Electronic control device

Abstract

This electronic control device comprises: a substrate on which at least one connector and an electronic circuit component are installed; and a conductive housing that accommodates the substrate and has an opening through which the connector penetrates. The at least one connector has a connection section that is electrically continuous with the conductive housing. The conductive housing has an enclosure section that protrudes toward the connection section and surrounds the connection section, and a wall section that is continuously formed in a planar direction and protrudes toward the substrate. The wall section includes a first wall section that is provided in a location which, in the planar direction, is closer to the opening than the location of a signal pin, said signal pin connecting the connector and pattern wiring that is formed on the substrate, and a second wall section that separates the opening and an accommodation space in which the electronic circuit component is accommodated.

Description

Electronic control unit

[0001] The present invention relates to an electronic control device.

[0002] As an example of a structure for suppressing noise in an electronic control device, the following Patent Document 1 discloses a configuration in which, in an electronic control device, multiple walls protrude from the housing toward an inserted connector, thereby suppressing electromagnetic noise passing between the connector and the walls.

[0003] Japanese Patent Application Laid-Open No. 2021-100069

[0004] The technology described in Patent Document 1 does not provide direct electrical continuity between the connector and the housing, resulting in a problem of inability to achieve significant noise suppression across a wide bandwidth. Furthermore, for example, if a spring material is inserted to provide direct electrical continuity, vibration can cause sliding of the conductive portion, resulting in metal contamination (metal powder) that can infiltrate the board and cause short-circuit failures. Even if a board-mounted EMI gasket that prevents metal contamination is installed inside the connector, noise coupling around the connector cannot be prevented, resulting in noise passing through the cable's shield being superimposed on high-speed signals at the connector on the board, degrading signal quality. Furthermore, the inability to shorten the wiring length of the board wiring also results in increased loss on the board.

[0005] The electronic control device comprises a substrate on which at least one connector and electronic circuit components are mounted, and a conductive housing having an opening through which the connector passes and accommodating the substrate, wherein the at least one connector has a connection portion electrically connected to the conductive housing, and the conductive housing has an enclosure portion that protrudes toward the connection portion and surrounds the connection portion, and a wall portion that is formed continuously in a planar direction and protrudes toward the substrate, wherein the wall portion includes a first wall portion that is provided at a position in the planar direction closer to the opening than the position of a signal pin that connects the connector to a pattern wiring formed on the substrate, and a second wall portion that separates the opening from a storage space in which the electronic circuit components are accommodated.

[0006] It is possible to provide an electronic control device that achieves reduced noise superposition, vibration resistance, and improved signal quality.

[0007] 1 is a perspective view of an electronic control device according to an embodiment of the present invention; 2 is a plan view of an electronic control device according to an embodiment of the present invention; 3 is a cross-sectional view of an electronic control device according to an embodiment of the present invention; 4 is a perspective view illustrating the structure of a high-speed signal connector and a wall portion according to an embodiment of the present invention;

[0008] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The following description and drawings are examples for explaining the present invention, and some omissions and simplifications have been made as appropriate for clarity of explanation. The present invention can be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

[0009] In order to facilitate understanding of the invention, the position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc. Therefore, the present invention is not necessarily limited to the position, size, shape, range, etc. disclosed in the drawings.

[0010] (One Embodiment and Overall Configuration) (FIGS. 1 to 4) In the following description, in FIG. 3, FIG. 3(a) is a cross-sectional view taken along line A-A' in FIG. 2, FIG. 3(b) is a cross-sectional view taken along line B-B' in FIG. 2, and FIG. 3(c) is a cross-sectional view taken along line C-C' in FIG. 2. In the electronic control device 101, a metal housing base 103 and a metal housing cover 104 are fastened together with housing cover fixing screws 106 to form an internal space for accommodating electronic circuit components, connectors, etc. Note that while the metal housing base 103 and the metal housing cover 104 are conductive, they are not limited to metallic materials as long as they are conductive. The electronic control device 101 has multiple openings 101a. A multi-pin connector 203 and a high-speed signal connector 201 are inserted into the openings 101a, respectively.

