Display module and display device

Abstract

A display module and a display device (1000). A support plate (100) of the display module comprises a carbon fiber layer (11), a barrier layer (12), and a conductive layer (13). The carbon fiber layer (11) comprises a first resin (111) and carbon fibers (xw). The barrier layer (12) is arranged on the carbon fiber layer (11). The conductive layer (13) is arranged on the side of the barrier layer (12) away from the carbon fiber layer (11). The conductive layer (13) comprises a second resin (131) and conductors (dd), the conductors (dd) being dispersed in the second resin (131). The barrier layer (12) is configured to prevent the first resin (111) and the second resin (131) from intermixing.

Description

Display modules and display devices Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and display device. Background Technology

[0002] Carbon fiber composite sheets, due to their lightweight and high strength, are used as folding support plates in foldable phone screens. Compared to metal support plates, carbon fiber composite sheets lack electrical conductivity due to the resin matrix. To address this conductivity issue, a layer of metallic nickel is currently sputtered onto the surface of the carbon fiber composite sheet to achieve surface conductivity. However, this method is costly, and the high sputtering temperature affects the flatness of the carbon fiber composite sheet, leading to a decrease in yield. Invention Overview

[0003] This application provides a display module and display device that can reduce the manufacturing cost of the support plate and improve the yield of the support plate.

[0004] On one hand, embodiments of this application provide a display module, including a support plate for supporting a flexible display panel, the support plate comprising:

[0005] The carbon fiber layer comprises a first resin and carbon fibers; and

[0006] A barrier layer is disposed on the carbon fiber layer;

[0007] A conductive layer is disposed on the side of the barrier layer away from the carbon fiber layer, the conductive layer comprising a second resin and a conductor, the conductor being dispersed in the second resin;

[0008] The barrier layer is configured to prevent the first resin and the second resin from fusing together.

[0009] On the other hand, correspondingly, embodiments of this application also provide a display device, which includes the display module of any of the above embodiments;

[0010] The conductive layer is disposed on the side of the carbon fiber layer away from the display panel, and the conductive layer is configured to at least cover the electronic components. Attached Figure Description

[0011] Figure 1 is a cross-sectional structural diagram of a support plate provided in an embodiment of this application;

[0012] Figure 2 is a plan view of a support plate provided in an embodiment of this application;

[0013] Figure 3 is another planar schematic diagram of the support plate provided in an embodiment of this application;

[0014] Figure 4 is another planar schematic diagram of the support plate provided in the embodiment of this application;

[0015] Figure 5 is a schematic cross-sectional view of another support plate provided in an embodiment of this application;

[0016] Figure 6 is a schematic diagram of the structure of the display device provided in an embodiment of this application. Embodiments of the present invention

[0017] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific implementation methods described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, the embodiments can be combined with each other but will not be described in detail one by one. Unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device; the terms "first," "second," "third," etc. are only used as markings and do not impose numerical requirements or establish a sequence.

[0018] This application provides a support plate, a display module, and a display device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0019] On one hand, embodiments of this application provide a display module, including a support plate for supporting a flexible display panel, the support plate comprising:

[0020] The carbon fiber layer comprises a first resin and carbon fibers; and

[0021] A barrier layer is disposed on the carbon fiber layer;

[0022] A conductive layer is disposed on the side of the barrier layer away from the carbon fiber layer, the conductive layer comprising a second resin and a conductor, the conductor being dispersed in the second resin;

[0023] The barrier layer is configured to prevent the first resin and the second resin from fusing together.

[0024] Optionally, in some embodiments of this application, the softening temperature of the barrier layer is greater than or equal to 110 degrees Celsius.

[0025] Optionally, in some embodiments of this application, the thickness of the barrier layer is between 3 micrometers and 8 micrometers.

[0026] Optionally, in some embodiments of this application, the molecular weight of the barrier layer is greater than 10,000 D.

[0027] Optionally, in some embodiments of this application, the thickness of the barrier layer is less than or equal to 1 micrometer.

[0028] Optionally, in some embodiments of this application, one side of the barrier layer is directly connected to the carbon fiber layer, and the other side of the barrier layer is directly connected to the conductive layer.

[0029] Optionally, in some embodiments of this application, the carbon fiber includes a first carbon fiber and a second carbon fiber, wherein the first carbon fiber is dispersed in the first resin, and a portion of the second carbon fiber is disposed in the first resin and a portion of the second carbon fiber is disposed in the barrier layer.

