Curable composition for inkjet printing, electronic component, and method for producing electronic component

Abstract

The present invention provides a curable composition for inkjet printing, which is capable of suppressing blurring of a curable composition that is applied using an inkjet device and is capable of suppressing the occurrence of a crack in a cured product.　A curable composition for inkjet printing according to the present invention contains a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermal curing agent. The photopolymerization initiator contains an α-aminoketone photopolymerization initiator that is in a liquid state at 25°C, or the photopolymerization initiator contains an α-aminoketone photopolymerization initiator that has a molecular weight of 500 or more. The thermosetting compound contains a thermosetting compound that is in a liquid state at 25°C.

Description

Curable composition for inkjet printers, electronic components, and method for manufacturing electronic components

[0001] The present invention relates to an inkjet-curable composition that is applied and used with an inkjet device. The present invention also relates to an electronic component using the above-mentioned inkjet-curable composition, and a method for manufacturing an electronic component using the above-mentioned inkjet-curable composition.

[0002] Inkjet-curable compositions are known that are applied using an inkjet device. These inkjet-curable compositions are designed to be ejected from the inkjet head of the inkjet device. Such inkjet-curable compositions are disclosed, for example, in the following Patent Documents 1 and 2.

[0003] Patent Document 1 below discloses a curable composition comprising a polymerizable compound, 1% to 3% by mass of a pigment having a chemical structure represented by a specific formula, and a photopolymerization initiator having absorption at wavelengths of 360 nm to 400 nm.

[0004] Patent Document 2 below discloses a curable composition comprising a polyfunctional (meth)acrylate compound, a bisacylphosphine compound and / or an α-aminoketone compound with a molecular weight of 340 or more, and a compound represented by a specific formula. This curable composition does not contain a polymerization initiator with a molecular weight of less than 340, or contains a polymerization initiator with a molecular weight of less than 340 in an amount of 1% by mass or less per 100% by mass of the curable composition.

[0005] Furthermore, in recent years, LED devices equipped with light-emitting diode (LED) chips have become widely used. To improve the efficiency of extracting light emitted from the LED chip, methods such as placing partitions or reflective layers around the periphery of the LED chip are being considered.

[0006] For example, Patent Document 3 below discloses a method for manufacturing an LED device having a substrate, an LED element mounted on the substrate, a wavelength conversion layer covering the LED element, and a reflective layer formed on the substrate and outside the peripheral edge of the mounting area of ​​the LED element. This manufacturing method comprises the following steps: (1) A mounting step of mounting the LED element on the substrate. (2) A reflective layer forming step of applying a reflective layer forming composition containing light diffusing particles, an organosilicon compound, and a solvent onto the substrate, and drying and curing the reflective layer forming composition to form the reflective layer. (3) A wavelength conversion layer forming step of applying a wavelength conversion layer composition containing phosphor particles and a binder component so as to cover the LED element, and forming the wavelength conversion layer.

[0007] Furthermore, photopolymerization initiators for curing photocurable compounds such as (meth)acrylate compounds are being developed. Patent Document 4 below discloses a polyfunctional initiator for use in coating compositions cured by radiant energy.

[0008] Japanese Patent Publication No. 2019-151703, Japanese Patent Publication No. 2013-209518, Japanese Patent Publication No. 2014-158011, WO2006 / 082477A1

[0009] One possible method for forming a partition wall around the periphery of an LED chip is to use an inkjet device to apply an inkjet-curable composition in a frame-like manner, and then cure the applied inkjet-curable composition to form the partition wall. In such a manufacturing method, since an inkjet method is used, the partition wall can be selectively formed at a predetermined location, and the resulting electronic component can be miniaturized.

[0010] In recent years, there has been a growing demand for further miniaturization of electronic components. To achieve this, possible approaches include reducing the distance between the LED chip and the partition wall, or precisely forming the partition wall within a narrow area.

[0011] However, with conventional inkjet curable compositions, bleeding can occur in the curable composition applied using an inkjet device. This bleeding can contaminate LED chips or cause the curable composition to be placed in unintended areas.

[0012] Furthermore, conventional inkjet curable compositions sometimes exhibit poor heat resistance in the cured product. Therefore, electronic components using conventional inkjet curable compositions may develop cracks in the cured product during processes such as reflow.

[0013] Conventional inkjet curable compositions make it difficult to simultaneously suppress bleeding of the curable composition applied using an inkjet device and suppress the occurrence of cracks in the cured product.

[0014] The object of the present invention is to provide an inkjet-curable composition that can suppress bleeding of the curable composition applied using an inkjet device and suppress the occurrence of cracks in the cured product. Another object of the present invention is to provide an electronic component using the above inkjet-curable composition and a method for manufacturing an electronic component using the above inkjet-curable composition.

[0015] This specification discloses the following inkjet curable compositions, uses of inkjet curable compositions, electronic components, and methods for manufacturing electronic components.

[0016] Item 1. A curable composition for inkjet printing, comprising a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, or the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more, and the thermosetting compound comprises a thermosetting compound that is liquid at 25°C.

[0017] Item 2. The curable composition according to Item 1, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C.

[0018] Item 3. The inkjet curable composition according to Item 1, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, and the content of the α-aminoketone-based photopolymerization initiator that is liquid at 25°C is 8 parts by weight or more and 30 parts by weight or less per 100 parts by weight of the photocurable compound.

[0019] Item 4. The inkjet curable composition according to Item 1, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more.

[0020] Item 5. The inkjet curable composition according to any one of items 1 to 4, wherein the thermosetting compound comprises a bisphenol A type epoxy compound that is liquid at 25°C, or a bisphenol F type epoxy compound that is liquid at 25°C.

[0021] Item 6. The inkjet curable composition according to any one of items 1 to 5, wherein the content of the thermosetting compound that is liquid at 25°C is 5% by weight or more and 35% by weight or less in 100% by weight of the inkjet curable composition.

[0022] Item 7. The inkjet curable composition according to any one of items 1 to 6, wherein the photocurable compound comprises a photocurable compound having two or more photocurable functional groups.

[0023] Item 8. An inkjet-curable composition according to any one of items 1 to 7, used for forming partitions in electronic components.

[0024] Item 9. Use of an inkjet-curable composition according to any one of items 1 to 8 for forming a partition wall in an electronic component.

[0025] Item 10. An electronic component comprising a substrate, an electronic element disposed on a first surface of the substrate, and a partition wall disposed on the first surface of the substrate, wherein the partition wall is arranged on the first surface of the substrate so as to surround the electronic element, and the partition wall is a cured product of an inkjet curable composition according to any one of items 1 to 8.

[0026] Item 11. A method for manufacturing an electronic component, comprising: a coating step of applying an inkjet-curable composition described in any one of Items 1 to 8 onto a first surface of a substrate using an inkjet device to form a composition layer; and a curing step of curing the composition layer to form a partition wall, wherein an electronic element is arranged on the first surface of the substrate, and the partition wall is arranged on the first surface of the substrate so as to surround the electronic element.

[0027] The inkjet-curable composition according to the present invention comprises a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent. In the inkjet-curable composition according to the present invention, the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, or the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more. In the inkjet-curable composition according to the present invention, the thermosetting compound comprises a thermosetting compound that is liquid at 25°C. Because the inkjet-curable composition according to the present invention has the above configuration, it is possible to suppress bleeding of the curable composition applied using an inkjet device and to suppress the occurrence of cracks in the cured product.

[0028] Figure 1(a) is a schematic plan view showing an electronic component obtained using the inkjet-curable composition according to the first embodiment of the present invention. Figure 2(b) is a schematic cross-sectional view showing an electronic component obtained using the inkjet-curable composition according to the first embodiment of the present invention. Figure 3 is a schematic cross-sectional view showing an electronic component obtained using the inkjet-curable composition according to the second embodiment of the present invention. Figures 4(a) and 4(b) are cross-sectional views illustrating each step of the manufacturing method for the electronic component shown in Figures 1(a) and 2(b). Figures 5(c) and 5(d) are cross-sectional views illustrating each step of the manufacturing method for the electronic component shown in Figures 1(a) and 2(b). Figures 6(e) and 6(f) are cross-sectional views illustrating each step of the manufacturing method for the electronic component shown in Figures 1(a) and 2(b). Figure 7(g) is a cross-sectional view illustrating each step of the manufacturing method for the electronic component shown in Figures 1(a) and 2(b).

[0029] The present invention will be described in detail below.

[0030] (Inkjet Curable Composition) The inkjet curable composition according to the present invention is used by being applied using an inkjet device. Hereinafter, "inkjet curable composition" may be referred to as "curable composition". The curable composition according to the present invention differs from curable compositions applied by screen printing and differs from curable compositions applied by dispensers.

[0031] The curable composition according to the present invention comprises (A) a photocurable compound, (B) a photopolymerization initiator, (C) a thermosetting compound, and (D) a thermosetting agent.

[0032] In the curable composition according to the present invention, (B) the photopolymerization initiator comprises (B1) an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, or (Ba) an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more.

[0033] The curable composition according to the present invention comprises (C) a thermosetting compound which is (C1) a thermosetting compound that is liquid at 25°C.

[0034] In one aspect of the curable composition according to the present invention, (B) the photopolymerization initiator comprises (B1) an α-aminoketone-based photopolymerization initiator that is liquid at 25°C. In another aspect of the curable composition according to the present invention, (B) the photopolymerization initiator comprises (Ba) an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more. With respect to (B) the photopolymerization initiator, the curable composition according to the present invention satisfies either the following first or second configuration.

[0035] First configuration: (B) The photopolymerization initiator comprises (B1) an α-aminoketone-based photopolymerization initiator that is liquid at 25°C.

[0036] Second configuration: (B) The photopolymerization initiator comprises (Ba) an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more.

[0037] When the curable composition according to the present invention satisfies the above first configuration, the curable composition satisfies the following requirements: It contains a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent, the photopolymerization initiator contains an α - aminoketone - type photopolymerization initiator that is liquid at 25°C, and the thermosetting compound contains a thermosetting compound that is liquid at 25°C, a curable composition.

[0038] When the curable composition according to the present invention satisfies the above second configuration, the curable composition satisfies the following requirements: It contains a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent, the photopolymerization initiator contains an α - aminoketone - type photopolymerization initiator having a molecular weight of 500 or more, and the thermosetting compound contains a thermosetting compound that is liquid at 25°C, a curable composition.

[0039] In a conventional curable composition for inkjet, bleeding may occur in the curable composition applied using an inkjet device. The bled curable composition may contaminate electronic elements such as LED chips or may be disposed in an unintended area.

[0040] Furthermore, in a conventional curable composition for inkjet, the heat resistance of the cured product may be inferior. Therefore, in an electronic component using a conventional curable composition for inkjet, cracks may occur in the cured product in a reflow process or the like.

[0041] In a conventional curable composition for inkjet, it is difficult to achieve both suppression of bleeding of the curable composition applied using an inkjet device and suppression of crack generation in the cured product.

[0042] In the curable composition according to the present invention, since the above configuration is provided, bleeding of the curable composition applied using an inkjet device can be suppressed, and crack generation in the cured product can be suppressed.

[0043] In the curable composition according to the present invention, bleeding of the curable composition can be suppressed, so that the curable composition can be accurately placed in a predetermined region. Therefore, it is possible to make it difficult to cause contamination in electronic components. For example, it is possible to make it difficult to cause contamination of electronic elements such as LED chips. Furthermore, the obtained electronic components can be miniaturized.

[0044] Furthermore, in the curable composition according to the present invention, the heat resistance of the curable composition and its cured product can be enhanced. For example, in a reflow process for thermally curing the curable composition, it is possible to make it difficult to generate cracks. Therefore, the reliability of electronic components can be enhanced.

