the chemical tank to the process treatment unit; a flow control unit having a first flow control unit for controlling the supply amount of the chemical supplied to the upper nozzle via the filter unit, and a second flow control unit for controlling the supply amount of the chemical supplied to the lower nozzle; a heat exchange unit having a first heat exchange unit for heating the chemical supplied through the first flow control unit to a required temperature, and a second heat exchange unit for heating the chemical supplied through the second flow control unit to a required temperature; And the chemical recovery line that guides the chemical recovered from the process treatment unit to the chemical tank; and the chemical exceeding the required chemical supply amount supplied to the flow control unit can be recovered to the chemical tank through the chemical recovery unit.

[0029] In one embodiment of the present invention, the chemical liquid supply line may further include an auxiliary heater unit for additionally heating the chemical liquid discharged from the heat exchange unit; a buffer tank provided on the chemical liquid recovery line; and a pretreatment heater unit provided in the chemical liquid tank and for heating the chemical liquid contained in the chemical liquid tank.

[0030] The effects of the substrate processing device according to the present invention described above are as follows.

[0031] According to the present invention, a substrate processing device is equipped with a heat exchanger. This heat exchanger is positioned on the front side of the nozzle that sprays the chemical solution into the process processing unit, thereby eliminating the need for a waiting time for the chemical solution to rise in temperature and minimizing the capacity of the chemical solution tank. Consequently, the substrate processing device can be configured compactly.

[0032] According to the present invention, the heater unit provided in the heat exchange unit can more effectively increase the heating temperature of the cleaning fluid through the operation of the first heating mode and the second heating mode. For example, in the first heating mode, the heating casing is heated through the heat transfer fluid supplied into the interior of the heater unit. That is, the heat transfer fluid heated to a certain temperature is filled into the interior of the heater unit and heats the heating casing to a required temperature. In the first heating mode, the cleaning fluid can be precisely heated to a required temperature within a low temperature range of 10 to 70°C.

[0033] In the second heating mode, the heating casing is heated through the heat generation of the heating wires provided inside the heater unit. In this second heating mode, the temperature can be controlled within a temperature range of 25 to 250°C, and in particular, cleaning fluids that must be heated to a high temperature of 100°C or higher can be effectively heated.

[0034] In this way, the heat exchanger capable of operating in the first heating mode or the second heating mode can selectively operate the first heating mode or the second heating mode depending on the type of cleaning fluid and effectively heat the cleaning fluid.

[0035] This type of heat exchanger, as a single device, can be heated by a heat transfer fluid or by a heating wire, thereby minimizing the device configuration of the heat exchanger. This also simplifies the structure of the substrate processing device.

[0036] According to the present invention, a substrate processing device is provided with a chemical solution supply unit located below the process processing unit. This minimizes the installation space of the substrate processing device, enabling installation with a minimal footprint.

[0037] This type of substrate processing device can simplify its structure due to the short distance between the chemical supply line and chemical recovery line connecting the process processing unit and chemical supply unit. Furthermore, the short chemical supply line prevents heat loss from the chemical moving along it, and the chemical recovered through the chemical supply unit can be recovered by gravity without a separate pump.

[0038] According to the present invention, the substrate processing device supplies the chemical from the chemical supply unit to the process processing unit by supplying a compressible gas into the interior of the chemical tank provided in the chemical supply unit. That is, unlike the conventional method, when supplying the chemical from the chemical supply unit to the process processing unit, a separate circulation pump is not required, thereby simplifying the structure.

[0039] Furthermore, since the substrate processing device according to the present invention does not require a circulation pump, there is no need to install a damper, a pressure regulator valve, or the like, and exhaust noise generated during the operation of the circulation pump is also not generated. Accordingly, the substrate processing device according to the present invention can be configured compactly.

[0040] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0041] Figure 1 is a schematic illustration of a conventional substrate processing device viewed from the front and the plane.

[0042] Figure 2 is a schematic illustration of a substrate processing device according to an embodiment of the present invention viewed from a plan view and a front view.

[0043] Figure 3 is a configuration diagram of a substrate processing device according to one embodiment of the present invention.

[0044] Figure 4 is a perspective view of a heat exchange unit according to the first embodiment of the present invention.

[0045] Figure 5 is an exploded perspective view of a heat exchanger according to the first embodiment of the present invention.

[0046] FIG. 6 is an exemplary diagram showing a heat exchanger according to the first embodiment of the present invention in cross-sectional form, showing part II of FIG. 4.

[0047] Fig. 7 is an exemplary diagram showing a heat exchanger according to a second embodiment of the present invention in cross-sectional form, part II of Fig. 4.

[0048] FIG. 8 is a configuration diagram of a substrate processing device equipped with an auxiliary heater section, a buffer tank, and a pretreatment heater section according to another embodiment of the present invention.

