High-frequency module and communication device

Abstract

Provided are a high-frequency module and a communication device capable of securing isolation between signal terminals and securing connection reliability of the signal terminals. A high-frequency module (1) includes a mounting substrate (2), a first signal terminal (5), a second signal terminal (6), and a ground terminal (7). The first signal terminal (5) has a first portion (51) on the side of a second main surface (22) and a second portion (52) on the opposite side from the second main surface (22). The ground terminal (7) has a third portion (71) on the side of the second main surface (22) and a fourth portion (72) on the opposite side from the second main surface (22). The ground terminal (7) is disposed between the first signal terminal (5) and the second signal terminal (6). The cross-sectional area of the first portion (51) of the first signal terminal (5) is smaller than the cross-sectional area of the second portion (52) of the first signal terminal (5). The cross-sectional area of the third portion (71) of the ground terminal (7) is greater than the cross-sectional area of the second portion (52) of the first signal terminal (5).

Description

High frequency module and communication device

[0001] The present invention generally relates to a high-frequency module and a communication device, and more particularly to a high-frequency module including a mounting board and a communication device including the high-frequency module.

[0002] Patent Document 1 describes a high-frequency module. The high-frequency module described in Patent Document 1 has a via conductor formed to penetrate through a substrate. In the via conductor penetrating through the substrate, a first portion on the main surface side of the substrate has a different cross-sectional area from a second portion on the opposite side of the main surface of the substrate.

[0003] International Publication No. 2017 / 138299

[0004] Incidentally, there is a demand for miniaturization of high frequency modules.

[0005] However, miniaturization often reduces the spacing between signal terminals, which can result in reduced isolation between the signal terminals. Making the signal terminals thinner to ensure isolation between the signal terminals also reduces the connection area between the signal terminals and the external board, which can result in reduced connection reliability between the signal terminals. Conventional high-frequency modules face the problem of making it difficult to ensure both isolation between the signal terminals and connection reliability between the signal terminals.

[0006] The present invention has been made in view of the above points, and has an object to provide a high-frequency module and a communication device that can ensure both isolation between signal terminals and connection reliability of the signal terminals.

[0007] A high-frequency module according to one aspect of the present invention includes a mounting substrate, a first signal terminal, a second signal terminal, and a ground terminal. The mounting substrate has a first main surface and a second main surface. The first main surface and the second main surface face each other. The first signal terminal is connected to the second main surface of the mounting substrate. The first signal terminal has a first portion and a second portion. The first portion is a portion on the second main surface side. The second portion is a portion opposite the second main surface. The second signal terminal is connected to the second main surface of the mounting substrate. The ground terminal is connected to the second main surface of the mounting substrate. The ground terminal has a third portion and a fourth portion. The third portion is a portion on the second main surface side. The fourth portion is a portion opposite the second main surface. The ground terminal is disposed between the first signal terminal and the second signal terminal. A cross-sectional area of ​​the first portion of the first signal terminal is smaller than a cross-sectional area of ​​the second portion of the first signal terminal. The cross-sectional area of ​​the third portion of the ground terminal is larger than the cross-sectional area of ​​the second portion of the first signal terminal.

[0008] A high-frequency module according to another aspect of the present invention includes a mounting substrate, a first signal terminal, a second signal terminal, and a ground terminal. The mounting substrate has a first main surface and a second main surface. The first main surface and the second main surface face each other. The first signal terminal is connected to the second main surface of the mounting substrate. The first signal terminal has a first portion and a second portion. The first portion is a portion on the second main surface side. The second portion is a portion opposite the second main surface. The second signal terminal is connected to the second main surface of the mounting substrate. The ground terminal is connected to the second main surface of the mounting substrate. The ground terminal has a third portion and a fourth portion. The third portion is a portion on the second main surface side. The fourth portion is a portion opposite the second main surface. The ground terminal is disposed between the first signal terminal and the second signal terminal. The first portion of the first signal terminal has a recess. The recess faces the ground terminal and is recessed further than the second portion of the first signal terminal. The third portion of the ground terminal has a protruding portion that faces the first signal terminal and protrudes beyond the fourth portion of the ground terminal.

[0009] A high-frequency module according to yet another aspect of the present invention includes a mounting substrate, a first signal terminal, a second signal terminal, and a ground terminal. The mounting substrate has a first main surface and a second main surface. The first main surface and the second main surface face each other. The first signal terminal is connected to the second main surface of the mounting substrate. The first signal terminal has a first portion and a second portion. The first portion is a portion on the second main surface side. The second portion is a portion opposite the second main surface. The second signal terminal is connected to the second main surface of the mounting substrate. The ground terminal is connected to the second main surface of the mounting substrate. The ground terminal has a third portion and a fourth portion. The third portion is a portion on the second main surface side. The fourth portion is a portion opposite the second main surface. The ground terminal is disposed between the first signal terminal and the second signal terminal. In a direction in which the first signal terminal, the ground terminal, and the second signal terminal are arranged, a width of the first portion of the first signal terminal is narrower than a width of the second portion of the first signal terminal, and in a direction in which the first signal terminal, the ground terminal, and the second signal terminal are arranged, a width of the third portion of the ground terminal is wider than a width of the second portion of the first signal terminal.

[0010] A communication device according to one aspect of the present invention includes the high-frequency module and a signal processing circuit, the signal processing circuit being connected to the high-frequency module.

[0011] According to the high-frequency module and communication device according to the above aspects of the present invention, it is possible to ensure both isolation between signal terminals and connection reliability of the signal terminals.

[0012] Fig. 1 is a cross-sectional view of a high-frequency module according to an embodiment. Fig. 2 is a plan view of the high-frequency module. Fig. 3 is a block diagram of a high-frequency module and a communication device according to an embodiment. Fig. 4 is a plan view of a high-frequency module according to a modified example of the embodiment.

[0013] A high-frequency module 1 and a communication device 9 according to an embodiment will be described below with reference to the drawings. Figures 1, 2, and 4, which are referred to in the following embodiments, are schematic diagrams, and the ratios of the sizes and thicknesses of the components in the figures do not necessarily reflect the actual dimensional ratios. Figure 1 is a cross-sectional view taken along line X1-X1 in Figure 2. The second resin layer 82 is not shown in Figures 2 and 4.

[0014] 1 and 2 , a high-frequency module 1 according to this embodiment includes a mounting substrate 2, a first signal terminal 5, a second signal terminal 6, and a ground terminal 7. The mounting substrate 2 has a first main surface 21 and a second main surface 22. The first main surface 21 and the second main surface 22 face each other. The first signal terminal 5 is connected to the second main surface 22 of the mounting substrate 2, and has a first portion 51 on the second main surface 22 side and a second portion 52 on the opposite side from the second main surface 22. The second signal terminal 6 is connected to the second main surface 22 of the mounting substrate 2. The ground terminal 7 is connected to the second main surface 22 of the mounting substrate 2, and has a third portion 71 on the second main surface 22 side and a fourth portion 72 on the opposite side from the second main surface 22.

[0015] The ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6. The cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. The cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. In this specification, the term "cross-sectional area" refers to the area of ​​a cross section including the first direction D21 and the second direction D22. In other words, the term "cross-sectional area" refers to the area of ​​a cross section in a plan view from the thickness direction D1 of the mounting substrate 2.

[0016] In the high-frequency module 1 according to this embodiment, the ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6, and the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. This ensures isolation between the first signal terminal 5 and the second signal terminal 6. Furthermore, in the high-frequency module 1 according to this embodiment, the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. In other words, in the first signal terminal 5, the cross-sectional area of ​​the second portion 52 is larger than the cross-sectional area of ​​the first portion 51. This ensures connection reliability of the first signal terminal 5. As a result, the high-frequency module 1 according to this embodiment can ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0017] (2) Components of the High-Frequency Module As shown in FIGS. 1 and 2, the high-frequency module 1 according to this embodiment includes a mounting substrate 2, an electronic component 31, a plurality of electronic components 32 to 34, a plurality of external connection terminals 4, and a plurality of resin layers 8.

[0018] The high frequency module 1 according to this embodiment is a receiving module having a receiving function for receiving a high frequency signal (receiving signal).

[0019] Hereinafter, each component of the high-frequency module 1 according to this embodiment will be described with reference to the drawings.

[0020] (2.1) Mounting Board As shown in FIG. 1 , the mounting board 2 has a first main surface 21 and a second main surface 22. The first main surface 21 and the second main surface 22 face each other. More specifically, the first main surface 21 and the second main surface 22 face each other in the thickness direction D1 of the mounting board 2. The mounting board 2 is a board on which multiple electronic components are arranged, and is, for example, a rectangular plate. The first main surface 21 and the second main surface 22 are, for example, rectangular. The second main surface 22 faces an external board (not shown) when the high-frequency module 1 is mounted on the external board.

[0021] The mounting substrate 2 has a plurality of dielectric layers (not shown) and a plurality of conductive layers (not shown). The mounting substrate 2 is, for example, a multilayer substrate having a plurality of dielectric layers and a plurality of conductive layers. The plurality of dielectric layers and the plurality of conductive layers are stacked in a thickness direction D1 of the mounting substrate 2.

[0022] Each of the plurality of conductive layers includes one or more conductor portions in a plane perpendicular to the thickness direction D1 of the mounting substrate 2. The plurality of conductive layers are formed in a predetermined pattern determined for each layer. The material of each conductive layer is, for example, copper.

[0023] The multiple conductive layers include a ground layer (not shown). The ground layer is a layer set to ground potential (reference potential) and is provided inside the mounting substrate 2. When the high-frequency module 1 is mounted on an external substrate (e.g., a motherboard), the ground layer is connected to the ground of the external substrate through via conductors or the like of the mounting substrate 2 and is maintained at ground potential (reference potential).

[0024] The mounting substrate 2 is, for example, a low temperature co-fired ceramic (LTCC) substrate. Note that the mounting substrate 2 is not limited to an LTCC substrate, and may be, for example, a printed wiring board, a high temperature co-fired ceramic (HTCC) substrate, or a resin multilayer substrate.

