Electronic device including antenna

Abstract

The present invention relates to an electronic device including an antenna, the electronic device comprising: a housing; a first antenna disposed inside the housing and configured to generate a signal to the outside of the housing; a support forming a portion of the housing and including a seating portion on which the first antenna is disposed; a second antenna which forms a portion of the support and is spaced apart from the first antenna in a first direction, and at least a portion of which overlaps the first antenna in a second direction perpendicular to the first direction when viewed in the first direction, so that a portion of the signal generated by the first antenna reaches the second antenna; a first support part, at least a portion of which is located in a gap formed in the first direction between the first antenna and the second antenna; and a second support part which is arranged to surround the first support part and at least a portion of which is aligned with the second antenna in the second direction.

Description

Electronic device including an antenna

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including antennas.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure comprises: a housing; a first antenna disposed inside the housing and configured to generate a signal to the outside of the housing; a support forming a portion of the housing and including a mounting portion on which the first antenna is disposed; a second antenna forming a portion of the support, spaced apart from the first antenna in a first direction, and positioned such that at least a portion overlaps the first antenna in a second direction perpendicular to the first direction when viewed in the first direction so that a portion of a signal generated from the first antenna reaches the second antenna; a first support portion, at least a portion of which is positioned within a gap formed in the first direction between the first antenna and the second antenna; and a second non-conductor disposed with at least a portion of the first support portion interposed therebetween, the second non-conductor being at least a portion aligned with the second antenna in the second direction and spaced apart from the first antenna in the first direction, wherein the first support portion comprises a first-first support portion positioned within the gap between the first antenna and the second antenna and configured to contact the second antenna in the first direction; And a 1-2 support portion configured to contact the second antenna in a third direction opposite to the first direction, such that the size of the gap between the first antenna and the second antenna in the first direction is fixed, and the second support portion may include a 2-1 support portion arranged to surround the 1-2 support portion, located between the 1-1 support portion and the 1-2 support portion, and configured to contact the second antenna in the second direction; and a 2-2 support portion configured to contact the second antenna in a fourth direction opposite to the second direction, such that the position of the second antenna in the second direction with respect to the first antenna is fixed.

[0006] An electronic device according to one embodiment of the present disclosure may include: a housing; a first antenna disposed inside the housing and configured to generate a signal to the outside of the housing; a support forming a portion of the housing and including a mounting portion on which the first antenna is disposed; a second antenna forming a portion of the support, the second antenna being spaced apart from the first antenna in a first direction and positioned to overlap the first antenna in a second direction perpendicular to the first direction; a first non-conductor at least a portion of which is positioned within a gap formed between the first antenna and the second antenna in the first direction; and a second non-conductor at least a portion of which is configured to fix a position of the second antenna relative to the first antenna in the second direction, the second non-conductor being aligned with the second antenna in the second direction.

[0007] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include: preparing a support including a mounting portion on which a first antenna is arranged and a second antenna spaced apart from the mounting portion in a first direction; manufacturing a first non-conductive body, at least a portion of which is positioned between the mounting portion and the second antenna; and manufacturing a second non-conductive body, at least a portion of which is aligned with the second antenna in a second direction perpendicular to the first direction.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is an exploded view of a portion of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 7 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 8 is a block diagram illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 9 is a drawing illustrating the manufacturing of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 10 is a part of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 11 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 12 is a part of a cross-sectional view of a mold according to one embodiment of the present disclosure.

[0021] Fig. 13 is a part of the inside of a mold according to one embodiment of the present disclosure.

[0022] FIG. 14 is a part of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 15 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0024] Fig. 16 is a part of the inside of a mold according to one embodiment of the present disclosure.

[0025] FIG. 17 is a part of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 18 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0027] Fig. 19 is a part of the inside of a mold according to one embodiment of the present disclosure.

[0028] FIG. 20 is a drawing of a portion of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 21 is a drawing illustrating the manufacturing of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 22 is a cross-sectional view of a part of an electronic device and a mold according to one embodiment of the present disclosure.

[0031] FIG. 23 is a drawing of an electronic device and a mold according to one embodiment of the present disclosure.

[0032] FIG. 24 is a drawing of a portion of an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 25 is a drawing of an electronic device and a mold according to one embodiment of the present disclosure.

[0034] FIG. 26 is a part of an electronic device according to one embodiment of the present disclosure.

[0035] FIG. 27 is a cross-sectional view of a part of an electronic device and a mold according to one embodiment of the present disclosure.

[0036] FIG. 28 is a part of an electronic device according to one embodiment of the present disclosure.

[0037] FIG. 29 is a cross-sectional view of a part of an electronic device and a mold according to one embodiment of the present disclosure.

[0038] FIG. 30 is a part of an electronic device according to one embodiment of the present disclosure.

[0039] FIG. 31 is a drawing of an electronic device and a mold according to one embodiment of the present disclosure.

[0040] FIG. 32 is a cross-sectional view of a part of an electronic device and a mold according to one embodiment of the present disclosure.

[0041] FIG. 33 is a part of an electronic device according to one embodiment of the present disclosure.

[0042] FIG. 34 is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0043] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0044] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0045] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0046] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0047] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0048] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0049] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0050] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0051] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0052] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0053] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0054] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0055] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0056] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0057] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0058] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0059] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0060] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0061] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0062] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0063] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0064] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0065] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0066] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0067] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0068] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0069] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0070] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0071] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0072] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0073] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0074] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0075] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0076] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0077] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0078] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 34.

[0079] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The back plate (211) may form the second side (210B). The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0080] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0081] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0082] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0083] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0084] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0085] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0086] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (101), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0087] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0088] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0089] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0090] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0091] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0092] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 34.

[0093] Referring to FIGS. 3 and 4, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0094] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

[0095] The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0096] In one embodiment, the housing (301) may include a first support member (311) and a side structure (310). In one embodiment, the housing (301) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and / or the rear plate (380). For example, the housing (301) may include structures forming the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and the rear plate (380). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and 3 . In one embodiment, the 'front or rear side of the housing (301)' may refer to the first side (210A) of FIG. 1 or the second side (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the rear plate (380) (e.g., the second side (210B) of FIG. 3), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0097] The memory may include, for example, volatile memory or non-volatile memory.

[0098] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0099] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another portion of the first support member (311). An additional printed circuit board not shown or a speaker module or interface arranged on the lower support member (360b) may be arranged corresponding to the audio module (207) or connector holes (208, 309) of FIG. 2.

[0100] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0101] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0102] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0103] According to one embodiment, the electronic device (101) may include camera holes (312, 313, 319). A plurality of camera holes (312, 313, 319) may be arranged spaced apart from each other. The camera assembly (307) may receive light passing through the camera holes (312, 313, 319).

[0104] In one embodiment, the first support member (311) may include a receiving portion (3111). A battery (350) may be disposed within the receiving portion (3111). The battery (350) may include a terrace (353). The terrace (353) may protrude toward the printed circuit board (340). The battery (350) may include a battery connection member (3501) connecting the terrace (353) and the printed circuit board (340).

[0105] According to one embodiment, the electronic device (101) may include a connector hole (308). The connector hole (308) may be opened in a portion of the housing (301). The connector hole (308) may be in communication with an external space of the housing (301). The electronic device (101) may be connected to an external device (e.g., a USB port, a charging cable), and the external device may be inserted into the connector hole (308).

[0106] According to one embodiment, the electronic device (101) may include an antenna (309). The antenna (309) may be positioned adjacent to the connector hole (308).

[0107] FIG. 6 is a drawing of the internal structure of the electronic device (101) with the back plate (e.g., the back plate (380) of FIG. 5) of the electronic device (101) removed. The components described with reference to FIG. 6 may be partially or entirely the same as the components described with reference to FIGS. 1 to 5. The components described with reference to FIG. 6 may be partially or entirely the same as the components described with reference to FIGS. 7 to 34.

