Electronic device comprising ground

Abstract

The present disclosure relates to a display. The display according to one embodiment of the present disclosure comprises: a substrate including a cathode and an anode spaced apart from each other in a first direction; an LED including a first electrode electrically connected to the cathode; a ground which includes a second electrode electrically connected to the anode, and which is spaced apart from the LED in the first direction; an insulator disposed between the LED and the ground; and a conductive coating layer, which is stacked on the LED and the ground in a second direction perpendicular to the first direction, extends along the first direction, and electrically connects the LED and the ground, wherein: the LED includes a first wall inclined in the second direction; the ground includes a second wall inclined in the second direction; and the conductive coating layer can be coated to have a substantially uniform first thickness along the first wall inclined in the second direction, and can be coated to have the substantially uniform first thickness along the second wall inclined in the second direction.

Description

Electronic devices containing grounding

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including grounding.

[0002] Typically, electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and / or car navigation systems. As electronic devices become more integrated and ultra-high-speed, high-capacity wireless communications become more widespread, a single, miniaturized electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0003] Recently, wearable electronic devices that can be worn on the body have become commercialized, and mobile communication terminals and wearable electronic devices are used in everyday life. Because wearable electronic devices can remain in contact with the user's body for a considerable period of time, they can be usefully utilized in medical or health management. For example, depending on the sensors installed, the electronic device can detect biometric information such as the user's photoplethysmography (PPG), sleep interval, skin temperature, heart rate, and / or electrocardiogram. The detected biometric information can be stored on the electronic device or transmitted in real time to a medical institution for use in health management. Typically, electronic devices have a bar shape, a box shape, or a flat plate shape. However, wearable electronic devices can be combined with multiple segments to accommodate the user's body curves and ensure comfort. For example, a wrist-worn electronic device may include a housing that serves as a main body by accommodating various circuit devices and at least one wearable member, and a face-worn electronic device may include lens(es) corresponding to both eyes of the user and at least one temple bow(s).

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, a display includes a substrate including a cathode and an anode spaced apart from each other in a first direction; an LED including a first electrode configured to be electrically connected to the cathode; a ground including a second electrode configured to be electrically connected to the anode, the ground being spaced apart from the LED in the first direction; an insulator disposed between the LED and the ground; and a conductive coating layer laminated on the LED and the ground in a second direction perpendicular to the first direction, the conductive coating layer extending along the first direction and electrically connecting the LED and the ground, wherein the LED includes a first wall inclined with respect to the second direction, the ground includes a second wall inclined with respect to the second direction, and the conductive coating layer is configured to be coated with a first thickness that is substantially uniform along the first wall inclined with respect to the second direction, and may be configured to be coated with a first thickness that is substantially uniform along the second wall inclined with respect to the second direction.

[0006] An electronic device according to one embodiment of the present disclosure comprises: a housing; and a display disposed in the housing and configured to emit light to the outside of the housing, the display comprising: a substrate including a cathode and an anode spaced apart from each other in a first direction; an LED including a first electrode configured to be electrically connected to the cathode; a ground including a second electrode configured to be electrically connected to the anode, the ground being spaced apart from the LED in the first direction; an insulator disposed between the LED and the ground; and a conductive coating layer laminated on the LED and the ground in a second direction perpendicular to the first direction, the conductive coating layer extending along the first direction and electrically connecting the LED and the ground, wherein the LED includes a first wall inclined with respect to the second direction, the ground includes a second wall inclined with respect to the second direction, and the conductive coating layer is configured to be coated with a first thickness that is substantially uniform along the first wall inclined with respect to the second direction, and may be configured to be coated with the first thickness that is substantially uniform along the second wall inclined with respect to the second direction.

[0007] A method for manufacturing a display according to one embodiment of the present disclosure may include: preparing a substrate including a cathode and an anode; manufacturing an LED including a first wall inclined with respect to a direction in which the LED is assembled to the substrate and a ground including a second wall inclined with respect to the direction in which the LED is assembled to the substrate; assembling the LED and the ground to the substrate; disposing an insulating layer between the LED and the ground; and coating a conductive coating layer along the first wall, the second wall, and the insulating layer.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a front perspective view illustrating a wearable electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a rear perspective view illustrating the wearable electronic device of FIG. 1 according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view illustrating the wearable electronic device of FIG. 1 according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded view of a portion of a display according to one embodiment of the present disclosure.

[0014] Figure 6 is a conceptual diagram of a panel according to one embodiment of the present disclosure.

[0015] FIG. 7 is a drawing illustrating a pixel according to one embodiment of the present disclosure.

[0016] FIG. 8 is a drawing illustrating pixels according to various embodiments of the present disclosure.

[0017] FIG. 9 is a drawing illustrating a pixel according to one embodiment of the present disclosure.

[0018] FIG. 10 is a cross-sectional view of a portion of a display according to one embodiment of the present disclosure.

[0019] FIG. 11 is a cross-sectional view of a portion of a display according to one embodiment of the present disclosure.

[0020] FIG. 12 is a block diagram illustrating a method for manufacturing a display according to one embodiment of the present disclosure.

[0021] FIG. 13a is a drawing illustrating a method for manufacturing a display according to one embodiment of the present disclosure.

[0022] FIG. 13b is a drawing illustrating a method for manufacturing a display according to one embodiment of the present disclosure.

[0023] FIG. 14 is a drawing illustrating a method for manufacturing a display according to one embodiment of the present disclosure.

[0024] FIG. 15 is a block diagram illustrating a method for manufacturing a display according to one embodiment of the present disclosure.

[0025] FIG. 16 is a drawing illustrating a method for manufacturing a display according to one embodiment of the present disclosure.

[0026] FIG. 17 is a cross-sectional view of a portion of a display according to one embodiment of the present disclosure.

[0027] FIG. 18 is a cross-sectional view of a portion of a display according to one embodiment of the present disclosure.

[0028] FIG. 19 is a cross-sectional view of a portion of a display according to one embodiment of the present disclosure.

[0029] FIG. 20 is a cross-sectional view of a portion of a display according to one embodiment of the present disclosure.

[0030] FIG. 21 is a drawing illustrating a structure of grounding according to various embodiments of the present disclosure.

[0031] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0032] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and technical spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0033] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0034] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0035] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0059] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0060] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0061] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0062] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0063] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0064] FIG. 2 is a front perspective view illustrating a wearable electronic device (100) according to one embodiment of the present disclosure. FIG. 3 is a rear perspective view illustrating the wearable electronic device (100) of FIG. 2 according to one embodiment of the present disclosure.

[0065] In the detailed description below, the 'X-axis direction' in the orthogonal coordinate system of FIGS. 2 to 4 may be understood as the width direction of the electronic device (100) or the housing (110), the 'Y-axis direction' may be understood as the length direction of the electronic device (100) or the housing (110), and the 'Z-axis direction' may be understood as the thickness direction of the electronic device (100) or the housing (110). In one embodiment, the direction in which the front surface of the electronic device (100) or the housing (110) (e.g., the first surface (110A) of FIG. 2) faces may be defined as the 'first direction' or the '+Z direction', and the direction in which the rear surface of the electronic device (100) or the housing (110) (e.g., the second surface (110B) of FIG. 3) faces may be defined as the 'second direction' or the '-Z direction'.

