Nozzle for dispenser, dispenser, and method for producing semiconductor device

Abstract

The present invention provides a nozzle which is for a dispenser and which makes it possible to reduce the application amount of a bonding material for bonding a semiconductor element while preventing a decrease in bonding force of the semiconductor element that is provided by the bonding material. A nozzle for a dispenser according to the present invention comprises a nozzle body, a flat portion, a hollowed portion, a discharge port, an opening, and a tapered portion. The flat portion is provided to an end surface of the nozzle body. The hollowed portion is hollowed so as to extend from a central portion in the flat portion toward a side surface of the nozzle body in plan view. The discharge port is in communication with the hollowed portion, and a bonding material is discharged from the discharge port to the hollowed portion. The opening is provided by cutting out, to the outer periphery, the flat portion which is on the extension of the hollowed portion. The tapered portion is formed on an upper surface of the hollowed portion, and is inclined such that the height of the upper surface decreases from the discharge port toward the opening.

Description

Dispenser nozzle, dispenser, and method for manufacturing semiconductor device

[0001] The present disclosure relates to a nozzle for a dispenser, a dispenser, and a method for manufacturing a semiconductor device.

[0002] When a dispenser method is used in the die bonding process of semiconductor chips, a bonding material is dispensed from a nozzle attached to the dispenser. In a typical die bonding process, a cylindrical nozzle is used. Patent Document 1 discloses a stamping nozzle with a rectangular recessed portion.

[0003] International Publication No. 2011 / 121756

[0004] When a cylindrical nozzle is used, the adhesive is applied in a cone shape. When the semiconductor element is mounted on the adhesive, the adhesive is crushed and spreads out into a circular shape. At this time, the adhesive protrudes from the center of each side of the semiconductor element. If this protruding adhesive creeps up onto the top surface of the semiconductor element, various problems such as short circuits can occur. If the amount of adhesive applied is reduced to reduce the amount of protruding, the adhesive will not be sufficiently filled into the corners of the semiconductor element, resulting in a decrease in bonding strength.

[0005] In order to solve the above-mentioned problems, the present disclosure aims to provide a dispenser nozzle that reduces the amount of bonding material applied to bond semiconductor elements while suppressing a decrease in the bonding strength of the bonding material to the semiconductor elements.

[0006] A dispenser nozzle according to the present disclosure is attachable to a dispenser and dispenses a bonding material supplied from the dispenser. The dispenser nozzle includes a nozzle body, a flat portion, a recessed portion, a discharge port, an opening, and a tapered portion. The flat portion is provided on the tip surface of the nozzle body. The recessed portion is recessed from the center of the flat portion toward the side surface of the nozzle body in a planar view, extending from the center of the flat portion. The opening is provided by removing the flat portion extending from the recessed portion to the outer periphery. The tapered portion is formed on the upper surface of the recessed portion and is inclined so that the height of the upper surface decreases from the discharge port toward the opening.

[0007] According to the present disclosure, it is possible to reduce the amount of bonding material applied to bond semiconductor elements while suppressing a decrease in the bonding strength of the semiconductor elements due to the bonding material.

[0008] The objects, features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings.

[0009] FIG. 1 is an external view showing the configuration of a dispenser according to the first embodiment. FIG. 2 is an external view showing the configuration of a dispenser nozzle according to the first embodiment. FIG. 3 is a view showing the configuration of a tip surface of the dispenser nozzle according to the first embodiment. FIG. 4 is a cross-sectional view showing the configuration of the dispenser nozzle according to the first embodiment. FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device according to the first embodiment. FIG. 6 is a view showing a state in which the surface of a lead and the tip surface of a nozzle body are parallel to each other and spaced a predetermined distance apart according to the first embodiment. FIG. 7 is a view showing a bonding material applied to the surface of a lead according to the first embodiment. FIG. 8 is a top view showing a state in which a semiconductor element is mounted on the surface of a lead via the bonding material according to the first embodiment. FIG. 9 is an external view showing the configuration of a cylindrical nozzle according to the first embodiment. FIG. 10 is a view showing the configuration of a tip surface of a cylindrical nozzle according to the first embodiment. FIG. 11 is a top view showing a state in which a semiconductor element is mounted via the bonding material applied by the cylindrical nozzle according to the first embodiment. FIG. 12 is a view showing the configuration of a dispenser nozzle according to the second embodiment. FIG. 13 is a cross-sectional view showing the configuration of a dispenser nozzle according to the second embodiment. Fig. 14 is a diagram showing the configuration of a dispenser nozzle in embodiment 3. Fig. 15 is a cross-sectional view showing the configuration of a dispenser nozzle in embodiment 3. Fig. 16 is an external view showing the configuration of a dispenser nozzle in embodiment 4. Fig. 17 is a diagram showing the configuration of a dispenser nozzle in embodiment 4.

