Optical module

Abstract

The present application relates to the technical field of optical communication devices. Disclosed is an optical module. The optical module comprises a light source assembly and an optical amplification assembly, wherein the optical amplification assembly is optically connected to the light source assembly, and the optical amplification assembly is used for performing optical amplification on an optical signal which is output by the light source assembly, so that the optical module has a relatively high output power. Moreover, in the present application, a pump source device of the optical amplification assembly is arranged on a bearing surface on one side of a main circuit board, and a variable optical attenuator is arranged on a bearing surface on the other side of the main circuit board. That is, by rationally arranging functional devices of the optical amplification assembly, the size of the optical module can meet protocol requirements, and the optical module can accommodate the added optical amplification assembly, so that the optical module has a high output power.

Description

Optical module

[0001] The present application claims priority to the Chinese patent application No. 202411239988.7, filed on September 5, 2024, and entitled "Optical module", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of optical communication equipment, in particular to an optical module. BACKGROUND

[0003] The optical module is an optical communication equipment for optical-electric and electric-optical conversion. In recent years, the global cloud computing data center market continues to expand, and the 5G telecommunication network construction is fully launched. The market demand for high-speed optical modules is also increasing day by day. Various series and types of products have been launched to provide the best optical module solution for customers in the fields of cloud computing data centers, unrepeatered transmission, etc.

[0004] At present, due to the limitation of silicon optical technology, the output power of the coherent optical module is relatively low. Therefore, the coherent optical module can integrate an optical amplifier to improve the output power. However, the optical module protocol has strict requirements on the size of the coherent optical module, and it is difficult for the current coherent optical module to integrate the optical amplifier under the premise of meeting the requirements of the related protocol. SUMMARY

[0005] The present application provides an optical module, which increases an optical amplification component in the optical module to improve the power of the output optical signal of the optical module under the condition of meeting the size requirements of the protocol.

[0006] The present application provides an optical module, which includes: a shell including an upper shell and a lower shell, the upper shell and the lower shell being combined together to form a containing cavity; a main circuit board contained in the containing cavity, the main circuit board having two opposite bearing surfaces, the two bearing surfaces respectively facing the upper shell and the lower shell, one end of the main circuit board being provided with an electrical connector for electrical connection with the outside; an optical source component contained in the containing cavity and electrically connected with the main circuit board; and an optical amplification component contained in the containing cavity and electrically connected with the main circuit board, and the optical amplification component is optically connected with the optical source component, the optical amplification component being used for amplifying the optical signal output by the optical source component; wherein the optical amplification component includes a pump source device and an adjustable optical attenuator, the pump source device being arranged on one of the two bearing surfaces, and the adjustable optical attenuator being arranged on the other of the two bearing surfaces.

[0007] In an embodiment of the present application, the optical source component and the adjustable optical attenuator are arranged on the same bearing surface of the main circuit board.

[0008] In an embodiment of the present application, the top of the upper shell is provided with a heat sink, the light source assembly and the adjustable optical attenuator are arranged on the bearing surface of the main circuit board close to the heat sink, and the light source assembly is in heat-conducting connection with the heat sink through the upper shell.

[0009] In an embodiment of the present application, the light module has a first direction, a second direction and a third direction perpendicular to each other, the light source assembly, the adjustable optical attenuator and the pump source device are arranged on both sides of the main circuit board in the first direction, and the light module is provided with a light interface and an electrical interface at both ends in the second direction; the light source assembly comprises a light output device and an electrical connecting member, and the light output device is electrically connected with the main circuit board through the electrical connecting member; wherein the light output device is arranged on one side of the pump source device in the third direction, and the adjustable optical attenuator is arranged on the other side of the pump source device in the third direction.

[0010] In an embodiment of the present application, the electrical connecting member is located on the side of the light output device facing the adjustable optical attenuator, the electrical connecting member is close to the middle position of the main circuit board in the third direction, the light output device is close to the edge position of the main circuit board in the third direction, and the surface of the light output device facing away from the main circuit board is in heat-conducting connection with the shell.

[0011] In an embodiment of the present application, the light amplification assembly further comprises a wavelength division multiplexer, an isolator and an optical monitoring detector, and the wavelength division multiplexer, the isolator and the optical monitoring detector are arranged on the same side of the main circuit board as the pump source device.

[0012] In an embodiment of the present application, the light module has a first direction, a second direction and a third direction perpendicular to each other, the light source assembly, the adjustable optical attenuator and the pump source device are arranged on both sides of the main circuit board in the first direction, and the light module is provided with a light interface and an electrical interface at both ends in the second direction; the light source assembly comprises a light output device and an electrical connecting member, and the light output device is electrically connected with the main circuit board through the electrical connecting member; wherein the light monitoring detector and the light output device are arranged on one side of the pump source device in the third direction, and the adjustable optical attenuator, the wavelength division multiplexer and the isolator are arranged on the other side of the pump source device in the third direction.

[0013] In an embodiment of the present application, the light module has a first direction, a second direction and a third direction perpendicular to each other, the light source assembly, the adjustable optical attenuator and the pump source device are arranged on both sides of the main circuit board in the first direction, and the light module is provided with a light interface and an electrical interface at both ends in the second direction; the light source assembly comprises a light output device and an electrical connecting member, and the light output device is electrically connected with the main circuit board through the electrical connecting member; wherein the light output device is arranged on one side of the pump source device in the third direction, and the adjustable optical attenuator, the wavelength division multiplexer, the isolator and the optical monitoring detector are arranged on the other side of the pump source device in the third direction.

