Adhesive structure and electronic device including same

Abstract

An electronic device may comprise: a housing; a cover disposed on the housing; a circuit board positioned in the housing and having contact elements disposed in one region thereof; a conductive structure coupled along the edge of the cover and including a part electrically connected to a first contact element among the contact elements; and a conductive adhesive sheet coupled along the edge of the housing, having a shape corresponding to the conductive structure, and including a part electrically connected to a second contact element among the contact elements. The conductive adhesive sheet may be formed to adhere to the conductive structure. The conductive structure and the conductive adhesive sheet may be formed to reduce adhesion between the conductive structure and the conductive adhesive sheet when a voltage is applied to the conductive structure and the conductive adhesive sheet.

Description

Adhesive structure and electronic device including same

[0001] The present disclosure relates to an adhesive structure and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices may refer to devices that perform specific functions according to the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and vehicle navigation systems.

[0004] For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, and even functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are also becoming smaller for convenient portability.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] According to one aspect of the present disclosure, an electronic device may include: a housing; a cover disposed over the housing; a circuit board positioned within the housing and having contact elements disposed in a region; a conductive structure coupled along an edge of the cover, the conductive structure including a portion electrically connected to a first contact element among the contact elements; and a conductive adhesive sheet coupled along an edge of the housing, the conductive structure having a shape corresponding to the conductive structure, and the conductive adhesive sheet including a portion electrically connected to a second contact element among the contact elements. The conductive adhesive sheet may be formed to adhere to the conductive structure. The conductive structure and the conductive adhesive sheet may be formed such that when a voltage is applied to the conductive structure and the conductive adhesive sheet, an adhesive force between the conductive structure and the conductive adhesive sheet decreases.

[0007] An electronic device according to one aspect of the present disclosure may include a housing; a cover disposed on the housing and having a conductive structure coupled along an edge thereof; a circuit board positioned within the housing; and a conductive adhesive sheet disposed along an edge of the housing, having a shape corresponding to the conductive structure, and configured to adhere to the conductive structure. A portion of the conductive structure and a portion of the conductive adhesive sheet may extend inwardly of the circuit board and be electrically connected to the circuit board. The conductive structure and the conductive adhesive sheet may be configured such that when a voltage is applied to the conductive structure and the conductive adhesive sheet, an adhesive force between the conductive structure and the conductive adhesive sheet decreases.

[0008] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0009] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0011] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 4 is an exploded perspective view of an electronic device viewed from the front according to one embodiment of the present disclosure.

[0014] FIG. 5 is an exploded perspective view of an electronic device viewed from the rear, according to one embodiment of the present disclosure.

[0015] FIG. 6 is a drawing showing a power-on state of an electronic device and a protective cover separated from a housing in relation thereto, according to one embodiment of the present disclosure.

[0016] FIG. 7 is an exploded perspective view of an adhesive structure including a housing and a protective cover of an electronic device and components related thereto, according to one embodiment of the present disclosure.

[0017] FIG. 8 is a perspective view showing an area inside an electronic device with a protective cover excluded, according to one embodiment of the present disclosure.

[0018] FIG. 9 is a cross-sectional view showing a laminated state of an adhesive structure in one area of ​​an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 10 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0020] FIG. 11 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0021] FIG. 12 is a drawing showing a state in which voltage is applied to a cross-sectional view of the electronic device of FIG. 10 according to one embodiment of the present disclosure.

[0022] FIG. 13 is a drawing showing a state in which voltage is applied to a cross-sectional view of the electronic device of FIG. 11 according to one embodiment of the present disclosure.

[0023] FIG. 14 is a diagram illustrating separation of electric peel-related charges after voltage is applied to an adhesive structure according to one embodiment of the present disclosure.

[0024] FIG. 15 is a drawing showing a configuration related to electric peeling of FIG. 14 according to one embodiment of the present disclosure.

[0025] FIG. 16 is a flowchart illustrating a separation process between a housing and a protective cover of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 17 is a flowchart illustrating a peeling process between a housing and a protective cover of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 18 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0028] FIG. 19 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0029] FIG. 20 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0030] FIG. 21 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0031] FIG. 22 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0032] FIG. 23 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0033] FIG. 24 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0034] The accompanying drawings are referenced in the following description, and specific examples of implementations are illustrated within the drawings. Furthermore, other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0035] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0036] The embodiments and terminology used in this document are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or alternatives of the embodiments. In connection with the description of the drawings, similar reference numerals may be used to refer to similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise.

[0037] In this document, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0038] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0039] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0040] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0041] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0042] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0043] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0044] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0045] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0046] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0047] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0048] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0049] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0050] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0051] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0052] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0053] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0054] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0055] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0056] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0057] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0058] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0059] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0060] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0061] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0062] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0063] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment of the present disclosure.

[0064] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0065] The components of the electronic device (101) of FIGS. 2 and 3 may be partially or completely identical to the components of the electronic device (101) of FIG. 1.

[0066] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or rear side) (110B), and a side surface (110C) (or outer side) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0067] According to one embodiment, the first side (110A) may be formed by a front plate (101a) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (110B) may be formed by a substantially opaque rear plate (111). The rear plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (101a) and the rear plate (111) and includes a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0068] In one embodiment, the front plate (101a) may include a seamlessly extending region(s) that is curved toward the back plate (111) at least along a portion of an edge. For example, the front plate (101a) (or the back plate (111)) may include only one of the curved and extending regions toward the back plate (111) (or the front plate (101a)) at one edge of the first side (110A). In one embodiment, the front plate (101a) or the back plate (111) may be substantially flat, in which case the front plate (101a) or the back plate (111) may not include a curved / extended region that is curved and extends. If the front plate (101a) or the back plate (111) includes a curved / extended region, the thickness of the electronic device (101) in the portion that includes the curved / extended region may be smaller than the thickness of the other portions.

[0069] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (101b), a second sensor module, a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (101c), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include another component.

[0070] The display (115) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (101a)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (101a) forming the first surface (110A) or through a portion of the side surface (110C). In one embodiment, the edge of the display (115) may be formed to be substantially the same as the adjacent outer shape of the front plate (101a). In one embodiment (not shown), in order to expand the area where the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (101a) may be formed to be substantially the same.

[0071] According to one embodiment, a recess or opening is formed in a part of a screen display area of ​​the display (115), and the electronic device (101) may include at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (101b)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) aligned with the recess or opening. According to one embodiment, at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (101b)), a camera module (e.g., a first camera device (105)), a fingerprint sensor, and a light-emitting element (106) may be arranged on a rear side of the screen display area of ​​the display (115). According to one embodiment, the display (115) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0072] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0073] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (101b) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (e.g., a fingerprint sensor) may be disposed on the first surface (110A) (e.g., a display (115)) of the housing (110), as well as the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0074] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (IR camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit IR, and IR emitted by the flash (113) and reflected by a subject may be received via the third sensor module (119). The electronic device (101) or the processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) can detect depth information of the subject based on the time point at which IR is received from the third sensor module (119).

[0075] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0076] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0077] According to one embodiment, the connector hole (e.g., the first connector hole (101c), the second connector hole (109)) may include a first connector hole (101c) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0078] FIG. 4 is an exploded perspective view of an electronic device viewed from the front according to one embodiment of the present disclosure.

[0079] FIG. 5 is an exploded perspective view of an electronic device viewed from the rear, according to one embodiment of the present disclosure.

[0080] The components of the electronic device (101) of FIGS. 4 and 5 may be partially or completely identical to the components of the electronic device (101) of FIGS. 1 to 3.

[0081] Referring to FIGS. 4 and 5, the electronic device (101) (e.g., the electronic device (101) of FIG. 1, FIG. 2 or FIG. 3) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (101a) of FIG. 2), a display (230) (e.g., the display (115) of FIGS. 2 and 3), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207) and a rear plate (280) (e.g., the rear plate (111) of FIG. 3).

[0082] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0083] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one side (e.g., a surface) and a printed circuit board (240) coupled to the other side (e.g., a surface). A processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1) may be mounted on the printed circuit board (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0084] In one embodiment, the first support member (211) and the side structure (210) may be combined to be referred to as a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear (or front side or rear side)' of the housing (201) may mean the first side (or front side) (110A) of FIG. 2 or the second side (or rear side) (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0085] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear side (e.g., surface) of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear side (e.g., surface) of the display panel. For example, unless otherwise distinguished in the detailed description below, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner side (e.g., the surface) of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0086] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0087] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0088] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board. In this case, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board or the lower support member (260b) may be arranged corresponding to an audio module (e.g., a microphone hole (103) or a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114))) or a connector hole (e.g., a first connector hole (101c), a second connector hole (109)) of FIG. 2.

[0089] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0090] According to one embodiment, the electronic device (101) may further include a separate sub-circuit board (290) spaced apart from the printed circuit board (240) within the first support member (211). The sub-circuit board (290) may be electrically connected to the printed circuit board (240) via a connecting member such as a connecting flexible board or cable. The sub-circuit board (290) may be electrically connected to electrical components disposed in an end region of the electronic device (101), such as a battery (289) or a speaker, a USB connector, an antenna connector, and / or a SIM socket, to transmit (e.g., transmit) signals and power.

[0091] The antenna may include a conductive pattern implemented on one side (e.g., one surface) of the second support member (260), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on one side (e.g., one surface) of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a portion or a combination of the side structure (210) and / or the first support member (211).

[0092] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0093] FIG. 6 is a drawing showing a power-on state of an electronic device and a protective cover separated from a housing in relation thereto, according to one embodiment of the present disclosure.

[0094] FIG. 7 is an exploded perspective view of an adhesive structure including a housing and a protective cover of an electronic device and components related thereto, according to one embodiment of the present disclosure.

[0095] Referring to FIGS. 6 and 7, the electronic device (101) may include at least one of a housing (310), a protective cover (320), a circuit board (240), a battery (250), a conductive structure (330), and / or a conductive adhesive sheet (340). The housing (310), the protective cover (320), the conductive structure (330), and the conductive adhesive sheet (340) of the electronic device (101) may provide an adhesive structure.