[0066] Referring to FIGS. 2 and 3, a wearable electronic device (100) according to one embodiment may include a housing (110) including a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) surrounding a space between the first side (110A) and the second side (110B), and a wearing member (150, 160) connected to at least a portion of the housing (110) and configured to detachably attach the electronic device (100) to a part of a user's body (e.g., a wrist, an ankle, etc.). For example, the wearable electronic device (100) may be in the form of a wristwatch. In one embodiment (not shown), the housing may also refer to a structure forming a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C). In one embodiment, the first side (110A) may be formed by a front plate (101) that is at least partially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (110B) may be formed by a back plate (107) that is substantially opaque. In one embodiment, when the electronic device includes a sensor module (111) disposed on the second side (110B), the back plate (107) may include an at least partially transparent area. The back plate (107) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side bezel structure (or “side member”) (106) that is coupled to the front plate (101) and the back plate (107) and includes a metal and / or a polymer. In one embodiment, the back plate (107) and the side bezel structure (106) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).The above-mentioned wearing member (150, 160) may be formed of various materials and shapes. It may be formed of a woven fabric, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the above materials, such that integral and multiple unit links can be formed to be mutually movable.

[0067] According to one embodiment, the electronic device (100) may include at least one of a display (220, see FIG. 4), an audio module (105, 108), a sensor module (111), a key input device (102, 103, 104), and a connector hole (109). In one embodiment, the electronic device (100) may omit at least one of the components (e.g., the key input device (102, 103, 104), the connector hole (109), or the sensor module (111)) or may additionally include other components.

[0068] A display (e.g., display (220) of FIG. 4) may be exposed, for example, through a significant portion of the front plate (101). The shape of the display (220) may correspond to the shape of the front plate (101), and may have various shapes such as a circle, an oval, or a polygon. The display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0069] The audio module (105, 108) may include a microphone hole (105) and a speaker hole (108). The microphone hole (105) may have a microphone positioned therein for acquiring external sounds, and in one embodiment, multiple microphones may be positioned therein to detect the direction of sounds. The speaker hole (108) may be used as an external speaker and a receiver for calls. In one embodiment, a speaker may be included without a speaker hole (e.g., a piezo speaker).

[0070] The sensor module (111) can generate an electric signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module (111) can include, for example, a biometric sensor module (111) (e.g., an HRM sensor) arranged on the second surface (110B) of the housing (110). The electronic device (100) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0071] The key input devices (102, 103, 104) may include a wheel key (102) disposed on a first surface (110A) of the housing (110) and rotatable in at least one direction, and / or a side key button (103, 104) disposed on a side surface (110C) of the housing (110). The wheel key (102) may have a shape corresponding to the shape of the front plate (101). In one embodiment, the electronic device (100) may not include some or all of the above-mentioned key input devices (102, 103, 104), and the key input devices (102, 103, 104) that are not included may be implemented in another form, such as a soft key, on the display (220). The connector hole (109) can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and may include another connector hole (not shown) for receiving a connector for transmitting and receiving audio signals with the external electronic device. The electronic device (100) may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole (109) and blocks the inflow of external foreign substances into the connector hole.

[0072] The wearing member (150, 160) can be detachably fastened to at least a portion of the housing (110) using a locking member (151, 161). The locking member (151, 161) can include a fastening component such as a pogo pin, and can be replaced with a protrusion(s) or recess(es) formed in the wearing member (150, 160) according to an embodiment. For example, the wearing member (150, 160) can be coupled in a manner of engaging with a groove or a protrusion formed in the housing (110). The wearing member (150, 160) can include one or more of a fixing member (152), a fixing member fastening hole (153), a band guide member (154), and a band fixing ring (155).

[0073] The fixing member (152) may be configured to fix the housing (110) and the wearing member (150, 160) to a part of the user's body (e.g., wrist, ankle, etc.). The fixing member fastening hole (153) may correspond to the fixing member (152) to fix the housing (110) and the wearing member (150, 160) to a part of the user's body. The band guide member (154) may be configured to limit the range of movement of the fixing member (152) when the fixing member (152) is fastened to the fixing member fastening hole (153), thereby allowing the wearing member (150, 160) to be fastened in close contact with a part of the user's body. The band fixing ring (155) may limit the range of movement of the wearing member (150, 160) when the fixing member (152) and the fixing member fastening hole (153) are fastened.

[0074] FIG. 4 is an exploded perspective view illustrating the wearable electronic device of FIG. 2 according to one embodiment of the present disclosure.

[0075] Referring to FIG. 4, the wearable electronic device (200) may include a side bezel structure (210), a wheel key (230), a front plate (201) (e.g., the front plate (101) of FIG. 2), a display (220), a first antenna (250), a second antenna (e.g., an antenna included in a second circuit board (255)), a support member (260) (e.g., a bracket), a battery (270), a printed circuit board (280), a sealing member (290), a rear plate (293), and a wearing member (295, 297) (e.g., the wearing member (150, 160) of FIG. 2 or 3). At least one of the components of the electronic device (200) may be the same as or similar to at least one of the components of the electronic device (100) of FIG. 2 or 3, and a redundant description thereof will be omitted below. The support member (260) may be disposed inside the electronic device (200) and connected to the side bezel structure (210), or may be formed integrally with the side bezel structure (210). The support member (260) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The support member (260) may have a display (220) coupled to one surface and a printed circuit board (280) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (280). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor sensor processor, or a communication processor.

[0076] The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0077] The battery (270) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (270) may be disposed substantially on the same plane as, for example, the printed circuit board (280). The battery (270) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

[0078] The first antenna (250) may be positioned between the display (220) and the support member (260). The first antenna (250) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The first antenna (250) may, for example, perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (210) and / or the support member (260).

[0079] A second circuit board (255) may be disposed between the circuit board (280) and the back plate (293). The second circuit board (255) may include an antenna, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The second circuit board (255) may, for example, perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (210) and / or the back plate (293). In various embodiments, when the electronic device (200) (e.g., the electronic device (100) of FIGS. 2 and 3) includes a sensor module (e.g., the sensor module (111) of FIG. 3), a sensor circuit disposed on the second circuit board (255) or a sensor element (e.g., a photoelectric conversion element or an electrode pad) separate from the second circuit board (255) may be disposed. For example, an electronic component provided as the sensor module (111) may be disposed between the circuit board (280) and the rear plate (293).

[0080] A sealing member (290) may be positioned between the side bezel structure (210) and the rear plate (293). The sealing member (290) may be configured to block moisture and foreign substances from entering the space surrounded by the side bezel structure (210) and the rear plate (293) from the outside.

[0081] FIG. 5 is an exploded view of a portion of a display (300) of a wearable electronic device (200). FIG. 6 is a view of a panel (310) of the display (300). The components described with reference to FIGS. 5 and 6 may be partially or entirely identical to the components described with reference to FIGS. 1 to 4. The components described with reference to FIGS. 5 and 6 may be partially or entirely identical to the components described with reference to FIGS. 7 to 21.

[0082] The display (300) illustrated in FIG. 5 may be an exploded view of a portion (e.g., a portion cut into a square prism shape) of the display (220) illustrated in FIG. 4. The display (300) described with reference to FIG. 5 may be understood as a description of the cylindrical display (220) illustrated in FIG. 4.

[0083] According to one embodiment, the wearable electronic device (200) may include a display (300). The description of the display (300) may be identical to the description of the display described with reference to FIGS. 1 to 4 (e.g., the display (220) of FIG. 4).

