Evaporation source apparatus, film deposition apparatus, film deposition method, and method for manufacturing electronic devices

Abstract

To provide a technology capable of suppressing decline of deposition quality by coating around an evaporation source.SOLUTION: An evaporation source device 4 includes a housing part 46 for housing a film deposition material 40, and a cylindrical nozzle part 47 which has an opening for discharging the film deposition material 40 evaporated by heating in the film deposition material 40 housed in the housing part 46 and projects from an outer wall of the housing part 46. A coating 71 for reducing an amount of attachment of the film deposition material 40 is applied to an outer side face 472 of the nozzle part 47.SELECTED DRAWING: Figure 3

Description

Technical Field

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[0001] The present invention relates to an evaporation source device, a film forming device, a film forming method, and a method for manufacturing an electronic device.

Background Art

[0002] As a film forming device for forming a thin film on a substrate as a film forming object, in a vacuum chamber, a container (crucible) containing a film forming material is heated, the film forming material is vaporized (sublimated or evaporated) and ejected outside the container, and deposited on the surface of the substrate. There is a vacuum evaporation type film forming device. Among the vaporized film forming materials, the film forming materials that do not contribute to film formation adhere to structures such as a deposition preventing plate and a shutter arranged in the chamber. Patent Document 1 discloses a technique for applying a coating for suppressing the adhesion of a film forming material in a chamber.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The conventional technologies have been studied for coatings on structures such as a deposition preventing plate and a shutter arranged opposite to an evaporation source. However, in the prior art, anti-deposition coatings for an evaporation source device, such as a container and a nozzle of a film forming material, have not been particularly studied. In contrast, the inventors of the present application have found a problem that film forming material may adhere to the evaporation source device. Since the adhesion of the film forming material to the evaporation source device is considered to affect the film forming quality, there is room for study on the coating for the evaporation source device.

[0005] An object of the present invention is to provide a technique capable of suppressing a decrease in film forming quality by coating around an evaporation source. [Means for solving the problem]

[0006] To solve the above problems, the evaporation source device of the present invention is A housing section in which the film-forming material is contained, An evaporation source device comprising: a cylindrical nozzle portion having an opening for releasing film-forming material that has vaporized due to heating from the film-forming material contained in the containment portion, and protruding from the outer wall of the containment portion, On the outer surface of the nozzle portion, to reduce the amount of film-forming material adhering to it oil-repellent It is characterized by being coated. [Effects of the Invention]

[0007] According to the present invention, the deterioration of film formation quality can be suppressed by coating the area around the evaporation source. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic cross-sectional view of the film deposition apparatus according to the example. [Figure 2] This is a schematic cross-sectional view of the evaporation source device according to Example 1. [Figure 3] This is a schematic diagram of the evaporation source apparatus according to Example 2. [Figure 4] This is a schematic diagram of the evaporation source apparatus according to Example 3. [Figure 5] This is a schematic diagram of the evaporation source apparatus according to Example 4. [Figure 6] This is a schematic diagram showing an example of the configuration of a film deposition apparatus and evaporation method. [Figure 7] This is a schematic diagram showing an example of the configuration of the nozzle section of an evaporation source device. [Figure 8] This is a schematic diagram showing an example of the configuration of the nozzle section of an evaporation source device. [Figure 9] This is an explanatory diagram of an organic EL display device. [Modes for carrying out the invention]

[0009] (Example 1) The embodiments for carrying out this invention will be described in detail below with reference to the drawings, based on examples. However, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of the components described in these embodiments are not intended to limit the scope of this invention to those specific components.

[0010] Referring to Figures 1 and 2, a film deposition apparatus 1 according to an embodiment of the present invention will be described. The film deposition apparatus 1 according to this embodiment is a film deposition apparatus that deposits a thin film on a substrate by vacuum deposition.

[0011] The film deposition apparatus according to this embodiment is used to deposit thin films on substrates (including those on which laminates are formed) in the manufacture of various electronic devices such as semiconductor devices, magnetic devices, and electronic components, as well as optical components. More specifically, the film deposition apparatus according to this embodiment is preferably used in the manufacture of electronic devices such as light-emitting elements, photoelectric conversion elements, and touch panels. In particular, the film deposition apparatus according to this embodiment is preferably used in the manufacture of organic EL (Electron Light-Emitting Diodes). This invention is particularly suitable for the manufacture of organic light-emitting elements such as luminescence elements and organic photoelectric conversion elements such as organic thin-film solar cells. The electronic devices in this invention also include display devices (e.g., organic EL display devices) and lighting devices (e.g., organic EL lighting devices) equipped with light-emitting elements, and sensors (e.g., organic CMOS image sensors) equipped with photoelectric conversion elements.

[0012] As the substrate material for film deposition, any material can be selected, including glass, semiconductors (e.g., silicon), polymer films, and metals. Furthermore, the substrate can be, for example, a silicon wafer or a substrate in which a film such as polyimide is laminated on a glass substrate.

[0013] In addition, when there are a plurality of identical or corresponding members in the same drawing of various devices and the like described below, subscripts such as a, b, etc. may be given in the drawing, but when there is no need to distinguish them in the description, the subscripts such as a, b, etc. may be omitted in the description.