[0045] In the curable composition according to the present invention, it is possible to achieve both suppression of bleeding of the curable composition applied using an inkjet device and suppression of crack generation in the cured product.

[0046] In order to achieve both suppression of bleeding of the curable composition applied using an inkjet device and suppression of crack generation in the cured product, it is important to use in combination (B1) an α - aminoketone - based photoinitiator that is liquid at 25°C or (Ba) an α - aminoketone - based photoinitiator having a molecular weight of 500 or more, and (C1) a thermosetting compound that is liquid at 25°C.

[0047] The present inventors have found that the effects of the present invention can be exhibited in both cases where the α - aminoketone - based photoinitiator is liquid at 25°C and where the molecular weight of the α - aminoketone - based photoinitiator is 500 or more.

[0048] Furthermore, in the curable composition according to the present invention, since the above - described configuration is provided, the adhesive strength of the cured product of the curable composition can be enhanced, and peeling of the cured product can be suppressed.

[0049] Furthermore, for example, when a partition wall is formed on the periphery of an LED chip using a conventional curable composition, it may not be possible to form the partition wall properly because the conventional curable composition is not intended for use in forming partition walls. In particular, with conventional inkjet curable compositions, it may not be possible to form partition walls with a large aspect ratio properly using an inkjet device.

[0050] On the other hand, since the curable composition according to the present invention has the above configuration, when a partition wall is formed on the peripheral edge of an electronic element (such as an LED chip) using the curable composition, a partition wall with a large aspect ratio can be formed. The curable composition according to the present invention can form a partition wall having the aspect ratio (height / width) required for a light-emitting device.

[0051] Furthermore, with the curable composition according to the present invention, the curable composition can be applied with high precision near a light-emitting device using an inkjet device, thereby enabling miniaturization of the resulting electronic component.

[0052] The details of each component contained in the above curable composition are described below. In this specification, "(meth)acryloyl" means either or both "acryloyl" and "methacryloyl," and "(meth)acrylate" means either or both "acrylate" and "methacrylate." In this specification, the CH group of the (meth)acryloyl group is also described below. ２ = C(H or CH) ３ The group(s) are not included in the vinyl group.

[0053] <(A) Photocurable Compound> The above curable composition contains (A) a photocurable compound. (A) A photocurable compound is a compound that can be photocured. (A) A photocurable compound has a photocurable functional group. (A) A may be used alone or in combination of two or more types.

[0054] (A) A photocurable compound may have one photocurable functional group, two photocurable functional groups, two or more photocurable functional groups, three or more photocurable functional groups, four or more photocurable functional groups, or five or more photocurable functional groups. (A) A photocurable compound may have 10 or fewer photocurable functional groups.

[0055] From the viewpoint of further enhancing photocurability, forming good partitions with an even larger aspect ratio, and further improving thermal cycling characteristics, it is preferable that (A) the photocurable compound includes a photocurable compound having two or more photocurable functional groups. When (A) the photocurable compound includes a photocurable compound having two or more photocurable functional groups, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0056] From the viewpoint of further enhancing photocurability, forming septa with an even larger aspect ratio, and further improving thermal cycling characteristics (especially crack suppression), it is preferable that (A) the photocurable compound includes a photocurable compound having three or more photocurable functional groups.

[0057] (A) Examples of the above-mentioned photocurable functional groups in the photocurable compound include (meth)acryloyl groups and vinyl groups.

[0058] From the viewpoint of enhancing photocurability, it is preferable that the above-mentioned photocurable functional group of the photocurable compound (A) is a (meth)acryloyl group. From the viewpoint of enhancing photocurability, it is preferable that the photocurable compound (A) has a (meth)acryloyl group.

[0059] From the viewpoint of further suppressing the bleeding of the curable composition and further suppressing the occurrence of cracks in the cured product, it is preferable that (A) the photocurable compound includes a photocurable compound having two or more (meth)acryloyl groups.

[0060] (A) The photocurable compound may have one (meth)acryloyl group, two (meth)acryloyl groups, two or more (meth)acryloyl groups, three or more (meth)acryloyl groups, four or more (meth)acryloyl groups, or five or more (meth)acryloyl groups. (A) The photocurable compound may have 10 or fewer (meth)acryloyl groups. (A) The range of the number of photocurable functional groups in the photocurable compound can be set by appropriately selecting the above lower limit and upper limit (the same applies to the range of the number of other functional groups described later).

[0061] (A) The photocurable compound may or may not have a cyclic ether group. (A) The photocurable compound may or may not have an epoxy group. (A) The photocurable compound may or may not have a glycidyl group.

[0062] (A) The photocurable compound preferably includes (A1) a first (meth)acrylate compound having two or more (meth)acryloyl groups. Hereinafter, "(A1) a first (meth)acrylate compound having two or more (meth)acryloyl groups" may be referred to as "(A1) a first (meth)acrylate compound".

[0063] (A) The photocurable compound may contain (A2) a second (meth)acrylate compound having one (meth)acryloyl group. Hereinafter, "(A2) a second (meth)acrylate compound having one (meth)acryloyl group" may be written as "(A2) a second (meth)acrylate compound".

[0064] (A) The photocurable compound may also contain (A3) a cyclopolymerizable compound.

[0065] (A) The photocurable compound may include other photocurable compounds different from the three types: (A1) the first (meth)acrylate compound, (A2) the second (meth)acrylate compound, and (A3) the cyclopolymerizable compound. Only one of the above other photocurable compounds may be used, or two or more may be used.

[0066] In 100% by weight of the above curable composition, the content of (A) the photocurable compound is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, particularly preferably 25% by weight or more, preferably 85% by weight or less, more preferably 80% by weight or less, even more preferably 75% by weight or less, particularly preferably 70% by weight or less, and most preferably 65% ​​by weight or less. When the content of (A) the photocurable compound is above the lower limit and below the upper limit, the photocurability can be further enhanced, a partition with an even larger aspect ratio can be formed well, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0067] (A1) First (meth)acrylate compound having two or more (meth)acryloyl groups: (A1) The use of the first (meth)acrylate compound having two or more (meth)acryloyl groups can further enhance photocurability, form septa with an even larger aspect ratio well, and further improve thermal cycling properties. Furthermore, it can further suppress the bleeding of the curable composition and further suppress the occurrence of cracks in the cured product. (A1) The first (meth)acrylate compound may be used alone or in combination of two or more.

[0068] (A1) The first (meth)acrylate compound may have two (meth)acryloyl groups, two or more (meth)acryloyl groups, three or more (meth)acryloyl groups, four or more (meth)acryloyl groups, or five or more (meth)acryloyl groups. (A1) The first (meth)acrylate compound may have ten or fewer (meth)acryloyl groups. (A1) The range of the number of (meth)acryloyl groups in the first (meth)acrylate compound can be set by appropriately selecting the above lower limit and upper limit (the same applies to the range of the number of other functional groups described later).

[0069] (A1) The first (meth)acrylate compound may be a difunctional (meth)acrylate compound, a trifunctional (meth)acrylate compound, a tetrafunctional (meth)acrylate compound, a pentafunctional (meth)acrylate compound, or a hexafunctional (meth)acrylate compound.

[0070] Examples of the above-mentioned difunctional (meth)acrylate compounds include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonane di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butylethylpropanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0071] Examples of the above-mentioned trifunctional (meth)acrylate compounds include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolpropane alkylene oxide-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, isocyanuric acid alkylene oxide-modified tri(meth)acrylate, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl) isocyanurate, and sorbitol tri(meth)acrylate.

[0072] Examples of the above-mentioned tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol tetra(meth)acrylate propionate.

[0073] Examples of the pentafunctional (meth)acrylate compounds mentioned above include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0074] Examples of the hexafunctional (meth)acrylate compounds mentioned above include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0075] (A) The photocurable compound and (A1) the first (meth)acrylate compound preferably include a (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton. In this case, the effects of the present invention can be exhibited even more effectively.

[0076] Examples of the above-mentioned alicyclic skeletons include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, cycloundecane, cyclododecane, naphthalene, tetracyclododecene, cubane, basquetane, dicyclopentadiene, norbornene, and adamantane.

[0077] (A1) Examples of the first (meth)acrylate compound include a (meth)acrylate compound having a dicyclopentadiene skeleton, a (meth)acrylate compound having a norbornene skeleton, or a (meth)acrylate compound having an adamantane skeleton.

[0078] The above-mentioned alicyclic skeleton is preferably a dicyclopentadiene skeleton, a norbornene skeleton, or an adamantane skeleton, and more preferably a dicyclopentadiene skeleton. Therefore, it is preferable that (A) the photocurable compound and (A1) the first (meth)acrylate compound include a (meth)acrylate compound having two or more (meth)acryloyl groups and a dicyclopentadiene skeleton, a (meth)acrylate compound having two or more (meth)acryloyl groups and a norbornene skeleton, or a (meth)acrylate compound having two or more (meth)acryloyl groups and an adamantane skeleton. In this case, the effects of the present invention can be exhibited even more effectively. From the viewpoint of exhibiting the effects of the present invention even more effectively, it is more preferable that (A) the photocurable compound and (A1) the first (meth)acrylate compound include a (meth)acrylate compound having two or more (meth)acryloyl groups and a dicyclopentadiene skeleton.

[0079] Examples of (meth)acrylate compounds having two or more (meth)acryloyl groups and a dicyclopentadiene skeleton include tricyclodecanedimethanol di(meth)acrylate.

[0080] Examples of (meth)acrylate compounds having two or more (meth)acryloyl groups and a norbornene skeleton include isobornyl di(meth)acrylate.

[0081] Examples of (meth)acrylate compounds having two or more (meth)acryloyl groups and an adamantane skeleton include 1,3-adamantanediol di(meth)acrylate.

[0082] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that (A) the photocurable compound and (A1) the first (meth)acrylate compound contain tricyclodecanedimethanol di(meth)acrylate or 1,3-adamantanediol di(meth)acrylate. From the viewpoint of exhibiting the effects of the present invention even more effectively, it is more preferable that (A) the photocurable compound and (A1) the first (meth)acrylate compound contain tricyclodecanedimethanol di(meth)acrylate.

[0083] In 100% by weight of the above curable composition, the content of the first (meth)acrylate compound (A1) is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the content of the first (meth)acrylate compound (A1) is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 85% by weight or less, more preferably 80% by weight or less, even more preferably 75% by weight or less, particularly preferably 70% by weight or less, and most preferably 65% ​​by weight or less. When the content of the first (meth)acrylate compound (A1) is above the lower limit and below the upper limit, the photocurability can be further enhanced, partitions with an even larger aspect ratio can be formed well, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. In 100% by weight of the above curable composition, the range of the content of the first (meth)acrylate compound (A1) can be set by appropriately selecting the lower limit and the upper limit.

[0084] In 100% by weight of the above curable composition, the content of a (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the content of a (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of this (meth)acrylate compound is above the lower limit and below the upper limit, the photocurability can be further enhanced, septa with an even larger aspect ratio can be formed well, and the thermal cycling characteristics (especially the ability to suppress peeling) can be further enhanced. The range of the content of a (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton in 100% by weight of the above curable composition can be set by appropriately selecting the above lower limit and upper limit.

[0085] (A2) A second (meth)acrylate compound having one (meth)acryloyl group: (A) The photocurable compound preferably contains (A3) a cyclopolymerizable compound or (A2) the second (meth)acrylate compound. In this case, the occurrence of cracks in the cured product can be further suppressed. Furthermore, (A) The photocurable compound preferably contains (A2) the second (meth)acrylate compound. In this case, the occurrence of cracks in the cured product can be further suppressed. (A2) The second (meth)acrylate compound may be used by one type only, or by two or more types.

