Information acquisition assembly, battery pack, and electric device

Abstract

The present application provides an information acquisition assembly, a battery pack, and an electric device. The information acquisition assembly comprises a circuit board and a conductive bar; the circuit board comprises a circuit board body and a plurality of circuit board branches; the conductive bar comprises a plurality of conductive units; at least one circuit board branch is electrically connected between the circuit board body and the conductive units; and the circuit board branches are configured as separate components from the circuit board body and the conductive units, facilitating a definable connection between the circuit board branches and the circuit board body.

Description

Information acquisition assembly, battery pack and electric device

[0001] The present application claims priority to the Chinese patent application No. 202422341299.9, filed on September 24, 2024, and entitled "Information acquisition assembly, battery pack and electric device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of power batteries, in particular to an information acquisition assembly, a battery pack and an electric device. BACKGROUND

[0003] In the related art, the adapter form of the main body of the circuit board of the information acquisition assembly is usually a nickel sheet adapter or a circuit board branch bending adapter form, but the cost of the adapter is high, and at the same time, since the main body of the circuit board and the circuit board branch are usually designed integrally, the connection between the main body of the circuit board and the circuit board branch cannot be defined and adjusted. SUMMARY

[0004] The information acquisition assembly in the related art has the technical problem that the connection between the main body of the circuit board and the circuit board branch cannot be defined and adjusted.

[0005] Embodiments of the present application provide an information acquisition assembly, a battery pack and an electric device, which can improve the technical problem that the connection between the main body of the circuit board and the circuit board branch cannot be defined and adjusted in the related art.

[0006] In a first aspect, embodiments of the present application provide an information acquisition assembly, comprising:

[0007] a circuit board, comprising a main body and a plurality of branches;

[0008] a conductive row, comprising a plurality of conductive units, each conductive unit being configured to electrically connect a corresponding battery cell;

[0009] At least one branch is electrically connected between the main body and the corresponding conductive unit, and at least one branch and the main body and the corresponding conductive unit are separately provided.

[0010] In an embodiment, one end of the branch is welded to the main body, and the other end of the branch is welded to the corresponding conductive unit.

[0011] In an embodiment, the branch includes a main body pad, the main body pad is exposed by a main body pad opening window provided at the one end of the branch close to the main body, and the main body pad is welded to the main body through the main body pad opening.

[0012] In one embodiment, the main body pad is provided with at least one through hole.

[0013] In one embodiment, the through hole is arranged through the main body pad along the thickness direction of the main body pad.

[0014] In one embodiment, a plurality of the through holes are uniformly arranged on the main body pad.

[0015] In one embodiment, the through hole is a circular hole, and a plurality of the circular holes have the same diameter.

[0016] In one embodiment, a plurality of the through holes are arranged in two rows along the length direction of the circuit board branch, the number of the through holes in one row is equal to the number of the through holes in the other row, and the two rows of the through holes are symmetrically arranged about a middle line in the row direction.

[0017] In one embodiment, the circuit board branch includes a conductive pad, and the circuit board branch is provided with a conductive pad window near the other end of the conductive unit to expose the conductive pad, so that the conductive pad is welded to the corresponding conductive unit.

[0018] In one embodiment, the circuit board branch includes a buffer arm, and the buffer arm is located between the one end of the circuit board branch near the circuit board main body and the other end of the circuit board branch near the conductive unit, and is provided with at least one buffer hole.

[0019] In one embodiment, the buffer arm is made of the same material as the circuit board branch.

[0020] In one embodiment, the buffer arm includes two buffer holes, and the two buffer holes can be arranged in central symmetry.

[0021] In one embodiment, the depth of the buffer hole ranges from 0.15 mm to 0.3 mm, and the length and width of the buffer hole are both greater than 0.8 mm.

[0022] In one embodiment, the circuit board branch is provided with two grooves on opposite sides, and the two grooves are arranged oppositely or staggered.

[0023] In one embodiment, the depth of the groove is less than or equal to 1 mm.

[0024] In one embodiment, each buffer hole includes opposite first and second ends; and in the width direction of the circuit board branch, the first ends of the two buffer holes are aligned, and the end of each groove is aligned with the second end of the corresponding buffer hole.

