Light detection device and electronic apparatus

Abstract

The present technology pertains to a light detection device and an electronic apparatus making it possible to reduce the occurrence of flaring and ghosting. The present invention comprises: a photoelectric conversion unit; light condensing units that condense light onto the photoelectric conversion unit; pixels having the light condensing units; and a pixel array unit in which the pixels are arranged in a matrix. The light condensing units have a shape in which axes of different lengths can be set, and the axes of adjacent light condensing units are set in different directions. The present invention can be applied to light detection devices that detect light.

Description

Photodetectors, electronic devices

[0001] The present technology relates to a photodetector and an electronic device, and more particularly to a photodetector and an electronic device that are capable of capturing images while suppressing the occurrence of flare and ghosting, for example.

[0002] In recent years, there has been a demand for digital video cameras and digital still cameras that offer high resolution to capture the finest details of a subject, while also being more compact for portability. Furthermore, development of imaging devices has been underway to reduce pixel size while maintaining imaging characteristics.

[0003] In addition to the ongoing demand for higher resolution and smaller size, there is also an increasing demand for improved minimum subject illumination and high-speed imaging, and to achieve these, expectations are rising for imaging devices to improve overall image quality, including the S / N ratio. Patent Document 1 proposes improving image quality by forming a light-shielding film formed on the pixel boundaries of the light-receiving surface via an insulating layer, thereby reducing optical color mixing and flare.

[0004] JP 2010-186818 A

[0005] As described above, conventionally, measures have been taken to suppress the occurrence of flare, ghosts, and the like, but the suppression effect is not sufficient, and there is a demand for measures with even greater suppression effect.

[0006] The present technology has been made in consideration of such circumstances, and is intended to make it possible to suppress the occurrence of flare and ghosts.

[0007] A photodetector according to one aspect of the present technology includes a photoelectric conversion unit, a light-collecting unit that collects light onto the photoelectric conversion unit, a pixel having the light-collecting unit, and a pixel array unit in which the pixels are arranged in a matrix, wherein the light-collecting unit has a shape that allows axes of different lengths to be set, and adjacent light-collecting units have their axes positioned in different directions.

[0008] An electronic device according to one aspect of the present technology includes a photoelectric conversion unit, a light collecting unit that collects light onto the photoelectric conversion unit, a pixel having the light collecting unit, and a pixel array unit in which the pixels are arranged in a matrix, wherein the light collecting unit has a shape that allows axes of different lengths to be set, and adjacent light collecting units include a light detection device whose axes are positioned in different directions, and a processing unit that processes signals from the light detection device.

[0009] In one aspect of the present technology, a photodetector device includes a photoelectric conversion unit, a light-collecting unit that collects light onto the photoelectric conversion unit, a pixel having the light-collecting unit, and a pixel array unit in which the pixels are arranged in a matrix, and the light-collecting unit has a shape that allows axes of different lengths to be set, and the axes of adjacent light-collecting units are positioned in different directions.

[0010] An electronic device according to one aspect of the present technology includes the photodetector device.

[0011] The photodetector and the electronic device may be independent devices or may be internal blocks constituting a single device.

[0012] 1 is a diagram illustrating a schematic configuration of a light detection device according to the present disclosure. FIG. 1 is a diagram illustrating an example of a planar configuration of an imaging device. FIG. 2 is a diagram illustrating an example of a cross-sectional configuration of an imaging device. FIG. 3 is a diagram illustrating the principle of occurrence of flare and ghost. FIG. 4 is a diagram illustrating a cell size and a diffraction angle. FIG. 5 is a diagram illustrating the relationship between cell size and reflectance. FIG. 6 is a diagram illustrating an example of a planar configuration of an imaging device according to a first embodiment. FIG. 7 is a diagram illustrating a direction of a long axis of an on-chip lens. FIG. 8 is a diagram illustrating a volume of an on-chip lens. FIG. 9 is a diagram illustrating an example of a planar configuration of an imaging device according to a second embodiment. FIG. 10 is a diagram illustrating another example of an arrangement of color filters. FIG. 11 is a diagram illustrating another example of a planar configuration of an imaging device according to a third embodiment. FIG. 12 is a diagram illustrating a direction of a long side of an on-chip lens. FIG. 13 is a diagram illustrating an example of an arrangement of on-chip lenses. FIG. 14 is a diagram illustrating another example of an arrangement of color filters. FIG. 15 is a diagram illustrating an example of a planar configuration of an imaging device according to a fourth embodiment. FIG. 16 is a diagram illustrating an example of a planar configuration of an imaging device according to a fifth embodiment. FIG. 17 is a diagram illustrating another example of a planar configuration of an imaging device according to the fifth embodiment. FIG. 13 is a diagram for explaining another example of the planar configuration of the imaging device in the fifth embodiment. FIG. 14 is a diagram for explaining on-chip lenses of different heights. FIG. 15 is a diagram for explaining the arrangement of CF partitions. FIG. 16 is a diagram for explaining an example of the configuration of an electronic device. FIG. 17 is a diagram for explaining an example of the schematic configuration of an endoscopic surgery system. FIG. 18 is a block diagram showing an example of the functional configuration of a camera head and a CCU. FIG. 19 is a block diagram showing an example of the schematic configuration of a vehicle control system. FIG. 19 is an explanatory diagram showing an example of the installation positions of an outside-vehicle information detection unit and an imaging unit.

[0013] Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described.

[0014] <Example of Schematic Configuration of Imaging Device> Fig. 1 shows a schematic configuration of an imaging device according to the present disclosure. The present technology can be applied to imaging devices that capture images (imaging devices that capture color images), distance measuring devices that measure the distance to a subject, and the like. In the following description, an imaging device that captures color images will be used as an example, but the present technology can be widely applied to light detection devices that receive light and detect the amount of light.

[0015] 1 includes a pixel array section 3 in which pixels 2 are arranged in a two-dimensional array on a semiconductor substrate 12 made of, for example, silicon (Si) as a semiconductor, and a peripheral circuit section around the pixel array section 3. The peripheral circuit section includes a vertical drive circuit 4, a column signal processing circuit 5, a horizontal drive circuit 6, an output circuit 7, a control circuit 8, etc.

[0016] Each pixel 2 includes a photodiode as a photoelectric conversion element and a plurality of pixel transistors, each of which is made up of, for example, four MOS transistors: a transfer transistor, a selection transistor, a reset transistor, and an amplification transistor.

[0017] The pixel 2 can also have a shared pixel structure. This pixel sharing structure is composed of multiple photodiodes, multiple transfer transistors, one shared floating diffusion (floating diffusion region), and each shared pixel transistor. That is, in a shared pixel, the photodiodes and transfer transistors that make up multiple unit pixels share each other pixel transistor.

[0018] The control circuit 8 receives an input clock and data instructing the operation mode and the like, and outputs data such as internal information of the imaging device 1. That is, the control circuit 8 generates clock signals and control signals that serve as references for the operations of the vertical drive circuit 4, column signal processing circuit 5, horizontal drive circuit 6, etc., based on a vertical synchronization signal, a horizontal synchronization signal, and a master clock. The control circuit 8 then outputs the generated clock signals and control signals to the vertical drive circuit 4, column signal processing circuit 5, horizontal drive circuit 6, etc.

[0019] The vertical drive circuit 4 is configured with, for example, a shift register, selects a pixel drive wiring 10, supplies a pulse for driving the pixels 2 to the selected pixel drive wiring 10, and drives the pixels 2 row by row. That is, the vertical drive circuit 4 selects and scans each pixel 2 of the pixel array unit 3 row by row in the vertical direction, and supplies a pixel signal based on a signal charge generated in the photoelectric conversion unit of each pixel 2 according to the amount of received light to the column signal processing circuit 5 through the vertical signal line 9.

[0020] The column signal processing circuits 5 are arranged for each column of pixels 2, and perform signal processing such as noise removal for each pixel column on signals output from one row of pixels 2. For example, the column signal processing circuits 5 perform signal processing such as CDS (Correlated Double Sampling) for removing fixed pattern noise specific to the pixels and AD conversion.

[0021] The horizontal drive circuit 6 is configured, for example, by a shift register, and sequentially outputs horizontal scanning pulses to select each of the column signal processing circuits 5 in turn, causing each of the column signal processing circuits 5 to output a pixel signal to the horizontal signal line 11.

[0022] The output circuit 7 processes and outputs signals sequentially supplied from each of the column signal processing circuits 5 through the horizontal signal line 11. The output circuit 7 may perform only buffering, or may perform black level adjustment, column variation correction, various digital signal processing, etc. The input / output terminal 13 exchanges signals with the outside.

[0023] The imaging device 1 configured as described above is a CMOS image sensor called a column AD type, in which the column signal processing circuits 5 that perform CDS processing and AD conversion processing are arranged for each pixel column.

[0024] The imaging device 1 is a backside illuminated MOS imaging device in which light is incident from the backside of the semiconductor substrate 12 opposite to the front side on which pixel transistors are formed.

