Fingerprint module and electronic device

Abstract

Embodiments of the present application provide a fingerprint module and an electronic device. The fingerprint module comprises an ultrasonic sensor, a touch sensing component, and a first circuit board. The touch sensing component is electrically connected to the ultrasonic sensor, the ultrasonic sensor is electrically connected to the first circuit board, and the first circuit board is electrically connected to a processing unit of an electronic device. The ultrasonic sensor transmits a first ultrasonic signal and receives a reflected first ultrasonic echo signal, converts the first ultrasonic echo signal into a fingerprint sensing signal, and then sends the fingerprint sensing signal to the processing unit by means of the first circuit board, and the processing unit performs fingerprint recognition on the basis of the fingerprint sensing signal. The touch sensing component generates a sensing signal after a press surface is touched, and sends the sensing signal to the ultrasonic sensor. The ultrasonic sensor generates a touch signal on the basis of the sensing signal, and sends the touch signal to the processing unit by means of the first circuit board, and the processing unit identifies a touch operation on the basis of the touch signal. The fingerprint module has high reliability.

Description

Fingerprint module and electronic device TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of fingerprint modules, and in particular to a fingerprint module and an electronic device. BACKGROUND

[0002] With the development of smart devices, fingerprint recognition has become a mainstream security solution for smart devices. A side fingerprint solution is different from a traditional front-and-back fingerprint solution in installation position. The traditional front-and-back fingerprint solution needs to occupy the structural space of the front or back of a smart device, while the side fingerprint solution is arranged on the side of the middle frame of the smart device, avoiding the occupation of the structural space of the front or back by the fingerprint module, and can meet the space requirements of the smart device.

[0003] At present, the side fingerprint solution mainly adopts a capacitive fingerprint solution.

[0004] However, the capacitive fingerprint solution is easily affected by the surface conditions of the skin (such as moisture, dryness or oiliness), thereby leading to poor fingerprint recognition performance.

[0005] SUMMARY

[0006] In view of this, embodiments of the present application provide a fingerprint module and an electronic device to at least partially solve the above problems.

[0007] According to a first aspect of embodiments of the present application, a fingerprint module is provided, which is arranged on a middle frame of an electronic device, and includes an ultrasonic sensor, a touch sensing assembly and a first circuit board. The touch sensing assembly is electrically connected to the ultrasonic sensor, and the ultrasonic sensor is electrically connected to the first circuit board. The first circuit board is used to be electrically connected to a processing unit of the electronic device. The ultrasonic sensor is used to emit a first ultrasonic signal and receive a first ultrasonic echo signal reflected back, and convert the first ultrasonic echo signal into a fingerprint sensing signal, and then send the fingerprint sensing signal to the processing unit through the first circuit board, so that the processing unit performs fingerprint recognition according to the fingerprint sensing signal. The touch sensing assembly is used to generate a sensing signal after the touch region of the pressing surface is touched, and send the sensing signal to the ultrasonic sensor, so that the ultrasonic sensor generates a touch signal according to the sensing signal, and sends the touch signal to the processing unit through the first circuit board, so that the processing unit identifies a touch operation according to the touch signal.

[0008] In a possible implementation, the ultrasonic sensor comprises a substrate and a first acoustic layer; the first acoustic layer is arranged on the substrate, the substrate is electrically connected with the first circuit board, and the touch sensing component is electrically connected with the substrate; the first acoustic layer is configured to emit a first ultrasonic signal when the fingerprint recognition region of the pressing surface is pressed, and receive the first ultrasonic echo signal and convert the ultrasonic echo signal into an electrical signal; and the substrate is configured to generate a fingerprint sensing signal according to the electrical signal and / or generate the touch signal according to the sensing signal.

[0009] In a possible implementation, the fingerprint module further comprises a first support plate, and the ultrasonic sensor and the touch sensing component are arranged on a first surface of the first support plate.

[0010] In a possible implementation, the substrate is electrically connected with the first support plate through an electrical connection line, and the first circuit board is electrically connected with an electrical connection area arranged on the first support plate, so that the substrate is electrically connected with the first circuit board through the first support plate.

[0011] In a possible implementation, the touch sensing component comprises at least one second acoustic layer; the at least one second acoustic layer is electrically connected with the substrate through an electrical connection line, and the at least one second acoustic layer is electrically connected with the first support plate; the at least one second acoustic layer is configured to generate a second ultrasonic signal after the touch region is touched, convert the second ultrasonic echo signal reflected by a finger into the sensing signal after receiving the second ultrasonic echo signal, and send the sensing signal to the substrate, and the substrate generates the touch signal according to the sensing signal.

[0012] In a possible implementation, the touch sensing component comprises a plurality of second acoustic layers, and the plurality of second acoustic layers are uniformly distributed on both sides of the ultrasonic sensor in a direction parallel to the substrate.

[0013] In a possible implementation, a second surface of the first support plate is bonded with a middle frame of the electronic device, and the middle frame of the electronic device provides the pressing surface, wherein the middle frame of the electronic device comprises a metal middle frame or a non-metal middle frame, the thickness of the metal middle frame of the electronic device is less than 1 mm, the thickness of the non-metal middle frame of the electronic device is less than 1.5 mm, and the first surface of the first support plate is opposite to the second surface of the first support plate.

[0014] In a possible implementation, the fingerprint module further comprises a first cover plate, a first surface of the first cover plate is configured to provide the pressing surface, and a second surface of the first cover plate is bonded with a second surface of the first support plate.

[0015] In a possible implementation, when the first cover plate is a metal cover plate, the thickness of the first cover plate is less than 1 mm, and when the first cover plate is a non-metal cover plate, the thickness of the first cover plate is less than 1.5 mm.

[0016] In a possible implementation, the touch sensing component includes a plurality of first electrodes, and the fingerprint module further includes a second circuit board; the second circuit board is arranged on a first side of the ultrasonic sensor in a direction parallel to the substrate, the first circuit board is arranged on a second side of the sensor, the first side and the second side are opposite, the second circuit board is electrically connected to the substrate through an electrical connection line, one end of the first circuit board is electrically connected to the substrate through an electrical connection line, the other end of the first circuit board is electrically connected to the processing unit, and the plurality of first electrodes are uniformly distributed on a side of the first circuit board and the second circuit board close to the pressing surface; when a finger touches, the first electrodes generate the sensing signal, and the sensing signal is transmitted to the substrate through the first circuit board and the second circuit board.

[0017] In a possible implementation, the fingerprint module further includes a second support plate, the ultrasonic sensor, the first circuit board, and the second circuit board are bonded to a first surface of the second support plate, a second surface of the second support plate is bonded to a non-metal middle frame of the electronic device, and the non-metal middle frame of the electronic device provides the pressing surface, where the thickness of the non-metal middle frame of the electronic device is less than 1.5 mm.

[0018] In a possible implementation, the fingerprint module further includes a second cover plate; a first surface of the second cover plate is used to provide the pressing surface, the ultrasonic sensor, the first circuit board, and the second circuit board are bonded to a second surface of the second cover plate, the first surface of the second cover plate is opposite to the second surface of the second cover plate, and the thickness of the second cover plate is less than 1.5 mm.

[0019] In a possible implementation, the fingerprint module further includes a third support plate, and the touch sensing component includes a plurality of second electrodes; the ultrasonic sensor is arranged on a first surface of the third support plate, the plurality of second electrodes are distributed on the third support plate, the plurality of second electrodes are electrically connected to the third support plate, and the ultrasonic sensor is electrically connected to the third support plate; when a finger touches, the second electrodes generate the sensing signal, and the sensing signal is transmitted to the substrate through the third support plate.