[0025] In an embodiment, the length of the main body pad ranges from 2 mm to 200 mm, the width of the main body pad ranges from 5 mm to 15 mm, the length of the conductive pad ranges from 5 mm to 15 mm, and the width of the conductive pad ranges from 5 mm to 15 mm.

[0026] In an embodiment, the information acquisition assembly further comprises a protective film, and a normal projection of the main body pad on the protective film in a film thickness direction is located within a boundary of the protective film.

[0027] In a second aspect, embodiments of the present application provide a battery pack comprising the information acquisition assembly according to any of the above embodiments.

[0028] In a third aspect, embodiments of the present application provide a power consumption device comprising the information acquisition assembly according to any of the above embodiments.

[0029] Advantages of embodiments of the present application:

[0030] In embodiments of the present application, by arranging the circuit board branch separately from the circuit board main body and the corresponding conductive unit, and electrically connecting the circuit board branch with the circuit board main body and the corresponding conductive unit by welding, the connection relationship between the circuit board main body and the circuit board branch can be defined and adjusted, thereby improving the technical problem in the related art that the connection between the circuit board main body and the circuit board branch cannot be defined and adjusted. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0032] FIG. 1 is a schematic diagram of an information acquisition assembly and a power management assembly according to an embodiment of the present application;

[0033] FIG. 2 is a schematic diagram of a circuit board branch in an information acquisition assembly according to an embodiment of the present application;

[0034] FIG. 3 is a schematic diagram of a cutting hole in the preparation process of an information acquisition assembly according to an embodiment of the present application. Embodiments of the present application

[0035] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work under the premise that the embodiments in the present application fall within the scope of protection of the present application. In addition, it should be understood that the specific implementation described herein is only used to illustrate and explain the present application, and is not used to limit the present application. In the present application, the orientation words such as "upper" and "lower" generally refer to the upper and lower of the device in the actual use or working state, and the specific direction of the drawing surface in the drawing; and "inner" and "outer" are relative to the outline of the device.

[0036] Referring to FIG. 1, the information collection assembly 4 provided by the embodiment of the present application includes a circuit board and a conductive row, the circuit board includes a circuit board main body 1 and a plurality of circuit board branches 2, and the conductive row includes a plurality of conductive units 3, each conductive unit 3 is used for electrically connecting a corresponding battery cell; wherein at least one circuit board branch 2 is electrically connected between the circuit board main body 1 and the corresponding conductive unit 3, and the at least one circuit board branch 2 is separately provided with the circuit board main body 1 and the corresponding conductive unit 3.

[0037] In the embodiment, by separately providing the circuit board branch 2 with the circuit board main body 1 and the corresponding conductive unit 3, using the welding method, the definable connection design of the circuit board branch 2 and the circuit board main body 1 is facilitated, and the technical problem that the connection between the circuit board main body 1 and the circuit board branch 2 in the related art cannot be defined and adjusted is improved.

[0038] The definable connection or defined connection design of the present application refers to: when the welding between the circuit board main body 1 and the circuit board branch 2 is completed by using the welding process, any signal connection line 13 having an electrical connection relationship with the battery management assembly 11 can be selectively and one-to-one electrically connected with any circuit board branch 2. For example: the circuit board main body 1 includes a plurality of signal connection lines 13N1, N2,..., Nn, the plurality of circuit board branches 2 includes M1, M2,..., Mm, and m = n, wherein when the welding between the circuit board main body 1 and the circuit board branch 2 is completed by using the welding process, any one of M1, M2,..., Mm can be selectively and one-to-one electrically connected with any one of N1, N2,..., Nn.

[0039] The technical solutions of the present application will be described in conjunction with specific embodiments.

[0040] The circuit board body 1 in the present application can be a FPC (Flexible Printed Circuit) body, the circuit board branch 2 can be a FFC (flexible flat cable) branch, and the conductive unit 3 can be a busbar. The circuit board body 1 comprises a plurality of signal connection lines 13 which are independent of each other and arranged side by side. The signal connection line 13 is connected between the signal collection port of the battery management assembly 11 and the corresponding conductive unit 3.

[0041] The definition adjustment refers to that, in the preparation process of the information collection assembly, when the signal collection line on the circuit board body is welded and connected with the branch, the signal collection line cannot be connected with any branch, but can only be connected with the branch in order, and cannot be selectively connected in disorder to cause the definition adjustment.