[0108] According to one embodiment, the electronic device (101) may include a housing (400). The description of the housing (400) may be equally applicable to the description of the housing described with reference to FIGS. 1 to 5 (e.g., the housing (210) of FIG. 2 and the housing (301) of FIG. 4).

[0109] According to one embodiment, the electronic device (101) may include a circuit board (340) and a battery (350). The circuit board (340) may be disposed inside a housing (400). The battery (350) may be disposed inside the housing (400). The description of the circuit board (340) may be identically applied to the description of the circuit board (340a) described with reference to FIGS. 4 and 5. The description of the battery (350) may be identically applied to the description of the battery (350) described with reference to FIGS. 4 and 5.

[0110] According to one embodiment, the electronic device (101) may include a support (410). The support (410) may be disposed within a housing (400). The support (410) may form at least a portion of the housing (400). The support (410) may include a conductive material. The support (410) may include a metallic material. The circuit board (340) and the battery (350) may be mounted on the support (410).

[0111] In one embodiment, the electronic device (101) may include a non-conductive material (420). The non-conductive material (420) may be coupled to a support (410). The non-conductive material (420) may form a side surface of the housing (400). The non-conductive material (420) may be arranged to surround at least a portion of the support (410).

[0112] According to one embodiment, the electronic device (101) may include a first antenna (401). The first antenna (401) may be mounted on a support (410). The first antenna (401) may be electrically connected to a circuit board (340). The first antenna (401) may be configured to communicate with the outside of the electronic device (101). The first antenna (401) may be configured to transmit a signal to the outside of the electronic device (101). The first antenna (401) may be configured to receive a signal from the outside of the electronic device (101). The first antenna (401) may include a high-frequency band antenna (e.g., a mmW antenna). The first antenna (401) may include an antenna for transmitting and receiving a signal in the mmW band. The first antenna (401) may include an antenna for transmitting and receiving a signal in the 5G band. According to one embodiment, the first antenna (401) may include an array antenna.

[0113] According to one embodiment, the electronic device (101) may include a second antenna (402). The second antenna (402) may be a part of the support (410). The second antenna (402) may include a conductive material. The second antenna (402) may include a metallic material. The second antenna (402) may be electrically connected to the circuit board (340). The second antenna (402) may be spaced apart from the first antenna (401). The second antenna (402) may be configured to communicate with the outside of the electronic device (101). The second antenna (402) may be configured to transmit a signal to the outside of the electronic device (101). The second antenna (402) may be configured to receive a signal from the outside of the electronic device (101). The second antenna (402) may include a low-frequency band antenna (e.g., a Wifi antenna). The second antenna (402) may include an antenna for transmitting and receiving a Wi-Fi signal. According to one embodiment, the second antenna (402) may include an antenna for transmitting and receiving a lower frequency band than the first antenna (401).

[0114] Fig. 7 is a cross-sectional view taken along the A-A' reference line illustrated in Fig. 6. The components described with reference to Fig. 7 may be partially or entirely identical to the components described with reference to Figs. 1 to 6. The components described with reference to Fig. 7 may be partially or entirely identical to the components described with reference to Figs. 8 to 34.

[0115] According to one embodiment, the first antenna (401) and the second antenna (402) may be spaced apart from each other. The first antenna (401) and the second antenna (402) may be spaced apart in a first direction (e.g., +X direction). The first antenna (401) may be spaced apart from the second antenna (402) in the first direction. The first antenna (401) and the second antenna (402) may be spaced apart from each other by a distance D1 in the first direction. Each of the first antenna (401) and the second antenna (402) may transmit and receive signals for communication with the outside of the electronic device (101). Each of the first antenna (401) and the second antenna (402) may include a conductive material. The performance of each of the first antenna (401) and the second antenna (402) may increase when the separation distance (D1) between the first antenna (401) and the second antenna (402) in the first direction is greater than a predetermined range. The performance of each of the first antenna (401) and the second antenna (402) may decrease when the separation distance (D1) between the first antenna (401) and the second antenna (402) in the first direction is less than a predetermined range. The electronic device (101) according to the embodiment of the present disclosure can improve the performance of the first antenna (401) and the second antenna (402) by utilizing a non-conductor (420) to secure a sufficient separation distance (D1) between the first antenna (401) and the second antenna (402).

[0116] According to one embodiment, the support (410) may include a mounting portion (413). The first antenna (401) may be placed on the mounting portion (413). The first antenna (401) may be supported by the mounting portion (413).

[0117] According to one embodiment, the mounting portion (413) may include a first mounting portion (411) and a second mounting portion (412). A first side of the first antenna (401) may be supported by the first mounting portion (411), and a second side of the first antenna (401) that is different from the first side may be supported by the second mounting portion (412).

[0118] According to one embodiment, the first antenna (401) may be arranged to be inclined with respect to a first direction (e.g., +X direction). The first antenna (401) may be arranged to be inclined with respect to a second direction (e.g., +Z direction) perpendicular to the first direction. The first mounting portion (411) may extend to be inclined with respect to the second direction. The first mounting portion (411) may form a first inclination angle (A1) with respect to the second direction. The second mounting portion (412) may extend to be inclined with respect to the second direction. The second mounting portion (412) may have a second inclination angle (A2) with respect to the second direction. The first antenna (401) may be arranged to be inclined with respect to the second direction by the first mounting portion (411) and the second mounting portion (412) being inclined with respect to the second direction. The first antenna (401) can be inclined by a first inclination angle (A1) with respect to the first direction. The first antenna (401) can be inclined by a second inclination angle (A2) with respect to the second direction.

[0119] According to one embodiment, the first antenna (401) and the second antenna (402) may overlap in a second direction (e.g., +Z direction). The second antenna (402) may face at least a portion of the first antenna (401) in the first direction (e.g., +X direction). The first antenna (401) may overlap in the second direction by the portion that faces the second antenna (402) in the first direction. The first antenna (401) and the second antenna (402) may overlap in the second direction by an overlapping distance (D2). The second antenna (402) may overlap with the first antenna in the second direction when viewed from the first direction. The second antenna (402) may overlap with the inclined first antenna (401) when viewed from the first direction. The second antenna (402) may overlap a portion of the orthogonal area when the inclined first antenna (401) is orthogonally projected in the first direction. The first antenna (401) may transmit a signal (S) to the outside of the electronic device (101). Due to the inclined structure of the mounting portion (413), the first antenna (401) may transmit the signal (S) in an inclined direction with respect to the first and second directions. A portion (S1) of the signal (S) transmitted from the first antenna (401) may be reflected by the second antenna (402) within the overlapping distance (D2) with the second antenna (402) and received again by the first antenna (401). The performance of the first antenna (401) may be improved when a portion of the signal radiated from the first antenna (401) is received again by the first antenna (401). The electronic device (101) according to the embodiment of the present disclosure can improve the performance of the first antenna (401) by overlapping the first antenna (401) and the second antenna (402) in a second direction so that a portion of the signal transmitted from the first antenna (401) is reflected from the second antenna (402).

[0120] According to one embodiment, the electronic device (101) may include a non-conductive member (420). The non-conductive member (420) may be configured to maintain a separation distance (D1) between the first antenna (401) and the second antenna (402). The non-conductive member (420) may be configured to maintain an overlapping distance (D2) between the first antenna (401) and the second antenna (402). For example, a first non-conductive member (430) at least partially disposed between the first antenna (401) and the second antenna (402) may maintain the separation distance (D1) between the first antenna (401) and the second antenna (402). For example, a second non-conductive member (440) aligned with the second antenna (402) in the second direction may maintain the overlapping distance (D2) between the first antenna (401) and the second antenna (402). The first non-conductive member (430) can fix the relative positions of the first antenna (401) and the second antenna (402) in the first direction (+X direction). The second non-conductive member (440) can fix the relative positions of the first antenna (401) and the second antenna (402) in the second direction (+Z direction).

