Clock device and electronic device

Abstract

A clock device and an electronic device, relating to the technical field of electronic devices, aiming to improve the performance stability of the clock device. The clock device comprises a substrate, a crystal resonator, a temperature sensor, a plastic encapsulation body, and a first electrical connector. The crystal resonator and the temperature sensor are disposed on two surfaces of the substrate, and the temperature sensor is electrically connected to the crystal resonator. The plastic encapsulation body covers at least a portion of a second surface. The first electrical connector penetrates the plastic encapsulation body, and one end of the first electrical connector is electrically connected to the temperature sensor. In this way, the plastic encapsulation body can block heat transferred to the crystal resonator through the substrate, thereby improving the temperature resistance of the clock device, effectively solving the problem of output frequency jumps in the clock device caused by temperature variations.

Description

Clock device and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411247602.7, filed on September 5, 2024, and entitled "Clock device and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of electronic devices, in particular to a clock device and an electronic device. BACKGROUND

[0003] A clock device, also known as a clock oscillator, is an important device in an electronic system, which provides a necessary clock frequency for the electronic system, so that the electronic system can perform various operations at the clock frequency and work normally. A crystal resonator is an important component of the clock device. The crystal resonator, i.e., a temperature compensated crystal oscillator (TCXO), is a quartz crystal oscillator that reduces the amount of change in the oscillation frequency caused by changes in the surrounding temperature through an additional temperature compensation circuit. The crystal resonator has the advantages of low power consumption, small size, strong environmental adaptability, and the like, and thus has been widely applied.

[0004] Stable performance is one of the important indicators of the crystal resonator. A crystal resonator with unstable performance can cause the output frequency of the crystal resonator to jump, resulting in degradation of the performance of the entire electronic system. SUMMARY

[0005] Embodiments of the present application provide a clock device and an electronic device, which aims to improve the performance stability of the clock device.

[0006] In a first aspect, an embodiment of the present application provides a clock device. The clock device includes a substrate, a crystal resonator, a temperature sensor, a plastic package, and a first electrical connector. The substrate includes opposite first and second surfaces. The crystal resonator is disposed on the first surface. The temperature sensor is disposed on the second surface and electrically connected to the crystal resonator. The plastic package covers at least part of the second surface. The first electrical connector penetrates the plastic package and has one end electrically connected to the temperature sensor.

[0007] Since the first electrical connecting member penetrates through the plastic encapsulation body, and the plastic encapsulation body covers at least part of the second surface. The plastic encapsulation body can block the heat (or cold) from the first electrical connecting member away from the end of the plastic encapsulation body to the substrate. Thus, the heat (or cold) transferred through the substrate to the crystal resonator is blocked, so that the temperature around the crystal resonator is more stable. The temperature performance of the clock device is improved, and the influence of the change of the environmental temperature on the clock device is reduced, effectively solving the problem of the frequency jump of the clock device caused by the temperature change. For example, when the end of the first electrical connecting member away from the plastic encapsulation body is connected to the printed circuit board, the plastic encapsulation body can block the heat (or cold) transferred from the printed circuit board to the crystal resonator through the substrate, thereby reducing the influence of the printed circuit board on the temperature of the crystal resonator and improving the stability of the clock device.

[0008] In combination with the first aspect, in some possible implementation manners, the plastic encapsulation body covers at least part of the second surface opposite to the crystal resonator. Thus, in the process of heat transfer from the part of the second surface opposite to the crystal resonator to the crystal resonator, the heat transfer path from the part of the second surface opposite to the crystal resonator to the crystal resonator is the shortest. The plastic encapsulation body covering at least the part of the second surface opposite to the crystal resonator can block the heat (or cold) transfer in the shortest heat transfer path, further reduce the influence of the printed circuit board on the temperature of the crystal resonator, and improve the stability of the clock device.

[0009] In combination with the first aspect, in some possible implementation manners, the plastic encapsulation body also covers the temperature sensor. In this way, the plastic encapsulation body does not need to avoid the temperature sensor on the second surface, and the process of forming the plastic encapsulation body is relatively simple, and the process cost is low. In addition, the plastic encapsulation body can also block the heat (or cold) from being transferred to the temperature sensor, and reduce the speed of the temperature change detected by the temperature sensor. The plastic encapsulation body has the functions of covering the temperature sensor and improving the temperature performance of the clock device.

[0010] In combination with the first aspect, in some possible implementation manners, the clock device further includes:

[0011] The first wiring layer is arranged on the surface of the plastic encapsulation body away from the substrate; the end of the first electrical connecting member away from the temperature sensor is electrically connected to the first wiring layer; and the vertical projection of the temperature sensor on the second surface overlaps the vertical projection of the first wiring layer on the second surface.

