Multi-foldable electronic device including antenna

Abstract

According to embodiments of the present disclosure, provided is a multi-foldable electronic device comprising: a multi-foldable housing including a first housing, a second housing, a third housing between the first housing and the second housing, a first hinge portion configured to rotatably connect the first housing with the third housing, and a second hinge portion configured to rotatably connect the second housing with the third housing, wherein the second housing is configured to be positioned between the first housing and the third housing in a folded state of the multi-foldable electronic device; a flexible display module including a first display area arranged in the first housing, a third display area extending from the first display area and arranged in the third housing, and a second display area extending from the third display area and arranged in the second housing; at least one antenna radiator configured to transmit and / or receive a signal in a designated frequency band; and a metal layer located in the second housing and configured to adjust frequency characteristics of the at least one antenna radiator in the folded state of the multi-foldable electronic device, wherein, in the folded state of the multi-foldable electronic device, the metal layer is located between the first display area of the flexible display module and a ground structure located in the second housing, and is electrically connected to the ground structure.

Description

Multi-foldable electronic device including antenna

[0001] The present disclosure relates to a multi-foldable electronic device including an antenna.

[0002] A multi-foldable electronic device may have metal members that overlap each other when transitioning from an unfolded state to a folded state.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] When a multi-foldable electronic device transitions from an unfolded state to a folded state, overlapping metal members can cause parasitic resonance, which can degrade antenna radiation performance.

[0005] Embodiments of the present disclosure provide a multi-foldable electronic device including an antenna that can reduce deterioration of antenna radiation performance due to parasitic resonance by adjusting parasitic resonance caused by metal members that overlap each other when the multi-foldable electronic device is converted from an unfolded state to a folded state.

[0006] The technical challenges to be addressed in this disclosure are not limited to the technical challenges mentioned above. Other technical challenges not mentioned above will be readily apparent to those skilled in the art, based on the description below. Various embodiments of this disclosure are provided to address the aforementioned challenges.

[0007] According to embodiments of the present disclosure, a multi-foldable electronic device includes a multi-foldable housing, a flexible display module, at least one antenna radiator, and a metal layer. The multi-foldable housing includes a first housing, a second housing, and a third housing between the first housing and the second housing. The multi-foldable housing includes a first hinge portion configured to rotatably connect the first housing and the third housing. The multi-foldable housing includes a second hinge portion configured to rotatably connect the second housing and the third housing. The multi-foldable housing is configured such that the second housing is positioned between the first housing and the third housing when the multi-foldable electronic device is in a folded state. The flexible display module includes a first display area disposed in the first housing, a third display area extending from the first display area and disposed in the third housing, and a second display area extending from the third display area and disposed in the second housing. At least one antenna radiator is configured to transmit and / or receive a signal in a specified frequency band. The metal layer is positioned in the second housing and is configured to adjust frequency characteristics for at least one antenna radiator in a folded state of the multi-foldable electronic device. The metal layer is positioned between the first display area of ​​the flexible display module and a ground structure positioned in the second housing in the folded state of the multi-foldable electronic device. The metal layer is electrically connected to the ground structure.

[0008] A multi-foldable electronic device including an antenna according to various embodiments of the present disclosure can reduce degradation of antenna radiation performance (e.g., radio wave transmission / reception performance) due to parasitic resonance by preventing parasitic resonance that may occur due to overlapping metal members when switching from an unfolded state to a folded state from being included in (or suppressed from being included in) an operating frequency band of at least one antenna radiator.

[0009] In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0010] The above and other aspects, features, and advantages of the embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0012] FIG. 2A is a diagram illustrating an unfolded multi-foldable electronic device according to various embodiments of the present disclosure.

[0013] FIG. 2B is a diagram illustrating an unfolded multi-foldable electronic device according to various embodiments of the present disclosure.

[0014] FIG. 2C is a diagram illustrating a portion of an unfolded multi-foldable electronic device according to various embodiments of the present disclosure.

[0015] FIG. 3A is a diagram illustrating a multi-foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0016] FIG. 3b is a diagram illustrating a multi-foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0017] FIG. 3c is a diagram illustrating a multi-foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0018] FIG. 4A is a partial cross-sectional perspective view of a portion of a multi-foldable electronic device in a folded state taken along line E-E' of FIG. 3A according to various embodiments of the present disclosure.

[0019] FIG. 4b is a partial cross-sectional perspective view of a portion of a multi-foldable electronic device in a folded state taken along line E-E' of FIG. 3a according to various embodiments of the present disclosure.

[0020] FIG. 5 is a cross-sectional view of a portion of a multi-foldable electronic device in a folded state taken along line F-F' of FIG. 3A according to various embodiments of the present disclosure.

[0021] FIG. 6 is a partially exploded perspective view of a multi-foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0022] FIG. 7 is a diagram illustrating an unfolded multi-foldable electronic device according to various embodiments of the present disclosure.

[0023] FIG. 8A is a cross-sectional view of a portion of a multi-foldable electronic device in a folded state taken along line E-E' of FIG. 3A according to various embodiments of the present disclosure.

[0024] FIG. 8B is a cross-sectional view of a portion of a multi-foldable electronic device in a folded state taken along line E-E' of FIG. 3A according to various embodiments of the present disclosure.

[0025] FIG. 9 is a cross-sectional view of a portion of a foldable electronic device as a comparative example for comparison with FIG. 8b, according to various embodiments of the present disclosure.

[0026] FIG. 10 is a graph showing antenna radiation performance in a folded state of a multi-foldable electronic device of the present disclosure and a multi-foldable electronic device of a comparative example, according to various embodiments of the present disclosure.

[0027] FIG. 11 is a partially exploded perspective view of a multi-foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0028] FIG. 12A is a diagram illustrating the shape of a metal layer in a multi-foldable electronic device according to various embodiments of the present disclosure, and heat maps of electric field distribution and frequency of parasitic resonance according to the shape of the metal layer.

[0029] FIG. 12b is a graph showing the radiation efficiency for a folded state of a multi-foldable electronic device according to the shape of a metal layer according to various embodiments of the present disclosure.

[0030] FIG. 12c is a graph showing the overall efficiency for a folded state of a multi-foldable electronic device according to the shape of the metal layer according to various embodiments of the present disclosure.

[0031] FIG. 13 is a diagram showing a shorting point on a metal layer in a multi-foldable electronic device according to various embodiments of the present disclosure, and a graph showing radiation efficiency for a folded state of the multi-foldable electronic device according to the shorting point.

[0032] FIG. 14 is a graph showing antenna radiation performance for a first antenna including at least one first antenna radiator in a multi-foldable electronic device in a folded state according to element values ​​of a first matching circuit according to various embodiments of the present disclosure.

[0033] FIG. 15 is a graph showing antenna radiation performance for a second antenna including at least one second antenna radiator in a multi-foldable electronic device in a folded state according to element values ​​of a second matching circuit according to various embodiments of the present disclosure.

[0034] FIG. 16 is a graph showing antenna radiation performance for a first antenna including at least one first antenna radiator in a multi-foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0035] FIG. 17 is a graph showing antenna radiation performance for a second antenna including at least one second antenna radiator in a multi-foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0036] FIG. 18 is a drawing showing a portion of a multi-foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0037] FIG. 19 is a diagram showing a folded state of a multi-foldable electronic device according to various embodiments of the present disclosure.

[0038] FIG. 20 is a diagram showing a folded state of a multi-foldable electronic device according to various embodiments of the present disclosure.

[0039] FIG. 21 is a diagram illustrating a sliderable electronic device according to various embodiments of the present disclosure.

[0040] Hereinafter, various embodiments of the present disclosure will be described in more detail. The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While various specific details are included herein to aid understanding, they are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of known functions and configurations may be omitted for clarity and brevity.

[0041] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are merely used to facilitate a clear and consistent understanding of the present disclosure. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0042] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present disclosure.

[0043] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an external electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). The electronic device (101) may communicate with the external electronic device (104) via the server (108). The external electronic device (102 or 104) may include, but is not limited to, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device, for example. The electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), and / or an antenna module (197). In various embodiments of the present disclosure, at least one of these components may be omitted, or one or more other components may be added to the electronic device (101). In various embodiments of the present disclosure, some of these components may be implemented as a single integrated circuitry. For example, a sensor module (176), a camera module (180), or an antenna module (197) may be implemented embedded in one component (e.g., a display module (160)).

[0044] The processor (120) may include various processing circuits and / or multiple processors. For example, the term “processor” as used in this disclosure, including the claims, may include various processing circuits, including at least one processor, wherein one or more of the at least one processor may be configured to individually and / or collectively perform the various functions described in this disclosure in a distributed manner. When the terms “processor,” “at least one processor,” and “one or more processors” as used in this disclosure are described as being configured to perform a number of functions, these terms encompass, for example, without limitation, situations where one processor performs some of the recited functions and other processor(s) perform other of the recited functions, and situations where a single processor may perform all of the recited functions. Furthermore, the at least one processor may include a combination of processors that perform the various recited / disclosed functions, for example, in a distributed manner. The at least one processor may execute program instructions to achieve or perform the various functions.

[0045] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. As at least part of the data processing or operations, the processor (120) may load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134). The processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently or together with the main processor (121). Additionally or alternatively, the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0046] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. The auxiliary processor (123) (e.g., an image signal processor (ISP) or a communication processor (CP)) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to various embodiments of the present disclosure, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. This learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include multiple artificial neural network layers.The artificial neural network may be any one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

[0047] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The various data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) and / or a non-volatile memory (134).

[0048] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), and / or an application (146).

[0049] The input module (150) can receive commands or data to be used in other components of the electronic device (101) (e.g., the processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, but is not limited to, a microphone or a key (e.g., a button), for example.

[0050] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0051] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. The display module (160) may include a touch circuit configured to detect a touch (e.g., a touch sensor), or a sensor circuit configured to measure the intensity of a force generated by the touch (e.g., a pressure sensor).

[0052] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. The audio module (170) can acquire sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device (101).

[0053] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. The sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0054] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the external electronic device (102)). The interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.

[0055] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., an external electronic device (102)). The connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0056] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. The haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0057] The camera module (180) can capture still images and videos. The camera module (180) may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.

[0058] The power management module (188) can manage power supplied to or consumed by the electronic device (101). The power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0059] A battery (189) may power at least one component of the electronic device (101). The battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0060] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor (AP)) and may include one or more communication processors (CPs) that support direct (e.g., wired) communication or wireless communication. The communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Of these communication modules, the corresponding communication module is a first network (198) (e.g., a short-range communication network such as BLUETOOTH, WiFi (wireless fidelity) direct, or IrDA (IR data association)) or a second network (199) (e.g., a legacy cellular network, 5G (5 thThe wireless communication module (192) can communicate with an external electronic device (104) via a wide area network (e.g., a LAN or WAN), a next generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network, such as the first network (198) or the second network (199), using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in a subscriber identity module (SIM) (196).

[0061] The wireless communication module (192) is 4G (4 thThe wireless communication module (192) can support 5G networks and next-generation communication technologies after the 5G network, such as new radio access technology (NR). The NR access technology can support high-speed transmission of large amounts of data (e.g., enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., millimeter wave (mmWave) band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) may support various requirements specified in the electronic device (101), an external electronic device (e.g., an external electronic device (104)), or a network system (e.g., a second network (199)). According to various embodiments of the present disclosure, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0062] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). The antenna module (197) may include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). The antenna module (197) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0063] According to various embodiments of the present disclosure, the antenna module (197) may form a mmWave antenna module. According to various embodiments of the present disclosure, the mmWave antenna module may include a printed circuit board (PCB), an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the PCB and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the PCB and capable of transmitting or receiving signals of the designated high-frequency band.

[0064] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0065] Commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be of the same or a different type of device as the electronic device (101). All or part of the operations executed by the electronic device (101) may be executed by one or more external electronic devices among the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to execute the function or at least a part of the service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be utilized, for example. The electronic device (101) may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC). In various embodiments of the present disclosure, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to various embodiments of the present disclosure, an external electronic device (104) or server (108) may be included in a second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0066] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In the present disclosure, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When one element (e.g., a first component) is referred to as being “coupled” or “connected” to another element (e.g., a second component), with or without the terms “functionally” or “communicatively,” the element can be connected to the other element directly (e.g., wired), wirelessly, or through a third component.

[0067] The term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or portion of such a component that performs one or more functions. For example, according to various embodiments of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0068] Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, a 'non-transitory' storage medium is a tangible device, may not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0069] The methods according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)) or an application store (e.g., PLAYSTORE). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0070] Each component (e.g., a module or a program) of the above-described components may comprise one or more entities. One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components prior to the integration. The operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0071] In the present disclosure, “disposed on XX” can be understood as disposed adjacent to XX, disposed in substantial contact with XX, or coupled to XX.

[0072] In the present disclosure, “located on XX” may be understood as being located adjacent to or substantially in contact with XX, coupled to XX, or included in XX.

[0073] In the present disclosure, when a first component (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” a second component, it can be understood that it can be directly disposed, connected to, or coupled to the second component, or that a third component can be disposed therebetween.

[0074] In the present disclosure, “ZZ between XX and YY” can be understood as ZZ being positioned in substantial contact with XX or YY, or ZZ being directly bonded to XX or YY. “ZZ between XX and YY” can be understood as ZZ being positioned between XX and YY with at least one other component between XX and ZZ, and / or at least one component between YY and ZZ interposed therebetween. “ZZ between XX and YY” can be understood as at least one other component between XX and ZZ connecting XX and ZZ, and / or at least one other component between YY and ZZ connecting YY and ZZ.

[0075] In this disclosure, unless otherwise specified, "conductivity" may be understood as "electrical conductivity," and "non-conductivity" may be understood as "electrical insulation." In context, or when referring to thermal properties, "conductivity" may be understood as "thermal conductivity."

[0076] In the present disclosure, when the term "substantially" is used to define a structural part, the expression including the term "substantially" is understood or interpreted as a technical feature produced within the technical tolerances of the method used to manufacture it.

[0077] In this disclosure, the term “and / or” may be understood to include any combination of one or more of the associated configurations that may be defined.

[0078] In this disclosure, the expression "comprising" means, for example, that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art knows how to achieve that tolerance. It should be understood that terms such as "comprising" or "having" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0079] In the drawings of the present disclosure, the shapes, thicknesses, ratios, and / or dimensions of the components are only for the effective explanation of the technical contents and are not limited to the shapes, thicknesses, ratios, and / or dimensions shown.

[0080] FIG. 2A is a diagram illustrating a multi-foldable electronic device (2) in an unfolded state (also referred to as an unfolding state or a flat state) according to various embodiments of the present disclosure.

[0081] FIG. 2b is a drawing showing an unfolded multi-foldable electronic device (2) according to various embodiments of the present disclosure.

[0082] FIG. 2c is a drawing showing a portion of an unfolded multi-foldable electronic device (2) according to various embodiments of the present disclosure.

[0083] FIG. 3A is a diagram illustrating a multi-foldable electronic device (2) in a folded state (also referred to as a folding state) according to various embodiments of the present disclosure.

[0084] FIG. 3b is a drawing showing a multi-foldable electronic device (2) in a folded state according to various embodiments of the present disclosure.

[0085] FIG. 3c is a drawing showing a multi-foldable electronic device (2) in a folded state according to various embodiments of the present disclosure.

[0086] FIG. 4A is a partial cross-sectional perspective view of a portion of a multi-foldable electronic device (2) in a folded state taken along line E-E' of FIG. 3A according to various embodiments of the present disclosure.

[0087] FIG. 4b is a partial cross-sectional perspective view of a portion of a multi-foldable electronic device (2) in a folded state taken along line E-E' of FIG. 3a according to various embodiments of the present disclosure.

[0088] It will be appreciated that the present disclosure encompasses and includes various combinations of the features and / or embodiments disclosed with respect to FIGS. 2a, 2b, 2c, 3a, 3b, 3c, 4a, and 4b. Various combinations of the features described below with respect to FIGS. 2a, 2b, 2c, 3a, 3b, 3c, 4a, and 4b may be considered to be encompassed by the present disclosure as specific examples.

[0089] Referring to FIGS. 2a, 2b, 2c, 3a, 3b, 3c, 4a, and 4b, a multi-foldable electronic device (2) (e.g., the electronic device (101) of FIG. 1) may include a first housing (21), a second housing (22), and a third housing (23) between the first housing (21) and the second housing (22). The multi-foldable electronic device (2) may be foldably implemented between the first housing (21) and the third housing (23). The multi-foldable electronic device (2) may include a first hinge portion (also referred to as a first hinge module, a first hinge structure, a first hinge, or a first hinge assembly) (H1) configured to rotatably connect the first housing (21) and the third housing (23). The multi-foldable electronic device (2) may be implemented to be foldable between a second housing (22) and a third housing (23). The multi-foldable electronic device (2) may include a second hinge portion (also referred to as a second hinge module, a second hinge structure, a second hinge, or a second hinge assembly) (H2) configured to rotatably connect the second housing (22) and the third housing (23). The combination of the first housing (21), the second housing (22), the third housing (23), the first hinge portion (H1), and the second hinge portion (H2) may be understood as a multi-foldable housing of the multi-foldable electronic device (2).

[0090] According to various embodiments, in the folded state of the multi-foldable electronic device (2), the second housing (22) may be positioned between the first housing (21) and the third housing (23). In the unfolded state of the multi-foldable electronic device (2), the first housing (21) and the third housing (23) may form an angle of substantially about 180 degrees, and the second housing (22) and the third housing (23) may form an angle of substantially about 180 degrees. In the folded state of the multi-foldable electronic device (2), the first housing (21) and the third housing (23) may form an angle of about 0 degrees to about 10 degrees. In the folded state of the multi-foldable electronic device (2), the second housing (22) and the third housing (23) may form an angle of about 0 degrees to about 10 degrees.

[0091] According to various embodiments, the multi-foldable electronic device (2) may include a first display module (3) (e.g., the display module (160) of FIG. 1). The first display module (3) may be disposed or coupled to the first housing (21), the second housing (22), and the third housing (23). The first display module (3) may be a flexible display module or a foldable display module configured to be bendable for transition between an unfolded state and a folded state of the multi-foldable electronic device (2). In the unfolded state of the multi-foldable electronic device (2), the first display module (3) may be provided substantially flat. In the folded state of the multi-foldable electronic device (2), the first display module (3) may not be visible from the outside.

[0092] According to various embodiments, the first display module (3) may include a first display area (31) disposed or coupled to the first housing (21), a second display area (32) disposed or coupled to the second housing (22), and a third display area (33) disposed or coupled to the third housing (23). The first display area (31) may be supported by the first housing (21) and disposed substantially flat in the first housing (21). The second display area (32) may be supported by the second housing (22) and disposed substantially flat in the second housing (22). The third display area (33) may be supported by the third housing (23) and disposed substantially flat in the third housing (23). In the folded state of the multi-foldable electronic device (2), the second display area (32) disposed in the second housing (22) and the third display area (33) disposed in the third housing (23) can face each other between the second housing (22) and the third housing (23). In the folded state of the multi-foldable electronic device (2), the first display area (31) disposed in the first housing (21) can face the second housing (22).