[0025] <Planar and cross-sectional configuration examples of imaging device> The left diagram in Fig. 2 shows 20 pixels 2 arranged in a 4 × 5 array in the pixel array section 3, and the right diagram shows an example of the arrangement of color filters 51 (Fig. 3). Fig. 3 is a diagram showing an example of the cross-sectional configuration of the pixel 2 taken along line a-a' in Fig. 2.

[0026] Referring to the cross-sectional configuration example of FIG. 3, the imaging device 1 includes a semiconductor substrate 12, a multilayer wiring layer formed on the surface side of the semiconductor substrate 12, and a support substrate (neither of which are shown).

[0027] The semiconductor substrate 12 is made of, for example, silicon (Si) and is formed to have a thickness of, for example, 1 to 6 μm. In the semiconductor substrate 12, for example, a P-type (first conductivity type) semiconductor region 41 and an N-type (second conductivity type) semiconductor region 42 are formed for each pixel 2, thereby forming a photodiode PD for each pixel. The P-type semiconductor regions 41 provided on both the front and back surfaces of the semiconductor substrate 12 also serve as hole charge accumulation regions for suppressing dark current.

[0028] As shown in FIG. 3, the imaging device 1 is configured by stacking an anti-reflection film 61, a transparent insulating film 46, a color filter 51, and an on-chip lens 52 on a semiconductor substrate 12 on which an N-type semiconductor region 42 constituting a photodiode PD is formed for each pixel 2.

[0029] An anti-reflection film 61 for preventing reflection of incident light is formed on the interface (light-receiving surface side interface) of the P-type semiconductor region 41 above the N-type semiconductor region 42 that serves as a charge storage region.

[0030] The anti-reflection film 61 has a layered structure in which, for example, a fixed charge film and an oxide film are stacked, and can be, for example, a high-dielectric-constant (High-k) insulating thin film formed by atomic layer deposition (ALD). Specifically, hafnium oxide (HfO), aluminum oxide (AlO), titanium oxide (TiO), STO (Strontium Titan Oxide), etc. can be used. In the example of FIG. 3 , the anti-reflection film 61 is configured by stacking a hafnium oxide film 62, an aluminum oxide film 63, and a silicon oxide film 64.

[0031] The transparent insulating film 46 is formed on the entire back surface (light incident surface) of the P-type semiconductor region 41. The transparent insulating film 46 is made of a material that is light-transmitting and insulating, and has a refractive index n1 that is smaller than the refractive index n2 of the semiconductor regions 41 and 42 (n1<n2). Examples of materials for the transparent insulating film 46 include silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), hafnium oxide (HfO), aluminum oxide (AlO), zirconium oxide (ZrO), tantalum oxide (TaO), titanium oxide (TiO), lanthanum oxide (LaO), praseodymium oxide (PrO), cerium oxide (CeO), neodymium oxide (NdO), and promethium oxide. (Pm2O3), samarium oxide (Sm2O3), europium oxide (Eu2O3), gadolinium oxide (Gd2O3), terbium oxide (Tb2O3), dysprosium oxide (Dy2O3), holmium oxide (Ho2O3), thulium oxide (Tm2O3), ytterbium oxide (Yb2O3), lutetium oxide (Lu2O3), yttrium oxide (Y2O3), resins, etc. can be used alone or in combination.

[0032] A color filter 51 is formed on the upper side of the transparent insulating film 46. A red, green, or blue color filter 51 is formed for each pixel. The color filter 51 is formed, for example, by spin-coating a photosensitive resin containing a coloring material such as a pigment or dye. The red, green, and blue colors are arranged, for example, in a Bayer array, but as will be described later, this technology can also be applied to other array methods. In the example of FIG. 3, a green (G) color filter 51 is formed on pixel 2-1-1 and pixel 2-3-1, and a blue (B) color filter 51 is formed on pixel 2-2-1 and pixel 2-4-1.

[0033] 2, the color filters 51 are arranged in a Bayer array, with a green (G) color filter 51 at the upper left, a blue (B) color filter 51 at the upper right, a red (R) color filter 51 at the lower left, and a B (G) color filter 51 at the lower right. If the four color filters 51 in a 2×2 arrangement shown in the right diagram of Fig. 2 are considered to be one unit, then multiple units are consecutively arranged in a matrix in both the vertical and horizontal directions in the pixel array section 3.

[0034] As will be described later, the four 2×2 color filters 51 have the same color, and when the four 2×2 color filters 51 are considered as one unit, the present technology can also be applied to a case where a plurality of units are consecutively arranged in the vertical and horizontal directions in the pixel array section 3. Furthermore, as will be described later, the sixteen 4×4 color filters 51 have the same color, and when the sixteen 4×4 color filters 51 are considered as one unit, the present technology can also be applied to a case where a plurality of units are consecutively arranged in the vertical and horizontal directions in the pixel array section 3.

[0035] CF (color filter) partitions 49 are provided between the color filters 51. The CF partitions 49 are formed in a direction perpendicular to the light incident surface, at positions between the pixels 2 and between the color filters 51. The CF partitions 49 can function as waveguides. The waveguides are formed of a material having a refractive index different from that of the color filters 51, and have the function of preventing light from leaking into adjacent pixels 2 and guiding light to the photoelectric conversion units (N-type semiconductor regions 42). The CF partitions 49 functioning as waveguides are formed of, for example, an oxide film such as SiO2, a material with a low refractive index, or an air gap.

[0036] 3 , an on-chip lens 52 is formed above the color filter 51 for each pixel 2. The on-chip lens 52 is made of a resin material such as a styrene-based resin, an acrylic-based resin, a styrene-acrylic copolymer resin, or a siloxane-based resin. The on-chip lens 52 functions as a light-collecting unit that collects incident light, and the light collected by the on-chip lens 52 is efficiently incident on the photodiode PD via the color filter 51.

[0037] 2, an on-chip lens 52 is disposed on each pixel 2. If the square shown in the left diagram of FIG. 2 also represents the shape of the on-chip lens 52, an on-chip lens 52 of the same shape is disposed on each pixel 2.

[0038] 3 , the pixel 2 has an inter-pixel isolation portion 54 formed in the semiconductor substrate 12 to isolate the pixels 2 from each other. The inter-pixel isolation portion 54 is formed by forming a trench penetrating the semiconductor substrate 12 between the N-type semiconductor regions 42 that constitute the photodiodes PD, depositing an aluminum oxide film 63 on the inner surface of the trench, and further filling the trench with an insulator 55 when depositing a silicon oxide film 64.

[0039] The portion of the silicon oxide film 64 that fills the inter-pixel isolation portion 54 may be filled with polysilicon. In FIG. 3, the silicon oxide film 64 is formed integrally with the insulator 55.

[0040] By configuring such inter-pixel isolation portion 54, adjacent pixels 2 are completely electrically isolated from each other by insulator 55 embedded in the trench, thereby preventing electric charges generated inside semiconductor substrate 12 from leaking to adjacent pixels 2.

[0041] <Regarding the Occurrence of Ghosts and Flares> Causes of image quality degradation, such as ghosts and flares, will be described with reference to FIG.

[0042] 4 , a seal glass 81 and an infrared cut filter 82 are disposed on the light incident surface side of the imaging device 1. Light incident on the imaging device 1 generates diffracted and reflected light having a certain diffraction order (m) and diffracted reflection angle (θ) according to the formation pitch of the surface of the on-chip lens 52.

[0043] The diffracted reflected light is reflected by a sealing glass 81 formed above the image sensor, and becomes reflected light containing visible light components. The light components that pass through the sealing glass 81 are reflected by an infrared cut filter 82 formed further above the sealing glass 81, and become reflected light containing a large amount of red components in the visible light range.

[0044] The light reflected by the sealing glass 81 and the infrared cut filter 82 travels back toward the image sensor, and some of its components are photoelectrically converted by the photodiode 42 of the image sensor. This can cause ghosts and flares, which can degrade the image quality of the image sensor 1.

[0045] 5 is a diagram for explaining the relationship between the size of the pixel 2 and the diffraction angle. In FIG. 5, an example is shown in which the pitch of the pixels 2 and the pitch at which the on-chip lenses 52 are formed are equal.

[0046] The diffraction order (m) and diffraction angle (θ) of the diffracted and reflected light can be expressed by the following equation (1): d×sinθ=m×λ (1)

[0047] In formula (1), d is the pixel size (referred to as cell size) and λ is the wavelength of incident light. From formula (1), it can be seen that when λ is constant, the number of possible diffraction orders m decreases as the cell size, which is the formation pitch of the on-chip lens, decreases, and the number of possible diffraction orders m increases as the cell size increases.

[0048] The formation pitch of the on-chip lenses is the cell size, but this can be rephrased as follows: a small cell size results in a small periodicity, and a large cell size results in a large periodicity. In other words, it can be seen that a small periodicity results in a decrease in the diffraction order m (the state shown in the left diagram of FIG. 5 ), and a large periodicity results in an increase in the diffraction order m (the state shown in the right diagram of FIG. 5 ).

