Foldable device

Abstract

The embodiments of the present application relate to the technical field of electronic devices. Provided is a foldable device. The solution can effectively improve the radiation performance of an antenna in a folded state. The foldable device comprises a first portion and a second portion, wherein the first portion and the second portion are connected by means of a rotating shaft. The first portion comprises a first metal middle frame, and the second portion comprises a second metal middle frame; the first portion or the second portion comprises a first antenna. The foldable device further comprises a connecting assembly, wherein a first end of the connecting assembly is electrically connected to the first metal middle frame. When the first portion and the second portion rotate around the rotating shaft into a stacked arrangement, a second end of the connecting assembly is electrically connected to the second metal middle frame.

Description

Foldable device TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a foldable device. BACKGROUND

[0002] Currently, when configuring an antenna radiator in an electronic device, the antenna can be configured on the outer region of the electronic device so as to facilitate the antenna to radiate through a relatively open space. Taking an electronic device with a metal frame structure as an example. The antenna radiator can be configured by reusing the metal frame, and by setting electrical connection points such as a feed point and a ground point on the metal frame, a feed signal can be radiated outward through the metal frame.

[0003] In addition, the electronic device can also be configured with a metal middle frame for providing rigid support and zero potential reference for the electronic device. In the case of a foldable electronic device, different folding planes (such as the planes on both sides of the hinge) can be provided with metal middle frames.

[0004] When the foldable electronic device is in a folded state, the two folding planes are close to each other, and the two metal middle frames form a cavity structure relative to the antenna radiator. The cavity structure, due to being close to the antenna radiator, will significantly affect the radiation performance of the antenna in the folded state.

[0005] SUMMARY

[0006] The present application provides a foldable device, which can be provided with a connection assembly. Through the provision of the connection assembly, the radiation performance of the antenna in the folded state can be effectively improved.

[0007] To achieve the above technical purposes, the present application adopts the following technical solutions:

[0008] In a first aspect, a foldable device is provided, which includes a first part and a second part connected by a hinge. The first part includes a first metal middle frame, and the second part includes a second metal middle frame. The first part or the second part includes a first antenna. The foldable device further includes a connection assembly, a first end of the connection assembly being electrically connected to the first metal middle frame. When the first part and the second part are rotated around the hinge to be stacked, a second end of the connection assembly is electrically connected to the second metal middle frame.

[0009] Based on the above scheme, the electrical connection between the first metal middle frame and the second metal middle frame is achieved in the foldable device through the connection assembly.

[0010] It can be understood that the first metal middle frame and the second metal middle frame are stacked when the foldable device is in the folded state. The first metal middle frame and the second metal middle frame constitute a cavity structure with an opening facing the first antenna. In a conventional design without the connecting assembly, part of the electromagnetic waves radiated by the first antenna will enter the cavity structure, forming a cavity electric field in the cavity structure. The existence of the cavity electric field will significantly affect the radiation performance of the first antenna.

[0011] In this application, the electrical connection of the first metal middle frame and the second metal middle frame is realized through the connecting assembly. In this way, the electromagnetic waves radiated by the first antenna can be isolated outside the cavity structure, thereby avoiding the emergence of a significant cavity electric field and the influence of the cavity electric field on the radiation performance of the first antenna. It can be understood that the closer the position of the connecting assembly to the end of the cavity structure close to the first antenna, the fewer the electromagnetic waves radiated by the first antenna that enter the cavity, the weaker the cavity electric field, and the smaller the influence of the cavity electric field on the radiation performance of the first antenna.

[0012] In some possible designs, the first part includes the first antenna, and the first end of the connecting assembly is electrically connected to the first position of the first metal middle frame. The first position is arranged at an end of the first metal middle frame away from the rotation shaft. For example, the end of the first metal middle frame away from the rotation shaft can include a face of the first metal middle frame opposite to the first antenna, and / or a part of the first metal middle frame away from the rotation shaft. As an example, the first metal middle frame is divided into a part close to the rotation shaft and a part away from the rotation shaft by a middle line. The part of the first metal middle frame away from the rotation shaft can correspond to a half of the first metal middle frame away from the rotation shaft and close to the first antenna.

[0013] In some possible designs, the second end of the connecting assembly is electrically connected to the second position of the second metal middle frame. The first part includes the first antenna, and the second position is included in a projection area of the first metal middle frame and the first slit on the second metal middle frame, the first slit being a slit between the first metal middle frame and the first antenna. Based on this design, the electrical connection position of the connecting assembly on the second metal middle frame can be as close to the first antenna as possible, thereby reducing the electromagnetic waves radiated by the first antenna that enter the cavity structure.

[0014] In some possible designs, the connecting assembly is at least partially made of a conductive material.

[0015] In some possible design, the connection component is arranged in the first part. A first end of the connection component is fixedly connected with the first metal middle frame. When the first part and the second part are stacked, a second end of the connection component is coupled to the second metal middle frame. In another implementation, the connection component can also be arranged in the second part, and the connection component is coupled to the first metal middle frame and fixedly connected with the second metal middle frame.

[0016] In some possible design, when the first part and the second part are stacked, the minimum distance between the second end of the connection component and the second metal middle frame is not greater than 1 mm. In this way, when the connection component and the second metal middle frame are coupled to each other, the current can be conducted between the connection component and the second metal middle frame with low impedance.

[0017] In some possible design, the connection component includes a first part and a third part, and both the first part and the third part are made of conductive material. A first end of the first part is fixedly connected with the first metal middle frame. When the first part and the second part are stacked, a second end of the third part is coupled to the second metal middle frame. A second end of the first part is electrically connected with a first end of the third part.

[0018] In this way, a possible structural composition of the connection component is provided.

[0019] It can be understood that, due to the structure inside the foldable device, in some cases, the connection component cannot be configured by using a complete conductive structure. In this example, multiple parts are configured to achieve the configuration of the connection component in the foldable device.

[0020] In another implementation, the structural composition of the connection component can also be different from the design when the structure allows. For example, the connection component is implemented by using a continuous conductive structure, or the connection component is implemented by using more conductive structures that are electrically connected with each other.

[0021] In some possible design, the first part includes a first sub-part, and the first sub-part extends along the plane in which the first part is located. In some implementation, the first part can be fixedly connected with the first metal middle frame at the first sub-part, for example, by welding.

[0022] In some possible design, the first part includes a second sub-part, and the second sub-part is a curved structure and is used to avoid the display screen of the foldable device. It can be understood that the specific form of the second sub-part can be flexibly configured according to actual conditions. For example, when it is necessary to avoid the display screen or other components, the second sub-part can be a curved structure. For another example, when it is not necessary to avoid, the second sub-part can also be configured as a planar structure.

[0023] In some possible design solutions, the first component includes a third subcomponent, which is arranged opposite at least part of the third component.

[0024] In some possible design solutions, the third component includes a fourth subcomponent, which is parallel to the plane in which the third subcomponent is arranged.

[0025] In some implementations, the third subcomponent and the fourth subcomponent can be arranged in the xoy plane respectively. In this way, when designing the electrical connection component (e.g., the second component) of the first component and the third component, the second component only needs to be configured to extend in the z direction. Thus, the configuration of the second component is facilitated.

[0026] In some possible design solutions, the third component includes a fifth subcomponent, and the third component is coupled to the second metal middle frame through the fifth subcomponent when the first part and the second part are stacked. It can be understood that the greater the area of the fifth subcomponent is, the greater the coupling area with the second metal middle frame is, and the better the current passing property is, and the lower the impedance is. In turn, the current transmission resistance between the third component (and the first component electrically connected to the third component, the first metal middle frame, etc.) and the second metal middle frame is smaller, and the shielding of the cavity electric field is more facilitated.

[0027] In some possible design solutions, the third component includes a fourth subcomponent, a fifth subcomponent, and a sixth subcomponent, the first part of the sixth subcomponent and the fourth subcomponent form a stepped structure, and the second part of the sixth subcomponent and the fifth subcomponent form a U-shaped structure.

[0028] In some possible design solutions, the foldable device is further provided with a display screen, and the display screen is fixed by a first structural member, and the first structural member includes a non-metallic material. The fourth subcomponent of the third component, the fifth subcomponent of the third component, and the sixth subcomponent of the third component are electrically connected, and the fourth subcomponent of the third component, the fifth subcomponent of the third component, and the sixth subcomponent of the third component include a conductive coating arranged on the surface of the first structural member.

[0029] In this way, by arranging the conductive coating on the first structural member, the third component is arranged. Thus, the existing structure in the foldable device can be effectively used as support to realize the configuration of the connection assembly.

[0030] In some possible design solutions, the first component includes at least one of the following: a conductive PCB, a conductive FPC, and a steel sheet.

[0031] In some possible design solutions, the first end of the first component is welded to the first metal middle frame.

[0032] In some possible design solutions, the connecting assembly further includes a second component made of an electrically conductive material. The second end of the first component is electrically connected to the first end of the third component through the second component.

[0033] In some possible design solutions, the second end of the first component is fixedly electrically connected to the first end of the second component. The second end of the second component is spring-connected or crimp-connected to the third component. Alternatively, the second end of the first component is spring-connected or crimp-connected to the first end of the second component. The second end of the second component is fixedly electrically connected to the third component.

[0034] In some possible design solutions, the second component includes a metal spring or an electrically conductive foam.

[0035] In some possible design solutions, at the operating frequency of the first antenna, when the first portion and the second portion are stacked, the first metal frame and the second metal frame are conductive through the connecting assembly. Thus, by virtue of the arrangement of the connecting assembly, the cavity structure formed by the first portion and the second portion is in a closed state relative to the electromagnetic wave radiated by the first antenna, thereby avoiding the influence of the cavity electric field on the radiation of the first antenna.

