Electronic device including speaker assembly

Abstract

According to an embodiment disclosed herein, an electronic device may be provided. The electronic device may comprise: a housing forming the exterior of the electronic device; and a speaker assembly disposed inside the housing and configured to output sound to the outside of the electronic device. The speaker assembly may include: a first case part; a second case part disposed on a first surface of the first case part; a speaker disposed in a first space surrounded by the first surface of the first case part and the second case part; a flexible circuit board including a first part, which is disposed in the first space and electrically connected to the speaker, and a second part, which is disposed on the first surface of the first case part and extends from the first part to the outside of the first space; a support plate disposed between the second part of the flexible circuit board and the first surface of the first case part; and an adhesive member disposed between the support plate and the first surface of the first case part. An air passage connecting the first space and the outside of the speaker assembly may be formed by a plurality of segments of the adhesive member or along the outermost edge of the adhesive member.

Description

Electronic device including a speaker assembly

[0001] Examples of the present disclosure relate to an electronic device including a speaker assembly.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing formed to form an exterior of the electronic device, and a speaker assembly disposed within the housing and configured to output sound to the outside of the electronic device. The speaker assembly may include a first case portion, a second case portion disposed on a first surface of the first case portion, a speaker disposed in a first space surrounded by the first surface of the first case portion and the second case portion, a flexible circuit board including a first portion disposed in the first space and electrically connected to the speaker, and a second portion disposed on the first surface of the first case portion and extending from the first portion to the outside of the first space, a support plate disposed between the second portion of the flexible circuit board and the first surface of the first case portion, and an adhesive member disposed between the support plate and the first surface of the first case portion. An air passage connecting the first space and the outside of the speaker assembly may be formed by a plurality of parts of the adhesive member or by an air passage formed along the outermost edge of the adhesive member.

[0005] The speaker assembly may include a first case portion, a second case portion disposed on a first surface of the first case portion, a speaker disposed in a first space surrounded by the first surface of the first case portion and the second case portion, a flexible circuit board including a first portion disposed in the first space and electrically connected to the speaker, and a second portion disposed on the first surface of the first case portion and extending from the first portion to the outside of the first space, a support plate disposed between the second portion of the flexible circuit board and the first surface of the first case portion, and an adhesive member disposed between the support plate and the first surface of the first case portion. An air passage may be formed by a plurality of portions of the adhesive member or formed along an outermost edge of the adhesive member, the air passage including a first end region connected to the first space and a second end region connected to the outside of the speaker assembly.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5A is a plan view of a speaker assembly according to one embodiment of the present disclosure.

[0013] FIG. 5b is a cross-sectional perspective view of the speaker assembly taken along line A-A' of FIG. 5a.

[0014] FIG. 6 is an exploded perspective view of a speaker assembly according to one embodiment of the present disclosure.

[0015] FIG. 7A is a side view of a flexible circuit board according to one embodiment of the present disclosure.

[0016] FIG. 7b is a rear perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0017] FIG. 8A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to one embodiment of the present disclosure.

[0018] FIG. 8b is a cross-sectional side view of a second portion of the flexible circuit board taken along line B-B' of FIG. 8a.

[0019] FIG. 9A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to one embodiment of the present disclosure.

[0020] FIG. 9b is a cross-sectional side view of a second portion of the flexible circuit board taken along line C-C' of FIG. 9a.

[0021] FIG. 10A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to one embodiment of the present disclosure.

[0022] FIG. 10b is a cross-sectional side view of a second portion of a flexible circuit board according to one embodiment of the present disclosure, taken along line D-D' of FIG. 10a.

[0023] FIG. 11A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to one embodiment of the present disclosure.

[0024] FIG. 11b is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to one embodiment of the present disclosure.

[0025] FIG. 12 is a rear view showing a flexible circuit board, an adhesive member, and an air passage according to one embodiment of the present disclosure.

[0026] FIG. 13A is a rear perspective view of a speaker assembly according to one embodiment of the present disclosure.

[0027] FIG. 13b is a cross-sectional side view of a substrate assembly according to one embodiment of the present disclosure.

[0028] FIG. 13c is a cross-sectional side view of a second portion of the flexible circuit board taken along line E-E' of FIG. 13a.

[0029] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0030] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0031] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0032] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0033] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall-area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit one embodiment of the present disclosure. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0057] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0058] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (219). The rear plate (219) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (219) and comprises a metal and / or polymer. In one embodiment, the rear plate (219) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0059] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the back plate (219) at least along a portion of an edge. In one embodiment, the front plate (202) (or the back plate (219)) may include only one of the curved extending regions toward the back plate (219) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the back plate (219) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0060] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0061] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0062] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0063] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).

[0064] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) may receive at least a portion of light incident on the first side (210A) (or front side) of the electronic device (101) through the display (201) within the electronic device (101). According to one embodiment, the first camera module (205) and / or the sensor module (204) may be arranged so as to be in contact with the external environment through a transparent area from the internal space of the electronic device (101) to the front plate (202) of the display (201). Additionally, some of the sensor modules (204) may be arranged so as to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device.

[0066] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board (e.g., the printed circuit board (240a) of FIG. 4). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received through a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or processor (e.g., processor (180) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.

[0067] The camera modules (205, 212, 213) are not limited to the above structure, and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0068] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras or triple cameras) each having different properties (e.g., angles of view) or functions. For example, the electronic device (101) may include a plurality of camera modules (205, 212) each having a different angle of view, and the electronic device (101) may control the camera modules (205, 212) to change the angle of view of the camera modules (205, 212) operated in the electronic device (101) based on a user's selection. For example, at least one of the plurality of camera modules (205, 212) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (205, 212) may be a front camera, and at least another may be a rear camera. Additionally, the plurality of camera modules (205, 212) may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). In one embodiment, the IR camera may be operated as at least a part of a sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting a distance to a subject.

