Module

Abstract

This module (1) comprises a wiring board (2), a first electronic component (5) provided in a first region (3) on the wiring board (2), a second electronic component (6) provided in a second region (4) on the wiring board (2), and a shield member (7) that partitions between the first region (3) and the second region (4) on the wiring board (2). The shield member (7) includes a first conductor (71) and a second conductor (72) disposed facing the first conductor (71), and constitutes a capacitor (70) in which the first conductor (71) is a first electrode and the second conductor (72) is a second electrode.

Description

Module

[0001] The present disclosure relates to modules.

[0002] In a module containing multiple electronic components, a shielding member may be provided to separate the components. Such a shielding member is provided for purposes such as preventing heat and unwanted radiation generated by each electronic component in the module from adversely affecting other electronic components.

[0003] International Publication No. 2017 / 047539 (Patent Document 1) discloses a high-frequency module including a plurality of electronic components, in which a shield wall is provided in the area between the electronic components. Such a shield wall is provided for the same purpose as the above-mentioned shield member.

[0004] International Publication No. 2017 / 047539

[0005] However, in conventional modules, when a shielding member is provided, electronic components cannot be placed in the area where the shielding member is provided, which poses a problem in that the area in which electronic components can be placed is narrowed by providing the shielding member.

[0006] The present disclosure has been made to solve such problems, and its purpose is to prevent the area in a module where a shielding member is provided from narrowing the area in which electronic components are provided.

[0007] A module according to one aspect of the present disclosure comprises a wiring board, a first electronic component provided in a first region on the wiring board, a second electronic component provided in a second region on the wiring board, and a shielding member separating the first region and the second region on the wiring board, the shielding member including a first conductor and a second conductor arranged opposite the first conductor, forming a capacitor in which the first conductor is a first electrode and the second conductor is a second electrode.

[0008] In the module according to the present disclosure, the shielding member includes a first conductor and a second conductor arranged opposite the first conductor, forming a capacitor with the first conductor as the first electrode and the second conductor as the second electrode, so that the shielding member also functions as a capacitor. This allows the region in the module where the shielding member is provided to be the region where electronic components are provided. Therefore, in the module, the region where the shielding member is provided can be prevented from narrowing the region where electronic components are provided.

[0009] 1. A longitudinal sectional view of a module according to a first embodiment. An enlarged sectional view of a shielding member according to the first embodiment. A side view of the shielding member of FIG. 2 as viewed from the first conductor side. A circuit diagram illustrating an example in which a shielding member is used as a capacitor in a module according to a first embodiment. A circuit diagram illustrating a configuration of the low-pass filter illustrated in FIG. 4. A plan view illustrating an example of an arrangement of electronic components in a module according to a first embodiment. A circuit diagram illustrating an example in which a shielding member is used as a capacitor in a module according to a second embodiment. A plan view illustrating an example of an arrangement of electronic components in a module according to a second embodiment. A circuit diagram illustrating an example in which a shielding member is used as a capacitor in a module according to a third embodiment. A circuit diagram illustrating a configuration of the low-pass filter illustrated in FIG. 9. A plan view illustrating an example of an arrangement of electronic components in a module according to a third embodiment. A circuit diagram illustrating an example in which a shielding member is used as a capacitor in a module according to a fourth embodiment. A circuit diagram illustrating a configuration of the high-pass filter illustrated in FIG. 12. A plan view illustrating an example of an arrangement of electronic components in a module according to a fourth embodiment. A circuit diagram illustrating an example in which a shielding member is used as a capacitor in a module according to a fifth embodiment. A circuit diagram illustrating a configuration of a bypass capacitor illustrated in FIG. 15. FIG. 13 is a plan view showing an example of the arrangement of electronic components in a module according to a fifth embodiment.

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. While multiple embodiments will be described below, it is anticipated from the beginning that the configurations described in each embodiment will be appropriately combined. Note that identical or corresponding parts in the drawings will be designated by the same reference numerals, and their description will not be repeated.

[0011] [Embodiment 1] (Configuration of Module 1) Fig. 1 is a vertical cross-sectional view of a module 1 in embodiment 1. Fig. 1 shows a cross section of a portion where a first electronic component 5 and a second electronic component 6 can be seen from the side.

[0012] 1 , the module 1 includes a wiring board 2, a first electronic component 5, a second electronic component 6, a shielding member 7, a first sealing material 30, a second sealing material 40, and a film 8. In the module 1, the first electronic component 5 is provided in a first region 3 on the wiring board 2. In the module 1, the second electronic component 6 is provided in a second region 4 on the wiring board 2.

[0013] The first electronic component 5 is, for example, one of various electronic components such as an integrated circuit, which will be described later. The second electronic component 6 is, like the first electronic component 5, one of various electronic components such as an integrated circuit.

[0014] On the wiring board 2, the first region 3 and the second region 4 are separated by a wall-shaped shielding member 7. The shielding member 7 includes a plate-shaped first conductor 71, a second conductor 72, and a dielectric 73. In the shielding member 7, the first conductor 71 and the second conductor 72 are arranged facing each other at a predetermined distance, with their planes facing each other. In the region where the first conductor 71 and the second conductor 72 face each other, a dielectric 73 is provided in a sandwiched manner.

[0015] The first conductor 71 is made of metal. The second conductor 72 is also made of metal. The dielectric 73 is made of a dielectric material such as resin. Because the first conductor 71 and the second conductor 72 are made of metal, the shielding member 7 has its original functions of heat dissipation and unwanted radiation suppression.

[0016] The shielding member 7 has a heat dissipation function of receiving heat generated from electronic components such as the first electronic component 5 and the second electronic component 6 provided in the module 1 and radiating the heat to the surroundings, such as above the module 1. The shielding member 7 also has an unwanted radiation suppression function of blocking unwanted radiation generated from electronic components such as the first electronic component 5 and the second electronic component 6 provided in the module 1.

[0017] The first conductor 71 may be made of any material other than metal as long as it has conductive properties. The second conductor 72 may be made of any material other than metal as long as it has conductive properties. However, at least one of the first conductor 71 and the second conductor 72 must have the heat dissipation function and the unwanted radiation suppression function, which are the original functions of the shielding member 7 described above.

[0018] Furthermore, the dielectric 73 may be made of any material other than resin as long as it has dielectric properties.

