On-board power supply, on-board charger, and vehicle

Abstract

An on-board power supply, an on-board charger, and a vehicle. The on-board power supply comprises an AC / DC converter. The AC / DC converter comprises a first connection port, a second connection port, a power factor correction circuit, a transformer circuit, and a flyback transistor. The first connection port is used for connecting to a load, and the second connection port is used for connecting to a battery. The power factor correction circuit is connected to the first connection port. A primary winding of the transformer circuit is connected to a DC output end of the power factor correction circuit, and a secondary winding of the transformer circuit is connected to the second connection port. Two ends of the flyback transistor are respectively connected to two ends of the secondary winding to form a loop, such that the second connection port supplies power to the first connection port.

Description

Vehicle-mounted power supply, vehicle-mounted charger and vehicle

[0001] This application claims priority to Chinese Patent Application No. 202411999294.3, filed on December 31, 2024, and Chinese Patent Application No. 202411377856.0, filed on September 29, 2024, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] The present disclosure relates to the technical field of vehicles, and in particular to a vehicle-mounted power supply, a vehicle-mounted charger and a vehicle. BACKGROUND

[0003] The rapid development of new energy vehicles has put higher requirements on power electronic technology, especially in terms of energy conversion. AC-DC converters, as the core components of energy conversion, are mainly used to convert AC power into DC power for battery charging and driving electric motors.

[0004] New energy vehicles generally require efficient and reliable energy conversion systems to maximize the range and improve energy utilization. SUMMARY

[0005] The present disclosure provides a vehicle-mounted power supply, a vehicle-mounted charger and a vehicle.

[0006] In one aspect, a vehicle-mounted power supply is provided. The vehicle-mounted power supply includes an AC-DC converter. The AC-DC converter includes a first connection port, a second connection port, a power factor correction circuit, a transformer circuit, and a freewheeling transistor. The first connection port is configured to be connected to a load, and the second connection port is configured to be connected to a battery. The power factor correction circuit is connected to the first connection port. A primary winding of the transformer circuit is connected to a DC output terminal of the power factor correction circuit, and a secondary winding of the transformer circuit is connected to the second connection port. The freewheeling transistor is connected across the secondary winding to form a loop, such that the second connection port supplies power to the first connection port.

[0007] In another aspect, a vehicle-mounted charger is provided. The vehicle-mounted charger includes a semiconductor device. The semiconductor device includes a substrate, a power circuit, a plurality of power pins, and a plurality of signal pins. The power circuit is disposed on the substrate. The plurality of power pins and the plurality of signal pins are connected to the power circuit. At least part of the plurality of signal pins disposed on the same side of the substrate are grouped to form a plurality of groups of signal pins, and the distance between adjacent two signal pins in different groups of the plurality of groups of signal pins is greater than the distance between adjacent two power pins in the plurality of power pins.

[0008] In yet another aspect, a vehicle is provided. The vehicle includes a battery and the on-board power supply described above. The on-board power supply includes the second connection port. The battery is connected to the second connection port of the on-board power supply. Alternatively, the vehicle includes the on-board charger described above. BRIEF DESCRIPTION OF DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments description will be briefly introduced as follows. However, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those of ordinary skill in the art without any creative effort based on these drawings.

[0010] FIG. 1 is a structural diagram of an on-board power supply according to some embodiments;

[0011] FIG. 2 is a structural diagram of an AC-DC converter according to some embodiments;

[0012] FIG. 3 is a structural diagram of another AC-DC converter according to some embodiments;

[0013] FIG. 4 is a working timing diagram of an AC-DC converter according to some embodiments;

[0014] FIG. 5 is another working timing diagram of an AC-DC converter according to some embodiments;

[0015] FIG. 6 is yet another working timing diagram of an AC-DC converter according to some embodiments;

[0016] FIG. 7 is a structural diagram of a multi-path AC-DC converter according to some embodiments;

[0017] FIG. 8 is a structural diagram of a controller according to some embodiments;

[0018] FIG. 9 is a block diagram of a vehicle according to some embodiments;

[0019] FIG. 10 is a structural diagram of a semiconductor device according to some embodiments;

[0020] FIG. 11 is a circuit diagram of a half-bridge circuit according to some embodiments;

[0021] FIG. 12 is a spacing size diagram of a semiconductor device according to some embodiments;

[0022] FIG. 13 is a circuit diagram of a power circuit with a detection function according to some embodiments;

[0023] FIG. 14 is a packaging structural diagram of a semiconductor device with a detection function corresponding to FIG. 13 according to some embodiments;

[0024] FIG. 15 is a pin length diagram, according to some embodiments;

[0025] FIG. 16 is a pin angle diagram, according to some embodiments;

[0026] FIG. 17 is a block diagram of an on-board charger, according to some embodiments;

[0027] FIG. 18 is another block diagram of a vehicle, according to some embodiments;

[0028] FIG. 19 is yet another block diagram of a vehicle, according to some embodiments. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. However, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present disclosure.

[0030] The terms "first", "second", etc. are used only for the purpose of description, and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0031] In the description of the present disclosure, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection", and "communication" should be understood in a broad sense, for example, can be fixed connection, can be detachable connection, or integral connection. It can be directly connected, or indirectly connected through an intermediate medium. It can be the communication inside two elements. For a person of ordinary skill in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0032] In the embodiments of the present disclosure, the terms "comprising", "containing" or any other variants thereof are intended to cover non-exclusive containing, so that the process, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, article or device. Without more limitations, the element defined by the sentence "including a" does not exclude the existence of other identical elements in the process, article or device including the element.

