Low-density high-thermal-conductivity solid-liquid transition type polymer-based thermal interface material as well as preparation method and application thereof

Abstract

The invention provides a solid-liquid conversion type polymer-based thermal interface material as well as a preparation method and application thereof, and the solid-liquid conversion type polymer-based thermal interface material is prepared from the following raw materials: vinyl terminated polydimethylsiloxane, active hydrogen group terminated siloxane and inorganic filler, the inorganic filler comprises a spherical filler and a flaky filler, and the weight ratio of the spherical filler to the flaky filler is (1.5-14): 1. Through cooperation of the spherical filler and the flaky filler, the spherical filler can generate a physical adsorption effect on the surface of the flaky filler and is different from a heat conduction channel formed by the spherical filler; a heat conduction channel formed by the flaky filler-spherical filler composite plays a role in integrating the dispersed small-particle-size spherical filler, so that the complete heat conduction channel can be formed at a relatively low filling fraction. The solid-liquid transition type polymer-based thermal interface material disclosed by the invention has low density and high thermal conductivity, and the workability and the lightweight performance in thermal management of optical module equipment are effectively improved.

Description

Technical Field

[0001] This invention belongs to the field of thermal interface materials technology, and relates to a solid-liquid transition polymer-based thermal interface material, its preparation method and application, and particularly to a low-density, high thermal conductivity solid-liquid transition polymer-based thermal interface material, its preparation method and application. Background Technology

[0002] With the rapid development of artificial intelligence, cloud computing, and 5G communication technologies, the demand for data transmission rates in data centers is growing exponentially, driving the evolution of optical modules from 400G and 800G to 1.6T and higher speeds. Along with this leap in speed, the power density and heat flux density of core components within optical modules, such as lasers, modulators, and driver chips, are also increasing dramatically. However, in pursuit of high-density integration, the packaging forms of optical modules (such as QSFP-DD and OSFP) are becoming increasingly compact, leaving extremely limited internal space for heat dissipation. Against this backdrop, efficient and reliable thermal management has become a core bottleneck determining the performance stability, signal accuracy, and long-term lifespan of optical modules (Bianco, V.; De Rosa, M.; Vafai, K. Phase-Change Materials for Thermal Management of Electronic Devices). Applied Thermal Engineering 2022, 214 , 118839; Liu, X. et al. Integrated Thermal DissipationMicro Structures for CDFP Optical Module. Optical and Quantum Electronics 2020, 52 (2), Chen, H. et al. Thermal Management Enhancement of ElectronicChips Based on Novel Technologies. Energy 2025, 316 , 134575.).

[0003] Thermal interface material (TIM) fills the microscopic gaps between the heat-generating chip and the heat sink to eliminate air and reduce contact thermal resistance, making it a crucial part of the heat dissipation path. In optical modules, the performance requirements for TIM are particularly stringent, requiring it to meet multiple demands such as high-efficiency heat conduction, optical path cleanliness, long-term reliability, and automated precision manufacturing.

[0004] Thermal interface materials (TIMs) play a crucial role in the thermal management of optical modules. These materials can effectively fill the microscopic gaps at the contact surface between heat-generating components and the heat sink, improving thermal conductivity and reducing thermal resistance, thereby optimizing heat dissipation. Furthermore, TIMs maintain stable physical properties during repeated thermal cycling, preventing performance degradation due to thermal fatigue. Therefore, they are considered an important technical approach to addressing the heat dissipation challenges of optical modules (Liu Wentao, Li Zhenqi, Jin Shilei, et al. Research progress on thermal interface materials and thermally conductive silicone grease [J]. Mechanical Engineering Materials, 2025, 49(08): 1-7+60, Wei, B. et al. Thermal Interface Materials: From Fundamental Research to Applications). SusMat 2024, 4 (6), Due, J.; Robinson, A. Reliability of Thermal InterfaceMaterials: A Review. Applied Thermal Engineering 2013, 50 (1), 455-463.).