[0036] In some possible design solutions, a projection of the connecting assembly to the first portion covers at least part of the first antenna.

[0037] In different implementations of the present application, the connecting assembly can be continuous as a whole in the plane in which the display screen is located, or the connecting assembly can be respectively configured as multiple portions. It can be understood that, in the case where the connecting assembly covers at least part of the first antenna, the cavity structure can be isolated from the radiation of the first antenna. The greater the range of the connecting assembly covering the first antenna, the better the isolation effect, and the smaller the influence of the cavity electric field on the radiation of the first antenna.

[0038] In some possible design solutions, the foldable device is further provided with a second antenna, and a radiator of the second antenna is arranged on the same side of the foldable device as a radiator of the first antenna.

[0039] In some possible design solutions, a projection of the connecting assembly to the first portion covers at least part of the second antenna.

[0040] In this way, the scheme provided in the present application is not limited to a single-antenna scenario. In the case where multiple antennas are arranged on the same side of the foldable device, the arrangement of the connecting assembly can take effect on each antenna. For example, the influence of the cavity electric field on the radiation of the first antenna and the second antenna can be avoided.

[0041] In some cases, the isolation between the first antenna and the second antenna needs to be improved, the first antenna and the second antenna can be configured with a means for improving isolation. For example, the first antenna and the second antenna are configured to excite orthogonal currents on the metal middle frame (e.g., the first metal middle frame) that belongs to the same part as the antenna.

[0042] In this case, the connection assembly is arranged such that the current distribution on the first metal middle frame and the second metal middle frame remains consistent in the folded state. For example, the first antenna and the second antenna can also excite orthogonal currents on the second metal middle frame. Thus, the configured means for improving isolation can still work in the folded state, and the coupling path caused by the proximity of the second metal middle frame will not cause a decrease in isolation. BRIEF DESCRIPTION OF DRAWINGS

[0043] FIG. 1 is a schematic diagram of a foldable electronic device;

[0044] FIG. 2 is a schematic diagram of a cavity electric field in a metal middle frame;

[0045] FIG. 3 is a simulation diagram of S parameters of an antenna;

[0046] FIG. 4 is a schematic diagram of an isolation control scheme for a multi-antenna scenario;

[0047] FIG. 5 is a schematic diagram of an electrical parameter between metal middle frames in a folded state;

[0048] FIG. 6 is a simulation diagram of S parameters of an antenna;

[0049] FIG. 7 is a schematic diagram of an electronic device provided by an embodiment of the present application;

[0050] FIG. 8 is a schematic diagram of a small A shell in a foldable device provided by an embodiment of the present application;

[0051] FIG. 9 is a schematic diagram of a cross section of a foldable device in an unfolded state provided by an embodiment of the present application;

[0052] FIG. 10 is a schematic diagram of a cross section of a foldable device in a folded state provided by an embodiment of the present application;

[0053] FIG. 11 is a schematic diagram of an arrangement of a connection assembly provided by an embodiment of the present application;

[0054] FIG. 12 is a schematic diagram of a cross section of a foldable device in an unfolded state provided by an embodiment of the present application;

[0055] FIG. 13 is a schematic diagram of a cross section of a foldable device in a folded state provided by an embodiment of the present application;

[0056] FIG. 14 is a schematic diagram of a composition of a connection assembly provided by an embodiment of the present application;

[0057] FIG. 15 is a schematic diagram of a connection assembly according to an embodiment of the present application;

[0058] FIG. 16 is a schematic diagram of a setting area of a connection assembly according to an embodiment of the present application;

[0059] FIG. 17 is a schematic diagram of efficiency simulation of an antenna according to an embodiment of the present application;

[0060] FIG. 18 is a schematic diagram of efficiency simulation of an antenna according to an embodiment of the present application;

[0061] FIG. 19 is a schematic diagram of S parameter simulation of an antenna according to an embodiment of the present application;

[0062] FIG. 20 is a schematic diagram of efficiency simulation of an antenna according to an embodiment of the present application;

[0063] FIG. 21 is a schematic diagram of a cross section of a foldable device in a folded state according to an embodiment of the present application. DETAILED DESCRIPTION

[0064] Hereinafter, the terms "first" and "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0065] The electronic device can realize the wireless communication function through the antenna and related components arranged therein.

[0066] In different implementations, the specific implementation of the antenna in the electronic device can be different. In some implementations, the antenna can be attached to the antenna support of non-conductive material in the form of a flexible printed circuit (FPC), realizing the configuration of the antenna in the electronic device. In other implementations, the radiator of the antenna can partially or wholly reuse the metal structural member in the electronic device.

[0067] Taking the metal frame architecture of the electronic device as an example. In the metal frame architecture, the electronic device can be provided with a metal middle frame. The metal middle frame can be a metal plate of metal material, which can provide rigid support for various components (such as printed circuit boards (PCBs) and the like) in the electronic device, and can also provide a zero potential reference for various electrical components in the electronic device. The metal middle frame can also be logically referred to as a reference ground. When the PCB is electrically connected to the metal middle frame through a large area of copper cladding, the copper cladding area of the PCB can also be referred to as the reference ground.

[0068] In the metal side frame architecture, the outer side of the metal middle frame can further include one or more metal side frames. Any of the one or more metal side frames can be suspended or connected with the metal middle frame structure to achieve grounding.

[0069] In the metal side frame architecture, the metal side frame can achieve the function of the antenna radiator through certain electrical connection design. In this way, the space and cost overhead of additionally setting the antenna radiator (such as FPC) can be saved.

[0070] It can be understood that the metal structure around the antenna radiator will have an impact on the radiation of the antenna. The metal structure can include metal parts near the antenna radiator, and the metal structure can also include metal side frames, metal middle frames, and other metal components that are close to the antenna radiator when the electronic device is in different folding states.

[0071] For example, the electronic device is a foldable electronic device (referred to as a foldable device for short). The foldable device can be a double-fold, triple-fold, quadruple-fold, or the like. Among them, double-fold corresponds to an electronic device that is configured with one hinge. Triple-fold corresponds to an electronic device that is configured with at least two hinges. And so on. In some implementations, the hinge can include a metal hinge.

[0072] For example, the foldable device is double-fold. The hinge in the electronic device can divide the electronic device into two parts, such as A screen and B screen. In some implementations, the structure assembly corresponding to the hinge on the side of the A screen can also be referred to as the first part of the foldable device, and the structure assembly corresponding to the hinge on the side of the B screen can also be referred to as the second part of the foldable device.

[0073] Based on the setting of the hinge, the foldable device can have different folding states, such as an unfolded state, a folded state, and the like. In the unfolded state, the hinge angle is 180 degrees, so that the first part and the second part can be in the same plane. In the folded state, the hinge angle is between 0 degrees and 30 degrees, and the A screen and the B screen are stacked with each other. That is, in the folded state, the first part and the second part are rotated around the hinge to be stacked. It can be understood that in other embodiments, the unfolded state can also not be limited to the hinge angle being 180 degrees, and / or the folded state can also not be limited to the hinge angle being 0 degrees. For example, when the hinge angle is any angle between 90 degrees and 180 degrees, the foldable device can be considered to be in the unfolded state. For example, when the hinge angle is any angle between 0 degrees and 30 degrees, the foldable device can be considered to be in the folded state.

[0074] For example, referring to FIG. 1, examples of a foldable device in different folding states under a metal frame structure are provided. The electronic device can include an A screen and a B screen. The A screen can include a middle frame A in a corresponding region, and the B screen can include a middle frame B in a corresponding region. In addition, one or more metal side frames (such as metal side frame 1 and metal side frame 2) can also be included in the A screen corresponding region. In some implementations, the metal side frame can be disposed on the periphery of the metal middle frame. The metal side frame and the metal middle frame can be separated by a gap, or the metal side frame can be electrically connected to the metal middle frame at one or more positions.

[0075] In this application, the A screen corresponding region can include the projection area of the A screen into the xoy plane. Similarly, the B screen corresponding region can include the projection area of the B screen into the xoy plane. The xoy plane can be the plane on which the display screen is located when the electronic device is in an unfolded state.

[0076] In this example, the metal side frame is disposed on the side (such as the side that does not intersect the rotation shaft) of the electronic device, which is reused as the radiator of the antenna.

[0077] For example, the side of the A screen can include metal side frame 1 and metal side frame 2. Metal side frame 1 can be reused as the radiator of antenna 1. Metal side frame 2 can be reused as the radiator of antenna 2. In other embodiments, antenna 1 can also be referred to as a first antenna, and antenna 2 can also be referred to as a second antenna.

[0078] It should be noted that in this example, metal side frame 1 and / or metal side frame 2 are only examples. In this example, metal side frame 1 and metal side frame 2 can be located on the same side and separated from each other by a gap. In other implementations, metal side frame 1 and metal side frame 2 can also be disposed on different sides.

[0079] In addition, in different implementations, one or more electrical connection points can also be provided on metal side frame 1 and / or metal side frame 2. The electrical connection points can include: a feed point coupled to a feed source, a grounding point coupled to a reference ground, etc.

[0080] In the embodiments of this application, coupling can be used to describe the form of electrical connection. For example, component A and component B are coupled.

[0081] In some embodiments, the coupling of component A and component B can correspond to: direct electrical connection of component A and component B. In this example, component A and component B can be configured to be connected by a conductive device or a transmission line. In this way, electrical signals can be transmitted between component A and component B through the conductive device or the transmission line between component A and component B.

[0082] In some embodiments, the coupling of component A and component B can correspond to: an indirect electrical connection between component A and component B. In this example, component A and component B can be configured to be indirectly electrically connected through a distributed capacitance structure. It can be understood that the distributed capacitance structure can be formed by two opposite conductive structures, and the distributed capacitance structure can be equivalent to a capacitor. In this way, the electrical signal can be transmitted between component A and component B through the distributed capacitance structure between component A and component B.