[0025] 2, the mounting substrate 2 has a plurality of wiring conductors 23. The plurality of wiring conductors 23 include a first wiring conductor 231 and a second wiring conductor 232.

[0026] (2.2) Electronic Components (2.2.1) Electronic Components Arranged on the Second Main Surface of the Mounting Board The electronic components 31 are arranged on the second main surface 22 of the mounting board 2, as shown in Figures 1 and 2. The electronic components 31 are, for example, IC (Integrated Circuit) components. Note that a portion of the electronic components 31 may be arranged on the second main surface 22 of the mounting board 2, with the remainder of the electronic components 31 being internally mounted in the mounting board 2. In short, the electronic components 31 are located closer to the second main surface 22 than the first main surface 21 on the mounting board 2, and have at least a portion mounted on the second main surface 22.

[0027] The electronic component 31 has a main body 311, a plurality of electrodes 312, and a plurality of bumps (not shown). The electronic component 31 is disposed on the second main surface 22 of the mounting substrate 2 by connecting the plurality of electrodes 312 of the electronic component 31 to a plurality of electrodes (not shown) provided on the second main surface 22 of the mounting substrate 2 via the plurality of bumps.

[0028] The main body portion 311 has a functional portion. The main body portion 311 is disposed on the mounting substrate 2 such that one main surface of the main body portion 311 faces the mounting substrate 2 in the thickness direction D1 of the mounting substrate 2. More specifically, when the electronic component 31 is disposed on the mounting substrate 2, the one main surface of the main body portion 311 faces the second main surface 22 of the mounting substrate 2.

[0029] The plurality of electrodes 312 are formed on one main surface of the main body portion 311. The plurality of electrodes 312 are provided, for example, spaced apart from one another on the one main surface of the main body portion 311. The plurality of electrodes 312 include a first electrode 313 and a second electrode 314. The first electrode 313 is connected to the first signal terminal 5 via a first wiring conductor 231. The second electrode 314 is connected to the second signal terminal 6 via a second wiring conductor 232.

[0030] The plurality of bumps (not shown) are used to connect the plurality of electrodes 312 to the conductive layer of the mounting substrate 2. The plurality of bumps are arranged on the plurality of electrodes 312. Each bump is formed, for example, in a circular shape. Each bump is formed, for example, from solder.

[0031] When the electronic component 31 is an IC component, the electronic component 31 includes, for example, the low-noise amplifier 13 (see FIG. 3) and a switch.

[0032] Examples of the switches included in the IC component include a first switch, a second switch, and a third switch.

[0033] The first switch is an antenna switch connected to an antenna terminal (not shown). The first switch has a common terminal and a plurality of selection terminals. The common terminal is connected to the antenna terminal. An antenna (not shown) is connected to the antenna terminal. The selection terminal is connected to, for example, a transmission filter (not shown) or a reception filter (not shown). The first switch is a switch that can connect at least one of the plurality of selection terminals to the common terminal. The first switch is, for example, a switch that can be connected one-to-one and one-to-many.

[0034] The second switch is, for example, a band select switch for switching signal paths for a plurality of transmission signals having different communication bands. The second switch has a common terminal and a plurality of selection terminals. The common terminal is connected to a power amplifier. The selection terminal is connected to a transmission filter. The second switch is a switch that can connect at least one of the plurality of selection terminals to the common terminal. The second switch is, for example, a switch that can be connected one-to-one and one-to-many.

[0035] The third switch has a common terminal and a plurality of selection terminals. The common terminal is connected to the low-noise amplifier via an input matching circuit. The selection terminal is connected to the receive filter. The third switch is a switch that can connect at least one of the plurality of selection terminals to the common terminal. The third switch is a switch that can be connected, for example, in one-to-one and one-to-many configurations.

[0036] (2.2.2) Electronic Components Arranged on the First Main Surface of the Mounting Board As shown in FIG. 1, the multiple electronic components 32 to 34 are arranged on the first main surface 21 of the mounting board 2. More specifically, the multiple electronic components 32 to 34 are mounted on the first main surface 21 of the mounting board 2. Each of the multiple electronic components 32 to 34 is, for example, an amplifier or a filter. The multiple electronic components 32 to 34 are, for example, a power amplifier, a transmission filter, a reception filter, or a low-noise amplifier.

[0037] The electronic component 32 has a main body 321, a plurality of electrodes (not shown), and a plurality of bumps 322. The electronic component 32 is disposed on the first main surface 21 of the mounting substrate 2 by connecting the plurality of electrodes of the electronic component 32 to a plurality of electrodes (not shown) provided on the first main surface 21 of the mounting substrate 2 via the plurality of bumps 322.

[0038] The main body portion 321 has a functional portion. The main body portion 321 is disposed on the mounting substrate 2 such that one main surface of the main body portion 321 faces the mounting substrate 2 in the thickness direction D1 of the mounting substrate 2. More specifically, the one main surface of the main body portion 321 faces the first main surface 21 of the mounting substrate 2 in a state in which the electronic component 32 is disposed on the mounting substrate 2.

[0039] A plurality of electrodes (not shown) are formed on one main surface of the main body portion 321. The plurality of electrodes are provided, for example, on the one main surface of the main body portion 321 and spaced apart from each other.

[0040] The bumps 322 are used to connect the electrodes to the conductive layer of the mounting substrate 2. The bumps 322 are arranged on the electrodes. Each bump 322 is formed, for example, in a circular shape. Each bump 322 is formed, for example, from solder.

[0041] The electronic component 33 has a main body 331, a plurality of electrodes (not shown), and a plurality of bumps 332. The electronic component 33 is disposed on the first main surface 21 of the mounting substrate 2 by connecting the plurality of electrodes of the electronic component 33 to a plurality of electrodes (not shown) provided on the first main surface 21 of the mounting substrate 2 via the plurality of bumps 332.

[0042] The main body portion 331 has a functional portion. The main body portion 331 is disposed on the mounting substrate 2 such that one main surface of the main body portion 331 faces the mounting substrate 2 in the thickness direction D1 of the mounting substrate 2. More specifically, the one main surface of the main body portion 331 faces the first main surface 21 of the mounting substrate 2 in a state in which the electronic component 33 is disposed on the mounting substrate 2.

[0043] A plurality of electrodes (not shown) are formed on one main surface of the main body portion 331. The plurality of electrodes are provided, for example, on the one main surface of the main body portion 331 and spaced apart from each other.

[0044] The bumps 332 are used to connect the electrodes to the conductive layer of the mounting substrate 2. The bumps 332 are arranged on the electrodes. Each bump 332 is formed, for example, in a circular shape. Each bump 332 is formed, for example, from solder.

[0045] The electronic component 34 has a main body 341, a plurality of electrodes (not shown), and a plurality of bumps 342. The electronic component 34 is disposed on the first main surface 21 of the mounting substrate 2 by connecting the plurality of electrodes of the electronic component 34 to a plurality of electrodes (not shown) provided on the first main surface 21 of the mounting substrate 2 via the plurality of bumps 342.

[0046] The main body 341 has a functional part. The main body 341 is disposed on the mounting substrate 2 such that one main surface of the main body 341 faces the mounting substrate 2 in the thickness direction D1 of the mounting substrate 2. More specifically, when the electronic component 34 is disposed on the mounting substrate 2, the one main surface of the main body 341 faces the first main surface 21 of the mounting substrate 2.

[0047] A plurality of electrodes (not shown) are formed on one main surface of the main body portion 341. The plurality of electrodes are provided, for example, on the one main surface of the main body portion 341 and spaced apart from each other.

[0048] The bumps 342 are used to connect the electrodes to the conductive layer of the mounting substrate 2. The bumps 342 are arranged on the electrodes. Each bump 342 is formed, for example, in a circular shape. Each bump 342 is formed, for example, from solder.

[0049] (2.3) External Connection Terminals The plurality of external connection terminals 4 include a first signal terminal 5, a second signal terminal 6, and a ground terminal 7, as shown in FIGS.

[0050] The plurality of external connection terminals 4 are arranged on the second main surface 22 of the mounting substrate 2. The plurality of external connection terminals 4 are terminals for electrically connecting the mounting substrate 2 to an external substrate (not shown). The plurality of external connection terminals 4 are arranged at intervals from one another on the second main surface 22 of the mounting substrate 2. In a plan view of the mounting substrate 2 in the thickness direction D1, the plurality of external connection terminals 4 are arranged in a matrix along the first direction D21 and the second direction D22.

[0051] Each of the external connection terminals 4 is a columnar (e.g., cylindrical) conductive member. The material of the external connection terminals 4 is, for example, a metal (e.g., copper, copper alloy, etc.). The tip of each of the external connection terminals 4 may include, for example, a gold plating layer.

[0052] Each external connection terminal 4 is connected to an external connection electrode (not shown) of the external substrate. In this specification, "the external connection terminals 4 are connected to the external connection electrodes of the external substrate" does not only mean that the external connection terminals 4 are in contact with the external connection terminals of the external substrate, but also means that the external connection terminals 4 are electrically connected to the external connection terminals of the external substrate via conductor electrodes, conductor terminals, wiring, other circuit components, etc. The multiple external connection terminals 4 are connected to the external connection electrodes of the external substrate via connecting members (e.g., solder bumps) made of a conductor, for example.

[0053] (2.4) First Signal Terminal The first signal terminal 5 is connected to the second main surface 22 of the mounting substrate 2, as shown in Figures 1 and 2. The first signal terminal 5 has a first portion 51 and a second portion 52. The first portion 51 is a portion on the second main surface 22 side of the mounting substrate 2. The second portion 52 is a portion on the opposite side of the mounting substrate 2 from the second main surface 22.

[0054] In the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the width W1 of the first portion 51 of the first signal terminal 5 is narrower than the width W2 of the second portion 52 of the first signal terminal 5.

