Signal acquisition circuit board, battery module, and electric device

By designing a special structure and materials for the signal acquisition circuit board, the problem of easy breakage of the signal acquisition harness in the battery module was solved, realizing reliable signal acquisition and improving safety of the battery module. It is applicable to battery modules and electrical equipment.

WO2026032064A1PCT designated stage Publication Date: 2026-02-12ZHEJIANG ZEEKR INTELLIGENT TECH CO LTD +2
View PDF 4 Cites 0 Cited by

Patent Information

Application Number
PCT/CN2025/110956
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-08-08
Filing Date
2025-07-28
Publication Date
2026-02-12

AI Technical Summary

Technical Problem

The signal acquisition harness of existing battery modules is easily pulled and broken during charging and discharging, resulting in failure to acquire voltage and temperature data, posing a safety risk. In addition, it occupies a large space and has a low degree of automation.

Method used

A signal acquisition circuit board is designed. By setting the first and second connection areas to be offset from the finest part, and by utilizing the special arrangement and transition design of conductive sheets and circuit patterns, stress is dispersed and stress resistance is increased. Furthermore, protective layers and protective wide lines are set in key parts to prevent the finest part from being damaged by stress.

Benefits of technology

It improves the reliability and safety of signal acquisition circuit boards, reduces the concentration of stress on the lines, is suitable for multi-cell acquisition, has a simple manufacturing process, low cost, and is suitable for reliable signal acquisition of battery modules and electrical equipment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN2025110956_12022026_PF_FP_ABST
    Figure CN2025110956_12022026_PF_FP_ABST
Patent Text Reader

Abstract

The present application provides a signal acquisition circuit board, a battery module, and an electric device. The signal acquisition circuit board comprises: circuit patterns, each circuit pattern comprising a first connecting region, a first extension line, a thinnest portion, a second extension line, and a second connecting region which are sequentially connected, the first connecting region and the second connecting region being arranged in a first direction, the first connecting region and the second connecting region being both away from the thinnest portion in a second direction, the first connecting region and the second connecting region being located on the same side of the thinnest portion in the second direction, and the second direction intersecting with the first direction; first conductive sheets connected to the first connecting regions; and second conductive sheets connected to the second connecting regions.
Need to check novelty before this filing date? Find Prior Art

Description

Signal acquisition circuit board, battery module and electrical equipment

[0001] Related Applications

[0002] The present application claims priority to the Chinese patent application No. 202421907366.2, filed on August 08, 2024, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to, but is not limited to, the technical field of circuit board, in particular to a signal acquisition circuit board, a battery module and an electrical equipment. BACKGROUND

[0004] The automobile industry is rapidly transforming towards electrification, intelligentization and light weight, and the new energy automobile market is developing rapidly. As one of the core components of new energy vehicles, the quality of the battery pack determines the performance of the vehicle. The new energy battery pack generally contains multiple battery modules, each of which is configured with a set of integrated busbars (Cells Contact System, CCS), which are composed of signal acquisition wiring harnesses, return flow bars and isolation plates, among which the sampling wiring harness is responsible for the information acquisition of the working voltage and temperature of the battery cell.

[0005] In the early CCS scheme, electronic wiring harnesses are used for signal acquisition. This scheme is composed of electronic wiring harnesses and peripheral plastic plates, etc., and each electronic wire is connected to one battery cell electrode. When there are many power battery signals, many such electronic wires are needed, which will occupy a lot of space and be relatively heavy, and the degree of automation is low.

[0006] During the charging and discharging process of the battery cell, there will be a size change, and the sampling wiring harness in the CCS of the blade battery will often be reciprocally pulled during the charging and discharging process of the battery cell. If the sampling wiring harness breaks, it will cause the voltage and temperature of the whole battery pack to be unable to be collected, causing the battery cells in the battery pack to run in a state of loss of control, which has uncertainty or abnormal alarm for the use of the battery, and there is a safety risk. SUMMARY

[0007] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0008] The signal acquisition circuit board provided by the embodiment of the present disclosure comprises: a circuit pattern, the circuit pattern comprising a first connecting area, a first extension line, a thinnest part, a second extension line and a second connecting area connected in sequence, the first connecting area and the second connecting area being arranged along a first direction, the first connecting area and the second connecting area both deviating from the thinnest part along a second direction, the first connecting area and the second connecting area being located on the same side of the thinnest part along the second direction, and the second direction intersecting the first direction; a first conductive sheet connected to the first connecting area; and a second conductive sheet connected to the second connecting area.