[0096] The configuration of the electronic device (101) of FIGS. 6 and 7 may be partially or entirely identical to the configuration of the electronic device (101) of FIGS. 1 to 5. The configuration of the housing (310) and the protective cover (320) of FIGS. 6 and 7 may be partially or entirely identical to the configuration of the housing (201), the front plate (220), and the rear plates (220, 280) of FIGS. 4 and 5.

[0097] The embodiments of FIGS. 6 and 7 can be optionally combined with the embodiments of FIGS. 1 to 5 and the embodiments of FIGS. 8 to 24.

[0098] According to one embodiment, the housing (310) may form the overall appearance of the electronic device (101). The housing (310) may be the housing (110) disclosed in FIGS. 2 and 3, and / or the housing (201) disclosed in FIGS. 4 and 5. According to one embodiment, the protective cover (or cover) (320) may be the front plate (101a) or the rear plate (111) disclosed in FIGS. 2 and 3. Hereinafter, the protective cover (320) will be described based on the rear plate.

[0099] According to one embodiment, with respect to the electronic device (101), the direction in which the display (e.g., the display (230) of FIGS. 4 and 5) faces may be defined as the front direction or the first direction (e.g., the +Z-axis direction), and the direction in which the protective cover (320) faces may be defined as the rear direction or the second direction (e.g., the -Z-axis direction).

[0100] According to one embodiment, the housing (310) may include a support plate (311) (e.g., a first support member (211) (e.g., a bracket) of FIGS. 4 and 5) providing a space in which electronic components are arranged, and side walls (312) (e.g., the side structure (210) of FIGS. 4 and 5) arranged in a front direction (e.g., +Z-axis direction) and / or a rear direction (e.g., -Z-axis direction) along an edge of the support plate (311). The space in which the support plate (301) is arranged may include a front space open in the front direction (e.g., +Z-axis direction), and a rear space (P1) open in the rear direction (e.g., -Z-axis direction). For example, an electronic component such as a display (230) may be arranged in the front space, while an electronic component such as a battery (250), a circuit board (240), a camera, and a sensor may be arranged in the rear space (P1).

[0101] According to one embodiment, the protective cover (320) may form a structure for protecting electronic components housed inside the electronic device (101). For example, the protective cover (320) may be at least one of glass, plastic (e.g., polycarbonate, acrylic), polyurethane (e.g., thermoplastic polyurethane (TPU), polyethylene terephthalate (PET)), or ceramic.

[0102] According to one embodiment, the circuit board (240) may be positioned in the housing (310). For example, the circuit board (240) may be positioned in the rear space (P1) of the support plate (311). According to one embodiment, the circuit board (240) may be equipped with at least one of a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1).

[0103] According to one embodiment, the circuit board (240) may be equipped with a contact element (260) for electrically connecting to the conductive structure (330) and / or the conductive adhesive sheet (340). The contact element (260) may be disposed in an area facing the rear side (e.g., the back) of the circuit board (240) (e.g., facing the - Z-axis direction). The contact element (260) may include a first contact element (261) electrically connectable to the conductive structure (330) and a second contact element (262) electrically connectable to the conductive adhesive sheet (340). The first contact element (261) and / or the second contact element (262) may be disposed along one edge of the circuit board (240). The first contact element (261) and the second contact element (262) may be arranged in parallel, and at least a portion thereof may protrude from the circuit board (240) in a rearward direction (e.g., in the Z-axis direction).

[0104] According to one embodiment, the contact element (260) includes a conductive material and can provide an electrical connection between the conductive structure (330) and / or the conductive adhesive sheet (340) connected to the contact element (260) and the circuit board (240). According to one embodiment, the contact element (260) can be named as at least one of a grounding element, a conductive element, a current-carrying element, a C-clip, a pogo-pin, a conductive sponge, or a connector, and the expression of the element can be replaced with at least one of a member, a part, a portion, a clip, or a component.

[0105] According to one embodiment, an electrical connection from the circuit board (240) to the protective cover (320) may be provided via at least one conductive member disposed between the protective cover (320) and the conductive adhesive sheet (340). For example, the at least one conductive member may serve as a bridge connecting a contact element (260) disposed on the circuit board (240) and the protective cover (320). The at least one conductive member may be at least one of an antenna rear (e.g., the second support member (260) of FIGS. 4 and 5) and / or a conductive sponge.

[0106] According to one embodiment, the circuit board (240) may include a main circuit board (241) (e.g., a first circuit board) and a sub-circuit board (242) (e.g., a second circuit board). The main circuit board (241) and the sub-circuit board (242) may be disposed with a battery (250) therebetween. For example, the sub-circuit board (242) may be electrically connected to the main circuit board (241) via a connecting member such as a connecting flexible board or a cable. The sub-circuit board (290) may be electrically connected to electrical components disposed at an end area of ​​the electronic device (101), such as the battery (250) or a speaker, a USB connector, an antenna connector, and / or a SIM socket, to transmit (e.g., transmit) signals and power.

[0107] According to one embodiment, the battery (250) may be located within the housing (310). For example, the battery (250) may be placed in the rear space (P1) of the support plate (311). According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and a power management integrated circuit (PMIC) as an integrated circuit for power management may be located on one side of the battery (250).

[0108] According to one embodiment, the adhesive structure of the electronic device (101) may be designed to separate the protective cover (320) from the housing (310) with a small force by utilizing the electrical delamination characteristics (or, electrically induced delamination characteristics, electrical release characteristics) of the conductive structure (330) and / or the conductive adhesive sheet (340). The electrical release characteristics may be achieved through a process in which a voltage is applied to the circuit board (240) and the charge of the conductive adhesive sheet (340) is separated. According to one embodiment, the application of the voltage may be configured to occur through an external power source or a circuit board (240) electrically connected to an external power source. For example, the application of the voltage may occur through the circuit board (240) electrically connected to the external power source via an external power cable (e.g., a terminal adapter (TA)). For example, voltage application may occur through a circuit board (240) electrically connected to a battery (250) and / or a PMIC. For example, the display (230) of the electronic device (101) may indicate a disassembly repair mode of the protective cover (320) or may indicate whether voltage is applied through a charging terminal or a battery to inform the user.

[0109] According to one embodiment, the conductive structure (330) is disposed along an edge of the protective cover (320) and / or the housing (310) and may be electrically connected to a first contact element (261) among the contact elements (260) disposed on the circuit board (240).

[0110] In one embodiment, the conductive structure (330) may be disposed between the protective cover (320) and the housing (310). In one embodiment, the conductive structure (330) may be disposed between the protective cover (320) and the conductive adhesive sheet (340). The conductive structure (330) may be provided in a shape corresponding to the conductive adhesive sheet (340). For example, the conductive structure (330) may be in the shape of a closed loop disposed along the edge of the protective cover (320).

[0111] In one embodiment, the conductive structure (330) may be coupled along an edge of the protective cover (320). For example, the conductive structure (330) may be formed by depositing, printing, transferring, or laminating a conductive material on an area of ​​the protective cover (320). For example, the conductive structure (330) may be coupled to an area of ​​the protective cover (320) using an adhesive material, such as an adhesive film.

[0112] According to one embodiment, the conductive structure (330) may be named at least one of a current-carrying structure or an electrical structure, and the electrical structure expression may be replaced with at least one of a member, a part, a portion, or a component of an element.

[0113] According to one embodiment, the conductive structure (330) may include a first connecting portion (330a) arranged along an edge of the protective cover (320), and a first extending portion (330b) extending from one side of the first connecting portion (330a) to the first contact element (261). The first extending portion (330b) is a portion for electrically connecting with the first contact element (261) and may extend to contact the first contact element (261) disposed on the circuit board (240).

[0114] According to one embodiment, the conductive adhesive sheet (340) is disposed along the edge of the protective cover (320) and / or the housing (310) and can be electrically connected to a second contact element (262) among the contact elements (260) disposed on the circuit board (240).

[0115] According to one embodiment, the conductive adhesive sheet (340) may be disposed between the housing (310) and the protective cover (320). According to one embodiment, the conductive adhesive sheet (340) may be disposed between the housing (310) and the conductive structure (330). The conductive adhesive sheet (340) may be provided in a shape corresponding to the conductive structure (330). For example, the conductive adhesive sheet (340) may be in a closed loop shape disposed along the edge of the housing (310).

[0116] In one embodiment, the conductive adhesive sheet (340) may be coupled along an edge of the housing (310). For example, the conductive adhesive sheet (340) may include a second connecting portion (340a) arranged along a side wall (312) of the housing (310) to overlap the side wall (312), and a second extending portion (340b) extending inwardly from the second connecting portion (340a) toward the circuit board (240). For example, the conductive adhesive sheet (340) is a double-sided adhesive material, and may be arranged along the side wall (312) of the housing (310) to couple (e.g., connect or adhere) the protective cover (320) coupled with the housing (310) and the conductive structure (330). The conductive adhesive sheet (340) may have a structure in which a plurality of layers are laminated, such as a material layer having electrically peelable properties and a material layer having adhesive properties.

[0117] According to one embodiment, the conductive adhesive sheet (340) may be named at least one of an electrical release sheet / electrical peel-off sheet, a current-carrying adhesive sheet, or an electrical adhesive sheet. The expression adhesive may be replaced with at least one of sticky, glue, paste member, or waterproof. The expression sheet may be replaced with at least one of tape, film, member, part, portion, or component of an element.

[0118] According to one embodiment, the conductive adhesive sheet (340) may include a second connection portion (340a) adhered to the side wall (312) of the housing (310), and a second extension portion (340b) extending from the second connection portion (340a) toward the inside of the circuit board (240). The second extension portion (340b) may be a portion (e.g., a section or a specific area) for electrically connecting to the second contact element (262) and may extend to contact the second contact element (262) disposed on the circuit board (240).