[0030] Optionally, in some embodiments of this application, the carbon fiber includes a first carbon fiber and a second carbon fiber, the first carbon fiber is dispersed in the first resin, a portion of the second carbon fiber is disposed in the first resin, a portion of the second carbon fiber is disposed in the barrier layer, the second carbon fiber penetrates the barrier layer, and a portion of the second carbon fiber is connected to the conductor.

[0031] Optionally, in some embodiments of this application, the material of the barrier layer includes a thermoplastic resin, and both the first resin and the second resin include thermosetting resins;

[0032] The carbon fiber layer, the barrier layer, and the conductive layer are integrally hot-pressed to form the support plate.

[0033] Optionally, in some embodiments of this application, the material of the barrier layer includes a thermoplastic resin, and both the first resin and the second resin include thermosetting resins;

[0034] The barrier layer is a coating, and the barrier layer is formed on the surface of the conductive layer to form a conductive composite layer. The conductive composite layer and the carbon fiber layer are integrally hot-pressed to form the support plate.

[0035] Optionally, in some embodiments of this application, the conductor includes at least one of conductive particles and conductive fibers, and in the conductive layer, the content of the conductor is between 70% and 92%, and the content of the second resin is between 8% and 30%.

[0036] Optionally, in some embodiments of this application, the conductive layer and the barrier layer are directly connected to form a conductive composite layer, and the surface resistance of the conductive composite layer is less than the vertical resistance of the conductive composite layer.

[0037] Optionally, in some embodiments of this application, the support plate includes a bending area and non-bending areas disposed on both sides of the bending area, and the conductive layer and the barrier layer are correspondingly disposed in the non-bending areas.

[0038] On the other hand, correspondingly, embodiments of this application also provide a display device, which includes the display module of any of the above embodiments;

[0039] The conductive layer is disposed on the side of the carbon fiber layer away from the display panel, and the conductive layer is configured to at least cover the electronic components.

[0040] The display module of this application embodiment includes a support plate for supporting a flexible display panel. The support plate includes a carbon fiber layer, a barrier layer, and a conductive layer. The carbon fiber layer includes a first resin and carbon fibers. The barrier layer is disposed on the carbon fiber layer, and the conductive layer is disposed on the side of the barrier layer away from the carbon fiber layer. The conductive layer includes a second resin and a conductor, with the conductor dispersed in the second resin. The barrier layer is configured to prevent the first resin and the second resin from fusing together.

[0041] Compared to vapor deposition, this embodiment uses a method of dispersing the conductor in the second resin to form the conductive layer, saving on manufacturing costs. Secondly, the conductive layer uses a non-vapor deposition process, resulting in better flatness. Furthermore, it should be noted that in high-temperature environments, the barrier layer prevents the first and second resins from mixing, avoiding the first resin flowing into the conductive layer and causing an increase in resin content, which could lead to conductivity failure. Therefore, the barrier layer can prevent the conductivity of the conductive layer from failing, thereby improving the yield of the support plate.

[0042] In Figures 1 to 5, the first direction F1 can be a direction parallel to one side of the support plate 100 in the plan view, and for example, it can be the transverse direction of the support plate 100. The second direction F2 can be a direction parallel to the other side of the support plate 100 in the plan view. The third direction F3 can be the thickness direction of the support plate 100. However, it is not limited to this; for example, the first direction F1 and the second direction F2 can also intersect non-perpendicularly.

[0043] Optionally, the support plate 100 includes a bending area wz and non-bending areas nw disposed on both sides of the bending area wz.

[0044] The non-bending area nw is used to support the flat part of the flexible display panel, and the bending area wz is used to support the bent part of the flexible display panel.

[0045] In some embodiments of this application, the bending region wz of the support plate 100 is provided with an opening, which penetrates the support plate 100 in a third direction F3 to reduce bending stress and thereby improve the bending performance of the bending region wz of the support plate 100.

[0046] It is understandable that the support plate 100 can be applied to teardrop-shaped folding flexible panels, but is not limited to this. For example, it can also be applied to inward-bending folding flexible panels or outward-bending folding flexible panels.

[0047] Referring to Figure 1, this embodiment of the application provides a support plate 100 configured to support a flexible display panel. The support plate 100 includes a carbon fiber layer 11, a barrier layer 12, and a conductive layer 13.

