Heat dissipating structure, interface board and communication device

Abstract

A heat dissipating structure (2000), an interface board and a communication device. The heat dissipating structure (2000) comprises a first optical cage (2100) and a printed circuit board (PCB) (2200). The first optical cage (2100) comprises an insertion cavity (2110), and comprises a crimping plate (2120), a top plate (2130) and a side plate (2140) which surround the insertion cavity (2110); the insertion cavity (2110) is used for allowing an optical module to insert therein; the top plate (2130) comprises a first window (2131), the first window (2131) being located inside a region where the top plate (2130) is in contact with the optical module; the outer wall of the top plate (2130) comprises a first snap-fit structure (2132), the first snap-fit structure (2132) being used for fixing a first heat sink (2400) on the outer wall of the top plate (2130); the first heat sink (2400) is used for extending into the first window (2131) to achieve contact with the optical module. The crimping plate (2120) is crimped to a first surface of the printed circuit board (PCB) (2200); and the crimping plate (2120) comprises a second window (2121), the second window (2121) being inside a region where the crimping plate (2121) is in contact with the optical module.

Description

A heat dissipation structure, interface board and communication device

[0001] The present application claims priority to the Chinese Patent Application No. 202411296647.3, filed on September 14, 2024, and entitled "A heat dissipation structure, interface board and communication device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of communication, and in particular to a heat dissipation structure, interface board and communication device. BACKGROUND

[0003] Optical modules are widely used in the fields of AI technology, data center, optical communication, etc., for realizing conversion and transmission of signals. The current requirement for the speed of optical modules is getting higher and higher, and the power consumption of optical modules is increasing accordingly, so the requirement for the heat dissipation capacity of optical modules is getting higher and higher.

[0004] The optical module is fixed and electrically connected to a printed circuit board (PCB) in a communication device through an optical cage. The optical cage is crimped on the PCB, and the optical module is inserted into the optical cage to realize the connection of the optical module to the PCB. The optical cage is also used to realize heat dissipation of the optical module.

[0005] Different optical modules have different structural designs. Some optical modules generate more heat on the surface close to the PCB, and some optical modules generate more heat on the surface away from the PCB. The current optical cage heat dissipation structure is relatively fixed. If it is set to dissipate heat on the surface of the optical module close to the PCB, it cannot guarantee the heat dissipation effect on the surface of the optical module away from the PCB, and vice versa.

[0006] Different types of optical modules can be inserted into the optical cage. When the optical modules inserted into the optical cage change, the heat dissipation demand (main heat generating part) changes accordingly, and the optical cage with fixed heat dissipation structure cannot meet the heat dissipation demand of different optical modules. SUMMARY

[0007] The embodiments of the present application provide a heat dissipation structure, interface board and communication device for improving the flexibility of the heat dissipation structure of the optical cage, so as to match different types of optical modules (optical modules with different heat generating parts) by the optical cage.

[0008] In a first aspect, an embodiment of the present application provides a heat dissipation structure. The heat dissipation structure comprises a first optical cage and a printed circuit board (PCB). The first optical cage comprises a crimping plate, a top plate and a side plate surrounding a plug-in cavity for inserting an optical module, and the top plate comprises a first window in an area where the top plate contacts the optical module. An outer wall of the top plate comprises a first buckling structure for fixing a first heat sink on the outer wall of the top plate, and the first heat sink is used to extend into the first window to contact the optical module. The crimping plate is crimped with a first surface of the PCB, and the crimping plate comprises a second window in an area where the crimping plate contacts the optical module.

[0009] In an embodiment of the present application, the first window provides space for heat dissipation of the top of the optical module (i.e. the face of the optical module away from the PCB), and the second window provides space for heat dissipation of the bottom of the optical module (i.e. the face of the optical module facing the PCB). If it is determined that the optical module inserted into the plug-in cavity is a top-heat-severe optical module, a first heat sink can be fixed on the top of the first optical cage through the first buckling structure, so that the first heat sink extends into the first window to contact the top of the optical module and achieve heat dissipation of the top of the optical module. If it is determined that the optical module inserted into the plug-in cavity is a bottom-heat-severe optical module, a second heat sink can be fixed on the bottom of the first optical cage, and the second heat sink extends into the second window to achieve heat dissipation of the bottom of the optical module. This structure can flexibly adapt to different types of optical modules (optical modules with different heat generating parts).

[0010] In an optional implementation, the heat dissipation structure further comprises a first heat sink and a first buckle. The first buckling structure of the first optical cage is used to fix the first buckle. The first buckle is used to fix the first heat sink on the outer wall of the top plate of the optical cage.

[0011] In an embodiment of the present application, due to the manufacturing tolerance of the optical module, the first heat sink and the like, there will be a certain tolerance between the top plate of the first optical cage and the first heat sink. Due to the existence of the tolerance, after the optical module is inserted into the plug-in cavity, the first heat sink may not necessarily be in close contact with the optical module. The flexibility (or elasticity) of the first buckle can absorb this tolerance, ensuring the close contact between the optical module and the first heat sink, thereby improving the heat dissipation effect of the top of the optical module.

[0012] Optionally, the first buckle can be made of a material with flexibility (elasticity), such as rubber, metal (thin sheet) and the like.

[0013] In an optional implementation, the first heat sink comprises a heat dissipation surface and a contact surface. The heat dissipation surface comprises a metal heat dissipation surface, and the contact surface comprises a first boss. The first boss is used to extend into the first window of the first optical cage to contact the optical module. The first buckle is in contact with the metal heat dissipation surface and is used to fix the first heat sink on the outer wall of the top plate of the optical cage.

[0014] In the embodiment of the present application, the first boss of the first heat sink extends into the first window and contacts the optical module, so as to transfer the heat of the optical module to the metal heat dissipation surface. The metal heat dissipation surface is used to release the heat of the optical module. Through the first heat sink including the first boss and the metal heat dissipation surface, efficient heat dissipation of the top of the optical module can be achieved.

[0015] In an optional implementation, the metal heat dissipation surface includes a heat dissipation fin, a liquid cooling plate, or a metal plate.

[0016] The liquid cooling plate includes a flow channel for accommodating a liquid cooling working medium. Heat is transferred through the liquid cooling working medium, so as to achieve heat dissipation of the optical module.

[0017] In an optional implementation, the first clamping structure includes a first connecting unit and a first clamping arm. The first connecting unit is used to connect the outer wall of the top plate and the first clamping arm. The first clamping arm includes an opening facing the outer wall of the top plate.

[0018] In the embodiment of the present application, the first surface of the first fastener is pressed on the metal heat dissipation surface. After the first clamping structure penetrates the through hole A of the first fastener, the first surface near the through hole A is clamped on the outer wall of the top plate by the first clamping arm of the first clamping structure, so that the position where the through hole A is located is concave, and the first surface is pulled tight. Therefore, the first surface of the first fastener can provide a pressure towards the first optical cage direction to the first heat sink, so that the first heat sink is tightly attached to the optical module, and the heat dissipation effect of the top of the optical module is ensured.