[0033] In the embodiments of the present disclosure, the word "exemplarily" or "for example" etc. is used to represent as an example, illustration or description. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of the present disclosure should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. In fact, the word "exemplarily" or "for example" etc. is intended to present the related concept in an exemplary manner.

[0034] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C", and includes the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0035] In the description of the specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0036] The current market generally uses converter technology, such as rectification and filtering methods, which can achieve basic power conversion, but there is still room for improvement in efficiency and power consumption. Especially in the context of increasing demand for power density, AC-DC converters in related technologies face a series of challenges.

[0037] To this end, some embodiments of the present disclosure provide a vehicle. The vehicle 2000 can be a pure electric vehicle, a hybrid electric vehicle, a plug-in hybrid electric vehicle, a range-extended electric vehicle, a fuel vehicle, etc. The vehicle can also be a car, a truck, a bus, a truck, a trailer, etc. The present disclosure does not limit the type of vehicle. As shown in FIG. 9, the vehicle 2000 includes an on-board power supply 1000 and a battery 260. The on-board power supply 1000 includes a second connection port 420, and the battery 260 is connected to the second connection port 420 of the on-board power supply 1000.

[0038] The on-board power supply 1000 includes an AC-DC converter and a controller 250. The AC-DC converter can be the AC-DC converter 100 as shown in FIG. 2, the AC-DC converter 200 as shown in FIG. 3, or the AC-DC converter 300 as shown in FIG. 7. Taking the AC-DC converter 200 shown in FIGS. 1 and 3 as an example, the AC-DC converter 200 includes a power factor correction circuit 220 and a transformer circuit 230. The controller 250 is configured to provide a control signal to change the charge-discharge state of the transformer circuit 230, so that the transformer circuit 230 forms a charge-discharge loop with the power factor correction circuit 220.

[0039] In embodiments of the present disclosure, the controlled middle electrode of a transistor is referred to as a control terminal, and the remaining two electrodes of the transistor are referred to as a first terminal and a second terminal, respectively. For the sake of uniformity of expression, in the context, the source, drain, and gate of a P-type metal-oxide-semiconductor (PMOS) transistor are referred to as a first terminal, a second terminal, and a control terminal, respectively, and the drain, source, and gate of an N-type metal-oxide-semiconductor (NMOS) transistor are referred to as a first terminal, a second terminal, and a control terminal, respectively.

[0040] In some embodiments, as shown in FIG. 2, the AC-DC converter 100 includes a rectifier circuit 120, a transformer circuit 130, and a filter circuit 140. The rectifier circuit 120 is connected to the AC source 110, and is configured to receive an AC input provided by the AC source 110 and convert the AC input into a steamed bun wave. The transformer circuit 130 is connected to the rectifier circuit 120, and is configured to receive the steamed bun wave provided by the rectifier circuit 120 and perform power factor correction. The filter circuit 140 is connected to the transformer circuit 130, and is configured to receive the steamed bun wave provided by the rectifier circuit 120 after power factor correction, filter the steamed bun wave to output a smooth DC voltage, and provide the DC voltage to the battery 150 to charge the battery 150.

[0041] It should be noted that the shape of the steamed bun wave is similar to that of a steamed bun, with a relatively flat top and gradually declining sides, and the overall shape is a relatively smooth curve. Compared with a sine wave, the steamed bun wave has a relatively flat area at the wave peak, rather than a sharp wave peak as in a sine wave.

[0042] In some embodiments, the transformer circuit 130 is further configured to achieve electrical isolation.

[0043] For example, as shown in FIG. 2, the rectifier circuit 120 includes a rectifier bridge and a first capacitor C1. The rectifier bridge includes a first diode D1, a second diode D2, a third diode D3, and a fourth diode D4. The first end of the first diode D1 is connected to the first end of the AC source 110; the first end of the second diode D2 is connected to the second end of the AC source 110, and the second end of the second diode D2 is connected to the second end of the first diode D1; the second end of the third diode D3 is connected to the first end of the first diode D1; the first end of the fourth diode D4 is connected to the first end of the third diode D3, and the second end of the fourth diode D4 is connected to the first end of the second diode D2. The first end of the first capacitor C1 is connected to the second end of the first diode D1, and the second end of the first capacitor C1 is connected to the first end of the third diode D3.

[0044] The first end of the first diode D1 and the first end of the second diode D2 are, for example, the first input end and the second input end of the rectifier bridge respectively, and the second end of the first diode D1 and the first end of the third diode D3 are the first output end and the second output end of the rectifier bridge respectively. The first input end and the second input end of the rectifier bridge are connected to the AC power source 110 to receive an AC input, and the AC input after rectification is output by the first output end and the second output end. The AC input after rectification is converted into a square wave by the first capacitor C1 and is output.

[0045] For example, the transformer circuit 130 includes a first inductor L1, a first transistor Q1, a second capacitor C2, a transformer 131, and a freewheeling diode D5. The first end of the first inductor is connected to the first end of the first capacitor C1. The first end of the second capacitor C2 is connected to the second end of the first inductor. The first end of the first winding of the transformer 131 is connected to the second end of the second capacitor C2, and the second end of the first winding is connected to the second end of the first capacitor C1. The first end of the first transistor Q1 is connected to the second end of the first inductor, the second end of the first transistor Q1 is connected to the second end of the first winding, and the control end of the first transistor Q1 is used to receive a control signal. The first end of the second winding of the transformer 131 is connected to the first end of the freewheeling diode D5.