[0055] (2.5) Second Signal Terminal The second signal terminal 6 is connected to the second main surface 22 of the mounting substrate 2, as shown in Figures 1 and 2. The second signal terminal 6 has a fifth portion 61 and a sixth portion 62. The fifth portion 61 is a portion on the second main surface 22 side of the mounting substrate 2. The sixth portion 62 is a portion on the opposite side of the mounting substrate 2 from the second main surface 22.

[0056] In the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the width W5 of the fifth portion 61 of the second signal terminal 6 is narrower than the width W6 of the sixth portion 62 of the second signal terminal 6.

[0057] (2.6) Ground Terminal The ground terminal 7 is connected to the second main surface 22 of the mounting substrate 2, as shown in Figures 1 and 2. The ground terminal 7 has a third portion 71 and a fourth portion 72. The third portion 71 is a portion on the second main surface 22 side of the mounting substrate 2. The fourth portion 72 is a portion on the opposite side of the mounting substrate 2 from the second main surface 22.

[0058] In the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the width W3 of the third portion 71 of the ground terminal 7 is wider than the width W4 of the fourth portion 72 of the ground terminal 7.

[0059] (2.7) Resin Layers The resin layers 8 include a first resin layer 81 and a second resin layer 82, as shown in FIG.

[0060] (2.7.1) First Resin Layer The first resin layer 81 is disposed on the first main surface 21 of the mounting substrate 2. The first resin layer 81 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. The first resin layer 81 contacts the first main surface 21 of the mounting substrate 2 and covers at least a portion of the electronic components 32 to 34. This makes it possible to protect the mounting substrate 2 and the electronic components 32 to 34.

[0061] (2.7.2) Second Resin Layer The second resin layer 82 is disposed on the second main surface 22 of the mounting substrate 2. The second resin layer 82 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. The second resin layer 82 contacts the second main surface 22 of the mounting substrate 2 and covers at least a portion of the electronic component 31. This makes it possible to protect the mounting substrate 2 and the electronic component 31.

[0062] (3) Arrangement of the First Signal Terminal, the Second Signal Terminal, and the Ground Terminal As shown in FIGS. 1 and 2, the ground terminal 7 is arranged between the first signal terminal 5 and the second signal terminal 6. More specifically, the ground terminal 7 is arranged between the first signal terminal 5 and the second signal terminal 6 in a first direction D21 that is orthogonal to the thickness direction D1 of the mounting substrate 2.

[0063] As described above, in this embodiment, the first signal terminal 5 has the first portion 51 and the second portion 52. The first portion 51 is a portion on the second main surface 22 side of the mounting substrate 2. The second portion 52 is a portion on the opposite side of the mounting substrate 2 from the second main surface 22.

[0064] In this embodiment, the second signal terminal 6 has a fifth portion 61 and a sixth portion 62. The fifth portion 61 is a portion on the second main surface 22 side of the mounting substrate 2. The sixth portion 62 is a portion on the opposite side to the second main surface 22.

[0065] Furthermore, in this embodiment, the ground terminal 7 has a third portion 71 and a fourth portion 72. The third portion 71 is a portion on the second main surface 22 side of the mounting substrate 2. The fourth portion 72 is a portion on the opposite side of the mounting substrate 2 from the second main surface 22.

[0066] (3.1) Cross-sectional Areas of First Signal Terminal, Second Signal Terminal, and Ground Terminal In the present embodiment, the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. More specifically, in a plan view in the thickness direction D1 of the mounting substrate 2, the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. In other words, the cross-sectional area of ​​the second portion 52 of the first signal terminal 5 is larger than the cross-sectional area of ​​the first portion 51 of the first signal terminal 5.

[0067] As described above, the cross-sectional area of ​​the second portion 52 of the first signal terminal 5 is larger than the cross-sectional area of ​​the first portion 51 of the first signal terminal 5, so that the area of ​​the second portion 52 of the first signal terminal 5 that is connected to an external substrate (not shown) can be increased, thereby improving the connection reliability of the first signal terminal 5.

[0068] Furthermore, since the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5, it is possible to reduce the connection area of ​​the first signal terminal 5 on the second main surface 22 of the mounting substrate 2. As a result, it is possible to increase the degree of freedom of wiring on the mounting substrate 2.

[0069] In this embodiment, the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. More specifically, in a plan view in the thickness direction D1 of the mounting substrate 2, the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5.

[0070] When the cross-sectional area of ​​the third portion 71 of the ground terminal 7 arranged between the first signal terminal 5 and the second signal terminal 6 is increased, the isolation between the first signal terminal 5 and the second signal terminal 6 can be improved compared to when the cross-sectional area of ​​the ground terminal is small.

[0071] Furthermore, even if the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is increased, the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 facing the third portion 71 of the ground terminal 7 in the first direction D21 is small, so it is possible to shorten the distance between the first signal terminal 5 and the ground terminal 7. As a result, it is possible to reduce the size of the high-frequency module 1 while improving the isolation between the first signal terminal 5 and the second signal terminal 6.

[0072] In this embodiment, the cross-sectional area of ​​the fifth portion 61 of the second signal terminal 6 is smaller than the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6. More specifically, in a plan view in the thickness direction D1 of the mounting substrate 2, the cross-sectional area of ​​the fifth portion 61 of the second signal terminal 6 is smaller than the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6. In other words, the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6 is larger than the cross-sectional area of ​​the fifth portion 61 of the second signal terminal 6.

[0073] As described above, the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6 is larger than the cross-sectional area of ​​the fifth portion 61 of the second signal terminal 6, so that the area connected to an external substrate (not shown) can be increased in the sixth portion 62 of the second signal terminal 6. This improves the connection reliability of the second signal terminal 6.

[0074] In this embodiment, the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6. More specifically, in a plan view in the thickness direction D1 of the mounting substrate 2, the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6.

[0075] When the cross-sectional area of ​​the third portion 71 of the ground terminal 7 arranged between the first signal terminal 5 and the second signal terminal 6 is increased, the isolation between the first signal terminal 5 and the second signal terminal 6 can be improved compared to when the cross-sectional area of ​​the ground terminal is small.

[0076] Furthermore, even if the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is increased, the cross-sectional area of ​​the fifth portion 61 of the second signal terminal 6 facing the third portion 71 of the ground terminal 7 in the first direction D21 is small, so it is possible to shorten the distance between the second signal terminal 6 and the ground terminal 7. This allows the high-frequency module 1 to be miniaturized while improving the isolation between the first signal terminal 5 and the second signal terminal 6.

[0077] (3.2) Concave and Convex Portions of First Signal Terminal, Second Signal Terminal, and Ground Terminal In this embodiment, the first portion 51 of the first signal terminal 5 has a concave portion 53. The concave portion 53 faces the ground terminal 7 and is recessed more than the second portion 52 of the first signal terminal 5. More specifically, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the first portion 51 of the first signal terminal 5 is recessed more than the second portion 52 of the first signal terminal 5. In other words, in the first direction D21, the second portion 52 of the first signal terminal 5 has a convex portion 54. The convex portion 54 faces the ground terminal 7 and protrudes more than the first portion 51 of the first signal terminal 5.

[0078] As described above, since the second portion 52 of the first signal terminal 5 has the convex portion 54, the cross-sectional area of ​​the second portion 52 of the first signal terminal 5 is larger than the cross-sectional area of ​​the first portion 51 of the first signal terminal 5, and the area of ​​the second portion 52 of the first signal terminal 5 that is connected to an external board (not shown) can be increased. This improves the connection reliability of the first signal terminal 5.

[0079] Furthermore, since the first portion 51 of the first signal terminal 5 has the recess 53, the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5, and the connection area of ​​the first signal terminal 5 can be reduced on the second main surface 22 of the mounting substrate 2. This increases the degree of freedom in wiring on the mounting substrate 2.

[0080] In this embodiment, the third portion 71 of the ground terminal 7 has a protrusion 73. The protrusion 73 faces the first signal terminal 5 and protrudes from the fourth portion 72 of the ground terminal 7. More specifically, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the third portion 71 of the ground terminal 7 protrudes from the fourth portion 72 of the ground terminal 7. In other words, the fourth portion 72 of the ground terminal 7 has a recess 74. The recess 74 faces the first signal terminal 5 and is recessed from the third portion 71 of the ground terminal 7.

[0081] The third portion 71 of the ground terminal 7, which is disposed between the first signal terminal 5 and the second signal terminal 6, has a protrusion 73, which increases the cross-sectional area of ​​the third portion 71 of the ground terminal 7. When the cross-sectional area of ​​the ground terminal 7 is increased, the isolation between the first signal terminal 5 and the second signal terminal 6 can be improved compared to when the cross-sectional area of ​​the ground terminal is small.

[0082] Furthermore, even if the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is increased, the first portion 51 of the first signal terminal 5 facing the third portion 71 of the ground terminal 7 in the first direction D21 has the recess 53, so it is possible to shorten the distance between the first signal terminal 5 and the ground terminal 7. As a result, it is possible to reduce the size of the high-frequency module 1 while improving the isolation between the first signal terminal 5 and the second signal terminal 6.

[0083] In this embodiment, the fifth portion 61 of the second signal terminal 6 has a recess 63. The recess 63 faces the ground terminal 7 and is recessed more than the sixth portion 62 of the second signal terminal 6. More specifically, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the fifth portion 61 of the second signal terminal 6 is recessed more than the sixth portion 62 of the second signal terminal 6. In other words, in the first direction D21, the sixth portion 62 of the second signal terminal 6 has a protrusion 64. The protrusion 64 faces the ground terminal 7 and protrudes more than the fifth portion 61 of the second signal terminal 6.

[0084] As described above, since the sixth portion 62 of the second signal terminal 6 has the convex portion 64, the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6 is larger than the cross-sectional area of ​​the fifth portion 61 of the second signal terminal 6, and the area of ​​the sixth portion 62 of the second signal terminal 6 that is connected to an external board (not shown) can be increased. This improves the connection reliability of the second signal terminal 6.