[0019] Optionally, the first clamping structure can be a hook-shaped, T-shaped, L-shaped, S-shaped structure, and the present application does not limit this.

[0020] In an optional implementation, the PCB further includes a third window. The third window and the second window on the first optical cage pressing plate include an overlapping area (i.e., the third window and the second window partially overlap or completely overlap).

[0021] In the embodiment of the present application, the second window and the third window are adjacent to the bottom of the optical module, so that heat dissipation of the bottom of the optical module can be achieved, and the optical module with serious heat at the bottom is suitable.

[0022] In an optional implementation, the PCB includes a first through hole, and the outer wall of the pressing plate includes a second clamping structure. The second clamping structure is used to penetrate the first through hole, so as to fix the second heat sink on the second surface of the PCB. The second heat sink is used to extend into the third window on the PCB and the second window on the first optical cage, so as to achieve contact with the optical module.

[0023] In the embodiment of the present application, the second fastening structure of the first optical cage passes through the first through hole of the PCB to fix the second heat sink on the second surface of the PCB. Thus, the positional relationship between the second heat sink and the first optical cage is fixed, so that the second heat sink can be in close contact with the optical module after extending into the second window and the third window, thereby ensuring the heat dissipation effect of the bottom of the optical module.

[0024] In an alternative implementation, the number of the second fastening structures is at least two, and the pressing plate further comprises at least two second through holes. The at least two second through holes are used to accommodate the at least two second fastening structures of the second optical cage, the structure of the second optical cage is the same as that of the first optical cage, and the pressing plate of the second optical cage is used to be pressed against the second surface of the PCB. On the pressing plate, the positions of the at least two second through holes are axially symmetrical to the positions of the at least two second fastening structures, the axis is the central axis of the positions of the at least two second through holes and the at least two second fastening structures, and is parallel to the direction in which the optical module is inserted into the insertion cavity.

[0025] In the embodiment of the present application, the second through hole and the second fastening structure on the first optical cage are axially symmetrical relative to the axis, so that when the second optical cage is pressed against different surfaces of the PCB respectively, the second through hole of the first optical cage can accommodate the second fastening structure of the second optical cage (as shown in FIGS. 11 and 12, and the same applies to the opposite case). Thus, in the case of pressing the optical cages against both surfaces of the PCB (double-sided pressing), the normal pressing between each optical cage and the PCB is ensured, so that the double-sided pressing scheme is feasible. The structure of the double-sided pressing can increase the number of the optical modules connected to the PCB, thereby improving the integration of the optical modules.

[0026] In an alternative implementation, the at least two second through holes and the at least two second fastening structures are distributed on both sides of the axis.

[0027] In the embodiment of the present application, arranging the second fastening structure on the axis will cause structural interference between the second fastening structure on the first optical cage and the second fastening structure on the second optical cage. Therefore, the plurality of second through holes and the plurality of second fastening structures are distributed on both sides of the axis to prevent the second fastening structures of the first optical cage and the second optical cage from interfering with each other.

[0028] In an alternative implementation, the at least two second fastening structures comprise at least two rows of fastening structures in the direction of the axis, and the at least two second through holes comprise at least two rows of second through holes in the direction of the axis.

[0029] In the embodiment of the present application, the at least two rows of second fastening structures can prevent the second heat sink from rotating or displacing, thereby ensuring the stability of the position of the second heat sink, ensuring the close contact between the second heat sink and the bottom of the optical module, and ensuring the heat dissipation effect of the bottom of the optical module. The at least two rows of second through holes are used to accommodate the at least two rows of second fastening structures.

[0030] In an optional implementation, the number of the second through holes is greater than or equal to the number of the second buckle structures.

[0031] In the embodiment, the number of the second through holes is greater than or equal to the number of the second buckle structures, so that all the second buckle structures on the second optical cage can be accommodated by the second through holes on the first optical cage (and vice versa), thereby improving the stability of the structure.

[0032] In an optional implementation, the second buckle structure includes a second connecting unit and a second buckle arm. The second connecting unit is used to connect the outer wall of the crimping plate and the second buckle arm. The second buckle arm includes an opening facing the outer wall of the crimping plate.

[0033] In the embodiment, the second buckle structure can fix the second fastener on the second surface of the PCB. Specifically, the second fastener is made of elastic material, and the fourth surface of the second fastener is a flat surface when not assembled. The fourth surface of the second fastener is pressed on the heat dissipation surface of the second heat sink. After the second buckle structure passes through the through hole C of the second fastener, the fourth surface near the through hole C is buckled on the second surface of the PCB by the second buckle arm of the second buckle structure, resulting in that the position where the through hole C is located is concave downward and the fourth surface is tightened. Therefore, the fourth surface of the second fastener can provide a pressure to the second heat sink in the direction of the first optical cage, so as to make the second heat sink closely contact with the optical module and ensure the heat dissipation effect of the bottom of the optical module.

[0034] In an optional implementation, the height of the second buckle structure is greater than the wall thickness of the PCB.

[0035] In the embodiment, the height of the second buckle structure is greater than the wall thickness of the PCB, so that the second buckle structure will protrude from the second surface of the PCB, thereby facilitating the fixation of the second heat sink on the second surface of the PCB.

[0036] In an optional implementation, the heat dissipation structure further includes a second heat sink and a second fastener. The second buckle structure on the first optical cage is used to pass through the first through hole on the PCB to fix the second fastener. The second fastener fixes the second heat sink on the second surface of the PCB.

[0037] In an optional implementation, the second heat sink includes a second boss. The second boss is used to protrude into the third window on the PCB and the second window on the first optical cage to contact the optical module in the first optical cage.

[0038] In the embodiment, the second boss of the second heat sink protrudes into the second window and the third window, and contacts the optical module through the second boss. Therefore, the heat transfer efficiency between the second heat sink and the optical module is improved, and the heat dissipation efficiency of the bottom of the optical module is improved.

[0039] In an optional implementation, the surface of the first boss or the second boss is an alloy material.

[0040] In the embodiments of the present application, the alloy material has wear-resistant properties, which can ensure the stability of the first / second boss structure and the heat dissipation effect under the premise of frequent plugging of the optical modules. If the first / second heat sink is a liquid cooling plate, it can prevent liquid leakage after wear; if the first / second heat sink is a heat dissipation tooth / metal plate, it can prevent the heat dissipation tooth / metal plate from being worn and not tightly contacting the optical module.

[0041] In an optional implementation, the heat dissipation structure further includes a second optical cage, the structure of the second optical cage is the same as that of the first optical cage. The crimping plate of the second optical cage is crimped with the second surface of the PCB, and the insertion cavity of the second optical cage is directed in the same direction as the insertion cavity of the first optical cage.