[0019] 1 also shows an example in which the thickness of the first conductor 71 and the thickness of the second conductor 72 are the same. However, this is not a limitation, and the thickness of the first conductor 71 and the thickness of the second conductor 72 may be different. Also, FIG. 1 also shows an example in which the thickness of the first conductor 71 and the thickness of the second conductor 72 are different from the thickness of the dielectric 73. However, this is not a limitation, and the thickness of the first conductor 71 and the thickness of the second conductor 72 may be the same as the thickness of the dielectric 73.

[0020] The shielding member 7 is provided in close contact with the wiring board 2 and also in close contact with the film body 8. The shielding member 7 extends as a wall-like member on the wiring board 2. In this way, the shielding member 7 separates the first region 3 and the second region 4 due to its wall-like shape.

[0021] It should be noted that the shielding member 7 may be provided in any manner that separates the first region 3 and the second region 4. Therefore, the shielding member 7 may be provided so as to separate the first region 3 and the second region 4 in such a manner that the shielding member 7 is in close contact with the wiring board 2 and the film 8, thereby sealing the space between the first region 3 and the second region 4, or may be provided so as to separate the first region 3 and the second region 4 in such a manner that a certain amount of gap is left between the shielding member 7 and the wiring board 2 without being in complete contact with the film 8.

[0022] In the shielding member 7, the first conductor 71, the second conductor 72, and the dielectric 73 form a capacitor 70. In the following description, when explaining the function of the capacitor in the shielding member 7, the shielding member 7 will be referred to as the capacitor 70.

[0023] When the shielding member 7 is used as a capacitor 70, the first conductor 71 serves as a first electrode, the second conductor 72 serves as a second electrode, and charge can be stored in the dielectric 73. With this configuration, the shielding member 7 includes the function of the capacitor 70.

[0024] A first sealing material 30 is filled in the first region 3. A second sealing material 40 is filled in the second region 4. The first sealing material 30 and the second sealing material 40 are made of the same type of resin. However, the first sealing material 30 and the second sealing material 40 may be made of different types of resin.

[0025] In the module 1, a film 8 is provided so as to cover the wiring substrate 2, the first region 3, the first sealing material 30, the second region 4, the second sealing material 40, and the shielding member 7. The film 8 is made of, for example, a metal that blocks electromagnetic waves.

[0026] The first resin used for the dielectric 73 in the shielding member 7 has properties different from those of the second resin used for the first sealing material 30 and the second sealing material 40. For example, the first resin has higher heat dissipation properties than the second resin. The first resin may have a higher dielectric constant than the second resin. The first resin may have higher heat dissipation properties and a higher dielectric constant than the second resin.

[0027] The first resin used for the dielectric 73 and the second resin used for the first sealing material 30 and the second sealing material 40 may have the same properties.

[0028] (Specific Configuration of Shielding Member 7) Fig. 2 is an enlarged cross-sectional view of the shielding member 7 according to the first embodiment. Fig. 2 shows an enlarged cross-sectional view of the shielding member 7 shown in Fig. 1. Fig. 3 is a side view of the shielding member 7 of Fig. 2 as viewed from the first conductor 71 side.

[0029] 2 and 3, the first conductor 71 and the second conductor 72 have different heights. In this case, the height refers to the vertical distance on the upper surface side of the wiring substrate 2. In an example shown in FIGS. 2 and 3, the height of the dielectric 73 is the same as the height of the second conductor 72.

[0030] 2 and 3, the first conductor 71 and the second conductor 72 are different in size. For example, the sizes of the surfaces of the opposing sides of the first conductor 71 and the second conductor 72 are different. Specifically, an example in which the height of the first conductor 71 is different from the height of the second conductor 72 is shown in FIGS. 2 and 3. The height in this case refers to the vertical distance on the upper surface side of the wiring substrate 2.

[0031] The sizes of the first conductor 71 and the second conductor 72 may differ depending on the capacitance of the capacitor 70 formed by the shielding member 7. Therefore, the height of the first conductor 71 and the height of the second conductor 72 may differ depending on the capacitance set for the capacitor 70 formed by the shielding member 7.

[0032] 2 and 3 show an example in which the size of the dielectric 73 is the same as the height of the second conductor 72. Specifically, an example in which the size of the dielectric 73 is the same as the height of the second conductor 72 is shown in FIGS.

[0033] The size of the dielectric 73 may vary depending on the capacitance of the capacitor 70 formed by the shield member 7. Therefore, the height and thickness of the dielectric 73 may vary depending on the capacitance set for the capacitor 70 formed by the shield member 7.

[0034] (Circuit Example Using Capacitor 70) FIG. 4 is a circuit diagram showing an example in which the shield member 7 is used as a capacitor 70 in the module 1 according to the first embodiment.

[0035] 4 shows an example in which the shield member 7 is used as a capacitor 70 in a low-pass filter 511, which is a circuit connected to the antenna switch IC 51. The antenna switch IC 51 is configured as an integrated circuit. The antenna switch IC 51 includes a common terminal 80 and a plurality of selection terminals (three in the illustrated example), namely, a first selection terminal 81, a second selection terminal 82, and a third selection terminal 83. The antenna switch IC 51 is also called an antenna switch integrated circuit.

[0036] The common terminal 80 is connected to the antenna 10. The antenna 10 transmits and receives radio waves. The first selection terminal 81 is connected to the first signal processing circuit 41. The second selection terminal 82 is connected to the second signal processing circuit 42. The third selection terminal 83 is connected to the third signal processing circuit 43.

[0037] Fig. 4 shows a specific configuration of the second signal processing circuit 42. Fig. 4 omits the specific configurations of the first signal processing circuit 41 and the second signal processing circuit 42.

[0038] The antenna switch IC 51 electrically connects the common terminal 80 to one of the first selection terminal 81, the second selection terminal 82, and the third selection terminal 83. When the common terminal 80 and the second selection terminal 82 are connected in the antenna switch IC 51, the received signal supplied from the antenna 10 to the antenna switch IC 51 is input to the second signal processing circuit 42.

[0039] 4, the second signal processing circuit 42 is a circuit in which a low-pass filter 511 is provided between the second selection terminal 82 and the output terminal 84. As shown in Fig. 5, the low-pass filter 511 is a filter for removing unnecessary high-frequency components from the signal input from the second selection terminal 82. The signal that has passed through the low-pass filter 511 is output from the output terminal 84.

