Support plate including digitizer sensing wires, and foldable electronic device including same

Abstract

According to the present disclosure, provided are a support plate (240) for supporting a flexible display (220) of a foldable electronic device (200), and the foldable electronic device (200) comprising the flexible display (220) and the support plate (240) for supporting the flexible display (220). A sensing wire is added to flexible portions (244, 245, 1214, 1215) of the support plate (240) so that the foldable electronic device (200) may be more easily used together with a pen.

Description

A support plate including digitizer sensing wires, and a foldable electronic device including the same

[0001] Embodiments of the present disclosure relate to a flexible plate including digitizer sensing wires, and a foldable electronic device including the same.

[0002] Electronic devices are striving for thinness, weight reduction, miniaturization, and multifunctionality. To achieve this, displays and various components are being incorporated into electronic devices. As display technology advances, research and development on electronic devices that incorporate displays (or flexible displays) are actively underway. Electronic devices may incorporate displays (or flexible displays), and digitizers may be applied to convert analog coordinates (e.g., position) from an electronic pen (e.g., a stylus pen) into digital data.

[0003] The above-described material is provided solely as background information to aid in understanding the embodiments of the present disclosure. No determination has been made, and no claims are made, as to whether any of the above material constitutes prior art in connection with the present disclosure.

[0004] An electronic device may include a digitizer for detecting input (e.g., a touch input or a hovering input) from an electronic pen (e.g., a stylus pen). For example, the digitizer may convert analog coordinates (e.g., a position) of the electronic pen (e.g., the stylus pen) into digital coordinate data. The digitizer may transmit the digital coordinate data to a processor (e.g., the processor (120) of FIG. 1). For example, the electronic pen (e.g., the stylus pen) may include a passive electromagnetic resonance (EMR) type electronic pen.

[0005] Foldable electronic devices may be thicker due to the inclusion of a flexible plate for supporting a foldable display (e.g., a flexible display) and a digitizer for detecting coordinates of an electronic pen (e.g., a stylus pen). In the case of foldable electronic devices, a separate digitizer is applied to suit the folding structure, and multiple connectors are arranged to connect the separate digitizer to the driving circuit, which may result in a complex structure and increased manufacturing costs.

[0006] Foldable or multi-foldable electronic devices typically include one or more, for example, two or more hinge portions, and may be divided into two or more, for example, three, display portions such that the foldable display (e.g., flexible display) can be folded twice. A multi-separable digitizer is typically divided into two, three, or more digitizer portions, and is configured such that the multi-foldable digitizer can be folded twice. Accordingly, multiple connectors are arranged to connect the multi-separable digitizer to the driving circuit, which may complicate the structure and increase manufacturing costs.

[0007] A multi-foldable electronic device may include a first hinge portion (e.g., a narrow hinge portion) and a second hinge portion (e.g., a wide hinge portion) for multi-folding of a housing structure and a foldable display. An electronic pen may acquire coordinates using a digitizer, but in an area of ​​the digitizer corresponding to the first hinge portion (e.g., the narrow hinge portion) and the second hinge portion (e.g., the wide hinge portion), a sensing signal of the electronic pen may be weak and noise may increase, which may limit the acquisition of coordinates.

[0008] The present disclosure can provide a flexible plate including digitizer sensing wires suitable for a multi-foldable structure, and a foldable electronic device including the same.

[0009] The present disclosure can provide a detachable digitizer suitable for a multi-foldable structure (e.g., a multi-detachable digitizer), and a foldable electronic device including the same.

[0010] The present disclosure may provide a foldable electronic device capable of obtaining coordinates of an electronic pen in an area corresponding to a first hinge portion (e.g., a narrow hinge portion) and a second hinge portion (e.g., a wide hinge portion) of the multi-foldable electronic device.

[0011] The technical challenges addressed in this document are not limited to the technical challenges mentioned above, and may be expanded upon without departing from the scope of the present disclosure. Other technical challenges not mentioned will be readily apparent to those skilled in the art to which this document pertains, as described below.

[0012] According to one aspect of the present disclosure, a support plate according to claim 1 for supporting a foldable display of an electronic device is provided. According to another aspect of the present disclosure, an electronic device is provided including a foldable or flexible display supported by a support plate according to claim 15. By integrating x-axis and y-axis sensing wiring forming a digitizer into the support plate, manufacturing and, for example, assembling of the electronic device can be facilitated. By integrating x-axis and y-axis sensing wiring forming a digitizer into the support plate, the digitizer can be formed at least partially within or on the first, second, and third plate portions, as well as within or on the first and / or second flexible portions. When a user wishes to use the electronic device with an electronic pen, the usability of the electronic device can be improved.

[0013] A foldable electronic device according to an embodiment of the present disclosure may include a foldable housing. The foldable housing may include a first housing part, a second housing part, and a third housing part. The foldable housing may include a first hinge structure and a second hinge structure. The first hinge structure may rotatably connect the first housing part and the second housing part. The second hinge structure may rotatably connect the second housing part and the third housing part. The foldable electronic device may include a flexible display. The flexible display may be disposed on the front surfaces of the first housing part, the second housing part, and the third housing part. The foldable electronic device may include a support plate that supports the flexible display. The foldable electronic device may include a digitizer control circuit. The flexible display may include a first folding part and a second folding part. The support play may include a first plate part, a second plate part, a third plate part, a first flexible part supporting a first folding part of the flexible display, and a second flexible part supporting a second folding part of the flexible display. The first flexible part may include first slits. The second flexible part may include second slits. The first flexible part and the second flexible part may include x-axis sensing wires arranged in an x-axis direction in a first layer to form x-axis channels of a digitizer, and these channels may be connected to a digitizer control circuit. The first flexible part and the second flexible part may include y-axis sensing wires arranged in a y-axis direction orthogonal to the x-axis direction in a second layer different from the first layer to form y-axis channels of the digitizer. The y-axis channels can be connected to the digitizer control circuit.

[0014] A support plate for supporting a foldable display according to one embodiment of the present disclosure may include a first plate part, a second plate part, a third plate part, a first flexible part for supporting a first folding part of the flexible display, and a second flexible part for supporting a second folding part of the flexible display. The first flexible part may include first slits. The second flexible part may include second slits. The first flexible part and the second flexible part may include x-axis sensing wires arranged in an x-axis direction in a first layer to form x-axis channels of a digitizer. The first flexible part and the second flexible part may include y-axis sensing wires arranged in a y-axis direction orthogonal to the x-axis direction in a second layer different from the first layer to form y-axis channels of the digitizer.

[0015] A foldable electronic device according to one embodiment of the present disclosure may include two hinge portions or hinges, a foldable display (e.g., a flexible display) divided into three display portions so that the foldable display can be folded twice, a multi-separable digitizer divided into three digitizer portions so that the multi-separable digitizer can be folded twice, and a flexible plate for supporting the foldable display (e.g., a flexible display). In addition, a digitizer for detecting coordinates of an electronic pen (e.g., a stylus pen) may be integrated into the support plate, for example, the support plate of claim 1.

[0016] A foldable electronic device according to one embodiment of the present disclosure can reduce the thickness of the foldable electronic device and reduce manufacturing costs by integrating a flexible plate for supporting a foldable display (e.g., a flexible display) and a digitizer for detecting coordinates of an electronic pen (e.g., a stylus pen).

[0017] A foldable electronic device according to one embodiment of the present disclosure can obtain coordinates of an electronic pen in an area corresponding to a first hinge portion (e.g., a narrow hinge portion) and a second hinge portion (e.g., a wide hinge portion).

[0018] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0019] In connection with the description of the attached schematic drawings, the same or similar reference numerals may be used for identical or similar components.

[0020] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0021] FIG. 2A is a perspective view showing a first state (e.g., unfolded state, expanded state) of a foldable electronic device (e.g., multi-foldable electronic device) according to one embodiment of the present disclosure.

[0022] FIG. 2b is a perspective view showing a second state (e.g., a first folded state, an intermediate state) of a foldable electronic device (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure.

[0023] FIG. 2C is a perspective view showing a third state (e.g., a double-folded state, a collapsed state) of a foldable electronic device (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure.

[0024] FIGS. 3 and 4 are cross-sectional views showing a first hinge portion (e.g., a narrow hinge portion) and a second hinge portion (e.g., a wide hinge portion) of a foldable electronic device (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure.

[0025] FIG. 5 is a cross-sectional view showing a first gear structure (e.g., a four-row gear structure) applied to a first hinge portion (e.g., a narrow hinge portion).

[0026] FIG. 6 is a cross-sectional view showing a second gear structure (e.g., a six-row gear structure) applied to a second hinge portion (e.g., a wide hinge portion).

[0027] FIG. 7 is an exploded view showing a first plate portion, a second plate portion, and a third plate portion of a flexible plate (e.g., a flexible plate including digitizer sensing wires) supported by a first housing, a second housing, and a third housing.

[0028] FIG. 8 is an exploded view showing a first display portion, a second display portion, and a third display portion of a foldable display (e.g., a flexible display) supported by a first housing, a second housing, and a third housing.

[0029] FIG. 9 is a drawing showing a first flexible portion (e.g., a first lattice portion, a narrow flexible portion) and a second flexible portion (e.g., a second lattice portion, a wide flexible portion) of a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure.

[0030] FIG. 10 is a drawing showing a first flexible portion (e.g., a first lattice portion, a narrow flexible portion) of a flexible plate (e.g., a flexible plate including digitizer sensing wires).

