Diaphragm of sound-producing device, and sound-producing device

By using a phenyl silicone rubber layer in the diaphragm of the sound-generating device, the problem of low adhesion between silicone rubber and the housing and voice coil is solved, resulting in higher adhesion strength and better acoustic performance, while reducing production costs and health risks.

WO2026045230A1PCT designated stage Publication Date: 2026-03-05GOERTEK INC
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Patent Information

Application Number
PCT/CN2025/083181
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-08-30
Filing Date
2025-03-18
Publication Date
2026-03-05

AI Technical Summary

Technical Problem

The diaphragm of existing sound-generating devices has low adhesion between silicone rubber and the housing and voice coil, which complicates the production process and increases costs. At the same time, the primer treatment has solvent evaporation problems, which affect the health of operators.

Method used

The phenyl silicone rubber layer is formed by curing liquid phenyl silicone rubber compound, which contains methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin and phenyl hydrogen silicone oil, to enhance adhesion and improve damping performance. When using UV adhesive for bonding, the UV adhesive cures rapidly.

Benefits of technology

It significantly improves the adhesion between the diaphragm and the housing and voice coil, reduces THD distortion, has better acoustic performance, and improves the mechanical properties and light transmittance of the diaphragm.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention belongs to the technical field of electroacoustics, and specifically relates to a diaphragm of a sound-producing device, and a sound-producing device. The diaphragm of the sound-producing device of the present invention comprises at least one phenyl silicone rubber layer, which contains a network polymer. The phenyl silicone rubber layer is formed by curing a liquid phenyl silicone rubber compound, which comprises methylphenyl vinyl polysiloxane, a methylphenyl vinyl silicone resin and a hydrogen-containing phenyl silicone oil. In the present invention, the diaphragm having the phenyl silicone rubber layer can significantly improve the adhesive force of the diaphragm to a housing and to a voice coil. Moreover, the hydrogen-containing phenyl silicone oil and methylphenyl vinyl polysiloxane have good compatibility, which makes the curing uniformity of the phenyl silicone rubber layer better, and the mechanical properties thereof more balanced and less prone to failing. In addition, the diaphragm of the present invention has high damping performance and can also significantly reduce THD distortion of the diaphragm, thus resulting in better acoustic performance.
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Description

Diaphragm and sound-generating device Technical Field

[0001] This invention belongs to the field of electroacoustic technology, specifically relating to a diaphragm and a sound-generating device. Background Technology

[0002] As is well known, silicone rubber is widely used in the manufacture of diaphragms for sound-producing devices due to its high resilience, high temperature resistance, and good waterproof properties. However, because silicone rubber itself has low surface energy, the adhesion between silicone rubber diaphragms and the housing and voice coil of the sound-producing device is relatively weak. To improve the adhesion between silicone rubber and other materials, a primer is usually applied to these materials. However, this complicates the process, increases production costs, and the primer application process can lead to solvent evaporation, which may affect the health of operators.

[0003] Therefore, the diaphragm and sound-generating device of existing sound-generating devices still need improvement. Summary of the Invention

[0004] The main objective of this invention is to provide a diaphragm and a sound-generating device. The diaphragm in this invention has a phenyl silicone rubber layer, which can significantly improve the adhesion between the diaphragm and the housing and voice coil, while also having high damping performance and significantly reducing the THD distortion of the diaphragm, resulting in better acoustic performance.

[0005] To achieve the above objectives, the present invention provides the following technical solutions.

[0006] In a first aspect, the present invention provides a diaphragm for a sound-generating device, the diaphragm comprising at least one layer of phenyl silicone rubber, the phenyl silicone rubber layer being formed by curing a liquid phenyl silicone rubber compound, the liquid phenyl silicone rubber compound comprising methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, and phenyl hydrogen-containing silicone oil; the phenyl silicone rubber layer containing a network polymer, the network polymer comprising chain segments: Wherein, the R group is at least one of methyl or phenyl. The phenyl groups in the chain segment account for 3% to 30% of the total mass percentage of the phenyl silicone rubber layer.

[0007] In some embodiments of the present invention, the hardness of the phenyl silicone rubber layer is 30A to 90A; and / or,

[0008] The tensile strength of the phenyl silicone rubber layer is 1 MPa to 10 MPa; and / or,

[0009] The loss factor of the phenyl silicone rubber layer is 0.15 to 0.4; and / or,

[0010] The light transmittance of the phenyl silicone rubber layer is 20% to 75%.

[0011] In some embodiments of the present invention, the The phenyl groups in the chain segment account for 8% to 20% of the total mass of the phenyl silicone rubber layer.

[0012] In some embodiments of the present invention, the methylphenyl vinyl silicone resin in the liquid phenyl silicone rubber compound is 2 wt% to 25 wt% by mass; and / or,

[0013] The phenyl hydrogen-containing silicone oil has a mass percentage of 0.1-5 wt%; and / or,

[0014] The mass percentage of the methylphenyl vinyl polysiloxane is 45 wt% to 90 wt%.

[0015] In some embodiments of the present invention, the phenyl group in the phenyl-containing hydrogen silicone oil has a mass percentage of 2 wt% to 50 wt%, and the hydrogen group in the phenyl-containing hydrogen silicone oil has a mass percentage of 0.05 wt% to 1.5 wt%; and / or,

[0016] The methylphenyl vinyl polysiloxane contains 0.05 wt% to 9 wt% vinyl by mass and 3 wt% to 45 wt% phenyl by mass.

[0017] In some embodiments of the present invention, the liquid phenyl silicone rubber compound further includes a reinforcing agent.

[0018] In some embodiments of the present invention, the reinforcing agent is selected from silicon dioxide; and / or,

[0019] The reinforcing agent has a mass percentage of 5 wt% to 45 wt%.

[0020] In some embodiments of the present invention, the liquid phenyl silicone rubber compound further includes at least one of an inhibitor and a catalyst.

[0021] In some embodiments of the present invention, the inhibitor is 0.01 wt% to 0.2 wt% by mass; and / or,

[0022] The catalyst has a mass percentage of 0.005 wt% to 0.2 wt%.

[0023] In some embodiments of the present invention, the inhibitor includes at least one of alkynyl alcohol inhibitors and polyvinyl polysiloxane inhibitors; and / or,

[0024] The catalyst is selected from platinum catalysts.

