Method for determining control and / or cleaning instructions for a container and corresponding system

Abstract

The invention relates to a method for determining control and / or cleaning instructions for a container (102) adapted and configured to hold wafers (106) or reticles, the method comprising, in a determination cycle, the steps of: Providing or receiving container data (210), wherein the container data comprises data about a contamination (104) of the container and / or data about characteristics of the container, and wherein the container data is or has been acquired by means of measurement, preferably at various points in time; determining, using an analysis model and based on the container data, defect information (220) about potential defects of the wafer or reticles; determining, using a planning model and based on the defect information and / or the container data, control instructions (220) for the container, and providing the control instructions for further handling of the container; and if the control instructions comprise cleaning the container, determining, using a cleaning model and based on the container data and / or the defect information and / or the control instructions, cleaning instructions for the container, and providing the cleaning instructions for cleaning the container.

Description

[0001] Brooks Automation (Germany) GmbH DG15. DD174486 / 01 IDF3252 16 September 2025

[0002] 1

[0003] Method for determining control and / or cleaning instructions for a container and corresponding system

[0004] The application relates to a method for determining control and / or cleaning instructions for a container adapted and configured to hold wafers or reticles, to a data processing system and a corresponding inspection and / or analysis system.

[0005] Description

[0006] Reticles are photomasks used for the production of integrated circuits, so called chips, to produce patterns on thin wafers of material, usually silicon.

[0007] Cleanliness requirements within the semiconductor industry has become ever more important, especially in connection with EUV technology. In order to obtain a reasonable yield of chips, the entire fabrication and handling environment for reticles and semiconductor wafers, sometimes referred to as semiconductor ecosystem, needs to work at extreme levels of efficiency and cleanliness with almost no scope for error. This requirement necessitates monitoring every aspect of the semiconductor ecosystem, irrespective of it belonging to manufacturing, process control or Research and Development (R&D). Every piece of information thus generated and stored can prove invaluable.

[0008] Contamination control plays an especially crucial role, as this directly influences cleanliness of wafers. Wafers are typically transported in specialized containers, so called FOURS (Front Opening Unified Pods), and the environment within these containers, often referred to as mini environment, is critical, as it directly impacts wafer or chip yield. This chip yield can be significantly enhanced by appropriate contamination control.

[0009] In semiconductor manufacturing, the trend towards smaller features - approaching that of atomic-scale - has brought with it new challenges. One is the challenge of controlling airborne molecular contaminants (AMC). AMC come from both internal processes such as chemicals and materials used in the manufacturing of containers and external processes, such as the air supply within semiconductor fabs. The presence of AMC even at very low concentrations can lead to costly defects in the wafers or reticles. Water vapor or moisture within containers is also to be avoided. Moisture can induce various chemical reactions that subsequently lead to defects. Currently, moisture contamination control is adopted in many wafer handling and storage situations. Particles, AMC, oxygen, Volatile Organic Compounds (VOC) and moisture, as well as static events, have the potential to cause defects on reticles or wafers which can lead to reduced product performance or product yield in manufacturing processes.

[0010] Thus, wafer or reticle random defects due to contamination are a significant challenge in semiconductor manufacturing, causing substantial yield losses and increased production costs. It has turned out that up to 50% of yield loss in semiconductor manufacturing can be traced back to contamination issues.

[0011] FOUPs are typically made of polycarbonate material, which is a hygroscopic polymer that can retain moisture. This means that cleaning fluids such as deionised water can be absorbed during the cleaning process. On the other hand, subsequent purging, for example using clean dry air (CDA), can induce desorption of moisture from the FOUP material. Hereafter, it must be ensured that FOUPs thus cleaned are completely free of moisture before usage. The capability of a FOUP to retain moisture can change over time, giving an indication of its age and condition.

[0012] Reticles, for which similar if not even more stringent cleanliness requirements apply, are usually transported and stored in so called reticle pods. Reticle pods and FOUPS will be at times simply referred to as ‘pods’ or containers in the following. These specialised containers for holding wafers or reticles typically comprise a body member, which defines an internal space, and a lid member, which can be sealingly connected to the body by means of a rubber gasket or seal, thereby defining a closed and sealed state of the container, so that e.g. a controlled environment can be provided within the container. The lid member can be opened and / or disconnected from the body in order to load or unload the container. On at least two opposite interior surfaces, the body is typically provided with a number of parallel grooves or ridges adapted to stack a number of wafers or reticles securely and safely in the container, without them touching one another. Seals and gaskets must be replaced regularly. Ascertaining their condition also gives useful information as to the condition of the container as a whole.