[0011] The multi-pin connector 203 has a plurality of harnesses 204. The plurality of harnesses 204 are exposed to the outside of the electronic control device 101. The high-speed signal connector 201 also has a high-speed signal cable 202. The high-speed signal cable 202 is exposed to the outside of the electronic control device 101.

[0012] The electronic control device 101 houses a circuit board 102 inside a housing. The circuit board 102 has board fixing screw holes 105, and is fixed to the electronic control device 101 by fastening screws or the like into the screw holes 105. The circuit board 102 is mounted with at least one high-speed signal connector 201 and electronic circuit components such as a communication LSI 401. The communication LSI 401 and the high-speed signal connector 201 are electrically connected to each other via board signal wiring 402 of the circuit board 102.

[0013] In the present invention, the multi-pin connector 203 that does not have the connection portion 306 described below does not necessarily have to be inserted into the electronic control device 101, and it is sufficient that at least one high-speed signal connector 201 that has the connection portion 306 is inserted into the electronic control device 101.

[0014] The metal housing base 103 has an enclosure 301 having a wall structure that surrounds a connection portion 306 (described later) of the high-speed signal connector 201, a first wall 302 having a wall structure that connects the enclosures 301 together, and a second wall 303 having a wall structure that separates the multi-pin connector 203 from the circuit accommodating space 103a. Within the electronic control device 101, the enclosure 301, the first wall 302, and the second wall 303 are formed continuously in a planar direction toward the circuit board 102. The first wall 302 not only connects the enclosures 301 together in the planar direction, but also connects the enclosure 301 to the second wall 303 and the enclosure 301 to the outer periphery of the metal housing base 103.

[0015] 3(a), the multi-pin connector 203 passing through the opening 301a of the electronic control device 101 includes a cable-side connector 203a exposed to the outside of the electronic control device 101 and a board-side connector 203b housed inside the electronic control device 101. The board-side connector 203b is electrically connected to the circuit board 102, and is disposed in a connector housing space 103b (see FIG. 3(a)) of the housing space of the electronic control device 101 partitioned by the second wall portion 303.

[0016] In the region of the electronic control device 101 where the multi-pin connector 203 is inserted, board-mounted EMI gaskets 308 are disposed on both sides of the circuit board 102, between the second wall 303 and the circuit board 102 facing the second wall 303, and between the metal housing cover 104 at the same position as the second wall 303 and the circuit board 102. This ensures the shielding performance of the circuit accommodating space 103a.

[0017] There is a possibility that external noise may enter connector accommodating space 103b through opening 101a. Therefore, by separating connector accommodating space 103b and circuit accommodating space 103a within electronic control device 101 by second wall 303, electronic circuit components on circuit board 102 are protected from external noise. However, in this configuration, the provision of second wall 303 makes it difficult to further shorten the wiring length in the planar direction of circuit board 102, which may increase loss on the circuit board or deteriorate communication quality.

[0018] 3(b), in the region of the electronic control device 101 where the high-speed signal connector 201 is inserted, a configuration is adopted in which the periphery of the high-speed signal connector 201 is covered by an enclosure 301 and a wall 302 so that the high-speed signal connector 201 can be brought closer to the communication LSI 401, which is an electronic circuit component. By overlapping the positions of the high-speed signal connector 201 and the wall in the planar direction in this way, a part of the high-speed signal connector 201 can be brought closer to the circuit accommodating space 103a, and the wiring length of the circuit board 102 can be shortened, thereby reducing loss on the circuit board 102.

[0019] The configuration of the present invention will be described in detail below. The high-speed signal connector 201 includes a cable-side connector 201a that is exposed to the outside of the electronic control device 101, and a board-side connector 201b that is housed inside the electronic control device 101. The board-side connector 201b has connector signal pins 320 and connector GND pins 321 that protrude from the circuit board 102, and these are electrically connected to the circuit board 102, thereby electrically connecting the high-speed signal connector 201 and the circuit board 102.

[0020] The metal housing base 103 has an enclosure 301 formed so as to protrude toward the board-side connector 201b.

[0021] The board-side connector 201b has a connection portion 306 that electrically connects to the metal housing base 103. The connection 306 includes a connector shield portion 306a and a conductive portion 306b that has a spring structure for electrically connecting the connector shield portion 306a to the metal housing base 103. The enclosure portion 301 has a structure that covers the connector shield portion 306a and the conductive portion 306b that are the connection portion 306.