[0042] In an embodiment, as shown in FIG. 1, one end of the circuit board branch 2 is welded to the circuit board body 1, and the other end of the circuit board branch 2 is welded to the corresponding conductive unit 3.

[0043] It can be understood that the electrical connection between the circuit board body 1 and the circuit board branch 2 is achieved by welding. At the welding position, the insulating layer between the circuit board branch 2 and the circuit board body 1 needs to be hollowed out so that the conductive part of the circuit board body 1 directly contacts the conductive part of the circuit board branch 2.

[0044] In an embodiment, as shown in FIG. 2, the circuit board branch 2 comprises a body solder pad 5. One end of the circuit board branch 2 is provided with a body solder pad window to expose the body solder pad 5, so that the body solder pad 5 is welded to the circuit board body 1.

[0045] The body solder pad 5 is used for welding with the circuit board body 1, and the body solder pad window is used for hollowing out the insulating layer on the side of the body solder pad 5 facing the circuit board body 1 to expose the body solder pad 5.

[0046] It can be understood that in the area of the body solder pad window, part of the insulating layer of the circuit board body 1 also needs to be removed to expose the conductive part of the circuit board body 1, so that the conductive part is aligned with and welded to the body solder pad 5.

[0047] In an embodiment, as shown in FIG. 2, the body solder pad 5 is provided with at least one through hole 10.

[0048] The through hole 10 is arranged through the body solder pad 5 along the thickness direction of the body solder pad 5.

[0049] The plurality of through holes 10 are uniformly arranged on the body solder pad 5.

[0050] The through hole 10 is a circular hole, and the diameters of the plurality of circular holes can be the same.

[0051] The plurality of through holes 10 are arranged in two rows along the length direction of the branch 2, the number of through holes in one row is equal to that in the other row, and the two rows are symmetrically arranged about a middle line in the row direction.

[0052] It can be understood that the through hole 10 is used for exhausting air when the main pad 5 and the main body 1 of the circuit board are welded, which can reduce the air bubbles generated during welding, make the welding more firm, and avoid forming a virtual weld.

[0053] In the embodiment, by arranging at least one through hole 10 on the main pad 5, virtual welding between the main pad 5 and the main body 1 of the circuit board can be avoided, and the firmness of the welding is improved.

[0054] In one embodiment, referring to FIG. 2, the branch 2 of the circuit board includes a conductive pad 6, and the other end of the branch 2 is provided with a conductive pad window to expose the conductive pad 6, so that the conductive pad 6 is welded to the corresponding conductive unit 3.

[0055] The conductive pad 6 can be welded to the conductive unit 3, and the conductive pad window is used to hollow out the insulating layer on the side of the conductive pad 6 facing the conductive unit 3 to expose the conductive pad 6.

[0056] In one embodiment, referring to FIG. 2, the branch 2 of the circuit board includes a buffer arm 7, which is located between one end and the other end of the branch 2 and is provided with at least one buffer hole 8.

[0057] The buffer arm 7 is located between the main pad 5 and the conductive pad 6.

[0058] The material of the buffer arm 7 can be the same as that of the branch 2 of the circuit board.

[0059] The buffer arm 7 can include two buffer holes 8, and the buffer holes 8 can be arranged in a central symmetry.

[0060] The buffer hole 8 is used to absorb the displacement and extrusion stress generated when the branch 2 of the circuit board expands.

[0061] The cross-sectional shape of the buffer hole 8 can be a curved surface.

[0062] Referring to FIG. 2, the buffer hole 8 can have a shape similar to “S” as shown.

[0063] The depth of the buffer hole 8 can range from 0.15 mm to 0.3 mm, and the length and width of the buffer hole 8 are both greater than 0.8 mm.

[0064] It can be understood that the buffer hole 8 is arranged through the circuit board branch 2, and the thickness of the circuit board branch 2 in the film thickness direction is the depth of the buffer hole 8. The depth of the buffer hole 8 can be 0.15 mm, 0.2 mm, 0.25 mm, or 0.3 mm.

[0065] It can be understood that when the length or width of the buffer hole 8 is less than 0.8 mm, the yield of the process for manufacturing the buffer hole 8 will be significantly reduced. When the length and width of the buffer hole 8 are greater than 0.8 mm, on the one hand, the size of the buffer hole 8 is larger, which improves the buffering effect of the buffer hole 8, and on the other hand, the process difficulty for manufacturing the buffer hole 8 is reduced, which improves the yield of manufacturing the buffer hole 8.