[0010] 1 is an external view showing the configuration of a dispenser 40 as a paste application device for applying a bonding material to a semiconductor element in a first embodiment.

[0011] 1, dispenser nozzle 101 is configured to be attachable to syringe 31 of dispenser 40. Syringe 31 is fixed to a die bonder (not shown) by arm 32 and is movable up, down, left, and right. A tube 33 connects pressure control unit 30 to syringe 31, and pressurized air is supplied from pressure control unit 30 to syringe 31 via tube 33.

[0012] 2 is an external view showing the configuration of dispenser nozzle 101 in embodiment 1. Dispenser nozzle 101 is attached to syringe 31, and pressure is applied to the syringe 31 by pressurized air supplied by pressure control unit 30, causing the bonding material filled in syringe 31 to be discharged from the tip of dispenser nozzle 101.

[0013] The dispenser 40 of the first embodiment is mounted on a die bonder (not shown) used in the manufacturing process of a semiconductor device. The die bonder automatically performs processes from applying a bonding material to mounting a semiconductor element. The bonding material is dispensed onto the surface of the lead through a dispenser nozzle 101, and the semiconductor element is bonded to the surface of the lead via the bonding material. The bonding material is a conductive adhesive. The bonding material contains an organic solvent and hardens when heated to a high temperature. The lead is a metal plate formed into a predetermined shape, e.g., a frame shape. The surface of the lead is silver-plated to prevent oxidation.

[0014] Fig. 3 is a diagram showing the configuration of tip surface 1A of dispenser nozzle 101. Fig. 4 is a cross-sectional view showing the configuration of dispenser nozzle 101. Fig. 4 shows a cross section taken along line A-A' shown in Fig. 3. Dispenser nozzle 101 includes a nozzle body 1, an attachment portion 2, a recessed portion 3, a discharge port 4, an opening 5, and a tapered portion 6.

[0015] The nozzle body 1 is made of, for example, stainless steel. A flow path 7 through which a bonding material passes is provided inside the nozzle body 1. If the bonding material contains an organic solvent, the organic solvent may corrode the nozzle body 1. By making the nozzle body 1 from stainless steel, the effects of corrosion are reduced. The nozzle body 1 is manufactured, for example, by cutting from a single member.

[0016] The tip surface 1A of the nozzle body 1 is a flat portion that is flat except for the region where the recessed portion 3 is provided. The outer shape of the tip surface 1A of the nozzle body 1 has a shape based on the maximum width of the outer shape of the semiconductor element to be bonded to the leads, which will be described later. More specifically, the outer shape of the tip surface 1A preferably corresponds to the outer shape of the semiconductor element to be bonded to the leads. In the first embodiment, the outer shape of the tip surface 1A is a quadrangle with an aspect ratio of 1:1, i.e., a square, and as will be described later, the outer shape of the semiconductor element to be bonded to the leads is also a square.

[0017] The attachment portion 2 is provided at the upper end of the nozzle body 1. A thread is cut into the attachment portion 2. The dispenser nozzle 101 is attached to the syringe of the dispenser via the attachment portion 2.

[0018] The dug portion 3 is provided on the tip surface 1A of the nozzle body 1. The dug portion 3 is formed by digging out an extension of the flat portion in a plan view. The dug portion 3 has a cross shape in a plan view. The dug portion 3 is provided on two diagonal lines of a square that forms the outline of the tip surface 1A of the nozzle body 1, and intersects at the center of the square. The depth of the dug portion 3 is preferably greater than the thickness of the bonding material after the semiconductor element and the lead are bonded.

[0019] A specific example of the dug portion 3 formed by dug into the flat portion in an extending manner in a plan view is, for example, a plurality of recessed shapes formed radially from the center of the flat portion toward the side surface of the nozzle body 1. Furthermore, when the flat portion is rectangular, the recessed shapes are formed on the diagonals of the rectangle.