[0009] By setting the positions of the first connecting area and the second connecting area to deviate from the thinnest part, the thinnest part can be well protected when the first connecting area and the second connecting area are subjected to external force, so as to avoid damage to the thinnest part due to stress. The signal acquisition circuit board provided by the embodiment of the present disclosure is reliable in performance.

[0010] In some embodiments, the second conductive sheet extends towards two opposite sides along the second direction; the first conductive sheet faces the thinnest part relative to the first connecting area, and the second conductive sheet faces away from the thinnest part relative to the second connecting area; and the first extension line is inclined by 20° to 70° relative to the first direction.

[0011] In this way, the signal acquisition circuit board is compact in structure; the circuit in the signal acquisition circuit board is smooth, and the circuit stress can be well distributed on all the circuits, so that the signal acquisition circuit board is reliable in performance; in addition, it is beneficial to realize production by die cutting process.

[0012] In some embodiments, the first extension line gradually widens along the direction away from the thinnest part, and the second extension line gradually widens along the direction away from the thinnest part.

[0013] In this way, by thickening the remaining circuits, it is also beneficial to improve the stress resistance of the circuits.

[0014] In some embodiments, in the extension plane defined by the circuit pattern, the thinnest part has an extension path, and the vertical dimension of the thinnest part at each position along the extension path ranges from 0.08 mm to 0.5 mm.

[0015] In this way, the function of the thinnest part can be ensured.

[0016] In some embodiments, the thinnest part is in a wave shape structure, and the radius of curvature of any wave bend of the thinnest part ranges from 0.5 mm to 3 mm.

[0017] In this way, the function of the thinnest part can be ensured, and the structural reliability of the thinnest part can be improved.

[0018] In some embodiments, one end of the first extension line connected to the thinnest part forms two arc-shaped transition parts on both sides of the thinnest part, and one end of the second extension line connected to the thinnest part forms another two arc-shaped transition parts on both sides of the thinnest part, and the radius of curvature of each arc-shaped transition part is 1 to 5 times the line width at the corresponding position.

[0019] In this way, by designing the arc-shaped transition at the inflection point of the line, the stress concentration of the line can be dispersed.

[0020] In some embodiments, the signal acquisition circuit board further comprises a protective layer covering the line pattern.

[0021] In this way, the structural stability of the line pattern is better, and the front and back sides of the first extension line, the second extension line, the thinnest part and the like can be insulated from the outside.

[0022] In some embodiments, the protective layer is provided with at least one hole between the first connecting area, the second connecting area and the thinnest part.

[0023] In this way, by opening the hole, the stress transmission path from the connecting area to the thinnest part can be cut off, and the thinnest part can be fully protected from the stress caused by the first connecting area and the second connecting area due to external force.

[0024] In some embodiments, the signal acquisition circuit board further comprises a micro connection point, and the micro connection point is located between the first connecting area and the second connecting area.

[0025] In this way, when the first connecting area and the second connecting area are under greater stress, the micro connection point can be broken to change or break the force transmission path, thereby protecting the integrity of the line pattern without opening the circuit.

[0026] In some embodiments, a plurality of line patterns are arranged along the first direction, and the protective layer is provided with at least one hole between adjacent two line patterns.

[0027] In this way, the signal acquisition circuit board is suitable for signal acquisition of multiple battery cells, and the influence between the line patterns is small. The signal acquisition circuit board can be manufactured by die cutting process, and the process is simple, low in cost, fast in line replication and pollution-free.

[0028] In some embodiments, the thinnest part and the second connecting area are oppositely arranged along the second direction; the signal acquisition circuit board further comprises a protective wide line, and the protective wide line is located between the thinnest part and the second connecting area, the protective wide line has a spacing with the line pattern, and the protective wide line is closer to the thinnest part relative to the second connecting area.

[0029] In this way, the protective wide line can be used to reduce the influence of the force transmitted at the first connecting area and the second connecting area on the thinnest part.

[0030] In some embodiments, the guard wide line has a guard dimension D along the second direction at any position along the first direction, and has a line width dimension d along the vertical direction of the extension path of the thinnest part, where 5d≤D≤10d.

[0031] In this way, the guard wide line is stable in state when under force, thereby improving the stability of the thinnest part near the guard wide line.