[0013] In semiconductor wafer processing, robotic mechanisms are constantly arranging, moving, transporting, organizing, and processing wafers and wafer containers, such as the front opening unified pod (FOUR). The FOUR maybe damaged in the process (e.g. scratch, break, deform, etc.), which may also lead to damage to wafers being stored or transported in such FOUPs.

[0014] Furthermore, FOUPs are subject to normal wear and tear. For example, a gasket / seal provided between the shell and the lid in order to maintain an uncontaminated environment within the FOUP can become damaged or brittle over time, such that its sealing capacity is diminished. The cleanliness of the environment within FOUP is critical to the yield of semiconductor manufacturing sites, so called fabs.

[0015] Each semiconductor fabrication plant, commonly referred to as a fab, typically uses a multitude of pods (based on the size and capability) at any time, for example for transportation and / or storage of reticles and wafers. Numerous tools and appliances are available for maintaining the above mentioned mini environment within the containers. For example, specialized tools are available for inspection and cleaning these containers. Since these containers (FOUPs and reticle pods) are costly, they are advantageously re-used as often as feasible, so that it is essential they are cleaned thoroughly in between steps and are inspected before being passed on to the next stage / step.

[0016] Further, the semiconductor industry faces increasing pressure to adopt sustainable and environmentally-friendly chip manufacturing processes. The industry's substantial energy and water consumption, along with hazardous waste production, has drawn regulatory and public scrutiny. It has turned out that sustainable practices could reduce operational costs by up to 20%.

[0017] Another issue is that the global semiconductor industry is experiencing critical workforce shortages and soaring workforce costs, hindering its ability to meet increasing demand and drive innovation.

[0018] In view of the above there exists a need to provide an improved way of handling and / or cleaning wafer or reticle containers such as FOUPs, in particular in order to overcome at least some of the issues mentioned.

[0019] The present invention proposes a method, in particular a computer- implemented method, for determining control and / or cleaning instructions for a container, a data processing system and an inspection and / or analysis system according to the independent claims. Further embodiments and additional features are provided in the dependent claims and further discussed in the following description.

[0020] In order to determine such control and / or cleaning instructions for a container adapted and configured to hold wafers or reticles, it is suggested to use container data and different models, e.g., so-called digital twins (DT). The container data provided or received (e.g., in the data processing system) comprises data about a contamination (in particular AMC) of the container and / or data about characteristics of the container. The container data is or has been acquired by means of measurement, preferably at various points in time. In an embodiment, the data about contamination or AMC of the container comprise data about at least one of the following contaminations: ammonia (NH3), propylene glycol methyl ether acetate (PGMEA), chlorine (CL2), hydrogen bromide (HBr), tetrafluoromethane (CF4, also called carbon tetrafluoride), mixture of ammonium hydroxide and hydrogen peroxide (NH4OH / H2O2), dihydrogen phosphate (H2PO4, weak acid). These are typical contaminations which can occur during wafer or container handling and processing on the wafer. Different steps of processing the wafer can result in different contaminations, e.g., with respect to combinations of different individual contaminations and / or different intensities of contamination (also of the individual ones).

[0021] Such contamination or AMC can be determined using, e.g., specific AMC metrology or measuring or analysis systems or devices. Such measuring device can, for example, be fluidly connected to the container or its inside.

[0022] In an embodiment, the data about characteristics of the container comprise data about at least one of the following characteristics: one or more images of at least a part of the container, a pressure within the container following a pressurization, a heat reaction following an exposure of the container to a heat source, humidity within the container. In addition to contamination like AMC, such kinds of characteristics allow analysis of the state of the container, e.g. for potential issues with a gasket or seal or the like. Such data about characteristics can in particular be acquired with inspection systems.

[0023] Based on the container data, defect information about potential defects of the wafer or reticle (i.e. , the product to be stored in the container) are determined. In order to do so, an analysis model is used, e.g. a respective digital twin. In an embodiment, the potential defects of the container comprise at least one of the following defects: PR footing (in particular, photoresist footing), HBr condense, ammonium fluoride (NH4F) condense, ammonium hydroxide (NH4OH) condense, Silicate, ammonium phosphate, (NH4)3PO4, salt. These types of defects in particular can result from the kinds of contaminations mentioned above.