[0012] In this way, in the direction perpendicular to the second surface, the first wiring layer and the temperature sensor overlap. In the direction parallel to the second surface, the first wiring layer and the temperature sensor need less space. In the direction parallel to the second surface, the plastic encapsulation body with a smaller size can embed the temperature sensor, and also support the first wiring layer, which is conducive to the miniaturization of the plastic encapsulation body, and thus is conducive to the miniaturization of the clock device.

[0013] With reference to the first aspect, in some possible implementation, the plastic package further covers part of the first surface. In this way, part of the substrate and the temperature sensor are located in the plastic package, which can increase the connection strength of the substrate and the temperature sensor. In addition, the plastic package can also block heat from other areas from being transmitted to the first surface covered by the plastic package through the plastic package, effectively blocking heat from being transmitted to the crystal resonator from the heat transfer path, reducing the influence of external temperature changes on the crystal resonator, and making the temperature around the crystal resonator more balanced.

[0014] With reference to the first aspect, in some possible implementation, the thermal conductivity of the plastic package is less than 1 W / m·K.

[0015] With reference to the first aspect, in some possible implementation, the material of the plastic package includes epoxy resin. In this way, the thermal conductivity of the epoxy resin is small, the thermal conductivity of the epoxy resin is 0.2 W / m·K, the plastic package with the material of the epoxy resin has better heat insulation performance, and the problem of frequency jump of the clock device output caused by temperature change is effectively improved.

[0016] With reference to the first aspect, in some possible implementation, the clock device further includes a second electrical connector and a second wiring layer; the second electrical connector penetrates the substrate, the second wiring layer is arranged on the second surface, and one end of the first electrical connector is electrically connected with the second wiring layer.

[0017] The electrical connection between the temperature sensor and the crystal resonator includes that the temperature sensor is electrically connected with the second electrical connector through the second wiring layer, the second electrical connector is electrically connected with the crystal resonator, and the vertical projection of the second electrical connector on the second surface does not overlap with the vertical projection of the first electrical connector on the second surface.

[0018] In this way, the temperature sensor and the crystal resonator are electrically interconnected through the second electrical connector and the second wiring layer. In addition, the area where the second electrical connector contacts the second wiring layer and the area where the first electrical connector contacts the second wiring layer are spaced apart. Direct contact of the second electrical connector and the first electrical connector with the same area of the second wiring layer is avoided to prevent the structural strength from being reduced.

[0019] With reference to the first aspect, in some possible implementation, the clock device further includes a glue layer; the substrate and the temperature sensor have a channel therebetween, and the glue layer fills the entire channel. In this way, the channel between the substrate and the temperature sensor has no or small porosity, and the small porosity or no porosity of the channel is conducive to improving the heat insulation performance of the glue layer, reducing heat transfer from the temperature sensor to the substrate through the glue layer, and making the temperature around the crystal resonator more balanced.

[0020] In some possible implementation manners of the first aspect, the temperature sensor comprises a bare chip or a thermistor. In this way, the plastic package embeds the bare chip, so as to isolate heat transfer to the bare chip, and facilitate the stability of the working temperature of the bare chip. The plastic package embeds the thermistor, and facilitates the stability of the working temperature of the thermistor.

[0021] In some possible implementation manners of the first aspect, the material of the substrate comprises ceramic or glass. In this way, the ceramic has relatively large strength, and can provide relatively strong support for the crystal resonator, the temperature sensor and the plastic package. In addition, the ceramic has good heat insulation performance, and can block heat transmission from the second surface to the first surface. The glass can provide relatively strong support for the crystal resonator, the temperature sensor and the plastic package, so that the structural strength of the clock device is better.

[0022] In some possible implementation manners of the first aspect, the clock device further comprises a cover body connected with the first surface, the cover body and the substrate form a containing cavity, and the crystal resonator is located in the containing cavity. In this way, the cover body can block water vapor or dust, avoid the exposure of the crystal resonator, and affect the performance of the crystal resonator, so as to avoid affecting the frequency output by the crystal resonator.

[0023] In the second aspect, the embodiments of the present application provide an electronic device. The electronic device comprises a printed circuit board and any one of the clock devices provided in the first aspect, and an end of the first electrical connector away from the temperature sensor is electrically connected with the printed circuit board. Since the performance of the clock device is stable, the frequency output is stable. Therefore, the performance of the electronic device comprising the clock device is stable.

[0024] The beneficial effects of the implementation manners of the second aspect can be referred to the description of the optional implementation manners of the first aspect, which will not be described herein. On the basis of the implementation manners of the above aspects, the embodiments of the present application can be further combined to provide more implementation manners. BRIEF DESCRIPTION OF DRAWINGS

[0025] FIG. 1 is a structural schematic diagram of an electronic device.

[0026] FIG. 2 is a structural schematic diagram of a printed circuit board and a clock device.

[0027] FIG. 3 is a structural schematic diagram of a clock device provided by the embodiments of the present application.

[0028] FIG. 4 is a sectional schematic diagram of A-A in FIG. 3.