[0032] The battery module according to the embodiments of the present disclosure includes at least two battery cells arranged along a first direction, and the signal acquisition circuit board as described above, and the first conductive sheet and the second conductive sheet are respectively electrically connected to the corresponding battery cells.

[0033] The battery module according to the embodiments of the present disclosure can reliably acquire signals, is controllable to use, and is safe.

[0034] The electrical equipment according to the embodiments of the present disclosure includes the battery module as described above.

[0035] The electrical equipment according to the embodiments of the present disclosure can reliably acquire signals, is controllable to use, and is safe. BRIEF DESCRIPTION OF DRAWINGS

[0036] FIG. 1 is a structural schematic diagram of a battery module according to an embodiment of the present disclosure;

[0037] FIG. 2 is a schematic sectional view of A-A in FIG. 1;

[0038] FIG. 3 is a structural schematic diagram of a metal layer according to an embodiment of the present disclosure;

[0039] FIG. 4 is a schematic structural diagram of a metal layer according to an embodiment of the present disclosure;

[0040] FIG. 5 is a structural schematic diagram of a signal acquisition circuit board according to an embodiment of the present disclosure;

[0041] FIG. 6 is a schematic structural block diagram of an electrical equipment according to an embodiment of the present disclosure.

[0042] Explanation of reference signs: 100, signal acquisition circuit board; 1, line pattern; 101, first connection area; 102, first extension line; 103, thinnest part; 104, second extension line; 105, second connection area; 106, first arc-shaped transition part; 107, second arc-shaped transition part; 108, third arc-shaped transition part; 109, fourth arc-shaped transition part; 110, fifth arc-shaped transition part; 111, sixth arc-shaped transition part; 112, seventh arc-shaped transition part; 113, eighth arc-shaped transition part; 2, conductive sheet; 21, first conductive sheet; 211, first connection end; 212, first contact end; 22, second conductive sheet; 221, second connection end; 222, second contact end; 3, protective layer; 31, first protective layer; 32, second protective layer; 301, first hole; 302, second hole; 303, third hole; 304, fourth hole; 305, first connection point; 306, second connection point; 307, third connection point; 4, protective wide line; 200, battery module; 201, battery cell; 300, battery management system; 400, power consumption module; 500, electrical equipment. Embodiments of the present application

[0043] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and easy to understand, the specific embodiments of the embodiments of the present disclosure will be described in detail below with reference to the drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the embodiments of the present disclosure. However, the embodiments of the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the embodiments of the present disclosure, so the embodiments of the present disclosure are not limited by the specific examples of the embodiments disclosed below.

[0044] In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the embodiments of the present disclosure and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present disclosure.

[0045] In the embodiments of the present disclosure, unless specifically defined and limited otherwise, a first feature is "on" or "under" a second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "over", "above" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. The first feature "under", "below" and "underneath" the second feature can mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0046] In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. For example, the first conductive sheet can also be referred to as the second conductive sheet, and the second conductive sheet can also be referred to as the first conductive sheet. In the description of the embodiments of the present disclosure, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0047] In the embodiments of the present disclosure, unless specifically defined and limited otherwise, the terms "connected", "connected", etc. should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be flexibly connected, or it can be rigidly connected in at least one direction; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be directly connected while there is an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. The terms "installation", "arrangement", "fixation", etc. can be broadly understood as connection. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0048] As used herein, the terms "layer", "region" refer to a portion of material that includes a region having a thickness. Layers can extend horizontally, vertically, and / or along a tapered surface. Layers can be regions of uniform or non-uniform continuous structures that can have a thickness perpendicular to the direction of extension that is no greater than the thickness of the continuous structure. Layers can include multiple layers, which can be stacked or can be multiple layers that extend discretely. The shapes of various regions, layers, and their relative sizes and positional relationships in the drawings are exemplary only, and actual variations can occur due to manufacturing tolerances or technical limitations, and the design can be adjusted according to actual needs.

[0049] Referring to FIG. 1, a battery module according to an embodiment of the present disclosure is shown. In an exemplary embodiment, the battery module 200 includes a battery cell 201 and a signal acquisition circuit board 100, which is electrically connected to the battery cell 201.