[0024] Based on the defect information, control instructions (or a control method) for the container is determined. Alternatively, or in addition, the control instructions can also be determined based on the container data. In order to determine the control instructions, a planning model is used, e.g. a respective digital twin. The control instructions are then provided for further handling of the container. Such further handling can then be performed automatedly (e.g. with a respective device or system) and / or manually; this can depend on the kind of control instructions. In an embodiment, the control instructions for the container comprise at least one of the following instructions: performing a cleaning method, swapping the container, discarding the container, performing a maintenance action for the container, using the container without further maintenance and / or cleaning. The control instructions, thus, can be determined such that a best way to mitigate the potential defects and / or remove contamination and, thus, increase the yield of the wafers or reticles and also reduce resources required to achieve this.

[0025] Further, at least if the control instructions comprise cleaning the container, cleaning instructions (or a cleaning recipe) for the container are determined. In order to do so, a cleaning model is used, e.g. a respective digital twin. The cleaning instructions are then provided for cleaning the container. Such cleaning can be performed used a suitable cleaning apparatus or system, for example. In an embodiment, the cleaning instructions are based on at least one of: using water, using air, using electricity. In particular, the cleaning instructions do not only comprise the cleaning means to be used but also a particular recipe on how and / or how much to use. For example, the cleaning instructions may instruct to use air (e.g. clean dry air) with a certain flow for a certain period of time.

[0026] The cleaning instructions are determined based on at least one of: the container data, the defect information, the control instructions. The data about a contamination (which are part of the container data) can, for example, indicate which cleaning means to use and / or for how long to use it. The defect information can, for example, also indicate which cleaning means to use and / or for how long to use it.

[0027] The above-mentioned steps are performed within a determination cycle. And such determination cycle, in an embodiment, is performed repeatedly, e.g., every certain point in time, or after each certain action, or each time after the wafers or reticles have been removed from the container (and, thus, before loading the container with new wafers or reticles).

[0028] It is noted that the cleaning instructions do not have to be determined if the control instructions do not include cleaning the container. However, cleaning instructions may nevertheless be determined, e.g. for later use.

[0029] In an embodiment, the container data further comprises information about the control instructions and / or cleaning instructions from one or more previous determination cycles. In an embodiment, the container data comprises container data having been acquired after handling and / or cleaning the container after each of one or more previous determination cycles. In this way, with each new determination cycle, more data is included, i.e. , historic data. This helps improving the determination step. For example, if in a previous cycle, certain cleaning instructions for certain contamination having been present were used, and in the new cycle the contamination is low or potential defects are merely present, this might result in using these cleaning instructions again. If, however, the contamination is worse, this might result in not using these cleaning instructions any more or extending the time period for it.

[0030] In an embodiment, visualizing instructions for a display are provided, at least upon request. Such visualizing instructions are to to visualize at least one of: at least a part of the container data, at least a part of the defect information, an indication about a development of at least one of the characteristics of the container over time (i.e. over a plurality of previous determination cycles), an indication about a development of at least a part of the contamination of the container over time (i.e. over a plurality of previous determination cycles). In this way, users can be provided with additional information about the situation, e.g. the contamination or characteristics and their development. This allows a user to adapt the overall process where the container is used or certain steps thereof, for example.

[0031] To sum up, the suggested solution or system intakes data about FOUPs (or other containers), and past historical data from cleanings, and provides, through data analysis, and use of Digital Twins (in place of humans), a customized FOUR (or other container) cleaning recipe. An ultimate result of the process is to provide a determination of yield, and particularly yield improvement, resulting from the customized FOIIP cleaning recipe.

[0032] The use of the different models or digital twins (or digital twin technology) allows to automate what was once formerly a human activity, but there is a strong aspect relating to the particular data inputs that are used. Those would not easily or not at all be used by a human given their nature, and specificity, to lead to the same customized FOIIP cleaning recipe.