[0029] FIG. 5 is a structural schematic diagram of a second wiring layer, a second electrical connector, a first electrical connector and a substrate provided by the embodiments of the present application.

[0030] Fig. 6 is a schematic diagram of an exploded structure of a clock device according to an embodiment of the present application.

[0031] Fig. 7 is a schematic diagram of a structure of a substrate and a temperature sensor according to an embodiment of the present application.

[0032] Fig. 8 is a schematic diagram of a connection relationship between a plastic package and a substrate according to an embodiment of the present application.

[0033] Fig. 9 is a flowchart of a manufacturing process of a clock device according to an embodiment of the present application.

[0034] Fig. 10a is a schematic diagram of a structure after S1 in Fig. 9 is performed.

[0035] Fig. 10b is a schematic diagram of a structure after S2 in Fig. 9 is performed.

[0036] Fig. 10c is a schematic diagram of a structure after S3 in Fig. 9 is performed.

[0037] Fig. 10d is a schematic diagram of a structure after S4 in Fig. 9 is performed.

[0038] Fig. 10e is a schematic diagram of a structure after S5 in Fig. 9 is performed.

[0039] In the drawings: 10 - electronic device; 11 - cover plate; 12 - display screen; 13 - printed circuit board; 14 - middle frame; 15 - back cover; 100 - clock device; 110 - substrate; 111 - first surface; 112 - second surface; 120 - crystal resonator; 130 - temperature sensor; 140 - plastic package; 150 - first electrical connecting member; 170 - second electrical connecting member; 160 - cover body; 201 - first wiring layer; 202 - second wiring layer; 203 - third wiring layer; 101 - adhesive layer; 102 - channel; 001 - pad; 161 - accommodating cavity; 113 - third surface. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0041] Hereinafter, the terms "first", "second", and the like are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0042] In addition, in the present application, the orientation terms such as "upper", "lower", etc. are defined relative to the orientation in which the components in the drawings are placed, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can change accordingly according to the change of the orientation in which the components are placed in the drawings.

[0043] The electronic device in the embodiments of the present application can be a mobile phone, a tablet computer, a notebook computer, a smart home, a smart bracelet, a smart watch, a smart helmet, smart glasses, etc. The electronic device can also be a handheld device with a wireless communication function, a computing device, or other processing devices connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile network (PLMN), etc. The embodiments of the present application are not limited thereto.

[0044] FIG. 1 is a structural schematic diagram of an electronic device 10. As shown in FIG. 1, the electronic device 10 can include a cover 11, a display 12, a printed circuit board 13, a middle frame 14, and a rear cover 15. It should be understood that in some embodiments, the cover 11 can be a cover glass, and can also be replaced by a cover made of other materials, such as a super-thin glass material cover, a PET (polyethylene terephthalate) material cover, etc.

[0045] The cover 11 can be arranged close to the display 12, and can be mainly used to protect and prevent dust from the display 12.

[0046] In some embodiments, the display 12 can include an LCD (liquid crystal display), an LED (light emitting diode) display panel, or an OLED (organic light-emitting diode) display panel, etc. The present application is not limited thereto.

[0047] The middle frame 14 mainly plays a role of supporting the whole machine. In FIG. 1, the printed circuit board 13 is arranged between the middle frame 14 and the back cover 15, and it should be understood that, in some embodiments, the printed circuit board 13 can also be arranged between the middle frame 14 and the display screen 12, which is not limited in the present application. The printed circuit board 13 can be made of a flame-resistant material (FR-4) medium plate, a Rogers medium plate, a mixed medium plate of Rogers and FR-4, etc. Here, FR-4 is a code of a flame-resistant material grade, and the Rogers medium plate is a high-frequency plate. The printed circuit board 13 carries electronic components such as radio frequency chips, etc.

[0048] The electronic device 10 can further include a battery (not shown in the figure). The battery can be arranged between the middle frame 14 and the back cover 15, or can be arranged between the middle frame 14 and the display screen 12, which is not limited in the present application. In some embodiments, the printed circuit board 13 is divided into a main board and a sub-board, and the battery can be arranged between the main board and the sub-board, wherein the main board can be arranged between the middle frame 14 and the upper edge of the battery, and the sub-board can be arranged between the middle frame 14 and the lower edge of the battery.

[0049] The back cover 15 can be a back cover made of a conductive material; can also be a back cover made of a non-conductive material, such as a glass back cover, a plastic back cover, etc. non-metal back cover; can also be a back cover made of both conductive material and non-conductive material.

[0050] In some embodiments, the back cover 15 including the conductive material can replace the middle frame 14, and the frame as a whole supports the electronic devices in the whole machine.

[0051] In the embodiments of the present application, the electronic device 10 further includes a clock device 100, and the clock device 100 is connected with the printed circuit board 13. The clock device 100 is used to provide a periodic signal with regular intervals and stability for the electronic device 10, and the electronic device 10 acts as a reference to the periodic signal.