[0066] It can be understood that by arranging two or more buffer holes 8 to be centrally symmetric, the buffering effect of the buffer hole 8 on the thermal expansion of the circuit board branch 2 can be further improved. Meanwhile, by arranging the cross-sectional shape of the buffer hole 8 to be a curved surface, for example, a shape similar to “S”, the buffering effect of the buffer hole 8 on stress can also be improved.

[0067] In the embodiment, by arranging the buffer arm 7 on the circuit board branch 2, and arranging the buffer hole 8 through the buffer arm 7, the stress caused by the expansion of the circuit board branch 2 can be absorbed, and the abnormality of the circuit board branch 2 caused by the stress can be prevented.

[0068] In one embodiment, referring to FIG. 2, the circuit board branch 2 is provided with two grooves 9 on opposite sides.

[0069] The depth of the groove 9 is less than or equal to 1 mm.

[0070] The groove 9 is located on the opposite side surfaces of the circuit board branch 2 in the width direction, and is recessed inward from the surface to form the groove 9.

[0071] The grooves 9 located on the opposite side surfaces can be arranged in a staggered manner.

[0072] The shapes and sizes of the grooves 9 located on the opposite side surfaces can be the same.

[0073] It can be understood that when the conductive unit 3 is offset in the length direction of the information acquisition assembly 4, the conductive unit 3 will be displaced relative to the circuit board branch 2. The groove 9 plays a buffering effect on such displacement, and further avoids the abnormality of the branch caused by stress when the material is delivered.

[0074] In the embodiment, by arranging the groove 9 on the two opposite side surfaces of the circuit board branch 2, the groove 9 is used to prevent the abnormality of the circuit board branch 2 from being warped.

[0075] In an embodiment, referring to FIG. 2, each buffer hole 8 comprises opposite first and second ends; wherein, in the width direction of the circuit board branch 2, the first ends of the two buffer holes 8 are aligned, and the end of each groove 9 is aligned with the second end of the corresponding buffer hole 8.

[0076] In an embodiment, the information collection assembly 4 further comprises a protective film, and the orthographic projection of at least the main pad 5 falls within the protective film in the film thickness direction.

[0077] The protective film can be made of polyethylene terephthalate.

[0078] It can be understood that, since the insulating layers on both sides of the main pad 5 need to be removed, by attaching the protective film to the lower surface of the circuit board branch 2, the lower surface of the main pad 5 after welding is covered by the protective film and is not exposed, and the external erosion is blocked by the protective film, without affecting the main pad 5.

[0079] It can be understood that, at the conductive pad, the protective glue material is formed by dispensing on the side of the circuit board branch away from the conductive unit, and the protective glue material covers the surface of the side of the conductive pad away from the conductive unit, which can prevent the conductive pad from being eroded by the external environment.

[0080] In the embodiment, the protective film is used to protect the main pad 5 after welding, so as to avoid the exposed area of the main pad 5 from being eroded by the environment during use, resulting in failure of the main pad 5.

[0081] In an embodiment, the circuit board body 1 and the circuit board branch 2 can both have a three-layer laminated structure, wherein the three-layer laminated structure comprises a conductive layer and two insulating layers on both sides of the conductive layer.

[0082] In the position where the circuit board body 1 and the circuit board branch 2 are welded, the insulating layers between the circuit board body 1 and the circuit board branch 2 are hollowed out to facilitate welding of the circuit board body 1 and the circuit board branch 2.

[0083] In the position where the circuit board branch 2 and the conductive unit 3 are welded, the insulating layers between the circuit board branch 2 and the conductive unit 3 are hollowed out to facilitate welding of the circuit board branch 2 and the conductive unit 3.

[0084] In an embodiment, the length of the main pad ranges from 2 mm to 200 mm, the width of the main pad ranges from 5 mm to 15 mm, the length of the conductive pad 6 ranges from 5 mm to 15 mm, and the width of the conductive pad 6 ranges from 5 mm to 15 mm.

[0085] The length of the main pad can be any one of 2 mm, 35.3 mm, 50 mm, 100 mm, and 200 mm.

[0086] wherein the width of the main body pad can be any one of 5mm, 8mm, 10mm, 13mm, 15mm.