[0046] In the transformer circuit 130, by changing the switching frequency of the first transistor Q1 in cooperation with the first inductor L1 and the second capacitor C2, the power factor correction can be realized. And through the transformer 131, electrical isolation can be realized.

[0047] For example, the filter circuit 140 includes a third capacitor C3, the first end of the third capacitor C3 is connected to the second end of the freewheeling diode D5, and the second end of the third capacitor C3 is connected to the second end of the second winding of the transformer 131.

[0048] The third capacitor C3 is used to further smooth the voltage signal to charge the battery 150. The freewheeling diode D5 in the transformer circuit 130 can prevent current from flowing back when the third capacitor C3 is discharging, thereby improving the reliability and stability of the AC-DC converter 100.

[0049] The battery 150 is connected in parallel across the third capacitor C3, i.e. the first end of the battery 150 is connected to the first end of the third capacitor C3, and the second end of the battery 150 is connected to the second end of the third capacitor C3.

[0050] It should be understood that the first diode D1 to the fourth diode D4 and the freewheeling diode D5 in the AC-DC converter 100 can be replaced by transistors. The first end of the diode is the second end of the corresponding transistor, the second end of the diode is the first end of the corresponding transistor, and the control end of the transistor is connected to the corresponding controller.

[0051] In some embodiments, as shown in FIG. 1 and FIG. 3, the AC-DC converter 200 includes a power factor correction circuit 220, a transformer circuit 230, and a filter circuit 240. The power factor correction circuit 220 is connected to the electrical component 210 through the first connection port 410. For example, the electrical component 210 can be an AC source, so that the first connection port 410 is used to receive the AC input provided by the electrical component 210. The transformer circuit 230 is connected to the power factor correction circuit 220 and is configured to transmit the electrical signal provided by the electrical component 210 to the filter circuit 240. In some embodiments, the transformer circuit 230 is also configured to electrically isolate the power factor correction circuit 220 and the filter circuit 240. The filter circuit 240 is connected to the transformer circuit 230 and is configured to filter the electrical signal provided by the transformer circuit 230 and provide the filtered electrical signal to the battery 260 through the second connection port 420. The controller 250 is connected to the power factor correction circuit 220 and the transformer circuit 230 and is configured to control the conduction state of the transistors in at least one of the power factor correction circuit 220 and the transformer circuit 230.

[0052] For example, the power factor correction circuit 220 includes a first inductor Li and a rectification circuit 221. The rectification circuit 221 includes a first bridge arm and a second bridge arm. The first bridge arm includes a first transistor Q1 and a third transistor Q3, and the second bridge arm includes a second transistor Q2 and a fourth transistor Q4. A first end of the first inductor Li is the first end 411 of the first connection port 410 and is connected to the first end of the electrical component 210. A first end of the first transistor Q1 is connected to a second end of the first inductor Li. A first end of the second transistor Q2 is connected to a second end 412 of the first connection port 410, and a second end of the second transistor Q2 is connected to a second end of the first transistor Q1. A second end of the third transistor Q3 is connected to a first end of the first transistor Q1. A first end of the fourth transistor Q4 is connected to a first end of the third transistor Q3, and a second end of the fourth transistor Q4 is connected to a second end of the second transistor Q2.

[0053] The transformer circuit 230 comprises a first capacitor C1, a transformer 231, a second capacitor C2, and a second inductor L0, and the AC-DC converter 200 further comprises a freewheeling transistor Q5. The first end of the first capacitor C1 is connected to the second end of the first transistor Q1. The transformer 231 comprises a first winding (i.e., a primary winding) and a second winding (i.e., a secondary winding), the first end of the first winding is connected to the second end of the first capacitor C1, and the second end of the first winding is connected to the first end of the third transistor Q3. The first end of the second capacitor C2 is connected to the first end of the freewheeling transistor Q5, and the second end of the second capacitor C2 is connected to the first end of the second winding. The second end of the second winding is connected to the second end of the freewheeling transistor Q5. The first end of the second inductor L0 is connected to the second end of the freewheeling transistor Q5, and the second end of the second inductor L0 is the first end 421 of the second connection port 420 and is connected to the first end of the battery 260.

[0054] In some embodiments, the AC-DC converter 200 comprises two or more freewheeling transistors. For example, the AC-DC converter 200 comprises two freewheeling transistors, which are a first sub-freewheeling transistor and a second sub-freewheeling transistor.

[0055] In some embodiments, the second end of the first sub-freewheeling transistor is connected to the first end of the second capacitor C2. The second end of the second sub-freewheeling transistor is connected to the first end of the first sub-freewheeling transistor, and the first end of the second sub-freewheeling transistor is connected to the second end of the secondary winding of the transformer 231.

[0056] In some embodiments, the first end of the first sub-freewheeling transistor is connected to the second end of the secondary winding of the transformer 231, and the second end of the first sub-freewheeling transistor is connected to the first end of the second capacitor C2. The first end of the second sub-freewheeling transistor is connected to the first end of the first sub-freewheeling transistor, and the second end of the second sub-freewheeling transistor is connected to the second end of the first sub-freewheeling transistor.

[0057] It can be understood that the first end and the second end of the first sub-freewheeling transistor can also be interchanged, and the first end and the second end of the second sub-freewheeling transistor can also be interchanged, which is not limited by the present disclosure.

[0058] For the setting of the freewheeling transistor Q5, a single freewheeling transistor Q5 can be connected to both ends of the secondary winding of the transformer 231 of the transformer circuit 230, or multiple freewheeling transistors Q5 connected in series or parallel can be connected to both ends of the secondary winding of the transformer 231.