[0042] In an optional implementation, the PCB includes a crimping hole. The outer wall of the crimping plate includes a crimping terminal, and the crimping terminal includes a crimping head and a shoulder. The crimping head is used to insert the crimping hole of the PCB to achieve crimping. The shoulder is used to connect the crimping head and the outer wall of the crimping plate, and the height d of the shoulder protruding from the outer wall of the crimping plate is greater than or equal to 0.15 mm.

[0043] In the embodiments of the present application, the height d of the shoulder of the crimping terminal protruding from the outer wall of the crimping plate is greater than or equal to 0.15 mm, thereby increasing the height h1 of the shoulder of the crimping terminal of the first optical cage and the height h2 of the shoulder of the crimping terminal of the second optical cage. Thus, the distance between the optical module A in the first optical cage and the optical module B in the second optical cage is increased, the ventilation between the bottom of the optical module A and the bottom of the optical module B is strengthened, and the heat dissipation of the bottom of the optical module A and the optical module B is achieved.

[0044] In an optional implementation, between the crimping plate of the first optical cage and the first surface of the PCB, a third heat sink is further included. The third heat sink is used to contact the optical module in the first optical cage through the second window of the first optical cage.

[0045] In the embodiments of the present application, by additionally arranging the third heat sink between the crimping plate of the first optical cage and the first surface of the PCB, the heat dissipation of the bottom of the optical module A in the first optical cage and the optical module B in the second optical cage is strengthened, and the bottom heat dissipation efficiency of the optical module can be improved.

[0046] In an optional implementation, between the crimping plate of the second optical cage and the second surface of the PCB, a fourth heat sink is further included. The fourth heat sink is used to contact the optical module in the second optical cage through the second window of the second optical cage.

[0047] In the embodiment of the present application, the fourth heat sink is additionally arranged between the crimping plate of the second optical cage and the second surface of the PCB, so that the heat dissipation of the bottom of the optical module A in the first optical cage and the optical module B in the second optical cage is strengthened, and the heat dissipation efficiency of the bottom of the optical module is improved.

[0048] In an optional implementation, a through hole is arranged on the third heat sink and the fourth heat sink. The through hole on the third heat sink and the fourth heat sink is used for passing the crimping terminal.

[0049] In the embodiment of the present application, the through hole on the third heat sink and the fourth heat sink can provide structural support for the crimping terminal, so as to further increase the shoulder height of the crimping terminal and improve the heat dissipation effect of the bottom of the optical module.

[0050] In a second aspect, the embodiment of the present application provides an interface plate, which comprises the heat dissipation structure of the first aspect or any implementation manner of the first aspect.

[0051] In a third aspect, the embodiment of the present application provides a communication device, which comprises one or more interface plates. The interface plate is the interface plate of the second aspect.

[0052] Optionally, the communication device can be a switch, a router, an optical communication device, a data center server, a data center switch, etc. BRIEF DESCRIPTION OF DRAWINGS

[0053] FIG. 1 is a schematic diagram of the connection relationship between the optical module and the PCB provided by the present application;

[0054] FIG. 2 is a schematic diagram of a structure of a heat dissipation structure provided by the embodiment of the present application;

[0055] FIG. 3 is a schematic diagram of a cross-sectional structure of a heat dissipation structure provided by the embodiment of the present application;

[0056] FIG. 4 is a schematic diagram of a structure of a heat dissipation structure comprising a first fastener and a first heat sink provided by the embodiment of the present application;

[0057] FIG. 5 is a schematic diagram of a structure of a first heat sink provided by the embodiment of the present application;

[0058] FIG. 6 is a schematic diagram of a structure of a first fastening structure provided by the embodiment of the present application;

[0059] FIG. 7 is a schematic diagram of a cross-sectional structure of a heat dissipation structure comprising a first fastener and a first heat sink provided by the embodiment of the present application;

[0060] FIG. 8 is a schematic diagram of a structure of a heat dissipation structure comprising a second fastener and a second heat sink provided by the embodiment of the present application;

[0061] FIG. 9 is a structural schematic diagram of a second heat sink provided by an embodiment of the present application;

[0062] FIG. 10 is an exploded view of a double-sided compression heat dissipation structure provided by an embodiment of the present application;

[0063] FIG. 11 is a schematic diagram of the positional relationship between a first optical cage compression plate and a second optical cage compression plate provided by an embodiment of the present application;

[0064] FIG. 12 is a schematic diagram of the positional relationship between a second buckle structure and a second through hole provided by an embodiment of the present application;

[0065] FIG. 13 is a schematic diagram of a cross-sectional structure of a double-sided compression heat dissipation structure provided by an embodiment of the present application;

[0066] FIG. 14 is a schematic diagram of a cross-sectional structure of a heat dissipation structure including a compression terminal provided by an embodiment of the present application;

[0067] FIG. 15 is a schematic diagram of a structure of a compression terminal provided by an embodiment of the present application. DETAILED DESCRIPTION

[0068] The embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art can know that, as technology develops and new scenarios appear, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0069] The terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, and this is merely a distinguishing way used in the description of the embodiments of the present application to describe the objects with the same attributes. "And / or", which describes the association relationship between the associated objects, indicates that there can be three relationships, for example, A and / or B, which can represent the following three cases: A exists alone, A and B exist together, and B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it.

[0070] An optical module is an optoelectronic device used to realize photoelectric conversion and electro-optical conversion, and is widely used in the fields of AI, data centers, optical communication, etc. As shown in FIG. 1, in actual use, the optical module is inserted into an optical cage, and electrical connection with a PCB is realized through the connector of the optical cage, so as to interact with the electrical signal of the PCB. Among them, the optical cage is fixed on the PCB, and the optical module is pluggable to the optical cage, so as to realize replacement of the optical module.

[0071] During the use of the optical module, the optical module will generate heat, and therefore the optical module needs to be cooled. The cooling of the optical module is usually achieved through the cooling structure on the optical cage (for example, fixing cooling teeth, cold plates, etc. on the optical cage). The cooling structure of the optical cage is roughly divided into two types: the structure for cooling the top of the optical module (i.e. the face of the optical module away from the PCB), and the structure for cooling the bottom of the optical module (i.e. the face of the optical module close to the PCB).

[0072] Different optical modules have different structural designs. Some optical modules generate more heat at the bottom (i.e. the face of the optical module close to the PCB), and some optical modules generate more heat at the top (i.e. the face of the optical module away from the PCB). The current cooling structure of the optical cage is relatively fixed. If it is set to cool the face of the optical module close to the PCB, it cannot guarantee the cooling effect of the face of the optical module away from the PCB, and vice versa.

[0073] Different types of optical modules can be inserted into the optical cage. When the optical modules inserted into the optical cage change, the cooling demand (main heat generating part) also changes. The optical cage with fixed cooling structure cannot meet the cooling demand of different optical modules.