[0014] In an embodiment of the present application, the optical module is provided with optical interfaces and electrical interfaces at opposite ends respectively; the optical amplification assembly further comprises an amplification optical fiber, one end of the amplification optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator; wherein the amplification optical fiber, the light source assembly and the adjustable optical attenuator are arranged on the same side of the main circuit board, and at least part of the amplification optical fiber is close to the electrical interface relative to the light source assembly and the adjustable optical attenuator.

[0015] In an embodiment of the present application, the optical module is provided with optical interfaces and electrical interfaces at opposite ends respectively; the optical module further comprises a connecting optical fiber, the connecting optical fiber is optically connected to the pump source device, the wavelength division multiplexer, the isolator, the adjustable optical attenuator and the optical monitoring detector respectively; wherein the connecting optical fiber, the pump source device, the wavelength division multiplexer, the isolator and the optical monitoring detector are located on the same side of the main circuit board, and at least part of the connecting optical fiber is close to the electrical interface relative to the pump source device, the wavelength division multiplexer, the isolator and the optical monitoring detector.

[0016] In an embodiment of the present application, the optical module is provided with optical interfaces and electrical interfaces at opposite ends respectively; the optical amplification assembly further comprises an amplification optical fiber, one end of the amplification optical fiber is connected to the wavelength division multiplexer, and the other end is connected to the isolator; the optical module further comprises a connecting optical fiber, the connecting optical fiber is optically connected to the pump source device, the wavelength division multiplexer, the isolator, the adjustable optical attenuator and the optical monitoring detector; the modulator is integrated on the main circuit board, and the light source assembly is optically connected to the wavelength division multiplexer through the modulator; wherein the light source assembly, the pump source device, the adjustable optical attenuator, the wavelength division multiplexer, the isolator and the optical monitoring detector are arranged close to the optical interface; the modulator, the amplification optical fiber and the connecting optical fiber are arranged between the light source assembly and the electrical interface on the main circuit board, and the amplification optical fiber and the connecting optical fiber are fixed to the main circuit board through the corresponding fiber spool.

[0017] In an embodiment of the present application, the light source assembly comprises a light output device and an electrical connecting piece, the light output device is electrically connected to the main circuit board through the electrical connecting piece; wherein the light output device is in thermal contact with the main circuit board; the electrical connecting piece comprises a first connecting part, a second connecting part and a third connecting part; the first connecting part is connected to the light output device; the second connecting part is connected to the main circuit board, and the first connecting part is away from the main circuit board relative to the second connecting part; the first connecting part and the second connecting part are connected through the third connecting part, the first connecting part and the second connecting part are arranged parallel to the plane on which the main circuit board is located, and the third connecting part is arranged inclined relative to the first connecting part and the second connecting part.

[0018] In an embodiment of the present application, the optical module further comprises a connecting optical fiber, the connecting optical fiber is optically connected to the pump source device and the adjustable optical attenuator; the optical module further comprises a plurality of first fiber spools separated from each other, the plurality of first fiber spools are arranged on the main circuit board at intervals, and the connecting optical fiber is coiled and fixed to the main circuit board through the plurality of first fiber spools.

[0019] The beneficial effects of the present application are: the optical module comprises a light source assembly and an optical amplification assembly, the optical amplification assembly is optically connected with the light source assembly, and the optical amplification assembly is used for optically amplifying the optical signal output by the light source assembly, so that the optical module has high output power. Moreover, the pump source device of the optical amplification assembly is arranged on the bearing surface on one side of the main circuit board, and the adjustable optical attenuator is arranged on the bearing surface on the other side of the main circuit board, that is, by reasonably arranging the functional devices of the optical amplification assembly, the size of the optical module can meet the protocol requirements and can also accommodate the increased optical amplification assembly, so that the optical module has high output power. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained according to these drawings without creative labor.

[0021] Fig. 1 is a structural schematic diagram of an optical module in an embodiment of the present application;

[0022] Fig. 2 is a structural schematic diagram of the cross section of the optical module in Fig. 1 in the A-A direction;

[0023] Fig. 3 is a structural schematic diagram of an optical module in an embodiment of the present application, in which the upper shell is removed;

[0024] Fig. 4 is a structural schematic diagram of an optical module in an embodiment of the present application, in which the lower shell is removed;

[0025] Fig. 5 is a system schematic diagram of an optical module in another embodiment of the present application;

[0026] Fig. 6 is a structural schematic diagram of the connection mode between the light source assembly and the main circuit board in an embodiment of the present application;

[0027] Fig. 7 is a structural schematic diagram of an optical module in another embodiment of the present application, in which the lower shell is removed.