[0040] Fig. 5 is a circuit diagram showing the configuration of the low-pass filter 511 shown in Fig. 4. The low-pass filter 511 includes an inductor L1 and a capacitor 70. The inductor L1 is connected between the second selection terminal 82 and the output terminal 84. The capacitor 70 is connected between the signal path between the output side of the inductor L1 and the output terminal 84 and the ground electrode 60. The capacitor 70 is formed by the shield member 7 as shown in Figs. 1 and 2.

[0041] (Example of arrangement of electronic components in module 1) Fig. 6 is a plan view showing an example of arrangement of electronic components in module 1 according to embodiment 1. Fig. 6 shows a plan view of wiring board 2 and other electronic components in module 1 with the upper portion of film body 8 broken away.

[0042] In the module 1, an antenna switch IC 51, an inductor L1, and other components 501 and 502 are arranged as a first electronic component 5 in a first region 3. In the module 1, a second electronic component 6 is arranged in a second region 4.

[0043] 1 is filled in the first region 3. A second sealing material 40 as shown in FIG.

[0044] The shielding member 7 is provided to separate the first region 3 and the second region 4. The shielding member 7 includes a first conductor 71, a second conductor 72, and a dielectric 73 as shown in FIGS.

[0045] The inductor L1 and the capacitor 70 shown in Fig. 6 are connected as shown in Fig. 5 to form the low-pass filter 511 shown in Fig. 4. The low-pass filter 511 including the inductor L1 and the capacitor 70 is connected to the antenna switch IC 51 to form the circuit shown in Fig. 4.

[0046] In the first embodiment, an example has been shown in which the area inside the module 1 is divided by the shielding member 7 into two areas, the first area 3 and the second area 4. However, this is not limiting, and the area inside the module 1 may be divided into three or more areas by the shielding member 7. For example, the area inside the module 1 may be divided into three or more areas by multiple shielding members 7.

[0047] The first embodiment described above can achieve the following technical effects. In the module 1 of the first embodiment shown in FIGS. 1 to 6 , the shielding member 7 includes a first conductor 71 and a second conductor 72 arranged opposite the first conductor 71, constituting a capacitor 70 in which the first conductor 71 serves as a first electrode and the second conductor 72 serves as a second electrode. Therefore, the shielding member 7 also functions as the capacitor 70. As a result, in the module 1, the area in which the shielding member 7 is provided can be used as an area in which electronic components are provided. Therefore, in the module 1, it is possible to prevent the area in which the shielding member 7 is provided from narrowing the area in which electronic components are provided.

[0048] Furthermore, in module 1, by making the area where shielding member 7 is provided the area where electronic components are provided, it is possible to prevent the size of module 1 from increasing when adding new functions to the functions that module 1 already has.

[0049] For example, when a low-pass filter 511 as shown in FIG. 4 is added as a new function to the module 1, the area where the shielding member 7 is provided can be set to the area where electronic components such as the capacitor 70 are provided, thereby preventing the size of the module 1 from increasing.

[0050] Furthermore, in the module 1, by providing the shielding member 7 in the same area where electronic components are provided, it is possible to achieve a configuration in which components can be mounted at a higher density.

[0051] For example, when a low-pass filter 511 as shown in FIG. 4 is added as a new function to the module 1, the area where the shielding member 7 is provided can be set to the area where electronic components such as the capacitor 70 are provided, thereby preventing the size of the module 1 from increasing.

[0052] 2 and 3, the sizes of the opposing surfaces of the first conductor 71 and the second conductor 72 are different. By making the sizes of the first conductor 71 and the second conductor 72 different in this way, the shielding member 7 can obtain a capacitance that corresponds to the application of the capacitor 70.

[0053] As shown in FIGS. 1 and 2, the dielectric 73 made of resin is provided between the first conductor 71 and the second conductor 72, so that the shielding member 7 can store electric charge in the dielectric 73.

[0054] 1 and 2, the first resin constituting the dielectric 73 has properties different from those of the second resin such as the resin of the first sealing material 30 provided around the shielding member 7. This allows the shielding member 7 to use a dielectric 73 with properties suited to the original function of the shielding member 7 and the function of the shielding member 7 as a capacitor 70.

[0055] 1 and 2, the first resin constituting the dielectric 73 has higher heat dissipation properties than the second resin such as the resin of the first sealing material 30 provided around the shielding member 7. This allows the shielding member 7 to use the dielectric 73 that enhances the heat dissipation properties that are the original function of the shielding member 7.

[0056] 4 and 5 , the capacitor 70 formed by the shield member 7 is connected to the antenna switch IC 51 serving as the first electronic component 5. Specifically, the capacitor 70 formed by the shield member 7 is included in a low-pass filter 511, which is an electric circuit connected to the antenna switch IC 51. In this manner, the shield member 7 is connected to the antenna switch IC 51 as the capacitor 70, which is an additional function of the shield member 7. This allows the shield member 7 to be used as an electronic component in the module 1. Therefore, when a low-pass filter 511 such as that shown in FIG. 4 is added as a new function to the module 1, the area in which the shield member 7 is provided can be set to the area in which electronic components such as the capacitor 70 are provided, thereby preventing the size of the module 1 from increasing.

[0057] [Embodiment 2] (Configuration of Module 1A) In embodiment 2, a second example will be described in which the shielding member 7 is used as a capacitor 70. Embodiment 2 is another example in which the shielding member 7 is used as a capacitor 70 included in a low-pass filter.

[0058] FIG. 7 is a circuit diagram showing an example in which the shield member 7 is used as a capacitor 70 in the module 1A of the second embodiment.

[0059] 7 shows an example in which the shield member 7 is used as a capacitor 70 in a low-pass filter 512, which is a circuit connected to an RFIC (Radio Frequency Integrated Circuit) 52. The RFIC is also called a radio frequency integrated circuit.

[0060] The shielding member 7 in the second embodiment, like that in the first embodiment, includes a first conductor 71, a second conductor 72, and a dielectric 73 as shown in FIGS.

[0061] 7 , RFIC 52 is a semiconductor integrated circuit capable of processing signals in the radio frequency band. RFIC 52 includes an antenna switch 520, a first signal processing circuit 521, a second signal processing circuit 522, and a third signal processing circuit 523. Antenna switch 520 includes a common terminal 90 and a plurality of selection terminals (three in the illustrated example), namely, a first selection terminal 91, a second selection terminal 92, and a third selection terminal 93.

