Electronic device

Abstract

Provided in the present application is an electronic device. The electronic device comprises: a display screen, a protective structure and a frame. The display screen comprises a display module and a cover plate arranged on the light-exiting side of the display module. The protective structure surrounds the periphery of the display screen and does not cover the light-exiting surface of the cover plate, and the protective structure covers at least part of a non-display region of the display screen. The frame surrounds the periphery of the display screen. In the thickness direction of the electronic device, at least part of the protective structure overlaps the frame. When the electronic device is in an unfolded state, there is a first gap between the protective structure and the frame in the thickness direction of the frame, the width of the first gap decreasing when the electronic device moves from the unfolded state to a folded state.

Description

Electronic device

[0001] The present application claims priority from the Chinese patent application No. 202422251349.4 filed on September 12, 2024, and entitled "Electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the field of display devices, and in particular to an electronic device. BACKGROUND

[0003] With the continuous development of display technology, electronic devices (such as foldable mobile phones) have gradually become a development trend of future mobile electronic products. In the unfolded state, the terminal device can obtain a larger display area and improve the viewing effect. In the folded state, the terminal device can obtain a smaller volume, which is convenient for users to carry.

[0004] With the pursuit of the user for the light performance of the electronic device, how to thin the electronic device has become a problem to be solved at present.

[0005] Practical new type content

[0006] Embodiments of the present application provide an electronic device, which aims to reduce the thickness of the electronic device.

[0007] To achieve the above purpose, the technical scheme is adopted as follows.

[0008] In a first aspect, embodiments of the present application provide an electronic device. The electronic device includes a display screen, a cover plate, a protective structure, and a bezel. The display screen includes a display module and a cover plate disposed on the light-emitting side of the display module. The protective structure is arranged around the outer periphery of the cover plate and does not cover the light-emitting surface of the cover plate. The protective structure covers at least part of the non-display area of the display screen. The bezel is arranged around the outer periphery of the display screen. The protective structure overlaps the bezel. In the unfolded state, the electronic device has a first gap between the protective structure and the bezel in the thickness direction of the bezel.

[0009] Exemplarily, the light-emitting surface of the cover plate includes a light-emitting surface of the cover plate located in the non-display area and a light-emitting surface located in the display area.

[0010] The smaller the size of the protective structure protruding from the cover plate, the smaller the thickness of the electronic device. Since the protective structure does not cover the light-emitting surface of the cover plate, the protective structure does not need to protrude on the light-emitting side of the cover plate, and the size of the protective structure protruding from the cover plate can be zero or close to zero, which is beneficial to thinning the electronic device. During the movement of the electronic device from the unfolded state to the folded state, the protective structure moves towards the frame. Since there is a first gap between the protective structure and the frame in the unfolded state. The first gap provides space for the movement of the protective structure towards the frame, and also provides movement space for the display module, which is beneficial to release the stress of the display module and the cover plate during the folding process, and avoid stress concentration to damage the display module.

[0011] In combination with the first aspect, in some implementable manners, the protective structure surrounds the outer periphery of the cover plate.

[0012] In combination with the first aspect, in some implementable manners, the protective structure surrounds the outer periphery of the display module.

[0013] In combination with the first aspect, in some implementable manners, the protective structure surrounds the outer periphery of the cover plate and the outer periphery of the display module.

[0014] In combination with the first aspect, in some implementable manners, during the movement of the electronic device from the unfolded state to the folded state, the width of the first gap decreases. In this way, during the movement of the electronic device from the unfolded state to the folded state, the display module and the protective structure move towards the frame, and the width of the first gap decreases, so that the display module and the protective structure have space for movement.

[0015] In combination with the first aspect, in some implementable manners, the electronic device further includes a middle plate, the frame is connected to the outer periphery of the middle plate, and the display module is located between the middle plate and the cover plate; and the display module or the protective structure is bonded to the middle plate.

[0016] In this way, under the action of an external force, the bonded display module and the middle frame can move relatively, and during the movement of the electronic device from the unfolded state to the folded state, the display module and the protective structure can move relatively together with the middle plate. Similarly, under the action of an external force, the bonded protective structure and the middle frame can move relatively, and the display module and the protective structure can move relatively together with the middle plate.

[0017] In combination with the first aspect, in some implementable manners, the electronic device further includes a bonding member, and the display module or the protective structure is bonded to the middle plate through the bonding member. In this way, under the action of an external force, the deformation of the bonding member can cause the display module and the middle frame to move relatively.

[0018] With reference to the first aspect, in some possible implementation, the electronic device further includes a flexible circuit board, the display module includes a bending part located at the non-display area, the bending part is connected with the flexible circuit board; the protection structure includes a top cover and an encapsulation part connected with each other, the top cover surrounds the outer periphery of the cover plate; at least part of the bending part is embedded in the encapsulation part, and the first gap is located between the encapsulation part and the frame. In this way, the encapsulation part has a deformable property, and the part of the bending part embedded in the encapsulation part can avoid direct collision with the top cover and the frame. The first gap provides a movement space for the movement of the encapsulation part and the bending part.

[0019] With reference to the first aspect, in some possible implementation, the protection structure further includes a first support part, the first support part is connected with the top cover, the first support part is located between the encapsulation part and the frame, and the first gap is located between the first support part and the frame. In this way, the first support part can support the top cover, in addition, the first support part separates the first gap and the encapsulation part, so that the encapsulation part cannot make the first gap narrow after deformation. The movement of the protection structure relative to the frame is more smooth.

[0020] With reference to the first aspect, in some possible implementation, the first support part and the top cover are connected as an integral molding. In this way, the connection strength between the first support part and the top cover is higher. This is conducive to improving the strength of the protection structure.

[0021] With reference to the first aspect, in some possible implementation, the protection structure further includes a second support part, the second support part is connected with a side of the encapsulation part away from the top cover, and the second support part and the first support part are connected at ends away from the top cover. In this way, the first support part and the second support part support the encapsulation part together, so that the deformation of the encapsulation part does not cause the movement of the protection structure relative to the frame to be more smooth.

[0022] With reference to the first aspect, in some possible implementation, the encapsulation part and the top cover are connected as an integral molding. In this way, the connection strength between the first support part and the top cover is higher. This is conducive to improving the strength of the protection structure.

[0023] With reference to the first aspect, in some possible implementation, the material of the encapsulation part includes glue. In this way, the glue in the encapsulation part can be connected with the middle plate, and the electronic device can not be provided with an adhesive, thereby reducing the manufacturing cost of the electronic device and reducing the thickness of the electronic device.

[0024] With reference to the first aspect, in some possible implementation, the material of the encapsulation part includes light-sensitive glue or foam glue. The light-sensitive glue or foam glue can bond the middle plate, so that the encapsulation part and the middle plate are connected, and an additional adhesive does not need to be provided, thereby reducing the cost of the electronic device.

[0025] With reference to the first aspect, in some possible implementation, the electronic device further includes a surrounding frame connected with the bezel, the surrounding frame surrounds the outer periphery of the protection structure; and the electronic device is in the unfolded state, and the second gap is formed between the surrounding frame and the protection structure along the thickness direction of the bezel. In this way, the existence of the second gap prevents the surrounding frame from interfering with the movement of the protection structure relative to the bezel. Since the surrounding frame surrounds the outer periphery of the protection structure, the surrounding frame can shield at least part of the outer periphery of the protection structure, so that the shielded part is invisible, and the appearance of the electronic device is improved. In addition, the surrounding frame can block part of the external force from damaging the outer periphery of the protection structure.