[0031] FIG. 11 is a drawing showing a first flexible portion (e.g., a first lattice portion, a narrow flexible portion) and a second flexible portion (e.g., a second lattice portion, a wide flexible portion) of a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure.

[0032] FIG. 12A is a drawing showing digitizer sensing wires of a flexible plate (e.g., a flexible plate including digitizer sensing wires) and a printed circuit board (e.g., a printed board assembly (PBA)) according to one embodiment of the present disclosure.

[0033] FIG. 12b is a drawing showing x-axis sensing channels formed by x-axis sensing wires arranged on a flexible plate and y-axis sensing channels formed by y-axis sensing wires.

[0034] FIG. 13 is a drawing showing a stacked structure of digitizer sensing wires arranged on a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure.

[0035] FIG. 14A is a drawing showing digitizer sensing wires arranged on a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure and the sensing wires passing through a first flexible portion (e.g., a narrow flexible portion).

[0036] FIG. 14b is a drawing showing digitizer sensing wires arranged on a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure and the sensing wires passing through a second flexible portion (e.g., a wide flexible portion).

[0037] FIG. 15A is a drawing showing that sensing wires are arranged to avoid slits formed in a first flexible portion (e.g., a first lattice portion, a narrow flexible portion) or a second flexible portion (e.g., a second lattice portion, a wide flexible portion).

[0038] FIG. 15b is a drawing showing that sensing wires arranged on a second flexible portion (e.g., a wide flexible portion) of a flexible plate are electrically connected by vias.

[0039] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims. While it includes numerous specific details to aid understanding, these are to be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations can be made to the various embodiments described herein without departing from the scope of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0040] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to facilitate a clear and consistent understanding of this document. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only and is not intended to limit this document as defined by the appended claims.

[0041] Singular forms should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to "component surfaces" may include reference to one or more of such surfaces.

[0042] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0043] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0044] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0045] According to one embodiment, the auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., the display module (160), the sensor module (176), or the communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0046] According to one embodiment, the memory (130) may store various data used by at least one component (e.g., the processor (120) or the sensor module (176)) of the electronic device (101). The data may include, for example, software (e.g., the program (140)) and input data or output data for commands related thereto. The memory (130) may include a volatile memory (132) or a non-volatile memory (134).

[0047] According to one embodiment, the program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0048] According to one embodiment, the input module (150) may receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0049] In one embodiment, the audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0050] In one embodiment, the display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0051] According to one embodiment, the audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), or output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0052] According to one embodiment, the sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0053] According to one embodiment, the interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0054] According to one embodiment, the connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] In one embodiment, the haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0056] In one embodiment, the camera module (180) can capture still images and moving images. In one embodiment, the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.

[0057] According to one embodiment, the power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0058] In one embodiment, the battery (189) can power at least one component of the electronic device (101). In one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] According to one embodiment, the communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0060] According to one embodiment, the wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0061] According to one embodiment, the antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0062] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0063] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0064] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0065] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0066] It should be understood that the embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0067] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0068] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0069] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0070] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0071] According to one embodiment, the display module (160) may include a foldable display (e.g., a flexible display) configured to be foldable or unfoldable.

[0072] For example, a foldable display may be folded once, dividing the entire surface into two areas. If the foldable display is folded once, the foldable electronic device may include a single hinge.

[0073] For example, a foldable display can be folded twice, dividing the entire surface into three areas. If the foldable display is folded once, the foldable electronic device may include two hinges.

[0074] The electronic device (101) of FIG. 1 may include a touch circuit including a touch sensor and a touch sensor IC (integrated circuit).

[0075] The electronic device (101) of FIG. 1 may include an electronic pen (e.g., a stylus pen) and a flexible plate (e.g., a digitizer flexible plate) including digitizer sensing wires.

[0076] FIG. 2A is a diagram illustrating a first state (e.g., unfolded state, expanded state) of a foldable electronic device (e.g., multi-foldable electronic device) according to one embodiment of the present disclosure.

[0077] FIG. 2b is a diagram illustrating a second state (e.g., a first folded state, an intermediate state) of a foldable electronic device (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure.

[0078] FIG. 2C is a diagram illustrating a third state (e.g., a double-folded state, a collapsed state) of a foldable electronic device (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure.

[0079] A foldable electronic device (e.g., a multi-foldable electronic device) according to an embodiment of the present disclosure of FIGS. 2A to 2C may include at least a portion of the electronic device (101) of FIG. 1.

[0080] Referring to FIGS. 2A to 2C , a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to an embodiment of the present disclosure may include a housing structure (210), a foldable display (220) (e.g., a flexible display), a plurality of hinge portions (230), and a flexible plate (e.g., the flexible plate (240) of FIGS. 7 and 9 ). For example, the flexible plate (240) may include digitizer sensing wires (e.g., the digitizer sensing wires 1221 and 1222 of FIG. 12A ). A description of the flexible plate (240) will be described later with reference to FIGS. 7 to 15 .

[0081] For example, a flexible plate (240) and a foldable display (220) may be placed in the internal space of a housing structure (210). The foldable display (220) may be supported by the housing structure (210) and the flexible plate (240).

[0082] For example, a foldable electronic device (200) (e.g., a multi-foldable electronic device) may have a housing structure (210) formed so that it can be folded twice. The housing structure (210) may include a first housing (211), a second housing (212), and a third housing (213).

[0083] For example, the foldable display (220) may include a first display portion (221, first display area), a second display portion (222, second display area), and a third display portion (223, third display area).

[0084] For example, a first display portion (221, first display area) of a foldable display (220) may be placed in the internal space of a first housing (211). The first display portion (221, first display area) of the foldable display (220) may be supported by the first housing (211).

[0085] For example, a second display portion (222, second display area) of a foldable display (220) may be placed in the internal space of a second housing (212). The second display portion (222, second display area) of the foldable display (220) may be supported by the second housing (212).

[0086] For example, a third display portion (223, third display area) of a foldable display (220) may be placed in the internal space of a third housing (213). The third display portion (223, third display area) of a foldable display (220) may be supported by the third housing (213).

[0087] For example, the plurality of hinge portions (230) may include a first hinge portion (231) (e.g., a narrow hinge portion) and a second hinge portion (232) (e.g., a wide hinge portion).

[0088] For example, a first hinge portion (231) (e.g., a narrow hinge portion) may be disposed between the first housing (211) and the second housing (212) so that the first housing (211) and the second housing (212) can be folded or unfolded. A first side of the first hinge portion (231) (e.g., the narrow hinge portion) may be connected to the first housing (211), and a second side of the first hinge portion (231) (e.g., the narrow hinge portion) may be connected to the second housing (212).

[0089] For example, a second hinge portion (232) (e.g., a wide hinge portion) may be disposed between the second housing (212) and the third housing (213) so that the second housing (212) and the third housing (213) can be folded or unfolded. A first side of the second hinge portion (232) (e.g., the wide hinge portion) may be connected to the second housing (212), and a second side of the second hinge portion (232) (e.g., the wide hinge portion) may be connected to the third housing (213).

[0090] According to one embodiment, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure may have a first state (e.g., an unfolded state, an expanded state), wherein the first housing (211), the second housing (212), and the third housing (213) are all unfolded.

[0091] For example, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure may be in an unfolded state (e.g., a first state, an expanded state). For example, as illustrated in FIG. 2A, a first display portion (221, a first display area), a second display portion (222, a second display area), and a third display portion (223, a third display area) of a foldable display (220) may all unfold to maximize the screen size.

[0092] According to one embodiment, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure can be in a second state (e.g., a first folded state, an intermediate state).

[0093] For example, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure may be folded so that the first housing (211) and the second housing (212) are brought into close proximity by the first hinge portion (231) (e.g., a narrow hinge portion), as illustrated in FIG. 2B. In the present disclosure, a state in which the first housing (211) and the second housing (212) are folded so that the first housing (211) and the second housing (212) are brought into close proximity by the first hinge portion (231) (e.g., a narrow hinge portion) may be defined as a primary folding state.

[0094] For example, when the foldable electronic device (200) (e.g., multi-foldable electronic device) according to one embodiment of the present disclosure is in a second state (e.g., a state folded once, an intermediate state), the first display portion (221, first display area) and the second display portion (222, second display area) of the foldable display (220) may be arranged to be close to each other (e.g., to be in contact with each other).

[0095] According to one embodiment, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure can be in a third state (e.g., a twice-folded state, a collapsed state).

[0096] For example, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure may be folded in a primary folding state in which a first housing (211) and a second housing (212) are folded so that they are close to each other by a first hinge portion (231) (e.g., a narrow hinge portion), and further folded in a secondary folding state in which a second housing (212) and a third housing (213) are folded so that they are close to each other by a second hinge portion (232) (e.g., a wide hinge portion). In the present disclosure, a secondary folding state in which the second housing (212) and the third housing (213) are folded so that they are close to each other by the second hinge portion (232) (e.g., a wide hinge portion) may be defined as a secondary folding state. For example, the third display portion (223, third display area) of the foldable display (220) may be positioned so as to be close to (e.g., in contact with) the back surface (221a) (e.g., the back) of the first housing (211).

[0097] FIGS. 3 and 4 are drawings showing a first hinge portion (e.g., a narrow hinge portion) and a second hinge portion (e.g., a wide hinge portion) of a foldable electronic device (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure.

