Display panel and manufacturing method therefor, and display device

Abstract

Disclosed in the present application are a display panel and a manufacturing method therefor, and a display device. The display panel (100) comprises a base substrate (110), a pixel definition layer (111), a plurality of light-emitting units (120), an electrically conductive isolation structure (130) and an encapsulation layer (140). The electrically conductive isolation structure (130) comprises a first metal layer (131), a transition layer (132) and a first insulating layer (133). On a contact surface between the transition layer (132) and the first metal layer (131), the width of the transition layer (132) is equal to that of the first metal layer (131). By means of utilizing a transition effect of the first insulating layer, the occurrence of a hole phenomenon is reduced, thereby enhancing an encapsulation effect, and improving the reliability of the display panel.

Description

Display panel, manufacturing method thereof and display device

[0001] The present application claims priority to the Chinese patent application No. CN2024110900081, filed on August 9, 2024, and entitled "Display panel, manufacturing method thereof and display device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0003] Organic light emitting diode (OLED) and other light emitting units are increasingly widely used in televisions, mobile phones and other products because of their lightness, energy saving, color gamut, contrast and other characteristics. However, the light emitting device in the OLED display panel has poor stability and is extremely sensitive to water and oxygen. Water and oxygen can cause the light emitting device to be oxidized and fail. Therefore, the packaging technology is particularly critical. The main purpose of packaging is to prevent water vapor and air from entering the light emitting device. However, in the absence of a fine mask technology, a conductive partition structure, also known as a roof structure, is formed on the non-opening position of the substrate. The conductive partition structure is formed by an insulating layer with a large width located above and a metal layer with a small width located below, which achieves the purpose of limiting the substrate area of the evaporation film layer.

[0004] However, due to the narrow angle region formed between the insulating layer and the metal layer of the conductive partition structure, holes and other phenomena are prone to occur during the process of the packaging layer, resulting in the problem of poor packaging. SUMMARY

[0005] The purpose of the present application is to provide a display panel, a manufacturing method thereof and a display device. By adding a first insulating layer between the first metal layer and the second insulating layer in the conductive partition structure, the transition effect of the first insulating layer is utilized to reduce the number of narrow angles formed between the first metal layer and the second insulating layer, reduce the occurrence of hole phenomenon, improve the packaging effect, and improve the reliability of the display panel.

[0006] The application discloses a display panel, which comprises a substrate, a pixel definition layer, a plurality of light-emitting units, a conductive partition structure and an encapsulation layer. The pixel definition layer is arranged on the substrate and is provided with a plurality of openings. The plurality of light-emitting units are arranged on the substrate and are respectively located in the openings. The conductive partition structure is arranged on the pixel definition layer. The encapsulation layer covers the light-emitting units and the conductive partition structure. The conductive partition structure comprises a first metal layer, a transition layer and a first insulating layer. The first metal layer is arranged on the pixel definition layer. The transition layer is arranged on the first metal layer. The first insulating layer is arranged on the transition layer. The width of the first insulating layer is greater than the width of the first metal layer. On the contact surface between the transition layer and the first metal layer, the width of the transition layer is equal to the width of the first metal layer, and the width of the transition layer gradually increases from the first metal layer to the first insulating layer.

[0007] The application further discloses a manufacturing method of the display panel, which comprises the following steps.

[0008] forming a pixel definition layer on the substrate and forming a plurality of openings;

[0009] forming a conductive partition structure on the pixel definition layer;

[0010] forming a plurality of light-emitting units in the openings; and

[0011] forming an encapsulation layer on the light-emitting units;

[0012] The conductive partition structure comprises a first metal layer, a transition layer and a first insulating layer. The first metal layer is arranged on the pixel definition layer. The transition layer is arranged on the first metal layer. The first insulating layer is arranged on the transition layer. The width of the first insulating layer is greater than the width of the first metal layer. On the contact surface between the transition layer and the first metal layer, the width of the transition layer is equal to the width of the first metal layer, and the width of the transition layer gradually increases from the first metal layer to the first insulating layer.