[0025] In some embodiments of the present invention, the liquid phenyl silicone rubber compound further includes methyl phenyl silicone resin, wherein the mass percentage of the methyl phenyl silicone resin in the liquid phenyl silicone rubber compound is 0 to 20 wt% and is not 0.

[0026] In some embodiments of the present invention, the phenyl content in the methylphenyl silicone resin is 2 wt% to 50 wt%.

[0027] In some embodiments of the present invention, the diaphragm of the sound-generating device includes at least one layer of phenyl silicone rubber, which is formed by curing a liquid phenyl silicone rubber compound, which includes methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, phenyl hydrogen silicone oil, reinforcing agent, inhibitor, and catalyst.

[0028] In some embodiments of the present invention, the diaphragm of the sound-generating device includes at least one layer of phenyl silicone rubber, which is formed by curing a liquid phenyl silicone rubber compound, wherein the liquid phenyl silicone rubber compound includes methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, phenyl hydrogen silicone oil, methylphenyl silicone resin, reinforcing agent, inhibitor, and catalyst.

[0029] In some embodiments of the present invention, the diaphragm has a single-layer structure, and the diaphragm is composed of a single layer of phenyl silicone rubber; or,

[0030] The diaphragm is formed as a composite layer structure, which includes at least one layer of the phenyl silicone rubber and a composite layer, wherein the composite layer includes at least one of a thermoplastic elastomer layer, an engineering plastic layer and a film layer.

[0031] In a second aspect, the present invention provides a sound-generating device, the sound-generating device comprising the diaphragm of the sound-generating device described in the first aspect.

[0032] In some embodiments of the present invention, the sound-generating device includes a housing, and the diaphragm of the sound-generating device is integrally heat-cured and formed with the housing; and / or,

[0033] The sound-generating device has a waterproof rating of at least 1ATM.

[0034] Compared with the prior art, the present invention achieves the following technical effects:

[0035] The diaphragm in this invention significantly improves its adhesion to the housing and voice coil through the design of the phenyl silicone rubber layer, and the diaphragm has more balanced mechanical properties and high damping performance, which can significantly reduce the THD distortion of the diaphragm and has better acoustic performance.

[0036] This invention, through the design of the components of the liquid phenyl silicone rubber compound forming the phenyl silicone rubber layer, significantly improves the hardness and tensile strength of the diaphragm, as well as the adhesion between the diaphragm and the housing and voice coil, through the synergistic effect of methylphenyl vinyl silicone resin, methylphenyl vinyl polysiloxane, and phenyl hydrogen-containing silicone oil. The diaphragm's damping performance is also enhanced. Simultaneously, the diaphragm exhibits good light transmittance, allowing for rapid and complete curing of the UV adhesive when bonding the diaphragm and voice coil, further improving the adhesion between them. Furthermore, the phenyl hydrogen-containing silicone oil and methylphenyl vinyl polysiloxane have good compatibility, resulting in better curing uniformity of the phenyl silicone rubber layer. This leads to more balanced mechanical properties of the diaphragm and reduces its susceptibility to failure.

[0037] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0038] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0039] Figure 1 is a cross-sectional view of a sound-generating device according to some embodiments of the present invention;

[0040] Figure 2 is a schematic diagram of the THD curves of the diaphragms of Comparative Example 1 and Example 2 according to the present invention.

[0041] Reference numerals in the attached figures: 100, sound-generating device; 10, housing; 20, diaphragm; 30, voice coil; 40, magnetic circuit system. Detailed Implementation

[0042] Exemplary embodiments of the present invention will now be described in more detail with reference to specific examples. It should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0044] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0045] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0046] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0047] Currently, phenyl silicone rubber is generally reinforced with methyl vinyl silicone resin. However, due to the poor compatibility between methyl vinyl silicone resin and methyl phenyl vinyl silicone oil, the light transmittance of phenyl silicone rubber deteriorates, affecting UV light transmittance. This leads to an increase in the UV adhesive curing time between the diaphragm and the voice coil, resulting in insufficient adhesion.

[0048] In addition, conventional hydrogen-containing silicone oil is often used as a crosslinking agent in general phenyl silicone rubber. However, conventional hydrogen-containing silicone oil has poor compatibility with methylphenyl vinyl silicone oil and poor dispersibility in phenyl liquid silicone rubber. This leads to poor local crosslinking uniformity and poor local mechanical properties of phenyl silicone rubber. As a result, local damage occurs during the reliability verification process of the speaker, leading to speaker failure.

[0049] Therefore, the present invention provides a diaphragm for a sound-generating device, the diaphragm comprising at least one phenyl silicone rubber layer, the phenyl silicone rubber layer being formed by curing a liquid phenyl silicone rubber compound, the liquid phenyl silicone rubber compound comprising methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, and phenyl hydrogen-containing silicone oil; the phenyl silicone rubber layer containing a network polymer, the network polymer comprising chain segments: Wherein, the R group is at least one of methyl or phenyl. The phenyl groups in the chain account for 3% to 30% of the total mass of the phenyl silicone rubber layer.

[0050] In this invention, the liquid phenyl silicone rubber compound forming the phenyl silicone rubber layer uses methylphenyl vinyl silicone resin as a reinforcing material. Methylphenyl vinyl silicone resin contains phenyl structures, which have strong polarity, thus giving it high polarity. This significantly improves the hardness and tensile strength of the phenyl silicone rubber layer, and more notably, significantly enhances the adhesion between the phenyl silicone rubber layer and the shell and voice coil. The damping performance of the phenyl silicone rubber layer is also higher. Furthermore, methylphenyl vinyl silicone resin has good compatibility with methylphenyl vinyl polysiloxane, resulting in a diaphragm with good light transmittance. When the diaphragm and voice coil are bonded with UV adhesive, the UV adhesive can cure quickly and completely, improving the adhesion between the diaphragm and voice coil. The phenyl hydrogen-containing silicone oil also has good compatibility with methylphenyl vinyl polysiloxane and can be better dispersed in the liquid phenyl silicone rubber compound, resulting in better curing uniformity and balanced mechanical properties of the phenyl silicone rubber layer. During reliability verification, it operates normally without failure.

[0051] Methylphenylvinyl polysiloxane is a product obtained by introducing methylphenylsiloxane or diphenylsiloxane linkages into the molecular chain of methylvinyl polysiloxane. Introducing phenyl groups onto the side groups of methylvinyl polysiloxane disrupts the regularity of the dimethylsiloxane structure, significantly lowering the polymer's crystallization temperature and expanding the range of low-temperature applications for this polymer material.