[0086] (A2) The second (meth)acrylate compound includes methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, and Examples include methyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono (meth)acrylate, 2-ethylhexyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, and stearyl (meth)acrylate.

[0087] Furthermore, (A2) examples of the second (meth)acrylate compound include glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0088] (A2) The second (meth)acrylate compound may have an alicyclic skeleton. Examples of the above alicyclic skeletons include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, cycloundecane, cyclododecane, naphthalene, tetracyclododecene, cubane, basquetane, dicyclopentadiene, norbornene, and adamantane.

[0089] (A2) Examples of the second (meth)acrylate compound include (meth)acrylate compounds having a dicyclopentadiene skeleton, (meth)acrylate compounds having a norbornene skeleton, and (meth)acrylate compounds having an adamantane skeleton.

[0090] Examples of (meth)acrylate compounds having the dicyclopentadiene skeleton mentioned above include dicyclopentadienyl (meth)acrylate.

[0091] Examples of (meth)acrylate compounds having the norbornene skeleton mentioned above include isobornyl (meth)acrylate.

[0092] Examples of (meth)acrylate compounds having the adamantane skeleton include 1-adamantyl(meth)acrylate, 3-hydroxy-1-adamantyl(meth)acrylate, 2-ethyladamantan-2-yl(meth)acrylate, 2-isopropyl-2-adamantyl(meth)acrylate, and 2-methyladamantan-2-yl(meth)acrylate.

[0093] In 100% by weight of the above curable composition, the total content of (A3) the cyclizable compound and (A2) the second (meth)acrylate compound is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the total content of (A3) the cyclizable compound and (A2) the second (meth)acrylate compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, preferably 65% ​​by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the total content of (A3) the cyclizable compound and (A2) the second (meth)acrylate compound is above the lower limit and below the upper limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, if the sum of the content of (A3) the cyclizable compound and the content of (A2) the second (meth)acrylate compound is equal to or greater than the lower limit, the thermal cycling properties (especially crack suppression) can be further enhanced. The range of the sum of the content of (A3) the cyclizable compound and the content of (A2) the second (meth)acrylate compound in 100% by weight of the curable composition can be set by appropriately selecting the lower limit and upper limit values.

[0094] In 100% by weight of the above curable composition, the content of the second (meth)acrylate compound (A2) is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the content of the second (meth)acrylate compound (A2) is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 8% by weight or more, preferably 40% by weight or less, more preferably 35% by weight or less, and even more preferably 30% by weight or less. If the content of the second (meth)acrylate compound (A2) is above the lower limit and below the upper limit, the occurrence of cracks can be further suppressed. In 100% by weight of the above curable composition, the range of the content of the second (meth)acrylate compound (A2) can be set by appropriately selecting the lower limit and the upper limit.

[0095] (A3) Cyclopolymerizable compound: (A) The photocurable compound preferably contains (A3) the cyclopolymerizable compound or (A2) the second (meth)acrylate compound. In this case, the occurrence of cracks in the cured product can be further suppressed. Furthermore, (A) the photocurable compound is more preferably to contain (A3) the cyclopolymerizable compound. In this case, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. (A3) The cyclopolymerizable compound may be used alone, or two or more may be used in combination.

[0096] (A3) Cyclopolymerizable compounds are compounds that can be cyclized. (A3) Cyclopolymerizable compounds have cyclizable groups. (A3) Cyclopolymerizable compounds can form polymers having a cyclic skeleton. (A3) It is preferable that cyclopolymerizable compounds can form polymers having a cyclic skeleton in their main chain.

[0097] (A3) Cyclopolymerizable compounds are preferably cyclized by radical polymerization. (A3) Cyclopolymerizable compounds are preferably capable of forming polymers having a cyclic skeleton by radical polymerization, and more preferably capable of forming polymers having a cyclic skeleton in the main chain by radical polymerization. (A3) In cyclopolymerizable compounds, it is preferable that the radical polymerization reaction proceeds while cyclization is occurring.

[0098] From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (particularly the ability to suppress peeling), it is preferable that the (A3) cyclizable compound is capable of forming a five-membered ring structure or a six-membered ring structure, and more preferably that it is capable of forming a five-membered ring ether structure. From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (particularly the ability to suppress peeling), it is preferable that the (A3) cyclizable compound is capable of forming a five-membered ring structure, and more preferably that it is capable of forming a five-membered ring ether structure.

[0099] (A3) The cyclizable compound preferably has a photocurable functional group. (A3) The cyclizable compound preferably has a photocurable functional group and a cyclizable group. (A3) In the cyclizable compound, the photocurable functional group may be a part of the cyclizable group, or it may be a side chain of the cyclizable group. (A3) In the cyclizable compound, the photocurable functional group and the cyclizable group may share some atoms or some skeleton.

[0100] (A3) The cyclizable compound may have one, two, two or more, three or more, four or more, five or more, or six or more of the above-mentioned cyclizable groups. (A3) The cyclizable compound may have 12 or fewer, eight or fewer, or six or fewer of the above-mentioned cyclizable groups.

[0101] From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (especially the ability to suppress peeling), it is preferable that the (A3) cyclizable compound has one cyclizable group. From the viewpoint of further improving photocurability, forming good partitions with an even larger aspect ratio, and further enhancing the thermal cycling properties (especially the ability to suppress cracking), it is preferable that the (A3) cyclizable compound has two or more cyclizable groups.

[0102] (A3) Cyclopolymerizable compounds may have one or more photocurable functional groups. (A3) The photocurable functional groups in cyclopolymerizable compounds may be groups that are not cyclized, and (A3) the photocurable functional groups in cyclopolymerizable compounds may be groups that are not included in the ring structure after cyclization (groups that do not constitute a ring structure after cyclization). (A3) When cyclopolymerizable compounds have photocurable functional groups, they may have the following number of photocurable functional groups: (A3) Cyclopolymerizable compounds may have one photocurable functional group, two photocurable functional groups, two or more photocurable functional groups, three or more photocurable functional groups, four or more photocurable functional groups, or five or more photocurable functional groups. (A3) Cyclopolymerizable compounds may have 10 or fewer photocurable functional groups. From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (especially the ability to suppress peeling), it is preferable that the (A3) cyclizable compound contains a photocurable compound having one photocurable functional group. From the viewpoint of further enhancing photocurability, forming a septum with an even larger aspect ratio well, and further enhancing the thermal cycling properties (especially the ability to suppress cracking), it is preferable that the (A3) cyclizable compound contains a photocurable compound having two or more photocurable functional groups.

[0103] Examples of the above-mentioned cyclizable group, group containing the above-mentioned cyclizable group, or photocurable functional group include (meth)acryloyl group, α-(allyloxymethyl)acryloyl group, and vinyl group.

[0104] If the above curable composition contains a cyclizable (meth)acrylate compound having one or more (meth)acryloyl groups, the above cyclizable (meth)acrylate compound having one or more (meth)acryloyl groups is classified as (A3) a cyclizable compound. In other words, the above cyclizable (meth)acrylate compound having one or more (meth)acryloyl groups is not classified as (A1) a first (meth)acrylate compound or (A2) a second (meth)acrylate compound.

[0105] From the viewpoint of enhancing cyclization polymerizability, the above-mentioned cyclization polymerizable group or group containing the above-mentioned cyclization polymerizable group of the (A3) cyclization polymerizable compound is preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. From the viewpoint of enhancing photocurability, the above-mentioned photocurable functional group of the (A3) cyclization polymerizable compound is preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. From the viewpoint of enhancing cyclization polymerizability and photocurability, the (A3) cyclization polymerizable compound is preferably having a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group.

[0106] (A3) The cyclopolymerizable compound may have one (meth)acryloyl group or α-(allyloxymethyl)acryloyl group, two (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, two or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, three or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, four or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, or five or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups. (A3) The cyclopolymerizable compound may have ten or fewer (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups.

[0107] (A3) The cyclizable compound may be a monofunctional (meth)acrylate compound or monofunctional α-(allyloxymethyl)acrylic acid, or a polyfunctional (meth)acrylate compound or polyfunctional α-(allyloxymethyl)acrylic acid. (A3) The cyclizable compound may contain a difunctional (meth)acrylate compound or difunctional α-(allyloxymethyl)acrylic acid, a trifunctional (meth)acrylate compound or trifunctional α-(allyloxymethyl)acrylic acid, a tetrafunctional (meth)acrylate compound or tetrafunctional α-(allyloxymethyl)acrylic acid, a pentafunctional (meth)acrylate compound or pentafunctional α-(allyloxymethyl)acrylic acid, or a hexafunctional (meth)acrylate compound or hexafunctional α-(allyloxymethyl)acrylic acid. (A3) The cyclopolymerizable compound may contain heptafunctional or more (meth)acrylate compounds, or heptafunctional or more α-(allyloxymethyl)acrylic acid. (A3) The cyclopolymerizable compound may contain decahy

[0108] From the viewpoint of further enhancing cyclization polymerizability, further enhancing photocurability, and good formation of septa with an even larger aspect ratio, it is preferable that the (A3) cyclization polymerizable compound contains a polyfunctional (meth)acrylate compound or a polyfunctional α-(allyloxymethyl)acrylic acid. The above polyfunctional (meth)acrylate compound may be a difunctional (meth)acrylate compound or a difunctional α-(allyloxymethyl)acrylic acid, a trifunctional (meth)acrylate compound or a trifunctional α-(allyloxymethyl)acrylic acid, a tetrafunctional (meth)acrylate compound or a tetrafunctional α-(allyloxymethyl)acrylic acid, a pentafunctional (meth)acrylate compound or a pentafunctional α-(allyloxymethyl)acrylic acid, a hexafunctional (meth)acrylate compound or a hexafunctional α-(allyloxymethyl)acrylic acid.

[0109] Examples of the above-mentioned monofunctional (meth)acrylate compounds or monofunctional α-(allyloxymethyl)acrylic acids include methyl-2-(allyloxymethyl)acrylic acid, 2-methoxyethyl-2-(allyloxymethyl)acrylic acid, tetrahydrofuran-2-ylmethyl-2-(allyloxymethyl)acrylic acid, 2-phenoxyethyl-2-(allyloxymethyl)acrylic acid, cyclohexyl-2-(allyloxymethyl)acrylic acid, and isobornyl-2-(allyloxymethyl)acrylic acid.

[0110] Examples of the above-mentioned difunctional (meth)acrylate compounds or difunctional α-(allyloxymethyl)acrylic acid include tripropylene glycol di-2-(allyloxymethyl)acrylic acid, 1,6-hexanediol di-2-(allyloxymethyl)acrylic acid, neopentyl glycol di-2-(allyloxymethyl)acrylic acid, and tricyclodecanedimethanol di-2-(allyloxymethyl)acrylic acid.

[0111] Examples of the above-mentioned trifunctional (meth)acrylate compound or trifunctional α-(allyloxymethyl)acrylic acid include trimethylolpropanetri-2-(allyloxymethyl)acrylic acid.

[0112] Examples of the hexafunctional (meth)acrylate compound or hexafunctional α-(allyloxymethyl)acrylic acid mentioned above include dipentaerythritol hexa-2-(allyloxymethyl)acrylic acid.

[0113] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound has two or more carbon-carbon double bonds. The (A3) cyclizable compound may have 12 or fewer carbon-carbon double bonds, 8 or fewer carbon-carbon double bonds, or 6 or fewer carbon-carbon double bonds.