[0026] With reference to the first aspect, in some possible implementation, the surrounding frame and the bezel are integrally formed. In this way, the connection strength between the surrounding frame and the bezel is higher, and the forming process of the surrounding frame and the bezel is simpler.

[0027] With reference to the first aspect, in some possible implementation, the display module includes a light-emitting layer and a support layer which are stacked, and the support layer is located at the back light-emitting surface of the light-emitting layer; and the bending part includes the light-emitting layer and the support layer located at the non-display area. In this way, the bending part occupies a smaller space, and the size of the encapsulation part used for embedding the bending part is also smaller, so that the thickness of the electronic device is reduced.

[0028] With reference to the first aspect, in some possible implementation, the electronic device further includes a polarizer located between the cover plate and the display module, and one end of the polarizer extends into the protection structure. Compared with the light-emitting surface of the polarizer covered by the protection structure, the light-emitting surface of the polarizer not covered by the protection structure is beneficial to save the installation space of the protection structure, and the thickness of the protection structure can be increased, so that the strength of the protection structure is improved. In addition, the light-emitting surface of the polarizer is not covered by the protection structure. The polarizer does not need to extend to the bending part, so that more space is provided for the protection structure.

[0029] With reference to the first aspect, in some possible implementation, the electronic device further includes a protective film covering the light-emitting surface of the cover plate, and the light-emitting surface of the protective film is not covered by the protection structure. In this way, the protective film does not occupy the installation space of the protection structure, and the thickness of the protection structure can be thicker. In addition, the protective film also has the function of protecting the cover plate.

[0030] With reference to the first aspect, in some possible implementation, when the electronic device is in the flattened state, the width of the first gap is 0.1 mm-1 mm. In this way, the first gap with the size can provide a larger space for the movement of the display module close to the bezel.

[0031] Secondly, embodiments of this application provide an electronic device. The electronic device includes a display module, a cover plate, a protective structure, and a frame. The cover plate is disposed on the light-emitting side of the display module; the protective structure surrounds the outer periphery of the cover plate but does not cover the light-emitting side of the cover plate, and is disposed on the light-emitting side of the display module; the frame surrounds the outer periphery of the display module, and the protective structure is connected to the frame; during the movement of the electronic device from a flattened state to a folded state, the protective structure bends. Thus, during the movement of the electronic device from a flattened state to a folded state, the display module and the cover plate move together close to the frame, and the force of the display module is transmitted to the protective structure, causing the protective structure to bend and release the internal stress of the display module. Since the protective structure does not cover the light-emitting surface of the cover plate, the protective structure does not need to protrude from the light-emitting side of the cover plate, and the dimension of the protective structure protruding from the cover plate can be zero or close to zero, which is beneficial for reducing the thickness of the electronic device. Attached Figure Description

[0032] Figure 1 is a schematic diagram of the structure of the electronic device in its flattened state.

[0033] Figure 2 is a schematic diagram of the structure of the electronic device in the folded state.

[0034] Figure 3 is a schematic diagram of the exploded structure of an electronic device.

[0035] Figure 4 is an enlarged schematic diagram of point A in Figure 1.

[0036] Figure 5 is a cross-sectional view of BB in Figure 1.

[0037] Figure 6 is a schematic diagram of a protective structure and a frame provided in an embodiment of this application.

[0038] Figure 7 is a schematic diagram of another protective structure and frame provided in an embodiment of this application.

[0039] Figure 8 is a schematic diagram of another protective structure and frame provided in an embodiment of this application.

[0040] Figure 9 is a schematic diagram of another protective structure and frame provided in an embodiment of this application.

[0041] Figure 10 is a schematic diagram of another protective structure and frame provided in an embodiment of this application.

[0042] In the figure: 10-electronic device; 210-first middle frame; 220-second middle frame; 230-rotation shaft; 100-display module; 110-protection structure; 111-top cover; 112-encapsulation part; 113-first support part; 114-second support part; 211-bezel; 20-printed circuit board; 15a, 15b-back shell; 101-cover plate; 102-bending part; 103-flexible circuit board; 104-chip; 105-enclosure; 212-middle plate; 213-adhesive; 011-first surface; 012-second surface; 002-first gap; 003-second gap; 004-third gap; 301-connecting layer; 302-supporting layer; 303-emitting layer; 304-optical adhesive layer; 305-polarizer; 201-protective film; 010-ink layer. DETAILED DESCRIPTION

[0043] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0044] Hereinafter, the terms "first", "second", and the like are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0045] In addition, in the present application, the orientation terms such as "up", "down", and the like are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0046] In the present application, an electronic device is provided, which is an electronic device. The electronic device can display a picture and can also be folded to change the size of the area of the electronic device. In the present application, the electronic device can be a product with a display interface, such as a mobile phone, a display, a tablet computer, a vehicle-mounted computer, etc. The embodiments of the present application are described taking a folding mobile phone as an example.

[0047] FIG. 1 is a structural schematic diagram of the electronic device 10 in an unfolded state. FIG. 2 is a structural schematic diagram of the electronic device 10 in a folded state. Referring to FIGS. 1 and 2, the electronic device 10 can be folded or unfolded, so as to change the size of the electronic device 10 according to actual needs and use scenarios. For example, when the screen needs to be watched, the electronic device 10 can be unfolded to the state shown in FIG. 1, and the display screen of the electronic device 10 is unfolded, so as to have a better screen watching. When the electronic device 10 needs to be stored, the electronic device 10 can be folded to the state shown in FIG. 2. For example, in the embodiment in which the electronic device 10 is a mobile phone, the state shown in FIG. 2 is convenient for the user to hold and answer or make a call, and improves the user experience.

[0048] It can be understood that the folded state of the electronic device 10 is not limited to the state shown in FIG. 2. The electronic device 10 can have multiple folded states, for example, the electronic device 10 can have multiple folded states between the unfolded state of FIG. 1 and the folded state of FIG. 2.

[0049] FIG. 3 is an exploded structural schematic diagram of the electronic device 10. Referring to FIG. 3, the electronic device 10 includes a first middle frame 210, a second middle frame 220, and a hinge 230, the first middle frame 210 and the hinge 230 are connected, and the second middle frame 220 and the hinge 230 are connected. The first middle frame 210 and the second middle frame 220 have the function of supporting the whole machine.

[0050] Exemplarily, the first middle frame 210 and the hinge 230 can be connected by bolts, buckles, glue layers, or welding layers, etc. Similarly, the second middle frame 220 and the hinge 230 can be connected by bolts, buckles, glue layers, or welding layers, etc. When the electronic device 10 is in the unfolded state, the first middle frame 210, the hinge 230, and the second middle frame 220 are arranged in sequence along the x direction. The hinge 230 can rotate around the y direction, in other words, the axis of the hinge 230 extends along the y direction.

[0051] For the convenience of description, the thickness direction of the electronic device 10 is defined as the z direction. Wherein, the x direction and the z direction are perpendicular, the x direction and the y direction are perpendicular, and the y direction and the z direction are perpendicular.

