Method of coating a substrate, substrate, and deposition system

Abstract

A method of coating a substrate in a vacuum chamber, the method comprising transporting the substrate into the chamber, the substrate comprising a plurality of pixel regions, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls; evaporating a material using an evaporation source having a vapor distribution pipe with a row of nozzles, wherein the row of nozzles further comprises a plurality of outer nozzles arranged in end regions of the row of nozzles, wherein each outer nozzle of the plurality of outer nozzles has a main emission direction tilted towards a central region; and depositing the material evaporated by the evaporation source in the plurality of pixel region of the substrate, wherein depositing the material comprises depositing the material under the overhang projecting from the sidewall adjacent to the pixel region.

Description

ZIMR-0569PCMETHOD OF COATING A SUBSTRATE, SUBSTRATE, AND DEPOSITION SYSTEMTECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to methods and apparatuses for coating substrates, and to substrates for display manufacture. More particularly, embodiments of the present disclosure relate to methods and apparatuses for coating substrates for display manufacture with pixel regions at least partially surrounded by overhang structures. In particular, embodiments relate to the manufacture of substrates for organic light-emitting diode (OLED) applications. Embodiments particularly relate to the deposition of a material, such as a metal, under the overhang structures, particularly without the use of fine metal masks (FMM). Methods and apparatuses particularly relate to uniform deposition across the substrates, in particular under overhang structures and / or on essentially vertically oriented substrates.BACKGROUND

[0002] An organic light-emitting diode (OLED) is a light-emitting diode in which an electroluminescent layer is a film of organic compounds that emits light in response to an electric current. Since OLEDs emit light directly without involving backlight and color filters, the color gamut and viewing angles possible with OLED displays are greater than those of traditional LCD displays. Furthermore, OLEDs can be manufactured on flexible substrates, and accordingly, they can be utilized in a variety of applications. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information. OLEDs can also be used for general space illumination. An OLED display, for example, may include layers of organic material situated between two electrodes that are deposited on a substrate in a manner so as to form a matrix display panel having individually energizable pixels.

[0003] Organic materials and metallic materials are deposited on a substrate in a vacuum processing chamber for OLED manufacturing. Metallic materials are employedZIMR-0569PC as, for example, electrode materials or electron injection layer (EIL) materials. The materials to be deposited are evaporated using an evaporation source arrangement, and the evaporated materials are deposited onto a substrate through nozzles. Metallic materials are typically evaporated in an evaporation source at a temperature of 1 ,000°C or above, or of 1 ,500°C or above. Organic materials are typically evaporated in an evaporation source arrangement at temperatures between 250°C and 500°C.

[0004] Metallic and organic evaporators can be used for the production of organic light-emitting diodes (OLED). Also, other applications utilize evaporators for depositing metal or organic layers, for example, onto large area substrates. For example, coevaporation of two or more metals or metal alloys can be provided. An OLED display, for example, may include a plurality of layers of organic material situated between two electrodes that are deposited onto a substrate. One of the electrodes can include a transparent conductive layer such as indium tin oxide (ITO) or other transparent conductive oxide (TOO) materials. The second electrode can include a metal or a metal alloy.

[0005] OLED pixels can be deposited onto a substrate through fine metal masks FMMs (also referred to as pixel masks) that have a plurality of small pixel holes that define individual pixel areas on the substrate. A precise alignment between the FMM and the substrate is necessary for the pixel deposition, which is challenging since each of the small pixels includes a plurality of organic layers that are to be deposited on top of each other on a respective anode.

[0006] Another technique for forming OLED pixels on a substrate uses photo lithography to pattern pixels instead of using fine metal masks (FMMs). Here, a structure that acts as a masking layer is formed directly on the substrate before the actual pixel deposition. Alignment issues can be reduced. However, quickly and reliably coating a substrate with an OLED layer stack without FMMs requires complex equipment and is also challenging.

[0007] In view of the above, it would be beneficial to provide methods of quickly and reliably coating a substrate with an OLED layer stack, particularly without the use of fine metal masks (FMMs). Furthermore, improved deposition systems and substrates for display manufacture would be beneficial.ZIMR-0569PCSUMMARY

[0008] In light of the above, methods of coating a substrate in a vacuum chamber, deposition systems, and substrates according to the independent claims are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0009] According to an aspect, a method of coating a substrate in a vacuum chamber is provided. The method includes transporting the substrate into the vacuum chamber, the substrate including a plurality of pixel regions formed thereon, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls. The method includes evaporating a material using an evaporation source arranged in the vacuum chamber. The evaporation source includes a vapor distribution pipe with a row of nozzles arranged along a first direction, wherein the row of nozzles includes a plurality of central nozzles arranged in a central region of the row of nozzles, the central region extending at least over a dimension of the substrate in the first direction. The row of nozzles further includes a plurality of outer nozzles arranged in end regions of the row of nozzles, the end regions being adjacent to the central region on opposite sides of the central region along the first direction. Each outer nozzle of the plurality of outer nozzles has a main emission direction tilted towards the central region. The method includes depositing the material evaporated by the evaporation source in the plurality of pixel regions of the substrate, wherein depositing the material includes depositing the material under a first overhang projecting from a first sidewall adjacent to a first pixel region of the plurality of pixel regions, wherein at least a portion of the material deposited under the first overhang is emitted from at least one outer nozzle of the plurality of outer nozzles.

[0010] In some embodiments, the material may be a metal or a metal alloy. The material may be deposited on a stack of organic layers deposited in the plurality of pixel regions. The material deposited in the plurality of pixel regions, and particularly under the overhangs projecting partially over the plurality of pixel regions, may form a cathode for the plurality of pixel regions, particularly a cathode of an OLED layer stack. The substrate may particularly be a glass substrate. In some embodiments, theZIMR-0569PC sidewalls may be formed at least partially of a conductive material such as a metal or a metal alloy. The evaporated material may be a metallic material to form a metal-metal contact, particularly to form a cathode of an OLED layer stack in contact with the sidewalls, the sidewalls providing an electrical contact for the cathode.

[0011] In some embodiments, the first pixel region may be located at or near an edge of the substrate, particularly at or near a first edge perpendicular to the first direction. The first overhang may project towards the first edge. The substrate and the evaporation pipe may be oriented essentially vertically. In particular, the first direction may be an essentially vertical direction. In embodiments, at least one nozzle of the plurality of outer nozzles is tilted such that material emitted by the at least one outer nozzle is deposited under the first overhang, particularly on at least a portion of the first sidewall.

[0012] In another aspect, a substrate for display manufacture including an organic light-emitting diode (OLED) pixel structure is provided. The OLED pixel structure includes a plurality of pixel regions, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls. The OLED pixel structure includes an organic layer deposited in each pixel region of the plurality of pixel regions. The OLED pixel structure includes a layer of a material deposited using a method of any one of the embodiments described herein. In particular, the layer of material deposited according to embodiments may be a conductive layer, such as a layer of a metal or a metal alloy. The layer may form a cathode for the each of the plurality of pixel regions of the OLED pixel structure.