[0049] FIG. 9 is an exemplary diagram showing a substrate processing device according to another embodiment of the present invention.

[0050] Fig. 10 is a perspective view of a heat exchange unit according to a third embodiment of the present invention.

[0051] Fig. 11 is an exemplary diagram showing a heat exchanger according to a third embodiment of the present invention in cross-sectional form along section II-II of Fig. 10.

[0052] Fig. 12 is an exemplary diagram showing a heat exchanger according to the fourth embodiment of the present invention in cross-sectional form along section II-II of Fig. 10.

[0053] Hereinafter, the present invention will be described with reference to the attached drawings. However, the present invention can be implemented in various different forms and is therefore not limited to the embodiments described herein. In the drawings, irrelevant parts have been omitted for clarity of description, and similar parts have been designated with similar reference numerals throughout the specification.

[0054] Throughout the specification, when a part is said to be "connected" to another part, this includes not only "directly connected" but also "indirectly connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather implies that the other components may be included, unless otherwise specifically stated.

[0055] In the present invention, upper and lower parts mean being located above or below the target member, but do not necessarily mean being located above or below with respect to the direction of gravity.

[0056] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0057] FIG. 2 is a schematic illustration of a substrate processing device according to an embodiment of the present invention viewed from a plan view and a front view, FIG. 3 is a configuration diagram of a substrate processing device according to an embodiment of the present invention, FIG. 4 is a perspective view of a heat exchange unit according to a first embodiment of the present invention, FIG. 5 is an exploded perspective view of a heat exchange unit according to a first embodiment of the present invention, and FIG. 6 is an illustration of a cross-sectional view of part II of FIG. 4 of a heat exchange unit according to the first embodiment of the present invention.

[0058] As shown in FIGS. 2 to 6, the substrate processing device (1000) may include a chemical supply unit (100), a process processing unit (200), and a chemical delivery unit (300).

[0059] Such a chemical supply unit (100) and process treatment unit (200) may be provided within a cleaning chamber divided into an upper space (S1) and a lower space (S2). That is, the process treatment unit (200) may be provided in the upper space (S1) located at the upper portion of the cleaning chamber, and the chemical supply unit (100) may be provided in the lower space (S2) located at the lower portion of the cleaning chamber.

[0060] In this way, the liquid supply unit (100) and the process treatment unit (200) are arranged vertically, thereby minimizing the installation space of the substrate treatment device (1000). In other words, installation with a minimized footprint is possible.

[0061] In addition, in a structure in which the chemical supply unit (100) and the process treatment unit (200) are arranged vertically, the distance between the chemical supply unit (100) and the process treatment unit (200) is short, so the structure of the chemical delivery unit (300) that delivers the chemical can be simplified, and the movement distance of the chemical can be shortened.

[0062] Accordingly, for example, heat loss of the chemical solution can be prevented during the process of supplying the chemical solution to the process treatment unit (200) through the chemical solution delivery unit (300). In addition, during the process of recovering the chemical solution from the process treatment unit (200), the chemical solution can be recovered by gravity without using a separate pump.

[0063] In one embodiment of the present invention, a configuration equipped with one process chamber (210) and two chemical liquid tanks will be described as an example. For convenience of explanation, the two chemical liquid tanks will be described separately as a first chemical liquid tank (111) and a second chemical liquid tank (112).

[0064] The first chemical solution tank (111) and the second chemical solution tank (112) provided in the chemical solution supply unit (100) form a pair and are configured to be used continuously in the substrate processing device (1000). For example, when the first chemical solution tank (111) supplies the chemical solution to the process chamber (210) provided in the process processing unit (200), the second chemical solution tank (112) may be configured to receive the chemical solution recovered from the process chamber (210). Conversely, when the second chemical solution tank (112) supplies the chemical solution to the process chamber (210) provided in the process processing unit (200), the first chemical solution tank (111) may be configured to receive the chemical solution recovered from the process chamber (210).

[0065] In the present invention, a first chemical solution tank (111) supplies the chemical solution to the process treatment unit (200), and a second chemical solution tank (112) stores the chemical solution recovered from the process treatment unit (200) will be described as an example. In this way, when a compressible gas is supplied into the interior of the first chemical solution tank (111) and the first chemical solution tank (111) supplies the chemical solution, the second chemical solution tank (112) is configured to recover the chemical solution from the process treatment unit (200) while maintaining an atmospheric pressure state.

[0066] This liquid supply unit (100) may include a first liquid tank (111), a second liquid tank (112), a first pressure valve (111-1), a first vent valve (111-2), a first relief valve (111-3), a second pressure valve (112-1), a second vent valve (112-2), a second relief valve (112-3), and a drain valve (120).

[0067] Here, the first liquid tank (111) can accommodate a liquid for cleaning the substrate (W).