[0052] It can be understood that the x direction and the z direction being perpendicular is not limited to the included angle between the x direction and the z direction being 90°, and the existence of assembly error or manufacturing error can be allowed. Exemplarily, the included angle between the x direction and the z direction can be 85°-95°. For example, it can be 85°, 87°, 88°, 89°, 90°, 91°, 92°, 93°, or 95°, etc. The rest of the description about perpendicular in the text is the same.

[0053] The embodiment of the present application does not limit the structure of the rotation shaft 230. Exemplarily, the rotation shaft 230 includes a first door plate, a second door plate and a shaft body, and the first door plate, the second door plate and the shaft body are arranged along the x direction when the electronic device 10 is in the unfolded state. The first door plate and the shaft body are rotationally connected, for example, the first door plate and the shaft body are rotationally connected through an arc-shaped slot and a sliding block; or the first door plate and the shaft body are rotationally connected through a hinge. Similarly, the second door plate and the shaft body are rotationally connected, for example, the second door plate and the shaft body are rotationally connected through an arc-shaped slot and a sliding block; or the second door plate and the shaft body are rotationally connected through a hinge. The first middle frame 210 is connected with the first door plate, for example, by screwing or clamping. The second middle frame 220 is connected with the second door plate, for example, by screwing or clamping.

[0054] During the adjustment of the electronic device 10 between the folded state and the unfolded state, the included angle between the surface of the first middle frame 210 facing the display module 100 (as shown in FIG. 1) and the surface of the second middle frame 220 facing the display module 100 changes accordingly. When the electronic device 10 adjusts from the unfolded state to the folded state, the first middle frame 210 connected with the rotation shaft 230 and the second middle frame 220 connected with the rotation shaft 230 can rotate around the y direction, so that the included angle between the plane of the first middle frame 210 and the plane of the second middle frame 220 gradually decreases. When the electronic device 10 adjusts from the folded state to the unfolded state, the first middle frame 210 and the second middle frame 220 rotate around the y direction, so that the included angle between the plane of the first middle frame 210 and the plane of the second middle frame 220 gradually increases.

[0055] When the electronic device 10 is in the folded state, the included angle between the surface of the first middle frame 210 facing the display module 100 and the surface of the second middle frame 220 facing the display module 100 can be -10°-10°, for example, it can be ±10°, ±9°, ±8°, ±7°, ±6°, ±5°, ±4°, ±3°, ±2°, ±1° or 0°, etc. When the electronic device 10 is in the unfolded state, the included angle between the surface of the first middle frame 210 facing the display module 100 and the surface of the second middle frame 220 facing the display module 100 can be 170°-190°, for example, it can be 170°, 172°, 175°, 178°, 179°, 180°, 181°, 182°, 185°, 188° or 190°.

[0056] Exemplarily, the electronic device 10 can further include a printed circuit board (PCB) 20, and the printed circuit board 20 is electrically connected with the display module 100 (as shown in FIG. 1).

[0057] Exemplarily, the printed circuit board 20 can carry electronic components. In some embodiments, components such as input buttons, transmitters, processors, memories, batteries, charging circuits, system on chip (SoC) structures, and the like can be mounted on or connected to the printed circuit board 20.

[0058] In some embodiments, the electronic device 10 can further include a rear shell 15a (15b), also referred to as a rear cover. In FIG. 3, the printed circuit board 20 is located between the display module 100 and the rear shell 15a (15b). In FIG. 3, the electronic device 10 includes two rear shells, one of which, the rear shell 15a, is connected to the first middle frame 210 and stacked in the z direction. The other rear shell 15b is connected to the second middle frame 220 and stacked in the z direction.

[0059] Exemplarily, the electronic device 10 can further include a battery (not shown in the figures). The battery is disposed between the display module 100 and the rear shell 15a (15b), which is not limited in the present application.

[0060] Embodiments of the present application do not limit the folding type of the electronic device 10. In some embodiments, the electronic device 10 is an inner folding structure, that is, when the electronic device 10 is in a folded state, the display module 100 (as shown in FIG. 1) is located between the first middle frame 210 and the second middle frame 220. In other embodiments, the electronic device 10 is an outer folding structure, that is, when the electronic device 10 is in a folded state, the first middle frame 210 and the second middle frame 220 are both located between the two ends of the display module 100.

[0061] In the process of converting the electronic device 10 from a flat state to a folded state, the display module 100 is bent, and the edges of the display module 100 move in the x direction. Among them, the edges of the display module 100 move away from the bending area of the display module 100. In other words, the edges of the display module 100 will move relative to the first middle frame 210 and the second middle frame 220.

[0062] In embodiments of the present application, the electronic device 10 further includes a protection structure 110 for protecting the edges of the display module 100 to prevent the edges of the display module 100 from being damaged after being hit. Currently, the setting of the protection structure will cause the thickness of the electronic device to increase.

[0063] The electronic device 10 provided by the embodiments of the present application effectively solves the problem of the increase in the thickness of the electronic device 10 caused by the protection structure.

[0064] FIG. 4 is an enlarged view of A in FIG. 1. Referring to FIG. 4, the electronic device further includes a bezel 211 and a cover plate 101. The cover plate 101 is disposed at the light-out side of the display module 100. The cover plate 101 can protect the display module 100 from being scratched. Exemplarily, the cover plate 101 and the display module 100 can be regarded as a display screen. In other words, the display screen includes the cover plate 101 and the display module 100. The protection structure 110 surrounds the outer periphery of the display screen, and the protection structure 110 does not cover the light-out surface of the cover plate 101.

[0065] FIG. 5 is a cross-sectional view of B-B in FIG. 1. Referring to FIG. 5, the display module 100 includes a display area W and a non-display area E. The display area W is used to display images, and the light emitted by the display area W can enter the eyes of the user to be viewed. The non-display area E surrounds the outer periphery of the display area W. The non-display area E does not emit light or the light emitted by the non-display area E is blocked (for example, blocked by the ink layer 010 described below) and cannot enter the eyes of the user. The non-display area E is covered by the protection structure 110 of the display module 100.

[0066] The light-out surface of the aforementioned cover plate 101 includes the light-out surface of the cover plate located in the display area W and the light-out surface of the cover plate located in the non-display area E. In some embodiments, the light-out surface of the cover plate 101 can also be referred to as the appearance surface of the cover plate 101. Alternatively, the light-out surface of the cover plate 101 can also be referred to as: along the thickness direction of the electronic device, the surface of the cover plate 101 facing away from the display module 100.

[0067] Exemplarily, the cover plate 101 covers the display area W of the display module 100. The cover plate 101 can also cover part of the non-display area E. Exemplarily, the display module 100 further includes a bending portion 102. The bending portion 102 is located in the non-display area E.

[0068] The electronic device 10 further comprises a flexible printed board (FPC) 103, and the bending part 102 is connected with the flexible printed board 103. The flexible printed board 103 is configured to send an image signal to the display module 100, and the display module 100 displays an image after receiving the image signal. The frame 211 is arranged around the outer periphery of the display screen, and the protection structure 110 is overlapped on the frame 211. During the movement of the electronic device 10 from the unfolded state to the folded state, the display screen also moves from the unfolded state to the folded state. Since the area of the display screen close to the rotating shaft 230 (as shown in FIG. 3) is connected with the first middle frame 210, the relative movement distance of the area with respect to the first middle frame 210 is small or no relative movement. Since the display screen has a certain thickness along the z direction, the part of the display screen away from the first middle frame 210 (for example, the cover plate 101) moves relative to the first middle frame 210. The area of the cover plate 101 away from the rotating shaft 230 moves away from the rotating shaft 230, which pushes the protection structure 110 to move towards the frame 211. Conversely, during the movement of the electronic device 10 from the folded state to the unfolded state, the part of the display screen away from the first middle frame 210 (for example, the cover plate 101) moves relative to the first middle frame 210. The area of the cover plate 101 away from the rotating shaft 230 moves towards the rotating shaft 230, which makes the protection structure 110 move away from the frame 211.