[0119] The conductive structure (330) and the conductive adhesive sheet (340) disclosed in FIGS. 6 and 7 are disclosed as structures arranged along all edges of the protective cover (320) and / or the housing (700), but are not limited thereto and may be designed in various shapes, such as an open loop with one side opened.

[0120] FIG. 8 is a perspective view showing an area inside an electronic device with a protective cover excluded, according to one embodiment of the present disclosure.

[0121] FIG. 9 is a cross-sectional view showing a laminated state of an adhesive structure in one area of ​​an electronic device according to one embodiment of the present disclosure.

[0122] FIG. 10 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0123] FIG. 11 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0124] The components of the electronic device (101) of FIGS. 8 to 11 may be partially or entirely identical to the components of the electronic device (101) of FIGS. 1 to 7.

[0125] The embodiments of FIGS. 8 to 11 can be optionally combined with the embodiments of FIGS. 1 to 7 and the embodiments of FIGS. 12 to 24.

[0126] According to one embodiment, the electronic device (101) may include at least one of a housing (310), a protective cover (320), a circuit board (240), a battery (250), a conductive structure (330), and / or a conductive adhesive sheet (340).

[0127] According to one embodiment, the adhesive structure can bond the housing (310) and the protective cover (320) with a strong adhesive force. According to one embodiment, when voltage is applied to the electronic device (101) for disassembly of the electronic device (101) (e.g., protective cover detachment mode), the adhesive force of the adhesive structure is weakened, so that the protective cover (320) can be easily detached from the housing (310).

[0128] According to one embodiment, the adhesive structure may place a conductive adhesive sheet (340) containing an adhesive component between the housing (310) and the protective cover (320) to strengthen the adhesive force. The adhesive structure may laminate a conductive adhesive sheet (340) containing a separable charge for electric peeling characteristics and a conductive structure (330) forming a passage for the charge to move, to weaken the adhesive force.

[0129] According to one embodiment, the side wall (312) of the housing (310) may include a first side wall portion (312a) forming an outer side (e.g., an outer surface) of the electronic device (101) and a second side wall portion (312b) extending inwardly from the first side wall portion (312a) of the electronic device (101). The second side wall portion (312b) is formed to surround an edge of a support plate (311) of the housing (310), and a rear side (e.g., a side) (e.g., a side facing the -Z axis) may provide a side (e.g., a side) on which a conductive adhesive sheet (340) adheres to the housing (310). The first side wall portion (312a) and the second side wall portion (312b) may have a stepped (e.g., a step) shape.

[0130] According to one embodiment, the adhesive structure may be a structure in which a conductive adhesive sheet (340), a conductive structure (330), and a protective cover (320) are sequentially laminated on a second side wall portion (312b) of the housing (310). The first side wall portion (312a) of the housing (310) may be formed to surround the outer side (e.g., surface) of the conductive adhesive sheet (340), the conductive structure (330), and the protective cover (320).

[0131] According to one embodiment, the conductive adhesive sheet (340) may include an adhesive substrate layer (341), a conductive layer (342), and an electrolyte layer (343). The adhesive substrate layer (341), the conductive layer (342), and the electrolyte layer (343) may have a general (e.g., overall) closed loop shape corresponding to each other. The adhesive substrate layer (341), the conductive layer (342), and / or the electrolyte layer (343) may each include an extended portion (e.g., a first extended portion (330b)) that protrudes toward the circuit board (240) (e.g., toward the X-axis direction) to be connected to the contact element (260).

[0132] According to one embodiment, the adhesive substrate layer (341) of the conductive adhesive sheet (340) may be disposed between the housing (310) (e.g., the second side wall portion (312b)) and the conductive layer (342). The adhesive substrate layer (341) may provide a support layer function for supporting the conductive adhesive sheet (340) as a whole (e.g., generally). The adhesive substrate layer (341) may provide an adhesive (e.g., attachment, bonding) function, for example, a pressure-sensitive adhesive function, for adhering the conductive adhesive sheet (340) to the housing (310) and the conductive layer (342). For example, the adhesive substrate layer (341) may be a double-sided adhesive layer, one side (e.g., a side) of which may be adhered to the second side wall portion (312b) of the housing (310), and the other side (e.g., a side) of which may remain adhered to the conductive layer (342). The adhesive substrate layer (341) is constantly combined with the housing (310) and the conductive layer (342), so that even if voltage is applied to the conductive adhesive sheet (340) to separate the housing (310) and the protective cover (320), the adhesive substrate layer (341) can continuously maintain the combined state of the housing (310) and the conductive layer (342). The adhesive substrate layer (341) may have a large thickness compared to other layers of the conductive adhesive sheet (340) (e.g., the conductive layer (342) and / or the electrolyte layer (343)).

[0133] According to one embodiment, the conductive layer (342) of the conductive adhesive sheet (340) may be disposed between the adhesive substrate layer (341) and the electrolyte layer (343). The conductive layer (342) is a layer for the movement of charges constituting the electrolyte layer (343) and may provide a current-conducting function like a metal. For example, if voltage is applied to the conductive adhesive sheet (340), the conductive layer (342) assumes either a (-) pole or a (+) pole, and some of the charges of the electrolyte layer (343) may move toward the conductive layer (342). The conductive layer (342) may remain adhered to the adhesive substrate layer (341) due to the adhesive properties of the adhesive substrate layer (341). The conductive layer (342) may have a small thickness compared to other layers of the conductive adhesive sheet (340) (e.g., the adhesive substrate layer (341) and / or the electrolyte layer (343)).

[0134] According to one embodiment, the electrolyte layer (343) of the conductive adhesive sheet (340) may be disposed between the conductive layer (342) and the protective cover (320). According to one embodiment, the electrolyte layer (343) of the conductive adhesive sheet (340) may be disposed between the conductive layer (342) and the conductive structure (330).

[0135] In one embodiment, the electrolyte layer (343) may include an electrolyte to provide electrical peeling properties, and an adhesive function for bonding the conductive adhesive sheet (340) to the conductive layer (342) and the conductive structure (330) (or the protective cover (320)), for example, the function of a pressure-sensitive adhesive.

[0136] According to one embodiment, the electrolyte layer (343) includes a material that is dissolved in a solvent and dissociates into ions to have electrical conductivity, and may be in a state in which (+) charges and (-) charges are mixed and distributed. The electrolyte layer (343) may be in a solid electrolyte or gel electrolyte state. If voltage is applied to the conductive adhesive sheet (340) to separate the housing (310) and the protective cover (320), the electrolyte layer (343) may separate the (+) charges and (-) charges, thereby allowing the conductive adhesive sheet (340) and the conductive structure (330) to be easily separated.

[0137] According to one embodiment, the electrolyte layer (343) is a double-sided adhesive layer, one side of which is adhered to the conductive layer (342), and the other side of which is maintained in a state of being adhered to the conductive structure (330). The electrolyte layer (343) can provide a property (e.g., electrical peeling property) in which the adhesive strength changes by applying a voltage.

[0138] According to one embodiment, the conductive structure (330) may be disposed between the protective cover (320) and the electrolyte layer (343) of the conductive adhesive sheet (340). The conductive structure (330) may provide a conductive function, such as a metal, as a layer for the movement of charges constituting the electrolyte layer (343). For example, if voltage is applied to the conductive structure (330), the conductive structure (330) may assume either a (-) pole or a (+) pole, and some of the charges of the electrolyte layer (343) may move toward the conductive structure (330). The conductive structure (330) may remain strongly bonded to the protective cover (320), and thus, may provide one side (e.g., a surface) that is separated from the conductive adhesive sheet (340) when the housing (310) and the protective cover (320) are separated.

[0139] According to one embodiment, the conductive adhesive sheet (340) and the conductive structure (330) may each include portions extending toward the circuit board (240) for voltage application. The conductive layer (432) of the conductive structure (330) and the conductive adhesive sheet (340) may have polarity when voltage is applied. For example, the conductive structure (330) may include a first connecting portion (330a) arranged along an edge of the protective cover (320), and a first extending portion (330b) extending from one side of the first connecting portion (330a) to the first contact element (261). For example, the conductive adhesive sheet (340) may include a second connecting portion (340a) arranged along an edge of a side wall of the housing (310), and a second extending portion (340b) extending from one side of the second connecting portion (340a) to the second contact element (262).

[0140] According to one embodiment, the second extension portion (340b) of the conductive adhesive sheet (340) and the first extension portion (330b) of the conductive structure (330) have corresponding shapes and can be arranged in parallel. According to one embodiment, since the conductive structure (330) is a structure laminated on the conductive adhesive sheet (340), the distance between the first extension portion (330b) and the circuit board (240) can be greater than the distance between the second extension portion (340b) and the circuit board (240). However, the shapes of the first extension portion (330b) and the second extension portion (340b) and / or the distance between the circuit board (240) can be variously designed and changed depending on the arrangement and shape of the first contact element (261) and the second contact element (262). According to one embodiment, the second extension portion (340b) of the conductive adhesive sheet (340) and the first extension portion (330b) of the conductive structure (330) may be arranged so as not to overlap when viewed from the protective cover (320) (e.g., in the + Z-axis direction).

[0141] According to one embodiment, one end of the second extension portion (340b) of the conductive adhesive sheet (340) may be arranged to face the second contact element (262) arranged on the circuit board (240). When voltage is applied through the circuit board (240), the conductive layer (342) of the conductive adhesive sheet (340) and the second contact element (262) may be formed in a state where the conductive layer (342) and the second contact element (262) are substantially in contact, for electrical connection between them.

[0142] According to one embodiment, in the second extension portion (340b) of the conductive adhesive sheet (340), the length of the conductive layer (342) and the adhesive substrate layer (341) may be longer than the length of the electrolyte layer (343). The conductive adhesive sheet (340) may be laminated with the conductive layer (342) and the electrolyte layer (343) in the -Z-axis direction based on the adhesive substrate layer (341). In order for the conductive layer (342) disposed between the adhesive substrate layer (341) and the electrolyte layer (343) to contact the second contact element (262), a portion thereof needs to be exposed to the outside of the portion covered by the electrolyte layer (343), and the length of the conductive layer (342) is designed to be longer than the length of the electrolyte layer (343), so that a portion thereof can contact the second contact element (262).