[0098] Referring to FIGS. 3 and 4, when a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the disclosure is in a secondary folding state, the first housing (211) may be positioned between the second housing (212) and the third housing (213).

[0099] According to one embodiment, when the foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure is in a first folding state (see FIG. 2b), the foldable display (220) can be folded once.

[0100] For example, the first hinge portion (231, narrow hinge portion) may be formed to have a relatively narrow width (e.g., narrower width than the second hinge portion (232)) by connecting the first housing (211) and the second housing (212) to each other.

[0101] For example, when a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure is in a first folding state, a first display portion (221, first display area) and a second display portion (222, second display area) of a foldable display (220) may be folded and placed close to each other (e.g., substantially touching each other).

[0102] For example, looking at the first folding area (201, narrow folding portion), the first display portion (221, first display area) and the second display portion (222, second display area) folded may have a dumbbell shape (201a). The first folding area (201, narrow folding portion) may have a relatively narrower width than the second folding area (202, wide folding portion). The first folding area (201, narrow folding portion) may have the first display portion (221, first display area) and the second display portion (222, second display area) folded at a relatively narrow width. In order to prevent damage to the foldable display (220) when in the first folding state, the first display portion (221, first display area) and the second display portion (222, second display area) can be folded into a dumbbell shape (201a).

[0103] According to one embodiment, when the foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure is in a secondary folding state (see FIG. 2c), the foldable display (220) can be folded twice.

[0104] For example, the second hinge portion (232, wide hinge portion) may be formed to have a relatively wide width (e.g., a wide width compared to the first hinge portion (231)) by connecting the second housing (212) and the third housing (213) to each other.

[0105] For example, when a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure is in a secondary folding state, the second housing (212) and the third housing (213) may be folded so as to be close to each other by the second hinge portion (232) (e.g., a wide hinge portion). For example, since the secondary folding is performed after the primary folding, the secondary folding state may include the primary folded state.

[0106] For example, looking at the secondary folding area (202, wide folding portion), the folded portion of the second display portion (222, second display area) and the third display portion (223, third display area) may have a “U” shape (202a). The secondary folding area (202, wide folding portion) may have a relatively wider width than the primary folding area (201, narrow folding portion). In the secondary folding area (202, wide folding portion), the second display portion (222, second display area) and the third display portion (223, third display area) may be folded at a relatively wider width. When in the secondary folding state, the second display portion (222, second display area) and the third display portion (223, third display area) may be folded to have a “U” shape (202a).

[0107] FIG. 5 is a drawing showing a first gear structure (e.g., a four-row gear structure) applied to a first hinge portion (e.g., a narrow hinge portion).

[0108] Referring to FIGS. 3, 4, and 5, according to one embodiment, a first hinge portion (231) (e.g., a narrow hinge portion) of a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure may be formed to have a relatively narrower width than a second hinge portion (e.g., a wide hinge portion, the second hinge portion (232) of FIG. 6) by connecting the first housing (211) and the second housing (212) to each other.

[0109] For example, the first hinge portion (231) (e.g., narrow hinge portion) may include a first gear structure (510) (e.g., a four-row gear structure) so that the first housing (211) and the second housing (212) can be folded and unfolded. In FIG. 5, the first hinge portion (231) (e.g., narrow hinge portion) is illustrated as including a four-row gear structure. However, the present invention is not limited thereto, and the number of gear structures constituting the first hinge portion (231) (e.g., narrow hinge portion) may be changed according to the size of the hinge area. For example, the first hinge portion (231) (e.g., narrow hinge portion) may include a two-row gear structure, a three-row gear structure, or a five-row gear structure.

[0110] According to one embodiment, the first hinge portion (231) (e.g., a narrow hinge portion) may include a first center bar (520) that supports the folded portion when the first housing (211) and the second housing (212) are folded.

[0111] FIG. 6 is a drawing showing a second gear structure (e.g., a six-row gear structure) applied to a second hinge portion (e.g., a wide hinge portion).

[0112] Referring to FIGS. 3, 4, and 6, according to one embodiment, a second hinge portion (232) (e.g., a wide hinge portion) of a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure may be formed to have a relatively wide width by connecting the second housing (212) and the third housing (213) to each other.

[0113] For example, the second hinge portion (232) (e.g., a wide hinge portion) may include a second gear structure (530) (e.g., a six-row gear structure) so that the second housing (212) and the third housing (213) can be folded and unfolded.

[0114] According to one embodiment, the second hinge portion (232) (e.g., a wide hinge portion) may include a second center bar (540) that supports the folded portion when the first housing (211) and the second housing (212) are folded.

[0115] FIG. 7 is a drawing showing a first plate portion, a second plate portion, and a third plate portion of a flexible plate (e.g., a flexible plate including digitizer sensing wires) supported by a first housing, a second housing, and a third housing.

[0116] FIG. 8 is a drawing showing a first display portion, a second display portion, and a third display portion of a foldable display (e.g., a flexible display) supported by a first housing, a second housing, and a third housing.

[0117] Referring to FIGS. 7 and 8, according to one embodiment, a foldable electronic device (e.g., a foldable electronic device (200) of FIG. 4, a multi-foldable electronic device) according to one embodiment of the present disclosure may include a housing structure (210), a foldable display (220) (e.g., a flexible display), a plurality of hinge portions (230) or hinges, and a flexible plate (240).

[0118] For example, a first plate portion (241) of a flexible plate (240) may be placed in the internal space of a first housing (211) of a housing structure (210). A first display portion (e.g., the first display portion (221) of FIG. 2A) of a foldable display (220) may be placed in the internal space of the first housing (211) of the housing structure (210). The first display portion (221) of the foldable display (220) may be placed on the first plate portion (241) of the flexible plate (240) so that the first display portion (221) may be supported. FIG. 7 illustrates a rear surface (221a) (e.g., a back surface) of the first display portion.

[0119] For example, a second plate portion (242) of a flexible plate (240) may be placed in the internal space of a second housing (212) of a housing structure (210). A second display portion (e.g., the second display portion (222) of FIG. 2A) of a foldable display (220) may be placed in the internal space of the second housing (212) of the housing structure (210). The second display portion (222) of the foldable display (220) may be placed on the second plate portion (242) of the flexible plate (240) so that the second display portion (222) may be supported. FIG. 7 illustrates a rear surface (222a) (e.g., a back surface) of the second display portion (222).

[0120] For example, a third plate portion (243) of a flexible plate (240) may be placed in the internal space of a third housing (213) of a housing structure (210). A third display portion (e.g., the third display portion (223) of FIG. 2A) of a foldable display (220) may be placed in the internal space of the third housing (213) of the housing structure (210). The third display portion (223) of the foldable display (220) may be placed on the third plate portion (243) of the flexible plate (240) so that the third display portion (223) may be supported. FIG. 7 illustrates a rear surface (223a) (e.g., a back surface) of the third display portion.

[0121] According to one embodiment, the flexible plate (240) may include digitizer sensing wires (e.g., digitizer sensing wires (1221, 1222) of FIG. 12A). For example, the digitizer sensing wires (1221, 1222) may be formed inside the flexible plate (240) and thus may not be visible from the outside.

[0122] According to one embodiment, the flexible plate (240) may include a first plate portion (241), a second plate portion (242), a third plate portion (243), a first flexible portion (244) (e.g., a first support plate, a first lattice portion, a narrow flexible portion), and a second flexible portion (245) (e.g., a second support plate, a second lattice portion, a wide flexible portion).

[0123] For example, the first plate portion (241) may be formed as a flat plate so as to support the first display portion (221) of the foldable display (220).

[0124] For example, the second plate portion (242) may be formed as a flat plate so as to support the second display portion (222) of the foldable display (220).

[0125] For example, the third plate portion (243) may be formed as a flat plate so as to support the third display portion (223) of the foldable display (220).

[0126] For example, a first flexible portion (244) (e.g., a first lattice portion, a narrow flexible portion) may be placed between the first plate portion (241) and the second plate portion (242).

[0127] For example, a first flexible portion (244) (e.g., a first lattice portion, a narrow flexible portion) may be positioned at a portion corresponding to the first hinge portion (231).

[0128] For example, a second flexible portion (245) (e.g., a second lattice portion, a wide flexible portion) may be positioned at a portion corresponding to the second hinge portion (232).

[0129] For example, a second flexible portion (245) (e.g., a second lattice portion, a wide flexible portion) may be placed between the second plate portion (242) and the third plate portion (243).

[0130] For example, a second flexible portion (245) (e.g., a second lattice portion, a wide flexible portion) may be positioned at a portion corresponding to the second hinge portion (232).

[0131] FIG. 9 is a drawing showing a first flexible portion (e.g., a first lattice portion, a narrow flexible portion) and a second flexible portion (e.g., a second lattice portion, a wide flexible portion) of a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure.

[0132] Referring to FIGS. 3, 8, and 9, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present disclosure may include a flexible plate (240) (e.g., a flexible plate including digitizer sensing wires).

[0133] According to one embodiment, a first flexible portion (244) (e.g., a first lattice portion, a narrow flexible portion) of a flexible plate (240) (e.g., a flexible plate including digitizer sensing wires) may be formed to be flexible so that the first display portion (221) and the second display portion (222) of the foldable display (220) can be folded and unfolded.

[0134] For example, the first flexible portion (244) (e.g., the first lattice portion, the narrow flexible portion) may include first slits (244a).