[0052] Based on the phenyl content, polysiloxanes can be classified into three types: low-phenyl polysiloxanes, medium-phenyl polysiloxanes, and high-phenyl polysiloxanes. Low-phenyl polysiloxanes contain 5 wt% to 10 wt% phenyl content; medium-phenyl polysiloxanes contain 10 wt% to 30 wt% phenyl content; and high-phenyl polysiloxanes contain more than 30 wt% phenyl content.

[0053] In some embodiments of the present invention, the mass percentage of methylphenylvinyl polysiloxane in the liquid phenyl silicone rubber compound is 45 wt% to 90 wt%. Exemplarily, the mass percentage of methylphenylvinyl polysiloxane can be one of 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, or 90 wt%, or any value satisfying the above range. When the mass percentage of methylphenylvinyl polysiloxane is <45 wt%, the viscosity of the liquid phenyl silicone rubber compound is too high, making it impossible to inject the rubber during production. It also causes poor resilience and reduced elongation at break in the phenyl silicone rubber layer, resulting in poor overall performance. Conversely, if the mass percentage of methylphenylvinyl polysiloxane is >90 wt%, the amount of reinforcing component methylvinylphenyl silicone resin and reinforcing agent is insufficient, resulting in low hardness, low modulus, and low tensile strength in the phenyl silicone rubber layer, making it prone to cracking and failure during reliability verification.

[0054] In some embodiments of the present invention, the mass percentage of vinyl in methylphenyl vinyl polysiloxane is 0.05 wt% to 9 wt%. Exemplarily, the mass percentage of vinyl in methylphenyl vinyl polysiloxane can be one of 0.05 wt%, 0.06 wt%, 0.07 wt%, 0.08 wt%, 0.09 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, or 9 wt%, or any value satisfying the above range. When the mass percentage of vinyl is less than 0.05 wt%, the cross-linking degree of the formed silicone rubber layer is too low, resulting in too low hardness, which cannot meet the requirements for diaphragm use. When the mass percentage of vinyl is greater than 9 wt%, the cross-linking degree of the formed silicone rubber layer is too high, which will lead to a significant decrease in the elongation at break, tensile strength, and tear performance of the silicone film. The formed diaphragm is prone to failure during reliability verification and cannot meet the requirements for use.

[0055] In some embodiments of the present invention, the mass percentage of phenyl in methylphenylvinyl polysiloxane is 3 wt% to 45 wt%. Exemplarily, the mass percentage of phenyl in methylphenylvinyl polysiloxane can be one of 3 wt%, 5 wt%, 8 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, or 45 wt%, or any value satisfying the above range. Wherein, when the mass percentage of phenyl is less than 3 wt%, the damping of the silicone rubber layer formed by methylphenylvinyl polysiloxane is low, leading to increased distortion of the diaphragm; while when the mass percentage of phenyl is greater than 45 wt%, the viscosity of the formed liquid phenyl silicone compound is too high, resulting in ineffective injection molding and thus preventing the injection molding of the diaphragm.

[0056] Methylphenyl vinyl silicone resin is a synthetic resin produced by the condensation reaction of methylphenyl vinyl monomers and siloxane monomers.

[0057] Compared to traditional methyl vinyl silicone resin, methyl phenyl vinyl silicone resin has good compatibility with methyl phenyl vinyl polysiloxane, resulting in a phenyl silicone rubber diaphragm with excellent light transmittance and high UV light transmittance. In embodiments of the present invention, the phenyl silicone rubber diaphragm and voice coil are bonded together using UV adhesive. UV light can pass through the phenyl silicone rubber, allowing the UV adhesive to cure quickly, efficiently, and completely. The UV adhesive has a short curing time and strong adhesion, thereby improving the bonding strength between the diaphragm and the voice coil.

[0058] In some embodiments of the present invention, the mass percentage of methylphenyl vinyl silicone resin in the liquid phenyl silicone rubber compound is 2 wt% to 25 wt%. Exemplarily, the mass percentage of methylphenyl vinyl silicone resin can be one of 2 wt%, 5 wt%, 8 wt%, 10 wt%, 12 wt%, 15 wt%, 18 wt%, 20 wt%, 22 wt%, or 25 wt%, or any value satisfying the above range. Verification revealed that as the content of methylphenyl vinyl silicone resin increases, the hardness and tensile strength of the phenyl silicone rubber layer increase, indicating a good reinforcing effect. However, when the mass percentage of methylphenyl vinyl silicone resin is <2 wt%, the adhesion between the phenyl silicone rubber layer and the voice coil and the shell decreases significantly, making it prone to cracking and failure during vibration. Furthermore, when the mass percentage of methylphenyl vinyl silicone resin is >25 wt%, the tensile strength of the phenyl silicone rubber layer decreases, and the elongation at break drops sharply, leading to diaphragm failure during high-power reliability verification.

[0059] In some embodiments of the present invention, the mass percentage of phenyl hydrogen silicone oil in the liquid phenyl silicone rubber compound is 0.1 wt% to 5 wt%. Exemplarily, the mass percentage of phenyl hydrogen silicone oil can be one of 0.1 wt%, 0.2 wt%, 0.5 wt%, 0.8 wt%, 1.0 wt%, 1.2 wt%, 1.5 wt%, 1.8 wt%, 2.0 wt%, 2.2 wt%, 2.5 wt%, 2.8 wt%, 3.0 wt%, 3.2 wt%, 3.5 wt%, 3.8 wt%, 4.0 wt%, 4.2 wt%, 4.5 wt%, 4.8 wt%, or 5 wt%, or any value satisfying the above range. When the mass percentage of phenyl hydrogen-containing silicone oil is less than 0.1%, the cross-linking degree of the phenyl silicone rubber layer is insufficient, resulting in surface stickiness and easy adhesion of impurities. Furthermore, the resilience decreases, tensile strength decreases, and the overall performance of the phenyl silicone rubber layer is poor. Consequently, the diaphragm is prone to failure during long-term high-power reliability verification. Conversely, when the mass percentage of phenyl hydrogen-containing silicone oil is greater than 5 wt%, the cross-linking of the phenyl silicone rubber layer is excessively high, resulting in small molecular weights between the cross-linking points. This leads to low elongation at break and poor tear resistance, making the diaphragm prone to failure during prolonged vibration.