[0068] A first pressurizing valve (111-1) is coupled to the first chemical liquid tank (111). When the first pressurizing valve (111-1) is opened, a compressible gas is supplied into the interior of the first chemical liquid tank (111), and the chemical liquid contained in the first chemical liquid tank (111) can be supplied to the process treatment unit (200) through the chemical liquid supply line (310). That is, when the compressible gas is supplied into the interior of the first chemical liquid tank (111) while the first pressurizing valve (111-1) is opened, the internal pressure of the first chemical liquid tank (111) increases, and the chemical liquid, which is an incompressible fluid contained in the first chemical liquid tank (111), can be supplied to the process treatment unit (200) along the chemical liquid supply line (310) by the pressurizing force of the compressible gas.

[0069] When supplying a chemical solution through this type of compressible gas, the pulsation that occurs when supplying a chemical solution through a conventional pump is eliminated. Consequently, the momentary flow rate hunting that occurs with conventional pumps is eliminated, and separate components such as pressure regulators to counteract this momentary flow rate hunting are no longer required. Consequently, piping structures can be simplified.

[0070] In this way, the compressible gas supplied into the interior of the first chemical liquid tank (111) through the first pressurizing valve (111-1) may be, for example, nitrogen. Here, the compressible gas supplied into the interior of the first chemical liquid tank (111) is not necessarily limited to nitrogen, and any other compressible gas other than nitrogen may be used as long as it can effectively supply the chemical liquid contained in the interior of the first chemical liquid tank (111) to the process treatment unit (200).

[0071] And the first vent valve (111-2) is connected to the first chemical liquid tank (111). This first vent valve (111-2) is configured to control the internal pressure. For example, when the first chemical liquid tank (111) is maintained at atmospheric pressure to receive the chemical liquid recovered from the process treatment unit (200), the first vent valve (111-2) can be maintained in an open state.

[0072] And the first relief valve (111-3) is connected to the first chemical tank (111). This first relief valve (111-3) maintains the internal pressure of the first chemical tank (111) at a certain pressure. In other words, when the internal pressure of the first chemical tank (111) exceeds a certain pressure range, the first relief valve (111-3) is temporarily opened and maintains the internal pressure of the first chemical tank (111) at a certain pressure.

[0073] And when the drain valve (120) discharges the chemical solution recovered from the process treatment unit (200) to the outside instead of supplying it to the second chemical solution tank (112), the chemical solution can be discharged to the outside while the drain valve (120) is open.

[0074] And the second liquid tank (112) has a configuration corresponding to the first liquid tank (111), and the second liquid tank (112) may be equipped with a second pressure valve (112-1), a second vent valve (112-2), and a second relief valve (112-3). Since the second pressure valve (112-1), the second vent valve (112-2), and the second relief valve (112-3) have configurations corresponding to the first pressure valve (111-1), the first vent valve (111-2), and the first relief valve (111-3) mentioned above, their specific details will be omitted.

[0075] Meanwhile, the liquid delivery unit (300) may include a liquid supply line (310), a filter unit (320), a flow control unit (330), a liquid recovery line (340), and a heat exchange unit (350).

[0076] Here, the chemical supply line (310) is configured to supply the chemical to the upper nozzle (N1) and the lower nozzle (N2) that spray the chemical. Accordingly, the substrate (W) fixedly mounted in the process chamber (210) can be cleaned.

[0077] A filter unit (320), a flow control unit (330), and a heat exchange unit (350) may be provided on the liquid supply line (310).

[0078] And the filter unit (320) is provided between the chemical solution supply unit (100) and the flow control unit (330). This filter unit (320) is configured to remove particles present in the chemical solution during the process of supplying the chemical solution from the chemical solution tank to the flow control unit (330).

[0079] And the flow control unit (330) is configured to control the flow rate of the filtered liquid introduced through the filter unit (320). This flow control unit (330) may include a first flow control unit (331) and a second flow control unit (332).

[0080] Here, the first flow control unit (331) may be configured to control the supply amount of the chemical liquid supplied to the upper nozzle (N1), and the second flow control unit (332) may be configured to control the supply amount of the chemical liquid supplied to the lower nozzle (N2).

[0081] In this way, the flow rate of the chemical liquid supplied to the upper nozzle (N1) and the lower nozzle (N2) through the first flow rate control unit (331) and the second flow rate control unit (332) can be selectively controlled.

[0082] Here, the liquid recovery unit (R) is configured to recover the excess liquid when the liquid supplied to the flow control unit (330) exceeds the required liquid supply amount. In this way, the liquid recovered through the liquid recovery unit (R) can be recovered into the second liquid tank (112).

[0083] And the heat exchange unit (350) is provided on the chemical liquid supply line (310) to heat the chemical liquid supplied to the process treatment unit (200) to the required temperature.