[0013] In yet another aspect, a deposition system for coating a substrate in a vacuum chamber is provided. The deposition system includes an evaporation source, including a vapor distribution pipe with a row of nozzles arranged along a first direction. The row of nozzles includes a plurality of central nozzles arranged in a central region of the row of nozzles, wherein the row of nozzles further includes a plurality of outer nozzles arranged in end regions of the row of nozzles, the end regions being adjacent to the central region on opposite sides of the central region along the first direction. Each outer nozzle of the plurality of outer nozzles has a main emission direction tilted towards the central region. The vapor distribution pipe is essentially vertically oriented.ZIMR-0569PC

[0014] In embodiments, the deposition system may be configured for coating the substrate according to a method in accordance with any of the embodiments of the present disclosure. In particular, the deposition system may be configured to coat substrates described herein. In particular, the central region of the row of nozzles may extend at least over a dimension of the substrate in the first direction. The deposition system may be configured to coat substrates including a plurality of pixel regions at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls. The evaporation source may be configured for evaporating a material and for depositing the material under a first overhang projecting from a first sidewall adjacent to a first pixel region of the plurality of pixel regions, wherein at least a portion of the material deposited under the first overhang is emitted from at least one outer nozzle of the plurality of outer nozzles.

[0015] According to a further aspect, a method of coating an essentially vertically oriented substrate in a vacuum chamber is provided, the substrate including a top edge and a bottom edge. The method includes transporting the substrate into the vacuum chamber. The method includes evaporating a material using an evaporation source arranged in the vacuum chamber. The evaporation source includes an essentially vertically oriented vapor distribution pipe with a row of nozzles, wherein one or more upper nozzles of the row of nozzles are located higher than the top edge of the substrate and have a downwardly inclined main emission direction, and wherein one or more lower nozzles of the row of nozzles are located lower than the bottom edge of the substrate and have an upwardly inclined main emission direction. The method includes depositing the material evaporated by the evaporation source in a plurality of pixel regions of the substrate.

[0016] The pixel regions may be configured according to embodiments described herein. In particular, each pixel region of the plurality of pixel regions may be at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls. The evaporated material may be directed under upwardly projecting overhangs in an upper part of the substrate, at least in part, by the one or more upper nozzles. The evaporated material may be directed under downwardly projecting overhangs in a lower part of the substrate, at least in part, by the one or more lower nozzles.ZIMR-0569PC

[0017] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. The method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments are also directed at methods for operating the described apparatus. The methods for operating the described apparatuses include method aspects for carrying out every function of the apparatus. Embodiments are also directed at methods of manufacturing processed substrates, particularly coated substrates, in a vacuum deposition system described herein and substrates manufactured in accordance with the methods and / or using the systems described herein, such as OLED substrates, particularly OLED displays. It is also possible for other devices than OLED displays to be manufactured using the apparatuses and methods described herein.BRIEF DESCRIPTION OF THE DRAWINGS

[0018] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

[0019] FIG. 1 shows a schematic view of a vacuum deposition system with a deposition system according to embodiments of the present disclosure;

[0020] FIG. 2 shows a schematic view of an evaporation source according to embodiments of the present disclosure in a vertical sectional plane;

[0021] FIG. 3 shows a schematic flow diagram of a method according to embodiments of the present disclosure;

[0022] FIG. 4 shows a schematic illustration of deposition under an overhang of a substrate using an evaporation source according to embodiments of the present disclosure in a vertical sectional plane;ZIMR-0569PC

[0023] FIG. 5 shows a schematic illustration of deposition under a further overhang of a substrate using an evaporation source according to embodiments of the present disclosure in a horizontal sectional plane;

[0024] FIG. 6 shows a schematic sectional view of a substrate with an OLED layer stack manufactured according to methods of the present disclosure; and

[0025] FIG. 7 shows a schematic front view of a pixel region surrounded by sidewalls with overhangs projecting from the sidewalls according to embodiments of the present disclosure.DETAILED DESCRIPTION

[0026] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations.

[0027] Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can also apply to a corresponding part or aspect in another embodiment.

[0028] OLED pixels can be formed on a substrate using photo lithography and patterning, particularly without a fine metal mask (FMM). An FMM has a plurality of pixel holes and is positioned in front of the substrate and aligned relative to the substrate before the material deposition. OLED pixel patterning without FMMs is based on a structure that acts as a “mask” and is formed directly on the substrate before coating the substrate with a plurality of materials in a vacuum deposition system. The structure that is formed on the substrate may include sidewalls adjacent to pixel regions, particularly sidewalls surrounding the pixel regions, and overhang structures projecting from the sidewalls at least partially over the pixel regions, as is depictedZIMR-0569PC exemplarily in FIG. 6.

[0029] FIG. 6 is a schematic sectional view showing a part of an OLED layer stack 760 on a substrate 10 manufactured with OLED pixel patterning techniques. Adjacent pixel-defining layer (PDL) structures 715 are formed on an upper surface of the substrate 10 that define pixel regions, and overhang structures 720 are disposed on an upper surface of the PDL structures 715. The overhang structures 720 include a lower portion 720B with a sidewall and an upper portion 720A with an overhang protruding from the lower portion 720B partially over the pixel region 13. In FIG. 6, a first sidewall 11 adjacent to a pixel region 13 is schematically depicted, and a first overhang 12 projects from the first sidewall 11 partially over the pixel region 13. As will be appreciated, the pixel region 13 may be surrounded by two or more sidewalls, and overhangs may be formed on the two or more sidewalls and project over the pixel region from different sides.

[0030] For example, as illustrated in FIG. 7, the pixel region 13 may be surrounded by sidewalls, with overhangs projecting from the sidewalls partially over the pixel region. For example, with a substrate 10 oriented in an x-y plane with the y-direction being a vertical direction and the x-direction being a transport direction of the substrate 10 in accordance with embodiments described herein, the first overhang 12 in FIG. 7 may project, in the y-direction, partially over the pixel region 13, particularly in the vertical direction. A second sidewall 16 and a second overhang 17 may extend along the y-direction, particularly the vertical direction, with the second overhang 17 projecting partially over the pixel region 13 in the x-direction, particularly in or against the transport direction of the substrate. A third sidewall 18 and a third overhang 19 may be arranged opposite the second sidewall 16 and the second overhang 17. A further sidewall and a further overhang, for example a fourth sidewall 14 and a fourth overhang 15, may be arranged opposite the first sidewall 11 and the first overhang 12. Although FIG. 7 illustrates a pixel region 13 fully surrounded on four sides by sidewalls and overhangs, other embodiments may include pixel regions which may be only partially surrounded by sidewalls and overhangs, or which may have a shape different from a square or rectangular shape.