[0052] Wherein, the poor performance of the clock device 100 can cause the signal provided by the clock device 100 to jump. The clock device 100 provided in the embodiments of the present application has better temperature resistance, which improves the problem of signal jump caused by temperature change of the clock device 100.

[0053] FIG. 2 is a structural schematic diagram of the printed circuit board 13 and the clock device 100. Please refer to FIG. 2, the printed circuit board 13 and the clock device 100 are connected. The printed circuit board 13 is provided with a solder pad 001, and the clock device 100 is electrically connected with the solder pad 001. The electrical signal of the printed circuit board 13 is transmitted to the clock device 100 through the solder pad 001, and vice versa, the electrical signal of the clock device 100 is transmitted to the printed circuit board 13 through the solder pad 001.

[0054] FIG. 3 is a structural schematic diagram of a clock device 100 according to an embodiment of the present application. FIG. 4 is a sectional schematic diagram of A-A in FIG. 3. Referring to FIG. 4, the clock device 100 includes a substrate 110, a crystal resonator 120, a temperature sensor 130, a plastic package 140, and a first electrical connecting member 150.

[0055] The substrate 110 includes a first surface 111 and a second surface 112 opposite to each other. The crystal resonator 120 is disposed on the first surface 111, and the temperature sensor 130 is disposed on the second surface 112. The crystal resonator 120 and the temperature sensor 130 are electrically connected. The plastic package 140 covers at least a part of the second surface 112. The first electrical connecting member 150 penetrates the plastic package 140, and one end of the first electrical connecting member 150 is electrically connected to the temperature sensor 130.

[0056] Compared with a ceramic package, the plastic package 140 has a lower thermal conductivity. The plastic package 140 can block heat (or cold) from passing through the plastic package 140 to the substrate 110, thereby blocking the heat (or cold) from passing through the substrate 110 to the crystal resonator 120. The temperature resistance of the clock device 100 is improved, the influence of the change of the ambient temperature on the clock device 100 is reduced, and the problem of the frequency jump of the clock device 100 caused by the temperature change is effectively solved.

[0057] Exemplarily, when the one end of the first electrical connecting member 150 away from the temperature sensor 130 is electrically connected to the printed circuit board 13 (as shown in FIG. 2), the plastic package 140 can block the influence of the heat (or cold) change of the printed circuit board 13 on the crystal resonator 120, so that the temperature around the crystal resonator 120 is more stable.

[0058] In the above, the plastic package 140 covering at least a part of the second surface 112 includes that the plastic package 140 covers the entire second surface 112. Alternatively, the plastic package 140 covers a part of the second surface 112. The plastic package 140 can be directly in contact with the second surface 112, or other components (for example, the second wiring layer 202 described below) can be further disposed between the plastic package 140 and the second surface 112.

[0059] In some embodiments of the present application, the plastic encapsulation 140 covers at least the portion of the second surface 112 opposite to the crystal resonator 120. In other words, the vertical projection of the plastic encapsulation 140 on the second surface 112 covers the vertical projection of the crystal resonator 120 on the second surface 112. The portion of the second surface 112 opposite to the crystal resonator 120 has the shortest heat (or cold) transfer path to the crystal resonator 120. By covering at least the portion of the second surface 112 opposite to the crystal resonator 120, the plastic encapsulation 140 blocks the heat (or cold) transfer in the shortest path, which further helps the plastic encapsulation 140 to block the heat (or cold) transfer to the crystal resonator 120, and further improves the stability of the clock device. The aforementioned "vertical projection of the plastic encapsulation 140 on the second surface 112" refers to the figure enclosed by the outer contour of the projection of the plastic encapsulation 140 on the second surface 112 in the direction perpendicular to the second surface 112. The same applies to the description of the vertical projection hereinafter.

[0060] It can be understood that, in some embodiments of the present application, the plastic encapsulation 140 can not cover the portion of the second surface 112 opposite to the crystal resonator 120. In other words, the vertical projection of the plastic encapsulation 140 on the second surface 112 can not overlap with the vertical projection of the crystal resonator 120 on the second surface 112.

[0061] In FIG. 4, the plastic encapsulation 140 also covers the temperature sensor 130. In this way, the plastic encapsulation 140 does not need to avoid the temperature sensor 130 on the second surface 112. In the process of forming the plastic encapsulation 140, the plastic encapsulation 140 can cover the second surface 112 and the temperature sensor 130 on the second surface 112, which is simple in manufacturing process and low in manufacturing cost.

[0062] In addition, the plastic encapsulation 140 can also block the heat (or cold) transfer to the temperature sensor 130, which reduces the speed of temperature change detected by the temperature sensor 130. The plastic encapsulation 140 has the dual functions of covering the temperature sensor 130 and improving the temperature resistance of the clock device 100. The plastic encapsulation 140 has multiple functions.