[0069] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0070] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0071] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0072] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0073] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (101) of FIG. 2 or FIG. 3) includes a display (201) (e.g., the display (201) of FIG. 2), a front plate (202) (e.g., the front plate (202) of FIG. 2), a support structure (221) (e.g., a bracket), a side bezel structure (or side bezel structure) (212), a camera module (230) (e.g., the camera module (180) of FIG. 1), at least one printed circuit board (or board assembly) (240a, 240b), a battery (245) (e.g., the battery (189) of FIG. 1), a rear case (250), an antenna (not shown) (e.g., the antenna module (197) of FIG. 1) and / or a rear plate (290) (e.g., the rear of FIG. 3). It may include a plate (219)). According to one embodiment, when including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit boards (240a, 240b) may include a first printed circuit board (240a) positioned above the battery (245) (e.g., in the +Y-axis direction) and a second printed circuit board (240b) positioned below the battery (245) (e.g., in the -Y-axis direction), and the flexible printed circuit board (240c) may electrically connect the first printed circuit board (240a) and the second printed circuit board (240b).

[0074] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the support structure (221), the rear case (250), or the flexible printed circuit board (240c)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0075] In one embodiment, the support structure (221) may be provided at least in a flat shape. In one embodiment, the support structure (221) may be disposed inside the electronic device (101) and connected to or formed integrally with the side bezel structure (222). For example, the support structure (221) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (221) at least partially includes a conductive material such as a metal, the side bezel structure (222) or a portion of the support structure (221) may function as an antenna. The support structure (221) may include two sides facing opposite directions. The display (201) may be disposed on one of the two sides of the support structure (221), and the printed circuit board (240a, 240b) may be disposed on the other side.

[0076] In one embodiment, the support structure (221) and the side bezel structure (222) may be combined and referred to as a front case or housing (210). In one embodiment, the housing (210) may be generally understood as a structure for accommodating, protecting, or arranging electrical / electronic components, such as printed circuit boards (240a, 240b) or batteries (245). In one embodiment, the housing (210) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side bezel structure (222), a front plate (202), and / or a back plate (290). In one embodiment, the front or back of the housing (210) may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the support structure (221) is disposed between the front plate (202) (e.g., the first side (210A) of FIG. 2) and the back plate (290) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (240a, 240b) or a camera module (230). In the detailed description below, the camera module (230) of the electronic device (101) may be generally illustrated as including a configuration that receives light incident through the second side (210B) of the electronic device (101), but the electronic device (101) may further include a camera module (e.g., the camera module (205) of FIG. 2) and / or a sensor module (e.g., the sensor module (204) of FIG. 2) disposed to be exposed to the outside through at least a portion of the display (201).

[0077] In one embodiment, the camera module (230) may include at least one camera module, for example, at least one of the plurality of camera modules illustrated in FIGS. 4 and 5. In one embodiment, the camera module (230) may be disposed on a portion of the support structure (221) adjacent to the printed circuit board (240a, 240b). In one embodiment, the camera module (230) may be at least partially enclosed by the rear case (250) (e.g., the upper rear case (250a)). In one embodiment, the camera module (230) may receive at least a portion of light incident through an optical hole or a cover window (232, 233) disposed on the rear of the electronic device (101) (e.g., the second side (210B) of FIG. 3) within the electronic device (101). According to one embodiment, the camera module (230) may be aligned with one or more of the cover window(s) (232, 233).

[0078] According to one embodiment, a circuit device (e.g., a processor), a communication module (e.g., a communication module (190) of FIG. 1), a power management module (e.g., a power management module (188)), or a memory (e.g., a memory (130) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), or various electrical / electronic components implemented in the form of an integrated circuit chip may be disposed on the printed circuit board (240a, 240b). The processor (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In some embodiments, the printed circuit board (240a, 240b) may be provided with an electromagnetic shielding environment from the rear case (250).

[0079] According to one embodiment, the battery (245) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (245) may be disposed substantially on the same plane as, for example, the printed circuit boards (240a, 240b). The battery (245) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0080] In one embodiment, the rear case (250) may include an upper rear case (250a) and a lower rear case (250b). In one embodiment, the upper rear case (250a) may be arranged to surround a printed circuit board (240a, 240b) (e.g., a first printed circuit board (240a)) together with a portion of a support structure (221). For example, the upper rear case (250a) may be arranged to face the support structure (221) with the first printed circuit board (240a) interposed therebetween.

[0081] In one embodiment, the lower rear case (250b) can be utilized as a structure on which various electrical / electronic components, including an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) and a speaker (e.g., an audio module (170) of FIG. 1, a speaker (330) of FIGS. 5b and 6) can be placed. In one embodiment, electrical / electronic components, such as an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed on an additional printed circuit board (not shown). In this case, the lower rear case (250b) can be placed to surround the additional printed circuit board (e.g., a second printed circuit board (240b)) together with another part of the support structure (221). For example, the interface placed on the additional printed circuit board (not shown) or the lower rear case (250) can be placed to correspond to the connector holes (208, 209). According to one embodiment, the lower rear case (250b) may be understood as a portion (e.g., the first case portion (310) of FIGS. 5A to 6) of a case (e.g., the first case portion (310) of FIGS. 5A to 6) for accommodating a speaker (e.g., the audio module (170) of FIG. 1, the speaker (330) of FIGS. 5B and 6). According to one embodiment, the speaker (e.g., the audio module (170) of FIG. 1, the speaker (330) of FIGS. 5B and 6) disposed in the lower rear case (250b) may be provided to output sound to the outside of the electronic device (101) through an acoustic hole (207) (e.g., the acoustic hole (207) of FIG. 2).

[0082] In one embodiment, the antenna (not shown) may include a conductive pattern implemented on the surface of the rear case (250), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the rear plate (290) and the battery (245). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a part or a combination of the support structure (221) and / or the side bezel structure (222).