[0022] The first wall portion 302 is provided at a position closer to the opening 301a in the planar direction than the position of the connector signal pin 320 that connects the high-speed signal connector 201 and the board signal wiring 402 of the pattern wiring formed on the circuit board 102. Note that in Fig. 3B, the position where the first wall portion 302 is formed is the position where the EMI gasket 308 is disposed. As a result, the connector signal pin 320 is protected by the first wall portion 302 from external noise that enters through the opening 101a.

[0023] The conductive portion 306b abuts against a part of the metal housing base 103 surrounded by the enclosure 301. This allows the connector shield portion 306a to be electrically connected to the metal housing base 103 via the conductive portion 306b.

[0024] With the above-described configuration, the shield portion 306a of the high-speed signal connector 201 is directly conductive with the metal housing base 103, thereby achieving a significant noise suppression effect over a wide bandwidth. Furthermore, the enclosure 301 can prevent metal contamination caused by vibrations or the like from spreading into the circuit accommodating space 103a in the area where the conductive portion 306b and the metal housing base 103 abut, thereby improving vibration resistance. Furthermore, the enclosure 301, the first wall 302, and the second wall 303 separate the circuit accommodating space 103a from the opening 101a, thereby protecting the circuit accommodating space 103a and the portion where the connector signal pins 320 of the high-speed signal connector 201 are connected to the circuit board 102 from external noise that enters through the opening 101a, thereby improving signal quality.

[0025] (First Modification) (FIG. 5) An adhesive 309 is provided between the enclosure 301 and the board-side connector 201b of the high-speed signal connector 201 that faces the enclosure 301. The adhesive 309 is made of, for example, resin. This completely prevents metal contamination caused by vibrations and the like from entering the circuit accommodating space 103a in the area where the conductive portion 306b and the metal housing base 103 abut, further improving vibration resistance.

[0026] (Second Modification) (FIG. 6) A portion of metal housing base 103 surrounded by enclosure 301 is electrically connected to connector shield portion 306a of board-side connector 201b of high-speed signal connector 201, with EMI gasket 310 with adhesive tape sandwiched therebetween. EMI gasket 310 is conductive, and can therefore replace spring-shaped conductive portion 306b described above.

[0027] (Third Modification) (FIG. 7) A portion of the metal housing base 103 surrounded by the enclosure 301 is electrically connected to the connector shield portion 306a of the board-side connector 201b of the high-speed signal connector 201 with a conductive adhesive 311 sandwiched therebetween. Because the conductive adhesive 311 is conductive, it can replace the spring-shaped conductive portion 306b described above. Furthermore, in the event that the conductive filler contained in the conductive adhesive 311 falls off and causes metal contamination, the enclosure 301 is prevented from spreading into the circuit accommodating space 103a, thereby improving vibration resistance.

[0028] (Fourth Modification) (FIG. 8) The enclosure 301 may be formed of a metal part 312, which is a conductive member separate from the metal housing base 103. The metal part 312 is fixed to the metal housing base 103 by means of welding, screwing, or the like. In FIG. 8, the spring-shaped conductive part 306b is electrically connected to the metal housing base 103 via the conductive metal part 312. This makes it possible to accommodate changes to the connector 201 and the connection part 306 simply by changing the shape of the metal part 312.

[0029] (Fifth Modification) (FIG. 9) In the high-speed signal connector 201, the connector shield portion 306a and the conductive portion 306b do not have to be provided on the surface facing the metal housing base 103, but may be provided on at least one of the surfaces on the side of the surface facing the metal housing base 103. This allows the conductive portion 306b to come into contact with the first wall portion 302 and establish electrical continuity.

[0030] 9 and the other side of the high-speed signal connector 201, the connector shield portion 306a and the conductive portion 306b may be similarly provided, so that the conductive portion 306b comes into contact with the first wall portion 302. Alternatively, the connector shield portion 306a and the conductive portion 306b may be provided on both sides of the high-speed signal connector 201, and the connector shield portion 306a and the conductive portion 306b may also be provided on the surface facing the metal housing base 103 as described above. This ensures stable conduction of the high-speed signal connector 201.