[0048] The carbon fiber layer 11 includes a first resin 111 and carbon fibers xw. A barrier layer 12 is disposed on the carbon fiber layer 11. A conductive layer 13 is disposed on the side of the barrier layer 12 away from the carbon fiber layer 11. The conductive layer 13 includes a second resin 131 and a conductor dd, wherein the conductor dd is dispersed in the second resin 131.

[0049] The barrier layer 12 is configured to prevent the first resin 111 and the second resin 131 from fusing.

[0050] Compared to forming a metallic nickel layer as a conductive layer on a carbon fiber plate using vapor deposition, this embodiment of the application forms the conductive layer 13 by dispersing the conductor dd in the second resin 131, thus saving on manufacturing costs. Secondly, the conductive layer 13 is formed using a non-vapor deposition process, resulting in better flatness. Furthermore, it should be noted that in high-temperature environments, the barrier layer 12 can prevent the first resin 111 and the second resin 131 from fusing, avoiding the first resin 111 flowing into the conductive layer 13 and causing an increase in the resin content of the conductive layer 13, which could lead to conductivity failure. Therefore, the barrier layer 12 can prevent the conductivity of the conductive layer 13 from failing, thereby improving the yield of the support plate 100.

[0051] It should be explained that if the conductive layer 13 directly contacts the carbon fiber layer 11, since both the conductive layer 13 and the carbon fiber layer 11 contain thermosetting resin materials, when they are hot-pressed, the resins are not fully cured. The resins are highly fluid after heating, and under hot pressing, they will fuse together, causing a significant increase in the resin content of the conductive layer 13 and resulting in conductivity failure. Therefore, a barrier layer 12 is used to separate the conductive layer 13 and the carbon fiber layer 11, preventing the first resin 111 of the carbon fiber layer 11 and the second resin 131 of the conductive layer 13 from fusing under high-temperature conditions.

[0052] Optionally, in some embodiments of this application, one side of the barrier layer 12 is directly connected to the carbon fiber layer 11, and the other side of the barrier layer 12 is directly connected to the conductive layer 13.

[0053] By using carbon fiber layer 11, barrier layer 12 and conductive layer 13 in sequential contact connection, the adhesive layer can be saved, thereby reducing the thickness and weight of support plate 100.

[0054] In some embodiments of this application, the carbon fiber layer 11 may be a composite carbon fiber layer, but is not limited thereto; for example, it may also be a single-layer carbon fiber layer.

[0055] The carbon fiber layer 11 includes a first resin 111 and carbon fibers xw. The carbon fibers xw are dispersed in the first resin 111. The carbon fiber layer 11 can be manufactured by processes such as prepreg, cutting, stacking, and molding. Compared with stainless steel of the same volume, the carbon fiber layer 11 has a lighter weight and can meet the support requirements of flexible display panels.

[0056] Optionally, the first resin 111 is a thermosetting resin, such as epoxy resin, phenolic resin, polyester resin, and vinyl ester resin.

[0057] Optionally, in some embodiments of this application, the carbon fiber xw includes a first carbon fiber x1 and a second carbon fiber x2, the first carbon fiber x1 is dispersed in the first resin 111, the second carbon fiber x2 is partially disposed in the first resin 111, and the second carbon fiber x2 is partially disposed in the barrier layer 12.

[0058] Understandably, the partial placement of the second carbon fiber x2 within the first resin 111 and the insertion of another portion of the second carbon fiber x2 into the barrier layer 12 can improve the strength of the barrier layer 12 and the carbon fiber layer 11.

[0059] Optionally, the lengths of the first carbon fiber x1 and the second carbon fiber x2 are both less than or equal to 1 micrometer. The barrier layer 12 is relatively thick, preventing the carbon fiber xw from penetrating it, thus improving the barrier effect of the barrier layer 12.

[0060] Optionally, in some embodiments, the lengths of the first carbon fiber x1 and the second carbon fiber x2 can also be greater than 3 micrometers. That is, by increasing the length of the carbon fiber xw, the second carbon fiber x2 penetrates the barrier layer 12 and is connected to the conductor dd of the conductive layer 13, so as to realize that the stack of the barrier layer 12 and the conductive layer 13 is electrically conductive in the thickness direction.

[0061] In some embodiments of this application, the conductive layer 13 includes a second resin 131 and a conductor dd, wherein the conductor dd is dispersed in the second resin 131.

[0062] The content of the conductor dd is between 70% and 92%, and the content of the second resin 131 is between 8% and 30%.