[0074] In order to improve the flexibility of the cooling structure of the optical cage, so that the optical cage can match different types of optical modules (optical modules with different heat generating parts), the present application provides a cooling structure, an interface plate and a communication device. The present application realizes flexible adjustment of the cooling surface of the optical cage by opening windows on the top, bottom and PCB of the optical cage, and setting a buckling structure on the top of the optical cage, so as to meet the cooling demand of optical modules of different heat generating types (top heat or bottom heat).

[0075] Fig. 2 is a structural schematic diagram of the cooling structure provided by the present application. As shown in Fig. 2, the cooling structure 2000 includes a first optical cage 2100 and a printed circuit board (PCB) 2200.

[0076] Fig. 3 is a cross-sectional structural schematic diagram of Fig. 2. As shown in Fig. 3, the first optical cage 2100 includes a plug-in cavity 2110, and a crimping plate 2120, a top plate 2130 and a side plate 2140 surrounding the plug-in cavity 2110. The plug-in cavity 2110 is used for inserting an optical module.

[0077] The top plate 2130 includes a first window 2131. The first window 2131 is in the area where the top plate 2130 contacts the optical module. The outer wall of the top plate 2130 (i.e. the face away from the optical module and the PCB 2200) further includes a first buckling structure 2132. The first buckling structure 2132 is used to fix a first heat sink 2400 on the outer wall of the top plate 2130. For example, as shown in Figs. 2 and 3, the first buckling structure 2132 fixes the first heat sink 2400 on the outer wall of the top plate 2130 by fixing a first fastener 2300.

[0078] The first heat sink 2400 is used to extend into the first window 2131 to contact the top of the optical module (i.e. the face of the optical module away from the PCB 2200), thereby achieving heat dissipation for the top of the optical module.

[0079] The crimping plate 2120 is used to be crimped with the first surface of the PCB 2200. The crimping plate 2120 comprises a second window 2121. The second window 2121 is in the area where the crimping plate 2120 contacts the optical module.

[0080] Optionally, the second window 2121 is used for the second heat sink to extend into, and the second heat sink contacts the bottom of the optical module (i.e. the face of the optical module towards the PCB 2200), thereby achieving heat dissipation for the bottom of the optical module.

[0081] In the embodiments of the present application, the first window 2131 provides space for heat dissipation for the top of the optical module, and the second window 2121 provides space for heat dissipation for the bottom of the optical module. If it is determined that the optical module inserted into the insertion cavity 2110 is an optical module with serious heat generation at the top, the first heat sink 2400 can be fixed on the top of the first optical cage 2100 through the first clamping structure 2132, so that the first heat sink 2400 extends into the first window 2131 to contact the top of the optical module, thereby achieving heat dissipation for the top of the optical module. If it is determined that the optical module inserted into the insertion cavity 2110 is an optical module with serious heat generation at the bottom, a second heat sink can be fixed at the bottom of the first optical cage 2100, and the second heat sink extends into the second window 2121 to achieve heat dissipation for the bottom of the optical module. This structure can be flexibly adapted to different types of optical modules (optical modules with different heat generation positions).

[0082] In the heat dissipation structure 2000 provided in the embodiments of the present application, the first window 2131 of the first optical cage 2100 is used to achieve heat dissipation for the top of the optical module, and the second window 2121 is used to achieve heat dissipation for the bottom of the optical module. The structures for heat dissipation for the top of the optical module and for the bottom of the optical module will be described respectively.

[0083] I. Structure for heat dissipation for the top of the optical module.

[0084] The first clamping structure 2132 located on the top plate 2130 of the first optical cage 2100 is used to fix the first fastener 2300, and the first heat sink 2400 is fixed on the outer wall of the top plate 2130 of the first optical cage 2100 through the first fastener 2300.

[0085] As shown in FIG. 5, the first heat sink 2400 comprises a heat dissipation face 2410 and a contact face 2420.

[0086] The contact surface 2420 comprises a first boss 2421. The first boss 2421 is used to extend into the first window 2131 of the first optical cage 2100, to realize contact with the optical module, so as to transfer the heat of the optical module to the heat dissipation surface 2410.

[0087] The heat dissipation surface 2410 comprises a metal heat dissipation surface 2411, which is used to realize heat dissipation of the optical module. The metal heat dissipation surface 2411 can be the heat dissipation tooth shown in FIG. 5, or can be a liquid cooling plate, a metal plate, etc., which are not limited in the present application.

[0088] The first fastener 2300 is in contact with the metal heat dissipation surface 2411, so as to fix the first heat sink 2400 on the outer wall of the top plate 2130 of the first optical cage 2100. As shown in FIG. 4, the first fastener 2300 is made of elastic material, and the first surface of the first fastener 2300 is a flat surface when not assembled. The first surface of the first fastener 2300 comprises a plurality of through holes A, and the first fastening structure 2132 can pass through the through holes A.

[0089] As shown in FIG. 6, the first fastening structure 2132 comprises a first connecting unit and a first fastening arm. The first connecting unit is used to connect the outer wall of the top plate 2130 and the first fastening arm. The first fastening arm comprises an opening facing the outer wall of the top plate 2130. Optionally, the first fastening structure 2132 can be a hook-shaped structure as shown in FIG. 6a and FIG. 6b, or can be a T-shaped structure as shown in FIG. 6c, or can be an L-shaped, S-shaped structure, etc., which are not limited in the present application.

[0090] The first surface of the first fastener 2300 is pressed on the metal heat dissipation surface 2411. As shown in FIG. 7, after the first fastening structure 2132 (for example, a hook-shaped structure in FIG. 7) passes through the through holes A, the first surface near the through holes A is buckled on the outer wall of the top plate 2130 by the first fastening arm of the first fastening structure 2132, resulting in that the position where the through holes A are located is concave (as shown in FIG. 4), and the first surface is pulled tight. Therefore, the first surface of the first fastener 2300 can provide a pressure to the first heat sink 2400 in the direction of the first optical cage 2100, so as to make the first heat sink 2400 tightly contact with the top of the optical module in the first optical cage 2100, and ensure the heat dissipation effect of the top of the optical module.

[0091] Optionally, the first fastener 2300 can further comprise a second surface and a third surface. The second surface and the third surface of the first fastener 2300 are used to fix with the side plate 2140 of the first optical cage. As shown in FIG. 4, the second surface and the third surface of the first fastener 2300 can comprise through holes B, which are used to cooperate with the side plate fastening structure on the side plate 2140 of the first optical cage 2100. The shape of the side plate fastening structure is described above in the description of the shape of the first fastening structure 2132, which is not repeated here.