[0033] The models or digital twins - analysis model, planning model, cleaning model - can be based on machine learning models or algorithms. Alternatively, or in addition, these models can be based on analytical models. In each case, such model can determine, based on the input data, the respective data or instructions. These models can thus be used for tasks that otherwise a human would do. For example, a Defect Engineer would determine the container data, e.g., create defect cause / effect analysis based on FOIIP AMC data through the process flow (analysis model). A Process Integration Engineer would determine the control instructions, e.g., plan contamination control methods to mitigate these defect risks (control model). A FOIIP Clean Process Engineer would determine the cleaning instructions, e.g., create the most suitable FOIIP clean recipes that can clean the FOIIP to the optimum cleanliness using minimum resource (cleaning model). Further, it is possible to initially set-up or train these models before using them in practice. This may include gathering data like the container data, defect information, control instructions and cleaning instructions from previous wafer handling processes. Such models can then rely on a great amount of data to make decisions as good as possible, taking into account every piece of data, even if a human would not think of it. During use, the gathered data can further be increased, also leading to improving the models and the decisions they make.

[0034] As mentioned, the control instructions can comprise swapping the container, discarding the container, performing a maintenance action (e.g., repairing, or gasket / rubber seal replacement) for the container, using the container without further maintenance and / or cleaning.

[0035] While the application in the following refers, especially, to front opening unified pods (FOUPs) and corresponding bodies as a preferred example of such a specialised container, the invention is applicable to any kind of wafer or reticle container. As a further example, front opening shipping boxes (FOSB) can be mentioned.

[0036] With the repeated cycles, the method allows a reliable monitoring of the states of containers such as FOUPs over time, so it can effectively be decided when a container can be continued to be used, or when it, or at least one of its components such as a gasket / seal, should be replaced.

[0037] In this connection, it is noted that a concept of evaluation of the state of a container body is meant to especially comprise an evaluation of damage to the container body, an evaluation of whether its dimensions conform to desired specifications, and an evaluation of potential contamination. A data processing system according to the invention, e.g., a computer, a central server or other computing system, is configured, to perform the steps of a method according to the invention.

[0038] There is also provided a corresponding inspection and / or analysis system configured to acquire container data for a container adapted and configured to hold wafers or reticles by means of measurement, wherein the container data comprises data about a contamination of the container and / or data about characteristics of the container. Thte inspection system comprises the data processing system mentioned above. Further, the inspection and / or analysis may also comprise a cleaning system configured to perform the mentioned cleaning method

[0039] For further embodiments and advantages of the inspection and / or analysis system it is referred to the description of the method and respective embodiments, which applies accordingly. In particular, the system implements the method according to any one of the mentioned embodiments. This may require the system comprising one or more additional components mentioned in the respective embodiment.

[0040] The implementation of a method according to the invention in the form of a computer program or computer program product with program code for performing all method steps is also advantageous, since this causes particularly low costs, especially if an executing control unit is still used for further tasks and is therefore present anyway. Finally, a machine-readable storage medium is provided with a computer program stored thereon as described above. Suitable storage media or data carriers for providing the computer program are, in particular, magnetic, optical and electrical memories, such as hard disks, flash memories, EEPROMs, DVDs and the like. It is also possible to download a program via computer net-works (Internet, intranet, etc.). Such a download can take place wired or wirelessly (e.g. via a WLAN network, a 3G, 4G, 5G or 6G connection, etc.). Further advantages and embodiments of the invention will be apparent from the description and the accompanying drawing.

[0041] The invention is shown schematically in the drawing by means of an example of an embodiment and is described below with reference to the drawing.

[0042] Drawings

[0043] Fig. 1a schematically shows a flow diagram illustrating an embodiment of the invention;

[0044] Figs. 1 b, 1 c schematically show parts of Fig. 1 a in more detail;

[0045] Fig. 2 schematically shows a diagram for explanation of an aspect of the invention; and

[0046] Fig. 3 schematically shows a diagram for explanation of an aspect of the invention.

[0047] Description of the drawings

[0048] Fig. 1a illustrates an inspection and analysis system according to an embodiment of the invention, generally designated 100. The inspection and analysis system 100 comprises a data processing system 110 and a display 112. Further, the inspection and analysis system is configured to acquire container data, by means of measurement, for a container 102, e.g., a FOUR, adapted and configured to hold wafers 106 or reticles.

[0049] For that, the inspection and analysis system 100, in this embodiment, comprises an analysis or measurement device 120 for measuring a contamination 104, e.g. AMC, of a FOUR 102. The inspection and analysis system 100 further comprises an inspection device 130 for, e.g., optically, inspecting the FOUR 102. The inspection device 130 can, e.g., comprise a camera and / or other inspection or measurement devices.