[0121] In one embodiment, the non-conductive member (420) may include a first non-conductive member (430). At least a portion of the first non-conductive member (430) may be positioned between the first antenna (401) and the second antenna (402). The first non-conductive member may be named a first support, a first support, or something substantially identical thereto.

[0122] According to one embodiment, the first non-conductor (430) may include a first-first non-conductor (431) and a first-second non-conductor (432, 433). The first-first non-conductor (431) and the first-second non-conductor (432, 433) may be formed integrally. The first-first non-conductor (431) may be positioned between the first antenna (401) and the second antenna (402). The first-second non-conductor (432, 433) may be spaced apart from the first-first non-conductor (431) in a third direction (-X direction) opposite to the first direction (+X direction). The second antenna (402) may be disposed between the first-first non-conductor (431) and the first-second non-conductor (432, 433). The first-first non-conductive body (431) can apply a force in a third direction (-X direction) to the second antenna (402). The first-second non-conductive bodies (432, 433) can apply a force in a first direction (+X direction) to the second antenna (402). The second antenna (402) can be fixed in its relative position in the first direction with respect to the first antenna (401) by the balance of the forces received from the first-first non-conductive bodies (431) and the first-second non-conductive bodies (432, 433). The first non-conductive body (or first support member) (430) can include the first-first non-conductive portion (431) and the first-second non-conductive portion (432). The first-first non-conductive body (431) can be named substantially the same as the first-first fixing portion and the first-first support member. The first-second non-conductive member (431) can be named substantially the same as the first-second fixed member and the first-second support member.

[0123] According to one embodiment, the first-second non-conductive member (432, 433) may include a first non-conductive portion (432) and a second non-conductive portion (433). The first non-conductive portion (432) and the second non-conductive portion (433) may be spaced apart from each other in the second direction (+Z direction). A portion of the second antenna (402) may be positioned between the first non-conductive portion (432) and the first-first non-conductive member (431), and the remainder of the second antenna (402) may be positioned between the second non-conductive portion (433) and the first-first non-conductive member (431).

[0124] In one embodiment, the non-conductive member (420) may include a second non-conductive member (440). The second non-conductive member (440) may surround at least a portion of the first non-conductive member (430). The second non-conductive member (440) may be spaced apart from the first antenna (401) in the first direction and may be positioned with at least a portion of the first non-conductive member (or the first support) therebetween. The second non-conductive member (440) may surround the first-second non-conductive member (432). The second non-conductive member (440) may be named the second support, the second support, or substantially the same as the first support.

[0125] According to one embodiment, the second non-conductor (440) may include a second-first non-conductor (441) and a second-second non-conductor (442). The second-first non-conductor (441) and the second-second non-conductor (442) may be spaced apart from each other in a second direction (+Z direction). The second-first non-conductor (441) may be positioned in the second direction (+Z direction) of the second antenna (402). The second-second non-conductor (442) may be positioned in a fourth direction (-Z direction) opposite to the second direction (+Z direction) of the second antenna (402). The second antenna (402) may be positioned between the second-first non-conductor (441) and the second-second non-conductor (442). The second-first non-conductive member (441) can apply a force in the fourth direction (-Z direction) to the second antenna (402). The second-second non-conductive member (442) can apply a force in the second direction (+Z direction) to the second antenna (402). The second antenna (402) can be fixed in its relative position in the second direction (+Z direction) with respect to the first antenna (401) by the balance of the forces applied by the second-first non-conductive member (441) and the second-second non-conductive member (442). The second non-conductive member (or second support member) (440) can include the second-first non-conductive member (441) and the second-second non-conductive member (442). The second-first non-conductive member (441) can be named substantially the same as the second-first support member and the second-first fixing member. The 2-2 non-conductive member (442) can be named substantially the same as the 2-1 support member and the 2-2 fixed member.

[0126] According to one embodiment, the first-first non-conductor (431) may be spaced apart from the first non-conductive portion (432) in the first direction (+X direction). A first gap (434) may be formed between the first-first non-conductor (431) and the first non-conductive portion (432). The second-first non-conductor (441) may be inserted between the first-first non-conductor (431) and the first non-conductive portion (432). The second-first non-conductor (441) may be positioned within the first gap (434).

[0127] According to one embodiment, the first-first non-conductor (431) may be spaced apart from the second non-conductive portion (433) in the first direction (+X direction). A second gap (435) may be formed between the first-first non-conductor (431) and the second non-conductive portion (433). The second-second non-conductor (442) may be inserted between the first-first non-conductor (431) and the second non-conductive portion (433). The second-second non-conductor (442) may be positioned within the second gap (435).

[0128] According to one embodiment, the second non-conductive member (440) may include a cover portion (443). The cover portion (443) may extend from the second-first non-conductive member (441) and the second-second non-conductive member (442) to the outside of the electronic device (101). The cover portion (443) may form a side surface of the housing (400). The cover portion (443) may cover the second antenna (402). The cover portion (443) may be arranged to surround the first-second non-conductive members (432, 433).

[0129] Hereinafter, the first non-conductive body (430) may be referred to as the first support. The second non-conductive body (440) may be referred to as the second support. The first-first non-conductive body (431) and the first-second non-conductive body (432) may be referred to as the first-first support and the first-second support, respectively. The second-first non-conductive body (441) and the second-second non-conductive body (442) may be referred to as the second-first support and the second-second support, respectively. The first-first non-conductive body (431) and the first-second non-conductive body (432) may be referred to as the first-first fixing body and the first-second fixing body, respectively. The second-first non-conductive body (441) and the second-second non-conductive body (442) may be referred to as the second-first fixing body and the second-2 fixing body, respectively.

[0130] FIG. 8 is a block diagram illustrating a method for manufacturing an electronic device (101) according to an embodiment of the present disclosure. FIG. 9 is a drawing illustrating a method for manufacturing an electronic device (101) according to an embodiment of the present disclosure. The components described with reference to FIGS. 8 and 9 may be partially or entirely identical to the components described with reference to FIGS. 1 to 7. The components described with reference to FIGS. 8 and 9 may be partially or entirely identical to the components described with reference to FIGS. 10 to 34.

[0131] According to one embodiment, a method for manufacturing an electronic device (101) may include an operation (901) of manufacturing a support. The method for manufacturing an electronic device (101) may include an operation (902) of manufacturing a first non-conductive material. The method for manufacturing an electronic device (101) may include an operation (903) of manufacturing a second non-conductive material.

[0132] According to one embodiment, a support (410) may be manufactured in the operation (901) of manufacturing a support. A support (401) including a mounting portion (413) and a second antenna (402) may be manufactured in the operation (901) of manufacturing a support.

[0133] In one embodiment, a first non-conductive body (430) may be manufactured in operation (902) of manufacturing a first non-conductive body. After operation (902) of manufacturing a first non-conductive body, the first non-conductive body (430) may be coupled to a support (410).

[0134] In one embodiment, a second non-conductive body (440) may be manufactured in operation (903) of manufacturing a second non-conductive body. After operation (903) of manufacturing a second non-conductive body, the second non-conductive body (440) may surround the first non-conductive body (430). After operation (903) of manufacturing a second non-conductive body, the non-conductive body (420) may be coupled to the support (410).

[0135] Fig. 10 is an enlarged view of the M1 area illustrated in Fig. 9. Fig. 11 is a cross-sectional view taken along the B-B' reference line illustrated in Fig. 10. Fig. 12 is a part of the internal structure of a mold (490) for manufacturing a support (410). Fig. 13 is a drawing explaining the manufacturing of a support (410) using a mold (490). The components described with reference to Figs. 10 to 13 may be partly or entirely the same as the components described with reference to Figs. 1 to 9. The components described with reference to Figs. 10 to 13 may be partly or entirely the same as the components described with reference to Figs. 14 to 34.