[0092] It is worth noting that if the top of the optical module inserted into the first optical cage 2100 is slightly heated, the heat dissipation structure 2000 can also not include the first fastener 2300 and the first heat sink 2400. The heat conduction between the optical module and the air outside the first insertion cavity 2110 is realized through the first window 2131, and the ventilation and heat dissipation of the optical module are realized. In the case of slight heating at the top of the optical module, ventilation and heat dissipation can also meet the heat dissipation requirements of the top of the optical module.

[0093] In the embodiment of the present application, the first window 2131 and the first buckle structure 2132 on the top plate 2130 of the first optical cage 2100 realize the close contact between the optical module and the first heat sink 2400, thereby realizing the heat dissipation of the top of the optical module, which is suitable for optical modules with serious top heating.

[0094] II. Structure for dissipating heat from the bottom of the optical module.

[0095] In the embodiment of the present application, the heat dissipation of the bottom of the optical module can be realized through the second window 2121 on the pressing plate 2120. As shown in FIG. 8, the PCB 2200 includes a third window 2210 corresponding to the second window 2121, and the third window 2210 and the second window 2121 include an overlapping area. After the first optical cage 2100 and the PCB 2200 are assembled, the third window 2210 and the second window 2121 partially overlap or fully overlap.

[0096] The outer wall of the pressing plate 2120 of the first optical cage 2100 (i.e. the surface of the pressing plate 2120 close to the optical module and the PCB 2200) also includes a second buckle structure 2122. The heat dissipation structure 2000 also includes a second fastener 2500 and a second heat sink 2600. The second buckle structure 2122 is used to fix the second heat sink 2600 on the second surface of the PCB 2200. For example, as shown in FIG. 8, the second buckle structure 2122 fixes the second heat sink 2600 on the second surface of the PCB 2200 by fixing the second fastener 2500.

[0097] The second heat sink 2600 is used to extend into the third window 2210 on the PCB 2200 and the second window 2121 on the pressing plate 2120 (of the first optical cage 2100), to realize contact with the bottom of the optical module (i.e. the surface of the optical module close to the PCB 2200) in the first optical cage 2100, thereby realizing the heat dissipation of the bottom of the optical module.

[0098] As shown in FIG. 9, the second heat sink 2600 includes a second boss 2610 and a heat dissipation surface 2620. The second boss 2610 is used to extend into the third opening window 2210 on the PCB 2200 and the second opening window 2121 on the crimping plate 2120 (of the first optical cage 2100), so as to contact the optical module in the first optical cage 2100, thereby transferring the heat of the optical module to the heat dissipation surface 2620.

[0099] The heat dissipation surface 2620 is used to dissipate the heat of the optical module. The heat dissipation surface 2620 can be a liquid cooling plate as shown in FIG. 9, or can be a heat dissipation fin, a metal plate, etc., which are not limited in the present application.

[0100] In the embodiments of the present application, the second boss 2610 of the second heat sink 2600 needs to be in contact with the optical module, and the optical module can be frequently plugged in and unplugged. Therefore, the second boss 2610 can be an alloy material, which has wear-resistant properties and can ensure the stability of the structure of the second boss 2610 and the heat dissipation effect under the premise of frequent plugging and unplugging of the optical module. If the second heat sink 2600 is a liquid cooling plate, it can prevent the liquid cooling plate from leaking after the second boss 2610 is worn out; if the heat dissipation surface 2620 is a heat dissipation fin / metal plate, it can prevent the second boss 2610 (a boss made of an alloy material for heat conduction of the heat dissipation fin / metal plate) from being worn out and not in close contact with the optical module.

[0101] Similarly, the first boss 2421 of the first heat sink 2400 in the embodiment shown in FIG. 5 can also be an alloy material, which will not be described here. Alternatively, the first boss 2421 and the second boss 2610 can also be wear-resistant materials other than alloy materials, such as metal materials, polymer materials, etc., which are not limited in the present application.

[0102] The PCB 2200 includes a first through hole 2220, and the second clamping structure 2122 of the first optical cage 2100 is used to pass through the first through hole 2220 on the PCB 2200 to fix the second clasp 2500, and the second clasp 2500 fixes the second heat sink 2600 on the second surface of the PCB 2200.

[0103] The second clasp 2500 is in contact with the heat dissipation surface 2620 of the second heat sink 2600, thereby fixing the second heat sink 2600 on the second surface of the PCB 2200. As shown in FIG. 8, the second clasp 2500 is made of an elastic material, and the fourth surface of the second clasp 2500 is a flat surface when not assembled. The fourth surface of the second clasp 2500 includes a plurality of through holes C, and the second clamping structure 2122 can pass into the through holes C.

[0104] The second buckling structure 2122 comprises a second connecting unit and a second buckling arm. The second connecting unit is used to connect the outer wall of the crimping plate 2120 and the second buckling arm. The second buckling arm comprises an opening facing the outer wall of the crimping plate 2120. The shape of the second buckling structure 2122 is described in the description of the first buckling structure 2132 in the embodiment of FIG. 6, which is not repeated here.

[0105] The fourth surface of the second buckle 2500 is pressed on the heat dissipation surface 2620 of the second heat sink 2600. As shown in FIG. 8, after the second buckling structure 2122 (for example, the shape of hook 2 in FIG. 8) passes through the first through hole 2220 of the PCB 2200 and the through hole C of the second buckle 2500, the fourth surface near the through hole C is buckled on the second surface of the PCB 2200 by the second buckling arm of the second buckling structure 2122, causing the position where the through hole C is located to be concave (as shown in FIG. 8) and the fourth surface to be tightened. Therefore, the fourth surface of the second buckle 2500 can provide a pressure to the second heat sink 2600 in the direction of the PCB 2200 (also in the direction of the optical module), so that the second heat sink 2600 is tightly attached to the bottom of the optical module in the first optical cage 2100, ensuring the heat dissipation effect of the bottom of the optical module.

[0106] Since the second heat sink 2600 is fixed on the second surface of the PCB 2200, in order to facilitate the fixation of the second heat sink 2600, the second buckling structure 2600 should protrude from the second surface of the PCB 2200. Therefore, as shown in FIG. 9, the height H of the second buckling structure 2122 is greater than the wall thickness d of the PCB 2200.

[0107] The first optical cage 2100 is usually crimped on the first surface of the PCB 2200 by a crimping terminal. It is worth noting that since the crimping terminal itself has a certain shoulder height (the shoulder of the crimping terminal is described in the description of the embodiments shown in FIG. 14 and FIG. 15 below), the outer wall of the crimping plate 2120 of the first optical cage 2100 is not attached to the first surface of the PCB 2200, and the outer wall of the crimping plate 2120 is usually separated from the first surface of the PCB 2200 by a height h of the shoulder of the crimping terminal. In order to make the second buckling structure 2600 protrude from the second surface of the PCB 2200, the height H of the second buckling structure 2122 is greater than d+h.