[0020] The discharge port 4 communicates with the dug portion 3 inside the nozzle body 1. The discharge port 4 in the first embodiment is provided at the lower end of the flow path 7, and is connected to the central part of the cross shape of the dug portion 3. The discharge port 4 discharges the bonding material from the flow path 7 to the dug portion 3. In other words, the bonding material supplied from the syringe of the dispenser passes through the flow path 7 and the discharge port 4 of the nozzle body 1, and is filled into the dug portion 3.

[0021] The opening 5 is provided on the side surface of the nozzle body 1 surrounding the dug portion 3. The opening 5 connects the dug portion 3 to the space outside the side surface of the nozzle body 1. The opening 5 is provided by cutting out the flat portion on the extension of the extended dug portion 3 to the outer periphery. The opening 5 in the first embodiment is provided at the cross-shaped end of the dug portion 3. The opening 5 is, for example, an air hole or a notch. When the opening 5 is an air hole, the air hole is provided, for example, in the flat region of the tip surface 1A located at the end of the extension of the dug portion 3, i.e., on the outer periphery of the flat portion. The provision of the opening 5 allows the bonding material to fill the dug portion 3 without entraining air. Furthermore, the bonding material is more easily filled up to the end of the dug portion 3.

[0022] The tapered portion 6 is formed on the upper surface of the dug portion 3, and is inclined from the discharge port 4 toward the side surface of the nozzle body 1. The provision of the tapered portion 6 makes it easier for the bonding material to fill the dug portion 3 up to the end.

[0023] A specific example of the tapered portion 6 shown in FIG. 4 is, for example, a slope in which the height of the upper surface of the recessed portion 3 decreases from the discharge port 4 toward the opening 5 in a cross-sectional view of the dispenser nozzle 101 .

[0024] Next, a method for manufacturing a semiconductor device will be described using the dispenser nozzle 101. Fig. 5 is a flowchart showing the method for manufacturing a semiconductor device according to the first embodiment.

[0025] In step S1, the surface of the lead, which is the surface to which the bonding material is to be applied, is held parallel to and spaced a predetermined distance from the tip surface 1A of the nozzle body 1. Figure 6 shows a state in which the surface of the lead 11 and the tip surface 1A of the nozzle body 1 are parallel to and spaced a predetermined distance from each other.

[0026] In step S2, the discharge shape of the bonding material is controlled by filling the dug portion 3 with the bonding material. Specifically, the bonding material extruded from the syringe by the dispenser passes through the flow path 7 and the discharge port 4 of the nozzle body 1 and fills the dug portion 3. Because the dug portion 3 has a tapered portion 6, the bonding material is efficiently filled up to the end of the cross shape. Furthermore, because an opening 5 is provided at the end of the dug portion 3 and there is only one discharge port 4, the bonding material is reliably filled up to the end of the dug portion 3 without entraining air. In this way, the flow of the bonding material is controlled by the dug portion 3, and the bonding material is formed into a cross shape that reflects the shape of the dug portion 3.

[0027] In step S3, the bonding material with a controlled ejection shape is applied to the surface of the lead 11. At this time, the bonding material is applied to the surface of the lead 11 while the surface of the lead 11 and the tip surface 1A of the nozzle body 1 are parallel to each other and spaced a predetermined distance apart. In other words, the dispenser nozzle 101 does not contact the surface of the lead 11 when applying the bonding material. The bonding material is also applied to the silver-plated portion of the surface of the lead 11. FIG. 7 is a diagram showing bonding material 12 applied to the surface of the lead 11. The bonding material 12 has a cross shape that reflects the shape of the recessed portion 3. The aspect ratio of the cross shape is 1:1. The thickness of the bonding material 12 applied to the surface of the lead 11 may be equal to or greater than the thickness of the semiconductor element to be mounted in the next step S4.

[0028] In step S4, a semiconductor element is mounted on the bonding material 12 applied to the surface of the lead 11. Specifically, a die bonder picks up one semiconductor element from a semiconductor wafer containing a plurality of individual semiconductor elements, and mounts the semiconductor element in the center of the bonding material 12 applied to the surface of the lead 11. At this time, the die bonder mounts the semiconductor element on the bonding material 12 so that the diagonal lines of the semiconductor element overlap the cross shape of the bonding material 12.