[0136] According to one embodiment, the support (410) may include a mounting portion (413) including a first mounting portion (411) and a second mounting portion (412). The support (410) may include a second antenna (402) spaced apart from the mounting portion (413). The mounting portion (413) and the second antenna (402) may be spaced apart from each other by a predetermined distance (D3) in the first direction.

[0137] In one embodiment, the support (410) may be manufactured using a mold (490). The support (410) may be manufactured through an insert injection process. The support (410) may be manufactured by solidifying a molten material forming the support (410) within the mold (490). However, the support (410) may also be manufactured through press processing or cutting processing.

[0138] According to one embodiment, the mold frame (490) may include a first mold frame (491), a second mold frame (492), and a third mold frame (493). The first mold frame (491), the second mold frame (492), and the third mold frame (493) may be assembled to each other.

[0139] According to one embodiment, a space may be formed between the first mold (491), the second mold (492), and the third mold (493). The support (410) may be manufactured in a shape corresponding to the space formed between the first mold (491), the second mold (492), and the third mold (493).

[0140] According to one embodiment, the first mold (491) may include a first boss (4911). The first boss (4911) may protrude toward the second mold (492). The first boss (4911) may be a portion that comes into contact with the second antenna (402) of the support (410) in a manufactured state. The first boss (4911) may be a portion corresponding to a first gap (e.g., the first gap (434) of FIG. 7).

[0141] According to one embodiment, the first mold (491) may include a first partition wall (4912). The first partition wall (4912) may face the third mold (493). The first partition wall (4912) may be a portion that comes into contact with the second antenna (402) of the manufactured support (410).

[0142] According to one embodiment, the first mold (491) may include a fence (4913). The fence (4913) may be positioned between the first mold (491) and the second mold (492). The fence (4913) may be a portion that comes into contact with the mounting portion (413) of the manufactured support (410). The fence (4913) may be a portion that is spaced apart from the second antenna (402) of the manufactured support (410).

[0143] According to one embodiment, the second mold (492) may include a second boss (4921). The second boss (4921) may protrude toward the first mold (491). The second boss (4921) may be a portion that comes into contact with the second antenna (402) of the support (410) in a manufactured state. The second boss (4921) may be a portion corresponding to a second gap (e.g., the second gap (435) of FIG. 7).

[0144] In one embodiment, the second mold (492) may include a second bulkhead (4922). The second bulkhead (4922) may face the first bulkhead (4912). The second bulkhead (4922) may be a portion that comes into contact with the second antenna (402) of the manufactured support (410).

[0145] According to one embodiment, the second mold (492) may include a protruding portion (4923). The protruding portion (4923) may protrude toward the first mold (491). The protruding portion (4923) may be a portion that comes into contact with the mounting portion (413) of the manufactured support (410). The protruding portion (4923) may correspond to a portion where the first antenna (e.g., the first antenna (401) of FIG. 7) is placed.

[0146] According to one embodiment, the third mold (493) may include a third boss (4931). The third boss (4931) may protrude into a space between the first mold (491) and the second mold (492). The third boss (4931) may be a portion corresponding to a space between a first non-conductive portion (e.g., the first non-conductive portion (432) of FIG. 7) and a second non-conductive portion (e.g., the second non-conductive portion (433) of FIG. 7).

[0147] In one embodiment, the mold (490) may include a first space (4901). The first space (4901) may be a portion of the space between the first mold (491) and the second mold (492). The first space (4901) may be partitioned by a fence (4913). The seating portion (413) of the support (410) may be manufactured by molding a material injected into the first space (4901).

[0148] In one embodiment, the mold (490) may include a second space (4902). The second space (4902) may be a space between the fence (4913) and the second partition wall (4922). The second space (4902) may be a space between the protrusion (4923) and the second partition wall (4922).

[0149] According to one embodiment, the mold (490) may include a third space (4903). The third space (4903) may be a space between the first bulkhead (4912) and the third mold (493).

[0150] In one embodiment, the mold (490) may include a fourth space (4904). The fourth space (4904) may be a space between the first partition wall (4912) and the second partition wall (4922). The fourth space (4904) may be a space between the first boss (4911) and the second boss (4921). The second antenna (402) may be manufactured by molding a material injected into the fourth space (4904).

[0151] Fig. 14 is an enlarged view of the M2 region illustrated in Fig. 9. Fig. 15 is a cross-sectional view taken along the C-C' reference line illustrated in Fig. 14. Fig. 16 is a drawing explaining the manufacturing of the first non-conductive body (430) using a mold (490). The components described with reference to Figs. 14 to 16 may be partially or entirely the same as the components described with reference to Figs. 1 to 13. The components described with reference to Figs. 14 to 16 may be partially or entirely the same as the components described with reference to Figs. 17 to 34.

[0152] In one embodiment, the first non-conductive member (430) may be arranged to surround at least a portion of the support (410). The first non-conductive member (430) may cover the second antenna (402). The first non-conductive member (430) may fill a space between the mounting portion (413) and the second antenna (402).

[0153] According to one embodiment, the first non-conductive member (430) can maintain a gap (D3) between the mounting portion (413) and the second antenna (402). The first-first non-conductive member (431) can be positioned between the mounting portion (413) and the second antenna (402). The first-first non-conductive member (431) can have a width equal to the gap (D3).

[0154] According to one embodiment, the first non-conductive body (430) may include first-second non-conductive bodies (432, 433). A first gap (434) may be formed between the first-first non-conductive body (431) and the first non-conductive portion (432). A second gap (435) may be formed between the first-first non-conductive body (431) and the second non-conductive portion (433).

[0155] According to one embodiment, the first non-conductive body (430) can be manufactured by a mold (490). The description of the mold (490) can be applied in the same manner as the description of the mold (490) described with reference to FIGS. 10 to 13. The first non-conductive body (430) can be manufactured by molding a non-conductive material injected into the mold (490).

[0156] According to one embodiment, the first-first non-conductive body (431) can be formed inside the second space (4902). The first-first non-conductive body (431) can be manufactured through molding of a non-conductive material injected into the second space (4902).

[0157] According to one embodiment, the first-second non-conductive body (432, 433) may be formed within the third space (4903). The first-second non-conductive body (432, 433) may be manufactured through molding of a non-conductive material injected into the third space (4903).

[0158] According to one embodiment, the first gap (434) may be formed at a position corresponding to the first boss (4911). The first boss (4911) may protrude between the second space (4902) and the third space (4903), thereby dividing the second space (4902) and the third space (4903).

[0159] According to one embodiment, the second gap (435) may be formed at a position corresponding to the second boss (4921). The second boss (4921) may protrude between the second space (4902) and the third space (4903), thereby partitioning the second space (4902) and the third space (4903).

[0160] Fig. 17 is an enlarged view of the M3 area illustrated in Fig. 9. Fig. 18 is a cross-sectional view taken along the D-D' reference line illustrated in Fig. 17. Fig. 19 is a drawing explaining the manufacturing of a second non-conductive body (440) using a mold (490). The components described with reference to Figs. 17 to 19 may be partially or entirely the same as the components described with reference to Figs. 1 to 16. The components described with reference to Figs. 17 to 19 may be partially or entirely the same as the components described with reference to Figs. 20 to 34.

[0161] In one embodiment, a circuit board (340) may be mounted on a support (410). A first antenna (401) may be mounted on the support (410). The first antenna (401) may be connected to the circuit board (340). A second antenna (402) may be connected to the circuit board (340). A non-conductive material (420) may be arranged to surround the second antenna (402).