[0093] According to various embodiments, the first display module (3) may include a first bendable display area (34) between the first display area (31) and the third display area (33). The first bendable display area (34) may be disposed at the first hinge portion (H1). When the multi-foldable electronic device (2) is switched between an unfolded state and a folded state, the first bendable display area (34) may be deformed corresponding to the relative position between the first display area (31) and the third display area (33). In the unfolded state of the multi-foldable electronic device (2), the first bendable display area (34) may be disposed substantially flat. In the folded state of the multi-foldable electronic device (2), the first bendable display area (34) may be disposed in a bent form. In various embodiments, the first hinge portion (H1) may be configured to support the first bendable display area (34). For example, in an unfolded state of the multi-foldable electronic device (2), the first hinge portion (H1) may be configured to support the first bendable display area (34) substantially flat. The first hinge portion (H1) may reduce a crease phenomenon in the first bendable display area (34) by supporting the first bendable display area (34) so ​​that the first bendable display area (34) may be arranged flat without sagging or with reduced sagging in the unfolded state of the multi-foldable electronic device (2), for example.

[0094] According to various embodiments, the first display module (3) may include a second bendable display area (35) between the second display area (32) and the third display area (33). The second bendable display area (35) may be disposed at the second hinge portion (H2). When the multi-foldable electronic device (2) is switched between an unfolded state and a folded state, the second bendable display area (35) may be deformed corresponding to the relative position between the second display area (32) and the third display area (33). In the unfolded state of the multi-foldable electronic device (2), the second bendable display area (35) may be disposed substantially flat. In the folded state of the multi-foldable electronic device (2), the second bendable display area (35) may be disposed in a bent shape. In various embodiments, the second hinge portion (H2) may be configured to support the second bendable display area (35). For example, in an unfolded state of the multi-foldable electronic device (2), the second hinge portion (H2) may be configured to support the second bendable display area (35) substantially flat. The second hinge portion (H2) may reduce a creasing phenomenon in the second bendable display area (35) by supporting the second bendable display area (35) so that the second bendable display area (35) can be arranged flat without sagging or with reduced sagging in the unfolded state of the multi-foldable electronic device (2), for example.

[0095] According to various embodiments, in a folded state of the multi-foldable electronic device (2), the first bendable display area (34) of the first display module (3) may be bent in a symmetrical shape with respect to a first center line (A1). The first center line (A1) may correspond to the middle of a width of the first bendable display area (34) extending from a first boundary between the first display area (31) and the first bendable display area (34) to a second boundary between the third display area (33) and the first bendable display area (34), when the multi-foldable electronic device (2) is viewed in an unfolded state. In various embodiments, the first center line (A1) of the multi-foldable electronic device (2) may be understood as a first folding axis of the multi-foldable housing or the multi-foldable electronic device (2). The first center line (A1) can be substantially provided (or formed) by the first hinge portion (H1).

[0096] According to various embodiments, in the folded state of the multi-foldable electronic device (2), the second bendable display area (35) of the first display module (3) may be bent in a symmetrical shape with respect to the second center line (A2). The second center line (A2) may correspond to the middle of the width of the second bendable display area (35) extending from the third boundary between the second display area (32) and the second bendable display area (35) to the fourth boundary between the third display area (33) and the second bendable display area (35), when viewing the unfolded state of the multi-foldable electronic device (2). In various embodiments, the second center line (A2) of the multi-foldable electronic device (2) may be understood as the second folding axis of the multi-foldable housing or the multi-foldable electronic device (2). The second center line (A2) may be substantially provided (or formed) by the second hinge portion (H2). The first center line (A1) and the second center line (A2) may be substantially parallel to each other.

[0097] The illustrated coordinate axes are based on the first housing (21). The first display area (31) of the first display module (3) can provide (or form) at least a portion of the first front area of ​​the multi-foldable electronic device (2), and the first front area can be oriented in the negative direction of the z-coordinate axis. The first front area can be substantially parallel to the xy plane, and the y-coordinate axis can be parallel to the first center line (A1).

[0098] According to various embodiments, the first housing (21) may include a first frame (also referred to as a first frame structure or a first framework) (F1), and a first back cover (also referred to as a first rear cover, a first rear plate, or a first back plate) (B1) disposed (or coupled) to the first frame (F1). The first frame (F1) may provide (or form) at least a portion of a first side area of ​​an exterior of the multi-foldable electronic device (2). The first back cover (B1) may provide (or form) at least a portion of a first rear area of ​​an exterior of the multi-foldable electronic device (2). The first display area (31) of the first display module (3) can provide (or form) at least a part of the first front area of ​​the multi-foldable electronic device (2), and the first back cover (B1) can provide (or form) a first rear area of ​​the first housing (21) facing in the opposite direction to the first front area. When viewed from above the first display area (31) of the first display module (3) or from above the first front area of ​​the multi-foldable electronic device (2), it can be understood as a view in the positive direction of the z-coordinate axis. The direction orthogonal to the first display area (31) of the first display module (3) or the direction orthogonal to the first front area of ​​the multi-foldable electronic device (2) can be understood as a direction parallel to the z-coordinate axis. When viewed from above the first back cover (B1) or from above the first rear area of ​​the first housing (21), it can be understood as a view in the negative direction of the z-coordinate axis. The direction perpendicular to the first back cover (B1) or the direction perpendicular to the first rear area of ​​the first housing (21) can be understood as a direction parallel to the z-coordinate axis.

[0099] According to various embodiments, the first frame (F1) of the first housing (21) may include a first side member (also referred to as a first side member, a first side structure, or a first side bezel structure) (F12). The first side member (F12) may provide (or form) at least a portion of a first side area of ​​an exterior of the foldable electronic device (2). The first frame (F1) may include a first bracket (also referred to as a first support plate, a first support member, a first support structure, or a first support portion) (F11) extending from or connected to the first side member (F12). The first frame (F1) may be provided (or formed) as an integrated or single structure (e.g., a single continuous structure or a complete structure) including the first side member (F12) and the first bracket (F11). The first frame (F1) may be provided (or formed) as a combination of a conductor (or metal body) (not shown separately) including one or more conductive parts (also referred to as metal parts) and a non-conductor (or non-metal body) (not shown separately) including one or more non-conductive parts (also referred to as non-metal parts). In the present disclosure, a 'conductor' may be understood as an electrical conductor, and a 'non-conductor' may be understood as an electrical insulator. The first bracket (F11) may be a structural element positioned inside the multi-foldable electronic device (2) corresponding to the first housing (21). The first bracket (F11) may be positioned at least partially between the first display area (31) of the first display module (3) and the first back cover (B1) of the first housing (21).Various members related to electrical elements, such as the first display area (31) of the first display module (3), at least one first PCB (printed circuit board) (e.g., at least one first PCB (511) of FIG. 5), and / or the first battery (e.g., the first battery (521) of FIG. 5), and / or the electrical components, may be at least partially arranged or coupled to the first frame (F1) (e.g., the first bracket (F11)) between the first frame (F1) and the first back cover (B1).

[0100] According to various embodiments, the first side member (F12) of the first frame (F1) may include a first side (also referred to as a first side portion) (S1), a second side (also referred to as a second side portion) (S2), a third side (also referred to as a third side portion) (S3), and a fourth side (also referred to as a fourth side portion) (S4). The first side (S1) and the second side (S2) may have a length extending in a direction parallel to the first center line (A1). The second side (S2) may be positioned closer to the first center line (A) than the first side (S1). The third side (S3) may extend from one end of the first side (S1) and one end of the second side (S2), or may connect one end of the first side (S1) and one end of the second side (S2). The fourth side (S4) may extend from the other end of the first side (S1) and the other end of the second side (S2), or may connect the other end of the first side (S1) and the other end of the second side (S2). The third side (S3) and the fourth side (S4) may have a length extending in a direction perpendicular to the first center line (A1). The third side (S3) and the fourth side (S4) may be perpendicular to the first side (S1) and the second side (S2). A corner between the first side (S1) and the third side (S3), a corner between the first side (S1) and the fourth side (S4), a corner between the second side (S2) and the third side (S3), and / or a corner between the second side (S2) and the fourth side (S4) may be provided (or formed) in a smooth curved shape. When viewed from above the first back cover (B1), the first side (S1), the second side (S2), the third side (S3), and the fourth side (S4) can surround the first back cover (B1).

[0101] According to various embodiments, an integral or single structure (e.g., a single continuous structure or a complete structure) replacing the first back cover (B1) and the first frame (F1) may be provided (or formed).

[0102] According to various embodiments, the second housing (22) may include a second frame (also referred to as a second frame structure or a second framework) (F2), and a second back cover (also referred to as a second rear cover, a second rear plate, or a second back plate) (B2) disposed (or coupled) to the second frame (F2). The second frame (F2) may provide (or form) at least a portion of a second side area of ​​an exterior of the multi-foldable electronic device (2). The second back cover (B2) may provide (or form) at least a portion of a second rear area of ​​an exterior of the multi-foldable electronic device (2). The second display area (32) of the first display module (3) can provide (or form) at least a portion of the second front area of ​​the multi-foldable electronic device (2), and the second back cover (B2) can provide (or form) a second rear area of ​​the second housing (22) facing in the opposite direction to the second front area. When viewed from above the second display area (32) of the first display module (3) or when viewed from above the second front area of ​​the multi-foldable electronic device (2), it can be understood as when viewed in a direction orthogonal to the second display area (32) of the first display module (3) or when viewed in a direction orthogonal to the second front area of ​​the multi-foldable electronic device (2). When viewed from above the second back cover (B2) or from above the second rear area of ​​the second housing (22), the direction perpendicular to the second back cover (B2) or the direction perpendicular to the second rear area of ​​the second housing (22) can be understood as when viewed in a direction parallel to the z-coordinate axis.

[0103] According to various embodiments, the second frame (F2) of the second housing (22) may include a second side member (also referred to as a second side member, a second side structure, or a second side bezel structure) (F22). The second side member (F22) may provide (or form) at least a portion of a second side area of ​​the exterior of the foldable electronic device (2). The second frame (F2) may include a second bracket (also referred to as a second support plate, a second support member, a second support structure, or a second support portion) (F21) extending from or connected to the second side member (F22). The second frame (F2) may be provided (or formed) as an integral or unitary structure (e.g., a single continuous structure or a complete structure) including the second side member (F22) and the second bracket (F21). The second frame (F2) may be provided (or formed) as a combination of a conductive body (or metal body) (not separately illustrated) including one or more conductive parts (also referred to as metal parts) and a non-conductive body (or non-metal body) (not separately illustrated) including one or more non-conductive parts (also referred to as non-metal parts). The second bracket (F21) may be a structural element positioned inside the multi-foldable electronic device (2) corresponding to the second housing (22). The second bracket (F21) may be positioned at least partially between the second display area (32) of the first display module (3) and the second back cover (B2) of the second housing (22). Various members related to electrical elements, such as the second display area (32) of the first display module (3), at least one second PCB (e.g., at least one second PCB (512) of FIG. 5), and / or the second battery (e.g., the second battery (522) of FIG. 5), and / or the electrical components, may be at least partially arranged or coupled to the second frame (F2) (e.g., the second bracket (F21)) between the second frame (F2) and the second back cover (B2).

[0104] According to various embodiments, the second side member (F22) of the second frame (F2) may include a fifth side (also referred to as a fifth side portion) (S5), a sixth side (also referred to as a sixth side portion) (S6), a seventh side (also referred to as a seventh side portion) (S7), and an eighth side (also referred to as an eighth side portion) (S8). The fifth side (S5) and the sixth side (S6) may have a length extending in a direction parallel to the second center line (A2). The sixth side (S6) may be positioned closer to the second center line (A2) than the fifth side (S5). The seventh side (S7) may extend from one end of the fifth side (S5) and one end of the sixth side (S6), or may connect one end of the fifth side (S5) and one end of the sixth side (S6). The eighth side (S8) may extend from the other end of the fifth side (S5) and the other end of the sixth side (S6), or may connect the other end of the fifth side (S5) and the other end of the sixth side (S6). The seventh side (S7) and the eighth side (S8) may have a length extending in a direction perpendicular to the second center line (A2). The seventh side (S7) and the eighth side (S8) may be perpendicular to the fifth side (S5) and the sixth side (S6). A corner between the fifth side (S5) and the seventh side (S7), a corner between the fifth side (S5) and the eighth side (S8), a corner between the sixth side (S6) and the seventh side (S7), and / or a corner between the sixth side (S6) and the eighth side (S8) may be provided (or formed) in a smooth curved shape. When viewed from above the second back cover (B2), the fifth side (S5), the sixth side (S6), the seventh side (S7), and the eighth side (S8) can surround the second back cover (B2).

[0105] According to various embodiments, an integral or single structure (e.g., a single continuous structure or a complete structure) replacing the second back cover (B2) and the second frame (F2) may be provided (or formed).

[0106] According to various embodiments, the third housing (23) may include a third frame (also referred to as a third frame structure or a third framework) (F3), and a third back cover (also referred to as a third rear cover, a third rear plate, or a third back plate) (B3) disposed (or coupled) to the third frame (F3). The third frame (F3) may provide (or form) at least a portion of a third side area of ​​an exterior of the multi-foldable electronic device (2). The third back cover (B3) may provide (or form) at least a portion of a third rear area of ​​an exterior of the multi-foldable electronic device (2). The third display area (33) of the first display module (3) can provide (or form) at least a portion of the third front area of ​​the multi-foldable electronic device (2), and the third back cover (B3) can provide (or form) a third rear area of ​​the third housing (23) facing in the opposite direction to the third front area. When viewed from above the third display area (33) of the first display module (3) or when viewed from above the third front area of ​​the multi-foldable electronic device (2), it can be understood as when viewed in a direction orthogonal to the third display area (33) of the first display module (3) or when viewed in a direction orthogonal to the third front area of ​​the multi-foldable electronic device (2). When viewed from above the third back cover (B3) or when viewed from above the third rear area of ​​the third housing (23), it can be understood as when viewed in a direction perpendicular to the third back cover (B3) or when viewed in a direction perpendicular to the third rear area of ​​the third housing (23).

[0107] According to various embodiments, the third frame (F3) of the third housing (23) may include a third side member (also referred to as a third side member, a third side structure, or a third side bezel structure) (F32). The third side member (F32) may provide (or form) at least a portion of a third side area of ​​the exterior of the foldable electronic device (2). The third frame (F3) may include a third bracket (also referred to as a third support plate, a third support member, a third support structure, or a third support portion) (F31) extending from or connected to the third side member (F32). The third frame (F3) may be provided (or formed) as an integral or unitary structure (e.g., a single continuous structure or a complete structure) including the third side member (F32) and the third bracket (F31). The third frame (F3) may be provided (or formed) as a combination of a conductive body (or metal body) (not separately illustrated) including one or more conductive parts (also referred to as metal parts) and a non-conductive body (or non-metal body) (not separately illustrated) including one or more non-conductive parts (also referred to as non-metal parts). The third bracket (F31) may be a structural element positioned inside the multi-foldable electronic device (2) corresponding to the third housing (23). The third bracket (F31) may be positioned at least partially between the third display area (33) of the first display module (3) and the third back cover (B3) of the third housing (23). Various members related to electrical elements, such as a third display area (33) of a first display module (3), at least one third PCB (e.g., at least one third PCB (513) of FIG. 5), and / or a second battery (e.g., the third battery (523) of FIG. 5), and / or electrical components, may be at least partially arranged or coupled to the third frame (F3) (e.g., the third bracket (F31)) between the third frame (F3) and the third back cover (B3).

[0108] According to various embodiments, the third side member (F32) of the third frame (F3) may include a ninth side (also referred to as a ninth side portion) (S9), a tenth side (also referred to as a tenth side portion) (S10), an eleventh side (also referred to as an eleventh side portion) (S11), and a twelfth side (also referred to as a twelfth side portion) (S12). The ninth side (S9) and the tenth side (S10) may have lengths extending in a direction parallel to the first center line (A1) and the second center line (A2). The ninth side (S9) may be positioned closer to the first center line (A1) than the tenth side (S10), and the tenth side (S10) may be positioned closer to the second center line (A2) than the ninth side (S9). The eleventh side (S11) may extend from one end of the ninth side (S9) and one end of the tenth side (S10), or may connect one end of the ninth side (S9) and one end of the tenth side (S10). The twelfth side (S12) may extend from the other end of the ninth side (S9) and the other end of the tenth side (S10), or may connect the other end of the ninth side (S9) and the other end of the tenth side (S10). The eleventh side (S11) and the twelfth side (S12) may have a length extending in a direction perpendicular to the first center line (A1) and the second center line (A2). The eleventh side (S11) and the twelfth side (S12) may be perpendicular to the ninth side (S9) and the tenth side (S10). The corner between the ninth side (S9) and the eleventh side (S11), the corner between the ninth side (S9) and the twelfth side (S12), the corner between the tenth side (S10) and the eleventh side (S11), and / or the corner between the tenth side (S10) and the twelfth side (S12) may be provided (or formed) in a smooth curved shape.When viewed from above the third back cover (B3), the ninth side (S9), the tenth side (S10), the eleventh side (S11), and the twelfth side (S12) can surround the third back cover (B3).

[0109] According to various embodiments, an integral or single structure (e.g., a single continuous structure or a complete structure) replacing the third back cover (B3) and the third frame (F3) may be provided (or formed).

[0110] According to various embodiments, in the unfolded state of the multi-foldable electronic device (2), the first side (S1), the third side (S3), and the fourth side (S4) of the first frame (F1), the fifth side (S5), the seventh side (S7), and the eighth side (S8) of the second frame (F2), and the eleventh side (S11) and the twelfth side (S12) of the third frame (F3) may be bezels (or screen bezels) surrounding the first display module (3). In the unfolded state of the multi-foldable electronic device (2), when viewed from above the first display area (31) of the first display module (3), the second side (S2) of the first frame (F1), the sixth side (S6) of the second frame (F2), and the ninth side (S9) and tenth side (S10) of the third frame (F3) may not be visually exposed.

[0111] According to various embodiments, in a folded state of the multi-foldable electronic device (2), when viewed from above the first back cover (B1), the third side (S3) of the first frame (F1), the seventh side (S7) of the second frame (F2), and the eleventh side (S11) of the third frame (F3) may be aligned and overlapped with each other, and the seventh side (S7) may be positioned between the third side (S3) and the eleventh side (S11). In the folded state of the multi-foldable electronic device (2), when viewed from above the first back cover (B1), the fourth side (S4) of the first frame (F1), the eighth side (S8) of the second frame (F2), and the twelfth side (S12) of the third frame (F3) can be aligned and overlapped with each other, and the eighth side (S8) can be positioned between the fourth side (S4) and the twelfth side (S12).