[0050] The analysis or measurement device 120 is shown in more detail in Fig. 1 b; note that this is just an example of such a device which can be used for the purposes of the present invention. The analysis or measurement device 120 comprises a cavity 121 with three mirrors 122 (one on the back end and two on comers on the front end; it can be called a three-mirrored-cavity), a sample gas inlet 123, a laser 124, a wavelength monitor 125, a laser shut-off 126 and a photo detector 127.

[0051] The inspection device 130 and the FOUR 102 are shown in more detail in Fig. 1 c; note that this is just an example of such a device and FOP which can be used for the purposes of the present invention. The FOIIP 102 comprises a Flange 103, inert gas diffusers 109, an inlet 105 for purge gas, an interface or door 107 for auto-load and a seal 108 which allows sealing the interface or door. Wafers 106 can be stored therein. The inspection device 130 comprises, by means of example, a camera 132 for optically inspecting the FOIIP 102

[0052] The inspection and analysis system 100 further comprises a swapping or changing device 150 where wafers 106 can be moved from FOIIP 102 to another FOIIP 102’. The inspection and analysis system 100 further comprises a cleaning device 160 for cleaning the FOIIP 102 according to cleaning instructions.

[0053] The method is, in the following, described with respect to Figs. 1a and 2. Wafers can be processed according to a specific procedure 200, as shown in Fig. 2. This specific procedure or data related to it may be customer specific and is not required for the further steps.

[0054] While a general overview is shown in Fig. 2, an example for such a specific procedure 200 having different individual steps is provided in detail in the following table 1.

[0055] Table 1

[0056] The FOUR can then be loaded with several of such processed wafers for moving the wafers to a certain further process step. Note that the FOUR can also be used to move the wafers between different ones of the steps of procedure 200.

[0057] At a certain point in time, the FOIIP 102 - typically empty - is received in the analysis or measurement device 120. Then, contamination (AMC) of the FOIIP is measured, in order to obtain data about a contamination of the FOIIP. These data about contamination of the FOIIP are provided to data processing system 110. Further, in inspection device 130, the FOIIP 102 is inspected in order to obtain data about characteristics of the FOIIP. These data about a about characteristics of the FOIIP are provided to data processing system 110. Note that these steps may also be exchanged, for example.

[0058] The data about a contamination of the FOIIP and / or the data about a about characteristics of the FOIIP can be part of container data (e.g. FOIIP AMC), which is designated 210 in Fig. 2 and above table 1 . By means of example, different kinds of contamination for, e.g., different steps of the procedure 200, are indicated.

[0059] In the data processing device 110, using an analysis model and based on the container data, defect information about potential defects of the wafer or reticles are determined. Such defect information is designed 220 in Fig. 2 and above table 1 . By means of example, different potential defects for, e.g., different steps of the procedure 200 or different contamination, are indicated.

[0060] Further, using a planning model and based on the defect information and / or the container data, control instructions for the container, and providing the control instructions for further handling of the container are determined. Such control instructions are designed 230 in Fig. 2 and above table 1. By means of example, different control instructions for, e.g., different steps of the procedure 200 or different contamination or different potential defects, are indicated.

[0061] For example, at a certain situation, the control instructions can comprise to swap (or exchange) the FOUR. This is illustrated by means of example with changing device 150 in Fig. 1a. The control instructions for further handling of the container are provided, in this case, to changing device 150 (and / or a user).

[0062] For example, at another certain situation, the control instructions can comprise to purge (or clean) the FOUR. This is illustrated by means of example with cleaning device 160 in Fig. 1a. The control instructions for further handling of the container are provided, in this case, to cleaning device 160 (and / or a user).

[0063] If the control instructions comprise cleaning the container, cleaning instructions for the container are determined, using a cleaning model. This is also based on the container data and / or the defect information and / or the control instructions. The cleaning instructions typically comprise a specific recipe of how and / or how long and / or by which cleaning means the FOIIP is to be cleaned. The cleaning instructions are also provided to cleaning device 160 (and / or a user). Such cycle can be repeated again and again. For example, after each or after certain steps of the procedure 200, such cycle can be performed.

[0064] Contamination measurement can be performed by Best-in-Class (i.e. , the best available) or other TVOC (Total Volatile Organic Compounds) Measurement Technology for FOUR Contamination Control. It can provide superior Compound Hunting Capability for Defect Troubleshooting, Low Maintenance Cost, and Minimized PM Time because of Calibration-Free Technology.