[0069] Exemplarily, the flexible printed board 103 is electrically connected with the printed circuit board 20. The printed circuit board 20 is configured to send an electrical signal to the flexible printed board 103. In addition, the printed circuit board 20 can also support the flexible printed board 103.

[0070] The smaller the size of the protection structure 110 protruding from the cover plate 101, the smaller the thickness of the electronic device 10. Since the protection structure 110 does not cover the light-emitting surface of the cover plate 101, the protection structure 110 does not need to be protruding on the light-emitting side of the cover plate 101, in other words, the size of the protection structure 110 protruding from the cover plate 101 can be zero. During the movement of the electronic device 10 from the unfolded state to the folded state, the protection structure 110 moves towards the frame 211, and the movement of the protection structure 110 provides space for the display module 100 during folding and unfolding, releases the internal stress of the display module 100, and avoids stress concentration and damage.

[0071] Exemplarily, the cover plate 101 is a flexible cover plate. The material of the cover plate 101 can be, for example, a colorless polyimide (CPI) film, an ultra thin glass (UTG), an ultra flexible glass (UFG), or a polyethylene terephthalate (PET) film.

[0072] In some embodiments of the present application, the protective structure 110 can cover at least part of the surface of the cover plate 101 located in the non-display area E and facing away from the light-out surface. The surface of the cover plate 101 facing away from the light-out surface is the surface of the cover plate 101 facing the display module 100 in the thickness direction of the electronic device. In other words, the protective structure 110 can cover at least part of the surface of the cover plate 101 facing the display module 100 and located in the non-display area E. In some embodiments of the present application, the protective structure 110 does not cover the surface of the cover plate 101 facing away from the light-out surface.

[0073] In some embodiments of the present application, the surface of the protective structure 110 facing away from the frame 211 can be coplanar with the light-out surface of the cover plate 101. For example, when the electronic device 10 is in the unfolded state, the surface of the protective structure 110 facing away from the frame 211 is flush with the light-out surface of the cover plate 101. In this way, the surface of the electronic device 10 is smoother and more aesthetically pleasing.

[0074] In some embodiments, the surface of the protective structure 110 facing away from the frame 211 can protrude from the light-out surface of the cover plate 101. In other words, compared with the light-out surface of the cover plate 101, the distance between the surface of the protective structure 110 facing away from the frame 211 and the back cover 15a (as shown in FIG. 2) of the electronic device 10 is greater.

[0075] For example, the distance between the surface of the protective structure 110 facing away from the frame 211 and the light-out surface of the cover plate 101 can be 0.02 mm to 0.2 mm. The distance can be, for example, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.1 mm, 0.12 mm, 0.15 mm, or 0.2 mm, etc. In this way, the thickness of the protective structure 110 can be thicker, which is beneficial to improving the strength of the protective structure 110.

[0076] In some embodiments of the present application, the protective structure 110 is connected to the edge of the cover plate 101 by a glue layer, for example, the glue layer can be arranged at the position where S is located in FIG. 6, FIG. 7, FIG. 8 or FIG. 9. In this way, the gap between the protective structure 110 and the cover plate 101 is filled with the optical glue layer, which has the effect of dustproof and moisture-proof, avoiding impurities such as dust or moisture entering the electronic device 10. In addition, the optical glue layer makes the gap between the protective structure 110 and the cover plate 101 weak in visibility, which is beneficial to improve the aesthetic appearance of the electronic device 10. Exemplarily, the material of the glue layer connecting the edge of the protective structure 110 and the cover plate 101 can be photosensitive glue, pressure-sensitive glue or thermosetting glue.

[0077] In some embodiments of the present application, the protective structure 110 can not be connected to the edge of the cover plate 101 by a glue layer. For example, the protective structure 110 can have a gap between the edge of the cover plate 101.

[0078] In some embodiments of the present application, the electronic device 10 can further include a protective film 201 covering the light-out side of the cover plate 101. The protective structure 110 does not cover the light-out surface of the protective film 201. In other words, the protective film 201 does not occupy the mounting space of the protective structure 110, and the thickness of the protective structure 110 can be relatively thick. In addition, the protective film 201 also has the effect of protecting the cover plate 101.

[0079] The surface of the protective structure 110 away from the frame 211 can have the same relationship with the light-out surface of the cover plate 101 as described above. In some embodiments, the surface of the protective structure 110 away from the frame 211 can be flush with the light-out surface of the protective film 201. Alternatively, the surface of the protective structure 110 away from the frame 211 can protrude from the light-out surface of the protective film 201.

[0080] Alternatively, in some embodiments, the protective film 201 can cover part of the protective structure 110. For example, the protective film 201 overlaps the protective structure 110.

[0081] In some embodiments of the present application, the protective film 201 is not necessary, and the electronic device 10 can not be provided with the protective film 201.

[0082] In some embodiments of the present application, the electronic device 10 further includes a middle plate 212. The frame 211 is connected to the outer periphery of the middle plate 212. Exemplarily, the frame 211 is connected to the outer periphery of the middle plate 212 by a solder layer or a glue layer, or the frame 211 is connected to the middle plate 212 as an integral molded part.

[0083] The structure after the connection of the frame 211 and the middle plate 212 can be regarded as the first middle frame 210. It can be understood that the second middle frame 220 in FIG. 3 also includes a connected frame and middle plate, and the electronic device 10 includes two protective structures 110, one of which is lapped on the frame of the first middle frame 210, and the other is lapped on the frame of the second middle frame. The present application embodiment describes the connection relationship between one protective structure 110 and the frame of the first middle frame 210, and the other protective structure and the frame of the second middle frame can be obtained in the same way.

[0084] In some embodiments, the frame can also be regarded as the side wall of the rear shell 15a (15b). In some embodiments, the electronic device 10 can not have a middle plate 212, and in such embodiments, the rear shell 15a can be regarded as the middle plate 212 in the embodiment, which has the same function as the middle plate described in the present application embodiment. Exemplarily, the rear shell 15a and the side wall can be integrally formed, or the rear shell 15a and the side wall can also be two separate pieces.

[0085] In addition, the aforementioned "movement of the protective structure 110 towards the frame 211" refers to movement of the protective structure along the left side in the x direction shown in FIG. 1 to approach the frame in the first middle frame 210. Similarly, the other protective structure moves along the right side to approach the frame in the second middle frame 220.

[0086] The display module 100 is located between the middle plate 212 and the cover plate 101, and the protective structure 110 is bonded to the middle plate 212. Exemplarily, the electronic device 10 further includes a bonding member 213, and the protective structure 110 is connected to the middle plate 212 through the bonding member 213. In this way, the space for accommodating the display module 100 is formed between the middle plate 212 and the cover plate 101. During the movement of the electronic device from the unfolded state to the folded state, the bonding member 213 between the protective structure 110 and the middle plate 212 generates a shear force, causing the protective structure 110 and the middle plate 212 to dislocate or generate a relative displacement, which causes the protective structure 110 to move relative to the middle plate 212 and the frame 211. In addition, the bonding member 213 can also block water vapor or dust from entering the space between the middle plate 212 and the display module 100.