[0135] For example, the first flexible portion (244) (e.g., the first lattice portion, the narrow flexible portion) may have first slits (244a) arranged in a lattice shape at regular intervals. The first slits (244a) may be arranged in one group.

[0136] [For example, the first flexible portion (244) (e.g., the first lattice portion, the narrow flexible portion) may be formed to a certain width (e.g., about 5 mm, or at least 3 mm, at most 4 mm, at most 5 mm, at most 6 mm, or at most 7 mm).

[0137] According to one embodiment, a second flexible portion (245) (e.g., a second lattice portion, a wide flexible portion) of a flexible plate (240) (e.g., a flexible plate including digitizer sensing wires) may be formed to be flexible so that the second display portion (222) and the third display portion (223) of the foldable display (220) can be folded and unfolded.

[0138] For example, the second flexible portion (245) (e.g., the second lattice portion, the wide flexible portion) may include second slits (245a).

[0139] For example, the second flexible portion (245) (e.g., the second lattice portion, the wide flexible portion) may have second slits (245a) arranged in a lattice shape at regular intervals. The second slits (245a) may be arranged in one group or two groups. FIG. 9 illustrates an example where the second slits (245a) are arranged in two groups.

[0140] For example, the second flexible portion (245) (e.g., the second lattice portion, the wide flexible portion) may be formed to a certain width (e.g., about 10 mm, or at least 8 mm or more, and at most 9 mm, 10 mm, 11 mm, or 12 mm or less).

[0141] For example, the first flexible portion (244) of the flexible plate (240) may include a flat portion in which no slits (e.g., lattices) are formed.

[0142] For example, the second flexible portion (245) of the flexible plate (240) may include a flat portion (245b) (e.g., the flat area (1013) or flat portion of FIG. 10) in which no slits (e.g., lattices) are formed.

[0143] FIG. 10 is a drawing showing a second flexible portion (e.g., a second lattice portion, a wide flexible portion) of a flexible plate (e.g., a flexible plate including digitizer sensing wires).

[0144] Referring to FIG. 10, according to one embodiment, a flexible plate (1000) (e.g., a flexible plate including digitizer sensing wires) may include a second flexible portion (1010) (e.g., a second lattice portion, a wide flexible portion).

[0145] For example, the second flexible portion (1010) (e.g., the second lattice portion, the wide flexible portion) may include second slits (245a). For example, the second slits (245a) may be arranged in a lattice shape at a predetermined interval. For example, the second flexible portion (1010) (e.g., the second lattice portion, the wide flexible portion) may be formed to have a predetermined width (e.g., about 10 mm to 12 mm, or at least 8 mm or more, and at most 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, or 14 mm or less).

[0146] For example, the second slits (245a) may be arranged to be divided into a first region (1011, or first group) and a second region (1012, or second group). The first region (1011, or first group) and the second region (1012, or second group) may be arranged at a certain interval. The first region (1011, or first group) and the second group (1012) may be formed to have a certain width (e.g., about 4 mm, at least 2 mm or more, or at most 3 mm, 4 mm, 5 mm, or 6 mm).

[0147] For example, a planar area (1013, or planar portion) (e.g., plate portion) in which no second slits (245a) are formed may be disposed between the first area (1011, or first group) and the second area (1012, or second group). The planar area (1013, or planar portion) may be formed with a certain width (e.g., about 2 to 4 mm, at least 1 mm or more, or at most 2 mm, 3 mm, 4 mm, 5 mm, or 6 mm or less). For example, a plurality of vias (e.g., a plurality of vias (1590) of FIG. 15) may be formed in a planar area (1013, or planar portion) (e.g., a plate portion) to electrically connect sensing wires formed in different layers (e.g., x-axis sensing wires (1221), y-axis sensing wires (1222) of FIG. 12a, x-axis sensing wires (1410) of FIG. 14).

[0148] For example, a center bar may be positioned to correspond to a planar area (1013, or planar portion) of a second flexible portion (1010) (e.g., a second lattice portion, a wide flexible portion).

[0149] FIG. 11 is a drawing showing a first flexible portion (e.g., a first lattice portion, a narrow flexible portion) and a second flexible portion (e.g., a second lattice portion, a wide flexible portion) of a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure.

[0150] Referring to FIG. 11, a foldable electronic device according to one embodiment of the present disclosure (e.g., a foldable electronic device (200, multi-foldable electronic device) of FIG. 3) may include a flexible plate (1100) (e.g., a flexible plate including digitizer sensing wires).

[0151] According to one embodiment, a flexible plate (1100) (e.g., a flexible plate including digitizer sensing wires) may include a first plate portion (1101), a second plate portion (1102), a third plate portion (1103), a first flexible portion (1104) (e.g., a first lattice portion, a narrow flexible portion), and a second flexible portion (1105) (e.g., a second lattice portion, a wide flexible portion).

[0152] For example, the flexible plate (1100) may include digitizer sensing wires (e.g., x-axis sensing wires (1221) and y-axis sensing wires (1222) of FIG. 12A).

[0153] For example, a first flexible portion (1104) (e.g., a first lattice portion, a narrow flexible portion) may be positioned at a portion corresponding to a first hinge portion (e.g., the first hinge portion (231) of FIG. 7).

[0154] For example, a second flexible portion (1105) (e.g., a second lattice portion, a wide flexible portion) may be positioned at a portion corresponding to a second hinge portion (e.g., the second hinge portion (232) of FIG. 7).

[0155] For example, the first plate portion (1101) may be formed as a flat plate so as to support the first display portion (e.g., the first display portion (221) of FIG. 3) of the foldable display (e.g., the foldable display (220) of FIG. 3).

[0156] For example, the second plate portion (1102) may be formed as a flat plate so as to support the second display portion of the foldable display (220) (e.g., the second display portion (222) of FIG. 3).

[0157] For example, the third plate portion (1103) may be formed as a flat plate so as to support the third display portion of the foldable display (220) (e.g., the third display portion (223) of FIG. 3).

[0158] For example, a first flexible portion (1104) (e.g., a first lattice portion, a narrow flexible portion) may be placed between the first plate portion (1101) and the second plate portion (1102).

[0159] For example, a first flexible portion (1104) (e.g., a first lattice portion, a narrow flexible portion) may be positioned at a portion corresponding to the first hinge portion (231).

[0160] For example, a second flexible portion (1105) (e.g., a second lattice portion, a wide flexible portion) may be placed between the second plate portion (1102) and the third plate portion (1103).

[0161] For example, a second flexible portion (1105) (e.g., a second lattice portion, a wide flexible portion) may be positioned at a portion corresponding to the second hinge portion (232).

[0162] According to one embodiment, the first flexible portion (1104) (e.g., the first lattice portion, the narrow flexible portion) may be formed flexibly so that the first display portion (221) and the second display portion (222) of the foldable display (220) can be folded and unfolded.

[0163] For example, to enable smooth folding and unfolding of the first flexible portion (1104) (e.g., the first lattice portion, the narrow flexible portion), the first flexible portion (1104) (e.g., the first lattice portion, the narrow flexible portion) may include first slits (1104a).

[0164] For example, the first flexible portion (1104) (e.g., the first lattice portion, the narrow flexible portion) may have first slits arranged in a lattice shape at regular intervals. The first slits (1104a) may be arranged in one group.

[0165] According to one embodiment, at least a portion of a first flexible portion (1104) (e.g., a first lattice portion, a narrow flexible portion) of a flexible plate (240) (e.g., a flexible plate including digitizer sensing wires) may be formed to a thinner thickness than the first plate portion (1211) and / or the second plate portion (1212).

[0166] According to one embodiment, a second flexible portion (1105) (e.g., a second lattice portion, a wide flexible portion) of a flexible plate (240) (e.g., a flexible plate including digitizer sensing wires) may be formed to be flexible so that the second display portion (222) and the third display portion (223) of the foldable display (220) can be folded and unfolded.

[0167] For example, to enable smooth folding and unfolding of the second flexible portion (1105) (e.g., the second lattice portion, the wide flexible portion), the second flexible portion (1105) (e.g., the second lattice portion, the wide flexible portion) may include second slits (1105a).

[0168] For example, the second flexible portion (1105) (e.g., the second lattice portion, the wide flexible portion) may have second slits arranged in a lattice shape at regular intervals. The second slits (1105a) may be arranged in one group.

[0169] For example, the first flexible portion (1104) (e.g., the first support plate, the first lattice portion, the narrow flexible portion) can be formed to have a certain width (e.g., about 5 mm, at least 3 mm, or at most 4 mm, 5 mm, 6 mm, or 7 mm or less).

[0170] For example, the second flexible portion (1105) (e.g., the second support plate, the second lattice portion, the wide flexible portion) may be formed to have a certain width (e.g., about 10 mm, at least 8 mm, or at most 9 mm, 10 mm, 11 mm, or 12 mm).

[0171] According to one embodiment, at least a portion of the second flexible portion (1105) (e.g., the second lattice portion, the wide flexible portion) of the flexible plate (240) (e.g., the flexible plate including the digitizer sensing wires) may be formed to a thinner thickness than the second plate portion (1212) and / or the third plate portion (1213).

[0172] FIG. 12A is a drawing showing digitizer sensing wires of a flexible plate (e.g., a flexible plate including digitizer sensing wires) and a printed circuit board (e.g., a printed board assembly (PBA)) according to one embodiment of the present disclosure.

[0173] FIG. 12b is a drawing showing x-axis sensing channels formed by x-axis sensing wires arranged on a flexible plate and y-axis sensing channels formed by y-axis sensing wires.