[0083] Therefore, the signal transmission between the two components can be realized through the coupling form.

[0084] In addition, in the example of FIG. 1, the number of antennas and the position of the metal frame are only examples and do not constitute a limitation on the embodiments of the present application.

[0085] As shown in FIG. 1, in the case that the electronic device is in the folded state, taking the example that the A screen is located directly above the B screen (such as the positive direction of the z axis).

[0086] In the folded state, the radiators of the antenna 1 and the antenna 2 (i.e., the metal frame 1 and the metal frame 2) are close to the middle frame B. In this example, in the folded state, the projection of the middle frame B to the plane where the B screen is located covers the projections of the metal frame 1 and the metal frame 2 to the plane where the B screen is located.

[0087] In this way, the metal cavity formed by the middle frame B, the hinge, and the middle frame A will have a significant impact on the normal radiation of the antenna 1 and / or the antenna 2.

[0088] For example, referring to FIG. 2, a folded state cross-sectional view in the xoz plane is shown.

[0089] As shown in FIG. 2, taking the antenna 1 as an example. When the antenna 1 is working, a feed signal can be input to the antenna 1 through a feed point, thereby exciting an alternating current on the antenna 1 to radiate. Correspondingly, an electric field corresponding to the cavity electric field will be generated between the middle frame A and the antenna 1, between the middle frame B and the antenna 1, and between the middle frame A and the middle frame B. In this example, the corresponding electric field can be referred to as a cavity electric field.

[0090] It should be noted that in the case that the hinge includes a metal hinge, a U-shaped cavity can be formed by the middle frame A, the metal hinge, and the middle frame B. In the U-shaped cavity, the cavity electric field shown in FIG. 2 will be generated.

[0091] In other cases, the hinge does not include a conductive material, and a capacitance structure can be formed by the middle frame A and the middle frame B. In this way, due to the alternating current on the antenna 1, a similar cavity electric field will also be generated between the middle frame A and the middle frame B.

[0092] In addition, in this example, the projection of the radiator of the antenna 1 to the plane in which the middle frame B is located is taken as an example. It can be understood that, in the case that the projection of the radiator of the antenna 1 to the plane in which the middle frame B is located includes the part covered by the middle frame B and the part not covered by the middle frame B, due to the alternating current on the antenna 1, a similar cavity electric field is also generated between the middle frame A and the middle frame B.

[0093] The distribution of the cavity electric field can have the following characteristics: the closer to the area of the antenna radiator, the greater the electric field strength.

[0094] Due to the existence of the cavity electric field, the radiation performance of the antenna 1 is significantly reduced.

[0095] Based on similar reasons, the radiation performance of the antenna 2 is also significantly deteriorated.

[0096] Referring to FIG. 3, the return loss (S11) and system efficiency simulation of the antenna 1 and the antenna 2 in the folded state are provided.

[0097] As shown in FIG. 3, in the angle of S11, the deepest points of the return loss of the antenna 1 and the antenna 2 are all more than -5 dB. And the radiation performance has a significant dip near the deepest point of the return loss. For example, from the angle of system efficiency, at the deepest point of the return loss (such as near 0.78 GHz), the system efficiency has a loss of 7-8 dB compared with the sideband.

[0098] The influence of the cavity electric field on the radiation performance can be explained as follows: part of the electromagnetic waves radiated by the antenna are reflected and absorbed inside the cavity, and cannot be normally radiated outward. This also leads to a decrease in the electromagnetic wave power radiated to the outside by the antenna when it works, and further affects the system efficiency.

[0099] It can be understood that, in the example shown in FIGS. 1-3, the electronic device has a metal frame structure, and the electronic device is a foldable device, which is taken as an example to explain the formation of the cavity near the antenna and the influence on the operation of the antenna. In other cases, such as the electronic device is not a foldable device, or the antenna of the electronic device is configured in other forms, due to the configuration of the conductive material near the antenna, a logical structure of the cavity can also be generated near the antenna radiator, thereby affecting the radiation performance of the antenna.

[0100] In the above description of FIGS. 1-3, the foldable device is in the folded state, and due to the existence of the cavity electric field, the radiation performance of each antenna is reduced. It can be understood that, in the case that the electronic device shown in FIGS. 1-3 is configured with multiple antennas, it is also necessary to ensure that the isolation between different antennas is high, so as to avoid the mutual influence of the antennas when they work, thereby ensuring the radiation performance of the antennas.

[0101] Take the antennas 1 and 2 as shown in FIG. 1 as an example. The working frequency bands of the antennas 1 and 2 overlap each other, or there is partial overlap, or the working frequency of the antenna 1 includes the frequency band of the antenna 2, and in this case, the isolation of the antennas 1 and 2 is poor, and the radiation performance of the antennas 1 and 2 is affected.

[0102] In the current technical solution, the isolation of the antennas 1 and 2 in the unfolded state can be optimized through various design ideas.

[0103] In some embodiments, the antennas 1 and 2 can be configured to excite orthogonal or nearly orthogonal currents on the reference ground (such as the middle frame A), thereby improving the isolation of the antennas 1 and 2.

[0104] For example, referring to FIG. 4, the antenna 1 can be configured to excite a horizontal (such as x-axis) current on the middle frame A. The antenna 2 can be configured to excite a vertical (such as y-axis) current on the middle frame A.

[0105] In this way, when the antennas are working, the current coupled on the reference ground will also participate in radiation, so that the orthogonal current can generate orthogonal or nearly orthogonal electromagnetic waves in space. Thus, by the principle that orthogonal electromagnetic waves do not affect each other, the mutual influence of the two antennas when working is avoided, and the isolation is improved. Thus, the radiation performance of the antennas 1 and 2 is improved.

[0106] In other embodiments, the radiators of the antennas 1 and 2 are respectively arranged at a distance far away (such as the antenna 1 is arranged at the upper left corner of the A screen in the unfolded state, and the antenna 2 is arranged at the lower left corner of the A screen in the unfolded state), or an isolation circuit is added between the radiators of the antennas 1 and 2, which can also effectively improve the isolation of the antennas 1 and 2 in the unfolded state.

[0107] However, in the folded state, since the middle frame B is close to the radiators of the antennas 1 and 2, the isolation of the two antennas is deteriorated, and thus the radiation performance of the antennas is affected.

[0108] For example, FIG. 5 shows a yoz plane cross-sectional view in the folded state. The electric field between the antennas and the middle frame B is also provided.

[0109] As shown in FIG. 5, in the folded state, when the antennas 1 and 2 work at the same time, due to the alternating current on the antennas 1 and 2, the radiators of the antennas 1 and 2 and the middle frame B respectively generate electric fields.

[0110] The electric field between the radiators of the antennas 1 and 2 and the middle frame B causes the side of the middle frame B close to the radiators of the antennas 1 and 2 to generate a current path between the antennas 1 and 2.

[0111] In this way, the radiation generated by the antenna 1 will flow to the location of the antenna 2 through the current path. Similarly, the radiation generated by the antenna 2 will flow to the location of the antenna 1 through the current path. This will also cause the isolation between the antenna 1 and the antenna 2 to decrease, and the radiation performance to decrease.

[0112] FIG. 6 shows an example of simulation of return loss and isolation of the antenna 1 and the antenna 2 in the folded state, where the antenna 1 corresponds to port 1, and the corresponding return loss can be S11. The antenna 2 corresponds to port 2, and the corresponding return loss can be S22. The isolation between the antenna 1 and the antenna 2 can be S12.

[0113] As shown in FIG. 6, in the folded state, the worst point of the isolation of the antenna 1 and the antenna 2 is significantly deteriorated, about -8.17 dB. This also proves the above description from the simulation results.

[0114] In summary, in order to ensure the radiation performance of the antenna in the electronic device, it is necessary to avoid the influence of the cavity electric field on the antenna radiation. In the case where multiple antennas are configured in the electronic device, it is also necessary to avoid the deterioration of the isolation between the antennas in the folded state, so as to ensure the radiation performance of the antennas.

[0115] Based on this, the technical scheme provided by the embodiments of the present application can effectively weaken or eliminate the generation of the cavity electric field through targeted configuration in the electronic device. In addition, the scheme can also ensure that the isolation of the multiple antennas in the folded state is not worse than that in the unfolded state.

[0116] The scheme provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0117] It should be noted that the electronic device in the embodiments of the present application can include at least one of a mobile phone, a foldable electronic device, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) device, a virtual reality (VR) device, an artificial intelligence (AI) device, a wearable device, a vehicle-mounted device, a smart home device, or a smart city device. The specific type of the electronic device is not specially limited in the embodiments of the present application.

[0118] In some implementations, the electronic device can include a foldable device. For example, a foldable mobile phone, a foldable tablet computer, etc. that can be folded in two, three, or four times.

[0119] Referring to FIG. 7, a schematic diagram of a hardware configuration of an electronic device is illustrated.

[0120] As shown in FIG. 7, the electronic device can include a processor 701, a mobile communication module 702, a wireless communication module 703, an antenna A, an antenna B, and a battery 704.

[0121] In some embodiments, the electronic device can further include an external memory interface, an internal memory, a universal serial bus (USB) terminal, a charging management module, a power management module, a battery, an audio module, a speaker, a microphone, an earphone interface, a sensor module, a key, a motor, an indicator, a camera module, a display screen, and a subscriber identification module (SIM) card interface, etc.

[0122] The sensor module can include a pressure sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, etc.

[0123] In this example, the processor 701 can include one or more processing units, such as: an application processor (AP), a modem, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor (BP or BBP), and / or a neural-network processing unit (NPU), etc. Different processing units can be independent devices, or can be integrated in one or more processors.