[0065] The models can use FOUR metadata (e.g., size, manufacturing date, hours of usage, information about content to be stored therein, etc.) helping fabs to manage FOIIP contamination and lifetime in a holistic approach. It provides intelligent suggestions with domain expertise by means of the different digital twins.

[0066] This (superior) cleaning technology allows to remove contaminants inside FOIIP material, at best cost of ownership technology (consumption, throughput, footprint). It is also an innovative solution to clean new contaminants (e.g., MOR, Map of Record).

[0067] To sum up, an automated, data driven, and closed-loop holistic FOIIP contamination control solution is provided, enhanced by Digital Twins, seamlessly integrated into fab operations. The solution helps customers to reduces random wafer defects, increase productivity, and improve sustainability by effectively managing FOIIP contaminations.

[0068] As mentioned, some of the data can also be visualized on a display, e.g., display 112 of Fig. 1 a. For example, a user can input a request to processing device 110 (e.g., a computer), in order to be provided with the data. An example of such data is shown in Fig. 3. The data can be presented as how fab engineers and experts would view it in a respective software. Actionable insights can also be made available, e.g., within a few clicks. By means of example, the view shown in Fig. 3 shows two diagrams, a TVOC linear regression diagram 310 and a HF linear regression diagram 312. These diagrams or view can be shown for, e.g. a FOUR, indicated by block 320. This might also be shown for, e.g. ambient and clean. Further, this can be shown for a specific time period, e.g, a current week, a current month, a current quarter, a previous (or last) week, a previous (or last) month or a previous (or last) quarter etc., as indicated with blocks 330.

[0069] Further, specific contaminations like RH, TVOC, NH3, HCL, HF etc. can be chosen, as indicated with blocks 340. Further, the diagrams can be shown in different types of diagrams, as indicated with blocks 350. While the shown view includes history and trends, other types like statistics or recommendations can be shown, as indicated with blocks 360.

[0070] In an embodiment, the inspection device 130 can comprise at least one detection unit for detection of at least one FOUR characteristic (data about characteristics of the container). As an example, detection unit comprises at least one camera, for example a high-resolution area scan camera, and a plurality of illumination devices, by means of which, for example, checks of a mechanical state of FOIIP components such as seals, gasket or grommets, or also of the main FOIIP components such as body and lid may be performed: These components can be imaged extensively using this high-resolution area scan camera and the illumination devices, and for example compared with standard dimensions or measures. A continuous evaluation of this can be extremely valuable in determining the sealing capacity of the FOIIP, thereby predicting its lifetime and providing scope for timely maintenance steps (e.g. replacing the FOIIP seal / gasket).

[0071] Determining the defect information or the control instructions can the, for example, comprise evaluating the state of the FOIIP based on a development of this FOIIP characteristic over time. Be it noted that on the basis of the images generated by the at least one camera, evaluation can also include the body components, i.e. shell and lid, of the FOUR. For example, defects on interior surfaces of the FOUR, especially on ridges, can be detected, using appropriate image recognition tools. Also, it is possible to effectively identify contaminations in this way. Also, for example by utilizing comparative reference images, dimensions and measurements of the container body, for example dimensions of the interior surfaces, especially ridges can be identified.

[0072] An example of an evaluation usable in connection with such a detection unit comprises to perform a contour extraction algorithm. This can be used to determine the state of the seal provided between FOIIP shell and FOIIP lid. In case this contour extraction indicates that the contour of the seal deviates too much from a standard contour, the evaluation unit may decide that the FOIIP needs to be discarded, or at least, as a maintenance measure, the seal needs to be replaced. Standard contours could, for example, be stored in databases corresponding to the barcode of the FOIIP being inspected.

[0073] As a further example, detection unit may comprise a pressure measuring unit, which is adapted to measure certain pressures generated within the FOIIP by means of pressurization unit. Be it noted that such a pressurization unit may also be used for other pressurization in connection with FOIIP cleaning, which have no direct connection to the FOIIP inspection or monitoring as discussed here.

[0074] Here, for example a controlled pressurizing of the FOIIP is performed by the pressurization unit to determine the body integrity of the FOIIP. For example, in short duration, the FOIIP is pressurized to its upper limit, followed by pressure measurement over a certain time period, for example a few seconds of minutes.