[0062] The common terminal 90 is connected to the antenna 10. The first selection terminal 91 is connected to the first signal processing circuit 521. The second selection terminal 92 is connected to the second signal processing circuit 522. The third selection terminal 93 is connected to the third signal processing circuit 523.

[0063] 7 shows a specific configuration of the second signal processing circuit 522. In FIG. 7, the specific configurations of the first signal processing circuit 521 and the third signal processing circuit 523 are omitted.

[0064] The antenna switch 520 electrically connects the common terminal 90 to any one of the first selection terminal 91 , the second selection terminal 92 , and the third selection terminal 93 .

[0065] 7 , the second signal processing circuit 522 includes a duplexer (DPX) 524 and a low-noise amplifier (LNA) 525. When the common terminal 90 and the second selection terminal 92 of the antenna switch 520 are connected, the received signal supplied from the antenna 10 to the antenna switch IC 51 is input to the second signal processing circuit 522.

[0066] 7 , the second signal processing circuit 522 includes a duplexer (DPX) 524 and a low-noise amplifier (LNA) 525. When the common terminal 90 and the second selection terminal 92 of the antenna switch 520 are connected, the received signal supplied from the antenna 10 to the antenna switch 520 is input to the second signal processing circuit 522.

[0067] The duplexer 524 uses a bandpass filter to demultiplex the received signal input to the second signal processing circuit 522. The low-noise amplifier 525 amplifies the received signal output from the duplexer 524 with low noise. The received signal output from the low-noise amplifier 525 is output to the outside of the second signal processing circuit 522 and further to the outside of the RFIC 52. Note that a duplexer such as the duplexer 524 may not be included in the second signal processing circuit 522. FIG. 7 shows one of the paths of the signals demultiplexed by the duplexer 524 in the second signal processing circuit 522. FIG. 7 does not show the other path of the signals demultiplexed by the duplexer 524 in the second signal processing circuit 522.

[0068] The low-pass filter 512 is a filter for removing unnecessary high-frequency components from the signal output from the second signal processing circuit 522 of the RFIC 52. The signal that has passed through the low-pass filter 512 is output from the output terminal 94.

[0069] 5, and includes an inductor L1 and a capacitor 70. The capacitor 70 is formed by the shield member 7 as shown in FIGS.

[0070] (Example of arrangement of electronic components in module 1A) Fig. 8 is a plan view showing an example of arrangement of electronic components in module 1A according to embodiment 2. Fig. 8 shows a plan view of wiring board 2 and other electronic components in module 1A with the upper portion of film body 8 shown in Fig. 1 broken away.

[0071] In the module 1A, an RFIC 52, an inductor L1, and other components 501 and 502 are arranged as the first electronic component 5 in the first region 3. In the module 1A, a second electronic component 6 is arranged in the second region 4. In the case of the module 1A, the inductor L1 and the capacitor 70 are used as a low-pass filter 512.

[0072] The sealing state of the first sealing material 30 and the sealing state of the second sealing material 40 in the module 1A are the same as those in the example of the module 1 shown in Fig. 6. The arrangement of the shielding member 7 in the module 1A is the same as those in the example of the module 1 shown in Fig. 6.

[0073] 8 is connected to the capacitor 70 as shown in Fig. 5, thereby forming a low-pass filter 512 similar to the low-pass filter 511 shown in Fig. 5. The low-pass filter 512 including the inductor L1 and the capacitor 70 is connected to the RFIC 52, thereby forming the circuit shown in Fig. 7.

[0074] 7 and 8 , the module 1A of the second embodiment includes a shielding member 7 that includes a first conductor 71 and a second conductor 72 that is disposed opposite the first conductor 71, and constitutes a capacitor 70 in which the first conductor 71 serves as a first electrode and the second conductor 72 serves as a second electrode. This allows the shielding member 7 to also function as the capacitor 70. As a result, in the module 1A, the area in which the shielding member 7 is provided can be used as an area in which electronic components are provided. Therefore, in the module 1A, the area in which the shielding member 7 is provided can be prevented from narrowing the area in which electronic components are provided.

[0075] As shown in FIG. 7 , the capacitor 70 formed by the shield member 7 is connected to the RFIC 52 serving as the first electronic component 5. Specifically, the capacitor 70 formed by the shield member 7 is included in a low-pass filter 512, which is an electric circuit connected to the RFIC 52. In this manner, the shield member 7 is connected to the RFIC 52 as the capacitor 70, which is an additional function of the shield member 7. This allows the shield member 7 to be used as an electronic component in the module 1A. Therefore, when a low-pass filter 512 such as that shown in FIG. 7 is added as a new function to the module 1A, the region in which the shield member 7 is provided is set to the region in which an electronic component such as the capacitor 70 is provided, thereby preventing the size of the module 1A from increasing.

[0076] In the second embodiment, an example is shown in which the shielding member 7 is used as the capacitor 70 in the low-pass filter 512 connected to the RFIC 52. However, the present invention is not limited to this example. Instead of the RFIC 52, the shielding member 7 may be used as the capacitor 70 in a low-pass filter connected to a high-frequency module including a low-noise amplifier.

[0077] [Embodiment 3] (Configuration of Module 1B) In embodiment 3, a third example will be described in which shield member 7 is used as capacitor 70. Embodiment 3 is another example in which shield member 7 is used as capacitor 70 included in a low-pass filter.

[0078] FIG. 9 is a circuit diagram showing an example in which the shielding member 7 is used as a capacitor 70 in the module 1B of the third embodiment.

[0079] 9 shows an example in which the shield member 7 is used as a capacitor 70 in a low-pass filter 513, which is a circuit provided in a signal path between an RFIC 53 and a BBIC (Base Band Integrated Circuit) 54. The BBIC 54 is also called a base band integrated circuit.

[0080] Similar to the first embodiment, the shielding member 7 in the third embodiment includes a first conductor 71, a second conductor 72, and a dielectric 73 as shown in FIGS. 1 to 3, and constitutes a capacitor 70.

[0081] 9, an RFIC 53 is a semiconductor integrated circuit capable of processing signals in the radio frequency band, and a BBIC 54 is a semiconductor integrated circuit capable of processing signals in the baseband frequency band.