[0049] This can be expressed graphically as shown in the graph in Figure 6. The horizontal axis of the graph in Figure 6 represents cell size, and the vertical axis represents reflectance. The upper graph in Figure 6 represents the sum of total reflection excluding zero-order light, and the lower graph represents the maximum value within the distribution excluding zero-order light. In Figure 6, the triangles represent the reflectance when red (R) light is incident, the squares represent the reflectance when green (G) light is incident, and the diamonds represent the reflectance when B (blue) light is incident.

[0050] From the graph shown at the top of FIG. 6, it can be seen that regardless of the color of the incident light, as the cell size increases, in other words, as the periodicity increases, the total reflection value tends to increase.

[0051] From the graph at the bottom of Figure 6, it can be seen that, regardless of the color of the incident light, as the cell size increases, in other words, as the periodicity increases, the intensity at one point tends to decrease. In other words, as the cell size decreases, the periodicity decreases, and the intensity of the reflected light converging on one order of light (at a specific angle) tends to increase.

[0052] From these facts, it can be seen that increasing the cell size and the periodicity are effective in suppressing the occurrence of flare and ghosting. However, in recent years, there has been an increasing need for smaller pixels 2 and an increase in the number of pixels, and it is therefore desirable to suppress the occurrence of flare and ghosting by methods other than increasing the cell size. Therefore, below, an image pickup device 1 that suppresses the occurrence of flare and ghosting by increasing the periodicity without increasing the cell size will be described.

[0053] In the embodiment described below, an image pickup device 1 will be described in which the shape, size, arrangement direction, and the like of the on-chip lenses 52 are made different at least between adjacent pixels 2, thereby increasing the periodicity, in other words, weakening the periodicity and suppressing the occurrence of flare and ghosts.

[0054] <Regarding the imaging device with weakened periodicity> The following describes the imaging device 1 that can reduce the reflection intensity at a specific angle by weakening the periodicity of the pixels 2, thereby suppressing image quality degradation due to flare and ghosting.

[0055] In order to weaken the periodicity of the pixels 2, the structures are arranged so that the structures constituting the pixels 2 are different at least between adjacent pixels 2. The structures are on-chip lenses 52, as will be described below.

[0056] FIG. 7 is a diagram showing an example of the planar configuration of the imaging device 1 according to the first embodiment. The color filters 51 of the imaging device 1 shown in FIG. 7 are described below using an example in which they are arranged in a Bayer array. FIG. 7 shows 16 pixels 2 (4×4) among the pixels 2 arranged in the pixel array section 3. The pixel 2-1-1 in the upper left of the figure is a pixel (hereinafter referred to as pixel R, where appropriate) on which a red color filter 51 is arranged, and an on-chip lens 52-1-1 is arranged. The pixel 2-2-1 arranged to the right of pixel 2-1-1 is a pixel (hereinafter referred to as pixel G, where appropriate) on which a green color filter 51 is arranged, and an on-chip lens 52-2-1 is arranged.

[0057] Pixel 2-1-2, which is located below pixel 2-1-1, is pixel G and is provided with an on-chip lens 52-1-2. Pixel 2-2-2, which is located to the right of pixel 2-1-2, is a pixel (hereinafter referred to as pixel B where appropriate) in which a blue color filter 51 is located and is provided with an on-chip lens 52-2-2. Similarly, the other pixels 2 are provided with color filters 51 in a Bayer array and on-chip lenses 52.

[0058] Each on-chip lens 52 disposed on a pixel 2 has an elliptical shape. Fig. 8 is an enlarged view of the four 2 x 2 pixels from Fig. 7 and the on-chip lenses 52 disposed on those pixels. Of the line segments connecting the ends of the elliptical on-chip lens 52, the longest line segment is the major axis and the shortest line segment is the minor axis.

[0059] The on-chip lens 52-1-1 disposed in pixel 2-1-1 is elliptical and disposed so that its major axis is aligned from the upper left to the lower right in the drawing. The on-chip lens 52-2-1 disposed in pixel 2-2-1 is elliptical and disposed so that its major axis is aligned from the upper right to the lower left in the drawing. The on-chip lens 52-1-1 and the on-chip lens 52-2-1 are on-chip lenses 52 adjacent to each other in the horizontal direction and are disposed so that their major axes point in different directions.

[0060] The on-chip lens 52-1-1 arranged in pixel 2-1-1 and the on-chip lens 52-1-2 arranged in pixel 2-1-2 are adjacent on-chip lenses 52 in the vertical direction. The on-chip lens 52-1-2 arranged in pixel 2-1-2 is elliptical and arranged with its major axis pointing from the upper right to the lower left. The on-chip lens 52-1-1 and the on-chip lens 52-1-2 are adjacent on-chip lenses 52 in the vertical direction and are arranged with their major axes pointing in different directions.

[0061] In this way, the on-chip lenses 52 adjacent to each other in the horizontal and vertical directions are arranged so that their major axes face in different directions. Although the description has been given using the major axis as an example, the same applies to the minor axes, and the on-chip lenses 52 adjacent to each other in the horizontal and vertical directions are arranged so that their minor axes face in different directions.

[0062] In this way, the on-chip lenses 52 are formed in a shape that allows axes of different lengths, namely, the major axis and the minor axis, to be set, and adjacent on-chip lenses 52 are arranged so that the axes that can be set face in different directions. This weakens the periodicity compared to when the axes are arranged facing the same direction. This makes it possible to suppress image quality degradation due to flare and ghosting.

[0063] The on-chip lenses 52 are formed to have the same shape and size. Having the same shape and size also includes the case where a difference occurs due to distortion of the shape or the like, but the difference falls within a predetermined range.

[0064] If the on-chip lenses 52 have different shapes or sizes, there is a possibility that a difference in sensitivity will occur between the pixels 2. When the on-chip lenses 52 are elliptical as shown in Fig. 8, the areas of the elliptical on-chip lenses 52 are approximately the same for the on-chip lenses 52-1-1, 52-2-1, 52-1-2, and 52-2-2.

[0065] The on-chip lenses 52 are also assumed to have approximately the same volume. The volume of the on-chip lens 52 is calculated from the area and height. As shown in the right diagram of FIG. 9 , the height of the on-chip lens 52 can be defined as the distance from the gap portion (the position that corresponds to the bottom surface) of the on-chip lens 52 to the highest point of the on-chip lens 52 in a cross-sectional view of the on-chip lens 52. Furthermore, the area of ​​the on-chip lens 52 can be defined as the area of ​​the gap portion of the on-chip lens 52, as shown in the right diagram of FIG. 9 . In this case, the volume V can be calculated by the equation volume V = S × H.

[0066] By making the area and volume of the on-chip lenses 52 the same, it is possible to prevent a difference in sensitivity from occurring between the pixels 2 .

[0067] In this way, by making the on-chip lenses 52 elliptical, and arranging the on-chip lenses 52 so that the directions of the on-chip lenses 52 arranged in adjacent pixels 2 are different and the areas of the on-chip lenses 52 are the same, it is possible to suppress the occurrence of flare and ghosting, and to suppress the occurrence of differences in sensitivity between the pixels 2.

[0068] Second Embodiment FIG. 10 is a diagram showing an example of the configuration of an imaging device 1 according to a second embodiment.

[0069] The configuration of the imaging device 1 shown in Fig. 10 is the same as the configuration of the imaging device 1 shown in Fig. 7, and the on-chip lenses 52 arranged in each pixel 2 are formed in an elliptical shape and are formed to have the same area and volume. The configuration of the imaging device 1 shown in Fig. 10 is different from the configuration of the imaging device 1 shown in Fig. 7 in the arrangement of the color filter 51, but is otherwise similar.

[0070] The color filters 51 of the imaging device 1 shown in Fig. 10 are arranged in the same color in four 2 x 2 pixels. Pixels 2-1-1, 2-2-1, 2-1-2, and 2-2-2 located in the upper left of the figure are pixels R in which red color filters 51 are arranged. The on-chip lenses 52 arranged in these four pixels 2 are arranged so that adjacent on-chip lenses 52 face in different directions, as in the case described with reference to Figs. 7 and 8. This makes it possible to suppress the occurrence of flare and ghosting in the pixels R of the four 2 x 2 pixels 2 and to suppress the occurrence of sensitivity differences between the pixels R of the four pixels 2.

[0071] Pixels 2-3-1, 2-4-1, 2-3-2, and 2-4-2 located in the upper right corner of the figure are pixels G in which green color filters 51 are arranged. The on-chip lenses 52 arranged in these four pixels 2 are arranged so that the directions of adjacent on-chip lenses 52 are different, as in the case described with reference to FIGS. 7 and 8. This makes it possible to suppress the occurrence of flare and ghosting in the pixel G of the four 2×2 pixels 2, and to suppress the occurrence of sensitivity differences between the pixel G of the four pixels 2.