[0029] 8 is a top view showing a state in which a semiconductor element 13 is mounted on the surface of a lead 11 via a bonding material 12. When the semiconductor element 13 is mounted on the bonding material 12, the bonding material 12 is compressed and spreads radially. Because the bonding material 12 is applied in a cross shape so as to overlap with the diagonal lines of the outer shape of the semiconductor element 13, the amount of bonding material 12 that spills out from the center of each side of the semiconductor element 13 is adjusted. At the same time, the bonding material 12 reliably spreads to the corners of the semiconductor element 13, and the bonding material 12 comes into contact with the entire back surface of the semiconductor element 13.

[0030] In step S5, the leads 11 on which the semiconductor elements 13 are mounted are ejected from the die bonder.

[0031] In step S6, the leads 11 on which the semiconductor elements 13 are mounted are heated in a reflow furnace, and the bonding material 12 is hardened.

[0032] In step S7, the semiconductor element 13 is ultrasonically bonded to the internal wiring (not shown) including other leads and the like using metal wires (not shown). This electrically connects the semiconductor element 13 to the internal wiring. The above steps complete the mounting of the semiconductor device on the leads.

[0033] The bonding material 12 applied by the dispenser nozzle 101 of the first embodiment has a cross shape. The semiconductor element 13 is mounted on the bonding material 12 so that the diagonal lines of the outer shape of the semiconductor element 13 overlap the cross shape of the bonding material 12. Therefore, an appropriate amount of bonding material 12 is supplied to the corners and the center of each side of the semiconductor element 13. In other words, even if the amount of bonding material 12 applied is reduced, the bonding material 12 is stably filled up to the corners of the semiconductor element 13, and the amount of bonding material 12 that protrudes from the center of each side of the semiconductor element 13 is also reduced. By reliably filling the corners of the semiconductor element 13 with the bonding material 12, bonding and heat dissipation are improved. Not only is the reliability of the semiconductor device improved, but manufacturing costs are also reduced. Furthermore, by reducing the amount of protrusion of the bonding material 12, defects due to creeping up of the bonding material 12 are reduced. As a result, the reliability of the semiconductor device is improved.

[0034] Furthermore, the dispenser nozzle 101 applies the bonding material 12, the shape of which is controlled to be the cross shape described above, to the surface of the lead 11 in a single discharge operation, thereby achieving a highly productive application process.

[0035] Since only one discharge port 4 is provided, the number of voids generated in the bonding material 12 is reduced compared to a nozzle having a plurality of discharge ports 4. As a result, the reliability of the semiconductor device is improved.

[0036] The recessed portion 3 has a shape based on the maximum width of the outer shape of the semiconductor element 13. Therefore, the amount of the bonding material 12 that protrudes after the semiconductor element 13 is mounted is minimized.

[0037] The depth of the recessed portion 3 is greater than the thickness of the bonding material 12 after the semiconductor element 13 is mounted, so that the bonding material 12 has an appropriate thickness even after bonding.

[0038] In summary, the dispenser nozzle 101 in embodiment 1 is attachable to a dispenser and dispenses bonding material 12 supplied by the dispenser. The dispenser nozzle 101 includes a nozzle body 1, a flat portion, a dug portion 3, a discharge port 4, an opening 5, and a tapered portion 6. The flat portion and the dug portion 3 are provided on the tip surface 1A of the nozzle body 1. The dug portion 3 is dug in an extending manner from the center of the flat portion toward the side surface of the nozzle body 1 in a plan view. The discharge port 4 is connected to the dug portion 3 and dispenses bonding material 12 into the dug portion 3. The opening 5 is provided by removing the flat portion on the extension of the dug portion 3 to the outer periphery. The tapered portion 6 is formed on the upper surface of the dug portion 3 and is inclined so that the height of the upper surface decreases from the discharge port 4 toward the opening 5.

[0039] Such a dispenser nozzle 101 can reduce the amount of bonding material 12 applied to bond the semiconductor element 13 while suppressing a decrease in the bonding strength of the semiconductor element 13 due to the bonding material 12. This realizes a highly productive, reliable, and stable manufacturing process for a semiconductor device. Furthermore, since the amount of bonding material 12 applied is reduced, manufacturing costs are also reduced.