[0060] In some embodiments of the present invention, the mass percentage of phenyl in the phenyl-containing hydrogen silicone oil is 2 wt% to 50 wt%. It should be noted that if the mass percentage of phenyl in the phenyl-containing hydrogen silicone oil is less than 2 wt%, the compatibility of the phenyl-containing hydrogen silicone oil with methylphenylvinyl polysiloxane deteriorates, leading to poor compatibility in the liquid phenyl silicone rubber compound, difficulty in dispersion, and ultimately, uneven local crosslinking of the silicone rubber film layer, resulting in poor mechanical properties. Conversely, if the mass percentage of phenyl in the phenyl-containing hydrogen silicone oil is greater than 50 wt%, the synthesis of the phenyl-containing hydrogen silicone oil becomes difficult. When the mass percentage of phenyl in the phenyl-containing hydrogen silicone oil is 2 wt% to 50 wt%, the crosslinking uniformity of the phenyl silicone rubber layer can be improved, thereby improving the mechanical properties of the diaphragm. Exemplarily, the mass percentage of phenyl in the phenyl-containing hydrogen silicone oil can be one of 2 wt%, 5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, 45 wt%, and 50 wt%, or any value satisfying the above range.

[0061] In some embodiments of the present invention, the mass percentage of hydrogen groups in the phenyl hydrogen-containing silicone oil is 0.05 wt% to 1.5 wt%. It should be noted that if the hydrogen content in the phenyl hydrogen-containing silicone oil is less than 0.05 wt%, the phenyl hydrogen-containing silicone oil only acts as a chain extender, resulting in excessively low crosslinking of the phenyl silicone rubber film and poor mechanical properties. Conversely, if the hydrogen content in the phenyl hydrogen-containing silicone oil is greater than 1.5 wt%, it will cause excessively high crosslinking of the phenyl silicone rubber film, resulting in insufficient elasticity and increased brittleness of the silicone rubber layer, failing to meet the actual application requirements of the diaphragm. When the mass percentage of hydrogen groups in the phenyl hydrogen-containing silicone oil is 0.05 wt% to 1.5 wt%, the phenyl silicone rubber film can maintain a suitable degree of crosslinking, thereby improving the mechanical properties and resilience of the diaphragm. For example, the mass percentage of hydrogen groups in the phenyl hydrogen-containing silicone oil can be one of 0.05wt%, 0.08wt%, 0.1wt%, 0.2wt%, 0.3wt%, 0.4wt%, 0.5wt%, 0.6wt%, 0.7wt%, 0.8wt%, 0.9wt%, 1.0wt%, 1.2wt%, 1.5wt%, or any value within the range described above.

[0062] In some embodiments of the present invention, in the liquid phenyl silicone rubber compound, the mass percentage of methylphenyl vinyl silicone resin is 2wt% to 25wt%, the mass percentage of phenyl hydrogen silicone oil is 0.1-5wt%, and the mass percentage of methylphenyl vinyl polysiloxane is 45wt% to 90wt%.

[0063] In this invention, the phenyl silicone rubber layer has a network polymer, and the core chain segment of the network polymer is: The R group can be either methyl or phenyl. The phenyl group in the chain segment accounts for 3% to 30% of the total mass percentage of the phenyl silicone rubber layer. If the mass percentage of phenyl in this chain segment is less than 3%, the damping performance of the phenyl silicone layer is generally poor, resulting in excessively high THD distortion of the formed diaphragm, which affects the listening performance of the speaker. Conversely, if the mass percentage of phenyl is greater than 30%, the viscosity of the formed liquid phenyl silicone rubber compound is too high, making it impossible to effectively inject the compound into the mold and hindering production. In some embodiments of the present invention, The phenyl group in the chain segment accounts for 8% to 20% of the total mass of the phenyl silicone rubber layer. For example, the phenyl group's mass percentage of the total phenyl silicone rubber layer can be one of 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, or 30%, or any value within the range described above.

[0064] In this invention, the phenyl silicone rubber layer has a network polymer, which further comprises chain segments. Among them, the phenyl structure contained in methylphenyl vinyl silicone resin has a high steric hindrance effect during the movement of molecular chains, which increases the friction between molecular chains, thereby improving the damping of the silicone rubber layer; and the phenyl structure has high polarity, which can improve the inductive force and orientation force of the bonding interface between the diaphragm, the shell and the voice coil, thereby significantly increasing the intermolecular forces between the bonding interfaces, thus improving the interfacial adhesion.

[0065] In this invention, the hardness of the phenyl silicone rubber layer is 30A to 90A. The hardness of the phenyl silicone rubber layer can be adjusted according to the performance requirements of the diaphragm by changing the content of methylphenyl vinyl silicone resin and the proportions of other components in the liquid phenyl silicone rubber compound, thus achieving a hardness between 30A and 90A. For example, the hardness of the phenyl silicone rubber layer can be one of 30A, 35A, 40A, 45A, 50A, 55A, 60A, 65A, 70A, 75A, 80A, 85A, or 90A, or any value within the above range. By using a hardness in the range of 30A to 90A, the required stiffness and elasticity of the diaphragm can be better met, ensuring the speaker's performance.

[0066] In embodiments of the present invention, the tensile strength of the phenyl silicone rubber layer is 1 MPa to 10 MPa. The tensile strength of the phenyl silicone rubber layer can be adjusted according to the requirements of the diaphragm, for example, it can be one of 1 MPa, 2 MPa, 3 MPa, 4 MPa, 5 MPa, 6 MPa, 7 MPa, 8 MPa, 9 MPa, or 10 MPa, or any value satisfying the above range. By keeping the tensile strength of the phenyl silicone rubber layer between 1 MPa and 10 MPa, the diaphragm can maintain a certain degree of rigidity while possessing a certain elasticity, making it less prone to diaphragm breakage or folding, thus extending the service life of the speaker.

[0067] In embodiments of the present invention, the conventional loss factor of the phenyl silicone rubber layer is 0.15 to 0.4. Exemplarily, the loss factor of the phenyl silicone rubber layer can be one of 0.15, 0.16, 0.17, 0.18, 0.19, 0.2, 0.22, 0.24, 0.26, 0.28, 0.3, 0.32, 0.34, 0.36, 0.38, or 0.4, or any value satisfying the above range. Using a phenyl silicone rubber layer with a room-temperature loss factor within this range can optimize the diaphragm performance, significantly reducing the THD of the phenyl silicone rubber layer's vibration. Generally, a higher loss factor indicates better damping properties of the material. Improved damping properties of the diaphragm material help reduce polarization during vibration, lower product distortion, and improve listening yield.