[0082] The signal path provided between the BBIC 54 and the RFIC 53 includes a transmission signal path 31, a reception signal path 32, and a control signal path 33. The transmission signal path 31 is a signal path for transmitting a transmission signal Tx from the BBIC 54 to the RFIC 53. The reception signal path 32 is a signal path for transmitting a reception signal Rx from the RFIC 53 to the BBIC 54. The control signal path 33 is a signal path for transmitting a control signal from the BBIC 54 to the RFIC 53. A low-pass filter 513 is provided in the control signal path 33.

[0083] An intermediate frequency transmission signal Tx is transmitted from the BBIC 54 to the RFIC 53 via a transmission signal path 31. The RFIC 53 up-converts the transmission signal Tx to a high frequency signal and supplies it to the antenna 10.

[0084] The RFIC 53 down-converts the high-frequency received signal supplied from the antenna 10. Then, the RFIC 53 transmits the down-converted received signal Rx to the BBIC 54 via the received signal path 32.

[0085] The BBIC 54 transmits a control signal for controlling the RFIC 53 via the control signal path 33. The control signal transmitted via the control signal path 33 is subjected to signal processing by the low-pass filter 513, whereby unnecessary high-frequency components are removed.

[0086] (Circuit Example Using Capacitor 70) Fig. 10 is a circuit diagram showing the configuration of low-pass filter 513 shown in Fig. 9. Low-pass filter 513 includes two inductors L2 and L3 and two capacitors C1 and C70.

[0087] The inductors L2 and L3 are connected in series between an output terminal 85 of the BBIC 54 and an input terminal 86 of the RFIC 53. The capacitor C1 is connected between the signal path between the inductors L2 and L3 and the ground electrode 60. The capacitor 70 is connected between the signal path between the inductor L3 and the input terminal 86 of the RFIC 53 and the ground electrode 60. The capacitor 70 is formed by the shield member 7 as shown in FIGS. 1 and 2 .

[0088] In addition, the low-pass filter 513 configured with two inductors L2, L3 and two capacitors C1, 70 as shown in Figure 10 may also be a low-pass filter configured with three or more inductors and three or more capacitors.

[0089] 10 may be a low-pass filter configured with one inductor L1 and one capacitor 70 as shown in Fig. 5. Also, the low-pass filters 511 and 512 shown in Fig. 5 may be low-pass filters configured with multiple inductors and multiple capacitors as shown in Fig. 10.

[0090] (Example of arrangement of electronic components in module 1B) Fig. 11 is a plan view showing an example of arrangement of electronic components in module 1B according to embodiment 3. Fig. 11 shows a plan view of wiring board 2 and other electronic components in module 1B with the upper portion of film body 8 shown in Fig. 1 broken away.

[0091] In module 1B, an RFIC 53, a BBIC 54, inductors L2 and L3, a capacitor C1, and other components 503 and 504 are arranged as first electronic components 5 in a first region 3. In module 1B, a second electronic component 6 is arranged in a second region 4. In the case of module 1B, inductors L2 and L3, capacitor C1, and capacitor 70 are used as a low-pass filter 513.

[0092] The sealing state of the first sealing material 30 and the sealing state of the second sealing material 40 in module 1B are the same as those in the example of module 1 shown in Fig. 6. The arrangement of the shielding member 7 in module 1B is the same as that in the example of module 1 shown in Fig. 6.

[0093] The inductors L2 and L3 and the capacitors C1 and 70 shown in Fig. 11 are connected as shown in Fig. 10 to form the low-pass filter 513 shown in Fig. 10. The low-pass filter 513 including the inductors L2 and L3 and the capacitors C1 and 70 is connected to the RFIC 53 and the BBIC 54 to form the circuit shown in Fig. 9.

[0094] In the third embodiment, the low-pass filter 513 connected to the RFIC 53 and the BBIC 54 has been described as an example of a low-pass filter including the capacitor 70 formed by the shield member 7. However, the present invention is not limited to this, and the low-pass filter 513 including the capacitor 70 formed by the shield member 7 may be connected to another integrated circuit such as the antenna switch IC 51.

[0095] 9 to 11 , in module 1B of embodiment 3, shielding member 7 includes first conductor 71 and second conductor 72 arranged opposite first conductor 71, constituting capacitor 70 in which first conductor 71 serves as a first electrode and second conductor 72 serves as a second electrode, so that shielding member 7 also functions as capacitor 70. As a result, in module 1B, the area in which shielding member 7 is provided can be used as an area in which electronic components are provided. Therefore, in module 1B, shielding member 7 can be prevented from narrowing the area in which electronic components are provided.

[0096] 9 and 10 , the capacitor 70 formed by the shield member 7 is connected to the RFIC 53 and the BBIC 54, which are the first electronic components 5. Specifically, the capacitor 70 formed by the shield member 7 is included in a low-pass filter 513, which is an electric circuit connected to the RFIC 53 and the BBIC 54. In this manner, the shield member 7 is connected to the RFIC 53 and the BBIC 54 as the capacitor 70, which is an additional function of the shield member 7. This allows the shield member 7 to be used as an electronic component in the module 1B. Therefore, when a low-pass filter 513 such as that shown in FIGS. 9 and 10 is added as a new function to the module 1B, the region in which the shield member 7 is provided can be set to the region in which electronic components such as the capacitor 70 are provided, thereby preventing the size of the module 1B from increasing.

[0097] [Fourth Embodiment] (Configuration of Module 1C) In the fourth embodiment, a fourth example will be described in which the shielding member 7 is used as the capacitor 70. The fourth embodiment is an example in which the shielding member 7 is used as the capacitor 70 included in a high-pass filter.

[0098] FIG. 12 is a circuit diagram showing an example in which the shielding member 7 is used as a capacitor 70 in the module 1C of the fourth embodiment.

[0099] FIG. 12 shows an example in which the shield member 7 is used as a capacitor 70 in a high-pass filter 514 that is a circuit provided in the signal path between the RFIC 53 and the BBIC 54 .

[0100] The antenna 10, RFIC 53, BBIC 54, transmission signal path 31, and reception signal path 32 shown in FIG. 12 are similar to those shown in FIG.

[0101] The shielding member 7 in the fourth embodiment, like that in the first embodiment, includes a first conductor 71, a second conductor 72, and a dielectric 73 as shown in FIGS.

