Adhesive-backed film for integrated film packaging and preparation method therefor, and chip packaging method

Abstract

Provided in the present invention are an adhesive-backed film for integrated film packaging and a preparation method therefor, and a chip packaging method. The adhesive-backed film comprises the following components in parts by weight: 20-23 parts of a phenoxy resin, 50-55 parts of silicon dioxide, 20-25 parts of an epoxy resin, 5-10 parts of a curing agent, and 0.3-0.5 parts of carbon black, wherein the epoxy resin is composed of a polyurethane-modified epoxy resin, a bisphenol F epoxy resin and a benzoxazine epoxy resin. By means of adjusting the ratio of the polyurethane-modified epoxy resin to the bisphenol F epoxy resin to the benzoxazine epoxy resin, the rheological viscosity between the adhesive-backed film and a dicing film can be changed significantly, thereby changing the peeling force between the adhesive-backed film and the dicing film. In the present invention, an integrated film formed by the adhesive-backed film and a dicing film is directly used to package a chip, and a well-packaged chip is obtained after marking, cutting, and removing the dicing film, thus improving the packaging yield and efficiency of chip packaging.

Description

Adhesive film for integrated film encapsulation and its preparation method, chip encapsulation method Technical Field

[0001] This invention belongs to the field of chip packaging technology, and specifically relates to an adhesive film for integrated film packaging, its preparation method, and a chip packaging method. Background Technology

[0002] The traditional CSP product packaging process is as follows: ball placement (ball placement - reflow - cleaning) - testing - die grinding (film application - die grinding - film removal) - adhesive backing (adhesive backing - baking) - printing - dicing (die placement - baking - dicing) - sorting. In other words, when packaging a chip, release films need to be applied to both the front and back of the adhesive film. After drying, the front release film is removed and transferred to the back of the chip. The back release film is then removed, cured, and marked. Then, a dicing film is applied to the adhesive film on the back of the chip. After baking and curing, the dicing film is removed. This process covers the back of the chip with an adhesive film to protect it. However, this process is cumbersome, and each step can affect the chip packaging effect. Furthermore, with the rapid development of the electronic information age, the requirements for adhesive films that protect electronic components are becoming increasingly stringent. In the existing technology, when adhesive films are peeled off from release films and dicing films, the low toughness of the adhesive film and the inconsistent bonding ability with the chip and dicing film can cause the adhesive film to break or fail to peel off effectively, thereby affecting the chip packaging effect and reducing the chip's lifespan.

[0003] Therefore, how to provide an adhesive film for integrated film encapsulation, by adjusting the ratio of polyurethane-modified epoxy resin, bisphenol F epoxy resin and benzoxazine epoxy resin to change the rheological viscosity of the adhesive film, thereby changing the peel force between the adhesive film and the dicing film, and improving the chip encapsulation yield and encapsulation efficiency, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide an adhesive film for integrated film encapsulation, a method for preparing the same, and a chip encapsulation method, so as to solve at least one of the above-mentioned technical problems.

[0005] To achieve the above objectives, the first aspect of the present invention provides an adhesive film for integrated film encapsulation, wherein the adhesive film comprises, by weight, the following components: 20-23 parts of phenoxy resin, 50-55 parts of silica, 20-25 parts of epoxy resin, 5-10 parts of curing agent, and 0.3-0.5 parts of carbon black; wherein the epoxy resin is composed of polyurethane-modified epoxy resin, bisphenol F type epoxy resin, and benzoxazine epoxy resin.

[0006] In the first aspect, the polyurethane-modified epoxy resin is 6 to 8 parts by weight, the bisphenol F epoxy resin is 10 to 12 parts by weight, and the benzoxazine epoxy resin is 1 to 4 parts by weight.

[0007] In the first aspect, the epoxy equivalent of the polyurethane-modified epoxy resin is 160-180 g / eq, the epoxy equivalent of the bisphenol F type epoxy resin is 160-180 g / eq, and the epoxy equivalent of the benzoxazine epoxy resin is 180-200 g / eq.

[0008] In the first aspect, the molecular weight of the phenoxy resin is 50,000.

[0009] In the first aspect, the silicon dioxide is spherical silicon dioxide; the particle size D50 of the spherical silicon dioxide is 0.25 μm.