[0068] In embodiments of the present invention, the light transmittance of the phenyl silicone rubber layer is 20% to 75%. Exemplarily, the light transmittance of the phenyl silicone rubber layer can be one of 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, or 75%, or any value satisfying the above range. The phenyl silicone rubber layer has good light transmittance and high UV light transmittance. The diaphragm and voice coil are bonded with UV adhesive, allowing UV light to pass through the phenyl silicone rubber layer, enabling the UV adhesive to cure quickly, efficiently, and completely. The UV adhesive has a short curing time and strong adhesion.

[0069] The diaphragm of the sound-generating device in this embodiment of the invention includes at least one layer of phenyl silicone rubber. That is, the diaphragm in this invention can be formed as a single-layer structure or as a multi-layer composite structure. When the diaphragm is a single-layer structure, it is made of one layer of phenyl silicone rubber as described in this invention. When the diaphragm is a multi-layer composite structure, it includes at least one layer of phenyl silicone rubber, and the diaphragm can be formed by combining the phenyl silicone rubber layer of this invention with film layers of other materials.

[0070] In some embodiments of the present invention, when the diaphragm contains multiple layers of phenyl silicone rubber, the adjacent phenyl silicone rubber layers can be spaced apart, that is, a film layer of other materials can be disposed between the adjacent phenyl silicone rubber layers. Of course, the adjacent phenyl silicone rubber layers can also be bonded together. The arrangement can be selected according to actual usage requirements, and the present invention does not impose specific limitations on this.

[0071] In some embodiments of the present invention, the diaphragm includes a phenyl silicone rubber layer and other composite layers, wherein the composite layers are one or more of a thermoplastic elastomer layer, an engineering plastic layer, or a film layer. The thermoplastic elastomer layer includes at least one of polyester thermoplastic elastomer, polyurethane thermoplastic elastomer, polystyrene thermoplastic elastomer, and polyamide thermoplastic elastomer. The engineering plastic layer is made of at least one of polyetheretherketone (PEEK), polyaryl ester (PAR), polymethacrylamide (PMI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), nylon (PA), polyetherimide (PEI), and liquid crystal polymer (LCP). The film layer includes at least one of acrylic film and silicone film.

[0072] In this invention, the liquid phenyl silicone rubber compound also includes a reinforcing agent, which mainly improves the tensile and tear properties of the silicone film. Optionally, the reinforcing agent is selected from silicon dioxide.

[0073] In some embodiments of the present invention, the mass percentage of the reinforcing agent is 5 wt% to 45 wt%. Exemplarily, the mass percentage of the reinforcing agent can be one of 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, or 45 wt%, or any value satisfying the above range. If the mass percentage of the reinforcing agent is less than 5 wt%, the reinforcing effect on the silicone rubber layer is insufficient, and the tensile and tear properties of the silicone rubber layer are poor. If the mass percentage of the reinforcing agent is greater than 45 wt%, it will cause the viscosity of the liquid phenyl silicone rubber compound to be too high, making injection difficult during production, resulting in an excessively low elongation at break of the silicone film, and making it prone to breakage and failure during large-amplitude vibration.

[0074] In this invention, the liquid phenyl silicone rubber compound also includes at least one of an inhibitor and a catalyst.

[0075] In some embodiments of the present invention, the mass percentage of the inhibitor is 0.01 wt% to 0.2 wt%. Exemplarily, the mass percentage of the inhibitor can be one of 0.01 wt%, 0.02 wt%, 0.03 wt%, 0.04 wt%, 0.05 wt%, 0.06 wt%, 0.07 wt%, 0.08 wt%, 0.09 wt%, 0.10 wt%, 0.12 wt%, 0.14 wt%, 0.16 wt%, 0.18 wt%, or 0.2 wt%, or any value satisfying the above range. When the mass percentage of the inhibitor is less than 0.01 wt%, the inhibitory effect is generally weak, causing the viscosity of the liquid phenyl silicone rubber compound to rise rapidly during room temperature storage, making injection impossible. Conversely, when the mass percentage of the inhibitor is greater than 0.2%, excessive inhibitor leads to a slower vulcanization rate of the liquid phenyl silicone rubber compound, resulting in an excessively long molding cycle and affecting the molding efficiency of the product.

[0076] In some embodiments of the present invention, the inhibitor includes at least one of alkynyl alcohol inhibitors and polyvinyl polysiloxane inhibitors. For example, the inhibitor may specifically be: 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, 1-ethynyl-1-cyclohexanol, or 3-phenyl-1-butyn-3-ol; the polyvinyl alcohol inhibitor includes: 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane.

[0077] In some embodiments of the present invention, the catalyst is selected from platinum catalysts. It is worth mentioning that platinum catalysts mainly include three types: The first type: chloroplatinic acid (H₂PtCl₆·6H₂O) is dissolved in organic solvents such as ethanol, isopropanol, and tetrahydrofuran, allowing them to interact and form complexes, called "Speier catalysts." This type of catalyst is simple and quick to prepare and convenient to use. The second type: platinum catalysts are platinum-vinyl dual-headed complexes, called Karstedt's catalysts. The third type is a platinum catalyst, which is formed by chloroplatinic acid forming complexes with ketones, cyclopentadienes, esters, alcohols, crown ethers, heteroatom-containing crown ethers, and polysiloxanes, in addition to forming complexes with other unsaturated compounds. These catalysts exhibit high reactivity, stable storage, and good compatibility with various types of polysiloxanes, making them the most widely used catalysts in addition to addition-type organosilicon release agents.

[0078] In some embodiments of the present invention, the mass percentage of platinum catalyst in the liquid phenyl silicone rubber compound is 0.005 wt% to 0.2 wt%. Exemplarily, the mass percentage of platinum catalyst can be one of 0.005 wt%, 0.006 wt%, 0.007 wt%, 0.008 wt%, 0.009 wt%, 0.01 wt%, 0.02 wt%, 0.03 wt%, 0.04 wt%, 0.05 wt%, 0.06 wt%, 0.07 wt%, 0.08 wt%, 0.09 wt%, 0.1 wt%, 0.12 wt%, 0.14 wt%, 0.16 wt%, 0.18 wt%, or 0.2 wt%, or any value satisfying the above range. It should be noted that when the mass percentage of platinum catalyst is less than 0.0001%, the curing rate of the liquid phenyl silicone rubber compound is too slow, resulting in a long curing time and affecting production efficiency. Conversely, when the mass percentage of platinum catalyst is greater than 0.005%, the curing rate of the liquid phenyl silicone rubber compound is too fast, and its viscosity increases rapidly during storage at room temperature, causing process instability. Furthermore, during the curing process, the excessively rapid curing leads to insufficient release of internal stress in the phenyl silicone rubber layer, making the layer prone to deformation.