[0084] In this way, the heat exchange unit (350) provided in the substrate processing device (1000) according to one embodiment of the present invention is described as heating the chemical solution supplied to the heat exchange unit (350) from the first chemical solution tank (111) or the second chemical solution tank (112) through the supply of compressible gas, but the heat exchange unit (350) is not limited to heating the chemical solution, and is configured to heat various other gases (e.g., IPA, nitrogen, etc.) to a required temperature. In other words, the heat exchange unit (350) can heat various cleaning fluids, including liquids and gases, to a required temperature.

[0085] In the present invention, the heat exchange unit (350) will be described as an example of heating a liquid.

[0086] This heat exchange unit (350) may include a first heat exchange unit (360) and a second heat exchange unit (370).

[0087] Here, the first heat exchange unit (360) is configured to heat the chemical liquid introduced through the first flow control unit (331) to a required temperature. And the second heat exchange unit (370) is configured to heat the chemical liquid introduced through the second flow control unit (332) to a required temperature.

[0088] The first heat exchange unit (360) and the second heat exchange unit (370) can selectively control the temperature of the liquid. The first heat exchange unit (360) and the second heat exchange unit (370) have the same configuration, and the configuration will be specifically described using the first heat exchange unit (360) as an example.

[0089] This first heat exchange unit (360) may include a heating casing (380), a heater section (391), and an insulation section (392).

[0090] A heating casing (380) such as this is provided with a cleaning fluid inlet (381) and a cleaning fluid outlet (382). Here, the chemical liquid passing through the flow control unit (330) can be introduced into the heating casing (380) through the cleaning fluid inlet (381). In addition, the chemical liquid that has undergone a heating treatment within the heating casing (380) can be supplied to the upper nozzle (N1) through the cleaning fluid outlet (382).

[0091] This heating casing (380) is formed by combining the first casing (383) and the second casing (384), and forms a cleaning fluid path (P) through which the liquid moves inside. This cleaning fluid path (P) can be formed in a meandering path shape like a snake crawling in the width direction of the heating casing (380).

[0092] Here, the first casing (383) includes a first coupling base (383-1) and a first euro forming portion (383-2).

[0093] This first coupling base (383-1) is configured to support the first euro forming portion (383-2), and the first coupling base (383-1) and the first euro forming portion (383-2) are configured to have a length corresponding to the length of the first heat exchange unit (360).

[0094] Here, the first euro forming portion (383-2) is formed to protrude from the first joining base (383-1), and the first mountain portion (383-3) and the first valley portion (383-4) can be alternately arranged along the width direction.

[0095] At this time, the cross-section of the first mountain portion (383-3) and the first valley portion (383-4) formed by connecting in the width direction of the first euro forming portion (383-2) may be formed in a trapezoidal shape, for example. Here, the first mountain portion (383-3) and the first valley portion (383-4) forming the trapezoid may be formed to form an inclination angle of 5° or more with respect to an imaginary horizontal line, for example.

[0096] This is to increase the contact area between the first flow path forming part (383-2) and the chemical liquid during the process in which the chemical liquid introduced into the cleaning fluid inlet (381) is discharged into the cleaning fluid outlet (382), thereby enabling the chemical liquid to be heated more effectively.

[0097] Here, the first ridge (383-3) and the first groove (383-4) do not necessarily have to be formed in a trapezoidal shape, and may be formed in various shapes as long as they do not obstruct the flow of the liquid and allow effective heat transfer between the liquid and the heating casing (380).

[0098] And the second casing (384) is configured to form a pair with the first casing (383), and the second casing (384) may be provided with a second coupling base (384-1) and a second flow path forming portion (384-2). In the second flow path forming portion (384-2), a second mountain portion (384-3) and a second valley portion (384-4) corresponding to the first flow path forming portion (383-2) may be alternately arranged along the width direction of the second flow path forming portion (384-2).

[0099] When the first casing (383) and the second casing (384) are combined in this manner, the second mountain portion (384-3) formed in the second mountain portion (384-2) is inserted into the first valley portion (383-4) formed in the first flow path forming portion (383-2), and the second valley portion (384-4) formed in the second mountain portion (383-3) formed in the first flow path forming portion (383-2) is inserted. In this way, when the first casing (383) and the second casing (384) are combined in this manner, the first flow path forming portion (383-2) and the second flow path forming portion (384-2) are spaced apart from each other at a predetermined interval to form a cleaning fluid flow path (P) through which the liquid moves. That is, a cleaning fluid path (P) spaced apart at a predetermined interval is formed between the first bone part (383-4) and the second mountain part (384-3) and between the first mountain part (383-3) and the second bone part (384-4).