[0050] In combination with FIG. 5, the signal acquisition circuit board 100 according to an embodiment of the present disclosure includes a circuit pattern 1 and a conductive sheet 2. The number of the conductive sheet 2 can be at least two. Each circuit pattern 1 can be electrically connected to two conductive sheets 2, which can be a first conductive sheet 21 and a second conductive sheet 22.

[0051] As shown in FIG. 1 and FIG. 3, the circuit pattern 1 includes a first connection region 101, a first extension line 102, a thinnest part 103, a second extension line 104, and a second connection region 105 connected in sequence. The circuit pattern 1 can have a plane parallel to the XY plane, and a thickness in the Z-axis direction. The circuit pattern 1 can be referred to as a circuit, and the circuit pattern 1 can extend continuously from the first connection region 101 to the second connection region 105. In other embodiments, the circuit pattern 1 can have a certain curvature.

[0052] In the plane of the circuit pattern 1, the extension paths of the parts of the circuit pattern 1 can ensure the transmission of current. Exemplarily, the extension path of the thinnest part 103 can be referred to as a first extension path, the first extension line 102 can have a second extension path, and the second extension line 104 can have a third extension path. The dimension of the circuit pattern 1 in the vertical direction of the extension path at each position can be referred to as the line width. The thinnest part 103 is the part of the circuit pattern 1 with the smallest line width. The line widths of the first connection region 101, the first extension line 102, the second extension line 104, and the second connection region 105 are all greater than the line width of the thinnest part 103.

[0053] The circuit pattern 1 can have substantially uniform thickness in the Z-axis direction, or can have certain thickness differences. In the transmission path of the current, the thinnest part 103 can have the smallest cross-sectional area. The resistance at the thinnest part 103 is large, and when the current of the circuit pattern 1 is too large, the thinnest part 103 can be fused, and the thinnest part 103 can act as a fuse in the circuit pattern 1.

[0054] The first connecting region 101 and the second connecting region 105 are arranged along a first direction, which can be parallel to the X-axis direction. A second direction can be present in the XY plane, which is transverse to the first direction, for example, the second direction is perpendicular to the first direction, for example, the second direction is parallel to the Y-axis direction. The first connecting region 101 and the second connecting region 105 can be approximately aligned or can be misaligned. The first connecting region 101 and the second connecting region 105 are both offset from the thinnest part 103 along the second direction, and the first connecting region 101 and the second connecting region 105 are located on the same side of the thinnest part 103 along the second direction, for example, in FIG. 1, the thinnest part 103 is located on the lower side of the thinnest part 103 along the Y-axis direction. The thinnest part 103 has a spacing from the first connecting region 101 along the Y-axis direction, and also has a spacing from the second connecting region 105. The first extension line 102 and the second extension line 104 can be designed as required.

[0055] The conductive sheet 2 is connected to the circuit pattern 1. For example, the conductive sheet 2 includes a connection end and a contact end, the connection end is connected to the circuit pattern 1, and the contact end is used to connect the battery cell 201, and the conductive sheet 2 is used to electrically connect the battery cell 201 and the circuit pattern 1. For example, the connection end of the first conductive sheet 21, i.e., the first connection end 211, is connected to the first connecting region 101. The connection end of the second conductive sheet 22, i.e., the second connection end 221, is connected to the second connecting region 105. The contact end of the first conductive sheet 21, i.e., the first contact end 212, protrudes from the circuit pattern 1, for example, protrudes from the first connecting region 101 along the Y-axis direction. The contact end of the second conductive sheet 22, i.e., the second contact end 222, protrudes from the circuit pattern 1, for example, protrudes from the second connecting region 105 along the Y-axis direction. In the signal acquisition circuit board 100, the circuit pattern 1 and the conductive sheet 2 can be placed on the battery cell 201 along the Z-axis direction, and the conductive sheet 2 is electrically connected to the battery cell 201.

[0056] During the operation of the battery cell 201, the signal acquisition circuit board 100 can be used to collect signals from the battery cell 201. The battery cell 201 can exert force on the conductive sheet 2 and then on the circuit pattern 1, for example, due to the expansion of the battery cell 201 during charging and discharging, environmental durability impact after long-term use, relative position changes of multiple battery cells 201, etc. The first conductive sheet 21 and the second conductive sheet 22 can be pulled to both sides along the X-axis direction, and then the first connecting region 101 and the second connecting region 105 can be pulled away to both sides. During this process, a stress region is formed near the first connecting region 101 and the second connecting region 105, and the thinnest part 103 can be considered as a non-stress region.