[0085] In this embodiment, the third portion 71 of the ground terminal 7 has a protrusion 75. The protrusion 75 faces the second signal terminal 6 and protrudes from the fourth portion 72 of the ground terminal 7. More specifically, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the third portion 71 of the ground terminal 7 protrudes from the fourth portion 72 of the ground terminal 7. In other words, the fourth portion 72 of the ground terminal 7 has a recess 76. The recess 76 faces the second signal terminal 6 and is recessed from the third portion 71 of the ground terminal 7.

[0086] The third portion 71 of the ground terminal 7, which is disposed between the first signal terminal 5 and the second signal terminal 6, has a protrusion 75, which increases the cross-sectional area of ​​the third portion 71 of the ground terminal 7. When the cross-sectional area of ​​the ground terminal 7 is increased, the isolation between the first signal terminal 5 and the second signal terminal 6 can be improved compared to when the cross-sectional area of ​​the ground terminal is small.

[0087] Furthermore, even if the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is increased, the fifth portion 61 of the second signal terminal 6 facing the third portion 71 of the ground terminal 7 in the first direction D21 has the recess 63, so it is possible to shorten the distance between the second signal terminal 6 and the ground terminal 7. This allows the high-frequency module 1 to be miniaturized while improving the isolation between the first signal terminal 5 and the second signal terminal 6.

[0088] (3.3) Widths of the First Signal Terminal, the Second Signal Terminal, and the Ground Terminal In this embodiment, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the width W1 of the first portion 51 of the first signal terminal 5 is narrower than the width W2 of the second portion 52 of the first signal terminal 5. In other words, in the first direction D21, the width W2 of the second portion 52 of the first signal terminal 5 is wider than the width W1 of the first portion 51 of the first signal terminal 5.

[0089] As described above, the width W2 of the second portion 52 of the first signal terminal 5 is greater than the width W1 of the first portion 51 of the first signal terminal 5, so that the area of ​​the second portion 52 of the first signal terminal 5 that is connected to an external substrate (not shown) can be increased, thereby improving the connection reliability of the first signal terminal 5.

[0090] Furthermore, since the width W1 of the first portion 51 of the first signal terminal 5 is narrower than the width W2 of the second portion 52 of the first signal terminal 5, the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5, and this makes it possible to reduce the connection area of ​​the first signal terminal 5 on the second main surface 22 of the mounting substrate 2. This increases the degree of freedom in wiring on the mounting substrate 2.

[0091] In this embodiment, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the width W3 of the third portion 71 of the ground terminal 7 is wider than the width W2 of the second portion 52 of the first signal terminal 5.

[0092] When the width W3 of the third portion 71 of the ground terminal 7 arranged between the first signal terminal 5 and the second signal terminal 6 is increased, the isolation between the first signal terminal 5 and the second signal terminal 6 can be improved compared to when the width of the ground terminal is narrow.

[0093] Furthermore, even if the width W3 of the third portion 71 of the ground terminal 7 is increased, the width W1 of the first portion 51 of the first signal terminal 5 facing the third portion 71 of the ground terminal 7 in the first direction D21 is narrow, so the distance between the first signal terminal 5 and the ground terminal 7 can be shortened. This allows the high-frequency module 1 to be miniaturized while improving the isolation between the first signal terminal 5 and the second signal terminal 6.

[0094] In this embodiment, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the width W5 of the fifth portion 61 of the second signal terminal 6 is narrower than the width W6 of the sixth portion 62 of the second signal terminal 6. In other words, in the first direction D21, the width W6 of the sixth portion 62 of the second signal terminal 6 is wider than the width W5 of the fifth portion 61 of the second signal terminal 6.

[0095] As described above, the width W6 of the sixth portion 62 of the second signal terminal 6 is greater than the width W5 of the fifth portion 61 of the second signal terminal 6, so that the area of ​​the sixth portion 62 of the second signal terminal 6 that is connected to an external substrate (not shown) can be increased, thereby improving the connection reliability of the second signal terminal 6.

[0096] In this embodiment, in the first direction D21 in which the first signal terminal 5, the ground terminal 7, and the second signal terminal 6 are aligned, the width W3 of the third portion 71 of the ground terminal 7 is wider than the width W6 of the sixth portion 62 of the second signal terminal 6.

[0097] When the width W3 of the third portion 71 of the ground terminal 7 arranged between the first signal terminal 5 and the second signal terminal 6 is increased, the isolation between the first signal terminal 5 and the second signal terminal 6 can be improved compared to when the width of the ground terminal is narrow.

[0098] Furthermore, even if the width W3 of the third portion 71 of the ground terminal 7 is increased, the width W5 of the fifth portion 61 of the second signal terminal 6 facing the third portion 71 of the ground terminal 7 in the first direction D21 is narrow, so the distance between the second signal terminal 6 and the ground terminal 7 can be shortened. This allows the high-frequency module 1 to be miniaturized while improving the isolation between the first signal terminal 5 and the second signal terminal 6.

[0099] (3.4) Adjacent Arrangement of Ground Terminal to First Signal Terminal and Second Signal Terminal In this embodiment, the ground terminal 7 is adjacent to the first signal terminal 5 and the second signal terminal 6. In this specification, "the ground terminal 7 is adjacent to the first signal terminal 5 and the second signal terminal 6" refers to a case where no other external connection terminal 4 is arranged between the ground terminal 7 and the first signal terminal 5, and no other external connection terminal 4 is arranged between the ground terminal 7 and the second signal terminal 6.

[0100] The ground terminal 7 may be adjacent to only the first signal terminal 5. Alternatively, the ground terminal 7 may be adjacent to only the second signal terminal 6.

[0101] (3.5) Arrangement Position of Ground Terminal In this embodiment, as shown in Fig. 2 , the ground terminal 7 is arranged at a position other than the four corners of the mounting board 2. The four corners of the mounting board 2 refer to the four corners of the mounting board 2 in the rectangular mounting board 2 shown in Fig. 2 , and refer to the positions where two of the four sides of the mounting board 2 intersect. Therefore, "the ground terminal 7 is arranged at a position other than the four corners of the mounting board 2" means that the ground terminal 7 is arranged so as not to be adjacent to two sides of the mounting board 2.

[0102] (3.6) Positional Relationship Between the First Signal Terminal and the Second Signal Terminal and the Electronic Component In this embodiment, as shown in Fig. 2, both the first signal terminal 5 and the second signal terminal 6 are adjacent to the electronic component 31. "Both the first signal terminal 5 and the second signal terminal 6 are adjacent to the electronic component 31" means that no other external connection terminal 4 is arranged between the first signal terminal 5 and the electronic component 31, and no other external connection terminal 4 is arranged between the second signal terminal 6 and the electronic component 31. "Other external connection terminals 4" refers to external connection terminals 4 other than the first signal terminal 5 and the second signal terminal 6.

[0103] Of the first and second signal terminals 5 and 6, only the first signal terminal 5 may be adjacent to the electronic component 31. Alternatively, of the first and second signal terminals 5 and 6, only the second signal terminal 6 may be adjacent to the electronic component 31. In short, it is sufficient that at least one of the first and second signal terminals 5 and 6 is adjacent to the electronic component 31.

[0104] (3.7) Positions of Boundaries in the First Signal Terminal, the Second Signal Terminal, and the Ground Terminal In this embodiment, as shown in FIG. 1 , the boundary between the first portion 51 and the second portion 52 of the first signal terminal 5, the boundary between the fifth portion 61 and the sixth portion 62 of the second signal terminal 6, and the boundary between the third portion 71 and the fourth portion 72 of the ground terminal 7 are located at the same position in the thickness direction D1 of the mounting substrate 2. In other words, the length of the first portion 51 of the first signal terminal 5, the length of the fifth portion 61 of the second signal terminal 6, and the length of the third portion 71 of the ground terminal 7 are the same in the thickness direction D1 of the mounting substrate 2. Furthermore, the length of the second portion 52 of the first signal terminal 5, the length of the sixth portion 62 of the second signal terminal 6, and the length of the fourth portion 72 of the ground terminal 7 are the same in the thickness direction D1 of the mounting substrate 2.

[0105] The boundary portion of the first signal terminal 5, the boundary portion of the second signal terminal 6, and the boundary portion of the ground terminal 7 may be located at different positions in the thickness direction D1 of the mounting substrate 2. In other words, the length of the first portion 51 of the first signal terminal 5, the length of the fifth portion 61 of the second signal terminal 6, and the length of the third portion 71 of the ground terminal 7 may be different in the thickness direction D1 of the mounting substrate 2. Furthermore, the length of the second portion 52 of the first signal terminal 5, the length of the sixth portion 62 of the second signal terminal 6, and the length of the fourth portion 72 of the ground terminal 7 may be different in the thickness direction D1 of the mounting substrate 2.

[0106] As an example, the length of the first portion 51 of the first signal terminal 5 is longer than the length of the third portion 71 of the ground terminal 7. In other words, the length of the second portion 52 of the first signal terminal 5 is shorter than the length of the fourth portion 72 of the ground terminal 7. Similarly, the length of the fifth portion 61 of the second signal terminal 6 is longer than the length of the third portion 71 of the ground terminal 7. In other words, the length of the sixth portion 62 of the second signal terminal 6 is shorter than the length of the fourth portion 72 of the ground terminal 7.

[0107] As another example, the length of the first portion 51 of the first signal terminal 5 is shorter than the length of the third portion 71 of the ground terminal 7. In other words, the length of the second portion 52 of the first signal terminal 5 is longer than the length of the fourth portion 72 of the ground terminal 7. Similarly, the length of the fifth portion 61 of the second signal terminal 6 is shorter than the length of the third portion 71 of the ground terminal 7. In other words, the length of the sixth portion 62 of the second signal terminal 6 is longer than the length of the fourth portion 72 of the ground terminal 7.

[0108] (4) Circuit Configuration of High-Frequency Module As shown in FIG. 3, the high-frequency module 1 includes an antenna switch 11, a plurality of filters 12, a plurality of low-noise amplifiers 13, and a plurality of terminals 14.