[0083] FIG. 5A is a plan view of a speaker assembly according to one embodiment of the present disclosure. FIG. 5B is a cross-sectional perspective view of the speaker assembly taken along line A-A' of FIG. 5A. FIG. 6 is an exploded perspective view of the speaker assembly according to one embodiment of the present disclosure.

[0084] The speaker assembly (300) of FIGS. 5A to 6 may be accommodated in the electronic device (101) of FIGS. 1 to 4. According to one embodiment, the speaker assembly (300) of FIGS. 5A to 6 may be arranged to output sound to the outside of the electronic device (101) through a sound hole (e.g., a sound hole (207) of FIGS. 2 and 4) formed in the exterior (e.g., the bottom) of the electronic device (101).

[0085] According to one embodiment, an electronic device (e.g., an electronic device (101) of FIGS. 1 to 4) may include a housing (e.g., a housing (210) of FIGS. 2 to 4) forming a part of an exterior of the electronic device (101), and a speaker assembly (300) disposed within the housing (210) and configured to output sound to the exterior of the electronic device (101).

[0086] According to one embodiment, a speaker assembly (300) may include a case (301), a support structure (380) and a speaker (330) disposed within the case (301), and a flexible circuit board (340).

[0087] In one embodiment, the case (301) may include a first case portion (310) (e.g., the lower rear case (250b) of FIG. 4) and a second case portion (320). In one embodiment, the first case portion (310) may include a first surface (310a) and a second surface (310b) opposite the first surface (310a). For example, the second case portion (320) may be disposed on and coupled to the first surface (310a) of the first case portion (310). For example, the second case portion (320) may be formed to reinforce the overall rigidity of the speaker assembly (300). For example, the first case portion (310) and the second case portion (320) may be coupled to each other or formed integrally. For example, a recess or groove may be formed in the first surface (310a) of the first case portion (310) to receive or settle the second case portion (320). For example, the remaining components of the speaker assembly (300) (e.g., the speaker (330), a portion of the flexible circuit board (340)) may be arranged in the space (e.g., the first space (S1)) surrounded by the first case portion (310) and the second case portion (320). However, in the present disclosure, the configuration of the first case portion (310) in which the second case portion (320) is arranged to form the first space (S1) together is not limited. As an example (see FIGS. 13a to 13c), the first case portion (310) may be a support structure (e.g., support structure (221) of FIG. 4) rather than a lower rear case (e.g., lower rear case (250b) of FIG. 4) of an electronic device (e.g., electronic device (101) of FIGS. 1 to 4).

[0088] Referring to FIGS. 5B and 6 , the first case portion (310) and / or the second case portion (320) may together form a first space (S1) of the speaker assembly (300). The first space (S1) may be a space (e.g., back volume) in which sound output from the speaker (330) resonates. In FIG. 6 , as an example, the shape of the first space (S1) defined by the surface of the first case portion (310) and / or the second case portion (320) may be illustrated by a dotted line.

[0089] Referring to FIGS. 5A to 6, according to one embodiment, a third space (e.g., the third space (S3) of FIG. 6) and a second space (e.g., the second space (S2) of FIG. 5B) that constitute a path (or passage, duct) through which sound output from the speaker (330) is transmitted may be formed in the first case portion (310). According to one embodiment, the first case portion (310) may include a speaker hole (311) located at an end of the second space (S2) and connected to an acoustic hole (e.g., the acoustic hole (207) of FIGS. 2 and 4). For example, sound output from the speaker (330) may sequentially pass through the third space (S3), the second space (S2), and the speaker hole (311) and then be emitted to the outside of the speaker assembly (300). For example, sound output from the speaker (330) can be emitted to the outside of the electronic device (101) through the third space (S3), the second space (S2), the speaker hole (311), and the sound hole (e.g., the sound hole (207) of FIGS. 2 and 4).

[0090] FIG. 7A is a side view of a flexible circuit board according to an embodiment of the present disclosure. FIG. 7B is a rear perspective view of the flexible circuit board according to an embodiment of the present disclosure. FIG. 8A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to an embodiment of the present disclosure. FIG. 8B is a side cross-sectional view of a second portion of the flexible circuit board taken along line B-B' of FIG. 8A.

[0091] The first case portion (310) and the flexible circuit board (340) described below with reference to FIGS. 7a, 7b, 8a, and 8b may be referred to as the first case portion (310) of FIGS. 5a, 5b, and 6, and the flexible circuit board (340) of FIGS. 5a and 6.

[0092] Referring to FIGS. 5A and 7A, 7B, 8A and 8B, according to one embodiment, the flexible circuit board (340) may include a first portion (341) connected to a speaker (330) and a second portion (342) extending from the first portion (341). For example, the first portion (341) may be directly coupled (e.g., soldered) to the speaker (330) or coupled via a connecting member.

[0093] According to one embodiment, the second portion (342) may be disposed in the first space (S1) and in another portion outside the first space (S1) and the case (301). According to one embodiment, the second portion (342) may include a first surface (342a) and a second surface (342b) opposite the first surface (342a). The second surface (242b) may be disposed to face the first surface (310a) of the first case portion (310). For example, one end of the second portion (342) may be connected to a circuit board. For example, the second portion (342) may include a connection member (343) (e.g., a contact pad) electrically connected to the circuit board. Here, the circuit board to which the second portion (342) is connected may be the printed circuit board (240a or 240b) illustrated in FIG. 4 or an additional circuit board not illustrated. For example, the additional circuit board may be placed on the first case portion (310) (or the lower rear case (250b) of FIG. 4).

[0094] Referring to FIGS. 7a, 7b, 8a, and 8b, according to one embodiment, the speaker assembly (300) may include an adhesive layer (350), a support plate (360), and an adhesive member (370) as components disposed between a second portion (342) of a flexible circuit board (340) and the first surface (310a) of the first case portion (310). According to one embodiment, an air passage (P) may be formed around the adhesive member (370) by the shape and arrangement of the adhesive member (370).