[0010] In the first aspect, the curing agent includes a naphthol-based curing agent; the hydroxyl equivalent of the naphthol-based curing agent is 100-120 g / eq.

[0011] In the first aspect, the average particle size of the carbon black is 20 nm.

[0012] In the first aspect, the phenoxy resin comprises 22 parts by weight, the silica comprises 51.5 parts by weight, the curing agent comprises 8 parts by weight, and the carbon black comprises 0.5 parts by weight.

[0013] A second aspect of the present invention provides a method for preparing an adhesive film for integrated film encapsulation as described in the first aspect. The method includes: adding each component to a stirring cup according to its respective weight parts, stirring and mixing to obtain a slurry, wherein the weight parts of each component specifically include: 20-23 parts of phenoxy resin, 50-55 parts of silica, 20-25 parts of epoxy resin, 5-10 parts of curing agent and 0.3-0.5 parts of carbon black; wherein the epoxy resin is composed of polyurethane-modified epoxy resin, bisphenol F type epoxy resin and benzoxazine epoxy resin; coating the slurry and drying it to obtain an adhesive film.

[0014] A third aspect of the present invention provides a chip packaging method, the method comprising: transferring an adhesive film for integrated film packaging as described in the first aspect onto a PET release film; covering the upper surface of the adhesive film with a dicing film and removing the PET release film to form an integrated film, wherein an adhesive is filled between the dicing film and the adhesive film; transferring the integrated film onto the back side of a wafer and curing it at 130°C for 2 hours to obtain a pre-packaged wafer; marking and cutting the pre-packaged wafer to obtain a pre-packaged chip; and removing the dicing film from the pre-packaged chip to obtain a fully packaged chip. Beneficial effects:

[0015] This invention provides an adhesive film for integrated film encapsulation, comprising the following components by weight: 20-23 parts phenoxy resin, 50-55 parts silica, 20-25 parts epoxy resin, 5-10 parts curing agent, and 0.3-0.5 parts carbon black; wherein the epoxy resin is composed of polyurethane-modified epoxy resin, bisphenol F type epoxy resin, and benzoxazine epoxy resin; by adjusting the ratio of polyurethane-modified epoxy resin, bisphenol F type epoxy resin, and benzoxazine epoxy resin, and by using phenoxy resin as the matrix material, silica as the filler material, and carbon black as the coloring agent, the rheological viscosity of the adhesive film at the curing temperature is adjusted under the action of the curing agent, so that the adhesive film has strong adhesion to silicon wafers and can be effectively peeled off from the dicing film, thereby achieving the effect of protecting the chip. The adhesive film prepared using this invention can form an integral structure (integrated film) with the dicing agent. At the same time, the integrated film can be directly transferred to the back of the wafer. After curing reaction, the adhesive film is stably adhered to the back of the wafer. After marking, cutting and removing the dicing film, a well-packaged chip can be obtained, which reduces the chip packaging process and improves the chip packaging yield and packaging efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this specification or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 is a flowchart of a chip packaging method provided by the present invention;

[0018] Figure 2 is a schematic diagram of the structure of the integrated membrane provided by the present invention;

[0019] Reference numerals: 1. PET release film; 2. Adhesive film; 3. Adhesive; 4. Scribing film. Detailed Implementation

[0020] The present invention will be described in detail below with reference to specific embodiments and examples, thereby making the advantages and various effects of the present invention more clearly apparent. Those skilled in the art should understand that these specific embodiments and examples are for illustrative purposes only and are not intended to limit the present invention.

[0021] Throughout this specification, unless otherwise specified, the terminology used herein should be understood as having the meaning commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. In the event of any conflict, this specification shall prevail.

[0022] Unless otherwise specified, all raw materials, reagents, instruments and equipment used in this invention can be obtained by purchasing them from the market or by existing methods.