[0005] Thermal interface materials with solid-liquid transition properties have shown great development potential in various application scenarios. Solid-liquid transition is reflected in the destruction and reconstruction of the microstructure inside the material. In rheology, it is also manifested as the yield behavior, thixotropy, and creep behavior of the material (Xu Jiatong, Zhou Ziyu, Liao Qingyu, et al. Determination of yield stress of complex fluids: theory, method and application [J]. Polymer Bulletin, 2025, 38(05): 689-717, Yang Kai. Rheological study of yield stress fluid in large amplitude oscillating shear flow field [D]. Shanghai Jiaotong University, 2017, Yang Kai, Yu Wei. Nonlinear rheological study of yield stress fluid [C] / / Chinese Chemical Society, Rheology Committee of Chinese Society of Theoretical and Applied Mechanics. Proceedings of the 13th National Conference on Rheology. Institute of Rheology, School of Chemistry and Chemical Engineering, Shanghai Jiaotong University; Malvern Instruments, 2016: 221-222). Due to the special properties of these materials, they are widely used in mobile electronic devices, flexible electronic devices, optical modules, etc. In today's highly integrated chip world, electronic devices generate enormous amounts of heat during operation. Since there are gaps between heat sinks and heat-generating components, and thermal expansion mismatch occurs between these components during heating, thermal interface materials that can fill these gaps and mitigate thermal expansion mismatch are particularly important.

[0006] Polymer-based thermal interface materials are widely used in various electronic devices due to their high processability and certain solid-liquid transition capabilities. To this end, researchers have developed polymer-based thermal interface materials with significant thermal conductivity and solid-liquid transition properties. However, the thermal conductivity and density of these materials are not yet ideal. For example, improving thermal conductivity is often achieved by adding more fillers, but this leads to a sharp decrease in solid-liquid transition properties and an increase in density, thus reducing processability and portability. Most research on polymer-based thermal interface materials encounters the problem of conflicting solid-liquid transition properties, thermal conductivity, and density. A method to integrate good solid-liquid transition properties, high thermal conductivity, and low density in a single polymer-based thermal interface material has not yet been achieved (Yan, Y.; et al. Bridging the Thermal Divide: Nano-Architectonics and Interface Engineering Strategies for High-Performance 2D Material-Based Polymer Composites). ACS Nano 2025, 19 (22), 20357–20402. DOI: 10.1021 / acsnano.5c02539, Zha, J.-W.; Wang, F.; Wan, B. Polymer Composites with HighThermal Conductivity: Theory, Simulation, Structure and InterfacialRegulation. Progress in Materials Science 2025, 148 , 101362.). Summary of the Invention

[0007] To address the shortcomings of existing technologies, the present invention aims to provide a solid-liquid transition polymer-based thermal interface material, its preparation method, and its application, particularly a low-density, high-thermal-conductivity solid-liquid transition polymer-based thermal interface material, its preparation method, and its application.

[0008] To achieve this objective, the present invention adopts the following technical solution: On one hand, the present invention provides a solid-liquid transition polymer-based thermal interface material, wherein the raw materials for preparing the solid-liquid transition polymer-based thermal interface material include the following components: The mixture comprises vinyl-terminated polydimethylsiloxane, active hydrogen-terminated siloxane, and inorganic filler, wherein the inorganic filler includes spherical filler and sheet filler, and the weight ratio of the spherical filler to the sheet filler is 1.5-14:1 (e.g., 1.5:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1, 10:1, 12:1, or 14:1, etc.).

[0009] In this invention, through the combination of spherical packing and sheet packing, the spherical packing will generate physical adsorption on the surface of the sheet packing. Unlike the heat conduction path formed by the spherical packing, the heat conduction path formed by the sheet packing-spherical packing composite plays an integrating role in the dispersed small-diameter spherical packing, so that a complete heat conduction path can be formed at a low filler fraction.

[0010] Preferably, the spherical packing is spherical aluminum nitride.

[0011] Preferably, the sheet-like filler is sheet-like boron nitride.