[0095] According to one embodiment, the adhesive layer (350) may be disposed between the second portion (342) of the flexible circuit board (340) and the support plate (360). According to one embodiment, the adhesive layer (350) may be adhered or bonded to the second portion (342) of the flexible circuit board (340) and the support plate (360). For example, the adhesive layer (350) may be formed by curing a liquid or semi-solid adhesive, or may be an adhesive member in the form of a sheet such as a double-sided tape.

[0096] In one embodiment, the support plate (360) may serve to reinforce the second portion (342) of the flexible circuit board (340). For example, the support plate (360) may be in the form of a sheet or plate and may include an elastic member (e.g., epoxy) and / or a metal member (e.g., stainless steel).

[0097] According to one embodiment, the adhesive member (370) may be disposed between the support plate (360) and the first surface (310a) of the first case portion (310). The adhesive member (370) may be bonded or adhered to the support plate (360) and the first surface (310a) of the case portion (310). Referring to FIG. 8B, for example, the adhesive member (370) may have a predetermined thickness. For example, the adhesive member (370) may be a double-sided tape.

[0098] According to one embodiment, the air passage (P) may be in the form of a portion of the adhesive member (370) being cut, deleted or opened.

[0099] For example, the air passage (P) may be arranged on the same plane as the adhesive member (370), and the air passage (P) and the adhesive member (370) may have substantially the same thickness (e.g., thickness in the Z-axis direction).

[0100] In one embodiment, the air passage (P) may be formed to cross the adhesive member (370) (e.g., see FIGS. 8A, 8B, 10A to 11B, 13A and 13C). In one embodiment, the air passage (P) may be formed along the outermost edge of the adhesive member (370) (e.g., see FIGS. 9A and 9B). In one embodiment, the air passage (P) is arranged to cross the adhesive member (370), and the adhesive member (370) may include a plurality of portions (371, 372) separated by the air passage (e.g., see FIGS. 8A, 8B, 10A to 11B, 13A and 13C). According to one embodiment, the air passage (P) may include at least one space surrounded or defined by the adhesive member (370), the first surface (310a) of the first case portion (310), and the support plate (360) (e.g., see FIGS. 8a, 8b, 10a-11b, 13a, and 13c).

[0101] According to one embodiment, the air passage (P) may be configured to allow the internal and external air of the speaker assembly (300) to pass through each other, and may serve to adjust the pressure difference between the internal and external air of the speaker assembly (300). According to one embodiment, the air passage (P) may include a first end region (11) connected to the first space (S1) and a second end region (12) connected to the outside of the speaker assembly (300) or open to the outside. For example, when the pressure of the second space (e.g., the second space (S2) of FIG. 5b) and the third space (e.g., the third space (S3) of FIG. 6) increases due to a change in the air pressure outside the electronic device (101), the air pressure of the first space (S1) may be adjusted to the pressure of the second space (S2) and the third space (S3) through the air passage (P). For example, air within the first space (S1) can be exchanged with the speaker assembly (300) through the first end region (11), the air passage (P), and the second end region (12). The air passage (P) of the present disclosure can provide an effect of enabling pressure control within the first space (S1) and preventing damage to the speaker (330) (e.g., diaphragm) due to a sudden increase in pressure.

[0102] In one embodiment, the second end region (12) may be disposed at the outermost edge of the adhesive member (370). For example, when the adhesive member (370) is smaller than the second portion (342) and the outermost edge of the adhesive member (370) is disposed inside the edge of the second portion (342) of the flexible circuit board (340), the second end region (12) of the air passage (P) may be disposed between the second portion (342) and the first case portion (310). For example, although not shown, when the adhesive member (370) is larger than the second portion (342), the outermost edge of the adhesive member (370) and the second end region (12) may be disposed outside the edge of the second portion (342) of the flexible circuit board (340).

[0103] The width of the air passage (P) of the present disclosure (e.g., d1 in FIGS. 8b and 13, d2, d3 in FIG. 9b, and d4, d5 in FIG. 10b) can be set to a fine size. According to one embodiment, the width of the air passage (P) (e.g., d1 in FIGS. 8b and 13, d2, d3 in FIG. 9b, and d4, d5 in FIG. 10b)

[0104] According to one embodiment, the width of the air passage (P) (e.g., d1 in FIGS. 8B and 13, d2 and d3 in FIG. 9B, and d4 and d5 in FIG. 10B) may be from about 0.05 mm to about 0.2 mm, from about 0.05 mm to about 0.15 mm, or from about 0.08 mm to about 0.12 mm. According to one embodiment, the height or thickness of the air passage (P) (e.g., the first thickness (t1) in FIGS. 8B, 9B, 10B, and 13C) may be from about 0.005 mm to about 0.02 mm, from about 0.005 mm to about 0.015 mm, or from about 0.0008 mm to about 0.0012 mm. According to one embodiment, the width of the air passage (P) (e.g., d1 in FIGS. 8B and 13, d2 and d3 in FIG. 9B, and d4 and d5 in FIG. 10B) may be about 0.1 mm, and the first thickness (t1) of the air passage (P) may be about 0.01 mm. For example, the first thickness (t1) of the air passage (P) may be about 0.25 to about 0.75 times, or about 0.5 times, the second thickness (t2) of the support plate (360). For example, the first thickness (t1) of the air passage (P) may be about 1.5 to about 3 times, or in one example, about 2 times, the second thickness (t2) of the support plate (360). For example, the third thickness (t3) of the flexible circuit board (340) may be about 15 to about 20 times, for example, about 15 times, the first thickness (t1) of the air passage (P).

[0105] In one embodiment, the cross-sectional area cut in a direction perpendicular to the length direction of the air passage (P) is 0.0001 mm 2 Within 0.003 mm 2, 0.0004 mm 2 Within 0.002 mm 2 or 0.0007 mm 2 0.0013 mm 2 It can be. Here, the longitudinal direction of the air passage (P) can be understood as the direction in which the air passage (P) extends, and the cross-sectional area cut in the direction perpendicular to the longitudinal direction can be a value obtained by multiplying the width of the air passage (P) described above (e.g., d1 in FIGS. 8b and 13, d2, d3 in FIG. 9b, and d4, d5 in FIG. 10b) by the height or thickness of the air passage (P) (e.g., the first thickness (t1) in FIGS. 8b, 9b, 10b, and 13c).