[0087] Exemplarily, the material of the bonding member 213 includes foam glue or photosensitive glue, etc. Under the action of external force, the foam glue or photosensitive glue is easy to deform. During the movement of the electronic device from the unfolded state to the folded state, the bonding member 213 deforms, providing a movement allowance for the relative movement of the protective structure 110 and the middle plate 212.

[0088] In some embodiments of the present application, the display module 100 is connected to the middle plate 212 by the adhesive 213. In this way, the adhesive 213 between the display module 100 and the middle plate 212 generates a shear force, causing a dislocation or relative displacement between the display module 100 and the middle plate 212, which causes the display module 100 to move relative to the middle plate 212. The adhesive 213 can also block water vapor or dust from entering the internal part of the electronic device.

[0089] In some embodiments of the present application, the adhesive 213 is not necessary, the protective structure 110 is not connected to the middle plate 212, and the display module 100 is also not connected to the middle plate 212. For example, the protective structure 110 and the display module 100 are both in contact with the middle plate 212 without being connected. The protective structure 110 and the display module 100 are both not in contact with the middle plate 212 without being connected. Also, during the movement of the electronic device from the unfolded state to the folded state, a dislocation or relative displacement can occur between the protective structure 110 and the middle plate 212, which causes the protective structure 110 to move relative to the middle plate 212 and the frame 211.

[0090] In embodiments of the present application, the protective structure 110 has various structures, and the protective structure 110 and the frame 211 also have various connection modes. Exemplary descriptions are provided below in combination with FIGS. 6, 7, 8, 9, and 10.

[0091] FIG. 6 is a structural schematic diagram of a protective structure 110 and a frame 211 according to an embodiment of the present application. Referring to FIG. 6, along the thickness direction of the electronic device 10, the protective structure 110 at least partially overlaps the frame 211. When the electronic device is in the unfolded state, along the thickness direction of the frame 211, the protective structure 110 and the frame 211 have a first gap 002 therebetween.

[0092] Exemplarily, along the thickness direction (z direction) of the electronic device, the frame 211 has a first surface 011 facing away from the back shell 15a, and along the thickness direction of the frame 211, the frame 211 has a second surface 012 close to the display module 100. The protective structure 110 covers at least part of the first surface 011. The aforementioned first gap 002 is located between the second surface 012 and the protective structure 110. During the movement of the electronic device 10 from the unfolded state to the folded state, the first gap 002 provides space for the movement of the protective structure 110 close to the frame 211, and also provides movement space for the display module 100, which is conducive to releasing the stress during the folding process of the display module 100 and the cover plate 101, and avoiding stress concentration to cause damage to the display module 100. In addition, the first gap 002 is located between the protective structure 110 and the frame 211, and the first gap 002 is not visible when the electronic device 10 is viewed from the light-emitting side of the electronic device 10, which is conducive to improving the aesthetics of the electronic device 10.

[0093] As shown in FIG. 6, the protection structure 110 includes a top cover 111 and an encapsulation portion 112. The top cover 111 is located at a side of the encapsulation portion 112 close to the cover plate 101. At least part of the bending portion 102 is embedded in the encapsulation portion 112. The first gap 002 is located between the encapsulation portion 112 and the frame 211. In this way, the part of the bending portion 102 embedded in the encapsulation portion 112 can avoid direct collision with the top cover 111 and the frame 211. The encapsulation portion 112 has the effect of connecting the top cover 111 and the bending portion 102, and also has the effect of protecting the bending portion 102. The first gap 002 provides a movement space for the movement of the encapsulation portion 112 and the bending portion 102.

[0094] The aforementioned "at least part of the bending portion 102 is embedded in the encapsulation portion 112" means that part of the bending portion 102 is embedded in the encapsulation portion 112, and the remaining part of the bending portion 102 is located outside the encapsulation portion 112. Alternatively, all of the bending portion 102 is embedded in the encapsulation portion 112. For example, the entire non-display area E between the flexible circuit board 103 and the display area W is embedded in the encapsulation portion 112. In this way, the encapsulation portion 112 has good wrapping effect on the bending portion 102, avoiding collision.

[0095] Further, the side of the bending portion 102 close to the second surface 012 and the side of the bending portion 102 away from the second surface 012 are both in contact with the encapsulation portion 112. In other words, part of the encapsulation portion 112 is located at the side of the bending portion 102 close to the second surface 012, and part of the encapsulation portion 112 is located at the side of the bending portion 102 away from the second surface 012. In this way, the encapsulation portion 112 has good wrapping effect on the bending portion 102.

[0096] The size of the first gap 002 is not limited in the embodiments of the present application. For example, when the electronic device 10 is in the unfolded state, the width d1 of the first gap 002 is 0.1mm-1mm. For example, the width d1 of the first gap 002 is 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, and the like.

[0097] In the example of FIG. 6, the top cover 111 and the first surface 011 also have a third gap therebetween. The width of the third gap is not limited in the embodiments of the present application. For example, the width of the third gap between the top cover 111 and the first surface 011 can be 0.1mm-1mm. For example, the width of the third gap between the top cover 111 and the first surface 011 is 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, and the like. In this way, the top cover 111 and the frame 211 are less likely to rub against each other during the movement of the protection structure 110 relative to the frame 211, reducing wear.

[0098] In some embodiments, there may be no third gap between the top cover 111 and the first surface 011, which can reduce the entry of dust and other substances into the interior of the electronic device 10 from between the top cover 111 and the first surface 011.

[0099] As described above, the surface of the protective structure 110 facing away from the frame 211 can be coplanar with the light-emitting surface of the cover plate 101. Alternatively, the surface of the protective structure 110 facing away from the frame 211 can protrude from the light-emitting surface of the cover plate 101. In embodiments where the protective structure 110 includes a top cover 111 and an encapsulating portion 112, the surface of the top cover 111 facing away from the frame 211 can be coplanar with the light-emitting surface of the cover plate 101. Alternatively, the surface of the top cover 111 facing away from the frame 211 can protrude from the light-emitting surface of the cover plate 101.

[0100] Similarly, in embodiments where the electronic device 10 includes a protective film 201, the surface of the top cover 111 facing away from the frame 211 can be coplanar with the light-emitting surface of the protective film 201. Alternatively, the surface of the top cover 111 facing away from the frame 211 can protrude beyond the light-emitting surface of the protective film 201.

[0101] The material of the top cover 111 is not limited in this embodiment. Exemplarily, the material of the top cover 111 can be rubber, polyurethane, silicone, or plastic, etc. The shape of the top cover 111 is also not limited in this embodiment. In Figure 6, the top cover 111 has a sheet-like structure. The top cover 111 is disposed around the outer periphery of the cover plate 101. The projection shape of the extension path of the top cover 111 on the reference plane can be an "U" shape. The aforementioned reference plane is perpendicular to the thickness direction of the electronic device 10.