[0023] The overall concept of this invention is as follows:

[0024] An integrated wafer can be formed by adding an adhesive between an adhesive backing film and a dicing film, allowing it to be directly transferred onto the wafer for protection. In existing technologies, the dicing film is typically made of polyolefin materials, while the adhesive backing film is usually made from epoxy resin. In practical applications, the dicing film within the integrated wafer is usually peeled off to utilize the adhesive backing film's properties to enhance wafer protection. However, when the peel force between the dicing film and the adhesive backing film is high, the adhesive backing film may be lifted during dicing, reducing the adhesion between the adhesive backing film and the wafer, thus compromising wafer protection. Conversely, when the peel force is low, dicing cannot be achieved, preventing the wafer from being cut into several well-packaged chips that meet size requirements. Therefore, investigating the peel force between the dicing film and the adhesive backing film is a key research focus for those skilled in the art.

[0025] The present invention provides an adhesive film for integrated film encapsulation, wherein the adhesive film comprises the following components by weight: 20-23 parts of phenoxy resin, 50-55 parts of silica, 20-25 parts of epoxy resin, 5-10 parts of curing agent and 0.3-0.5 parts of carbon black; wherein the epoxy resin is composed of polyurethane modified epoxy resin, bisphenol F type epoxy resin and benzoxazine epoxy resin.

[0026] Specifically, the present invention provides an adhesive film for integrated film encapsulation, comprising the following components by weight: 20-23 parts phenoxy resin, 50-55 parts silica, 20-25 parts epoxy resin, 5-10 parts curing agent, and 0.3-0.5 parts carbon black; wherein the epoxy resin is composed of polyurethane-modified epoxy resin, bisphenol F epoxy resin, and benzoxazine epoxy resin; by adjusting the ratio of polyurethane-modified epoxy resin, bisphenol F epoxy resin, and benzoxazine epoxy resin, and by using phenoxy resin as the matrix material, silica as the filler material, and carbon black as the coloring agent, the rheological viscosity of the adhesive film at the curing temperature is adjusted under the action of the curing agent, so that the adhesive film has strong adhesion to silicon wafers and can be effectively peeled off from the dicing film, thereby achieving the effect of protecting the chip. The adhesive film prepared using this invention can form an integral structure (integrated film) with the dicing agent. At the same time, the integrated film can be directly transferred to the back of the wafer. After curing reaction, the adhesive film is stably adhered to the back of the wafer. After marking, cutting and removing the dicing film, a well-packaged chip can be obtained, which reduces the chip packaging process and improves the chip packaging yield and packaging efficiency.

[0027] In some possible embodiments, the polyurethane-modified epoxy resin is 6 to 8 parts by weight, the bisphenol F epoxy resin is 10 to 12 parts by weight, and the benzoxazine epoxy resin is 1 to 4 parts by weight.

[0028] In some possible embodiments, the epoxy equivalent of the polyurethane-modified epoxy resin is 160-180 g / eq, the epoxy equivalent of the bisphenol F type epoxy resin is 160-180 g / eq, and the epoxy equivalent of the benzoxazine epoxy resin is 180-200 g / eq.

[0029] This is because benzoxazine epoxy resin has a high glass transition temperature (Tg≥170℃) after curing, good toughness, and low curing shrinkage, which can increase the rheological viscosity of the adhesive film at 130℃, thereby changing the peel force between the cured adhesive film and the scribe film. By adjusting the ratio of polyurethane-modified epoxy resin, bisphenol F epoxy resin, and benzoxazine epoxy resin, the rheological viscosity between the adhesive film and the scribe film can be significantly changed, thereby changing the peel force between them. By controlling the weight parts of polyurethane-modified epoxy resin to 6-8 parts, bisphenol F epoxy resin to 10-12 parts, and benzoxazine epoxy resin to 1-4 parts, with a total weight part of 21 parts, the matrix material and the curing agent undergo a cross-linking reaction, thus adhering to the back of the chip and protecting it. The grade of polyurethane-modified epoxy resin can be EPU-133, the grade of bisphenol F type epoxy resin can be NPEF-170, and the grade of benzoxazine epoxy resin can be CB4100.

[0030] In some possible embodiments, the molecular weight of the phenoxy resin is 50,000.

[0031] Those skilled in the art will understand that phenoxy resin has good flexibility and adhesion, which can improve the adhesion to the chip. The grade of phenoxy resin can be selected as 019M.

[0032] In some possible embodiments, the silica is spherical silica; the particle size D50 of the spherical silica is 0.25 μm.