[0063] In some embodiments of the present application, the temperature sensor 130 includes an IC chip (integrated circuit) on which a sensor capable of detecting temperature and converting it into an available output signal is integrated. The IC chip can be regarded as a bare chip. The plastic encapsulation 140 embeds the IC chip, which can isolate the heat transfer to the IC chip and help stabilize the working temperature of the IC chip.

[0064] In some embodiments of the present application, the temperature sensor 130 includes a negative temperature coefficient (NTC) thermistor. The plastic package 140 embeds the NTC thermistor, which is conducive to stabilizing the working temperature of the NTC thermistor.

[0065] In some embodiments of the present application, the thermal conductivity of the plastic package 140 is less than 1 W / m·K (Watt per meter Kelvin), and the lower thermal conductivity makes the plastic package 140 have excellent heat insulation performance. For example, the thermal conductivity of the plastic package 140 can be 0.1 W / m·K, 0.3 W / m·K, 0.4 W / m·K, 0.5 W / m·K, 0.6 W / m·K, 0.7 W / m·K, 0.9 W / m·K, or 1 W / m·K, etc.

[0066] In some embodiments of the present application, the material of the plastic package 140 is epoxy resin. The thermal conductivity of the epoxy resin is small, and the thermal conductivity of the epoxy resin is 0.2 W / m·K. The plastic package 140 with the material of the epoxy resin has better heat insulation performance, which effectively improves the problem of frequency jump of the clock device 100 caused by temperature change.

[0067] Embodiments of the present application do not limit the material of the substrate 110. For example, the material of the substrate 110 includes ceramic, which has high strength and can provide strong support for the crystal resonator 120, the temperature sensor 130, and the plastic package 140. In addition, the ceramic has good heat insulation performance and can block the heat transmission from the second surface 112 to the first surface 111. In some embodiments, the material of the substrate 110 includes glass, which can provide strong support for the crystal resonator 120, the temperature sensor 130, and the plastic package 140, so that the structural strength of the clock device 100 is better.

[0068] Embodiments of the present application do not limit the shape of the substrate 110. In the example of FIG. 4, the substrate 110 is a square sheet structure. In other embodiments, the substrate 110 can be a circular or elliptical sheet structure, or the substrate 110 can be a special-shaped structure.

[0069] Embodiments of the present application do not limit the thickness of the crystal resonator 120. The thickness of the crystal resonator 120 is related to the fundamental frequency, which can also be called the base frequency or the output frequency. The higher the base frequency, the thinner the wafer thickness. For example, the wafer thickness of the base frequency of 156.25 MHz is about 11 μm, the wafer thickness of the base frequency of 285 MHz is about 7 μm, and the wafer thickness of the base frequency of 500 MHz is about 3 μm.

[0070] In the embodiments of the present application, the connection between the crystal resonator 120 and the first surface 111 can be, for example, bonding, clamping or welding, and the present application is not limited in this regard.

[0071] In some embodiments of the present application, the clock device 100 can further include a cover 160. The cover 160 is connected to the first surface 111. The cover 160 and the substrate 110 enclose a receiving cavity 161, and the crystal resonator 120 is located in the receiving cavity 161. The cover 160 can block water vapor or dust, so as to avoid the crystal resonator 120 being exposed and affecting the performance of the crystal resonator 120, thereby avoiding affecting the frequency output by the crystal resonator 120.

[0072] For example, the material of the cover 160 can be ceramic. The ceramic has high strength, so that the receiving cavity 161 enclosed by the cover 160 and the substrate 110 is more stable. For example, the cover 160 and the substrate 110 can be connected by a welding layer or a glue layer.

[0073] In some embodiments, the receiving cavity 161 is a sealed cavity. In other words, the cover 160 and the substrate 110 have good air tightness, so as to avoid dust or water vapor entering the receiving cavity 161 and affecting the performance of the crystal resonator 120.

[0074] In the embodiments of the present application, the material of the first electrical connecting member 150 is conductive material, for example, which can include gold, copper, aluminum, stainless steel, brass and alloys thereof.

[0075] The present application is not limited in the number of the first electrical connecting member 150. For example, the number of the first electrical connecting member 150 can be one, two, three or more.

[0076] As described above in FIG. 2, the clock device 100 is electrically connected to the printed circuit board 13. In this case, the end of the first electrical connecting member 150 away from the temperature sensor 130 is electrically connected to the printed circuit board 13.

[0077] As shown in FIG. 4, the clock device 100 can further include a first wiring layer 201, which is arranged on the surface of the plastic package 140 away from the substrate 110. The end of the first electrical connecting member 150 away from the temperature sensor 130 is electrically connected to the first wiring layer 201. The vertical projection of the temperature sensor 130 on the second surface 112 overlaps the vertical projection of the first wiring layer 201 on the second surface 112.