[0014] <Schematic Configuration of Film Deposition Apparatus> FIG. 1 is a schematic diagram showing the configuration of a film deposition apparatus 1 according to an embodiment of the present invention. The film deposition apparatus 10 has a vacuum chamber (film deposition chamber, evaporation chamber) 2 whose interior is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. Here, "vacuum" in this specification refers to a state in a space filled with a gas at a pressure lower than atmospheric pressure, and typically refers to a state in a space filled with a gas at a pressure lower than 1 atm (1013 hPa). The vacuum chamber 2 (hereinafter, chamber 2) can adjust the chamber pressure (pressure inside the chamber) by a chamber pressure control unit 3 equipped with a vacuum pump and a chamber pressure gauge.

[0015] When a substrate 5 to be film-deposited is transported (loaded) into the chamber 2 by a transfer robot (not shown) via a gate valve (not shown), it is held by a mask support part (not shown) provided in the chamber 2. The substrate 5 is held horizontally and with the film deposition surface (processing surface) of the substrate 5 facing downward. The substrate 5 is covered with a mask (not shown) having an opening pattern corresponding to the thin film pattern to be formed on the film deposition surface. Below the substrate 5 inside the chamber 2, an evaporation source device 4 is provided.

[0016] In addition, in this embodiment, the description is based on the configuration of a so-called depot-up type film deposition apparatus in which the evaporation source is installed on the bottom surface inside the chamber and the substrate to be film-deposited is arranged above the chamber. That is, regarding the definition of directions such as the vertical direction and the horizontal direction in the following description, if the device configuration changes, for example, in the case of a depot-down type or side-depo type device configuration, it is needless to say that the specific way of specifying the direction in the description will change.

[0017] <Evaporation Source> Figure 2 is a schematic cross-sectional view of the evaporation source device 4 according to this embodiment. The evaporation source device 4 includes an evaporation source container (crucible) 41 (hereinafter referred to as container 41) that contains a film-forming material (deposition material) 40, a case 42 that houses the container 41, a heating element 43 that heats the container 41, and reflectors (heat shielding members) 44 and 45 for increasing the heating efficiency of the container 41.

[0018] The container 41 has a storage section 46 in which the film-forming material 40 is contained, and a nozzle section 47 that forms an opening (also called an injection port or discharge port) for releasing the film-forming material 40, which has been vaporized (evaporated or sublimated) by heating of the heating element 43, to the outside of the container 41. The storage section 46 has a roughly rectangular box shape. Since this embodiment is a deposit-up type, the nozzle section 47 is provided on the upper wall section 461 of the outer wall of the storage section 46. The nozzle section 47 has a cylindrical shape that protrudes upward from the upper wall section 461 of the storage section 46, and a communication hole that connects the storage space of the film-forming material 40 in the storage section 46 to the outside of the container 41 forms the injection port described above. In this embodiment, a plurality of nozzle sections 47 are provided and arranged in a row with a predetermined interval between them. In this embodiment, the storage section 46 and the nozzle section 47 are made of a metal with high thermal conductivity. For example, Mo, Ta, W, Ti, etc. are used. Stainless steel (SUS) may be used for the housing section 46 and the nozzle section 47.

[0019] The arrangement, number, and shape of the nozzle section 47 shown here are merely examples and are not limited to any specific configuration. As described above, this embodiment is a deposit-up type film deposition apparatus, so the nozzle section 47 is located on the upper outer wall (upper wall section 461) of the container 41, facing the substrate to be deposited. For example, in the case of a side-deposit type film deposition apparatus, the nozzle section 47 is located on the side of the container 41, and the nozzle opening that opens to the side is configured to face the substrate. Also, the number of nozzle sections 47 may be one rather than multiple as in this embodiment. Furthermore, although a circular opening shape is exemplified in this embodiment, other shapes such as a rectangle may also be used for the opening of the nozzle section 47.

[0020] The case 42 is provided to house the container 41 so as to surround the outer wall surface of the housing section 46 in the container 41, and to suppress the transfer of heat from the container 41 to external components of the evaporation source device 4, such as the substrate 5. The case 42 may also be configured to provide thermal insulation by forming a passage (flow channel) inside it and flowing a coolant such as cooling water through this passage. On the other hand, in a configuration where the evaporation source device 4 is not insulated from other structures, the case 42 is not provided.

[0021] The case 42 has a case opening 420 through which the nozzle portion 47 is inserted, and the nozzle portion 47 is open to the outside in the container 41. Multiple case openings 420 are provided in the case upper wall portion 421, which is opposite the container upper wall portion 461 of the housing portion 46, corresponding to the nozzle portion 47. By inserting the nozzle portion 47 through the case opening 420, the case 42 surrounds the outer side surface of the nozzle portion 47. The case 42 may also be provided with a cylindrical cover portion (case cylindrical portion) that surrounds the outer side surface (outer peripheral surface) of the nozzle portion 47 in the case opening 420. This can further enhance the heat insulation effect. In this embodiment, stainless steel (SUS) is used for the case 42. Any other material with heat insulation properties may be used.