[0162] In one embodiment, the first antenna (401) may be disposed on the mounting portion (413). A portion of the first non-conductive member (430) may be positioned between the first antenna (401) and the second antenna (402). The second non-conductive member (440) may surround at least a portion of the first non-conductive member (430). The second non-conductive member (440) may be disposed to surround the second antenna (402).

[0163] According to one embodiment, the second-first non-conductor (441) of the second non-conductor (440) may be positioned between the first-first non-conductor (431) and the first non-conductive portion (432). The second-second non-conductor (442) of the second non-conductor (440) may be positioned between the first-first non-conductor (431) and the second non-conductive portion (433). The cover portion (443) may surround the second antenna (402) and the first-second non-conductor (432, 433).

[0164] According to one embodiment, the second non-conductive body (440) can be manufactured by a mold (494). The description of the mold (494) can be identical to the description of the mold (490) described with reference to FIGS. 10 to 13. The second non-conductive body (440) can be manufactured by molding a non-conductive material injected into the mold (494).

[0165] According to one embodiment, the mold frame (494) may include a first mold frame (495), a second mold frame (496), and a third mold frame (497). The support (410) and the first non-conductive member (430) may be fixed between the first mold frame (495) and the second mold frame (496).

[0166] In one embodiment, the third mold (497) can surround the first non-conductive body (430) and the second antenna (402). The third mold (497) can form a space between it and the first non-conductive body (430). The third mold (497) can form a space between it and the second antenna (402).

[0167] According to one embodiment, a fifth space (4941) may be formed between the first non-conductive member (431) and the first non-conductive portion (432). The fifth space (4941) may be a space corresponding to the first boss (4911) of the mold (490) described with reference to FIGS. 10 to 13. The second non-conductive member (441) may be formed inside the fifth space (4941). The second non-conductive member (441) may be manufactured through molding of a non-conductive material injected into the fifth space (4941).

[0168] According to one embodiment, a sixth space (4942) may be formed between the first non-conductive member (431) and the second non-conductive portion (433). The sixth space (4942) may be a space corresponding to the second boss (4921) of the mold (490) described with reference to FIGS. 10 to 13. The second-second non-conductive member (442) may be formed inside the sixth space (4942). The second-second non-conductive member (442) may be manufactured through molding of a non-conductive material injected into the sixth space (4942).

[0169] According to one embodiment, a seventh space (4943) may be formed between the first and second non-conductive members (432, 433) and the third mold (497). A cover portion (443) may be formed inside the seventh space (4943). The cover portion (443) may be manufactured through molding of a non-conductive material injected into the seventh space (4943).

[0170] Fig. 20 is a side view and a cross-sectional view of the M2 area illustrated in Fig. 9. Fig. 21 is a drawing showing the assembly of the electronic device (101) and the third mold (493). Fig. 22 is a cross-sectional view taken along the G-G' reference line illustrated in Fig. 21. Fig. 23 is an exploded view of the electronic device (101) and the third mold (493). The components described with reference to Figs. 20 to 23 may be partly or entirely the same as the components described with reference to Figs. 1 to 19. The components described with reference to Figs. 20 to 23 may be partly or entirely the same as the components described with reference to Figs. 24 to 34.

[0171] In one embodiment, the first non-conductive member (430) may be arranged to surround at least a portion of the support (410). The first non-conductive member (430) may be arranged to surround the second antenna (402).

[0172] According to one embodiment, the first non-conductor (430) may include a first-first non-conductor (431) and a first-second non-conductor (437). The first-first non-conductor (431) and the first-second non-conductor (437) may be spaced apart in a first direction (e.g., +X direction). The second antenna (402) may be positioned between the first-first non-conductor (431) and the first-second non-conductor (437). The first-first non-conductor (431) and the first-second non-conductor (437) may apply force to the second antenna (402) in a first direction (+X direction) and a third direction (-X direction), thereby fixing the position of the second antenna (402) relative to the first antenna (401) in the first direction. The first-second non-conductive member (437) may include a first non-conductive portion (432) and a second non-conductive portion (433).

[0173] According to one embodiment, the first non-conductive member (430) may include a recess (436). The recess (436) may be formed by being recessed into the first-second non-conductive member (437). The recess (436) may connect the first non-conductive portion (432) and the second non-conductive portion (433). The recess (436) may be a portion of the first-second non-conductive member (437) formed between the first non-conductive portion (432) and the second non-conductive portion (433). The recess (436) may be recessed toward the second antenna (402). The recess (436) may be formed at a position corresponding to the third boss (4931) of the third mold (493).

[0174] According to one embodiment, the recess (436) may include a plurality of recesses (436a, 436b, 436c). The plurality of recesses (436a, 436b, 436c) may be spaced apart from each other in a fifth direction (e.g., +Y direction) perpendicular to the first direction (+X direction).

[0175] According to one embodiment, the first non-conductive member (430) of the electronic device (101) can be manufactured through a molding process using a third mold (493). The description of the molding process using the third mold (493) can be equally applied to the description of the molding process described with reference to FIGS. 8 to 19.

[0176] In one embodiment, the third mold (493) may include a third boss (4931). The third boss (4931) may be a part of the third mold (493) that is integrally formed with the third mold (493). However, the third boss (4931) may also be a “pin” that is detachably assembled to the third mold (493). The third boss (4931) may be referred to as a “third pin.”

[0177] According to one embodiment, the third mold (493) can apply a force in the first direction (+X direction) to the support (410) and the first non-conductive member (430) during the manufacturing process of the electronic device (101). The gap in the first direction (+X direction) between the mounting portion (413) and the second antenna (402) can be maintained by the third mold (493) applying a force in the first direction (+X direction). For example, the first-first non-conductive member (431) can be formed between the mounting portion (413) and the second antenna (402), and the first-second non-conductive member (437) can be formed between the second antenna (402) and the third mold (493). The third boss (4931) of the third mold (493) can protrude in the first direction (+X direction) and push the first-first non-conductive body (431), the first-second non-conductive body (437), and the second antenna (402) in the first direction (+X direction). By the pushing force of the third boss (4931), the relative positions of the first-first non-conductive body (431), the first-second non-conductive body (437), and the second antenna (402) in the first direction can be fixed. After the first non-conductive body (430) is manufactured, a recess (436) can be formed at a position corresponding to the third boss (4931).

[0178] FIG. 24 is a drawing showing an enlarged view of an M21 region as viewed in one direction (e.g., +Z direction) of an M2 region as viewed in FIG. 9, an enlarged view of an M21 region as viewed in another direction (e.g., -Z direction) of an M2 region as viewed in FIG. 9, and a cross-sectional view of an M2 region along the H-H' reference line according to various embodiments. FIG. 25 is a drawing of an electronic device (101) between a first mold (491) and a second mold (492). FIG. 26 is a drawing of an M21 region as shown in FIG. 24. FIG. 27 is a cross-sectional view along the I-I' reference line as shown in FIG. 26. FIG. 28 is an enlarged view of an M22 region as shown in FIG. 24. FIG. 29 is a cross-sectional view along the J-J' reference line as shown in FIG. 28. The components described with reference to FIGS. 24 to 29 may be partially or entirely identical to the components described with reference to FIGS. 1 to 23. The components described with reference to FIGS. 24 to 29 may be partially or entirely identical to the components described with reference to FIGS. 30 to 34.

[0179] Area M21 is a drawing of area M2 shown in Fig. 9 viewed from a position in the -Z direction toward the +Z direction. Area M22 is a drawing of area M2 shown in Fig. 9 viewed from a position in the +Z direction toward the -Z direction.

[0180] According to one embodiment, the first non-conductive member (430) may be arranged to surround the support (410). The first non-conductive member (430) may be arranged to surround the second antenna (402). The first non-conductive member (430) may include a first gap (434) formed in a second direction (+Z direction) with respect to the second antenna (402) and a second gap (435) formed in a fourth direction (-Z direction) with respect to the second antenna (402).