[0143] According to one embodiment, in the second extended portion (340b) of the conductive adhesive sheet (340), the length of the conductive layer (342) may be longer than the lengths of the adhesive substrate layer (341) and the electrolyte layer (343). In the second extended portion (340b) of the conductive adhesive sheet (340), the electrolyte layer (343) is adhered (e.g., attached or bonded) to the protective cover (320) via the conductive structure (330), and the conductive layer (342) and the adhesive substrate layer (341) that are extended longer than the electrolyte layer (343) may form a bent section. In the above-mentioned bent section, the adhesive substrate layer (341) is placed facing (e.g., facing or in an opposite direction) and adhered (e.g., attached or bonded) to another layer after bending, and a portion of the conductive layer (342) formed to surround the adhesive substrate layer (341) is exposed to the outside and can come into contact with the second contact element (262).

[0144] According to one embodiment, when a voltage is applied through the circuit board (240) to cause the second contact element (262) to have a positive (+) polarity, the conductive layer (342) electrically connected to the second contact element (262) may form a layer having a positive (+) polarity.

[0145] According to one embodiment, one end of the first extension portion (330b) of the conductive structure (330) may be arranged to face the first contact element (261) arranged on the circuit board (240). When voltage is applied through the circuit board (240), the conductive structure (330) and the first contact element (261) may be formed in a state where they are substantially in contact, for electrical connection between the conductive structure (330) and the first contact element (261).

[0146] According to one embodiment, the first extension portion (330b) of the conductive structure (330) extends inwardly of the circuit board (240) with one side (e.g., a surface) attached to the protective cover (320), and the other side (e.g., a surface) is exposed to the outside and can contact (e.g., be attached to) the first contact element (261).

[0147] According to one embodiment, when a voltage is applied through the circuit board (240) to the first contact element (261) so that it has a negative (-) polarity, the conductive structure (330) electrically connected to the first contact element (261) can form a layer having a negative (-) polarity.

[0148] FIG. 12 is a drawing showing a state in which voltage is applied to a cross-sectional view of the electronic device of FIG. 10 according to one embodiment of the present disclosure.

[0149] FIG. 13 is a drawing showing a state in which voltage is applied to a cross-sectional view of the electronic device of FIG. 11 according to one embodiment of the present disclosure.

[0150] FIG. 14 is a diagram illustrating the separation of electric charges related to electrical peeling after voltage is applied to an adhesive structure according to one embodiment of the present disclosure. FIG. 14 is an enlarged cross-sectional view of the first region (S1) of FIG. 12.

[0151] FIG. 15 is a drawing showing a configuration related to electric peeling of FIG. 14 according to one embodiment of the present disclosure.

[0152] The components of the electronic device (101) of FIGS. 12 to 15 may be partially or entirely identical to the components of the electronic device (101) of FIGS. 1 to 11.

[0153] The embodiments of FIGS. 12 to 15 can be optionally combined with the embodiments of FIGS. 1 to 11 and the embodiments of FIGS. 16 to 24.

[0154] According to one embodiment, the electronic device (101) may include at least one of a housing (201), a protective cover (320), a circuit board (240), a battery (250), a conductive structure (330), and / or a conductive adhesive sheet (340).

[0155] According to one embodiment, the adhesive structure can bond the housing (310) and the protective cover (320) with strong adhesive force. The adhesive structure can place a conductive adhesive sheet (340) containing an adhesive component between the housing (310) and the protective cover (320).

[0156] According to one embodiment, the adhesive structure can separate the protective cover (320) from the housing (310) due to the application of voltage. To weaken the adhesive force between the housing (310) and the protective cover, the adhesive structure can provide a structure in which a conductive adhesive sheet (340) having electric peeling properties and a conductive structure (330) forming a charge movement path are laminated.

[0157] According to one embodiment (see FIG. 12), a first extension portion (330b) of the conductive structure (330) may extend inwardly (e.g., in the X-axis direction) of the circuit board (240) and be electrically connected to a first contact element (261) mounted on the circuit board (240). A front side (e.g., a surface) (e.g., a surface facing the +Z-axis) of the conductive structure (330) provides one side (e.g., a surface) exposed toward the circuit board (240), and a portion of the conductive structure (330) may be in physical contact with the first contact element (261). According to one embodiment, when a voltage is applied to the circuit board (240), a current may flow along the electrically connected conductive structure (330). For example, when voltage is applied so that the first contact element (261) has a (-) polarity, the conductive structure (330) electrically connected to the first contact element (261) can form a layer having a (-) polarity.

[0158] According to one embodiment (see FIG. 13), the second extension portion (340b) of the conductive adhesive sheet (340) may extend inwardly (e.g., in the X-axis direction) of the circuit board (240) and be electrically connected to a second contact element (262) mounted on the circuit board (240). The conductive layer (342) of the conductive adhesive sheet (340) may be bent to provide an exposed state toward the circuit board (240), and a portion of the conductive layer (342) may be in physical contact with the second contact element (262). According to one embodiment, when voltage is applied to the circuit board (240), current may flow along the electrically connected conductive layer (342). For example, when voltage is applied so that the second contact element (262) has a (+) polarity, the conductive layer (342) electrically connected to the second contact element (262) may form a layer having a (+) polarity.

[0159] Referring to FIGS. 12 and 13, the conductive structure (330) is formed to have a (-) pole, and the conductive layer (342) of the conductive adhesive sheet (340) is formed to have a (+) pole, but this is not limited thereto, and the design can be changed in various ways depending on the voltage conditions so that the conductive structure (330) is formed to have a (+) pole, and the conductive layer (342) of the conductive adhesive sheet (340) is formed to have a (-) pole.

[0160] According to one embodiment (see FIG. 14), a voltage is applied to the circuit board (240), the conductive structure (330) may be formed so that the edge facing the electrolyte layer (343) has a (+) polarity, and the conductive layer (342) of the conductive adhesive sheet (340) may be formed so that the edge facing the electrolyte layer (343) has a (-) polarity. Thereafter, the (-) charges and (+) charges mixed within the electrolyte layer (343) of the conductive adhesive sheet (340) may move to a region having an opposite polarity. For example, after a certain period of time (e.g., approximately 1 min to 3 min), the (-) charges (second charges) of the electrolyte layer (343) may move toward the conductive structure (330) formed to have a (+) pole, and the (+) charges (first charges) of the electrolyte layer (343) may move toward the conductive layer (342) formed to have a (-) pole. As the (-) charges are arranged near the front side (e.g., the side) (e.g., the side facing the +Z axis) of the electrolyte layer (343) and the (+) charges are arranged near the back side (e.g., the side) (e.g., the side facing the -Z axis) of the electrolyte layer (343), the physical structure of the electrolyte layer (343) may be destroyed and the adhesive strength of the electrolyte layer (343) may be reduced. Thereafter, the decrease in adhesive strength that occurs between the conductive structure (330) and the conductive adhesive sheet (340) allows the protective cover (320) to be easily separated from the housing (310) by a tool such as an adsorber or by a worker (e.g., a user). Hereinafter, the electric peeling characteristics of the conductive adhesive sheet (340) that provides the decrease in adhesive strength will be described in detail.

[0161] According to one embodiment (see FIG. 15), the electrical separation mechanism of the adhesive structure may be a method of electrically weakening the adhesive force by utilizing an ionic liquid within the conductive adhesive sheet (340) to separate the housing (310) and the protective cover (320). The electrical separation mechanism may include dissociation and diffusion of ions, and a chemical reaction at the electrode resulting therefrom.

[0162] According to one embodiment, the electrolyte layer (343) of the conductive adhesive sheet (340) may include a mixture of an acrylic adhesive and an ionic liquid. The ionic liquid may not form crystals and may exist in a liquid state due to the size asymmetry of cations and anions. Unlike conventional salts, the ionic liquid may exist in a liquid state at a temperature of approximately 100°C or lower.

[0163] In one embodiment, in order for the conductive adhesive sheet (340) to provide electrical peeling properties, the arrangement of conductive materials adjacent to the electrolyte layer (343) may be required so that separated charges (e.g., positive charges and negative charges) within the electrolyte layer (343) can easily (e.g., freely) move. For example, a conductive layer (342) and a conductive structure (330) having conductivity may be arranged in contact with the front side (e.g., the surface) and the back side (e.g., the surface) of the electrolyte layer (343) of the conductive adhesive sheet (340), respectively.

[0164] When explaining the electro-peeling process of the conductive adhesive sheet (340), when voltage is applied to the circuit board (240), a (+) voltage is applied to the conductive layer (342) disposed on both sides (e.g., the surface) of the electrolyte layer (343) (e.g., forming a layer having a (+) polarity), and a (-) voltage is applied to the conductive structure (330) (e.g., forming a layer having a (-) polarity), and dissociation and diffusion may occur in the ionic liquid of the electrolyte layer (343). For example, the ionic liquid of the electrolyte layer (343) is composed of (+) ions and (-) ions, and when voltage is applied, the ionic liquid may dissociate into cations and anions. Thereafter, the dissociated ions (e.g., (-) charges and (+) charges) may move under the influence of an electric field. Negative ions (e.g., negative charges) can diffuse toward the positive electrode, and positive ions (e.g., positive charges) can diffuse toward the negative electrode.

[0165] Afterwards, a (-) pole peeling mechanism and / or a (+) pole peeling mechanism may occur. The (-) pole and / or the (+) pole peeling mechanism may be determined to be predominantly one of them depending on the chemical properties of the adhesive, the adherend, and the peeling occurrence conditions. According to one embodiment of the present disclosure, the (-) pole peeling mechanism is predominantly occurred, and thus, separation of the protective cover (320) from the housing (310) may occur.