[0112] According to various embodiments, in a folded state of the multi-foldable electronic device (2), when viewed from above the first back cover (B1), the first non-metallic portion (D1) of the first side member (F12), the sixth non-metallic portion (D6) of the second side member (F22), and the tenth non-metallic portion (D10) of the third side member (F32) may be aligned and overlapped with each other. In a folded state of the multi-foldable electronic device (2), when viewed from above the first back cover (B1), the second non-metallic portion (D2) of the first side member (F12), the fifth non-metallic portion (D5) of the second side member (F22), and the ninth non-metallic portion (D9) of the third side member (F32) may be aligned and overlapped with each other. In the folded state of the multi-foldable electronic device (2), when viewed from above the first back cover (B1), the third non-metallic portion (D3) of the first side member (F12), the eighth non-metallic portion (D8) of the second side member (F22), and the twelfth non-metallic portion (D12) of the third side member (F32) can be aligned and overlapped with each other. In the folded state of the multi-foldable electronic device (2), when viewed from above the first back cover (B1), the fourth non-metallic portion (D4) of the first side member (F12), the seventh non-metallic portion (D7) of the second side member (F22), and the eleventh non-metallic portion (D11) of the third side member (F32) can be aligned and overlapped with each other. In the folded state of the multi-foldable electronic device (2), the non-metallic portions of the first side member (F12), the non-metallic portions of the second side member (F22), and the non-metallic portions of the third side member (F32) are aligned and overlapped with each other, so that when at least one metal portion included in the first side member (F12), the second side member (F22), and / or the third side member (F32) is configured to operate as an antenna radiator, electromagnetic interference between the first side member (F12), the second side member (F22), and the third side member (F32) can be reduced, thereby reducing degradation of antenna radiation performance.

[0113] According to various embodiments, the first hinge portion (H1) may include at least one first hinge (not shown separately) and a first hinge cover (also referred to as a first hinge housing) (411). The at least one first hinge may be connected to a first bracket (F11) of a first frame (F1) included in a first housing (21) and a third bracket (F31) of a third frame (F3) included in a third housing (23). The first hinge cover (411) may be coupled to at least one first hinge. The first hinge cover (411) can reduce or prevent internal components, such as at least one first hinge, from being visually exposed through a gap between the first frame (F1) and the third frame (F3) (e.g., a gap between the second side (S2) and the ninth side (S9)).

[0114] According to various embodiments, the second hinge portion (H2) may include at least one second hinge (not shown separately) and a second hinge cover (also referred to as a second hinge housing) (412). The at least one second hinge may be connected to a second bracket (F21) of a second frame (F2) included in a second housing (22) and a third bracket (F31) of a third frame (F3) included in a third housing (23). The second hinge cover (412) may be coupled to at least one second hinge. The second hinge cover (412) can reduce or prevent internal components, such as at least one second hinge, from being visually exposed through a gap between the second frame (F2) and the third frame (F3) (e.g., a gap between the sixth side (S6) and the tenth side (S10)).

[0115] According to various embodiments, the multi-foldable electronic device (2) may have an external appearance of a bar-type electronic device in a folded state. The multi-foldable electronic device (2) in a folded state may have a front surface formed at least partially by a first back cover (B1). The multi-foldable electronic device (2) in a folded state may have a rear surface formed at least partially by a third back cover (B3). The multi-foldable electronic device (2) in a folded state may have a first side surface formed at least partially by a first hinge cover (411) of a first hinge portion (H1). The multi-foldable electronic device (2) in a folded state may have a second side surface formed by a first side (S1) of a first frame (F1) and a second hinge cover (412). The multi-foldable electronic device (2) in a folded state may have a third side formed by a third side (S3) of the first frame (F1), a seventh side (S7) of the second frame (F2), and an eleventh side (S11) of the third frame (F3). The multi-foldable electronic device (2) in a folded state may have a fourth side formed by a fourth side (S4) of the first frame (F1), an eighth side (S8) of the second frame (F2), and a twelfth side (S12) of the third frame (F3).

[0116] According to various embodiments, since the first hinge portion (H1) and the second hinge portion (H2) are configured such that the second housing (22) is positioned between the first housing (21) and the third housing (23) in the folded state of the multi-foldable electronic device (2), the second bendable display area (35) can be bent with a smaller radius of curvature than the first bendable display area (34). The second hinge portion (H2) can be configured to reduce or prevent damage to the second bendable display area (35) in the folded state of the multi-foldable electronic device (2). In various embodiments, the second hinge portion (H2) may include a first plate (also referred to as a first hinge plate or a first wing plate) (421) (see FIG. 4B) and a second plate (also referred to as a second hinge plate or a second wing plate) (422) (see FIG. 4B). The first plate (421) and the second plate (422) may be operatively connected to at least one second hinge of the second hinge portion (H2). The second bendable display area (35) of the first display module (3) may be arranged in a bent shape (e.g., a water drop shape or a dumbbell shape) that can reduce bending stress and / or buckling phenomenon by being supported by the first plate (421) and the second plate (422) between the first plate (421) and the second plate (422) in the folded state of the multi-foldable electronic device (2). The second bendable display area (35) of the first display module (3) may be arranged flat by being supported by the first plate (421) and the second plate (422) in the unfolded state of the multi-foldable electronic device (2).

[0117] According to various embodiments, the multi-foldable electronic device (2) may include a second display module (4) (e.g., the display module (160) of FIG. 1). The second display module (4) may be positioned between the first back cover (B1) and the first bracket (F11) of the first frame (F1). The second display module (4) may be disposed or coupled to the first back cover (B1) and / or the first bracket (F11). A display area (e.g., an active area or a screen area capable of displaying an image based on an electrical signal) of the second display module (4) may be visually visible through the first back cover (B1). In various embodiments, the first back cover (B1) may include a transparent area (also referred to as a light-transmitting area) corresponding to the display area of ​​the second display module (4), and an opaque area surrounding the transparent area. The display area of ​​the second display module (4) can be visually seen through the transparent area of ​​the first back cover (B1). The multi-foldable electronic device (2) can be configured to display images through the second display module (4) instead of the first display module (3) in a folded state.

[0118] According to various embodiments, the foldable electronic device (1) may include a first camera module (51), a second camera module (52), a third camera module (53), and / or a fourth camera module (54). The first camera module (51), the second camera module (52), the third camera module (53), and / or the fourth camera module (54) may include a camera including one or more lenses, image sensor(s), and / or image signal processor (ISP). The first camera module (51), the second camera module (52), the third camera module (53), and / or the fourth camera module (54) may include the camera module (180) of FIG. 1.

[0119] According to various embodiments, the first camera module (51) may be accommodated in the second housing (22), for example, corresponding to the second back cover (B2). The second display module (4) may include an opening corresponding to the first camera module (51). The first camera module (51) may be positioned in alignment with the opening of the second display module (4) or may be at least partially inserted into the opening. External light may pass through the opening of the second back cover (B2) and the second display module (4) to reach the first camera module (51). The opening of the second display module (4) aligned with or overlapping the first camera module (51) may be a through hole. In various embodiments, the opening of the second display module (4) aligned with or overlapping the first camera module (51) may be provided (or formed) as a notch (not separately illustrated). In various embodiments, although not shown separately, the first camera module (51) may overlap the display area of ​​the second display module (4) when viewed from above the first front area of ​​the foldable electronic device (1). The first camera module (51) may be positioned on the back of the display area of ​​the second display module (4) or below the display area of ​​the second display module (4). When viewed from the outside of the multi-foldable electronic device (2), the first camera module (51), or the position of the first camera module (51), may not be substantially visually distinguishable (or exposed). The first camera module (51) may include, for example, a hidden display rear camera (e.g., an under display camera (UDC)). External light may pass through the second display module (4) to reach the first camera module (51).

[0120] According to various embodiments, the second camera module (52), the third camera module (53), and the fourth camera module (54) may be accommodated in the third housing (23) corresponding to the third back cover (B3). The third back cover (B3) may include a first camera hole (or a first light-transmitting area) corresponding to the second camera module (52), a second camera hole (or a second light-transmitting area) corresponding to the third camera module (53), and / or a third camera hole (or a third light-transmitting area) corresponding to the fourth camera module (54). The positions or numbers of the camera modules accommodated in the third housing (23) corresponding to the third back cover (B3) are not limited to the illustrated examples.

[0121] According to various embodiments, the multi-foldable electronic device (2) may include a light-emitting module (55). The light-emitting module (55) may be accommodated in the third housing (23) corresponding to the third back cover (B3). The third back cover (B3) may include a flash hole (or a fourth light-transmitting area) corresponding to the light-emitting module (55). The light-emitting module (55) may include, for example, an LED or a xenon lamp. The light-emitting module (55) may include a light source for the second camera module (52), the third camera module (53), and / or the fourth camera module (54).

[0122] According to various embodiments, the multi-foldable electronic device (2) may include at least one audio input module (not shown separately). The audio input module may include a microphone (also referred to as a microphone). The microphone may be positioned inside the multi-foldable electronic device (2) corresponding to a microphone hole included, for example, in a first side member (F12) of the first housing (21), a second side member (F22) of the second housing (22), or a third side member (F32) of the third housing (23).

[0123] According to various embodiments, the multi-foldable electronic device (2) may include a plurality of audio output modules (not shown separately). Any one of the plurality of audio output modules may include a speaker for multimedia playback or recording playback. The speaker for multimedia playback or recording playback may be positioned inside the multi-foldable electronic device (2) corresponding to a speaker hole (e.g., a first speaker hole (SH1) formed in the first side member (F12) of the first housing (21), a second side member (F22) of the second housing (22), or a third side member (F32) of the third housing (23) of FIG. 6). Any one of the plurality of audio output modules may include a receiver for calls. A receiver for a call may be accommodated in the second housing (22), for example, corresponding to a receiver hole formed in a non-display area of ​​the second display module (4). The non-display area of ​​the second display module (4) may surround the display area of ​​the second display module (4).

[0124] According to various embodiments, the multi-foldable electronic device (2) may include a key input module. The key input module may include a first key (also referred to as a first side key) (56) and / or a second key (also referred to as a second side key) (57). The key input module may include a key signal generating unit (not separately illustrated). For example, the first key (56) may be positioned in a first key hole included in a first side member (F12) of the first housing (21), and the second key (57) may be positioned in a second key hole included in the first side member (F12) of the first housing (21). The key signal generating unit may be configured to generate a key signal in response to a press or touch on the first key (56) and / or the second key (57). The location or number of the key input modules is not limited to the illustrated example.

[0125] According to various embodiments, the multi-foldable electronic device (2) may include at least one connection terminal (also referred to as a connector or interface terminal). The at least one connection terminal may be positioned inside the multi-foldable electronic device (2) corresponding to a connection terminal hole (e.g., a connector hole) (e.g., a terminal hole (TH) formed in the third side member (F32) of FIG. 6) included in, for example, a first side member (F12) of the first housing (21), a second side member (F22) of the second housing (22), or a third side member (F32) of the third housing (23). The multi-foldable electronic device (2) may be configured to transmit and / or receive power and / or data to and from an external electronic device electrically connected to the at least one connection terminal (e.g., a USB connector or an HDMI connector). An external storage medium such as an SD (secure digital memory) card, a SIM card, or a USIM (universal SIM) card can be connected to at least one connection terminal (e.g., a connector for external storage medium).

[0126] According to various embodiments, the multi-foldable electronic device (2) may include a ground structure (not separately illustrated). The ground structure of the multi-foldable electronic device (2) may be configured to reduce or prevent electromagnetic interference (EMI) to electrical elements included in the multi-foldable electronic device (2). The ground structure of the multi-foldable electronic device (2) may be configured to reduce or prevent electromagnetic influence of noise from outside the multi-foldable electronic device (2) on electrical elements included in the multi-foldable electronic device (2). The ground structure of the multi-foldable electronic device (2) may be configured to reduce or prevent electromagnetic interference between electrical elements included in the multi-foldable electronic device (2).

[0127] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a first conductor (also referred to as a first conductive structure or a first metal structure) included in a first housing (21). The first frame (F1) may include a first outer metal portion (also referred to as a first outer metal structure) included in a first side member (F12), and a first outer non-metal portion (also referred to as a first outer non-metal structure) included in the first side member (F12) and coupled (e.g., bonded) to the first outer metal portion. For example, the first outer metal portion may include a plurality of metal portions (also referred to as conductive portions) and first segmented portions (also referred to as first gaps) between the plurality of metal portions, and the first outer non-metal portion may include a plurality of non-metal portions (also referred to as non-conductive portions) arranged (e.g., filled) in the first segmented portions of the first outer metal portion. The plurality of non-metal portions may include, for example, a first non-metal portion (D1) and a second non-metal portion (D2) included in a third side (S3), and a third non-metal portion (D3) and a fourth non-metal portion (D4) included in a fourth side (S4). The positions or numbers of the plurality of metal portions and the plurality of non-metal portions included in the first side member (F12) are not limited to the illustrated examples. The first frame (F1) may include a first inner metal portion (also referred to as a first inner metal structure) included in the first bracket (F11), and a first inner non-metal portion (also referred to as a first inner non-metal structure) included in the first bracket (F11) and coupled (e.g., bonded) to the first inner metal portion. The first frame (F1) may include an integral or single structure (e.g., a single continuous structure or a complete structure) including the first outer non-metal portion and the first inner non-metal portion. The first frame (F1) may include an integral or single structure (e.g., a single continuous structure or a complete structure) including the first outer non-metal portion and the first inner non-metal portion.The first conductor included in the first housing (21) of the ground structure of the multi-foldable electronic device (2) may include, but is not limited to, the first outer metal portion and the first inner metal portion of the first frame (F1).

[0128] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a second conductor (also referred to as a second conductive structure or a second metal structure) included in a second housing (21). The second frame (F2) may include a second outer metal portion (also referred to as a second outer metal structure) included in a second side member (F22), and a second outer non-metal portion (also referred to as a second outer non-metal structure) included in the second side member (F22) and coupled (e.g., bonded) to the second outer metal portion. For example, the second outer metal portion may include a plurality of metal portions (also referred to as conductive portions) and second segments (also referred to as second gaps) between the plurality of metal portions, and the second outer non-metal portion may include a plurality of non-metal portions (also referred to as non-conductive portions) arranged (e.g., filled) in the second segments of the second outer metal portion. The plurality of non-metal portions may include, for example, a fifth non-metal portion (D5) and a sixth non-metal portion (D6) included in the seventh side (S7), and a seventh non-metal portion (D7) and an eighth non-metal portion (D8) included in the eighth side (S8). The positions or numbers of the plurality of metal portions and the plurality of non-metal portions included in the second side member (F22) are not limited to the illustrated examples. The second frame (F2) may include a second inner metal portion (also referred to as a second inner metal structure) included in the second bracket (F21), and a second inner non-metal portion (also referred to as a second inner non-metal structure) included in the second bracket (F21) and coupled (e.g., bonded) to the second inner metal portion. The second frame (F2) may include an integral or single structure (e.g., a single continuous structure or a complete structure) including the second outer metal portion and the second inner metal portion. The second frame (F2) may include an integral or single structure (e.g., a single continuous structure or a complete structure) including the second outer non-metal portion and the second inner non-metal portion.The second conductor included in the second housing (22) among the ground structures of the multi-foldable electronic device (2) may include, but is not limited to, the second outer metal portion and the second inner metal portion of the second frame (F2).

[0129] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a third conductor (also referred to as a third conductive structure or a third metal structure) included in a third housing (23). The third frame (F3) may include a third outer metal portion (also referred to as a third outer metal structure) included in a third side member (F32), and a third outer non-metal portion (also referred to as a third outer non-metal structure) included in the third side member (F32) and coupled (e.g., bonded) to the third outer metal portion. For example, the third outer metal portion may include a plurality of metal portions (also referred to as conductive portions) and third segments (also referred to as third gaps) between the plurality of metal portions, and the third outer non-metal portion may include a plurality of non-metal portions (also referred to as non-conductive portions) arranged (e.g., filled) in the third segments of the third outer metal portion. The plurality of non-metal portions may include, for example, a ninth non-metal portion (D9) and a tenth non-metal portion (D10) included in an eleventh side (S11), and an eleventh non-metal portion (D11) and a twelfth non-metal portion (D12) included in a twelfth side (S12). The positions or numbers of the plurality of metal portions and the plurality of non-metal portions included in the third side member (F32) are not limited to the illustrated examples. The third frame (F3) may include a third inner metal portion (also referred to as a third inner metal structure) included in the third bracket (F31), and a third inner non-metal portion (also referred to as a second inner non-metal structure) included in the third bracket (F31) and coupled (e.g., bonded) to the third inner metal portion. The third frame (F3) may include an integral or single structure (e.g., a single continuous structure or a complete structure) including the third outer metal portion and the third inner metal portion. The third frame (F3) may include an integral or single structure (e.g., a single continuous structure or a complete structure) including the third outer non-metal portion and the third inner non-metal portion.The third conductor included in the third housing (23) among the ground structures of the multi-foldable electronic device (2) may include, but is not limited to, the third outer metal portion and the third inner metal portion of the third frame (F3).

[0130] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a fourth conductor (also referred to as a fourth conductive structure or a fourth metal structure) included in the first hinge portion (H1).

[0131] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a fifth conductor (also referred to as a fifth conductive structure or a fifth metal structure) included in the second hinge portion (H2).

[0132] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a sixth conductor (also referred to as a sixth conductive structure or a sixth metal structure) included in one or more PCBs (e.g., a rigid PCB, a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)) included in the multi-foldable electronic device (2). The sixth conductor may include, for example, one or more ground regions included in the PCB.

[0133] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a seventh conductor (also referred to as a seventh conductive structure or a seventh metal structure) included in the first display module (3). The seventh conductor may include a ground plane (also referred to as a ground layer) of the first display module (3). The ground plane of the first display module (3) may include, for example, an electromagnetic shielding layer of a metal material that forms at least a portion of the back surface of the first display module (3) or is at least a portion of the back surface of the first display module (3).

[0134] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include an eighth conductor (also referred to as an eighth conductive structure or an eighth metal) (not shown separately) included in the second display module (4). The eighth conductor may include a ground plane (also referred to as a ground layer) of the second display module (4). The ground plane of the second display module (4) may include, for example, an electromagnetic shielding layer of a metallic material that forms at least a portion of the back surface of the second display module (4) or is at least a portion of the back surface of the second display module (4).

[0135] According to various embodiments, a first conductor of the first housing (21), a second conductor of the second housing (22), a third conductor of the third housing (23), a fourth conductor of the first hinge portion (H1), a fifth conductor of the second hinge portion (H2), a sixth conductor of one or more PCBs, a seventh conductor of the first display module (3), and an eighth conductor of the second display module (4) may be electrically connected. According to various embodiments, at least two of the first conductor, the second conductor, the third conductor, the fourth conductor, the fifth conductor, the sixth conductor, the seventh conductor, and the eighth conductor may be directly electrically connected through physical contact. According to various embodiments, at least two of the first conductor, the second conductor, the third conductor, the fourth conductor, the fifth conductor, the sixth conductor, the seventh conductor, and the eighth conductor can be indirectly electrically connected via a separate electrical connecting member.

[0136] According to various embodiments, the first conductor of the first housing (21) and the third conductor of the third housing (23) may be electrically connected through the fourth conductor of the first hinge portion (H1) and / or through an electrical connection member (e.g., FPCB) disposed across the first hinge portion (H1). The fourth conductor of the first hinge portion (H1) may be electrically connected to the first conductor of the first housing (21) and the third conductor of the third housing (23) through mechanical fastening, such as screw fastening, or physical contact. The second conductor of the second housing (22) and the third conductor of the third housing (23) may be electrically connected through the fifth conductor of the second hinge portion (H2) and / or through an electrical connection member (e.g., FPCB) arranged across the second hinge portion (H2). The fifth conductor of the second hinge portion (H2) may be electrically connected to the first conductor of the first housing (21) and the third conductor of the third housing (23) through mechanical fastening, such as screw fastening, or physical contact.