[0102] As described above, in some embodiments, the protective structure 110 may cover at least a portion of the surface of the cover plate 101 located in the non-display area E and facing away from the light-emitting surface. In the example of FIG. 6, the encapsulation portion 112 covers at least a portion of the surface of the cover plate 101 located in the non-display area E and facing away from the light-emitting surface. In some embodiments, the encapsulation portion 112 may not cover the surface of the cover plate 101 facing away from the light-emitting surface.

[0103] As described above, the edge of the protective structure 110 facing the cover plate 101 is connected to the cover plate 101 via an adhesive layer. In the example of Figure 6, the edge of the top cover 111 facing the cover plate 101 is connected to the cover plate 101 via an adhesive layer. For example, the adhesive layer can be provided at the location indicated by S in Figure 6. This adhesive layer can prevent moisture or dust from entering between the top cover 111 and the cover plate 101. It is understood that this adhesive layer is not necessary and may be omitted.

[0104] The material of the encapsulating portion 112 is not limited in the embodiments of the present application. For example, the material of the encapsulating portion 112 can be a thermosetting glue or a light-curing glue. In the embodiment where the material of the encapsulating portion 112 is a thermosetting glue, the encapsulating portion 112 can be formed by a thermosetting process. In the embodiment where the material of the encapsulating portion 112 is a light-curing glue, the encapsulating portion 112 can be formed by a light-curing process.

[0105] In the embodiment where the electronic device 10 further includes the adhesive 213, the encapsulating portion 112 or the display module 100 is connected with the adhesive 213. In addition, in the embodiment where the encapsulating portion 112 is adhesive, the electronic device 10 can not be provided with the adhesive 213, and the encapsulating portion 112 is connected with the middle plate 212.

[0106] In some embodiments, the material of the encapsulating portion 112 includes glue, and the glue in the encapsulating portion 112 is connected with the middle plate 212. The electronic device 10 can not be provided with the adhesive 213, which can reduce the thickness of the electronic device 10 while reducing the manufacturing cost of the electronic device 10. For example, the material of the encapsulating portion 112 can include foam glue or light-sensitive glue.

[0107] As described above, in some embodiments of the present application, the adhesive 213 is not necessary. The example of FIG. 6 can not be provided with the aforementioned adhesive 213.

[0108] In the example of FIG. 6, the display module 100 includes a support layer 302, a light-emitting layer 303, and an optical glue layer 304. The support layer 302, the light-emitting layer 303, and the optical glue layer 304 are sequentially stacked in the thickness direction (z direction) of the electronic device 10. The optical glue layer 304 is connected with the cover plate 101.

[0109] The electronic device 10 can further include a connecting layer 301. The support layer 302 is connected with the middle plate 212 through the connecting layer 301. For example, the material of the connecting layer 301 can be foam glue or light-sensitive glue, etc.

[0110] The support layer 302 is used to support the light-emitting layer 303, which can improve the structural strength of the display module 100. The structure of the support layer 302 is not limited in the embodiments of the present application. For example, the support layer 302 is a thin plate structure. In some embodiments, the support layer 302 is provided with a through hole penetrating through the support layer 302. The vertical projection of the through hole on the display module 100 overlaps with the bending area of the display module 100. The aforementioned bending area of the display module 100 is located in the display area of the display module 100. During the movement of the electronic device from the unfolded state to the folded state, the aforementioned bending area of the display module 100 is bent.

[0111] In some embodiments of the present application, the bending portion 102 includes the light-emitting layer 303 located in the non-display area. In other words, the light-emitting layer 303 located in the non-display area is bent to form the bending portion. The light-emitting layer 303 located in the non-display area is electrically connected to the flexible circuit board 103. The flexible circuit board 103 provides the light-emitting layer 303 with image display signals. In some embodiments, the bending portion 102 can only include part of the light-emitting layer 303 located in the non-display area. In other words, the layer structure such as the support layer 302 in the display module 100 can not be bent and is not part of the bending portion. In this way, the bending portion 102 occupies a smaller area and can provide more space for the top cover 111. The thickness of the top cover 111 can be increased, which is beneficial to improve the strength of the top cover 111.

[0112] In some embodiments of the present application, the bending portion 102 can also include the support layer 302 located in the non-display area. In other words, the support layer 302 located in the non-display area is bent to form part of the bending portion 102. Part of the support layer 302 and part of the light-emitting layer 303 are embedded in the encapsulation portion 112. In this way, the encapsulation portion 112 can constrain the support layer 302 and the light-emitting layer 303 together, which can reduce the mutual friction of the various layers in the display module 100 during unfolding or folding.

[0113] Similarly, in some embodiments, the bending portion 102 can also include the optical adhesive layer 304 located in the non-display area. In other words, the optical adhesive layer 304 located in the non-display area is bent to form part of the bending portion 102. In some embodiments of the present application, the electronic device 10 also includes a polarizing plate 305, and the optical adhesive layer 304 is located between the polarizing plate 305 and the cover plate 101.

[0114] In the example of FIG. 6, one end of the polarizing plate 305 extends into the protective structure 110. For example, one end of the polarizing plate 305 located in the non-display area extends into the encapsulation portion 112. In this way, the encapsulation portion 112 can fix the polarizing plate 305, and the connection strength of the protective structure 110 and the polarizing plate 305 is improved.

[0115] In some embodiments of the present application, the protective structure 110 does not cover the light-emitting surface of the polarizing plate 305. Compared with the protective structure 110 covering the light-emitting surface of the polarizing plate 305, the protective structure 110 not covering the light-emitting surface of the polarizing plate 305 is beneficial to save the installation space of the protective structure 110, and the thickness of the protective structure 110 can be increased, which is beneficial to improve the strength of the protective structure 110. In addition, the protective structure 110 does not cover the light-emitting surface of the polarizing plate 305. The polarizing plate 305 does not need to extend to the bending portion 102, which provides more space for the protective structure 110.

[0116] In some embodiments of the present application, the protective structure 110 can be lapped on the polarizing plate 305. In other words, the protective structure 110 covers at least part of the light-emitting surface of the polarizing plate 305.

[0117] For example, in some embodiments, the bending portion 102 can further include the polarizer 305 located in the non-display area. In other words, the polarizer 305 located in the non-display area is bent to form a part of the bending portion 102. In this way, the encapsulation portion 112 can wrap part of the polarizer 305.

[0118] In some embodiments of the present application, the electronic device 10 further includes a chip 104. The chip 104 is connected with the flexible circuit board 103. The chip 104 is configured to provide electrical signals for the flexible circuit board 103.

[0119] In some embodiments of the present application, the electronic device 10 further includes an ink layer 010, which covers the non-display area of the display module 100. The light emitted from the non-display area of the display module 100 can be avoided to affect the image displayed by the display module 100. In some embodiments, the ink layer 010 is located between the cover plate 101 and the display module 100. In some embodiments, the ink layer 010 can be located inside the cover plate 101, in other words, the cover plate 101 can be a multi-layer structure, and the ink layer 010 is located between any two layers of the multi-layer structure.

[0120] It can be understood that, in some embodiments of the present application, the aforementioned bending portion 102 can also include the ink layer 010. In other words, the end of the ink layer 010 is bent to form a part of the bending portion 102. In this way, the encapsulation portion 112 can wrap part of the ink layer 010.

[0121] In some embodiments, the chip 104 is located outside the encapsulation portion 112.

[0122] In some embodiments, at least part of the chip 104 is embedded in the encapsulation portion 112. In this way, the encapsulation portion 112 can protect the chip 104.