[0114] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound has an allyl ether group. From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the cyclizable group in the (A3) cyclizable compound is an allyl ether group.

[0115] The above-mentioned cyclopolymerizable group or group containing the above-mentioned cyclopolymerizable group is preferably a vinyl group, a (meth)acryloyl group, or an α-(allyloxymethyl)acryloyl group, and more preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. In this case, the thermal cycling properties can be further enhanced, the reflow resistance can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. The above-mentioned photocurable functional group is preferably a vinyl group, a (meth)acryloyl group, or an α-(allyloxymethyl)acryloyl group, and more preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. In this case, the thermal cycling properties can be further enhanced, the reflow resistance can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. (A3) The cyclopolymerizable compound preferably has a vinyl group, a (meth)acryloyl group, or an α-(allyloxymethyl)acryloyl group, and more preferably has a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. In this case, the thermal cycling properties can be further enhanced, the reflow resistance can be further enhanced, and a partition wall with an even larger aspect ratio can be formed.

[0116] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound has a structure represented by the following formula (11).

[0117]

[0118] In formula (11) above, R represents an organic group having 1 to 200 carbon atoms.

[0119] (A3) If the cyclizable compound has the structure represented by formula (11) above, the cyclizable compound (A3) can form a polymer having a five-membered ring ether structure in its main chain by radical polymerization.

[0120] In formula (11) above, the number of carbon atoms in R is 1 or more, 200 or less, preferably 150 or less, and more preferably 100 or less. In formula (11) above, R is preferably an alkyl group. In formula (11) above, R may be a linear alkyl group, a branched alkyl group, or a cyclic alkyl group. In formula (11) above, R may contain an ether bond.

[0121] In the above formula (11), R can be a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, isobutyl group, phenyl group, pentyl group, vinyl group, allyl group, clotyl group, cyclopropyl group, cyclobutyl group, cyclohexyl group, tetrahydrofurfuryl group, methoxymethyl group, methoxyethyl group, ethoxymethyl group, ethoxyethyl group, phenoxyethyl group, vinyloxyethyl group, epoxy group, isobornyl group, adamantyl group, dicyclopentadienyl group, and oxetanyl group.

[0122] From the viewpoint of adjusting the viscosity of the curable composition to an appropriate range and dispensing the curable composition well using an inkjet device, in formula (11) above, R is preferably a methyl group or an ethyl group, and more preferably a methyl group.

[0123] (A3) The cyclizable compound may have an alicyclic skeleton. (A3) The cyclizable compound may be a cyclizable compound having an alicyclic skeleton. (A3) The cyclizable compound may have a cyclizable group and also have an alicyclic skeleton.

[0124] Examples of cyclopolymerizable compounds having the above-mentioned alicyclic skeleton include cyclohexyl-2-(allyloxymethyl)acrylic acid, isobornyl-2-(allyloxymethyl)acrylic acid, and tricyclodecanedimethyldi-2-(allyloxymethyl)acrylic acid.

[0125] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound contains methyl-2-(allyloxymethyl)acrylic acid (i.e., methyl 2-(allyloxymethyl)acrylate).

[0126] In 100% by weight of the above curable composition, the content of (A3) cyclizable compound is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the content of (A3) cyclizable compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of (A3) cyclizable compound is above the lower limit and below the upper limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling properties (suppression of peeling and suppression of cracking) can be further enhanced. Also, when the content of (A3) cyclizable compound is above the lower limit, the thermal cycling properties (especially the suppression of cracking) can be further enhanced. In 100% by weight of the above curable composition, the range of the content of (A3) cyclizable compound can be set by appropriately selecting the lower limit and upper limit values.

[0127] <(B) Photopolymerization initiator> The above curable composition contains (B) a photopolymerization initiator. (B) may be used alone or in combination of two or more types.

[0128] The above curable composition contains (B1) an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, or (Ba) an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more. Hereinafter, "(B1) an α-aminoketone-based photopolymerization initiator that is liquid at 25°C" may be referred to as "(B1) photopolymerization initiator." Hereinafter, "(Ba) an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more" may be referred to as "(Ba) photopolymerization initiator."

[0129] In the curable composition according to the present invention, (B) the photopolymerization initiator may contain (B1) the photopolymerization initiator, or it may contain (Ba) the photopolymerization initiator. The curable composition may contain or may not contain photopolymerization initiators other than (B1) the photopolymerization initiator. The curable composition may contain or may not contain photopolymerization initiators other than (Ba) the photopolymerization initiator. The curable composition according to the present invention may satisfy the first configuration, or the second configuration, or it may satisfy both the first configuration and the second configuration. The curable composition according to the present invention only needs to satisfy at least one of the first configuration and the second configuration.

[0130] (B1) The photopolymerization initiator may be an α-aminoketone-based photopolymerization initiator that is liquid at 25°C and has a molecular weight of 500 or more. (B1) The photopolymerization initiator may be an α-aminoketone-based photopolymerization initiator that is liquid at 25°C and has a molecular weight of less than 500. (Ba) The photopolymerization initiator may be an α-aminoketone-based photopolymerization initiator that is liquid at 25°C and has a molecular weight of 500 or more. (Ba) The photopolymerization initiator may be an α-aminoketone-based photopolymerization initiator that is solid at 25°C and has a molecular weight of 500 or more.

[0131] (B) Examples of photopolymerization initiators include photoradical polymerization initiators and photocationic polymerization initiators. (B) The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0132] The above-mentioned photoradical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.

[0133] Examples of the above-mentioned photoradical polymerization initiators include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpho Linopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, N,N-dimethylaminoacetophenone, polyethylene glycol di(beta-4-[4-(2-dimethylamino-2-benzyl)butaonylphenyl]piperazine)propio Aminoacetophenone compounds such as methyl anthraquinone, 2-ethyl anthraquinone, 2-t-butyl anthraquinone, and other anthraquinone compounds; thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,4,6-trimethyl Acyl phosphine oxide compounds such as benzoyl)-phenylphosphine oxide, ethyl phenyl(2,4,6-trimethylbenzoyl)phosphinate, and polymeric ethyl(2,4,6-trimethylbenzoyl)-phenylphosphinate; oxime ester compounds such as 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyl oxime)], ethanone, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(o-acetyl oxime);Examples include titanocene compounds such as bis(cyclopentadienyl)-diphenyl-titanium, bis(cyclopentadienyl)-dichloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrole-1-yl)phenyl)titanium. The above photoradical polymerization initiators may be used individually or in combination of two or more.

[0134] In addition to the above-mentioned photoradical polymerization initiator, a photopolymerization initiator aid may also be used. Examples of such photopolymerization initiator aids include (methylimino)diethylene-bis[4-(dimethylamino)benzoate], polyethylene glycol (200) di(β-(4(pasetylphenyl)piperazine))propionate, N,N-dimethylaminobenzoate ethyl ester, N,N-dimethylaminobenzoate isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Other photopolymerization initiator aids may also be used. The above-mentioned photopolymerization initiator aids may be used individually or in combination of two or more.

[0135] Additionally, titaniumene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals), which have absorption in the visible light region, may be used to promote the photoreaction.

[0136] Examples of the above-mentioned photocationic polymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzointosylates. One of these photocationic polymerization initiators may be used, or two or more may be used in combination.

[0137] In 100% by weight of the above curable composition, the content of (B) photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, even more preferably 1% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less. When the content of (B) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling characteristics (especially the ability to suppress peeling) can be further enhanced. Furthermore, when the content of (B) photopolymerization initiator is above the lower limit and below the upper limit, a partition with an even larger aspect ratio can be formed.

[0138] (A) The content of (B) the photopolymerization initiator per 100 parts by weight of the photocurable compound is preferably 1% by weight or more, more preferably 3% by weight or more, even more preferably 5% by weight or more, still more preferably 6% by weight or more, even more preferably 7% by weight or more, particularly preferably 8% by weight or more, most preferably 10% by weight or more, preferably 35% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less. If the content of (B) the photopolymerization initiator is above the lower limit above, the photocurability can be further enhanced and a partition with an even larger aspect ratio can be formed. If the content of (B) the photopolymerization initiator is below the upper limit above, the adhesive strength of the cured product of the curable composition can be increased and the thermal cycling properties (in particular, the ability to suppress peeling) can be further enhanced.

[0139] (B1) An α-aminoketone-based photopolymerization initiator that is liquid at 25°C, and (Ba) an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more: The effects of the present invention can be achieved by using (B1) the photopolymerization initiator or (Ba) the photopolymerization initiator. In particular, the effects of the present invention can be achieved by using (B1) the photopolymerization initiator or (Ba) the photopolymerization initiator in combination with (C1) a thermosetting compound that is liquid at 25°C. Only one type of (B1) photopolymerization initiator may be used, or two or more types may be used in combination. Only one type of (Ba) photopolymerization initiator may be used, or two or more types may be used in combination.

[0140] (B1) Examples of photopolymerization initiators include α-aminoketone-based photopolymerization initiators that are liquid at 25°C, among the compounds listed as photopolymerization initiators in (B).

[0141] (Ba) Examples of photopolymerization initiators include α-aminoketone-based photopolymerization initiators with a molecular weight of 500 or more, among the compounds listed as (B) photopolymerization initiators. (Ba) Other photopolymerization initiators besides the compounds listed as (B) photopolymerization initiators can also be used. (Ba) Examples of photopolymerization initiators (with a molecular weight of 500 or more) include the photopolymerization initiator with CAS number 886463-10-1, and other examples include the photopolymerization initiators described in Synthesis Example 3 or Synthesis Example 6 of WO2006 / 082477A1.

[0142] (B) The photopolymerization initiator preferably includes a photopolymerization initiator with CAS number 886463-10-1. In this case, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0143] The molecular weight of (B) photopolymerization initiator and (B1) photopolymerization initiator is preferably 300 or more, more preferably 500 or more, even more preferably 600 or more, still more preferably 700 or more, particularly preferably 800 or more, most preferably 900 or more, preferably 1500 or less, more preferably 1400 or less, still more preferably 1300 or less, particularly preferably 1200 or less, and most preferably 1150 or less. The molecular weight of (B) photopolymerization initiator and (B1) photopolymerization initiator may be 1100 or less. If the molecular weight of (B) photopolymerization initiator and (B1) photopolymerization initiator is above the lower limit above, the effects of the present invention can be further enhanced. If the molecular weight of (B) photopolymerization initiator and (B1) photopolymerization initiator is below the upper limit above, the occurrence of cracks in the cured product can be further suppressed.

[0144] (Ba) The molecular weight of the photopolymerization initiator is 500 or more. (Ba) The molecular weight of the photopolymerization initiator is preferably 600 or more, more preferably 700 or more, even more preferably 800 or more, particularly preferably 900 or more, preferably 1500 or less, more preferably 1400 or less, even more preferably 1300 or less, particularly preferably 1200 or less, and most preferably 1150 or less. (Ba) The molecular weight of the photopolymerization initiator may be 1100 or less. (Ba) If the molecular weight of the photopolymerization initiator is above the lower limit above, the effects of the present invention can be enhanced even more effectively. (Ba) If the molecular weight of the photopolymerization initiator is below the upper limit above, the occurrence of cracks in the cured product can be further suppressed.

[0145] Specifically, cracks may occur due to the volatilization of unreacted components in the cured product during the thermal cycle. However, by having molecular weights of (B) photopolymerization initiator, (B1) photopolymerization initiator, and (Ba) photopolymerization initiator above the above lower limit, the unreacted components of the photopolymerization initiator in the cured product are less likely to volatilize, thus further suppressing the occurrence of cracks in the cured product.