[0075] A preferred example of an evaluation usable in connection with such a detection unit comprises to perform an evaluation of the state of the FOIIP based on the pressure development after such a pressurizing step. This can also be used to determine the state of the seal provided between FOUR shell and FOUR lid. In case this evaluation indicates that the FOIIP does not maintain the pressure in a sufficient manner, the evaluation unit may decide that the FOIIP needs to be discarded, or at least, as a maintenance measure, the seal needs to be replaced. Standard pressure values could, for example, be stored in databases corresponding to the barcode of the FOIIP being inspected.

[0076] A further example for a detection unit and an evaluation is given in connection with typical FOIIP cleaning: During FOIIP cleaning, the FOIIP can be subjected to drying via IR lamp and heated CDA (clean dry air). Every FOIIP has its characteristic heat signature. This heat signature may comprise, for example, a maximum and or minimum temperature at predetermined locations on the FOIIP reached during such a process, or a temperature distribution of the FOIIP. A detection unit comprising a temperature detector can constantly or regularly monitor such heat signatures. Any deviation in the mean values beyond a certain tolerance could be indicative of deeper problems that need to be addressed immediately - with corresponding control instructions, else that could lead to loss of wafers in mid production.

[0077] Humidity trend is another aspect that can monitored. Humidity is an extremely important in connection with contamination and is one of the biggest challenges within fabs. Measuring and monitoring the humidity trends is crucial to a defect and contamination free fab.

Claims

Claims1 . A method for determining control and / or cleaning instructions for a container (102) adapted and configured to hold wafers (106) or reticles, the method comprising, in a determination cycle, the steps of:Providing or receiving container data (210), wherein the container data comprises data about a contamination (104) of the container and / or data about characteristics of the container, and wherein the container data is or has been acquired by means of measurement, preferably at various points in time; determining, using an analysis model and based on the container data, defect information (220) about potential defects of the wafer or reticles; determining, using a planning model and based on the defect information and / or the container data, control instructions (220) for the container, and providing the control instructions for further handling of the container; and if the control instructions comprise cleaning the container, determining, using a cleaning model and based on the container data and / or the defect information and / or the control instructions, cleaning instructions for the container, and providing the cleaning instructions for cleaning the container.

2. The method of claim 1 , wherein the determination cycle is performed repeatedly.

3. The method of claim 2, wherein the container data further comprises information about the control instructions and / or cleaning instructions from one or more previous determination cycles.

4. The method of claim 2 or 3, wherein the container data comprises container data having been acquired after handling and / or cleaning the container after each of one or more previous determination cycles.

5. The method of any one of the preceding claims, wherein the data about a contamination of the container comprises data about airborne molecular contamination of the container.

6. The method of claim 5, wherein the data about airborne molecular contamination of the container comprise data about at least one of the following contaminations:- NH3,- PGMEA,- CL2, HBr,- CF4,- NH4OH / H2O2,- H2PO4 (weak acid).

7. The method of any one of the preceding claims, wherein the data about characteristics of the container comprise data about at least one of the following characteristics:- one or more images of at least a part of the container,- a pressure within the container following a pressurization,- a heat reaction following an exposure of the container to a heat source,- humidity within the container.

8. The method of any one of the preceding claims, wherein the potential defects of the container comprise at least one of the following defects:- PR footing,- HBr condense,- NH4F condense,- NH4OH condense,- Silicate,- (NH4)3PO4 salt.

9. The method of any one of the preceding claims, wherein the control instructions for the container comprise at least one of the following instructions:- cleaning the container,- swapping the container,- discarding the container,- performing a maintenance action for the container,- using the container without further maintenance and / or cleaning.

10. The method of any one of the preceding claims, further comprising: providing, at least upon request, visualizing instructions for a display to visualize at least one of:- at least a part of the container data,- at least a part of the defect information,- an indication about a development of at least one of the characteristics of the container over time,- an indication about a development of at least a part of the contamination of the container over time.11 . The method of any one of the preceding claims, wherein the cleaning instructions are based on at least one of:- using water,- using air,- using electricity.

12. A data processing system comprising means to perform the steps of the method of any one of the preceding claims.

13. An Inspection and / or analysis system (100) configured to acquire container data for a container adapted and configured to hold wafers or reticles by means of measurement, wherein the container data comprises data about a contamination of the container and / or data aboutcharacteristics of the container, the inspection system comprising the data processing system (110) of claim 12.

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