[0063] It should be explained that the content ratio of conductor dd is the volume percentage of conductor dd in conductive layer 13, and the content ratio of second resin 131 is the volume percentage of second resin 131 in conductive layer 13.

[0064] Understandably, the higher the content of the conductor dd, the better the conductivity of the conductive layer 13, but the weaker its adhesion. The function of the conductive layer 13 is antistatic, and it can be grounded. In conventional applications, the surface resistance of the conductive layer 13 at room temperature needs to be less than 2 ohms to meet the requirements for grounding and antistatic properties.

[0065] Therefore, the content ratio of the conductor dd is set to be more than twice the content ratio of the second resin 131 to ensure that the conductivity performance requirements of the conductive layer 13 are met and that the conductive layer 13 has good integrity.

[0066] For example, the content ratio of conductor dd is 70% and the content ratio of second resin 131 is 30%; the content ratio of conductor dd is 75% and the content ratio of second resin 131 is 25%; the content ratio of conductor dd is 80% and the content ratio of second resin 131 is 20%; the content ratio of conductor dd is 86% and the content ratio of second resin 131 is 14%; or, the content ratio of conductor dd is 92% and the content ratio of second resin 131 is 8%, and so on.

[0067] Optionally, in some embodiments of this application, the conductive layer 13 and the barrier layer 12 are directly connected to form a conductive composite layer, wherein the surface resistance of the conductive composite layer is less than the vertical resistance of the conductive composite layer.

[0068] It should be understood that the surface resistance of the conductive composite layer is the room temperature surface resistance of the conductive layer 13, and the vertical resistance of the conductive composite layer is the room temperature resistance of the conductive composite layer in the thickness direction. Room temperature resistance refers to the resistance measured under room temperature conditions.

[0069] Based on the skin effect of electric current, the electrostatic discharge effect can be achieved as long as the surface resistance of the conductive composite layer meets the requirements. Of course, the lower the vertical resistance of the conductive composite layer, the better its conductivity, and thus the better its electrostatic discharge effect.

[0070] Optionally, in some embodiments of this application, the conductor dd includes at least one of conductive particles d1 and conductive fibers d2. For example, the conductor dd may include only conductive particles d1 or conductive fibers d2, or the conductor dd may include both conductive particles d1 and conductive fibers d2.

[0071] In this process, conductive particles d1 and conductive fibers d2 are dispersed in the second resin 131. Since the conductive particles d1 are dot-like and the conductive fibers d2 are filament-like, their combination facilitates the formation of conductive pathways while further reducing resistance. For example, with conductive particles d1 and conductive fibers d2 dispersed in the second resin 131 and the content of the conductor d1 being greater than or equal to 70%, the surface resistance of the conductive layer 13 at room temperature can be less than 0.1 ohms.

[0072] Optionally, in some embodiments of this application, the content ratio of conductive fiber d2 is greater than the content ratio of conductive particle d1, so as to improve the conductivity of the conductive layer 13 in the thickness direction.

[0073] Optionally, in some embodiments of this application, the second resin 131 is a thermosetting resin, such as epoxy resin, phenolic resin, polyester resin, and vinyl ester resin.

[0074] The materials for conductive particles d1 and conductive fibers d2 can include, but are not limited to, metals such as copper, nickel, silver, and gold, as well as conductive materials such as metal oxides.

[0075] Optionally, in some embodiments of this application, the thickness of the conductive layer 13 is between 8 micrometers and 25 micrometers, for example, it can be 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers, 16 micrometers, 17 micrometers, 18 micrometers, 19 micrometers, 20 micrometers, 21 micrometers, 22 micrometers, 23 micrometers, 24 micrometers or 25 micrometers.

[0076] Referring to Figures 2 to 4, in some embodiments, the conductive layer 13 and the barrier layer 12 are respectively disposed in the non-bending region nw. That is, the conductive layer 13 and the barrier layer 12 are not disposed in the bending region wz to avoid increasing the bending stress on the bending region wz.

[0077] It is understandable that electronic components are typically mounted on the back of the conductive layer 13, and the conductive layer 13 is used to conduct static electricity to ground, thereby protecting the electronic components. Therefore, the conductive layer 13 can be adapted to the position, shape, and size of the electronic components.