[0057] By setting the positions of the first connection region 101 and the second connection region 105 to deviate from the thinnest portion 103 and the first connection region 101 and the second connection region 105 to be on the same side of the thinnest portion 103, when the first connection region 101 and the second connection region 105 are subjected to an external force, the force-affected region deviates from the thinnest portion 103, and the thinnest portion 103 can be well protected from being damaged by the force. The signal acquisition circuit board 100 of the embodiment of the present disclosure has reliable performance.

[0058] In some embodiments, the second conductive sheet 22 extends along the second direction to opposite sides relative to the first conductive sheet 21; the contact end of the second conductive sheet 22 and the contact end of the first conductive sheet 21 are located on both sides of the first connection region 101 and the second connection region 105 as a whole. As shown in FIG. 1, the first contact end 212 is located on the upper side of the illustration of the first connection region 101 and the second connection region 105 along the Y-axis direction, and the second contact end 222 is located on the lower side of the illustration of the first connection region 101 and the second connection region 105 along the Y-axis direction. Exemplarily, the thinnest portion 103 and the contact end of the first conductive sheet 21 are on the same side of the first connection region 101 and the second connection region 105, in other words, along the second direction, the first conductive sheet 21 is relative to the first connection region 101 towards the thinnest portion 103, and the second conductive sheet 22 is relative to the second connection region 105 away from the thinnest portion 103. The signal acquisition circuit board 100 has a compact structure.

[0059] Exemplarily, the position of the thinnest portion 103 along the X-axis direction is substantially the same as the position of the second connection region 105. The first extension line 102 is inclined relative to the arrangement direction by 20° to 70°, for example, 30°, 45°, or 60°. Exemplarily, the second extension line 104 is substantially parallel to the Y-axis direction. The signal acquisition circuit board 100 has smooth lines, and the line stress can be well distributed on all lines, and has reliable performance; in addition, it is beneficial to realize production by die cutting process.

[0060] In other embodiments, the contact end of the second conductive sheet 22 and the contact end of the first conductive sheet 21 are located on the same side of the first connection region 101 and the second connection region 105 along the Y-axis direction as a whole.

[0061] In some embodiments, the dimension of the thinnest portion 103 at each position along the vertical direction of the extension path ranges from 0.08 mm to 0.5 mm, for example, 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, or 0.4 mm, which can ensure the function of the thinnest portion 103 to be realized.

[0062] Exemplarily, the first extension line 102 gradually widens in the direction away from the thinnest portion 103, and the second extension line 104 gradually widens in the direction away from the thinnest portion 103. By thickening the portion other than the thinnest portion 103, the stress resistance of the circuit pattern 1 is improved. The extension path of the first extension line 102 can be substantially linear, or can have a certain curvature. The extension path of the second extension line 104 can be substantially linear, or can have a certain curvature.

[0063] In some embodiments, the thinnest portion 103 is in a wave shape. The wave bends of the thinnest portion 103 can have the same size, or can be different. Exemplarily, the radius of curvature of any wave bend of the thinnest portion 103 ranges from 0.5 mm to 3 mm, for example, the radius of curvature of the wave bend is 0.7 mm, 1.3 mm, 1.9 mm or 2.5 mm, which can ensure the function of the thinnest portion 103 and improve the structural reliability of the thinnest portion 103. The radius of curvature can be measured at the inner circle of the wave bend. The radius of curvature of the wave bend of the thinnest portion 103 is greater than the line width of the thinnest portion 103, which is also beneficial to reduce the influence of stress on the thinnest portion 103 and avoid the thinnest portion 103 being pulled apart.

[0064] Referring to FIG. 4, exemplarily, the line width d of the thinnest portion 103 at each position is 0.1 mm. The thinnest portion 103 at each position can be substantially equal in width, or can have a certain change, for example, the middle position of the thinnest portion 103 is slightly narrower and the two ends are slightly wider. It can be understood that along the Y-axis direction, the Y-direction size e of different positions of the thinnest portion 103 can be greater than the line width d. For the thinnest portion 103 in a wave shape or other non-linear structure, it can have a structure width E along the Y-axis direction.