[0124] The processor can generate operation control signals according to instruction opcodes and timing signals, and complete the control of fetching and executing instructions.

[0125] The processor 701 can further include a memory for storing instructions and data. In some embodiments, the memory in the processor 701 can be a cache memory. The memory can hold instructions or data that are frequently used or used recently by the processor 701. If the processor 701 needs to use the instructions or data, the instructions or data can be directly called from the memory. This avoids repeated access and reduces the waiting time of the processor 701, thereby improving the efficiency of the system.

[0126] In some embodiments, the processor 701 can include one or more interfaces. The interfaces can include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc. The processor 701 can connect modules such as a touch sensor, an audio module, a wireless communication module, a display, a camera, etc. through at least one of the above interfaces.

[0127] It can be understood that the interface connection relationship between the modules shown in the embodiments of the present application is only illustrative and does not constitute a limitation on the structure of the electronic device. In some other embodiments of the present application, the electronic device can also use different interface connection modes or combinations of multiple interface connection modes in the above embodiments.

[0128] It should be noted that the structure shown in the embodiments of the present application does not constitute a specific limitation on the electronic device. In some other embodiments of the present application, the electronic device can include more or fewer components than shown, or combine certain components, or split certain components, or different component arrangements. The components shown can be implemented in hardware, software, or a combination of software and hardware.

[0129] The wireless communication function of the electronic device can be realized through the antenna A, the antenna B, the mobile communication module 702, the wireless communication module 703, the modem processor, and the baseband processor, etc.

[0130] Antenna A and antenna B are used for transmitting and receiving electromagnetic wave signals. Each antenna in the electronic device can be used to cover a single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization of the antennas. For example: antenna A can be multiplexed as a diversity antenna for wireless local area networks. In some other embodiments, antennas can be used in combination with tuning switches.

[0131] The mobile communication module 702 can provide a solution for wireless communication including 2G / 3G / 4G / 5G, etc. applied on the electronic device. The mobile communication module 702 can include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module 702 can receive electromagnetic waves by antenna A, and perform filtering, amplification, etc. on the received electromagnetic waves, and transmit the processed electromagnetic waves to the modem processor for demodulation. The mobile communication module 702 can also amplify the signals modulated by the modem processor, and convert the signals into electromagnetic waves radiated by antenna A. In some embodiments, at least part of the functional modules of the mobile communication module 702 can be arranged in the processor 701. In some embodiments, at least part of the functional modules of the mobile communication module 702 can be arranged in the same device as at least part of the modules of the processor 701.

[0132] The modem processor can include a modulator and a demodulator. The modulator is used to modulate a low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. The low-frequency baseband signal processed by the baseband processor is transmitted to the application processor. The application processor outputs sound signals through the audio device (not limited to the loudspeaker 170A, the microphone 170B, etc.), or displays images or videos through the display screen 194. In some embodiments, the modem processor can be an independent device. In some other embodiments, the modem processor can be independent of the processor 701, and arranged in the same device as the mobile communication module 702 or other functional modules.

[0133] The wireless communication module 703 can provide solutions for wireless communication applied to the electronic device, including wireless local area networks (WLAN) (e.g., wireless fidelity (Wi-Fi) networks), Bluetooth (BT), Bluetooth low energy (BLE), ultra wide band (UWB), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR) technology, and the like. The wireless communication module 703 can be one or more devices that integrate at least one communication processing module. The wireless communication module 703 receives electromagnetic waves via an antenna B, frequency-modulates and filters the electromagnetic wave signals, and transmits the processed signals to the processor 701. The wireless communication module 703 can also receive signals to be transmitted from the processor 701, frequency-modulate them, amplify them, and radiate them as electromagnetic waves via the antenna B.

[0134] In some embodiments, the antenna A and the mobile communication module 702 of the electronic device are coupled, and the antenna B and the wireless communication module 703 are coupled, so that the electronic device can communicate with a network and other electronic devices through a wireless communication technology. The wireless communication technology can include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology, etc. The GNSS can include a global positioning system (GPS), a global navigation satellite system (GLONASS), a beidou navigation satellite system (BDS), a quasi-zenith satellite system (QZSS), and / or a satellite based augmentation systems (SBAS).

[0135] In the embodiments of the present application, the antenna 1 and the antenna 2 described above can be included in the antenna A and / or the antenna B.

[0136] The electronic device can implement a display function through the display screen 704. The display screen 704 includes a display panel. The display panel can adopt a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light emitting diode (AMOLED), a flex light-emitting diode (FLED), a Miniled, a MicroLed, a Micro-oLed, a quantum dot light emitting diodes (QLED), or the like. In some embodiments, the electronic device can include one or more display screens 704.

[0137] In some embodiments, the electronic device can be a foldable device. A foldable display screen can be configured on the foldable device. The foldable screen can be folded with the rotation of the hinge. In some embodiments, in addition to the foldable display screen, one or more non-foldable display screens can also be provided on the foldable device.

[0138] In the following examples, the electronic device is taken as an example of a foldable device.

[0139] In the embodiments of the present application, the foldable device can have a plurality of different architectures similar to the non-foldable electronic device (such as a straight phone). For example, the foldable device can be a foldable device with a metal frame architecture. For another example, the foldable device can be a foldable device with a non-metal frame architecture.

[0140] Taking the foldable device with a metal frame architecture as an example. As in the foregoing examples, the antenna radiator in the electronic device can be configured by partially or wholly multiplexing the metal frame.

[0141] In some embodiments, a structure made of non-conductive material can also be provided between the metal frame and the display screen. For example, the non-conductive material can be plastic.

[0142] The structure can be used to fix the display screen. The structure can also be used to fix the suspended (i.e., not connected to the middle frame) metal frame. The structure can also seal and prevent dust from the display screen by filling the gap between the metal frame and the display screen.

[0143] In the embodiments of the present application, the small A shell can be used to describe the above-mentioned structural member. For example, the small A shell can include the structural member made of non-conductive material arranged between the metal frame and the display screen. In some implementations, the small A shell can also be referred to as the first structural member.

[0144] As a possible implementation, referring to FIG. 8, a schematic diagram of the xoy plane of the electronic device in an unfolded state is provided. In this example, the small A shell can be arranged on the A screen and the B screen. Taking the small A shell on the A screen as an example, the small A shell can be fixedly connected with the metal frame and the metal middle frame respectively by means of adhesion of non-conductive glue and the like.

[0145] For example, the small A shell can be fixedly connected with the metal frame corresponding to the antenna 1, the metal frame corresponding to the antenna 2, and the middle frame A.

[0146] It can be understood that in some structural implementations, the metal frame and the metal middle frame can be separated by a gap. Then as a possible implementation, the non-conductive material as a part of the small A shell can be filled (or bonded or crimped) between the metal frame and the metal middle frame, so that the metal frame, the non-conductive material and the metal middle frame are sequentially connected to form the gap structure between the metal frame and the metal middle frame.

[0147] It should be noted that the small A shell (such as the structural member made of non-conductive material shown in FIG. 8) shown in FIG. 8 completely surrounds the middle frame A and the middle frame B respectively. In other embodiments, the small A shell can also cover a smaller area, or be composed of multiple structural members that are not connected to each other.

[0148] FIGS. 9 and 10 respectively provide schematic diagrams of the xoz cross section of the electronic device in different folding states.

[0149] As shown in FIG. 9, a schematic diagram of the xoz cross section of the electronic device in an unfolded state is provided. FIG. 9 shows part of the structure in the xoz cross section. In other implementations, the xoz cross section of the electronic device can also be provided with more or fewer structural components, which are not described one by one here. For example, the xoz cross section shown in FIG. 9 can be a cross section schematic diagram obtained based on the cd line shown in FIG. 8.

[0150] In other embodiments, the cd line shown in FIG. 8 can also be arranged to transversely pass through the radiator of the antenna 2, so that in the xoz cross section schematic diagram shown in FIG. 9, the antenna radiator can be the radiator of the antenna 2.

[0151] The antenna radiator can include a protruding feeding portion. The feeding portion is structurally connected with the antenna radiator and is in conduction with each other. In this way, through electrical connection, a feeding signal can be fed from the feeding portion to the antenna radiator so as to facilitate the antenna radiator to radiate.

[0152] On the side of the antenna radiator close to the rotation shaft, the display screen, the middle frame A and the PCB are stacked along the z-axis direction respectively.

[0153] The PCB can be used to carry various chips, electronic devices and communication wires in the electronic device. In some implementations, the PCB can be a multi-layer PCB. Each layer can be covered with copper according to different designs to realize the setting of a reference ground or the arrangement of a communication cable.

[0154] As shown in FIG. 9, the small A shell can be irregularly shaped. In specific implementations, the shape of the small A shell can be flexibly set according to the gap between the antenna radiator (i.e., the metal frame) and the display screen. The small A shell can be filled between the antenna radiator and the display screen to realize the functions of fixing the display screen, fixing the antenna radiator, dustproofing and waterproofing, etc. For example, the small A shell can be bonded to the end of the antenna radiator and the display screen by using non-conductive glue to realize fixed connection with the antenna radiator and the display screen.

[0155] It can be understood that FIG. 9 only shows the stacking in the xoz plane when the antenna is arranged on the A screen. In other embodiments, the similar stacking structure and the small A shell can also be arranged on the B screen, and the specific implementation can be flexibly set according to actual conditions.