[0031] (Sixth Modification) (FIG. 10) The high-speed signal connector 201 may have a dielectric sheet 313 between it and the connection portion 306. This configuration is used to support coaxial communication using a coaxial communication cable. The coaxial communication cable is connected to the circuit ground of the circuit board 102, but if there are constraints that prevent a direct connection between the ground of the circuit board 102 and the metal housing base 103 due to the potential of the housing, the dielectric sheet 313 can be disposed between them. By disposing the dielectric sheet 313, it is possible to achieve capacitive coupling and an effect similar to that of a high-frequency connection. Furthermore, to enhance this effect, the dielectric sheet 313 may be disposed so as to separate the dielectric sheet 313 from the ground portion of the circuit board 102 by as large an area as possible.

[0032] (Seventh Modification) (FIG. 11) When supporting coaxial communication, a dielectric sheet 313 may be provided between the part of the metal housing base 103 surrounded by the surrounding portion 301 and the connecting portion 306. This configuration also provides the same effect as the sixth modification.

[0033] 12(a) is a diagram showing the relationship between the distance between the enclosure 301 and the high-speed signal connector 201 and the distance between the pads 102a, and FIG. 12(b) is a diagram showing the relationship between the distance between the first wall 302 and the circuit board 102 and the distance between the pads 102a. As shown in FIGS. 12(a) and 12(b), a plurality of pads 102a are formed on the circuit board 102. Note that the pads 102a are those formed on the surface of the circuit board 102 on which the high-speed signal connector 201 and the enclosure 301 are provided. Of the pitches between the pads 102a on the circuit board 102, the smallest pitch is defined as distance a.

[0034] 12A, the distance b1 is the distance between the enclosure 301 and the connector 201 facing the enclosure 301. This distance b1 is shorter than the distance a, which makes it possible to prevent the intrusion of metal powder of a size that would cause a short circuit between the pads 102a into the circuit accommodating space 103a.

[0035] 12B, the distance b2 is the distance between the first wall 302 and the circuit board 102 facing the first wall 302. This distance b2 is shorter than the distance a, which similarly prevents the intrusion of metal powder of a size that would cause a short circuit between the pads 102a into the circuit accommodating space 103a.

[0036] According to the embodiment of the present invention described above, the following advantageous effects are achieved.

[0037] (1) The electronic control device 101 comprises a substrate 102 on which at least one connector 201 and electronic circuit components are mounted, and a conductive housing 103 (104) having an opening 101a through which the connector 201 passes and accommodating the substrate 102, wherein the at least one connector 201 has a connection portion 306 electrically connected to the conductive housing 103, and the conductive housing 103 has an enclosure portion 301 that protrudes toward the connection portion 306 and surrounds the connection portion 306, and a wall portion that is formed continuously in a planar direction and protrudes toward the substrate 102, wherein the wall portion includes a first wall portion 302 that is located in a position closer to the opening 101a in the planar direction than the position of a signal pin 320 that connects the connector 201 and the pattern wiring formed on the substrate 102, and a second wall portion 303 that separates the opening 101a from the accommodating space 103b in which the electronic circuit components are accommodated. By doing so, it is possible to provide an electronic control device 101 that reduces noise superimposition on high-speed signals, improves vibration resistance, and improves signal quality.

[0038] (2) The distance b1 between the enclosure 301 and the connector 201 facing the enclosure 301 is shorter than the smallest distance a among the distances between the pads 102a formed on the substrate 102. This prevents the intrusion of metal powder of a size that could cause a short circuit into the circuit accommodating space 103a.

[0039] (3) The distance b2 between the first wall portion 302 and the substrate 102 facing the first wall portion 302 is shorter than the smallest distance a among the distances between the multiple pads 102a formed on the substrate 102. This makes it possible to prevent the intrusion of metal powder of a size that would cause a short circuit in the circuit accommodating space 103a.

[0040] (4) An adhesive 309 is provided between the enclosure 301 and the connector 201. This prevents metal powder of a size smaller than that which would cause a short circuit from entering the circuit accommodating space 103a, further improving vibration resistance.