[0028] Explanation of reference signs:

[0029] 10 optical module; 11 housing; 111 accommodating cavity; 112 upper shell; 113 lower shell; 12 main circuit board; 121 bearing surface; 122 electrical connector; 13 heat sink; 14 optical interface; 15 electrical interface; 16 first fiber tray; 17 second fiber tray; 18 connecting optical fiber; 19 electrical chip; 20 light source assembly; 21 light output device; 22 electrical connecting piece; 221 first connecting part; 222 second connecting part; 223 third connecting part; 30 optical amplification assembly; 31 pump source device; 32 adjustable optical attenuator; 33 wavelength division multiplexer; 34 isolator; 35 optical monitoring detector; 36 amplification optical fiber; 40 modulator. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified and limited, the terms "connected", "connected", "stacked" and the like should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrated; can be directly connected, or indirectly connected through an intermediate medium; can be internal connection of two elements or interaction relationship between two elements. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise specified and limited, the terms "connected", "connected", "stacked" and the like should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrated; can be directly connected, or indirectly connected through an intermediate medium; can be internal connection of two elements or interaction relationship between two elements. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] The present application provides an optical module, which will be described in detail below. It should be noted that the description order of the following embodiments is not limited as the preferred order of the embodiments of the present application. In the following embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0033] The coherent optical module in OSFP (Octal Small Form Factor Pluggable, eight-channel small form pluggable package) package adopts a silicon light modulation scheme, and the output power thereof is limited by the silicon light technology. For a 100G transmission scenario, the output power of a traditional coherent optical module can only reach about -6.5dBm. For a 400G transmission scenario, the output power of the traditional coherent optical module can only reach about -9dBm. For an 800G transmission scenario, the output power of the traditional coherent optical module can only reach about -13dBm. Moreover, the traditional coherent optical module has sacrificed certain OSNR (Optical Signal Noise Ratio) performance in order to ensure the output power of -6.5dBm to -13dBm. The above factors limit the application of the traditional coherent optical module in a point-to-point transmission scenario without a relay point.

[0034] The coherent optical module can increase the output power by integrating an EDFA (Erbium Doped Fiber Amplifier, erbium-doped fiber amplifier), so that the output power of the coherent optical module can reach +3dBm. In an IP over DWDM transmission scenario and a point-to-point transmission scenario, the coherent optical module integrated with the EDFA can optimize the network structure and reduce the deployment cost. Moreover, the coherent optical module integrated with the EDFA can also be compatible with an emerging ROADM (Reconfigurable Optical Add-Drop Multiplexe, reconfigurable optical add-drop multiplexer) line system, and plays an important role in a metropolitan area / regional ROADM network. However, the optical module protocol has strict requirements on the size of the coherent optical module, and it is difficult for the traditional coherent optical module to integrate the optical amplifier under the premise of meeting the requirements of the related protocol.

[0035] Therefore, the embodiment of the present application provides an optical module which not only has a high output power, but also has a size that can meet the protocol requirements of an optical module with a small package size. Details are described below.

[0036] Please refer to FIG. 1 to FIG. 4, FIG. 1 is a structural schematic diagram of an optical module in an embodiment of the present application, FIG. 2 is a structural schematic diagram of a cross section of the optical module in FIG. 1 in A-A direction, FIG. 3 is a structural schematic diagram of the optical module in an embodiment of the present application without an upper shell, and FIG. 4 is a structural schematic diagram of the optical module in an embodiment of the present application without a lower shell. Among them, FIG. 3 shows a top view of the optical module 10 after removing the upper shell 112, and FIG. 4 shows a bottom view of the optical module 10 after removing the lower shell 113.

[0037] In an embodiment, the optical module 10 comprises a housing 11 serving as a basic carrier of the optical module 10 for packaging and protecting the remaining components of the optical module 10. Specifically, the housing 11 has an accommodating cavity 111 inside for accommodating the remaining components of the optical module 10. The housing 11 further comprises an upper shell 112 and a lower shell 113. The optical module 10 has a first direction Z, a second direction X and a third direction Y perpendicular to each other. The upper shell 112 and the lower shell 113 are combined together along the first direction Z to form the accommodating cavity 111, i.e. the accommodating cavity 111 is located between the upper shell 112 and the lower shell 113. The length of the optical module 10 in the second direction X is greater than the length of the optical module 10 in the third direction Y. The first direction Z is the height direction of the optical module 10, the second direction X is the length direction of the optical module 10, and the third direction Y is the width direction of the optical module 10.

[0038] The optical module 10 further comprises a light source assembly 20, a main circuit board 12 and an optical amplification assembly 30, all of which are accommodated in the accommodating cavity 111. The optical amplification assembly 30 is optically connected with the light source assembly 20, and the light source assembly 20 and the optical amplification assembly 30 are both electrically connected with the main circuit board 12. The optical amplification assembly 30 is used for optically amplifying the optical signal output by the light source assembly 20, so that the optical module 10 of the embodiment has a higher output power.

[0039] In an embodiment, the main circuit board 12 is integrated with a signal circuit and a power supply circuit. The electronic devices in the optical module 10 are connected according to the circuit design through circuit traces of the main circuit board 12 to realize the electrical functions such as power supply, electrical signal transmission and grounding. One end of the main circuit board 12 is provided with an electrical connector 122 for electrical connection with the outside. The optical module 10 is provided with an optical interface 14 and an electrical interface 15 at opposite ends in the second direction X. The optical interface 14 is used for optical connection with the optical fiber outside the optical module 10, and one end of the main circuit board 12 is electrically connected with the device outside the optical module 10 through the electrical interface 15. The electrical connector 122 is located at the end of the main circuit board 12 close to the electrical interface 15. The electrical connector 122 is specifically a gold finger, which is used for connection with the electrical connector of the optical cage on the customer device through the electrical interface 15. The main circuit board 12 is further integrated with an electrical chip 19 for controlling and / or processing electrical signals, such as a digital signal processor (DSP).