[0174] Referring to FIGS. 12A and 12B , a foldable electronic device (200) according to an embodiment of the present disclosure (e.g., the foldable electronic device (200) of FIG. 3 , a multi-foldable electronic device) may include a flexible plate (1200) (e.g., a flexible plate including digitizer sensing wires), a plurality of printed circuit boards (1230, 1240, 1250) (e.g., a plurality of PBAs (printed board assemblies), and a plurality of FPCBs (1260, 1270, 1280, flexible printed circuit boards).

[0175] According to one embodiment, the plurality of printed circuit boards (1230, 1240, 1250) may include a first printed circuit board (1230), a second printed circuit board (1240), and a third printed circuit board (1250).

[0176] For example, the first printed circuit board (1230) may include a processor (1232) (e.g., processor (120) of FIG. 1) for driving a foldable electronic device (200, multi-foldable electronic device) and electronic components.

[0177] For example, the second printed circuit board (1240) may include a digitizer control circuit (1242, electromagnetic resonance (EMR) control IC).

[0178] For example, the third printed circuit board (1250) may include control circuits for driving a foldable electronic device (200, multi-foldable electronic device) and electronic components (1252).

[0179] For example, the plurality of FPCBs (1260, 1270, 1280) may include a first FPCB (1260), a second FPCB (1270), and a third FPCB (1280).

[0180] For example, the first FPCB (1260) can electrically connect the flexible plate (1200) and the second printed circuit board (1240). For example, the first FPCB (1260) and the flexible plate (1200) can be bonded by an anisotropic conductive film (ACF) or a hot bar. The first FPCB (1260) and the second printed circuit board (1240) can be electrically connected by a board-to-board connector.

[0181] For example, the second FPCB (1270) can electrically connect the first printed circuit board (1230) and the second printed circuit board (1240).

[0182] For example, the third FPCB (1280) can electrically connect the second printed circuit board (1240) and the third printed circuit board (1250).

[0183] According to one embodiment, the flexible plate (1200) may include a first plate portion (1211) (e.g., the first plate portion (241) of FIG. 7), a second plate portion (1212) (e.g., the second plate portion (242) of FIG. 7), a third plate portion (1213) (e.g., the third plate portion (243) of FIG. 7), a first flexible portion (1214) (e.g., the first flexible portion (244) of FIG. 7), and a second flexible portion (1215) (e.g., the second flexible portion (245) of FIG. 7).

[0184] According to one embodiment, the flexible plate (1200) may include a plurality of digitizer sensing wires (1221, 1222).

[0185] For example, the digitizer sensing wires (1221, 1222) may include x-axis sensing wires (1221) arranged in a first direction (e.g., x-axis direction) to form a loop, and y-axis sensing wires (1222) arranged in a second direction (e.g., y-axis direction) to form a loop.

[0186] For example, x-axis sensing channels (1223) can be formed by x-axis sensing wires (1221) arranged on a flexible plate (1200). For example, the x-axis sensing wires (1221) can be arranged to correspond to the number of x-axis sensing channels (1223) of the digitizer (e.g., x:1 to 23 ch).

[0187] For example, the x-axis sensing wires (1221) may be arranged in a first direction (e.g., in the x-axis direction) from the first plate portion (1211) to the third plate portion (1213). Each of the x-axis sensing wires (1221) may be arranged to cross the first plate portion (1211), the first flexible portion (1214), the second plate portion (1212), the second flexible portion (1215), and the third plate portion (1213) in the first direction (e.g., in the x-axis direction).

[0188] For example, the first terminal of the x-axis sensing wires (1221) can be electrically connected to the x-axis output terminal of the digitizer control circuit (1242). The second terminal of the x-axis sensing wires (1221) can be electrically connected to the x-axis input terminal of the digitizer control circuit (1242).

[0189] For example, the digitizer control circuit (1242) can supply an x-axis sensing signal to the x-axis sensing wires (1221) in a time-division manner. The digitizer control circuit (1242) can receive an x-axis sensing signal passing through a loop of the x-axis sensing wires (1221) in a time-division manner.

[0190] For example, y-axis sensing channels (1224) can be formed by y-axis sensing wires (1222) arranged on a flexible plate (1200). For example, the y-axis sensing wires (1222) can be arranged to correspond to the number of y-axis sensing channels (1224) of the digitizer (e.g., y: 1 to 32 ch).

[0191] For example, the y-axis sensing wires (1222) can be distributed and arranged on the first plate portion (1211), the second flexible portion (1215), and the third plate portion (1213). For example, the y-axis sensing channels (1224) (e.g., y:1 to 32 ch) can be sprayed and arranged on the first plate portion (1211), the second plate portion (1212), and the third plate portion (1213).

[0192] For example, among the y-axis sensing wires (1222), the first y-axis sensing wires may be placed on the first plate portion (1211).

[0193] For example, among the y-axis sensing wires (1222), the second y-axis sensing wires may be arranged starting from the end of the first plate portion (1211) and extending to the beginning of the second plate portion (1212) via the first flexible portion (1214).

[0194] For example, among the y-axis sensing wires (1222), the third y-axis sensing wires may be arranged starting from the end of the second plate portion (1212) and extending to the beginning of the third plate portion (1213) via the second flexible portion (1215).

[0195] For example, among the y-axis sensing wires (1222), the fourth y-axis sensing wires may start at the beginning of the third plate portion (1213) and be arranged to the end of the third plate portion (1213).

[0196] For example, a first terminal of each of the y-axis sensing wires (1222) may be electrically connected to a y-axis output terminal of the digitizer control circuit (1242). A second terminal of each of the y-axis sensing wires (1222) may be electrically connected to a y-axis input terminal (1232d) of the digitizer control circuit (1242).

[0197] For example, when 23 x-axis sensing channels (1223) (e.g., x-axis loops) are formed by x-axis sensing wires (1221), the y-axis length of the flexible plate (1200) may be about 150 mm, or at least 100 mm or more, and at most 110 mm, 120 mm, 130 mm, 140 mm, 150 mm, 160 mm, 170 mm, or 180 mm or less. For example, when 23 x-axis sensing channels (1223) (e.g., x-axis loops) are formed by x-axis sensing wires (1221), each of the x-axis sensing channels (1223) (e.g., x-axis loops) may be arranged at intervals of about 6.5 mm, or at least 4.5 mm, and at most 5.5 mm, 6.5 mm, 7.5 mm, or 8.5 mm.

[0198] For example, when 32 y-axis sensing channels (1224) (e.g., y-axis loops) are formed by y-axis sensing wires (1222), the x-axis length of the flexible plate (1200) may be about 205 mm, or at least 170 mm or more, and at most 175 mm, 185 mm, 195 mm, 200 mm, 205 mm, 210 mm, 215 mm, or 220 mm. For example, when 32 y-axis sensing channels (1224) (e.g., x-axis loops) are formed by y-axis sensing wires (1222), each of the y-axis sensing channels (1224) (e.g., y-axis loops) may be arranged at intervals of about 6.5 mm, or at least 4.5 mm, and at most 5.5 mm, 6.5 mm, 7.5 mm, or 8.5 mm.

[0199] FIG. 13 is a drawing (1300) showing a laminated structure of digitizer sensing wires arranged on a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure.

[0200] Referring to FIGS. 12A and 13, a flexible plate (1200) (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure may include a first wiring layer (1310), a second wiring layer (1320), a third wiring layer (1330), a first insulating layer (1340), a second insulating layer (1350), a lower substrate layer (1370), and an upper substrate layer (1380).

[0201] For example, x-axis sensing wires (1221) and y-axis sensing wires (1222) may be arranged on the flexible plate (1200). Since both the x-axis sensing wires (1221) and the y-axis sensing wires (1222) cannot be arranged on one wiring layer, the x-axis sensing wires (1221) and the y-axis sensing wires (1222) may be distributed and arranged on multiple wiring layers (1310, 1320, 1330). For example, an x-axis direction channel (e.g., an x-axis loop) may be formed with the x-axis sensing wires (1221), and a y-axis direction channel (e.g., a y-axis loop) may be formed with the y-axis sensing wires (1222).

[0202] According to one embodiment, the x-axis sensing wires (1221) and the y-axis sensing wires (1222) may be formed in different layers inside the flexible plate (1200).

[0203] For example, x-axis sensing wires (1221) may be arranged in the first wiring layer (1310). Not limited thereto, y-axis sensing wires (1222) may also be arranged in the first wiring layer (1310).

[0204] For example, y-axis sensing wires (1222) may be arranged in the second wiring layer (1320). Not limited thereto, x-axis sensing wires (1221) may also be arranged in the second wiring layer (1320).

[0205] For example, x-axis sensing wires (1221) or y-axis sensing wires (1222) may be arranged in the third wiring layer (1330).

[0206] For example, the x-axis sensing wires (1221) and the y-axis sensing wires (1222) may be formed of a conductive metal (e.g., copper (Cu)).

[0207] For example, other wires other than the x-axis sensing wires (1221) and the y-axis sensing wires (1222) may be placed in the third wiring layer (1330).

[0208] For example, a first insulating layer (1340) may be placed between the first wiring layer (1310) and the second wiring layer (1320).

[0209] For example, a second insulating layer (1350) may be placed between the second wiring layer (1320) and the third wiring layer (1330).

[0210] For example, the first wiring layer (1310) can be bonded to the lower substrate layer (1370) and the first insulating layer (1340) by the first insulating adhesive layer (1361).