[0065] Exemplarily, one end of the first extension line 102 connected to the thinnest portion 103 forms two arc-shaped transition portions on both sides of the thinnest portion 103; one end of the second extension line connected to the thinnest portion forms another two arc-shaped transition portions on both sides of the thinnest portion. The radius of curvature of each arc-shaped transition portion is 1 to 5 times the line width at the corresponding position. The radius of curvature of the arc-shaped transition portion at each position of the two ends of the first extension line 102 and the two ends of the second extension line 104 is 1 to 5 times the line width at the corresponding position. By designing the arc-shaped transition of the inflection point of the circuit pattern 1, the stress of the circuit pattern 1 can be dispersed, and the stress concentration phenomenon of the circuit pattern 1 can be avoided. The line width on both sides of the arc-shaped transition portion along the extension path is different, exemplarily, the radius of curvature can be 1 to 5 times the line width of the thinnest portion 103, and in other embodiments, the arc-shaped transition portion can be a gradually changing arc. Exemplarily, the line width of the first extension line 102 can be 0.1 mm to 3 mm.

[0066] As shown in FIG. 3, the first extension line 102 and the first connecting area 101 form a first arc-shaped transition 106 and a second arc-shaped transition 107. In some embodiments, the second arc-shaped transition 107 can be considered as a fillet of the first connecting area 101. The first extension line 102 connects to one end of the thinnest part 103 to form a third arc-shaped transition 108 and a fourth arc-shaped transition 109. In some embodiments, at least one of the two arc-shaped transitions can be considered as a part of the wave structure of the thinnest part 103. For example, the first arc-shaped transition 106 has a radius of 3 mm, and the third arc-shaped transition 108 has a radius of 1 mm.

[0067] The second extension line 104 connects to one end of the thinnest part 103 to form a fifth arc-shaped transition 110 and a sixth arc-shaped transition 111. In some embodiments, at least one of the two arc-shaped transitions can be considered as a part of the wave structure of the thinnest part 103. The second extension line 104 and the second connecting area 105 form a seventh arc-shaped transition 112 and an eighth arc-shaped transition 113. In some embodiments, the seventh arc-shaped transition 112 can be considered as a part of the second connecting area 105. For example, the eighth arc-shaped transition 113 has a radius of 2 mm.

[0068] The first connecting area 101 and the second connecting area 105 can each be extended to a rectangle or other shape with a larger area. In some embodiments, the first connecting area 101 and the second connecting area 105 each form a fillet with a radius of 1 mm to 3 mm.

[0069] As shown in FIG. 2, in some embodiments, the signal acquisition circuit board 100 further includes a protective layer 3 covering the circuit pattern 1. The circuit pattern 1 has better structural stability, and the first extension line 102, the second extension line 104, and the thinnest part 103 on both sides along the Z-axis direction can be insulated from the outside. The protective layer 3 can include a first protective layer 31 and a second protective layer 32.

[0070] As shown in FIG. 1 and FIG. 2, in some embodiments, the protective layer 3 is provided with at least one hole between the first connecting area 101, the second connecting area 105, and the thinnest part 103. By opening the hole, the stress transmission path from the connecting area to the thinnest part 103 can be broken, and the thinnest part 103 can be fully protected from the stress caused by the first connecting area 101 and the second connecting area 105 due to external force. For example, the first hole 301 and the second hole 302 are located between the first connecting area 101 and the second connecting area 105. The third hole 303 is located between the second connecting area 105 and the thinnest part 103, and can extend to between the second connecting area 105 and the first extension line 102. Along the X-axis direction, the third hole 303 is also located between the first extension line 102 and the second extension line 104.

[0071] Exemplarily, the signal acquisition circuit board 100 can include micro connection points. The micro connection points can be part of the protective layer 3. The micro connection points can be located between the first connection area 101 and the second connection area 105. When the first connection area 101 and the second connection area 105 are under greater stress, the micro connection points can be broken to change or break the force transmission path, thereby protecting the integrity of the circuit pattern 1 and preventing open circuits.

[0072] The micro connection points can be the parts remaining between the holes. The first connection point 305 can be located at the boundary of the first hole 301. The second connection point 306 is located between the first hole 301 and the second hole 302. The third connection point 307 is located between the second hole 302 and the third hole 303.

[0073] In combination with FIGS. 2 and 3, in some embodiments, the thinnest part 103 is arranged opposite the second connection area 105 along the Y-axis direction. The signal acquisition circuit board 100 further includes a protective wide line 4 located between the thinnest part 103 and the second connection area 105. The protective wide line 4 can be used to slow down the effect of the force transmitted at the first connection area 101 and the second connection area 105 on the thinnest part 103.