[0020] In a possible implementation, the second surface of the third support plate is bonded to a non-metal middle frame of the electronic device, and a thickness of the non-metal middle frame of the electronic device is less than 1.5 mm; or the fingerprint module further includes a third cover plate, and the second surface of the third support plate is bonded to the third cover plate, and a thickness of the third cover plate is less than 1.5 mm.

[0021] In a possible implementation, the electric connection line is located in the protective glue, and a part of the protective glue is bonded to the ultrasonic sensor.

[0022] According to a second aspect of the embodiments of the present application, an electronic device is provided, including a processing unit and the fingerprint module according to the first aspect of the present application; the processing unit is configured to perform fingerprint identification according to a fingerprint sensing signal transmitted by the ultrasonic sensor in the fingerprint module, and / or identify a touch control instruction according to a touch control signal transmitted by the ultrasonic sensor.

[0023] According to the fingerprint module provided by the embodiments of the present application, the fingerprint module includes an ultrasonic sensor, a touch sensing assembly and a first circuit board. The ultrasonic sensor can emit a first ultrasonic signal and receive a first ultrasonic echo signal reflected back. The ultrasonic sensor generates a fingerprint sensing signal according to the first ultrasonic echo signal, thereby realizing fingerprint identification. The touch sensing assembly can generate a sensing signal after a pressing surface is touched, and convert the sensing signal into a touch control signal through the ultrasonic sensor, thereby realizing identification of a touch operation. The ultrasonic fingerprint is not easily affected by the surface conditions of the skin (such as moisture, dryness or oiliness), and the identification effect is more stable than that of the capacitive fingerprint identification. In addition, since the fingerprint module adopts an ultrasonic fingerprint identification scheme, compared with the capacitive fingerprint identification scheme in the prior art, the ultrasonic wave can penetrate a relatively thick fingerprint identification surface and can penetrate various materials, such as metal materials. Therefore, different materials and / or a relatively thick fingerprint identification surface can be provided, which can prevent the fingerprint module from being damaged under the impact of external force. Therefore, the reliability of the fingerprint module is high. In addition, since the touch sensing assembly is provided in the fingerprint module, the touch operation of the user can be identified. Therefore, the physical keys (such as power keys, volume control keys, etc.) in the electronic device can be replaced, the touch operation identification function is integrated on the fingerprint module, the internal space of the electronic device is saved, and the functional expandability is high, which can improve the user experience. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0025] Fig. 1 is a schematic diagram of a fingerprint module according to an embodiment of the present application;

[0026] Fig. 2 is a side sectional view of a fingerprint module according to an embodiment of the present application;

[0027] Fig. 3 is a sectional view of an application scenario of a fingerprint module according to an embodiment of the present application;

[0028] Fig. 4 is a top view of an application scenario of a fingerprint module according to an embodiment of the present application;

[0029] Fig. 5 is a sectional view of an application scenario of another fingerprint module according to an embodiment of the present application;

[0030] Fig. 6 is a top view of an application scenario of another fingerprint module according to an embodiment of the present application;

[0031] Fig. 7 is a side sectional view of another fingerprint module according to an embodiment of the present application;

[0032] Fig. 8 is a sectional view of an application scenario of yet another fingerprint module according to an embodiment of the present application;

[0033] Fig. 9 is a top view of an application scenario of yet another fingerprint module according to an embodiment of the present application;

[0034] Fig. 10 is a sectional view of an application scenario of still another fingerprint module according to an embodiment of the present application;

[0035] Fig. 11 is a top view of an application scenario of still another fingerprint module according to an embodiment of the present application;

[0036] Fig. 12 is a sectional view of an application scenario of still another fingerprint module according to an embodiment of the present application;

[0037] Fig. 13 is a sectional view of an application scenario of still another fingerprint module according to an embodiment of the present application;

[0038] Fig. 14 is a sectional view of an application scenario of still another fingerprint module according to an embodiment of the present application;

[0039] Fig. 15 is a top view of an application scenario of still another fingerprint module according to an embodiment of the present application;

[0040] Fig. 16 is a top view of an application scenario of still another fingerprint module according to an embodiment of the present application;

[0041] Fig. 17 is a schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments of the present application. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art should belong to the scope of protection of the embodiments of the present application.

[0043] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in this application and the appended claims, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "and / or," as used herein, refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0044] It should be understood that although the terms first, second, third, etc. can be employed in this application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one piece of information from another piece of information. For example, without departing from the scope of the present application, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information. Depending on the context, the word "if" as used herein can be interpreted as "when" or "in response to determining" as used herein.

[0045] As described previously, with the development of smart devices, fingerprint recognition has become a mainstream security solution for smart devices. The side fingerprint solution is different from the installation position of the traditional front and back fingerprint solution. The traditional front and back fingerprint solution needs to occupy the structural space of the front or back of the smart device, while the side fingerprint solution is arranged on the side of the middle frame of the smart device, avoiding the occupation of the structural space of the front or back by the fingerprint module, and can meet the space requirement of the smart device. At present, the side fingerprint solution mainly adopts a capacitive fingerprint solution. However, the capacitive fingerprint solution is easily affected by the surface condition of the skin (such as wetness, dryness or oiliness), thereby leading to poor fingerprint recognition performance, and the capacitive fingerprint solution has poor penetration performance, leading to that the cover plate of the fingerprint module is designed to be thin, and under the impact of external force, the fingerprint module can be damaged.

[0046] The application provides a fingerprint module, which comprises an ultrasonic sensor, a touch sensing assembly and a first circuit board. The ultrasonic sensor can emit a first ultrasonic signal and receive a first ultrasonic echo signal reflected back. The ultrasonic sensor generates a fingerprint sensing signal according to the first ultrasonic echo signal, thereby realizing fingerprint identification. The touch sensing assembly can generate a sensing signal after a pressing surface is touched, and convert the sensing signal into a touch signal through the ultrasonic sensor, thereby realizing identification of a touch operation. The ultrasonic fingerprint is not easily affected by the surface conditions of the skin (such as moisture, dryness or greasiness), and the identification effect is more stable than that of a capacitive fingerprint identification. In addition, since the fingerprint module adopts an ultrasonic fingerprint identification scheme, compared with the capacitive fingerprint identification scheme in the prior art, the ultrasonic wave can penetrate a relatively thick fingerprint identification surface and can penetrate various materials, such as metal materials, so that different materials and / or a relatively thick fingerprint identification surface can be arranged, the fingerprint module can be prevented from being damaged under the impact of external force, and therefore the reliability of the fingerprint module is high. In addition, since the touch sensing assembly is arranged in the fingerprint module, the touch operation of the user can be identified, thereby replacing physical keys (such as power keys, volume control keys, etc.) in the electronic device, realizing integration of the touch operation identification function on the fingerprint module, saving the internal space of the electronic device, and having high functional expandability, and the user experience can be improved.

[0047] FIG. 1 is a schematic view of a fingerprint module according to an embodiment of the application. The fingerprint module 100 is arranged on the middle frame of an electronic device. As shown in FIG. 1, the fingerprint module 100 comprises an ultrasonic sensor 101, a touch sensing assembly 102 and a first circuit board 103. The touch sensing assembly 102 is electrically connected to the ultrasonic sensor 101, and the ultrasonic sensor 101 is electrically connected to the first circuit board 103. The first circuit board 103 is used to be electrically connected to a processing unit 201 of the electronic device. The ultrasonic sensor 101 is used to emit a first ultrasonic signal and receive a first ultrasonic echo signal reflected back. After the first ultrasonic echo signal is converted into a fingerprint sensing signal, the fingerprint sensing signal is sent to the processing unit 201 through the first circuit board 103, so that the processing unit 201 performs fingerprint identification according to the fingerprint sensing signal. The touch sensing assembly 102 is used to generate a sensing signal after a touch region of a pressing surface is touched, and send the sensing signal to the ultrasonic sensor 101. The ultrasonic sensor 101 generates a touch signal according to the sensing signal, and sends the touch signal to the processing unit 201 through the first circuit board 103, so that the processing unit 201 identifies a touch operation according to the touch signal.