[0031] By depositing various materials on the pixel regions to defined positionsZIMR-0569PC under the overhangs, in combination with subsequent etching / patterning, individually switchable pixels can be formed on the substrate. The deposition of metals and organic layers in predetermined regions, particularly under the overhangs, is challenging.

[0032] Referring again to FIG. 6, the lower portion 720B with the first sidewall 11 may be made of a conductive material that is intended to be in contact with a cathode layer 711 of the OLED layer stack 760 and allows a connection of the cathode layer 711 with a cathode potential. Alternatively or additionally, at least a part of the first sidewall 11 may include an assistant cathode 716 that is intended to be in contact with a cathode layer 711 of the OLED layer stack. The upper portion 720A with the first overhang 12 may be made of a non-conductive inorganic material or alternatively, of a conductive inorganic material.

[0033] The OLED layer stack 760 generally includes an anode layer 714, an optional hole injection layer HIL 718, at least one organic layer 713 (made of one or more optically active organic materials), an optional electron injection layer EIL 712, the cathode layer 711 , and at least one encapsulation layer 710.

[0034] As is shown in FIG. 6, the at least one organic layer 713 does not contact the first sidewall 11 , but the cathode layer 711 does contact the first sidewall 11 under the first overhang 12. For ensuring that the at least one organic layer 713 does not substantively contact the first sidewall 11 under the first overhang, the at least one organic layer 713 may be deposited with an organic vapor plume 732 having a small opening angle. For ensuring that the cathode layer 711 reliably contacts the first sidewall 11 under the overhang, the cathode layer may be deposited with a metal vapor plume 731 having a large opening angle. However, particularly in edge regions of the substrate, deposition of material, such as deposition of the material of the cathode layer 711 , may be non-uniform with respect to the rest of the substrate.

[0035] In view of the above, according to embodiments described herein, methods and apparatuses are described that allow a reliable deposition of OLED layer stacks on substrates, particularly on substrates with overhang structures formed thereon. For example, methods described herein may ensure or improve an electrical contact of a cathode layer with a conductive sidewall under an overhang. A good contact between the cathode layer and the sidewall may yield a low contact resistance between theZIMR-0569PC cathode layer and the conductive sidewall, which may be beneficial, e.g., in order to reduce or prevent an influence on the l-V-curve of the manufactured OLED device. Further, deposition uniformity of the cathode layer over the substrate can improve uniformity of performance of the plurality of pixels of the manufactured OLED device, particularly also uniformity of performance for pixels at the edge of the substrate. Methods and apparatuses described herein may particularly provide deposition under overhangs at the edge of the substrate, wherein the deposition area under the overhangs cannot be reached by evaporated material emitted by nozzles in a central region of the vapor distribution pipe. Embodiments described herein may further improve material utilization, particularly by reducing material being deposited outside the substrate region, e.g. on shields of the deposition system. Further, embodiments can allow for depositing material with a reduced substrate temperature during deposition.

[0036] FIG. 1 shows a schematic view of a deposition system for coating a substrate 10. In particular, a vacuum deposition system 1000 according to embodiments described herein is shown in a schematic top view, with a plurality of evaporation source arrangements 100. The vacuum deposition system 1000 includes a first vacuum chamber 1001 that houses a first evaporation source 101 , and optionally one or more further vacuum chambers that may house one or more further evaporation sources, e.g., a second evaporation source 102 and / or a third evaporation source 103. The evaporation sources may be configured to coat vertically or essentially vertically oriented substrates that are transported past the evaporation sources on a substrate transportation track 1013. A plurality of materials, that may include one or more metals and one or more organic materials, can be deposited in succession onto the substrate in order to provide a layer stack on the substrate, e.g., an OLED layer stack. For example, the vacuum deposition system 1000 may include 10 or more evaporation sources for coating the substrate with a plurality of layers.

[0037] In the present disclosure, a "vacuum deposition system" is to be understood as a system or arrangement configured for vacuum deposition of materials on a substrate. A "vacuum chamber" or “vacuum processing chamber” is to be understood as a chamber configured for vacuum deposition. The term "vacuum", as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure ofZIMR-0569PC less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10’5mbar and approximately 10’8mbar, particularly between 10’5mbar and 10’7mbar.

[0038] The vacuum deposition system 1000 may include a substrate transportation track 1013 configured to move a substrate 10 along a substrate transport path T past the first evaporation source 101 and past the optional further evaporation sources. The substrate transportation track 1013 may extend at least partially through the first vacuum chamber 1001 and through the optional further vacuum chambers and may include a substrate transportation system configured for substrate transport, e.g., a roller transportation system, one or more linear motors and / or a magnetic levitation system suitable for moving the substrate relative to and past the evaporation sources. The substrate may be carried by a substrate carrier 1020 during the transport and / or deposition.

[0039] The vacuum deposition system 1000 may further include a shield transportation track 1012 extending between the substrate transportation track 1013 and the first evaporation source 101 in the first vacuum chamber 1001. The shield transportation track 1012 is configured to move a movable shield 1030 in front of the substrate 10 for shielding one or more edge regions of the substrate 10 and / or for shielding at least parts of a substrate carrier 1020 that carries the substrate 10. The movable shield 1030 may be a movable edge exclusion shield with a shielding frame for covering one or more edge regions of the substrate. The shield transportation track 1012 may be located between the substrate transportation track 1013 and the first evaporation source 101 in the first vacuum chamber 1001 and may include a shield transportation system, e.g., a roller transportation system, one or more linear motors and / or a magnetic levitation system suitable to move the movable shield 1030 in front of the substrate 10, such that one or more edge regions of the substrate are covered during coating with the first evaporation source 101 , as is schematically depicted in FIG. 1.

[0040] The movable shield 1030 may be movable back and forth on the shield transportation track 1012, as is schematically indicated by respective arrows in FIG. 1 , such that subsequent substrates moved along the substrate transport path T can beZIMR-0569PC shielded by the movable shield 1030 during coating with the first evaporation source 101. Each evaporation source may have an associated movable shield that is movable back and forth on a respective shield transportation track for shielding an edge region of the substrate from being coated when the substrate is moved past the respective evaporation source.

[0041] Accordingly, an in-line system is provided that allows the deposition of a plurality of layers on a substrate in succession, while the substrate is moved past a plurality of evaporation sources through the vacuum deposition system 1000.

[0042] Embodiments described herein particularly relate to deposition of materials, e.g. for display manufacturing on large area substrates. According to some embodiments, large area substrates or substrate carriers supporting one or more substrates may have a size of 0.5 m2or larger, particularly of 1 m2or larger. For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 4.5, which corresponds to about 0.67 m2of substrate (0.73 m x 0.92 m), GEN 5, which corresponds to approximately 1 .4 m2(1 .1 m x 1 .3 m), GEN 6, which corresponds to approximately 2.7 m2(1.5 m x about 1.8 m), GEN 7.5, which corresponds to approximately 4.29 m2(1.95 m x 2.2 m), GEN 8.5, which corresponds to approximately 5.7 m2(2.2 m x 2.5 m), or even GEN 10, which corresponds to approximately 8.7 m2(2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can be implemented. According to yet further implementations, half sizes of the above-mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.