[0079] In this invention, the liquid phenyl silicone rubber compound also includes methylphenyl silicone resin, wherein the mass percentage of methylphenyl silicone resin in the liquid phenyl silicone rubber compound is 0-20 wt% and not zero. It should be noted that if the mass percentage of methylphenyl silicone resin is greater than 20 wt%, the elongation at break of the molded silicone rubber layer is significantly reduced, and the diaphragm is prone to breakage and failure during large-amplitude vibration. Exemplarily, the mass percentage of methylphenyl silicone resin in the liquid phenyl silicone rubber compound can be one of 0.1 wt%, 0.3 wt%, 0.5 wt%, 0.8 wt%, 1 wt%, 3 wt%, 5 wt%, 8 wt%, 10 wt%, 12 wt%, 15 wt%, 18 wt%, and 20 wt%, or any value satisfying the above range.

[0080] In some embodiments of the present invention, the mass percentage of phenyl in the methylphenyl silicone resin is 2 wt% to 50 wt%. If the mass percentage of phenyl in the methylphenyl silicone resin is less than 2 wt%, the damping performance of the formed silicone rubber layer is generally poor, and the adhesion between the diaphragm and the shell is insufficient; if the mass percentage of phenyl is greater than 50 wt%, the viscosity of the liquid phenyl silicone compound will be too high, making injection difficult during production. Exemplarily, the mass percentage of phenyl in the methylphenyl silicone resin can be one of 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, 45 wt%, or 50 wt%, or any value satisfying the above range.

[0081] In some embodiments of the present invention, the liquid phenyl silicone rubber compound includes methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, phenyl hydrogen silicone oil, silica, inhibitor, and catalyst.

[0082] In some embodiments of the present invention, the liquid phenyl silicone rubber compound includes methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, phenyl hydrogen silicone oil, silica, inhibitor, catalyst and methylphenyl silicone resin.

[0083] The present invention also provides a sound generating device, which includes the diaphragm of the sound generating device of any of the above embodiments.

[0084] In the embodiments of this invention, the sound-generating device includes a housing, and the diaphragm of the sound-generating device is integrally heat-cured and formed with the housing. The material of the housing may be, but is not limited to, fiber-reinforced polycarbonate or fiber-reinforced polyamide.

[0085] The diaphragm provided by this invention can be used to construct sound-generating devices of any structure. For example, as shown in Figure 1, the sound-generating device 100 can be a loudspeaker, which includes a housing 10, a vibration system disposed in the housing 10, and a magnetic circuit system 40 that cooperates with the vibration system. The vibration system includes a diaphragm 20 and a voice coil 30 coupled to one side of the diaphragm. When the sound-generating device 100 is working, after the voice coil 30 is energized, under the action of the magnetic field force of the magnetic circuit system 40, the voice coil 30 can vibrate up and down to drive the diaphragm 20 to vibrate, and the diaphragm 20 can produce sound when it vibrates.

[0086] In the embodiments of this invention, the waterproof rating of the sound-generating device is at least 1ATM, meeting the 10m waterproof reliability verification requirement. It is understood that the use of methylphenyl vinyl silicone resin as a reinforcing material in the liquid phenyl silicone rubber compound significantly improves the adhesion between the diaphragm and the housing, thereby enhancing the waterproof performance of the sound-generating device and ensuring a waterproof rating of at least 1ATM.

[0087] The present invention also provides a method for manufacturing a sound-generating device having a diaphragm according to any of the above embodiments, the method comprising the following steps:

[0088] Place the shell into the mold;

[0089] The liquid phenyl silicone rubber compound is injected into the mold and the mold is closed.

[0090] The mold is heated to a temperature of 100℃~200℃, and the liquid phenyl silicone rubber compound is cured and formed integrally with the shell in the mold to obtain a diaphragm with a phenyl silicone rubber layer that is integrally bonded to the shell.

[0091] For example, the mold heating temperature can be one of 100°C, 120°C, 140°C, 150°C, 180°C, 200°C or any value that meets the above range.

[0092] In embodiments of the present invention, a voice coil can be bonded, a magnetic circuit system can be installed, and a housing can be encapsulated to form a finished sound-generating device, according to actual usage requirements.

[0093] The chemical reagents used in the specification and examples of this invention include any type or variety conventional in the art, and this invention does not impose any special limitations.

[0094] The diaphragm and the sound-generating device according to embodiments of the present invention will be described in detail below with reference to specific embodiments and comparative examples. It is worth understanding that the following description is merely exemplary and not a specific limitation of the present invention.

[0095] Example 1

[0096] A diaphragm for a sound-generating device is disclosed, comprising a phenyl silicone rubber layer formed by curing a liquid phenyl silicone rubber compound; the composition of the liquid phenyl silicone rubber compound is as follows:

[0097] Methylphenyl vinyl polysiloxane: 100 parts;

[0098] Silica (reinforcing agent): 20 parts;

[0099] Methylphenyl vinyl silicone resin: 15 parts;

[0100] Phenyl hydrosilicone oil: 3 parts;

[0101] Chloroplatinic acid (platinum catalyst): 0.2 parts;

[0102] 3-Methyl-1-butyn-3-ol (inhibitor): 0.15 parts.

[0103] In this product, the phenyl-containing hydrogen silicone oil contains 15 wt% phenyl groups and 1 wt% hydrogen groups; the methylphenyl vinyl polysiloxane contains 0.12 wt% vinyl groups and 20 wt% phenyl groups; the methylphenyl vinyl silicone resin contains 0.4 wt% vinyl groups and 30 wt% phenyl groups.

[0104] The phenyl silicone rubber layer contains a network polymer, which includes chain segments: The R group is phenyl, and the phenyl group in this segment accounts for 18% of the total mass of the phenyl silicone rubber layer.

[0105] The diaphragm of the sound-generating device is integrally heated and cured with the housing at a temperature of 150°C.