[0181] According to one embodiment, the first gap (434) may be located in a second direction (+Z direction) with respect to the second antenna (402). The second gap (435) may be located in a fourth direction (-Z direction) opposite to the second direction (+Z direction) with respect to the second antenna (402).

[0182] According to one embodiment, the positions of the first gap (434) and the second gap (435) may vary depending on the embodiment. For example, the first gap (434a) and the second gap (435a) may be positioned to be offset from each other in the second direction (+Z direction). For example, the first gap (434b) and the second gap (435b) may be positioned to overlap each other in the second direction (+Z direction). For example, the first gap (434c) and the second gap (435c) may be arranged in multiple numbers to be offset from each other in the second direction (+Z direction).

[0183] In one embodiment, the width of the first gap (434d) and the width of the second gap (435d) may be different.

[0184] In one embodiment, either the first gap (434e) or the second gap (435e) may be inclined with respect to the second direction (+Z direction).

[0185] According to one embodiment, the first non-conductive member (430) of the electronic device (101) can be manufactured by a molding process using a first mold (491) and a second mold (492). The description of the molding process using the first mold (491) and the second mold (492) can be equally applied to the description of the molding process described with reference to FIGS. 8 to 19.

[0186] According to one embodiment, the first gap (434) may be formed by the first mold (491). The first mold (491) may include a first boss (4911), and the first gap (434) may be formed at a position corresponding to the first boss (4911). The first boss (4911) may be a part of the first mold (491) that is formed integrally with the first mold (491), or may be a “pin” that is detachably assembled with the first mold (491). The first boss (4911) may be referred to as a “first pin.”

[0187] According to one embodiment, the second antenna (402) may be surrounded by a first non-conductive member (430). The second antenna (402) may be positioned between the first-first non-conductive member (431) and the first-second non-conductive member (432, 433). The first boss (4911) may be positioned between the first-first non-conductive member (431) and the first-second non-conductive member (432, 433). The first gap (434) may have a shape corresponding to the first boss (4911) positioned between the first-first non-conductive member (431) and the first-second non-conductive member (432, 433).

[0188] According to one embodiment, the second antenna (402) may be surrounded by a first non-conductive body (430). The second antenna (402) may be positioned between the first-first non-conductive body (431) and the first-second non-conductive body (432, 433). The second boss (4921) may be positioned between the first-first non-conductive body (431) and the first-second non-conductive body (432, 433). The second gap (435) may have a shape corresponding to the second boss (4921) positioned between the first-first non-conductive body (431) and the first-second non-conductive body (432, 433).

[0189] In one embodiment, the first boss (4911) can support the second antenna (402) during the manufacturing process of the first non-conductive body (430). The first boss (4911) can apply force in a fourth direction (-Z direction) to the second antenna (402) during the manufacturing process of the first non-conductive body (430). The second boss (4921) can support the second antenna (402) during the manufacturing process of the first non-conductive body (430). The second boss (4921) can apply force in a second direction (+Z direction) to the second antenna (402) during the manufacturing process of the first non-conductive body (430). The second antenna (402) can be supported by the first boss (4911) and the second boss (4921) during the manufacturing process of the first non-conductive body (430) so that its position in the second direction (+Z direction) can be fixed.

[0190] Fig. 30 is an enlarged view of the M1 area illustrated in Fig. 9. Fig. 31 is a drawing of an electronic device (101) surrounded by molds (491, 492, 493). Fig. 32 is a cross-sectional view taken along the K-K' reference line illustrated in Fig. 31. The components described with reference to Figs. 30 to 32 may be partly or entirely identical to the components described with reference to Figs. 1 to 29. The components described with reference to Figs. 30 to 32 may be partly or entirely identical to the components described with reference to Figs. 33 and 34.

[0191] According to one embodiment, the support (410) may include a bridge (414). The bridge (414) may be aligned with the second antenna (402) in a fifth direction (+Y direction). The bridge (414) may limit movement of the second antenna (402) in the fifth direction (+Y direction) or the sixth direction (-Y direction) during the manufacturing process of the non-conductive body (420). For example, the bridge (414) may support the second antenna (402) by connecting the cantilever-shaped second antenna (402) to the support (410). The second antenna (402) may be fixed in position in the fifth and sixth directions (+Y, -Y) during the manufacturing process of the electronic device (101) due to support by the bridge (414). The second antenna (402) can be fixed in its relative position with respect to the first antenna (401) during the manufacturing process of the electronic device (101) due to support by the bridge (414). The bridge (414) can be removed from the support (410) after the manufacturing process of the non-conductive body (420).

[0192] According to one embodiment, the first non-conductive member (430) of the electronic device (101) can be manufactured by a molding process using a mold (491, 492, 493). The description of the molding process using the mold (491, 492, 493) can be equally applied to the description of the molding process described with reference to FIGS. 8 to 19.

[0193] In one embodiment, the third mold (493) can surround at least a portion of the bridge (414). The third mold (493) can support the bridge (414). The third mold (493) can restrict movement of the bridge (414) during the manufacturing process of the first non-conductive member (430).

[0194] According to one embodiment, the third mold (493) may include a bridge support portion (4934). The bridge support portion (4934) may surround the bridge (414). The bridge support portion (4934) may include a first bridge support portion (4932) and a second bridge support portion (4933). The bridge (414) may be positioned between the first bridge support portion (4932) and the second bridge support portion (4933). The bridge support portion (4933) may restrict movement of the bridge (414) in the second direction (+Z direction) or the fourth direction (-Z direction).

[0195] Fig. 33 is an enlarged view of the M4 area illustrated in Fig. 6. The components described with reference to Fig. 33 may be partially or entirely identical to the components described with reference to Figs. 1 to 32.

[0196] In one embodiment, the support (410) may include a rounded portion (415). The first non-conductive member (430) may surround the rounded portion (415). The support (410) may include a bending portion (416). The second antenna (402) may be positioned in each of the rounded portion (415) and the bending portion (416). The first non-conductive member (430) may surround the second antenna (402) positioned in the rounded portion (415) and the bending portion (416).

[0197] According to one embodiment, the first non-conductive member (430) may include first and second gaps (434, 435) formed by first and second bosses (4911, 4921). The shapes of the first and second gaps (434, 435) may be formed to correspond to the shapes of the curved portion (415) and the bending portion (416). For example, the first gap (434) may be inclined to correspond to the shape of the bending portion (416).

[0198] Fig. 34 is a drawing illustrating a manufacturing process of a non-conductive body (530) according to an embodiment of the present disclosure. The components described with reference to Fig. 34 may be partially or entirely identical to the components described with reference to Figs. 1 to 33.

[0199] According to one embodiment, a method of manufacturing an electronic device may include preparing a support (510) including a mounting portion (513), a second antenna (502), and a bridge (514). The description of the mounting portion (513), the second antenna (502), and the bridge (514) may be equally applicable to the description of the components described with reference to FIGS. 1 to 33 (e.g., the mounting portion (413), the second antenna (402), and the bridge (414)).

[0200] According to one embodiment, a method of manufacturing an electronic device may include manufacturing a first non-conductive body (530). The first non-conductive body (530) may be manufactured by a molding process using a mold (490) described with reference to FIGS. 8 to 19. The first non-conductive body (530) may be arranged to surround a second antenna (502). A bridge (514) may protrude from at least a portion of the first non-conductive body (530) to the outside of the first non-conductive body (530).

[0201] According to one embodiment, a method of manufacturing an electronic device may include an operation of removing a bridge (514). The bridge (514) protruding outwardly from the first non-conductive member (530) may be removed through cutting. The first non-conductive member (530) may include a recess (536). The recess (536) may be formed at a location where the bridge (514) is removed.

[0202] According to one embodiment, a method of manufacturing an electronic device may include an operation of joining a first non-conductive material (530) and a cover (550). The cover (550) may be placed in a recess (536). The cover (550) may be joined to the first non-conductive material (530) in an inner space of the recess (536).