[0123] In the example of FIG. 6, the protective structure 110 is visible from the outer peripheral surface of the cover plate 101. In other words, during the use of the electronic device 10 by the user, the protective structure 110 visible from the outer peripheral surface of the cover plate 101 is within the visual range of the user. In some embodiments, the protective structure 110 visible from the outer peripheral surface of the cover plate 101 can be configured to be invisible.

[0124] FIG. 7 is a structural schematic view of another protective structure 110 and the frame 211 according to an embodiment of the present application. The difference between FIG. 7 and FIG. 6 includes that the electronic device 10 further includes a fence 105, which is connected with one end of the frame 211 and surrounds the outer periphery of the protective structure 110. When the electronic device 10 is in the unfolded state, there is a second gap 003 between the fence 105 and the protective structure 110 in the thickness direction of the frame 211.

[0125] Thus, the presence of the second gap 003 makes the bezel 105 not interfere with the movement of the protective structure 110 relative to the frame 211. Since the bezel 105 is arranged around the outer periphery of the protective structure 110, the bezel 105 can shield at least part of the outer periphery of the protective structure 110, so that the shielded part is not visible, which is conducive to improving the aesthetics of the electronic device 10. In addition, the bezel 105 can block the damage of part of external force to the outer periphery of the protective structure 110.

[0126] During the movement of the electronic device 10 from the unfolded state to the folded state, the widths of the second gap 003 and the first gap 002 decrease. The embodiments of the present application do not limit the width d2 of the second gap 003. For example, the width d2 of the second gap 003 can be greater than the width d1 of the first gap 002, or the width d2 of the second gap 003 can be less than or equal to the width d1 of the first gap 002. For example, the width d2 of the second gap 003 is 0.1mm-1mm. For example, the width d2 of the second gap 003 is 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, etc.

[0127] In the example of FIG. 7, the bezel 105 is integrally formed with the frame 211. In other words, the bezel 105 can be regarded as a part of the first middle frame 210. Thus, the connection strength between the bezel 105 and the frame 211 is high. Moreover, the forming process of the bezel 105 and the frame 211 is simple. In some other embodiments of the present application, the bezel 105 and the frame 211 can be two pieces connected by a glue layer or a welding layer, etc.

[0128] The embodiments of the present application do not limit the shape of the bezel 105. In some embodiments, the surface of the bezel 105 away from the outer periphery of the protective structure 110 and the surface of the bezel 105 facing the light-emitting surface of the electronic device 10 are arc-shaped and smoothly transitioned.

[0129] In the example of FIG. 7, the surface of the bezel 105 away from the frame 211 and the surface of the top cover 111 away from the package 112 are coplanar. In other words, the surface of the bezel 105 away from the frame 211 and the surface of the top cover 111 away from the package 112 are flush. Thus, it is conducive to the aesthetics of the electronic device. In some embodiments, the surface of the bezel 105 away from the frame 211 can protrude from the surface of the top cover 111 away from the package 112. Alternatively, in some embodiments, the surface of the top cover 111 away from the package 112 can protrude from the surface of the bezel 105 away from the frame 211.

[0130] The remaining structures in FIG. 7 are described in FIG. 6, which will not be repeated here.

[0131] FIG. 8 is a structural schematic view of another protective structure 110 and a bezel 211 according to an embodiment of the present application. As shown in FIG. 8, the difference between FIG. 8 and FIG. 6 is that the protective structure 110 in FIG. 8 further comprises a first supporting part 113 and a second supporting part 114.

[0132] In FIG. 8, the first supporting part 113 is connected with the top cover 111, the first supporting part 113 is located between the encapsulating part 112 and the bezel 211, and the first gap 002 is located between the first supporting part 113 and the bezel 211.

[0133] In this way, the first supporting part 113 can support the top cover 111, and in addition, the first supporting part 113 isolates the first gap 002 and the encapsulating part 112, so as to avoid that the first gap 002 is narrowed due to the deformation of the encapsulating part 112. This makes the movement of the protective structure 110 relative to the bezel 211 more smooth.

[0134] In addition, in the embodiment in which the encapsulating part 112 comprises glue, the first supporting part 113 can support the glue liquid for forming the encapsulating part 112 in the process of forming the encapsulating part 112, so as to reduce glue overflow.

[0135] In the embodiment of FIG. 8, the protective structure 110 can further comprise the second supporting part 114, the second supporting part 114 is connected with the side of the encapsulating part 112 away from the top cover 111, and the second supporting part 114 is connected with the end of the first supporting part 113 away from the top cover 111. In this way, the second supporting part 114 can support the encapsulating part 112 together with the first supporting part 113, so as to avoid that the friction between the encapsulating part 112 and the middle plate 212 is increased due to the deformation of the encapsulating part 112.

[0136] In the example of FIG. 8, the first supporting part 113 and the second supporting part 114 are connected as an integral molding. The first supporting part 113 and the second supporting part 114 together constitute an L-shaped structure. In other embodiments, the first supporting part 113 and the second supporting part 114 can constitute other shaped structural members.

[0137] For example, the material of the first supporting part 113 can be rubber, polyurethane, silica gel or plastic, etc., and the material of the second supporting part 114 can be rubber, polyurethane, silica gel or plastic, etc. The embodiments of the present application do not limit this.

[0138] In some embodiments of the present application, the first supporting part 113 and the top cover 111 are connected as an integral molding. In this way, the connection strength between the first supporting part 113 and the top cover 111 is higher. This is conducive to improving the strength of the protective structure 110.

[0139] In some embodiments, the first supporting part 113 and the top cover 111 can be connected through a glue layer or a buckle, etc.

[0140] In some embodiments, the encapsulation portion 112 can not wrap the bending portion 102, in other words, the bending portion 102 does not extend into the encapsulation portion 112. For example, the bending portion 102 is connected with the first support portion 113 through the encapsulation portion 112. In this way, the encapsulation portion 112, the top cover 111, the first support portion 113 and the bending portion 102 can also remain relatively static.

[0141] In some embodiments of the present application, the first support portion 113 and the second support portion 114 can be two pieces connected through a glue layer, a welding layer or a buckle.

[0142] In some embodiments of the present application, the second support portion 114 is not necessary, and the protective structure 110 can only be provided with the first support portion 113.

[0143] In the example of FIG. 8, one end of the support layer 302 extends into the encapsulation portion 112, which increases the connection strength between the display module 100 and the encapsulation portion 112. It can be understood that in other embodiments, the support layer 302 can be located outside the encapsulation portion 112.

[0144] In addition, in the embodiment of FIG. 8, the electronic device does not include the enclosure 105 shown in FIG. 7. In some embodiments, the example in FIG. 8 can also be provided with the enclosure 105 shown in FIG. 7.

[0145] FIG. 9 is a structural schematic diagram of another protective structure 110 and a frame 211 provided by an embodiment of the present application. Please refer to FIG. 9. The difference between FIG. 9 and FIG. 6 is that the encapsulation portion 112 and the top cover 111 in FIG. 9 are integrally formed. In other words, the encapsulation portion 112 and the top cover 111 are made of the same material. In this way, the connection strength between the encapsulation portion 112 and the top cover 111 is higher, and the connection between the encapsulation portion 112 and the top cover 111 is not easy to tear or crack. This is conducive to improving the strength of the protective structure 110.