[0102] The transmission signal path 31 is provided with a circuit of a high-pass filter 514. The reception signal path 32 is provided with a circuit of a high-pass filter 515. The signal transmitted through the transmission signal path 31 is subjected to signal processing by the high-pass filter 514, whereby unnecessary low-frequency components are removed.

[0103] The signal transmitted through the receiving signal path 32 is subjected to signal processing by the high-pass filter 515, whereby unnecessary low-frequency components are removed.

[0104] (Circuit Example Using Capacitor 70) Fig. 13 is a circuit diagram showing the configuration of high-pass filter 514 shown in Fig. 12. High-pass filter 514 includes two inductors L4 and L5 and two capacitors 70 and C2.

[0105] The capacitor 70 and the capacitor C2 are connected in series between the output terminal 87 of the BBIC 54 and the input terminal 88 of the RFIC 53. The inductor L4 is connected between the signal path between the capacitor 70 and the capacitor C2 and the ground electrode 60. The inductor L5 is connected between the signal path between the capacitor C2 and the input terminal 88 of the RFIC 53 and the ground electrode 60. The capacitor 70 is formed by the shield member 7 as shown in FIGS. 1 and 2 .

[0106] The high-pass filter 514 configured with two capacitors 70, C2 and two inductors L4, L5 as shown in FIG. 13 may be replaced with a high-pass filter configured with three or more capacitors and three or more inductors.

[0107] Moreover, the high-pass filter 514 shown in FIG. 13 may be a high-pass filter configured by one capacitor 70 and one inductor L4.

[0108] 13 may have a configuration in which the capacitor 70 is not provided at the position shown in Fig. 13 but is connected between the inductor L5 and the ground electrode 60. In that case, only the capacitor C2 is connected between the output terminal 87 of the BBIC 54 and the input terminal 88 of the RFIC 53 at the position shown in Fig. 13.

[0109] (Example of arrangement of electronic components in module 1C) Fig. 14 is a plan view showing an example of arrangement of electronic components in module 1C according to embodiment 4. Fig. 14 shows a plan view of wiring board 2 and other electronic components in module 1C with the upper portion of film body 8 shown in Fig. 1 broken away.

[0110] In module 1C, an RFIC 53, a BBIC 54, inductors L4 and L5, a capacitor C2, a high-pass filter 515, and other components 505 are arranged as first electronic components 5 in the first region 3. In module 1C, a second electronic component 6 is arranged in the second region 4. In the case of module 1C, inductors L4 and L5, a capacitor C2, and a capacitor 70 are used as a high-pass filter 514.

[0111] The sealing state of the first sealing material 30 and the sealing state of the second sealing material 40 in the module 1C are the same as those in the example of the module 1 shown in Fig. 6. The arrangement of the shielding member 7 in the module 1C is the same as those in the example of the module 1 shown in Fig. 6.

[0112] The inductors L4 and L5 and the capacitors C2 and 70 shown in Fig. 14 are connected as shown in Fig. 13 to form the high-pass filter 514 shown in Fig. 13. The high-pass filter 515 including the inductors L4 and L5 and the capacitors C2 and 70 is connected to the RFIC 53 and the BBIC 54 to form the circuit shown in Fig. 12.

[0113] In the fourth embodiment, the high-pass filter 514 connected to the RFIC 53 and the BBIC 54 has been described as an example of a high-pass filter including the capacitor 70 configured by the shielding member 7. However, the present invention is not limited to this, and the high-pass filter including the capacitor 70 configured by the RFIC 53 and the shielding member 7 may be connected to other integrated circuits such as the antenna switch IC 51 and the RFIC 52.

[0114] 12 to 14 , in module 1C of embodiment 4, shielding member 7 includes first conductor 71 and second conductor 72 arranged opposite first conductor 71, constituting capacitor 70 in which first conductor 71 serves as a first electrode and second conductor 72 serves as a second electrode, so that shielding member 7 also functions as capacitor 70. As a result, in module 1C, the area in which shielding member 7 is provided can be used as the area in which electronic components are provided. Therefore, in module 1C, it is possible to prevent the area in which shielding member 7 is provided from narrowing the area in which electronic components are provided.

[0115] 12 and 13 , the capacitor 70 formed by the shield member 7 is connected to the RFIC 53 and the BBIC 54, which are the first electronic components 5. Specifically, the capacitor 70 formed by the shield member 7 is included in the high-pass filter 514, which is an electric circuit connected to the RFIC 53 and the BBIC 54. In this manner, the shield member 7 is connected to the RFIC 53 and the BBIC 54 as the capacitor 70, which is an additional function of the shield member 7. This allows the shield member 7 to be used as an electronic component in the module 1C. Therefore, when a high-pass filter 514 such as that shown in FIGS. 12 and 13 is added as a new function to the module 1C, the region in which the shield member 7 is provided can be the region in which electronic components such as the capacitor 70 are provided, thereby preventing the size of the module 1C from increasing.

[0116] Fifth Embodiment (Configuration of Module 1D) In ​​the fifth embodiment, a fifth example will be described in which the shielding member 7 is used as a capacitor 70. The fifth embodiment is an example in which the shielding member 7 is used as a capacitor 70 included in a bypass capacitor.

[0117] FIG. 15 is a circuit diagram showing an example in which the shield member 7 is used as a capacitor 70 in the module 1D of the fifth embodiment.

[0118] FIG. 15 shows an example in which the shield member 7 is used as a capacitor 70 in a bypass capacitor 516 which is a circuit provided in the voltage output path 34 of the power supply IC 55 .

[0119] The shielding member 7 in the fifth embodiment, like that in the first embodiment, includes a first conductor 71, a second conductor 72, and a dielectric 73 as shown in FIGS.

[0120] The power supply IC 55 is a semiconductor integrated circuit that supplies power to various electronic components such as the RFIC 52 in Fig. 7, the RFIC 53 in Fig. 9, and the BBIC 54 in Fig. 9. The power supply IC 55 is also called a power supply integrated circuit.

[0121] A bypass capacitor 516 is provided in the voltage output path 34 between the voltage output terminal 89 of the power supply IC 55 and the voltage supply terminal 95 for supplying voltage to an electronic component to which power is supplied. The bypass capacitor 516 removes noise on the voltage output path 34 and stabilizes the output voltage.