[0048] The ultrasonic sensor 101 is electrically connected with the first circuit board 103, and the first circuit board 103 is electrically connected with the processing unit 201. The ultrasonic sensor 101 can emit a first ultrasonic signal when a finger presses the fingerprint recognition area of the pressing surface, and receive a first ultrasonic echo signal reflected by the finger. The ultrasonic sensor 101 converts the first ultrasonic echo signal into a fingerprint sensing signal and sends the fingerprint sensing signal to the first circuit board 103. The first circuit board 103 transmits the fingerprint sensing signal to the processing unit 201 of the electronic device. The processing unit 201 is a chip with processing function in the electronic device, for example, a processor of the electronic device or a fingerprint recognition chip of the electronic device, etc. The processing unit 201 can identify a fingerprint image according to the fingerprint sensing signal, and compare the identified fingerprint image with a registered fingerprint template to realize a fingerprint recognition function.

[0049] The fingerprint module 100 further includes a touch sensing assembly 102. The touch sensing assembly 102 can generate a sensing signal when the touch area of the pressing surface is touched. Optionally, the fingerprint module 100 can be a side fingerprint module arranged on the middle frame 202 of the electronic device. Therefore, the pressing surface can be the middle frame 202 of the electronic device or a pressing surface arranged on the fingerprint module 100. When a finger touches the touch area of the pressing surface, for example, the finger presses or slides on the touch area of the pressing surface, the touch sensing assembly 102 can generate a sensing signal and send the sensing signal to the ultrasonic sensor 101. The ultrasonic sensor 101 can convert the sensing signal into a touch signal. Specifically, the ultrasonic sensor 101 can be provided with a sensing signal conversion circuit. The sensing signal conversion circuit can convert the sensing signal into a touch signal. After the ultrasonic sensor 101 converts the sensing signal into the touch signal, the ultrasonic sensor 101 sends the touch signal to the first circuit board 103. The first circuit board 103 transmits the touch signal to the processing unit 201 of the electronic device. The processing unit 201 of the electronic device can identify a touch operation according to the touch signal, for example, identify a finger pressing operation for volume control, identify a finger sliding operation for page turning, volume control, page zooming, etc.

[0050] In the embodiment of the present application, the fingerprint module 100 includes an ultrasonic sensor 101, a touch sensing assembly 102, and a first circuit board 103. The ultrasonic sensor 101 can emit a first ultrasonic signal and receive a first ultrasonic echo signal reflected back. The ultrasonic sensor 101 generates a fingerprint sensing signal according to the first ultrasonic echo signal, thereby realizing fingerprint recognition. The touch sensing assembly 102 can generate a sensing signal after a touch region of a pressing surface is touched, and convert the sensing signal into a touch signal through the ultrasonic sensor 101, thereby realizing recognition of a touch operation. The ultrasonic fingerprint is not easily affected by the surface condition of the skin (such as moisture, dryness, or oiliness), and the recognition effect is more stable than that of a capacitive fingerprint recognition. In addition, since the fingerprint module 100 adopts an ultrasonic fingerprint recognition scheme, compared with the capacitive fingerprint recognition scheme in the prior art, since the ultrasonic wave can penetrate a relatively thick pressing surface and can penetrate various materials, such as metal materials, different materials and / or a relatively thick pressing surface can be set, damage to the fingerprint module 100 under the impact of external force can be prevented, and therefore the reliability of the fingerprint module 100 is high. In addition, since the touch sensing assembly 102 is arranged in the fingerprint module 100, the touch operation of the user can be recognized, thereby the physical keys (such as the power key, the volume control key, etc.) in the electronic device can be replaced, the touch operation recognition function is integrated on the fingerprint module 100, the internal space of the electronic device is saved, and the functional expandability is high, and the user experience can be improved.

[0051] In a possible implementation, the ultrasonic sensor 101 includes a substrate and a first acoustic layer. The first acoustic layer is arranged on the substrate. The substrate is electrically connected to the first circuit board 103. The first acoustic layer is configured to generate the first ultrasonic signal when the fingerprint recognition region of the pressing surface is pressed, receive the first ultrasonic echo signal, and convert the ultrasonic echo signal into an electrical signal. The substrate is configured to generate the fingerprint sensing signal according to the electrical signal and / or generate the touch signal according to the sensing signal.

[0052] The ultrasonic sensor 101 comprises a substrate and a first acoustic layer, the substrate can be a silicon substrate in an example, and the substrate is provided with electronic elements such as CMOS, etc., and the first acoustic layer can comprise a piezoelectric sound-emitting material such as a polyvinylidene fluoride (PVDF) material, which includes but is not limited to PVDF and its copolymer. Based on this, the acoustic layer in the present application comprises a PVDF material layer, when a finger is pressed on the pressing surface, the electronic elements on the substrate drive the first acoustic layer to emit a first ultrasonic signal. Specifically, the electronic elements such as MOS tubes, etc. provided on the substrate form an anode, and a silver layer provided on the surface of the first acoustic layer is a cathode, the cathode is connected to a ground wire, when the electronic elements on the substrate drive the first acoustic layer, a potential difference is generated between the anode and the cathode, thereby driving the PVDF to vibrate through the potential difference to emit the first ultrasonic signal. The first acoustic layer receives the first ultrasonic echo signal reflected back by the finger, and transmits the first ultrasonic echo signal to the substrate after converting the first ultrasonic echo signal into an electric signal. The substrate converts the electric signal into a fingerprint sensing signal through the electronic elements provided on the substrate.

[0053] The substrate is also electrically connected to the touch sensing assembly 102, and the touch sensing assembly 102 generates a sensing signal when the touch area of the pressing surface is touched, and sends the sensing signal to the substrate. The substrate converts the sensing signal into a touch signal. In an example, the substrate can be provided with a sensing signal conversion circuit, and the sensing signal conversion circuit can convert the sensing signal into a touch signal.

[0054] In the embodiment of the present application, the ultrasonic sensor 101 comprises a substrate and a first acoustic layer, and the acoustic layer can be understood as being printed on a silicon wafer, which can be understood as the substrate of the acoustic layer. The first acoustic layer can emit a first ultrasonic signal and receive a first ultrasonic echo signal reflected back, and convert the first ultrasonic echo signal into an electric signal. The substrate can generate a fingerprint sensing signal according to the electric signal, and receive a sensing signal sent by the touch sensing assembly 102 and convert the sensing signal into a touch signal. Therefore, the processing unit 201 can perform fingerprint recognition according to the fingerprint sensing signal and touch operation recognition according to the touch signal, thereby realizing the functions of touch recognition and fingerprint recognition.

[0055] FIG. 2 is a side sectional view of a fingerprint module according to an embodiment of the present application. As shown in FIG. 2, the fingerprint module 100 further comprises a first support plate 104, and the ultrasonic sensor 101 and the touch sensing assembly 102 are arranged on the first surface of the first support plate 104.

[0056] The material of the first support plate 104 includes but is not limited to glass, sapphire, etc., and the thickness of the first support plate 104 can be greater than 0.2 mm in an example.

[0057] In the embodiment of the present application, the fingerprint module 100 further comprises a first support plate 104, the ultrasonic sensor 101 and the touch sensing component 102 are arranged on a first surface of the first support plate 104, so that the ultrasonic sensor 101 and the touch sensing component 102 can be supported by the first support plate 104, and the ultrasonic sensor 101 and the touch sensing component 102 can be protected when the electronic device is impacted, thereby improving the reliability of the fingerprint module 100.