[0146] When the above curable composition contains (B1) photopolymerization initiator, it is preferable that the following content is satisfied. The content of (B1) photopolymerization initiator in 100% by weight of the above curable composition is preferably 1% by weight or more, more preferably 3% by weight or more, even more preferably 5% by weight or more, particularly preferably 6% by weight or more, most preferably 7% by weight or more, preferably 35% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less. When the content of (B1) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the content of (B1) photopolymerization initiator is above the lower limit and below the upper limit, a partition with an even larger aspect ratio can be formed. Furthermore, if the content of (B1) the photopolymerization initiator is above the lower limit and below the upper limit, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0147] When the above curable composition contains a (Ba) photopolymerization initiator, it is preferable that the following content is satisfied. The content of the (Ba) photopolymerization initiator in 100% by weight of the above curable composition is preferably 1% by weight or more, more preferably 3% by weight or more, even more preferably 5% by weight or more, particularly preferably 6% by weight or more, most preferably 7% by weight or more, preferably 35% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less. When the content of the (Ba) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the content of the (Ba) photopolymerization initiator is above the lower limit and below the upper limit, a partition with an even larger aspect ratio can be formed. Furthermore, if the content of (Ba) photopolymerization initiator is above the lower limit and below the upper limit, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0148] (A) The content of (B1) the photopolymerization initiator per 100 parts by weight of the photocurable compound is preferably 3 parts by weight or more, more preferably 6 parts by weight or more, even more preferably 8 parts by weight or more, particularly preferably 10 parts by weight or more, preferably 40 parts by weight or less, more preferably 35 parts by weight or less, even more preferably 30 parts by weight or less, particularly preferably 25 parts by weight or less. If the content of (B1) the photopolymerization initiator is above the lower limit above, the photocurability can be further enhanced and a partition with an even larger aspect ratio can be formed. If the content of (B1) the photopolymerization initiator is below the upper limit above, the adhesive strength of the cured product of the curable composition can be increased and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0149] (A) The content of (Ba) photopolymerization initiator per 100 parts by weight of the photocurable compound is preferably 3 parts by weight or more, more preferably 6 parts by weight or more, even more preferably 8 parts by weight or more, particularly preferably 10 parts by weight or more, preferably 40 parts by weight or less, more preferably 35 parts by weight or less, even more preferably 30 parts by weight or less, particularly preferably 25 parts by weight or less. If the content of (Ba) photopolymerization initiator is above the lower limit, the photocurability can be further enhanced and a partition with an even larger aspect ratio can be formed. If the content of (Ba) photopolymerization initiator is below the upper limit, the adhesive strength of the cured product of the curable composition can be increased and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0150] (A) It is particularly preferable that the content of (B1) photopolymerization initiator and (Ba) photopolymerization initiator are each 1 part by weight or more and 30 parts by weight or less per 100 parts by weight of the photocurable compound. In this case, the occurrence of cracks in the cured product can be further suppressed.

[0151] (A) It is particularly preferable that the content of (B1) the photopolymerization initiator and (Ba) the photopolymerization initiator are each 8 parts by weight or more and 40 parts by weight or less per 100 parts by weight of the photocurable compound. In this case, the bleeding of the curable composition can be further suppressed.

[0152] (A) It is particularly preferable that the content of (B1) the photopolymerization initiator and (Ba) the photopolymerization initiator are each 8 parts by weight or more and 30 parts by weight or less per 100 parts by weight of the photocurable compound. In this case, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0153] <(C) Thermosetting Compound> The above curable composition contains (C) a thermosetting compound. (C) A thermosetting compound is a compound that can be thermoset. (C) A thermosetting compound has a thermosetting functional group. (C) A thermosetting compound may be used alone, or two or more may be used in combination.

[0154] (C) Thermosetting compounds include (C1) thermosetting compounds that are liquid at 25°C. Hereinafter, "(C1) thermosetting compounds that are liquid at 25°C" may be referred to as "(C1) thermosetting compounds".

[0155] The above curable composition may or may not contain thermosetting compounds other than the (C1) thermosetting compound.

[0156] (C) Examples of thermosetting compounds include thermosetting compounds having a maleimide group, thermosetting compounds having a cyclic ether group, thermosetting compounds having a cyclic thioether group, thermosetting compounds having a thiirane group, and thermosetting compounds having a vinyl group.

[0157] From the viewpoint of enhancing thermosetting properties, (C) the thermosetting compound preferably has a cyclic ether group or a cyclic thioether group, and more preferably has an epoxy group. From the viewpoint of enhancing thermosetting properties, (C) the thermosetting compound preferably contains a thermosetting compound having a cyclic ether group or a thermosetting compound having a cyclic thioether group. From the viewpoint of enhancing thermosetting properties, (C) the thermosetting compound preferably contains an epoxy compound.

[0158] Examples of the epoxy compounds mentioned above include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, cresol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine core as their skeleton.

[0159] The epoxy compound described above may also be a glycidyl ether type epoxy compound. A glycidyl ether type epoxy compound is an epoxy compound having at least one glycidyl ether group. Alternatively, the epoxy compound may also be a glycidylamine type epoxy compound. A glycidylamine type epoxy compound is an epoxy compound having at least one glycidylamine group.

[0160] From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (especially the ability to suppress peeling), (C) the thermosetting compound preferably has an aromatic skeleton and more preferably contains a bisphenol A type epoxy compound or a bisphenol F type epoxy compound.

[0161] (C) The thermosetting compound more preferably contains a bisphenol A type epoxy compound that is liquid at 25°C, or a bisphenol F type epoxy compound that is liquid at 25°C. In this case, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0162] (C) The thermosetting compound preferably does not have a photocurable functional group and preferably does not have a (meth)acryloyl group.

[0163] In 100% by weight of the above curable composition, the content of (C) thermosetting compound is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, particularly preferably 15% by weight or more, preferably 45% by weight or less, more preferably 40% by weight or less, even more preferably 35% by weight or less, particularly preferably 30% by weight or less. When the content of (C) thermosetting compound is above the lower limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling properties (especially the ability to suppress peeling) can be further enhanced. When the content of (C) thermosetting compound is below the upper limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed.

[0164] In 100% by weight of the above curable composition, the content of the (C1) thermosetting compound is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, particularly preferably 15% by weight or more, preferably 45% by weight or less, more preferably 40% by weight or less, even more preferably 35% by weight or less, and particularly preferably 30% by weight or less. When the content of the (C1) thermosetting compound is above the lower limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling properties (especially the ability to suppress peeling) can be further enhanced. When the content of the (C1) thermosetting compound is below the upper limit, the photocurability can be further enhanced, and partitions with an even larger aspect ratio can be formed. Furthermore, when the content of the (C1) thermosetting compound is above the lower limit and below the upper limit, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0165] In the above curable composition, the content of the (C1) thermosetting compound is preferably 5% by weight or more and 45% by weight or less. In this case, the adhesive strength of the cured product of the above curable composition can be further increased.

[0166] In the above curable composition, the content of the (C1) thermosetting compound is preferably 1% by weight or more and 35% by weight or less. In this case, the seepage of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed.

[0167] In the above curable composition, the content of the (C1) thermosetting compound is preferably 5% by weight or more and 35% by weight or less. In this case, the bleeding of the curable composition can be further suppressed, and the occurrence of cracks in the cured product can be further suppressed. Furthermore, the adhesive strength of the cured product of the above curable composition can be further increased.

[0168] In 100% by weight of the above curable composition, the total content of (C) thermosetting compound and (D) thermosetting agent is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, particularly preferably 15% by weight or more, preferably 45% by weight or less, more preferably 40% by weight or less, even more preferably 35% by weight or less, particularly preferably 30% by weight or less. If the total content of (C) thermosetting compound and (D) thermosetting agent is above the lower limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (especially the ability to suppress peeling) can be further enhanced. If the total content of (C) thermosetting compound and (D) thermosetting agent is below the upper limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed.

[0169] <(D) Thermosetting agent> The above curable composition contains (D) thermosetting agent. (D) thermosetting agent heat-cures (C) thermosetting compound. (D) may be used alone or in combination of two or more types.

[0170] (D) Examples of thermosetting agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. (D) Modified polyamine compounds such as amine-epoxy adducts may also be used as thermosetting agents. (D) Only one type of thermosetting agent may be used, or two or more types may be used in combination.

[0171] The above-mentioned amine compound refers to a compound having one or more primary to tertiary amino groups. Examples of the above-mentioned amine compound include (1) aliphatic amines, (2) alicyclic amines, (3) aromatic amines, (4) hydrazides, and (5) guanidine derivatives. Adduct forms of the above-mentioned amine compound may be used, such as epoxy compound-added polyamines (reaction product of epoxy compound and polyamine), Michael-added polyamines (reaction product of α,β-unsaturated ketone and polyamine), Mannich-added polyamines (condensate of polyamine, formalin, and phenol), thiourea-added polyamines (reaction product of thiourea and polyamine), and ketone-blocked polyamines (reaction product of ketone compound and polyamine [ketimine]).

[0172] Examples of the aliphatic amines mentioned in (1) above include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0173] Examples of the alicyclic amines in (2) above include mensendiamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0174] The above (3) aromatic amines include m-phenylenediamine, p-phenylenediamine, o-xylenediamine, m-xylenediamine, p-xylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenyl ether, 4,4-diamino-3,3-diethyl-5,5-dimethyldiphenylmethane, diphenylmethane, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1, Examples include 1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0175] Examples of the hydrazides mentioned in (4) above include carbodihydrazide, adipic acid dihydrazide, sebacate acid dihydrazide, dodecanediic acid dihydrazide, and isophthalic acid dihydrazide.

[0176] Examples of the above (5) guanidine derivatives include dicyandiamide, 1-o-tolyl diguanide, α-2,5-dimethylguanide, α,ω-diphenyl diguanidide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyl diguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)]diguanide, phenyl diguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0177] Examples of the above-mentioned phenol compounds include polyhydric phenol compounds. Examples of the above-mentioned polyhydric phenol compounds include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabrombisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, xylylene skeleton-containing phenol novolac resin, dicyclopentadiene skeleton-containing phenol novolac resin, and fluorene skeleton-containing phenol novolac resin.

[0178] Examples of the above-mentioned acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecyl succinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0179] From the viewpoint of good ejection of the curable composition using an inkjet device, (D) the thermosetting agent is preferably an aromatic amine. The aromatic amine may have one, two, two or more, or three or more benzene rings. The aromatic amine may have 10 or fewer benzene rings. The aromatic amine may have one, two, two or more, or three or more amino groups. The aromatic amine may have 10 or fewer amino groups. From the viewpoint of good ejection of the curable composition using an inkjet device, it is preferable that the aromatic amine has two or more benzene rings and two or more amino groups.

[0180] From the viewpoint of good ejection of the curable composition using an inkjet device, it is preferable that in the above aromatic amine, adjacent benzene rings are bonded by oxygen atoms or sulfur atoms. From the viewpoint of good ejection of the curable composition using an inkjet device, it is preferable that in the above aromatic amine, adjacent benzene rings are bonded by ether bonds or thioether bonds.

[0181] Aromatic amines having two or more benzene rings and two or more amino groups, in which adjacent benzene rings are bonded by oxygen or sulfur atoms, include bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4-diaminodiphenylsulfone, and 4,4-diaminodiphenyl ether. From the viewpoint of good ejection of the curable composition using an inkjet device, the above aromatic amine is more preferably 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone, and even more preferably 1,3-bis(3-aminophenoxy)benzene. From the viewpoint of good ejection of the curable composition using an inkjet device, (D) the thermosetting agent is preferably composed of 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone, and more preferably composed of 1,3-bis(3-aminophenoxy)benzene.