[0109] (4.1) Terminals The plurality of terminals 14 include a first antenna terminal 141, a second antenna terminal 142, a signal input terminal 143, a first signal output terminal 144, and a second signal output terminal 145, as shown in FIG.

[0110] The first antenna terminal 141 is a terminal to which a first antenna 911 (described later) is connected. A received signal is input from the first antenna 911 to the first antenna terminal 141. The second antenna terminal 142 is a terminal to which a second antenna 912 (described later) is connected. A received signal is input from the second antenna 912 to the second antenna terminal 142. The signal input terminal 143 is a terminal to which another module (not shown) is connected. A received signal output from, for example, a filter (not shown) of another module is input to the signal input terminal 143. The first signal output terminal 144 is a terminal to which the first low-noise amplifier 131 and a signal processing circuit 92 (described later) are connected. The received signal output from the first low-noise amplifier 131 is output to the signal processing circuit 92 through the first signal output terminal 144. The second signal output terminal 145 is a terminal to which the second low-noise amplifier 132 and the signal processing circuit 92 (described later) are connected. The received signal output from the second low-noise amplifier 132 is output to the signal processing circuit 92 via a second signal output terminal 145 .

[0111] (4.2) Antenna Switch As shown in FIG. 3, the antenna switch 11 is connected to a first antenna terminal 141, a second antenna terminal 142, and a plurality of filters 12.

[0112] (4.3) Filters The filters 12 include a first filter 121 and a second filter 122, as shown in FIG.

[0113] The first filter 121 is connected between the antenna switch 11 and the input terminal of a first low-noise amplifier 131 (described later). The first filter 121 has a pass band that includes the frequency band of the first communication band. As a result, the first filter 121 passes the received signal of the first communication band from the antenna switch 11.

[0114] The second filter 122 is connected between the antenna switch 11 and the input terminal of a second low-noise amplifier 132 (described later). The second filter 122 has a pass band that includes the frequency band of the second communication band. As a result, the second filter 122 passes the received signal of the second communication band from the antenna switch 11.

[0115] (4.4) Low-Noise Amplifiers As shown in FIG. 3, the plurality of low-noise amplifiers 13 include a first low-noise amplifier 131 and a second low-noise amplifier 132.

[0116] The first low-noise amplifier 131 amplifies the received signal from the first filter 121. The first low-noise amplifier 131 has an input terminal and an output terminal. The input terminal of the first low-noise amplifier 131 is connected to the first filter 121. The output terminal of the first low-noise amplifier 131 is connected to the first signal output terminal 144. Therefore, the output terminal of the first low-noise amplifier 131 is connected to the signal processing circuit 92 via the first signal output terminal 144. The first low-noise amplifier 131 amplifies the received signal input to the input terminal from the first filter 121 and outputs the amplified signal from the output terminal.

[0117] The second low-noise amplifier 132 amplifies the received signal from the second filter 122. The second low-noise amplifier 132 has an input terminal and an output terminal. The input terminal of the second low-noise amplifier 132 is connected to the second filter 122. The output terminal of the second low-noise amplifier 132 is connected to the second signal output terminal 145. Therefore, the output terminal of the second low-noise amplifier 132 is connected to the signal processing circuit 92 via the second signal output terminal 145. The second low-noise amplifier 132 amplifies the received signal input to the input terminal from the second filter 122 and outputs the amplified signal from the output terminal.

[0118] (5) Communication Device As shown in Fig. 3, the communication device 9 includes the high-frequency module 1, multiple (two in the illustrated example) antennas 91, and a signal processing circuit 92. The communication device 9 is, for example, a mobile terminal (e.g., a smartphone). Note that the communication device 9 is not limited to a mobile terminal and may also be, for example, a wearable terminal (e.g., a smart watch).

[0119] The high-frequency module 1 is configured to amplify a reception signal (high-frequency signal) received by the antenna 91 and output the amplified signal to the signal processing circuit 92. The high-frequency module 1 is controlled by, for example, the signal processing circuit 92. When the high-frequency module 1 has a transmission function, the high-frequency module 1 is configured to amplify a transmission signal (high-frequency signal) from the signal processing circuit 92 and output the amplified signal to the antenna 91.

[0120] The high-frequency module 1 is a module that is compatible with, for example, the 4G (fourth generation mobile communication) standard and the 5G (fifth generation mobile communication) standard. The 4G standard is, for example, the 3GPP (Third Generation Partnership Project, registered trademark) LTE (Long Term Evolution, registered trademark) standard. The 5G standard is, for example, 5G NR (New Radio). The high-frequency module 1 is a module that is compatible with carrier aggregation and dual connectivity.

[0121] In the communication device 9, the high-frequency module 1 is electrically connectable to an external board (not shown). The external board corresponds to, for example, a motherboard of a mobile terminal, a communication device, or the like. Note that the high-frequency module 1 being electrically connectable to an external board includes not only the case where the high-frequency module 1 is directly mounted on the external board, but also the case where the high-frequency module 1 is indirectly mounted on the external board. Furthermore, the case where the high-frequency module 1 is indirectly mounted on the external board includes the case where the high-frequency module 1 is mounted on another high-frequency module mounted on the external board, for example.

[0122] (5.1) Antennas The plurality of antennas 91 includes a first antenna 911 and a second antenna 912 as shown in FIG.

[0123] The first antenna 911 is connected to the first antenna terminal 141 of the high-frequency module 1. The first antenna 911 has a receiving function of receiving a reception signal as radio waves from the outside and outputting it to the high-frequency module 1. The first antenna 911 may also have a transmitting function of emitting a transmission signal output from the high-frequency module 1 as radio waves.

[0124] The second antenna 912 is connected to the second antenna terminal 142 of the high-frequency module 1. The second antenna 912 has a receiving function of receiving a reception signal as radio waves from the outside and outputting it to the high-frequency module 1. Note that the second antenna 912 may also have a transmitting function of emitting a transmission signal output from the high-frequency module 1 as radio waves.

[0125] (5.2) Signal Processing Circuit The signal processing circuit 92 is connected to the high-frequency module 1 as shown in FIG. 3 . The signal processing circuit 92 processes high-frequency signals passing through the high-frequency module 1. More specifically, the signal processing circuit 92 is configured to process reception signals received from the high-frequency module 1. Note that, if the high-frequency module 1 has a transmission function, the signal processing circuit 92 is configured to process transmission signals to be output to the high-frequency module 1.

[0126] The signal processing circuit 92 includes an RF signal processing circuit 93 and a baseband signal processing circuit 94 .

[0127] The RF signal processing circuit 93 is, for example, an RFIC (Radio Frequency Integrated Circuit), and performs signal processing on high frequency signals (received signals and transmitted signals).

[0128] The RF signal processing circuit 93 performs signal processing on the received signal output from the high-frequency module 1, and outputs the processed received signal to the baseband signal processing circuit 94. Specifically, the RF signal processing circuit 93 performs signal processing such as down-conversion on the received signal output from the reception path of the high-frequency module 1, and outputs the processed received signal to the baseband signal processing circuit 94.

[0129] When the high-frequency module 1 has a transmission function, the RF signal processing circuit 93 performs signal processing on the transmission signal output from the baseband signal processing circuit 94 and outputs the processed transmission signal to the high-frequency module 1. Specifically, the RF signal processing circuit 93 performs signal processing such as up-conversion on the transmission signal output from the baseband signal processing circuit 94 and outputs the processed transmission signal to the transmission path of the high-frequency module 1.

[0130] The baseband signal processing circuit 94 is, for example, a BBIC (Baseband Integrated Circuit).

[0131] The baseband signal processing circuit 94 performs predetermined signal processing on the signal from the RF signal processing circuit 93. More specifically, the baseband signal processing circuit 94 outputs the received signal received from the RF signal processing circuit 93 to the outside. The received signal processed by the baseband signal processing circuit 94 is used, for example, as an image signal for image display or as an audio signal for telephone calls.

[0132] When the high-frequency module 1 has a transmission function, the baseband signal processing circuit 94 performs predetermined signal processing on a signal from outside the signal processing circuit 92. More specifically, the baseband signal processing circuit 94 generates a transmission signal from a baseband signal (e.g., an audio signal and an image signal) from outside the signal processing circuit 92, and outputs the generated transmission signal to the RF signal processing circuit 93.