[0087] wherein the length of the conductive pad 6 can be any one of 5mm, 8mm, 10mm, 13mm, 15mm.

[0088] wherein the width of the conductive pad 6 can be any one of 5mm, 8mm, 10mm, 13mm, 15mm.

[0089] Embodiments of the present application also provide a battery pack and an electrical equipment, both of which comprise the information acquisition assembly 4 according to any one of the above embodiments; the information acquisition assembly 4 comprises a circuit board and a conductive row, the circuit board comprises a circuit board main body 1 and a plurality of circuit board branches 2, and the conductive row comprises a plurality of conductive units 3, each of which is used for electrically connecting a corresponding battery cell; wherein at least one circuit board branch 2 is electrically connected between the circuit board main body 1 and the corresponding conductive unit 3, and the at least one circuit board branch 2 is separately arranged from the circuit board main body 1 and the corresponding conductive unit 3; by separately arranging the circuit board branch 2 from the circuit board main body 1 and the corresponding conductive unit 3, a definable connection design between the circuit board branch 2 and the circuit board main body 1 is facilitated by means of welding.

[0090] wherein the connection relationship between the signal acquisition end of the battery management assembly 11 and the signal connection line 13 of the information acquisition assembly 4 is in order and mutually corresponding.

[0091] wherein the battery pack further comprises a battery management assembly 11, and the battery management assembly 11 comprises a plurality of signal acquisition ends, which are sequentially and one-to-one connected with the signal connection lines 13 of the plurality of circuit board main bodies 1.

[0092] In an embodiment, the battery management assembly 11 and the information acquisition assembly 4 are connected by a wire harness.

[0093] wherein the battery management assembly 11 comprises a first male connector, the information acquisition assembly 4 comprises a second male connector, and the two ends of the wire harness respectively comprise a first female connector and a second female connector; by electrically connecting the first male connector and the first female connector and electrically connecting the second male connector and the second female connector, the battery management assembly 11 and the information acquisition assembly 4 are electrically connected.

[0094] In an embodiment, the battery management assembly 11 and the information acquisition assembly 4 are electrically connected by means of a gold finger plug.

[0095] It can be understood that directly connecting the connecting end of the battery management assembly 11 and the connecting end of the information collection assembly 4 through the gold finger plug-in mode can realize the electrical connection, and the wire harness for switching can be omitted, and the cost is further reduced.

[0096] In an embodiment, referring to FIG. 3, the definition line board branch 2 and the line board main body 1 are welded at the first welding point, and the definition line board branch 2 and the conductive unit 3 are welded at the second welding point. When the information collection assembly 4 is prepared, the line board main body 1 is formed with a cutting hole 12, and the cutting hole 12 is used to divide the signal connection line 13 of the line board main body 1 into a first part 131 and a second part which are independent of each other. The first part 131 is connected between the first welding point and the signal collection port of the battery management assembly 11 of the battery management system 11, and the second part is discarded and removed from the information collection assembly 4.

[0097] It can be understood that a plurality of signal connection lines 13 with the same length are prepared first, and then the cutting hole 12 is arranged on the line board main body 1 according to the position of the first welding point at which the signal connection line 13 is welded with the line board branch 2, so that the second part of the signal connection line 13 located on the side of the first welding point away from the signal collection port is removed.

[0098] It can be understood that the second part does not need to be electrified, and the second part is independent of the first part 131, so that the electrical safety accident of the second part can be avoided, and the electrical safety accident of the information collection assembly 4 is reduced.

[0099] It should be noted that the second part is not included in the structure of the information collection assembly 4. Since the cutting hole 12 is located at the edge of the first part 131, the surface of the side of the first part 131 away from the signal collection port may be irregular or rough due to the cutting of the cutting hole 12; wherein the forming process of the cutting hole 12 can be laser etching.

[0100] In the embodiment, the second part is cut off and removed by forming the cutting hole 12, and the occurrence of the electrical safety accident is reduced.

[0101] The information collection assembly 4 provided in the application is provided by arranging the line board main body 1, the line board branch 2 and the conductive unit 3 in a split manner, so that the connection between the line board main body 1 and the line board branch 2 can be defined. By making the connection between the line board main body 1 and the line board branch 2 definable, the production efficiency can be improved.