[0156] FIG. 10 provides a cross-sectional view of the electronic device in the xoz plane in the folded state. As described above, in the folded state, the metal part corresponding to the middle frame B is stacked with the metal corresponding to the middle frame A. Correspondingly, the metal of the middle frame B is close to the antenna radiator. Therefore, the cavity electric field shown in FIG. 2 will appear between the middle frame A and the middle frame B, thereby affecting the radiation performance of the antenna 1 and / or the antenna 2. In addition, since the middle frame B is close to the antenna 1 and the antenna 2 at the same time, the current loop on the middle frame B shown in FIG. 5 will appear, which will cause the isolation between the antenna 1 and the antenna 2 to deteriorate, further affecting the radiation performance of the antenna 1 and / or the antenna 2.

[0157] It should be noted that the structure implementation provided in FIGS. 9 and 10 is only an example and does not constitute a limitation on the position and shape of the metal frame, the small A shell and / or the metal middle frame in the embodiments of the present application. The embodiments of the present application do not limit this.

[0158] The technical solutions provided by the embodiments of the present application will be described in detail below taking the structure shown in FIGS. 9 and 10 as an example.

[0159] In the embodiments of the present application, a connection assembly can be provided in the electronic device. The connection assembly and the antenna (such as the antenna 1 and / or the antenna 2) in the electronic device can constitute an antenna device.

[0160] As an example, refer to FIG. 11. When the electronic device is in the folded state, one end of the connection assembly can be coupled to one or more positions on the side of the middle frame A close to the antenna radiator (e.g., the metal side frame corresponding to the antenna 1 or the antenna 2). The other end of the connection assembly can be coupled to one or more points on the side of the middle frame B close to the antenna radiator (e.g., the metal side frame corresponding to the antenna 1 or the antenna 2).

[0161] For example, in some implementations, the position on the side of the middle frame A close to the antenna radiator, where the connection assembly is coupled, can be included on the surface of the middle frame A opposite the antenna radiator. In other implementations, the position on the side of the middle frame A close to the antenna radiator, where the connection assembly is coupled, can be included on the surface of the middle frame A opposite the middle frame B. For example, the coupled position can be on the surface of the middle frame A opposite the middle frame B, close to the edge of the antenna radiator.

[0162] Correspondingly, in some implementations, the position on the side of the middle frame B close to the antenna radiator, where the connection assembly is coupled, can be included on the surface of the middle frame B opposite the middle frame A. For example, the coupled position can be on the surface of the middle frame B opposite the middle frame A, close to the antenna radiator. For example, the position close to the antenna radiator can include the antenna radiator and the projection area on the middle frame B of the gap between the antenna radiator and the middle frame A.

[0163] As an example in FIG. 10, the point on the middle frame A where the connection assembly is coupled can include P1. The point on the middle frame B where the connection assembly is coupled can include P2. The projections of P1 and P2 on the xoz plane to the side frame of the electronic device are covered by the side frame corresponding to the radiator of either antenna. For example, the projections of P1 and P2 on the A-screen side frame can be covered by the side frame corresponding to the antenna 1 or the side frame corresponding to the antenna 2.

[0164] In some implementations, P1 can be disposed in region 1 or region 2 as shown in FIG. 10.

[0165] For example, region 1 can be the surface of the middle frame A opposite the antenna 1 radiator. Region 2 can be a partial region on the surface of the middle frame A opposite the middle frame B close to the antenna 1. For example, when the middle frame A is divided into left and right parts along the middle line, region 2 can include the part of the middle frame A away from the rotation shaft. In some embodiments of the present application, region 1 and region 2 can be referred to as one end of the middle frame A away from the rotation shaft.

[0166] In some implementations, P2 can be disposed in region 3 as shown in FIG. 10.

[0167] For example, region 3 can be included on the surface of the middle frame B opposite the middle frame A. For example, region 3 can be the projection area on the middle frame B of the antenna 1 and the gap S1 between the antenna 1 and the middle frame A.

[0168] It can be understood that the above description of the area 3 where P2 is located is only an example. In other implementations, P2 can also be arranged at a position outside the area 3. For example, P2 can be arranged on the face of the middle frame B opposite to the middle frame A, and the area 3 is deviated to the side area of the rotation shaft.

[0169] It can be understood that the closer the positions of P1 and P2 to the projection of the antenna 1 to the middle frame B, the better the connection assembly between P1 and P2 can block the electromagnetic waves radiated by the antenna 1 from entering the cavity between the middle frame A and the middle frame B, thereby making the cavity have less influence on the radiation performance of the antenna 1.

[0170] The above takes the point connection between the connection assembly and the middle frame A and / or the middle frame B as an example.

[0171] In other embodiments, in the case of line connection or surface connection between the connection assembly and the middle frame A and / or the middle frame B, the projection of the line connection or surface connection to the side frame can include at least part of the corresponding side frame being covered by the radiator of any antenna.

[0172] It should be noted that in combination with the foregoing description of the coupling, the electrical connection of the connection assembly at P1 and P2 to the middle frame A and / or the middle frame B can be direct or indirect electrical connection.

[0173] For example, direct electrical connection can include conductive glue bonding, welding, metal spring connection, conductive foam compression, etc.

[0174] For another example, the coupling electrical connection can include electrical connection realized by constructing a distributed capacitor, etc.

[0175] In some embodiments, the electrical connection can correspond to a connection state that is conductive at all frequency bands (such as 600MHz-6GHz). In other embodiments, the electrical connection can correspond to a connection state that is equivalent to a conductive state at the working frequency band of the antenna 1 and / or the antenna 2.

[0176] Taking the antenna 1 as an example. When the antenna 1 is working, the cavity composed of the middle frame A, the metal rotation shaft and the middle frame B can exhibit a stacked state for the electromagnetic waves radiated by the antenna 1 due to the arrangement of the connection assembly. That is, the electromagnetic waves of the antenna 1 will not be radiated into the cavity between the middle frame A and the middle frame B. Then there will be no cavity electric field in the cavity. Thus, the radiation performance decline caused by the cavity electric field can be effectively avoided.

[0177] In addition, due to the arrangement of the connecting assembly, when the antenna (e.g., antenna 1) radiates in the folded state, the current distribution generated on the middle frame B is the same as that on the middle frame A. Thus, taking the example of the antenna 1 working to excite a transverse current on the middle frame A, the current on the middle frame A can also flow to the middle frame B through the conduction of the connecting assembly, so that a transverse current is also generated on the middle frame B.

[0178] Similarly, taking the example of the antenna 2 configured to work to excite a longitudinal current on the middle frame A, a longitudinal current can also be generated on the middle frame B.

[0179] Thus, when the antenna 1 and the antenna 2 work, for the middle frame A, since the orthogonal current can be excited on the middle frame A, the antenna 1 and the antenna 2 can have a better isolation degree. Similarly, for the middle frame B, due to the arrangement of the connecting assembly, the orthogonal current can also be excited on the middle frame B, so that the antenna 1 and the antenna 2 can also have a better isolation degree when the middle frame B cooperates with the antenna 1 and the antenna 2 to radiate. That is, through the arrangement of the connecting assembly, the increased isolation degree of the middle frame A based on the antenna 1 and the antenna 2 can also be effective for the middle frame B. In this way, the problem of the isolation degree of the antenna 1 and the antenna 2 decreasing due to the middle frame B being close to the middle frame A in the folded state can be avoided. In the case where the antenna 1 and the antenna 2 are configured to increase the isolation degree through other means, since the current distribution on the middle frame A and the middle frame B is basically the same, the isolation degree of the antenna 1 and the antenna 2 can also be effectively improved in the folded state through the means of increasing the isolation degree.

[0180] The following provides a specific arrangement of the connecting assembly in combination with the description in FIGS. 9 and 10.

[0181] Referring to FIG. 12, a structural stack diagram of an electronic device in an unfolded state is shown. Compared with the example in FIG. 9, in the implementation as shown in FIG. 12, a connecting assembly is additionally arranged. In some implementations, the connecting assembly can be a non-conductive structure based on a small A shell arranged as a support.

[0182] For example, as shown in FIG. 12, the connecting assembly can be arranged in the area corresponding to the A screen. The A screen can be the side of the electronic device with a metal frame that is multiplexed as an antenna radiator.

[0183] One end of the connecting assembly can be coupled with the middle frame A. In the unfolded state, since the middle frame B is away from the middle frame A, the end of the connecting assembly away from the middle frame A can be suspended. Through the arrangement of the connecting assembly, a flow path from the middle frame A to the side of the display screen is provided.

[0184] Figure 13 provides a schematic diagram of the stack in the folded state. As shown in Figure 13, in the folded state, the A screen and the B screen are stacked on each other, and the middle frame A and the middle frame B have at least partial overlap in the z-direction projection. Meanwhile, the middle frame B is close to the antenna radiator.

[0185] In this folded state, the end of the connecting assembly that is far from the middle frame A is close to the middle frame B, thereby forming a distributed capacitance coupling structure.

[0186] In this application, in the folded state, the distance between the end of the connecting assembly that is close to the middle frame B and the middle frame B is controlled to be between 0.02 mm and 1 mm. In this way, in the folded state, the distributed capacitance formed by the end of the connecting assembly that is close to the middle frame B and the middle frame B is equivalent to a conductive state with respect to the current at the antenna operating frequency. That is, through the distributed capacitance structure, electrical connection between the middle frame A and the middle frame B at the end close to the antenna radiator can be achieved at the antenna operating frequency.

[0187] It should be noted that in the embodiments of the present application, the end of the connecting assembly that is closest to the middle frame B corresponds to a plane parallel to the middle frame B, which constitutes a distributed capacitance structure. In this way, the minimum distance between the connecting assembly and the middle frame B is the distance between the plane parallel to the middle frame B and the middle frame B. This distance can be controlled to be between 0.02 mm and 1 mm, thereby enabling the electrical signal at the operating frequency band to smoothly pass through the distributed capacitance formed by the plane parallel to the middle frame B of the connecting assembly and the middle frame B.