[0106] The shape and extension direction of the air passage (P) of the present disclosure may vary and are not limited. For example, the air passage (P) may include straight paths formed in a plurality of directions, and may also include curved paths. The width, thickness, cross-sectional area, length, shape, and / or arrangement of the air passage (P) of the present disclosure may be set according to the ventilation amount required for the air passage (P), and may be changed according to factors such as the usage environment, structure, and / or specifications of the electronic device (101) and / or the speaker assembly (300). According to one embodiment of the present disclosure, the air passage (P) may be formed to have a fine width, thickness, and / or cross-sectional area, thereby enabling fine adjustment of the ventilation amount, thereby improving the control performance of the internal and external air pressure difference of the speaker assembly (300) and maintaining normal diaphragm operation even under rapid air pressure changes, thereby reducing or preventing sound distortion.

[0107] FIG. 9A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to an embodiment of the present disclosure. FIG. 9B is a side cross-sectional view of a second portion of the flexible circuit board taken along line C-C' of FIG. 9A. FIG. 10A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to an embodiment of the present disclosure. FIG. 10B is a side cross-sectional view of a second portion of the flexible circuit board according to an embodiment of the present disclosure taken along line D-D' of FIG.

[0108] The first case portion (310) of FIGS. 9A and 10A may be referred to as the first case portion (310) of FIGS. 5A to 6. The flexible circuit board (340), the adhesive layer (350), and the support plate (360) of the embodiments of FIGS. 9A to 10B may be referred to as the flexible circuit board (340), the adhesive layer (350), and the support plate (360) of the embodiments of FIGS. 7A to 8B. The description of the adhesive member (370) and the air passage (P) described above with reference to FIGS. 7A to 8B may be applied identically or similarly to the embodiments of FIGS. 9A to 10B. The embodiments of FIGS. 9A to 10B may differ from the embodiments of FIGS. 7A to 8B in the shape, structure, and / or arrangement of the adhesive member (370) and the air passage (P).

[0109] Referring to FIGS. 9A to 10B , according to one embodiment, the air passage (P) may include a plurality of air passages (P2, P3, P4, P5) spaced apart from each other. For example, the number, length, shape, and / or arrangement of the air passages may be set according to the ventilation amount required for the air passage (P), and may be changed according to factors such as the usage environment, structure, and / or specifications of the electronic device (101) and / or the speaker assembly (300). For example, the shapes and extension directions of the plurality of air passages (P2, P3, P4, P5) may vary and are not limited. For example, the plurality of air passages (P2, P3, P4, P5) may include straight paths formed in a plurality of directions, and may also include curved paths.

[0110] Referring to FIGS. 9A and 9B, according to one embodiment, the air passage (P) may be formed along the outermost edge of the adhesive member (370). According to one embodiment, the air passage (P) may include a first air passage (P1) and a second air passage (P2) spaced apart from the first air passage (P1). According to one embodiment, the first air passage (P1) may include a first-first end region (111) connected to a first space (e.g., the first space (S1) of FIG. 5b) within a speaker assembly (e.g., the speaker assembly (300) of FIGS. 5a to 6). According to one embodiment, the second air passage (P2) may include a first-second end region (112) connected to the first space (S1) and spaced apart from the first-first end region (111). For example, the width of the first ventilation passage (P1) (e.g., indicated by d3 in FIG. 9b) and the width of the second air passage (P2) (e.g., indicated by d4 in FIG. 10b) may be different from or the same as each other.

[0111] The embodiments of FIGS. 9A and 9B can be combined with the embodiments of FIGS. 8A, 8B, 10A to 13C. In one embodiment, the air passage (P) can include both a passage formed along the outermost edge of the adhesive member (370) and a passage formed across the adhesive member (370).

[0112] Referring to FIGS. 10A and 10B, according to one embodiment, the air passage (P) may include a first air passage (P1) and a second air passage (P2) spaced apart from the first air passage (P1). According to one embodiment, the first air passage (P1) may include a first-first end region (111) connected to a first space (e.g., the first space (S1) of FIG. 5b) in a speaker assembly (e.g., the speaker assembly (300) of FIGS. 5a to 6) and a second end region (121) connected to the exterior of the speaker assembly (300). According to one embodiment, the second air passage (P2) may include a first-second end region (112) connected to the first space (S1) and spaced apart from the first-first end region (111) and a second-second end region (122) connected to the exterior of the speaker assembly (300) and spaced apart from the second-first end region (121). For example, the width of the first ventilation passage (P1) (e.g., indicated by d4 in FIG. 10b) and the width of the second air passage (P2) The widths (e.g., indicated as d5 in Fig. 1Ob) may be different or the same.

[0113] FIG. 11A is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to an embodiment of the present disclosure. FIG. 11B is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to an embodiment of the present disclosure. FIG. 12 is a rear view illustrating a flexible circuit board, an adhesive member, and an air passage according to an embodiment of the present disclosure.

[0114] The flexible circuit board (340) of FIGS. 11A, 11A, and 12 may be referred to as the flexible circuit board (340) of the embodiment of FIGS. 5A to 7B. The description of the adhesive member (370) and the air passage (P) described above with reference to FIGS. 7A to 8B may be applied identically or similarly to the embodiment of FIGS. 11A, 11A, and 12. The embodiment of FIGS. 11A, 11A, and 12 may differ from the embodiment of FIGS. 7A to 10B in the shape, structure, and / or arrangement of the adhesive member (370) and the air passage (P).