[0078] The conductive layer 13 is disposed at least in the four corner areas of the support plate 100 to ensure the need for static electricity discharge and facilitate grounding. For example, the conductive layer 13 can be disposed in the four corner areas of the support plate 100, as shown in Figure 2; the conductive layer 13 can be disposed on the side of the non-bending area nw away from the bending area wz, as shown in Figure 3; the conductive layer 13 can be semi-frame shaped and extend along the perimeter of the non-bending area nw, as shown in Figure 4; or the conductive layer 13 can cover the entire surface of both non-bending areas nw.

[0079] Optionally, in some embodiments of this application, the softening temperature of the barrier layer 12 is greater than or equal to 110 degrees Celsius. For example, it can be 110 degrees Celsius, 115 degrees Celsius, 120 degrees Celsius, 125 degrees Celsius, 130 degrees Celsius, 135 degrees Celsius, 140 degrees Celsius, 145 degrees Celsius, 150 degrees Celsius, 155 degrees Celsius, 160 degrees Celsius, 165 degrees Celsius, 170 degrees Celsius, 175 degrees Celsius, or 180 degrees Celsius.

[0080] Understandably, the higher the softening temperature of the barrier layer 12, the stronger its heat resistance and the worse its thermal fluidity at high temperatures, thus improving the effect of preventing the first resin 111 and the second resin 131 from fusing. Furthermore, the typical hot-pressing temperature is between 80 and 120 degrees Celsius. However, considering hot-pressing efficiency and stability, a temperature between 100 and 110 degrees Celsius is usually selected. Therefore, selecting a softening temperature of the barrier layer 12 greater than or equal to 110 degrees Celsius ensures that the first resin 111 and the second resin 131 do not fuse during the hot-pressing process.

[0081] Optionally, in some embodiments of this application, the thickness of the barrier layer 12 is between 3 micrometers and 8 micrometers. For example, the thickness of the barrier layer 12 can be 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, or 8 micrometers.

[0082] Understandably, the greater the thickness of the barrier layer 12, the better its blocking effect. Considering both thickness and blocking performance, the thickness of the barrier layer 12 is selected to be between 3 micrometers and 8 micrometers.

[0083] Optionally, in some embodiments of this application, the material of the barrier layer 12 includes a thermoplastic resin, and both the first resin 111 and the second resin 131 include thermosetting resins.

[0084] The carbon fiber layer 11, the barrier layer 12, and the conductive layer 13 are integrally hot-pressed to form a support plate 100.

[0085] It is understandable that thermoplastic resins have the property of softening when heated and hardening when cooled without undergoing a chemical reaction, and this property can be maintained even after repeated heating. At the same time, thermoplastic resins and thermosetting resins also have excellent adhesion during hot pressing. Therefore, by hot pressing the carbon fiber layer 11, the barrier layer 12, and the conductive layer 13 together, not only can the support plate 100 be thinned, but excellent firmness can also be maintained.

[0086] Optionally, the thermoplastic material of the barrier layer 12 can be polyetheretherketone (PEEK), acrylic (PMMA), polycarbonate (PC), etc.

[0087] Figure 5 shows a support plate 100 according to one or more embodiments of this application. In Figure 5, the parts that are different from the above embodiments will be described to avoid redundancy.

[0088] Please refer to Figure 5. In some embodiments of this application, the molecular weight of the barrier layer 12 is greater than 10,000 Daltons.

[0089] It is understandable that polymer materials themselves do not possess fluidity and require the addition of solvents to achieve fluidity. The barrier layer 12 can be formed by coating a polymer slurry with added solvent onto the conductive layer 13, followed by heating to remove the solvent. This is based on the non-fluidity of polymer materials, which prevents the first resin 111 and the second resin 131 from fusing through the barrier layer 12 during hot pressing.

[0090] In addition, the molecular weight of thermosetting resins before they are cured depends on the type of resin and the preparation process. Even for the same type of resin, different preparation processes can lead to different molecular weights.

[0091] Optionally, the molecular weight of the polyester resin in the thermosetting resin before heat curing can be between 400 D and 500 D; the molecular weight of the phenolic resin in the thermosetting resin before heat curing can be between 1000 D and 9000 D. Taking the first resin 111 and the second resin 131 as epoxy resins as an example, the molecular weight of the epoxy resin before curing is between 800 D and 7000 D. Therefore, the molecular weight of the barrier layer 12 is greater than 10000 D to better prevent the first resin 111 and the second resin 131, which have smaller molecular weights, from passing through the barrier layer 12 and fusing.