[0012] Preferably, the D50 particle size of the spherical filler is in the range of 0.1 μm to 120 μm (e.g., 0.1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm or 120 μm). The D50 particle size of the sheet-like filler is in the range of 0.1 μm to 100 μm (e.g., 0.1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm or 100 μm).

[0013] In this invention, a low density (2.77 g / cm³) is obtained by adjusting the ratio of sheet-like packing to spherical packing, as well as the particle size of the spherical and sheet-like packing. 3 High thermal conductivity 20 W / m -1 K -1 The solid-liquid transition properties (accelerated creep time less than 100s) effectively improve the processability and lightweight performance of thermally conductive gels in the thermal management of optical module devices.

[0014] The spherical filler is a combination of two particle sizes, with the following D50 range and content: the mass percentage content of spherical filler with 10um≤D50≤120um is 40%-88% (e.g., 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85% or 88%); the mass percentage content of spherical filler with 0.1um≤D50<10um is 15%-60% (e.g., 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55% or 60%).

[0015] Preferably, the mass ratio of spherical packing with 20µm < D50 ≤ 120µm to spherical packing with 10µm ≤ D50 ≤ 20µm in the spherical packing is 0-40:8 (e.g., 0:18, 36:18, 36:15, 36:10 or 36:8, etc.).

[0016] Preferably, the spherical packing material with a particle size of 0.1µm ≤ D50 < 10µm can be selected from any particle size within the range; preferably, when two particle sizes need to be combined, the mass ratio of the spherical packing material with a particle size of 1µm ≤ D50 < 10µm to the spherical packing material with a particle size of 0.1µm ≤ D50 < 1µm is 20-10:8 (e.g., 20:8, 16:8, or 10:8, etc.). Preferably, the vinyl-terminated polydimethylsiloxane is selected from at least one of side-chain vinyl polydimethylsiloxane and single-terminated vinyl polydimethylsiloxane.

[0017] Preferably, the active hydrogen-terminated siloxane is selected from at least one of polydimethylsiloxane containing active hydrogen groups and single-terminated hydrogen-terminated polydimethylsiloxane.

[0018] Preferably, the vinyl-terminated polydimethylsiloxane is heated at 25°C for 1 second. -1 The viscosity at that time is 10-2500 mPa·s, for example 10 mPa·s, 260 mPa·s, 510 mPa·s, 760 mPa·s, 1000 mPa·s, 1260 mPa·s, 1510 mPa·s, 1760 mPa·s, 2000 mPa·s or 2500 mPa·s, etc.

[0019] Preferably, the active hydrogen-terminated siloxane is subjected to oxidation at 25°C for 1 second. -1 The viscosity at that time is 10-2500 mPa·s, for example 10 mPa·s, 260 mPa·s, 510 mPa·s, 760 mPa·s, 1000 mPa·s, 1260 mPa·s, 1510 mPa·s, 1760 mPa·s, 2000 mPa·s or 2500 mPa·s, etc.

[0020] Preferably, the total weight of the raw materials used in preparing the solid-liquid transition polymer-based thermal interface material is 100%, the content of the active hydrogen-terminated siloxane is 3.27-18.10% (e.g., 3.27%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, or 18.1%), the content of the active hydrogen-terminated siloxane is 1.19-18.10% (e.g., 1.19%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, or 18.1%), and the content of the inorganic filler is 83.25-95.54% (e.g., 83.25%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 93%, or 95%).

[0021] Preferably, the density of the solid-liquid transition polymer-based thermal interface material is 2.0 g / cm³. 3 -3.0 g / cm 3 For example, 2g / cm 3 2.1g / cm 3 2.2g / cm 3 2.3g / cm 3 2.4g / cm 3 2.5g / cm 3 2.6g / cm 3 2.7g / c m3 Or 3g / cm 3 wait.

[0022] Preferably, the accelerated creep time of the solid-liquid transition polymer-based thermal interface material measured on a rotational rheometer under a stress of 1500 Pa is between 10 and 100 s (e.g., 10 s, 20 s, 30 s, 40 s, 50 s, 60 s, 70 s, 80 s, 90 s, or 100 s, etc.).