[0040] The effects of dispenser nozzle 101 of embodiment 1 will be supplemented below by comparing it with a cylindrical nozzle. Fig. 9 is an external view showing the configuration of cylindrical nozzle 200. Fig. 10 is a diagram showing the configuration of tip surface 21A of cylindrical nozzle 200. Tip surface 21A of cylindrical nozzle 200 is provided with discharge port 24 for discharging bonding material 12, but is not provided with dug portion 3.

[0041] The bonding material 12 discharged from the cylindrical nozzle 200 assumes a cone shape on the leads. Fig. 11 is a top view showing a state in which a semiconductor element 13 is mounted via the bonding material 12 applied by the cylindrical nozzle 200.

[0042] The cone-shaped bonding material 12 is crushed and spreads radially, forming protruding portions 12A of the bonding material 12 on the leads 11. In particular, the amount of protrusion at the center of each side of the semiconductor element 13 is greater than the amount of protruding bonding material 12 at the corners of the semiconductor element 13. Therefore, when the semiconductor element 13 is mounted on the bonding material 12, the center of the protruding portion 12A rises, and the bonding material 12 creeps up onto the upper surface of the semiconductor element 13.

[0043] Because the bonding material 12 is conductive, if the bonding material 12 creeps up onto the upper surface of the semiconductor element 13, a short circuit will occur in the circuit of the semiconductor element 13. In addition, when a metal wire is bonded to the semiconductor element 13 by ultrasonic bonding in a subsequent process, the bonding material 12 attached to the upper surface of the semiconductor element 13 acts as an obstruction, reducing the bonding strength. The bonding material 12 attached to the upper surface of the semiconductor element 13 is also transferred to the next semiconductor element 13 mounted by a die bonder, causing such defects to occur repeatedly.

[0044] If the amount of bonding material 12 applied is reduced in order to reduce the amount of bonding material 12 that protrudes, the amount of protrusion is reduced, but there is an insufficient amount of bonding material 12 filling the corners of the semiconductor element 13. If there is an insufficient amount of bonding material 12 at the corners of the semiconductor element 13, the bonding strength decreases, and the reliability of the semiconductor device decreases.

[0045] Even when the cylindrical nozzle 200 is used, it is possible to form a coating shape that reduces the amount of overflow of the bonding material 12 by the drawing coating method or the multi-coating method. However, the drawing coating method and the multi-coating method increase the coating time compared to the one-point coating method, and productivity decreases.

[0046] In the case of a multi-nozzle method in which the bonding material 12 is applied by a nozzle (not shown) provided with multiple discharge ports 4, it is possible to apply the bonding material to multiple locations in one operation, but gaps will occur between adjacent bonding materials 12. When mounting the semiconductor element 13, the probability of voids occurring will increase due to air entrapment.

[0047] In the multi-application method or multi-nozzle method, the amount of adhesive applied to each application point must be reduced compared to the single-point application method. As the size of the semiconductor element 13 becomes smaller, the hole diameter of the discharge port 4 must also be smaller. Only semiconductor elements 13 of a size corresponding to the hole diameter that allows stable application of the bonding material 12 can be mounted.

[0048] The dispenser nozzle 101 described in the first embodiment can solve all of these problems. For example, sufficient bonding material 12 is filled at the corners of the semiconductor element 13 where the amount of overflow of the bonding material 12 is smallest, and a smaller amount of bonding material 12 than that applied by the cylindrical nozzle 200 is filled at the centers of each side of the semiconductor element 13 where the amount of overflow is largest. With the dispenser nozzle 101, by matching the extended shape of the recessed portion 3 in the flat portion in a plan view to the shape of the semiconductor element 13, it is possible to apply bonding material 12 that matches the shape of the semiconductor element 13 to be mounted on the leads 11, and to apply bonding material 12 while maintaining a constant thickness and height of the applied base material.

[0049] Embodiment 2. Fig. 12 is a diagram showing the configuration of tip surface 1A of dispenser nozzle 102 in embodiment 2. Fig. 13 is a cross-sectional view showing the configuration of dispenser nozzle 102. Fig. 13 shows a cross section taken along line B-B' shown in Fig. 12. In embodiment 2, the configuration of dispenser nozzle 102 will be described, including differences from embodiment 1. The same components as in embodiment 1 are designated by the same reference numerals, and their description may be omitted.

[0050] In the second embodiment, the external shape of the semiconductor element 13 mounted on the lead 11 is rectangular. The external shape of the tip surface 1A of the nozzle body 1 in the second embodiment is quadrilateral corresponding to the dimensions and aspect ratio of the semiconductor element 13. In other words, the external shape of the tip surface 1A of the nozzle body 1 has a rectangle with an aspect ratio that is not 1:1.