[0022] The heating element 43 is a heating means (heating section) that vaporizes the film-forming material 40 contained in the container 41 and The heating element 43 is positioned inside the case 42 so as to face the outer surface of the container 41, and by heating the container 41, the film-forming material 40 contained in the container 41 is heated. Suitable heating elements 43 include sheath heaters and other components that generate heat when electricity is applied. The heating element 43 may also be positioned so as to face the outer surface of the nozzle portion 47. This suppresses the temperature drop at the nozzle portion 47 and inhibits the deposition of the film-forming material 40.

[0023] The film-forming material 40 inside the container 41 is vaporized by heating with the heating element 43 and ejected (discharged) outside the container 41 through a nozzle 47 provided at the top of the container 41. The film-forming material 40 ejected outside the container 41 is deposited onto the film-forming surface of the substrate 5 located above the evaporation source device 4. In this embodiment, the heating element 43 is a component of the evaporation source device 4. However, in a modified example in which the film-forming material 40 in the container 41 is heated by a separately provided heating means, the evaporation source device 4 does not have a heating means.

[0024] The reflector 44 is positioned inside the case 42 so as to surround the heating element 43. The reflector 44 is positioned to improve the heating efficiency of the container 41 by the heating element 43 by reflecting the heat from the heating element 43 towards the container 41. The reflector 45 is an additional reflector provided to further improve the heating efficiency on the side of the container 41, and is positioned outside the portion of the reflector 44 that is positioned opposite the outer side of the container 41. In other words, the evaporation source device 4 of this embodiment employs a double reflector structure on the side of the container. A similar double structure may also be adopted below or above the container. Furthermore, if the heating element 43 is also positioned around the nozzle section 47, a reflector may also be positioned outside that heating element 43. If the boiling point or sublimation point of the film-forming material 40 is low, the reflectors 44 and 45 are not provided. In this embodiment, the reflectors 44 and 45 are made of stainless steel (SUS). In addition, any material that reflects thermal radiation can be used. Generally, metals are suitable as materials for reflectors 44 and 45 because they have high reflectivity.

[0025] <Coating> In the film deposition apparatus 1 according to this embodiment, the structure around the nozzle portion 47 of the evaporation source device 4 is coated to reduce the amount of film deposition material 40 adhering to its surface compared to when the substrate is exposed. In the prior art, it was thought that anti-adhesion treatment was almost unnecessary for the evaporation source device 4 due to reasons such as the vaporized material being discharged linearly from the opening and the evaporation source being at a high temperature. However, according to the inventors of the present invention, it has been found that if anti-adhesion treatment is not applied to the area around the nozzle portion, the film deposition material adhering to the area around the nozzle portion can accumulate, hindering the discharge of the film deposition material from the nozzle portion. As a result, the film deposition quality may deteriorate. Therefore, in this embodiment, an anti-adhesion coating is applied to the area around the nozzle portion 47 of the evaporation source device 4. This suppresses the adhesion of film deposition material to the opening of the nozzle portion 47 and suppresses the deterioration of film deposition quality.

[0026] As shown in Figure 2, more specifically, in this embodiment, the above-mentioned coating 71 is applied to the outer surface (top surface) of the case upper wall portion 421 of the case 42. That is, in this embodiment, the coating 71 is applied to the area around the outer surface of the nozzle portion 47 on the outer surface of the case 42. The temperature on the outer surface of the case 42 tends to be lower than on the inside of the case 42, and this tendency is particularly pronounced outside the area where the reflector 44 is placed on the inside of the case 42. Therefore, according to the inventors' knowledge of the present invention, it has been found that the adhesion and deposition of the film-forming material begins on the outer surface (top surface) of the case upper wall portion 421, particularly in the area around the nozzle portion 47. Accordingly, by applying a coating 71 that suppresses the adhesion of the film-forming material to the area surrounding the nozzle portion 47 on the outer surface of the case upper wall portion 421, the deposition of the film-forming material can be effectively suppressed.

[0027] In this embodiment, the entire upper surface of the case 42 is coated with the coating 71. As a variation, the coating 71 is applied to only a part of the upper surface of the case 42. For example, the coating is applied only to the edge of the case opening 420 through which the nozzle portion 47 is inserted, and the rest of the case is not coated. In addition, as a region in the vicinity of the nozzle portion 47 on the case 42, it is preferable to apply the coating 71 to at least the outer surface of the case upper wall portion 421 that overlaps with the reflector 44 when the case upper wall portion 421 is projected in a top view. This is because the temperature of this region drops particularly significantly due to the heat reflection of the reflector 44.

[0028] The coating 71 can be made of a material having predetermined oil repellency and heat resistance, such as DLC (Diamond-Like Carbon), fluorine-containing carbon (fluorocarbon), or Teflon (registered trademark). Regardless of the film-forming material, the higher the oil repellency (also called oleophobicity), the higher the anti-adhesion performance. In particular, when organic materials are formed into a film, a high anti-adhesion effect can be obtained by using an oil-repellent coating material. The heat resistance of the coating material is required because the coating 71 is applied to the evaporation source device 4, which becomes particularly hot inside the chamber 2. For example, the heat resistance of the coating material should be 100°C or higher, preferably 200°C or higher.