[0058] In a possible implementation, as shown in FIG. 2, the substrate is electrically connected with the first support plate 104 through an electric connection line, and the first circuit board 103 is electrically connected with the electric connection area arranged on the first support plate 104, so that the substrate is electrically connected with the first circuit board 103 through the first support plate 104.

[0059] The first support plate 104 can be provided with an electric connection area and a circuit, the substrate is electrically connected with the electric connection area arranged on the first support plate 104 through an electric connection line, and the first circuit board 103 is electrically connected with the electric connection area on the first support plate 104. Since the circuit is arranged on the first support plate 104, the substrate is electrically connected with the first circuit board 103 through the first support plate 104. In an example, the first circuit board 103 can be electrically connected with the electric connection area on the first support plate 104 through a conductive material 302, which includes but is not limited to an anisotropic conductive film (ACF), low-temperature tin paste, low-temperature silver glue, etc.

[0060] In an example, the first surface of the first acoustic layer of the ultrasonic sensor 101 can be bonded on the first support plate 104 through a first adhesive layer 301, the first surface of the substrate is in contact with the second surface of the first acoustic layer, and the electric connection line of the substrate and the first support plate 104 can be arranged on the first surface of the substrate, or the electric connection line of the substrate and the first support plate 104 can be arranged on the second surface of the substrate. Specifically, the electric connection line can be arranged on the second surface of the substrate through a through silicon via (TSV) technology (as shown in FIG. 2), and the first adhesive layer 301 includes but is not limited to glue, adhesive film, etc.

[0061] In the embodiment of the present application, the substrate is electrically connected with the first support plate 104 through an electric connection line, and the first circuit board 103 is electrically connected with the electric connection area arranged on the first support plate 104, so that the substrate is electrically connected with the first circuit board 103 through the first support plate 104, thereby realizing the electrical connection between the ultrasonic sensor 101 and the first circuit board 103.

[0062] In a possible implementation, the touch sensing component 102 includes at least one second acoustic layer 1021 electrically connected to the substrate through the electric connection line, the at least one second acoustic layer 1021 being electrically connected to the first support plate 104, the at least one second acoustic layer 1021 being configured to generate a second ultrasonic signal after the touch of the pressing surface, and to convert a second ultrasonic echo signal reflected back by the finger into a sensing signal after receiving the second ultrasonic echo signal, and to send the sensing signal to the substrate, and the substrate is configured to generate a touch signal according to the sensing signal.

[0063] The touch component includes at least one second acoustic layer 1021 electrically connected to the first support plate 104, and in an example, different second acoustic layers 1021 are electrically connected to different electric connection areas on the first support plate 104. When the touch area of the pressing surface is touched, the second acoustic layer 1021 emits a second ultrasonic signal, and receives a second ultrasonic echo signal reflected back by the finger, and converts the second ultrasonic echo signal into a sensing signal. In an example, the second acoustic layer 1021 can include a PVDF material layer. The second acoustic layer 1021 sends the sensing signal to the substrate of the ultrasonic sensor 101, and the substrate converts the sensing signal into a touch signal.

[0064] It should be noted that the at least one second acoustic layer 1021 is electrically connected to the electric connection area on the first support plate 104, and the ultrasonic sensor 101 is electrically connected to the first support plate 104, so that the ultrasonic sensor 101 can transmit a driving signal to the at least one second acoustic layer 1021 through the first support plate 104 to drive the at least one second acoustic layer 1021 to emit a second ultrasonic signal. Specifically, the substrate sends the driving signal to the first support plate 104 through the electric connection line, and the silver layer included in the second acoustic layer 1021 is grounded through the electric connection area arranged between the second acoustic layer 1021 and the first support plate 104. When the first support plate 104 receives the driving signal, a potential difference is generated between the first support plate 104 and the silver layer in the second acoustic layer 1021, so that the PVDF in the second acoustic layer 1021 emits a second ultrasonic signal through the potential difference, and the second acoustic layer 1021 can transmit the sensing signal to the substrate of the ultrasonic sensor 101 through the first support plate 104, and the substrate of the ultrasonic sensor 101 can generate a touch signal according to the sensing signal, and then transmit the touch signal to the first circuit board 103 through the first support plate 104.

[0065] Optionally, when the touch operation is recognized, the substrate of the ultrasonic sensor 101 can drive the first acoustic layer and the second acoustic layer 1021 simultaneously, and the touch operation is recognized by the first acoustic layer and the second acoustic layer 1021 simultaneously. Specifically, the touch position can be determined according to the sensing signals generated by the first acoustic layer and the second acoustic layer 1021, or the sliding direction of the finger on the pressing surface can be determined according to the change of the signal strength of the sensing signals.

[0066] In the embodiment of the present application, the touch sensing assembly 102 includes at least one second acoustic layer 1021, which can emit a second ultrasonic signal and receive a reflected second ultrasonic echo signal, and convert the second ultrasonic echo signal into a sensing signal. The sensing signal can be converted into a touch signal by the substrate of the ultrasonic sensor 101, so that the touch operation can be recognized. Since the recognition of the touch operation is realized by the second ultrasonic signal, and since the ultrasonic signal has strong penetration ability, a thicker pressing surface can be provided, and a pressing surface made of various materials (such as metal material) can be provided to improve the reliability of the fingerprint module 100. Since the signal processing is performed by the substrate of the ultrasonic sensor 101, that is, the touch sensing assembly 102 only includes the second acoustic layer 1021 and does not include the substrate, the cost is lower compared with the recognition of the touch operation by multiple ultrasonic sensors 101.

[0067] In a possible implementation, as shown in FIG. 2, the touch sensing assembly 102 includes a plurality of second acoustic layers 1021, which are uniformly distributed on both sides of the ultrasonic sensor 101 in a direction parallel to the substrate.

[0068] As shown in FIG. 2, the plurality of second acoustic layers 1021 are uniformly distributed on both sides of the ultrasonic sensor 101. The scheme of including at least one second acoustic layer 1021 in the above embodiment can be arranged at any position of the two second acoustic layers 1021 shown in FIG. 2 when only one second acoustic layer 1021 is included. It should be understood that when four second acoustic layers 1021 are included, two second acoustic layers 1021 can be distributed on each side of the ultrasonic sensor 101. It should also be understood that generally only an even number of second acoustic layers 1021 will be provided, and when the number of second acoustic layers 1021 is odd, the extra second acoustic layer 1021 can be arranged on either side of the ultrasonic sensor 101.

[0069] The following describes the scheme of two second acoustic layers 1021 as shown in FIG. 2. When the user performs fingerprint identification, the user's finger presses on the pressing surface at a position corresponding to fingerprint identification. At this time, the first acoustic layer emits a first ultrasonic signal, receives a first ultrasonic echo signal reflected back by the finger, and converts the first ultrasonic echo signal into an electrical signal. The substrate converts the electrical signal into a fingerprint sensing signal. Thus, the processing unit 201 can perform fingerprint identification according to the fingerprint sensing signal. When the user's finger presses on another position, both the two second acoustic layers 1021 emit a second ultrasonic signal, receive a second ultrasonic echo signal reflected back, and convert the second ultrasonic echo signal into a sensing signal. The substrate converts the sensing signals of the two second acoustic layers 1021 into touch signals. Thus, according to the signal strengths of the two touch signals, the touch position of the finger can be determined. For example, when the finger touches the left side in FIG. 2, the signal strength of the touch signal corresponding to the second acoustic layer 1021 arranged on the left side is greater than the signal strength of the touch signal corresponding to the second acoustic layer 1021 arranged on the right side. When the finger slides on the pressing surface, the sliding direction of the finger can be determined according to the change in the signal strengths generated by the two second acoustic layers 1021. For example, when the finger slides from the left side as shown in FIG. 2 to the right side, the signal strength of the touch signal corresponding to the second acoustic layer 1021 arranged on the left side changes from strong to weak, and the signal strength of the touch signal corresponding to the second acoustic layer 1021 arranged on the right side changes from weak to strong. Thus, the sliding operation of the finger can be identified. It should be understood that, when touch sensing is performed, the first acoustic layer on the ultrasonic sensor 101 can also participate in sensing, or when fingerprint sensing is performed, multiple second acoustic layers 1021 can also participate in sensing. At this time, the multiple second acoustic layers 1021 send the electrical signals converted from the ultrasonic signals reflected back by the finger to the substrate of the ultrasonic sensor 101. Thus, fingerprint sensing can be simultaneously performed by the ultrasonic sensor 101 and the multiple second acoustic layers 1021. Details are not described herein again.