[0043] FIG. 2 shows an evaporation source 201 according to embodiments described herein in further detail in a vertical sectional plane. In the present disclosure, an "evaporation source" is to be understood as an arrangement configured for material deposition by evaporation on a substrate. The substrate 10 may be a substrate according to embodiments described herein, particularly with a plurality of pixel regions at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls.

[0044] In embodiments, the evaporation source 201 includes a vapor distribution pipe 110 with a row of nozzles 111 arranged along a first direction. Referring forZIMR-0569PC example to FIG. 2, the first direction is directed in an essentially vertical direction. In the coordinate system shown in FIG. 2, the vertical direction corresponds to the z- direction. According to embodiments of the present disclosure, the vapor distribution pipe 110, particularly the row of nozzles 111 , is essentially vertically oriented.

[0045] According to embodiments, the row of nozzles 111 comprises a plurality of central nozzles 121 arranged in a central region 122 of the row of nozzles 111. The central region 122 may extend at least over a dimension 140 of the substrate 10 in the first direction. The substrate 10 may be oriented in a plane defined by an essentially vertical direction and a transport direction of the substrate 10. For example, in FIG. 2, the substrate 10 may be arranged in an x-z-plane.

[0046] In embodiments, the row of nozzles 111 includes a plurality of outer nozzles125 arranged in end regions of the row of nozzles 111 , the end regions being adjacent to the central region 122 on opposite sides of the central region 122 along the first direction. In particular, the end regions may include a first end region 126, such as a lower end region of a vertically arranged row of nozzles 111 as illustrated in FIG. 2. Herein, one or more outer nozzles of a lower end region may also be referred to as one or more lower nozzles. The end regions may include a second end region 127, such as an upper end region of a vertically arranged row of nozzles 111 as illustrated in FIG. 2. Herein, one or more outer nozzles of an upper end region may also be referred to as one or more upper nozzles.

[0047] According to embodiments, each outer nozzle of the plurality of outer nozzles 125 has a main emission direction tilted towards the central region 122. In embodiments, the main emission direction of each outer nozzle is tilted with respect to the first direction, and specifically not perpendicular to the first direction. The main emission direction of a nozzle may correspond to a direction of the maximum of particles emitted by the nozzle, or to the average direction of particles emitted by the nozzle. The main emission direction may correspond to a longitudinal direction of a nozzle channel of a nozzle.

[0048] According to embodiments, one or more outer nozzles of the first end region126 may have a first main emission direction 128 tilted towards the central region 122. Referring for example to FIG. 2, an outer nozzle 125 of the first end region 126,ZIMR-0569PC particularly a lower nozzle of a lower end region, may have a main emission direction tilted in an upward direction towards the central region 122. One or more outer nozzles of the second end region 127 may have a second main emission direction 129 tilted towards the central region 122. For instance, an outer nozzle 125 of the second end region 127, particularly an upper nozzle of an upper end region, may have a main emission direction tilted in a downward direction towards the central region 122. In embodiments, the first main emission direction 128 and the second main emission direction 129 are different, particularly such that the first main emission direction 128 and the second main emission direction 129 intersect in front of the evaporation source 201 , e.g. at an intersection point behind the substrate.

[0049] According to embodiments, the main emission direction of at least one of the plurality of outer nozzles may be tilted at least 20° relative to the first direction, particularly at least 25° or at least 30° relative to the first direction, and / or the main emission direction of at least one of the plurality of outer nozzles may be tilted maximum 60° relative to the first direction, particularly maximum 55° or maximum 50° relative to the first direction. For example, an angle 130 between the first direction and the main emission direction of the at least one of the plurality of outer nozzles may be between 20° and 50°, between 25° and 50°, or between 30° and 50°. In particular, an outer end nozzle at an end of the row of nozzles 111 , particularly both outer end nozzles at the ends of the row of nozzles 111 , may be tilted at least 20° relative to the first direction, particularly at least 25° or at least 30°, and / or maximum 60° relative to the first direction, particularly maximum 55° or maximum 50°, for example between 20° and 50°, or between 25° and 50°, or between 30° and 50°.

[0050] According to some embodiments, at least one or each of the plurality of central nozzles 121 has a main emission direction, in FIG. 2 a third main emission direction 123, which is essentially perpendicular to the first direction. In FIG. 2, the main emission direction of a nozzle is indicated by the long arrow extending centrally from the nozzle. The smaller side arrows indicate, for illustrative purposes, that a vapor plume 120 emitted by a nozzle has a certain opening angle. Typically, a generally cone- shaped vapor plume emitted by a nozzle is centered around the main emission direction of a nozzle. A vapor plume 120 emitted by a nozzle may be defined by the main emission direction and by an opening angle of the vapor plume 120. A vaporZIMR-0569PC plume 120 can be rotationally symmetrical with respect to the main emission direction, and / or a vapor plume 120 can be shaped with one or more shaper shields to be symmetrical or to be asymmetrical relative to the main emission direction.

[0051] An opening angle of a vapor plume 120 emitted by a nozzle and propagating to the substrate 10 may provide deposition under overhangs arranged adjacent to at least a part of the plurality of pixel regions of the substrate, even with a main emission direction perpendicular to the first direction as shown for the plurality of central nozzles 121. However, when using only nozzles with emission directions perpendicular to the first direction, deposition of material under overhangs arranged at pixel regions at or near an edge of the substrate may not be uniform when compared to the deposition in pixel regions at the center of the substrate. Particularly, deposition at or near an edge perpendicular to the first direction may not be uniform, for example at or near a top edge or a bottom edge of the substrate, if the row of nozzles is essentially vertically oriented. Further, when using only nozzles with emission directions perpendicular to the first direction, the use of material may be inefficient due to material being emitted towards regions of the deposition system outside the substrate.

[0052] Embodiments of the present disclosure particularly provide improved uniformity of material deposition under overhangs, particularly under overhangs at or near the edges 141 of the substrate 10, particularly at or near edges 141 of the substrate 10 perpendicular to the first direction. Embodiments may particularly provide a higher deposition rate at edges of the substrate as compared to deposition without the tilted main emission direction of the outer nozzles as described herein. Further, material utilization may be more efficient during coating according to embodiments of the present disclosure. In particular, embodiments may provide that less material is directed to regions outside the substrate, and / or that a required film thickness may be achieved more efficiently over the entire substrate by a uniform deposition. A more efficient deposition may further result in reduced heat transfer to the substrate, and thus in a reduced substrate temperature during deposition. For example, a temperature of a glass substrate with OLED pixel structures may be reduced during deposition.