[0092] Optionally, in some embodiments of this application, the thickness of the barrier layer 12 is less than or equal to 1 micrometer.

[0093] It is understood that, compared to the above embodiments with a thicker barrier layer 12, the barrier layer 12 of this application embodiment can be directly coated onto the surface of the conductive layer 13 or the carbon fiber layer 11 by coating. Since the barrier layer 12 is directly formed on the conductive layer 13 or the carbon fiber layer 11 by coating, the thickness of the barrier layer 12 can be reduced, resulting in a smaller thickness, wherein the thickness of the barrier layer 12 can be less than or equal to 1 micrometer.

[0094] Optionally, the thickness of the barrier layer 12 can be 1 micrometer, 0.9 micrometer, 0.8 micrometer, 0.7 micrometer, 0.6 micrometer, 0.5 micrometer, 0.4 micrometer, 0.3 micrometer or 0.2 micrometer, etc.

[0095] Optionally, in some embodiments of this application, the carbon fiber xw includes a first carbon fiber x1 and a second carbon fiber x2, wherein the first carbon fiber x1 is dispersed within the first resin 111. A portion of the second carbon fiber x2 is disposed within the first resin 111, and a portion of the second carbon fiber x2 is disposed within the barrier layer 12.

[0096] The second carbon fiber x2 penetrates the barrier layer 12, and the second carbon fiber x2 is partially connected to the conductor dd.

[0097] It is understood that, compared to the above embodiment with a thicker barrier layer 12, based on the fact that the length of the second carbon fiber x2 is less than or equal to 1 micrometer, the embodiment of this application reduces the thickness of the barrier layer 12 to less than or equal to 1 micrometer so that the second carbon fiber x2 can penetrate the barrier layer 12 and connect to the conductor dd, so that the conductive layer 13 can electrically connect to the carbon fiber layer 11, thereby improving the conductivity of the support plate 100 in the thickness direction F3.

[0098] Optionally, in some embodiments of this application, the material of the barrier layer 12 includes a thermoplastic resin, and both the first resin 111 and the second resin 131 include thermosetting resins.

[0099] The barrier layer 12 is a coating layer, and the barrier layer 12 is formed on the surface of the conductive layer 13 to form a conductive composite layer. The conductive composite layer and the carbon fiber layer 11 are integrally hot-pressed to form a support plate 100.

[0100] In other words, the material of the barrier layer 12 is first coated on the conductive layer 13, and the solvent in the material of the barrier layer 12 is removed to form a conductive composite layer of barrier layer 12 superimposed on conductive layer 13. Then the conductive composite layer is directly stacked on carbon fiber layer 11 and integrally hot-pressed in a high-temperature environment to form support plate 100.

[0101] Optionally, the thermoplastic resin material of the barrier layer 12 can be a thermoplastic resin powder coating such as saturated polyester resin or polyetheretherketone.

[0102] It should be noted that this application is based on the analysis of conductivity and adhesion test data from three comparative examples. The support plate in the first comparative example consists only of a carbon fiber layer; the support plate in the second comparative example includes both a carbon fiber layer and a nickel layer, with the nickel layer formed directly on the carbon fiber layer using physical vapor deposition. The support plate in the third comparative example corresponds to the structure in Figure 1. The support plate in the fourth comparative example corresponds to the structure in Figure 5. Please refer to the table below:

[0103]

[0104] It should be noted that the resistance in the first comparative example is the resistance of the carbon fiber layer. The resistance in the second comparative example is the resistance of the nickel layer. The resistances in the third and fourth comparative examples are the resistances of the composite conductive layer formed by stacking conductive layer 13 and barrier layer 12. In the second comparative example, the conductive film is a nickel layer. In the third and fourth comparative examples, the conductive film is a composite conductive layer formed by stacking conductive layer 13 and barrier layer 12.

[0105] As shown in the table above, in the comparison of surface resistance at room temperature, surface resistance after boiling in water, and surface resistance after salt spray, the third and fourth pairs are much smaller than the second pair. That is, the conductive layer 13 of the third and fourth pairs has better surface conductivity and is more conducive to electrostatic discharge.

[0106] In the comparison of vertical resistance at room temperature, the fourth comparative example is close to that of the second comparative example. The third comparative example has a larger vertical resistance at room temperature because the barrier layer 12 completely isolates the carbon fibers of the carbon fiber layer and the conductive layer 13. In other words, the composite conductive layer of the fourth comparative example has vertical conductivity close to that of the second embodiment, and its vertical conductivity performance is better than that of the third comparative example.