[0108] It is worth noting that if the bottom of the optical module inserted into the first optical cage 2100 generates relatively slight heat, the heat dissipation structure 2000 can also not include the second buckle 2500 and the second heat sink 2600. The heat conduction between the optical module and the air outside the plug-in cavity 2110 is realized through the second window 2121 and the third window 2210, and the ventilation heat dissipation of the optical module is realized. In the case of slight heat generation at the bottom of the optical module, ventilation heat dissipation can also meet the heat dissipation needs of the optical module.

[0109] In the embodiment of the present application, the second window 2121 on the crimping plate 2120 of the first optical cage 2100, the third window 2210 on the PCB 2200, and the second buckling structure 2122 on the crimping plate 2120 are used to realize the close contact between the optical module and the second heat sink 2600, thereby realizing the heat dissipation of the bottom of the optical module, which is suitable for the optical module with serious bottom heat.

[0110] In the embodiment of the present application, the second surface of the PCB 2200 can also not fix the second heat sink, but crimp the second optical cage to realize the double-sided pressing of the PCB 2200. The double-sided pressing can improve the integration of the optical module.

[0111] III. Structure of double-sided pressing to improve integration of optical module

[0112] The double-sided pressing is performed on the PCB 2200, so that the second surface of the PCB 2200 is not fixed with the second heat sink 2600, but is crimped with the second optical cage. As shown in FIG. 10, the heat dissipation structure 2000 further includes a second optical cage 2700, which has the same structure as the first optical cage 2100.

[0113] As shown in FIGS. 10 and 11, in order to distinguish the first optical cage 2100 and the second optical cage 2700, the first optical cage is referred to as the first optical cage 2100-A, and the devices (or the devices included in the first optical cage 2100-A) in contact with the first optical cage 2100-A are suffixed with “-A”. Similarly, the second optical cage 2700 is referred to as the second optical cage 2700-B, and the devices (or the devices included in the second optical cage 2700-B) in contact with the second optical cage 2700-B are suffixed with “-B”.

[0114] The crimping plate 2120-B of the second optical cage 2700-B is crimped with the second surface of the PCB 2200, and the insertion cavity 2110 of the second optical cage 2700-B is oriented in the same direction as the insertion cavity 2110 of the first optical cage 2100-A.

[0115] The second optical cage 2700-B has the same structure as the first optical cage 2100-A. The crimping mode of the second optical cage 2700-B with the second surface of the PCB 2200 can refer to the crimping mode of the first optical cage 2100-A with the first surface of the PCB 2200. As described in the embodiment of FIG. 8, the first optical cage 2100-A is crimped on the first surface of the PCB 2200, and the second buckling structure 2122-A of the first optical cage 2100-A will pass through the PCB 2200. Therefore, the first through hole 2220-A is provided on the PCB 2200 for the second buckling structure 2122-A of the first optical cage 2100-A to pass through.

[0116] Similarly, the second fastening structure 2122-B of the second optical cage 2700-B also passes through the PCB 2200. Therefore, a first through hole 2220-B should be provided on the PCB 2200 for the second fastening structure 2122-B of the second optical cage 2700-B to pass through.

[0117] As shown in FIGS. 11 and 12, in the process of fitting, the first optical cage 2100-A moves downward to press against the PCB 2200, and the second optical cage 2700-B moves upward to press against the PCB 2200.

[0118] As shown in FIG. 12, the press plate 2120-A of the first optical cage 2100-A includes a plurality of second fastening structures 2122-A. The four dashed lines on the press plate 2120-A are the positions of the second fastening structures 2122-A and the second through holes 2123-A. The bold dotted line (axis) is the axis of symmetry of the four dashed lines.

[0119] FIG. 12 includes four second fastening structures 2122-A, which are respectively on the first and third dashed lines from left to right. The press plate 2120-A, the PCB 2200, and the press plate 2120-B each include four dashed lines, and the four dashed lines of the press plate 2120-A, the PCB 2200, and the press plate 2120-B correspond to each other and coincide in the vertical direction.

[0120] In order to accommodate the four second fastening structures 2122-A of the first optical cage 2100, the PCB 2200 includes four first through holes 2220-A, and the press plate 2120-B of the second optical cage 2700-B also includes four second through holes 2123-B. In the process of moving the first optical cage 2100 downward to press against the PCB 2200, the four second fastening structures 2122-A will pass through the four first through holes 2220-A on the PCB 2200 and the four second through holes 2123-B on the second optical cage 2700-B in turn.

[0121] As shown in FIG. 12, the press plate 2120-B of the second optical cage 2700-B includes four second fastening structures 2122-B. The four second fastening structures 2122-B are respectively on the second and fourth dashed lines from left to right.

[0122] Similarly, in order to accommodate the four second buckling structures 2122-B of the second optical cage 2700-B, the PCB 2200 includes four first through holes 2220-B, and the crimping plate 2120-A of the first optical cage 2700-A further includes four second through holes 2123-A. During the process of moving upward to be crimped with the PCB 2200, the four second buckling structures 2122-B will pass through the four first through holes 2220-B on the PCB 2200 and the four second through holes 2123-A on the first optical cage 2100-A in turn.

[0123] Since the second buckling structure 2122-A and the second buckling structure 2122-B will both pass through the PCB 2200, if the second buckling structure 2122-A and the second buckling structure 2122-B coincide in the vertical direction, it will cause structural interference. In order to ensure that the second buckling structure 2122-A of the first optical cage 2100-A does not interfere with the second buckling structure 2122-B of the second optical cage 2700-B when double-sided crimping, the positions of the second buckling structure 2122-A and the second through hole 2123-A on the first optical cage 2100-A need to be limited.

[0124] As shown in FIG. 11, in the case of double-sided crimping of the optical cage on the PCB 2200, it is equivalent to crimping the first optical cage 2100-A on the second surface of the PCB 2200 after being flipped by 180°. The crimping plate 2120-B is equivalent to mirror flipping the crimping plate 2120-A along the axis. In the embodiments of the present application, the axis is defined as the center axis of the positions of the plurality of second buckling structures 2122-A and the plurality of second through holes 2123-A on the crimping plate 2120-A of the first optical cage 2100-A. And the axis is parallel to the direction of inserting the optical module into the insertion cavity 2110.

[0125] Therefore, the dotted line position (for example, the first dotted line from left to right on the crimping plate 2120-A in FIG. 12) where the second buckling structure 2122-A on the crimping plate 2120-A is located is axis-symmetric along the axis, that is, the dotted line position (the fourth dotted line from left to right) where the second buckling structure 2122-B on the crimping plate 2120-B is located. In the vertical direction, the fourth dotted line where the second buckling structure 2122-B is located corresponds to the fourth dotted line on the crimping plate 2120-A, and the second through hole 2123-A should be arranged on this dotted line for the second buckling structure 2122-B to pass through.

[0126] Therefore, on the crimping plate of the first optical cage 2100-A, the positional relationship between the second buckling structure 2122-A and the second through hole 2123-A should be that the positions of the plurality of second through holes 2123-A and the positions of the plurality of second buckling structures 2122-A are axis-symmetric along the axis.