[0053] According to some embodiments, an extension of the row of nozzles 111 in the first direction, particularly the combined extension of the central region 122 and theZIMR-0569PC two end regions in the first direction, is at least 140 % of the dimension 140 of the substrate 10 in the first direction, particularly at least 150 % or at least 160 % of the dimension 140 of the substrate 10 in the first direction, and / or maximum 200 % of the dimension 140 of the substrate 10 in the first direction, particularly maximum 190 % or maximum 170 % of the dimension 140 of the substrate 10 in the first direction. Embodiments with a row of nozzles 111 extending further along the first direction than the substrate 10 may provide increased uniformity of deposition under overhangs, particularly in combination with the tilted main emission direction of the plurality of outer nozzles 125 as described herein.

[0054] Although FIG. 2 illustrates an evaporation source 201 with only few nozzles, a row of nozzles 111 of an evaporation source 201 according to embodiments may include, for example, at least 10 nozzles, particularly at least 15 nozzles or at least 20 nozzles. Each end region may include at least one outer nozzle of the plurality of outer nozzles 125. In some embodiments, the plurality of outer nozzles 125 includes at least two outer nozzles in each end region of the row of nozzles 111 , particularly at least three outer nozzles in each end region of the row of nozzles 111. In some embodiments, angles of the main emission direction of outer nozzles within each end region may be different. For example, an angle 130 of the main emission direction of the outer nozzles relative to the first direction may decrease towards an end of the row of nozzles 111.

[0055] According to embodiments, the evaporation source 201 may have one or more crucibles 112 configured to evaporate a source material to be deposited. In embodiments, the source material to be deposited may be an inorganic material, particularly a metallic material, for example, a metal or a metal alloy. The metallic material may be configured for use as an electrode material, particularly for use as a cathode of an OLED stack.

[0056] The evaporation source 201 can include one or more vapor distribution pipes 110 configured for directing the evaporated material towards the substrate 10 through a plurality of nozzles. In particular, the evaporation source 201 includes a vapor distribution pipe 110 and a row (or “line array”) of nozzles 111 as described herein. For instance, a vapor distribution tube or vapor distribution pipe 110 may provide a lineZIMR-0569PC source with a plurality of nozzles that are arranged in a row one above the other along the first direction, particularly along a longitudinal direction of the vapor distribution pipe 110. The row of nozzles 111 may be provided along a longitudinal direction (typically an essentially vertical direction) of the vapor distribution pipe 110 to provide an essentially vertical line source. Each vapor distribution pipe 110 generally has one single row of nozzles, particularly one single vertical nozzle row suitable to coat substrates in an essentially vertical orientation. The term “essentially” with respect to a direction as used herein, defines a direction that corresponds to the identified direction or deviates from the direction by less than 10°. For example, an “essentially vertical direction” refers to a direction that corresponds to the direction of gravity or deviates from the direction of gravity by less than 10°.

[0057] The evaporation source 201 of FIG. 2 may be part of an evaporation source arrangement 100, which may include further vapor distribution pipes, each with a further row of nozzles (not shown in FIG. 2).

[0058] The evaporation source 201 may further include a rotation drive 113 for rotating the vapor distribution pipe 110 around a source rotation axis 109. The evaporation source 201 may include a controller 114 for controlling the rotational movement of the evaporation source 201. In some embodiments, a deposition system may include a carrier (not shown in FIG. 2) adapted for carrying the substrate 10, particularly for carrying a substrate 10 according to embodiments described herein. In embodiments, the deposition system is configured for coating the substrate according to any of the methods described herein.

[0059] According to embodiments of the present disclosure, methods of coating a substrate 10 in a vacuum chamber are provided. According to some embodiments, an essentially vertically oriented substrate 10 may be coated, wherein the substrate 10 particularly has a top edge and a bottom edge. For instance, FIG. 3 illustrates a flow diagram of a method 300 according to embodiments.

[0060] At block 302, the method 300 includes transporting the substrate 10 into the vacuum chamber. The substrate 10 may be provided according to embodiments described herein, particularly including a plurality of pixel regions formed thereon, wherein each pixel region of the plurality of pixel regions is at least partially surroundedZIMR-0569PC by sidewalls, with overhangs projecting from the sidewalls. The substrate 10 may be a glass substrate. The substrate may be transported in an essentially vertical orientation. In particular, the substrate 10 may be oriented with the surface to be coated essentially parallel to a plane including a transport direction (x-direction in FIG. 2) and a first direction (z-direction in FIG. 2) of a row of nozzles 111 of an evaporation source 201 in the vacuum chamber.

[0061] At block 304, the method 300 includes evaporating a material using an evaporation source 201 arranged in the vacuum chamber. The evaporation source 201 may be configured according to any of the embodiments described herein, for instance as described in connection with FIG. 2. In particular, the evaporation source 201 includes a vapor distribution pipe 110 with a row of nozzles 111 arranged along a first direction. The row of nozzles 111 includes a plurality of central nozzles 121 arranged in a central region of the row of nozzles, the central region 122 extending at least over a dimension 140 of the substrate 10 in the first direction. The row of nozzles 111 further includes a plurality of outer nozzles 125 arranged in end regions of the row of nozzles 111 , the end regions being adjacent to the central region 122 on opposite sides of the central region 122 along the first direction. Each outer nozzle of the plurality of outer nozzles 125 has a main emission direction tilted towards the central region 122. In some embodiments, the first direction is an essentially vertical direction. The vapor distribution pipe 110 may be essentially vertically oriented. One or more upper nozzles of the row of nozzles 111 may be located higher than the top edge of the substrate 10 and may have a downwardly inclined main emission direction. One or more lower nozzles of the row of nozzles 111 may be located lower than the bottom edge of the substrate 10 and may have an upwardly inclined main emission direction.At block 306, the method 300 includes depositing the material evaporated by the evaporation source 201 in the plurality of pixel regions of the substrate 10. In embodiments, depositing the material includes depositing the material under a first overhang 12 projecting from a first sidewall 11 adjacent to a first pixel region of the plurality of pixel regions, wherein at least a portion of the material deposited under the first overhang 12 is emitted from at least one outer nozzle of the plurality of outer nozzles 125. In embodiments with an essentially vertically oriented substrate 10 and with the first direction being essentially vertical, evaporated material may particularlyZIMR-0569PC be deposited under upwardly projecting overhangs in an upper part of the substrate, at least in part, by one or more outer nozzles (one or more upper nozzles) arranged in the upper end region of the row of nozzles 111. Evaporated material may be deposited under downwardly projecting overhangs in a lower part of the substrate 10, at least in part, by one or more outer nozzles (one or more lower nozzles) arranged in the lower end region of the row of nozzles 111.

[0062] In some embodiments, the material evaporated by the evaporation source 201 , particularly the material deposited in the plurality of pixel regions, is a conductive material, particularly a metallic material, such as a metal or a metal alloy. In embodiments, the material is deposited over an organic layer in the plurality of pixel regions, particularly on a stack of organic layers deposited in the plurality of pixel regions. An anode may be provided below the organic layer, particularly below the stack of organic layers. According to embodiments, the material is deposited on the plurality of pixel regions to form a cathode for the plurality of pixel regions. The cathode may be formed as a cathode layer, for example, a cathode layer 711 as illustrated in FIG. 6.