[0166] In one embodiment, when explaining the (-) pole peeling mechanism, a reduction reaction of (+) ions may occur due to contact between a conductive structure (330) having a (-) pole and (+) ions in the ionic liquid of the electrolyte layer (343). The (+) ions in the electrolyte layer (343) gathered toward the (-) pole of the conductive structure (330) may obtain electrons from the (-) pole and be reduced, thereby causing a chemical reaction that reduces adhesive strength (e.g., adhesive function within the electrolyte layer (343)). For example, the reduced (+) ions may attack the carbonyl group (C=O) forming the backbone structure of the acrylic pressure-sensitive adhesive, and the attack may cause the structure of the adhesive to be deformed or decomposed. The chemical reaction generates hydrogen gas as a byproduct, and the generation of the hydrogen gas may make the structure of the adhesive more unstable. Accordingly, the adhesive strength of the acrylic adhesive at the (-) pole interface is reduced due to the above chemical reactions, and the weakened adhesive strength can facilitate separation between the conductive structure (330) and the conductive adhesive sheet (340).

[0167] According to one embodiment, when explaining the (+) pole peeling mechanism, an oxidation reaction of the (+) pole may occur due to contact of (-) ions in the ionic liquid of the conductive layer (342) having a (+) pole and the electrolyte layer (343). The (-) ions in the electrolyte layer (343) gathered toward the (+) pole of the conductive layer (342) cause an oxidation reaction at the (+) pole, and in the reaction, the metal (e.g., the conductive layer (342)) used in the (+) pole may be oxidized. Thereafter, as a result of the oxidation reaction, an oxide layer is generated at the (+) pole interface, and the oxide film layer may be formed on the surface of the metal (e.g., the conductive layer (342)) to weaken the bonding force between the adhesive and the metal (e.g., the conductive layer (342)). Accordingly, the adhesive strength of the acrylic adhesive on one side (e.g., surface) of the metal (e.g., conductive layer (342)) is reduced by the formation of the oxide layer, and the weakened adhesive strength can facilitate separation between the conductive layer (342) and the electrolyte layer (343) within the conductive adhesive sheet (340).

[0168] FIG. 16 is a flowchart illustrating a separation operation between a housing and a protective cover of an electronic device according to one embodiment of the present disclosure.

[0169] FIG. 17 is a flowchart illustrating a separation operation between a housing and a protective cover of an electronic device according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 16 and 17 may be partially or entirely identical to the configuration of the electronic device (101) of FIGS. 1 to 15.

[0170] The embodiments of FIGS. 16 and 17 can be optionally combined with the embodiments of FIGS. 1 to 15 and the embodiments of FIGS. 18 to 24.

[0171] According to one embodiment, the electronic device (101 of FIGS. 1 to 14) may include at least one of a housing (310 of FIGS. 7 to 14), a protective cover (320 of FIGS. 7 to 14), a circuit board (240 of FIGS. 7 to 14), a battery (250 of FIGS. 7 to 14), a conductive structure (330 of FIGS. 7 to 14), and / or a conductive adhesive sheet (340 of FIGS. 7 to 14).

[0172] Fig. 16 shows a flow chart for supplying voltage from a battery (250) in an electronic device (101) and separating a protective cover (320).

[0173] First, when a user wishes to disassemble the electronic device (101) (e.g., separate the protective cover (320) from the housing (310), the user's intention can be transmitted (e.g., identified or determined) to the electronic device (101) (e.g., processor (120) of FIG. 1). In operation 1010, the user can enter (e.g., input) a setting mode within the electronic device (101) and perform a mode progression for separating the protective cover (320) from the housing (310). The setting mode can be entered, for example, through an application and / or a button.

[0174] In operation 1020, the processor (120) of the electronic device (101) may determine whether the user has selected to separate the protective cover (320) in order to proceed with the separation mode. If the processor (120) determines that the separation mode is to be performed by receiving a separation mode input value within the setting mode of the electronic device (101), the processor may proceed to a subsequent operation (e.g., operation 1030). If the processor (120) does not receive a separation mode input value within the setting mode of the electronic device (101) (or receives a non-separation mode input value) and determines that the separation mode is not to be performed, the processor may return to operation 1020.

[0175] In operation 1030, the processor (120) of the electronic device (101) can activate an electrical connection between the conductive adhesive sheet (340) (and / or the conductive structure (330)) and the circuit board (240). For example, the processor (120) can activate the electrical connection by turning on a switch connected to a second contact element (262) disposed on the circuit board (240) connected to the conductive layer (342) of the conductive adhesive sheet (340), and a first contact element (261) disposed on the circuit board (240) connected to the conductive structure (330), respectively.

[0176] In operation 1040, the process (120) of the electronic device (101) can apply a voltage from a low dropout regulator (LDO) to the conductive adhesive sheet (340) (and / or the conductive structure (330)) through the circuit board (240). For example, the LDO connected to the battery (250) can convert the voltage of the battery (250) into a stable output voltage to enable the circuit of the circuit board (240) to operate stably. When a voltage (e.g., 9 V) is applied to the circuit board (240) through the LDO connected to the battery (250), the first contact element (261) can cause the conductive structure (330) to have a (-) polarity through the first extension portion (330b) of the conductive structure (330). When voltage is applied to the circuit board (240) through the LDO connected to the battery (250), the second contact element (262) can cause the conductive layer (342) to have a positive (+) polarity through the second extension portion (340b) of the conductive adhesive sheet (340).

[0177] In operation 1050, if a certain period of time passes while the voltage is applied, the (-) charges and (+) charges mixed within the electrolyte layer (343) may move to regions having opposite polarities. For example, between approximately 1 min and 2 min, the (-) charges of the electrolyte layer (343) may move toward the conductive structure (330) forming the (+) pole, and the (+) charges of the electrolyte layer (343) may move toward the conductive layer (342) of the conductive adhesive sheet (340) forming the (-) pole. The movement of each charge may reduce the adhesive force of the electrolyte layer (343).

[0178] The process (120) of the electronic device (101) may proceed to a subsequent operation (e.g., operation 1060) when a preset period of time (e.g., 4 min) has elapsed while the voltage is applied. The process (120) may maintain operation 1050 until a preset period of time has elapsed while the voltage is applied.

[0179] In operation 1060, the processor (120) of the electronic device (101) determines whether the protective cover (320) is detachable from the housing (310), and based on the determination, may notify the user of whether the protective cover (320) is detachable. For example, the processor (120) may determine the degree of adhesion reduction between the conductive adhesive sheet (340) and the conductive structure (330), and notify the user of whether the protective cover is detachable. For example, after voltage is applied to the circuit board (240), after a preset time (e.g., a designated time) (e.g., 4 minutes or more) has elapsed, the processor (120) may notify the user of whether the protective cover (320) is detachable. The method of notifying the user of whether the protective cover is detachable may be transmitted (e.g., provided) in various ways that the user can confirm. For example, the information may be transmitted as text on the display of the electronic device (or wearable electronic device) or as a voice-like message.

[0180] In operation 1070, the user (or operator) can directly separate the protective cover (320) from the housing (310) after receiving a notification from the electronic device (101) that the protective cover (320) is in a detachable state. The separation of the protective cover (320) can be performed by pulling the protective cover (320) with a hand or by pulling the protective cover (320) using an absorber, depending on the degree to which the adhesive force between the housing (310) and the protective cover (320) is reduced.

[0181] In operation 1080, the processor (120) of the electronic device (101) may proceed with the next process or maintain the current process depending on whether a predetermined period of time has elapsed after the protective cover (320) is detached. For example, if a preset period of time (e.g., 20 minutes) has elapsed after the protective cover (320) is detached, operation 1090 may be performed. Operation 1080 may be maintained until a preset period of time has elapsed while the voltage is applied.

[0182] In operation 1090, if the processor (120) of the electronic device (101) determines that the preset period of time (e.g., 20 min) of operation 1080 has elapsed, the processor (120) may deactivate the electrical connection between the conductive adhesive sheet (340) (and / or the conductive structure (330)) and the circuit board (240). For example, the processor (120) may activate the electrical connection by turning off a switch connected to a second contact element (262) disposed on the circuit board (240) connected to the conductive layer (342) of the conductive adhesive sheet (340), and a first contact element (261) disposed on the circuit board (240) connected to the conductive structure (330), respectively.

[0183] Fig. 17 illustrates a flowchart of separating a protective cover (320) by supplying voltage from an external power source to an electronic device (101). The flowchart of Fig. 17 may apply the configuration of operations 1020 to 1090 of the flowchart of Fig. 16. Hereinafter, operations prior to operation 1020, which are different from the flowchart of Fig. 16, will be described.

[0184] Referring to FIG. 17, when a user wants to disassemble the electronic device (101) (e.g., separate the protective cover (320) from the housing (310), the user's intention (e.g., user input) can be transmitted (e.g., identified or determined) to the electronic device (101) (e.g., processor (120) of FIG. 1). In operation 1011, if the user enters the setting mode within the electronic device (101), and performs the mode progression of separating the protective cover (320) from the housing (310), the processor (120) of the electronic device (101) can guide the connection of the electronic device (101) and a terminal adapter (TA) (e.g., an external power cable). The setting mode can be entered, for example, through an application and / or a button. The guiding method can be transmitted (e.g., provided) to the user in the form of a message through the screen of the electronic device (101).

[0185] In operation 1015, the processor (120) of the electronic device (101) may check whether there is an electrical connection between the electronic device (101) and a terminal adapter (TA) and perform subsequent operations. If the processor (120) determines that an external power source is connected to the electronic device (101), the process may proceed to operation 1020. If the processor (1020) determines that an external power source is not connected to the electronic device (101), the process may return to operation 1011.

[0186] Thereafter, operations 1020 to 1090 may apply the contents disclosed above (e.g., processes or determinations).

[0187] FIG. 18 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0188] The configuration of the electronic device (101) of FIG. 18 may be partially or entirely identical to the configuration of the electronic device (101) of FIGS. 1 to 17.