[0023] Preferably, the thermal conductivity of the solid-liquid transition polymer-based thermal interface material is 0.2-20 W / (mK), such as 0.2 W / (mK), 2 W / (mK), 4 W / (mK), 6 W / (mK), 8 W / (mK), 10 W / (mK), 12 W / (mK), 14 W / (mK), 16 W / (mK), or 20 W / (mK).

[0024] On the other hand, the present invention provides a method for preparing a solid-liquid transition polymer-based thermal interface material as described above, the method comprising the following steps: Spherical fillers and sheet fillers are mixed, and then mixed with vinyl-terminated polydimethylsiloxane and active hydrogen-terminated siloxane to obtain the solid-liquid transition polymer-based thermal interface material.

[0025] Preferably, the spherical packing and the sheet packing are mixed and then dried at a temperature of 125℃-175℃ (e.g., 125℃, 131℃, 137℃, 143℃, 149℃, 155℃, 161℃, 167℃ or 175℃, etc.) and for a time of 30-60 min (e.g., 30 min, 34 min, 38 min, 42 min, 46 min, 50 min, 54 min or 60 min, etc.).

[0026] Preferably, the mixture of vinyl-terminated polydimethylsiloxane and active hydrogen-terminated siloxane is rotated at high speeds of 800 r / min and 1200 r / min for 30-45 s (e.g., 30 s, 33 s, 37 s, 41 s or 45 s) and 65-85 s (e.g., 65 s, 70 s, 75 s, 80 s or 85 s) respectively in a vacuum environment.

[0027] On the other hand, the present invention provides an application of the solid-liquid transition polymer-based thermal interface material as described above or the solid-liquid transition polymer-based thermal interface material prepared by the preparation method described above in electronic devices.

[0028] Compared with the prior art, the present invention has the following beneficial effects: This invention utilizes a combination of spherical and sheet-like fillers. The spherical fillers create a physical adsorption effect on the surface of the sheet-like fillers. Unlike the thermally conductive pathways formed by the spherical fillers, the thermally conductive pathways formed by the sheet-like filler-spherical filler composite integrate the dispersed small-diameter spherical fillers, allowing complete thermally conductive pathways to be formed even at lower filler fractions. The solid-liquid transition polymer-based thermal interface material of this invention exhibits low density and high thermal conductivity, effectively improving its processability and lightweight performance in the thermal management of optical module devices. Detailed Implementation

[0029] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0030] The materials used in the following embodiments and comparative examples are from the following sources: Aluminum nitride powder: D50 is 120, 20, 10, 2, and 0.2 μm aluminum nitride powder, Suzhou Jinyi New Material Technology Co., Ltd.; Flake boron nitride powder: D50 is 100um, 50um, 30um, 10um, 2um, and 0.1um boron nitride; Tianyuan Aviation Materials (Yingkou) Technology Co., Ltd.; Vinyl-terminated polydimethylsiloxane: VS-50, at 25°C, 1s -1 The viscosity at that time was 30 mPa·s. (Anbia Specialty Silicones (Nantong) Co., Ltd.) Mixed silicone oil containing active hydrogen-based polysiloxanes: CE-30, at 25°C, 1s -1 The viscosity at that time was 30 mPa·s. Anbia Specialty Silicones (Nantong) Co., Ltd.

[0031] Example 1 This embodiment provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), and the preparation method of the solid-liquid transition polymer-based thermal interface material is as follows: First, aluminum nitride powder with D50 of 20, 10, 2, and 0.2 μm and flake boron nitride powder with D50 of 100 μm were weighed in a ratio of 8:10:16:8:28. The weighed powders were then high-speed blended and dried in a 150°C drying oven. Next, a 94.59% mass fraction of the mixed powder was weighed, and 4.00% mass fraction of vinyl-terminated polydimethylsiloxane and 1.41% mass fraction of a mixed silicone oil containing active hydrogen-based polysiloxanes were added. The mixture was then high-speed blended at 800 rpm for 30 s under vacuum, followed by high-speed blending at 1200 rpm for 75 s to obtain a low-density, high-thermal-conductivity thermally conductive gel with good solid-liquid transition properties.