[0106] Example 2

[0107] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0108] Methylphenyl vinyl polysiloxane: 100 parts;

[0109] Silica (reinforcing agent): 40 parts;

[0110] Methylphenyl vinyl silicone resin: 30 parts;

[0111] Phenyl hydrogen silicone oil: 3.5 parts;

[0112] Platinum-1,3-divinyltetramethyldisiloxane complex (platinum catalyst): 0.2 parts;

[0113] 3-Methyl-1-pentyn-3-ol (inhibitor): 0.15 parts.

[0114] In this product, the phenyl-containing hydrogen silicone oil contains 25 wt% phenyl groups and 0.8 wt% hydrogen groups; the methylphenyl vinyl polysiloxane contains 0.10 wt% vinyl groups and 13 wt% phenyl groups; the methylphenyl vinyl silicone resin contains 0.45 wt% vinyl groups and 40 wt% phenyl groups.

[0115] The phenyl silicone rubber layer contains a network polymer, which includes chain segments: The R group is phenyl, and the phenyl group in this segment accounts for 14.9% of the total mass of the phenyl silicone rubber layer.

[0116] The diaphragm of the sound-generating device is integrally heated and cured with the housing at a temperature of 160°C.

[0117] Example 3

[0118] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0119] Methylphenyl vinyl polysiloxane: 100 parts;

[0120] Silica (reinforcing agent): 60 parts;

[0121] Methylphenyl vinyl silicone resin: 35 parts;

[0122] Phenyl hydrogen silicone oil: 3.9 parts;

[0123] Platinum-1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane complex (platinum catalyst): 0.2 parts;

[0124] 3,5-Dimethyl-1-hexyn-3-ol (inhibitor): 0.15 parts.

[0125] In this product, the phenyl-containing hydrogen silicone oil contains 30 wt% phenyl groups and 0.6 wt% hydrogen groups; the methylphenyl vinyl polysiloxane contains 0.07 wt% vinyl groups and 10 wt% phenyl groups; the methylphenyl vinyl silicone resin contains 0.3 wt% vinyl groups and 45 wt% phenyl groups.

[0126] The phenyl silicone rubber layer contains a network polymer, which includes chain segments: The R group is methyl, and the phenyl group in this segment accounts for 13.5% of the total mass of the phenyl silicone rubber layer.

[0127] The diaphragm of the sound-generating device is integrally heated and cured with the housing at a temperature of 150°C.

[0128] Example 4

[0129] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0130] Methylphenyl vinyl polysiloxane: 100 parts;

[0131] Silica (reinforcing agent): 50 parts;

[0132] Methylphenyl vinyl silicone resin: 15 parts;

[0133] Phenyl hydrogen silicone oil: 3.1 parts;

[0134] Platinum-bis(alkynyl)(cyclodieneyl) complex (platinum catalyst): 0.2 parts;

[0135] 1-Ethynyl-1-cyclohexanol (inhibitor): 0.15 parts;

[0136] Methylphenyl silicone resin: 10 parts.

[0137] Among them, the phenyl hydrogen silicone oil has a phenyl mass percentage of 13 wt% and a hydrogen mass percentage of 0.45 wt%; the methylphenyl vinyl polysiloxane has a vinyl mass percentage of 0.08 wt% and a phenyl mass percentage of 18 wt%; the methylphenyl silicone resin has a phenyl mass percentage of 20 wt%; the methylphenyl vinyl silicone resin has a vinyl mass percentage of 0.35 wt% and a phenyl mass percentage of 20 wt%.

[0138] The phenyl silicone rubber layer contains a network polymer, which includes chain segments: The R group is methyl, and the phenyl group in this segment accounts for 13.2% of the total mass of the phenyl silicone rubber layer.

[0139] The diaphragm of the sound-generating device is integrally heated and cured with the housing at a temperature of 145°C.

[0140] Comparative Example 1

[0141] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0142] Methyl vinyl silicone oil: 100 parts;

[0143] Silica (reinforcing agent): 50 parts;

[0144] Methyl vinyl silicone resin: 15 parts;

[0145] Hydrogen-containing silicone oil: 3 parts;

[0146] Chloroplatinic acid (catalyst): 0.2 parts;

[0147] 3-Methyl-1-butyn-3-ol (inhibitor): 0.15 parts.

[0148] Comparative Example 2

[0149] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0150] Methylphenyl vinyl polysiloxane: 100 parts;

[0151] Silica (reinforcing agent): 50 parts;

[0152] Methyl vinyl silicone resin: 15 parts;

[0153] Hydrogen-containing silicone oil: 3 parts;

[0154] Chloroplatinic acid (catalyst): 0.2 parts;

[0155] 3-Methyl-1-butyn-3-ol (inhibitor): 0.15 parts.

[0156] The external dimensions of the diaphragms prepared in the embodiments and comparative examples of the present invention are completely identical. The components and formulations of the liquid phenyl silicone rubber compound used to prepare the diaphragms in the embodiments and comparative examples are shown in Table 1.

[0157] Table 1 Summary of the components of the liquid phenyl silicone rubber compound in the examples and comparative examples

[0158] Performance testing

[0159] Hardness: Tested according to GBT531.1-2008.

[0160] Tensile strength: Tested according to GBT528-2009.

[0161] Tear strength: Tested according to GBT529-2008.

[0162] Loss factor: The loss factor of the silicone film was tested using DMA. Test conditions: temperature range -100℃ to 100℃, heating rate 3℃ / min.

[0163] Light transmittance: Tested according to GBT2410-2008.

[0164] Adhesion force between diaphragm and housing: A self-made testing device was used, which included a fixing fixture. During the test, the housing was fixed on the fixture, and the force gauge was placed at the middle of the diaphragm. The maximum push-out force that caused the diaphragm and housing to break was measured and recorded as the adhesion force between the two.

[0165] The diaphragms prepared in Examples 1-4 of this invention and the diaphragms prepared in Comparative Examples 1-2 were tested for properties such as hardness, tensile strength, tear strength, loss factor, light transmittance, and adhesion between the diaphragm and the shell. The test results are detailed in Table 2.

[0166] Table 2 Summary of performance test results of the diaphragms prepared in the examples and comparative examples

[0167] As shown in Table 2, the diaphragm of this invention exhibits excellent overall performance. In particular, its loss factor, light transmittance, adhesion between the diaphragm and the housing, tear strength, and tensile strength are all superior to the corresponding performance of the diaphragm in the comparative example under the same conditions. In Comparative Example 1, without primer treatment, the adhesion between the diaphragm and the housing is only 0.5 N, which is too low. This low adhesion force makes the diaphragm prone to localized cracking and failure during vibration. Furthermore, the loss factor of the diaphragm in Comparative Example 1 is 0.078, which is very low, resulting in excessively high THD distortion and poor acoustic performance.

