Heat exchange member, heat exchange module and electronic device

Abstract

Disclosed in the embodiments of the present disclosure are a heat exchange member, a heat exchange module and an electronic device. The heat exchange member comprises a first cover plate, a second cover plate and an intermediate layer that are stacked, wherein a flow channel groove is formed in the intermediate layer and runs through the intermediate layer in the direction of thickness thereof; the intermediate layer comprises a liquid-cooling layer and bonding layers arranged on two sides of the liquid-cooling layer, the liquid-cooling layer and the bonding layers on the two sides jointly forming a side wall of the flow channel groove; and the first cover plate and the second cover plate are respectively sealingly connected to the liquid-cooling layer by means of the bonding layers, such that the first cover plate, the second cover plate and the intermediate layer form a flow channel at the flow channel groove. In this way, the bonding seal between the first and the second cover plate and the liquid-cooling layer can be achieved by means of the bonding layers, thereby simplifying the sealing process, and also reducing the processing difficulty of the heat exchange member.

Description

Heat exchange component, heat exchange module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411390534.X, filed on September 30, 2024, and entitled "Heat exchange component, heat exchange module and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat transfer, and more particularly, to a heat exchange component, a heat exchange module and an electronic device. BACKGROUND

[0003] With the increasing integration of electronic devices, the heat dissipation problem has become one of the key factors restricting the performance improvement of the electronic devices. As a kind of high-efficiency heat dissipation element, the liquid cooling plate is widely used in various high-power-density electronic devices.

[0004] For the current structure of the liquid cooling plate, the flow channel layer and the sealing layer are usually sealed by a hot pressing process. However, due to the complexity and diversity of the flow channel in the flow channel layer, a positioning mold is usually designed to position the flow channel layer and the sealing layer during the hot pressing sealing process, which leads to a relatively complex processing technology of the liquid cooling plate. SUMMARY

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a novel heat exchange component, a heat exchange module and an electronic device.

[0006] According to one aspect of the present application, a heat exchange component is provided.

[0007] The heat exchange component comprises:

[0008] a first cover plate, a second cover plate and an intermediate layer which are stacked, a flow channel groove is formed on the intermediate layer, the flow channel groove is arranged through the thickness direction of the intermediate layer, the intermediate layer comprises a liquid cooling layer and an adhesive layer arranged on both sides of the liquid cooling layer, the liquid cooling layer and the adhesive layers on both sides form a side wall of the flow channel groove, and the first cover plate and the second cover plate are respectively sealed and connected with the liquid cooling layer through the adhesive layers, so that the first cover plate, the second cover plate and the intermediate layer enclose a flow channel at the flow channel groove.

[0009] Optionally, the adhesive layer comprises at least one layer of adhesive, the first side of the liquid cooling layer and the first cover plate are adhesively connected through the adhesive layer, and the second side of the liquid cooling layer and the second cover plate are adhesively connected through the adhesive layer.

[0010] Optionally, the adhesive forms the adhesive layer by dispensing or screen printing.

[0011] Optionally, the adhesive comprises a polyolefin elastomer glue, a polyurethane glue, a butyl glue, a pressure-sensitive glue, a pressure-sensitive hot-melt composite glue film, a hot-melt glue, or a thermosetting glue.

[0012] Optionally, the first cover plate comprises at least one of a polymer material layer and a metal layer, and / or the second cover plate comprises at least one of a polymer material layer and a metal layer.

[0013] Optionally, the liquid cooling layer comprises at least one of a polymer material layer and a metal layer.

[0014] Optionally, the thickness of the adhesive layer ranges from 0.025 mm to 0.05 mm.

[0015] Optionally, the first cover plate, the first adhesive layer, the liquid cooling layer, the second adhesive layer, and the second cover plate are sequentially stacked along the thickness direction of the heat exchange component, the first cover plate is sealingly connected to the first side of the liquid cooling layer through the first adhesive layer, and the second cover plate is sealingly connected to the second side of the liquid cooling layer through the second adhesive layer.