[0074] Exemplarily, along the X-axis direction, the length of the protective wide line 4 can be greater than the length of the thinnest part 103. The protective wide line 4 can include a portion extending along the first extension line 102, which can help to reduce the force transmitted by the first extension line 102 to the thinnest part 103.

[0075] The protective wide line 4 has a spacing from the circuit pattern 1 and can not be used for conduction. The protective wide line 4 is closer to the thinnest part 103 relative to the second connection area 105, which can help to ensure that the non-stress area is isolated from the stress area. In some embodiments, the protective wide line 4 is located between the thinnest part 103 and the third hole 303, which can help to protect the thinnest part 103.

[0076] Exemplarily, the protective wide line 4 extends substantially along the X-axis direction. The dimension D of the protective wide line 4 along the Y-axis direction is 5 to 10 times the line width of the thinnest part 103, which can help to ensure the strength of the protective wide line 4. Exemplarily, the line width D of the protective wide line 4 is greater than the structure width E of the wave structure.

[0077] In combination with FIG. 5, in some embodiments, a plurality of circuit patterns 1 are arranged along a first direction, and the protective layer 3 is provided with at least one hole, i.e., at least one fourth hole 304, between adjacent two circuit patterns 1. The signal acquisition circuit board 100 is suitable for signal acquisition of a plurality of battery cells 201, and the influence between the circuit patterns 1 is small.

[0078] Exemplarily, the signal acquisition circuit board 100 is formed by a die-cutting process. The circuit pattern 1 in the signal acquisition circuit board 100 is manufactured by the die-cutting process, which has simple process procedures, low cost, fast line replication, and no pollution.

[0079] In some embodiments, the signal acquisition circuit board 100 can be formed by a printing process. Specifically, the circuit pattern 1 and the protective layer 3 are formed based on the printing process to form an excellent flexible printed circuit board with high reliability, high wiring density, light weight, thin thickness, good bending property, and small space occupation.

[0080] In some embodiments, the material of the conductive sheet 2 and the material of the circuit pattern 1 are both metal, which can be different. The conductive sheet 2 can be a nickel sheet. The material of the circuit pattern 1 can be copper. The conductive sheet 2 can be welded to the circuit pattern 1. The conductive sheet 2 can be welded to the battery cell 201.

[0081] The material of the protective layer 3 can be polyimide (PI). For example, the material of the protective layer 3 can include polyimide and adipic acid dihydrazide. In the protective layer 3, the thickness of the first protective layer 31 and the thickness of the second protective layer 32 can range from 50 μm to 85 μm, respectively. The thickness of the circuit pattern 1 can be 35 μm.

[0082] In combination with FIGS. 1 and 6, the battery module 200 according to the embodiments of the present disclosure includes at least two battery cells 201 arranged along a first direction, and the aforementioned signal acquisition circuit board 100. The first conductive sheet 21 and the second conductive sheet 22 are electrically connected to the corresponding battery cell 201.

[0083] The battery module 200 according to the embodiments of the present disclosure can reliably acquire signals, is controllable to use, and has good safety. The conductive sheet 2 realizes sampling of signals, and the circuit pattern 1 is responsible for electrical transmission. The current can pass from the first conductive sheet 21, the circuit pattern 1, and the second conductive sheet 22, or in the reverse direction, and the thinnest part 103 bears the overload protection of the circuit pattern 1. For example, the protective layer 3 realizes structural bearing and electrical protection of the circuit pattern 1.

[0084] Referring to FIG. 5, the electrical equipment 500 according to the embodiments of the present disclosure includes the aforementioned battery module 200. The electrical equipment 500 can reliably acquire signals, is controllable to use, and has good safety.

[0085] For example, the electrical equipment 500 includes the power consumption module 400. The electrical equipment 500 can be a new energy vehicle, and the power consumption module 400 can be an electric motor. The power consumption module 400 is electrically connected to the battery cell 201. The electrical equipment 500 can also be other power consumption power equipment or energy equipment.

[0086] For example, the electrical equipment 500 includes the battery management system 300. The battery management system 300 can be electrically connected to the signal acquisition circuit board 100.

[0087] The technical features of each of the above disclosed embodiments can be combined in any manner. For the sake of brevity, not all possible combinations are described, but it is understood that the scope of the present specification includes all possible combinations.