[0013] The application further discloses a display device, which comprises a driving circuit and the display panel.

[0014] The application increases a transition layer between the first metal layer and the first insulating layer of the conductive partition structure in the example technology to serve as a transition function, gradually increases the width of the transition layer from the direction of the first metal layer to the first insulating layer, and makes the included angle between the transition layer and the first insulating layer an obtuse angle. When the packaging layer is filled, the first insulating layer and the first metal layer do not form a slit due to an acute angle, which causes the packaging layer to be unable to fill into the first insulating layer and form a hole. The application uses the transition function of the transition layer, increases the included angle between the first metal layer and the first insulating layer, reduces the number of narrow included angles between the first metal layer and the first insulating layer, reduces the occurrence of a hole, improves the packaging effect, and improves the reliability of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings included are intended to provide a further understanding of the embodiments of the application, constitute a part of the specification and serve to explain the principles of the application together with the text. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor. In the drawings:

[0016] FIG. 1 is a schematic diagram of a display panel of the example technology of the application;

[0017] FIG. 2 is a schematic diagram of a display panel of the first embodiment of the application;

[0018] FIG. 3 is a schematic diagram of the steps of a manufacturing method of a display panel of the first embodiment of the application;

[0019] FIG. 4 is a schematic diagram of the steps of another manufacturing method of a display panel of the first embodiment of the application;

[0020] FIG. 5 is a flowchart of a manufacturing process of a display panel of the first embodiment of the application;

[0021] FIG. 6 is a schematic diagram of a display panel of the second embodiment of the application;

[0022] FIG. 7 is a schematic diagram of a display panel of the third embodiment of the application;

[0023] FIG. 8 is a schematic diagram of a display device of the application. DETAILED DESCRIPTION

[0024] It should be understood that the terms used herein, the specific structures and functional details disclosed, are only for the purpose of describing specific embodiments, and are representative, but the application can be embodied in many alternative forms, and should not be interpreted as being limited to the embodiments described herein.

[0025] In the description of the present application, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating relative importance, or implying the number of the indicated technical features. Therefore, unless otherwise specified, the features defined with "first", "second" can explicitly or implicitly include one or more of the features; the meaning of "multiple" is two or more. In addition, the terms indicating the orientation or position relationship such as "up", "down", "left", "right", "vertical", "horizontal" and the like are described based on the orientation or relative position relationship shown in the drawings, and are only for the convenience of the simplified description of the present application, and cannot be understood as indicating that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] The present application will be described in detail below with reference to the accompanying drawings and optional embodiments.

[0027] FIG. 1 is a schematic diagram of a display panel of the exemplary technology of the present application. Referring to FIG. 1, the conductive partition structure 130 generally includes a first metal layer 131 and a first insulating layer 133 disposed above the metal layer, and the width of the first metal layer 131 is less than the width of the first insulating layer 133. The conductive partition structure 130 formed by the first metal layer 131 and the first insulating layer 133 can realize the process of multiple light emitting units 120 without a mask during the process of the light emitting unit 120. However, since the included angle between the bottom surface of the first insulating layer 133 and the side surface of the first metal layer 131 is generally an acute angle, a relatively narrow gap is generated at the contact position of the first insulating layer 133 and the first metal layer 131. During subsequent packaging, the problem of holes in the narrow gap is prone to occur. It can be understood that in the present application, the first insulating layer 133 is taken as an example, the side of the first insulating layer 133 close to the substrate 110 is the bottom surface, and the side of the first insulating layer 133 away from the substrate 110 is the top surface.