[0016] Optionally, the ratio of the thickness of the first cover plate to the first adhesive layer ranges from 0.6 to 2, and / or the ratio of the thickness of the second cover plate to the second adhesive layer ranges from 0.6 to 2.

[0017] Optionally, the edge of the adhesive layer is flush with the edge of the liquid cooling layer along the thickness direction of the heat exchange component.

[0018] Optionally, the side of the adhesive layer close to the flow channel has a guide portion for guiding the flow of the working medium in the flow channel.

[0019] Optionally, the first cover plate has a single-layer structure or a multi-layer structure.

[0020] Optionally, the second cover plate has a single-layer structure or a multi-layer structure.

[0021] According to another aspect of the present application, a heat exchange module is provided, comprising a micro-pump and the heat exchange component.

[0022] Optionally, the heat exchange component has a first working medium inlet and a first working medium outlet, the micro-pump has a second working medium inlet and a second working medium outlet, the first working medium inlet and the first working medium outlet are respectively in communication with the flow channel, and the first working medium inlet is in communication with the second working medium outlet, and the first working medium outlet is in communication with the second working medium inlet.

[0023] According to still another aspect of the present application, an electronic device is provided, comprising the heat exchange component or the heat exchange module.

[0024] One technical effect of embodiments of the present disclosure is that:

[0025] The heat exchange element comprises a first cover plate, a second cover plate and an intermediate layer arranged in layers, a flow channel groove is formed on the intermediate layer, the flow channel groove is arranged through along the thickness direction of the intermediate layer, the intermediate layer comprises a liquid cooling layer and an adhesive layer arranged on both sides of the liquid cooling layer, the liquid cooling layer and the adhesive layers on both sides form a side wall of the flow channel groove, and the first cover plate and the second cover plate are sealingly connected with the liquid cooling layer through the adhesive layers. Thus, the first cover plate, the second cover plate and the intermediate layer can be sealingly connected through the adhesive layer, the sealing process can be simplified, and the processing difficulty of the heat exchange element is also reduced.

[0026] Other features of the present application, and their advantages, will become apparent in the non-limiting examples described below and the claims. BRIEF DESCRIPTION OF DRAWINGS

[0027] The accompanying drawings, which constitute a part of this specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0028] FIG. 1 is a schematic view of a heat exchange element according to an embodiment of the present disclosure.

[0029] REFERENCE NUMERALS

[0030] 1, first cover plate; 2, intermediate layer; 21, flow channel groove; 22, liquid cooling layer; 23, adhesive layer; 3, second cover plate. DETAILED DESCRIPTION

[0031] Various example embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements, numerical expressions, and values of components and steps set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0032] The following description of at least one example embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0033] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and devices can be viewed as part of the specification.

[0034] In all examples shown and discussed herein, any specific values should be interpreted as merely illustrative and not as limiting. Thus, other examples of example embodiments can have different values.

[0035] It should be noted that like reference numerals and letters refer to like items in the several views, and that no further discussion on the same will be undertaken in the subsequent views, once an item has been defined in one view.

[0036] The heat exchange element provided by the embodiment of the present application can be applied to heat exchange of electronic devices such as tablet computers, notebook computers, VR (Virtual Reality) products, AR (Augmented Reality) products, watches, and the like.

[0037] As shown in FIG. 1, the heat exchange element provided by the embodiment of the present application comprises:

[0038] The first cover plate 1, the second cover plate 3, and the intermediate layer 2 are arranged in a stack, the intermediate layer 2 is provided with a flow channel groove 21, the flow channel groove 21 is arranged through along the thickness direction of the intermediate layer 2, the intermediate layer 2 comprises a liquid cooling layer 22 and an adhesive layer 23 arranged on both sides of the liquid cooling layer 22, the liquid cooling layer 22 and the adhesive layers 23 on both sides jointly form the side wall of the flow channel groove 21, the first cover plate 1 and the second cover plate 3 are respectively sealed and connected with the liquid cooling layer 22 through the adhesive layers 23, so that the first cover plate 1, the second cover plate 3, and the intermediate layer 2 enclose a flow channel at the flow channel groove 21.