[0029] The hexane contact angle can be used as a parameter to indicate the degree of lipophilicity or oleophobicity of a coating material. It can be defined as the angle made between a surface and the hexane surface when hexane is dropped onto that surface. A smaller contact angle indicates lipophilicity, while a larger contact angle indicates oleophobicity. In other words, a larger hexane contact angle suppresses the adhesion of the film-forming material. In this example, a material with a hexane contact angle of 40 degrees or more is used.

[0030] Generally, for the same surface, the longer the main chain, the larger the contact angle tends to be. Therefore, surfaces with a hexane contact angle of 40 degrees or more can be said to exhibit a degree of oleophobicity that is useful as an anti-adhesion coating for most organic materials. In other words, the hexane contact angle is a suitable indicator for coating materials used in film deposition equipment that forms thin films with organic materials. However, a hexane contact angle of 40 degrees or more is merely an example, and the hexane contact angle required for coating materials in film deposition equipment is not limited to 40 degrees or more.

[0031] Specific examples of DLC include aC:H film, ta-C:H film, aC film, ta-C film, S Examples include metal-containing DLC ​​such as i and Ta, and fluorine-containing DLC. Examples of film deposition methods for these include the following: For aC:H films, plasma CVD (PACVD), ionization deposition, and plasma ion implantation deposition. For aC films, sputtering. For ta-C films, cathode vacuum arc deposition and T-shaped filtered arc deposition. For ta-C:H films, arc ion plating. For aC:H films and Si-containing aC:H films, unbalanced magnetron sputtering (UBMS). For metal-containing aC:H films such as tungsten, a combination of PACVD and UBMS. In this example, an aC:H film (film thickness 1.5 μm) was deposited by plasma CVD (carbon source: C2H2).

[0032] Specific examples of fluorine materials include coating with perfluorocarbon-alkoxysilane material by vapor deposition. In this example, a base layer (SiO2 layer, approximately 1 μm thick) was formed on a SUS substrate used for the case by vapor deposition of a silica material, and then Canon Optron's SurfClear 100 was vapor-deposited (perfluorocarbon-alkoxysilane layer, 20 nm thick). Alternatively, plasma CVD using tetrafluoroethylene (TFE) may also be used.

[0033] Specific examples of fluororesins and Teflon coatings include the following materials which may be coated by baking (200-400°C): PTFE (polytetrafluoroethylene (tetrafluorinated)) ), PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer (4,6-fluorinated)), ETFE (tetrafluoroethylene-ethylene copolymer), PVDF (polyvinylidene fluoride (2-fluorinated)), PCTFE (polychlorotrifluoroethylene (3-fluorinated)), ECTFE (chlorotrifluoroethylene-ethylene copolymer). Alternatively, coating by electroless nickel-Teflon plating may also be used.

[0034] The coating material is not limited to those described above and can be appropriately selected depending on the material of the substrate. For example, even if the case 42 is made of a material to which film-forming materials such as fluororesin do not adhere easily, the effects of this embodiment can be obtained by coating it with a material that has a higher anti-adhesion effect.

[0035] (Example 2) Referring to Figure 3, Embodiment 2 of the present invention will be described. Embodiment 2 differs from Embodiment 1 in that the nozzle portion 47 is coated. Figure 3(a) is a schematic cross-section end view showing the coating configuration of Embodiment 2, and is a magnified view of only a part of the evaporation source device 4. Figure 3(b) is a top view of the area around one of the nozzle portions in Figure 3(a). Here, only the differences between Embodiment 2 and Embodiment 1 will be described, and the configurations common to Embodiment 1 will not be described. At least the configurations with the same reference numerals as in Embodiment 1 are configurations common to Embodiment 1 in Embodiment 2.

[0036] As shown in Figure 3, in this embodiment, a coating is applied to the outer surface of the nozzle portion 47 to reduce the amount of film-forming material 40 adhering to it compared to when the substrate is exposed. Specifically, a coating 72a is formed to cover the area of ​​the outer side surface (outer peripheral surface) 472 of the nozzle portion 47 that is exposed to the outside of the case 42 (the outer peripheral surface of the portion that protrudes outward from the upper wall portion 421 of the case), and the tip surface 471 where the through hole 48 of the nozzle portion 47 opens. Furthermore, a coating 72b may be formed to cover the area of ​​the outer side surface (outer peripheral surface) 472 of the nozzle portion 47 that is surrounded by the case 42. Note that the inside of the case 42 is less likely to have the film-forming material 40 seep in, and the temperature drop is also small, so a sufficient effect can be obtained with coating 72a alone. The materials, properties, and manufacturing methods of coatings 72a and 72b are the same as those described in Example 1.

[0037] On the other hand, the inner surface of the nozzle portion 47, that is, the inner circumferential surface that forms the through hole 48, does not require coating. The inside of the nozzle portion 47 becomes hot due to the vaporized film-forming material 40, so adhesion and accumulation of the film-forming material 40 are unlikely to occur. Furthermore, in order to avoid the contamination of the film-forming material 40 by applying a coating, it is preferable not to apply a coating.

[0038] The coatings 72a and 72b in this embodiment may be combined with the coating 71 of Example 1.