[0084] According to one embodiment, the display (300) may include a panel (310). The panel (310) may be configured to output a screen.

[0085] According to one embodiment, the display (300) may include a first support member (301) and a second support member (302). The first and second support members (301, 302) may support the panel (310). The first and second support members (301, 302) may be the same as the bracket (260) described with reference to FIGS. 1 to 4.

[0086] According to one embodiment, the display (300) may include a window (303). The window (303) may cover the panel (310). The window (303) may be identical to the front plate (303) described with reference to FIGS. 1 to 4.

[0087] According to one embodiment, the panel (310) may include a substrate (320) and a pixel assembly (330). The substrate (320) and the pixel assembly (330) may be electrically connected. The pixel assembly (330) may be disposed on the substrate (320). The substrate (320) may be electrically connected to the printed circuit board (280) illustrated in FIG. 4. The pixel assembly (330) may configure the minimum unit of pixels required for screen output through the display (300). Each of the plurality of pixels (331) may include LEDs that implement RGB colors. Each of the plurality of pixels (331) may include a ground that is electrically connected to the LEDs.

[0088] FIG. 7 is a drawing illustrating an arrangement of pixels (330) of a display (300). FIG. 8 is a drawing illustrating an arrangement of pixels (330, 330a, 330b) of a display (300) according to various embodiments. FIG. 9 is a drawing illustrating an arrangement of pixels (330c) according to one embodiment of the present disclosure. The components described with reference to FIGS. 7 to 9 may be partly or entirely identical to the components described with reference to FIGS. 1 to 6. The components described with reference to FIGS. 7 to 9 may be partly or entirely identical to the components described with reference to FIGS. 10 to 21.

[0089] According to one embodiment, the display (300) may include a pixel assembly (330). The pixel assembly (330) may include pixels (331). A plurality of pixels (331) may be arranged on the substrate (320). The pixel (331) may be the smallest unit pixel for screen output through the display (300).

[0090] In one embodiment, a pixel (331) may include an LED (332). The LED (332) may be configured to emit light. The LED (332) may be referred to as a “light source.” The LED (332) may include LEDs (3321, 3322, 3323) that emit light of different colors. For example, the LED (332) may include a first LED (3321) that emits red light, a second LED (3322) that emits green light, and a third LED (3323) that emits blue light. Each of the plurality of pixels (331) may include a first LED (3321), a second LED (3322), and a third LED (3323), respectively.

[0091] According to one embodiment, the pixel (331) may include a ground (333). The ground (333) may be electrically connected to an LED (332). The ground (333) may be electrically connected to the LED (332) and the substrate (320) to form a circuit.

[0092] According to one embodiment, the ground (333) may be placed between a plurality of LEDs (332). For example, the ground (333) may be placed in each of the plurality of pixels (331) and may be placed so as to be surrounded by the first, second, and third LEDs (3321, 3322, 3323).

[0093] According to one embodiment, the ground (333a) of the pixel assembly (330a) may be arranged to be surrounded by the first, second, and third LEDs (332a), and may be arranged in the same number as the LEDs (332a).

[0094] According to one embodiment, the ground (333b) of the pixel assembly (330b) may be arranged one per a plurality of pixels. The ground (333b) may be arranged to be surrounded by a plurality of LEDs (332b).

[0095] According to one embodiment, the first, second, and third LEDs (3321c, 3322c, and 3323c) and the ground (333c) constituting the pixel (331c) may have a rectangular prism shape. The side of the LED (332c) and the side of the ground (333c) may face each other.

[0096] Fig. 10 is a cross-sectional view taken along the A-A' reference line illustrated in Fig. 7. The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 1 to 9. The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 11 to 21.

[0097] In one embodiment, the substrate (320) may be a TFT substrate. The substrate (320) may include a body (321). The substrate (320) may include a cathode (322). The cathode (322) may protrude from the body (321). The cathode (322) may be connected to an LED (332). The substrate (320) may include an anode (323). The anode (323) may protrude from the body (321). The anode (323) may be connected to a ground (333).

[0098] According to one embodiment, the LED (332) may be connected to the cathode (322) of the substrate (320). The ground (333) may be connected to the anode (323) of the substrate (320).

[0099] According to one embodiment, the display (300) may include an insulating layer (340). At least a portion of the insulating layer (340) may be disposed between the LED (332) and the ground (333). The insulating layer (340) may include a non-conductive material.

[0100] According to one embodiment, the display (300) may include a conductive coating layer (350). The conductive coating layer (350) may be laminated with an insulating layer (340). The conductive coating layer (350) may include a conductive material. The conductive coating layer (350) may cover at least a portion of the LED (332). The conductive coating layer (350) may cover at least a portion of the ground (333). The conductive coating layer (350) may be electrically connected to the LED (332). The conductive coating layer (350) may be electrically connected to the ground (333). The conductive coating layer (350) may extend in a first direction (e.g., +X direction) in which the LED (332) and the ground (333) are arranged.

[0101] According to one embodiment, the LED (332) may include a light emitter (3324). The light emitter (3324) may generate light when current is applied to the light emitter.

[0102] According to one embodiment, the LED (332) may include a first electrode (3325). The first electrode (3325) may be electrically connected to a cathode (322) of the substrate (320).

[0103] In one embodiment, the LED (332) may include a first wall (3326). The first wall (3326) may surround the light emitter (3324). The first wall (3326) may form a perimeter wall of the LED (332). The first wall (3326) may include a non-conductive material. The first wall (3326) may be inclined with respect to a second direction (e.g., a +Y direction) that is perpendicular to a first direction (e.g., a +X direction). The first wall (3326) may be inclined with respect to the first direction in which the LED (332) and the ground (333) are arranged. The first wall (3326) may be inclined with respect to a second direction that is perpendicular to the first direction. The first wall (3326) may have an inclination angle (A1) with respect to the second direction.

[0104] According to one embodiment, the LED (332) may include an LED electrode (3327). The LED electrode (3327) may be spaced apart from the first electrode (3325) in a second direction (+Y direction). The LED electrode (3327) may be in contact with the conductive coating layer (350).

[0105] According to one embodiment, the ground (333) may include a conductive body (3334). The conductive body (3334) may be in contact with the conductive coating layer (350).

[0106] According to one embodiment, the ground (333) may include a second electrode (3335). The second electrode (3335) may be connected to the anode (323) of the substrate (320).

[0107] In one embodiment, the ground (333) may include a second wall (3336). The second wall (3336) may surround the conductive body (3334). The second wall (3336) may form a perimeter wall of the ground (333). The second wall (3336) may include a non-conductive material. The second wall (3336) may be inclined with respect to a second direction (e.g., +Y direction) that is perpendicular to a first direction (e.g., +X direction). The second wall (3336) may be inclined with respect to the first direction in which the LEDs (332) and the ground (333) are arranged. The second wall (3336) may be inclined with respect to a second direction that is perpendicular to the first direction. The second wall (3336) may have an inclination angle (A2) with respect to the second direction.