[0127] It is worth noting that since the second buckle structure 2122-A arranged on the axis will inevitably cause the structural interference between the second buckle structure 2122-A and the second buckle structure 2122-B, the plurality of second through holes 2123-A and the plurality of second buckle structures 2122-A are distributed on both sides of the axis.

[0128] Optionally, in the embodiment shown in FIG. 8, in order to ensure the stability of the position of the second heat sink 2600, a plurality of rows of second buckle structures 2122 are arranged in the axis direction. Correspondingly, in the embodiments shown in FIGS. 10-12, the axis direction includes a plurality of rows of second buckle structures 2122-A. As shown in FIGS. 10-12, the second buckle structure 2122-A is two rows.

[0129] In the embodiments of the present application, the plurality of rows of second buckle structures 2122 can prevent the second heat sink 2600 from rotating or displacing, thereby ensuring the stability of the position of the second heat sink 2600, ensuring the close contact of the second heat sink 2600 with the bottom of the optical module, and ensuring the heat dissipation effect of the bottom of the optical module.

[0130] Optionally, the number of second through holes 2123-A on the press plate 2120-A is greater than or equal to the number of second buckle structures 2122-A. So that all the second buckle structures 2122-B can be accommodated by the second through holes 2123-A, improving the stability of the structure.

[0131] Since the second optical cage 2700-B has the same structure as the first optical cage 2100-A, the positional relationship between the second buckle structure 2122-B and the second through hole 2123-B on the second optical cage 2700-B is referred to the first optical cage 2100-A, which will not be repeated here.

[0132] In the embodiments of the present application, the double-sided pressing scheme can press the optical cage on both surfaces of the PCB 2200, which can increase the number of optical modules connected by the PCB 2200, thereby improving the integration of the optical modules.

[0133] Four, the heat dissipation structure of the double-sided pressing scheme lifting the press plate.

[0134] In the double-sided pressing scheme, both surfaces of the PCB 2200 are pressed against the optical cages, and the bottoms of the optical modules in the two optical cages are not ventilated. As shown in FIG. 13, the optical module A in the first optical cage 2100-A and the optical module B in the second optical cage 2700-B are separated by the second window 2121-A of the first optical cage 2100-A, the first gap between the pressing plate 2120-A and the first surface of the PCB 2200, the third window 2210 of the PCB 2200, the second gap between the second surface of the PCB 2200 and the pressing plate 2120-B, and the second window 2121-B of the second optical cage 2700-B. Between the optical module A and the optical module B, there are windows or gaps, so that the bottom of the optical module A (the face towards the PCB 2200, which is the lower surface of the optical module A in the figure) and the bottom of the optical module B (the face towards the PCB 2200, which is the upper surface of the optical module B in the figure) are separated by a distance. If the distance is increased, the distance between the optical module A and the optical module B can be increased, and the bottoms of the optical module A and the optical module B can be ventilated and cooled.

[0135] As shown in FIG. 14, the pressing terminal 2124-A of the first optical cage 2100-A is inserted into the pressing hole of the PCB 2200 from the first surface of the PCB 2200 (the upper surface of the PCB 2200 in FIG. 14), so as to press the first optical cage 2100-A against the PCB 2200. The pressing terminal 2124-B of the second optical cage 2700-B is inserted into the pressing hole of the PCB 2200 from the second surface of the PCB 2200 (the lower surface of the PCB 2200 in FIG. 14), so as to press the second optical cage 2700-B against the PCB 2200.

[0136] In FIG. 14, the thickness a1 of the pressing plate 2120-A is the height of the second window 2121-A in FIG. 13; the shoulder height h1 of the pressing terminal 2124-A is the height of the first gap in FIG. 13; the wall thickness d of the PCB 2200 is the height of the third window 2210 in FIG. 13; the shoulder height h2 of the pressing terminal 2124-B is the height of the second gap in FIG. 13; and the thickness a2 of the pressing plate 2120-B is the height of the second window 2121-B in FIG. 13.

[0137] If the shoulder height h1 of the pressing terminal 2124-A is increased, the height of the first gap can be increased; if the shoulder height h2 of the pressing terminal 2124-B is increased, the height of the second gap can be increased; and thus the distance between the optical module A and the optical module B can be increased.

[0138] The structure of the crimping terminal 2124 on the crimping plate 2120 is shown in FIG. 15. The crimping terminal includes a crimping head and a shoulder. The crimping head is used to be inserted into the crimping hole of the PCB 2200 to achieve crimping, and the shoulder is used to connect the crimping head and the outer wall of the crimping plate 2120.

[0139] In the embodiment of the present application, the height d of the shoulder of the crimping terminal 2124 protruding from the outer wall of the crimping plate 2120 is greater than or equal to 0.15 mm, thereby increasing the shoulder height h1 of the crimping terminal 2124-A and the shoulder height h2 of the crimping terminal 2124-B. The distance between the optical module A and the optical module B is increased, and the ventilation between the bottom of the optical module A and the bottom of the optical module B is strengthened, thereby achieving heat dissipation of the bottom of the optical module A and the bottom of the optical module B.

[0140] Optionally, in order to further strengthen the heat dissipation of the bottom of the optical module A and the bottom of the optical module B, a third heat sink is additionally arranged between the crimping plate 2120-A of the first optical cage 2100-A and the first surface of the PCB 2200. The third heat sink is used to contact the optical module A in the first optical cage 2100-A through the second window 2121-A, thereby achieving heat dissipation of the optical module A. A fourth heat sink is additionally arranged between the crimping plate 2120-B of the second optical cage 2700-B and the second surface of the PCB 2200. The fourth heat sink is used to contact the optical module B in the second optical cage 2700-B through the second window 2121-B, thereby achieving heat dissipation of the optical module B.

[0141] Optionally, a through hole can also be arranged on the third heat sink and the fourth heat sink. The through hole on the third heat sink and the fourth heat sink is used for the crimping terminal 2124 to pass through. The through hole on the third heat sink and the fourth heat sink can provide structural support for the crimping terminal 2124, thereby further increasing the shoulder height of the crimping terminal 2124 and improving the heat dissipation effect of the bottom of the optical module.

[0142] Optionally, the crimping terminal 2124 can also be made of high-strength material, and / or the thickness and structural strength of the crimping terminal 2124 can be increased, so as to increase the shoulder height of the crimping terminal 2124 and improve the heat dissipation effect of the bottom of the optical module.

[0143] The embodiment of the present application also provides an interface plate, which includes the heat dissipation structure 2000 in any of the foregoing embodiments.

[0144] In an optional implementation, the heat dissipation structure 2000 in the interface plate includes the PCB 2200, the first optical cage 2100, the first fastener 2300, and the first heat sink 2400. This structure can achieve heat dissipation of the top of the optical module. For corresponding structures, refer to FIGS. 2 and 3.