[0072] Pixels 2-1-3, 2-2-3, 2-1-4, and 2-2-4 located at the bottom left of the drawing are pixels G in which green color filters 51 are arranged. The on-chip lenses 52 arranged in these four pixels 2 are arranged so that the directions of adjacent on-chip lenses 52 are different, as in the case described with reference to FIGS. 7 and 8. This makes it possible to suppress the occurrence of flare and ghosting in the pixel G of the four 2×2 pixels 2, and to suppress the occurrence of sensitivity differences between the pixel G of the four pixels 2.

[0073] Pixels 2-3-3, 2-4-3, 2-3-4, and 2-4-4 located at the bottom right of the figure are designated as pixels B, in which blue color filters 51 are arranged. The on-chip lenses 52 arranged in these four pixels 2 are arranged so that the directions of adjacent on-chip lenses 52 are different, as in the case described with reference to FIGS. 7 and 8. This makes it possible to suppress the occurrence of flare and ghosting in the pixel B of the four 2×2 pixels 2, and to suppress the occurrence of a difference in sensitivity between the pixel B of the four pixels 2.

[0074] The four pixels G located in the upper right and the four pixels G located in the lower left are equipped with on-chip lenses 52 of the same area, which makes it possible to prevent a difference in sensitivity from occurring between the pixels G. The pixels R and B are also equipped with on-chip lenses 52 of the same area, which makes it possible to prevent a difference in sensitivity from occurring between the pixels R and B.

[0075] In this way, by configuring the on-chip lenses 52 mounted on adjacent pixels 2 to face in different directions, it is possible to weaken the periodicity, suppress the diffraction intensity, and prevent the occurrence of flare and ghosting. Furthermore, by making the sizes of the on-chip lenses 52 uniform, it is possible to prevent the occurrence of sensitivity differences between the same colors.

[0076] 10 shows an example in which color filters 51 of the same color are arranged in four pixels 2 in a 2×2 array, but the present technology can also be applied to a configuration in which color filters 51 of the same color are arranged in 16 pixels in a 4×4 array, as shown in Fig. 11. In the example shown in Fig. 11, 64 pixels 2 in an 8×8 array are shown among the pixels 2 arranged in the pixel array unit 3.

[0077] The 16 pixels 2 arranged in a 4×4 array at the top left are configured as pixels R in which red color filters 51 are arranged. Of the 16 pixels 2, an on-chip lens 52 having the shape described with reference to FIGS. 7 and 8 and with its major axis facing a predetermined direction is arranged for every four pixels 2 arranged in a 2×2 array. Even when viewing the 16 pixels R, adjacent on-chip lenses 52 are arranged with the major axes of their elliptical shapes facing in different directions, which makes it possible to suppress the occurrence of flare and ghosting, and because they are formed to be the same size, it is possible to suppress the occurrence of differences in sensitivity.

[0078] The 16 pixels 2 arranged in a 4×4 array at the top right are configured as pixels G in which green color filters 51 are arranged. Of the 16 pixels 2, an on-chip lens 52 having the shape described with reference to FIGS. 7 and 8 and with its major axis facing a predetermined direction is arranged for every four pixels 2 arranged in a 2×2 array. Even when viewing the 16 pixels G, adjacent on-chip lenses 52 are arranged with the major axes of their ellipses facing in different directions, which makes it possible to suppress the occurrence of flare and ghosting, and because they are formed to be the same size, it is possible to suppress the occurrence of differences in sensitivity.

[0079] The 16 pixels 2 arranged in a 4×4 array at the top left are configured as pixels G in which green color filters 51 are arranged. Of the 16 pixels 2, an on-chip lens 52 having the shape described with reference to FIGS. 7 and 8 and with its major axis facing a predetermined direction is arranged for every four pixels 2 arranged in a 2×2 array. Even when viewing the 16 pixels G, adjacent on-chip lenses 52 are arranged with the major axes of their ellipses facing in different directions, which makes it possible to suppress the occurrence of flare and ghosting, and because they are formed to be the same size, it is possible to suppress the occurrence of differences in sensitivity.

[0080] The 16 pixels 2 arranged in a 4×4 matrix at the bottom right are configured as pixels B in which green color filters 51 are arranged. Of the 16 pixels 2, an on-chip lens 52 having the shape described with reference to FIGS. 7 and 8 and with its major axis facing a predetermined direction is arranged for every four pixels 2 arranged in a 2×2 matrix among the 16 pixels 2. Even when viewing the 16 pixels G, adjacent on-chip lenses 52 are arranged with the major axes of their ellipses facing in different directions, which makes it possible to suppress the occurrence of flare and ghosting, and because they are formed to be the same size, it is possible to suppress the occurrence of differences in sensitivity.

[0081] 11 , the 16 pixels G located in the upper right corner and the 16 pixels G located in the lower left corner are each equipped with an on-chip lens 52 having the same area, which makes it possible to prevent a difference in sensitivity between the pixels G. The pixels R and B are also equipped with an on-chip lens 52 having the same area, which makes it possible to prevent a difference in sensitivity between the pixels R and B.

[0082] In this way, by configuring the axes of the on-chip lenses 52 mounted on adjacent pixels 2 to face in different directions, it is possible to weaken the periodicity, suppress the diffraction intensity, and prevent the occurrence of flare and ghosting. Furthermore, by making the sizes of the on-chip lenses 52 uniform, it is possible to prevent the occurrence of sensitivity differences between the same colors.

[0083] Note that, here, we have used examples where four 2x2 pixels are of the same color and where 16 4x4 pixels are of the same color, but this technology can also be applied to cases where MxN pixels are of the same color.

[0084] <Another Arrangement Example of Elliptical On-Chip Lenses> FIG. 12 shows an example in which the same color is arranged in four 2×2 pixels 2, and elliptical on-chip lenses 52 are arranged, as in FIG. 10 , but the direction in which the long axis of the on-chip lenses 52 faces is different from that of the on-chip lenses 52 shown in FIG. 10 .

[0085] The on-chip lenses 52 arranged in each of the four pixels R located in the upper left, the four pixels G located in the upper right, the four pixels G located in the lower left, and the four pixels B located in the lower right are formed in the same shape and are arranged so that the long axes are arranged in a similar manner, so the four pixels R located in the upper left will be used as an example for explanation.

[0086] The on-chip lens 52-1-1 disposed in pixel 2-1-1 is elliptical and disposed with its major axis aligned in the horizontal direction in the figure. The on-chip lens 52-2-1 disposed in pixel 2-2-1 is elliptical and disposed with its major axis aligned in the vertical direction in the figure. The on-chip lens 52-1-1 and the on-chip lens 52-2-1 are on-chip lenses 52 adjacent to each other in the horizontal direction, and are disposed with their major axes pointing in different directions.

[0087] The on-chip lens 52-1-2 disposed in pixel 2-1-2 is elliptical and disposed with its major axis aligned in the vertical direction. The on-chip lens 52-1-1 disposed in pixel 2-1-1 and the on-chip lens 52-1-2 disposed in pixel 2-1-2 are on-chip lenses 52 adjacent to each other in the vertical direction, and are disposed with their major axes pointing in different directions.

[0088] In this way, by configuring the on-chip lenses 52 so that axes of different lengths that intersect at right angles, for example, the major axis and the minor axis, can be set, and the major axes or minor axes of the on-chip lenses 52 mounted on adjacent pixels 2 face in different directions, it is possible to weaken the periodicity, suppress the diffraction intensity, and suppress the occurrence of flare and ghost. In addition, by making the sizes of the on-chip lenses 52 uniform, it is possible to suppress the occurrence of differences in sensitivity between the same colors.

[0089] The embodiment of the on-chip lenses 52 having directions in diagonal directions (diagonally downward to the left and diagonally downward to the right) shown in Fig. 10 may be combined with the embodiment of the on-chip lenses 52 having directions in the vertical or horizontal direction shown in Fig. 12. When combined, a configuration can be achieved in which on-chip lenses 52 having elliptical major axes oriented diagonally downward to the left, on-chip lenses 52 having elliptical major axes oriented diagonally downward to the right, on-chip lenses 52 oriented vertically, and on-chip lenses 52 oriented horizontally are arranged in this order, for example, in the vertical and horizontal directions, respectively. In this case, the periodicity can be further weakened, and the diffraction intensity can be suppressed.

[0090] Third Embodiment As a third embodiment, a case where the on-chip lens 52 has a rectangular shape will be described.

[0091] Fig. 13 is a diagram showing an example of the planar configuration of the third embodiment of the imaging device 1. The color filters 51 of the imaging device 1 shown in Fig. 13 are arranged in the same array as that shown in Fig. 10, and an example will be described in which the same color is arranged in four 2 x 2 pixels 2. Note that the third embodiment described below can also be applied to the configuration of the color filters 51 in the Bayer array shown in Fig. 7 and the configuration in which color filters 51 of the same color are arranged in 16 4 x 4 pixels 2 shown in Fig. 11.