[0188] In other embodiments, the plane where the part of the connecting assembly opposite to the middle frame B is located can also be non-parallel to the middle frame B. In this way, a distributed capacitance structure can also be formed. In this example, the minimum distance between the part of the connecting assembly opposite to the middle frame B and the middle frame B can be set to be between 0.02 mm and 1 mm, thereby enabling the electrical signal at the operating frequency band to smoothly pass through the distributed capacitance formed by the plane parallel to the middle frame B of the connecting assembly and the middle frame B.

[0189] In other embodiments, the connecting assembly can also be directly electrically connected to the middle frame B if the structure allows. For example, the end of the connecting assembly close to the middle frame B can be directly electrically connected to the middle frame B. In this way, a distributed capacitance does not need to be constructed, and the conduction of the current between the connecting assembly and the middle frame B can be achieved. In this case, the minimum distance between the connecting assembly and the middle frame B can be 0 mm.

[0190] In summary of the above two cases, in the present application, the minimum distance between the connecting assembly (such as the end of the connecting assembly close to the middle frame B) and the middle frame B can be configured to be between 0 mm and 1 mm when the electronic device is in the folded state.

[0191] In specific implementations, the specific component implementation of the connection assembly and the connection mode with the middle frame A can have various different changes. For example, in some implementations, the connection assembly can be directly electrically connected with the middle frame A or coupled with the middle frame A through a distributed capacitor. Similarly, the connection assembly can be directly electrically connected with the middle frame or coupled with the middle frame through a distributed capacitor.

[0192] As an example, referring to FIG. 14, a schematic diagram of the component implementation of the connection assembly is provided.

[0193] As shown in FIG. 14, in this example, the connection assembly can include component 1, component 2, and component 3.

[0194] The component 1, the component 2, and the component 3 are all conductive materials.

[0195] In some embodiments, the component 1 can include any one of the following forms: a conductive PCB, a conductive FPC, a steel sheet, a conductive foam, and the like.

[0196] The component 1 can be electrically connected with the middle frame A in any one of the following forms: welding, bonding with the middle frame A through conductive glue, and crimping.

[0197] The component 3 can be configured with the small A shell as a support. For example, the component 3 can be configured along the surface of the small A shell.

[0198] The component 3 can be configured on the surface of the small A shell in any one of the following forms: physical vapor deposition (PVD), silver paste coating, conductive PCB, LDS, steel sheet, and the like.

[0199] It should be noted that in some embodiments of the present application, the setting area of the component 3 on the small A shell can at least extend to the side close to the middle frame B in the folded state. Thus, the part of the component 3 extending to the side close to the middle frame B in the folded state can effectively form a distributed capacitor with the middle frame B, so as to realize the mutual conduction of the electrical signals on the side close to the antenna radiator of the middle frame A and the middle frame B in the folded state.

[0200] In combination with the description in FIGS. 12 and 13, in this example, the component 3 can be configured by being coated on the side of the small A shell close to the middle frame B (in the folded state). In this way, after the component 3 is coated, the minimum distance between the small A shell and the middle frame B in the folded state of the electronic device can be between 0 mm and 1 mm.

[0201] In this example as shown in FIG. 14, the component 2 can also be referred to as an electrical connection guide. The component 2 can be used to realize the electrical connection of the component 1 and the component 3.

[0202] For example, the component 2 can be configured in the form of a metal spring, conductive foam, etc. The component 2 can be fixedly connected to the component 3 or fixedly connected to the component 1. The electrical connection between the component 1 and the component 3 can be achieved by elastic connection, pressure connection, etc.

[0203] For example, the component 1 is configured by a rigid conductive material (such as a conductive PCB, a conductive FPC, a steel sheet, etc.), and the component 3 is configured by a conductive coating (such as a PVD coating, a silver paste coating, etc.) on the small A shell. Since the rigid contact between the rigid conductive material and the conductive coating will cause too large resistance, which is not conducive to the conduction of the electric current between the middle frame A and the middle frame B. Therefore, in the present example, the configuration of the component 2 can effectively reduce the resistance between the component 1 and the component 3, so that the electric signal can be better conducted between the middle frame A and the middle frame B.

[0204] It can be understood that, in contrast to the rigid contact connection mode, the flexible connection connection mode can be used. For example, the flexible connection contact mode can include pressure connection, elastic connection, etc. When connected by flexible connection, at least one of the two components connected to each other can be connected (or electrically connected) to the other component with smaller resistance by the flexible connection force generated by deformation.

[0205] Therefore, in the above embodiments of the present application, by providing the component 2, the flexible connection between the component 1 and the component 3 through the component 2 is achieved, thereby reducing the resistance of the electric signal when conducted between the component 1 and the component 3.

[0206] It should be noted that, in the example of FIG. 14, the electrical connection between the component 1 and the component 3 is achieved by the component 2. In other embodiments, when the component 1 includes an elastic component and can be directly connected to the component 3 by elastic connection or pressure connection with smaller resistance, the connection assembly can also not include the component 2, and the component 1 and the component 3 can be used to achieve the setting of the connection assembly.

[0207] In the embodiments of the present application, the connection assembly composed of the component 1, the component 2 and the component 3 can constitute a current conduction path on the side of the middle frame A-middle frame B close to the antenna radiator with the middle frame A and the middle frame B. In specific implementation, the smaller the resistance on the current conduction path, the better the suppression effect on the cavity electric field in the folded state.

[0208] In some embodiments, the resistance of the current conduction path can be reduced in any of the following ways: nickel plating treatment at the welding position, gold plating treatment of the spring elastic connection point, use of silver paste material for the conductive coating, etc.

[0209] In addition, in some embodiments, a large-area rigid conductive material can be used in the configuration of component 1. The larger the area of the rigid conductive material that is projected onto the area of the middle frame A that is covered by the A-screen projection area, the smaller the resistance between the connecting assembly and the middle frame A. As an example, in the implementation of FIG. 14, 141 and 142 are included. 141 can have a planar structure. At least a portion of 141 can be fixedly electrically connected to the middle frame A, such as by welding. 142 can be a portion of component 1 that is not covered by the middle frame A after the A-screen projection. In some implementations, 142 can have a curved surface structure that is elastic in the z-direction. In other implementations, 142 can have a planar structure.

[0210] In some embodiments, a large-area conductive coating can be applied to the side of the small A-shell that is close to the middle frame B. The larger the area of the conductive coating on the side of the small A-shell that is close to the middle frame B, the lower the frequency of the antenna that can be covered, and the more conducive to the conduction of current between the connecting assembly and the middle frame B. As an example, component 3 can include 143 and 144. 143 can be a conductive coating on the surface of the small A-shell that extends in the z-direction. 144 can be a conductive coating on the surface of the step of the small A-shell that extends in the lateral direction and is directly electrically connected to 143. In this example, the U-shaped conductive coating of 144 can include a conductive coating surface that is parallel to the middle frame B on the side that is close to the middle frame B, thereby forming a distributed capacitance with the middle frame B in the folded state. The distributed capacitance can be equivalent to a state in which the antenna (such as antenna 1 and / or antenna 2) is in conduction at the operating frequency band.

[0211] In the example of FIG. 14, component 2 can be disposed between component 1 and component 3 to electrically connect component 1 and component 3. In some implementations, component 2 can be implemented in the form of conductive foam, metal spring, or the like. As an example, one end of component 2 can be fixedly connected to 142 of component 1. The other end of component 2 can be spring-connected or crimp-connected to 143 of component 3. In other embodiments, component 2 can also be fixedly connected to component 3 and spring-connected or crimp-connected to component 1. In other embodiments, component 2 can also be spring-connected or crimp-connected or fixedly connected (such as by welding) to both component 1 and component 3.

[0212] It should be noted that the specific configurations of the connecting assembly provided in the above examples are merely examples and do not constitute a specific limitation on the connecting assembly. In other embodiments of the present application, the connecting assembly can also be configured in other forms between the middle frame A and the middle frame B to achieve the mutual conduction of current between the middle frame A and the middle frame B on the side close to the antenna radiator within the operating frequency.

[0213] Exemplarily, in some implementations, only the component 1 and the component 3 can be included in the connection assembly. The component 1 and the component 3 are directly electrically connected or coupled electrically connected. That is, in this example, the component 2 can no longer be arranged to conduct current between the component 1 and the component 3.

[0214] In other implementations, the component 1, the component 2 and the component 3 in the connection assembly can be implemented by the same conductive component. For example, the connection assembly can include a rigid metal sheet (such as a steel sheet) having at least the outer shape of the component 1 and the component 3. One side of the rigid metal sheet can be coupled with the middle frame A, and the other side of the rigid metal sheet can be attached to the small A shell, thereby realizing the fixation of the connection assembly. Similar to the implementation of the component 3 described above, in the folded state, the side of the component 3 close to the middle frame B can form a distributed capacitance with the middle frame B, realizing the conduction of current between the middle frame A and the middle frame B.

[0215] It should be noted that in the above embodiments, the connection assembly is taken as an example to be directly electrically connected (such as being welded to the middle frame A by the component 1) on the side close to the middle frame A, and to be coupled electrically connected (such as forming a distributed capacitance with the middle frame B by the component 3) on the side close to the middle frame B. In other embodiments, the connection assembly can also be configured to conduct current with the middle frame A in the form of coupled electrical connection. In other embodiments, the connection assembly can be configured to conduct current with the middle frame B in the form of direct electrical connection.

[0216] In different implementations, according to the configured electrical connection form, the structural connection form of the connection assembly with the middle frame A and / or the middle frame B can be flexibly adjusted. The embodiments of the present application do not limit this.