[0108] According to one embodiment, the display (300) may include an adhesive layer (360). The adhesive layer (360) may secure the LED (332) and the ground (333) to the substrate (320). The adhesive layer (360) may include a first adhesive layer (361) disposed between the cathode (322) and the first electrode (3325). The first adhesive layer (361) may bond the cathode (322) and the first electrode (3325). The first adhesive layer (361) may include a conductive material. The cathode (322) and the first electrode (3325) may be electrically conductive through the first adhesive layer (361). The adhesive layer (360) may include a second adhesive layer (362) disposed between the anode (323) and the second electrode (3335). The second adhesive layer (362) can bond the anode (323) and the second electrode (3335). The second adhesive layer (362) can include a conductive material. The anode (323) and the second electrode (3335) can be electrically connected through the second adhesive layer (362).

[0109] Fig. 11 is a portion of a cross-section of a display (300). The components described with reference to Fig. 11 may be partially or entirely identical to the components described with reference to Figs. 1 to 10. The components described with reference to Fig. 11 may be partially or entirely identical to the components described with reference to Figs. 12 to 21.

[0110] According to one embodiment, the display (300) may include a first adhesive portion (334). The first adhesive portion (334) may include a portion where the LED (332) and the substrate (320) are bonded. The cathode (322) and the first electrode (3325) may be bonded within the first adhesive portion (334). The first adhesive layer (361) may bond the cathode (322) and the first electrode (3325) within the first adhesive portion (334).

[0111] According to one embodiment, the display (300) may include a second adhesive portion (335). The second adhesive portion (335) may include a portion where the LED (332) and the conductive coating layer (350) are bonded. The LED electrode (3327) and the conductive coating layer (350) may be bonded within the second adhesive portion (335). The third adhesive layer (363) may bond the LED electrode (3327) and the conductive coating layer (350) within the second adhesive portion (335).

[0112] According to one embodiment, the first adhesive layer (361) may include a conductive material. The first adhesive layer (361) may include a metal material. The first adhesive layer (361) may be formed by solidifying a molten metal material. The cathode (322) and the first electrode (3325) may be bonded by the first adhesive layer (361) formed by solidifying a molten metal material between the cathode (322) and the first electrode (3325). The first adhesive layer (361) and the second adhesive layer (362) may be formed by a soldering process.

[0113] In one embodiment, the cathode (322) may include copper (Cu). The first electrode (3325) may include gold (Au). The first adhesive layer (361) may include a first-first adhesive layer (3611) and a first-second adhesive layer (3612). The first-first adhesive layer (3611) may be bonded to the cathode (322). The first-first adhesive layer (3611) may include a metal compound (e.g., (Au, Ni, Cu)6Sn5)). The first-first adhesive layer (3611) may include gold (Au), nickel (Ni), copper (Cu), or tin (Sn). The first-second adhesive layer (3612) may be bonded to the first electrode (3325). The first-second adhesive layer (3612) may include a metal compound (e.g., AuSn). The first-second adhesive layer (3612) may include gold (Au) and tin (Sn). The first adhesive layer (361) may be referred to as a "reaction layer." The first adhesive layer (361) may be referred to as a "deposition layer."

[0114] According to one embodiment, the description of the first adhesive layer (361) described above can be equally applied to the second adhesive layer (362). For example, the second adhesive layer (362) can bond the second electrode (3325) of the ground (333) and the anode (323) of the substrate (320) by a soldering process.

[0115] FIG. 12 is a block diagram illustrating a method (910) for manufacturing a display (300) according to one embodiment of the present disclosure. FIG. 13a is a diagram illustrating a part (911, 912) of a method for manufacturing a display (300) according to one embodiment of the present disclosure. FIG. 13b is a diagram illustrating a part (913, 914, 915, 916, 917) of a method for manufacturing a display (300) according to one embodiment of the present disclosure. FIG. 14 is a diagram illustrating a part (914) of a method for manufacturing a display (300) according to one embodiment of the present disclosure. The components described with reference to FIGS. 12 to 14 may be part or all the same as the components described with reference to FIGS. 1 to 11. The components described with reference to FIGS. 12 to 14 may be part or all the same as the components described with reference to FIGS. 15 to 21.

[0116] According to one embodiment, a method (910) for manufacturing a display (300) may include an operation (911) of preparing a substrate. The operation (911) of preparing a substrate may include an operation of preparing a substrate (320) including a cathode (322) and an anode (323).

[0117] According to one embodiment, the method (910) for manufacturing a display (300) may include an operation (912) of manufacturing a ground. The operation (912) of manufacturing a ground may include an operation of manufacturing a ground (333) having an inclined shape.

[0118] According to one embodiment, the operation (912) of manufacturing a ground may include an operation of preparing a first carrier (931) including a substrate layer (932) and an electrode layer (933). The operation (912) of manufacturing a ground may include an operation of placing a molding layer (934) having a molding space (935) formed on the electrode layer (933). The operation (912) of manufacturing a ground may include an operation of manufacturing a conductive body (3334) inside the molding space (935) of the molding layer (934). The molding space (935) may be inclined with respect to the first and second directions. The conductive body (3334) may be manufactured in a shape corresponding to the molding space (935). The operation (912) of manufacturing a ground may include an operation of removing the molding layer (934) after the conductive body (3334) is formed inside the molding space (935). The conductive body (3334) may have an inclination angle (A2) with respect to the second direction. The operation (912) of manufacturing a ground may include an operation of cutting the substrate layer (932) and the electrode layer (933) at positions corresponding to the conductive body (3334). The operation (912) of manufacturing a ground may include an operation of arranging a second wall (3336) along the perimeter of the conductive body (3334).

[0119] According to one embodiment, the method (910) for manufacturing a display (300) may include an operation (913) of assembling an LED. The operation (913) of assembling an LED may include an operation of assembling an LED (332) onto a cathode (322) of a substrate (320).

[0120] According to one embodiment, the operation (913) of assembling the LED may include an operation of irradiating a base layer (937) of an LED (332) carried by a second carrier (936) with a laser (938) to place the LED (332) on top of the cathode (322). The first electrode (3325) of the LED (332) may be placed on top of the cathode (322).

[0121] According to one embodiment, the method (910) for manufacturing a display (300) may include an operation of assembling a ground (914). The operation of assembling a ground (914) may include an operation of assembling a ground (333) to an anode (323) of a substrate (320).

[0122] According to one embodiment, the act of assembling the ground (914) may include an act of irradiating a laser (938) onto a substrate layer (932) of the ground (333) carried via a first carrier (931) to place the ground (333) on the anode (323). A second electrode (3335) of the ground (333) may be placed on the anode (323).

[0123] In one embodiment, the act of assembling the ground (914) may include an act of rotating the ground (333) along the rotational direction (R1) so as not to interfere with the LED (332). The ground (333) may be positioned through rotation so that the second electrode (3335) corresponds to the anode (323).

[0124] According to one embodiment, the manufacturing method (910) of the display (300) may include a bonding operation (915). The bonding operation (915) may include an operation of bonding the cathode (322) and the first electrode (3325) through a soldering process of the first adhesive layer (361). The bonding operation (915) may include an operation of bonding the anode (323) and the second electrode (3335) through a soldering process of the second adhesive layer (362).

[0125] In one embodiment, the bonding operation (915) may include solidifying the first adhesive layer (361) and the second adhesive layer (362) through a soldering process. The first adhesive layer (361) may bond the first electrode (3325) and the cathode (332). The second adhesive layer (362) may bond the second electrode (3335) and the anode (333).