[0092] 13 shows 16 pixels 2 arranged in a 4×4 array among the pixels 2 arranged in the pixel array unit 3. The four pixels 2 arranged in a 2×2 array at the top left of the figure are pixels R, the four pixels 2 arranged in a 2×2 array at the top right of the figure are pixels G, the four pixels 2 arranged in a 2×2 array at the bottom left of the figure are pixels G, and the four pixels 2 arranged in a 2×2 array at the bottom right of the figure are pixels B.

[0093] Each on-chip lens 52b arranged in a pixel 2 is rectangular. Like an ellipse, a rectangle is a shape in which axes of different lengths and perpendicular axes, such as a major axis (long side) and a minor axis (short side), can be set. Figure 14 is an enlarged view of the four 2 x 2 pixels from Figure 13 and the on-chip lenses 52b arranged on those pixels.

[0094] The on-chip lens 52b-1-1 disposed in pixel 2-1-1 is rectangular and disposed with its long side aligned horizontally in the drawing. The on-chip lens 52b-2-1 disposed in pixel 2-2-1 is rectangular and disposed with its long side aligned vertically in the drawing. The on-chip lens 52b-1-1 and the on-chip lens 52b-2-1 are on-chip lenses 52 adjacent to each other in the horizontal direction, and are disposed with their long sides facing in different directions.

[0095] The on-chip lens 52b-1-2 disposed in pixel 2-1-2 is rectangular and disposed with its long side aligned vertically. The on-chip lens 52b-1-1 disposed in pixel 2-1-1 and the on-chip lens 52b-1-2 disposed in pixel 2-1-2 are adjacent on-chip lenses 52b in the vertical direction, and are disposed with their long sides facing in different directions.

[0096] In this way, the on-chip lenses 52b adjacent to each other in the horizontal and vertical directions are arranged so that the long sides thereof face in different directions. Although the long sides have been used as an example in the description here, the same applies to the short sides, and the on-chip lenses 52b adjacent to each other in the horizontal and vertical directions are arranged so that the short sides thereof face in different directions.

[0097] In this way, by forming the on-chip lenses 52b in a shape that allows sides of different lengths, for example, long and short sides, and configuring the long and short sides of the on-chip lenses 52b mounted on adjacent pixels 2 to face in different directions, the periodicity can be weakened, the diffraction intensity can be suppressed, and the occurrence of flare and ghosts can be suppressed.

[0098] The on-chip lenses 52b are formed to have approximately the same shape and size. If the on-chip lenses 52b have different shapes or sizes, there is a possibility that a difference in sensitivity will occur between the pixels 2. When the on-chip lenses 52b are rectangular as shown in FIG. 8, the areas of the rectangular on-chip lenses 52b are approximately the same for the on-chip lenses 52b-1-1, 52b-2-1, 52b-1-2, and 52b-2-2.

[0099] The on-chip lenses 52b have approximately the same volume. The volume of the on-chip lens 52b is calculated from the area and height. While the case of an ellipse has been described with reference to FIG. 9 , the same applies to the case of a rectangle. As shown in the right diagram of FIG. 9 , the height of the on-chip lens 52b can be defined as the distance from the gap between the on-chip lens 52b (the position that serves as the bottom surface) to the highest point of the on-chip lens 52b in a cross-sectional view of the on-chip lens 52b. The area of ​​the on-chip lens 52b can be defined as the area of ​​the rectangle in the gap between the on-chip lens 52b.

[0100] By making the area and volume of the on-chip lenses 52b approximately the same, it is possible to prevent a difference in sensitivity between the pixels 2.

[0101] In this way, by making the on-chip lenses 52 b rectangular and arranging the on-chip lenses 52 b arranged in adjacent pixels 2 so that the directions of the on-chip lenses 52 b are different and the areas (volumes) of the on-chip lenses 52 b are the same, it is possible to suppress the occurrence of flare and ghosting, and to suppress the occurrence of differences in sensitivity between the pixels 2.

[0102] <Other Directions of On-Chip Lenses> FIG. 15 illustrates only the on-chip lenses 52 arranged in four 2×2 pixels 2, and the directions in which the on-chip lenses 52 are arranged will be described.

[0103] The arrangement of the on-chip lenses 52-1 to 52-4 shown in A of Figure 15 corresponds to the case shown in Figures 7 and 10, and is an example in which each of the on-chip lenses 52-1 to 52-4 is formed in an elliptical shape, with its major axis directed toward the center of the four 2 x 2 pixels 2. The major axis of the on-chip lens 52-1 is directed from the upper left to the lower right (hereinafter referred to as the diagonally downward right direction), and the major axis of the on-chip lens 52-2 is directed from the upper right to the lower left (hereinafter referred to as the diagonally downward left direction). The major axis of the on-chip lens 52-3 is directed in the diagonally downward left direction, and the major axis of the on-chip lens 52-4 is directed in the diagonally downward right direction.

[0104] The arrangement of the on-chip lenses 52-1 to 52-4 shown in FIG. 15B is an example in which the on-chip lenses 52-1 to 52-4 are formed in an elliptical shape and their major axes are arranged in a direction that does not intersect with the centers of the four 2 × 2 pixels 2. The major axis of the on-chip lens 52-1 is located in a diagonally downward left direction, and the major axis of the on-chip lens 52-2 is located in a diagonally downward right direction. The major axis of the on-chip lens 52-3 is located in a diagonally downward right direction, and the major axis of the on-chip lens 52-4 is located in a diagonally downward left direction.

[0105] The arrangement of the on-chip lenses 52-1 to 52-4 shown in Fig. 15C corresponds to the case shown in Fig. 12, and is an example in which the on-chip lenses 52-1 to 52-4 are formed in an elliptical shape and their major axes are arranged in a direction that does not intersect with the centers of the four 2 x 2 pixels 2. The major axis of the on-chip lens 52-1 is located in the horizontal direction, and the major axis of the on-chip lens 52-2 is located in the vertical direction. The major axis of the on-chip lens 52-3 is located in the vertical direction, and the major axis of the on-chip lens 52-4 is located in the horizontal direction.

[0106] The arrangement of the on-chip lenses 52-1 to 52-4 shown in Fig. 15D corresponds to the case shown in Fig. 13, and is an example in which the on-chip lenses 52-1 to 52-4 are formed in a rectangular shape, and their long sides (long axes) are arranged in a direction that does not intersect with the centers of the four 2 x 2 pixels 2. The long side of the on-chip lens 52-1 is positioned horizontally, and the long side of the on-chip lens 52-2 is positioned vertically. The long side of the on-chip lens 52-3 is positioned vertically, and the long side of the on-chip lens 52-4 is positioned horizontally.

[0107] The arrangement of the on-chip lenses 52-1 to 52-4 shown in Fig. 15E is an example in which the on-chip lenses 52-1 to 52-4 are formed in a rectangular shape, and their long sides (long axes) are arranged in a direction that does not intersect with the centers of the four 2 x 2 pixels 2. The long side of the on-chip lens 52-1 is positioned diagonally downward to the left, and the long side of the on-chip lens 52-2 is positioned diagonally downward to the right. The long side of the on-chip lens 52-3 is positioned diagonally downward to the right, and the long side of the on-chip lens 52-4 is positioned diagonally downward to the left.

[0108] The arrangement of the on-chip lenses 52-1 to 52-4 shown in Fig. 15F is an example in which the on-chip lenses 52-1 to 52-4 are formed in a rectangular shape, with their long sides (long axes) arranged in a direction intersecting the centers of the four 2 x 2 pixels 2. The long side of the on-chip lens 52-1 is positioned diagonally downward to the right, and the long side of the on-chip lens 52-2 is positioned diagonally downward to the left. The long side of the on-chip lens 52-3 is positioned diagonally downward to the left, and the long side of the on-chip lens 52-4 is positioned diagonally downward to the right.

[0109] In any of the cases shown in FIG. 15 , the on-chip lenses 52 arranged in adjacent pixels 2 are arranged so that their directions are different and the areas of the on-chip lenses 52 are the same, which makes it possible to suppress the occurrence of flare and ghosting and to suppress the occurrence of a difference in sensitivity between the pixels 2.

[0110] <Other Arrangement Examples of Color Filters> In the above-described embodiment, the color filters 51 are described as being red, blue, and green. However, the color filters 51 may be configured to use three colors, namely, yellow, magenta, and cyan, or may include white, as shown in FIG. 16 .

[0111] The on-chip lenses 52 shown in Fig. 16 have the same shape and arrangement as those shown in Fig. 10, and therefore will not be described further. The arrangement of the color filters 51 described with reference to Fig. 16 can be applied to any of the above-mentioned embodiments and the embodiments described below.

[0112] 16, in addition to the three colors of red, blue, and green, a white (transparent) color filter 51 is also arranged. Of the four 2×2 pixels 2 shown in the upper left, pixels 2-2-1 and 2-1-2 are designated as white color filters 51 (hereinafter referred to as pixel W where appropriate). Of the four 2×2 pixels 2 shown in the upper right, pixels 2-4-1 and 2-3-2 are designated as pixel W.