[0039] (Example 3) Referring to Figure 4, Embodiment 3 of the present invention will be described. Embodiment 3 differs from Embodiments 1 and 2 in that a coating is applied to the cylindrical projection (the cylindrical part of the case 422, described later) of the case 42. Figure 4(a) is a schematic cross-section end view showing the coating configuration of Embodiment 3, and is a magnified view of only a part of the evaporation source device 4. Figure 4(b) is a top view of the area around one of the nozzle parts in Figure 4(a). Here, only the differences between Embodiment 3 and the above embodiments will be described, and the configurations common to the above embodiments in Embodiment 3 will not be described. At least the configurations with the same reference numerals as in Embodiment 1 or Embodiment 2 are configurations common to Embodiment 3 and Embodiment 1 or Embodiment 2.

[0040] As shown in Figure 4, the case 42 in this embodiment has a case cylindrical portion 422 that surrounds the outer side surface (circumferential surface) 472 of the nozzle portion 47 at the case opening 420. The case cylindrical portion 422 protrudes from the case upper wall portion 421 such that the inner circumferential surface surrounding the outer side surface 472 of the nozzle portion 47 at the case opening 420 extends in the direction of projection of the nozzle portion 47. In this embodiment, the above-mentioned coating is applied to the case cylindrical portion 422 as the region near the nozzle portion 47 in the case 42. Specifically, a coating 73a is formed to cover the outer circumferential surface, the tip surface (annular tip surface), and the inner circumferential surface facing the outer circumferential surface 472 of the nozzle portion 47 (the region of the inner circumferential surface of the case opening 420 that is extended by the case cylindrical portion 422). Furthermore, the inner circumferential surface of the case upper wall portion 421, which is connected to the inner circumferential surface of the case cylindrical portion 422, may also be coated with the coating 73b. Furthermore, regarding the inner circumferential surface of the cylindrical case portion 422 and the inner circumferential surface of the upper wall portion 421 of the case, the possibility of the film-forming material 40 wrapping around to these areas is low, and the temperature drop is also small. Therefore, sufficient effect can be expected even if only the outer circumferential surface and tip surface of the cylindrical case portion 422 are coated. The materials, properties, and manufacturing methods of coatings 73a and 73b are the same as those described in Example 1.

[0041] In this embodiment, the inner circumferential surface of the cylindrical case portion 422 forming the case opening 420 and the inner circumferential surface of the upper case wall portion 421 are configured to have the same diameter and form the same circumferential surface. However, they may have different diameters and form circumferential surfaces with a step. Also, the coatings 73a and 73b in this embodiment may be combined with either or both of the coating 71 of Embodiment 1 and the coatings 72a and 72b of Embodiment 2.

[0042] (Example 4) Referring to Figure 5, Embodiment 4 of the present invention will be described. Embodiment 4 differs from Embodiments 1 to 3 in that a part of the reflector 44 is coated. Figure 5(a) is a schematic cross-section end view showing the coating configuration of Embodiment 4, and is a magnified view showing only a part of the evaporation source device 4. Figure 5(b) is a top view of the area around one of the nozzle parts in Figure 5(a). Here, only the differences between Embodiment 4 and the above embodiments will be described, and the configurations common to the above embodiments in Embodiment 4 will not be described. At least the configurations with the same reference numerals as any of Embodiments 1 to 3 are configurations common to the above embodiments in Embodiment 4.

[0043] As shown in Figure 5, the reflector 44 in this embodiment has a heat-shielding cylindrical portion 441 surrounding the outer side surface (circumferential surface) 472 of the nozzle portion 47. In this embodiment, the above-mentioned coating is applied to the heat-shielding cylindrical portion 441 as the region near the nozzle portion 47 of the reflector 44. Specifically, a coating 74 is formed to cover the outer side surface (circumferential surface) of the heat-shielding cylindrical portion 441. Furthermore, the tip surface (annular tip surface) of the heat-shielding cylindrical portion 441 may also be coated. As for the inner side surface (inner circumferential surface) of the heat-shielding cylindrical portion 441, it is preferable not to apply a coating to avoid a decrease in heat reflection performance due to the coating, but a coating may be applied if it is made of a material that does not significantly reduce the reflectivity of heat reflection, such as Teflon. The material, properties, and manufacturing method of the coating 74 are the same as those described in Example 1.

[0044] In this embodiment, the case 42 is shown as having a cylindrical case portion 422 as described in Embodiment 3, but it may also be configured without the cylindrical case portion 422. Furthermore, the coatings 73a and 73b of this embodiment may be combined with the coating 71 of Embodiment 1, the coatings 72a and 72b of Embodiment 2, and the coatings 73a and 73b of Embodiment 3.

[0045] (Other examples) Figures 6 and 7 are schematic diagrams showing examples of the configuration of a film deposition apparatus and a vapor deposition method. An overview of the configuration examples of the film deposition apparatus and vapor deposition method to which the present invention can be applied will be provided. Note that the configuration examples shown here are merely illustrative, and the configurations to which the present invention can be applied are not limited to these configurations. isn't it.

[0046] Figure 6(a) is a schematic diagram showing an example of a cluster-type film deposition apparatus configuration using a point-type evaporation source device. Specifically, the discharge port (nozzle) of the evaporation source device 4 rotates relative to the substrate 5 around a perpendicular line at the center of the film deposition surface of the substrate 5 as the axis of rotation, thereby performing deposition. In the illustrated configuration, the substrate 5 is rotated to cause relative rotation of the substrate 5 and the evaporation source device 4, but the substrate 5 may be kept stationary and the evaporation source device 4 may be rotated, or both may be rotated.