[0126] According to one embodiment, the method (910) for manufacturing a display (300) may include an insulating layer filling operation (916). The insulating layer filling operation (916) may include an operation of filling an insulating layer (340) between an LED (332) and a ground (333).

[0127] According to one embodiment, the method (910) for manufacturing a display (300) may include an operation (917) of placing a coating layer. The operation (917) of placing a coating layer may include an operation of coupling a conductive coating layer (350) to an LED (332) and a ground (333).

[0128] FIG. 15 is a block diagram illustrating a method (920) for manufacturing a display (300) according to one embodiment of the present disclosure. FIG. 16 is a diagram illustrating a part (925, 926) of a method for manufacturing a display (300) according to one embodiment of the present disclosure. FIG. 17 is a part of a cross-sectional view of a display (300) manufactured through a method (920) for manufacturing a display (300) according to one embodiment of the present disclosure. The components described with reference to FIGS. 15 to 17 may be partly or entirely the same as the components described with reference to FIGS. 1 to 14. The components described with reference to FIGS. 15 to 17 may be partly or entirely the same as the components described with reference to FIGS. 18 to 21.

[0129] According to one embodiment, the method (920) for manufacturing a display (300) may include an operation (921) of preparing a substrate. The method (920) for manufacturing a display (300) may include an operation (922) of manufacturing a ground. The method (920) for manufacturing a display (300) may include an operation (923) of filling an insulating layer. The method (920) for manufacturing a display (300) may include an operation (924) of assembling an LED. The method (920) for manufacturing a display (300) may include an operation (925) of assembling a ground. The method (920) for manufacturing a display (300) may include an operation (926) of curing an insulating layer. The method (920) for manufacturing a display (300) may include an operation (927) of disposing a coating layer. The manufacturing method (920) of the display (300) described with reference to FIGS. 15 to 17, unlike the manufacturing method (910) of the display (300) described with reference to FIGS. 12 to 14, can first place the insulating layer and then place the LED (332) and the ground (333).

[0130] In one embodiment, the operation of assembling the ground (925) may include an operation of placing the ground (333) by inserting it into the interior of the insulating layer (340) before it is cured. In the operation of assembling the ground (925), the insulating layer (340) may be an adhesive material including conductive particles (341). In the operation of assembling the ground (925), the insulating layer (340) may be a mixture of a solid state and a liquid state. In the operation of assembling the ground (925), the LED (332) may be placed on the substrate (320).

[0131] In one embodiment, the operation of curing the insulating layer (926) may include an operation of curing the insulating layer (340) after the LED (332) and the ground (333) are disposed on the substrate (320). When the insulating layer (340) is cured, the conductive particles (341) within the insulating layer (340) may move between the LED (332) and the cathode (322) to form a first adhesive layer (361). When the insulating layer (340) is cured, the conductive particles (341) within the insulating layer (340) may move between the ground (333) and the anode (323) to form a second adhesive layer (362). The conductive particles (341) may be cured to bond the first electrode (3325) and the cathode (322). The conductive particles (341) can be cured to bond the second electrode (3335) and the anode (323). The conductive particles (341) can include first conductive particles (3614) that are cured between the first electrode (3325) and the cathode (322) and second conductive particles (3624) that are cured between the second electrode (3335) and the anode (323).

[0132] FIG. 18 is a cross-sectional view of a display (400) according to one embodiment of the present disclosure. The components described with reference to FIG. 18 may be partially or entirely identical to the components described with reference to FIGS. 1 to 17.

[0133] According to one embodiment, the display (400) may include an LED (432) and a ground (433). The description of the LED (432) and the ground (433) may be identical to the description of the LED (332) and the ground (333) described with reference to FIGS. 1 to 17.

[0134] According to one embodiment, the LED (432) can be inclined with respect to a first direction in which the LED (432) and the ground (433) are arranged. The ground (433) can be inclined with respect to the first direction. The LED (432) can be inclined with respect to a second direction perpendicular to the first direction. The ground (433) can be inclined with respect to a second direction perpendicular to the first direction. The LED (432) can have an inclined angle (A1) with respect to the second direction. The ground (433) can have an inclined angle (A2) with respect to the second direction. In the display according to the embodiment of the present disclosure, due to the inclined shapes of the LED and the ground, when coating the conductive coating layer (350, 450), the conductive coating layer (350, 450) is evenly distributed along the outer walls of the inclined LED and the ground, thereby forming the thickness of the conductive coating layer (350, 450) constant.

[0135] According to one embodiment, the display (400) may include a substrate (420), an insulating layer (440), and a conductive coating layer (450). The description of the substrate (420), the insulating layer (440), and the conductive coating layer (450) may be identical to the description of the substrate (320), the insulating layer (340), and the conductive coating layer (350) described with reference to FIGS. 1 to 17.

[0136] According to one embodiment, the LED (432) may include an LED electrode (4327) and a first wall (4326). The description of the LED electrode (4327) and the first wall (4326) may be identical to the description of the LED electrode (3327) and the first wall (3326) described with reference to FIGS. 1 to 17.

[0137] In one embodiment, the first wall (4326) may include a first peripheral portion (4326a) and a first cover portion (4326b). The first cover portion (4326b) may protrude from the first peripheral portion (4326a). The first cover portion (4326b) may cover at least a portion of the LED electrode (4327).

[0138] According to one embodiment, the ground (433) may include a conductive body (4334) and a second wall (4336). The description of the conductive body (4334) and the second wall (4336) may be identical to the description of the conductive body (4334) and the second wall (4336) described with reference to FIGS. 1 to 17.

[0139] In one embodiment, the second wall (4336) may include a second peripheral portion (4336a) and a second cover portion (4336b). The second cover portion (4336b) may protrude from the second peripheral portion (4336a). The second cover portion (4336b) may cover at least a portion of the conductive body (4334).

[0140] In one embodiment, a conductive coating layer (450) can be coated along the LED (432) and the ground (433). At least a portion of the conductive coating layer (450) can extend along the inclined first and second walls (4326, 4336).

[0141] According to one embodiment, the conductive coating layer (450) may include a coating portion (451) extending along the insulating layer (440). The coating portion (451) may be located between the LED (432) and the ground (433).

[0142] According to one embodiment, the conductive coating layer (450) may include a first inclined portion (452) extending obliquely along the first wall (4326). The first inclined portion (452) may extend from the coating portion (451) in a direction away from the insulating layer (440).

[0143] According to one embodiment, the conductive coating layer (450) may include a first banding portion (453) extending along the first cover portion (4326b). The first banding portion (453) may extend by bending from the first inclined portion (452).

[0144] In one embodiment, the conductive coating layer (450) may include a first connecting portion (454) extending along the LED electrode (4327). The first connecting portion (454) may be bent and extended from the first bending portion (453). The first connecting portion (454) may be electrically connected to the LED electrode (4327).

[0145] According to one embodiment, the conductive coating layer (450) may include a second inclined portion (455) extending obliquely along the second wall (4336). The second inclined portion (455) may extend from the coating portion (451) in a direction away from the insulating layer (440).

[0146] According to one embodiment, the conductive coating layer (450) may include a second bending portion (456) extending along the second cover portion (4336b). The second bending portion (456) may extend by bending from the second inclined portion (455).

[0147] In one embodiment, the conductive coating layer (450) may include a second connecting portion (457) extending along the conductive body (4334). The second connecting portion (457) may be bent and extended from the second bending portion (456). The second connecting portion (457) may be electrically connected to the conductive body (4334).