[0122] (Example of a circuit using the capacitor 70) Fig. 16 is a circuit diagram showing the configuration of the bypass capacitor 516 shown in Fig. 15. The bypass capacitor 516 includes three capacitors 70, C3, and C4.

[0123] The capacitors 70, C3, and C4 are connected in parallel between the voltage output path 34 and the ground electrode 60. In order from the closest to the voltage output terminal 89, the capacitors 70, C3, and C4 are connected to the voltage output path 34.

[0124] The capacitances of capacitors 70, C3, and C4 have the following relationship: capacitor 70 < capacitor C3 < capacitor C4. Capacitor C4 is provided to stabilize the power supply voltage. Capacitors 70 and C3 are provided to remove noise. Capacitor 70 is provided to remove noise with a higher frequency than capacitor C3. Capacitor 70 is formed by a shield member 7 as shown in FIGS. 1 and 2.

[0125] (Example of arrangement of electronic components in module 1D) Fig. 17 is a plan view showing an example of arrangement of electronic components in module 1D according to embodiment 5. Fig. 17 shows a plan view of wiring board 2 and other electronic components in module 1D with the upper portion of film body 8 shown in Fig. 1 broken away.

[0126] In module 1D, a power supply IC 55, capacitors C3 and C4, and other components 507 are arranged as first electronic components 5 in the first region 3. In module 1D, a second electronic component 6 is arranged in the second region 4. In the case of module 1D, capacitors C3 and C4 and capacitor 70 are used as bypass capacitors 516.

[0127] The sealing state of the first sealing material 30 and the sealing state of the second sealing material 40 in the module 1D are the same as those in the example of the module 1 shown in Fig. 6. The arrangement of the shielding member 7 in the module 1D is the same as those in the example of the module 1 shown in Fig. 6.

[0128] The bypass capacitor 516 shown in Fig. 16 is configured by connecting the capacitors C3, C4, and the capacitor 70 shown in Fig. 17 as shown in Fig. 16. The bypass capacitor 516 including the capacitors C3, C4, and the capacitor 70 is provided on the voltage output path 34, thereby configuring the circuit shown in Fig. 15.

[0129] In the fifth embodiment, an example has been shown in which the bypass capacitor 516 is configured with three capacitors C3, C4, and 70 including the capacitor 70. However, the present invention is not limited to this, and the bypass capacitor 516 may be configured with two capacitors including the capacitor 70, or may be configured with four or more capacitors including the capacitor 70. In other words, when the bypass capacitor 516 is configured with a plurality of capacitors, the number of capacitors is not limited to three.

[0130] In the fifth embodiment, the bypass capacitor 516 is configured by a plurality of capacitors C3, C4, and 70 including the capacitor 70. However, the present invention is not limited to this, and the bypass capacitor 516 may be configured by the capacitor 70 alone.

[0131] In the fifth embodiment, the bypass capacitor 516 is provided in the voltage output path of the power supply IC 55. However, the present invention is not limited to this, and the bypass capacitor 516 may be provided in the voltage output path of other integrated circuits, such as the antenna switch IC 51, the RFIC 52, the RFIC 53, and the BBIC 54, as long as the integrated circuits output voltage.

[0132] 15 to 17 , in module 1D of embodiment 5, shielding member 7 includes first conductor 71 and second conductor 72 arranged opposite first conductor 71, constituting capacitor 70 in which first conductor 71 serves as a first electrode and second conductor 72 serves as a second electrode, so that shielding member 7 also functions as capacitor 70. As a result, in module 1D, the area in which shielding member 7 is provided can be used as the area in which electronic components are provided. Therefore, in module 1D, it is possible to prevent the area in which shielding member 7 is provided from narrowing the area in which electronic components are provided.

[0133] 15 and 16 , the capacitor 70 formed by the shield member 7 is connected to the power supply IC 55 as the first electronic component 5. Specifically, the capacitor 70 formed by the shield member 7 is included in a bypass capacitor 516, which is an electric circuit connected to the power supply IC 55. In this manner, the shield member 7 is connected to the power supply IC 55 as the capacitor 70, which is an additional function of the shield member 7. This allows the shield member 7 to be used as an electronic component in the module 1D. Therefore, when a bypass capacitor 516 as shown in FIGS. 15 and 16 is added as a new function to the module 1D, the area in which the shield member 7 is provided can be set to the area in which an electronic component such as the capacitor 70 is provided, thereby preventing the size of the module 1D from increasing.

[0134] [Other Modifications] Next, other modifications of the embodiments of the present disclosure will be described.

[0135] (1) In the first to fifth embodiments, the first conductors 71 and the second conductors 72 included in the shielding member 7 are different in size. However, this is not limiting, and the first conductors 71 and the second conductors 72 included in the shielding member 7 may be the same in size.

[0136] (2) In the third embodiment, an example has been shown in which the capacitor 70 formed by the shield member 7 is used as the capacitor of the low-pass filter 513 provided in the control signal path 33 between the BBIC 54 and the RFIC 53. However, this is not limiting, and the capacitor 70 formed by the shield member 7 may be used as the capacitor of the low-pass filter when a low-pass filter is provided in the transmission signal path 31 between the BBIC 54 and the RFIC 53. Furthermore, the capacitor 70 formed by the shield member 7 may be used as the capacitor of the low-pass filter when a low-pass filter is provided in the reception signal path 32 between the BBIC 54 and the RFIC 53.

[0137] (3) In the fourth embodiment, an example was shown in which the capacitor 70 formed by the shield member 7 is used in the high-pass filter 514 provided in the transmission signal path 31. However, this is not limiting, and the capacitor 70 formed by the shield member 7 may also be used in the high-pass filter 515 provided in the reception signal path 32.

[0138] (4) A plurality of shielding members 7 may be provided in a module such as module 1 in which electronic components are provided. In this case, each shielding member 7 may constitute an individual capacitor. In this case, the capacitor formed by each shielding member 7 may be used as a capacitor for an individual circuit.

[0139] [Additional Notes] Next, features of the embodiments of the present disclosure will be summarized.

[0140] <1> A module (modules 1, 1A, 1B, 1C, and 1D) comprising: a wiring board (wiring board 2); a first electronic component (first electronic component 5) provided in a first region (first region 3) on the wiring board; a second electronic component (second electronic component 6) provided in a second region (second region 4) on the wiring board (wiring board 2); and a shielding member (shielding member 7) separating the first region (first region 3) and the second region (second region 4) on the wiring board (wiring board 2), wherein the shielding member (shielding member 7) includes a first conductor (first conductor 71) and a second conductor (second conductor 72) arranged opposite the first conductor (first conductor 71), constituting a capacitor (capacitor 70) in which the first conductor (first conductor 71) serves as a first electrode and the second conductor (second conductor 72) serves as a second electrode.