[0070] In the embodiment of the present application, the touch sensing assembly 102 includes multiple second acoustic layers 1021, which are uniformly distributed on both sides of the ultrasonic sensor 101 in a direction parallel to the substrate. Thus, the identification of the sliding operation of the finger can be performed. Compared with arranging only one second acoustic layer 1021, arranging multiple second acoustic layers 1021 uniformly distributed can identify touch operations at different positions, so as to improve the identification accuracy and sensitivity of the touch operation and enable the sliding operation to be identified. The functionality of the fingerprint module 100 is improved.

[0071] FIG. 3 is a schematic diagram of an application scenario of a fingerprint module according to an embodiment of the present application. As shown in FIG. 3, the second surface of the first support plate 104 can be bonded to the middle frame 202 of an electronic device, and the middle frame 202 of the electronic device provides a pressing surface. The middle frame 202 of the electronic device includes a metal middle frame 202 or a non-metal middle frame 202. The thickness of the metal middle frame 202 of the electronic device is less than 1 mm, and the thickness of the non-metal middle frame 202 of the electronic device is less than 1.5 mm, preferably 1.0 mm or 1.3 mm. The first surface of the first support plate 104 is opposite to the second surface of the first support plate 104.

[0072] FIG. 4 is a schematic diagram of an application scenario of a fingerprint module according to an embodiment of the present application. As shown in FIG. 3 and FIG. 4, the second surface of the first support plate 104 is bonded to the middle frame 202 of the electronic device, and the middle frame 202 of the electronic device provides a pressing surface.

[0073] It should be understood that, since the touch sensing assembly 102 adopts the second acoustic layer 1021, the ultrasonic signals emitted by the second acoustic layer 1021 and the reflected ultrasonic echo signals received by the second acoustic layer 1021 can penetrate the metal material. Therefore, the pressing surface can be made of metal material, and can be applied to the electronic device with the metal middle frame 202. The middle frame 202 of the electronic device can be designed as an arc surface, rather than a flat surface. In an example, the non-metal middle frame 202 can be a plastic middle frame 202. The second surface of the first support plate 104 can be bonded to the middle frame 202 of the electronic device through a second adhesive layer 303, which includes but is not limited to glue, adhesive film, etc.

[0074] In the embodiments of the present application, the fingerprint module 100 can be bonded to the middle frame 202 of the electronic device, so that the middle frame 202 of the electronic device can be used as a pressing surface. Therefore, the middle frame 202 of the electronic device does not need to be perforated, so that the strength of the middle frame 202 of the electronic device is high. Since the fingerprint module 100 integrates the touch identification function, the electronic device does not need to be provided with physical buttons, and the cost is low.

[0075] FIG. 5 is a schematic diagram of an application scenario of another fingerprint module according to an embodiment of the present application. As shown in FIG. 5, the fingerprint module 100 further includes a first cover plate 105. The first surface of the first cover plate 105 is used to provide a pressing surface, and the second surface of the first cover plate 105 is bonded to the second surface of the first support plate 104.

[0076] The fingerprint module 100 can further include a first cover plate 105, which provides a pressing surface for a user to press a finger thereon for fingerprint recognition or touch operation. The first cover plate 105 can be made of metal or non-metal material due to the use of the second acoustic layer 1021 and the ultrasonic sensor 101. In an example, FIG. 6 is a top view of an application scenario of another fingerprint module according to an embodiment of the present application. As shown in FIG. 6 and FIG. 5, the first cover plate 105 can be arranged at an opening on the middle frame 202 of an electronic device, so that the first cover plate 105 provides a pressing surface, and the second surface of the first cover plate 105 can be bonded to the second surface of the first support plate 104 through a third adhesive layer 304, which includes but is not limited to glue, adhesive film, etc.

[0077] In the embodiment of the present application, the fingerprint module 100 further includes a first cover plate 105, a first surface of the first cover plate 105 is used to provide a pressing surface, and a second surface of the first cover plate 105 is bonded to a second surface of the first support plate 104. In this way, the fingerprint module 100 can be protected by the first cover plate 105, the reliability of the fingerprint module 100 is improved, and the fingerprint module 100 can be applied to an electronic device with an opening in the middle frame 202.

[0078] In a possible implementation, when the first cover plate 105 is a metal cover plate, the thickness of the first cover plate 105 is less than or equal to 1 mm, and when the first cover plate 105 is a non-metal cover plate, the thickness of the first cover plate 105 is less than or equal to 1.5 mm.

[0079] Due to the use of the second acoustic layer 1021 and the ultrasonic sensor 101, the first cover plate 105 can be made of metal. In an example, the first cover plate 105 can include a first cover plate 105 made of plastic, glass or metal. In an example, the side of the first cover plate 105 that provides a pressing surface can be provided with an arc structure. When the first cover plate 105 is a non-metal first cover plate 105, such as a plastic material and a glass material, the thickness of the first cover plate 105 is 1.5 mm or less, and preferably 1.0 mm or 1.3 mm. When the first cover plate 105 is a metal material, the thickness of the first cover plate 105 is 1 mm or less.

[0080] In the embodiment of the present application, when the first cover plate 105 is a metal cover plate, the thickness of the first cover plate 105 is less than or equal to 1 mm, and when the first cover plate 105 is a non-metal cover plate, the thickness of the first cover plate 105 is less than or equal to 1.5 mm. In this way, the signal strength and the thickness of the first cover plate 105 can be balanced. A higher signal strength can be achieved while the first cover plate 105 is thicker. In this way, when the electronic device is impacted, the fingerprint module 100 can be protected by the thicker first cover plate 105, and the reliability of the fingerprint module 100 can be improved.

[0081] Figure 7 is a side view of another fingerprint module according to an embodiment of the present application. As shown in Figure 7, the touch sensing component 102 includes a plurality of first electrodes 1023. The fingerprint module further includes a second circuit board 109 disposed on a first side of the ultrasonic sensor 101 in a direction parallel to the substrate of the ultrasonic sensor 101. The first circuit board 103 is disposed on a second side of the ultrasonic sensor 101 opposite to the first side. The second circuit board 109 is electrically connected to the substrate via an electrical connection line. One end of the first circuit board 103 is electrically connected to the substrate via an electrical connection line. The other end of the first circuit board 103 is electrically connected to the processing unit 201. The plurality of first electrodes 1023 are uniformly distributed on a side of the second circuit board 109 close to the pressing surface. When a finger touches, the first electrodes 1023 generate sensing signals. Since the first circuit board 103 and the second circuit board 109 are electrically connected to the ultrasonic sensor 101, the sensing signals generated by the first electrodes 1023 can be transmitted to the substrate via the first circuit board 103 and the second circuit board 109.