[0148] According to one embodiment, the conductive coating layer (450) may have a substantially uniform thickness (t) along the first direction. The conductive coating layer (450) may have a coated surface guided by the inclined first and second walls (4326, 4336), thereby ensuring a constant coating thickness.

[0149] FIG. 19 is a cross-sectional view of a display (500) according to one embodiment of the present disclosure. The components described with reference to FIG. 19 may be partially or entirely identical to the components described with reference to FIGS. 1 to 17.

[0150] According to one embodiment, the display (500) may include an LED (532) and a ground (533). The description of the LED (532) and the ground (533) may be identical to the description of the LED (332) and the ground (333) described with reference to FIGS. 1 to 17.

[0151] According to one embodiment, the LED (532) can be inclined with respect to a first direction in which the LED (532) and the ground (533) are arranged. The ground (533) can be inclined with respect to the first direction. The LED (532) can be inclined with respect to a second direction perpendicular to the first direction. The ground (533) can be inclined with respect to the second direction perpendicular to the first direction. The LED (532) can have an inclination angle (A1) with respect to the second direction. The ground (533) can have an inclination angle (A2) with respect to the second direction. In the display according to the embodiment of the present disclosure, due to the inclined shape of the LED and the ground, when coating the conductive coating layer (350, 450, 550), the conductive coating layer (350, 450, 550) is evenly distributed along the outer wall of the inclined LED and the ground, thereby forming the thickness of the conductive coating layer (350, 450, 550) constant.

[0152] According to one embodiment, the display (500) may include a substrate (520), an insulating layer (540), and a conductive coating layer (550). The description of the substrate (520), the insulating layer (540), and the conductive coating layer (550) may be identical to the description of the substrate (320), the insulating layer (340), and the conductive coating layer (350) described with reference to FIGS. 1 to 17.

[0153] According to one embodiment, the LED (532) may include an LED electrode (5327) and a first wall (5326). The description of the LED electrode (5327) and the first wall (5326) may be identical to the description of the LED electrode (3327) and the first wall (3326) described with reference to FIGS. 1 to 17.

[0154] According to one embodiment, the first wall (5326) may include a first peripheral portion (5326a) and a first cover portion (5326b). The first cover portion (5326b) may protrude from the first peripheral portion (5326a). The first cover portion (5326b) may cover at least a portion of the LED electrode (5327).

[0155] According to one embodiment, the ground (533) may include a conductive body (5334) and a second wall (5336). The description of the conductive body (5334) and the second wall (5336) may be identical to the description of the conductive body (4334) and the second wall (4336) described with reference to FIGS. 1 to 17.

[0156] In one embodiment, the second wall (5336) may include a second peripheral portion (5336a) and a second cover portion (5336b). The second cover portion (5336b) may protrude from the second peripheral portion (5336a). The second cover portion (5336b) may cover at least a portion of the conductive body (5334).

[0157] In one embodiment, a conductive coating layer (550) can be coated along the LED (532) and the ground (533). At least a portion of the conductive coating layer (550) can extend along the inclined first and second walls (5326, 5336).

[0158] According to one embodiment, the conductive coating layer (550) may include a coating portion (551) extending along the insulating layer (540). The coating portion (551) may be positioned at a corresponding position between the LED (532) and the ground (533).

[0159] According to one embodiment, the conductive coating layer (550) may include a first inclined portion (552) extending obliquely toward the LED electrode (5327). The first inclined portion (552) may extend from the coating portion (551) in a direction toward the insulating layer (540). A portion of the insulating layer (540) may form an inclined surface by the first wall (5326), and the first inclined portion (552) may extend obliquely along the inclined surface of the insulating layer (540).

[0160] In one embodiment, the conductive coating layer (550) may include a first connecting portion (554) extending along the LED electrode (5327). The first connecting portion (554) may extend by bending from the first inclined portion (552). The first connecting portion (554) may be electrically connected to the LED electrode (5327).

[0161] According to one embodiment, the conductive coating layer (550) may include a second inclined portion (555) extending obliquely toward the conductive body (5334). The second inclined portion (555) may extend from the coating portion (551) in a direction toward the insulating layer (540). A portion of the insulating layer (540) may form an inclined surface by the second wall (5336), and the second inclined portion (555) may extend obliquely along the inclined surface of the insulating layer (540).

[0162] According to one embodiment, the conductive coating layer (550) may include a second connecting portion (557) extending along the conductive body (5334). The second connecting portion (557) may be bent and extended from the second inclined portion (555). The second connecting portion (557) may be electrically connected to the conductive body (5334).

[0163] According to one embodiment, the conductive coating layer (550) can have a substantially uniform thickness (t) along the first direction. The conductive coating layer (550) can have a uniform coating thickness by having a surface to be coated guided by the inclined surface of the insulating layer (540) formed by the inclined first and second walls (5326, 5336).

[0164] FIG. 20 is a cross-sectional view of a display (300) according to one embodiment of the present disclosure. The components described with reference to FIG. 20 may be partially or entirely identical to the components described with reference to FIGS. 1 to 19.

[0165] According to one embodiment, the display (300) may include a substrate (320) and first, second, and third LEDs (3321, 3322, 3323) connected to the substrate (320). The heights (H1, H2, H3) at which the first, second, and third LEDs (3321, 3322, 3323) protrude from the substrate (320) may be different from each other. The heights (H1, H2, H3) at which the first, second, and third LEDs (3321, 3322, 3323) protrude from the substrate (320) and the height (H4) at which the ground (333) protrudes from the substrate (320) may be different from each other. In the display (300) according to the embodiment of the present disclosure, even though the first, second, and third LEDs (3321, 3322, 3323) and the ground (333) have different protruding heights from the substrate (320), the thickness of the conductive coating layer (350) can be formed uniformly due to the inclined structure of the first, second, and third LEDs (3321, 3322, 3323) and the ground (333).

[0166] According to one embodiment, the conductive coating layer (350) may include a coating portion (351), an inclined portion (352a, 352b, 352c, 354), and a connecting portion (353a, 353b, 353c, 355). The coating portion (351) may be positioned between the LEDs (3321, 3322, 3323). The coating portion (351) may be positioned between the LED (3323) and the ground (333). The inclined portions (352a, 352b, 352c, 354) may extend inclinedly from the coating portion (351) along the first and second walls (3326a, 3326b, 3326c, 3336). The connecting portions (353a, 353b, 353c, 355) can be bent and extended from the inclined portions (352a, 352b, 352c, 354) and can be electrically connected to the LED (332) and the ground (333). In the display (300) according to the embodiment of the present disclosure, the thickness of the conductive coating layer (350) can be formed to be constant due to the inclined structure of the first and second walls (3326a, 3326b, 3326c, 3336).

[0167] FIG. 21 is a diagram illustrating grounding according to various embodiments of the present disclosure. The components described with reference to FIG. 21 may be partially or entirely identical to the components described with reference to FIGS. 1 to 20.

[0168] According to one embodiment (A), the ground (333) may include a conductive body (3334).

[0169] According to one embodiment (B), the ground (333) may include a conductive body (3334) and a second wall (3336).

[0170] According to one embodiment (C), the ground (333) may include a conductive body (3334), a second wall (3336), and an anti-oxidation layer (3337) connected to the conductive body (3334).