[0041] (5) A conductive gasket 310 is provided between the connector 201 and a part of the conductive housing 103 surrounded by the surrounding portion 301. This can replace the spring-shaped conductive portion 306b.

[0042] (6) A conductive adhesive 311 is provided between the connector 201 and a part of the conductive housing 103 surrounded by the surrounding portion 301. This can replace the spring-shaped conductive portion 306b.

[0043] (7) The enclosure 301 is formed of a conductive member 312 that is separate from the conductive housing 103. This configuration allows changes to the components of the high-speed signal connector 201 and the connection portion 306 to be accommodated simply by changing the shape of the separate conductive member 312.

[0044] (8) The connection portion 306 is provided on at least one side of the surface of the connector 201 that faces the conductive housing 103. This ensures stable electrical conduction of the connector 201.

[0045] (9) Connector 201 has dielectric sheet 313 between it and connecting portion 306. This allows electronic control device 101 to support coaxial communication.

[0046] (10) A dielectric sheet 313 is provided between the part of the conductive housing 103 surrounded by the surrounding portion 301 and the connecting portion 306. This allows the electronic control device 101 to support coaxial communication.

[0047] The present invention is not limited to the above-described embodiments, and various modifications and combinations of other configurations are possible without departing from the spirit of the present invention. Furthermore, the present invention is not limited to those having all of the configurations described in the above-described embodiments, and includes those in which some of the configurations are omitted.

[0048] REFERENCE SIGNS LIST 101 Electronic control device 101a Opening 102 Board 102a Board pad 103 Metal housing base 103a Circuit accommodating space 103b Connector accommodating space 104 Metal housing cover 105 Board fixing screw hole 106 Housing cover fixing screw 201 High speed signal connector 201a Cable side connector 201b Board side connector 202 High speed signal cable 203 Multi-pin connector 203a Cable side connector 203b Board side connector 204 Harness 301 Enclosure 302 First wall 303 Second wall 306 Connection part 306a Connector shield part 306b Conductive part 308 EMI gasket 309 Adhesive 310 EMI gasket with adhesive tape 311 Conductive adhesive 312 Metal part 313 Dielectric sheet 320 Connector signal pin 321 Connector GND pin 401 Communication LSI 402 Board signal wiring

Claims

1. An electronic control device comprising: a substrate on which at least one connector and electronic circuit components are mounted; and a conductive housing having an opening through which the connector passes and accommodating the substrate, wherein the at least one connector has a connection portion electrically connected to the conductive housing, the conductive housing having an enclosure portion that protrudes toward the connection portion and surrounds the connection portion, and a wall portion that is formed continuously in a planar direction and protrudes toward the substrate, the wall portion including: a first wall portion that is provided in a position in the planar direction closer to the opening than the position of a signal pin that connects the connector to a pattern wiring formed on the substrate, and a second wall portion that separates an accommodation space in which the electronic circuit components are accommodated from the opening.

2. An electronic control device according to claim 1, wherein the distance between the enclosure and the connector facing the enclosure is shorter than the smallest distance among the distances between multiple pads formed on the substrate.

3. An electronic control device according to claim 1, wherein the distance between the first wall portion and the substrate facing the first wall portion is shorter than the smallest distance among the distances between a plurality of pads formed on the substrate.

4. An electronic control device according to claim 1, wherein an adhesive is provided between the enclosure and the connector.

5. An electronic control device according to claim 1, wherein a conductive gasket is provided between the connector and a part of the conductive housing surrounded by the surrounding portion.

6. An electronic control device according to claim 1, wherein a conductive adhesive is provided between the connector and the part of the conductive housing surrounded by the surrounding portion.

7. An electronic control device according to claim 1, wherein the enclosure is formed of a conductive member separate from the conductive housing.

8. An electronic control device according to claim 1, wherein the connection portion is provided on at least one side of the surface of the connector that faces the conductive housing.

9. An electronic control device according to claim 1, wherein the connector has a dielectric sheet between it and the connecting portion.

10. An electronic control device according to claim 1, wherein a dielectric sheet is provided between the connection portion and the part of the conductive housing surrounded by the surrounding portion.

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