[0078] Thus, the first wiring layer 201 and the temperature sensor 130 overlap in the direction perpendicular to the second surface 112. In the direction parallel to the second surface 112, the first wiring layer 201 and the temperature sensor 130 need less space. In the direction parallel to the second surface 112, the plastic package 140 of smaller size can cover the temperature sensor 130, and meanwhile support the first wiring layer 201, which is beneficial to miniaturization of the plastic package 140, and thus beneficial to miniaturization of the clock device 100.

[0079] In some embodiments of the present application, the vertical projection of the temperature sensor 130 on the second surface 112 and the vertical projection of the first wiring layer 201 on the second surface 112 can not overlap.

[0080] In embodiments of the present application, the material of the first wiring layer 201 is a conductive material, which can include copper, aluminum, stainless steel, brass, and alloys thereof, for example.

[0081] In embodiments in which the clock device 100 includes the first wiring layer 201, the first wiring layer 201 and the pad 001 (shown in FIG. 2) of the printed circuit board 13 (shown in FIG. 2) are electrically connected. In other words, the first electrical connector 150 is electrically connected through the first wiring layer 201 and the pad 001 of the printed circuit board 13. For example, the first wiring layer 201 and the pad 001 can be electrically connected through a solder layer or a conductive adhesive layer.

[0082] As mentioned above, the temperature sensor 130 is electrically connected with the crystal resonator 120. As shown in FIG. 4, the clock device 100 further includes a second electrical connector 170 and a second wiring layer 202. The second electrical connector 170 penetrates the substrate 110, and the second wiring layer 202 is disposed on the second surface 112.

[0083] The temperature sensor 130 described above is electrically connected with the crystal resonator 120, which includes that the temperature sensor 130 is electrically connected with the second electrical connector 170 through the second wiring layer 202. The second electrical connector 170 is electrically connected with the crystal resonator 120. One end of the first electrical connector 150 is electrically connected with the second wiring layer 202. Thus, the temperature sensor 130 and the crystal resonator 120 are electrically connected through the second electrical connector 170 and the second wiring layer 202.

[0084] In addition, the clock device 100 can only be provided with one layer of the second wiring layer 202 and one layer of the plastic package 140, so as to lead the electrical signal of the temperature sensor 130 to the end of the first electrical connector 150 away from the second wiring layer 202, which is simple in manufacturing process and is beneficial to reducing the process cost.

[0085] In addition, compared with the second wiring layer 202 being arranged in the middle of the plastic package 140, the second wiring layer 202 is arranged on the second surface 112, the plastic package 140 is more complete, and the heat insulation effect of the plastic package 140 is better. In addition, the second wiring layer 202 is arranged on the second surface 112, and the temperature sensor 130 is electrically connected to the second wiring layer 202 in a flip chip manner. Compared with a normal chip manner, the flip chip manner can have a larger space to accommodate the plastic package 140, increase the volume of the plastic package 140, and improve the heat insulation effect of the plastic package 140.

[0086] It can be understood that the embodiments of the present application do not limit the number of the second wiring layer 202 and the plastic package 140 to one layer. In some embodiments, if the interconnection circuit of the temperature sensor 130 is complex, multiple layers of the second wiring layer 202 and multiple layers of the plastic package 140 can be arranged. One layer of the plastic package 140 is arranged between two adjacent layers of the second wiring layer 202, and the two adjacent layers of the second wiring layer 202 are electrically connected through a conductive via.

[0087] FIG. 5 is a structural schematic diagram of the second wiring layer 202, the second electrical connecting member 170, the first electrical connecting member 150, and the substrate 110 provided by the embodiments of the present application. Referring to FIG. 5, the vertical projection of the second electrical connecting member 170 on the second surface 112 does not overlap the vertical projection of the first electrical connecting member 150 on the second surface 112. In this way, the second electrical connecting member 170 and the first electrical connecting member 150 do not directly contact the same region of the second wiring layer 202, in other words, the region of the second electrical connecting member 170 contacting the second wiring layer 202 and the region of the first electrical connecting member 150 contacting the second wiring layer 202 are arranged in a spaced manner. Avoiding the direct contact between the second electrical connecting member 170 and the first electrical connecting member 150 and the same region of the second wiring layer 202 leads to a decrease in structural strength, thereby improving the structural strength of the entire device.

[0088] The material of the second electrical connecting member 170 is described above in the description of the first electrical connecting member 150, and the material of the second wiring layer 202 is described above in the description of the first wiring layer 201, which will not be described herein again.

[0089] In the embodiments of the present application, the number of the second electrical connecting member 170 can be one, two, three, or more, and the number of the first electrical connecting member 150 can be one, two, three, or more. In the embodiments in which the number of the second electrical connecting member 170 is two or more, the vertical projection of each second electrical connecting member 170 on the second surface 112 does not overlap the vertical projection of each first electrical connecting member 150 on the second surface 112, further improving the structural strength of the entire device.