[0171] According to one embodiment (D), the ground (333) may include a conductive body (3334), a second wall (3336), a second adhesive layer (362), and a soldering layer (3338).

[0172] According to one embodiment (E), the ground (333) may include a second wall (3336) including a banding portion (33362) bent toward one side of the peripheral wall (33361) and the conductive body (3334).

[0173] According to one embodiment (F), the ground (333) may include a conductive body (3334) including a first conductive portion (33361) located inside the second wall (3336) and a second conductive portion (33342) protruding outside the second wall (3336).

[0174] According to one embodiment, the ground (333) may include a second wall (3336) including a bending portion (33362) bent toward one side of the peripheral wall (33361) and the conductive body (3334), a conductive body (3334) including a first conductive portion (33361) positioned inside the second wall (3336) and a second conductive portion (33342) protruding outwardly of the second wall (3336), an anti-oxidation layer (3337) connected to the second conductive portion (33342), a second adhesive layer (362), and a soldering layer (3338).

[0175] An electronic device includes a display that outputs a screen. The display includes an LED that emits light and a conductive via for grounding the LED. The conductive via is formed through an insulating layer and is prone to electrical connection failure with the LED. The display includes a conductive coating layer that covers the LED and the conductive via. When the thickness of the conductive coating layer is uneven, the grounding performance of the LED may be reduced.

[0176] The problem to be solved in the present disclosure may be to form a conductive coating layer with a uniform thickness.

[0177] A problem to be solved in the present disclosure may be to facilitate electrode connection between an LED, a ground, and a substrate.

[0178] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0179] An electronic device according to various embodiments of the present disclosure can have a conductive coating layer having a uniform thickness by applying the conductive coating layer along the inclined first and second walls.

[0180] Electronic devices according to various embodiments of the present disclosure can facilitate electrode bonding by bonding electrodes of an LED, a ground, and a substrate through a soldering process.

[0181] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0182] A display according to one embodiment of the present disclosure (e.g., 300 of FIGS. 1 to 21) may include a substrate (e.g., 320 of FIGS. 1 to 21) including a cathode (e.g., 322 of FIGS. 1 to 21) and an anode (e.g., 323 of FIGS. 1 to 21) spaced apart from each other in a first direction.

[0183] A display (e.g., 300 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include an LED (e.g., 332 of FIGS. 1 to 21) including a first electrode (e.g., 3325 of FIGS. 1 to 21) configured to be electrically connected to the cathode (e.g., 322 of FIGS. 1 to 21).

[0184] A display (e.g., 300 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include a second electrode (e.g., 3335 of FIGS. 1 to 21) configured to be electrically connected to the anode (e.g., 323 of FIGS. 1 to 21), and may include a ground (e.g., 333 of FIGS. 1 to 21) spaced apart from the LED (e.g., 332 of FIGS. 1 to 21) in the first direction.

[0185] A display according to one embodiment of the present disclosure (e.g., 300 of FIGS. 1 to 21) may include an insulator (e.g., 340 of FIGS. 1 to 21) disposed between the LED (e.g., 332 of FIGS. 1 to 21) and the ground (e.g., 333 of FIGS. 1 to 21).

[0186] A display according to one embodiment of the present disclosure (e.g., 300 of FIGS. 1 to 21) may include a conductive coating layer (e.g., 350 of FIGS. 1 to 21) that is laminated on the LED (e.g., 332 of FIGS. 1 to 21) and the ground (e.g., 333 of FIGS. 1 to 21) in a second direction perpendicular to the first direction, extends along the first direction, and electrically connects the LED (e.g., 332 of FIGS. 1 to 21) and the ground (e.g., 333 of FIGS. 1 to 21).

[0187] According to one embodiment of the present disclosure, the LED (e.g., 332 of FIGS. 1 to 21) may include a first wall (e.g., 3326 of FIGS. 1 to 21) inclined with respect to the second direction.

[0188] According to one embodiment of the present disclosure, the ground (e.g., 332 of FIGS. 1 to 21) may include a second wall (e.g., 3336 of FIGS. 1 to 21) inclined with respect to the second direction.

[0189] The conductive coating layer (e.g., 350 of FIGS. 1 to 21) according to one embodiment of the present disclosure may be configured to be coated with a substantially uniform first thickness along the first wall (e.g., 3326 of FIGS. 1 to 21) inclined with respect to the second direction.

[0190] The conductive coating layer (e.g., 350 of FIGS. 1 to 21) according to one embodiment of the present disclosure may be configured to be coated with the first thickness that is substantially uniform along the second wall (e.g., 3336 of FIGS. 1 to 21) inclined with respect to the second direction.

[0191] The conductive coating layer (e.g., 350 of FIGS. 1 to 21) according to one embodiment of the present disclosure may be configured to be coated on the insulating layer (e.g., 340 of FIGS. 1 to 21) and may be configured to extend along the first direction with the first thickness that is substantially uniform to cover the LED (e.g., 332 of FIGS. 1 to 21) and the ground (e.g., 333 of FIGS. 1 to 21).

[0192] According to one embodiment of the present disclosure, the first wall (e.g., 4326 of FIGS. 1 to 21) may include a first peripheral wall (e.g., 4326a of FIGS. 1 to 21) that surrounds the light emitting body (e.g., 3324 of FIGS. 1 to 21) and is inclined with respect to the second direction.

[0193] According to one embodiment of the present disclosure, the first wall (e.g., 4326 of FIGS. 1 to 21) may include a first covering portion (e.g., 4326b of FIGS. 1 to 21) that is bent from the first peripheral wall (e.g., 4326a of FIGS. 1 to 21) and covers at least a portion of the light emitting body (e.g., 3324 of FIGS. 1 to 21).

[0194] At least a portion of the conductive coating layer (e.g., 450 of FIGS. 1 to 21) according to one embodiment of the present disclosure may be configured to be coated along the first peripheral wall (e.g., 4326a of FIGS. 1 to 21) inclined with respect to the second direction.

[0195] The conductive coating layer (e.g., 450 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include a coating portion (e.g., 451 of FIGS. 1 to 21) positioned correspondingly between the LED (e.g., 432 of FIGS. 1 to 21) and the ground (e.g., 433 of FIGS. 1 to 21).

[0196] The conductive coating layer (e.g., 450 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include a banding portion (e.g., 453, 456 of FIGS. 1 to 21) extending from the coating portion (e.g., 451 of FIGS. 1 to 21) toward the LED (e.g., 432 of FIGS. 1 to 21) or the ground (e.g., 433 of FIGS. 1 to 21).

[0197] The conductive coating layer (e.g., 450 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include a connecting portion (e.g., 454, 457 of FIGS. 1 to 21) electrically connected to the LED (e.g., 432 of FIGS. 1 to 21) or the ground (e.g., 433 of FIGS. 1 to 21).

[0198] The LED (e.g., 432 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include a light emitting body (e.g., 3324 of FIGS. 1 to 21).

[0199] The LED (e.g., 432 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include an LED electrode (e.g., 4327 of FIGS. 1 to 21) connected to the light-emitting body (e.g., 3324 of FIGS. 1 to 21).

[0200] The conductive coating layer (e.g., 450 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include a connecting portion (e.g., 454 of FIGS. 1 to 21) extending along the LED electrode (e.g., 4327 of FIGS. 1 to 21).