[0141] <2> A module (modules 1, 1A, 1B, 1C, 1D) described in <1>, in which the first conductor (first conductor 71) and the second conductor (second conductor 72) have different sizes of the surfaces on the opposing sides.

[0142] <3> The module (module 1, 1A, 1B, 1C, 1D) described in <1> or <2> further includes a dielectric (dielectric 73) provided between the first conductor (first conductor 71) and the second conductor (second conductor 72), and the dielectric (dielectric 73) is a first resin (resin of the dielectric 73).

[0143] <4> The module (modules 1, 1A, 1B, 1C, and 1D) described in <3> further includes a second resin (resin of the first sealing material 30) provided around the shielding member (shielding member 7), and the first resin (resin of the dielectric 73) has properties different from those of the second resin (resin of the first sealing material 30).

[0144] <5> A module (module 1, 1A, 1B, 1C, 1D) described in <4>, wherein the first resin (resin of the dielectric 73) has higher heat dissipation properties than the second resin (resin of the first sealing material 30).

[0145] <6> A module (modules 1, 1A, 1B, 1C, 1D) described in <4>, wherein the first resin (resin of the dielectric 73) has a higher dielectric constant than the second resin (resin of the first sealing material 30).

[0146] <7> The module (module 1, 1A, 1B, 1C, 1D) described in <1> or <2>, wherein the capacitor (capacitor 70) formed by the shielding member (shielding member 7) is connected to the first electronic component (first electronic component 5).

[0147] <8> The module (module 1, 1A, 1B, 1C, 1D) according to any one of <1> to <7>, further comprising an electric circuit (low-pass filters 511, 512, 513, a high-pass filter 514, a bypass capacitor 516) connected to the first electronic component (first electronic component 5), wherein the capacitor (capacitor 70) formed by the shielding member (shielding member 7) is included in the electric circuit (low-pass filters 511, 512, 513, the high-pass filter 514, and the bypass capacitor 516).

[0148] <9> The module (module 1, 1A, 1B) described in <8>, wherein the first electronic component (first electronic component 5) is an integrated circuit (antenna switch IC 51, RFIC 52, RFIC 53, BBIC 54, power supply IC 55), and the electric circuit (low-pass filters 511, 512, 513, high-pass filter 514, bypass capacitor 516) is a low-pass (low-pass filters 511, 512, 513).

[0149] <10> The module (module 1C) described in <8>, wherein the first electronic component (first electronic component 5) is an integrated circuit (RFIC 53, BBIC 54), and the electrical circuit is a high-pass filter (high-pass filter 514).

[0150] <11> The module (module 1D) described in <8>, wherein the first electronic component (first electronic component 5) is an integrated circuit (power supply IC 55), and the electrical circuit is a bypass capacitor (bypass capacitor 516).

[0151] <12> The module (module 1A) described in <8>, wherein the first electronic component (first electronic component 5) includes a low-noise amplifier (low-noise amplifier 525), and the electrical circuit is a low-pass filter (low-pass filter 512).

[0152] <13> The module (module 1) described in <9>, wherein the integrated circuit is an antenna switch integrated circuit (antenna switch IC51).

[0153] <14> The module (module 1A) described in <9>, wherein the integrated circuit is a radio frequency integrated circuit (RFIC 52).

[0154] <15> The module (module 1B) described in <9>, wherein the integrated circuits are a radio frequency integrated circuit (RFIC 53) and a baseband integrated circuit (BBIC 54).

[0155] <16> The module (module 1B) described in <10>, wherein the integrated circuits are a radio frequency integrated circuit (RFIC 53) and a baseband integrated circuit (BBIC 54).

[0156] <17> The module (module 1B) according to <10>, wherein the integrated circuit is a power supply integrated circuit (power supply IC55).

[0157] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not by the description of the above embodiments, and is intended to include all modifications within the meaning and scope of the claims.

[0158] 2 wiring board, 3 first region, 5 first electronic component, 4 second region, 6 second electronic component, 7 shielding member, 71 first conductor, 72 second conductor, 70 capacitor, 1, 1A, 1B, 1C, 1D module, 73 dielectric, 30 first sealing material, 511, 512, 513 low pass filter, 514 high pass filter, 516 bypass capacitor, 51 antenna switch IC, 52 RFIC, 53 RFIC, 54 BBIC, 55 power supply IC, 525 low noise amplifier.

Claims

1. A module comprising: a wiring board; a first electronic component provided in a first region on the wiring board; a second electronic component provided in a second region on the wiring board; and a shielding member separating the first region and the second region on the wiring board, wherein the shielding member includes a first conductor and a second conductor arranged opposite the first conductor, constituting a capacitor in which the first conductor is a first electrode and the second conductor is a second electrode.

2. The module according to claim 1, wherein the first conductor and the second conductor have opposing surfaces with different sizes.

3. The module according to claim 1 or 2, further comprising a dielectric provided between the first conductor and the second conductor, the dielectric being a first resin.

4. The module according to claim 3, further comprising a second resin provided around the shielding member, wherein the first resin has properties different from those of the second resin.

5. The module according to claim 4, wherein the first resin has higher heat dissipation properties than the second resin.

6. The module according to claim 4, wherein the first resin has a higher dielectric constant than the second resin.

7. The module according to claim 1 or 2, wherein the capacitor formed by the shielding member is connected to the first electronic component.

8. The module according to any one of claims 1 to 7, further comprising an electric circuit connected to the first electronic component, wherein the capacitor constituted by the shielding member is included in the electric circuit.

9. The module according to claim 8, wherein the first electronic component is an integrated circuit, and the electric circuit is a low-pass filter.

10. The module of claim 8, wherein the first electronic component is an integrated circuit, and the electrical circuit is a high-pass filter.

11. The module of claim 8, wherein the first electronic component is an integrated circuit, and the electrical circuit is a bypass capacitor.

12. The module of claim 8, wherein the first electronic component includes a low-noise amplifier, and the electrical circuit is a low-pass filter.

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