[0146] For example, the forming process of the protective structure 110 in FIG. 9 includes: placing the bending portion 102 in a mold, filling glue liquid into the mold, and forming the encapsulation portion 112 and the top cover 111 after heat curing or light curing.

[0147] In some embodiments, the example in FIG. 9 can also be provided with the enclosure 105 shown in FIG. 7. Similarly, in some embodiments of the present application, the example in FIG. 9 can also be provided with the first support portion 113 and the second support portion 114 shown in FIG. 8.

[0148] In addition, the shapes of the encapsulation portion 112 and the top cover 111 provided by the embodiments of the present application can be the same as or different from the shapes of the encapsulation portion 112 and the top cover 111 in FIG. 6.

[0149] FIGS. 6, 7, 8 and 9 illustrate some examples of the movement of the protection structure 110 relative to the side frame 211. In the examples of FIGS. 6-9, during the movement of the electronic device 10 from the unfolded state to the folded state, the portion of the display screen away from the first middle frame 210, such as the cover plate 101, moves relative to the first middle frame 210, the area of the cover plate 101 away from the rotation shaft 230 moves towards the direction away from the rotation shaft 230, and the movement of the cover plate 101 pushes the protection structure 110 towards the side frame 211 to release the internal stress of the display module 100.

[0150] In some embodiments of the present application, during the movement of the electronic device 10 from the unfolded state to the folded state, the protection structure 110 can not move relative to the side frame 211. For example, the protection structure 110 deforms and can also release the internal stress of the display module 100.

[0151] FIG. 10 is a structural schematic diagram of another protection structure 110 and side frame 211 provided in an embodiment of the present application. Referring to FIG. 10, the protection structure 110 is connected to the side frame 211. The protection structure 110 does not cover the light-out surface of the cover plate 101. The protection structure 110 has elasticity, and during the movement of the electronic device 10 from the unfolded state to the folded state, the protection structure 110 deforms. In this way, during the movement of the electronic device 10 from the unfolded state to the folded state, the display module 100 and the cover plate 101 move together towards the side frame 211, and after the edge of the display module 100 contacts the protection structure 110, the display module 100 exerts a force on the protection structure 110 to make the protection structure 110 move towards the side frame 211, and the protection structure 110 deforms to release the internal stress of the display module 100.

[0152] During the movement of the electronic device 10 from the folded state to the unfolded state, the display module 100 and the cover plate 101 move away from the side frame 211 together. The protection structure 110 deforms to recover.

[0153] In the embodiments of the present application, the protection structure 110 and the side frame 211 can be connected by a glue layer, a buckle or the like.

[0154] The material of the protection structure 110 includes an elastic material, which can be rubber for example. The protection structure 110 made of rubber material deforms under the action of the display module 100, effectively releasing the internal stress of the display module 100.

[0155] In some embodiments, the display module 100 is in the unfolded state, and the protective structure 110 and the cover plate 101 have a third gap 004 therebetween. Illustratively, the third gap 004 can have a width of 0.05mm-0.6mm. The third gap 004 can have a width of, for example, 0.05mm, 0.08mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, or 0.6mm, etc. The third gap 004 can provide a margin for the cover plate 101 and the display module 100 to move relative to the bezel 211 together.

[0156] In some embodiments of the present application, an adhesive layer can be arranged in the aforementioned third gap 004. The adhesive layer connects the protective structure 110 and the cover plate 101. During the movement of the electronic device 10 from the folded state to the unfolded state, the display module 100 and the cover plate 101 move away from the bezel 211 together. The cover plate 101 pulls the protective structure 110 through the adhesive layer arranged in the third gap 004, so that the protective structure 110 is stretched.

[0157] In the example of FIG. 10, the protective structure 110 and the display module 100 are not connected. In the example of FIG. 10, the protective structure 110 can not be provided with the aforementioned encapsulation portion.

[0158] The structure and connection relationship of the display module 100, the rear shell 15a, and the flexible circuit board 103 in FIG. 10 are described above with reference to FIG. 6, and will not be described again here.

[0159] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0160] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising: The electronic device comprises: a display screen comprising a display module and a cover plate arranged on the light-emitting side of the display module; a protective structure surrounding the periphery of the display screen and not covering the light-emitting surface of the cover plate, the protective structure covering at least part of the non-display area of the display screen; and a frame surrounding the periphery of the display screen, at least part of the protective structure overlapping the frame in the thickness direction of the electronic device; when the electronic device is in a flat state, a first gap is formed between the protective structure and the frame in the thickness direction of the frame.

2. The electronic device of claim 1, wherein, During the movement of the electronic device from the flat state to the folded state, the width of the first gap decreases.

3. The electronic device of claim 1, wherein, The electronic device further comprises a middle plate, the frame is connected to the periphery of the middle plate, and the display module is located between the middle plate and the cover plate; the display module or the protective structure is bonded to the middle plate.

4. The electronic device of claim 3, wherein, The electronic device further comprises a bonding member, and the display module or the protective structure is bonded to the middle plate through the bonding member.

5. The electronic device of any of claims 1-4, wherein, The electronic device further comprises a flexible circuit board, the display module comprises a bending portion located in the non-display area, and the bending portion is connected to the flexible circuit board; the protective structure comprises a top cover and an envelope portion connected to each other, the top cover surrounds the periphery of the cover plate, at least part of the bending portion is embedded in the envelope portion, and the first gap is located between the envelope portion and the frame.

6. The electronic device of claim 5, wherein, The protective structure further comprises a first support portion connected to the top cover, the first support portion is located between the envelope portion and the frame, and the first gap is located between the first support portion and the frame.

7. The electronic device of claim 6, wherein, The first support portion and the top cover are connected to form an integral piece.

8. The electronic device of claim 6 or 7, wherein, The protective structure further comprises a second support portion connected to the side of the envelope portion away from the top cover, and the second support portion and the first support portion are connected at the ends away from the top cover.

9. The electronic device of any of claims 5-8, wherein, The envelope portion and the top cover are connected to form an integral piece.

10. The electronic device of any of claims 5-9, wherein, The material of the envelope portion comprises glue.

11. The electronic device of any of claims 5-10, wherein, The display module comprises a light-emitting layer and a support layer arranged in a stack, the support layer is located on the back light-emitting surface of the light-emitting layer, and the bending portion comprises the light-emitting layer and the support layer located in the non-display area.

12. The electronic device of any of claims 1-11, wherein, The electronic device further comprises a fence connected to the frame, and the fence surrounds the periphery of the protective structure. When the electronic device is in an unfolded state, a second gap is formed between the fence and the protective structure in the thickness direction of the frame.

13. The electronic device of claim 12, wherein, The fence and the frame are connected to form an integral piece.

14. The electronic device of any of claims 1-13, wherein, In the thickness direction of the electronic device, a third gap is formed between the protective structure and the frame.

15. The electronic device of any of claims 1-14, wherein, The electronic device further comprises a polarizing plate located between the cover plate and the display module, and one end of the polarizing plate extends into the protective structure.

16. The electronic device of any of claims 1-15, wherein, The electronic device further comprises a protective film covering the light-emitting surface of the cover plate, and the protective structure does not cover the light-emitting surface of the protective film.

17. The electronic device of any of claims 1-16, wherein, The width of the first gap is 0.1mm-1mm when the electronic device is in the unfolded state.

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