[0107] In the comparison of adhesion at room temperature and adhesion after boiling in water, the third and fourth pairs are the same as the second pair; in the comparison of salt spray adhesion, the third and fourth pairs are greater than the second pair. In other words, the third and fourth pairs use a hot-pressing integrated molding process, which makes the composite conductive layer have the same adhesion strength as the second pair, and even stronger adhesion in a salt spray environment.

[0108] This application embodiment also provides a display module, which includes a display panel 200 and a support plate 100 as described in any of the above embodiments, wherein the display panel 200 is disposed on the support plate 100;

[0109] A conductive layer 13 is disposed on the side of the carbon fiber layer 11 away from the display panel 200, and the conductive layer 13 is configured to at least cover the electronic components.

[0110] Optionally, the display panel 200 is a flexible panel. The display panel 200 can be an electroluminescent panel, such as an organic light-emitting display panel, a quantum dot light-emitting display panel, or a light-emitting diode display panel.

[0111] It should be noted that the structure of the support plate 100 of the display module in this application embodiment is similar to or the same as the structure of the support plate 100 described in any of the above embodiments, so it will not be described again here.

[0112] Referring to Figure 6, correspondingly, this application embodiment also provides a display device 1000, which includes a display panel 200 and a support plate 100 as described in any of the above embodiments, wherein the display panel 200 is disposed on the support plate 100;

[0113] A conductive layer 13 is disposed on the side of the carbon fiber layer 11 away from the display panel 200, and the conductive layer 13 is configured to at least cover the electronic components.

[0114] It should be noted that the structure of the support plate 100 of the display device 1000 in this application embodiment is similar to or the same as the structure of the support plate 100 described in any of the above embodiments, so it will not be described again here.

[0115] In other words, the display device 1000 of this application includes the display module of any of the above embodiments.

[0116] The support plate 100 of the display device 1000 in this embodiment is configured to support the display panel 200. The support plate 100 includes a carbon fiber layer 11, a barrier layer 12, and a conductive layer 13. The carbon fiber layer 11 includes a first resin 111 and carbon fibers xw. The barrier layer 12 is disposed on the carbon fiber layer 11, and the conductive layer 13 is disposed on the side of the barrier layer 12 away from the carbon fiber layer 11. The conductive layer 13 includes a second resin 131 and a conductor dd, with the conductor dd dispersed in the second resin 131. The barrier layer 12 is configured to prevent the first resin 111 and the second resin 131 from fusing.

[0117] Compared to vapor deposition, this embodiment of the application uses a method of dispersing the conductor dd in the second resin 131 to form the conductive layer 13, which saves on preparation costs. Secondly, the conductive layer 13 is formed using a non-vapor deposition process, resulting in better flatness. Furthermore, it should be noted that in high-temperature environments, the barrier layer 12 can prevent the first resin 111 and the second resin 131 from fusing, avoiding the first resin 111 from flowing into the conductive layer 13 and causing an increase in the resin content of the conductive layer 13, thus preventing conductivity failure. Therefore, the barrier layer 12 can prevent the conductivity of the conductive layer 13 from failing, thereby improving the yield of the support plate 100.

[0118] Optionally, the display panel 200 is a flexible panel. The display panel 200 can be an electroluminescent panel, such as an organic light-emitting display panel, a quantum dot light-emitting display panel, or a light-emitting diode display panel.

[0119] Optionally, the display device 1000 can be applied to and used in a variety of products, including, for example, televisions, laptop computers, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smartphones, tablet computers, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile personal computers (UMPCs).

[0120] Furthermore, the display device 1000 according to some embodiments can be applied to and used within wearable devices, including smartwatches, watch phones, glasses-type displays, and head-mounted displays (HMDs). Additionally, according to some embodiments, the display device 1000 can be applied to instrument panels for automobiles, displays in central dashboards or central information displays (CIDs) arranged on instrument panels, interior mirror displays replacing side mirrors, and displays for entertainment systems arranged on the back of the front seats for rear-seat passengers in automobiles.