[0100] Here, it is preferable that the gap between the first valley portion (383-4) and the second peak portion (384-3) forming the cleaning fluid path (P), and between the first peak portion (383-3) and the second valley portion (384-4) be 0.1 to 3 mm. This is because, when the gap between the first valley portion (383-4) and the second peak portion (384-3) forming the cleaning fluid path (P), and between the first peak portion (383-3) and the second valley portion (384-4) is less than 0.1 mm, the heat transfer efficiency is high, but there is a problem that the movement of the chemical liquid is not smooth, and when it exceeds 3 mm, there is no problem with the movement of the chemical liquid, but there is a problem that the heat transfer efficiency of the chemical liquid is somewhat reduced.

[0101] Therefore, it is preferable that the gap between the first groove (383-4) and the second mountain (384-3) forming the cleaning fluid path (P) and between the first mountain (383-3) and the second valley (384-4) be 0.1 to 3 mm.

[0102] The inner surfaces of the first casing (383) and the second casing (384) that face each other and form the cleaning fluid path (P) through which the chemical liquid moves may be coated. This is to prevent corrosion of the inner surfaces of the first casing (383) and the second casing (384) due to the chemical liquid moving in the cleaning fluid path (P). For example, the inner surfaces of the first casing (383) and the second casing (384) may be coated with a fluororesin series material such as Teflon that has excellent chemical resistance and heat resistance. Here, the material to be coated on the inner surfaces of the first casing (383) and the second casing (384) is not necessarily limited to the fluororesin series, and various coating materials may be coated as long as they have excellent chemical resistance and heat resistance.

[0103] In addition, the first casing (383) and the second casing (384) are preferably made of aluminum or stainless steel, which are lightweight, strong, and have high thermal conductivity. The first casing (383) and the second casing (384) are not necessarily limited to aluminum or stainless steel, and may be made of various other materials.

[0104] Meanwhile, the heater unit (391) is connected to each side of the heating casing (380) to heat the heating casing (380). In this way, the heater unit (391) indirectly heats the chemical liquid guided to the cleaning fluid path (P) through the heating casing (380).

[0105] Such a heater unit (391) may be provided as a single unit or may be provided in a form in which multiple units are connected. For example, in the case of a heater unit (391) provided in a form in which multiple units are connected, the temperature of each heater unit (391) may be individually controlled.

[0106] This heater unit (391) is equipped with a temperature sensor (393), so that the temperature of the heater unit (391) can be detected in real time, and the temperature of the heater unit (391) can be selectively controlled.

[0107] Meanwhile, the insulation part (392) is formed to completely surround the heating casing (380) and the heater part (391). This insulation part (392) prevents the heating casing (380) and the heater part (391) from losing heat due to the external environment by blocking heat from the outside.

[0108] In this way, the liquid heated to the required temperature through the heat exchanger (350) is supplied to the upper nozzle (N1) and the lower nozzle (N2) to clean the substrate (W).

[0109] And the chemical solution recovered from the process treatment unit (200) may be supplied to the second chemical solution tank (112) through the chemical solution recovery line (340) or may be discharged to the outside through the drain valve (120). This chemical solution recovery line (340) enables gravity recovery of the chemical solution as the process treatment unit (200) and the chemical solution supply unit (100) are arranged above and below.

[0110] FIG. 7 is an exemplary diagram showing a heat exchanger according to a second embodiment of the present invention in cross-sectional form in part II of FIG. 4. The heat exchanger according to the second embodiment differs only in the configuration of the heater part (391') from the heat exchanger according to the first embodiment.

[0111] Referring to Fig. 7, the heater unit (391') heats the chemical liquid to a required heating temperature by operating the first heating mode and the second heating mode. That is, the heater unit (391') operates either the first heating mode or the second heating mode depending on the required heating temperature of the chemical liquid, thereby more effectively heating the temperature of the chemical liquid sprayed onto the substrate (W).

[0112] Here, the first heating mode is configured to heat the heater unit (391') by supplying a heat transfer fluid (not shown) to the filling space (396) formed inside the heater unit (391'). That is, the heat transfer fluid preheated to the required temperature can be supplied into the heater unit (391') through the heat transfer fluid inlet (394) provided on one side of the heater unit (391') to heat the heater unit (391') to the required temperature. This heat transfer fluid, while filled inside the heater unit (391'), transfers the heat of the heat transfer fluid heated to a predetermined temperature to the heating casing (380).

[0113] In this first heating mode, while the inside of the heater unit (391') is filled with a heat transfer fluid, the heat transfer fluid is supplied to the heat transfer fluid inlet (394) and discharged to the heat transfer fluid outlet (395). That is, in the first heating mode, the heat transfer fluid heated to a predetermined temperature is continuously supplied to the inside of the heater unit (391'), and the temperature of the heater unit (391') is continuously maintained at the required temperature without dropping.

[0114] Here, the heat transfer fluid that heats the heater unit (391') may be water, for example, and the heat transfer fluid may also be a fluid other than water.