[0113] Of the four 2×2 pixels 2 shown in the lower left, pixel 2-2-3 and pixel 2-1-4 are designated as pixels W. Of the four 2×2 pixels G shown in the lower right, pixel 2-4-3 and pixel 2-3-4 are designated as pixels W. Because the white pixel W has a higher sensitivity than the other pixels (pixels R, G, and B), a configuration in which the white pixel W is arranged can be used when it is desired to perform processing in which such a highly sensitive pixel is arranged.

[0114] In this case as well, it is possible to prevent a difference in sensitivity from occurring between the pixels W in which the white color filters 51 are arranged. Furthermore, since the arrangement of the on-chip lenses 52 is the same as in the above-described case, similarly to the above-described embodiment, the on-chip lenses 52 arranged in adjacent pixels 2 are arranged so that their directions are different and the areas of the on-chip lenses 52 are the same, thereby suppressing the occurrence of flare and ghosting and making it possible to suppress a difference in sensitivity from occurring between the pixels 2.

[0115] 17 is a diagram for explaining other shapes, sizes, and arrangements of the image pickup device 1 according to the fourth embodiment, mainly of the on-chip lens 52. The arrangement of the color filter 51 and the shape and arrangement of the on-chip lens 52 of the image pickup device 1 shown in FIG. 17 are basically the same as those of the image pickup device 1 shown in FIG.

[0116] The on-chip lens 52 of the imaging device 1 shown in FIG. 17 is different from the on-chip lens 52 of the imaging device 1 shown in FIG. 10 in that a larger lens is arranged in the pixel G, but is otherwise similar.

[0117] The on-chip lenses 52c arranged in the four 2×2 pixels G shown in the upper right are larger in size than the on-chip lenses 52 arranged in the four 2×2 pixels R shown in the upper left. Also, the on-chip lenses 52c arranged in the four 2×2 pixels G shown in the lower left are larger in size than the on-chip lenses 52 arranged in the four 2×2 pixels R shown in the upper left.

[0118] When compared for the same color, the on-chip lenses 52c arranged on the four 2 x 2 pixels G shown in the upper right and the on-chip lenses 52c arranged on the four 2 x 2 pixels G shown in the lower left are lenses of the same size.

[0119] The on-chip lenses 52c arranged in the four 2 x 2 pixels G shown in the upper right and the on-chip lenses 52c arranged in the four 2 x 2 pixels G shown in the lower left are formed in an elliptical shape, as in the case described with reference to Figure 10, etc., and the major axes of adjacent on-chip lenses 52c are configured to face in different directions.

[0120] By arranging the on-chip lenses 52 and 52c of different sizes in the pixel array unit 3, the periodicity can be further weakened, and the occurrence of flare and ghosts can be suppressed.

[0121] 17 , when focusing on pixel G, on-chip lenses 52c of the same shape and size are arranged, so that it is possible to prevent a difference in sensitivity from occurring in pixel G. Similarly, with respect to pixel R and pixel B, it is possible to prevent a difference in sensitivity from occurring in pixel R or pixel B. That is, even with the configuration shown in FIG. 17 , it is possible to prevent a difference in sensitivity from occurring in the same color.

[0122] <Other Configuration Examples of On-Chip Lens> Fig. 18 is a diagram for explaining other shapes, sizes, and arrangements of the image pickup device 1 according to the fifth embodiment, mainly the on-chip lens 52. The image pickup device 1 shown in Fig. 18 differs in that an elliptical on-chip lens 52 and a circular on-chip lens 52d are arranged in the on-chip lens 52, but other points are similar to those of the image pickup device 1 shown in Fig. 10, for example.

[0123] The on-chip lenses 52d arranged in the four 2 x 2 pixels R shown in the upper left are circular lenses. Since the pixels R are provided with circular on-chip lenses 52d of the same size, it is possible to prevent a difference in sensitivity between the pixels R.

[0124] The on-chip lenses 52d arranged in the four 2 x 2 pixels B shown in the lower right are circular lenses. Since the pixels B are provided with circular on-chip lenses 52d of the same size, it is possible to prevent a difference in sensitivity between the pixels B.

[0125] The on-chip lenses 52 arranged in the four 2×2 pixels G shown in the upper right and the on-chip lenses 52 arranged in the four 2×2 pixels G shown in the lower left are similar to the on-chip lenses 52 arranged in the four 2×2 pixels G shown in Fig. 10, for example, and are configured to have an elliptical shape with their major axes facing in different directions, thereby preventing a difference in sensitivity between the pixels G.

[0126] By arranging the on-chip lenses 52 and 52d having different shapes in the pixel array unit 3, the periodicity can be further weakened, and the occurrence of flare and ghosts can be suppressed.

[0127] In the configuration shown in FIG. 18 , an example has been described in which circular on-chip lenses 52 d are arranged in pixels R and B, and an elliptical on-chip lens 52 is arranged in pixel G. However, a configuration may also be used in which elliptical on-chip lenses 52 are arranged in pixels R and B, and a circular on-chip lens 52 d is arranged in pixel G.

[0128] <Other Configuration Examples of On-Chip Lens> Fig. 19 is a diagram for explaining other shapes, sizes, and arrangements of the image pickup device 1 according to the fifth embodiment, mainly the on-chip lenses 52. The on-chip lenses 52 of the image pickup device 1 shown in Fig. 19 are different in that they include an elliptical on-chip lens 52 and an elliptical on-chip lens 52e arranged across two pixels 2, but other points are similar to those of the image pickup device 1 shown in Fig. 10, for example.

[0129] Of the four 2×2 pixels R shown in the upper left, the upper pixels 2-1-1 and 2-2-1 are provided with an elliptical on-chip lens 52e-1-1 that straddles the two pixels 2. Of the four 2×2 pixels R shown in the upper left, the lower pixels 2-1-2 and 2-2-2 are provided with an elliptical on-chip lens 52e-1-2 that straddles the two pixels 2.

[0130] The on-chip lenses 52e disposed in the pixels 2-1-1, 2-2-1, 2-1-2, and 2-2-2 are all equal in size, so that it is possible to prevent a difference in sensitivity from occurring between the pixels R.

[0131] Of the four 2×2 pixels B shown in the lower right, the upper pixels 2-3-3 and 2-4-3 are provided with an elliptical on-chip lens 52e-3-3 that straddles the two pixels 2. Of the four 2×2 pixels B shown in the lower right, the lower pixels 2-3-4 and 2-4-4 are provided with an elliptical on-chip lens 52e-3-4 that straddles the two pixels 2.

[0132] The on-chip lenses 52e disposed in the pixels 2-3-3, 2-4-3, 2-3-4, and 2-4-4 are all the same size, so that it is possible to prevent a difference in sensitivity between the pixels B.

[0133] The on-chip lenses 52 arranged in the four 2 x 2 pixels G shown in the upper right and the on-chip lenses 52 arranged in the four 2 x 2 pixels G shown in the lower left are similar to the on-chip lenses 52 shown in FIG. 10 , for example, and are elliptical in shape with their major axes pointing in different directions, so that there is no difference in sensitivity between the pixels G.

[0134] By arranging the on-chip lenses 52 and 52e having different shapes in the pixel array unit 3, the periodicity can be further weakened, and the occurrence of flare and ghosts can be suppressed.

[0135] In the configuration shown in FIG. 19 , an example has been described in which one elliptical on-chip lens 52 e is arranged across two pixels 2 in pixel R and pixel B, and one elliptical on-chip lens 52 is arranged on one pixel 2 in pixel G. However, a configuration may also be used in which one elliptical on-chip lens 52 is arranged on one pixel 2 in pixel R and pixel B, and one elliptical on-chip lens 52 e is arranged across two pixels 2 in pixel G.

[0136] The elliptical on-chip lens 52e arranged across two pixels can also be configured to include an on-chip lens 52e arranged in the vertical direction, as shown in Fig. 20. Referring to Fig. 20, of the four 2 x 2 pixels R shown in the upper left, an elliptical on-chip lens 52e-1-1 arranged across two pixels 2 is arranged between pixels 2-1-1 and 2-1-2 located on the left side. Of the four 2 x 2 pixels R shown in the upper left, an elliptical on-chip lens 52e-2-1 arranged across two pixels 2 is arranged between pixels 2-2-1 and 2-2-2 located on the right side.

[0137] The on-chip lenses 52e disposed in the pixels 2-1-1, 2-2-1, 2-1-2, and 2-2-2 are all equal in size, so that it is possible to prevent a difference in sensitivity from occurring between the pixels R.

[0138] In the example shown in Fig. 20, the on-chip lenses 52e arranged in the four 2 x 2 pixels B shown in the lower right are arranged so as to straddle two pixels 2 in the horizontal direction, similar to the on-chip lenses 52e arranged in the four 2 x 2 pixels B shown in the lower right of Fig. 19. The on-chip lenses 52e arranged in the four 2 x 2 pixels B shown in the lower right may also be configured as lenses straddling two pixels B arranged in the vertical direction.