[0121] The above provides a detailed description of a support plate, display module, and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display module, comprising a support plate for supporting a flexible display panel, the support plate comprising: A carbon fiber layer comprising a first resin and carbon fibers, wherein the carbon fibers are dispersed in the first resin; as well as A barrier layer is disposed on the carbon fiber layer; A conductive layer is disposed on the side of the barrier layer away from the carbon fiber layer, the conductive layer comprising a second resin and a conductor, the conductor being dispersed in the second resin; The barrier layer is configured to prevent the first resin and the second resin from fusing together.

2. The display module according to claim 1, wherein, The softening temperature of the barrier layer is greater than or equal to 110 degrees Celsius.

3. The display module according to claim 2, wherein, The thickness of the barrier layer is between 3 micrometers and 8 micrometers.

4. The display module according to claim 1, wherein, The molecular weight of the barrier layer is greater than 10,000 D.

5. The display module according to claim 4, wherein, The thickness of the barrier layer is less than or equal to 1 micrometer.

6. The display module according to any one of claims 1-5, wherein, One side of the barrier layer is directly connected to the carbon fiber layer, and the other side of the barrier layer is directly connected to the conductive layer.

7. The display module according to claim 6, wherein, The carbon fiber includes a first carbon fiber and a second carbon fiber, wherein the first carbon fiber is dispersed in the first resin, and a portion of the second carbon fiber is disposed in the first resin and a portion of the second carbon fiber is disposed in the barrier layer.

8. The display module according to claim 5, wherein, The carbon fiber includes a first carbon fiber and a second carbon fiber. The first carbon fiber is dispersed in the first resin, and a portion of the second carbon fiber is disposed in the first resin. A portion of the second carbon fiber is disposed in the barrier layer, and the second carbon fiber penetrates the barrier layer. A portion of the second carbon fiber is connected to the conductor.

9. The display module according to claim 3, wherein, The barrier layer is made of thermoplastic resin, and both the first resin and the second resin are thermosetting resins. The carbon fiber layer, the barrier layer, and the conductive layer are integrally hot-pressed to form the support plate.

10. The display module according to claim 5, wherein, The barrier layer is made of thermoplastic resin, and both the first resin and the second resin are thermosetting resins. The barrier layer is a coating, and the barrier layer is formed on the surface of the conductive layer to form a conductive composite layer. The conductive composite layer and the carbon fiber layer are integrally hot-pressed to form the support plate.

11. The display module according to any one of claims 1-5, wherein, The conductor includes at least one of conductive particles and conductive fibers, and in the conductive layer, the content of the conductor is between 70% and 92%, and the content of the second resin is between 8% and 30%.

12. The display module according to claim 11, wherein, The conductive layer and the barrier layer are directly connected to form a conductive composite layer, and the surface resistance of the conductive composite layer is less than the vertical resistance of the conductive composite layer.

13. The display module according to any one of claims 1-5, wherein, The support plate includes a bending area and non-bending areas disposed on both sides of the bending area, and the conductive layer and the barrier layer are respectively disposed in the non-bending areas.

14. A display device, comprising a display module, the display module including a display panel and a support plate supporting the display panel, the support plate comprising: A carbon fiber layer comprising a first resin and carbon fibers, wherein the carbon fibers are dispersed in the first resin; as well as A barrier layer is disposed on the carbon fiber layer; A conductive layer is disposed on the side of the barrier layer away from the carbon fiber layer, the conductive layer comprising a second resin and a conductor, the conductor being dispersed in the second resin; The barrier layer is configured to prevent the first resin and the second resin from fusing together; The conductive layer is disposed on the side of the carbon fiber layer away from the display panel, and the conductive layer is configured to at least cover the electronic components.

15. The display device according to claim 14, wherein, The softening temperature of the barrier layer is greater than or equal to 110 degrees Celsius.

16. The display device according to claim 15, wherein, The thickness of the barrier layer is between 3 micrometers and 8 micrometers.

17. The display device according to claim 14, wherein, The molecular weight of the barrier layer is greater than 10,000 D.

18. The display device according to claim 17, wherein, The thickness of the barrier layer is less than or equal to 1 micrometer.

19. The display device according to any one of claims 14-18, wherein, One side of the barrier layer is directly connected to the carbon fiber layer, and the other side of the barrier layer is directly connected to the conductive layer.

20. The display device according to claim 19, wherein, The carbon fiber includes a first carbon fiber and a second carbon fiber, wherein the first carbon fiber is dispersed in the first resin, and a portion of the second carbon fiber is disposed in the first resin and a portion of the second carbon fiber is disposed in the barrier layer.

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