[0039] As shown in FIG. 1, the intermediate layer 2 is arranged between the first cover plate 1 and the second cover plate 3, so that the first cover plate 1 and the second cover plate 3 on both sides can support and protect the intermediate layer 2. The embodiment of the present application is provided with the flow channel groove 21 on the intermediate layer 2, and the flow channel groove 21 is arranged through along the thickness direction of the intermediate layer 2, so that the working medium can flow smoothly in the flow channel at the flow channel groove 21 and fully contact with the liquid cooling layer 22, thereby realizing efficient heat conduction.

[0040] That is, the flow channel groove 21 is a through groove on the intermediate layer 2, which can simplify the process of opening the flow channel groove 21. According to actual design, the shape of the flow channel groove 21 includes but is not limited to straight line, snake shape, and spiral shape, so as to optimize the flow path of the working medium and the heat exchange efficiency. At the inlet and outlet of the flow channel, corresponding connecting pieces or interfaces can also be arranged, so as to be connected with external heat exchange systems such as water micro-pumps and heat sinks, and form a complete heat exchange cycle.

[0041] In the embodiment, the intermediate layer 2 comprises a liquid cooling layer 22 and two adhesive layers 23 on both sides. One side of the liquid cooling layer 22 has a first adhesive layer, and the opposite side of the liquid cooling layer 22 has a second adhesive layer. The first adhesive layer, the liquid cooling layer 22, and the second adhesive layer together form the intermediate layer 2. During the processing of the flow channel groove 21, the first adhesive layer, the liquid cooling layer 22, and the second adhesive layer can be stacked to form the intermediate layer 2, and then the intermediate layer 2 is cut to form the flow channel groove 21. In this way, the first adhesive layer, the liquid cooling layer 22, and the second adhesive layer can together form the side wall of the flow channel groove 21, which can facilitate the formation of the flow channel groove 21 and also strengthen the sealing of the side wall of the flow channel groove 21, thereby ensuring the sealing of the flow channel formed on the heat exchange element and thus ensuring the heat exchange effect.

[0042] The liquid cooling layer 22 can be made of metal material, or made of high polymer material, or made of a combination of metal material and high polymer material, which can adapt to different application requirements.

[0043] The first adhesive layer and the second adhesive layer are respectively located on both sides of the liquid cooling layer 22, and can be made of adhesive or film material with good sealing and thermal conductivity. On the one hand, the adhesive layer 23 can firmly connect the cover plate with the liquid cooling layer 22, thereby forming the overall structure of the heat exchange element; on the other hand, the adhesive layers 23 on both sides can also ensure the sealing of the flow channel groove 21 to prevent leakage of the working medium from affecting the heat exchange effect.

[0044] During production and assembly, the first cover plate 1 and the second cover plate 3 are respectively sealed and connected with the liquid cooling layer 22 through the respective adhesive layers 23, and the first cover plate 1, the second cover plate 3, and the intermediate layer 2 form a closed flow channel at the flow channel groove 21. The working medium flows in the flow channel, thereby realizing the heat exchange function of the heat exchange element. In this way, the adhesive layers can be used to achieve the adhesive sealing of the first cover plate 1, the second cover plate 3, and the liquid cooling layer 22, which can simplify the sealing process and thus reduce the processing difficulty of the heat exchange element. The surfaces of the first cover plate 1 and the second cover plate 3 that contact the adhesive layers 23 can be treated, for example, roughened, to increase the adhesive strength of the first cover plate 1 and the second cover plate 3 with the adhesive layers 23.