[0115] Referring to FIGS. 11A and 11B, according to one embodiment, the air passage (P) may include at least one branch (Pb) in the form of a closed path extending from a portion disposed between the first end region (11) and the second end region (12). For example, the branch (Pb) may serve to alleviate the sudden increase in the amount of ventilation by providing a space for some air to escape when the amount of ventilation within the air passage (P) suddenly increases. For example, the branch (Pb) may provide the advantage of reducing sound distortion or noise of a speaker (e.g., the speaker (330) of FIG. 6) caused by the sudden increase in the amount of ventilation within the air passage (P). For example, the number and / or shape of the branches (Pb) may be set in various ways. For example, the branch (Pb) may include a closed curved path such as a circle or a spiral. For example, the branch (Pb) may include a closed end and a straight path and / or a curved path. Referring to FIG. 11a, according to one embodiment, the branch (Pb) may comprise a closed curved path (e.g., a circle). Referring to FIG. 11b, according to one embodiment, the branch (Pb) may comprise a straight path including a closed end.

[0116] Referring to FIG. 12, according to one embodiment, the air passages (P) may be implemented in a plurality. For example, in FIG. 12, the dotted lines may represent air passages (P) arranged between adhesive members (370), the extension direction of the air passages (P) and / or the path of air in the air passages (P). According to one embodiment, the air passages (P) may include a plurality of passages extending in a first direction (e.g., the X-axis direction in FIG. 12) and spaced apart from each other, and a plurality of passages extending in a second direction (e.g., the Y-axis direction in FIG. 12) intersecting the first direction and spaced apart from each other. In other words, according to one embodiment, the air passages (P) may be in a grid shape. Referring to FIG. 12, according to one embodiment, the adhesive member (370) may be an adhesive member such as a tape (e.g., a double-sided tape) or may be formed by curing a liquid adhesive. However, in the present disclosure, the type or kind of the adhesive member (370) is not limited.

[0117] FIG. 13A is a rear perspective view of a speaker assembly according to one embodiment of the present disclosure. FIG. 13B is a side cross-sectional view of a substrate assembly according to one embodiment of the present disclosure. FIG. 13C is a side cross-sectional view of a second portion of a flexible circuit board taken along line E-E' of FIG. 13A.

[0118] The embodiments of FIGS. 13A to 13C can be combined with the embodiments described above with reference to FIGS. 5A to 11B. The speaker assembly (300) of the embodiments of FIGS. 13A to 13C may have a difference from the speaker assembly (300) according to the embodiments described above with reference to FIGS. 5A to 11B in that the first case portion (310) is replaced with a support structure (390). The description of the remaining components of the speaker assembly (300) described above with reference to FIGS. 5A to 11B, excluding the description of the first case portion (310), may be applied identically or similarly to the speaker assembly (300) of the embodiments of FIGS. 13A to 13C, and may not be described repeatedly hereinafter.

[0119] The flexible circuit board (340), the adhesive layer (350), and the support plate (360) of the embodiments of FIGS. 13a to 13c may be referred to as the flexible circuit board (340), the adhesive layer (350), and the support plate (360) of the embodiments of FIGS. 7a to 8b. The descriptions regarding the adhesive member (370) and the air passage (P) described above with reference to FIGS. 7a to 11b may be applied identically or similarly to the embodiments of FIGS. 13a to 13c.

[0120] Referring to FIGS. 13A to 13C , according to one embodiment, a speaker assembly (300) may be disposed on a support structure (390) (e.g., the support structure (221) of FIG. 4 ) disposed within an electronic device (e.g., the electronic device (101) of FIGS. 1 to 4 ). In the present disclosure, the support structure (390) may also be referred to as a “first case portion.” According to one embodiment, the speaker assembly (300) may include a second case portion (320) disposed on the support structure (390) (or the first case portion), a speaker (330) disposed in a first space (S1) (or resonance space) surrounded by the support structure (390) and the second case portion (320), and a flexible circuit board (340) at least partially disposed in the first space (S1). According to one embodiment, the second case portion (320) of the speaker assembly (300) may be disposed on a circuit board (e.g., the second printed circuit board (240b) of FIG. 4), and the speaker (330) and at least a portion of the flexible circuit board (340) may be disposed in a first space (S1) (or resonant space) surrounded by the second case portion (320) and the circuit board (e.g., the first printed circuit board (240a) of FIG. 4).

[0121] According to one embodiment, the second case portion (320) may include a speaker hole (321) connected to an acoustic hole (e.g., an acoustic hole (207) of FIGS. 2 and 4). For example, sound output from the speaker (330) may be transmitted through a sound transmission path (or passage, duct) (e.g., the second space (S2) of FIG. 5b and / or the third space (S3) of FIG. 6) inside the speaker assembly (300), the speaker hole (321), and may be emitted to the outside of the speaker assembly (300) through, for example, an acoustic hole (e.g., an acoustic hole (207) of FIGS. 2 and 4).

[0122] Referring to Fig. 13c, the description of the adhesive member (370) and the air passage (P) described above with reference to Figs. 7a to 11b may be applied identically or similarly to the adhesive member (370) and the air passage (P). According to one embodiment, the air passage (P) may be a space surrounded by the support plate (360), the adhesive member (370), and the support structure (390).

[0123] According to one embodiment, the speaker assembly (300) may include an adhesive layer (350), a support plate (360), and an adhesive member (370) as components disposed between a second portion (342) of a flexible circuit board (340) and the first surface (310a) of the first case portion (310). According to one embodiment, an air passage (P) may be formed around the adhesive member (370) by the shape and arrangement of the adhesive member (370).

[0124] Aspects of the present disclosure are intended to solve at least the problems and / or disadvantages described above and to provide at least the advantages described below.