[0082] The touch sensing component 102 includes a plurality of first electrodes 1023. The plurality of first electrodes 1023 are uniformly distributed on the first circuit board 103 and the second circuit board 109. For example, as shown in Figure 7, three first electrodes 1023 are distributed on the first circuit board 103 and the second circuit board 109 respectively. When a finger touches, the capacitance of the first electrodes 1023 changes, thereby generating sensing signals. In an example, the first electrodes 1023 serve as both driving electrodes and receiving electrodes. The ultrasonic sensor 101 transmits driving signals to the driving electrodes and converts the sensing signals output by the receiving electrodes into touch signals. For example, the ultrasonic sensor 101 outputs driving signals to the plurality of first electrodes 1023 (driving electrodes) and simultaneously receives the sensing signals output by the plurality of first electrodes 1023 (receiving electrodes) and converts the sensing signals into touch signals. In an example, the first circuit board 103 and the second circuit board 109 are flexible circuit boards.

[0083] The first circuit board 103 and the second circuit board 109 are electrically connected to the substrate of the ultrasonic sensor 101 via electrical connection lines. In an example, as shown in Figure 7, the first circuit board 103 and the second circuit board 109 are electrically connected to the side of the substrate on which the acoustic layer is disposed via electrical connection lines. In another example, the TSV technology can be used to electrically connect the first circuit board 103 and the second circuit board 109 to the side of the substrate on which the acoustic layer is not disposed.

[0084] The following is described with a specific example. When the user performs fingerprint identification, the user's finger presses on the pressing surface at a position corresponding to fingerprint identification. At this time, the ultrasonic sensor 101 emits a first ultrasonic signal, receives a first ultrasonic echo signal reflected by the finger, and converts the first ultrasonic echo signal into an electrical signal. The substrate converts the electrical signal into a fingerprint sensing signal. Thus, the processing unit 201 can perform fingerprint identification according to the fingerprint sensing signal. When the user's finger presses on another position, the first electrode 1023 at the finger pressing position generates a sensing signal. The substrate converts the sensing signal into a touch signal. Thus, the touch position of the finger can be determined according to the touch signal. When the finger slides on the pressing surface, the sliding direction of the finger can be determined according to the sensing signals generated by the plurality of first electrodes 1023 in sequence. For example, when the finger slides from the left to the right as shown in FIG. 7, the sensing signals are generated by the plurality of first electrodes 1023 from left to right in sequence. Thus, the sliding operation of the finger can be identified. It should be understood that the ultrasonic sensor 101 can also participate in identification when performing touch identification, which is not described herein again.

[0085] In the embodiment of the present application, the touch sensing assembly 102 includes a plurality of first electrodes 1023, which are distributed on the first circuit board 103 and the second circuit board 109. Thus, the touch sensing function can be realized by the plurality of first electrodes 1023. Since the fingerprint module 100 is provided with the touch sensing assembly 102, the touch operation of the user can be identified. The physical keys (for example, the power key, the volume control key, etc.) can be replaced in the electronic device. Since the touch operation identification function is integrated on the fingerprint module 100, the physical keys do not need to be provided, the internal space of the electronic device can be saved, and the fingerprint module 100 has high functional expandability, which can improve the user experience.

[0086] FIG. 8 is a cross-sectional view of an application scenario of another fingerprint module according to an embodiment of the present application. As shown in FIG. 8, the fingerprint module 100 further includes a second support plate 106. The ultrasonic sensor 101, the first circuit board 103, and the second circuit board 109 are bonded on a first surface of the second support plate 106. A second surface of the second support plate 106 is bonded to a non-metal middle frame 202 of an electronic device. The non-metal middle frame 202 of the electronic device provides a pressing surface. The thickness of the non-metal middle frame 202 of the electronic device is less than 1.5 mm.

[0087] In an example, the ultrasonic sensor 101, the first circuit board 103 and the second circuit board 109 can be adhered to the first surface of the second support plate 106 by a fourth adhesive layer 305, and the first surface of the second support plate 106 is adhered to the middle frame 202 of the electronic device by a fifth adhesive layer 306, and the fourth adhesive layer 305 and the fifth adhesive layer 306 include but are not limited to glue, adhesive film, etc. In an example, the first surface of the substrate of the ultrasonic sensor 101 is adhered to the second support plate 106, the first acoustic layer is arranged on the second surface of the substrate of the ultrasonic sensor, and the substrate of the ultrasonic sensor 101 is electrically connected to the first circuit board 103 and the second circuit board 109 by the electrical connection line respectively. In another example, the first acoustic layer of the ultrasonic sensor 101 is adhered to the second support plate 106, the first acoustic layer is arranged on the first surface of the substrate of the ultrasonic sensor, and the second surface of the substrate of the ultrasonic sensor 101 is electrically connected to the first circuit board 103 and the second circuit board 109 by the electrical connection line respectively after TSV technology. The surface of the first circuit board 103 and the second circuit board 109 on which the first electrode 1023 is arranged is adhered to the second support plate 106. FIG. 9 is a top view of another application scenario of the fingerprint module according to an embodiment of the present application. As shown in FIG. 9, the second support plate 106 is adhered to the middle frame 202 of the electronic device, and the middle frame 202 of the electronic device provides a pressing surface.

[0088] It should be understood that, since the flatness of the inner edge of the middle frame 202 of the electronic device is low, the second support plate 106 is needed to arrange the first circuit board 103 and the second circuit board 109 on the same plane, and the second support plate 106 can protect the ultrasonic sensor 101 and the plurality of first electrodes 1023. It should also be understood that, since the embodiment does not need to pass the wire through the second support plate 106, the second support plate 106 does not need to be provided with an electrical connection area and a wire. The material of the second support plate 106 includes but is not limited to glass, sapphire, etc. In an example, the thickness of the second support plate 106 can be greater than 0.2 mm.

[0089] It should be noted that, when the touch sensing assembly 102 is the plurality of first electrodes 1023, since the first electrode 1023 and the finger include metal, touch recognition cannot be performed, and therefore the second support plate 106 is adhered to the non-metal middle frame 202 of the electronic device, and cannot be adhered to the metal middle frame 202 of the electronic device, and therefore the embodiment is only applicable to the electronic device with a non-metal middle frame 202.

[0090] In the embodiment of the present application, the fingerprint module 100 further comprises a second support plate 106, the ultrasonic sensor 101, the first circuit board 103 and the second circuit board 109 are bonded on a first surface of the second support plate 106, so that the plurality of first electrodes 1023 can be arranged on the same plane, the plurality of first electrodes 1023 can be used for detecting the sliding touch, and the ultrasonic sensor 101 and the touch sensing component 102 can be protected by the second support plate 106, thereby improving the reliability of the fingerprint module 100. Since the non-metal middle frame 202 of the electronic device is used as the pressing surface, the middle frame 202 of the electronic device does not need to be punched, the strength of the middle frame 202 of the electronic device is high, and since the fingerprint module 100 integrates the touch recognition function, the electronic device does not need to be provided with a physical button, and the cost is low.

[0091] FIG. 10 is a schematic diagram of the application scenario of another fingerprint module according to an embodiment of the present application. As shown in FIG. 10, the fingerprint module 100 further comprises a second cover plate 107, a first surface of the second cover plate 107 is used to provide a pressing surface, the ultrasonic sensor 101, the first circuit board 103 and the second circuit board 109 are bonded on a second surface of the second cover plate 107, the first surface of the second cover plate 107 is opposite to the second surface of the second cover plate 107, and the thickness of the second cover plate 107 is less than 1.5 mm.