[0201] The conductive coating layer according to one embodiment of the present disclosure (e.g., 350 of FIGS. 1 to 21) may be extended in a band with the first thickness being substantially uniform along the first direction.

[0202] According to one embodiment of the present disclosure, the LED (e.g., 332 of FIGS. 1 to 21) may include a first LED (e.g., 3321 of FIGS. 1 to 21) configured to generate a first color and protruding from the substrate (e.g., 320 of FIGS. 1 to 21) by a first height (e.g., H1 of FIGS. 1 to 21).

[0203] According to one embodiment of the present disclosure, the LED (e.g., 332 of FIGS. 1 to 21) may include a second LED (e.g., 3322 of FIGS. 1 to 21) configured to generate a second color different from the first color and protruding from the substrate (e.g., 320 of FIGS. 1 to 21) by a second height (e.g., H2 of FIGS. 1 to 21) different from the first height (e.g., H1 of FIGS. 1 to 21).

[0204] The conductive coating layer (e.g., 350 of FIGS. 1 to 21) according to one embodiment of the present disclosure may be configured to coat the first LED (e.g., 3321 of FIGS. 1 to 21) and the second LED (e.g., 3322 of FIGS. 1 to 21) with the first thickness that is substantially uniform along the first direction.

[0205] A display according to one embodiment of the present disclosure (e.g., 300 of FIGS. 1 to 21) may include an adhesive layer (e.g., 360 of FIGS. 1 to 21) including a first adhesive layer (e.g., 361 of FIGS. 1 to 21) that joins the first electrode (e.g., 3325 of FIGS. 1 to 21) and the cathode (e.g., 322 of FIGS. 1 to 21) and a second adhesive layer (e.g., 362 of FIGS. 1 to 21) that joins the second electrode (e.g., 3335 of FIGS. 1 to 21) and the anode (e.g., 323 of FIGS. 1 to 21).

[0206] The adhesive layer according to one embodiment of the present disclosure (e.g., 360 of FIGS. 1 to 21) may include a metal material solidified from a molten state.

[0207] The adhesive layer (e.g., 360 of FIGS. 1 to 21) according to one embodiment of the present disclosure may include conductive particles (e.g., 341 of FIGS. 1 to 21) that have been moved and cured from the insulating layer (e.g., 340 of FIGS. 1 to 21).

[0208] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

[0209] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In the display (300), A substrate (320) including a cathode (322) and an anode (323) spaced apart from each other in a first direction; An LED (332) including a first electrode (3325) configured to be electrically connected to the cathode (322); A second electrode (3335) configured to be electrically connected to the anode (323), and a ground (333) spaced apart from the LED (332) in the first direction; An insulator (340) placed between the LED (332) and the ground (333); and A conductive coating layer (350) is laminated on the LED (332) and the ground (333) in a second direction perpendicular to the first direction, extends along the first direction, and electrically connects the LED (332) and the ground (333). The LED (332) includes a first wall (3326) inclined with respect to the second direction, The above ground (333) includes a second wall (3336) inclined with respect to the second direction, The above conductive coating layer (350) is It is configured to be coated with a substantially uniform first thickness along the first wall (3326) inclined with respect to the second direction, A display configured to be coated with a substantially uniform first thickness along the second wall (3336) inclined with respect to the second direction.

2. In paragraph 1, The above conductive coating layer (350) is A display configured to be coated on the insulating layer (340) and extending along the first direction with the first thickness being substantially uniform to cover the LED (332) and the ground (333).

3. In paragraph 1 or 2, The above first wall (4326) is, A first peripheral wall (4326a) surrounding the light emitting body (3324) and inclined with respect to the second direction; and It includes a first cover portion (4326b) that is banded from the first peripheral wall (4326a) and covers at least a portion of the light emitting body (3324), A display configured such that at least a portion of the conductive coating layer (450) is coated along the first peripheral wall (4326a) inclined with respect to the second direction.

4. In any one of paragraphs 1 to 3, The above conductive coating layer (450) is A coating portion (451) positioned correspondingly between the LED (432) and the ground (433); A banding portion (453, 456) extending from the coating portion (451) toward the LED (432) or the ground (433); and A display including a connection portion (454, 457) electrically connected to the LED (432) or the ground (433).

5. In any one of paragraphs 1 to 4, The above LED (432) is luminous body (3324); and Includes an LED electrode (4327) connected to the above light emitting body (3324), The above conductive coating layer (450) is A display including a connecting portion (454) extending along the above LED electrode (4327).

6. In any one of paragraphs 1 to 5, The above conductive coating layer (350) is A display that is extended and banded along the first direction and has a substantially uniform first thickness.

7. In any one of paragraphs 1 to 6, The above LED (332) is A first LED (3321) configured to generate a first color and protruding from the substrate (320) by a first height (H1); and A second LED (3322) configured to generate a second color different from the first color and protruding from the substrate (320) by a second height (H2) different from the first height (H1), The above conductive coating layer (350) is A display configured to coat the first LED (3321) and the second LED (3322) with the first thickness being substantially uniform along the first direction.

8. In any one of paragraphs 1 to 7, A display further comprising an adhesive layer (360) including a first adhesive layer (361) that combines the first electrode (3325) and the cathode (322) and a second adhesive layer (362) that combines the second electrode (3335) and the anode (323).

9. In paragraph 8, The above adhesive layer (360) is A display comprising a metallic material solidified from a molten state.

10. In paragraph 8, The above adhesive layer (360) is A display comprising conductive particles (341) that have been moved and hardened from the insulating layer (340).

11. In the manufacturing method of the display, An operation of preparing a substrate (320) including a cathode (322) and an anode (323); An operation of manufacturing an LED (332) including a first wall (3326) inclined with respect to the direction in which it is assembled to the substrate (320) and a ground (333) including a second wall (3336) inclined with respect to the direction in which it is assembled to the substrate (320); An operation of assembling the LED (332) and the ground (333) to the substrate (320); An operation of placing an insulating layer (340) between the LED (332) and the ground (333); and A method for manufacturing a display, comprising the action of coating a conductive coating layer (350) along the first wall (3326), the second wall (3336) and the insulating layer (340).

12. In paragraph 11, The above conductive coating layer (350) is A method for manufacturing a display configured to be coated on the insulating layer (340) and extended with a substantially uniform first thickness to cover the LED (332) and the ground (333).

13. In paragraph 11 or 12, The above conductive coating layer (450) is A coating portion (451) positioned correspondingly between the LED (432) and the ground (433); A banding portion (453, 456) extending from the coating portion (451) toward the LED (432) or the ground (433); and A method for manufacturing a display including a connection portion (454, 457) electrically connected to the LED (432) or the ground (433).

14. In any one of paragraphs 11 to 13, An operation of forming a first adhesive layer (361) by solidifying a molten metal material between the LED (332) and the cathode (322); and A method for manufacturing a display further comprising an operation of solidifying a molten metal material between the ground (333) and the anode (323) to form a second adhesive layer (362).

15. In any one of paragraphs 11 to 14, An operation in which conductive particles (341) included in the insulating layer (340) are cured between the LED (332) and the cathode (322) to form a first adhesive layer (361); and A method for manufacturing a display further comprising an operation of curing conductive particles (341) included in the insulating layer (340) between the ground (333) and the anode (323) to form a second adhesive layer (362).

Images