[0059] The transformer 231 is used to achieve electrical isolation between the power factor correction circuit 220 and the filter circuit 240, to avoid the current change of one of them from adversely affecting the other, thereby improving the reliability and stability of the AC-DC converter 200.

[0060] The filter circuit 240 comprises a filter capacitor Cdc. A first end of the filter capacitor Cdc is connected to a second end of the second inductor L0, a second end of the filter capacitor Cdc is a second end 422 of the second connection port 420, and is connected to a second end of the battery 260. Moreover, the second end of the filter capacitor Cdc is connected to a first end of the freewheeling transistor Q5.

[0061] In some embodiments, the filter circuit 240 can be a resistor-capacitance (RC) filter circuit, etc.

[0062] As shown in FIG. 1, the controller 250 is configured to provide a second control signal, the second control signal comprising a first switch signal VQ1 to a fourth switch signal VQ4, the second control signal being used to change on-off states of the first transistor Q1 to the fourth transistor Q4 to control the transformer circuit 230 and the rectifier circuit 221 to form a charging loop.

[0063] In some embodiments, the controller 250 is connected to a control end of the first transistor Q1, and provides the first switch signal VQ1 to the first transistor Q1 to control an on-off state of the first transistor Q1. The controller 250 is connected to a control end of the second transistor Q2, and provides the second switch signal VQ2 to the second transistor Q2 to control an on-off state of the second transistor Q2. The controller 250 is connected to a control end of the third transistor Q3, and provides the third switch signal VQ3 to the third transistor Q3 to control an on-off state of the third transistor Q3. The controller 250 is connected to a control end of the fourth transistor Q4, and provides the fourth switch signal VQ4 to the fourth transistor Q4 to control an on-off state of the fourth transistor Q4. The controller 250 is connected to the freewheeling transistor Q5, and provides the fifth switch signal VQ5 to the freewheeling transistor Q5 to control an on-off state of the freewheeling transistor Q5.

[0064] The first connection port 410 of the AC-DC converter 200 is connected to the electrical component 210, and the second connection port 420 is connected to the battery 260, so as to supply power to the battery 260, i.e., the power is transmitted from the first connection port 410 to the second connection port 420. In the above power transmission process, the timing diagrams of various signals are shown in FIG. 4. In combination with FIGS. 3 and 4, the working state of the AC-DC converter 200 when the power is transmitted from the first connection port 410 to the second connection port 420 is described.

[0065] In FIG. 4, from top to bottom are the first switch signal VQ1, the current iLi flowing through the first inductor Li, the current ip flowing through the first capacitor C1, the current iLo flowing through the second inductor Lo, the current iSec flowing through the second capacitor C2, the current iD flowing through the freewheeling transistor Q5, the voltage VC1 of the first capacitor C1, the voltage VC2 of the second capacitor C2, and the voltage Vdc of the filter capacitor Cdc. It should be understood that when the electric energy is transmitted from the first connection port 410 to the second connection port 420 of the AC-DC converter 200, the first switch signal VQ1, the second switch signal VQ2, the third switch signal VQ3, and the fourth switch signal VQ4 are substantially consistent, and the dotted lines in each timing diagram represent zero voltage or zero current values in the corresponding timing.

[0066] In some embodiments of the present disclosure, the first state can be a high level state, and the second state can be a low level state. It should be understood that in some embodiments, the first state can be a low level state, and the second state can be a high level state.

[0067] When the electric energy is transmitted from the first connection port 410 to the second connection port 420, the working period Ts of the AC-DC converter 200 can be divided into three time periods t0, t1, and t2. Moreover, during the entire working period Ts of the AC-DC converter 200, the fifth switch signal VQ5 provided by the controller 250 is in the second state, and the freewheeling transistor Q5 is in an off state. At this time, the freewheeling transistor Q5 can be equivalent to a diode, the first end of the equivalent diode is connected to the first end of the second capacitor C2, and the second end of the equivalent diode is connected to the second end of the second winding of the transformer 231.

[0068] In the first time period t0, the two transistors of the first bridge arm and the two transistors of the second bridge arm are turned on to form a loop to charge the first inductor Li, or discharge the first capacitor C1, or charge the first inductor Li and discharge the first capacitor C1. For example, the first transistor Q1 to the fourth transistor Q4 are turned on to form a loop.

[0069] In some embodiments, the first inductor Li forms a loop with the electrical component 210. In this case, the electrical component 210 is a power supply to charge the first inductor Li; the second capacitor C2 forms a loop with the second inductor Lo, so that the second capacitor C2 charges the second inductor Lo.

[0070] In some embodiments, at the first time period t0, the first to fourth switch signals VQ1 to VQ4 provided by the controller 250 are in the first state, respectively, the first to fourth transistors Q1 to Q4 are in the on state, respectively, the electrical component 210 charges the first inductor Li, and the current flowing through the first inductor continuously increases. In this case, the current loop of the current flowing through the first inductor Li includes two loops, one of which is the electrical component 210-the first inductor Li-the third transistor Q3-the fourth transistor Q4-the electrical component 210, and the other of which is the electrical component 210-the first inductor Li-the first transistor Q1-the second transistor Q2-the electrical component 210.

[0071] At the same time, the first capacitor C1 discharges from the fully charged state, the voltage VC1 of the first capacitor C1 gradually decreases, and the current ip flowing through the first capacitor C1 gradually increases. In this case, the current loop of the current flowing through the first capacitor C1 is the first capacitor C1-the second transistor Q2-the fourth transistor Q4-the first winding of the transformer 231-the first capacitor C1.