[0028] FIG. 2 is a schematic diagram of a display panel of the first embodiment of the present application. Referring to FIG. 2, the present application discloses a display panel 100, which comprises a substrate 110, a pixel definition layer 111, a plurality of light emitting units 120, a conductive partition structure 130 and an encapsulation layer 140. The pixel definition layer 111 is disposed on the substrate 110 and is provided with a plurality of openings 112. The plurality of light emitting units 120 are disposed on the substrate 110 and are respectively located in the openings 112. The conductive partition structure 130 is disposed on the pixel definition layer 111. The encapsulation layer 140 covers the light emitting units 120 and the conductive partition structure 130. The conductive partition structure 130 comprises a first metal layer 131, a transition layer 132 and a first insulating layer 133. The first metal layer 131 is disposed on the pixel definition layer 111. The transition layer 132 is disposed on the first metal layer 131. The first insulating layer 133 is disposed on the transition layer 132. The width of the first insulating layer 133 is greater than the width of the first metal layer 131. On the contact surface between the transition layer 132 and the first metal layer 131, the width of the transition layer 132 is equal to the width of the first metal layer 131, and the width of the transition layer 132 gradually increases from the first metal layer 131 towards the first insulating layer 133.

[0029] In the present application, the transition layer 132 is added between the first metal layer 131 and the first insulating layer 133 of the conductive partition structure 130 in the exemplary technology to serve as a transition function. The width of the transition layer 132 gradually increases from the first metal layer 131 towards the first insulating layer 133, so that the included angle between the transition layer 132 and the first insulating layer 133 is obtuse. When the encapsulation layer 140 is filled, no gap caused by the acute angle between the first insulating layer 133 and the first metal layer 131 will cause the encapsulation layer 140 to be unable to fill in and have holes, etc. By using the transition function of the transition layer 132, the included angle between the first metal layer 131 and the first insulating layer 133 is increased, the number of narrow included angles between the first metal layer 131 and the first insulating layer 133 is reduced, the occurrence of holes is reduced, the encapsulation effect is improved, and the reliability of the display panel 100 is improved.

[0030] It can be understood that the cross-sectional shape of the first metal layer 131 is generally trapezoidal, and the bottom width of the first metal layer 131 is greater than the top width, so that it has an inclined slope, which is generally naturally formed by the process. The included angle between the slope and the bottom surface of the first insulating layer 133 is an acute angle, and the bottom surface of the first insulating layer 133 is generally parallel to the surface of the substrate 110. It is worth mentioning that the present embodiment mainly forms an obtuse angle between the slope of the transition layer 132 and the bottom surface of the first insulating layer 133 by making the transition layer 132 have an inclined outward slope. The conductive partition structure 130 is arranged around the light emitting unit 120, in other words, two adjacent light emitting units 120 are separated by the conductive partition structure 130.

[0031] Specifically, the encapsulation layer 140 generally includes a first inorganic layer 141, an organic layer 142 and a second inorganic layer 143, the first inorganic layer 141 covers the conductive partition structure 130 and the light emitting unit 120, the organic layer 142 is arranged on the first inorganic layer 141, and the second inorganic layer 143 is arranged on the organic layer 142. Due to the first insulating layer 133 and the first metal layer 131 in the conductive partition structure 130, the first inorganic layer 141 is prone to produce holes at the acute angle between the first metal layer 131 and the first insulating layer 133, resulting in poor encapsulation. Moreover, due to the difference in process mode between the first inorganic layer 141 and the organic layer 142, the first inorganic layer 141 generally adopts vapor deposition, while the organic layer 142 needs to adopt inkjet printing and static leveling to form. In the leveling process of the organic layer 142, the above-mentioned acute angle is not conducive to the leveling and encapsulation of the organic layer 142, thereby producing holes and causing the appearance of bubbles, resulting in poor encapsulation. The present application increases the included angle between the first metal layer 131 and the first insulating layer 133 to improve the phenomenon of holes appearing in the first inorganic layer 141 and the organic layer 142.

[0032] Specifically, the maximum width of the transition layer 132 is less than the width of the first insulating layer 133, and the cross section of the transition layer 132 is inverted trapezoidal. In the present embodiment, there is a problem of insufficient support of the inverted trapezoidal film layer. Therefore, the maximum width of the transition layer 132 should not be too wide, which causes the side surface of the transition layer 132 to be unable to support in the process and the film layer to be broken. Of course, some graphene and derivative materials can be added to the transition layer 132 to enhance the film layer resistance of the transition layer 132.