[0125] According to an embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (210) formed to form an exterior of the electronic device, and a speaker assembly (300) disposed within the housing and configured to output sound to the outside of the electronic device. The speaker assembly may include a flexible circuit board (340) including a first case portion (310), a second case portion (320) disposed on a first surface (310a) of the first case portion, a speaker (330) disposed in a first space (S1) surrounded by the first surface of the first case portion and the second case portion, a first portion (341) disposed in the first space (S1) and electrically connected to the speaker, and a second portion (342) disposed on the first surface of the first case portion and extending from the first portion to the outside of the first space, a support plate (360) disposed between the second portion of the flexible circuit board and the first surface of the first case portion, and an adhesive member (370) disposed between the support plate and the first surface of the first case portion. An air passage (P) formed by a plurality of parts (371, 372) of the adhesive member or formed along the outermost edge of the adhesive member may be formed to connect the first space and the outside of the speaker assembly.

[0126] According to one embodiment, the air passage may include a first end region (11, 111, 121) connected to the first space and a second end region (12, 112, 122) connected to the exterior of the speaker assembly.

[0127] In one embodiment, the second end region may be disposed between the outermost edges of the plurality of portions of the adhesive member.

[0128] According to one embodiment, the air passage may include at least one space surrounded or defined by the adhesive member, the first surface of the first case portion, and the support plate.

[0129] According to one embodiment, the air passage may be formed to cross a plurality of portions (371, 372) of the adhesive member.

[0130] According to one embodiment, the air passage may include a plurality of air passages (P2, P3, P4, P5) spaced apart from each other.

[0131] According to one embodiment, the air passage may include a first air passage (P1) including a first-first end region (111) connected to the first space and a second end region (121) connected to the exterior of the speaker assembly, and a second air passage (P2) including a first-second end region (112) connected to the first space and spaced apart from the first-first end region, and a second-second end region (122) connected to the exterior of the speaker assembly and spaced apart from the second-first end region.

[0132] According to one embodiment, the air passage may include at least one branch (Pb) connected to a portion disposed between the first end region and the second end region and including a closed end.

[0133] According to one embodiment, the size of the cross-sectional area in the width direction cut in the direction perpendicular to the longitudinal direction of the air passage is 0.0001 mm. 2 Within 0.003mm 2 It could be.

[0134] According to one embodiment, the speaker assembly may further include a bonding layer (350) disposed between the flexible circuit board and the support plate, the speaker assembly being coupled to the flexible circuit board and the support plate.

[0135] According to one embodiment, the adhesive member may include a double-sided tape bonded to the support plate and the first surface of the first case portion.

[0136] According to one embodiment, the air passage may be in the form of a grid including a plurality of passages extending in a first direction and spaced apart from each other and a plurality of passages extending in a second direction intersecting the first direction and spaced apart from each other.

[0137] In one embodiment, the adhesive member can be formed by curing a liquid adhesive.

[0138] According to one embodiment, the electronic device further includes a support structure disposed within the housing, the first case portion being a part of the support structure, and the second case portion being coupled to the first case portion.

[0139] According to an embodiment of the present disclosure, a speaker assembly (300) may be provided. The speaker assembly may include a first case portion (310), a second case portion (320) disposed on a first surface (310a) of the first case portion, a speaker (330) disposed in a first space (S1) surrounded by the first surface of the first case portion and the second case portion, a flexible circuit board (340) including a first portion (341) disposed in the first space (S1) and electrically connected to the speaker, and a second portion (342) disposed on the first surface of the first case portion and extending from the first portion to the outside of the first space, a support plate (360) disposed between the second portion of the flexible circuit board and the first surface of the first case portion, and an adhesive member (370) disposed between the support plate and the first surface of the first case portion. An air passage (P) formed by a plurality of parts (371, 372) of the adhesive member or formed along the outermost edge of the adhesive member, may be formed, including a first end region (11, 111, 121) connected to the first space and a second end region (12, 112, 122) connected to the outside of the speaker assembly.

[0140] In one embodiment, the second end region is disposed between the outermost edges of the plurality of portions of the adhesive member, and the air passage may include at least one space surrounded or defined by the adhesive member, the first surface of the first case portion, and the support plate.

[0141] According to one embodiment, the air passage may include a plurality of air passages (P2, P3, P4, P5) spaced apart from each other.

[0142] According to one embodiment, the air passage may include at least one branch (Pb) connected to a portion disposed between the first end region and the second end region and including a closed end.

[0143] According to one embodiment, the size of the cross-sectional area in the width direction cut in the direction perpendicular to the longitudinal direction of the air passage is 0.0001 mm. 2 Within 0.003mm 2 It could be.

[0144] According to one embodiment, the air passage may be in the form of a grid including a plurality of passages extending in a first direction and spaced apart from each other and a plurality of passages extending in a second direction intersecting the first direction and spaced apart from each other.

[0145] The speaker assembly of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0146] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0147] Typically, a speaker assembly of an electronic device may include an air passage (e.g., an air vent) to regulate or maintain the air pressure inside the speaker assembly. For example, in an environment where air pressure inside and outside the electronic device changes, the diaphragm of the speaker inside the speaker assembly may be pressed upward or downward due to the air pressure difference between the inside and outside of the speaker assembly. If this deformation of the diaphragm continues for a long period of time, the diaphragm may be deformed or damaged. The air passage may be connected to the inside and outside of the speaker assembly to regulate the air pressure inside the speaker assembly and improve the sound quality of the speaker.

[0148] For example, in order to control the internal and external air pressure difference of a speaker assembly, a conventional method of forming a vent hole connected to a resonance space (or back volume) may be applied, which involves forming an opening in the speaker assembly case and arranging a mesh member. However, this method has the problem of high manufacturing costs, and there may be a limitation that the back volume of the speaker assembly is reduced by the amount of space where the mesh member is arranged. For example, in order to control the internal and external air pressure difference of a speaker assembly, a conventional method of forming an air passage (or duct) in the injection molding case of the speaker assembly may be applied. In this case, in order to form an air passage in the injection molding case, an injection mold or processing tool with a shape corresponding to the air passage is used, so there may be limitations in forming the air passage in a fine size. If the width of the air passage is not formed sufficiently small, it is difficult to finely adjust the ventilation amount, which may cause sound distortion and deteriorate speaker performance.