[0137] According to various embodiments, the first conductor of the first housing (21) and the sixth conductor of one or more PCBs may be electrically connected via an electrical connection member such as a flexible conductive member (e.g., a conductive clip (e.g., a conductive structure including a resilient structure), a pogo-pin, a spring, a conductive poron, a conductive sponge, or a conductive rubber), a conductive adhesive member (e.g., a conductive tape), or a conductive connector) disposed between the first conductor and the sixth conductor. The second conductor of the second housing (22) and the sixth conductor of one or more PCBs may be electrically connected via an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed between the second conductor and the sixth conductor. The third conductor of the third housing (23) and the sixth conductor of one or more PCBs can be electrically connected through an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed between the third conductor and the sixth conductor.

[0138] According to various embodiments, the first conductor of the first housing (21) and the seventh conductor of the first display module (3) may be electrically connected via an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed between the first conductor and the seventh conductor. The second conductor of the second housing (22) and the seventh conductor of the first display module (3) may be electrically connected via an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed between the second conductor and the seventh conductor. The third conductor of the third housing (23) and the seventh conductor of the first display module (3) may be electrically connected via an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed between the third conductor and the seventh conductor.

[0139] According to various embodiments, the first conductor of the first housing (21) and the eighth conductor of the second display module (4) may be electrically connected through an electrical connection member, such as a flexible conductive member, a conductive adhesive member, or a conductive connector, disposed between the first conductor and the eighth conductor.

[0140] According to various embodiments, the seventh conductor of the first display module (3) and the sixth conductor of one or more PCBs may be electrically connected via an electrical connection member, such as a flexible conductive member, a conductive adhesive member, or a conductive connector, disposed between the seventh conductor and the sixth conductor. The seventh conductor of the first display module (3) and the sixth conductor of one or more PCBs may be electrically connected via an electrical connection member, such as an FPCB, that electrically connects the first display module (3) and the one or more PCBs.

[0141] According to various embodiments, the eighth conductor of the second display module (4) and the sixth conductor of one or more PCBs may be electrically connected via an electrical connection member, such as a flexible conductive member, a conductive adhesive member, or a conductive connector, disposed between the eighth conductor and the sixth conductor. The eighth conductor of the second display module (4) and the sixth conductor of one or more PCBs may be electrically connected via an electrical connection member, such as an FPCB, that electrically connects the second display module (4) and the one or more PCBs.

[0142] According to various embodiments, the sixth conductor of one or more PCBs may include a plurality of ground regions of a plurality of PCBs, and the plurality of ground regions may be electrically connected via an electrical connecting member (e.g., an FPCB). For example, one of the two PCBs may be positioned in the first housing (21), and the other may be positioned in the third housing (23), and the two PCBs may be electrically connected via an electrical connecting member (e.g., an FPCB) disposed across the first hinge portion (H1). For example, one of the two PCBs may be positioned in the second housing (22), and the other may be positioned in the third housing (23), and the two PCBs may be electrically connected via an electrical connecting member (e.g., an FPCB) disposed across the second hinge portion (H2).

[0143] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may be diverse and is not limited to the first conductor, the second conductor, the third conductor, the fourth conductor, the fifth conductor, the sixth conductor, the seventh conductor, and the eighth conductor.

[0144] According to various embodiments, the multi-foldable electronic device (2) may include a first conductive region (not separately illustrated) and a second conductive region (not separately illustrated). The first conductive region and the second conductive region may be electrically connected, or may be electrically and physically connected. According to various embodiments of the present disclosure, when the first conductive region is configured to substantially radiate electromagnetic waves, the first conductive region among the combination of the first conductive region and the second conductive region may be defined or understood as a radiating portion (or, antenna radiating portion, radiator, or antenna radiator), and the second conductive region among the combination of the first conductive region and the second conductive region may be interpreted or understood as a ground structure of the multi-foldable electronic device (2) that is distinct from the radiating portion. According to various embodiments of the present disclosure, when the first conductive region is configured to substantially radiate electromagnetic waves, the combination of the first conductive region and the second conductive region may be interpreted or understood as a ground structure of the multi-foldable electronic device (2), and the first conductive region may be interpreted or understood as a radiating portion implemented through a portion of the ground structure of the multi-foldable electronic device (2). According to various embodiments of the present disclosure, when the first conductive region is configured to substantially radiate electromagnetic waves, the second conductive region may operate as an antenna ground that electromagnetically influences the first conductive region (e.g., antenna radiator). The antenna ground may contribute to securing antenna radiation performance (or, radio wave transmission and reception performance or communication performance) and / or securing coverage with respect to the antenna radiator. The antenna ground may reduce electromagnetic interference (EMI) or signal loss with respect to the radiating portion.

[0145] According to various embodiments, some of the ground structures of the multi-foldable electronic device (2) may be configured to operate as a radiating portion (or, antenna radiating portion, radiator, or antenna radiator). Some of the ground structures of the multi-foldable electronic device (2) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) arranged on a PCB. Some of the ground structures of the multi-foldable electronic device (2) may receive (or be powered by) an electromagnetic signal (or, a wireless signal, an RF (radio frequency) signal, or a radiating current) from the wireless communication circuit and operate as a radiating portion (e.g., a resonator). Other parts of the ground structures of the multi-foldable electronic device (2) may be formed as an antenna ground that exerts an electromagnetic influence on at least one antenna radiator.

[0146] According to various embodiments, the multi-foldable electronic device (2) may be configured to transmit and / or receive an electromagnetic signal through at least a portion of a first outer metal portion included in a first side member (F12) of a first housing (21). The multi-foldable electronic device (2) may be configured to transmit and / or receive an electromagnetic signal through at least a portion of a second outer metal portion included in a second side member (F22) of a second housing (22). The multi-foldable electronic device (2) may be configured to transmit and / or receive an electromagnetic signal through at least a portion of a third outer metal portion included in a third side member (F32) of a third housing (23). A portion of the ground structure configured to operate as an antenna radiator may also vary.

[0147] According to various embodiments, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may process a transmit signal or a receive signal in at least one designated or selected frequency band via at least one radiator (or antenna radiator, radiator, or antenna radiator). The designated or selected frequency band may include, but is not limited to, for example, a low band (LB) (about 600 MHz (megahertz) to about 1 GHz (gigahertz), a middle band (MB) (about 1 GHz to about 2.3 GHz), a high band (HB) (about 2.3 GHz to about 2.7 GHz), or an ultra-high band (UHB) (about 2.7 GHz to about 6 GHz).

[0148] According to various embodiments, the multi-foldable electronic device (2) may further include various components depending on its provision form. These components cannot all be listed as they are modified in various ways according to the convergence trend of the multi-foldable electronic device (2), but components equivalent to the above-mentioned components may be additionally included in the multi-foldable electronic device (2). In various embodiments, depending on the provision form, certain components may be excluded from the above-mentioned components or replaced with other components.

[0149] FIG. 5 is a cross-sectional view of a portion of a multi-foldable electronic device (2) in a folded state taken along line F-F' of FIG. 3A according to various embodiments of the present disclosure.

[0150] FIG. 6 is a partially exploded perspective view of a multi-foldable electronic device (2) in an unfolded state according to various embodiments of the present disclosure.

[0151] FIG. 7 is a drawing showing an unfolded multi-foldable electronic device (2) according to various embodiments of the present disclosure.

[0152] FIG. 8A is a cross-sectional view of a portion of a multi-foldable electronic device (2) in a folded state taken along line E-E' of FIG. 3A according to various embodiments of the present disclosure.

[0153] FIG. 8b is a cross-sectional view of a portion of a multi-foldable electronic device (2) in a folded state taken along line E-E' of FIG. 3a according to various embodiments of the present disclosure.

[0154] FIG. 9 is a cross-sectional view of a portion of a foldable electronic device (900) as a comparative example for comparison with FIG. 8b, according to various embodiments of the present disclosure.

[0155] It will be appreciated that the present disclosure encompasses and includes various combinations of the features and / or embodiments disclosed with respect to FIGS. 5, 6, 7, 8a, and 8b. Various combinations of the features described below with respect to FIGS. 5, 6, 7, 8a, and 8b may be considered to be encompassed by the present disclosure as specific examples.

[0156] Referring to FIGS. 5, 6, 7, 8a, and 8b, the multi-foldable electronic device (2) may include a first housing (21), a second housing (22), a third housing (23), and a first display module (3). The first housing (21) may include a first frame (F1) and a first back cover (B1). The first frame (F1) may include a first bracket (F11) and a first side member (F12). The second housing (22) may include a second frame (F2) and a second back cover (B2). The second frame (F2) may include a second bracket (F21) and a second side member (F22). The third housing (23) may include a third frame (F3) and a third back cover (B3). The third frame (F3) may include a third bracket (F31) and a third side member (F32). The first display module (3) may include a first display area (31) disposed or coupled to the first bracket (F11), a second display area (32) disposed or coupled to the second bracket (F21), and a third display area (33) disposed or coupled to the third bracket (F31). For example, the multi-foldable electronic device (2) may include a second display module (4). The multi-foldable electronic device (2) may include a first camera module (51), a second camera module (52), a third camera module (53), and / or a fourth camera module (54). The multi-foldable electronic device (2) may include a light-emitting module (55). The multi-foldable electronic device (2) may include at least one first PCB (511), at least one second PCB (512), and / or at least one third PCB (513). For example, at least one first PCB (511) may be positioned or coupled to the first bracket (F11) between the first bracket (F11) and the first back cover (B1).For example, at least one second PCB (512) may be positioned or coupled to the second bracket (F21) between the second bracket (F21) and the second back cover (B2). For example, at least one third PCB (513) may be positioned or coupled to the third bracket (F31) between the third bracket (F31) and the third back cover (B3). The multi-foldable electronic device (2) may include a first battery (521), a second battery (522), and / or a third battery (523). For example, the first battery (521) may be positioned or coupled to the first bracket (F11) between the first bracket (F11) and the first back cover (B1). For example, the second battery (522) may be placed or coupled to the second bracket (F21) between the second bracket (F21) and the second back cover (B2). For example, the third battery (523) may be placed or coupled to the third bracket (F31) between the third bracket (F31) and the third back cover (B3). Descriptions of some components that are the same as in the previous embodiment may not be repeated.

[0157] According to various embodiments, the multi-foldable electronic device (2) may be configured to transmit and / or receive an electromagnetic signal through at least a portion of a first outer metal portion included in a first side member (F12) of a first frame (F1). The multi-foldable electronic device (2) may be configured to transmit and / or receive an electromagnetic signal through at least a portion of a second outer metal portion included in a second side member (F22) of a second housing (22). The multi-foldable electronic device (2) may be configured to transmit and / or receive an electromagnetic signal through at least a portion of a third outer metal portion included in a third side member (F32) of a third housing (23).

[0158] According to various embodiments, the multi-foldable electronic device (2) may be configured to transmit and / or receive a signal (e.g., an electromagnetic signal) of a designated or selected frequency band through at least a portion of the first outer metal portion included in the first side member (F12) of the first frame (F1) and / or at least a portion of the third outer metal portion included in the third side member (F32) of the third frame (F3). When at least a portion of the second outer metal portion included in the second side member (F22) of the second frame (F2) is configured as an antenna radiator, the first housing (21) and the third housing (23) may have an electromagnetic effect (e.g., electromagnetic interference) on the antenna radiator due to the second housing (22) being positioned between the first housing (21) and the third housing (23) in the folded state of the multi-foldable electronic device (2), thereby deteriorating the antenna radiation performance. In a folded state, using at least a part of the first outer metal part included in the first side member (F12) of the first frame (F1) and / or at least a part of the third outer metal part included in the third side member (F32) of the third frame (F3) as an antenna radiator may be advantageous in reducing a deterioration of antenna radiation performance or securing antenna radiation performance compared to using at least a part of the second outer metal part included in the second side member (F22) of the second frame (F2) as an antenna radiator.

[0159] According to various embodiments, the multi-foldable electronic device (2) may be configured to transmit and / or receive a signal (e.g., an electromagnetic signal) of a designated or selected frequency band through a metal portion (210) between a first non-metal portion (D1) and a third non-metal portion (D3) among the first outer metal portions included in the first side member (F12) of the first frame (F1). The metal portion (210) may include a portion extending from the first side (S1) to the first non-metal portion (D1) among the first side (S1) and the third side (S3), and a portion extending from the first side (S1) to the third non-metal portion (D3) among the fourth side (S4).

[0160] According to various embodiments, the multi-foldable electronic device (2) may be configured to transmit and / or receive a signal (e.g., an electromagnetic signal) of a designated or selected frequency band through the first partial metal portion (211) and / or the second partial metal portion (212) of the metal portion (210). For example, the first partial metal portion (211) may include a first corner between the first side (S1) and the third side (S3), a portion of the first side (S1) extending from the first corner, and a portion of the third side (S3) extending from the first corner to the first non-metal portion (D1). For example, the second metal portion (212) may include a second corner between the first side (S1) and the fourth side (S4), a portion of the first side (S1) extending from the second corner, and a portion of the fourth side (S4) extending from the second corner to the third non-metal portion (D3).

[0161] According to various embodiments, the first metal portion (211) may be configured to operate as an inverted F antenna (IFA) or a planar IFA (PIFA). For example, the first metal portion (211) may include a first feeding point (also referred to as a first feeding point) and a first ground point (also referred to as a first ground point). The first feeding point of the first metal portion (211) may be configured to receive (or be fed) an electromagnetic signal from a wireless communication circuit of the multi-foldable electronic device (2) (e.g., the wireless communication module (192) of FIG. 1). The first ground point of the first metal portion (211) may be electrically connected to a first ground area included in at least one first PCB (511). The first power supply point of the first metal portion (211) may be electrically connected to at least one first PCB (511) via, for example, an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed (e.g., surface-mounted) on at least one first PCB (511). The first ground point of the first metal portion (211) may be electrically connected to at least one first PCB (511) via, for example, an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed (e.g., surface-mounted) on at least one first PCB (511). When the wireless communication circuit provides (or supplies) an electromagnetic signal to the first feed point of the first metal portion (211), a current path (also called a signal path) through which a current (also called a radiation current) flows through the first metal portion (211) between the first feed point and the first ground point can be formed.The distribution of current along the current path can generate (or form) an electromagnetic field (also called a radiation field) (or magnetic field distribution) capable of transmitting a signal in a designated frequency band through the first metal portion (211). In various embodiments, the first power supply point can be implemented in multiple numbers. In various embodiments, the first grounding point can be implemented in multiple numbers.

[0162] According to various embodiments, the second metal portion (212) may be configured to operate as an IFA or a PIFA. For example, the second metal portion (212) may include a second power supply point (also referred to as a second power supply portion) and a second ground point (also referred to as a second ground portion). The second power supply point of the second metal portion (212) may be configured to receive (or be supplied with) an electromagnetic signal from a wireless communication circuit of the multi-foldable electronic device (2) (e.g., the wireless communication module (192) of FIG. 1). The second ground point of the second metal portion (212) may be electrically connected to a first ground area included in at least one first PCB (511). The second power supply point of the second metal portion (212) may be electrically connected to at least one first PCB (511) via, for example, an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed (e.g., surface-mounted) on at least one first PCB (511). The second ground point of the second metal portion (212) may be electrically connected to at least one first PCB (511) via, for example, an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector disposed (e.g., surface-mounted) on at least one first PCB (511). When the wireless communication circuit provides (or feeds) an electromagnetic signal to the second feed point of the second metal portion (212), a current path (also referred to as a signal path) through which a current (also referred to as a radiation current) flows between the second feed point and the second ground point through the second metal portion (212) may be formed. The distribution of the current along the current path may generate (or form) an electromagnetic field (also referred to as a radiation field) (or magnetic field distribution) capable of transmitting a signal in a designated frequency band through the second metal portion (212). In various embodiments, the second feed point may be implemented in multiple numbers.In various embodiments, the second grounding point may be implemented in multiple numbers.

[0163] According to various embodiments, the wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) of the multi-foldable electronic device (2) may be disposed (e.g., surface-mounted) on at least one first PCB (511) accommodated in the first housing (21). In various embodiments, the wireless communication circuit may be disposed (e.g., surface-mounted) on at least one second PCB (512) accommodated in the second housing (22). In various embodiments, the wireless communication circuit may be disposed (e.g., surface-mounted) on at least one third PCB (513) accommodated in the third housing (23).

[0164] According to various embodiments, the ground structure of the multi-foldable electronic device (2) may include a first ground structure (also referred to as a first ground) positioned in the first housing (21), a second ground structure (also referred to as a second ground) (820) positioned in the second housing (22) (see FIGS. 8A and 8B), and a third ground structure (also referred to as a third ground) positioned in the third housing (23). In a folded state of the multi-foldable electronic device (2), the second ground structure (820) may be positioned between the first ground structure and the third ground structure. In a folded state of the multi-foldable electronic device (2), when viewed from above the first back cover (B1), the first ground structure, the second ground structure (820), and the third ground structure may overlap.

[0165] According to various embodiments, the first ground structure located in the first housing (21) may include, but is not limited to, a first conductor included in the first housing (21), a first ground area (e.g., a portion of the sixth conductor) included in at least one first PCB (511), a portion of a seventh conductor (e.g., a ground plane (810) of FIG. 8A) included in the first display area (31) of the first display module (3), and an eighth conductor (e.g., a ground plane) included in the second display module (4). The first conductor included in the first housing (21) may include a first inner metal portion included in the first bracket (F11), and a first outer metal portion included in the first side member (F12).

[0166] According to various embodiments, the second ground structure located in the second housing (22) may include, but is not limited to, a second conductor included in the second housing (22), a second ground area (e.g., a portion of the sixth conductor) included in at least one second PCB (512), and a portion of the seventh conductor (e.g., an electromagnetic shielding layer) included in the second display area (32) of the first display module (3). The second conductor included in the second housing (22) may include a second inner metal portion included in the second bracket (F21), and a second outer metal portion included in the second side member (F22).

[0167] According to various embodiments, the third ground structure located in the third housing (23) may include, but is not limited to, a third conductor included in the third housing (23), a third ground area (e.g., a portion of the sixth conductor) included in at least one third PCB (513), and a portion of the seventh conductor (e.g., an electromagnetic shielding layer) included in the third display area (33) of the first display module (3). The third conductor included in the third housing (23) may include a third inner metal portion included in the third bracket (F31), and a second outer metal portion included in the third side member (F32).

[0168] According to various embodiments, a first ground structure positioned in the first housing (21) and a third ground structure positioned in the third housing (23) may be electrically connected. The first ground structure and the third ground structure may be electrically connected, for example, through a fourth conductor included in the first hinge portion (H1) (see FIG. 2c). The first ground structure and the third ground structure may be electrically connected, for example, through a seventh conductor (e.g., ground plane (810) of FIGS. 8a and 8b) of the first display module (3) disposed across the first hinge portion (H1) (see FIG. 2c). The first ground structure and the third ground structure may be electrically connected, for example, via a separate electrical connection member (e.g., FPCB) arranged across the first hinge portion (H1) (see FIG. 2c).

[0169] According to various embodiments, a second ground structure positioned in the second housing (22) and a third ground structure positioned in the third housing (23) may be electrically connected. The second ground structure and the third ground structure may be electrically connected, for example, through a fifth conductor included in the second hinge portion (H2) (see FIG. 2c). The second ground structure and the third ground structure may be electrically connected, for example, through a seventh conductor (e.g., ground plane (810) of FIGS. 8a and 8b) of the first display module (3) disposed across the second hinge portion (H2) (see FIG. 2c). The second ground structure and the third ground structure may be electrically connected, for example, via a separate electrical connection member (e.g., FPCB) arranged across the second hinge portion (H2) (see FIG. 2c).