[0102] The information collection assembly 4 of the application can also realize the electrical connection of the line board branch 2 with the line board main body 1 and the conductive unit 3 through welding. Compared with the form of nickel sheet switching in the related art, the application can omit the nickel sheet, and the cost is reduced.

[0103] The above has carried out the detailed introduction to the embodiment of the application, the principle and implementation mode of the application have been described by applying specific examples in this paper, the above embodiment explanation is only for helping understanding the method of the application and its core idea; at the same time, for the person skilled in the art, according to the idea of the application, there will be changes in specific implementation mode and application range, and the above-mentioned, the content of the specification should not be understood as the limitation of the application.

Claims

1. An information acquisition assembly, comprising: a circuit board including a circuit board main body and a plurality of circuit board branches; a conductive row including a plurality of conductive units, each of the conductive units being configured to electrically connect to a corresponding battery cell; wherein at least one of the circuit board branches is electrically connected between the circuit board main body and a corresponding conductive unit, and the at least one of the circuit board branches is separately arranged from the circuit board main body and the corresponding conductive unit.

2. The information gathering assembly of claim 1, wherein, one end of the circuit board branch is welded to the circuit board main body, and the other end of the circuit board branch is welded to the corresponding conductive unit.

3. The information gathering assembly of claim 2, wherein, the circuit board branch includes a main body pad, the circuit board branch is provided with a main body pad opening window near the one end of the circuit board main body to expose the main body pad, and the main body pad is welded to the circuit board main body through the main body pad opening window.

4. The information gathering assembly of claim 3, wherein, the main body pad is provided with at least one through hole.

5. The information gathering assembly of claim 4, wherein, the through hole is arranged through the main body pad along the thickness direction of the main body pad.

6. The information gathering assembly of claim 4, wherein, a plurality of the through holes are uniformly arranged on the main body pad.

7. The information gathering assembly of claim 4, wherein, the through hole is a circular hole, and a plurality of the circular holes have the same hole diameter.

8. The information gathering assembly of claim 4, wherein, a plurality of the through holes are arranged in two columns along the length direction of the circuit board branch, the number of the through holes in one column is equal to the number of the through holes in the other column, and the two columns of the through holes are symmetrically arranged about a middle line in the column direction.

9. The information gathering assembly of claim 3, wherein, the circuit board branch includes a conductive pad, the circuit board branch is provided with a conductive pad opening window near the other end of the conductive unit to expose the conductive pad, so that the conductive pad is welded to the corresponding conductive unit.

10. The information gathering assembly of claim 2, wherein, the circuit board branch includes a buffer arm, the buffer arm is located between the one end of the circuit board branch near the circuit board main body and the other end of the circuit board branch near the conductive unit, and is provided with at least one buffer hole.

11. The information gathering assembly of claim 10, wherein, the buffer arm is made of the same material as the circuit board branch.

12. The information gathering assembly of claim 10, wherein, the buffer arm includes two buffer holes, and the two buffer holes can be centrally symmetrically arranged.

13. The information gathering assembly of claim 10, wherein, the depth of the buffer hole ranges from 0.15 mm to 0.3 mm, and the length and width of the buffer hole are greater than 0.8 mm.

14. The information gathering assembly of claim 10, wherein, the circuit board branch is provided with two grooves on opposite sides, and the two grooves are oppositely arranged or staggered.

15. The information gathering assembly of claim 14, wherein, the depth of the groove is less than or equal to 1 mm.

16. The information gathering assembly of claim 14, wherein, each of the buffer holes includes opposite first and second ends; wherein, in the width direction of the circuit board branch, the first ends of the two buffer holes are aligned, and the end of each of the grooves is aligned with the second end of the corresponding buffer hole. 17.The information acquisition assembly of claim 9, wherein the length of the main body pad ranges from 2 mm to 200 mm, the width of the main body pad ranges from 5 mm to 15 mm, the length of the conductive pad ranges from 5 mm to 15 mm, and the width of the conductive pad ranges from 5 mm to 15 mm. 18.The information acquisition assembly of any one of claims 1 to 17, further comprising a protective film, and in the film thickness direction, the orthographic projection of the main body pad on the protective film is located within the boundary of the protective film.

19. A battery pack comprising the information gathering assembly of any one of claims 1 to 17.

20. An electrical device comprising the information gathering assembly of any one of claims 1 to 17.

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