[0045] In addition, heat dissipation fins can be provided on the first cover plate 1 and / or the second cover plate 3 to increase the heat exchange area and promote air convection, thereby further improving the heat exchange effect of the heat exchange element. Alternatively, more efficient working medium (such as low-viscosity, high-thermal-conductivity liquid) or phase change material can be used to further improve the heat exchange effect of the heat exchange element.

[0046] The heat exchange component provided by the embodiment can be widely applied to heat exchange of electronic devices such as tablet computers, notebook computers, smart glasses, smart watches, and smart headsets, and can effectively reduce the working temperature of the electronic device and improve the operation stability and service life of the electronic device. The heat exchange component has small thickness, light weight, high heat exchange efficiency, and is easy to process and install, and has good market application prospect.

[0047] Optionally, the adhesive layer 23 comprises at least one adhesive, and the first side of the liquid cooling layer 22 and the first cover plate 1 are adhesively connected through the adhesive layer 23, and the second side of the liquid cooling layer 22 and the second cover plate 3 are adhesively connected through the adhesive layer 23.

[0048] Specifically, according to actual design requirements, the adhesive layer 23 can comprise one layer, two layers or even multiple layers of adhesive to form different adhesive effects. The adhesive layer 23 can comprise the same kind of adhesive, and the adhesive layer 23 can also comprise different kinds of adhesive to adapt to different application requirements.

[0049] In the embodiment, the two sides of the liquid cooling layer 22 are adhesively connected with the cover plates through the adhesive layers 23, and the overall structure of the heat exchange component is formed. Moreover, the adhesive layers 23 on the two sides can also ensure the sealing performance of the flow channel groove 21 and prevent leakage of the working medium from causing poor heat exchange effect.

[0050] Optionally, the adhesive is formed into the adhesive layer 23 by dispensing or screen printing.

[0051] In the dispensing and screen printing process in the embodiment, the coating amount and distribution position of the adhesive can be accurately controlled, the thickness of the adhesive layer 23 on the two sides of the liquid cooling layer 22 is uniform and consistent, and the adhesive layer 23 only covers the area that needs to be adhesively connected, which helps to reduce unnecessary material waste and improve the strength and sealing performance of the adhesive connection. The coating shape and spacing of the adhesive can be adjusted as needed to adapt to liquid cooling layers 22 and cover plates of different shapes and sizes, which helps to optimize the structure of the adhesive layer 23, improve the contact area and adhesion of the adhesive interface, and thus enhance the overall adhesive performance and sealing effect of the heat exchange component.

[0052] Optionally, the adhesive comprises polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive.

[0053] In the embodiment, by designing the adhesive to be any one of polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, and thermosetting adhesive, the adhesive connection and sealing between the first cover plate 1 and the liquid cooling layer 22 and between the second cover plate 3 and the liquid cooling layer 22 can be achieved, so that the forming process of the heat exchange component can be simplified and the processing difficulty of the heat exchange component can be reduced.

[0054] Preferably, the adhesive is a pressure-sensitive hot melt composite adhesive film, which is used to bond the first cover plate 1 and the liquid cooling layer 22 and bond the second cover plate 3 and the liquid cooling layer 22, thereby improving the reliability of the bonding and sealing and improving the compactness of the bonding and sealing, and thus improving the structural stability of the heat exchange device.

[0055] Optionally, the first cover plate 1 comprises at least one of a polymer material layer and a metal layer, and / or the second cover plate 3 comprises at least one of a polymer material layer and a metal layer.

[0056] In this embodiment, the first cover plate 1 can comprise a polymer material layer and / or a metal layer according to actual design requirements. For example, the first cover plate 1 can comprise a metal layer, which can improve the overall strength and heat conduction performance of the heat exchange device, thereby ensuring the stability of the electronic device having the heat exchange device in a complex working environment and reducing the working temperature of the electronic device. The first cover plate 1 can also comprise a polymer material layer, which can meet the lightweight design requirements of the heat exchange device, thereby facilitating the carrying and use of the electronic device having the heat exchange device. The first cover plate 1 can also comprise a polymer material layer and a metal layer, which can combine the characteristics of the two to improve the comprehensive performance of the heat exchange device.