[0170] According to various embodiments, a portion of the ground structure of the multi-foldable electronic device (2) may be configured to operate as an antenna radiator. For example, a portion of the first ground structure (e.g., the first partial metal portion (211) and / or the second partial metal portion (212)) may be configured to be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) and to operate as an antenna radiator. For example, a portion of the second ground structure may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) and to operate as an antenna radiator. For example, a portion of the third ground structure may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) and to operate as an antenna radiator. At least a portion of the remaining portion of the ground structure, excluding the portion configured to operate as an antenna radiator, may be configured as an antenna ground that electromagnetically influences the antenna radiator. Antenna grounding can contribute to securing antenna radiation performance (or radio transmission / reception performance or communication performance) and / or coverage with respect to the antenna radiator. Antenna grounding can reduce electromagnetic interference (EMI) or signal loss with respect to the radiator.

[0171] According to various embodiments, the first ground structure and the third ground structure may be a waveguide structure (e.g., a parallel-plate waveguide (PPW) structure) in a folded state of the multi-foldable electronic device (2). In the first comparative example where the first ground structure and the third ground structure are not electrically connected, the waveguide structure including the first ground structure and the third ground structure may cause parasitic resonance due to an electromagnetic influence (e.g., electromagnetic coupling) from energy (also referred to as electromagnetic wave energy) radiated from at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212)). In the first comparative example, a portion of an electromagnetic wave radiated from at least one antenna radiator may generate a guided wave that travels while reflecting from a first surface of a first ground structure and a second surface of a second ground structure. In the first comparative example, a parasitic resonance (or waveguide resonance) caused by the guided wave flowing between the first ground structure and the second ground structure may degrade the antenna radiation performance of an antenna including at least one antenna radiator. In the first comparative example, a frequency of the parasitic resonance (e.g., a frequency at which the parasitic resonance occurs) may be included in an operating frequency band (usable frequency band) of the antenna including at least one antenna radiator, and power leakage due to this may degrade the antenna radiation performance. According to the present disclosure, electrically connecting the first ground structure and the second ground structure may reduce the influence of the waveguide structure on the antenna radiation performance of the antenna including at least one antenna radiator.According to the present disclosure, the electrical connection of the first ground structure and the second ground structure can adjust the frequency of the parasitic resonance formed by the waveguide structure so that the frequency is not included in the operating frequency band of the antenna including at least one antenna radiator. The 'comparative examples' mentioned in the present disclosure are merely presented for comparison with various embodiments of the present disclosure and do not have a prior status with respect to the various embodiments of the present disclosure.

[0172] According to various embodiments, the second ground structure and the third ground structure may be a waveguide structure (e.g., a PPW structure) in a folded state of the multi-foldable electronic device (2). In a second comparative example in which the second ground structure and the third ground structure are not electrically connected, the waveguide structure including the second ground structure and the third ground structure may cause parasitic resonance due to an electromagnetic influence (e.g., electromagnetic coupling) from energy (also referred to as electromagnetic wave energy) radiated from at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212)). In the second comparative example, a guided wave may be generated in which a portion of the electromagnetic wave radiated from the at least one antenna radiator reflects at the second surface of the second ground structure and the third surface of the third ground structure and propagates. In a second comparative example, a parasitic resonance (or waveguide resonance) caused by a guided wave flowing between the second ground structure and the third ground structure may degrade the antenna radiation performance of an antenna including at least one antenna radiator. In the second comparative example, a frequency of the parasitic resonance (e.g., a frequency at which the parasitic resonance occurs) may be included in an operating frequency band of the antenna including at least one antenna radiator, and the resulting power leakage may degrade the antenna radiation performance. According to the present disclosure, electrically connecting the second ground structure and the third ground structure may reduce the influence of the waveguide structure on the antenna radiation performance of the antenna including at least one antenna radiator.According to the present disclosure, the second ground structure and the third ground structure are electrically connected so that the frequency of the parasitic resonance formed by the waveguide structure is adjusted so that the frequency of the parasitic resonance is not included in the operating frequency band of the antenna including at least one antenna radiator.

[0173] According to various embodiments, the ground plane (810) (e.g., electromagnetic shielding layer) of the first display module (3) may include a first partial ground plane (811) positioned in the first display area (31), a second partial ground plane (812) positioned in the second display area (32), and a third partial ground plane (813) positioned in the third display area (33). The ground plane (810) of the first display module (3) may include a fourth partial ground plane (814) positioned in the first bendable display area (34). The ground plane (810) of the first display module (3) may include a fifth partial ground plane (815) positioned in the second bendable display area (35).

[0174] According to various embodiments, in the folded state of the multi-foldable electronic device (2), the second housing (22) is positioned between the first housing (21) and the third housing (23), so that the first partial ground plane (811) of the first display area (31) is spaced apart from the second ground structure (820) positioned in the second housing (22) by a first distance (801) (see FIGS. 8a, 8b, and 9) in a direction orthogonal to the first back cover (B1) or the third back cover (B3) (e.g., a direction parallel to the z-coordinate axis), and the third partial ground plane (813) of the third display area (33) is spaced apart from the second ground structure (820) by a second distance (802) (see FIGS. 8a, 8b, and 9) greater than the first distance (801). It should be noted that although the first straight line with double-headed arrows indicating the first distance (801) in FIGS. 8a, 8b, and 9 is shown as being longer than the second straight line with double-headed arrows indicating the second distance (802), this does not mean that the first distance (801) is greater than the second distance (802).

[0175] According to various embodiments, in a folded state of the multi-foldable device (2), the third partial ground plane (813) and the second ground structure (820) may form a waveguide structure. In a folded state of the multi-foldable device (2), the waveguide structure including the third partial ground plane (813) and the second ground structure (820) may cause parasitic resonance due to an electromagnetic influence (e.g., electromagnetic coupling) from energy (also referred to as electromagnetic wave energy) radiated from at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212)). The waveguide structure including the third partial ground plane (813) and the second ground structure (820) can have a capacitance of a third value (C3) (see FIG. 8b) due to the second distance (802) between the third partial ground plane (813) and the second ground structure (820). The capacitance of the third value (C3) due to the second distance (802) can adjust the frequency of the parasitic resonance formed by the waveguide structure including the third partial ground plane (813) and the second ground structure (820) so that the frequency of the parasitic resonance is not included in the operating frequency band of the antenna including at least one antenna radiator. The frequency of the parasitic resonance formed by the waveguide structure is configured so that it is not included in the operating frequency band of the antenna including at least one antenna radiator, thereby reducing the leakage of power and reducing the degradation of the antenna radiation performance for the at least one antenna radiator. The antenna is configured such that a wireless communication circuit transmits and / or receives an electromagnetic signal through the at least one antenna radiator, and may include at least one antenna radiator and an antenna ground.It can be understood that the configuration so that the frequency of the parasitic resonance formed by the waveguide structure is not included in the operating frequency band of the antenna including at least one antenna radiator can reduce the degradation of the antenna radiation performance for at least one antenna radiator even if the capacitance value between the third partial ground plane (813) and the second ground structure (820) is not adjusted (e.g., maintained at the default value) in the folded state of the multi-foldable electronic device (2). It can be understood that the configuration so that the frequency of the parasitic resonance formed by the waveguide structure is not included in the operating frequency band of the antenna including at least one antenna radiator can be understood that the third partial ground plane (813) and the second ground structure (820) are configured to function well as an antenna ground for at least one antenna radiator. It can be understood that the third partial ground plane (813) is electromagnetically well integrated into the second ground structure (820) as an antenna ground for at least one antenna radiator, such that the frequency of the parasitic resonance formed by the waveguide structure is not included in the operating frequency band of the antenna including at least one antenna radiator.In order to strengthen the ground connection between the third partial ground plane (813) located in the third housing (23) and the second ground structure (820) located in the second housing (22) in the folded state of the multi-foldable electronic device (2), in a situation where it is difficult to implement an additional electrical path (e.g., a ground path) that electrically connects the third partial ground plane (813) and the second ground structure (820) without crossing the second hinge portion (H2) (see FIG. 2c), it can be understood that the second distance (802) between the third partial ground plane (813) and the second ground structure (820) is formed so that the frequency of the parasitic resonance formed by the waveguide structure is not included in the resonant frequency band of the antenna including at least one antenna radiator.

[0176] According to various embodiments, in the foldable electronic device (900) of the comparative example (see FIG. 9), in a folded state, the first partial ground plane (811) and the second ground structure (820) can form a waveguide structure. In the folded state of the multi-foldable device (900) of the comparative example, the waveguide structure including the first partial ground plane (811) and the second ground structure (820) can cause parasitic resonance due to an electromagnetic influence (e.g., electromagnetic coupling) from energy (also referred to as electromagnetic wave energy) radiated from at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212)). The at least one antenna radiator that can exert an electrical influence on the waveguide structure is not limited to the first partial metal portion (211) and / or the second partial metal portion (212) and can vary. A waveguide structure including a first partial ground plane (811) and a second ground structure (820) may have a capacitance of a fourth value (C4) (see FIG. 9) due to a first distance (801) between the first partial ground plane (811) and the second ground structure (820). Due to the capacitance of the fourth value (C4) due to the first distance (801), a frequency of a parasitic resonance formed by the waveguide structure including the first partial ground plane (811) and the second ground structure (820) may be included in a resonant frequency band of an antenna including at least one antenna radiator. It can be understood that the inclusion of a frequency of a parasitic resonance formed by the waveguide structure in a resonant frequency band of an antenna including at least one antenna radiator causes a degradation of antenna radiation performance due to power leakage.The frequency of the parasitic resonance formed by the waveguide structure being included in the resonant frequency band of the antenna including at least one antenna radiator may cause a degradation of the antenna radiation performance for the at least one antenna radiator due to power leakage. The frequency of the parasitic resonance formed by the waveguide structure being included in the resonant frequency band of the antenna including at least one antenna radiator may be understood as a situation in which adjustment of the capacitance value between the first partial ground plane (811) and the second ground structure (820) is required to reduce the degradation of the antenna radiation performance for the at least one antenna radiator in the folded state of the multi-foldable electronic device (2). The frequency of the parasitic resonance formed by the waveguide structure being included in the resonant frequency band of the antenna including at least one antenna radiator may be understood as a situation in which the first partial ground plane (811) and the second ground structure (820) do not function well as an antenna ground for the at least one antenna radiator. The frequency of the parasitic resonance formed by the waveguide structure being included in the resonant frequency band of the antenna including at least one antenna radiator can be understood as a state in which the first partial ground plane (811) is not electromagnetically well integrated into the second ground structure (820) as an antenna ground for at least one antenna radiator.

[0177] According to various embodiments, the first distance (801) may be, but is not limited to, about 2.0 mm (millimeter) to about 5.0 mm.

[0178] According to various embodiments, the multi-foldable electronic device (2) may include a metal layer (6) configured to strengthen a ground connection between the first partial ground plane (811) and the second ground structure (820) in a folded state. For example, the metal layer (6) may be positioned in the second housing (22). In a direction orthogonal to the second back cover (B2) (e.g., in the z-axis direction), the metal layer (6) and the second ground structure (820) may be at least partially spaced apart. In various embodiments, in the folded state of the multi-foldable electronic device (2), the metal layer (6) may be positioned between the first partial ground plane (811) and the second ground structure (820). The metal layer (6) may be electrically connected to the second ground structure (820). The multi-foldable electronic device (2) may include, for example, a first electrical member (71) and / or a second electrical member (72) configured to electrically connect a metal layer (6) and a second ground structure (820).

[0179] According to various embodiments, the metal layer (6) may be positioned between the second back cover (B2) and the second frame (F2) (e.g., the second bracket (F21) of the second frame (F2)). The metal layer (6) may be disposed or coupled (e.g., attached) to the second back cover (B2) between the second back cover (B2) and the second bracket (F21). The metal layer (6) may be coupled to the second back cover (B2) via an adhesive material (or bonding material) disposed between the metal layer (6) and the second back cover (B2). At least one second PCB (512) may be positioned at least partially between the metal layer (6) and the second bracket (F21). The metal layer (6) may be positioned at least partially between the second back cover (B2) and the at least one second PCB (512). The metal layer (6) may be positioned at least partially between the second back cover (B2) and the second battery (521). When viewed from above the first back cover (B1) in the folded state of the multi-foldable electronic device (2), the first display area (31) of the first display module (3) and the metal layer (6) may overlap.

[0180] According to various embodiments, the metal layer (6) may be a metal sheet disposed on the second back cover (B2). The metal sheet may be formed of various metal materials having electrical conductivity.

[0181] According to various embodiments, the metal layer (6) may be electrically connected to a second ground region of at least one second PCB (512) disposed on the second bracket (F21). The metal layer (6) may be electrically connected to at least one second PCB (512) via, for example, a first electrical connection member (71) and / or a second electrical connection member (72).

[0182] According to various embodiments, the first electrical connection member (71) may include a first conductive clip (e.g., a first conductive structure including a resilient structure). The second electrical connection member (72) may include a second conductive clip (e.g., a second conductive structure including a resilient structure). For example, the first conductive clip and / or the second conductive clip may be disposed (e.g., surface mounted) on at least one second PCB (512) between the metal layer (6) and the at least one second PCB (512). The first conductive clip and / or the second conductive clip may be in resilient contact with the metal layer (6) between the metal layer (6) and the at least one second PCB (512). The first electrical connection member (71) and / or the second electrical connection member (72) are not limited to conductive clips, and may be various types of flexible conductive members such as pogo-pins, springs, conductive porons, conductive sponges, or conductive rubbers, conductive adhesive members (e.g., conductive tapes), or conductive connectors.

[0183] According to various embodiments, at least one second PCB (512) may include a first conductive pad (not shown separately) configured to be physically and electrically connected to a first electrical connection member (71). At least one second PCB (512) may include a first conductive line configured to electrically connect the first conductive pad and a second ground region of at least one second PCB (512). The first electrical connection member (71), the first conductive pad, and the first conductive line may be understood as a first grounding path (GP1) (see FIG. 8a) configured to electrically connect a first point (P1) (e.g., a shorting point or a grounding point) on the metal layer (6) and a second ground structure (820) (see FIGS. 8a and 8b) (e.g., a second ground region of at least one second PCB (512)). In various embodiments, the first conductive pad and the first conductive line are omitted, the first electrical connection member (71) can be physically and electrically coupled to the second ground area of ​​at least one second PCB (512), and the first ground path (GP1) can be understood as the first electrical connection member (71). The first ground path (GP1) can strengthen the ground connection between the metal layer (6) and the second ground structure (820). The first ground path (GP1) and the metal layer (6) can strengthen the ground connection between the first partial ground plane (811) and the second ground structure (820) in the folded state of the multi-foldable electronic device (2).

[0184] According to various embodiments, at least one second PCB (512) may include a second conductive pad (not shown) configured to be physically and electrically connected to a second electrical connection member (72). At least one second PCB (512) may include a second conductive line configured to electrically connect the second conductive pad and a second ground region of at least one second PCB (512). The second electrical connection member (72), the second conductive pad, and the second conductive line may be understood as a second ground path (GP2) (see FIG. 8a) configured to electrically connect a second point (P2) (e.g., a shorting point or a ground point) on the metal layer (6) and a second ground structure (820) (see FIGS. 8a and 8b) (e.g., a second ground region of at least one second PCB (512)). In various embodiments, the second conductive pad and the second conductive line are omitted, the second electrical connection member (72) can be physically and electrically coupled to the second ground area of ​​at least one second PCB (512), and the second ground path (GP2) can be understood as the second electrical connection member (72). The second ground path (GP2) can strengthen the ground connection between the metal layer (6) and the second ground structure (820). The second ground path (GP2) and the metal layer (6) can at least strengthen the ground connection between the first partial ground plane (811) and the second ground structure (820) in the folded state of the multi-foldable electronic device (2).

[0185] According to various embodiments, the first partial metal portion (211) configured to operate as an antenna radiator may be understood as at least one first antenna radiator (e.g., also referred to as an upper antenna radiator). The second partial metal portion (212) configured to operate as an antenna radiator may be understood as at least one second antenna radiator (e.g., also referred to as a lower antenna radiator). For example, in order to reduce parasitic resonance generated by a waveguide structure (e.g., the first partial ground plane (811) and the second ground structure (820)) formed in a folded state of the multi-foldable electronic device (2) from deteriorating the antenna radiation performance of the first antenna including the at least one first antenna radiator, the first point (P1) on the metal layer (6) may be positioned closer to the at least one first antenna radiator than the second point (P2) on the metal layer (6). The first antenna is configured to allow the wireless communication circuit to transmit and / or receive an electromagnetic signal through at least one first antenna radiator, and may include at least one first antenna radiator and an antenna ground. In order to reduce the parasitic resonance generated by the waveguide structure (e.g., the first partial ground plane (811) and the second ground structure (820)) formed in the folded state of the multi-foldable electronic device (2) from deteriorating the antenna radiation performance of the second antenna including the at least one second antenna radiator, the second point (P2) on the metal layer (6) may be positioned closer to the at least one second antenna radiator than the first point (P1) on the metal layer (6). The second antenna is configured to allow the wireless communication circuit to transmit and / or receive an electromagnetic signal through at least one second antenna radiator, and may include at least one second antenna radiator and an antenna ground.In various embodiments, the first antenna and the second antenna may be configured to transmit and / or receive electromagnetic signals in substantially the same frequency band. In various embodiments, the first antenna and the second antenna may be configured to transmit and / or receive electromagnetic signals in at least some different frequency bands.

[0186] According to various embodiments, the first electrical connection member (71) and / or the second electrical connection member (72) may be physically and electrically coupled to a second inner metal portion included in the second bracket (F21) of the second frame (F2) to electrically connect the metal layer (6) to the second ground structure (820) and may be in electrical contact with the metal layer (6).

[0187] According to various embodiments, the first electrical connection member (71) and / or the second electrical connection member (72) may be physically and electrically coupled to the metal layer (6).

[0188] According to various embodiments, the first ground path (GP1) and / or the second ground path (GP2) may be implemented as various conductive parts or conductive structures between the metal layer (6) and the second ground structure (820). The number or location of the ground paths between the metal layer (6) and the second ground structure (820) is not limited to the illustrated example.