[0033] Among them, the included angle θ1 between the bottom surface of the first insulating layer 133 and the side surface of the transition layer 132 is greater than 90 degrees; the included angle θ2 between the side surface of the transition layer 132 and the side surface of the first metal layer 131 is greater than 90 degrees; and the included angle θ3 between the side surface of the first metal layer 131 and the top surface of the pixel definition layer 111 is greater than 90 degrees.

[0034] In the embodiment, on the continuous and tortuous surface formed by the bottom surface of the first insulating layer 133 in contact with the first inorganic layer 141, the side surface of the transition layer 132, the side surface of the first metal layer 131, and the top surface of the pixel definition layer 111, there is no longer a position with an acute angle. By increasing the side surface of the transition layer 132, the number of acute angles is reduced, so that in the process of forming the first inorganic layer 141, the film layer of the side surface of the conductive isolation structure 130 has a smaller tortuosity, and the problem of easy occurrence of holes is solved.

[0035] Of course, in another embodiment, the transition layer 132 with a rectangular cross-sectional shape can also improve the phenomenon that the angle between the first metal layer 131 and the first insulating layer 133 is acute. At this time, the angle between the bottom surface of the first insulating layer 133 and the side surface of the transition layer 132 is equal to 90 degrees.

[0036] Specifically, in the embodiment, the transition layer 132 is formed of an organic insulating material, and the first insulating layer 133 is formed of an inorganic insulating material; the maximum width of the transition layer 132 is smaller than the minimum width of the first insulating layer 133. In the process of forming the inverted-trapezoidal transition layer 132, the organic insulating material is used to realize the transition layer 132, and the angle of etching is controlled to form a larger gap at the positions of the two sides of the transition layer 132, so that the width of the side close to the first insulating layer 133 is larger, and the width of the side close to the first metal layer 131 is smaller.

[0037] In the embodiment, the width of the first insulating layer 133 is the largest, and the width of the transition layer 132 and the width of the first metal layer 131 can be designed according to actual conditions. Generally, the first insulating layer 133 also has a trapezoidal cross section, and the width of the first insulating layer 133 greater than the width of the transition layer 132 means that the minimum width of the first insulating layer 133 is greater than the maximum width of the transition layer 132, so as to achieve a better isolation effect.

[0038] Specifically, the thickness of the transition layer 132 can be equal to the thickness of the first insulating layer 133. The greater the thickness of the transition layer 132, the more easily the corresponding side surface is broken, and the thickness of the transition layer 132 does not need to be very thick.

[0039] FIG. 3 is a step schematic diagram of a manufacturing method of a display panel of the first embodiment of the present application. The present application also discloses a manufacturing method of a display panel, which comprises the following steps

[0040] S10: forming a pixel definition layer on a substrate and forming a plurality of openings;

[0041] S20: forming a conductive isolation structure on the pixel definition layer;

[0042] S30: forming a plurality of light emitting units in the plurality of openings; and

[0043] S40: forming an encapsulation layer on the light emitting units;

[0044] The conductive partition structure 130 includes a first metal layer 131, a transition layer 132, and a first insulating layer 133. The first metal layer 131 is disposed on the pixel definition layer 111. The transition layer 132 is disposed on the first metal layer 131. The first insulating layer 133 is disposed on the transition layer 132.

[0045] The width of the first insulating layer 133 is greater than the width of the first metal layer 131. On the contact surface between the transition layer 132 and the first metal layer 131, the width of the transition layer 132 is equal to the width of the first metal layer 131. The width of the transition layer 132 gradually increases from the first metal layer 131 toward the first insulating layer 133.