[0040] In an embodiment, the devices of the optical amplification assembly 30 are connected by optical fibers, and the package shell of the optical amplification assembly 30 is omitted, and the devices of the optical amplification assembly 30 are directly arranged in the accommodating cavity 111 of the housing 11 of the optical module 10. In this way, the optical amplification assembly 30 is omitted from the package shell, so that the optical amplification assembly 30 can be integrated into the optical module 10, thereby enabling the size of the optical module 10 to meet the protocol requirements and accommodate the increased optical amplification assembly 30, so that the optical module 10 has high output power.

[0041] Please refer to FIG. 5, which is a system schematic diagram of an optical module in another embodiment of the present application.

[0042] In an embodiment, the optical amplification assembly 30 includes a pump source device 31, an adjustable optical attenuator 32, a wavelength division multiplexer 33, an isolator 34, an optical monitoring detector 35, and an amplification optical fiber 36. The amplification optical fiber 36 is preferably an erbium-doped optical fiber, and these elements constitute an erbium-doped fiber amplifier (EDFA). The wavelength division multiplexer 33 is optically connected to the light source assembly 20 and the pump source device 31. The isolator 34 is optically connected to the wavelength division multiplexer 33 through the amplification optical fiber 36. One end of the amplification optical fiber 36 is connected to the wavelength division multiplexer 33, and the other end is connected to the isolator 34. One end of the wavelength division multiplexer 33 is connected to the amplification optical fiber 36, and the other end is optically connected to the light source assembly 20 and the pump source device 31, respectively. The wavelength division multiplexer 33 is used to couple the optical signal output by the light source assembly 20 and the pump light output by the pump source device 31 into the amplification optical fiber 36. The wavelength division multiplexer 33 can be an IWDM (isolated wavelength division multiplexer) or the like. The adjustable optical attenuator 32 is optically connected to the isolator 34, and the optical monitoring detector 35 is optically connected to the adjustable optical attenuator 32. The modulator 40 is integrated on the main circuit board 12, and the light source assembly 20 is optically connected to the wavelength division multiplexer 33 through the modulator 40. The optical signal output by the light source assembly 20 is input into the wavelength division multiplexer 33 after being modulated by the modulator 40, and the wavelength division multiplexer 33 combines the optical signal output by the light source assembly 20 and the pump light output by the pump source device 31 into one input into the amplification optical fiber 36. The pump light output by the pump source device 31 excites the amplification optical fiber 36 to amplify the optical signal output by the light source assembly 20, and then the amplified optical signal is sequentially output through the isolator 34, the adjustable optical attenuator 32, and the optical monitoring detector 35, so that the optical module 10 has high output power. The output power of the optical module 10 in the embodiment of the present application can reach +3 dBm.

[0043] In an embodiment, the main circuit board 12 has two opposite bearing surfaces 121, respectively facing the upper shell 112 and the lower shell 113. The pump source device 31 of the optical amplification assembly 30 is arranged on one of the two bearing surfaces 121, and the adjustable optical attenuator 32 is arranged on the other of the two bearing surfaces 121. In this way, the optical amplification assembly 30 of the embodiment eliminates the packaging shell compared with the conventional EDFA, and by reasonably arranging the various functional devices of the optical amplification assembly 30, the optical amplification assembly 30 is integrated into the optical module 10, which not only improves the output power of the optical module 10 by using the optical amplification assembly 30, but also ensures that the size of the optical module 10 meets the protocol requirements.

[0044] Further, the top of the upper shell 112 is provided with a heat dissipation member 13 for dissipating heat of the optical module 10. The heat dissipation member 13 is specifically provided on the side of the upper shell 112 away from the lower shell 113. The heat dissipation member 13 can be a heat dissipation column, a heat dissipation fin or other heat dissipation structure, which is not limited here.

[0045] The light source assembly 20, the adjustable optical attenuator 32 and the pump source device 31 are arranged on both sides of the main circuit board 12 in the first direction Z. The light source assembly 20 and the adjustable optical attenuator 32 are arranged on the same bearing surface 121 of the main circuit board 12, specifically, the light source assembly 20 and the adjustable optical attenuator 32 are arranged on the bearing surface 121 of the main circuit board 12 close to the heat dissipation member 13, and the pump source device 31 is arranged on the bearing surface 121 of the main circuit board 12 away from the light source assembly 20 and the adjustable optical attenuator 32. The light source assembly 20 is arranged on the side of the main circuit board 12 close to the heat dissipation member 13 due to its high heat generation, so that the light source assembly 20 is in heat conduction connection with the heat dissipation member 13 through the upper shell 112, the heat dissipation path is shortened to reduce the thermal resistance, which is conducive to improving the heat dissipation effect of the light source assembly 20. The space on the side of the main circuit board 12 close to the heat dissipation member 13 has a large size (height) in the first direction Z, and the size (height) of the adjustable optical attenuator 32 in the first direction Z is also large, and the space on the side of the main circuit board 12 away from the heat dissipation member 13 has a small height, which is not convenient for arranging the adjustable optical attenuator 32, therefore, the adjustable optical attenuator 32 and the light source assembly 20 are arranged on the same side of the main circuit board 12 in the embodiment, specifically, on the side of the main circuit board 12 close to the heat dissipation member 13. After the light source assembly 20 and the adjustable optical attenuator 32 are arranged on the side of the main circuit board 12 close to the heat dissipation member 13, there is not enough space to arrange the remaining devices, therefore, the pump source device 31 is arranged on the side of the main circuit board 12 away from the light source assembly 20 and the adjustable optical attenuator 32. By reasonably arranging the arrangement positions of the light source assembly 20, the pump source device 31 and the adjustable optical attenuator 32, the utilization rate of the internal space of the optical module 10 is improved in the embodiment, which further ensures that the size of the optical module 10 meets the protocol requirements.