[0133] (6) Effects In the high-frequency module 1 according to the embodiment, the ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6, and the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. This ensures isolation between the first signal terminal 5 and the second signal terminal 6. Furthermore, in the high-frequency module 1 according to the embodiment, the cross-sectional area of ​​the first portion 51 of the first signal terminal 5 is smaller than the cross-sectional area of ​​the second portion 52 of the first signal terminal 5. In other words, in the first signal terminal 5, the cross-sectional area of ​​the second portion 52 is larger than the cross-sectional area of ​​the first portion 51. This ensures connection reliability of the first signal terminal 5. As a result, the high-frequency module 1 according to the embodiment can ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0134] In the high-frequency module 1 according to the embodiment, the ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6, and the third portion 71 of the ground terminal 7 has a convex portion 73 that faces the first signal terminal 5 and protrudes beyond the fourth portion 72 of the ground terminal 7. This ensures isolation between the first signal terminal 5 and the second signal terminal 6. Furthermore, in the high-frequency module 1 according to the embodiment, the first portion 51 of the first signal terminal 5 has a concave portion 53, and the third portion 71 of the ground terminal 7 has a convex portion 73. In other words, the second portion 52 of the first signal terminal 5 has a convex portion 54. This ensures connection reliability of the first signal terminal 5. As a result, the high-frequency module 1 according to the embodiment can ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0135] In the high-frequency module 1 according to the embodiment, the ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6, and the width W3 of the third portion 71 of the ground terminal 7 is wider than the width W2 of the second portion 52 of the first signal terminal 5. This ensures isolation between the first signal terminal 5 and the second signal terminal 6. Furthermore, in the high-frequency module 1 according to the embodiment, the width W1 of the first portion 51 of the first signal terminal 5 is narrower than the width W2 of the second portion 52 of the first signal terminal 5. In other words, in the first signal terminal 5, the width W2 of the second portion 52 is wider than the width W1 of the first portion 51. This ensures connection reliability of the first signal terminal 5. As a result, the high-frequency module 1 according to the embodiment can ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0136] In the high-frequency module 1 according to the embodiment, the ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6, and the cross-sectional area of ​​the third portion 71 of the ground terminal 7 is larger than the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6. This further ensures isolation between the first signal terminal 5 and the second signal terminal 6. Furthermore, in the high-frequency module 1 according to the embodiment, the cross-sectional area of ​​the fifth portion 61 of the second signal terminal 6 is smaller than the cross-sectional area of ​​the sixth portion 62 of the second signal terminal 6. In other words, in the second signal terminal 6, the cross-sectional area of ​​the sixth portion 62 is larger than the cross-sectional area of ​​the fifth portion 61. This further ensures connection reliability of the second signal terminal 6. As a result, the high-frequency module 1 according to the embodiment can further ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0137] In the high-frequency module 1 according to the embodiment, the ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6, and the third portion 71 of the ground terminal 7 has a convex portion 75 that faces the second signal terminal 6 and protrudes beyond the fourth portion 72 of the ground terminal 7. This further ensures isolation between the first signal terminal 5 and the second signal terminal 6. Furthermore, in the high-frequency module 1 according to the embodiment, the fifth portion 61 of the second signal terminal 6 has a concave portion 63, and the third portion 71 of the ground terminal 7 has a convex portion 75. In other words, the sixth portion 62 of the second signal terminal 6 has a convex portion 64. This further ensures connection reliability of the second signal terminal 6. As a result, the high-frequency module 1 according to the embodiment can further ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0138] In the high-frequency module 1 according to the embodiment, the ground terminal 7 is disposed between the first signal terminal 5 and the second signal terminal 6, and the width W3 of the third portion 71 of the ground terminal 7 is wider than the width W6 of the sixth portion 62 of the second signal terminal 6. This further ensures isolation between the first signal terminal 5 and the second signal terminal 6. Furthermore, in the high-frequency module 1 according to the embodiment, the width W5 of the fifth portion 61 of the second signal terminal 6 is narrower than the width W6 of the sixth portion 62 of the second signal terminal 6. In other words, in the second signal terminal 6, the width W6 of the sixth portion 62 is wider than the width W5 of the fifth portion 61. This further ensures connection reliability of the second signal terminal 6. As a result, the high-frequency module 1 according to the embodiment can further ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0139] In the high-frequency module 1 according to the embodiment, the ground terminal 7 is adjacent to the first signal terminal 5. This can further improve the isolation between the signal terminals.

[0140] In the high-frequency module 1 according to the embodiment, the ground terminal 7 is adjacent to the first signal terminal 5 and the second signal terminal 6. This can further improve the isolation between the signal terminals.

[0141] In the high-frequency module 1 according to the embodiment, the ground terminal 7 located between the first signal terminal 5 and the second signal terminal 6 is arranged at a location other than the four corners of the mounting substrate 2. This allows for greater isolation between the signal terminals than when the ground terminal 7 is arranged at the four corners of the mounting substrate 2.

[0142] In the high-frequency module 1 according to the embodiment, at least one of the first signal terminal 5 and the second signal terminal 6 is adjacent to the electronic component 31. This can improve isolation between at least one of the first signal and the second signal input to or output from the electronic component 31 and the remaining signals.

[0143] In the high-frequency module 1 according to the embodiment, both the first signal terminal 5 and the second signal terminal 6 are adjacent to the electronic component 31. This can improve isolation between the first signal and the second signal input to or output from the electronic component 31.

[0144] According to the communication device 9 of the embodiment, in the high-frequency module 1, it is possible to ensure both isolation between the signal terminals and connection reliability of the signal terminals.

[0145] (7) Modifications Modifications of the embodiment will now be described.

[0146] In the radio-frequency module 1a according to the modified example of the embodiment, as shown in Fig. 4, the first signal terminal 5a is a first antenna terminal 141 (see Fig. 3) through which a received signal in a first communication band passes, and the second signal terminal 6a is a second antenna terminal 142 (see Fig. 3) through which a received signal in a second communication band capable of simultaneous communication with the first communication band passes. The ground terminal 7a is disposed between the first signal terminal 5a and the second signal terminal 6a. The first signal terminal 5a has a first portion 51a and a second portion 52a. The second signal terminal 6a has a fifth portion 61a and a sixth portion 62a. The ground terminal 7a has a third portion 71a and a fourth portion 72a.

[0147] In the high-frequency module 1a according to the modified example of the embodiment, as shown in FIG. 4 , the first signal terminal 5b is a signal input terminal 143 (see FIG. 3 ) connected to an external receiving filter (not shown) and an input terminal of the low-noise amplifier 13 (first low-noise amplifier 131), and the second signal terminal 6b is a first signal output terminal 144 (see FIG. 3 ) connected to the output terminal of the low-noise amplifier 13 (first low-noise amplifier 131) and passing a received signal in the first communication band. The ground terminal 7b is disposed between the first signal terminal 5b and the second signal terminal 6b. The first signal terminal 5b has a first portion 51b and a second portion 52b. The second signal terminal 6b has a fifth portion 61b and a sixth portion 62b. The ground terminal 7b has a third portion 71b and a fourth portion 72b.

[0148] Furthermore, in the high-frequency module 1a according to the modified example of the embodiment, as shown in FIG. 4 , the first signal terminal 5c is a first signal output terminal 144 (see FIG. 3 ) through which a first received signal in a first communication band passes, and the second signal terminal 6c is a second signal output terminal 145 (see FIG. 3 ) through which a second received signal in a second communication band passes. The ground terminal 7c is disposed between the first signal terminal 5c and the second signal terminal 6c. The first signal terminal 5c has a first portion 51c and a second portion 52c. The second signal terminal 6c has a fifth portion 61c and a sixth portion 62c. The ground terminal 7c has a third portion 71c and a fourth portion 72c.

[0149] In the high-frequency module 1a according to the modified example of the embodiment, the first signal terminal 5a is the first antenna terminal 141, and the second signal terminal 6a is the second antenna terminal 142. This can improve isolation between the signal path of the first communication band and the signal path of the second communication band.

[0150] In the high-frequency module 1a according to the modified example of the embodiment, the first signal terminal 5b is a signal terminal connected to the input terminal of the low-noise amplifier 13 (first low-noise amplifier 131), and the second signal terminal 6b is a signal terminal connected to the output terminal of the low-noise amplifier 13 (first low-noise amplifier 131). This reduces the isolation between the input terminal and output terminal of the low-noise amplifier 13 (first low-noise amplifier 131).

[0151] In the high-frequency module 1a according to the modified example of the embodiment, the first signal terminal 5c is a first signal output terminal 144 through which a first reception signal in a first communication band passes, and the second signal terminal 6c is a second signal output terminal 145 through which a second reception signal in a second communication band passes, thereby improving isolation between the first reception signal and the second reception signal.

[0152] As another modification of this embodiment, the high-frequency modules 1 and 1a may be a transmitting module having a transmitting function for transmitting a high-frequency signal (transmitting signal), or a transceiver module having both a receiving function for receiving a high-frequency signal (receiving signal) and a transmitting function for transmitting a high-frequency signal (transmitting signal).

[0153] The above-described embodiments and modifications are merely a part of the various embodiments and modifications of the present invention. Furthermore, the embodiments and modifications can be modified in various ways depending on the design, etc., as long as the object of the present invention can be achieved.

[0154] (Aspects) The present specification discloses the following aspects.

[0155] A high-frequency module (1; 1a) according to a first aspect includes a mounting substrate (2), first signal terminals (5; 5a; 5b; 5c), second signal terminals (6; 6a; 6b; 6c), and ground terminals (7; 7a; 7b; 7c). The mounting substrate (2) has a first main surface (21) and a second main surface (22). The first main surface (21) and the second main surface (22) face each other. The first signal terminals (5; 5a; 5b; 5c) are connected to the second main surface (22) of the mounting substrate (2). The first signal terminals (5; 5a; 5b; 5c) have first portions (51; 51a; 51b; 51c) and second portions (52; 52a; 52b; 52c). The first portion (51; 51a; 51b; 51c) is a portion on the second main surface (22) side. The second portion (52; 52a; 52b; 52c) is a portion on the opposite side from the second main surface (22). The second signal terminal (6; 6a; 6b; 6c) is connected to the second main surface (22) of the mounting board (2). The ground terminal (7; 7a; 7b; 7c) is connected to the second main surface (22) of the mounting board (2). The ground terminal (7; 7a; 7b; 7c) has a third portion (71; 71a; 71b; 71c) and a fourth portion (72; 72a; 72b; 72c). The third portion (71; 71a; 71b; 71c) is a portion on the second main surface (22) side. The fourth portion (72; 72a; 72b; 72c) is the portion opposite the second main surface (22). The ground terminal (7; 7a; 7b; 7c) is disposed between the first signal terminal (5; 5a; 5b; 5c) and the second signal terminal (6; 6a; 6b; 6c). The cross-sectional area of ​​the first portion (51; 51a; 51b; 51c) of the first signal terminal (5; 5a; 5b; 5c) is smaller than the cross-sectional area of ​​the second portion (52; 52a; 52b; 52c) of the first signal terminal (5; 5a; 5b; 5c). The cross-sectional area of ​​the third portion (71; 71a; 71b; 71c) of the ground terminal (7; 7a; 7b; 7c) is larger than the cross-sectional area of ​​the second portion (52; 52a; 52b; 52c) of the first signal terminal (5; 5a; 5b; 5c).

[0156] According to the high-frequency module (1; 1a) of the first aspect, it is possible to ensure both isolation between signal terminals and connection reliability of the signal terminals.