[0182] (C) The content of the thermosetting agent is preferably 25 parts by weight or more, more preferably 30 parts by weight or more, even more preferably 35 parts by weight or more, preferably 90 parts by weight or less, more preferably 80 parts by weight or less, and even more preferably 70 parts by weight or less, per 100 parts by weight of the thermosetting compound. (D) When the content of the thermosetting agent is above the lower limit, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycle characteristics (especially the ability to suppress peeling) can be further enhanced. (D) When the content of the thermosetting agent is below the upper limit, the thermosetting properties can be further enhanced, and a partition with an even larger aspect ratio can be formed.

[0183] <Curing Accelerator> The above curable composition optionally contains a curing accelerator. The above curable composition may or may not contain the above curing accelerator. Only one type of curing accelerator may be used, or two or more types may be used in combination.

[0184] Examples of the curing accelerators mentioned above include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.

[0185] In 100% by weight of the above curable composition, the content of the above curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably 10% by weight or less, and more preferably 5% by weight or less.

[0186] <Solvent> The above curable composition optionally contains a solvent. The above curable composition may or may not contain a solvent. Only one type of solvent may be used, or two or more types may be used in combination.

[0187] Examples of the solvents mentioned above include water and organic solvents.

[0188] From the viewpoint of further improving the ability to remove residues, the above solvent is preferably an organic solvent.

[0189] Examples of the above-mentioned organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.

[0190] When forming a composition layer using the above-mentioned curable composition, from the viewpoint of further improving the thickness accuracy of the composition layer, it is preferable that the solvent content in the curable composition be as low as possible.

[0191] The curable composition is preferably free of solvent or contains the solvent in an amount of 5% by weight or less per 100% by weight of the curable composition. The solvent content per 100% by weight of the curable composition is preferably 0% by weight (not present) or more, preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. The curable composition is most preferably free of the solvent.

[0192] <Other Components> The above curable composition may contain other components besides those described above. Examples of these other components include coupling agents, flame retardants, colorants, fillers, leveling agents, defoamers, antioxidants, and polymerization inhibitors.

[0193] The above curable composition optionally contains a filler. The above curable composition may or may not contain a filler. Only one type of filler may be used, or two or more types may be used.

[0194] From the viewpoint of miniaturizing electronic components obtained by smoothly ejecting a curable composition using an inkjet device and applying the curable composition near electronic elements with high precision, it is preferable that the curable composition contains a filler in an amount of 30% by weight or less per 100% by weight of the curable composition, or does not contain a filler. When the curable composition contains a filler, the amount of the filler in 100% by weight of the curable composition is preferably 20% by weight or less, more preferably 10% by weight or less, and even more preferably 5% by weight or less. From the viewpoint of miniaturizing electronic components obtained by smoothly ejecting a curable composition using an inkjet device and applying the curable composition near electronic elements with high precision, it is most preferable that the curable composition does not contain a filler.

[0195] (Further details of the curable composition) The curable composition may satisfy, for example, the following configuration A, and may also satisfy the following configuration B.

[0196] Composition A: The inkjet-curable composition comprises a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent. In the inkjet-curable composition, the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C and has a molecular weight of less than 500, or an α-aminoketone-based photopolymerization initiator that has a molecular weight of 500 or more. In the inkjet-curable composition, the thermosetting compound comprises a thermosetting compound that is liquid at 25°C.

[0197] Composition B: The inkjet-curable composition comprises a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent. In the inkjet-curable composition, the photopolymerization initiator comprises either an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, or an α-aminoketone-based photopolymerization initiator that is solid at 25°C and has a molecular weight of 500 or more. In the inkjet-curable composition, the thermosetting compound comprises a thermosetting compound that is liquid at 25°C.

[0198] The above curable composition is preferably liquid at 25°C. Liquid includes paste-like forms. The viscosity of the above curable composition at 25°C and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 30 mPa·s or more, still more preferably 40 mPa·s or more, particularly preferably 60 mPa·s or more, and most preferably 80 mPa·s or more. The viscosity of the above curable composition at 25°C and 10 rpm is preferably 1000 mPa·s or less, more preferably 500 mPa·s or less, even more preferably 400 mPa·s or less, particularly preferably 300 mPa·s or less, and most preferably 160 mPa·s or less. From the viewpoint of further improving inkjet ejection performance, further improving the thickness accuracy of the composition layer, and further reducing the likelihood of voids occurring in the composition layer, it is particularly preferable that the viscosity of the curable composition at 25°C and 10 rpm be 10 mPa·s or more and 160 mPa·s or less.

[0199] The above viscosity is measured in accordance with JIS K2283 using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) under conditions of 25°C and 10 rpm.

[0200] The above-mentioned curable composition is used after curing by irradiation with light. Preferably, the above-mentioned curable composition is used after curing by irradiation with light and then curing by heating.

[0201] The above curable composition is preferably used, for example, to form partitions (use of the above curable composition for forming partitions). Partitions can be formed using the above curable composition. It is preferable that the above curable composition is used to form partitions. It is preferable that the above curable composition is a curable composition for forming partitions. It is preferable that the above curable composition is used to form partitions in electronic components (use of the above curable composition for forming partitions in electronic components). The above curable composition is particularly preferably used to form partitions in LED modules (use of the above curable composition for forming partitions in LED modules). It is preferable that the above curable composition is a curable composition for forming partitions. The above curable composition is preferably used to form partitions in the gaps between multiple LED chips (use of the above curable composition for forming partitions in the gaps between multiple LED chips). The above curable composition is preferably used to form partitions at the periphery of the mounting area of ​​an LED chip (use of the above curable composition for forming partitions at the periphery of the mounting area of ​​an LED chip). This makes it possible to increase the utilization efficiency of light generated from the LED chips and suppress discoloration when the LED module is viewed from an oblique angle. Furthermore, if the LED chip is an LED chip that emits ultraviolet light (UV-LED chip), the luminous efficiency of the LED chip itself may be low. Since the light extraction efficiency can be increased by using the above-mentioned curable composition, the above-mentioned curable composition can be used particularly suitably when the LED chip is an LED chip that emits ultraviolet light.

[0202] The curable composition is preferably used by being applied to the first surface of the substrate so as to surround the electronic element placed on the first surface of the substrate. The curable composition is preferably used by being applied in a frame shape on the first surface of the substrate. The curable composition is preferably used to form a frame-shaped partition (use of the curable composition to form a frame-shaped partition). It is preferable that an electronic element is located inside the frame-shaped partition. It is preferable that an internal space is located inside the partition. It is preferable that a void is located inside the partition.

[0203] Furthermore, the above-mentioned curable composition may be used for applications other than partition formation. Such applications include, for example, marking materials, adhesives, coating materials, and light-shielding materials. Since peeling and cracking can be effectively suppressed by using the curable composition according to the present invention, reliability can be improved by using the curable composition according to the present invention in marking materials, adhesives, coating materials, and light-shielding materials. Because the curable composition according to the present invention allows for fine coating, which is a characteristic of inkjet printing, it can be more preferably used as a marking material for electronic components, an adhesive for electronic components, a coating material for electronic components, or a light-shielding material for electronic components.

[0204] (Electronic components and methods for manufacturing electronic components) This section describes electronic components (LED modules, etc.) and methods for manufacturing electronic components (LED modules, etc.).

[0205] This specification also discloses inventions for electronic components (such as LED modules) and methods for manufacturing electronic components (such as LED modules). The electronic components disclosed below are preferably LED modules. The methods for manufacturing electronic components disclosed below are preferably methods for manufacturing LED modules. The electronic elements described below are preferably LED chips.

[0206] The electronic component (LED module, etc.) according to the present invention comprises a substrate, an electronic element (LED chip, etc.) disposed on a first surface of the substrate, and a partition wall disposed on the first surface of the substrate. In the electronic component (LED module, etc.), the partition wall is arranged on the first surface of the substrate so as to surround the electronic element (LED chip). In the electronic component (LED module, etc.), the partition wall is a cured product of the inkjet curable composition described above.

[0207] Furthermore, the method for manufacturing an electronic component (such as an LED module) according to the present invention comprises the following steps: A coating step (1) in which the above-mentioned inkjet-curable composition is applied to a first surface of a substrate using an inkjet device to form a composition layer (curable composition layer); and a curing step (2) in which the composition layer is cured to form a partition wall. The method for manufacturing an electronic component according to the present invention provides an electronic component in which an electronic element is arranged on the first surface of the substrate, and the partition wall is arranged on the first surface of the substrate so as to surround the electronic element.

[0208] The electronic component (LED module, etc.) and the method for manufacturing the electronic component (LED module, etc.) according to the present invention, having the above configuration, can suppress both the bleeding of the curable composition applied using an inkjet device and the occurrence of cracks in the cured product. Furthermore, the electronic component (LED module, etc.) and the method for manufacturing the electronic component (LED module, etc.) according to the present invention, having the above configuration, can increase the adhesive strength of the cured product of the curable composition. Furthermore, the electronic component (LED module, etc.) and the method for manufacturing the electronic component (LED module, etc.) according to the present invention, having the above configuration, can form partitions with a large aspect ratio. Moreover, the electronic component (LED module, etc.) and the method for manufacturing the electronic component (LED module, etc.) according to the present invention, having the above configuration, can increase the efficiency of light extraction from electronic elements (LED chips, etc.).

[0209] In the coating step (1) described above, it is preferable to coat the above-mentioned inkjet-curable composition in a frame shape on the first surface of the substrate, and it is preferable to form a frame-shaped composition layer.

[0210] In the method for manufacturing electronic components according to the present invention, an electronic component body is prepared in which an electronic element is arranged on the first surface of the substrate, and a coating step (1A) is performed in which the above-mentioned inkjet-curable composition is applied to the first surface of the substrate on the electronic component body using an inkjet device to form a composition layer. Alternatively, in the method for manufacturing electronic components according to the present invention, a mounting step (0) is performed before the coating step (1) in which an electronic element is arranged on the first surface of the substrate to obtain the electronic component body.

[0211] After the curing step (2) described above, a mounting step (3) may be performed in which the electronic elements are placed on the first surface of the substrate and inside the region surrounded by the partition wall.

[0212] The curing step (2) described above preferably comprises a photocuring step (2A) in which light is irradiated onto the composition layer to form a B-stage compound, and a thermocuring step (2B) in which the B-stage compound is heat-cured to form a partition wall.

[0213] Specific embodiments of the present invention will be described below with reference to the drawings. Note that the size, thickness, and shape shown in the following drawings may differ from the actual size, thickness, and shape for illustrative purposes.

[0214] Figure 1(a) is a schematic plan view showing an electronic component obtained using a curable composition according to a first embodiment of the present invention. Figure 2(b) is a schematic cross-sectional view showing the electronic component. Figure 2(b) is a cross-sectional view taken along the line I-I in Figure 1(a).

[0215] The electronic component 1 shown in Figures 1(a) and 2(b) comprises a substrate 11, an electronic element 12 disposed on a first surface 11a of the substrate 11, and a partition wall 13 disposed on the first surface 11a of the substrate 11. In the electronic component 1, the partition wall 13 is arranged on the first surface 11a of the substrate 11 so as to surround the electronic element 12. In the electronic component 1, the partition wall 13 is a cured product of the curable composition described above. There is a gap between the outer surface of the electronic element 12 and the inner surface of the partition wall 13. A space exists between the outer surface of the electronic element 12 and the inner surface of the partition wall 13. In the electronic component 1, the partition wall 13 is formed from the curable composition described above. The partition wall 13 is not disposed (formed) on the surface of the electronic element 12. The upper surface of the electronic element 12 is not covered by the partition wall 13. The shape of the partition wall 13 is frame-like.