[0090] FIG. 6 is an exploded structural diagram of the clock device 100 according to an embodiment of the present application. Referring to FIG. 6, the clock device 100 can further include a third wiring layer 203 disposed on the first surface 111. One end of the second electrical connecting member 170 is electrically connected to the third wiring layer 203, and the other end of the second electrical connecting member 170 is electrically connected to the second wiring layer 202.

[0091] Exemplarily, the third wiring layer 203 and the clock device 100 can be connected by a solder layer or a conductive adhesive layer, for example. The third wiring layer 203 is disposed in the accommodating cavity 161 (as shown in FIG. 4).

[0092] In FIG. 6, only the positional relationship between the third wiring layer 203, the second wiring layer 202, the first wiring layer 201 and other components is shown for example, and the shape of the third wiring layer 203, the second wiring layer 202 and the first wiring layer 201 is not limited to that shown in FIG. 6.

[0093] FIG. 7 is a structural diagram of the substrate 110 and the temperature sensor 130 according to an embodiment of the present application. Referring to FIG. 7, in some embodiments of the present application, the clock device 100 further includes an adhesive layer 101. The substrate 110 and the temperature sensor 130 have a channel 102 therebetween, and the adhesive layer 101 fills the entire channel 102. In this way, the channel 102 between the substrate 110 and the temperature sensor 130 has no porosity, or has small porosity, for example, more than 50% of the pores have a pore diameter less than 10 μm. The connection strength between the substrate 110 and the temperature sensor 130 is high, in addition, the gas (for example, air) in the pores can cause the thermal conductivity of the adhesive layer 101 to be high, reducing the heat insulation performance of the adhesive layer 101. The porosity of the channel 102 is small or non-existent, which is conducive to improving the heat insulation performance of the adhesive layer 101, reducing the heat transfer from the temperature sensor 130 to the substrate 110 through the adhesive layer 101, and making the temperature around the crystal resonator 120 more uniform.

[0094] It can be understood that, in some embodiments of the present application, the pore diameter of the pores in the channel 102 can be greater than or equal to 10 μm.

[0095] The plastic package 140 shown in FIG. 3 is located on one side of the substrate 110, and the plastic package 140 is connected to the second surface 112 of the substrate 110. The first surface 111 of the substrate 110 is exposed outside the plastic package 140.

[0096] FIG. 8 is a diagram of a connection relationship between the plastic package 140 and the substrate 110 according to an embodiment of the present application. Referring to FIG. 8, the plastic package 140 further covers the area of the first surface 111 that is not covered by the cover 160. In this way, a part of the substrate 110 and the temperature sensor 130 are both located in the plastic package 140, which can increase the connection strength between the substrate 110 and the temperature sensor 130.

[0097] In addition, the plastic package 140 can also block heat from other areas from being transmitted to the first surface 111 covered by the plastic package 140, effectively blocking the heat from being transmitted to the crystal resonator 120 from the heat transmission path, reducing the influence of external temperature changes on the crystal resonator 120, and making the temperature around the crystal resonator 120 more balanced.

[0098] In the example of FIG. 8, the plastic package 140 also covers the connection position of the substrate 110 and the cover 160. In this way, the plastic package 140 can enhance the connection strength of the substrate 110 and the cover 160, and avoid problems such as cracks between the substrate 110 and the cover 160.

[0099] In some embodiments of the present application, the thickness of the substrate 110 is relatively thick, and the plastic package 140 can not cover the first surface 111. In some embodiments, the plastic package 140 covers the entire side surface of the substrate 110, and in some embodiments, the plastic package 140 covers part of the side surface of the substrate 110. The side surface of the substrate 110 mentioned above refers to the third surface 113 of the substrate 110 connecting the first surface 111 and the second surface 112. In this way, it is beneficial to improve the connection strength of the plastic package 140 and the substrate 110, and increase the structural strength of the clock device.

[0100] The embodiments of the present application do not limit the preparation process of the clock device 100, and the preparation process of the clock device 100 is exemplarily described below in combination with FIG. 9 and FIGS. 10a-10e.

[0101] FIG. 9 is a preparation process flow chart of the clock device 100 provided by the embodiments of the present application. Please refer to FIG. 9, the preparation process of the clock device 100 includes:

[0102] S1. Connect the substrate 110 and the crystal resonator 120 to form the structure shown in FIG. 10a.

[0103] Exemplarily, the substrate 110 and the crystal resonator 120 are connected through a glue layer. The third wiring layer 203 on the crystal resonator 120 and the substrate 110 are connected through a solder layer or a conductive glue layer.

[0104] S2. Connect the cover 160 and the substrate 110 to form the structure shown in FIG. 10b.