[0211] For example, the second wiring layer (1320) can be bonded to the first insulating layer (1340) and the second insulating layer (1350) by the second insulating adhesive layer (1362).

[0212] For example, the third wiring layer (1330) can be bonded to the second insulating layer (1350) and the upper substrate layer (1380) by the third insulating adhesive layer (1363).

[0213] In Fig. 13, the flexible plate (1200) is described as including three wiring layers (1310, 1320, 1330). However, the present invention is not limited thereto, and depending on the number of x-axis sensing channels and y-axis sensing channels formed in the flexible plate (1200), the flexible plate (1200) may include two or four wiring layers.

[0214] According to one embodiment, the lower substrate layer (1370) may be formed of glass fiber reinforced polymer (GFRP) as an insulating layer.

[0215] According to one embodiment, the upper substrate layer (1380) may be formed of glass fiber reinforced polymer (GFRP) as an insulating layer.

[0216] For example, a shielding sheet (e.g., a magnetic metal powder (MMP) sheet) for shielding electromagnetic signals may be placed on the lower portion of the lower substrate layer (1370). For example, a foldable display (e.g., the foldable display (220) of FIGS. 2A and 3) may be placed on the upper portion of the upper substrate layer (1380).

[0217] FIG. 14A is a drawing (1430) showing digitizer sensing wires arranged on a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure and the sensing wires passing through a first flexible portion (e.g., a narrow flexible portion).

[0218] FIG. 14B is a drawing (1440) showing digitizer sensing wires arranged on a flexible plate (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure and the sensing wires passing through a second flexible portion (e.g., a wide flexible portion).

[0219] FIG. 15A is a drawing showing that sensing wires are arranged to avoid slits formed in a first flexible portion (e.g., a first lattice portion, a narrow flexible portion) or a second flexible portion (e.g., a second lattice portion, a wide flexible portion).

[0220] Referring to FIGS. 12A, 14A, 14B, and 15A, a flexible plate (1200) applied to a multi-foldable electronic device may include a first flexible portion (1214) (e.g., a first lattice portion, a narrow flexible portion) and a second flexible portion (1215) (e.g., a second lattice portion, a wide flexible portion).

[0221] For example, the first flexible portion (1214) may correspond to the first hinge portion (e.g., the first hinge portion (231) of FIG. 2c and FIG. 7, a narrow hinge portion).

[0222] For example, the second flexible portion (1215) may correspond to a second hinge portion (e.g., the second hinge portion (232) of FIG. 2c and FIG. 7, a wide hinge portion).

[0223] According to one embodiment of the present disclosure, x-axis sensing wires (1410) (e.g., x-axis sensing wires (1221) of FIG. 12A) arranged on a flexible plate (1200) (e.g., a flexible plate including digitizer sensing wires) may be arranged to cross a first plate portion (1211), a first flexible portion (1214), a second plate portion (1212), a second flexible portion (1215), and a third plate portion (1213) in a first direction (e.g., x-axis direction).

[0224] As illustrated in FIG. 14A, first slits (1421) may be formed in the first flexible portion (1214). The portion where the first slits (1421) are formed in the first flexible portion (1214) is an empty space, so the x-axis sensing wires (1410) cannot pass in a straight line. The x-axis sensing wires (1410) may be arranged to avoid the portion where the first slits (1421) are formed in the first flexible portion (1214).

[0225] For example, in the first flexible portion (1214), the x-axis sensing wires (1410) can be arranged in a meandering shape (1411) to avoid the portion where the first slits (1421) are formed. This allows the x-axis sensing wires (1410) to pass through the first flexible portion (1214) while avoiding the slits (1421).

[0226] As illustrated in FIG. 14b, the second flexible portion (1214) (e.g., a wide flexible portion) may include second slits (1441) (e.g., the second slits (245a) of FIG. 9).

[0227] For example, the second slits (1441) may be arranged to be divided into a first region (1011, or first group) and a second region (1012, or second group). The first region (1011, or first group) and the second region (1012, or second group) may be arranged at a predetermined interval. For example, a flat region (1013, or flat portion) (e.g., plate portion) in which the second slits (1441) are not formed may be arranged between the first region (1011, or first group) and the second region (1012, or second group). The second slits (1441) may be arranged at a predetermined interval within the first region (1011, or first group) and the second region (1012, or second group).

[0228] For example, the area where the second slits (1441) are formed in the second flexible portion (1215) is an empty space, so the x-axis sensing wires (1410) cannot pass in a straight line. The x-axis sensing wires (1410) can be arranged by avoiding the area where the second slits (1441) are formed in the second flexible portion (1215).

[0229] For example, in the second flexible portion (1215), the x-axis sensing wires (1410) can be arranged in a meandering shape (1431) to avoid the portion where the second slits (1441) are formed. This allows the x-axis sensing wires (1410) to pass through the second flexible portion (1215) while avoiding the second slits (1441).

[0230] For example, a plurality of vias (1590, via) may be arranged in a planar area (1013, or planar portion) (e.g., plate portion) to electrically connect x-axis sensing wires (1410) arranged in different layers. In the description with reference to FIGS. 14A, 14B, and 15A, it was described that the x-axis sensing wires (1410) are arranged in a meandering shape (1411, 1431) by avoiding the portions where the first slits (1421) and the second slits (1441) are formed in the first flexible portion (1214) and the second flexible portion (1215).

[0231] Not limited thereto, the y-axis sensing wires (e.g., the y-axis sensing wires (1222) of FIG. 12) formed on the second wiring layer (e.g., the second wiring layer (1320) of FIG. 13) of the first flexible portion (1214) and the second flexible portion (1215) may also be arranged on the first flexible portion (1214) and the second flexible portion (1215) while avoiding the portions where the first slits (1421) and the second slits (1441) are formed.

[0232] Not limited thereto, the x-axis sensing wires (e.g., the x-axis sensing wires (1221) of FIG. 12) or the y-axis sensing wires (e.g., the y-axis sensing wires (1222) of FIG. 12) formed on the third wiring layer (e.g., the third wiring layer (1330) of FIG. 13) of the first flexible portion (1214) and the second flexible portion (1215) may also be arranged on the first flexible portion (1214) and the second flexible portion (1215) while avoiding the portions where the first slits (1421) and the second slits (1441) are formed.

[0233] FIG. 15b is a drawing showing that sensing wires arranged on a second flexible portion (e.g., a wide flexible portion) of a flexible plate are electrically connected by vias.

[0234] Referring to FIGS. 12A and 15B, a flexible plate (1200) (e.g., a flexible plate including digitizer sensing wires) according to one embodiment of the present disclosure may include a first wiring layer (1510), a second wiring layer (1520), a third wiring layer (1530), a first insulating layer (1540), a second insulating layer (1550), a lower substrate layer (1570), a solder pad (1575), and an upper substrate layer (1580).

[0235] For example, x-axis sensing wires (1221) and y-axis sensing wires (1222) may be arranged on the flexible plate (1200). Since a large number of x-axis sensing wires (1221) and y-axis sensing wires (1222) are arranged, there is a limit to arranging all wires (1221, 1222) on a single wiring layer. The x-axis sensing wires (1221) and y-axis sensing wires (1222) may be distributed and arranged on a plurality of wiring layers (1510, 1520, 1530). The x-axis sensing wires and the y-axis sensing wires may be formed on different layers within the flexible plate (1200).

[0236] As illustrated in FIG. 15b, according to one embodiment, x-axis sensing wires (1511, 1512) may be arranged in the first wiring layer (1510) in the second flexible portion (1215) (e.g., wide flexible portion). However, the present invention is not limited thereto, and y-axis sensing wires may also be arranged in the first wiring layer (1510).

[0237] For example, x-axis sensing wires (1521, 15232) may be arranged in the second wiring layer (1520) in the second flexible portion (1215) (e.g., a wide flexible portion). Not limited thereto, y-axis sensing wires may also be arranged in the second wiring layer (1520).

[0238] For example, x-axis sensing wires (1531, 1532) may be arranged in the third wiring layer (1530) in the second flexible portion (1215) (e.g., wide flexible portion). Not limited thereto, y-axis sensing wires may also be arranged in the third wiring layer (1530).

[0239] For example, the x-axis sensing wires (1511, 1512, 1521, 1522, 1531, 1532) and the y-axis sensing wires (1222) may be formed of a conductive metal (e.g., copper (Cu)).

[0240] For example, other wires other than the x-axis sensing wires (1511, 1512, 1521, 1522, 1531, 1532) and the y-axis sensing wires may be arranged in the second flexible portion (1215) (e.g., a wide flexible portion).

[0241] According to one embodiment, a first insulating layer (1540) may be disposed between the first wiring layer (1510) and the second wiring layer (1520) in the second flexible portion (1215) (e.g., a wide flexible portion).

[0242] According to one embodiment, a second insulating layer (1550) may be disposed between the second wiring layer (1520) and the third wiring layer (1530) in the second flexible portion (1215) (e.g., a wide flexible portion).

[0243] According to one embodiment, in the second flexible portion (1215) (e.g., a wide flexible portion), the first wiring layer (1510) may be bonded to the lower substrate layer (1570) and the first insulating layer (1540) by an insulating adhesive layer (1561).

[0244] According to one embodiment, in the second flexible portion (1215) (e.g., a wide flexible portion), the second wiring layer (1520) may be bonded to the first insulating layer (1540) and the second insulating layer (1550) by the second insulating adhesive layer (1562).