[0216] Figure 3 is a schematic cross-sectional view showing an electronic component obtained using a curable composition according to a second embodiment of the present invention.

[0217] The electronic component 1A shown in Figure 3 further comprises a substrate 11, an electronic element 12 disposed on a first surface 11a of the substrate 11, a partition wall 13 disposed on the first surface 11a of the substrate 11, and a reflective film 14 disposed on the inner wall surface (inner surface) of the partition wall 13. There is a gap between the outer surface of the electronic element 12 and the inner surface of the partition wall 13. There is a gap between the outer surface of the electronic element 12 and the inner surface of the partition wall 13. There is a gap between the outer surface of the electronic element 12 and the inner surface of the reflective film 14. There is a space between the outer surface of the electronic element 12 and the inner surface of the reflective film 14. Electronic component 1A differs from electronic component 1 only in the presence or absence of the reflective film 14. The electronic component may or may not further have a reflective film on the inner wall surface of the partition wall.

[0218] Referring to Figures 4(a), 4(b), 5(c), 5(d), 6(e), 6(f), and 7(g), an example of a manufacturing method for the electronic component 1 shown in Figures 1(a) and 2(b) will be described. In the following example of a manufacturing method, a coating step (1), a photocuring step (2A), a thermocuring step (2B), and a mounting step (3) are performed.

[0219] First, an inkjet curable composition (curable composition) is prepared, comprising (A) a photocurable compound, (B) a photopolymerization initiator, (C) a thermosetting compound, and (D) a thermosetting agent. The curable composition comprises (B1) a photopolymerization initiator and (C1) a thermosetting composition.

[0220] Next, as shown in Figure 4(a), the curable composition is applied to the first surface 11a of the substrate 11 using an inkjet device to form a composition layer 13A (coating step (1)). The curable composition is ejected from the ejection unit 51 of the inkjet device. In the coating step (1), it is preferable to apply the curable composition in a frame shape.

[0221] Furthermore, as shown in Figure 4(b), light is irradiated onto the composition layer 13A from the light irradiation section 52 of the inkjet device to advance the curing of the composition layer 13A and form the B-stage compound 13B (photocuring step (2A)). The B-stage compound 13B is a pre-cured product of the curable composition.

[0222] Furthermore, in the above method for manufacturing electronic components, after applying the curable composition to a specific area, the entire applied curable composition may be irradiated with light to form a B-stage compound. In the above method for manufacturing electronic components, the applied curable composition may be irradiated with light each time multiple drops of the curable composition are applied to form a B-stage compound. In the above method for manufacturing electronic components, the applied curable composition may be irradiated with light each time one drop of the curable composition is applied to form a B-stage compound.

[0223] After the above photocuring step (2A), it is determined whether or not to repeat the above coating step (1) and the above photocuring step (2A). If the above coating step (1) and the above photocuring step (2A) are repeated, the curable composition is applied to the surface side of the formed B-stage compound 13B that is opposite to the substrate 11 side.

[0224] Figures 5(c) and 5(d) show the second coating step (1) and the second photocuring step (2A), respectively. As shown in Figure 5(c), a curable composition is applied to the surface of the B-stage material 13B opposite to the substrate 11 side using an inkjet device, forming a composition layer 13A on the surface of the B-stage material 13B. Next, as shown in Figure 5(d), light is irradiated onto the applied composition layer 13A from the light irradiation unit 52 of the inkjet device to form the B-stage material 13B. In the above photocuring step (2A), it is preferable to form a frame-shaped composition layer.

[0225] In Figures 4(a), 4(b), 5(c), and 5(d), the coating step (1) and the photocuring step (2A) are performed twice in the thickness direction of the composition layer 13A, as shown in Figures 4(a) and 4(b), and as shown in Figures 5(c) and 5(d). By performing the coating step (1) and the photocuring step (2A) multiple times in the thickness direction of the composition layer, the thickness of the B-stage compound can be increased, and the aspect ratio (thickness / width) of the B-stage compound can be increased. The coating step (1) and the photocuring step (2A) may each be performed two or more times, or three or more times.

[0226] By repeating the above coating step (1) and the above photocuring step (2A), the B-stage compound 13B shown in Figure 6(e) is formed.

[0227] Next, as shown in Figure 6(f), the B-stage compound 13B is heat-cured (thermosetting step (2B)). The structure comprising the substrate 11 and the B-stage compound 13B obtained in Figure 6(e) is heated to heat-cur the B-stage compound 13B. This forms a partition wall 13. The partition wall 13 is a cured layer of the curable composition. In the above thermosetting step (2B), it is preferable to form a frame-shaped partition wall.

[0228] Next, as shown in Figure 7(g), the electronic element 12 is placed on the first surface 11a of the substrate 11 and inside the area surrounded by the partition wall 13 (mounting step (3)). In this way, the electronic component 1 shown in Figures 1(a) and 2(b) can be obtained.

[0229] Furthermore, after the thermosetting process (2B) shown in Figure 6(f) and before the placement process of the electronic element 12 shown in Figure 7(g), a reflective film may be further formed on the inner wall surface of the partition wall 13. If a reflective film is further formed on the inner wall surface of the partition wall 13, the electronic component 1A shown in Figure 3 is manufactured.

[0230] The above-mentioned curable composition is preferably dispensed by the inkjet device while heated to a temperature of 40°C to 100°C. From the viewpoint of continuously dispensing the curable composition for a long period of time, it is preferable to apply the curable composition while circulating it.

[0231] When circulating the above-mentioned curable composition while heating it, the temperature of the curable composition can be adjusted by introducing a heating element into the ink tank of the inkjet device or by using a heating element in the circulation channel.

[0232] In the above photocuring step (2A), it is preferable that ultraviolet light is irradiated. The irradiance and irradiation time of the ultraviolet light in the above photocuring step (2A) can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition. The irradiance of the ultraviolet light in the above photocuring step (2A) is, for example, 1000 mW / cm². ２ It may be greater than or equal to 2000 mW / cm². ２ It may be greater than or equal to 5000 mW / cm². ２ It may be greater than or equal to 10,000 mW / cm². ２ It may also be less than 8000 mW / cm². ２ The following is also possible: The irradiation time of ultraviolet light in the above photocuring step (2A) may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.

[0233] The time between the above coating step (1) and irradiation with ultraviolet light can be appropriately changed depending on the composition of the curable composition (especially its curability) and the coating thickness. The time between the above coating step (1) and irradiation with ultraviolet light may be 0.001 seconds or more, 0.01 seconds or more, 0.1 seconds or more, 40 seconds or less, 4 seconds or less, or 0.4 seconds or less. The time between the above coating step (1) and irradiation with ultraviolet light can be adjusted by the ejection speed of the inkjet device and the distance between the ejection section and the light irradiation section of the inkjet device.

[0234] The heating temperature and heating time in the above-mentioned thermosetting step (2B) can be appropriately changed depending on the composition of the curable composition and the thickness of the B-stage compound. The heating temperature in the above-mentioned thermosetting step (2B) may be, for example, 100°C or higher, 120°C or higher, 250°C or lower, or 200°C or lower. The heating time in the above-mentioned thermosetting step (2B) may be, for example, 5 minutes or higher, 30 minutes or higher, 600 minutes or lower, or 300 minutes or lower.

[0235] In the above-mentioned electronic component, it is preferable that the partition wall is arranged in a frame shape. In the above-mentioned electronic component, it is preferable that the partition wall is not located in the center of the substrate.

[0236] When the above electronic component is an LED module and the above electronic element is an LED chip, from the viewpoint of increasing the brightness of the LED module, it is preferable that there is a gap between the outer surface of the LED chip and the inner surface of the partition wall. From the viewpoint of increasing the brightness of the LED module, it is preferable that there is a space between the outer surface of the LED chip and the inner surface of the partition wall.

[0237] The width and height of the above-mentioned bulkhead can be changed as appropriate.

[0238] The width of the above-mentioned partition may be 30 μm or more, 50 μm or more, 70 μm or more, 1000 μm or less, 800 μm or less, or 700 μm or less.

[0239] From the viewpoint of further improving the efficiency of light extraction from the LED chip, the height of the LED chip is preferably 10 μm or more, more preferably 20 μm or more, even more preferably 50 μm or more, preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 150 μm or less.

[0240] From the viewpoint of further improving the efficiency of light extraction from the LED chip, the height of the partition wall is preferably 100 μm or more, more preferably 250 μm or more, even more preferably 400 μm or more, preferably 3000 μm or less, more preferably 2000 μm or less, and even more preferably 1500 μm or less.

[0241] From the viewpoint of further improving the efficiency of light extraction from the LED chip, the height of the partition wall is preferably 50 μm or more higher than the height of the LED chip, more preferably 100 μm or more higher, and even more preferably 200 μm or more higher.

[0242] The aspect ratio (height / width ratio) of the partition wall is preferably 3 or more, more preferably 4 or more, and even more preferably 5 or more. The aspect ratio (height / width ratio) of the partition wall may be 100 or less, 50 or less, 25 or less, or 15 or less.

[0243] The above-mentioned substrate may or may not be made of a transparent material. Examples of the above-mentioned substrate include circuit boards and silicon substrates.

[0244] Examples of the above electronic elements include light-emitting elements. Preferably, the above electronic element is a light-emitting element. Examples of the above electronic elements include semiconductor elements, etc. Preferably, the above electronic element is a semiconductor element. Examples of the above semiconductor elements include LED chips, etc. Preferably, the above semiconductor element is an LED chip.

[0245] The LED chip may be a red LED chip, a blue LED chip, a green LED chip, a UV-LED chip, or a combination of these LED chips. The UV-LED chip may be a deep ultraviolet UV-LED chip.

[0246] From the viewpoint of further improving the efficiency of light extraction from the LED chip, it is preferable that the LED module further comprises a reflective film on the inner wall surface of the partition. The reflective film may or may not be formed on the outer wall surface of the partition.

[0247] From the viewpoint of further improving the efficiency of extracting light generated from the LED chip, it is preferable that the manufacturing method of the electronic component further includes a step of forming a reflective film on the inner wall surface of the partition wall.

[0248] Examples of materials for the reflective film include silver, chromium, copper, niobium, niobium oxide, hafnium, hafnium oxide, silicon, silicon dioxide, titanium, and aluminum. Only one of these materials may be used, or two or more may be used in combination. From the viewpoint of further improving the utilization efficiency of light generated from the LED chip, the material for the reflective film is preferably aluminum.

[0249] Methods for forming the above-mentioned reflective film on the inner wall surface of the partition include electroless plating, electroplating, physical impact, mechanochemical reaction, physical film formation, or physical adsorption, as well as coating the surface of the partition with metal powder or a paste containing metal powder and a binder. The method for forming the above-mentioned reflective film on the inner wall surface of the partition is preferably electroless plating, electroplating, or physical impact. Examples of the physical film formation method include vacuum deposition, ion plating, and ion sputtering. Furthermore, a sheeter composer (manufactured by Tokuju Kogyo Co., Ltd.) can be used as the physical impact method.

[0250] The shape of the electronic component described above is not particularly limited. The electronic component may be round, rectangular, or triangular in shape.

[0251] The present invention will be described in more detail below with reference to examples. The present invention is not limited to the following examples.

[0252] The following materials were prepared.