[0057] Similarly, the second cover plate 3 can comprise a polymer material layer and / or a metal layer according to actual design requirements. For example, the second cover plate 3 can comprise a metal layer, which can improve the overall strength and heat conduction performance of the heat exchange device, thereby ensuring the stability of the electronic device having the heat exchange device in a complex working environment and reducing the working temperature of the electronic device. The second cover plate 3 can also comprise a polymer material layer, which can meet the lightweight design requirements of the heat exchange device, thereby facilitating the carrying and use of the electronic device having the heat exchange device. The second cover plate 3 can also comprise a polymer material layer and a metal layer, which can combine the characteristics of the two to improve the comprehensive performance of the heat exchange device.

[0058] Optionally, the liquid cooling layer 22 comprises at least one of a polymer material layer and a metal layer.

[0059] In this embodiment, the liquid cooling layer 22 can comprise a polymer material layer and / or a metal layer according to actual design requirements. For example, the liquid cooling layer 22 can comprise a metal layer, which can improve the strength and heat conduction performance of the liquid cooling layer 22, thereby improving the heat exchange efficiency of the heat exchange device, reducing the working temperature of the electronic device having the heat exchange device, and facilitating the reduction of the thickness of the liquid cooling layer 22. The liquid cooling layer 22 can also comprise a polymer material layer, which can meet the lightweight design requirements of the heat exchange device, thereby facilitating the carrying and use of the electronic device having the heat exchange device. The liquid cooling layer 22 can also comprise a polymer material layer and a metal layer, which can combine the characteristics of the two to improve the comprehensive performance of the heat exchange device.

[0060] For example, the liquid cooling layer 22 can be made of a high-thermal-conductivity, corrosion-resistant metal material such as copper, aluminum, or stainless steel alloy, or a high-molecular material such as PET (Polyethylene terephthalate) or PBT (Polybutylene terephthalate).

[0061] Optionally, the thickness of the adhesive layer 23 is in the range of 0.025 mm to 0.05 mm.

[0062] In this embodiment, the thickness of the adhesive layer 23 can be precisely controlled to be in the range of 0.025 mm to 0.05 mm in the dispensing or screen printing process, so as to connect the liquid cooling layer 22 and the two side cover plates by the adhesive layer 23 while reducing the thickness of the adhesive layer 23, thereby reducing the overall thickness of the heat exchange device and meeting the light and thin requirements of the electronic device using the heat exchange device.

[0063] When the overall thickness of the heat exchange device needs to be thin, the thickness of the adhesive layer 23 can be set to 0.025 mm; when the connection strength of the heat exchange device needs to be high, the thickness of the adhesive layer 23 can be set to 0.05 mm.

[0064] Optionally, the first cover plate 1, the first adhesive layer, the liquid cooling layer 22, the second adhesive layer, and the second cover plate 3 are sequentially stacked along the thickness direction of the heat exchange device, the first cover plate 1 is sealed and connected to the first side of the liquid cooling layer 22 through the first adhesive layer, and the second cover plate 3 is sealed and connected to the second side of the liquid cooling layer 22 through the second adhesive layer.

[0065] In this way, a five-layer stacked structure of the heat exchange device can be formed. According to actual design requirements, the thickness of each layer can be adjusted to reduce the overall thickness of the heat exchange device and meet the light and thin requirements of the electronic device using the heat exchange device.

[0066] The overall thickness of the heat exchange device is in the range of 0.2 mm to 0.4 mm, the thickness of the first cover plate 1 is in the range of 0.03 mm to 0.05 mm, the thickness of the second cover plate 3 is in the range of 0.03 mm to 0.05 mm, the thickness of the first adhesive layer is in the range of 0.025 mm to 0.05 mm, the thickness of the second adhesive layer is in the range of 0.025 mm to 0.05 mm, and the thickness of the liquid cooling layer 22 is in the range of 0.09 mm to 0.2 mm.