[0063] In some embodiments, the first sidewall 11 includes a conductive sidewall material. In embodiments, depositing the material under the first overhang 12 may include depositing the material, particularly a conductive material such as a metal or a metal alloy, on at least a portion of the conductive sidewall material of the first sidewall 11 . The conductive sidewall material may be, for example, a metal or metal alloy. For instance, the conductive sidewall material may provide the electrical contact for a deposited cathode layer. For instance, depositing an evaporated metallic material as a cathode on an at least partially metallic sidewall may provide a cathode electrically connected to the sidewall via a metal-metal contact.

[0064] According to embodiments, the first pixel region is arranged in a first edge region of the substrate 10, the first edge region extending along a first edge of the substrate, the first edge being essentially perpendicular to the first direction. In particular, the first overhang 12 may project from the first sidewall 11 towards the first edge. For example, FIG. 4 illustrates a schematic detailed view of an outer nozzle 125 in an upper end region (second end region 127 in FIG. 2) of an evaporation source 201ZIMR-0569PC as shown in FIG. 2, the outer nozzle 125 emitting evaporated material along a second main emission direction 129. A portion of the material emitted by the outer nozzle 125 is deposited under an upwardly projecting first overhang 12 of a first pixel region 413 arranged in an edge region of the substrate 10 near a first edge 442 of the substrate 10. It should be understood that material emitted by the outer nozzle 125 may be deposited in more than one pixel regions and particularly under more than one upwardly projecting overhang. For instance, material emitted by the nozzle may be deposited under further upwardly projecting overhangs located further away from the edge than the first overhang 12 illustrated in FIG. 4. Referring to FIG. 2, one or more outer nozzles of the plurality of outer nozzles 125 in the first end region 126, e.g. a lower end region, on the opposite side of the central region 122, may similarly deposit the evaporated material under overhangs projecting towards a second edge of the substrate 10 opposite the first edge 442, the overhangs particularly being arranged at respective pixel regions at or near the second edge. For instance, the material may be deposited under downwardly projecting overhangs arranged at respective pixel regions, particularly near the bottom edge of the substrate 10.

[0065] In some embodiments, the overhangs at the plurality of pixel regions include second overhangs 17 projecting in a direction of a transport axis, along which the substrate is transported relative to the evaporation source 201. The method may include generating, for each nozzle of the row of nozzles 111 , a vapor plume of the evaporated material, wherein a main propagation direction of the vapor plume is tilted with respect to the transport axis to deposit the evaporated material under the second overhangs. The main propagation direction of the vapor plume may refer the average or maximum propagation direction of particles emitted by a nozzle between the evaporation source 201 and the substrate 10. For example, the main propagation direction may be tilted at least 20° relative to the transport axis, particularly at least 25° or at least 30°, and / or maximum 60° relative to the transport axis, particularly maximum 55° or maximum 50°.

[0066] According to some embodiments, the tilted main propagation direction may be provided, for example, by rotating the evaporation source 201 about a source rotation axis 109 to change an angle of the main emission direction of the row of nozzles 111 relative to the transport axis (x-direction in FIGS. 2 and 5). In suchZIMR-0569PC embodiments, the main propagation direction of the vapor plume of a nozzle may correspond to the main emission direction of the nozzle. In particular, the method 300 may include rotating the evaporation source 201 about the source rotation axis 109 in a first rotation direction, the source rotation axis 109 particularly extending essentially parallel to the first direction of the row of nozzles 111. Further, depositing the material evaporated by the evaporation source 201 in the plurality of pixel regions of the substrate 10 may include depositing the evaporated material under the second overhangs 17 using the rotated evaporation source 201 .

[0067] For instance, FIG. 5 schematically illustrates a schematic horizontal sectional view of a rotated evaporation source 201 with a row of nozzles 111 emitting evaporated material in a main emission direction 523 towards the substrate 10, the substrate 10 being transported in a transport direction 541 parallel to the x-direction. In FIG. 5, the main propagation direction of the vapor plume from the illustrated nozzle corresponds to the main emission direction 523 of the nozzle. Evaporated material is deposited under second overhangs 17, for example, second overhangs 17 projecting against the transport direction 541 .

[0068] In embodiments, the method 300 may further include moving the substrate 10 in a transport return direction relative to the evaporation source, the transport return direction being the opposite direction with respect to the transport direction 541 . The method 300 may further include rotating the evaporation source 201 in a second rotation direction different from the first rotation direction about the source rotation axis 109, such that the main emission direction 523 of the nozzles is tilted relative to the transport axis, and such that material is deposited under third overhangs 19 projecting in an opposite direction as compared to the second overhangs 17.

[0069] Additionally, or alternatively, the main propagation direction of a vapor plume of a nozzle may be defined between the nozzle and the substrate, for example using shields of the deposition system to shape the vapor plume of the nozzle. In some embodiments, in which the main propagation direction of a vapor plume is defined by shields between the evaporation source and the substrate, the evaporation source may not rotate to tilt the main propagation direction. For example, the evaporation source may be static.ZIMR-0569PC

[0070] Embodiments of the present disclosure may provide deposition of material under overhangs projecting partially over a pixel region from different directions. In particular, uniform deposition under overhangs projecting over a pixel region in or against the first direction, for example, in a vertical direction, may be provided using a plurality of outer nozzles with tilted main emission direction tilted in accordance with embodiments described herein. Deposition under overhangs projecting over a pixel region in or against the transport direction, for example, in a horizontal direction, may be provided by generating a vapor plume with tilted main propagation direction. Embodiments described herein may provide uniform deposition of material in pixel regions and under overhangs over the substrate, particularly also in edge regions perpendicular to the first direction of the evaporation source 201 . For example, uniform deposition may be provided for pixel regions 13 surrounded by sidewalls and overhangs as illustrated in FIG. 7.

[0071] According to embodiments of the present disclosure, a substrate for display manufacture comprising an organic light-emitting diode (OLED) pixel structure is provided. In particular, the OLED pixel structure may be provided on a glass substrate. The OLED pixel structure includes a plurality of pixel regions, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls. The sidewalls and overhangs may be provided in accordance with embodiments described herein, for instance as described in connection with FIGS. 6 and 7. According to embodiments, the OLED pixel structure includes an organic layer deposited in each pixel region of the plurality of pixel regions, particularly a stack of organic layers. In embodiments, the OLED pixel structure includes a layer of a material deposited using a method according to any of the embodiments described herein, for example using a method 300 as described in connection with FIG. 3. The layer may be a layer of a conductive material, particularly of a metallic material, more particularly a metal or metal alloy. The layer may form a cathode, particularly a cathode layer, for each of the plurality of pixel regions. In each pixel region 13, for instance in a first pixel region, the layer may contact a first sidewall adjacent to the pixel region, particularly a first sidewall 11 and one or more further sidewalls. The first sidewall 11 may be arranged under a first overhang 12 in accordance with embodiments described herein. The one or more further sidewallsZIMR-0569PC may be arranged under respective overhangs, for instance one or more further sidewalls such as the second, third and fourth sidewalls illustrated in FIG. 7.