[0046] In an embodiment, the light source assembly 20 and the light amplification assembly 30 are arranged close to the optical interface 14. In this way, the embodiment can improve the utilization of the internal space of the optical module 10 by reasonably designing the arrangement position of the light source assembly 20 and the light amplification assembly 30 in the second direction X, and further ensure that the size of the optical module 10 meets the protocol requirements.

[0047] Specifically, the light source assembly 20, the pump source device 31 and the adjustable optical attenuator 32 are arranged close to the optical interface 14, and are arranged at the position of the main circuit board 12 close to the optical interface 14. This means that after the light source assembly 20 and the adjustable optical attenuator 32 are arranged at the side of the main circuit board 12 close to the heat dissipation member 13, there is not enough space to arrange the remaining devices at the side of the main circuit board 12 close to the heat dissipation member 13, so the pump source device 31 is arranged at the side of the main circuit board 12 away from the light source assembly 20 and the adjustable optical attenuator 32.

[0048] In an embodiment, the light source assembly 20 includes a light output device 21 and an electrical connection 22, and the light output device 21 is electrically connected to the main circuit board 12 through the electrical connection 22. The main circuit board 12 is used to control the light output device 21 to output an optical signal and supply power to the light output device 21. The light output device 21 is arranged at one side of the pump source device 31 in the third direction Y, specifically close to the edge position of the main circuit board 12 in the third direction Y; and the adjustable optical attenuator 32 is arranged at the other side of the pump source device 31 in the third direction Y, specifically close to the edge position of the main circuit board 12 on the other side opposite to the light output device 21. Since the light output device 21 and the pump source device 31 have high heat generation, the light output device 21 and the pump source device 31 are arranged at different sides of the main circuit board 12 and are staggered in the third direction Y (the pump source device 31 is arranged at the middle position of the main circuit board 12 in the third direction Y, and the light output device 21 and the adjustable optical attenuator 32 are arranged at the two side positions of the main circuit board 12 in the third direction Y), so as to avoid the mutual influence of the heat generated by the light output device 21 and the pump source device 31 as much as possible, which is conducive to improving the heat dissipation effect of the light output device 21 and the pump source device 31. Moreover, in order to avoid the influence of the heat generated by the light output device 21 and the pump source device 31 on the adjustable optical attenuator 32, the adjustable optical attenuator 32 is arranged away from the light output device 21 and the pump source device 31 in the third direction Y, which is further conducive to ensuring the normal and stable operation of each device of the optical module 10.

[0049] Further, the top surface of the light output device 21 is the main heat dissipation surface, and the fiber outlet of the light output device 21 faces the electrical interface 15 of the light module 10. Therefore, in the embodiment, the electrical connector 22 is arranged on the side of the light output device 21 facing the adjustable optical attenuator 32, and specifically, the electrical connector 22 is arranged near the middle position of the main circuit board 12 in the third direction Y, so that the top surface of the light output device 21 (the surface of the light output device 21 facing away from the main circuit board 12) is in heat conduction connection with the heat dissipation member 13 through the upper shell 112, thereby further improving the heat dissipation effect of the light source assembly 20. The light output device 21 and the shell 11 can be in heat conduction connection through a heat dissipation material (for example, heat dissipation glue, heat dissipation pad, etc.), so as to further reduce the thermal resistance and improve the heat dissipation effect.

[0050] In an embodiment, the bottom surface of the light output device 21 is the secondary heat dissipation surface, and the bottom surface of the light output device 21 is in heat conduction connection with the main circuit board 12. In this way, on the basis of the top surface of the light output device 21 being in heat conduction connection with the heat dissipation member 13 through the upper shell 112, the heat dissipation path of the light output device 21 is increased, thereby further improving the heat dissipation effect of the light source assembly 20. Of course, the light output device 21 and the main circuit board 12 can also be in heat conduction connection through a heat dissipation material, so as to further reduce the thermal resistance and improve the heat dissipation effect.

[0051] Please refer to FIG. 6, in order to paste the light output device 21 on the main circuit board 12, reduce the height of the package, and at the same time ensure that the light output device 21 and the main circuit board 12 have a large enough heat exchange area to ensure the heat dissipation effect, the electrical connector 22 is arranged in a bent manner. Specifically, the electrical connector 22 includes a first connecting portion 221, a second connecting portion 222, and a third connecting portion 223. The first connecting portion 221 is connected to the light output device 21. The second connecting portion 222 is connected to the main circuit board 12, and the first connecting portion 221 is away from the main circuit board 12 relative to the second connecting portion 222. The first connecting portion 221 and the second connecting portion 222 are connected through the third connecting portion 223. The first connecting portion 221 and the second connecting portion 222 are arranged parallel to the plane on which the main circuit board 12 is arranged, and the third connecting portion 223 is arranged inclined relative to the first connecting portion 221 and the second connecting portion 222.