[0046] The present application gradually increases the width of the transition layer 132 from the first metal layer 131 toward the first insulating layer 133, so that the included angle between the transition layer 132 and the first insulating layer 133 is obtuse. When the encapsulation layer 140 is filled, the encapsulation layer 140 cannot be filled due to the existence of the acute angle between the first insulating layer 133 and the first metal layer 131, resulting in the existence of holes, etc. The present application gradually increases the included angle between the first metal layer 131 and the first insulating layer 133 by using the transition effect of the transition layer 132, reduces the number of narrow included angles between the first metal layer 131 and the first insulating layer 133, reduces the occurrence of hole phenomenon, improves the encapsulation effect, and improves the reliability of the display panel 100.

[0047] FIG. 4 is a step schematic diagram of another display panel manufacturing method of the first embodiment of the present application. FIG. 5 is a flow schematic diagram of the process of the display panel of the first embodiment of the present application. Referring to FIGS. 4-5, in the step S10, the bottom electrode 121 of the light emitting unit 120 is formed by a patterning process before the pixel definition layer 111 is formed on the substrate 110. The bottom electrode 121 is located at the opening 112 and partially overlaps with the pixel definition layer 111.

[0048] In the step S20, the following steps are included:

[0049] S201: sequentially depositing a first metal layer material and a transition layer material on the pixel definition layer, and patterning to form the first metal layer and the transition layer.

[0050] Continuing to refer to FIG. 5, a first metal layer 131 and a transition layer 132 are formed on the pixel definition layer 111 and the bottom electrode 121. The transition layer 132 is first exposed, developed and etched to form a patterned transition layer 132. The first metal layer 131 is then etched using the patterned transition layer 132 to form a patterned first metal layer 131. The cross section of the patterned transition layer 132 is an inverted trapezoid, and the first metal layer 131 is a trapezoid.

[0051] S202: Forming a template layer in the positions where the first metal layer material and the transition layer material are removed. The positions where the first metal layer 131 material and the transition layer 132 material are removed are the areas other than the patterned first metal layer 131 and the transition layer 132. The areas are filled with the template layer 150, and the top surface of the template layer 150 is flush with the top surface of the transition layer 132.

[0052] S203: Depositing and patterning a first insulating layer on the template layer and the transition layer. A first insulating layer 133 is formed on the template layer 150 and the transition layer 132. The first insulating layer 133 is then exposed, developed and etched to form a patterned first insulating layer 133.

[0053] S204: Removing the template layer. The template layer 150 in this embodiment is formed of a fluorine-containing resin material, specifically a resin material containing about 50% of fluorine. A stripping agent is used to selectively remove the template layer 150 in the step of removing the template layer 150. The stripping agent can be a hydrofluoroether material.

[0054] In this embodiment, after the first metal layer 131 and the transition layer 132 of the conductive partition structure 130 are patterned, the areas where the first metal layer 131 and the transition layer 132 are not provided are filled with the template layer 150. After the filling is completed, the first insulating layer 133 is formed to realize the three-layer film conductive partition structure 130. Moreover, the use of the template layer 150 does not affect the film layers of the first metal layer 131, the transition layer 132 and the first insulating layer 133 in the process of stripping the template layer 150.

[0055] It can be understood that, after the conductive partition structure 130 is formed, a maskless evaporation process is used to form the light emitting layer 122 and the top electrode 123 of the light emitting unit 120. After the process of the light emitting unit 120 is completed, the process of the encapsulation layer 140 is performed.

[0056] Further, the embodiment forms the conductive partition structure 130 in three layers, the lower part of which is the first metal layer 131 in the shape of a right trapezoid, the middle part of which is the transition layer 132 in the shape of an inverted trapezoid, and the upper part of which is the first insulating layer 133 with the largest width. By forming the conductive partition structure 130 in three layers, the side shape of the conductive partition structure 130 is improved by using the transition layer 132 without affecting the maskless evaporation process, and the occurrence of holes is reduced. It should be noted that the embodiment only proposes one embodiment of the conductive partition structure 130 in three layers, and the conductive partition structure 130 in the embodiment can also be formed by other means.