[0139] 20 , the periodicity can be further weakened and the occurrence of flare and ghosting can be suppressed by arranging the on-chip lenses 52 and on-chip lenses 52e having different shapes in the pixel array unit 3. Furthermore, by configuring the on-chip lenses 52e arranged across two pixels 2 as an on-chip lens 52e having a long axis in the vertical direction and an on-chip lens 52e having a long axis in the horizontal direction, the periodicity can be further weakened and the occurrence of flare and ghosting can be suppressed.

[0140] 19 or 20, the oval on-chip lens 52e arranged across two pixels can also be configured as an on-chip lens 52e arranged across four 2 × 2 pixels 2 as shown in Fig. 21. Referring to Fig. 21, one circular on-chip lens 52e-1-1 is arranged across four 2 × 2 pixels R shown in the upper left. The sizes of the on-chip lenses 52e arranged in pixels 2-1-1, 2-2-1, 2-1-2, and 2-2-2 are all ¼ the same, which makes it possible to prevent differences in sensitivity from occurring between the pixels R.

[0141] One circular on-chip lens 52e-3-3 is arranged across four 2 x 2 pixels B shown in the lower right. The size of the on-chip lenses 52e arranged in pixels 2-3-3, 2-4-3, 2-3-4, and 2-4-4 is 1 / 4 of the original size, so that it is possible to prevent a difference in sensitivity between the pixels B.

[0142] In the case of the configuration shown in FIG. 21 , by arranging the on-chip lenses 52 and the on-chip lenses 52 e having different shapes within the pixel array unit 3, the periodicity can be further weakened, and the occurrence of flare and ghosting can be suppressed.

[0143] 19 or 20 may be configured by applying the configuration shown in Fig. 21 and replacing the two on-chip lenses 52e arranged across two pixels 2 with one on-chip lens 52e arranged across four pixels 2. For example, a configuration may be used in which one on-chip lens 52e-1-1 is arranged on four 2 × 2 pixels R arranged in the upper left of Fig. 19.

[0144] <Arrangement of On-Chip Lenses at Different Heights> As shown in Fig. 22, a configuration in which on-chip lenses 52 at different heights are arranged may be used. In Fig. 22, the two pixels on the left side are pixels R, and the two pixels on the right side are pixels G. Compared to the height of the on-chip lens 52 arranged in pixel R, the height of the on-chip lens 52' arranged in pixel G is formed to be higher.

[0145] Although not shown, the on-chip lens 52 disposed in pixel B may be set to the same height as the on-chip lens 52 disposed in pixel R, or may be set to the same height as the on-chip lens 52' disposed in pixel G. It is also possible to configure the on-chip lenses 52 disposed in pixel R, pixel B, and pixel G to have different heights.

[0146] On-chip lenses 52 of the same height are arranged for pixels of the same color, and on-chip lenses 52 of different heights are arranged for pixels of different colors.

[0147] In this way, by changing the height of the on-chip lens 52, it is possible to change the focus for each color, and to achieve a desired focus for each color. Furthermore, by arranging on-chip lenses 52 of the same height for the same color, the sensitivity for the same color becomes the same, and it is possible to suppress the occurrence of sensitivity differences.

[0148] Such a configuration in which the height of the on-chip lenses 52 is changed for each color can be applied to any of the above-described embodiments. By arranging on-chip lenses 52 with different heights in the pixel array unit 3, the periodicity can be further weakened, and the occurrence of flare and ghosting can be suppressed.

[0149] <Regarding Arrangement of CF Partition Ribs> Fig. 23 is a diagram for explaining the arrangement of the CF partition ribs 49. In Fig. 23, the two pixels on the left side are R pixels, and the two pixels on the right side are G pixels.

[0150] 23A shows a case where a CF partition 49 is provided for each pixel 2. A CF partition 49-1 is provided between the pixel 2-1-1 and the pixel 2 (not shown) located on the left side, a CF partition 49-2 is provided between the pixel 2-1-1 and the pixel 2-2-1, a CF partition 49-4 is provided between the pixel 2-2-1 and the pixel 2-3-1, a CF partition 49-4 is provided between the pixel 2-3-1 and the pixel 2-4-1, and a CF partition 49-5 is provided between the pixel 2-4-1 and the pixel 2 (not shown) located on the right side.

[0151] 23B shows a case where a CF partition 49 is not provided between same-color pixels 2, and a CF partition 49 is provided between different-color pixels 2. A CF partition 49-11 is provided between pixel 2-1-1 and the pixel 2 (not shown) located on the left side because they are different colors, but a CF partition 49 is not provided between pixels 2-1-1 and 2-2-1 because they are the same color. A CF partition 49-12 is provided between pixels 2-2-1 and 2-3-1 because they are different colors, but a CF partition 49 is not provided between pixels 2-3-1 and 2-4-1 because they are the same color. A CF partition 49-13 is provided between pixel 2-4-1 and the pixel 2 (not shown) located on the right side because they are different colors.

[0152] The CF partition 49 can be used as a waveguide, and can enhance the effect of suppressing the occurrence of a difference in sensitivity between the same colors by the waveguide effect.

[0153] According to the present technology, it is possible to suppress the occurrence of flare and ghosting, and to suppress the occurrence of a difference in sensitivity at least between pixels 2 of the same color.

[0154] <Application Examples to Electronic Devices> The present technology is applicable to general electronic devices that use an imaging element in an image capture unit (photoelectric conversion unit), such as imaging devices such as digital still cameras and video cameras, portable terminal devices with imaging functions, copiers that use an imaging element in an image reading unit, etc. The imaging element may be formed as a single chip, or may be in the form of a module having an imaging function in which the imaging unit and a signal processing unit or an optical system are packaged together.

[0155] FIG. 24 is a block diagram showing an example of the configuration of an imaging device as an electronic device to which the present technology is applied.

[0156] 24 includes an optical unit 1001 including a lens group and the like, an image sensor (image capturing device) 1002, and a DSP (Digital Signal Processor) circuit 1003, which is a camera signal processing circuit. The image sensor 1000 also includes a frame memory 1004, a display unit 1005, a recording unit 1006, an operation unit 1007, and a power supply unit 1008. The DSP circuit 1003, frame memory 1004, display unit 1005, recording unit 1006, operation unit 1007, and power supply unit 1008 are interconnected via a bus line 1009.

[0157] The optical unit 1001 takes in incident light (image light) from a subject and forms an image on the imaging surface of the image sensor 1002. The image sensor 1002 converts the amount of incident light formed on the imaging surface by the optical unit 1001 into an electrical signal on a pixel-by-pixel basis and outputs the signal as a pixel signal.

[0158] The display unit 1005 is configured with a thin display such as an LCD (Liquid Crystal Display) or an organic EL (Electro Luminescence) display, and displays moving images or still images captured by the imaging element 1002. The recording unit 1006 records the moving images or still images captured by the imaging element 1002 on a recording medium such as a hard disk or semiconductor memory.

[0159] An operation unit 1007, under user operation, issues operation commands for various functions of the image sensor 1000. A power supply unit 1008 appropriately supplies various types of power to the DSP circuit 1003, frame memory 1004, display unit 1005, recording unit 1006, and operation unit 1007 as operating power sources.

[0160] The imaging device 1 described above can be applied to a part of the imaging device shown in FIG.

[0161] <Application Example to Endoscopic Surgery System> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0162] FIG. 25 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0163] 25 shows an operator (doctor) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0164] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the example shown, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible scope having a flexible lens barrel.

[0165] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens toward an object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0166] An optical system and an image sensor are provided inside the camera head 11102, and light reflected from the object of observation (observation light) is collected onto the image sensor by the optical system. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. The image signal is sent to a camera control unit (CCU) 11201 as RAW data.

[0167] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102 and performs various types of image processing on the image signal, such as development processing (demosaic processing), to display an image based on the image signal.

[0168] Under the control of the CCU 11201, the display device 11202 displays an image based on an image signal that has been subjected to image processing by the CCU 11201.

[0169] The light source device 11203 is composed of a light source such as an LED (light emitting diode), and supplies irradiation light to the endoscope 11100 when photographing the surgical site, etc.

[0170] The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiation light, magnification, focal length, etc.) of the endoscope 11100.

[0171] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 inflates the body cavity of the patient 11132 through the insufflation tube 11111 in order to ensure a clear field of view for the endoscope 11100 and a working space for the surgeon. The recorder 11207 is a device capable of recording various types of information related to the surgery. The printer 11208 is a device capable of printing various types of information related to the surgery in various formats such as text, images, or graphs.

[0172] The light source device 11203, which supplies illumination light to the endoscope 11100 when photographing the surgical site, can be configured from a white light source, such as an LED, a laser light source, or a combination of these. When the white light source is configured from a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, allowing the light source device 11203 to adjust the white balance of the captured image. In this case, it is also possible to time-share images corresponding to each RGB by irradiating the object of observation with laser light from each RGB laser light source and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, color images can be obtained without providing a color filter to the image sensor.

[0173] Furthermore, the light source device 11203 may be controlled to change the intensity of light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and combining the images, it is possible to generate an image with a high dynamic range that is free from so-called blocked-up shadows and blown-out highlights.