[0072] At the same time, the second capacitor C2 discharges from the fully charged state, and the energy released by the second capacitor C2 is transmitted to the second connection port 420, for example, to the battery 260, through the second inductor L0. In this case, the body diode of the freewheeling transistor Q5 remains in the reverse bias state, the current flowing through the freewheeling transistor Q5 is 0, and the current flow direction is the second capacitor C2-the second winding of the transformer 231-the second inductor L0-the filter capacitor Cdc-the second capacitor C2. As can be seen from FIG. 4, the current iL0 flowing through the second inductor L0 and the current iSec flowing through the second capacitor C2 are the same and gradually increase, the voltage VC2 of the second capacitor C2 gradually decreases, and the voltage Vdc of the filter capacitor Cdc gradually increases.

[0073] In some embodiments, as shown in FIG. 4, the length of the first time period t0 is equal to the product of the working period Ts and the duty cycle D1.

[0074] At the second time period t1, one transistor in the first bridge arm and one transistor in the second bridge arm form a loop to charge the first capacitor C1 and the second capacitor C2 with the first inductor Li, or to charge the filter capacitor Cdc with the second inductor L0, or to charge the first capacitor C1 and the second capacitor C2 with the first inductor Li and to charge the filter capacitor Cdc with the second inductor L0. For example, the current flows through the body diode of the first transistor Q1 in the first bridge arm and the body diode of the fourth transistor Q4 in the second bridge arm to form a loop.

[0075] In some embodiments, the first inductor Li forms a loop with the first capacitor Ci to charge the first capacitor Ci and the second capacitor C2; the second inductor Lo and the filter capacitor Cdc form a loop to charge the filter capacitor Cdc.

[0076] In some embodiments, at the second time period t1, the first to fourth switch signals VQ1 to VQ4 provided by the controller 250 are in the second state respectively, the first to fourth transistors Q1 to Q4 are in the off state respectively, and the body diode of the first transistor Q1 and the body diode of the fourth transistor Q4 provide a current path for the first inductor Li. In this case, the current loop of the current flowing through the first winding of the transformer 231 is the electrical component 210 - the first inductor Li - the first transistor Q1 - the first capacitor Ci - the first winding of the transformer 231 - the fourth transistor Q4 - the electrical component 210. The current loop of the current flowing through the second winding of the transformer 231 is the second winding of the transformer 231 - the second capacitor C2 - the freewheeling transistor Q5 - the second winding of the transformer 231. The current loop of the current flowing through the second inductor Lo is the second inductor Lo - the filter capacitor Cdc - the freewheeling transistor Q5 - the second inductor Lo. At this time, it is the discharge time of the first inductor Li.

[0077] For example, the body diode of the freewheeling diode D5 is forward biased to provide a current path for the first inductor Li, so that the first inductor Li can release energy to the first capacitor Ci and the second capacitor C2. As can be seen from FIG. 4, at the junction of the first time period t0 and the second time period t1, the current flowing through the freewheeling transistor Q5 suddenly increases. At the second time period t1, the current flowing through the freewheeling transistor Q5 gradually decreases, the current iLi flowing through the first inductor Li gradually decreases, and the voltage VC2 of the first capacitor Ci and the second capacitor C2 gradually increases.

[0078] At the second time period t1, the second inductor Lo releases energy to charge the battery 260, and the second inductor Lo also charges the filter capacitor Cdc. As can be seen from FIG. 4, the current iL0 flowing through the second inductor Lo gradually decreases, and the voltage Vdc of the filter capacitor Cdc gradually increases. And at the junction of the first time period t0 and the second time period t1, the current ip flowing through the first capacitor Ci suddenly reverses, and the current iSec flowing through the second capacitor C2 also suddenly reverses. At the second time period t1, the current ip flowing through the first capacitor Ci gradually decreases, and the current iSec flowing through the second capacitor C2 gradually decreases.

[0079] In some embodiments, the energy stored in the first inductor Li and the second inductor Lo is gradually released, and the current of the second inductor Lo is zero-crossed in the discontinuous mode, and changes from a positive value to a negative value before the end of the second time period tl. When the current flows through the body diode of the freewheeling diode D5, and the current ip flowing through the first capacitor Cl is negative, the body diode returns to the reverse bias state, and the AC-DC converter 200 starts to enter the discontinuous mode.

[0080] In the third time period t2, one transistor in the first bridge arm and one transistor in the second bridge arm form a loop to charge the filter capacitor Cdc for the battery 260. For example, the current flows through the body diode of the first transistor Q1 in the first bridge arm and the body diode of the fourth transistor Q4 in the second bridge arm to form a loop.

[0081] In some embodiments, the filter capacitor Cdc and the battery 260 form a loop to charge the filter capacitor Cdc for the battery 260.

[0082] In some embodiments, in the third time period t2, the first to fourth switch signals VQ1 to VQ4 provided by the controller 250 are in the second state respectively, the first to fourth transistors Q1 to Q4 are in the off state respectively, the body diode of the freewheeling diode D5 is in the reverse bias state, and the current flowing through the body diode of the freewheeling diode D5 is 0. At this time, the current iLi flowing through the first inductor Li and the current iLo flowing through the second inductor Lo are equal in size and opposite in direction. In the third time period t2, the filter capacitor Cdc releases energy to supply power for the battery 260. As can be seen in FIG. 4, the voltage VC1 of the first capacitor Cl and the voltage VC2 of the second capacitor C2 continue to rise, and the voltage Vdc of the filter capacitor Cdc gradually decreases. At this time, it is the discontinuous time of the first inductor Li.