[0057] FIG. 6 is a schematic diagram of a display panel according to a second embodiment of the present application. As shown in FIG. 6, the present application also discloses a display panel 100, which comprises a substrate 110, a pixel definition layer 111, a plurality of light-emitting units 120, a conductive partition structure 130, and an encapsulation layer 140. The conductive partition structure 130 comprises a first metal layer 131, a transition layer 132, and a first insulating layer 133. The first metal layer 131 is arranged on the pixel definition layer 111. The transition layer 132 is arranged on the first metal layer 131. The first insulating layer 133 is arranged on the transition layer 132. The width of the first insulating layer 133 is greater than the width of the first metal layer 131. On the contact surface between the transition layer 132 and the first metal layer 131, the width of the transition layer 132 is equal to the width of the first metal layer 131, and the width of the transition layer 132 gradually increases from the first metal layer 131 towards the first insulating layer 133. On the contact surface between the transition layer 132 and the first insulating layer 133, the width of the transition layer 132 is equal to the width of the first insulating layer 133.

[0058] In the embodiment, by increasing the top width of the transition layer 132, the width of the transition layer 132 is equal to the width of the first insulating layer 133 on the contact surface between the transition layer 132 and the first insulating layer 133. The side surface of the transition layer 132 no longer forms an included angle with the bottom surface of the first insulating layer 133, and only an included angle is formed between the side surface of the transition layer 132 and the first metal layer 131. In other words, the acute included angle formed by the first insulating layer 133 and the first metal layer 131 is converted into an obtuse included angle formed by the transition layer 132 and the first metal layer 131, which greatly improves the phenomenon of holes in the encapsulation layer 140.

[0059] Specifically, the included angle between the side surface of the transition layer 132 and the side surface of the first metal layer 131 is greater than 90 degrees. The included angle between the side surface of the first metal layer 131 and the top surface of the pixel definition layer 111 is greater than 90 degrees.

[0060] Specifically, due to the large width span of the top surface of the transition layer 132 and the bottom surface of the transition layer 132, the film layer of the transition layer 132 beyond the bottom surface area may be at risk of cracking. Therefore, in the present embodiment, the graphene and its derivatives are doped to make the film layer of the transition layer 132 have stronger toughness and resistance, and the problem of side surface cracking of the transition layer 132 due to overhanging does not occur.

[0061] FIG. 7 is a schematic diagram of a display panel of a third embodiment of the present application. Referring to FIG. 7, on the basis of the first or second embodiment, the first insulating layer 133 can be further improved. Specifically, the side surface of the first insulating layer 133 away from the first metal layer 131 is an upwardly convex arc surface.

[0062] In the present embodiment, the top surface of the conductive partition structure 130, i.e. the top surface of the first insulating layer 133, is improved, so that the side surface of the first insulating layer 133 away from the first metal layer 131 is an upwardly convex arc surface. The arc surface is beneficial to the subsequent inflow of the organic layer 142 in the encapsulation layer 140 formed by inkjet printing, so that the organic adhesive material can flow more smoothly between adjacent conductive partition structures 130 to fill the openings 112 and the side surfaces of the conductive partition structures 130.

[0063] In a specific process, referring to the process in the first embodiment, a substrate 110 is first formed, a pixel driving layer is formed on the substrate 110, circuit traces and devices such as thin film transistors are formed in the pixel driving layer, a pixel definition layer 111 and a bottom electrode 121 are formed on the pixel driving layer, and then the first metal layer 131 and the transition layer 132 are deposited and patterned, the template layer 150 is formed in the area other than the first metal layer 131 and the transition layer 132, the first insulating layer 133 is formed on the template layer 150 and the transition layer 132 by using a negative photo-curable organic insulating material, the negative photo-curable organic insulating material is used to form the first insulating layer 133 with an arc-shaped top surface by exposure and development, and finally the template layer 150 is removed to obtain the conductive partition structure 130.