[0203] An electronic device includes a housing, a support disposed within the housing, a first antenna mounted on the support, and a second antenna spaced apart from the first antenna. The first antenna and the second antenna are configured to transmit and receive signals with the exterior of the electronic device. When the first antenna and the second antenna are not sufficiently spaced apart, the performance of the first antenna and the second antenna may be reduced.

[0204] A problem to be solved in the present disclosure may be to maintain a separation distance between the first antenna and the second antenna in the first direction.

[0205] A problem to be solved in the present disclosure may be to maintain an overlapping interval in the second direction between the first antenna and the second antenna.

[0206] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0207] An electronic device according to various embodiments of the present disclosure can maintain a separation distance between a first antenna and a second antenna in a first direction through the structure of a first non-conductive body and a second non-conductive body.

[0208] An electronic device according to various embodiments of the present disclosure can maintain an overlapping interval in a second direction between a first antenna and a second antenna through the structure of a first non-conductive body and a second non-conductive body.

[0209] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0210] An electronic device (e.g., 101 of FIGS. 1 to 34) according to one embodiment of the present disclosure may include a housing (e.g., 400 of FIGS. 1 to 34).

[0211] An electronic device (e.g., 101 of FIGS. 1 to 34 ) according to one embodiment of the present disclosure may include a first antenna (e.g., 401 of FIGS. 1 to 34 ) disposed inside the housing (e.g., 400 of FIGS. 1 to 34 ) and configured to generate a signal outside the housing (e.g., 400 of FIGS. 1 to 34 ).

[0212] An electronic device (e.g., 101 of FIGS. 1 to 34) according to one embodiment of the present disclosure may include a support (e.g., 410 of FIGS. 1 to 34) that forms a portion of the housing (e.g., 400 of FIGS. 1 to 34) and includes a mounting portion (e.g., 413 of FIGS. 1 to 34) on which the first antenna (e.g., 401 of FIGS. 1 to 34) is disposed.

[0213] An electronic device (e.g., 101 of FIGS. 1 to 34 ) according to one embodiment of the present disclosure may include a second antenna (e.g., 402 of FIGS. 1 to 34 ) that forms a portion of the support (e.g., 410 of FIGS. 1 to 34 ), is spaced apart from the first antenna (e.g., 401 of FIGS. 1 to 34 ) in a first direction, and is positioned so as to overlap the first antenna (e.g., 401 of FIGS. 1 to 34 ) in a second direction that is perpendicular to the first direction when viewed in the first direction so that a portion of a signal generated from the first antenna (e.g., 401 of FIGS. 1 to 34 ) reaches the second antenna.

[0214] An electronic device (e.g., 101 of FIGS. 1 to 34) according to one embodiment of the present disclosure may include a first support (e.g., 430 of FIGS. 1 to 34) at least partly positioned within a gap formed in the first direction between the first antenna (e.g., 401 of FIGS. 1 to 34) and the second antenna (e.g., 402 of FIGS. 1 to 34).

[0215] An electronic device (e.g., 101 of FIGS. 1 to 34) according to one embodiment of the present disclosure may include a second support (e.g., 440 of FIGS. 1 to 34) arranged with at least a portion of the first support (e.g., 430 of FIGS. 1 to 34) spaced apart from the first antenna (e.g., 401 of FIGS. 1 to 34) in the first direction, at least a portion of the second support (e.g., 402 of FIGS. 1 to 34) being aligned in the second direction.

[0216] According to one embodiment of the present disclosure, the first support (e.g., 430 of FIGS. 1 to 34 ) may include a first-first support (e.g., 431 of FIGS. 1 to 34 ) positioned within the gap between the first antenna (e.g., 401 of FIGS. 1 to 34 ) and the second antenna (e.g., 402 of FIGS. 1 to 34 ) and configured to contact the second antenna (e.g., 402 of FIGS. 1 to 34 ) in the first direction.

[0217] According to one embodiment of the present disclosure, the first support (e.g., 430 of FIGS. 1 to 34) may include a first-second support (e.g., 437 of FIGS. 1 to 34) configured to be spaced apart from the first-first support (e.g., 431 of FIGS. 1 to 34) in the first direction with the second antenna (e.g., 402 of FIGS. 1 to 34) interposed therebetween, and to contact the second antenna (e.g., 402 of FIGS. 1 to 34) in a third direction opposite to the first direction so that the size of the gap between the first antenna (e.g., 401 of FIGS. 1 to 34) and the second antenna (e.g., 402 of FIGS. 1 to 34) in the first direction is fixed.

[0218] According to one embodiment of the present disclosure, the second support (e.g., 440 of FIGS. 1 to 34 ) may include a second-first support (e.g., 441 of FIGS. 1 to 34 ) arranged to surround the first-second support (e.g., 432 of FIGS. 1 to 34 ), positioned between the first-first support (e.g., 431 of FIGS. 1 to 34 ) and the first-second support (e.g., 437 of FIGS. 1 to 34 ), and configured to contact the second antenna (e.g., 402 of FIGS. 1 to 34 ) in the second direction.

[0219] According to one embodiment of the present disclosure, the second support (e.g., 440 of FIGS. 1 to 34 ) may include a second-second support (e.g., 442 of FIGS. 1 to 34 ) that is spaced apart from the second-first support (e.g., 441 of FIGS. 1 to 34 ) in the second direction with the second antenna (e.g., 402 of FIGS. 1 to 34 ) interposed therebetween, and that is configured to contact the second antenna (e.g., 402 of FIGS. 1 to 34 ) in a fourth direction opposite to the second direction so that the position of the second antenna (e.g., 402 of FIGS. 1 to 34 ) with respect to the first antenna (e.g., 401 of FIGS. 1 to 34 ) in the second direction is fixed.

[0220] According to one embodiment of the present disclosure, the first support member (e.g., 430 of FIGS. 1 to 34) and the second support member (e.g., 440 of FIGS. 1 to 34) may surround the second antenna (e.g., 402 of FIGS. 1 to 34) such that a separation distance in the first direction between the first antenna (e.g., 401 of FIGS. 1 to 34) and the second antenna (e.g., 402 of FIGS. 1 to 34) and an overlapping distance in the second direction between the first antenna (e.g., 401 of FIGS. 1 to 34) and the second antenna (e.g., 402 of FIGS. 1 to 34) are fixed.

[0221] According to one embodiment of the present disclosure, the first support member (e.g., 430 of FIGS. 1 to 34) can fix the second antenna (e.g., 402 of FIGS. 1 to 34) in the first direction, and the second support member (e.g., 440 of FIGS. 1 to 34) can fix the second antenna (e.g., 402 of FIGS. 1 to 34) in the second direction.

[0222] According to one embodiment of the present disclosure, the first antenna (e.g., 401 of FIGS. 1 to 34) may be arranged to be inclined with respect to the first direction, and a portion of a signal generated from the first antenna (e.g., 401 of FIGS. 1 to 34) may be configured to reach the second antenna (e.g., 402 of FIGS. 1 to 34) along the first direction.

[0223] According to one embodiment of the present disclosure, the first-second support member (e.g., 437 of FIGS. 1 to 34) may include a first non-conductive portion (e.g., 432 of FIGS. 1 to 34).

[0224] According to one embodiment of the present disclosure, the first non-conductive portion (e.g., 432 of FIGS. 1 to 34) and the second non-conductive portion (e.g., 433 of FIGS. 1 to 34) spaced apart in the second direction may be included.