[0067] Optionally, the thickness ratio of the first cover plate 1 to the first adhesive layer is in the range of 0.6 to 2, and / or the thickness ratio of the second cover plate 3 to the second adhesive layer is in the range of 0.6 to 2.

[0068] In the embodiment, according to the connection strength requirement and size requirement of the heat exchange component, the ratio of the thickness of the first cover plate 1 to the first adhesive layer and the ratio of the thickness of the second cover plate 3 to the second adhesive layer can be adjusted, and the overflow problem caused by the over-thickness of the adhesive layer 23 can be avoided, thereby improving the reliability of the heat exchange component.

[0069] Optionally, along the thickness direction of the heat exchange component, the edge of the adhesive layer 23 is flush with the edge of the liquid cooling layer 22. As shown in FIG. 1, the edge of the adhesive layer 23 is aligned with the edge of the liquid cooling layer 22, which can reduce the flow resistance of the working medium in the flow channel, thereby ensuring the heat exchange effect of the heat exchange component.

[0070] Optionally, the side of the adhesive layer 23 close to the flow channel groove 21 has a guide portion for guiding the flow of the working medium in the flow channel.

[0071] In the embodiment, the guide portion, such as one or more fillets, can be provided on the side of the adhesive layer 23 close to the flow channel groove 21. The flow resistance of the working medium in the flow channel can be reduced in a smooth transition manner, which helps to reduce energy loss and also reduces the pressure drop in the flow channel, further improving the flowability of the working medium, thereby ensuring the heat exchange effect of the heat exchange component.

[0072] Optionally, the first cover plate 1 is a single-layer structure or a multi-layer structure.

[0073] And / or, the second cover plate 3 is a single-layer structure or a multi-layer structure.

[0074] In the embodiment, the first cover plate 1 can include a single-layer or multi-layer sealing layer, and the first cover plate 1 is adhesively sealed to the first side of the liquid cooling layer 22 through the adhesive layer 23. The first cover plate 1 also includes a sealing layer and a barrier layer, and the barrier layer is arranged close to the flow channel groove 21. The first cover plate 1 is adhesively sealed to the first side of the liquid cooling layer 22 through the adhesive layer 23, and the barrier layer can also block water, dust and other foreign matters.

[0075] Similarly, the second cover plate 3 can include a single-layer or multi-layer sealing layer, and the second cover plate 3 is adhesively sealed to the second side of the liquid cooling layer 22 through the adhesive layer 23. The second cover plate 3 also includes a sealing layer and a barrier layer, and the barrier layer is arranged close to the flow channel groove 21. The second cover plate 3 is adhesively sealed to the second side of the liquid cooling layer 22 through the adhesive layer 23, and the barrier layer can also block water, dust and other foreign matters.

[0076] The embodiment of the present application also provides a heat exchange module including a micro-pump and the aforementioned heat exchange component. Corresponding connectors or interfaces can be provided at the inlet and outlet of the flow channel to facilitate connection with the micro-pump and form a complete heat exchange cycle.

[0077] Optionally, the heat exchange element has a first working medium inlet and a first working medium outlet, the micro pump has a second working medium inlet and a second working medium outlet, the first working medium inlet and the first working medium outlet are respectively communicated with the flow channel, and the first working medium inlet is communicated with the second working medium outlet, and the first working medium outlet is communicated with the second working medium inlet. In this way, the working medium can enter the flow channel through the second working medium outlet and the first working medium inlet, and return to the micro pump through the first working medium outlet and the second working medium inlet, so as to realize the circulation of the working medium.

[0078] The embodiment of the present application also provides an electronic device comprising the heat exchange element or the heat exchange module. The electronic device can be a small electronic device, such as a tablet computer, a notebook computer, smart glasses, a smart watch, smart headwear, etc.