[0245] In one embodiment, the third wiring layer (1530) in the second flexible portion (1215) (e.g., a wide flexible portion) may be bonded to the second insulating layer (1550) and the upper substrate layer (1380) by the third insulating adhesive layer (1563).

[0246] According to one embodiment, the planar region (1013, or planar portion) (e.g., plate portion) may include a plurality of vias (1590) for selectively connecting x-axis sensing wires (1511, 1512, 1521, 1522, 1531, 1532) formed in different layers.

[0247] For example, the x-axis sensing wiring (1511) arranged on the first wiring layer (1510) and the x-axis sensing wiring (1531) arranged on the third wiring layer (1530) can be electrically connected by a first via (1591). The first via (1591) is formed to penetrate the first insulating layer (1540), the second insulating adhesive layer (1562), and the second insulating layer (1550), thereby electrically connecting the x-axis sensing wirings (1511, 1531).

[0248] For example, the x-axis sensing wiring (1521) arranged on the second wiring layer (1520) and the x-axis sensing wiring (1531) arranged on the third wiring layer (1530) can be electrically connected by a second via (1592). The second via (1592) is formed to penetrate the second insulating layer (1550), thereby electrically connecting the x-axis sensing wirings (1521, 1531).

[0249] For example, the x-axis sensing wiring (1512) arranged on the first wiring layer (1510) and the x-axis sensing wiring (1522) arranged on the second wiring layer (1520) can be electrically connected by a third via (1593). The third via (1593) is formed to penetrate the first insulating layer (1540), thereby electrically connecting the x-axis sensing wirings (1512, 1522).

[0250] In one embodiment, at least a portion of the lower substrate layer (1570) is removed to expose the x-axis sensing wiring (1512) disposed on the first wiring layer (1510), and the x-axis sensing wiring (1512) and the solder pad (1575) can be electrically connected.

[0251] For example, a first side of the solder pad (1575) may be connected to an x-axis sensing wiring (1512). A second side of the solder pad (1575) may be electrically connected to a first FPCB (e.g., a first FPCB (1260) of FIG. 12A) that is electrically connected to a flexible plate (1200).

[0252] For example, the solder pad (1575) and the x-axis sensing wiring (1512) may be bonded by an anisotropic conductive film (ACF) or a hot bar. The solder pad (1575) and the first FPCB (1260) may be bonded by an anisotropic conductive film (ACF) or a hot bar.

[0253] A foldable electronic device according to one embodiment of the present disclosure (e.g., a foldable electronic device (200) of FIGS. 2A and 3) comprises a foldable housing including a first housing part (e.g., a first housing (211) of FIGS. 2A and 3), a second housing part (e.g., a second housing (212) of FIGS. 2A and 3), and a third housing part (e.g., a third housing (213) of FIGS. 2A and 3); It may include a first hinge structure (e.g., the first hinge portion (231) of FIGS. 2A and 3) that rotatably connects the first housing part (211) and the second housing part (212), a second hinge structure (e.g., the second hinge portion (232) of FIGS. 2A and 3) that connects the second housing part (212) and the third housing part (213), a foldable display disposed on the front of the first housing part (211), the second housing part (212), and the third housing part (213), a support plate (e.g., the flexible plate (240) of FIG. 7, the flexible plate (1200) of FIG. 12A) that supports the flexible display, and a digitizer control circuit (e.g., the digitizer control circuit (1242) of FIG. 12A). The flexible display (220) may include a first folding part and a second folding part. The support plate (240) may include a first plate part (241, 1211), a second plate part (242, 1212), a third plate part (243, 1213), a first flexible part (244) that supports the first folding part of the flexible display, and a second flexible part (245) that supports the second folding part of the flexible display. The first flexible part (244) may include first slits (244a). The second flexible part (245) may include second slits (245a).The first flexible part (244) and the second flexible part (255) may include x-axis sensing wires (e.g., x-axis sensing wires (1221) of FIG. 12A) arranged in the x-axis direction in the first layer to form x-axis channels of the digitizer. The first flexible part (244) and the second flexible part (255) may include y-axis sensing wires (e.g., y-axis sensing wires (1222) of FIG. 12A) arranged in the y-axis direction orthogonal to the x-axis direction in a second layer different from the first layer to form y-axis channels of the digitizer.

[0254] According to an aspect of the present disclosure, the first plate part and the second plate part may be arranged at a predetermined distance from each other, or may be separated from each other by a flexible part (e.g., the first flexible part or the second flexible part). An advantage of this embodiment is that the plate parts can be easily moved, or for example, swivel, relative to the flexible part.

[0255] According to an aspect of the present disclosure, the first plate portion and the second plate portion can be arranged or separated from each other at a predetermined distance by the first flexible portion, and the second plate portion and the third plate portion can be arranged or separated from each other at a predetermined distance by the second flexible portion. An advantage of this aspect is that the plate portions can be easily moved, or for example, swivel, relative to the flexible portion.

[0256] According to one embodiment, the first flexible part (244) may be formed with a first width, and the second flexible part (255) may be formed with a second width wider than the first width. The first width and the second width may be aligned with a direction in which the first plate portion and the second plate portion are arranged at a constant distance from each other and / or a direction in which the second plate portion and the third plate portion are arranged at a constant distance from each other. The first slit and / or the second slit may extend perpendicular to the distance direction. The first slit and / or the second slit may extend longer in a direction perpendicular to the distance direction than a length extending along the distance direction. An advantage of this aspect is that the display can be folded in a desired manner in a structure having three sections.

[0257] According to an aspect of the present disclosure, the x-axis sensing wires can be arranged to cross the first plate portion, the second plate portion, and the flexible portion. According to an aspect of the present disclosure, the x-axis sensing wires can be arranged to cross the first plate portion, the second plate portion, the third plate portion, the first flexible portion, and the second flexible portion. According to an aspect of the present disclosure, the x-axis sensing wires can include a plurality of x-axis sensing wires. In one embodiment, each of the x-axis sensing wires can be arranged to cross the first plate portion, the second plate portion, the third plate portion, the first flexible part, and the second flexible part. An advantage of this aspect is that the digitizer can detect the pen even in the flexible portion or in a plurality of flexible portions.

[0258] According to one embodiment, each of the x-axis sensing wires may be arranged to avoid the first slits in the first flexible part, and may be arranged to avoid the second slits in the second flexible part. According to an aspect of the present disclosure, the x-axis sensing wire may be limited to a portion of the flexible part adjacent to the slit or a plurality of flexible parts. An advantage of this aspect is that wear and damage to the x-axis sensing wire due to the folding action of the electronic device may be reduced.

[0259] According to one embodiment, the y-axis sensing wires may be distributed and arranged on the first plate part, the second plate part, and the third plate part. The advantage of this aspect is that the pen can be detected more accurately through the y-axis sensing wires.

[0260] According to one embodiment, among the y-axis sensing wires, the first y-axis sensing wires may be arranged on the first plate part. According to an aspect of the present disclosure, the first y-axis sensing wire may be limited to the first plate part. An advantage of this aspect is that the first y-axis sensing wire can be easily connected to the digitizer control circuit.

[0261] According to one embodiment, among the y-axis sensing wires, the second y-axis sensing wires may be arranged on the first plate portion, the first flexible portion, and the second plate portion. According to an aspect of the present disclosure, the second y-axis sensing wires may be limited to the second plate portion. An advantage of this aspect is that the second y-axis sensing wires can be easily connected to a digitizer control circuit.

[0262] According to an aspect of the present disclosure, the second y-axis sensing wire can be arranged in the first flexible part, avoiding the first slit. According to an aspect of the present disclosure, the second y-axis sensing wire can include a plurality of second y-axis sensing wires. In one embodiment, each of the second y-axis sensing wires can be arranged in the first flexible part, avoiding the first slits. An advantage of this aspect is that wear and damage of the second y-axis sensing wire due to repeated folding can be reduced.

[0263] In one embodiment, the second y-axis sensing wire or each of the second y-axis sensing wires may be positioned in the second flexible part to avoid the second slits. This aspect has the advantage that wear and damage to the second y-axis sensing wire due to repeated folding may be reduced.

[0264] According to one embodiment, among the y-axis sensing wires, the third y-axis sensing wires may be arranged on the second plate part, the second flexible part, and the third plate part. An advantage of this aspect is that the third y-axis sensing wire can be easily connected to the digitizer control circuit.

[0265] According to an aspect of the present disclosure, the third y-axis sensing wire can be arranged in the second flexible part, avoiding the second slit. According to an aspect of the present disclosure, the third y-axis sensing wire can include a plurality of third y-axis sensing wires. According to one embodiment, each of the third y-axis sensing wires can be arranged in the second flexible part (245), avoiding the second slits (245a). An advantage of this aspect is that the third y-axis sensing wire can be easily connected to a digitizer control circuit.

[0266] According to one embodiment, among the y-axis sensing wires (1222), the fourth y-axis sensing wires may be arranged on the third plate part (243, 1213). The advantage of this aspect is that the fourth y-axis sensing wire can be easily connected to the digitizer control circuit.

[0267] In one embodiment, the second flexible portion may include a first region and a second region in which the second slits are distributed and arranged. The second flexible portion may include a planar region formed between the first region and the second region and in which no slits are formed. The advantage of this aspect is that deformation may be limited only to the section requiring deformation.