[0225] According to one embodiment of the present disclosure, the 2-1 support portion (e.g., 441 of FIGS. 1 to 34 ) may be positioned between the 1-1 support portion (e.g., 431 of FIGS. 1 to 34 ) and the first non-conductive portion (e.g., 432 of FIGS. 1 to 34 ), and the 2-2 support portion (e.g., 442 of FIGS. 1 to 34 ) may be positioned between the 1-1 support portion (e.g., 431 of FIGS. 1 to 34 ) and the second non-conductive portion (e.g., 433 of FIGS. 1 to 34 ).

[0226] According to one embodiment of the present disclosure, the second antenna (e.g., 402 of FIGS. 1 to 34) may be positioned correspondingly between the first non-conductive portion (e.g., 432 of FIGS. 1 to 34) and the second non-conductive portion (e.g., 433 of FIGS. 1 to 34).

[0227] According to one embodiment of the present disclosure, the second support portion (e.g., 440 of FIGS. 1 to 34 ) may include a cover portion (e.g., 443 of FIGS. 1 to 34 ) extending from the 2-1 support portion (e.g., 441 of FIGS. 1 to 34 ) and the 2-2 support portion (e.g., 442 of FIGS. 1 to 34 ) and surrounding the 1-2 support portion (e.g., 437 of FIGS. 1 to 34 ).

[0228] According to one embodiment of the present disclosure, the first support member (e.g., 430 of FIGS. 1 to 34) is manufactured by a molding method using a mold (e.g., 490 of FIGS. 1 to 34), and the second support member (e.g., 440 of FIGS. 1 to 34) can be manufactured after the first support member (e.g., 430 of FIGS. 1 to 34) is manufactured.

[0229] The mold (e.g., 490 of FIGS. 1 to 34) according to one embodiment of the present disclosure may include a first mold (e.g., 491 of FIGS. 1 to 34) including a first boss (e.g., 4911 of FIGS. 1 to 34) configured to apply force to the second antenna (e.g., 402 of FIGS. 1 to 34) in the second direction.

[0230] The mold (e.g., 490 of FIGS. 1 to 34) according to one embodiment of the present disclosure may include a second mold (e.g., 492 of FIGS. 1 to 34) including a second boss (e.g., 4921 of FIGS. 1 to 34) configured to apply force to the second antenna (e.g., 402 of FIGS. 1 to 34) in the fourth direction.

[0231] The mold (e.g., 490 of FIGS. 1 to 34) according to one embodiment of the present disclosure may include a third mold (e.g., 493 of FIGS. 1 to 34) including a third boss (e.g., 4931 of FIGS. 1 to 34) configured to apply force to the second antenna (e.g., 402 of FIGS. 1 to 34) in the first direction.

[0232] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

[0233] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In an electronic device (101), Housing (400); A first antenna (401) arranged inside the housing (400) and configured to generate a signal outside the housing (400); A support (410) forming a part of the housing (400) and including a mounting portion (413) on which the first antenna (401) is placed; A second antenna (402) forming a part of the support (410), spaced apart from the first antenna (401) in a first direction, and positioned so that at least a part of the signal generated from the first antenna (401) reaches the first antenna (401) in a second direction perpendicular to the first direction when viewed in the first direction; A first support member 430, at least part of which is located within a gap formed in the first direction between the first antenna (401) and the second antenna (402); and At least a part of the second support (440) is aligned with the second antenna (402) in the second direction and is spaced apart from the first antenna in the first direction, with at least a part of the first support interposed therebetween; The above first support member (430) is A first-first support portion (431) positioned within the gap between the first antenna (401) and the second antenna (402) and configured to contact the second antenna (402) in the first direction; and It includes a first-second support member (437) configured to be spaced apart from the first-first non-conductive member (431) in the first direction with the second antenna (402) interposed therebetween, and to contact the second antenna (402) in a third direction opposite to the first direction so that the size of the gap between the first antenna (401) and the second antenna (402) in the first direction is fixed, The above second support (440) is It is arranged to surround the above 1-2 support members, A second-first support (441) positioned between the first-first support (431) and the first-second support (437) and configured to contact the second antenna (402) in the second direction; and An electronic device including a second-second support portion (442) spaced apart from the second-first support portion (441) in the second direction with the second antenna (402) interposed therebetween, and configured to contact the second antenna (402) in a fourth direction opposite to the second direction so that the position of the second antenna (402) with respect to the first antenna (401) in the second direction is fixed.

2. In paragraph 1, The first support member (430) and the second support member (440) are an electronic device that surrounds the second antenna (402) such that the separation distance in the first direction between the first antenna (401) and the second antenna (402) and the overlapping distance in the second direction between the first antenna (401) and the second antenna (402) are fixed.

3. In paragraph 1 or 2, An electronic device in which the first support member (430) fixes the second antenna (402) in the first direction, and the second support member (440) fixes the second antenna (402) in the second direction.

4. In any one of paragraphs 1 to 3, An electronic device in which the first antenna (401) is arranged to be inclined with respect to the first direction, and a portion of a signal generated from the first antenna (401) reaches the second antenna (402) along the first direction.

5. In any one of paragraphs 1 to 4, The above 1-2 non-conductive body (437) is, First non-challenging part (432); and It includes the first non-conductive portion (432) and the second non-conductive portion (433) spaced apart in the second direction, An electronic device in which the above-mentioned 2-1 non-conductive member (441) is located between the above-mentioned 1-1 support member (431) and the above-mentioned 1-1 non-conductive part (432), and the above-mentioned 2-2 support member (442) is located between the above-mentioned 1-1 support member (431) and the above-mentioned 2-2 non-conductive part (433).

6. In paragraph 5, The above second antenna (402) is, An electronic device positioned at a corresponding position between the first non-conductive portion (432) and the second non-conductive portion (433).

7. In any one of paragraphs 1 to 6, The above second support (440) is An electronic device including a cover portion (443) extending from the 2-1 support portion (441) and the 2-2 support portion (442) and surrounding the 1-2 support portion (437).

8. In any one of paragraphs 1 to 7, An electronic device in which the first support part (430) is manufactured by a molding method using a mold (490), and the second support part (440) is manufactured after the first support part (430) is manufactured.

9. In paragraph 8, The above mold (490) is A first mold (491) including a first boss (4911) configured to apply force to the second antenna (402) in the second direction; and An electronic device comprising a second mold (492) including a second boss (4921) configured to apply force to the second antenna (402) in the fourth direction.

10. In paragraph 8 or 9, The above mold (490) is An electronic device comprising a third mold (493) including a third boss (4931) configured to apply force to the second antenna (402) in the first direction.

11. In a method for manufacturing an electronic device, An operation of preparing a support (410) including a mounting portion (413) on which a first antenna (401) is placed and a second antenna (402) spaced apart from the mounting portion (413) in a first direction; An operation of manufacturing a first non-conductive member (430) at least part of which is positioned between the mounting portion (413) and the second antenna (402); and A method of manufacturing an electronic device, comprising the operation of manufacturing a second non-conductive member (440) aligned with the second antenna (402) in a second direction at least partially perpendicular to the first direction.

12. In paragraph 11, A method for manufacturing an electronic device, wherein at least a portion of the first non-conductive member (430) is positioned within a gap formed in the first direction between the first antenna (401) and the second antenna (402).

13. In paragraph 11 or 12, The above second non-conductive body (440) is, A method for manufacturing an electronic device configured to fix the position of the second antenna (402) in the second direction with respect to the first antenna (401).

14. In any one of paragraphs 11 to 13, A method for manufacturing an electronic device, wherein the first antenna (401) is arranged to be inclined with respect to the first direction, and a portion of a signal generated from the first antenna (401) reaches the second antenna (402) along the first direction.

15. In any one of paragraphs 11 to 14, A method for manufacturing an electronic device in which the first non-conductive member (430) and the second non-conductive member (440) surround the second antenna (402) so that the separation distance in the first direction between the first antenna (401) and the second antenna (402) and the overlapping distance in the second direction between the first antenna (401) and the second antenna (402) are fixed.

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