[0157] A high-frequency module (1; 1a) according to a second aspect includes a mounting substrate (2), first signal terminals (5; 5a; 5b; 5c), second signal terminals (6; 6a; 6b; 6c), and ground terminals (7; 7a; 7b; 7c). The mounting substrate (2) has a first main surface (21) and a second main surface (22). The first main surface (21) and the second main surface (22) face each other. The first signal terminals (5; 5a; 5b; 5c) are connected to the second main surface (22) of the mounting substrate (2). The first signal terminals (5; 5a; 5b; 5c) have first portions (51; 51a; 51b; 51c) and second portions (52; 52a; 52b; 52c). The first portion (51; 51a; 51b; 51c) is a portion on the second main surface (22) side. The second portion (52; 52a; 52b; 52c) is a portion on the opposite side from the second main surface (22). The second signal terminal (6; 6a; 6b; 6c) is connected to the second main surface (22) of the mounting board (2). The ground terminal (7; 7a; 7b; 7c) is connected to the second main surface (22) of the mounting board (2). The ground terminal (7; 7a; 7b; 7c) has a third portion (71; 71a; 71b; 71c) and a fourth portion (72; 72a; 72b; 72c). The third portion (71; 71a; 71b; 71c) is a portion on the second main surface (22) side. The fourth portion (72; 72a; 72b; 72c) is the portion opposite the second main surface (22). The ground terminal (7; 7a; 7b; 7c) is disposed between the first signal terminal (5; 5a; 5b; 5c) and the second signal terminal (6; 6a; 6b; 6c). The first portion (51; 51a; 51b; 51c) of the first signal terminal (5; 5a; 5b; 5c) has a recess (53). The recess (53) faces the ground terminal (7; 7a; 7b; 7c) and is recessed further than the second portion (52; 52a; 52b; 52c) of the first signal terminal (5; 5a; 5b; 5c). The third portion (71; 71a; 71b; 71c) of the ground terminal (7; 7a; 7b; 7c) has a protrusion (73). The protrusion (73) faces the first signal terminal (5; 5a; 5b; 5c) and protrudes from the fourth portion (72; 72a; 72b; 72c) of the ground terminal (7; 7a; 7b; 7c).

[0158] According to the high-frequency module (1; 1a) of the second aspect, it is possible to ensure both isolation between signal terminals and connection reliability of the signal terminals.

[0159] A high-frequency module (1; 1a) according to a third aspect includes a mounting substrate (2), first signal terminals (5; 5a; 5b; 5c), second signal terminals (6; 6a; 6b; 6c), and ground terminals (7; 7a; 7b; 7c). The mounting substrate (2) has a first main surface (21) and a second main surface (22). The first main surface (21) and the second main surface (22) face each other. The first signal terminals (5; 5a; 5b; 5c) are connected to the second main surface (22) of the mounting substrate (2). The first signal terminals (5; 5a; 5b; 5c) have first portions (51; 51a; 51b; 51c) and second portions (52; 52a; 52b; 52c). The first portion (51; 51a; 51b; 51c) is a portion on the second main surface (22) side. The second portion (52; 52a; 52b; 52c) is a portion on the opposite side from the second main surface (22). The second signal terminal (6; 6a; 6b; 6c) is connected to the second main surface (22) of the mounting board (2). The ground terminal (7; 7a; 7b; 7c) is connected to the second main surface (22) of the mounting board (2). The ground terminal (7; 7a; 7b; 7c) has a third portion (71; 71a; 71b; 71c) and a fourth portion (72; 72a; 72b; 72c). The third portion (71; 71a; 71b; 71c) is a portion on the second main surface (22) side. The fourth portion (72; 72a; 72b; 72c) is the portion opposite the second main surface (22). The ground terminals (7; 7a; 7b; 7c) are arranged between the first signal terminals (5; 5a; 5b; 5c) and the second signal terminals (6; 6a; 6b; 6c). In the direction (first direction D21) in which the first signal terminals (5; 5a; 5b; 5c), the ground terminals (7; 7a; 7b; 7c), and the second signal terminals (6; 6a; 6b; 6c) are arranged, the width (W1) of the first portions (51; 51a; 51b; 51c) of the first signal terminals (5; 5a; 5b; 5c) is narrower than the width (W2) of the second portions (52; 52a; 52b; 52c) of the first signal terminals (5; 5a; 5b; 5c).In the direction (first direction D21) in which the first signal terminals (5; 5a; 5b; 5c), the ground terminals (7; 7a; 7b; 7c), and the second signal terminals (6; 6a; 6b; 6c) are arranged, the width (W3) of the third portions (71; 71a; 71b; 71c) of the ground terminals (7; 7a; 7b; 7c) is wider than the width (W2) of the second portions (52; 52a; 52b; 52c) of the first signal terminals (5; 5a; 5b; 5c).

[0160] According to the high-frequency module (1; 1a) of the third aspect, it is possible to ensure both the isolation between the signal terminals and the connection reliability of the signal terminals.

[0161] In the high-frequency module (1; 1a) according to the fourth aspect, in the first aspect, the second signal terminal (6; 6a; 6b; 6c) has a fifth portion (61; 61a; 61b; 61c) and a sixth portion (62; 62a; 62b; 62c). The fifth portion (61; 61a; 61b; 61c) is a portion on the second main surface (22) side of the mounting substrate (2). The sixth portion (62; 62a; 62b; 62c) is a portion on the opposite side from the second main surface (22). The cross-sectional area of ​​the fifth portion (61; 61a; 61b; 61c) of the second signal terminal (6; 6a; 6b; 6c) is smaller than the cross-sectional area of ​​the sixth portion (62; 62a; 62b; 62c) of the second signal terminal (6; 6a; 6b; 6c). The cross-sectional area of ​​the third portion (71; 71a; 71b; 71c) of the ground terminal (7; 7a; 7b; 7c) is larger than the cross-sectional area of ​​the sixth portion (62; 62a; 62b; 62c) of the second signal terminal (6; 6a; 6b; 6c).

[0162] According to the high-frequency module (1; 1a) of the fourth aspect, it is possible to further ensure both the isolation between the signal terminals and the connection reliability of the signal terminals.

[0163] In the high-frequency module (1; 1a) according to the fifth aspect, in the second aspect, the second signal terminal (6; 6a; 6b; 6c) has a fifth portion (61; 61a; 61b; 61c) and a sixth portion (62; 62a; 62b; 62c). The fifth portion (61; 61a; 61b; 61c) is a portion on the second main surface (22) side of the mounting substrate (2). The sixth portion (62; 62a; 62b; 62c) is a portion on the opposite side from the second main surface (22). The fifth portion (61; 61a; 61b; 61c) of the second signal terminal (6; 6a; 6b; 6c) has a recess (63). The recess (63) faces the ground terminal (7; 7a; 7b; 7c) and is recessed from the sixth portion (62; 62a; 62b; 62c) of the second signal terminal (6; 6a; 6b; 6c). The third portion (71; 71a; 71b; 71c) of the ground terminal (7; 7a; 7b; 7c) has a protrusion (75). The protrusion (75) faces the second signal terminal (6; 6a; 6b; 6c) and protrudes from the fourth portion (72; 72a; 72b; 72c) of the ground terminal (7; 7a; 7b; 7c).

[0164] According to the high-frequency module (1; 1a) of the fifth aspect, it is possible to further ensure both the isolation between the signal terminals and the connection reliability of the signal terminals.

[0165] In a high-frequency module (1; 1a) according to a sixth aspect, in the third aspect, the second signal terminal (6; 6a; 6b; 6c) has a fifth portion (61; 61a; 61b; 61c) and a sixth portion (62; 62a; 62b; 62c). The fifth portion (61; 61a; 61b; 61c) is a portion on the second main surface (22) side of the mounting substrate (2). The sixth portion (62; 62a; 62b; 62c) is a portion on the opposite side from the second main surface (22). In the direction (first direction D21) in which the first signal terminals (5; 5a; 5b; 5c), the ground terminals (7; 7a; 7b; 7c), and the second signal terminals (6; 6a; 6b; 6c) are aligned, the width (W5) of the fifth portions (61; 61a; 61b; 61c) of the second signal terminals (6; 6a; 6b; 6c) is narrower than the width (W6) of the sixth portions (62; 62a; 62b; 62c) of the second signal terminals (6; 6a; 6b; 6c). In the direction (first direction D21) in which the first signal terminals (5; 5a; 5b; 5c), the ground terminals (7; 7a; 7b; 7c), and the second signal terminals (6; 6a; 6b; 6c) are arranged, the width (W3) of the third portions (71; 71a; 71b; 71c) of the ground terminals (7; 7a; 7b; 7c) is wider than the width (W6) of the sixth portions (62; 62a; 62b; 62c) of the second signal terminals (6; 6a; 6b; 6c).

[0166] According to the high-frequency module (1; 1a) of the sixth aspect, it is possible to further ensure both the isolation between the signal terminals and the connection reliability of the signal terminals.

[0167] In the high-frequency module (1; 1a) according to the seventh aspect, in any one of the first to sixth aspects, the ground terminal (7; 7a; 7b; 7c) is adjacent to the first signal terminal (5; 5a; 5b; 5c).

[0168] According to the high-frequency module (1; 1a) of the seventh aspect, the isolation between the signal terminals can be further improved.

[0169] In the high-frequency module (1; 1a) according to the eighth aspect, in the seventh aspect, the ground terminal (7; 7a; 7b; 7c) is adjacent to the first signal terminal (5; 5a; 5b; 5c) and the second signal terminal (6; 6a; 6b; 6c).

[0170] According to the high-frequency module (1; 1a) of the eighth aspect, the isolation between the signal terminals can be further improved.

[0171] In the high-frequency module (1; 1a) according to the ninth aspect, in the eighth aspect, the ground terminals (7; 7a; 7b; 7c) are arranged at locations other than the four corners of the mounting substrate (2).