[0047] Figure 6(b) is a schematic diagram showing an example of the configuration of a cluster-type film deposition apparatus using a line-type evaporation source device. Specifically, the evaporation source device 4 has discharge ports (nozzle sections) arranged in a direction perpendicular to the scanning direction with respect to the substrate 5, and deposition is performed by moving the evaporation source device 4 relative to the stationary substrate 5. The configuration of the evaporation source device 4 may not be limited to a configuration with multiple discharge ports, but may also be a configuration such as the evaporation source device 4b shown in Figure 7, which has a nozzle section 47b with an elongated opening perpendicular to the scanning direction with respect to the substrate 5 for discharging the film deposition material.

[0048] Figure 6(c) is a schematic diagram showing an example configuration of a side-depot type film deposition apparatus. The evaporation source device 4c has a container comprising a film deposition material storage chamber 460 and a diffusion chamber 461, with multiple nozzle sections 47 arranged in the diffusion chamber 461. The substrate 5 and each nozzle section 47 are facing each other in the lateral (horizontal) direction, and the arrangement of each nozzle section 47 is perpendicular to the scanning direction with respect to the substrate 5. Note that the configuration of the nozzle section may be similar to the nozzle section 47b with a slit-type opening shown in the evaporation source device 4b in Figure 7.

[0049] Figure 6(d) is a schematic diagram showing an example of the configuration of an in-line film deposition apparatus using a line-type evaporation source. In an in-line film deposition apparatus, the substrate 5 is transported along a predetermined transport path between multiple deposition chambers and other components to undergo various processes. The evaporation source 4 is positioned in accordance with the transport path of the substrate 5, and as the substrate 5 is transported along the predetermined transport path, the substrate 5 and the evaporation source 4 move relative to each other, and deposition takes place. The nozzle section may be configured as shown in Figure 7, with a nozzle section 47b having a slit-type opening in the evaporation source 4b.

[0050] Figure 8 is a schematic perspective view showing yet another example of nozzle configuration. The evaporation source device 4d shown in Figure 8 comprises multiple sets of nozzle sections 47a erected vertically toward the substrate, corresponding heat-shielding cylindrical sections (reflectors) 441a, and case cylindrical sections 422a of the case 22, similar to the above embodiment. Furthermore, the evaporation source device 4d has an inclined nozzle section 47d that extends in a direction inclined with respect to the vertical direction (the direction in which the nozzle section 47a protrudes). In addition, as part of the reflector, an inclined heat-shielding cylindrical section 441d is provided that extends in the same inclined direction so as to surround the outer circumference of the inclined nozzle section 47d. Multiple sets (three in this example) of the inclined nozzle section 47d and inclined heat-shielding cylindrical sections 441d are arranged in a line at equal intervals, and an inclined case cylindrical section 422d is provided to surround them together. The coatings described in each of the above embodiments can also be applied to such a nozzle configuration. Note that the number of components in each nozzle set, as well as the combinations of their arrangement, are not limited to the configuration examples shown here.

[0051] <Methods for manufacturing electronic devices> A method for manufacturing electronic devices using the above-described film deposition apparatus will be explained. Here, as an example of an electronic device, an organic EL element used in display devices such as organic EL display devices will be used as an example. However, the electronic device according to the present invention is not limited to this and may also be a thin-film solar cell or an organic CMOS image sensor. The process includes a step of forming an organic film on a substrate 5 using the above-described film formation method. Furthermore, after forming the organic film on the substrate 5, a step of forming a metal film or a metal oxide film is also included. The structure of the organic EL display device 600 obtained through these steps is described below.

[0052] Figure 9(a) shows an overall view of the organic EL display device 600, and Figure 9(b) shows the cross-sectional structure of a single pixel. As shown in Figure 9(a), multiple pixels 62, each having multiple light-emitting elements, are arranged in a matrix in the display area 61 of the organic EL display device 600. Each light-emitting element has a structure comprising an organic layer sandwiched between a pair of electrodes. Here, a pixel refers to the smallest unit that enables the display of a desired color in the display area 61. In the organic EL display device shown in this figure, the pixels 62 are composed of a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B, each exhibiting different light emission. Pixels 62 are often composed of a combination of red, green, and blue light-emitting elements, but a combination of yellow, cyan, and white light-emitting elements is also acceptable; as long as there is at least one color, there are no particular limitations. Furthermore, each light-emitting element may be composed of multiple light-emitting layers stacked on top of each other.

[0053] Alternatively, a pixel 62 may be composed of multiple light-emitting elements that emit the same light, and a color filter may be used in which multiple different color conversion elements are arranged in a pattern to correspond to each light-emitting element, thereby enabling a single pixel to display a desired color in the display area 61. For example, a pixel 62 may be composed of at least three white light-emitting elements, and a color filter may be used in which red, green, and blue color conversion elements are arranged to correspond to each light-emitting element. Or, a pixel 62 may be composed of at least three blue light-emitting elements, and a color filter may be used in which red, green, and colorless color conversion elements are arranged to correspond to each light-emitting element. In the latter case, by using a quantum dot color filter (QD-CF) made of quantum dot (QD) material as the material constituting the color filter, the display color gamut can be made wider than that of a normal organic EL display device that does not use a quantum dot color filter.