[0115] This first heating mode is preferably used when heating a chemical liquid to a required temperature within a low temperature range of 10 to 70°C. For example, when heating a hydrogen fluoride (HF) chemical liquid to 23°C, the first heating mode can continuously maintain the required low temperature without any deviation in the heating temperature, and heat can be transferred to the heating casing (380).

[0116] In contrast, it is possible to heat, for example, a hydrogen fluoride solution to 23°C through a second heating mode that heats the solution to a high temperature, but there is a problem in that the second heating mode cannot precisely and continuously maintain the low temperature of 23°C.

[0117] In other words, since the switch that supplies current to the heating wire (397) equipped in the second heating mode heats the heater unit (391') through repeated on / off operations, the temperature range of the heater unit (391') can be formed between 22 and 24°C during the repeated on / off operation of the switch. That is, when the temperature of the heater unit (391') is 24°C, the switch is switched to the off state and the heating of the heating wire (397) is stopped, and when the temperature of the heater unit (391') is 22°C, the switch is switched to the on state and the heating of the heating wire (397) occurs, and the on / off operation of the switch is repeatedly performed so that the temperature of the heater unit (391') is maintained at the required temperature of 23°C.

[0118] In this way, when controlling the temperature of the heater part (391') through the heating wire (397), it is difficult to continuously maintain the required low temperature without deviation in the heating temperature.

[0119] Accordingly, the heater unit (391') is controlled to heat the medicinal solution through the first heating mode in the case of a medicinal solution heated to a low temperature, and is controlled to heat the medicinal solution through the second heating mode in the case of a medicinal solution heated to a high temperature.

[0120] Here, the second heating mode is configured to heat the heater unit (391') through a heating wire (397) provided inside the heater unit (391').

[0121] In this way, the arrangement structure of the heating wire (397) provided inside the heater section (391') is not limited to a specific structure, and can be formed into various arrangement structures as long as the heater section (391') can be heated effectively.

[0122] This second heating mode is configured to heat the heater part (391') by supplying current to the heating wire (397) to heat the heating wire (397). In this second heating mode, temperature control is possible in a temperature range of 25 to 250°C, and in particular, precise temperature control is possible at a high temperature of 100°C or higher to a required temperature. For example, in the second heating mode, when heating a sulfuric acid chemical solution to a high temperature of 220°C, the heat generated through the heating wire (397) can be transferred to the heating casing (380) to heat the chemical solution.

[0123] This heater unit (391') is configured to selectively operate the first heating mode or the second heating mode depending on the type of the chemical liquid to be heated, thereby effectively heating the chemical liquid to the required heating temperature.

[0124] In this way, since one heat exchange unit (350) is equipped with a configuration that heats the heater unit (391') through a heat transfer fluid and a configuration that heats the heater unit (391') through a heating wire (397), the configuration of the heat exchange unit (350) can be simplified.

[0125] FIG. 8 is a configuration diagram of a substrate processing device equipped with an auxiliary heater section, a buffer tank, and a pretreatment heater section according to another embodiment of the present invention.

[0126] Referring to FIG. 8, the substrate processing device (1100) may further include an auxiliary heater unit (400), a buffer tank (500), and a pretreatment heater unit (600).

[0127] Here, the auxiliary heater unit (400) is provided on the chemical liquid supply line (310). Such auxiliary heater unit (400) is configured to additionally heat the chemical liquid discharged from the heat exchange unit (350).

[0128] For example, in the process of indirectly heating a chemical liquid through a heat exchange unit (350), in the case of a chemical liquid such as sulfuric acid, the required heating temperature is very high. Therefore, if the heat exchange unit (350) directly heats a chemical liquid such as sulfuric acid to the required temperature, the operation of the heat exchange unit (350) may be impaired. Therefore, the auxiliary heater unit (400) is configured to instantaneously additionally heat the chemical liquid that has been primarily heated through the heat exchange unit (350) to heat the chemical liquid to the required temperature.

[0129] And the buffer tank (500) is provided on the chemical solution recovery line (340). This buffer tank (500) can be used, for example, when the state is switched from a state in which the first chemical solution tank (111) supplies the chemical solution to the process treatment unit (200) and the second chemical solution tank (112) recovers the chemical solution from the process treatment unit (200), to a state in which the second chemical solution tank (112) supplies the chemical solution to the process treatment unit (200) and the first chemical solution tank (111) recovers the chemical solution from the process treatment unit (200).

[0130] In this way, in order for the second chemical solution tank (112) to supply the chemical solution to the process treatment unit (200), a compressible gas is supplied into the interior of the second chemical solution tank (112), and the internal pressure of the second chemical solution tank (112) must be maintained above a certain level. That is, the switching process of the chemical solution tank takes a certain amount of time, and the buffer tank (500) may be configured to temporarily store the chemical solution introduced through the chemical solution recovery line (340), or the chemical solution may be discharged externally through the drain valve (120) via the buffer tank (500).