[0217] The above FIGS. 12-14 provide a schematic of the arrangement of the connection assembly in the zox plane. In combination with the schematic of the small A shell in the figure, in different implementations, the projection area of the connection assembly in the xoy plane can cover different areas. Correspondingly, in the area of the connection assembly arranged in the y-axis direction, the connection assembly can have the structural composition shown in FIGS. 12-14 in the corresponding xoz cross section.

[0218] Exemplarily, taking the distribution area of the radiator of the antenna 1 in the y-axis direction as [y1, y2] as an example.

[0219] In some embodiments, the y-axis coordinate of the projection area of the connection assembly in the xoy plane can be at least partially included in the range of [y1, y2]. In this way, the arrangement of the connection assembly can effectively avoid the influence of the cavity electric field on the antenna 1. At the same time, it can also avoid the deterioration of the isolation degree of the antenna 1 and the antenna 2 in the folded state.

[0220] In some embodiments, the y-axis coordinate of the projection area of the connecting assembly in the xoy plane can be at least partially included in the y-axis distribution interval of the radiator of the antenna 2. In this way, the connecting assembly can effectively avoid the influence of the cavity electric field on the antenna 2. At the same time, the isolation of the antenna 1 and the antenna 2 in the folded state can also be improved.

[0221] In some embodiments, the y-axis coordinate of the projection area of the connecting assembly in the xoy plane can be included in the y-axis distribution interval of the radiator of the antenna 1 and the antenna 2. In this way, the radiation performance of the antenna 1 and the antenna 2 can be significantly improved.

[0222] In some embodiments, based on the above description of the connecting assembly in the zox plane and the xoy plane, the connecting assembly can be implemented in the electronic device through a three-dimensional assembly.

[0223] For example, referring to FIG. 15, a schematic diagram of a connecting assembly is provided. In this example, the component 1 and the component 3 can be respectively arranged in the y-axis direction according to the structure of the xoz cross section in the above examples. One or more components 2 can be arranged between the component 1 and the component 3 for electrical connection. The more the number of the components 2, the better the electrical connection between the component 1 and the component 3, and the more obvious the improvement of the antenna radiation performance through the arrangement of the connecting assembly.

[0224] In addition, in different implementations, the connecting assembly can be continuous in the y-axis direction, or can include multiple discontinuous parts.

[0225] For example, referring to FIG. 16, in some embodiments, as shown in 1601, the component 1 and the component 3 in the connecting assembly can be respectively arranged as continuous metal components. The y-axis coordinate interval of the connecting assembly can include the y-axis coordinate interval of the radiator of the antenna 1 and the antenna 2. The specific arrangement of the connecting assembly can refer to the examples in FIGS. 12-15.

[0226] In some embodiments, as shown in 1602, the component 1 and the component 3 in the connecting assembly can be respectively arranged as discontinuous metal components. The y-axis coordinate interval of the connecting assembly can include the y-axis coordinate interval of the radiator of the antenna 1 and the antenna 2. The specific arrangement of the connecting assembly can refer to the examples in FIGS. 12-15.

[0227] In some embodiments, the y-axis coordinate interval of the connecting assembly can include at least part of the y-axis coordinate interval of the radiator of the antenna 1 and / or the antenna 2.

[0228] Based on the above description, through the arrangement of the connecting assembly, the radiation performance of the antenna 1 and the antenna 2 in the folded state can be effectively improved.

[0229] It should be noted that in the above examples, the middle frame A is located on the same surface as the antenna (e.g., the surface on which the A screen is located), the component 1 is fixedly connected to the middle frame A, and the middle frame B is coupled to the component 3. In other embodiments, the middle frame A located on the same surface as the antenna can also be electrically connected to the component 1 in a coupled manner. In other embodiments, the middle frame B located on different surfaces can also be electrically connected to the component 3 in a fixedly connected manner. In different implementations, the middle frame A and the middle frame B are equivalent to being conductive at the working frequency through the connection assembly.

[0230] The improvement effect is specifically described below in combination with simulation results.

[0231] For example, referring to FIG. 17, an efficiency simulation diagram of the antenna 1 in the folded state after the connection assembly is arranged is shown.

[0232] As shown in FIG. 17, in the case where the electronic device is in the folded state after the connection assembly is arranged, the free space, left-handed mode (HL) efficiency, and right-handed mode (HR) efficiency of the antenna 1 do not have significant notches. That is, due to the arrangement of the connection assembly, the cavity electric field is effectively suppressed, thereby avoiding the occurrence of efficiency notches. The effect of improving the radiation performance will not be weakened due to changes in holding states such as holding the electronic device.

[0233] For example, referring to FIG. 18, an efficiency simulation diagram of the antenna 2 in the folded state after the connection assembly is arranged is shown.

[0234] Similarly to the description in FIG. 17, as shown in FIG. 18, in the case where the electronic device is in the folded state after the connection assembly is arranged, the free space, left-handed mode (HL) efficiency, and right-handed mode (HR) efficiency of the antenna 2 do not have significant notches.

[0235] In addition, the arrangement of the connection assembly in this application can also avoid the deterioration of the isolation of the antenna in the folded state.

[0236] For example, referring to FIG. 19, a return loss and isolation simulation diagram of the antenna 1 and the antenna 2 in the folded state after the connection assembly is arranged is shown.

[0237] As shown in FIG. 19, in the case where the minimum points of the return loss of the antenna 1 and the antenna 2 are both more than -10 dB, that is, the antenna 1 and the antenna 2 both have good radiation performance, the isolation is controlled to be less than -18 dB. Compared with the example in FIG. 6, after the connection assembly is arranged, the deterioration of the isolation of the two antennas in the folded state is effectively avoided.

[0238] Figure 20 provides a comparison of the system efficiency simulation of antenna 1 and antenna 2 in the case of the connection assembly separation setting (as 1602 in Figure 16). As shown in Figure 20, in the connection assembly separation setting, there is also no significant dip in the system efficiency of antenna 1 and antenna 2.

[0239] As can be understood from the above description, due to the connection assembly setting, the radiation performance of the antenna in the folded state can be effectively improved without changing the antenna scheme. Correspondingly, in different embodiments, the implementation of the scheme is not limited to the specific form of the antenna. For example, antenna 1 and / or antenna 2 in the above embodiments can be a monopole antenna, a dipole antenna, a loop antenna, a left-handed antenna, an inverted F antenna, an IFA antenna, a magnetic current loop antenna, and / or a current loop antenna.

[0240] The type of communication system corresponding to the antenna 1 or antenna 2 is also not limited. For example, the communication system corresponding to the antenna 1 and / or antenna 2 can be a cellular communication system, a WIFI communication system, a GPS communication system, etc.

[0241] In addition, it should be noted that in the above scheme examples, the configuration of the antenna radiator multiplexing the metal frame is taken as an example for description.

[0242] As can be understood, in other embodiments, when the antenna is configured in a foldable device with a non-metal frame structure in the form of FPC, LDS, etc., due to the presence of the middle frame A and the middle frame B, the problems shown in Figures 2 to 6 will also occur in the folded state. That is, in the folded state, due to the presence of the cavity electric field, the antenna radiation performance is reduced; and due to the fact that the middle frame B is close to the antenna radiator in the folded state, the isolation between the antennas is reduced. Thus, based on the connection assembly provided in the present application, the above problems can be effectively solved, and the antenna radiation performance can be improved. Therefore, the specific application of the connection assembly in the electronic device provided in the embodiments of the present application is not limited to the antenna multiplexing the metal frame, or the electronic device having a metal frame structure.

[0243] In the above embodiments, the antenna radiator is taken as an example and arranged outside the middle frame A. In this way, when the middle frame B is close to the antenna radiator in the folded state, the antenna radiation performance can be correspondingly improved by the above scheme implementation. As can be understood, in other implementations, the antenna radiator can be arranged outside the middle frame B, and the connection assembly is still arranged on the side of the A screen corresponding to the middle frame A. In this way, when the middle frame A is close to the antenna radiator in the folded state, the antenna radiation performance can also be correspondingly improved by the above scheme implementation. That is, when the connection assembly is fixedly connected to one side of the middle frame, the middle frame fixedly connected to the connection assembly can be arranged on the same surface as the antenna (such as the surface corresponding to the A screen or the surface corresponding to the B screen), or can be arranged on different surfaces.

[0244] In addition, the names of the middle frame A and the middle frame B are merely examples. In other implementations, the middle frame in the electronic device can also be described as a first metal middle frame and a second metal middle frame, etc. For example, the first metal middle frame can be the middle frame A, and the second metal middle frame can be the middle frame B. For another example, the first metal middle frame can be the middle frame B, and the second metal middle frame can be the middle frame A.

[0245] The above description of the configuration and the structural shape of the connecting assembly is merely an example. Among them, the component 3 in the connecting assembly can be arranged on the surface of the small A shell according to the structural shape of the side of the small A shell facing the display screen. That is, when the structural shape of the side of the small A shell facing the display screen is different, the structural shape of the component 3 coated on the surface of the small A shell of the connecting assembly can also be different.

[0246] As an example, referring to FIG. 21, a cross-sectional schematic diagram of the electronic device in another folding state is shown.

[0247] In this example, the connecting assembly can also include a component 1, a component 2, and a component 3. The component 1 can also be referred to as a first component, the component 2 can also be referred to as a second component, and the component 3 can also be referred to as a third component.

[0248] Among them, similar to the above-mentioned examples, one side of the component 1 can be directly electrically connected with the middle frame A, for example, welded. The other side of the component 1 can be directly electrically connected with the component 2. For example, the side of the component 1 away from the middle frame A can be welded with the component 2. The end of the component 2 away from the component 1 can be directly electrically connected with the component 3 in the form of crimping or elastic connection. The component 3 can be configured by brushing a metal coating on part of the surface of the small A shell.