[0172] According to the high-frequency module (1; 1a) of the ninth aspect, the isolation between the signal terminals can be further improved compared to when the ground terminals are arranged at the four corners of the mounting board.

[0173] A high-frequency module (1) according to a tenth aspect is any one of the first to ninth aspects, further comprising an electronic component (31). The electronic component (31) is disposed on a second main surface (22) of the mounting substrate (2). At least one of the first signal terminal (5) and the second signal terminal (6) is adjacent to the electronic component (31).

[0174] According to the high-frequency module (1) of the tenth aspect, it is possible to improve isolation between at least one of the first signal and the second signal input to or output from the electronic component (31) and the remaining signal.

[0175] In the high-frequency module (1) according to the eleventh aspect, in the tenth aspect, both the first signal terminal (5) and the second signal terminal (6) are adjacent to the electronic component (31).

[0176] According to the high-frequency module (1) of the eleventh aspect, it is possible to improve isolation between the first signal and the second signal input to or output from the electronic component (31).

[0177] In a high-frequency module (1; 1a) according to a twelfth aspect, in any one of the first to ninth aspects, the first signal terminal (5; 5a) is a first antenna terminal (141) through which a received signal in a first communication band passes, and the second signal terminal (6; 6a) is a second antenna terminal (142) through which a received signal in a second communication band capable of simultaneous communication with the first communication band passes.

[0178] According to the high-frequency module (1; 1a) of the twelfth aspect, it is possible to improve isolation between the signal path of the first communication band and the signal path of the second communication band.

[0179] In a high-frequency module (1; 1a) according to a thirteenth aspect, in any one of the first to ninth aspects, the first signal terminal (5; 5c) is a first signal output terminal (144) through which a first received signal in a first communication band passes, and the second signal terminal (6; 6c) is a second signal output terminal (145) through which a second received signal in a second communication band passes.

[0180] According to the high-frequency module (1; 1a) of the thirteenth aspect, it is possible to improve the isolation between the first reception signal and the second reception signal.

[0181] In a high-frequency module (1; 1a) according to a fourteenth aspect, in any one of the first to ninth aspects, the first signal terminal (5; 5b) is a signal input terminal (143) connected to an external receiving filter (not shown) and an input terminal of the low-noise amplifier (13). The second signal terminal (6; 6b) is a signal output terminal (first signal output terminal 144) connected to an output terminal of the low-noise amplifier (13) and through which a received signal in the first communication band passes.

[0182] According to the high-frequency module (1; 1a) of the fourteenth aspect, it is possible to reduce the isolation between the input end side and the output end side of the low-noise amplifier (13).

[0183] A communication device (9) according to a fifteenth aspect includes the high-frequency module (1; 1a) according to any one of the first to fourteenth aspects and a signal processing circuit (92). The signal processing circuit (92) is connected to the high-frequency module (1; 1a).

[0184] According to the communication device (9) of the fifteenth aspect, in the high-frequency module (1; 1a), it is possible to ensure both isolation between the first signal terminal (5; 5a; 5b; 5c) and the second signal terminal (6; 6a; 6b; 6c) and connection reliability of the signal terminals (first signal terminal 5; 5a; 5b; 5c, second signal terminal 6; 6a; 6b; 6c).

[0185] REFERENCE SIGNS LIST 1, 1a High frequency module 11 Antenna switch 12 Filter 121 First filter 122 Second filter 13 Low noise amplifier 131 First low noise amplifier 132 Second low noise amplifier 14 Terminal 141 First antenna terminal 142 Second antenna terminal 143 Signal input terminal 144 First signal output terminal 145 Second signal output terminal 2 Mounting substrate 21 First main surface 22 Second main surface 23 Wiring conductor 231 First wiring conductor 232 Second wiring conductor 31 Electronic component 311 Main body 312 Electrode 313 First electrode 314 Second electrode 32, 33, 34 Electronic component 321, 331, 341 Main body 322, 332, 342 Bump 4 External connection terminal 5, 5a, 5b, 5c First signal terminal 51, 51a, 51b, 51c First portion 52, 52a, 52b, 52c Second portion 53 Concave portion 54 Convex portion 6, 6a, 6b, 6c Second signal terminal 61, 61a, 61b, 61c Fifth portion 62, 62a, 62b, 62c Sixth portion 63 Concave portion 64 Convex portion 7, 7a, 7b, 7c Ground terminal 71, 71a, 71b, 71c Third portion 72, 72a, 72b, 72c Fourth portion 73, 75 Convex portion 74, 76 Convex portion 8 Resin layer 81 First resin layer 82 Second resin layer 9 Communication device 91 Antenna 911 First antenna 912 Second antenna 92 ​​Signal processing circuit 93 RF signal processing circuit 94 Baseband signal processing circuit W1, W2, W3, W4, W5, W6 Width D1 Thickness direction D21 First direction D22 Second direction

Claims

1. A high-frequency module comprising: a mounting board having first and second main surfaces opposing each other; a first signal terminal connected to the second main surface of the mounting board and having a first portion on the second main surface side and a second portion on an opposite side to the second main surface; a second signal terminal connected to the second main surface of the mounting board; and a ground terminal connected to the second main surface of the mounting board and having a third portion on the second main surface side and a fourth portion on an opposite side to the second main surface, wherein the ground terminal is disposed between the first and second signal terminals, and a cross-sectional area of ​​the first portion of the first signal terminal is smaller than a cross-sectional area of ​​the second portion of the first signal terminal, and a cross-sectional area of ​​the third portion of the ground terminal is larger than a cross-sectional area of ​​the second portion of the first signal terminal.

2. A high-frequency module comprising: a mounting board having first and second main surfaces opposing each other; a first signal terminal connected to the second main surface of the mounting board and having a first portion on the second main surface side and a second portion on an opposite side to the second main surface; a second signal terminal connected to the second main surface of the mounting board; and a ground terminal connected to the second main surface of the mounting board and having a third portion on the second main surface side and a fourth portion on an opposite side to the second main surface, wherein the ground terminal is disposed between the first and second signal terminals, the first portion of the first signal terminal having a recess facing the ground terminal and recessed further than the second portion of the first signal terminal, and the third portion of the ground terminal having a protrusion facing the first signal terminal and protruding further than the fourth portion of the ground terminal.

3. A high-frequency module comprising: a mounting board having first and second main surfaces opposing each other; a first signal terminal connected to the second main surface of the mounting board and having a first portion on the second main surface side and a second portion on an opposite side to the second main surface; a second signal terminal connected to the second main surface of the mounting board; and a ground terminal connected to the second main surface of the mounting board and having a third portion on the second main surface side and a fourth portion on an opposite side to the second main surface, wherein the ground terminal is disposed between the first and second signal terminals, and in the direction in which the first signal terminal, the ground terminal, and the second signal terminal are arranged, the width of the first portion of the first signal terminal is narrower than the width of the second portion of the first signal terminal, and in the direction in which the first signal terminal, the ground terminal, and the second signal terminal are arranged, the width of the third portion of the ground terminal is wider than the width of the second portion of the first signal terminal.

4. The high-frequency module according to claim 1, wherein the second signal terminal has a fifth portion on the second main surface side of the mounting board and a sixth portion on the opposite side to the second main surface, the cross-sectional area of ​​the fifth portion of the second signal terminal is smaller than the cross-sectional area of ​​the sixth portion of the second signal terminal, and the cross-sectional area of ​​the third portion of the ground terminal is larger than the cross-sectional area of ​​the sixth portion of the second signal terminal.

5. The high-frequency module according to claim 2, wherein the second signal terminal has a fifth portion on the second main surface side of the mounting board and a sixth portion on the opposite side to the second main surface, the fifth portion of the second signal terminal has a recess that faces the ground terminal and is recessed further than the sixth portion of the second signal terminal, and the third portion of the ground terminal has a protrusion that faces the second signal terminal and protrudes further than the fourth portion of the ground terminal.

6. The high-frequency module according to claim 3, wherein the second signal terminal has a fifth portion on the second main surface side of the mounting board and a sixth portion on the opposite side to the second main surface, the width of the fifth portion of the second signal terminal is narrower than the width of the sixth portion of the second signal terminal in the direction in which the first signal terminal, the ground terminal, and the second signal terminal are arranged side by side, and the width of the third portion of the ground terminal is wider than the width of the sixth portion of the second signal terminal in the direction in which the first signal terminal, the ground terminal, and the second signal terminal are arranged side by side.

7. The high-frequency module according to any one of claims 1 to 6, wherein the ground terminal is adjacent to the first signal terminal.

8. The high-frequency module according to claim 7, wherein the ground terminal is adjacent to the first signal terminal and the second signal terminal.

9. The high-frequency module according to claim 8, wherein the ground terminals are arranged at locations other than the four corners of the mounting board.

10. The high-frequency module according to any one of claims 1 to 9, further comprising an electronic component disposed on the second main surface of the mounting board, and at least one of the first signal terminal and the second signal terminal being adjacent to the electronic component.

11. The high frequency module according to claim 10, wherein both the first signal terminal and the second signal terminal are adjacent to the electronic component.

12. A high-frequency module according to any one of claims 1 to 9, wherein the first signal terminal is a first antenna terminal through which a received signal in a first communication band passes, and the second signal terminal is a second antenna terminal through which a received signal in a second communication band capable of simultaneous communication with the first communication band passes.

13. A high-frequency module according to any one of claims 1 to 9, wherein the first signal terminal is a first signal output terminal through which a first received signal in a first communication band passes, and the second signal terminal is a second signal output terminal through which a second received signal in a second communication band passes.

14. A high-frequency module according to any one of claims 1 to 9, wherein the first signal terminal is a signal terminal connected to an input terminal of an external receiving filter and a low-noise amplifier, and the second signal terminal is a signal output terminal connected to an output terminal of the low-noise amplifier and through which a received signal of a first communication band passes.

15. A communication device comprising: a high-frequency module according to any one of claims 1 to 14; and a signal processing circuit connected to the high-frequency module.

Images