[0083] For example, in the third time period t2, the current iLi flowing through the first inductor Li and the current iLo flowing through the second inductor Lo are constant in size, and the current ip flowing through the first capacitor Cl and the current iSec flowing through the second capacitor C2 are constant in size. In some embodiments, the current iLo flowing through the second inductor Lo has a slight change, which is caused by, for example, component errors in actual applications.

[0084] In the AC-DC converter 200, by controlling the conduction state of the first to fourth transistors Q1 to Q4 in the power factor correction circuit 220 by the controller 250, the charging or discharging of the first inductor Li is realized to reduce the energy loss of the power factor correction circuit 220, improve the energy conversion efficiency of the power factor correction circuit 220, and thus improve the power factor.

[0085] In some embodiments, by changing the duty cycle D1, the charging and discharging time of the first inductor Li can be changed, and thus the charging and discharging time of at least one of the first capacitor C1 and the second capacitor C2 is changed, i.e., at least one of the voltage VC1 of the first capacitor C1 and the voltage VC2 of the second capacitor C2 is changed, so as to adjust the output voltage at the second connection port 420.

[0086] In some embodiments, the greater the duty cycle D1, the higher the output voltage at the second connection port 420.

[0087] In some embodiments, the AC-DC converter 200 can also transmit electrical energy from the second connection port 420 to the first connection port 410, in which case the electrical component 210 can be a load, the first connection port 410 is connected to the load, and the second connection port 420 is connected to the battery 260. When electrical energy is transmitted from the second connection port 420 of the AC-DC converter 200 to the first connection port 410, the second inductor L0, the filter capacitor Cdc, and the freewheeling transistor Q5 form a boost circuit, and the controller 250 controls the conduction state of the freewheeling transistor Q5. The second capacitor C2, the transformer 231, and the first capacitor C1 are used to transmit electrical energy and electrically isolate the second connection port 420 and the first connection port 410. The rectifier bridge composed of the first transistor Q1 to the fourth transistor Q4 and the first inductor Li perform power factor correction.

[0088] For example, in FIG. 5, from top to bottom are the first switch signal VQ1, the second switch signal VQ2 and the third switch signal VQ3, the fourth switch signal VQ4 and the fifth switch signal VQ5, the current iLi flowing through the first inductor Li, the current ip flowing through the first capacitor C1, the current iSec flowing through the second capacitor C2, the voltage VC1 of the first capacitor C1, the voltage VC2 of the second capacitor C2, and the current iL0 flowing through the second inductor L0. In FIG. 6, from top to bottom are the first switch signal VQ1 and the fourth switch signal VQ4, the second switch signal VQ2, the third switch signal VQ3 and the fifth switch signal VQ5, the current iLi flowing through the first inductor Li, the current ip flowing through the first capacitor C1, the current iSec flowing through the second capacitor C2, the voltage VC1 of the first capacitor C1, the voltage VC2 of the second capacitor C2, and the current iL0 flowing through the second inductor L0.

[0089] The working state of the AC-DC converter 200 when transmitting electrical energy from the second connection port 420 to the first connection port 410 is described in combination with FIG. 3, FIG. 5, and FIG. 6.

[0090] When the electric energy is transmitted from the second connection port 420 to the first connection port 410 of the AC-DC converter 200, the working state of the AC-DC converter 200 is slightly different according to the positive and negative of the AC power. The working cycle of the AC-DC converter 200 when the AC power is negative is regarded as a first sub-cycle, and the working cycle of the AC-DC converter 200 when the AC power is positive is regarded as a second sub-cycle.

[0091] The controller 250 provides a first control signal to the rectifier circuit 221 and the transformer circuit 230, and the first control signal includes a first switch signal VQ1 to a fifth switch signal VQ5. The first control signal is used to control the transformer circuit 230 and the rectifier circuit 221 to form a discharge loop.

[0092] The working state of the AC-DC converter 200 in the first sub-cycle is described below in combination with FIG. 3 and FIG. 5.

[0093] In the first time period t0, one transistor in the first bridge arm and one transistor in the second bridge arm are turned on to form a loop, so that the first capacitor C1 charges the first inductor Li. For example, the first transistor Q1 in the first bridge arm and the fourth transistor Q4 in the second bridge arm are turned on to form a loop.

[0094] In some embodiments, the second inductor L0 forms a loop with the battery 260 to charge the second inductor L0 with the battery 260; the first capacitor C1 forms a loop with the first inductor Li to charge the first inductor Li with the first capacitor C1.

[0095] In some embodiments, in the first time period t0, the first switch signal VQ1, the fourth switch signal VQ4 and the fifth switch signal VQ5 provided by the controller 250 are in a first state, the second switch signal VQ2 and the third switch signal VQ3 are in a second state, the first transistor Q1, the fourth transistor Q4 and the freewheeling transistor Q5 are in a conductive state, the second transistor Q2 and the third transistor Q3 are in an off state, the first inductor Li is discharged, the current iLi flowing through the first inductor Li gradually decreases, the second inductor L0 is charged, the current iL0 flowing through the second inductor L0 gradually increases. The first capacitor C1 releases energy from a fully charged state, which is transmitted to the electrical assembly 210 through the first inductor Li, and the voltage VC1 of the first capacitor C1 gradually decreases.