[0052] For example, the first connecting part 221 is connected to one side of the light output device 21, the second connecting part 222 is connected to the main circuit board 12, and the first connecting part 221 and the second connecting part 222 are connected through the third connecting part 223. The first connecting part 221, the second connecting part 222 and the third connecting part 223 are arranged in a bending manner, and the third connecting part 223 is arranged obliquely relative to the main circuit board 12. The overall size of the bent electric connecting part 22 in the third direction Y can be 3.65mm±0.3mm, and the size of the third connecting part 223 in the first direction Z can be 1.22mm±0.1mm. The size of the second connecting part 222 in the third direction Y can be 1mm, that is, the effective welding length provided by the second connecting part 222 is 1mm, which ensures that the electric connecting part 22 and the main circuit board 12 have good electrical connection performance.

[0053] In an embodiment, since the light source assembly 20 and the adjustable optical attenuator 32 are arranged on one side of the main circuit board 12, there is not enough space on this side of the main circuit board 12 to arrange the remaining devices, therefore, in this embodiment, the wavelength division multiplexer 33, the isolator 34 and the optical monitoring detector 35 and the pump source device 31 are arranged on the same side of the main circuit board 12. In this embodiment, by reasonably arranging the various functional devices of the optical amplification assembly 30, the optical amplification assembly 30 is integrated into the optical module 10, which not only can improve the output power of the optical module 10 by using the optical amplification assembly 30, but also can ensure that the size of the optical module 10 meets the protocol requirements.

[0054] Specifically, since the size of the pump source device 31 in the second direction X is smaller than the size of the wavelength division multiplexer 33 in the second direction X, the size of the isolator 34 in the second direction X, and the size of the optical monitoring detector 35 in the second direction X, in order to coil the optical fibers (i.e., the connecting optical fibers 18 below) connecting the pump source device 31, the wavelength division multiplexer 33, the isolator 34, and the optical monitoring detector 35, the present embodiment arranges the optical monitoring detector 35 and the optical output device 21 on one side of the pump source device 31 in the third direction Y, and arranges the adjustable optical attenuator 32, the wavelength division multiplexer 33, and the isolator 34 on the other side of the pump source device 31 in the third direction Y. Moreover, the wavelength division multiplexer 33 and the isolator 34 are more sensitive to heat sources than the optical monitoring detector 35, so the wavelength division multiplexer 33 and the isolator 34 are arranged on the side of the pump source device 31 in the third direction Y away from the optical output device 21, so as to avoid the heat generated by the optical output device 21 from affecting the normal operation of the wavelength division multiplexer 33 and the isolator 34. The wavelength division multiplexer 33 is closer to the pump source device 31 than the isolator 34. Since the side of the pump source device 31 in the third direction Y away from the optical output device 21 has limited space, the optical monitoring detector 35 has low sensitivity to heat sources, so the optical monitoring detector 35 is arranged on the side of the pump source device 31 in the third direction Y on which the optical output device 21 is arranged, so as to facilitate arranging the wavelength division multiplexer 33, the isolator 34, and the optical monitoring detector 35 on the main circuit board 12 while ensuring reliable and stable operation of the wavelength division multiplexer 33, the isolator 34, and the optical monitoring detector 35. The present embodiment improves the utilization rate of the internal space of the optical module 10 by reasonably arranging the positions of the wavelength division multiplexer 33, the isolator 34, and the optical monitoring detector 35, and further ensures that the size of the optical module 10 meets the protocol requirements.

[0055] Please refer to FIG. 7, which is a structural schematic diagram of an optical module without a lower shell in another embodiment of the present application. FIG. 7 shows a bottom view of the optical module 10 after the lower shell 113 is removed.

[0056] In the present embodiment, the optical output device 21 is arranged on one side of the pump source device 31 in the third direction Y, and the adjustable optical attenuator 32, the wavelength division multiplexer 33, the isolator 34, and the optical monitoring detector 35 are arranged on the other side of the pump source device 31 in the third direction Y. In other words, the difference between the present embodiment and the above-mentioned embodiments is that the adjustable optical attenuator 32, the wavelength division multiplexer 33, the isolator 34, and the optical monitoring detector 35 are all arranged on the side of the pump source device 31 in the third direction Y away from the optical output device 21, so as to avoid the heat generated by the optical output device 21 from affecting the normal operation of the wavelength division multiplexer 33, the isolator 34, and the optical monitoring detector 35. The optical monitoring detector 35 is located between the wavelength division multiplexer 33 and the isolator 34, and the wavelength division multiplexer 33 is closer to the pump source device 31 than the isolator 34.

[0057] In an embodiment, the optical module 10 further comprises connecting optical fibers 18, which are optically connected with the pump source device 31, the wavelength division multiplexer 33, the isolator 34, the adjustable optical attenuator 32 and the optical supervisory detector 35 respectively. The light source assembly 20 (specifically the light output device 21) is optically connected with the modulator 40 through the connecting optical fibers 18, and the modulator 40 is also optically connected with the wavelength division multiplexer 33 through the connecting optical fibers 18, and the isolator 34 and the adjustable optical attenuator 32 are optically connected through the connecting optical fibers 18, and the adjustable optical attenuator 32 and the optical supervisory detector 35 are optically connected through the connecting optical fibers 18.