[0105] Exemplarily, the cover 160 and the substrate 110 are connected through a solder layer or a glue layer, and the cover 160 and the substrate 110 together enclose a containing cavity. The crystal resonator 120 is located in the containing cavity.

[0106] S3. Connect the temperature sensor 130 and the substrate 110 to form the structure shown in FIG. 10c.

[0107] Exemplarily, the temperature sensor 130 and the substrate 110 are connected by a glue layer, and the temperature sensor 130 and the second wiring layer 202 on the substrate 110 are connected by a solder layer or a conductive glue layer. The temperature sensor 130 and the crystal resonator 120 are electrically connected through the second wiring layer 202 and the third wiring layer 203.

[0108] Exemplarily, the second wiring layer 202 and the third wiring layer 203 are electrically connected through the second electrical connection 170 penetrating the substrate 110.

[0109] S4. Forming a plastic package 140 on the substrate 110, so that the plastic package 140 covers the temperature sensor 130, and forming the structure shown in FIG. 10d.

[0110] Exemplarily, a raw material (for example, epoxy resin) of the plastic package is stacked on the temperature sensor 130, and the raw material of the plastic package is cured to form the plastic package 140.

[0111] S5. Forming a first electrical connection 150 penetrating the plastic package 140, and forming the structure shown in FIG. 10e.

[0112] Exemplarily, a via hole is formed on the plastic package 140, the via hole penetrates the plastic package 140, a conductive paste is filled in the via hole, and the conductive paste is cured to form the first electrical connection 150. One end of the first electrical connection 150 is electrically connected with the second wiring layer 202, so that the electrical signal of the temperature sensor 130 can be output through the second wiring layer 202 and the first electrical connection 150.

[0113] S6. Forming a first wiring layer 201 on the surface of the plastic package 140, and forming the structure shown in FIG. 3.

[0114] Exemplarily, the first wiring layer 201 and the temperature sensor 130 are stacked. The vertical projection of the first wiring layer 201 on the substrate 110 and the vertical projection of the temperature sensor 130 on the substrate 110 overlap. In this way, the first wiring layer 201 and the temperature sensor 130 occupy less space, which is conducive to reducing the volume of the plastic package 140, so as to reduce the volume of the clock device 100.

[0115] In the embodiments of the present application, the preparation process of the clock device 100 can not adopt the order of S1-S6 described above. For example, steps S3-S6 can be performed before steps S1 and S2.

[0116] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0117] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A clock device, characterized by The clock device comprises: a substrate comprising opposite first and second surfaces; a crystal resonator disposed on the first surface; a temperature sensor disposed on the second surface, the temperature sensor being electrically connected to the crystal resonator; a plastic package covering at least a portion of the second surface; and a first electrical connector penetrating the plastic package and having one end electrically connected to the temperature sensor.

2. The clock device of claim 1, wherein, The plastic package covers at least a portion of the second surface opposite the crystal resonator.

3. The clock device according to claim 1 or 2, characterized in that, The plastic package also covers the temperature sensor.

4. The clock device according to any one of claims 1 to 3, characterized in that, The clock device further comprises: a first wiring layer disposed on a surface of the plastic package facing away from the substrate; the one end of the first electrical connector, which is away from the temperature sensor, being electrically connected to the first wiring layer; a vertical projection of the temperature sensor on the second surface overlapping a vertical projection of the first wiring layer on the second surface.

5. The clock device according to any of claims 1-4, characterized in that, The plastic package also covers a portion of the first surface.

6. The clock device according to any one of claims 1 to 5, characterized in that, The material of the plastic package comprises epoxy resin.

7. The clock device according to any one of claims 1 to 6, characterized in that, The clock device further comprises a second electrical connector penetrating the substrate and a second wiring layer disposed on the second surface, one end of the first electrical connector being electrically connected to the second wiring layer; the temperature sensor being electrically connected to the crystal resonator comprises: the temperature sensor being electrically connected to the second electrical connector through the second wiring layer, the second electrical connector being electrically connected to the crystal resonator; a vertical projection of the second electrical connector on the second surface not overlapping a vertical projection of the first electrical connector on the second surface.

8. The clock device according to any one of claims 1 to 7, characterized in that, The clock device further comprises: a glue layer; a channel between the substrate and the temperature sensor, the glue layer filling the entire channel.

9. The clock device according to any of claims 1-7, characterized by The temperature sensor comprises a bare chip or a thermistor.

10. The clock device according to any one of claims 1 to 9, characterized in that, The material of the substrate comprises ceramic or glass.

11. The clock device according to any one of claims 1 to 10, characterized in that, The clock device further comprises: a cover connected to the first surface, the cover and the substrate forming a receiving cavity, the crystal resonator being located in the receiving cavity.

12. An electronic device, comprising: The electronic device comprises: a printed circuit board and the clock device according to any one of claims 1-11, one end of the first electrical connector, which is away from the temperature sensor, being electrically connected to the printed circuit board.

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