[0051] The recessed portion 3 has a cross shape in a plan view. The recessed portion 3 is provided on two diagonals of a rectangle that forms the outer shape of the tip surface 1A of the nozzle body 1, and intersects at the center of the rectangle.

[0052] As in the first embodiment, an opening 5 is provided on the side surface of the nozzle body 1 surrounding the recessed portion 3 .

[0053] The tapered portion 6 has a first taper 6A and a second taper 6B. The first taper 6A is formed on the upper surface of the recessed portion 3 and is inclined from the discharge port 4 toward the side surface of the nozzle body 1. The second taper 6B is provided on the side surface of the outlet of the discharge port 4. The inclination of the second taper 6B is greater than the inclination of the first taper 6A.

[0054] In the method for manufacturing a semiconductor device using the dispenser nozzle 102 of the second embodiment, the bonding material 12 discharged from the discharge port 4 also fills the dug portion 3. Because the outer shape of the nozzle body 1 is rectangular, the distance from the discharge port 4 to the end of the dug portion 3 is longer than in the first embodiment. Because the second taper 6B, which has a greater inclination than the first taper 6A, is provided, the bonding material 12 is more easily discharged from the discharge port 4, and the time required for the bonding material 12 to fill the dug portion 3 is reduced.

[0055] After the discharge shape of the bonding material 12 is controlled by the recessed portion 3, the bonding material 12 is applied to the surface of the lead 11. The bonding material 12 applied to the surface of the lead 11 has a cross shape that reflects the shape of the recessed portion 3. The die bonder mounts the semiconductor element 13 on the bonding material 12 so that the diagonal line of the semiconductor element 13 overlaps the cross shape of the bonding material 12.

[0056] With this configuration, even when a rectangular semiconductor element 13 is mounted on the leads 11, the amount of bonding material 12 that protrudes from the center of each side of the semiconductor element 13 is reduced. Furthermore, the bonding material 12 is reliably filled up to the corners of the semiconductor element 13.

[0057] As described above, the dispenser nozzle 102 of the second embodiment makes it possible to apply the bonding material 12 in accordance with the shape of the semiconductor element 13. This prevents the bonding material 12 from creeping up, and reduces the amount of bonding material 12 used.

[0058] Embodiment 3. Fig. 14 is a diagram showing the configuration of dispenser nozzle 103 in embodiment 3. Fig. 15 is a cross-sectional view showing the configuration of dispenser nozzle 103 in embodiment 3. Fig. 15 shows a cross section taken along CC' shown in Fig. 14. In embodiment 3, the configuration of dispenser nozzle 103 will be described, including differences from embodiments 1 and 2. The same components as those in embodiments 1 and 2 are designated by the same reference numerals, and their description may be omitted.

[0059] The external shape of tip surface 1A of nozzle body 1 in embodiment 3 is a rectangle corresponding to the dimensions and aspect ratio of semiconductor element 13. In other words, the external shape of tip surface 1A of nozzle body 1 has a rectangle with an aspect ratio that is not 1:1. Dug portion 3 has a cross shape in a plan view. Dug portion 3 is provided on two diagonals of the rectangle that forms the external shape of tip surface 1A of nozzle body 1, and intersects at the center of the rectangle.

[0060] The tapered portion 6 has a first taper 6A, a second taper 6B, and a third taper 6C. The first taper 6A and the second taper 6B are provided on the side surface of the outlet of the discharge port 4. The third taper 6C is provided closer to the opening 5 than the first taper 6A and the second taper 6B. The gradient of the tapered portion 6 on the opening 5 side is greater than the gradient on the discharge port 4 side. Specifically, the gradient of the second taper 6B is greater than the gradient of the first taper 6A. The gradient of the third taper 6C is greater than the gradient of the second taper 6B and is at an angle that is nearly flat.

[0061] Unlike in the second embodiment, the discharge port 4 has an elongated hole shape. That is, the opening shape of the discharge port 4 is elliptical. The longitudinal direction of the ellipse of the discharge port 4 is parallel to the longitudinal direction of the rectangle at the tip end surface 1A of the nozzle body 1. In the method for manufacturing a semiconductor device using the dispenser nozzle 103 of the third embodiment, the bonding material 12 discharged from the discharge port 4 also fills the recessed portion 3. Because the third taper 6C has an angle that is close to flat, the thickness of the bonding material 12 does not become thin even on the outside.