[0253] ((A) Photocurable compound) Ethoxylated bisphenol A diacrylate (APG-700, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (A1) First (meth)acrylate compound) Tripropylene glycol diacrylate (APG-200, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (A1) First (meth)acrylate compound) Tricyclodecanedimethanol diacrylate (IRR214-K, manufactured by Daicel Ornex, Inc., (A1) First (meth)acrylate compound) Bisacrylic acid (2,2-dimethylethylene) (5-ethyl-1,3-dioxan-2,5-diyl)methylene (KAYARAD R604, manufactured by Nippon Kayaku Co., Ltd., (A1) First (meth)acrylate compound) 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (A1) First (meth)acrylate compound) Tris-(2-acryloxyethyl) isocyanurate (A-9300S, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (A1) First (meth)acrylate compound) Trimethylolpropane triacrylate (TMPTA, manufactured by Osaka Organic Chemical Industry Co., Ltd., (A1) First (meth)acrylate compound) Isobornyl acrylate (IBOA, manufactured by Daicel Ornex, Inc., (A2) Second (meth)acrylate compound) 2-(allyloxymethyl)methyl acrylate (AOMA, manufactured by Nippon Shokubai Co., Ltd., (A3) Cyclopolymerizable compound)

[0254] ((B) Photopolymerization Initiator) Polyethylene glycol di(beta-4-[4-(2-dimethylamino-2-benzyl)butaonylphenyl]piperazine)propionate (Omnipol 910, manufactured by IGM Resins, (B1) / (Ba) an α-aminoketone-based photopolymerization initiator that is liquid at 25°C and has a molecular weight of 500 or more, CAS number: 886463-10-1, molecular weight 1039.38) 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (Omnirad 907, manufactured by IGM Resins, an α-aminoketone-based photopolymerization initiator that is solid at 25°C, CAS number: 71868-10-5, molecular weight 279.4) Ethyl (2,4,6-trimethylbenzoyl)-phenylphosphene (Omnirad TPO-L, manufactured by IGM RESINS, an acylphosphine oxide photopolymerization initiator that is liquid at 25°C, CAS number: 84434-11-7, molecular weight 316.4) Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (Omnirad 819, manufactured by IGM RESINS, an acylphosphine oxide photopolymerization initiator that is solid at 25°C, CAS number: 162881-26-7, molecular weight 418.5) 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO-L, manufactured by IGM RESINS) TPO (Acylphosphine oxide-based photopolymerization initiator, solid at 25°C, CAS number: 75980-60-8, molecular weight 348.4) Photopolymerization initiator (M17) (Synthesized according to the synthesis method described in Synthesis Example 3 of WO2006 / 082477A1, (Ba) α-aminoketone-based photopolymerization initiator with molecular weight of 500 or more, molecular weight 793.0) Photopolymerization initiator (M18) (Synthesized according to the synthesis method described in Synthesis Example 6 of WO2006 / 082477A1, (Ba) α-aminoketone-based photopolymerization initiator with molecular weight of 500 or more, molecular weight 1140.5)

[0255] ((C) Thermosetting compound) Bisphenol F type liquid epoxy compound ("830CRP" manufactured by DIC, (C1) Thermosetting compound that is liquid at 25 °C) Bisphenol A type liquid epoxy compound ("850CRP" manufactured by DIC, (C1) Thermosetting compound that is liquid at 25 °C) Phenol novolac type solid epoxy compound ("N-775" manufactured by DIC, Thermosetting compound that is solid at 25 °C)

[0256] ((D) Curing agent) 1,3-Bis(3-aminophenoxy)benzene ("APB-N" manufactured by Mitsui Chemicals)

[0257] (Polymerization inhibitor) Aluminum N-nitrosophenylhydroxylamine ("Q1301" manufactured by Fujifilm Wako Pure Chemical Corporation)

[0258] (Coupling agent) 3-Glycidoxypropyltriethoxysilane ("KBE-403" manufactured by Shin-Etsu Chemical Co., Ltd.)

[0259] (Examples 1 to 16 and Comparative Examples 1 to 7) Preparation of curable composition for inkjet: The components shown in Tables 1, 3, 5, 7, and 9 were blended in the blending amounts (wt%) shown in Tables 1, 3, 5, 7, and 9 and uniformly mixed to obtain a curable composition (curable composition for inkjet).

[0260] Formation of partition walls: An aluminum nitride substrate with a surface roughness Ra of 0.4 μm was prepared. On the surface of the substrate, the obtained curable composition was applied while circulating at 75 °C, and the first photocuring step (UV-LED lamp having a main wavelength of 365 nm, 4000 mW / cm ２ , irradiated for 0.1 seconds 0.2 seconds after coating) was repeated to form a laminate having a width of 2 mm × a length of 1.5 mm × a height of 1 mm. Thereafter, the second photocuring step (metal halide lamp, 1000 mW / cm ２ , 10 seconds) was carried out to advance the curing. Thereafter, it was heated at 170 °C for 2 hours for thermosetting to obtain a laminate having partition walls formed on the surface of the substrate.

[0261] (Evaluation) (1) Suppression of bleeding of curable composition In the obtained laminate, the distance over which the cured material protrudes laterally from the side surface of the partition wall (cured material) at the lower end of the partition wall was measured. This distance over which the cured material protrudes corresponds to the distance over which bleeding of the curable composition occurred. The suppression of bleeding of the curable composition was determined from the distance over which bleeding of the curable composition occurred according to the following criteria.

[0262] [Criteria for determining the ability of curable composition to suppress bleeding] ○: No bleeding of the curable composition occurs, or the distance over which bleeding occurs is 15 μm or less ○: The distance over which bleeding occurs exceeds 15 μm but is 50 μm or less ×: The distance over which bleeding occurs exceeds 50 μm

[0263] (2) Crack suppression of the cured material The obtained laminates were reflowed using a reflow oven (ANTOM "UNI-5016F"), with five zones inside the reflow oven set to different temperatures and a conveyor speed of 0.20 m / min. After reflowing, the laminates were observed using a microscope (KEYENCE "VHX-5000") to see if cracks had occurred in the laminates. The crack suppression of the cured material was judged according to the following criteria.

[0264] [Criteria for determining crack suppression of hardened material] ○○: No cracks after passing through Zone 1: 100°C, Zone 2: 200°C, Zone 3: 270°C, Zone 4: 290°C, Zone 5: 180°C ○: No cracks after passing through Zone 1: 100°C, Zone 2: 180°C, Zone 3: 250°C, Zone 4: 270°C, Zone 5: 180°C; AND, cracks present after passing through Zone 1: 100°C, Zone 2: 200°C, Zone 3: 270°C, Zone 4: 290°C, Zone 5: 180°C △: No cracks after passing through Zone 1: 100°C, Zone 2: 180°C, Zone 3: 230°C, Zone 4: 250°C, Zone 5: 180°C; AND, cracks present after passing through Zone 1: 100°C, Zone 2: 200°C, Zone 3: 250°C, Zone 4: 270°C, Zone 5: 180°C ×: Zone 1: 100°C, Zone 2: 180°C, Zone 3: 230°C, Zone 4: 250°C, Zone 5: Cracks present after passing through 180°C.

[0265] (3) Suppression of peeling of cured material A thermal cycle test was performed on the obtained laminate by cooling it at -40°C for 15 minutes, heating it to 125°C at a heating rate of 100°C / min, heating it at 125°C for 15 minutes, and cooling it to -40°C at a cooling rate of 100°C / min, with this process being considered as one cycle and repeated 1000 times. Die shear strength was measured for the laminate before and after the thermal cycle test using a die shear strength measuring device (Nordson "DAGE 4000PXY") by pressing the partition wall at a height of 50 μm from the substrate surface under conditions of a blade length of 2 mm and a speed of 10 μm / s. The die shear strength before the thermal cycle test was taken as F1 and the die shear strength after the thermal cycle test was taken as F2, and the ratio (F2 / F1) was calculated. The suppression of peeling of cured material was judged according to the following criteria.

[0266] [Criteria for determining the ability to suppress peeling of hardened material] ○○: Ratio (F2 / F1) is 0.50 or higher ○: Ratio (F2 / F1) is 0.30 or higher and less than 0.50 △: Ratio (F2 / F1) is 0.15 or higher and less than 0.30 ×: Ratio (F2 / F1) is less than 0.15

[0267] (4) Formation of partitions with a large aspect ratio The obtained curable composition was applied to the first member using the inkjet head of a piezo-type inkjet printer equipped with an ultraviolet irradiation device (coating step (1)). Next, the applied curable composition was irradiated with ultraviolet light to form a B-stage material layer (photocuring step (2A)). The above coating step (1) and the above photocuring step (2A) were repeated in the thickness direction of the formed B-stage material layer. Next, the obtained B-stage material layer was heated and thermally cured to form partitions (photocuring and thermocuring layers) (thermocuring step (2B)). The shape of the partitions was observed using a laser microscope (Olympus "OLS4100"). The ability to form partitions with a large aspect ratio was determined according to the following criteria.

[0268] [Criteria for determining the ability to form partitions with a large aspect ratio] ○○: A partition with a width of 200 μm and a height of 1 mm can be formed ○: A partition with a width of 300 μm and a height of 1 mm can be formed ×: A partition with a width of 300 μm and a height of 1 mm cannot be formed

[0269] The composition and results are shown in Tables 1 to 10 below.

[0270]

[0271]

[0272]

[0273]

[0274]

[0275]

[0276]

[0277]

[0278]

[0279]

[0280] 1, 1A...Electronic component 11...Substrate 11a...First surface 12...Electronic element 13...Partition wall 13A...Composition layer 13B...B-stage compound 14...Reflective film 51...Discharge section 52...Light irradiation section 3...Second connection target member 3a...Second electrode 4...Resin part 4Xa...Flux composition

Claims

1. An inkjet curable composition comprising a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, or the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more, and the thermosetting compound comprises a thermosetting compound that is liquid at 25°C.

2. The curable composition according to claim 1, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C.

3. The inkjet curable composition according to claim 1, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator that is liquid at 25°C, and the content of the α-aminoketone-based photopolymerization initiator that is liquid at 25°C is 8 parts by weight or more and 30 parts by weight or less per 100 parts by weight of the photocurable compound.

4. The inkjet curable composition according to claim 1, wherein the photopolymerization initiator comprises an α-aminoketone-based photopolymerization initiator having a molecular weight of 500 or more.

5. The inkjet curable composition according to any one of claims 1 to 4, wherein the thermosetting compound comprises a bisphenol A type epoxy compound that is liquid at 25°C, or a bisphenol F type epoxy compound that is liquid at 25°C.

6. The inkjet curable composition according to any one of claims 1 to 5, wherein the content of the thermosetting compound that is liquid at 25°C is 5% by weight or more and 35% by weight or less in 100% by weight of the inkjet curable composition.

7. The inkjet curable composition according to any one of claims 1 to 6, wherein the photocurable compound comprises a photocurable compound having two or more photocurable functional groups.

8. An inkjet-curable composition according to any one of claims 1 to 7, used for forming partitions in electronic components.

9. Use of the inkjet-curable composition according to any one of claims 1 to 8 for forming partitions in electronic components.

10. An electronic component comprising a substrate, an electronic element disposed on a first surface of the substrate, and a partition wall disposed on the first surface of the substrate, wherein the partition wall is disposed on the first surface of the substrate so as to surround the electronic element, and the partition wall is a cured product of the inkjet curable composition described in any one of claims 1 to 8.

11. A method for manufacturing an electronic component, comprising: a coating step of applying an inkjet-curable composition according to any one of claims 1 to 8 onto a first surface of a substrate using an inkjet device to form a composition layer; and a curing step of curing the composition layer to form a partition wall, wherein an electronic element is arranged on the first surface of the substrate, and the partition wall is arranged on the first surface of the substrate so as to surround the electronic element.

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