[0032] Example 2 This embodiment provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), and the preparation method of the solid-liquid transition polymer-based thermal interface material is as follows: First, aluminum nitride powder with D50 of 120, 10, 2, and 0.2 μm and flake boron nitride powder with D50 of 30 μm were weighed in a ratio of 36:8:16:8:7. The weighed powders were then high-speed blended and dried in a drying oven. Subsequently, 95.54% of the powder was weighed, and 3.30% of vinyl-terminated polydimethylsiloxane and 1.16% of a mixed silicone oil containing active hydrogen-based polysiloxane were added. The mixture was then high-speed blended at 800 rpm for 30 s under vacuum, followed by high-speed blending at 1200 rpm for 75 s to obtain a low-density, high-thermal-conductivity thermally conductive gel with good solid-liquid transition properties.

[0033] Example 3 This embodiment provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), and the preparation method of the solid-liquid transition polymer-based thermal interface material is as follows: First, aluminum nitride powder with D50 of 120, 20, 10, and 0.2 μm and flake boron nitride powder with D50 of 2 μm were weighed in a ratio of 36:8:7:8:6. The weighed alumina powder was then rapidly blended and dried in a drying oven. Next, 89.04% of the powder was weighed, and 8.11% of vinyl-terminated polydimethylsiloxane and 2.85% of a mixed silicone oil containing active hydrogen-based polysiloxanes were added. The mixture was then rapidly blended at 800 rpm for 30 seconds under vacuum, followed by rapid blending at 1200 rpm for 75 seconds to obtain a low-density, high-thermal-conductivity thermally conductive gel with good solid-liquid transition properties.

[0034] Example 4 This embodiment provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), and the preparation method of the solid-liquid transition polymer-based thermal interface material is as follows: First, aluminum nitride powder with D50 of 120, 20, 10, and 2 μm and flake boron nitride with D50 of 0.1 μm were weighed in a ratio of 36:10:8:16:5. The weighed powders were then high-speed blended and dried in a drying oven. Subsequently, 90.36% of the powder was weighed, and 7.14% of vinyl-terminated polydimethylsiloxane and 2.50% of a mixed silicone oil containing active hydrogen-based polysiloxanes were added. The mixture was then high-speed blended at 800 rpm for 30 s under vacuum, followed by high-speed blending at 1200 rpm for 75 s to obtain a low-density, high-thermal-conductivity thermally conductive gel with good solid-liquid transition properties.

[0035] Example 5 This embodiment provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), and the preparation method of the solid-liquid transition polymer-based thermal interface material is as follows: First, aluminum nitride powder with D50 of 120, 10, 2, and 0.2 μm and flake boron nitride with D50 of 50 μm were weighed in a ratio of 36:10:16:8:6. The weighed powders were then high-speed blended and dried in a drying oven. Subsequently, 94.40% of the powder was weighed, and 4.14% of vinyl-terminated polydimethylsiloxane and 1.46% of a mixed silicone oil containing active hydrogen-based polysiloxane were added. The mixture was then high-speed blended at 800 rpm for 30 s under vacuum, followed by high-speed blending at 1200 rpm for 75 s to obtain a low-density, high-thermal-conductivity thermally conductive gel with good solid-liquid transition properties.

[0036] Example 6 This embodiment provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), and the preparation method of the solid-liquid transition polymer-based thermal interface material is as follows: First, aluminum nitride powder with D50 of 120, 20, 2, and 0.2 μm and flake boron nitride with D50 of 10 μm were weighed in a ratio of 36:10:16:8:6. The weighed powders were then high-speed blended and dried in a drying oven. Next, 91.56% of the powder was weighed, and 6.24% of vinyl-terminated polydimethylsiloxane and 2.20% of a mixed silicone oil containing active hydrogen-based polysiloxanes were added, totaling 8.44% by mass. The mixture was then high-speed blended at 800 rpm for 30 s under vacuum, followed by high-speed blending at 1200 rpm for 75 s to obtain a low-density, high-thermal-conductivity thermally conductive gel with good solid-liquid transition properties.