[0054] Figure 9(b) is a schematic partial cross-sectional view of the line A and B in Figure 9(a). Pixel 62 has an organic EL element on the substrate 5, comprising a first electrode (anode) 64, a hole transport layer 65, one of the light-emitting layers 66R, 66G, or 66B, an electron transport layer 67, and a second electrode (cathode) 68. Of these, the hole transport layer 65, the light-emitting layers 66R, 66G, 66B, and the electron transport layer 67 are organic layers. In this embodiment, the light-emitting layer 66R is a red-emitting organic EL layer, the light-emitting layer 66G is a green-emitting organic EL layer, and the light-emitting layer 66B is a blue-emitting organic EL layer. When a color filter or quantum dot color filter is used as described above, the color filter or quantum dot color filter is placed on the light-emitting side of each light-emitting layer, i.e., at the top or bottom of Figure 9(b), but this is omitted from the illustration.

[0055] The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The first electrode 64 is formed separately for each light-emitting element. The hole transport layer 65, electron transport layer 67, and second electrode 68 may be formed in common for multiple light-emitting elements 62R, 62G, and 62B, or they may be formed for each light-emitting element. An insulating layer 69 is provided between the first electrode 64 and the second electrode 68 to prevent short circuits caused by foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer P is provided to protect the organic EL elements from moisture and oxygen.

[0056] Next, an example of a method for manufacturing an organic EL display device as an electronic device will be specifically described. First, a circuit (not shown) for driving the organic EL display device and the first electrode 64 are formed. Prepare the circuit board 5.

[0057] Next, a resin layer such as acrylic resin or polyimide is formed on the substrate 5 on which the first electrode 64 is formed by spin coating. The resin layer is then patterned by lithography so that an opening is formed in the area where the first electrode 64 is formed, thereby forming an insulating layer 69. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0058] Next, the substrate 5 with the insulating layer 69 patterned is loaded into the first deposition apparatus, the substrate is held in a substrate holding unit, and the hole transport layer 65 is deposited as a common layer on the first electrode 64 of the display area. The hole transport layer 65 is deposited by vacuum deposition. In practice, the hole transport layer 65 is formed to a size larger than the display area 61, so a high-resolution mask is not required. Here, the deposition apparatus used for deposition in this step and for deposition of each of the following layers is the deposition apparatus described in any of the embodiments above.

[0059] Next, the substrate 5, on which the hole transport layer 65 has been formed, is loaded into a second film deposition apparatus and held in a substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light-emitting layer 66R is deposited on the portion of the substrate 5 where the red light-emitting elements are to be placed. In this example, the mask and the substrate can be properly overlapped, enabling high-precision film deposition.

[0060] Similar to the deposition of the light-emitting layer 66R, a light-emitting layer 66G that emits green light is deposited using a third deposition apparatus, and then a light-emitting layer 66B that emits blue light is deposited using a fourth deposition apparatus. After the deposition of the light-emitting layers 66R, 66G, and 66B is completed, an electron transport layer 67 is deposited over the entire display area 61 using a fifth deposition apparatus. Each of the light-emitting layers 66R, 66G, and 66B may be a single layer or a layer made up of multiple different layers stacked together. The electron transport layer 65 is formed as a common layer for the three colored light-emitting layers 66R, 66G, and 66B. In this embodiment, the electron transport layer 67 and the light-emitting layers 66R, 66G, and 66B are deposited by vacuum deposition.

[0061] Next, a second electrode 68 is formed on the electron transport layer 67. The second electrode may be formed by vacuum deposition or by sputtering. After that, the substrate on which the second electrode 68 has been formed is moved to a sealing apparatus and a protective layer P is formed by plasma CVD (sealing process), completing the organic EL display device 600. In this example, the protective layer P is formed by the CVD method, but it is not limited to this method and may also be formed by ALD or inkjet methods.

[0062] From the time the substrate 5, which has the insulating layer 69 patterned on it, is brought into the film deposition apparatus until the deposition of the protective layer P is completed, exposure to an atmosphere containing moisture or oxygen may cause the light-emitting layer, which is made of organic EL material, to deteriorate due to moisture or oxygen. Therefore, in this example, the loading and unloading of substrates between film deposition apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere. [Explanation of Symbols]

[0063] 1…Film deposition apparatus, 2…Vacuum chamber, 4…Evaporation source apparatus, 47…Nozzle section, 5…Substrate, 72…Coating

Claims

1. A housing section in which the film-forming material is contained, An evaporation source device comprising: a cylindrical nozzle portion having an opening for releasing film-forming material that has vaporized due to heating from the film-forming material contained in the containment portion, and protruding from the outer wall of the containment portion, An evaporation source device characterized in that an oil-repellent coating is applied to the outer surface of the nozzle portion to reduce the amount of film-forming material adhering to it.

2. The case further comprises the outer side surface of the nozzle portion and the housing portion, such that at least the tip of the nozzle portion is exposed to the outside, The evaporation source device according to claim 1, characterized in that the oil-repellent coating is applied to the area surrounding the outer side surface of the nozzle portion in the case.