[0064] The application improves the top surface of the conductive partition structure 130, i.e., the top surface of the first insulating layer 133, so that the side surface of the first insulating layer 133 away from the first metal layer 131 is an upward convex arc surface. The arc surface is conducive to the subsequent inflow of the organic layer 142 in the encapsulation layer 140 formed by inkjet printing, so that the organic adhesive material can flow more smoothly between adjacent conductive partition structures 130 to fill the opening 112 and the side surface of the conductive partition structure 130. By increasing the transition layer 132 in the conductive partition structure 130 and gradually increasing the width of the transition layer 132 from the first metal layer 131 toward the first insulating layer 133, the included angle between the transition layer 132 and the first insulating layer 133 is obtuse. When the encapsulation layer 140 is filled, there will be no slits caused by the acute angle between the first insulating layer 133 and the first metal layer 131, which will prevent the encapsulation layer 140 from being filled and cause holes, etc. The application uses the transition effect of the transition layer 132 to increase the included angle between the first metal layer 131 and the first insulating layer 133, reduce the number of narrow angles between the first metal layer 131 and the first insulating layer 133, reduce the occurrence of holes, improve the encapsulation effect, and improve the reliability of the display panel 100.

[0065] FIG. 8 is a schematic diagram of a display device of the application. Referring to FIG. 8, the application also discloses a display device 200, which comprises a driving circuit 210 and the display panel 100 in any of the above embodiments, wherein the driving circuit 210 is configured to drive the display panel 100 to display.

[0066] It should be noted that the inventive concept of the application can form a very large number of embodiments, but the length of the application file is limited and cannot be listed one by one, so the above-described embodiments or technical features can be combined to form new embodiments without conflict. The combination of each embodiment or technical feature will enhance the original technical effect.

[0067] The above is a further detailed description of the application in combination with specific optional embodiments, and the specific implementation of the application cannot be limited to these descriptions. For ordinary skilled persons in the art to which the application belongs, without departing from the concept of the application, a number of simple deductions or substitutions can be made, which should be considered as falling within the scope of protection of the application.

Claims

1. A display panel, comprising: a substrate substrate; a pixel definition layer disposed on the substrate substrate, provided with a plurality of openings; a plurality of light emitting units disposed on the substrate substrate and respectively located in the openings; a conductive partition structure disposed on the pixel definition layer; and an encapsulation layer covering the light emitting units and the conductive partition structure. The conductive partition structure comprises a first metal layer, a transition layer and a first insulating layer, the first metal layer is disposed on the pixel definition layer, the transition layer is disposed on the first metal layer, and the first insulating layer is disposed on the transition layer. The width of the first insulating layer is greater than the width of the first metal layer; on the contact surface between the transition layer and the first metal layer, the width of the transition layer is equal to the width of the first metal layer, and the width of the transition layer gradually increases from the first metal layer towards the first insulating layer. The maximum width of the transition layer is less than the width of the first insulating layer.

2. The display panel of claim 1, wherein, The included angle between the bottom surface of the first insulating layer and the side surface of the transition layer is greater than or equal to 90 degrees. On the contact surface between the transition layer and the first insulating layer, the width of the transition layer is equal to the width of the first insulating layer.

3. The display panel of claim 1, wherein, The included angle between the side surface of the transition layer and the side surface of the first metal layer is greater than 90 degrees.

4. The display panel of claim 2, wherein, The included angle between the side surface of the first metal layer and the top surface of the pixel definition layer is greater than 90 degrees. The included angle between the side surface of the transition layer and the side surface of the first metal layer is greater than 90 degrees.

5. The display panel of claim 3, wherein, The included angle between the side surface of the first metal layer and the top surface of the pixel definition layer is greater than 90 degrees. The transition layer is formed of an organic insulating material, and the first insulating layer is formed of an inorganic insulating material.

6. The display panel of claim 2, wherein, The maximum width of the transition layer is less than the minimum width of the first insulating layer. The side surface of the first insulating layer away from the first metal layer is an upwardly convex arc surface.

7. The display panel of claim 1, wherein, The cross-sectional shape of the first metal layer is trapezoidal, the bottom surface width of the first metal layer is greater than the top surface width of the first metal layer, and the included angle between the inclined surface of the first metal layer and the bottom surface of the first insulating layer is an acute angle.