[0037] Example 7 This embodiment provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), and the preparation method of the solid-liquid transition polymer-based thermal interface material is as follows: First, aluminum nitride powder with D50 of 120, 20, 2, and 0.2 μm and flake boron nitride with D50 of 10 μm were weighed in a ratio of 36:10:16:8:6. The weighed powders were then high-speed blended and dried in a drying oven. Subsequently, 83.25% of the powder was weighed, and 12.39% of vinyl-terminated polydimethylsiloxane and 4.36% of a mixed silicone oil containing active hydrogen-based polysiloxane were added. The mixture was then high-speed blended at 800 rpm for 30 s under vacuum, followed by high-speed blending at 1200 rpm for 75 s to obtain a low-density, high-thermal-conductivity thermally conductive gel with good solid-liquid transition properties.

[0038] Comparative Example 1 This comparative example provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), prepared by the following method: First, aluminum nitride powders with D50 values ​​of 120, 20, 10, 2, and 0.2 μm were weighed in a ratio of 36:8:7:6:8. The weighed alumina powder was then rapidly blended with the blended powder and dried in a drying oven. Next, aluminum nitride powder with a mass fraction of 89.04% was weighed, and 8.11% of vinyl-terminated polydimethylsiloxane and 2.85% of a mixed silicone oil containing active hydrogen-based polysiloxanes were added. The mixture was then rapidly blended at 800 rpm for 30 seconds under vacuum, followed by rapid blending at 1200 rpm for 75 seconds to obtain a highly thermally conductive gel.

[0039] Comparative Example 2 This comparative example provides a solid-liquid transition polymer-based thermal interface material (i.e., thermally conductive gel), prepared by the following method: First, alumina powders with D50 values ​​of 120, 30, 10, 2, and 0.2 μm were weighed in a ratio of 36:7:8:16:8. The weighed alumina powders were then subjected to high-speed blending and dried in a drying oven. Next, aluminum nitride powder with a mass fraction of 95.54% was weighed, and 3.30% (by mass) of vinyl-terminated polydimethylsiloxane and 1.16% (by mass) of a mixed silicone oil containing active hydrogen-based polysiloxanes were added. The mixture was then high-speed blended at 800 rpm for 30 seconds under vacuum, followed by high-speed blending at 1200 rpm for 75 seconds to obtain a highly thermally conductive gel.

[0040] (1) Thermal conductivity test: The thermal conductivity of the material was evaluated according to ASTM D5470. The cured thermally conductive gel was cut into pieces (30 mm × 30 mm × 15 mm) and tested using an LW-9389 TIM thermal resistance and conductivity meter at 80°C and 40 psi.

[0041] (2) Density test: The cured thermally conductive gel was cut to size (30 mm × 30 mm × 15 mm) at room temperature. Its density was tested using an unLong DX-300D paste density tester.

[0042] (3) Solid-liquid transition test: Uncured samples were tested using an Anton Paar MCR 302 rotational rheometer at 25°C. A unidirectional rotation mode was used, with a stress of 1500 Pa applied. The time required for accelerated creep to occur was observed and recorded. The time required for accelerated creep was negatively correlated with the sample's tendency to undergo a solid-liquid transition.

[0043] The test results of density, thermal conductivity and accelerated creep time of the composite materials of Examples 1-6 and Comparative Examples 1-2 according to the above method are shown in Table 1.

[0044] Table 1 As can be seen above, the solid-liquid transition polymer-based thermal interface material of the present invention has low density and high thermal conductivity (density of 2.81 g / cm³). 3 Below, the thermal conductivity is 3.46 W·m -1 ·k -1 (Above), the accelerated creep time is 18-92s, which effectively improves the processability and lightweight performance in the thermal management of optical module equipment.