[0174] The light source device 11203 may also be configured to supply light in a predetermined wavelength band corresponding to special light observation. Special light observation, for example, utilizes the wavelength dependence of light absorption in body tissues to irradiate light with a narrower band than the light irradiated during normal observation (i.e., white light), thereby capturing high-contrast images of specific tissues, such as blood vessels on the surface of mucous membranes, known as narrow-band imaging. Alternatively, special light observation may involve fluorescence observation, in which images are obtained using fluorescence generated by irradiating excitation light. Fluorescence observation may involve irradiating excitation light onto body tissues and observing the fluorescence from the tissue (autofluorescence observation), or by locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0175] FIG. 26 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.

[0176] The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so that they can communicate with each other.

[0177] The lens unit 11401 is an optical system provided at the connection portion with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses including a zoom lens and a focus lens.

[0178] The imaging unit 11402 may include one imaging element (a so-called single-chip type) or multiple imaging elements (a so-called multi-chip type). When the imaging unit 11402 is configured as a multi-chip type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining these signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to a 3D (dimensional) display. The 3D display allows the surgeon 11131 to more accurately grasp the depth of the biological tissue at the surgical site. Note that when the imaging unit 11402 is configured as a multi-chip type, multiple lens units 11401 may be provided corresponding to each imaging element.

[0179] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately after the objective lens.

[0180] The driving unit 11403 is configured by an actuator, and moves the zoom lens and focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted appropriately.

[0181] The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0182] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of imaging, and / or information specifying the magnification and focus of the captured image.

[0183] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with a so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0184] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404 .

[0185] The communication unit 11411 is configured by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0186] Furthermore, the communication unit 11411 transmits to the camera head 11102 a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

[0187] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data transmitted from the camera head 11102 .

[0188] The control unit 11413 performs various controls related to the imaging of the surgical site, etc. by the endoscope 11100 and the display of the captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0189] Furthermore, the control unit 11413 displays the captured image showing the surgical site, etc., on the display device 11202 based on the image signal subjected to image processing by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical tools such as forceps, specific biological parts, bleeding, mist generated when using the energy treatment tool 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When displaying the captured image on the display device 11202, the control unit 11413 may use the recognition results to superimpose various surgical support information on the image of the surgical site. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0190] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for electrical signal communication, an optical fiber for optical communication, or a composite cable of these.

[0191] In the illustrated example, communication is performed wired using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0192] <Application to a Mobile Body> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0193] FIG. 27 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0194] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 27, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (Interface) 12053.

[0195] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0196] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0197] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0198] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0199] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0200] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0201] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0202] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0203] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In the example of Fig. 27, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0204] FIG. 28 is a diagram showing an example of the installation position of the imaging unit 12031.

[0205] In FIG. 28, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0206] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0207] 28 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0208] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0209] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation.

[0210] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0211] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. The pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0212] In this specification, a system refers to an entire device made up of multiple devices.

[0213] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0214] It should be noted that the embodiments of the present technology are not limited to the above-described embodiments, and various modifications are possible within the scope of the present technology.

[0215] The present technology can also be configured as follows. (1) A photodetector including a photoelectric conversion unit, a light collecting unit that collects light onto the photoelectric conversion unit, a pixel having the light collecting unit, and a pixel array unit in which the pixels are arranged in a matrix, wherein the light collecting unit has a shape that allows axes of different lengths to be set, and adjacent light collecting units have the axes located in different directions. (2) The photodetector according to (1), wherein the light collecting units are elliptical in shape, and the major axes of adjacent light collecting units are located in different directions. (3) The photodetector according to (1), wherein the light collecting units are rectangular in shape, and the long sides of adjacent light collecting units are located in different directions. (4) The photodetector according to (2), wherein the major axes are located in a diagonal direction or a vertical or horizontal direction with respect to the pixel. (5) The photodetector according to (3), wherein the long sides are located in a diagonal direction or a vertical or horizontal direction with respect to the pixel. (6) The photodetector according to any one of (1) to (5), further comprising a color filter between the light collecting portion and the photoelectric conversion portion, wherein the light collecting portions formed with approximately the same size are arranged in the pixels having the color filters of the same color. (7) The photodetector according to (6), wherein color filters of the same color are arranged in four pixels of a 2x2 array. (8) The photodetector according to (6), wherein color filters of the same color are arranged in sixteen pixels of a 4x4 array. (9) The photodetector according to any one of (6) to (8), wherein the first light collecting portion and the second light collecting portion have different sizes and are arranged in the pixel array portion, wherein the first light collecting portion or the second light collecting portion is arranged in the pixels having the color filters of the same color. (10) The photodetector according to (9), wherein the first light collecting portion is elliptical and the second light collecting portion is circular. (11) The photodetector according to (9) or (10), wherein the second light-collecting portion is formed in a circular shape across four pixels of the same color (2 × 2), (12) The photodetector according to any one of (9) to (11), wherein the second light-collecting portion is formed in an elliptical shape across two pixels of the same color (2 × 2).(13) The photodetector according to any one of (9) to (12), wherein the first light-collecting portion and the second light-collecting portion have different heights. (14) The photodetector according to any one of (6) to (13), wherein the color filter includes a wall provided perpendicular to a light incident surface, and the wall is arranged between different colors. (15) An electronic device comprising: a photodetector including: a photoelectric conversion portion; a light-collecting portion that collects light on the photoelectric conversion portion; pixels having the light-collecting portion; and a pixel array portion in which the pixels are arranged in a matrix, wherein the light-collecting portion has a shape that allows axes of different lengths to be set, and wherein adjacent light-collecting portions have the axes positioned in different directions; and a processing portion that processes signals from the photodetector.

[0216] REFERENCE SIGNS LIST 1 imaging device, 2 pixel, 3 pixel array section, 4 vertical drive circuit, 5 column signal processing circuit, 6 horizontal drive circuit, 7 output circuit, 8 control circuit, 9 vertical signal line, 10 pixel drive wiring, 11 horizontal signal line, 12 semiconductor substrate, 13 input / output terminal, 41 semiconductor region, 42 photodiode, 46 transparent insulating film, 49 CF partition wall, 51 color filter, 52 on-chip lens, 54 inter-pixel separation section, 55 insulator, 61 anti-reflection film, 62 hafnium oxide film, 63 aluminum oxide film, 64 silicon oxide film, 81 seal glass, 82 infrared cut filter

Claims

a photoelectric conversion unit; a light collecting unit that collects light on the photoelectric conversion unit; a pixel having the light collecting portion; a pixel array section in which the pixels are arranged in a matrix; Equipped with The light-collecting portions have shapes that allow axes of different lengths to be set, and the adjacent light-collecting portions have the axes positioned in different directions. Light detection device. 　 The shape of the light collecting portion is elliptical, The directions in which the major axes of the adjacent light-collecting portions are positioned are different The photodetector device according to claim 1 . 　 The shape of the light collecting portion is rectangular, The long sides of the adjacent light-collecting portions are positioned in different directions. The photodetector device according to claim 1 . 　 The long axis is positioned diagonally or vertically or horizontally relative to the pixel. The photodetector device according to claim 2 . 　 The long side is positioned diagonally or vertically or horizontally relative to the pixel. The photodetector according to claim 3 . 　 a color filter is further provided between the light collecting unit and the photoelectric conversion unit; The light collecting portions formed to have approximately the same size are arranged in the pixels having the same color filter. The photodetector device according to claim 1 . 　 The color filters of the same color are arranged in four 2×2 pixels.

7. The photodetector according to claim 6. 　 The color filters of the same color are arranged in 16 pixels of 4×4.

7. The photodetector according to claim 6. 　 a first light-collecting portion and a second light-collecting portion having different sizes are disposed in the pixel array portion; The first light collecting portion or the second light collecting portion is disposed in the pixel having the color filter of the same color.

7. The photodetector according to claim 6. 　 The first light-collecting portion is elliptical, and the second light-collecting portion is circular. The photodetector device according to claim 9 . 　 The second light collecting portion has a circular shape in which the color filter is formed across four pixels of the same color (2×2). The photodetector device according to claim 9 . 　 The second light collecting portion is formed in an elliptical shape spanning two pixels having the same color color filter and adjacent to each other in the vertical or horizontal direction. The photodetector device according to claim 9 . 　 The first light collecting portion and the second light collecting portion have different heights. The photodetector device according to claim 9 . 　 the color filter includes a wall provided in a direction perpendicular to a light incident surface, The wall is arranged between different colors 7. The photodetector according to claim 6. a photoelectric conversion unit; a light collecting unit that collects light on the photoelectric conversion unit; a pixel having the light collecting portion; a pixel array section in which the pixels are arranged in a matrix; Equipped with The light-collecting portions have shapes that allow axes of different lengths to be set, and the adjacent light-collecting portions have the axes positioned in different directions. a photodetector; a processing unit that processes a signal from the photodetector; An electronic device comprising:

Images