[0072] Thus, in view of the embodiments described herein, improved evaporation systems, improved coating methods and improved substrates are provided, particularly using “maskless” OLED pixel deposition that does not use fine metal masks, but rather uses angled deposition under overhangs. “Angled deposition” as used herein refers to a tilted main emission direction or tilted nozzle channels of the plurality of outer nozzles of a row of nozzles for improving the deposition below the overhangs. Embodiments of the present disclosure may improve a uniformity over the substrate of a deposition of material under overhangs, particularly a uniformity of deposition at edges of the substrate as compared to the deposition at the center of the substrate. In particular, a uniform coverage of pixel regions can provide that one or more organic layers covered by a cathode layer according to embodiments can be protected during subsequent processing steps, such as during a subsequent photolithography process and / or etching process. Embodiments may improve a material utilization during deposition. In particular, embodiments may reduce the amount of material directed to regions outside the substrate, and / or may achieve a required film thickness over the entire substrate with reduced material utilization due to improved deposition uniformity. Further, embodiments of the present disclosure may reduce a substrate temperature during deposition. For example, a temperature of a glass substrate with OLED pixel structures may be reduced during deposition.

[0073] In particular, the following implementations according to embodiments are described:

[0074] Implementation 1 : A method of coating a substrate in a vacuum chamber, the method comprising: transporting the substrate into the vacuum chamber, the substrate comprising a plurality of pixel regions formed thereon, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls; evaporating a material using an evaporation source arranged in the vacuum chamber, the evaporation source having a vapor distribution pipe with a row of nozzles arranged along a first direction, wherein the row of nozzles comprises a plurality of central nozzles arranged in a central region of theZIMR-0569PC row of nozzles, the central region extending at least over a dimension of the substrate in the first direction, wherein the row of nozzles further comprises a plurality of outer nozzles arranged in end regions of the row of nozzles, the end regions being adjacent to the central region on opposite sides of the central region along the first direction, wherein each outer nozzle of the plurality of outer nozzles has a main emission direction tilted towards the central region; and depositing the material evaporated by the evaporation source in the plurality of pixel regions of the substrate, wherein depositing the material comprises depositing the material under a first overhang projecting from a first sidewall adjacent to a first pixel region of the plurality of pixel regions, wherein at least a portion of the material deposited under the first overhang is emitted from at least one outer nozzle of the plurality of outer nozzles.

[0075] Implementation 2: The method of implementation 1 , wherein the material is a metal or a metal alloy.

[0076] Implementation 3: The method of implementation 1 or 2, wherein the material is deposited on the plurality of pixel regions to form a cathode for the plurality of pixel regions.

[0077] Implementation 4: The method of any one of the preceding implementations, wherein the material is deposited on a stack of organic layers deposited in the plurality of pixel regions.

[0078] Implementation 5: The method of any one of the preceding implementations, wherein the first pixel region is arranged in a first edge region of the substrate, the first edge region extending along a first edge of the substrate, the first edge being essentially perpendicular to the first direction.

[0079] Implementation 6: The method of any one of the preceding implementations, wherein the main emission direction of at least one of the plurality of outer nozzles is tilted at least 20° relative to the first direction, and / or wherein the main emission direction of at least one of the outer nozzles is tilted maximum 60° relative to the first direction.

[0080] Implementation 7: The method of any one of the preceding implementations, wherein each of the plurality of central nozzles has a main emission directionZIMR-0569PC essentially perpendicular to the first direction.

[0081] Implementation 8: The method of any one of the preceding implementations, wherein an extension of the row of nozzles in the first direction is at least 140 % of the dimension of the substrate in the first direction, and / or maximum 200 % of the dimension of the substrate in the first direction.

[0082] Implementation 9: The method of any one of the preceding implementations, wherein the plurality of outer nozzles includes at least two outer nozzles in each end region of the row of nozzles.

[0083] Implementation 10: The method of any one of the preceding implementations, wherein the substrate is transported in an essentially vertical orientation, wherein the first direction is an essentially vertical direction, and wherein the end regions of the row of nozzles comprise a lower end region at a lower end of the row of nozzles and an upper end region at an upper end of the row of nozzles.

[0084] Implementation 11 . The method of implementation 10, wherein the evaporated material is deposited under upwardly projecting overhangs in an upper part of the substrate, at least in part, by one or more outer nozzles arranged in the upper end region, and / or the evaporated material is deposited under downwardly projecting overhangs in a lower part of the substrate, at least in part, by one or more outer nozzles arranged in the lower end region.

[0085] Implementation 12: The method of any one of the preceding implementations, wherein the substrate is transported relative to the evaporation source along a transport axis, and wherein the overhangs comprise second overhangs projecting in a direction of the transport axis; the method further comprising: generating, for each nozzle of the row of nozzles, a vapor plume of the evaporated material, wherein a main propagation direction of the vapor plume is tilted with respect to the transport axis to deposit the evaporated material under the second overhangs.

[0086] Implementation 13: The method of any one of the preceding implementations, wherein the substrate is a glass substrate.

[0087] Implementation 14: The method of any one of the precedingZIMR-0569PC implementations, wherein the first sidewall comprises a conductive sidewall material, and wherein depositing the material under the first overhang comprises depositing the material on at least a portion of the conductive sidewall material of the first sidewall.

[0088] Implementation 15: A substrate for display manufacture comprising an organic light-emitting diode (OLED) pixel structure, the OLED pixel structure comprising: a plurality of pixel regions, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls; an organic layer deposited in each pixel region of the plurality of pixel regions; and a layer of a material deposited using a method of any one of the preceding implementations.

[0089] Implementation 16: The substrate of implementation 15, wherein the material is a metal or a metal alloy.

[0090] Implementation 17: A deposition system for coating a substrate in a vacuum chamber, the deposition system comprising: an evaporation source having a vapor distribution pipe with a row of nozzles arranged along a first direction, wherein the row of nozzles comprises a plurality of central nozzles arranged in a central region of the row of nozzles, wherein the row of nozzles further comprises a plurality of outer nozzles arranged in end regions of the row of nozzles, the end regions being adjacent to the central region on opposite sides of the central region along the first direction, wherein each outer nozzle of the plurality of outer nozzles has a main emission direction tilted towards the central region, and wherein the vapor distribution pipe is essentially vertically oriented.

[0091] Implementation 18: The deposition system of implementation 17, wherein the deposition system is configured for coating the substrate according to a method of any one of implementations 1 to 14.