[0189] The embodiments of FIG. 18 can be optionally combined with the embodiments of FIGS. 1 to 17 and the embodiments of FIGS. 19 to 24.

[0190] Fig. 18 shows the electrical connection relationship between the conductive adhesive sheet (340) and the second contact element (262), and the electrical connection relationship between the conductive structure (330) and the first contact element (261) can be applied to the configuration of Fig. 10.

[0191] According to one embodiment, the electronic device (101) may include at least one of a housing (310), a protective cover (320), a circuit board (240), a conductive structure (330), and / or a conductive adhesive sheet (340).

[0192] According to one embodiment, the adhesive structure may be a structure in which a conductive adhesive sheet (340), a conductive structure (330), and a protective cover (320) are sequentially laminated on a second side wall portion (312b) of the housing (310). The first side wall portion (312a) of the housing (310) may be formed to surround the outer side (e.g., surface) of the conductive adhesive sheet (340), the conductive structure (330), and the protective cover (320).

[0193] According to one embodiment, the conductive adhesive sheet (340) may include an adhesive substrate layer (341), a conductive layer (342), and an electrolyte layer (343). Among the conductive adhesive sheets (340), the adhesive substrate layer (341) and the conductive layer (342) may each include an extended portion (e.g., a second extended portion (340b)) protruding toward the circuit board (240) to be connected to the second contact element (262).

[0194] According to one embodiment, in the second extended portion (340b) of the conductive adhesive sheet (340), the conductive layer (342) may be exposed toward the protective cover (320) while being disposed on the adhesive substrate layer (341). For electrical connection between the conductive layer (342) and the second contact element (262) disposed on the circuit board (240), a plurality of conductive materials may be positioned between the conductive layer (342) and the second contact element (262). The plurality of conductive materials may serve as a bridge between the conductive layer (342) and the second contact element (262). The plurality of conductive materials may be in contact with the exposed conductive layer (342) and may be in a form extending toward the second contact element (262).

[0195] According to one embodiment, the plurality of conductive materials may include a first conductive adhesive portion (501) and a second conductive adhesive portion (502). The first conductive adhesive portion (501) may be a conductive double-sided tape having a double-sided adhesive property. The first conductive adhesive portion (501) may have one side (e.g., a side facing the -Z axis) adhered to the protective cover (320), and the other side (e.g., a side) (e.g., a side facing the +Z axis) adhered to the conductive layer (342) and the second conductive adhesive portion (502). The second conductive adhesive portion (502) may be a conductive single-sided tape having one side (e.g., a side) having an adhesive property. The second conductive adhesive portion (502) may have one side (e.g., a surface) (e.g., a surface facing the -Z axis) adhered to the first conductive adhesive portion (501), and the other side (e.g., a surface) (e.g., a surface facing the +Z axis) may be in contact with the second contact element (262).

[0196] According to one embodiment, the conductive layer (342) of the conductive adhesive sheet (340) may have one side connected to the electrolyte layer (343) and the other side connected to the first conductive adhesive portion (501). One side of the first conductive adhesive portion (501) may be located on one side (e.g., a surface) (e.g., a surface facing the -Z axis) of the conductive layer (342). According to one embodiment, the first conductive adhesive portion (501) disposed on the protective cover (320) and extending inwardly of the circuit board (240) may be disposed such that the overlapping region of the second contact element (262) is laminated with the second conductive adhesive portion (502). The second conductive adhesive portion (502) may be disposed parallel to the conductive layer (342) and may face the second contact element (262).

[0197] According to one embodiment, the adhesive substrate layer (341), the conductive layer (342), the first conductive adhesive portion (501), and the second conductive adhesive portion (502) may have a plate shape (e.g., a rigid or straight shape), which may be different from the structure of the bent adhesive substrate layer (341) and the conductive layer (342) of FIG. 10. The thickness of a portion of the conductive adhesive sheet (340) (the adhesive substrate layer (341), the conductive layer (342)) arranged parallel to one side (e.g., the surface) of the first conductive adhesive portion (501) and the second conductive adhesive portion (502) may be substantially the same. The thickness of the first conductive adhesive portion (501) may be substantially the same as the sum of the thicknesses of the conductive layer (342) and the electrolyte layer (343).

[0198] According to one embodiment, when voltage is applied to the circuit board (240), the current transmitted to the second contact element (262) may be transmitted to the conductive layer (342) via the second conductive adhesive portion (502) and the first conductive adhesive portion (501). For example, the conductive layer (342) may have a positive (+) pole.

[0199] FIG. 19 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0200] FIG. 20 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0201] The configuration of the electronic device (101) of FIGS. 19 and 20 may be partially or entirely identical to the configuration of the electronic device (101) of FIGS. 1 to 17.

[0202] The embodiments of FIGS. 19 and 20 can be optionally combined with the embodiments of FIGS. 1 to 18 and the embodiments of FIGS. 21 to 24.

[0203] According to one embodiment, the electronic device (101) may include at least one of a housing (310), a protective cover (320), a circuit board (240), a conductive structure (330), and / or a conductive adhesive sheet (340).

[0204] Fig. 19 shows the electrical connection relationship between a conductive structure (330) and a first contact element (261), and Fig. 20 shows the electrical connection relationship between a conductive adhesive sheet (340) and a second contact element (262).

[0205] Referring to FIGS. 19 and 20, a conductive structure (330) is positioned (e.g., bonded) along an edge of a housing (310), and a conductive adhesive sheet (340) is positioned (e.g., bonded) along an edge of a protective cover (320), and then the conductive structure (330) and the conductive adhesive sheet (340) can be bonded (e.g., bonded).

[0206] According to one embodiment, the adhesive structure may be a structure in which a conductive structure (330), a conductive adhesive sheet (340), and a protective cover (320) are sequentially laminated on a second side wall portion (312b) of a housing (310). The first side wall portion (312a) of the housing (310) may be formed to surround the outer side (e.g., surface) of the conductive structure (330), the conductive adhesive sheet (340), and the protective cover (320).

[0207] Referring to FIG. 19, a conductive structure (330) may be placed between a conductive adhesive sheet (340) and a housing (310). In a first extension portion (330b) of the conductive structure (330), the conductive structure (330) may be placed on the housing (310).

[0208] According to one embodiment, the conductive structure (330) may be arranged in a curved shape along the second side wall portion (312b) of the housing (310) toward the support plate (311). A portion of the conductive structure (330) may be arranged adjacent to the circuit board (240). The conductive structure (330) may be exposed toward the circuit board (240) while being coupled to the housing (310). The conductive structure (330) may be electrically connected to the first contact element (261) arranged on the circuit board (240).

[0209] In one embodiment, the conductive structure (330) extending into the circuit board (240) may be coupled to one side (e.g., surface) of the housing (310) and may have a structure different from that of the conductive structure (330) extending into the circuit board (240) of FIG. 10. In one embodiment, when voltage is applied to the circuit board (240), the current transmitted to the first contact element (261) may form a path along the conductive structure (330). For example, the conductive structure (330) may have a (-) polarity.

[0210] Referring to FIG. 20, a conductive adhesive sheet (340) adhered (e.g., attached) to a protective cover (320) may include an adhesive substrate layer (341), a conductive layer (342), and an electrolyte layer (343) laminated in the +Z-axis direction. Among the conductive adhesive sheets (340), the adhesive substrate layer (341) and the conductive layer (342) may each include an extended portion (e.g., a second extended portion (340b)) protruding toward the circuit board (240) to be connected to the contact element (260).

[0211] According to one embodiment, a conductive adhesive sheet (340) may be disposed between a protective cover (320) and a conductive structure (330). In a second extended portion (340b) of the conductive adhesive sheet (340), a conductive layer (342) may be disposed on an adhesive substrate layer (341) and exposed toward a circuit board (240). The conductive layer (342) may be electrically connected to a second contact element (262) disposed on the circuit board (240) by making contact with it.

[0212] According to one embodiment, the adhesive substrate layer (341) and the conductive layer (342) extending inwardly of the circuit board (240) may have a plate shape (e.g., a rigid or straight shape), which may be different from the structure of the bent adhesive substrate layer (341) and the conductive layer (342) of FIG. 11. According to one embodiment, when voltage is applied to the circuit board (240), the current transmitted to the second contact element (262) may form a path along the conductive layer (342). For example, the conductive layer (342) may have a positive (+) polarity.

[0213] FIG. 21 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0214] FIG. 22 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0215] The configuration of the electronic device (101) of FIGS. 21 and 22 may be partially or entirely identical to the configuration of the electronic device (101) of FIGS. 1 to 17.

[0216] The embodiments of FIGS. 21 and 22 can be optionally combined with the embodiments of FIGS. 1 to 20 and the embodiments of FIGS. 23 to 24.

[0217] According to one embodiment, the electronic device (101) may include at least one of a housing (310), a protective cover (320), a circuit board (240), a conductive structure (330), and / or a conductive adhesive sheet (340).

[0218] Fig. 21 shows the electrical connection relationship between the second conductive layer (342b) of the conductive adhesive sheet (340) and the first contact element (261), and Fig. 22 shows the electrical connection relationship between the first conductive layer (342a) of the conductive adhesive sheet (340) and the second contact element (262).

[0219] Referring to FIGS. 21 and 22, a conductive adhesive sheet (340) can be placed between the housing (310) and the protective cover (320) to combine the housing (310) and the protective cover (320).

[0220] According to one embodiment, the adhesive structure may be a structure in which a conductive adhesive sheet (340) and a protective cover (320) are sequentially laminated on a second side wall portion (312b) of a housing (310). The conductive adhesive sheet (340) may include a plurality of conductive layers, and each conductive layer may be arranged toward the housing (310) side and the protective cover (320) side.