[0249] In this example, the component 1 can include a first sub-component, a second sub-component, and a third sub-component electrically connected. Among them, the second sub-component can have a curved surface structure for avoiding and protecting the display screen.

[0250] The two sides of the second sub-component can be the first sub-component and the third sub-component, respectively.

[0251] The first sub-component can be a part of the component 1 close to the side of the middle frame A. The first sub-component can extend along the plane where the middle frame A is located. For example, the first sub-component can extend along the x-axis. The first sub-component of the component 1 can be directly electrically connected with the middle frame A. For example, the first sub-component can be welded with the middle frame A.

[0252] The third sub-component can be a part of the component 1 away from the side of the middle frame A. In some implementations, the plane where the third sub-component is located can be parallel to the plane where the first sub-component is located. In other implementations, the plane where the third sub-component is located can also be non-parallel to the plane where the first sub-component is located. The third sub-component can be used to electrically connect with the component 3 through the component 2.

[0253] It should be noted that in the present example, the configuration and composition of the first sub-component, the second sub-component and the third sub-component in the component 1 are only examples and do not constitute a specific limitation on the component 1. The composition of the component 1 can be flexibly set according to the actual situation. For example, in some implementations, the second sub-component can also be configured as a non-curved structure in the case that the component 1 does not need to avoid other components such as a display screen in the corresponding area. For example, the second sub-component can have a planar structure, etc.

[0254] In the present example, as shown in FIG. 21, the component 3 forms a step structure and a U-shaped structure by coating on the small A shell.

[0255] In some embodiments, the component 3 can include a fourth sub-component, a fifth sub-component and a sixth sub-component which are electrically connected. The fourth sub-component is connected to the sixth sub-component, and the sixth sub-component is further connected to the fifth sub-component.

[0256] The fourth sub-component can be arranged opposite to the third sub-component of the first component. Thus, the electrical connection of the component 2 is facilitated. In some implementations, the plane where the fourth sub-component is located is parallel to the plane where the third sub-component is located.

[0257] The sixth sub-component can include a first part and a second part. The first part of the sixth sub-component together with the fourth sub-component constitutes the step structure. The second part of the sixth sub-component is in an inverted L shape and together with the fifth sub-component constitutes the U-shaped structure.

[0258] In the folded state, the fifth sub-component can be opposite to the middle frame B to form a distributed capacitance structure. The distributed capacitance structure is equivalent to a conduction with respect to the working frequency band of the antenna (such as the antenna 1 or the antenna 2). Thus, the conduction between the component 3 and the middle frame B is realized through the fifth sub-component.

[0259] Similar to the above description of the component 1, the composition and structure of the component 3 in FIG. 21 are only examples. In other implementations, the structure of the component 3 can also be flexibly configured according to the support surface of the small A shell (or referred to as the first structural member) close to the middle frame A. Details are not described again.

[0260] In the present example, the component 2 can be arranged along the z-axis, so as to achieve the coupling of the component 1 and the component 3 along the z-axis. Since the third sub-component in the component 1 is arranged opposite to the fourth sub-component in the component 3, the component 2 is configured as an electrical connecting component along the z-axis, so as to achieve the electrical connection between the component 1 and the component 3. In some implementations, the component 2 can be fixedly and electrically connected to the third sub-component. The component 2 can also be spring-connected or crimp-connected to the fourth sub-component. Thus, the coating of the component 3 on the small A shell can not need to extend along the component 2 along the z-axis as shown in FIG. 14. In this way, the component 1 and the component 3 can be coupled through the component 2 on the opposite surfaces along the x-axis. Compared with the form that the part of the component 3 along the z-axis is coupled with the part of the component 1 extending along the x-axis, the scheme shown in FIG. 21 can more effectively utilize the space between the component 1 and the component 3, reduce the difficulty of arranging the component 2, and improve the electrical connection reliability between the component 1 and the component 3.

[0261] In combination with the foregoing description of the connecting assembly, in the present example, the electrical connection between the component 1 and the component 3 is achieved through the component 2. In other embodiments, the component 1 can also be electrically connected to the component 3 in other forms. For example, the component 1 can be directly or coupled electrically connected to the component 3 without the component 2. For another example, the component 1 can be electrically connected to the component 3 through other forms or other components. The embodiments of the present application do not limit this.

[0262] It should be understood that, although the present application is described in conjunction with specific features and embodiments thereof, it is evident that various modifications and combinations are possible without departing from the scope of the present application. Accordingly, the present description and drawings are merely illustrative of the exemplary embodiments of the present application and are not intended to limit the scope of the present application, and any and all modifications, variations, combinations or equivalents that are within the scope of the present application are intended to be embraced by the present application. Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, they are intended to be embraced by the present application.

Claims

1. A foldable device, characterized by, The foldable device comprises a first part and a second part, the first part and the second part are connected by a rotating shaft; The first part comprises a first metal middle frame, the second part comprises a second metal middle frame, and the first part or the second part comprises a first antenna; The foldable device further comprises a connecting assembly, a first end of the connecting assembly is electrically connected with the first metal middle frame; When the first part and the second part rotate around the rotating shaft to be stacked, a second end of the connecting assembly is electrically connected with the second metal middle frame.

2. The foldable device of claim 1, wherein, The first part comprises the first antenna, and a first end of the connecting assembly is electrically connected with a first position of the first metal middle frame; The first position is arranged at one end of the first metal middle frame away from the rotating shaft.

3. The foldable device of claim 1 or 2, wherein, A second end of the connecting assembly is electrically connected with a second position of the second metal middle frame; the first part comprises the first antenna, The second position is included in a projection area of the first metal middle frame and a first gap on the second metal middle frame, and the first gap is a gap between the first metal middle frame and the first antenna.

4. The foldable device of any one of claims 1-3, wherein, The connecting assembly is at least partially made of conductive material.

5. The foldable device of any one of claims 1-4, wherein, The connecting assembly is arranged in the first part; The first end of the connecting assembly is fixedly and electrically connected with the first metal middle frame; When the first part and the second part are stacked, the second end of the connecting assembly is coupled and electrically connected with the second metal middle frame.

6. The foldable device of claim 5, wherein, When the first part and the second part are stacked, the minimum distance between the second end of the connecting assembly and the second metal middle frame is not greater than 1 mm.

7. The foldable device of claim 5 or 6, wherein, The connecting assembly comprises a first component and a third component, and the first component and the third component are both made of conductive material; A first end of the first component is fixedly and electrically connected with the first metal middle frame; When the first part and the second part are stacked, a second end of the third component is coupled and electrically connected with the second metal middle frame; A second end of the first component is electrically connected with a first end of the third component.

8. The foldable device of claim 7, wherein The first component comprises a first sub-component, and the first sub-component extends along a plane in which the first part is located.

9. The foldable device of claim 7 or 8, wherein The first component comprises a second sub-component, and the second sub-component is a curved structure, and the second sub-component is used to avoid a display screen of the foldable device.

10. The foldable device of any one of claims 7-9, wherein The first component comprises a third sub-component, and the third sub-component is opposite to at least part of the third component.

11. The foldable device of claim 10, wherein The third component comprises a fourth sub-component, and the fourth sub-component is parallel to a plane in which the third sub-component is located.

12. The foldable device of claim 10 or 11, wherein The third component comprises a fifth sub-component, ​ The third component is coupled to the second metal middle frame by the fifth sub-component when the first part and the second part are stacked.

13. The foldable device of any one of claims 10-12, wherein, The third component includes a fourth sub-component, a fifth sub-component, and a sixth sub-component, The first part of the sixth sub-component and the fourth sub-component form a stepped structure, and the second part of the sixth sub-component and the fifth sub-component form a U-shaped structure.

14. The foldable device of any one of claims 8-13, wherein, The foldable device is further provided with a display screen fixed by a first structural member, and the first structural member includes a non-metallic material. The fourth sub-component of the third component, the fifth sub-component of the third component, and the sixth sub-component of the third component are electrically connected, and the fourth sub-component of the third component, the fifth sub-component of the third component, and the sixth sub-component of the third component include a conductive coating arranged on the surface of the first structural member.

15. The foldable device of any one of claims 7-14, wherein, The first component includes at least one of: a conductive PCB, a conductive FPC, and a steel sheet.

16. The foldable device of any one of claims 7-15, wherein, The first end of the first component is welded to the first metal middle frame.

17. The foldable device of any one of claims 7-16, wherein, The connecting assembly further includes a second component made of a conductive material. The second end of the first component is electrically connected to the first end of the third component through the second component.

18. The foldable device of claim 17, wherein: The second end of the first component is fixedly electrically connected to the first end of the second component, and the second end of the second component is spring-connected or crimp-connected to the third component; or The second end of the first component is spring-connected or crimp-connected to the first end of the second component, and the second end of the second component is fixedly electrically connected to the third component.

19. The foldable device of claim 17 or 18, wherein, The second component includes a metal spring or a conductive foam.

20. The foldable device of any one of claims 1-19, wherein: At the operating frequency of the first antenna, the first metal middle frame and the second metal middle frame are conductive through the connecting assembly when the first part and the second part are stacked.

21. The foldable device of any one of claims 1-20, wherein, A projection of the connecting assembly to the first part covers at least part of the first antenna.

22. The foldable device of any one of claims 1-21, wherein, The foldable device is further provided with a second antenna, and a radiator of the second antenna is arranged on the same side of the foldable device as a radiator of the first antenna.

23. The foldable device of claim 22, wherein, A projection of the connecting assembly to the first part covers at least part of the second antenna. The foldable device is further provided with a second antenna, and a radiator of the second antenna is arranged on the same side of the foldable device as a radiator of the first antenna. A projection of the connecting assembly to the first part covers at least part of the second antenna.

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