[0045] The applicant declares that this invention illustrates the solid-liquid transition polymer-based thermal interface material, its preparation method, and its application through the above embodiments. However, this invention is not limited to the above embodiments, meaning that this invention does not necessarily rely on the above embodiments for implementation. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of raw materials, additions of auxiliary components, and selection of specific methods, etc., all fall within the protection and disclosure scope of this invention.

Claims

1. A solid-liquid transition polymer-based thermal interface material, characterized in that, The raw materials for preparing the solid-liquid transition polymer-based thermal interface material include the following components: The mixture comprises vinyl-terminated polydimethylsiloxane, active hydrogen-terminated siloxane, and inorganic filler, wherein the inorganic filler includes spherical filler and sheet filler, and the weight ratio of the spherical filler to the sheet filler is 1.5-14:

1.

2. The solid-liquid transition polymer-based thermal interface material according to claim 1, characterized in that, The spherical packing material is spherical aluminum nitride; Preferably, the sheet-like filler is sheet-like boron nitride; Preferably, the D50 particle size of the spherical packing is 0.1μm-120μm, and the D50 particle size of the sheet packing is 0.1μm-100μm.

3. The solid-liquid transition polymer-based thermal interface material according to claim 1 or 2, characterized in that, The vinyl-terminated polydimethylsiloxane is selected from at least one of side-chain vinyl polydimethylsiloxane and single-end vinyl-terminated polydimethylsiloxane. Preferably, the active hydrogen-terminated siloxane is selected from at least one of polydimethylsiloxane containing active hydrogen groups and single-terminated hydrogen-terminated polydimethylsiloxane.

4. The solid-liquid transition polymer-based thermal interface material according to any one of claims 1-3, characterized in that, The vinyl-terminated polydimethylsiloxane was subjected to a temperature of 25°C for 1 second. -1 The viscosity at that time was 10-2500 mPa·s; Preferably, the active hydrogen-terminated siloxane is subjected to oxidation at 25°C for 1 second. -1 The viscosity is 10-2500 mPa·s.

5. The solid-liquid transition polymer-based thermal interface material according to any one of claims 1-4, characterized in that, The total weight of the raw materials used in the preparation of the solid-liquid transition polymer-based thermal interface material is 100%, the content of the active hydrogen-terminated siloxane is 3.27-18.10%, the content of the active hydrogen-terminated siloxane is 1.19-18.10%, and the content of the inorganic filler is 83.25-95.54%.

6. The solid-liquid transition polymer-based thermal interface material according to any one of claims 1-5, characterized in that, The density of the solid-liquid transition polymer-based thermal interface material is 2.0 g / cm³. 3 -3.0 g / cm 3 .

7. The solid-liquid transition polymer-based thermal interface material according to any one of claims 1-6, characterized in that, The accelerated creep time of the solid-liquid transition polymer-based thermal interface material measured on a rotational rheometer under a stress of 1500 Pa is 10-100 s. Preferably, the thermal conductivity of the solid-liquid transition polymer-based thermal interface material is 0.2-20 W / (mK).

8. The method for preparing the solid-liquid transition polymer-based thermal interface material according to any one of claims 1-7, characterized in that, The preparation method includes the following steps: Spherical fillers and sheet fillers are mixed, and then mixed with vinyl-terminated polydimethylsiloxane and active hydrogen-terminated siloxane to obtain the solid-liquid transition polymer-based thermal interface material.

9. The preparation method according to claim 8, characterized in that, The spherical packing and the sheet packing are mixed and then dried at a temperature of 125℃-175℃ for 30-60 minutes. Preferably, the mixture of vinyl-terminated polydimethylsiloxane and active hydrogen-terminated siloxane is rotated at high speeds of 800 r / min and 1200 r / min for 30 s-45 s and 65 s-85 s respectively in a vacuum environment.

10. The solid-liquid transition polymer-based thermal interface material according to any one of claims 1-7, and / or the solid-liquid transition polymer-based thermal interface material prepared by the preparation method according to claims 8-9, in electronic devices.

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