[0221] According to one embodiment, the conductive adhesive sheet (340) may include an adhesive substrate layer (341), a first conductive layer (342a), an electrolyte layer (343), and a second conductive layer (342b). The adhesive substrate layer (341), the conductive layer (342), the electrolyte layer (343), and the second conductive layer (342b) may have a closed loop shape that corresponds to each other as a whole. The adhesive substrate layer (341), the conductive layer (342), the electrolyte layer (343), and / or the second conductive layer (342b) may each include an extended portion extending toward the circuit board (240) (e.g., in the X-axis direction) to be connected to the contact elements (261, 262).

[0222] According to one embodiment, the adhesive substrate layer (341) of the conductive adhesive sheet (340) may be disposed between the housing (310) (e.g., the second side wall portion (312b)) and the first conductive layer (342a). The adhesive substrate layer (341) may provide a support layer function for supporting the conductive adhesive sheet (340) as a whole.

[0223] According to one embodiment, the first conductive layer (342a) of the conductive adhesive sheet (340) may be disposed between the adhesive substrate layer (341) and the electrolyte layer (343). The first conductive layer (342a) is a layer for the movement of charges constituting the electrolyte layer (343) and may provide a current-conducting function like a metal. For example, if voltage is applied to the conductive adhesive sheet (340), the first conductive layer (342a) may assume one of the (-) pole or the (+) pole (e.g., the (+) pole in FIG. 22), and some of the charges of the electrolyte layer (343) may move toward the first conductive layer (342a).

[0224] According to one embodiment, the electrolyte layer (343) of the conductive adhesive sheet (340) may be disposed between the first conductive layer (342a) and the second conductive layer (342b). According to one embodiment, the electrolyte layer (343) may include an electrolyte to provide an electric peeling property, and an adhesive function for adhering the conductive adhesive sheet (340) to the first conductive layer (342a) and the second conductive layer (342b) (or the protective cover (320)), for example, the function of a pressure-sensitive adhesive.

[0225] According to one embodiment, the electrolyte layer (343) includes a material that is dissolved in a solvent and dissociates into ions to have electrical conductivity, and may be in a state in which (+) charges and (-) charges are mixed and distributed. The electrolyte layer (343) may be in a solid electrolyte or gel electrolyte state. When voltage is applied to the conductive adhesive sheet (340) to separate the housing (310) and the protective cover (320), the electrolyte layer (343) can separate the (+) charges and (-) charges, thereby allowing the electrolyte layer (343) and the second conductive layer (342b) (or the first conductive layer (342a)) to be easily separated.

[0226] According to one embodiment, the second conductive layer (342b) of the conductive adhesive sheet (340) may be disposed between the electrolyte layer (343) and the protective cover (320). The second conductive layer (342b) is a layer for the movement of charges constituting the electrolyte layer (343) and may provide a conducting function like a metal. For example, if voltage is applied to the conductive adhesive sheet (340), the second conductive layer (342b) may assume one of the (-) pole or the (+) pole (e.g., the (-) pole in FIG. 21), and some of the charges of the electrolyte layer (343) may move toward the second conductive layer (342b).

[0227] Referring to FIG. 21, in the extended portion of the conductive adhesive sheet (340), the length (X-axis direction) of the second conductive layer (342b) may have a longer (e.g., larger) length than the lengths of other layers of the conductive adhesive sheet (340). The conductive adhesive sheet (340) may be laminated in the -Z-axis direction with respect to the adhesive base layer (341) disposed on the housing (310) as a first conductive layer (342a), an electrolyte layer (343), and a second conductive layer (342b). In order for the second conductive layer (342b) disposed between the electrolyte layer (343) and the protective cover (320) to come into contact with the first contact element (261), it is necessary to expose a portion covered by the electrolyte layer (343) to the outside, and the length of the second conductive layer (342b) is designed to be longer (e.g., larger) than the lengths of the first conductive layer (342a) and the electrolyte layer (343), so that a portion of the second conductive layer (342b) can come into contact with the first contact element (261).

[0228] According to one embodiment, in the extended portion of the conductive adhesive sheet (340), the second conductive layer (342b) is bonded to the protective cover (320) via the adhesive material (371), and the adhesive substrate layer (341), the first conductive layer (342a), the electrolyte layer (343), and the second conductive layer (342b) extended to the circuit board (240) can form a bent section. In the bent section, the second conductive layer (342b) forms an outermost layer while wrapping the adhesive substrate layer (341), the first conductive layer (342a), and the electrolyte layer (343), and is exposed to the outside and can come into contact with the first contact element (261).

[0229] Referring to FIG. 21, in the extended portion of the conductive adhesive sheet (340), the length (X-axis direction) of the first conductive layer (342a) may have a length longer (e.g., greater) than the length of the adhesive substrate layer (341) of the conductive adhesive sheet (340). The conductive adhesive sheet (340) may be laminated in the -Z-axis direction with respect to the adhesive substrate layer (341) as a first conductive layer (342a), an electrolyte layer (343), and a second conductive layer (342b). In order for the first conductive layer (342a) disposed between the conductive adhesive sheet (340) and the electrolyte layer (343) to contact the second contact element (262), it is necessary to expose the portion covered by the conductive adhesive sheet (340) to the outside, and the exposed first conductive layer (342a) may contact the second contact element (262).

[0230] FIG. 23 is a cross-sectional view taken along line A-A' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0231] FIG. 24 is a cross-sectional view taken along line B-B' of a portion of the electronic device of FIG. 8 according to one embodiment of the present disclosure.

[0232] The configuration of the electronic device (101) of FIGS. 23 and 24 may be partially or entirely identical to the configuration of the electronic device (101) of FIGS. 1 to 17.

[0233] The embodiments of FIGS. 23 and 24 can be optionally combined with the embodiments of FIGS. 1 to 20 and the embodiments of FIGS. 23 to 24.

[0234] According to one embodiment, the electronic device (101) may include at least one of a housing (310), a protective cover (320), a circuit board (240), a conductive structure (337, 338), and / or an electrolyte sheet (380).

[0235] Fig. 23 illustrates an electrical connection relationship between a first conductive structure (337) and a second contact element (262), and Fig. 24 illustrates an electrical connection relationship between a second conductive structure (338) and a first contact element (261). Referring to Figs. 23 and 24, the first and second conductive structures (337, 338) may be positioned between a housing (310) and a protective cover (320).

[0236] According to one embodiment, the adhesive structure may be a structure in which a first conductive structure (337), an electrolyte sheet (380), and a second conductive structure (338) are sequentially laminated on a second side wall portion (312b) of the housing (310). The adhesive structure may include a plurality of conductive structures on both sides of the electrolyte sheet (380), and each conductive structure may be arranged toward the housing (310) side and the protective cover (320) side.

[0237] According to one embodiment, the first conductive structure (337), the electrolyte sheet (380), and the second conductive structure (338) may have a closed loop shape that corresponds to each other as a whole. The first and second conductive structures (337, 338) may include extended portions that protrude toward the circuit board (240) to be connected to the contact elements (261, 262).

[0238] According to one embodiment, the first conductive structure (337) and the second conductive structure (338) may be respectively disposed on the upper and lower sides (e.g., the surface) of the electrolyte sheet (380). The first conductive structure (337) and the second conductive structure (338) may serve as layers for the movement of charges constituting the electrolyte sheet (380) and may provide a conductive function, such as a metal. For example, if voltage is applied to the first conductive structure (337) and the second conductive structure (338), the first conductive structure (337) may assume one of the (-) pole or the (+) pole (e.g., the (-) pole in FIG. 23), and some of the charges of the electrolyte sheet (380) may move toward the first conductive structure (337). The second conductive structure (338) has either a (+) pole or a (-) pole (e.g., a (+) pole in FIG. 24), and some of the charges of the electrolyte sheet (380) can move toward the second conductive structure (338).

[0239] According to one embodiment, the electrolyte sheet (380) includes a material that is dissolved in a solvent and dissociates into ions to have electrical conductivity, and may have (+) charges and (-) charges mixed and distributed. When voltage is applied to the first conductive structure (337) and the second conductive structure (338) to separate the housing (310) and the protective cover (320), the electrolyte sheet (380) can separate the (+) charges and (-) charges, thereby allowing the electrolyte layer (343) and the first conductive structure (337) (or the second conductive structure (338)) to be easily separated.

[0240] Referring to FIG. 23, the first conductive structure (337) may be positioned between the electrolyte sheet (380) and the housing (310). In an extended portion of the first conductive structure (337) (e.g., a portion extending toward the circuit board (240), the first conductive structure (337) may be positioned to correspond to the curved shape of the housing (310).

[0241] According to one embodiment, the first conductive structure (337) may be arranged in a curved shape along the second side wall portion (312b) of the housing (310) toward the support plate (311). A portion of the first conductive structure (337) may be arranged adjacent to the circuit board (240). The first conductive structure (337) may be exposed toward the circuit board (240) while being coupled to the housing (310). The first conductive structure (337) may be electrically connected to the first contact element (261) arranged on the circuit board (240).

[0242] In one embodiment, when voltage is applied to the circuit board (240), the current transmitted to the first contact element (261) may form a path along the first conductive structure (337). For example, the first conductive structure (337) may have a negative (-) polarity.

[0243] Referring to FIG. 24, in an extended portion of the second conductive structure (338) (e.g., a portion extending toward the circuit board (240), the length (X-axis direction) of the second conductive structure (338) may have a length longer (e.g., greater) than the lengths of the electrolyte sheet (380) and the first conductive structure (337). The adhesive structure may laminate the electrolyte layer (343) and the second conductive structure (338) in the -Z-axis direction based on the first conductive structure (337) disposed on the housing (310). In order for the second conductive structure (338) to contact the second contact element (262), it is necessary to expose the portion surrounded by the electrolyte layer (343) and the first conductive structure (337) to the outside, and the exposed second conductive structure (338) may contact the second contact element (262).

[0244] In one embodiment, when voltage is applied to the circuit board (240), the current transmitted to the second contact element (262) may form a path along the second conductive structure (338). For example, the second conductive structure (338) may have a positive (+) pole.