[0189] According to various embodiments, in a folded state of the multi-foldable device (2), the first partial ground plane (811), the metal layer (6), and the second ground structure (820) may form a waveguide structure. The waveguide structure may have a capacitance of a first value (C1) (see FIG. 8b) between the first partial ground plane (811) and the metal layer (6). The waveguide structure may have a capacitance of a second value (C2) (see FIG. 8b) between the metal layer (6) and the second ground structure (820). A waveguide structure including a first partial ground plane (811), a metal layer (6), and a second ground structure (820) may cause parasitic resonance due to an electromagnetic influence (e.g., electromagnetic coupling) from energy (also referred to as electromagnetic wave energy) radiated from at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212)). The waveguide structure including the first partial ground plane (811), the metal layer (6), and the second ground structure (820) may have a capacitance of a first value (C1) (see FIG. 8b) between the first partial ground plane (811) and the metal layer (6), and a capacitance of a second value (C2) (see FIG. 8b) between the metal layer (6) and the second ground structure (820). The waveguide structure including the first partial ground plane (811), the metal layer (6), and the second ground structure (820) can be understood as a series circuit including a capacitance of a first value (C1) and a capacitance of a second value (C2).In a series circuit, the total amount of capacitance determined from the capacitance of the first value (C1) and the capacitance of the second value (C2) can adjust the frequency of the parasitic resonance formed by the waveguide structure including the first partial ground plane (811), the metal layer (6), and the second ground structure (820) so that the frequency of the parasitic resonance is not included in the operating frequency band of the antenna including at least one antenna radiator. The configuration so that the frequency of the parasitic resonance formed by the waveguide structure is not included in the operating frequency band of the antenna including at least one antenna radiator can reduce the leakage of power and thus reduce the degradation of the antenna radiation performance for at least one antenna radiator. It can be understood that the frequency of the parasitic resonance formed by the waveguide structure is configured so that it is not included in the operating frequency band of the antenna including at least one antenna radiator, and that the first partial ground plane (811) and the second ground structure (820) are configured to function well as an antenna ground for at least one antenna radiator through the metal layer (6) configured to strengthen the ground connection between the first partial ground plane (811) and the second ground structure (820) in the folded state of the multi-foldable electronic device (2). It can be understood that the first partial ground plane (811) is electromagnetically well integrated into the second ground structure (820) as an antenna ground for at least one antenna radiator through the metal layer (6) configured to strengthen the ground connection between the first partial ground plane (811) and the second ground structure (820) in the folded state of the multi-foldable electronic device (2) so that the frequency of the parasitic resonance formed by the waveguide structure is not included in the operating frequency band of the antenna including at least one antenna radiator.In a situation where there is a structural constraint that makes it difficult to implement an additional electrical path (e.g., a ground path) to electrically connect between the first partial ground plane (811) and the second ground structure (820) without crossing the first hinge portion (H1) (see FIG. 2c) and the second hinge portion (H2) (see FIG. 2c), the metal layer (6) can serve as a part of the antenna ground for at least one antenna radiator in the folded state of the multi-foldable electronic device (2), thereby strengthening the ground connection between the first partial ground plane (811) and the second ground structure (820). A metal layer (6) configured to strengthen the ground connection between the first partial ground plane (811) and the second ground structure (820) can reduce or prevent the influence of the electrical path (e.g., length expressed as a ratio of wavelengths) of the first partial ground plane (811) on the frequency characteristics of an antenna including at least one antenna radiator in the folded state of the multi-foldable electronic device (2).

[0190] According to various embodiments, the metal layer (6) may be understood to be configured to adjust the frequency characteristics (e.g., resonant frequency) of at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7).

[0191] According to various embodiments, the multi-foldable electronic device (2) may include at least one matching circuit (e.g., the first matching circuit (M1) and / or the second matching circuit (M2) of FIG. 8A). The at least one matching circuit may be disposed (e.g., surface-mounted) on at least one second PCB (512). The at least one matching circuit may include an electrical element having, for example, a component such as inductance, capacitance, or conductance. The at least one matching circuit may include various elements such as, for example, a lumped element or a passive element. At least one matching circuit may include a switching circuit (e.g., a switching element) configured to adjust a component value (e.g., an inductance value, a capacitance value, or a conductance value) in response to a signal from a circuit such as a processor (e.g., a processor (120) of FIG. 1) included in the multi-foldable electronic device (2) or a wireless communication circuit (51). The at least one matching circuit may shift a resonant frequency of at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212)) to a specified frequency or shift it by a specified amount. The at least one matching circuit may perform impedance matching for the at least one antenna. The at least one matching circuit may be configured to substantially match an impedance of an electrical path (e.g., a transmission line or a feed line) that electrically connects the wireless communication circuit and the at least one antenna radiator to an impedance of the at least one antenna radiator. Impedance matching can reduce the degradation of antenna radiation performance by reducing the amount of reflection at the connection between the transmission line and at least one antenna radiator.

[0192] According to various embodiments, the first matching circuit (M1) (see FIG. 8a) may be electrically connected to a first ground path (GP1) configured to electrically connect a first point (P1) of the metal layer (6) and a second ground structure (820) (see FIGS. 8a and 8b) (e.g., a second ground region of at least one second PCB (512)). For example, the at least one second PCB (512) may include a first conductive pad (not shown separately) configured to be physically and electrically connected to the first electrical connection member (71), and a first conductive line configured to electrically connect the first conductive pad and the second ground region of the at least one second PCB (512). The first matching circuit (M1) may be disposed on the first conductive line of the at least one second PCB (512).

[0193] According to various embodiments, in order to reduce the parasitic resonance generated by the waveguide structure (e.g., the first partial ground plane (811) and the second ground structure (820)) formed in the folded state of the multi-foldable electronic device (2) from deteriorating the antenna radiation performance of the first antenna including at least one first antenna radiator (e.g., the first partial metal portion (211)), the first matching circuit (M1) disposed in the first ground path (GP1) may be configured to adjust the frequency of the parasitic resonance so as not to be included in the operating frequency band of the first antenna.

[0194] According to various embodiments, the second matching circuit (M2) (see FIG. 8a) may be electrically connected to a second ground path (GP2) configured to electrically connect a second point (P2) of the metal layer (6) and a second ground structure (820) (see FIGS. 8a and 8b) (e.g., a second ground region of at least one second PCB (512)). For example, the at least one second PCB (512) may include a second conductive pad (not shown separately) configured to be physically and electrically connected to the second electrical connection member (72), and a second conductive line configured to electrically connect the second conductive pad and the second ground region of the at least one second PCB (512). The second matching circuit (M2) may be disposed on the second conductive line of the at least one second PCB (512).

[0195] According to various embodiments, in order to reduce the parasitic resonance generated by the waveguide structure (e.g., the first partial ground plane (811) and the second ground structure (820)) formed in the folded state of the multi-foldable electronic device (2) from deteriorating the antenna radiation performance of the second antenna including at least one second antenna radiator (e.g., the second partial metal portion (212)), the second matching circuit (M2) disposed in the second ground path (GP2) may be configured to adjust the frequency of the parasitic resonance so as not to be included in the operating frequency band of the second antenna.

[0196] According to various embodiments, at least one matching circuit may be electrically connected to a transmission line (also referred to as a feed line) that electrically connects the wireless communication circuit and at least one antenna radiator (e.g., the first metal portion (211) and / or the second metal portion (212)). The at least one matching circuit may be disposed in the transmission line.

[0197] FIG. 10 is a graph showing antenna radiation performance in a folded state of a multi-foldable electronic device (2) of the present disclosure (see FIG. 8a) and a multi-foldable electronic device (900) of a comparative example (see FIG. 9), according to various embodiments of the present disclosure.

[0198] Referring to FIGS. 8A, 8B, 9, and 10, 1011 represents the total efficiency (e.g., gain characteristics reflecting input impedance matching characteristics) for a multi-foldable electronic device (2) according to various embodiments of the present disclosure. 1021 represents the total efficiency for a multi-foldable electronic device (900) of a comparative example. 1012 represents the reflection coefficient for a multi-foldable electronic device (2) according to various embodiments of the present disclosure. 1022 represents the reflection coefficient for a multi-foldable electronic device (900) of a comparative example. The multi-foldable electronic device (2) of the present disclosure can shift the frequency of the parasitic resonance formed through the first partial ground plane (811) and the second ground structure (820) through the metal layer (6) configured to strengthen the ground connection between the first partial ground plane (811) and the second ground structure (820) in the folded state so that the frequency of the parasitic resonance is not included in the operating frequency band (e.g., about 800 MHz to about 830 MHz) of the antenna including at least one antenna radiator.

[0199] FIG. 11 is a partially exploded perspective view of a multi-foldable electronic device (2) in an unfolded state according to various embodiments of the present disclosure.

[0200] It is understood that the present disclosure encompasses and encompasses various combinations of the features and / or embodiments disclosed in connection with FIG. 11. Various combinations of the features described below in connection with FIG. 11 may be considered to be encompassed by the present disclosure as specific examples.

[0201] Referring to FIG. 11, the multi-foldable electronic device (2) may include a first housing (21), a second housing (22), and a third housing (23). The first housing (21) may include a first frame (F1) and a first back cover (B1). The first frame (F1) may include a first bracket (F11) and a first side member (F12). The second housing (22) may include a second frame (F2) and a second back cover (B2). The second frame (F2) may include a second bracket (F21) and a second side member (F22). The third housing (23) may include a third frame (F3) and a third back cover (B3). The third frame (F3) may include a third bracket (F31) and a third side member (F32). The multi-foldable electronic device (2) may include a first display module (3). For example, the multi-foldable electronic device (2) may include a second display module (4). The multi-foldable electronic device (2) may include at least one second PCB (512). The multi-foldable electronic device (2) may include a second battery (522). The multi-foldable electronic device (2) may include a metal layer (6). The multi-foldable electronic device (2) may include a first electrical connection member (71) and / or a second electrical connection member (72). Descriptions of some components that are the same as those in the previous embodiment may not be repeated.

[0202] According to various embodiments, at least one second PCB (512) may include an upper PCB (1101) and a lower PCB (1102). When viewed from above the second back cover (B2), the second battery (522) may be positioned between the upper PCB (1101) and the lower PCB (1102). When viewed from above the second back cover (B2), the upper PCB (1101) may be positioned closer to the seventh side (S7) of the second frame (F2) than the second battery (522), and may be positioned between the seventh side (S7) and the second battery (522). The lower PCB (1102) may be positioned closer to the eighth side (S8) of the second frame (F2) than the second battery (522), and may be positioned between the eighth side (S8) and the second battery (522).

[0203] According to various embodiments, when viewed from above the second back cover (B2), the metal layer (6) may overlap with the upper PCB (1101) and / or the lower PCB (1102). When viewed from above the second back cover (B2), the metal layer (6) may not overlap with the second battery (522).

[0204] According to various embodiments, when viewed from above the second back cover (B2), the metal layer (6) may include a first portion (61) overlapping the upper PCB (1101), a second portion (62) overlapping the lower PCB (1102), and a third portion (63) extending from the first portion (61) and the second portion (62). When viewed from above the second back cover (B2), the second battery (522) may be positioned between the first portion (61) of the metal layer (6) and the sixth side (S6) of the second frame (F2). When viewed from above the second back cover (B2), the third portion (63) of the metal layer (6) may be positioned at least partially between the second battery (522) and the sixth side (S6) of the second frame (F2). In various embodiments, when viewed from above the second back cover (B2), a portion of the third portion (63) of the metal layer (6) may overlap at least one second PCB (512). The metal layer (6) may include an opening (64) formed by the first portion (61), the second portion (62), and the third portion (63) when viewed from above the second back cover (B2). The opening (64) may overlap the second battery (522) when viewed from above the second back cover (B2). The opening (64) of the metal layer (6) may enable the second housing (22) to be slimmed down while expanding the size of the second battery (522) in a direction orthogonal to the second back cover (B2).

[0205] According to various embodiments, when viewed from above the second back cover (B2), the third portion (63) of the metal layer (6) may overlap with the hinge area (1103) of the second housing (22). The second bracket (F21) included in the second frame (F2) of the second housing (22) may include a hinge area (1103) that is coupled with a second hinge portion (H2) (see FIG. 2c) that rotatably connects the second housing (22) and the third housing (23).

[0206] FIG. 12A is a drawing showing the shape of a metal layer (6) in a multi-foldable electronic device (2) according to various embodiments of the present disclosure, and heat maps of electric field distribution and frequency of parasitic resonance according to the shape of the metal layer (6).

[0207] FIG. 12b is a graph showing the radiation efficiency for a folded state of a multi-foldable electronic device (2) according to the shape of the metal layer (6) according to various embodiments of the present disclosure.

[0208] FIG. 12c is a graph showing the overall efficiency for the folded state of a multi-foldable electronic device (2) according to the shape of the metal layer (6) according to various embodiments of the present disclosure.

[0209] It is understood that the present disclosure encompasses and includes various combinations of the features and / or embodiments disclosed with respect to FIGS. 12a, 12b, and 12c. Various combinations of the features described below with respect to FIGS. 12a, 12b, and 12c may be considered to be included within the present disclosure as specific examples.

[0210] Referring to FIGS. 12a, 12b, and 12c, when an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or powered) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), the antenna radiation performance for a designated or selected frequency band (operating frequency band or use frequency band) may be affected by the frequency characteristics (e.g., resonant frequency) of parasitic resonance that vary depending on the shape of the metal layer (6).

[0211] According to various embodiments, 1211 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the first example. 1212 is a heat map showing an electric field distribution for the multi-foldable electronic device (2) in a folded state according to the first example. 1213 represents a radiation efficiency (an antenna characteristic substantially unrelated to an input impedance characteristic of the antenna) for the multi-foldable electronic device (2) in a folded state according to the first example. 1214 represents an overall efficiency (e.g., a gain characteristic reflecting an input impedance matching characteristic) for the multi-foldable electronic device (2) in a folded state according to the first example. According to the first example, when viewed from above the second back cover (B2), the metal layer (6) may be implemented to substantially overlap the entire area of ​​the second back cover (B2). When viewed from above the second back cover (B2), the metal layer (6) may be rectangular. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or fed) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), a parasitic resonance having a frequency of about 650 MHz to about 700 MHz may be generated in the multi-foldable electronic device (2) in the folded state.

[0212] According to various embodiments, 1221 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the second example. 1222 is a heat map showing an electric field distribution for the multi-foldable electronic device (2) in a folded state according to the second example. 1223 shows radiation efficiency for the multi-foldable electronic device (2) in a folded state according to the second example. 1224 shows overall efficiency for the multi-foldable electronic device (2) in a folded state according to the second example. According to the second example, when viewed from above the second back cover (B2), the metal layer (6) may be a rectangle that overlaps the second back cover (B2) and includes edges spaced apart from the fifth side (S5), the sixth side (S6), the seventh side (S7), and the eighth side (S8). For example, the metal layer (6) may be formed to have a smaller size than the second back cover (B2). The shape of the metal layer (6) is not limited to a rectangle. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or fed) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), a parasitic resonance having a frequency of about 750 MHz may be generated in the multi-foldable electronic device (2) in the folded state.

[0213] According to various embodiments, 1231 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to a third example. 1232 is a heat map showing an electric field distribution for a multi-foldable electronic device (2) in a folded state according to a third example. 1233 shows radiation efficiency for a multi-foldable electronic device (2) in a folded state according to a third example. 1234 shows overall efficiency for a multi-foldable electronic device (2) in a folded state according to a third example. According to the third example, when viewed from above the second back cover (B2), the metal layer (6) overlaps the second back cover (B2) and may be in a rectangular annular shape. For example, the metal layer (6) may include a through hole. The shape of the metal layer (6) is not limited to a rectangular annular shape. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or powered) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), a parasitic resonance having a frequency of about 650 MHz and about 890 MHz may be generated in the multi-foldable electronic device (2) in the folded state.

[0214] According to various embodiments, 1241 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the fourth example. 1242 is a heat map showing an electric field distribution for a multi-foldable electronic device (2) in a folded state according to the fourth example. 1243 shows radiation efficiency for a multi-foldable electronic device (2) in a folded state according to the fourth example. 1244 shows overall efficiency for a multi-foldable electronic device (2) in a folded state according to the fourth example. According to the fourth example, when viewed from above on the second back cover (B2), the metal layer (6) may include two partial metal layers (12A, 12B) that overlap with the second back cover (B2) and are separated from each other. When viewed from above on the second back cover (B2), one partial metal layer (12A) may be surrounded by the remaining partial metal layer (12B). For example, when viewed from above the second back cover (B2), one partial metal layer (12A) may be rectangular, and the remaining partial metal layer (12B) may be rectangular and annular. The shapes of the two partial metal layers (12A, 12B) are not limited to the illustrated example. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or fed) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), a parasitic resonance having a frequency of about 650 MHz to about 700 MHz may be generated in the multi-foldable electronic device (2) in the folded state.

[0215] According to various embodiments, 1251 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the fifth example. 1252 is a heat map showing an electric field distribution for the multi-foldable electronic device (2) in a folded state according to the fifth example. 1253 shows radiation efficiency for the multi-foldable electronic device (2) in a folded state according to the fifth example. 1254 shows overall efficiency for the multi-foldable electronic device (2) in a folded state according to the fifth example. According to the fifth example, when viewed from above the second back cover (B2), the metal layer (6) may include two partial metal layers (12C, 12D) that overlap with the second back cover (B2) and are separated from each other. When viewed from above the second back cover (B2), one partial metal layer (12A) may be positioned close to the third side (S3), and the remaining partial metal layer (12B) may be positioned close to the fourth side (S4). The two partial metal layers (12C, 12D) may be rectangular, but are not limited thereto. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or powered) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), parasitic resonances having frequencies of about 650 MHz and about 870 MHz may be generated in the multi-foldable electronic device (2) in the folded state.

[0216] According to various embodiments, 1261 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the sixth example. 1262 is a heat map showing an electric field distribution for a multi-foldable electronic device (2) in a folded state according to the sixth example. 1263 shows a radiation efficiency for a multi-foldable electronic device (2) in a folded state according to the sixth example. 1264 shows an overall efficiency for a multi-foldable electronic device (2) in a folded state according to the sixth example. According to the sixth example, when viewed from above the second back cover (B2), the metal layer (6) may include three partial metal layers (12E, 12F, 12G) that overlap with the second back cover (B2) and are separated from each other. When viewed from above the second back cover (B2), one partial metal layer (12E) may be positioned close to the third side (S3), another partial metal layer (12F) may be positioned close to the fourth side (S4), and the remaining partial metal layer (12G) may be positioned between the two partial metal layers (12E, 12F). The three partial metal layers (12E, 12F, 12G) may be rectangular, but are not limited thereto. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or powered) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), a parasitic resonance having a frequency of about 860 MHz may be generated in the multi-foldable electronic device (2) in the folded state.

[0217] According to various embodiments, 1271 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the seventh example. 1272 is a heat map showing an electric field distribution for a multi-foldable electronic device (2) in a folded state according to the seventh example. 1273 shows radiation efficiency for a multi-foldable electronic device (2) in a folded state according to the seventh example. 1274 shows overall efficiency for a multi-foldable electronic device (2) in a folded state according to the seventh example. According to the seventh example, when viewed from above the second back cover (B2), the metal layer (6) may overlap with the second back cover (B2) and include four partial metal layers (12H, 12I, 12J, 12K) that are separated from each other. When viewed from above the second back cover (B2), the four partial metal layers (12H, 12I, 12K, 12K) may be arranged in a square grid shape. The four partial metal layers (12H, 12I, 12K, 12K) may be rectangular, but are not limited thereto. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or fed) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), a parasitic resonance having a frequency of about 960 MHz may be generated in the multi-foldable electronic device (2) in the folded state.

[0218] According to various embodiments, although not shown separately, the shape of the metal layer (6) and the frequency of parasitic resonance according to the shape of the metal layer (6) may vary.

[0219] According to various embodiments, in an example where the metal layer (6) is implemented as a plurality of separate partial metal layers (e.g., the fourth example of 1241, the fifth example of 1251, the sixth example of 1261, or the seventh example of 1271 in FIG. 12A), at least one of the plurality of partial metal layers can be electrically connected to the second ground structure (820) via at least one ground path.