[0131] And the pretreatment heater unit (600) can be provided in the first chemical solution tank (111) and the second chemical solution tank (112). This pretreatment heater unit (600) is configured to heat the chemical solution in advance within the chemical solution tank before being supplied to the heat exchange unit (350) in the case of a chemical solution having a high required heating temperature. In this way, the pretreatment heater unit (600) can heat the chemical solution more efficiently by preheating the temperature of the chemical solution within the chemical solution tank to a certain temperature or higher, thereby raising the chemical solution to the required heating temperature in the heat exchange unit (350).

[0132] FIG. 9 is an exemplary diagram showing a substrate processing device according to another embodiment of the present invention.

[0133] Referring to FIG. 9, the substrate processing device (1200) may further include a third chemical tank (113) and a fourth chemical tank (114) in addition to the first chemical tank (111) and the second chemical tank (112).

[0134] The third chemical solution tank (113) and the fourth chemical solution tank (114) provided in the substrate processing device (1200) are configured to operate in the same manner as the first chemical solution tank (111) and the second chemical solution tank (112), and the chemical solutions contained in the first chemical solution tank (111) and the second chemical solution tank (112) and the chemical solutions contained in the third chemical solution tank (113) and the fourth chemical solution tank (114) may be different chemical solutions.

[0135] In this way, the number of chemical tanks provided in the chemical supply unit (100) and the number of process chambers (210) provided in the process treatment unit (200) are not limited to a specific number, and may be provided in various numbers, and the connection structure of the chemical supply unit (100) and the process treatment unit (200) may also be formed in various forms.

[0136] Fig. 10 is a perspective view of a heat exchanger according to a third embodiment of the present invention, and Fig. 11 is an exemplary view showing a heat exchanger according to a third embodiment of the present invention in cross-sectional form along section II-II of Fig. 10.

[0137] As seen in FIGS. 10 and 11, the heat exchange unit (350') is formed in a form in which the length of the cleaning fluid path (P) is longer than that of the heat exchange unit (350) according to one embodiment. That is, the length of the cleaning fluid path (P) is formed longer while the length of the heat exchange unit (350') is the same.

[0138] This heat exchanger (350') is provided with a cleaning fluid inlet (381) and a cleaning fluid outlet (382) on one side of the heating casing (380').

[0139] In this heat exchange unit (350'), an upper cleaning fluid path (P1) formed at the top and a lower cleaning fluid path (P2) formed at the bottom are formed in series (Fig. 10) or in parallel to increase the length of the cleaning fluid path (P) and further increase the heat exchange efficiency of the chemical liquid.

[0140] These upper cleaning fluid paths (P1) and lower cleaning fluid paths (P2) are connected through a connecting pipe (385) provided on the other side of the heat exchanger (350').

[0141] In this way, the chemical liquid guided to the upper cleaning fluid path (P1) through the cleaning fluid inlet (381) provided on one side of the heat exchanger (350') is first heated in the upper cleaning fluid path (P1) and then guided to the lower cleaning fluid path (P2) through the connecting pipe (385). In addition, the chemical liquid supplied to the lower cleaning fluid path (P2) can be secondarily heated in the lower cleaning fluid path (P2) and then discharged through the cleaning fluid discharge port (382).

[0142] In this way, a plurality of cleaning fluid paths may be formed inside the heat exchange unit (350') to further increase the movement distance of the chemical liquid, thereby further increasing the heat exchange efficiency of the chemical liquid.

[0143] FIG. 12 is an exemplary diagram showing a heat exchanger according to a fourth embodiment of the present invention in cross-sectional form along section II-II of FIG. 10. The heat exchanger according to the fourth embodiment differs only in the configuration of the heat exchanger according to the third embodiment and the heater (391'), and therefore, a detailed description thereof will be omitted.

[0144] However, this is only a preferred embodiment of the present invention, and the scope of the rights of the present invention is not limited by the scope of the description of this embodiment.

[0145] The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will readily appreciate that the present invention can be readily modified into other specific forms without altering the technical spirit or essential characteristics of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single entity may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined manner.

[0146] The scope of the present invention is indicated by the claims described below, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

Claims

1. A heating casing in which a cleaning fluid path is formed inside, and cleaning fluid flowing in through a cleaning fluid inlet is heated while moving along the cleaning fluid path and then discharged through a cleaning fluid discharge port; A heater unit coupled to the outer surface of the heating casing and transferring heat to the heating casing to heat the cleaning fluid; and It includes an insulating part surrounding the above heating casing and the heater part, A heat exchanger in which the above cleaning fluid path is formed in a meandering path shape in the width direction of the above heating casing.