[0033] This is because spherical silica is used as a filler material to improve the mechanical strength of the adhesive film. Preferably, the particle size D50 of the spherical silica is 0.25μm, which can prevent the spherical silica from flowing in the molten adhesive film (during the adhesive film curing and crosslinking process), thereby affecting the chip packaging effect.

[0034] In some possible embodiments, the curing agent includes a naphthol-based curing agent; the hydroxyl equivalent of the naphthol-based curing agent is 100-120 g / eq.

[0035] Those skilled in the art will understand that the hydroxyl groups in naphthol curing agents react with the epoxy groups in epoxy resins to form a segment of the cured product, and the linear molecules are cross-linked into three-dimensional molecular structures through a stepwise polymerization reaction, thereby improving the strength of the adhesive film.

[0036] In some possible embodiments, the average particle size of the carbon black is 20 nm.

[0037] This is because carbon black is used as a dye, and the preferred average particle size of the carbon black is 20nm. It is also to prevent the carbon black from flowing in the adhesive film and affecting the chip packaging effect.

[0038] In some possible embodiments, the phenoxy resin comprises 22 parts by weight, the silica comprises 51.5 parts by weight, the curing agent comprises 8 parts by weight, and the carbon black comprises 0.5 parts by weight.

[0039] Based on a general inventive concept, a second aspect of the present invention provides a method for preparing an adhesive film for integrated film encapsulation as described in the first aspect. The method includes: adding each component to a stirring cup according to its respective weight parts, stirring and mixing to obtain a slurry, wherein the weight parts of each component specifically include: 20-23 parts of phenoxy resin, 50-55 parts of silica, 20-25 parts of epoxy resin, 5-10 parts of curing agent, and 0.3-0.5 parts of carbon black; wherein the epoxy resin is composed of polyurethane-modified epoxy resin, bisphenol F type epoxy resin, and benzoxazine epoxy resin; coating the slurry and drying it to obtain an adhesive film.

[0040] Weigh each component according to the formula ratio in the first aspect, stir them evenly to obtain a slurry, coat the slurry onto the PET release film, dry it to remove small molecule solvents, peel off the PET release film, and you can obtain the adhesive film.

[0041] Based on a general inventive concept, referring to Figure 1, a third aspect of the present invention provides a chip packaging method, the method comprising:

[0042] S1. Transfer the adhesive film for integrated film encapsulation as described in the first aspect onto the PET release film;

[0043] S2. Cover the upper surface of the adhesive film with a dicing film and remove the PET release film to form an integral film, wherein an adhesive is filled between the dicing film and the adhesive film.

[0044] S3. The integrated film is transferred to the back of the wafer and cured at 130°C for 2 hours to obtain a pre-packaged wafer;

[0045] S4. Mark and cut the pre-packaged wafer to obtain a pre-packaged chip;

[0046] S5. Remove the dicing film from the pre-packaged chip to obtain a properly packaged chip.

[0047] Specifically, the adhesive film prepared in the second aspect is transferred onto a PET release film, and a PO dicing film is then covered on the adhesive film. Adhesive is filled between the adhesive film and the PO dicing film to form an integrated film (as shown in Figure 2). This integrated film is then directly applied to the back side of an 8-inch or 2-inch wafer using a hot press and cured at 130°C for 2 hours, ensuring stable adhesion of the adhesive film to the back side of the wafer. The wafer is then marked and cut to obtain multiple chips of the target size and information. Finally, the dicing film is removed to obtain the packaged chip. Compared with traditional chip packaging methods, the chip packaging method provided by this invention reduces the processes of applying and removing PET release films on the front and back of the adhesive film, as well as the hot-applying, curing, and dicing processes of the dicing film. The packaging method is simple, easy to operate, and can significantly improve the packaging efficiency and yield of chip packaging.

[0048] It should be further noted that, as shown in Figure 2, this invention provides an integrated film. An adhesive backing film 2 is attached to the upper surface of a PET release film 1, and an adhesive 3 is coated on the upper surface of the adhesive backing film 2 to bond a dicing film 4. The resulting integrated film can be directly applied to wafer / chip packaging. Preferably, the thickness of the PET release film 1 is 50 μm, the thickness of the adhesive backing film 2 is 25 μm, the thickness of the adhesive 3 is 10 μm, and the thickness of the dicing film 4 is 78 μm.