[0245] Typically, when repairing electronic devices like smartphones, removing the protective cover (e.g., the front or back plate) from the housing required a separate external heat source and a strong suction device. Consequently, disassembling a smartphone required both an external heat source and a strong suction device, making it only possible for after-sales service centers or manufacturers, not general consumers, and causing inconvenience to consumers.

[0246] An electronic device according to one embodiment of the present disclosure includes a conductive adhesive sheet provided with electrical peeling properties, thereby allowing a general user (e.g., a consumer) to easily disassemble the electronic device.

[0247] According to one embodiment of the present disclosure, the electronic device can receive the heat source required for disassembling the electronic device from the battery itself or by connecting an external power cable to the electronic device. Accordingly, general users (e.g., consumers) can easily obtain the heat source required for disassembling the electronic device.

[0248] An electronic device according to one embodiment of the present disclosure can be easily disassembled by a general person without significant force. For example, the electronic device can be provided in compliance with EU (European Union) regulations (compliant with EU battery repair regulations), such as "removable from the product using commercially available tools without requiring special tools, proprietary tools, heat energy, or solvents."

[0249] An electronic device according to one embodiment of the present disclosure may include two contact elements arranged on a circuit board, each of which may be electrically connected to a conductive structure coupled to a protective cover and a conductive adhesive sheet coupled to a housing. Accordingly, when voltage is applied to the circuit board, the protective cover may be easily separated from the housing.

[0250] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0251] An electronic device (101) according to one embodiment of the present disclosure may include a housing (310), a protective cover (320) disposed on the housing, a circuit board (240) positioned within the housing and having contact elements disposed in one area, a conductive structure (330) coupled along an edge of the protective cover and having a portion electrically connected to a first contact element (261) among the contact elements, and a conductive adhesive sheet (340) coupled along an edge of the housing and having a portion electrically connected to a second contact element (262) among the contact elements. The conductive adhesive sheet (340) may be configured to adhere to the conductive structure in a shape corresponding to the conductive structure. When a voltage is applied to the conductive structure and the conductive adhesive sheet, the conductive structure may be configured to have a reduced adhesive force between the conductive structure and the conductive adhesive sheet.

[0252] In one embodiment, the application of the voltage may occur through the circuit board being electrically connected to an external power source or an internal power source.

[0253] According to one embodiment, a portion of the conductive structure may include a first extension portion (330b) extending inwardly from the circuit board toward the first contact element.

[0254] According to one embodiment, a portion of the conductive adhesive sheet may include a second extension portion (340b) extending inwardly from the circuit board toward the second contact element.

[0255] According to one embodiment, the first extension portion of the conductive structure and the second extension portion of the conductive adhesive sheet may be arranged parallel to each other.

[0256] In one embodiment, the distance between the first extension portion and the circuit board and the distance between the second extension portion and the circuit board may be different.

[0257] According to one embodiment, the conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) disposed facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer, wherein the conductive layer can extend toward the second contact element to be electrically connected to the second contact element.

[0258] According to one embodiment, the conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) disposed facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer, and the length of the conductive layer may be greater than the length of the adhesive substrate layer or the electrolyte layer.

[0259] According to one embodiment, the adhesive substrate layer and the conductive layer of the conductive adhesive sheet are bent toward the circuit board, and a portion of the conductive layer exposed toward the circuit board can substantially contact the second contact element.

[0260] According to one embodiment, the conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) disposed facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer, and when voltage is applied to the conductive structure and the conductive adhesive sheet, ions of the electrolyte layer can be formed to move toward the conductive structure and the conductive adhesive sheet, respectively, according to polarity.

[0261] According to one embodiment, when a voltage is applied to the conductive structure and the conductive adhesive sheet, charges of the first polarity (e.g., (+) pole) among the charges of the electrolyte layer may be formed to move toward the conductive structure, and charges of the second polarity (e.g., (-) pole) opposite to the first polarity among the charges of the electrolyte layer may be formed to move toward the conductive layer.

[0262] According to one embodiment, the first contact element and the second contact element may be arranged adjacent to an edge of the housing and spaced apart from each other in parallel.

[0263] According to one embodiment, at least one of the conductive structure or the conductive adhesive sheet may be formed in a closed loop shape along an edge of the protective cover.

[0264] According to one embodiment, the electronic device further includes a battery (250) disposed within the mounting space of the housing, and the voltage may be applied through the circuit board electrically connected to the battery.

[0265] In one embodiment, when a voltage is applied to the conductive structure, an electrical path may be formed through the circuit board and the first adhesive element toward the conductive structure.

[0266] According to one embodiment, when a voltage is applied to the conductive layer of the conductive adhesive sheet, an electrical path may be formed through the circuit board and the second adhesive element toward the conductive layer.

[0267] According to one embodiment, the electronic device further includes a display (230) disposed on the housing, and the protective cover may include a back plate of the electronic device facing opposite to the display.

[0268] According to one embodiment, the housing and the conductive structure may be formed as one piece.

[0269] An electronic device (101) according to one embodiment of the present disclosure may include a housing (310), a protective cover (320) disposed on the housing and having a conductive structure (330) coupled thereto along an edge thereof, a circuit board (240) positioned within the housing, and a conductive adhesive sheet (340) disposed along an edge of the housing and formed to adhere to the conductive structure in a shape corresponding to the conductive structure. A portion of the conductive structure and a portion of the conductive adhesive sheet may extend inwardly of the circuit board and be electrically connected to the circuit board. When a voltage is applied to the conductive structure and the conductive adhesive sheet, an adhesive force between the conductive structure and the conductive adhesive sheet may be formed to decrease.

[0270] According to one embodiment, the application of the voltage may be configured to occur through the circuit board electrically connected to an external power source or an internal power source.

[0271] According to one embodiment, the electronic device may include a first contact element (261) and a second contact element (262) arranged in parallel on the circuit board, wherein the first contact element may be formed to contact the portion of the conductive structure, and the second contact element may be formed to contact the portion of the conductive adhesive sheet.

[0272] According to one embodiment, the conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) disposed facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer, wherein the conductive layer can extend toward the second contact element to be electrically connected to the second contact element.

[0273] According to one embodiment, the conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) disposed facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer, and the length of the conductive layer may be greater than the length of the adhesive substrate layer or the electrolyte layer.

Claims

1. In an electronic device (101), Housing (310) A cover (320) placed on the above housing; A circuit board (240) located within the housing and having contact elements arranged in one area; A conductive structure (330) coupled along the edge of the cover and including a portion electrically connected to the first contact element (261) among the contact elements; and A conductive adhesive sheet (340) is formed to adhere to the conductive structure and is coupled along the edge of the housing, and includes a part of the contact elements that is electrically connected to the second contact element (262), and is an adhesive sheet (340) having a shape corresponding to the conductive structure. An electronic device wherein the conductive structure and the conductive adhesive sheet are configured such that when voltage is applied to the conductive structure and the conductive adhesive sheet, the adhesive force between the conductive structure and the conductive adhesive sheet decreases.

2. In paragraph 1, An electronic device, wherein the circuit board is electrically connected to an external power source or an internal power source and configured to apply the voltage.

3. In paragraph 1 or 2, The part of the conductive structure includes a first extension portion (330b) extending inwardly toward the circuit board toward the first contact element, An electronic device, wherein said part of said conductive adhesive sheet includes a second extension portion (340b) extending inwardly toward said second contact element on said circuit board.

4. In paragraph 3, The first extension portion of the conductive structure and the second extension portion of the conductive adhesive sheet are parallel, An electronic device, wherein the distance between the first extension portion and the circuit board and the distance between the second extension portion and the circuit board are different.

5. In any one of paragraphs 1 to 4, The conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer. An electronic device wherein the conductive layer extends toward the second contact element to be electrically connected to the second contact element.

6. In any one of paragraphs 1 to 4, The conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer. An electronic device wherein the length of the conductive layer is greater than the length of the adhesive substrate layer or the electrolyte layer.

7. In any one of paragraphs 1 to 6, An electronic device, wherein the adhesive substrate layer and the conductive layer among the conductive adhesive sheets are bent toward the circuit board, and a portion of the conductive layer exposed toward the circuit board is in substantial contact with the second contact element.

8. In any one of paragraphs 1 to 4, The conductive adhesive sheet includes an adhesive substrate layer (341), an electrolyte layer (343) facing the conductive structure, and a conductive layer (342) disposed between the adhesive substrate layer and the electrolyte layer. An electronic device in which, when the voltage is applied to the conductive structure and the conductive adhesive sheet, ions of the electrolyte layer are formed to move toward the conductive structure and the conductive adhesive sheet, respectively, according to polarity.

9. In paragraph 8, An electronic device in which the electrolyte layer is configured such that when a voltage is applied to the conductive structure and the conductive adhesive sheet, first charges of the first polarity of the electrolyte layer move toward the conductive structure, and second charges of the second polarity of the electrolyte layer move toward the conductive layer.

10. In any one of paragraphs 1 to 9, An electronic device wherein the first contact element and the second contact element are arranged adjacent to an edge of the housing and spaced apart from each other.

11. In any one of paragraphs 1 to 9, An electronic device, wherein at least one of the conductive structure or the conductive adhesive sheet is formed in a closed loop shape along the edge of the cover.

12. In any one of paragraphs 1 to 11, Further comprising a battery (250) placed within the mounting space of the above housing, An electronic device, wherein the circuit board electrically connected to the battery is configured to apply the voltage.

13. In any one of paragraphs 1 to 12, When voltage is applied to the conductive structure, an electrical path is formed through the circuit board and the first adhesive element toward the conductive structure, An electronic device in which, when a voltage is applied to the conductive layer of the conductive adhesive sheet, an electrical path is formed through the circuit board and the second adhesive element toward the conductive layer.

14. In any one of paragraphs 1 to 13, Further comprising a display (230) arranged on the housing, An electronic device, wherein the protective cover comprises a back plate of the electronic device opposite the display.

15. In any one of paragraphs 1 to 14, An electronic device wherein the housing and the conductive structure are integral.

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