[0079] In the above embodiments, the differences between the embodiments are mainly described, and the optimization features different between the embodiments can be combined to form a better embodiment without contradiction. In view of the brevity of the text, the details are not described herein.

[0080] Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A heat exchanging member, characterized by, The application relates to a heat exchange element comprising: a first cover plate (1), a second cover plate (3) and an intermediate layer (2) which are stacked together, a flow channel groove (21) is formed in the intermediate layer (2), the flow channel groove (21) penetrates through the thickness direction of the intermediate layer (2), the intermediate layer (2) comprises a liquid cooling layer (22) and adhesive layers (23) arranged on both sides of the liquid cooling layer (22), the liquid cooling layer (22) and the adhesive layers (23) on both sides jointly form the side wall of the flow channel groove (21), the first cover plate (1) and the second cover plate (3) are sealedly connected with the liquid cooling layer (22) through the adhesive layers (23), so that the first cover plate (1), the second cover plate (3) and the intermediate layer (2) enclose a flow channel at the flow channel groove (21). The adhesive layer (23) comprises at least one adhesive, the first side of the liquid cooling layer (22) is adhesively connected with the first cover plate (1) through the adhesive layer (23), and the second side of the liquid cooling layer (22) is adhesively connected with the second cover plate (3) through the adhesive layer (23).

2. The heat exchange member according to claim 1, characterized by The adhesive forms the adhesive layer (23) through dispensing or screen printing.

3. The heat exchange member according to claim 2, characterized by The adhesive comprises polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot melt composite glue film, hot melt glue or thermosetting glue.

4. The heat exchange member according to claim 2, wherein The first cover plate (1) comprises at least one of a polymer material layer and a metal layer, and / or the second cover plate (3) comprises at least one of a polymer material layer and a metal layer.

5. The heat exchange member according to claim 1, wherein The liquid cooling layer (22) comprises at least one of a polymer material layer and a metal layer.

6. The heat exchange member according to claim 1, wherein The thickness of the adhesive layer (23) ranges from 0.025 mm to 0.05 mm.

7. The heat exchange member of claim 1, wherein The first cover plate (1), a first adhesive layer, the liquid cooling layer (22), a second adhesive layer and the second cover plate (3) are sequentially stacked in the thickness direction of the heat exchange element, the first cover plate (1) is sealedly connected with the first side of the liquid cooling layer (22) through the first adhesive layer, and the second cover plate (3) is sealedly connected with the second side of the liquid cooling layer (22) through the second adhesive layer.

8. The heat exchange member of claim 1, wherein The thickness ratio of the first cover plate (1) to the first adhesive layer ranges from 0.6 to 2, and / or the thickness ratio of the second cover plate (3) to the second adhesive layer ranges from 0.6 to 2.

9. A heat exchange member according to claim 8, wherein The edge of the adhesive layer (23) is flush with the edge of the liquid cooling layer (22) in the thickness direction of the heat exchange element.

10. The heat exchange member of claim 1, wherein The side of the adhesive layer (23) close to the flow channel groove (21) has a guide part for guiding the flow of the working medium in the flow channel.

11. The heat exchange member of claim 1, wherein The first cover plate (1) is a single-layer structure or a multi-layer structure.

12. The heat exchange member of claim 1, wherein The second cover plate (3) is a single-layer structure or a multi-layer structure. The application further relates to a micro-pump and the heat exchange element.

13. A heat exchange module, characterized by ​ 14. The heat exchange module of claim 13, wherein, The heat exchange element has a first working medium inlet and a first working medium outlet, and the micro-pump has a second working medium inlet and a second working medium outlet, the first working medium inlet and the first working medium outlet are communicated with the flow channel respectively, and the first working medium inlet is communicated with the second working medium outlet, and the first working medium outlet is communicated with the second working medium inlet.

15. An electronic device, comprising: The heat exchange element or the heat exchange module.

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