[0049] The present application is further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the application. Experimental methods in the following embodiments that do not specify specific conditions are generally determined according to national standards. If there is no corresponding national standard, then general international standards, conventional conditions, or conditions recommended by the manufacturer are followed.

[0050] The components of the adhesive film in Examples 1-4 and Comparative Examples 1-4, according to their weight parts, are shown in Table 1 below:

[0051] Table 1. Weight parts of raw material components

[0052] The adhesive films provided in Examples 1-4 and Comparative Examples 1-4 were subjected to peel force after curing, rheological viscosity at 130°C, Tg test, and silicon wafer adhesion test. The specific test procedures are as follows:

[0053] 1. Post-curing peel strength (adhesive film / scribing film) test: Take the full-width coated finished product (integrated film, adhesive film and scribing film), and take three samples from the left, center and right sides. The sample size is 25mm×150mm. The sampling is in the MD direction of the coating. Heat-press it onto the PET release film and cure it. At 23±2℃ and 65±5%RH, use a tensile testing machine at a speed of 300mm / min, a stroke of 120mm and a temperature of 180℃ to peel the scribing film. Record the flattest (most stable curve) value in the 120mm stroke. The average value of the three measurements is recorded as the adhesion (peel strength) of the sample adhesive film to the scribing film.

[0054] 2. Test method for rheological viscosity at 130℃: Heat transfer the adhesive film at 100℃ / 2kg onto the release film to form a stacked sheet, and stack it to a thickness of 1.2-1.3mm. Take the stacked sheet and test it with a rheometer. Select the "variable speed rotational viscosity + curing modulus" program for testing. Take the viscosity value at 130℃ in the 4th program as the melt viscosity@130℃.

[0055] 3. Tg test: Take 100mm×150mm sample pieces, 55-60 25μm sample pieces or 35-40 40μm sample pieces, heat-bond thick sheets at 100℃ / 2kg, then cut 10mm×55mm sample pieces and place them in the mold, then heat-cur at 180℃ for 1 hour. Use the heat-cured sample as the sample for measuring DMA storage modulus. Use a DMA dynamic thermomechanical analyzer to perform thermal analysis from room temperature to 250℃. After the measurement is completed, read the glass transition temperature value.

[0056] 4. Silicon Wafer Adhesion Test: Cut a sample of approximately 400mm × 250mm from the batch of coated adhesive film and cut it into smaller pieces of approximately 2mm × 2mm for testing. Adhesive film is bonded to the surface of a 10mm × 10mm × 0.7mm silicon wafer heated to 80℃. Another 2mm × 2mm × 0.7mm silicon wafer is placed on top of the adhesive film on the silicon wafer. Excess adhesive film on the 2mm × 2mm edge is removed. The adhesive film is bonded between the silicon wafers. The sample is clamped with stainless steel clips and cured in an oven at 100℃ for 30min + 165℃ for 60min. Peeling is tested at a 180° angle using a multi-functional shear force tester. Measurements are performed n=3 times, and the average value of each batch is taken as the measurement value.

[0057] The test results are shown in Table 2 below:

[0058] Table 2 Test Results

[0059] As can be seen from the table above:

[0060] (1) In Comparative Example 1, without the addition of benzoxazine epoxy resin, the silicon wafer adhesion and Tg of the prepared backing film were low. The peel force between the cured backing film and the dicing film was large. During the peeling process of the dicing film, the backing film was easily moved, which was not conducive to chip packaging.

[0061] (2) Comparative Example 2 added benzoxazine epoxy resin with an extended range. The prepared backing film had high silicon wafer adhesion and Tg, and high rheological viscosity at 130℃, which was not conducive to wafer cutting.

[0062] (3) In Comparative Example 3, no polyurethane-modified epoxy resin was added. The prepared backing film had high silicon wafer adhesion and Tg, and a large rheological viscosity at 130℃, which was not conducive to wafer cutting.

[0063] (4) In Comparative Example 4, no bisphenol F epoxy resin was added. Although the adhesive film prepared had high silicon wafer adhesion, its Tg was low and its rheological viscosity at 130°C was also low. Silica and carbon black were easy to flow in the molten state, which was not conducive to chip packaging.