[0062] Since the discharge port 4 has an elongated hole shape, it is possible to ensure that the amount of bonding material 12 is applied even to the tip end.

[0063] These structures ensure the depth of the recessed portion 3 near the chip outer shape, preventing unfilled or voids, and enabling the bonding material 12 to quickly spread after chip mounting. Because the discharge port 4 is an elongated hole, it can be applied in a shape that matches even chips with a large aspect ratio.

[0064] By forming the discharge port 4 in the shape of an elongated hole, the bonding material 12 can be efficiently discharged to the short sides of a rectangular chip. The discharge time can be shortened, thereby improving the productivity of semiconductor devices.

[0065] Embodiment 4. Fig. 16 is an external view showing the configuration of dispenser nozzle 104 in embodiment 4. Fig. 17 is a diagram showing the configuration of dispenser nozzle 104. In embodiment 4, the configuration of dispenser nozzle 104 will be described, including the differences from embodiments 1 to 3. Although the illustration of dug portion 3 is omitted in Fig. 17, dispenser nozzle 104 also has dug portion 3 similar to embodiments 1 to 3 provided in the flat portion of tip surface 1A.

[0066] As in the first embodiment, the outer shape of the tip surface 1A of the nozzle body 1 corresponds to the outer shape of the semiconductor element 13 bonded to the leads 11. In the fourth embodiment, the semiconductor element 13 has a square shape, and the aspect ratio of the outer shape of the tip surface 1A of the nozzle body 1 is 1:1.

[0067] The dispenser nozzle 104 is provided with a push-in portion 8. The push-in portion 8 is formed integrally with the nozzle body 1 on the tip surface 1A of the nozzle body 1. The push-in portion 8 plays a role in maintaining a constant distance between the bonding material 12 and the application target during application.

[0068] As described in the manufacturing method of the first embodiment, bonding material 12 is applied to the surface of lead 11 while the surface of lead 11 and tip surface 1A of nozzle body 1 are parallel to each other and spaced a predetermined distance apart. In this manufacturing method, the shape of the applied bonding material 12 varies significantly depending on the distance between lead 11 and nozzle body 1. In particular, compared to cylindrical nozzle 200, the shape of the applied bonding material using dispenser nozzles 101 to 103 of the first to third embodiments is more likely to change depending on the distance between lead 11 and nozzle body 1.

[0069] The teaching function of the die bonder makes it possible to adjust the distance between the leads 11 and the nozzle body 1. However, the coating shape is affected by variations in the thickness of the leads 11 and variations in the shape of the leads 11, such as lifting of the leads 11.

[0070] In the manufacturing method of the fourth embodiment, the pusher 8 contacts the surface of the lead 11, reliably maintaining a constant distance between the surface of the lead 11 and the tip surface 1A of the nozzle body 1. For example, if the lead 11 is raised higher than usual, the pusher 8 presses down on the lead 11, maintaining a constant distance. In this way, the dispenser nozzle 104 of the fourth embodiment performs a dispensing operation while maintaining a constant distance between the surface of the lead 11 and the tip surface 1A of the nozzle body 1. As a result, variation in the shape of the applied bonding material 12 is reduced.

[0071] Although the present disclosure has been described in detail, the above description is illustrative in all respects and is not restrictive. It is understood that countless variations not illustrated can be envisioned.

[0072] In the present disclosure, the embodiments can be freely combined, and the embodiments can be modified or omitted as appropriate.

[0073] Various aspects of the present disclosure are summarized below as appendices.

[0074] (Note 1) A dispenser nozzle that can be attached to a dispenser and that dispenses bonding material supplied by the dispenser, comprising: a nozzle body; a flat portion provided on a tip surface of the nozzle body; a dug portion that is dug from a center of the flat portion toward a side surface of the nozzle body in an extending shape in a plan view; a discharge port that communicates with the dug portion and dispenses the bonding material into the extending dug portion; an opening that is provided by cutting out the flat portion to the outer periphery on an extension of the extending dug portion; and a tapered portion that is formed on an upper surface of the dug portion and is inclined so that the height of the upper surface decreases from the discharge port toward the opening.