[0092] Implementation 19: A method of coating an essentially vertically oriented substrate in a vacuum chamber, the substrate having a top edge and a bottom edge, the method comprising: transporting the substrate into the vacuum chamber; evaporating a material using an evaporation source arranged in the vacuum chamber, the evaporation source having an essentially vertically oriented vapor distribution pipeZIMR-0569PC with a row of nozzles, wherein one or more upper nozzles of the row of nozzles are located higher than the top edge of the substrate and have a downwardly inclined main emission direction, and wherein one or more lower nozzles of the row of nozzles are located lower than the bottom edge of the substrate and have an upwardly inclined main emission direction; and depositing the material evaporated by the evaporation source in the plurality of pixel regions of the substrate.

[0093] Implementation 20: The method of implementation 19, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls, and the evaporated material is deposited under upwardly projecting overhangs in an upper part of the substrate, at least in part, by the one or more upper nozzles, and / or the evaporated material is deposited under downwardly projecting overhangs in a lower part of the substrate, at least in part, by the one or more lower nozzles.

[0094] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

[0095] In particular, this written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject-matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

ZIMR-0569PCWHAT IS CLAIMED1 . A method of coating a substrate in a vacuum chamber, the method comprising: transporting the substrate into the vacuum chamber, the substrate comprising a plurality of pixel regions formed thereon, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls; evaporating a material using an evaporation source arranged in the vacuum chamber, the evaporation source having a vapor distribution pipe with a row of nozzles arranged along a first direction, wherein the row of nozzles comprises a plurality of central nozzles arranged in a central region of the row of nozzles, the central region extending at least over a dimension of the substrate in the first direction, wherein the row of nozzles further comprises a plurality of outer nozzles arranged in end regions of the row of nozzles, the end regions being adjacent to the central region on opposite sides of the central region along the first direction, wherein each outer nozzle of the plurality of outer nozzles has a main emission direction tilted towards the central region; and depositing the material evaporated by the evaporation source in the plurality of pixel regions of the substrate, wherein depositing the material comprises depositing the material under a first overhang projecting from a first sidewall adjacent to a first pixel region of the plurality of pixel regions, wherein at least a portion of the material deposited under the first overhang is emitted from at least one outer nozzle of the plurality of outer nozzles.

2. The method of claim 1 , wherein the material is a metal or a metal alloy.

3. The method of claim 1 , wherein the material is deposited on the plurality of pixel regions to form a cathode for the plurality of pixel regions.

4. The method of claim 1 , wherein the material is deposited on a stack of organic layers deposited in the plurality of pixel regions.ZIMR-0569PC5. The method of any one of claims 1 to 3, wherein the first pixel region is arranged in a first edge region of the substrate, the first edge region extending along a first edge of the substrate, the first edge being essentially perpendicular to the first direction.

6. The method of any one of claims 1 to 3, wherein the main emission direction of at least one of the plurality of outer nozzles is tilted at least 20° relative to the first direction, and / or wherein the main emission direction of at least one of the outer nozzles is tilted maximum 60° relative to the first direction.

7. The method of any one of claims 1 to 3, wherein each of the plurality of central nozzles has a main emission direction essentially perpendicular to the first direction.

8. The method of any one of claims 1 to 3, wherein an extension of the row of nozzles in the first direction is at least 140 % of the dimension of the substrate in the first direction, and / or maximum 200 % of the dimension of the substrate in the first direction.

9. The method of any one of claims 1 to 3, wherein the plurality of outer nozzles includes at least two outer nozzles in each end region of the row of nozzles.

10. The method of any one of claims 1 to 3, wherein the substrate is transported in an essentially vertical orientation, wherein the first direction is an essentially vertical direction, and wherein the end regions of the row of nozzles comprise a lower end region at a lower end of the row of nozzles and an upper end region at an upper end of the row of nozzles.11 . The method of claim 10, wherein the evaporated material is deposited under upwardly projecting overhangs in an upper part of the substrate, at least in part, by one or more outer nozzles arranged in the upper end region, and / or the evaporated material is deposited under downwardly projecting overhangs in a lower part of the substrate, at least in part, by one or more outer nozzles arranged in the lower end region.ZIMR-0569PC12. The method of any one of claims 1 to 3, wherein the substrate is transported relative to the evaporation source along a transport axis, and wherein the overhangs comprise second overhangs projecting in a direction of the transport axis; the method further comprising: generating, for each nozzle of the row of nozzles, a vapor plume of the evaporated material, wherein a main propagation direction of the vapor plume is tilted with respect to the transport axis to deposit the evaporated material under the second overhangs.

13. The method of any one of claims 1 to 3, wherein the substrate is a glass substrate.

14. The method of any one of claims 1 to 3, wherein the first sidewall comprises a conductive sidewall material, and wherein depositing the material under the first overhang comprises depositing the material on at least a portion of the conductive sidewall material of the first sidewall.

15. A substrate for display manufacture comprising an organic light-emitting diode (OLED) pixel structure, the OLED pixel structure comprising: a plurality of pixel regions, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls; an organic layer deposited in each pixel region of the plurality of pixel regions; and a layer of a material deposited using a method of any one of claims 1 to 3.

16. The substrate of claim 15, wherein the material is a metal or a metal alloy.

17. A deposition system for coating a substrate in a vacuum chamber, the deposition system comprising: an evaporation source having a vapor distribution pipe with a row of nozzles arranged along a first direction, wherein the row of nozzles comprises a plurality ofZIMR-0569PC central nozzles arranged in a central region of the row of nozzles, wherein the row of nozzles further comprises a plurality of outer nozzles arranged in end regions of the row of nozzles, the end regions being adjacent to the central region on opposite sides of the central region along the first direction, wherein each outer nozzle of the plurality of outer nozzles has a main emission direction tilted towards the central region, and wherein the vapor distribution pipe is essentially vertically oriented.

18. The deposition system of claim 17, wherein the deposition system is configured for coating the substrate according to a method of any one of claims 1 to 3.

19. A method of coating an essentially vertically oriented substrate in a vacuum chamber, the substrate having a top edge and a bottom edge, the method comprising: transporting the substrate into the vacuum chamber; evaporating a material using an evaporation source arranged in the vacuum chamber, the evaporation source having an essentially vertically oriented vapor distribution pipe with a row of nozzles, wherein one or more upper nozzles of the row of nozzles are located higher than the top edge of the substrate and have a downwardly inclined main emission direction, and wherein one or more lower nozzles of the row of nozzles are located lower than the bottom edge of the substrate and have an upwardly inclined main emission direction; and depositing the material evaporated by the evaporation source in a plurality of pixel regions of the substrate.

20. The method of claim 19, wherein each pixel region of the plurality of pixel regions is at least partially surrounded by sidewalls, with overhangs projecting from the sidewalls, and the evaporated material is deposited under upwardly projecting overhangs in an upper part of the substrate, at least in part, by the one or more upper nozzles, and / or the evaporated material is deposited under downwardly projecting overhangs in a lower part of the substrate, at least in part, by the one or more lower nozzles.

Images