[0064] (5) In Examples 1-4, the epoxy resin prepared under the specified formulation ratio has a suitable peel force (400-2000mN / 25mm) with the dicing film after curing. The thickness of the adhesive film after peeling the dicing film does not affect the encapsulation effect of the adhesive film on the chip.

[0065] In summary, the peel force between the PO dicing film and the adhesive film after curing is negatively correlated with the rheological viscosity of the adhesive film at a curing temperature of 130°C. By adjusting the ratio of polyurethane-modified epoxy resin, bisphenol F epoxy resin, and benzoxazine epoxy resin, the rheological viscosity between the adhesive film and the dicing film can be significantly altered, thereby changing the peel force between them. Furthermore, since the PO dicing film and the adhesive film are integrated into a single film, and this integrated film is directly adhered to the back of the wafer, after cross-linking and curing with epoxy resin and curing agent, the adhesive film in the integrated film is stably adhered to the wafer. Simultaneously, effective peeling of the dicing film within the integrated film can be achieved, providing insulation and heat protection for the chip.

[0066] Finally, it should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0067] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0068] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. An adhesive film for integrated film encapsulation, characterized in that, The adhesive film comprises the following components by weight: 20-23 parts phenoxy resin, 50-55 parts silica, 20-25 parts epoxy resin, 5-10 parts curing agent, and 0.3-0.5 parts carbon black; wherein the epoxy resin is composed of polyurethane-modified epoxy resin, bisphenol F type epoxy resin, and benzoxazine epoxy resin. The polyurethane-modified epoxy resin is 6 to 8 parts by weight, the bisphenol F type epoxy resin is 10 to 12 parts by weight, and the benzoxazine epoxy resin is 1 to 4 parts by weight. The epoxy equivalent of the polyurethane-modified epoxy resin is 160-180 g / eq, the epoxy equivalent of the bisphenol F type epoxy resin is 160-180 g / eq, and the epoxy equivalent of the benzoxazine epoxy resin is 180-200 g / eq.

2. The adhesive film for integrated film encapsulation according to claim 1, characterized in that, The molecular weight of the phenoxy resin is 50,000.

3. The adhesive film for integrated film encapsulation according to claim 1, characterized in that, The silica is spherical silica; the particle size D50 of the spherical silica is 0.25 μm.

4. The adhesive film for integrated film encapsulation according to claim 1, characterized in that, The curing agent includes a naphthol-based curing agent; the hydroxyl equivalent of the naphthol-based curing agent is 100-120 g / eq.

5. The adhesive film for integrated film encapsulation according to claim 1, characterized in that, The average particle size of the carbon black is 20 nm.

6. The adhesive film for integrated film encapsulation according to claim 1, characterized in that, The phenoxy resin comprises 22 parts by weight, the silica comprises 51.5 parts by weight, the curing agent comprises 8 parts by weight, and the carbon black comprises 0.5 parts by weight.

7. A method for preparing an adhesive film for integrated film encapsulation as described in any one of claims 1-6, characterized in that, The preparation method includes: Each component is added to a mixing cup according to its respective weight proportions and stirred to obtain a slurry. The specific weight proportions of each component include: 20-23 parts of phenoxy resin, 50-55 parts of silica, 20-25 parts of epoxy resin, 5-10 parts of curing agent, and 0.3-0.5 parts of carbon black; wherein the epoxy resin is composed of polyurethane modified epoxy resin, bisphenol F type epoxy resin, and benzoxazine epoxy resin. The slurry is coated and dried to obtain an adhesive film.

8. A chip packaging method, characterized in that, The method includes: The adhesive film for integrated film encapsulation as described in any one of claims 1-6 is transferred onto the PET release film; A dicing film is covered on the upper surface of the adhesive film, and the PET release film is removed to form an integral film, with an adhesive filling the space between the dicing film and the adhesive film. The integrated film is transferred to the back of the wafer and cured at 130°C for 2 hours to obtain a pre-packaged wafer. The pre-packaged wafer is marked and cut to obtain a pre-packaged chip; Remove the dicing film from the pre-packaged chip to obtain a properly packaged chip.

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