[0092] The fingerprint module 100 can further comprise a second cover plate 107, the second cover plate 107 provides a pressing surface, when a user needs to perform fingerprint recognition or touch operation, the user presses a finger on the second cover plate 107 to perform fingerprint recognition or touch operation. Since the first electrodes 1023 distributed on the first circuit board 103 and the second circuit board 109 are used for touch position recognition, the second cover plate 107 can only be made of a non-metal material. In an example, FIG. 11 is a top view of another application scenario of a fingerprint module according to an embodiment of the present application. As shown in FIG. 11, the second cover plate 107 can be arranged at a hole on the middle frame 202 of the electronic device, so that the second cover plate 107 provides a pressing surface, the ultrasonic sensor 101, the first circuit board 103 and the second circuit board 109 can be bonded to the second surface of the second cover plate 107 through a sixth adhesive layer 307, and the sixth adhesive layer 307 includes but is not limited to glue, adhesive film and the like.

[0093] In the embodiment of the present application, the fingerprint module 100 further comprises a second cover plate 107, a first surface of the second cover plate 107 is used to provide a pressing surface, the ultrasonic sensor 101, the first circuit board 103 and the second circuit board 109 are bonded on a second surface of the second cover plate 107, so that the fingerprint module 100 can be protected by the second cover plate 107, thereby improving the reliability of the fingerprint module 100, and the fingerprint module 100 can be applied to an electronic device with a hole in the middle frame 202.

[0094] Fig. 12 is a schematic diagram of an application scenario of still another fingerprint module according to an embodiment of the present application. As shown in Fig. 12, the fingerprint module 100 further includes a third support plate 110, and the touch sensing assembly 102 includes a plurality of second electrodes 1024. The ultrasonic sensor 101 is disposed on a first surface of the third support plate 110, and the plurality of second electrodes 1024 are distributed on the third support plate 110. The plurality of second electrodes 1024 are electrically connected to the third support plate 110, and the ultrasonic sensor 101 is electrically connected to the third support plate 110. When a finger touches, the second electrodes 1024 generate sensing signals, which are transmitted to the substrate through the third support plate 110.

[0095] The third support plate 110 is made of, but not limited to, glass, sapphire, etc. In an example, the thickness of the third support plate 110 can be greater than 0.2 mm. The touch sensing assembly 102 includes a plurality of second electrodes 1024, which are distributed on the third support plate 110. The ultrasonic sensor 101 is disposed on the first surface of the third support plate 110. In an example, the ultrasonic sensor 101 can be bonded to the first surface of the third support plate 110 through a seventh adhesive layer 308. The plurality of second electrodes 1024 can be uniformly distributed on the first surface of the third support plate 110, or on the second surface of the third support plate 110, or inside the third support plate 110. When a finger touches, the capacitance of the second electrodes 1024 changes, thereby generating sensing signals. In an example, the second electrodes 1024 serve as both driving electrodes and receiving electrodes. The ultrasonic sensor 101 sends driving signals to the driving electrodes and converts the sensing signals output by the receiving electrodes into touch signals. For example, the ultrasonic sensor 101 outputs driving signals to the plurality of second electrodes 1024 (driving electrodes), receives the sensing signals output by the plurality of second electrodes 1024 (receiving electrodes), and converts the sensing signals into touch signals.

[0096] The plurality of second electrodes 1024 are electrically connected to the third support plate 110, and the ultrasonic sensor 101 is electrically connected to the third support plate 110. In an example, metal traces can be deposited on the third support plate 110 to electrically connect the second electrodes 1024 to the third support plate 110. The ultrasonic sensor 101 can be electrically connected to the third support plate 110 through an electrical connection line. The touch recognition principle of the second electrodes 1024 is similar to that of the first electrodes 1023, which will not be described here.

[0097] In an example, the first circuit board 103 can be electrically connected to the ultrasonic sensor 101, as shown in Fig. 12. In another example, the first circuit board 103 can be electrically connected to the third support plate 110, which is not limited herein.

[0098] In the embodiment of the present application, the touch sensing assembly 102 includes a plurality of second electrodes 1024, which are distributed on the third support plate 110, so that the touch recognition function can be realized by the plurality of second electrodes 1024. Compared with the distribution of the first electrodes 1023 in the above embodiment, the second circuit board 109 does not need to be additionally arranged, the cost is lower, and since the touch sensing assembly 102 is arranged in the fingerprint module 100, the touch operation of the user can be recognized, and the physical keys (for example, the power key, the volume control key, etc.) can be replaced in the electronic device. Since the touch operation recognition function is integrated on the fingerprint module 100, the physical keys do not need to be arranged, the internal space of the electronic device can be saved, and the fingerprint module 100 has higher functional expandability, and the user experience can be improved.

[0099] In a possible implementation, the second surface of the third support plate 110 is bonded to a non-metal middle frame 202 of the electronic device, wherein the thickness of the non-metal middle frame 202 of the electronic device is less than 1.5 mm, or the fingerprint module 100 further includes a third cover plate 111, and the second surface of the third support plate 110 is bonded to the third cover plate 111, wherein the thickness of the third cover plate 111 is less than 1.5 mm.

[0100] FIG. 13 is a cross-sectional view of another application scenario of a fingerprint module according to an embodiment of the present application. As shown in FIG. 13, the second surface of the third support plate 110 is bonded to a non-metal middle frame 202 of the electronic device, and the first surface of the third support plate 110 is the surface on which the ultrasonic sensor 101 is arranged. In an example, the second surface of the third support plate 110 can be bonded to the non-metal middle frame 202 by an eighth adhesive layer 309. It should be noted that when the touch sensing assembly 102 is a plurality of second electrodes 1024, the touch recognition cannot be performed between the second electrodes 1024 and the fingers because the metal is included therebetween. Therefore, the third support plate 110 is bonded to the non-metal middle frame 202 of the electronic device, but cannot be bonded to the metal middle frame 202 of the electronic device, so that the embodiment scheme can only be applied to the electronic device with the non-metal middle frame 202. The thickness of the non-metal middle frame 202 of the electronic device is less than 1.5 mm.

[0101] FIG. 14 is a schematic diagram of an application scenario of another fingerprint module according to an embodiment of the present application. As shown in FIG. 14, the fingerprint module 100 further includes a third cover plate 111, and a second surface of the third support plate 110 is bonded to the third cover plate 111. The thickness of the third cover plate 111 is less than 1.5 mm. Similar to the middle frame 202, the third cover plate 111 is made of a non-metal material because the touch control cannot be performed when the metal is included between the second electrode 1024 and the finger. In a possible implementation, the second surface of the third support plate 110 can be bonded to the third cover plate 111 through a ninth adhesive layer 310, and the ninth adhesive layer 310 includes but is not limited to glue, adhesive film, and the like.

[0102] FIG. 15 is a schematic diagram of a top view of an application scenario of another fingerprint module according to an embodiment of the present application, and FIG. 16 is a schematic diagram of a top view of an application scenario of another fingerprint module according to an embodiment of the present application. FIG. 15 is a top view of the second surface of the third support plate 110 being bonded to the non-metal middle frame 202 of the electronic device according to FIG. 13, and FIG. 16 is a top view of the second surface of the third support plate 110 being bonded to the third cover plate 111 according to FIG. 14.

[0103] In the embodiments of the present application, the third support plate 110 can be bonded to the non-metal middle frame 202 of the electronic device. Since the non-metal middle frame 202 of the electronic device is used as the pressing surface, the middle frame 202 of the electronic device does not need to be punched, and the strength of the middle frame 202 of the electronic device is high. Alternatively, the fingerprint module 100 includes the third cover plate 111, and the third support plate 110 is bonded to the third cover plate 111. The third cover plate 111 can provide the pressing surface, thereby protecting the fingerprint module 100 through the third cover plate 111, improving the reliability of the fingerprint module 100, and making the fingerprint module 100 applicable to the electronic device with the punched middle frame 202.