2. In paragraph 1, The above heating casing, A first casing having a first coupling base and a first flow path forming portion protruding from the first coupling base and having first ridges and first grooves alternately formed along the width direction; and A second casing comprising a pair with the first casing, a second coupling base, and a second flow path forming portion protruding from the second coupling base and having second peaks and second valleys alternately formed along the width direction; A heat exchanger characterized in that, when the first casing and the second casing are combined, a second mountain formed in the second flow path forming part is inserted into the first groove formed in the first flow path forming part, and a cleaning fluid flow path spaced apart is formed between the first flow path forming part and the second flow path forming part.

3. In paragraph 2, The cross sections of the first and second ridges and valleys alternately formed along the width direction of the first and second ridge formations are trapezoidal. A heat exchanger, characterized in that the gap between the first groove and the second peak forming the cleaning fluid path and between the first peak and the second valley is 0.1 to 3 mm.

4. In paragraph 2, A heat exchanger characterized in that the inner surfaces of the first and second casings facing each other are coated with fluororesin to prevent corrosion caused by a cleaning fluid, and the first and second casings are made of aluminum or stainless steel.

5. In paragraph 1, The above heater part is configured to selectively heat the heating casing through operation of the first heating mode and the second heating mode, In the first heating mode, the heat transfer fluid supplied into the heater section heats the heating casing. In the second heating mode, the heating wire provided in the heater section heats the heating casing. A heat exchange unit characterized in that the heater unit selectively operates either the first heating mode or the second heating mode depending on the type of cleaning fluid sprayed onto the substrate.

6. A chemical solution supply unit equipped with a chemical solution tank containing a chemical solution for cleaning the substrate; A process treatment unit having a process chamber for cleaning a substrate using a chemical solution supplied from the chemical solution supply unit; and It includes a chemical solution delivery unit having a chemical solution supply line for supplying chemical solution from the chemical solution supply unit to the process treatment unit, and a chemical solution recovery line for recovering or draining chemical solution from the process treatment unit; A heat exchanger according to paragraph 1 is provided on the above-mentioned chemical supply line to heat the chemical supplied to the process treatment unit to a required temperature. A substrate processing device in which a compressible gas is supplied into the interior of the above-mentioned chemical tank, and the chemical supply unit having at least one pair of the above-mentioned chemical tanks supplies the chemical to the above-mentioned process processing unit.

7. In paragraph 6, The above-mentioned liquid supply unit and process treatment unit are provided in a cleaning chamber in which an upper space and a lower space are formed, which are divided into upper and lower parts. A substrate processing device characterized in that the process treatment unit is arranged in the upper space, and the chemical supply unit is arranged in the lower space, so that gravity recovery is possible when the chemical is recovered from the process treatment unit to the chemical supply unit.

8. In paragraph 6, The above liquid supply unit, A first liquid tank containing the liquid; A second liquid tank that forms a pair with the first liquid tank; A first pressurizing valve coupled to the first liquid tank and supplying compressible gas into the first liquid tank; A first vent valve coupled to the first liquid tank and controlling the pressure inside the first liquid tank; A second pressurizing valve coupled to the second liquid tank and supplying compressible gas into the second liquid tank; and A second vent valve coupled to the second liquid tank and configured to control the pressure inside the second liquid tank; A substrate processing device characterized in that, when a compressible gas is supplied to the first chemical tank and the chemical is supplied from the first chemical tank to the process treatment unit, the second chemical tank is configured to maintain an atmospheric pressure state.

9. In paragraph 6, The above liquid delivery unit, The chemical supply line that supplies the chemical to the upper nozzle and the lower nozzle that spray the chemical from the chemical supply unit to the substrate fixedly installed in the process chamber; A filter unit provided on the above-mentioned chemical supply line and removing particles present in the chemical solution supplied from the chemical solution tank to the process treatment unit; A flow control unit having a first flow control unit for controlling the supply amount of the chemical solution supplied to the upper nozzle via the filter unit, and a second flow control unit for controlling the supply amount of the chemical solution supplied to the lower nozzle; A heat exchange unit having a first heat exchange unit for heating the chemical liquid passing through the first flow control unit to a required temperature, and a second heat exchange unit for heating the chemical liquid passing through the second flow control unit to a required temperature; and It includes the chemical recovery line that guides the chemical recovered from the above process treatment unit to the chemical tank; A substrate processing device, characterized in that the chemical liquid exceeding the required chemical liquid supply amount supplied to the above flow control unit is recovered to the chemical liquid tank through the chemical liquid recovery unit.

10. In paragraph 6, The above-mentioned liquid supply line includes an auxiliary heater unit that additionally heats the liquid discharged from the heat exchange unit; A buffer tank provided on the above liquid recovery line; and A substrate processing device further comprising a pretreatment heater unit provided in the chemical tank and heating the chemical solution contained in the chemical solution tank.

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