[0088] In the above disclosed embodiments, unless otherwise explicitly specified and limited, the execution order of each step is not limited, for example, the steps can be executed in parallel, or executed in different order. The sub-steps of each step can also be executed in an interleaved manner. The above described various forms of flow can be used, and the steps can be reordered, added or deleted, as long as the desired results of the technical solutions provided by the embodiments of the present disclosure can be achieved, which are not limited herein.

[0089] The above disclosed embodiments only express several embodiments of the present application, which are described in a specific and detailed manner, but should not be understood as a limitation on the patent protection scope of the present application. It should be noted that, for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the patent protection scope required by the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

[0090] Other aspects can become apparent from the following drawings and detailed description.

Claims

1. A signal acquisition circuit board, comprising: a circuit pattern, the circuit pattern comprising a first connecting region, a first extension line, a thinnest part, a second extension line, and a second connecting region connected in sequence, the first connecting region and the second connecting region being arranged along a first direction, the first connecting region and the second connecting region being offset from the thinnest part along a second direction, the first connecting region and the second connecting region being located on the same side of the thinnest part along the second direction, the second direction being perpendicular to the first direction; a first conductive sheet connected to the first connecting region; and a second conductive sheet connected to the second connecting region. The second conductive sheet and the first conductive sheet extend towards opposite sides along the second direction; the first conductive sheet is directed towards the thinnest part relative to the first connecting region, and the second conductive sheet is directed away from the thinnest part relative to the second connecting region.

2. The signal acquisition circuit board of claim 1, wherein, The first extension line is inclined by 20° to 70° relative to the first direction. The first extension line gradually widens in a direction away from the thinnest part, and the second extension line gradually widens in a direction away from the thinnest part.

3. The signal acquisition circuit board of claim 2, wherein, In an extension plane defined by the circuit pattern, the thinnest part has an extension path, and a vertical dimension of the thinnest part along the extension path at each position ranges from 0.08 mm to 0.5 mm.

4. The signal acquisition circuit board of claim 1, wherein, The thinnest part is a wavy structure, and a radius of curvature of any wave bend of the thinnest part ranges from 0.5 mm to 3 mm. One end of the first extension line connected to the thinnest part forms two arc-shaped transition portions located on both sides of the thinnest part, and one end of the second extension line connected to the thinnest part forms other two arc-shaped transition portions located on both sides of the thinnest part, and a radius of curvature of each arc-shaped transition portion is 1 to 5 times a line width at a corresponding position.

5. The signal acquisition circuit board of claim 1, wherein, Further comprising a protective layer covering the circuit pattern.

6. The signal acquisition circuit board of any one of claims 1 to 5, wherein, The protective layer is provided with at least one hole between the first connecting region, the second connecting region, and the thinnest part.

7. The signal acquisition circuit board of claim 6, wherein, The signal acquisition circuit board further comprises a micro connection point between the first connecting region and the second connecting region.

8. The signal acquisition circuit board of claim 7, wherein, A plurality of the circuit patterns are arranged along the first direction, and the protective layer is provided with at least one hole between any two adjacent circuit patterns.

9. The signal acquisition circuit board of claim 6, wherein, The thinnest part and the second connecting region are oppositely arranged along the second direction.

10. The signal acquisition circuit board of claim 6, wherein, The signal acquisition circuit board further comprises a protective wide line between the thinnest part and the second connecting region, the protective wide line is spaced apart from the circuit pattern, and the protective wide line is closer to the thinnest part relative to the second connecting region. The protective wide line has a protective dimension D along the second direction at any position along the first direction, and the thinnest part has a line width dimension d along a vertical direction of the extension path of the thinnest part, wherein 5d≤D≤10d.

11. The signal acquisition circuit board of claim 10, wherein, 12.A battery module, comprising: at least two battery cells arranged along a first direction; and the signal acquisition circuit board according to any one of claims 1 to 11, the first conductive sheet and the second conductive sheet being electrically connected to corresponding battery cells, respectively. 13.An electrical device comprising the battery module according to claim 12. ​

Citation Information

Patent Citations

  • Signal acquisition module and battery system with same

    CN204243156U

  • Battery signal acquisition assembly and battery pack

    CN217332778U

  • Signal acquisition circuit board, battery module and electrical equipment

    CN222995761U

  • Signal collection assembly and power battery module comprising the same

    US20160308256A1