[0220] According to various embodiments, in an example where the metal layer (6) is implemented as a plurality of separate partial metal layers (e.g., the fourth example of 1241, the fifth example of 1251, the sixth example of 1261, or the seventh example of 1271 in FIG. 12A), at least any two of the plurality of partial metal layers can be connected via at least one switch (e.g., the first switch (1281), the second switch (1282), the third switch (1283), the fourth switch (1284), the fifth switch (1285), the sixth switch (1286), or the seventh switch (1287)). For example, any two partial metal layers can be electrically connected to at least one second PCB (512) of FIG. 6 via an electrical connection member such as a flexible conductive member, a conductive adhesive member, or a conductive connector, and at least one switch can be disposed (e.g., surface mounted) on at least one second PCB (512) of FIG. 6 to electrically connect or disconnect the two partial metal layers in response to a control signal from a processor (e.g., the processor (120) of FIG. 1) or a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The multi-foldable electronic device (2) can be configured to electrically connect the two partial metal layers by turning on at least one switch between the two partial metal layers, or to electrically separate the two partial metal layers by turning off at least one switch between the two partial metal layers, so as to control parasitic resonance (e.g., frequency of the parasitic resonance) so as to reduce degradation of antenna radiation performance. In various embodiments, at least one switch between at least two of the plurality of partial metal layers may be understood as part of a matching circuit (e.g., the first matching circuit (M1) or the second matching circuit (M2) of FIG. 8A).

[0221] FIG. 13 is a diagram showing a shorting point on a metal layer (6) in a multi-foldable electronic device (2) according to various embodiments of the present disclosure, and a graph showing radiation efficiency for a folded state of the multi-foldable electronic device (2) according to the shorting point.

[0222] It is understood that the present disclosure encompasses and encompasses various combinations of the features and / or embodiments disclosed in connection with FIG. 13. Various combinations of the features described below in connection with FIG. 13 may be considered to be encompassed by the present disclosure as specific examples.

[0223] Referring to FIG. 13, when an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or fed) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), the antenna radiation performance for a designated or selected frequency band (operating frequency band or use frequency band) may be affected by the frequency characteristics (e.g., resonant frequency) of parasitic resonance that vary depending on the number and / or position of shorting points on the metal layer (6).

[0224] According to various embodiments, the metal layer (6) may be the metal layer (6) according to the example of FIG. 11. For example, the metal layer (6) may include a first portion (61), a second portion (62), and a third portion (63).

[0225] According to various embodiments, 1311 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the eighth example. 1312 shows radiation efficiency for the multi-foldable electronic device (2) in a folded state according to the eighth example. In the eighth example, the metal layer (6) may include a first shorting point (P11) electrically connected to a second ground structure (820) (see FIGS. 8A and 8B). The first shorting point (P11) may be located, for example, in a third portion (63) of the metal layer (6) and may be located closer to the first portion (61) of the metal layer (6) than to the second portion (62) of the metal layer (6).

[0226] According to various embodiments, 1321 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the ninth example. 1322 shows radiation efficiency for a multi-foldable electronic device (2) in a folded state according to the ninth example. The ninth example may further include a second shorting point (P12) on the metal layer (6) compared to the eighth example. The second shorting point (P12) may be located, for example, in a third portion (63) of the metal layer (6) and may be located closer to the second portion (62) of the metal layer (6) than to the first portion (61) of the metal layer (6).

[0227] According to various embodiments, 1331 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to the tenth example. 1332 shows radiation efficiency for a multi-foldable electronic device (2) in a folded state according to the tenth example. The tenth example may further include a third shorting point (P13) on the metal layer (6), compared to the ninth example. The third shorting point (P13) may be located, for example, in a first portion (61) of the metal layer (6). In various embodiments, the third shorting point (P13) may be located adjacent to the first portion metal portion (211) of FIG. 7, which is configured to operate as an antenna radiator, when viewed from above the first back cover (B1) (see FIG. 3A) of the multi-foldable electronic device (2) in the folded state.

[0228] According to various embodiments, 1341 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to an eleventh example. 1342 shows radiation efficiency for a multi-foldable electronic device (2) in a folded state according to an eleventh example. The eleventh example may further include a fourth shorting point (P14) on the metal layer (6) compared to the tenth example. The fourth shorting point (P14) may be located, for example, in a second portion (62) of the metal layer (6). In various embodiments, the fourth shorting point (P14) may be located adjacent to the second portion metal portion (212) of FIG. 7, which is configured to operate as an antenna radiator, when viewed from above the first back cover (B1) (see FIG. 3A) of the multi-foldable electronic device (2) in a folded state.

[0229] According to various embodiments, referring to 1311, 1321, 1331, and 1341, it is shown that the radiation efficiency is improved in a designated or selected frequency band including about 730 MHz by adding shorting points on the metal layer (6). In various embodiments, the radiation performance can be improved by using shorting points (e.g., depending on the location and / or number of shorting points) to remove or shift parasitic resonances in a designated or selected frequency band.

[0230] FIG. 14 is a graph showing antenna radiation performance for a first antenna including at least one first antenna radiator in a multi-foldable electronic device (2) (see FIG. 8a) in a folded state according to element values ​​of a first matching circuit (M1) (see FIG. 8a) according to various embodiments of the present disclosure.

[0231] Referring to FIG. 14, when an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or fed) to at least one first antenna radiator (e.g., the first partial metal portion (211) of FIG. 7), the antenna radiation performance of the first antenna for a designated or selected frequency band (operating frequency band or usage frequency band) may be affected by the frequency characteristics (e.g., resonant frequency) of parasitic resonance that vary depending on the element values ​​of the first matching circuit (M1).

[0232] According to various embodiments, 1401 represents a radiation efficiency for the first antenna when the first matching circuit (M1) is configured to provide (or form) a first element value. 1402 represents a radiation efficiency for the first antenna when the first matching circuit (M1) is configured to provide (or form) a second element value. 1403 represents a radiation efficiency for the first antenna when the first matching circuit (M1) is configured to provide (or form) a third element value. 1404 represents a radiation efficiency for the first antenna when the first matching circuit (M1) is configured to provide (or form) a fourth element value. 1405 represents a radiation efficiency for the first antenna when the first matching circuit (M1) is configured to provide (or form) a fifth element value. 1406 represents the radiation efficiency for the first antenna when the first matching circuit (M1) is configured to provide (or form) the sixth element value. For example, the first element value may be about 0.6 nanohenry (nH). For example, the second element value may be about 1 nH. For example, the third element value may be about 1.2 nH. For example, the fourth element value may be about 1.5 nH. For example, the fifth element value may be about 2.2 nH. For example, the sixth element value may be about 4.7 nH. Depending on the element values ​​of the first matching circuit (M1), the frequency characteristics (e.g., resonant frequency) of the parasitic resonance with respect to the radiation efficiency of the first antenna may vary. For example, Fig. 14 shows that as the inductance value of the first matching circuit (M1) increases, the frequency of parasitic resonance becomes low shifted.

[0233] FIG. 15 is a graph showing antenna radiation performance for a second antenna including at least one second antenna radiator in a folded state multi-foldable electronic device (2) (see FIG. 8a) according to element values ​​of a second matching circuit (M2) (see FIG. 8a) according to various embodiments of the present disclosure.

[0234] Referring to FIG. 15, when an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or fed) to at least one second antenna radiator (e.g., the second partial metal portion (212) of FIG. 7), the antenna radiation performance of the second antenna for a designated or selected frequency band (operating frequency band or use frequency band) may be affected by the frequency characteristics (e.g., resonant frequency) of parasitic resonance that vary depending on the element values ​​of the second matching circuit (M2).

[0235] According to various embodiments, 1501 represents a radiation efficiency for the second antenna when the second matching circuit (M2) is configured to provide (or form) a first element value. 1502 represents a radiation efficiency for the second antenna when the second matching circuit (M2) is configured to provide (or form) a second element value. 1503 represents a radiation efficiency for the second antenna when the second matching circuit (M2) is configured to provide (or form) a third element value. 1504 represents a radiation efficiency for the second antenna when the second matching circuit (M2) is configured to provide (or form) a fourth element value. 1505 represents a radiation efficiency for the second antenna when the second matching circuit (M2) is configured to provide (or form) a fifth element value. 1506 represents the radiation efficiency for the second antenna when the second matching circuit (M2) is configured to provide (or form) the sixth element value. For example, the first element value may be about 0.6 nH. For example, the second element value may be about 1 nH. For example, the third element value may be about 1.2 nH. For example, the fourth element value may be about 1.5 nH. For example, the fifth element value may be about 2.2 nH. For example, the sixth element value may be about 4.7 nH. Depending on the element values ​​of the second matching circuit (M1), the frequency characteristics (e.g., resonance frequency) of the parasitic resonance with respect to the radiation efficiency of the second antenna may vary. For example, FIG. 15 shows that as the inductance value of the second matching circuit (M2) increases, the frequency of the parasitic resonance is shifted downward.

[0236] FIG. 16 is a graph showing antenna radiation performance for a first antenna including at least one first antenna radiator in a multi-foldable electronic device (2) in a folded state (see FIG. 8a) according to various embodiments of the present disclosure.

[0237] Referring to FIG. 16, 1601, 1602, 1603, and 1604 represent radiation efficiencies of the first antenna when the phase of an electromagnetic signal (or, a radio signal, an RF signal, or a radiated current) provided (or fed) to at least one first antenna radiator (e.g., the first partial metal portion (211) of FIG. 7) is varied, respectively. For example, the resonant frequency of the first antenna may be determined at least in part by the phase of the electromagnetic signal, and the phase may vary depending on the element value provided (or formed) by the matching circuit for the first antenna. 1601 represents the radiation efficiency of the first antenna when, for example, the matching circuit is configured to provide (or form) an element value of about 1.0 nH. 1602 represents the radiation efficiency of the first antenna when, for example, the matching circuit is configured to provide (or form) an element value of about 2.2 nH. 1603 represents the radiation efficiency of the first antenna, for example, when the matching circuit is configured to provide (or form) an element value of about 3.3 nH. 1604 represents the radiation efficiency of the first antenna, for example, when the matching circuit is configured to provide (or form) an element value of about 4.7 nH. The antenna radiation performance of the first antenna for a specified or selected frequency band (operating frequency band or use frequency band) may be affected by the frequency characteristics (e.g., resonant frequency) of parasitic resonances that depend on the phase of the radiated current of the electromagnetic signal provided to at least one first antenna radiator.

[0238] FIG. 17 is a graph showing antenna radiation performance for a second antenna including at least one second antenna radiator in a multi-foldable electronic device (2) in a folded state (see FIG. 8a), according to various embodiments of the present disclosure.

[0239] Referring to FIG. 17, 1701, 1702, 1703, and 1704 represent radiation efficiencies of the second antenna when the phase of an electromagnetic signal (or, radio signal, RF signal, or radiated current) provided (or fed) to at least one second antenna radiator (e.g., the second partial metal portion (212) of FIG. 7) is changed, respectively. For example, the resonant frequency of the second antenna may be determined at least in part by the phase of the electromagnetic signal, and the phase may vary depending on the element value provided (or formed) by the matching circuit for the second antenna. 1701 represents the radiation efficiency of the second antenna when, for example, the matching circuit is configured to provide (or form) an element value of about 1.0 nH. 1702 represents the radiation efficiency of the second antenna when, for example, the matching circuit is configured to provide (or form) an element value of about 2.2 nH. 1703 represents the radiation efficiency of the second antenna, for example, when the matching circuit is configured to provide (or form) an element value of about 3.3 nH. 1704 represents the radiation efficiency of the second antenna, for example, when the matching circuit is configured to provide (or form) an element value of about 4.7 nH. The antenna radiation performance of the second antenna for a specified or selected frequency band (operating frequency band or use frequency band) may be affected by the frequency characteristics (e.g., resonant frequency) of parasitic resonances that depend on the phase of the radiated current of the electromagnetic signal provided to at least one second antenna radiator.

[0240] FIG. 18 is a drawing showing a portion of a multi-foldable electronic device (2) in an unfolded state according to various embodiments of the present disclosure.

[0241] It is understood that the present disclosure encompasses and encompasses various combinations of the features and / or embodiments disclosed in connection with FIG. 18. Various combinations of the features described below in connection with FIG. 18 may be considered to be encompassed by the present disclosure as specific examples.

[0242] Referring to FIG. 18, at least a portion of the second back cover (B2) may be formed of a metal material in place of the metal layer (6) (see FIG. 6). Referring to 1801, by replacing the metal layer (6) (see FIG. 6), the entire area of ​​the second back cover (B2) may be formed of a metal material. Referring to 1802, 1803, or 1804, by replacing the metal layer (6) (see FIG. 6), some areas of the second back cover (B2) may be implemented as metal areas (1821, 1831, or 1841), and other areas of the second back cover (B2) may be implemented as non-metal areas (1822, 1832, or 1842). The non-metal areas (1822, 1832, or 1842) may be formed, for example, by injection molding. The non-metallic region (1822, 1832, or 1842) of the second back cover (B2) can be positioned, for example, in an opening formed in the metal region (1821, 1831, or 1841) when viewed from above the second back cover (B2). Examples 1801, 1802, 1803, and 1804 show that the shape of the metal region included in the second back cover (B2) can be implemented in various ways. When an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) is provided (or powered) to at least one antenna radiator (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7), the antenna radiation performance for a designated or selected frequency band (operating frequency band or use frequency band) may be affected by the frequency characteristics (e.g., resonant frequency) of parasitic resonance that vary depending on the shape of the metal area included in the second back cover (B2).

[0243] According to various embodiments, the non-metallic area (1822, 1832, or 1842) of the second back cover (B2) may be implemented in a shape that is not limited to a circular or rectangular shape, or may additionally include a non-metallic area such as a letter.

[0244] FIG. 19 is a diagram showing a folded state of a multi-foldable electronic device (1900) according to various embodiments of the present disclosure.

[0245] It is understood that the present disclosure encompasses and encompasses various combinations of the features and / or embodiments disclosed in connection with FIG. 19. Various combinations of the features described below in connection with FIG. 19 may be considered to be encompassed by the present disclosure as specific examples.

[0246] Referring to FIG. 19, a multi-foldable electronic device (1900) may include a first housing (1910) (e.g., the first housing (21) of FIG. 6), a second housing (1920) (e.g., the second housing (22) of FIG. 6), and a third housing (1930) (e.g., the third housing (23) of FIG. 6). The first housing (1910) and the third housing (1930) may be rotatably connected via a first hinge portion (1941) (e.g., the first hinge portion (H1) of FIG. 2C). The second housing (1920) and the third housing (1930) may be rotatably connected via a second hinge portion (1942) (e.g., the first hinge portion (H1) of FIG. 2C). In the folded state of the multi-foldable electronic device (1900), the second housing (1920) can be positioned between the first housing (1910) and the third housing (1930).

[0247] According to various embodiments, the multi-foldable electronic device (1900) may include a flexible display module (1950) (e.g., the first display module (810) of FIG. 8A). The flexible display module (1950) may include a first display area (1951) disposed or coupled to a first housing (1910) (e.g., the first display area (31) of FIG. 8A), a second display area (1952) disposed or coupled to a second housing (1920) (e.g., the second display area (32) of FIG. 8A), and a third display area (1953) disposed or coupled to a third housing (1930) (e.g., the third display area (33) of FIG. 8A). In the folded state of the multi-foldable electronic device (1900), the first housing (1910) can be positioned between the first display area (1951) and the second display area (1952). In the folded state of the multi-foldable electronic device (1900), the second display area (1952) can be positioned between the first housing (1910) and the second housing (1920). In the folded state of the multi-foldable electronic device (1900), the second housing (1920) and the third housing (1930) can be positioned between the second display area (1952) and the third display area (1953). The flexible display module (1950) may include a first bendable display area (1954) (e.g., the first bendable display area (34) of FIG. 8A) between a first display area (1951) and a third display area (1953). The first hinge portion (1941) may be configured to support the first bendable display area (1954). The flexible display module (1950) may include a second bendable display area (1955) (e.g., the second bendable display area (35) of FIG. 8A) between a second display area (1952) and a third display area (1953).The second hinge portion (1942) may be configured to support a second bendable display area (1955).

[0248] According to various embodiments, the multi-foldable electronic device (1900) may include a first ground structure (1911) positioned in a first housing (1910), a second ground structure (1921) positioned in a second housing (1920) (e.g., the second ground structure of FIG. 8A), and a third ground structure (1931) positioned in a third housing (1930). The first ground structure (1911) and the third ground structure (1931) may be electrically connected via a first hinge portion (1941) and / or an electrical connection member (e.g., an FPCB) disposed across the first hinge portion (1941). The second ground structure (1921) and the third ground structure (1931) may be electrically connected via the second hinge portion (1942) and / or an electrical connection member (e.g., FPCB) disposed across the second hinge portion (1942).

[0249] According to various embodiments, the multi-foldable electronic device (1900) may include an antenna radiator (1960) (e.g., the first metal portion (211) and / or the second metal portion (212) of FIG. 7) configured to transmit and / or receive an electromagnetic signal (or, a radio signal, an RF signal, or a radiated current) by a wireless communication circuit included in the multi-foldable electronic device (1900) (e.g., the wireless communication module (192) of FIG. 1). For example, the antenna radiator (1960) may be implemented as a part of a first ground structure (1911) positioned in the first housing (1910). The antenna radiator (1960) may be a part of a first ground structure (1911) that is positioned close to or substantially forms the outermost portion of the first housing (1910) in a direction from the first hinge portion (1941) to the second hinge portion (1942), for example, in an unfolded state (not shown) of the multi-foldable electronic device (1900). The antenna radiator (1960) may include, for example, a part of a side member (also referred to as a side member, a side structure, or a side bezel structure) of the first housing (1910). In various embodiments, when viewed from above the first display area (1951), the antenna radiator (1960) may at least partially overlap the second hinge portion (1942) in the folded state of the multi-foldable electronic device (1900). In various embodiments, the antenna radiator (1960) may be positioned below the back surface of the first display area (1951). When viewed from above the first display area (1951), the antenna radiator (1960) may overlap the first display area (1951) with the antenna radiator (1960). The position or number of the antenna radiators (1960) is not limited to the illustrated example.

[0250] According to various embodiments, in a folded state of the multi-foldable electronic device (1900), the first ground structure (1911) and the conductive portion (1956) included in the second display area (1952) of the flexible display module (1950) may form a waveguide structure. The flexible display module (1950) may include, for example, a ground plane (e.g., an electromagnetic shielding layer) of a metal material that forms at least a portion of the back surface of the flexible display module (1950) or is at least partially disposed on the back surface of the flexible display module (1950), and the conductive portion (1956) included in the second display area (1952) may be a partial ground plane included in the second display area (1952) among the ground planes. In the folded state of the multi-foldable electronic device (1900), when the wireless communication circuit provides (or supplies) an electromagnetic signal to the antenna radiator (1960), the waveguide structure including the conductive portion (1956) included in the first ground structure (1911) and the second display area (1952) may form a parasitic resonance due to the electromagnetic wave energy radiated from the antenna radiator (1960). The multi-foldable electronic device (1900) according to various embodiments of the present disclosure may include a metal layer (1970) positioned in the first housing (1910). The metal layer (1970) may be positioned at least partially between the first ground structure (1911) and the second display area (1952) in the folded state of the multi-foldable electronic device (1900). The metal layer (1970) may be electrically connected to the first ground structure (1911). The metal layer (1970) can strengthen the ground connection between the first ground structure (1911) and the conductive portion (1956) included in the second display area (1952) in the folded state of the multi-foldable electronic device (1900).The metal layer (1970) can reduce parasitic resonance or adjust the frequency of parasitic resonance so that the waveguide structure including the conductive portion (1956) included in the first ground structure (1911) and the second display area (1952) does not generate parasitic resonance in the operating frequency band for the antenna radiator (1960). The metal layer (1970) can ensure that the conductive portion (1956) included in the second display area (1952) is electromagnetically well integrated into the first ground structure (1911) as an antenna ground for the antenna radiator (1960) so that the frequency of the parasitic resonance formed by the waveguide structure is not included in the operating frequency band of the antenna including the antenna radiator (1960).