[0058] Please continue to refer to FIG. 3 and FIG. 4. In an embodiment, the pump source device 31, the adjustable optical attenuator 32, the wavelength division multiplexer 33, the isolator 34 and the optical supervisory detector 35 of the optical amplification assembly 30 are arranged close to the optical interface 14, and the fiber outlets of the pump source device 31, the adjustable optical attenuator 32, the wavelength division multiplexer 33, the isolator 34 and the optical supervisory detector 35 are all directed to the electrical interface 15. The modulator 40, the amplification optical fiber 36 and the connecting optical fibers 18 are all arranged on the main circuit board 12 between the light source assembly 20 and the electrical interface 15, and the amplification optical fiber 36 and the connecting optical fibers 18 are fixed on the main circuit board 12 through corresponding fiber trays. The electrical chip 19 is located on the side of the modulator 40 facing the electrical interface 15.

[0059] The amplification optical fiber 36, the light source assembly 20 and the adjustable optical attenuator 32 are arranged on the same side of the main circuit board 12, and at least part of the amplification optical fiber 36 is close to the electrical interface 15 relative to the light source assembly 20 and the adjustable optical attenuator 32. The amplification optical fiber 36 is coiled around the modulator 40 and the electrical chip 19. In this way, the embodiment reasonably arranges the position of the amplification optical fiber 36 to improve the utilization rate of the internal space of the optical module 10, and further ensures that the size of the optical module 10 meets the protocol requirements.

[0060] The connecting optical fibers 18 and the pump source device 31, the wavelength division multiplexer 33, the isolator 34 and the optical supervisory detector 35 are located on the same side of the main circuit board 12, and at least part of the connecting optical fibers 18 is close to the electrical interface 15 relative to the pump source device 31, the wavelength division multiplexer 33, the isolator 34 and the optical supervisory detector 35. In this way, the embodiment reasonably arranges the position of the connecting optical fibers 18 to improve the utilization rate of the internal space of the optical module 10, and further ensures that the size of the optical module 10 meets the protocol requirements.

[0061] In an embodiment, the optical module 10 further comprises a plurality of first fiber winding frames 16 which are spaced apart from each other on the main circuit board 12, i.e. the different first fiber winding frames 16 are independent components and not an integral structure. The connection optical fiber 18 is wound and arranged, and each first fiber winding frame 16 is spaced apart along the winding direction of the connection optical fiber 18, and the connection optical fiber 18 is fixed to the main circuit board 12 through the plurality of first fiber winding frames 16. In this embodiment, the connection optical fiber 18 is wound by using the first fiber winding frames 16 which are spaced apart from each other, which is conducive to improving the utilization rate of the internal space of the optical module 10, and further ensures that the size of the optical module 10 meets the protocol requirements.

[0062] In an embodiment, the optical module 10 further comprises a second fiber winding frame 17, and the amplification optical fiber 36 is fixed to the main circuit board 12 through the second fiber winding frame 17. Exemplarily, the second fiber winding frame 17 can be an integral structure, and the second fiber winding frame 17 is used to wind the amplification optical fiber 36. Of course, in other embodiments of the present application, the number of second fiber winding frames 17 can also be a plurality, and the different second fiber winding frames 17 are spaced apart from each other and arranged on the main circuit board 12, which is also conducive to improving the utilization rate of the internal space of the optical module 10, so as to further ensure that the size of the optical module 10 meets the protocol requirements.

[0063] The optical module provided by the present application is described in detail above, and specific examples are applied to describe the principles and implementation modes of the present application. The above description of the embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the above description should not be understood as a limitation of the present application.

Claims

1. An optical module characterized by comprising: The optical module comprises: a shell comprising an upper shell and a lower shell, the upper shell and the lower shell being combined to form a receiving cavity; a main circuit board accommodated in the receiving cavity, the main circuit board having two opposite bearing surfaces respectively facing the upper shell and the lower shell, one end of the main circuit board being provided with an electrical connector for electrical connection with the outside; a light source assembly accommodated in the receiving cavity and electrically connected with the main circuit board; and an optical amplification assembly accommodated in the receiving cavity and electrically connected with the main circuit board, and the optical amplification assembly is optically connected with the light source assembly, and the optical amplification assembly is used for amplifying the optical signal output by the light source assembly. The optical amplification assembly comprises a pump source device arranged on one of the two bearing surfaces and an adjustable optical attenuator arranged on the other of the two bearing surfaces.

2. The optical module according to claim 1, wherein the light source assembly and the adjustable optical attenuator are arranged on the same bearing surface of the main circuit board.

3. The optical module according to claim 2, wherein a heat dissipation member is arranged on the top of the upper shell, the light source assembly and the adjustable optical attenuator are arranged on the bearing surface of the main circuit board close to the heat dissipation member, and the light source assembly is in thermal conductive connection with the heat dissipation member through the upper shell.