[0268] In one embodiment, the planar region may include a plurality of vias. At least some of the vias (1590) may electrically connect x-axis sensing wires (1221) or y-axis sensing wires (1222) arranged in different layers. The vias may be through holes extending at least partially through a support plate made of a conductive material or plated with a conductive material, and may electrically interconnect different layers. An advantage of this aspect is that the x-axis sensing wires or y-axis sensing wires within each layer may be connected without affecting the corresponding wires.

[0269] In one embodiment, the first slits and the second slits may be arranged in a grid pattern. This aspect has the advantage of allowing the flexibility of the flexible portion to be aligned in a desired direction.

[0270] In one embodiment of the present disclosure, an electronic device may include a foldable housing including a first housing part, a second housing part, and a third housing part, a first hinge structure rotatably connecting the first housing part and the second housing part, a second hinge structure rotatably connecting the second housing and the third housing, a flexible display disposed on a front surface of the first housing part, the second housing part, and the third housing part, and a digitizer control circuit. The support plate may include the first plate part, the second plate part, the third plate part, a first flexible part supporting a first folding part of the flexible display, and a second flexible part supporting a second folding part of the flexible display. The first flexible part may include first slits. The second flexible part may include second slits. The first flexible part and the second flexible part may include x-axis sensing wires arranged in the x-axis direction in the first layer to form x-axis channels of the digitizer. The first flexible part and the second flexible part may include y-axis sensing wires arranged in the y-axis direction orthogonal to the x-axis direction in a second layer different from the first layer to form y-axis channels of the digitizer. An advantage of this aspect is that the electronic device including the three housing parts can be folded so that it can be easily used with a pen even in a section of the foldable display that is actually deformed due to folding, i.e., a section supported by the flexible section of the support plate.

[0271] According to another aspect of the present disclosure, a support plate for supporting a foldable display of an electronic device may be provided. The support plate may include a first plate portion and a second plate portion. The support plate may include a flexible portion. The flexible portion may be configured to support a flexible portion of the flexible display. The flexible portion may be disposed between the first plate portion and the second plate portion. The flexible portion may interconnect the first plate portion and the second plate portion. The flexible portion may include a slit, for example, a first slit and / or a second slit. The flexible portion may include an x-axis wiring. The x-axis wiring may extend in the x-axis direction. The x-axis wiring may be formed in a first layer of the support plate to form an x-axis channel of a digitizer to be connected to a digitizer control circuit of the electronic device. The flexible portion may include a y-axis wiring. The y-axis wiring may extend in the y-axis direction. The y-axis direction can extend perpendicular to the x-axis direction. The y-axis wiring can be formed on the second layer of the support plate to form a y-axis channel of the digitizer to be connected to the digitizer control circuit of the electronic device. The x-axis channel and the y-axis channel can be part of the same digitizer.

[0272] The x-axis direction may be a width direction of the display. The x-axis direction may extend perpendicular to the flexible portion. The x-axis direction may extend perpendicular to the first flexible portion and / or the second flexible portion. The x-axis direction may extend from the first plate portion to the second plate portion. The x-axis direction may be a width direction of the flexible portion. The x-axis direction may be a width direction of the first flexible portion and / or the second flexible portion.

[0273] According to another aspect of the present disclosure, a foldable electronic device including a flexible display may be provided. The foldable electronic device may include a foldable housing including a first housing portion and a second housing portion. The foldable electronic device may include a hinge structure rotatably connecting the first housing portion and the second housing portion. The foldable electronic device may include a flexible display disposed on the front surfaces of the first housing portion and the second housing portion. The foldable electronic device may include a support plate supporting the flexible display. The foldable electronic device may include a digitizer control circuit. The support plate may include a first plate portion and a second plate portion. The support plate may include a flexible portion, for example, a first flexible portion or a second flexible portion. The flexible portion may support a flexible section of the flexible display. The flexible portion may be disposed between the first plate portion and the second plate portion. The flexible portion may interconnect the first plate portion and the second plate portion. The flexible portion may include slits, for example, a first slit and / or a second slit. The flexible portion may include an x-axis wiring. The x-axis wiring may extend in the x-axis direction. The x-axis wiring may be formed in a first layer of the support plate to form an x-axis channel of the digitizer that is connected to a digitizer control circuit of the electronic device. The flexible portion may include a y-axis wiring. The y-axis wiring may extend in the y-axis direction. The y-axis direction may extend perpendicular to the x-axis direction. The y-axis wiring may be formed in a second layer of the support plate to form a y-axis channel of the digitizer that is connected to a digitizer control circuit of the electronic device. The x-axis channel and the y-axis channel may be part of the same digitizer.

[0274] A foldable electronic device according to one embodiment of the present disclosure may include two hinge portions or hinges, be divided into three display portions so that the foldable display (e.g., a flexible display) can be folded twice, be divided into three digitizer portions so that the multi-separable digitizer can be folded twice, and may integrate a flexible plate for supporting the foldable display (e.g., a flexible display) and a digitizer for detecting coordinates of an electronic pen (e.g., a stylus pen).

[0275] A foldable electronic device according to one embodiment of the present disclosure can reduce the thickness of the foldable electronic device and reduce manufacturing costs by integrating a flexible plate for supporting a foldable display (e.g., a flexible display) and a digitizer for detecting coordinates of an electronic pen (e.g., a stylus pen).

[0276] A foldable electronic device according to one embodiment of the present disclosure can obtain coordinates of an electronic pen in an area corresponding to a first hinge portion (e.g., a narrow hinge portion) and a second hinge portion (e.g., a wide hinge portion).

[0277] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

Claims

1. In a foldable electronic device (200), A foldable housing comprising a first housing part (211), a second housing part (212), and a third housing part (213); A first hinge structure (231) that rotatably connects the first housing part (211) and the second housing part (212); A second hinge structure (232) that rotatably connects the second housing part (212) and the third housing part (213); A flexible display (220) arranged on the front of the first housing part (211), the second housing part (212), and the third housing part (213); A support plate (240) supporting the flexible display (220); and including a digitizer control circuit (1242); The above flexible display (220) includes a first folding part and a second folding part, The above support play (240) includes a first plate part (241, 1211), a second plate part (242, 1212), a third plate part (243, 1213), a first flexible part (244) that supports the first folding part of the flexible display; and a second flexible part (245) that supports the second folding part of the flexible display. The above first flexible part (244) includes first slits (244a), The second flexible part (245) includes second slits (245a), The first flexible part (244) and the second flexible part (255) include x-axis sensing wires (1221) arranged in the x-axis direction in the first layer of the support plate (240) to form x-axis channels of the digitizer, and y-axis sensing wires (1222) arranged in the y-axis direction orthogonal to the x-axis direction in a second layer different from the first layer to form y-axis channels of the digitizer. Foldable electronic device (200).

2. In paragraph 1, The above first flexible part (244, 1214) is formed with a first width, The above second flexible part (255, 1215) is formed with a second width wider than the first width. Foldable electronic device (200).

3. In paragraph 1 or 2, The above x-axis sensing wires (1221) are Arranged to cross the first plate part (241, 1211), the second plate part (242, 1212), the third plate part (243, 1213), the first flexible part (244, 1214) and the second flexible part (255), Foldable electronic device (200).

4. In any one of paragraphs 1 to 3, Each of the above x-axis sensing wires (1221) In the above first flexible part (244, 1214), the first slits (244a) are arranged to avoid the above, In the second flexible part (245), the second slits (245a) are arranged to avoid the second slits. Foldable electronic device (200).

5. In any one of paragraphs 1 to 4, The above y-axis sensing wires (1222) are Distributed and arranged on the first plate part (241, 1211), the second plate part (242, 1212), and the third plate part (243, 1213), Foldable electronic device (200).

6. In any one of paragraphs 1 to 5, Among the above y-axis sensing wires (1222), the first y-axis sensing wire is arranged on the first plate part (241, 1211). Foldable electronic device (200).

7. In paragraph 6, Among the above y-axis sensing wires (1222), the second y-axis sensing wires are arranged in the first plate part (241, 1211), the first flexible part (244, 1214), and the second plate part (242, 1212). Foldable electronic device (200).

8. In paragraph 7, Each of the above second y-axis sensing wires, In the first flexible part (244, 1214), the first slits (244a) are arranged to avoid the first slits. Foldable electronic devices.

9. In paragraph 7 or 8, Among the above y-axis sensing wires (1222), the third y-axis sensing wires are arranged in the second plate part (242, 1212), the second flexible part (245, 1215), and the third plate part (243, 1213). Foldable electronic device (200).

10. In paragraph 9, Each of the above third y-axis sensing wires, In the second flexible part (245, 1215), the second slits (245a) are arranged to avoid the second slits. Foldable electronic devices.

11. In paragraph 9 or 10, Among the above y-axis sensing wires (1222), the fourth y-axis sensing wires are arranged on the third plate part (243, 1213). Foldable electronic device (200).

12. In any one of paragraphs 1 to 11, The above second flexible part (245, 1215) is The first region (1011) and the second region (1012) in which the second slits (245a) are dispersed and arranged, and A planar region (1013) formed between the first region (1011) and the second region (1012) and having no slits formed therein; Foldable electronic device (200).

13. In paragraph 12, The above planar area includes a plurality of vias (1590), At least some of the vias (1590) electrically connect x-axis sensing wires (1221) or y-axis sensing wires (1222) arranged on different layers. Foldable electronic device (200).

14. In any one of paragraphs 1 to 13, The first slits (244a) and the second slits (245a) are arranged in a grid shape. Foldable electronic device (200).

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