[0251] According to various embodiments, the first housing (1910) may include a back cover (not shown) facing in an opposite direction from the first display area (1951). A metal layer (1960) may be positioned between the back cover and the first ground structure (1911). The metal layer (1960) may be disposed on (e.g., attached to) the back cover. In various embodiments, the back cover may be formed of a metal material in place of the metal layer (1960) and may be electrically connected to the first ground structure (1911).

[0252] FIG. 20 is a diagram showing a folded state of a multi-foldable electronic device (2000) according to various embodiments of the present disclosure.

[0253] It is understood that the present disclosure encompasses and encompasses various combinations of the features and / or embodiments disclosed in connection with FIG. 20. Various combinations of the features described below in connection with FIG. 20 may be considered to be encompassed by the present disclosure as specific examples.

[0254] Referring to FIG. 20, a multi-foldable electronic device (2000) may include a first housing (1910), a second housing (1920), and a third housing (1930). The multi-foldable electronic device (2000) may include a first ground structure (1911) positioned in the first housing (1910), a second ground structure (1921) positioned in the second housing (1920), and a third ground structure (1931) positioned in the third housing (1930). The multi-foldable electronic device (2000) may include a first hinge portion (1941) and a second hinge portion (1942). The multi-foldable electronic device (2000) may include a flexible display module (1950). The flexible display module (1950) may include a first display area (1951), a second display area (1952), and a third display area (1953). The flexible display module (1950) may include a first bendable display area (1954). The flexible display module (1950) may include a second bendable display area (1954). The multi-foldable electronic device (2000) may include a metal layer (1970). Descriptions of some components that are the same as in the previous embodiment may not be repeated.

[0255] According to various embodiments, the multi-foldable electronic device (2000) may include an antenna radiator (2060) (e.g., the first partial metal portion (211) and / or the second partial metal portion (212) of FIG. 7). The antenna radiator (2060) may include a portion of the first ground structure (1911). The antenna radiator (2060) according to the example of FIG. 20 may not overlap the first display area (1951) when viewed from above the first display area (1951) compared to the antenna radiator (1960) according to the example of FIG. 19. The antenna radiator (1960) may include, for example, a portion of the first ground structure (1911) configured to surround an edge of the first display area (1951) (e.g., a portion of a screen bezel).

[0256] FIG. 21 is a diagram illustrating a sliderable electronic device (2100) according to various embodiments of the present disclosure.

[0257] It is understood that the present disclosure encompasses and encompasses various combinations of the features and / or embodiments disclosed in connection with FIG. 21. Various combinations of the features described below in connection with FIG. 21 may be considered to be encompassed by the present disclosure as specific examples.

[0258] Referring to FIG. 21, a sliderable electronic device (2100) may include a sliderable housing (2110) and a flexible display module (2120) disposed or coupled to the sliderable housing (2110). The sliderable housing (2110) may be implemented such that a first portion (2111) of the sliderable housing (2110) is slidable in a first direction (2101) relative to a second portion (2112) of the sliderable housing (2110). The first portion (2111) and the second portion (2112) may overlap in a direction perpendicular to the first direction (2101). When the first part (2111) is slid in the first direction (2101) with respect to the second part (2112), the first part (2111) may expand, and the second part (2112) may contract due to the expansion of the first part (2111). FIG. 21 illustrates a state in which the first part (2111) is not slid in the first direction (2101) with respect to the second part (2112). The sliderable housing (2110) may include a bendable part (2113) between the first part (2111) and the second part (2112) that overlap each other. When the first part (2111) is slid in the first direction (2101) with respect to the second part (2112), the position of the bendable part (2113) in the sliderable housing (2110) may change. The sliderable housing (2110) may include a first side (2110A) and a second side (2110B) positioned opposite the first side (2110A). The sliderable housing (2110) may be configured such that the first side (2110A) folds inward at the bendable portion (2113). The flexible display module (2120) may be positioned or coupled to the second side (2110B) of the sliderable housing (2110) and may slide together with the sliderable housing (2110).

[0259] According to various embodiments, the sliderable electronic device (2100) may include a ground structure positioned in the sliderable housing (2110). The ground structure may extend from a first portion (2111) across a bendable portion (2113) to a second portion (2112). A first portion ground structure (2131) positioned in the first portion (2111) of the ground structure and a second portion ground structure (2132) positioned in the second portion (2112) of the ground structure may be spaced apart from each other in a direction perpendicular to the first direction (2101) and may overlap each other. When the first part (2111) slides in the first direction (2101) with respect to the second part (2112), the first part ground structure (2131) may expand due to the expansion of the first part (2111), and the second part ground structure (2132) may contract due to the contraction of the second part (2112).

[0260] According to various embodiments, the sliderable electronic device (2100) may include an antenna radiator (2140) configured to transmit and / or receive an electromagnetic signal (or, a radio signal, an RF signal, or a radiated current) from a wireless communication circuit included in the sliderable electronic device (2100) (e.g., a wireless communication module (192) of FIG. 1). The antenna radiator (2140) may be implemented as a part of a first partial ground structure (2131). The antenna radiator (2140) may be, for example, positioned close to or substantially forming an outermost portion of the sliderable housing (2110) spaced apart from the bendable portion (2113) in the first direction (2101). The antenna radiator (2140) may, for example, comprise a portion of a side member (also referred to as a side member, a side structure, or a side bezel structure) of the sliderable housing (2110). In various embodiments, the position or number of the antenna radiators (2140) is not limited to the illustrated example.

[0261] According to various embodiments, a first partial ground structure (2131) positioned in a first portion (2111) of a sliderable housing (2110) and a second partial ground structure (2132) positioned in a second portion (2112) of the sliderable housing (2110) may form a waveguide structure. When a wireless communication circuit provides (or feeds) an electromagnetic signal to an antenna radiator (2140), the waveguide structure including the first partial ground structure (2131) and the second partial ground structure (2132) may form a parasitic resonance due to electromagnetic wave energy radiated from the antenna radiator (2140). The sliderable electronic device (2100) of the present disclosure may include a metal layer (2150) positioned between the first partial ground structure (2131) and the second partial ground structure (2132). A metal layer (2150) may be positioned at least partially between the first partial ground structure (2131) and the second partial ground structure (2132), and may be positioned in the first portion (2110) of the sliderable housing (2110). The metal layer (2150) may be electrically connected to the first partial ground structure (2131). The metal layer (2150) may strengthen the ground connection between the first partial ground structure (2131) and the second partial ground structure (2132). The metal layer (2150) may reduce parasitic resonance or adjust the frequency of parasitic resonance so that the waveguide structure including the first partial ground structure (2131) and the second partial ground structure (2132) does not generate parasitic resonance in an operating frequency band for the antenna radiator (2140).To prevent the frequency of the parasitic resonance formed by the waveguide structure from being included in (or suppressed from being included in) the operating frequency band of the antenna including the antenna radiator (2140), the metal layer (2150) can enable the first partial ground structure (2131) and the second partial ground structure (2132) to function well as an antenna ground for the antenna radiator (2140).

[0262] According to various embodiments of the present disclosure, a multi-foldable electronic device (2) includes a multi-foldable housing, a flexible display module (e.g., a first display module (3)), at least one antenna radiator (e.g., a first partial metal portion (211) and / or a second partial metal portion (212)), and a metal layer (6). The multi-foldable housing includes a first housing (21), a second housing (22), and a third housing (23) between the first housing (21) and the second housing (22). The multi-foldable housing includes a first hinge portion (H1) configured to rotatably connect the first housing (21) and the third housing (23). The multi-foldable housing includes a second hinge portion (H2) configured to rotatably connect the second housing (22) and the third housing (23). The multi-foldable housing is configured such that the second housing (22) is positioned between the first housing (21) and the third housing (23) in the folded state of the multi-foldable electronic device (2). The flexible display module includes a first display area (31) disposed in the first housing (21), a third display area (33) extending from the first display area (31) and disposed in the third housing (23), and a second display area (32) extending from the third display area (33) and disposed in the second housing (22). At least one antenna radiator is configured to transmit and / or receive a signal of a specified frequency band. The metal layer (6) is positioned in the second housing (22) and is configured to adjust the frequency characteristics for the at least one antenna radiator in the folded state of the multi-foldable electronic device (2). The metal layer (6) is positioned between the first display area (31) of the flexible display module (24) and a ground structure (e.g., the second ground structure (820)) positioned in the second housing (22) in the folded state of the multi-foldable electronic device (2). The metal layer (6) is electrically connected to the ground structure.

[0263] According to various embodiments of the present disclosure, the metal layer (6) may be configured to adjust the frequency of a parasitic resonance formed between a first display area (31) of a flexible display module (e.g., a first display module (3)) and a ground structure (e.g., a second ground structure (820)) located in a second housing (22) in a folded state of a multi-foldable electronic device (2).

[0264] According to various embodiments of the present disclosure, the metal layer (6) may be configured to adjust a capacitance value formed by a first display area (31) of a flexible display module (e.g., a first display module (3)) and a ground structure (e.g., a second ground structure (820)) positioned in a second housing (22) in a folded state of a multi-foldable electronic device (2).

[0265] According to various embodiments of the present disclosure, a flexible display module (e.g., a first display module (3)) may include an electromagnetic shielding layer (e.g., a ground plane (810)). A metal layer (6) may be configured to adjust a capacitance value formed by a portion of the electromagnetic shielding layer included in the first display area (31) (e.g., a first partial ground plane (811)) and a ground structure (e.g., a second ground structure (820)) located in the second housing (22) in a folded state of the multi-foldable electronic device (2).

[0266] According to various embodiments of the present disclosure, the second housing (22) may include a back cover (e.g., a second back cover (B2)) positioned opposite a second display area (32) of a flexible display module (e.g., a first display module (3)), and a bracket (e.g., a second bracket (F21)) configured to support the second display area (32) of the flexible display module. A metal layer (6) may be disposed on the back cover between the back cover and the bracket.

[0267] According to various embodiments of the present disclosure, the metal layer (6) may be a back cover (e.g., a second back cover (B2)) positioned in the second housing (22).

[0268] According to various embodiments of the present disclosure, in a folded state of a multi-foldable electronic device (2), a separation distance between a first display area (31) of a flexible display module (e.g., a first display module (3)) and a ground structure (e.g., a second ground structure (820)) located in a second housing (22) may be greater than a separation distance between a second display area (32) of the flexible display module and a third display area (33) of the flexible display module.

[0269] According to various embodiments of the present disclosure, a multi-foldable electronic device (2) may include a battery (e.g., a second battery (522)) disposed in a bracket (e.g., a second bracket (F21)) of a second housing (22) between a back cover (e.g., a second back cover (B2)) of a second housing (22). In a direction perpendicular to the back cover of the second housing (22), a metal layer (6) may not overlap with the battery.

[0270] According to various embodiments of the present disclosure, a bracket (e.g., a second bracket (F21)) may include a hinge area (1103) configured to be connected to a second hinge portion (H2). In a direction perpendicular to a back cover (e.g., a second back cover (B2)) of a second housing (22), a metal layer (6) may include a portion (e.g., a third portion (63)) overlapping the hinge area (1103) of the bracket.

[0271] According to various embodiments of the present disclosure, a ground structure (e.g., a second ground structure (820)) may include a ground region of at least one PCB (e.g., at least one second PCB (512)) positioned in a second housing (22), and a conductor included in the second housing (22) and electrically connected to the ground region of the at least one PCB. The metal layer (6) may be electrically connected to the ground region of the at least one PCB via at least one electrical connection member (e.g., a first electrical connection member (71) and / or a second electrical connection member (72)) disposed between the metal layer (6) and the at least one PCB.

[0272] According to various embodiments of the present disclosure, at least one antenna radiator (e.g., the first metal portion (211) and / or the second metal portion (212)) may be included in a side member (e.g., the first side member (F12)) that forms at least a portion of a side surface of the first housing (21).

[0273] According to various embodiments of the present disclosure, at least one antenna radiator (e.g., the first metal portion (211) and / or the second metal portion (212)) may be positioned below the back surface of the first display area (31) of the flexible display module (e.g., the first display module (3)).

[0274] According to various embodiments of the present disclosure, the multi-foldable electronic device (2) may include at least one matching circuit (e.g., a first matching circuit (M1) and / or a second matching circuit (M2)) disposed in at least one electrical path (e.g., a first ground path (GP1) and / or a second ground path (GP2)) between a metal layer (6) and a ground structure (e.g., a second ground structure (820)).

[0275] According to various embodiments of the present disclosure, the metal layer (6) may include a plurality of partial metal layers that are separated from each other.

[0276] According to various embodiments of the present disclosure, the multi-foldable electronic device (2) may include at least one switch (e.g., a first switch (1281), a second switch (1282), a third switch (1283), a fourth switch (1284), a fifth switch (1285), a sixth switch (1286), or a seventh switch (1287)) configured to electrically connect or disconnect a plurality of partial metal layers of the metal layer (6) in response to a control signal.

[0277] The embodiments disclosed in this disclosure and the drawings are merely examples to more easily explain the technical content and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, it should be understood that the scope of the various embodiments of the present disclosure includes various modifications or variations in addition to the embodiments disclosed herein. Additionally, it should be understood that any embodiment(s) described herein can be used in conjunction with any other embodiment(s) described herein. For example, although the present disclosure is presented in a form that provides multiple embodiments each defining multiple features, it is emphasized that some of these embodiments may be connected only by reference to the same drawing or drawings. It should be understood that the present disclosure includes various combinations of these embodiments, as long as there is no apparent contradiction between two (or more) embodiments. For example, if features are presented as optional in the present disclosure, various combinations of such optional features are included in the present disclosure.

Claims

1. In a multi-foldable electronic device (2), As a multi-foldable housing, 1st housing (21), Second housing (22), A third housing (23) between the first housing (21) and the second housing (22), A first hinge portion (H1) configured to rotatably connect the first housing (21) and the third housing (23), and It includes a second hinge portion (H2) configured to rotatably connect the second housing (22) and the third housing (23), A multi-foldable housing configured such that the second housing (22) is positioned between the first housing (21) and the third housing (23) in the folded state of the multi-foldable electronic device (2); A flexible display module (3) comprising a first display area (31) disposed in the first housing (21), a third display area (33) extending from the first display area (31) and disposed in the third housing (23), and a second display area (32) extending from the third display area (33) and disposed in the second housing (22); At least one antenna radiator (211, 212) configured to transmit and / or receive signals of a specified frequency band; and A metal layer (6) positioned in the second housing (22) and configured to adjust the frequency characteristics of the at least one antenna radiator (211, 212) in the folded state of the multi-foldable electronic device (2), The above metal layer (6) is The ground structure (820) is positioned between the first display area (31) of the flexible display module (24) and the second housing (22) in the folded state of the multi-foldable electronic device (2), and A multi-foldable electronic device electrically connected to the above ground structure (820).

2. In paragraph 1, The above metal layer (6) is A multi-foldable electronic device configured to adjust the frequency of parasitic resonance formed between the first display area (31) of the flexible display module (3) and the ground structure (820) located in the second housing (22) in the folded state of the multi-foldable electronic device (2).

3. In paragraph 1, The above metal layer (6) is A multi-foldable electronic device configured to adjust a capacitance value formed by the first display area (31) of the flexible display module (3) and the ground structure (820) located in the second housing (22) in the folded state of the multi-foldable electronic device (2).

4. In paragraph 1, The above flexible display module (3) includes an electromagnetic shielding layer (810), and The above metal layer (6) is A multi-foldable electronic device configured to adjust a capacitance value formed by a part (811) of the electromagnetic shielding layer (810) included in the first display area (31) and the ground structure (820) located in the second housing (22) in the folded state of the multi-foldable electronic device (2).

5. In paragraph 1, The second housing (22) includes a back cover (B2) positioned opposite the second display area (32) of the flexible display module (3), and a bracket (F21) configured to support the second display area (32) of the flexible display module (3), and A multi-foldable electronic device in which the metal layer (6) is disposed between the back cover (B2) and the bracket (F21) on the back cover (B2).

6. In paragraph 1, A multi-foldable electronic device in which the above metal layer (6) is a back cover (B2) located in the above second housing (22).

7. In paragraph 1, A multi-foldable electronic device (2), wherein, in the folded state of the multi-foldable electronic device (2), a distance between the first display area (31) of the flexible display module (3) and the ground structure (820) located in the second housing (22) is greater than a distance between the second display area (32) of the flexible display module (3) and the third display area (33) of the flexible display module (3).

8. In paragraph 7, Further comprising a battery (522) arranged in the bracket (F21) between the back cover (B2) of the second housing (22) and the bracket (F21) of the second housing (22), A multi-foldable electronic device in which the metal layer (6) does not overlap the battery (522) in a direction perpendicular to the back cover (B2) of the second housing (22).

9. In paragraph 8, The above bracket (F21) includes a hinge area (1103) configured to be connected to the second hinge portion (H2), and A multi-foldable electronic device in which the metal layer (6) includes a portion (63) overlapping the hinge area (1103) of the bracket (F21) in a direction perpendicular to the back cover (B2) of the second housing (22).

10. In paragraph 1, The ground structure (820) includes a ground area of ​​at least one printed circuit board (PCB) (512) positioned in the second housing (22), and a conductor included in the second housing (22) and electrically connected to the ground area of ​​the at least one PCB (512), A multi-foldable electronic device in which the metal layer (6) is electrically connected to the ground area of ​​the at least one PCB (512) through at least one electrical connection member (71, 72) disposed between the metal layer (6) and the at least one PCB (512).

11. In paragraph 1, A multi-foldable electronic device, wherein at least one antenna radiator (211, 212) is included in a side member (F12) that includes at least a portion of a side surface of the first housing (21).

12. In paragraph 11, A multi-foldable electronic device, wherein at least one antenna radiator (211, 212) is positioned below the back surface of the first display area (31) of the flexible display module (3).

13. In paragraph 1, A multi-foldable electronic device further comprising at least one matching circuit (M1, M2) arranged in at least one electrical path (GP1, GP2) between the metal layer (6) and the ground structure (820).

14. In paragraph 1, A multi-foldable electronic device wherein the metal layer (6) comprises a plurality of partial metal layers separated from each other.

15. In paragraph 13, A multi-foldable electronic device further comprising at least one switch (1281, 1282, 1283, 1284, 1285, 1286, 1287) configured to electrically connect or disconnect the plurality of partial metal layers of the metal layer (6) in response to a control signal.

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