3. The nozzle portion is further provided with a reflector that is positioned opposite to the outer side surface of the nozzle portion. The evaporation source device according to claim 1, characterized in that the reflector is coated with the oil-repellent coating.

4. The outer side surface of the nozzle portion and the case surrounding the housing portion are provided such that at least the tip of the nozzle portion is exposed to the outside, The case further comprises a reflector provided between the nozzle portion and the surrounding area of ​​the outer surface of the nozzle portion, facing the outer surface of the nozzle portion, The evaporation source device according to claim 1, characterized in that the oil-repellent coating is applied to the area surrounding the outer side surface of the nozzle portion in the case and to the reflector.

5. A housing section in which the film-forming material is contained, The container has an opening for releasing the film-forming material that has vaporized due to heating, and a cylindrical nozzle portion protruding from the outer wall of the container, In an evaporation source device comprising a case surrounding the outer side surface of the nozzle portion and the housing portion, such that at least the tip of the nozzle portion is exposed to the outside, At least the area around the outer side surface of the nozzle portion in the case is coated with the film-forming material. An evaporation source device characterized by being coated with an oil-repellent coating to reduce the amount of deposits.

6. The nozzle portion is positioned to protrude from the upper wall of the housing portion. The evaporation source device according to claim 5, characterized in that the oil-repellent coating is applied to the upper surface of the portion of the case that faces the upper wall of the housing section.

7. The case has a case opening through which the nozzle portion is inserted. The evaporation source device according to claim 5 or 6, characterized in that the oil-repellent coating is applied to the inner circumferential surface surrounding the outer side surface of the nozzle portion in the case opening.

8. The case has a cylindrical case portion that surrounds the outer side surface of the nozzle portion. The evaporation source device according to any one of claims 5 to 7, characterized in that the cylindrical part of the case is coated with the oil-repellent coating.

9. The case has an upper wall portion facing the upper surface of the housing portion, and a case opening provided in the upper wall portion through which the nozzle portion is inserted. The cylindrical case portion protrudes from the upper wall portion such that the inner circumferential surface surrounding the outer side surface of the nozzle portion at the case opening extends in the direction of protrusion of the nozzle portion. The evaporation source device according to claim 8, characterized in that the oil-repellent coating is applied to at least one of the following: the region of the inner circumferential surface extended by the case cylindrical portion, the tip surface of the case cylindrical portion, and the outer side surface of the case cylindrical portion.

10. The evaporation source apparatus according to any one of claims 5 to 9, characterized in that the oil-repellent coating is applied to the portion of the outer surface of the nozzle that is exposed to the outside of the case.

11. A housing section in which the film-forming material is contained, The container has an opening for releasing the film-forming material that has vaporized due to heating, and a cylindrical nozzle portion protruding from the outer wall of the container, In an evaporation source device comprising a reflector provided opposite to the outer surface of the nozzle portion, An evaporation source device characterized in that at least the reflector is coated with an oil-repellent coating to reduce the amount of film-forming material adhering to it.

12. The evaporation source device according to claim 11, characterized in that the oil-repellent coating is applied to the surface of the reflector that faces the outer side surface of the nozzle portion.

13. The reflector has a cylindrical portion provided so as to surround the outer side surface of the nozzle portion, The evaporation source device according to claim 11 or 12, characterized in that the tip surface and outer surface of the cylindrical portion are coated with the oil-repellent coating.

14. The evaporation source device according to any one of claims 11 to 13, further comprising a heating means disposed between the outer surface of the nozzle portion and the reflector.

15. The evaporation source device according to any one of claims 1 to 13, further comprising a heating means for heating at least one of the housing portion and the nozzle portion.

16. The evaporation source device according to any one of claims 1 to 15, characterized in that the tip surface of the nozzle portion is also coated with the oil-repellent coating.

17. The evaporation source apparatus according to any one of claims 1 to 16, characterized in that the oil-repellent coating is formed of a material having a hexane contact angle of 40 degrees or more.

18. The evaporation source apparatus according to claim 17, characterized in that the material is DLC (Diamond-Like Carbon) or fluorine-containing carbon (fluorocarbon).

19. The evaporation source apparatus according to any one of claims 1 to 18, characterized in that the oil-repellent coating has heat resistance of 100°C or higher.

20. The evaporation source device according to any one of claims 1 to 19, characterized by comprising a plurality of nozzle portions.

21. The evaporation source device according to claim 20, characterized in that the plurality of nozzle portions are arranged in a direction perpendicular to the scanning direction with respect to the substrate.

22. The evaporation source apparatus according to any one of claims 1 to 19, characterized in that the opening of the nozzle portion is elongated in a direction perpendicular to the scanning direction with respect to the substrate.

23. Chamber and, An evaporation source apparatus according to any one of claims 1 to 22, which is provided in the chamber and performs film formation on a substrate installed in the chamber, A film deposition apparatus characterized by comprising the following features.

24. A method for forming a film, characterized by forming a film on a substrate using the film forming apparatus described in claim 23.

25. The method comprises a step of forming an organic film on a substrate using the film formation method described in claim 24. A method for manufacturing an electronic device characterized by the following:

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