[0096] For example, as can be seen in FIG. 5, the current ip flowing through the first capacitor C1 and the current iSec flowing through the second capacitor C2 gradually increase, and the voltage VC2 of the second capacitor C2 gradually decreases.

[0097] In the second period t1, one transistor in the first bridge arm and another transistor in the second bridge arm are turned on to form a loop, so that the first inductor Li charges the electrical component 210. For example, the first transistor Q1 in the first bridge arm and the second transistor Q2 in the second bridge arm are turned on to form a loop.

[0098] In some embodiments, the second inductor L0 and the second capacitor C2 form a loop to charge the second capacitor C2 with the second inductor L0; the first capacitor C1 and the first inductor Li form a loop to charge the first inductor Li with the first capacitor C1.

[0099] In some embodiments, in the second period t1, the first switch signal VQ1 provided by the controller 250 is in the first state, the second switch signal VQ2, the third switch signal VQ3, the fourth switch signal VQ4 and the fifth switch signal VQ5 are in the second state, the first transistor Q1 is in the on state, and the second transistor Q2, the third transistor Q3, the fourth transistor Q4 and the freewheeling transistor Q5 are in the off state. In this case, the second inductor L0 discharges to provide energy to the first capacitor C1 and the second capacitor C2, the current iL0 flowing through the second inductor L0 gradually decreases, and the voltage VC1 of the first capacitor C1 and the voltage VC2 of the second capacitor C2 gradually increase. At the junction of the first period t0 and the second period t1, the first inductor Li releases energy to power the electrical component 210, the current ip flowing through the first capacitor C1 and the current iSec flowing through the second capacitor C2 suddenly reverse, gradually decrease in the second period t1, and the current iLi flowing through the first inductor Li gradually increases.

[0100] In the third period t2, the states of the switch signals provided by the controller 250 are the same as those in the second period t1, and the on states of the first transistor Q1 to the fourth transistor Q4 and the freewheeling transistor Q5 are also the same as those in the second period t1. In the third period t2, the first inductor Li continues to release energy to power the electrical component 210, the current iL0 flowing through the second inductor L0 remains unchanged, and the current ip flowing through the first capacitor C1 and the current iSec flowing through the second capacitor C2 also remain unchanged.

[0101] As can be seen in FIG. 5, the current iLi flowing through the first inductor Li gradually increases, and the voltage VC1 of the first capacitor C1 and the voltage VC2 of the second capacitor C2 also gradually increase.

[0102] The working state of the AC-DC converter 200 in the second sub-period is described below in combination with FIG. 3 and FIG. 6.

[0103] At the first time period t0, one transistor in the first bridge arm and one transistor in the second bridge arm are turned on to form a loop, so that the first capacitor C1 charges the first inductor Li. For example, the third transistor Q3 in the first bridge arm and the second transistor Q2 in the second bridge arm are turned on to form a loop.

[0104] In some embodiments, the second inductor L0 forms a loop with the battery 260 to charge the second inductor L0 with the battery 260; the first capacitor C1 forms a loop with the first inductor Li to charge the first inductor Li with the first capacitor C1.

[0105] In some embodiments, at the first time period t0, the second switch signal VQ2, the third switch signal VQ3 and the fifth switch signal VQ5 provided by the controller 250 are in the first state, the first switch signal VQ1 and the fourth switch signal VQ4 are in the second state, the second transistor Q2, the third transistor Q3 and the freewheeling transistor Q5 are in the on state, and the first transistor Q1 and the fourth transistor Q4 are in the off state.

[0106] For example, as can be seen in FIG. 6, the current iLi flowing through the first inductor Li and the current iL0 flowing through the second inductor L0 gradually rise, the current ip flowing through the first capacitor C1 and the current iSec flowing through the second capacitor C2 gradually rise, and the voltage VC1 of the first capacitor C1 and the voltage VC2 of the second capacitor C2 gradually decrease.

[0107] At the second time period t1, one transistor in the first bridge arm and another transistor in the second bridge arm are turned on to form a loop, so that the first inductor Li charges the electrical component 210. For example, the third transistor Q3 in the first bridge arm and the fourth transistor Q4 in the second bridge arm are turned on to form a loop.

[0108] In some embodiments, the second inductor L0 and the second capacitor C2 form a loop to charge the second capacitor C2 with the second inductor L0; the first capacitor C1 and the first inductor Li form a loop to charge the first inductor Li with the first capacitor C1.

[0109] In some embodiments, at the second time period t1, the second switch signal VQ2 provided by the controller 250 is in the first state, the first switch signal VQ1, the third switch signal VQ3, the fourth switch signal VQ4 and the fifth switch signal VQ5 are in the second state, the second transistor Q2 is in the on state, and the first transistor Q1, the third transistor Q3, the fourth transistor Q4 and the freewheeling transistor Q5 are in the off state.

[0110] As can be seen from FIG. 6, the current iLi flowing through the first inductor Li and the current iLo flowing through the second inductor Lo gradually decrease. At the junction of the first time period to and the second time period ti, the current ip flowing through the first capacitor Ci and the current iSec flowing through the second capacitor C2 suddenly reverse and gradually decrease in the second time period ti. The voltage VC1 of the first capacitor Ci and the voltage VC2 of the second capacitor C2 gradually increase.

[0111] In the third time period t2, the states of the respective switching signals provided by the controller 250 are the same as those in the second time period ti, and the conducting states of the first transistor Q1 to the fourth transistor Q4 and the freewheeling transistor Q5 are also the same as those in the second time period ti.