[0145] In an optional implementation, the heat dissipation structure 2000 in the interface board includes not only the PCB 2200, the first optical cage 2100, the first fastener 2300 and the first heat sink 2400, but also the second fastener 2500 and the second heat sink 2600. This structure can realize heat dissipation on the top and bottom of the optical module. For the corresponding structure, please refer to FIG. 8.

[0146] In an optional implementation, the heat dissipation structure 2000 in the interface board includes not only the PCB 2200, the first optical cage 2100, the first fastener 2300 and the first heat sink 2400, but also the second optical cage 2700, the first heat sink 2400-B and the first fastener 2300-B. This structure can realize double-sided pressing of the PCB 2200. For the corresponding structure, please refer to FIG. 10.

[0147] The interface board is also called an input / output (IO) board. Optionally, the interface board can be an interface board in a communication device such as an optical communication device, various switches applied to a campus scenario, a data center switch, a data center server, a router and the like.

[0148] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiments, which will not be described here.

[0149] In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic. The division of the units is only a logical function division. There can be another division manner in actual implementation, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or in other forms.

[0150] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., they can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0151] In addition, each function unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software function unit.

[0152] When the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the present application, essentially or in the form of a contribution to the prior art, or all or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes several instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

Claims

1. A heat dissipating structure, characterized by comprising: The first optical cage and a printed circuit board (PCB); The first optical cage comprises a crimping plate, a top plate and a side plate surrounding the plug-in cavity, the plug-in cavity being used for inserting an optical module; The top plate comprises a first window, the first window being in an area where the top plate contacts the optical module; An outer wall of the top plate comprises a first buckling structure, the first buckling structure being used for fixing a first heat sink on the outer wall of the top plate, the first heat sink being used for extending into the first window to contact the optical module; The crimping plate is crimped with a first surface of the PCB, the crimping plate comprises a second window, the second window being in an area where the crimping plate contacts the optical module.

2. The structure of claim 1, wherein The first heat sink and a first buckle are further included; The first buckling structure of the first optical cage is used for fixing the first buckle, the first buckle being used for fixing the first heat sink on the top plate of the first optical cage.

3. The structure of claim 2, wherein The first heat sink comprises a heat dissipation surface and a contact surface, the heat dissipation surface comprises a metal heat dissipation surface, and the contact surface comprises a first boss; The first boss is used for extending into the first window of the first optical cage to contact the optical module; The first buckle contacts the metal heat dissipation surface and is used for fixing the first heat sink on the outer wall of the top plate of the optical cage.

4. The structure of claim 3, wherein The metal heat dissipation surface comprises a heat dissipation tooth, a liquid cooling plate or a metal plate.

5. The structure of any one of claims 2 to 4, wherein, The first buckling structure comprises a first connecting unit and a first buckling arm; The first connecting unit is used for connecting the outer wall of the top plate and the first buckling arm; The first buckling arm comprises an opening facing the outer wall of the top plate.

6. The structure of any one of claims 1 to 5, wherein, The PCB further comprises a third window; The third window and the second window on the crimping plate of the first optical cage comprise an overlapping area.

7. The structure of claim 6, wherein The PCB comprises a first through hole, and an outer wall of the crimping plate comprises a second buckling structure; The second buckling structure is used for fixing a second heat sink on a second surface of the PCB through the first through hole, the second heat sink being used for extending into the third window on the PCB and the second window on the first optical cage to contact the optical module.

8. The structure of claim 7, wherein The number of the second buckling structures is at least two, and the crimping plate further comprises at least two second through holes; The at least two second through holes are used for accommodating at least two second buckling structures of a second optical cage, the second optical cage having the same structure as the first optical cage, and a crimping plate of the second optical cage being used for being crimped with the second surface of the PCB; On the crimping plate, positions of the at least two second through holes and positions of the at least two second buckling structures are axisymmetric along an axis, the axis being a central axis of the positions of the at least two second through holes and the at least two second buckling structures and being parallel to a direction in which the optical module is inserted into the plug-in cavity.

9. The structure of claim 8, wherein The at least two second through holes and the at least two second buckling structures are distributed on two sides of the axis.

10. The structure according to any one of claims 7 to 9, characterized in that, The at least two second buckling structures comprise at least two rows of buckling structures in a direction of the axis, and the at least two second through holes comprise at least two rows of second through holes in the direction of the axis.

11. The structure according to any one of claims 7 to 10, characterized in that The number of the second through holes is greater than or equal to the number of the second buckle structures.

12. The structure of any one of claims 7-11, wherein, The second buckle structure comprises a second connecting unit and a second buckle arm. The second connecting unit is used to connect the outer wall of the crimping plate and the second buckle arm. The second buckle arm comprises an opening facing the outer wall of the crimping plate.

13. The structure of any one of claims 7-12, wherein, The height of the second buckle structure is greater than the wall thickness of the PCB.

14. The structure of any one of claims 7 to 13, wherein, The second heat sink and a second buckle are further included. The second buckle structure on the first light cage is used to pass through the first through hole on the PCB to fix the second buckle. The second buckle is used to fix the second heat sink on the second surface of the PCB.

15. The structure of any one of claims 7 to 14, wherein, The second heat sink comprises a second boss, which is used to extend into the third window on the PCB and the second window on the first light cage to realize contact with the optical module in the first light cage.

16. The structure of any one of claims 3 to 15, wherein, The surface of the first boss or the second boss is an alloy material.

17. The structure of any one of claims 8-16, wherein, The second light cage is further included, and the structure of the second light cage is the same as that of the first light cage. The crimping plate of the second light cage is crimped with the second surface of the PCB, and the plug-in cavity of the second light cage faces the same direction as the plug-in cavity of the first light cage.

18. The structure of any one of claims 1-17, wherein, The PCB comprises a crimping hole, the outer wall of the crimping plate comprises a crimping terminal, and the crimping terminal comprises a crimping head and a shoulder. The crimping head is used to be inserted into the crimping hole of the PCB to realize crimping. The shoulder is used to connect the crimping head and the outer wall of the crimping plate, and the height d of the shoulder protruding from the outer wall of the crimping plate is greater than or equal to 0.15 mm.

19. The structure of claim 18, wherein A third heat sink is further included between the crimping plate of the first light cage and the first surface of the PCB, and the third heat sink is used to pass through the second window of the first light cage to contact the optical module in the first light cage.

20. The structure of claim 19, wherein A fourth heat sink is further included between the crimping plate of the second light cage and the second surface of the PCB, and the fourth heat sink is used to pass through the second window of the second light cage to contact the optical module in the second light cage.

21. An interface plate, characterized by The heat dissipation structure of any one of claims 1 to 20 is included.

22. A communications device, characterized by The interface plate of claim 21 is included.

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