4. The optical module according to claim 2, wherein the optical module has a first direction, a second direction and a third direction perpendicular to each other, the light source assembly, the adjustable optical attenuator and the pump source device are arranged on both sides of the main circuit board in the first direction, and the optical module is provided with an optical interface and an electrical interface at both ends thereof in the second direction; the light source assembly comprises a light output device and an electrical connecting member, and the light output device is electrically connected with the main circuit board through the electrical connecting member; wherein the light output device is arranged on one side of the pump source device in the third direction, and the adjustable optical attenuator is arranged on the other side of the pump source device in the third direction.

5. The optical module according to claim 4, wherein the electrical connecting member is located on the side of the light output device facing the adjustable optical attenuator, the electrical connecting member is close to the middle position of the main circuit board in the third direction, the light output device is close to the edge position of the main circuit board in the third direction, and the surface of the light output device away from the main circuit board is in thermal conductive connection with the shell.

6. The optical module according to claim 2, wherein the optical amplification assembly further comprises a wavelength division multiplexer, an isolator and an optical monitoring detector, and the wavelength division multiplexer, the isolator and the optical monitoring detector are arranged on the same side of the pump source device.

7. The optical module according to claim 6, wherein ​ The light module has a first direction, a second direction and a third direction perpendicular to each other, the light source assembly, the adjustable optical attenuator and the pump source device are arranged on both sides of the main circuit board in the first direction, and the light module is respectively provided with a light interface and an electrical interface at both ends in the second direction; the light source assembly comprises a light output device and an electrical connector, and the light output device is electrically connected with the main circuit board through the electrical connector; The light monitoring detector and the light output device are arranged on one side of the pump source device in the third direction, and the adjustable optical attenuator, the wavelength division multiplexer and the isolator are arranged on the other side of the pump source device in the third direction.

8. The light module of claim 6, wherein, The light module has a first direction, a second direction and a third direction perpendicular to each other, the light source assembly, the adjustable optical attenuator and the pump source device are arranged on both sides of the main circuit board in the first direction, and the light module is respectively provided with a light interface and an electrical interface at both ends in the second direction; the light source assembly comprises a light output device and an electrical connector, and the light output device is electrically connected with the main circuit board through the electrical connector; The light output device is arranged on one side of the pump source device in the third direction, and the adjustable optical attenuator, the wavelength division multiplexer, the isolator and the light monitoring detector are arranged on the other side of the pump source device in the third direction.

9. The light module of claim 6, wherein, The light module is respectively provided with a light interface and an electrical interface at opposite ends; the light amplification assembly further comprises an amplification optical fiber, one end of the amplification optical fiber is connected with the wavelength division multiplexer, and the other end of the amplification optical fiber is connected with the isolator; The amplification optical fiber, the light source assembly and the adjustable optical attenuator are arranged on the same side of the main circuit board, and at least part of the amplification optical fiber is close to the electrical interface relative to the light source assembly and the adjustable optical attenuator.

10. The light module of claim 6, wherein, The light module is respectively provided with a light interface and an electrical interface at opposite ends; the light module further comprises a connecting optical fiber, and the connecting optical fiber is optically connected with the pump source device, the wavelength division multiplexer, the isolator, the adjustable optical attenuator and the light monitoring detector respectively; The connecting optical fiber, the pump source device, the wavelength division multiplexer, the isolator and the light monitoring detector are located on the same side of the main circuit board, and at least part of the connecting optical fiber is close to the electrical interface relative to the pump source device, the wavelength division multiplexer, the isolator and the light monitoring detector.

11. The light module of claim 6, wherein, The optical module is provided with an optical interface and an electrical interface at opposite ends respectively; the optical amplification assembly further comprises an amplification optical fiber, one end of which is connected to the wavelength division multiplexer, and the other end is connected to the isolator; the optical module further comprises a connecting optical fiber, which is optically connected to the pump source device, the wavelength division multiplexer, the isolator, the adjustable optical attenuator and the optical monitoring detector respectively; the main circuit board is integrated with a modulator, and the light source assembly is optically connected to the wavelength division multiplexer through the modulator; The light source assembly, the pump source device, the adjustable optical attenuator, the wavelength division multiplexer, the isolator and the optical monitoring detector are arranged close to the optical interface; the modulator, the amplification optical fiber and the connecting optical fiber are arranged between the light source assembly and the electrical interface on the main circuit board, and the amplification optical fiber and the connecting optical fiber are fixed to the main circuit board through corresponding fiber spooling racks.

12. The optical module according to claim 1, characterized in that The light source assembly comprises a light output device and an electrical connecting member, and the light output device is electrically connected to the main circuit board through the electrical connecting member; The light output device is in heat-conducting connection with the main circuit board; the electrical connecting member comprises a first connecting portion, a second connecting portion and a third connecting portion; the first connecting portion is connected to the light output device; the second connecting portion is connected to the main circuit board, and the first connecting portion is away from the main circuit board relative to the second connecting portion; the first connecting portion and the second connecting portion are connected through the third connecting portion, and the first connecting portion and the second connecting portion are arranged parallel to the plane on which the main circuit board is located, and the third connecting portion is arranged obliquely relative to the first connecting portion and the second connecting portion.

13. The optical module according to claim 1, characterized in that The optical module further comprises a connecting optical fiber, which is optically connected to the pump source device and the adjustable optical attenuator respectively; The optical module further comprises a plurality of first fiber spooling racks which are separated from each other and arranged on the main circuit board at intervals, and the connecting optical fiber is arranged in a coiled manner and fixed to the main circuit board through the plurality of first fiber spooling racks.

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