[0075] (Supplementary Note 2) The nozzle for a dispenser according to Supplementary Note 1, wherein the outer shape of the tip surface of the nozzle body is a rectangle, and the recessed portions are provided on two diagonals of the rectangle and have a cross shape that intersects at the center of the rectangle.

[0076] (Supplementary Note 3) The dispenser nozzle according to Supplementary Note 2, wherein the quadrangle is a rectangle.

[0077] (Supplementary Note 4) The dispenser nozzle according to any one of Supplementary Note 1 to Supplementary Note 3, further comprising a pushing portion provided on the tip surface of the nozzle body for maintaining a constant distance from an object to which the bonding material is to be applied.

[0078] (Supplementary Note 5) The dispenser nozzle according to Supplementary Note 3, wherein an opening shape of the ejection port is elliptical, and a longitudinal direction of the ellipse at the ejection port is parallel to a longitudinal direction of the rectangle at the tip surface of the nozzle body.

[0079] (Supplementary Note 6) The dispenser nozzle according to Supplementary Note 5, wherein the inclination of the tapered portion on the opening side is greater than the inclination of the tapered portion on the discharge port side.

[0080] (Supplementary Note 7) A dispenser comprising the dispenser nozzle according to any one of Supplementary Notes 1 to 6.

[0081] (Appendix 8) A method for manufacturing a semiconductor device using a dispenser nozzle described in any one of appendices 1 to 6, comprising the steps of: holding a surface of a lead, which is a target surface for application of the bonding material discharged from the discharge port, and the tip surface of the nozzle body in a state where they are parallel to each other and spaced a predetermined distance apart; applying the bonding material, the discharge shape of which is controlled by the recessed portion, to the surface of the lead in the state; and mounting a semiconductor element on the bonding material applied to the surface of the lead.

[0082] 1 nozzle body, 1A tip surface, 2 mounting portion, 3 recessed portion, 4 discharge port, 5 opening, 6 tapered portion, 6A first taper, 6B second taper, 6C third taper, 7 flow path, 8 pushing portion, 11 lead, 12 bonding material, 12A protruding portion, 13 semiconductor element, 21A tip surface, 24 discharge port, 30 pressure control unit, 31 syringe, 32 arm, 33 tube, 40 dispenser, 101 to 104 dispenser nozzle, 200 cylindrical nozzle.

Claims

1. A dispenser nozzle that can be attached to a dispenser and that dispenses bonding material supplied by the dispenser, comprising: a nozzle body; a flat portion provided on a tip surface of the nozzle body; a dug portion that is dug from the center of the flat portion toward a side surface of the nozzle body in an extending shape in a plan view; a discharge port that communicates with the dug portion and dispenses the bonding material into the extending dug portion; an opening that is provided by cutting out the flat portion to the outer periphery on an extension of the extending dug portion; and a tapered portion that is formed on an upper surface of the dug portion and is inclined so that the height of the upper surface decreases from the discharge port toward the opening.

2. The dispenser nozzle according to claim 1, wherein the outer shape of the tip surface of the nozzle body is rectangular, and the recessed portions are provided on two diagonals of the rectangle and have a cross shape that intersects at the center of the rectangle.

3. The dispenser nozzle of claim 2, wherein the square is a rectangle.

4. A dispenser nozzle as described in any one of claims 1 to 3, further comprising a pushing portion provided on the tip surface of the nozzle body for maintaining a constant distance from the object to which the bonding material is to be applied.

5. A dispenser nozzle according to claim 3, wherein the opening shape of the discharge port is elliptical, and the longitudinal direction of the ellipse at the discharge port is parallel to the longitudinal direction of the rectangle at the tip surface of the nozzle body.

6. The dispenser nozzle according to claim 5, wherein the gradient of the tapered portion on the opening side is greater than the gradient on the discharge port side.

7. A dispenser comprising a dispenser nozzle according to any one of claims 1 to 6.

8. A method for manufacturing a semiconductor device using a dispenser nozzle according to any one of claims 1 to 6, comprising the steps of: holding the surface of a lead, which is the surface to be coated with the bonding material discharged from the discharge port, and the tip surface of the nozzle body in a state where they are parallel to each other and separated by a predetermined distance; applying the bonding material, the discharge shape of which is controlled by the recessed portion, to the surface of the lead in this state; and mounting a semiconductor element on the bonding material applied to the surface of the lead.

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