[0149] The present invention relates to a structure of an air passage (e.g., an air vent) for controlling the pressure difference between the inside and outside of a speaker assembly of an electronic device, and to a speaker assembly and an electronic device including the same. According to one embodiment of the present disclosure, a speaker assembly including an air passage, which is implemented by cutting, deleting, or opening a portion of an adhesive member that connects the flexible circuit board to a case of the speaker assembly and is provided on one side of a flexible circuit board that extends from a resonance space (or back volume) of the speaker assembly to the outside of the speaker assembly, can be provided, and an electronic device including the same can be provided. However, the problem to be solved in the present disclosure is not limited to the problem mentioned above, and various changes can be made without departing from the spirit and scope of the present disclosure.

[0150] According to one embodiment of the present disclosure, an air passage for adjusting the internal and external air pressure difference of a speaker assembly is implemented in a form in which a portion of an adhesive member provided on one surface of a flexible circuit board is cut, deleted, or opened, thereby reducing manufacturing difficulty and material cost, and enabling the width of the air passage to be implemented minutely. According to one embodiment of the present disclosure, since the air passage can be formed to have a minute width, minute adjustment of the ventilation amount is possible, thereby improving the performance of adjusting the internal and external air pressure difference of the speaker assembly, and maintaining normal diaphragm operation even in rapid air pressure changes, so that sound distortion can be reduced or prevented. The effects obtainable from the present disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly identified through this document can be provided.

[0151] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0152] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0153] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0154] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0155] According to one embodiment, the method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0156] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (210) formed to form the exterior of the electronic device; and It includes a speaker assembly (300) disposed within the above housing and configured to output sound to the outside of the electronic device, and The above speaker assembly, Part 1 of the case (310); A second case portion (320) disposed on the first surface (310a) of the first case portion; A speaker (330) placed in a first space (S1) surrounded by the first surface of the first case part and the second case part; A flexible circuit board (340) comprising a first part (341) disposed in the first space (S1) and electrically connected to the speaker, and a second part (342) disposed on the first surface of the first case part and extending from the first part to the outside of the first space; A support plate (360) disposed between the second part of the flexible circuit board and the first surface of the first case part; and It includes an adhesive member (370) disposed between the support plate and the first surface of the first case part, and An electronic device having an air passage (P) formed by a plurality of parts (371, 372) of the adhesive member or along the outermost edge of the adhesive member, the air passage connecting the first space and the outside of the speaker assembly.

2. In paragraph 1, The above air passage comprises a first end region (11, 111, 121) connected to the first space and a second end region (12, 112, 122) connected to the outside of the speaker assembly, an electronic device.

3. In paragraph 2, The above second end region is an electronic device disposed between the outermost edges of the plurality of parts of the adhesive member.

4. In any one of paragraphs 1 to 3, The above air passage comprises at least one space surrounded or defined by the adhesive member, the first surface of the first case portion, and the support plate, in an electronic device.

5. In any one of paragraphs 1 to 4, The above air passage is formed to cross a plurality of parts (371, 372) of the adhesive member, an electronic device.

6. In any one of paragraphs 1 to 5, The above air passage is an electronic device comprising a plurality of air passages (P2, P3, P4, P5) spaced apart from each other.

7. In any one of paragraphs 1 through 6, The electronic device comprises an air passage including a first air passage (P1) comprising a first-1 end region (111) connected to the first space and a second end region (121) connected to the outside of the speaker assembly, and a second air passage (P2) comprising a first-2 end region (112) connected to the first space and spaced apart from the first-1 end region and a second-2 end region (122) connected to the outside of the speaker assembly and spaced apart from the second-1 end region.

8. In paragraph 7, An electronic device wherein the air passage comprises at least one branch (Pb) connected to a portion disposed between the first end region and the second end region and including a closed end.

9. In any one of paragraphs 1 to 8, The size of the cross-sectional area in the width direction cut perpendicular to the length direction of the above air passage is 0.0001mm 2 Within 0.003mm 2 People, electronic devices.

10. In any one of paragraphs 1 to 9, An electronic device, wherein the speaker assembly is disposed between the flexible circuit board and the support plate, and the speaker assembly further includes a bonding layer (350) coupled to the flexible circuit board and the support plate.

11. In any one of paragraphs 1 through 10, An electronic device comprising a double-sided tape bonded to the first surface of the support plate and the first case portion, wherein the adhesive member comprises the above-mentioned support plate and the first surface of the first case portion.

12. In any one of paragraphs 1 through 11, An electronic device in which the air passage is in the form of a grid including a plurality of passages extending in a first direction and spaced apart from each other and a plurality of passages extending in a second direction intersecting the first direction and spaced apart from each other.

13. In paragraph 12, An electronic device in which the above adhesive member is formed by curing a liquid adhesive.

14. In any one of paragraphs 1 to 13, The electronic device further comprises a support structure disposed within the housing, An electronic device wherein the first case portion is a part of the support structure, and the second case portion is coupled to the first case portion.

15. In the speaker assembly (300), Part 1 of the case (310); A second case portion (320) disposed on the first surface (310a) of the first case portion; A speaker (330) placed in a first space (S1) surrounded by the first surface of the first case part and the second case part; A flexible circuit board (340) comprising a first part (341) disposed in the first space (S1) and electrically connected to the speaker, and a second part (342) disposed on the first surface of the first case part and extending from the first part to the outside of the first space; A support plate (360) disposed between the second part of the flexible circuit board and the first surface of the first case part; and It includes an adhesive member (370) disposed between the support plate and the first surface of the first case part, and A speaker assembly having an air passage (P) formed by a plurality of parts (371, 372) of the adhesive member or along the outermost edge of the adhesive member, the air passage comprising a first end region (11, 111, 121) connected to the first space and a second end region (12, 112, 122) connected to the outside of the speaker assembly.

Images