[0168] In Comparative Example 2, the poor compatibility between methyl vinyl silicone resin, hydrogen-containing silicone oil, and methyl phenyl vinyl polysiloxane caused local aggregation. Light was reflected, scattered, and diffused at these aggregation sites, resulting in low light transmittance of the diaphragm. Furthermore, the poor compatibility of the hydrogen-containing silicone oil led to uneven distribution and dispersion within the liquid phenyl silicone rubber compound, resulting in uneven mechanical properties of the diaphragm and consequently, insufficient tear and tensile strength. In addition, the poor light transmittance of the diaphragm resulted in low UV light transmittance during UV curing, leading to longer curing times, reduced production efficiency, and increased product costs.

[0169] Reliability verification

[0170] High temperature and high humidity reliability: Operates for 120 hours under conditions of 85℃, 85% humidity, and rated voltage.

[0171] High-power reliability: 72 hours of operation under 1.2 times rated voltage.

[0172] High and low temperature cycle reliability: 20 minutes of operation at rated voltage and -20°C, followed by 20 minutes of operation at 65°C constitutes one cycle, and 120 cycles are performed.

[0173] Waterproof performance test: A 10m water depth test was conducted to check for any membrane rupture. The test revealed that the diaphragm in the embodiments of this invention did not exhibit any membrane rupture, demonstrating superior waterproof performance and meeting the waterproof requirements of acoustic equipment.

[0174] Table 3 Comparison of diaphragm reliability results between the embodiments and comparative examples

[0175] As can be seen from Table 3 and Figure 2, the diaphragms in this invention have all passed tests for high temperature and humidity reliability, high power reliability, high and low temperature cycling reliability, and 1ATM waterproof performance. In contrast, in Comparative Example 1, due to insufficient adhesion between the diaphragm and the shell, stress concentration easily leads to localized cracking and failure during reliability verification. The diaphragm in Comparative Example 1 also exhibits an excessively low loss factor, poor damping performance, and excessively high THD distortion.

[0176] In the high-power reliability verification process of Comparative Example 2, the large amplitude and tensile strength of the diaphragm, along with stress concentration in localized areas, led to the rupture and failure of the diaphragm in its weakest areas.

[0177] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A diaphragm for a sound-generating device, characterized in that, It comprises at least one layer of phenyl silicone rubber, which is formed by curing a liquid phenyl silicone rubber compound, wherein the liquid phenyl silicone rubber compound comprises methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, and phenyl hydrogen-containing silicone oil; the phenyl silicone rubber layer contains a network polymer, wherein the network polymer comprises chain segments: Wherein, the R group is at least one of methyl or phenyl. The phenyl groups in the chain segment account for 3% to 30% of the total mass percentage of the phenyl silicone rubber layer.

2. The diaphragm of the sound-generating device as described in claim 1, characterized in that, The hardness of the phenyl silicone rubber layer is 30A to 90A; and / or, The tensile strength of the phenyl silicone rubber layer is 1 MPa to 10 MPa; and / or, The loss factor of the phenyl silicone rubber layer is 0.15 to 0.4; and / or, The light transmittance of the phenyl silicone rubber layer is 20% to 75%; Preferably, the The phenyl groups in the chain segment account for 8% to 20% of the total mass of the phenyl silicone rubber layer.

3. The diaphragm of the sound-generating device as described in claim 1 or 2, characterized in that, In the liquid phenyl silicone rubber compound, the methylphenyl vinyl silicone resin has a mass percentage of 2 wt% to 25 wt%, and / or, The phenyl hydrogen-containing silicone oil has a mass percentage of 0.1-5 wt%, and / or, The mass percentage of the methylphenyl vinyl polysiloxane is 45 wt% to 90 wt%.

4. The diaphragm of the sound-generating device as described in claim 1, characterized in that, The phenyl-containing hydrogen silicone oil contains 2 wt% to 50 wt% of phenyl groups by mass, and 0.05 wt% to 1.5 wt% of hydrogen groups by mass; and / or, The methylphenyl vinyl polysiloxane contains 0.05 wt% to 9 wt% vinyl by mass and 3 wt% to 45 wt% phenyl by mass.

5. The diaphragm of the sound-generating device as described in claim 1, characterized in that, The liquid phenyl silicone rubber compound also includes a reinforcing agent; Preferably, the reinforcing agent is selected from silicon dioxide; and / or, The reinforcing agent has a mass percentage of 5 wt% to 45 wt%.

6. The diaphragm of the sound-generating device as described in claim 1 or 5, characterized in that, The liquid phenyl silicone rubber compound also includes at least one of an inhibitor and a catalyst; Preferably, the inhibitor has a mass percentage of 0.01 wt% to 0.2 wt%; and / or, The catalyst has a mass percentage of 0.005 wt% to 0.2 wt%. Preferably, the inhibitor comprises at least one of alkynyl alcohol inhibitors and polyvinyl polysiloxane inhibitors; and / or, The catalyst is selected from platinum catalysts.

7. The diaphragm of the sound-generating device as described in claim 1 or 5, characterized in that, The liquid phenyl silicone rubber compound also includes methyl phenyl silicone resin, wherein the mass percentage of methyl phenyl silicone resin in the liquid phenyl silicone rubber compound is 0 to 20 wt% and is not 0. Preferably, the phenyl content in the methylphenyl silicone resin is 2 wt% to 50 wt%.

8. The diaphragm of the sound-generating device as described in claim 1, characterized in that, The diaphragm has a single-layer structure, consisting of a single layer of phenyl silicone rubber; or... The diaphragm is formed as a composite layer structure, which includes at least one layer of the phenyl silicone rubber and a composite layer, wherein the composite layer includes at least one of a thermoplastic elastomer layer, an engineering plastic layer and a film layer.

9. A sound-generating device, characterized in that, The sound-generating device includes the diaphragm of the sound-generating device according to any one of claims 1-8.

10. The sound-generating device as claimed in claim 9, characterized in that, The sound-generating device includes a housing, and the diaphragm of the sound-generating device is integrally heated and cured with the housing. And / or, the waterproof rating of the sound-generating device is at least 1ATM.

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