8. The display panel of claim 1, wherein, 9.The display panel of claim 1, wherein The encapsulation layer comprises a first inorganic layer, an organic layer and a second inorganic layer, the first inorganic layer covers the conductive partition structure and the light emitting units, the organic layer is disposed on the first inorganic layer, and the second inorganic layer is disposed on the organic layer. 10.A manufacturing method of a display panel, comprising the steps of: forming a pixel definition layer on a substrate substrate and forming a plurality of openings; forming a conductive partition structure on the pixel definition layer; forming a plurality of light emitting units in the plurality of openings; and forming an encapsulation layer on the light emitting units. The conductive partition structure comprises a first metal layer, a transition layer and a first insulating layer, the first metal layer is disposed on the pixel definition layer, the transition layer is disposed on the first metal layer, and the first insulating layer is disposed on the transition layer. ​ ​ The width of the first insulating layer is greater than the width of the first metal layer; on the contact surface between the transition layer and the first metal layer, the width of the transition layer is equal to the width of the first metal layer, and the width of the transition layer gradually increases from the first metal layer towards the first insulating layer.

11. The method of manufacturing a display panel according to claim 10, wherein, The step of forming the conductive partition structure on the pixel definition layer comprises: Depositing and patterning a first metal layer material and a transition layer material on the pixel definition layer in sequence, and forming the first metal layer and the transition layer; Forming a template layer at the positions where the first metal layer material and the transition layer material are removed; Depositing and patterning a first insulating layer on the template layer and the transition layer; Removing the template layer.

12. The method of manufacturing a display panel according to claim 11, wherein, The transition layer material is an organic insulating material, the first insulating layer material is an inorganic insulating material, and the template layer is formed of a fluorine-containing resin material.

13. A display device, wherein, A display panel and a driving circuit for driving the display panel to display; the display panel comprises a substrate, a pixel definition layer, a plurality of light-emitting units, a conductive partition structure, and an encapsulation layer; the pixel definition layer is arranged on the substrate and is provided with a plurality of openings; the plurality of light-emitting units are arranged on the substrate and are respectively located in the openings; the conductive partition structure is arranged on the pixel definition layer; and the encapsulation layer covers the light-emitting units and the conductive partition structure; wherein the conductive partition structure comprises a first metal layer, a transition layer, and a first insulating layer; the first metal layer is arranged on the pixel definition layer; the transition layer is arranged on the first metal layer; and the first insulating layer is arranged on the transition layer; the width of the first insulating layer is greater than the width of the first metal layer; on the contact surface between the transition layer and the first metal layer, the width of the transition layer is equal to the width of the first metal layer, and the width of the transition layer gradually increases from the first metal layer towards the first insulating layer.

14. The display device of claim 13, wherein, The maximum width of the transition layer is less than the width of the first insulating layer. The included angle between the bottom surface of the first insulating layer and the side surface of the transition layer is greater than or equal to 90 degrees.

15. The display device of claim 13, wherein, On the contact surface between the transition layer and the first insulating layer, the width of the transition layer is equal to the width of the first insulating layer.

16. The display device of claim 14, wherein, The included angle between the side surface of the transition layer and the side surface of the first metal layer is greater than 90 degrees. The included angle between the side surface of the first metal layer and the top surface of the pixel definition layer is greater than 90 degrees.

17. The display device of claim 15, wherein, The included angle between the side surface of the transition layer and the side surface of the first metal layer is greater than 90 degrees. The included angle between the side surface of the first metal layer and the top surface of the pixel definition layer is greater than 90 degrees.

18. The display device of claim 14, wherein, The transition layer is formed of an organic insulating material, and the first insulating layer is formed of an inorganic insulating material. The maximum width of the transition layer is less than the minimum width of the first insulating layer.

19. The display device of claim 13, wherein, The side surface of the first insulating layer away from the first metal layer is an upwardly convex arc surface.

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