[0104] In a possible implementation, as shown in FIGS. 2, 3, 5, 8, 10, 12, 13, and 14, the electric connection line is located in the protective glue 108, and the protective glue 108 is partially bonded to the ultrasonic sensor 101.

[0105] In the embodiments of the present application, the electric connection line is located in the protective glue 108, and the protective glue 108 is partially bonded to the ultrasonic sensor 101. Therefore, the electric connection line can be fixed through the protective glue 108, the electric connection line can be prevented from being broken under the action of an external force, and the reliability of the fingerprint module 100 is improved.

[0106] Fig. 17 is a schematic diagram of an electronic device according to an embodiment of the present application. As shown in Fig. 12, the electronic device includes a processing unit 201 and the fingerprint module 100 according to any of the above embodiments. The processing unit 201 is configured to perform fingerprint identification according to a fingerprint sensing signal transmitted by the ultrasonic sensor 101 in the fingerprint module 100, and / or to identify a touch instruction according to a touch signal transmitted by the ultrasonic sensor 101.

[0107] It should be noted that, according to the needs of implementation, each component / step described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or parts of the operations of the components / steps can be combined into a new component / step, to achieve the purpose of the embodiments of the present application.

[0108] Those skilled in the art can appreciate that the units and method steps of the examples described in combination with the embodiments disclosed herein can be implemented in electronic hardware, or in combination of computer software and electronic hardware. Whether the functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of the present application.

[0109] The above embodiments are only used to illustrate but not to limit the embodiments of the present application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application, and all equivalent technical solutions belong to the scope of the embodiments of the present application. The patent protection scope of the embodiments of the present application should be defined by the claims.

Claims

1. A fingerprint module, characterized in that, The fingerprint module comprises an ultrasonic sensor, a touch sensing component and a first circuit board; The touch sensing component is electrically connected with the ultrasonic sensor, and the ultrasonic sensor is electrically connected with the first circuit board, which is used to be electrically connected with a processing unit of an electronic device; The ultrasonic sensor is used to emit a first ultrasonic signal and receive a first ultrasonic echo signal reflected back, and convert the first ultrasonic echo signal into a fingerprint sensing signal, and then send the fingerprint sensing signal to the processing unit through the first circuit board, so that the processing unit performs fingerprint identification according to the fingerprint sensing signal; The touch sensing component is used to generate a sensing signal after a touch region of a pressing surface is touched, and send the sensing signal to the ultrasonic sensor, so that the ultrasonic sensor generates a touch signal according to the sensing signal, and sends the touch signal to the processing unit through the first circuit board, so that the processing unit identifies a touch operation according to the touch signal.

2. The fingerprint module of claim 1, wherein, The ultrasonic sensor comprises a substrate and a first acoustic layer; The first acoustic layer is arranged on the substrate, the substrate is electrically connected with the first circuit board, and the touch sensing component is electrically connected with the substrate; The first acoustic layer is used to emit a first ultrasonic signal when a fingerprint identification region of the pressing surface is pressed, receive the first ultrasonic echo signal, and convert the ultrasonic echo signal into an electrical signal; The substrate is used to generate a fingerprint sensing signal according to the electrical signal, and / or generate the touch signal according to the sensing signal.

3. The fingerprint module of claim 2, wherein, The fingerprint module further comprises a first support plate, and the ultrasonic sensor and the touch sensing component are arranged on a first surface of the first support plate.

4. The fingerprint module of claim 3, wherein, The substrate is electrically connected with the first support plate through an electrical connection line, and the first circuit board is electrically connected with an electrical connection area arranged on the first support plate, so that the substrate is electrically connected with the first circuit board through the first support plate.

5. The fingerprint module of claim 4, wherein, The touch sensing component comprises at least one second acoustic layer; The at least one second acoustic layer is electrically connected with the substrate through an electrical connection line, and is electrically connected with the first support plate; The at least one second acoustic layer is used to generate a second ultrasonic signal after the touch region is touched, convert the second ultrasonic echo signal reflected back by a finger into the sensing signal, and send the sensing signal to the substrate, so that the substrate generates the touch signal according to the sensing signal.

6. The fingerprint module of claim 5, wherein, The touch sensing component comprises a plurality of second acoustic layers, and the plurality of second acoustic layers are uniformly distributed on both sides of the ultrasonic sensor in a direction parallel to the substrate.

7. The fingerprint module of claim 5, wherein the first and second substrates are made of glass. The second surface of the first support plate is bonded to a middle frame of the electronic device, and the middle frame of the electronic device provides the pressing surface, wherein the middle frame of the electronic device includes a metal middle frame or a non-metal middle frame, the thickness of the metal middle frame of the electronic device is less than 1 mm, and the thickness of the non-metal middle frame of the electronic device is less than 1.5 mm.

8. The fingerprint module of claim 5, wherein, The fingerprint module further includes a first cover plate, a first surface of the first cover plate is used to provide the pressing surface, and a second surface of the first cover plate is bonded to the second surface of the first support plate.

9. The fingerprint module of claim 2, wherein, The touch sensing assembly includes a plurality of first electrodes, and the fingerprint module further includes a second circuit board. The second circuit board is arranged on a first side of the ultrasonic sensor in a direction parallel to the substrate, and the first circuit board is arranged on a second side of the sensor, the first side and the second side being opposite to each other. The second circuit board is electrically connected to the substrate through an electrical connection line, one end of the first circuit board is electrically connected to the substrate through an electrical connection line, the other end of the first circuit board is electrically connected to the processing unit, and the plurality of first electrodes are uniformly distributed on a side of the first circuit board and the second circuit board close to the pressing surface.

10. The fingerprint module of claim 9, wherein, The fingerprint module further includes a second support plate, the ultrasonic sensor, the first circuit board and the second circuit board are bonded to a first surface of the second support plate, and a second surface of the second support plate is bonded to a non-metal middle frame of the electronic device, the non-metal middle frame of the electronic device providing the pressing surface, wherein the thickness of the non-metal middle frame of the electronic device is less than 1.5 mm.

11. The fingerprint module of claim 10, wherein, The fingerprint module further includes a second cover plate. The first surface of the second cover plate is used to provide the pressing surface, the ultrasonic sensor, the first circuit board and the second circuit board are bonded to a second surface of the second cover plate, the first surface of the second cover plate is opposite to the second surface of the second cover plate, and the thickness of the second cover plate is less than 1.5 mm.

12. The fingerprint module of claim 2, wherein, The fingerprint module further includes a third support plate, and the touch sensing assembly includes a plurality of second electrodes. The ultrasonic sensor is arranged on a first surface of the third support plate, the plurality of second electrodes are distributed on the third support plate, the plurality of second electrodes are electrically connected to the third support plate, and the ultrasonic sensor is electrically connected to the third support plate. When a finger touches, the second electrode generates the sensing signal and sends the sensing signal to the substrate through the third support plate.

13. The fingerprint module of claim 12, wherein The second surface of the third support plate is bonded to a non-metal middle frame of the electronic device, wherein the thickness of the non-metal middle frame of the electronic device is less than 1.5 mm. Alternatively, the fingerprint module further comprises a third cover plate, and the second surface of the third support plate is bonded to the third cover plate, wherein the thickness of the third cover plate is less than 1.5 mm.

14. The fingerprint module according to any one of claims 4, 5, 9, wherein, The electric connection line is located in the protective glue, and the protective glue is partially bonded to the ultrasonic sensor.

15. An electronic device, comprising: The fingerprint module comprises a processing unit and a fingerprint module as claimed in any one of claims 1-14. The processing unit is configured to perform fingerprint identification according to a fingerprint sensing signal transmitted by the ultrasonic sensor in the fingerprint module, and / or to identify a touch instruction according to a touch signal transmitted by the ultrasonic sensor.

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