[0112] As can be seen from FIG. 6, the current iLi flowing through the first inductor Li gradually decreases, and the current iLo flowing through the second inductor Lo, the current ip flowing through the first capacitor Ci and the current iSec flowing through the second capacitor C2 remain unchanged. The voltage VC1 of the first capacitor Ci and the voltage VC2 of the second capacitor C2 gradually increase.

[0113] Therefore, the AC-DC converter 200 includes at least two operating modes. In a first operating mode, the first connection port 410 is connected to an AC source, and the second connection port 420 is connected to the battery 260. The AC source supplies power to the battery 260 through the first inductor Li, the rectifier circuit 221, the transformer circuit 230 and the filter circuit 240. In a second operating mode, the first connection port 410 is connected to a load, and the second connection port 420 is connected to the battery 260. The battery 260 supplies power to the load through the filter circuit 240, the transformer circuit 230 and the power factor correction circuit 220.

[0114] In some embodiments, when power is transmitted from the second connection port 420 to the first connection port 410, the controller 250 can provide an AC output at the first connection port 410 by controlling the conducting states of the first transistor Q1 to the fourth transistor Q4.

[0115] In some embodiments, the second inductor Lo, the filter capacitor Cdc in the filter circuit 240 and the freewheeling transistor Q5 in the transformer circuit 230 collectively form a boost circuit, so that after the voltage of the battery 260 is adjusted to a target voltage, the voltage is provided to the power factor correction circuit 220. For example, by adjusting the duty cycle of the freewheeling transistor Q5, the target voltage can be adjusted.

[0116] In some embodiments, the controller 250 controls the third transistor Q3 and the freewheeling transistor Q5 to keep the same on state, or controls the fourth transistor Q4 and the freewheeling transistor Q5 to keep the same on state, so that when the freewheeling transistor Q5 is turned off, the current loop of the first inductor Li is cut off, the energy stored in the first inductor Li is prevented from being discharged, and the energy conversion efficiency and power factor of the AC-DC converter 200 are improved.

[0117] Some embodiments of the present disclosure also provide a multi-path AC-DC converter. The multi-path AC-DC converter can be composed of a plurality of the above-mentioned AC-DC converters.

[0118] As shown in FIG. 7, the multi-path AC-DC converter 300 includes three first connection ports 410, three conversion units, and one second connection port 420. The three conversion units 200 are conversion unit 201, conversion unit 202, and conversion unit 203, each of which includes a power factor correction circuit 220, a transformer circuit 230, and a filter circuit 240, and a first AC source 211, a second AC source 212, and a third AC source 213 corresponding to the conversion unit 201, the conversion unit 202, and the conversion unit 203, respectively. In some examples, the multi-path AC-DC converter 300 further includes a first switch S1, a second switch S2, and a third switch S3, which are, for example, single-pole double-throw switches, respectively.

[0119] The first end 411 of the first connection port 410 of the conversion unit 201 is connected to the first end of the first AC source 211, the second end 412 of the first connection port 410 of the conversion unit 201 is connected to the moving end of the first switch S1, the first stationary end of the first switch S1 is connected to the second end of the first AC source 211, and the second stationary end of the first switch S1 is connected to the first end of the second AC source 212. The first end 411 of the first connection port 410 of the conversion unit 202 is connected to the first end of the second AC source 212, the second end 412 of the first connection port 410 of the conversion unit 202 is connected to the moving end of the second switch S2, the first stationary end of the second switch S2 is connected to the second end of the second AC source 212, and the second stationary end of the second switch S2 is connected to the first end of the third AC source 213. The first end 411 of the first connection port 410 of the conversion unit 203 is connected to the first end of the third AC source 213, the second end 412 of the first connection port 410 of the conversion unit 203 is connected to the moving end of the third switch S3, the first stationary end of the third switch S3 is connected to the second end of the third AC source 213, and the second stationary end of the third switch S3 is connected to the first end of the first AC source 211. Furthermore, the second connection ports 420 of the conversion unit 201, the conversion unit 202, and the conversion unit 203 are connected in parallel.

[0120] In some embodiments, the moving terminals of the first switch S1, the second switch S2 and the third switch S3 are coupled to their corresponding second stationary terminals. If the line voltage input to each phase circuit is greater than the preset voltage, the moving terminals of the first switch S1, the second switch S2 and the third switch S3 are coupled to their corresponding first stationary terminals. If the line voltage input to each phase circuit is not greater than (less than or equal to) the preset voltage, the moving terminals of the first switch S1, the second switch S2 and the third switch S3 are coupled to their corresponding second stationary terminals.

[0121] As shown in FIG. 8 in combination with FIG. 7, the working state of the controller 500 is described, which is connected with the conversion unit 201, the conversion unit 202 and the conversion unit 203.

[0122] For example, the controller 500 includes an output voltage loop 501, an output current loop 502 and a pulse width modulation (PWM) modulator 503. The output voltage loop 501 receives a reference voltage Voref and an output voltage Vo provided by the multi-phase AC-DC converter 300, and generates a reference current Iref according to the two. The output current loop 502 receives the reference current Iref and an output current Io provided by the multi-phase AC-DC converter 300, and generates an initial switch signal according to the two. The PWM modulator 503 generates a first switch control signal S1c for controlling the first switch S1, a second switch control signal S2c for controlling the second switch S2 and a third switch control signal S3c for controlling the third switch S3 according to the initial switch signal.

[0123] The controller 500 generates a plurality of switch control signals according to the output voltage Vo and the output current Io of the multi-phase AC-DC converter 300, so as to change the states of a plurality of switches in the multi-phase AC-DC converter 300, thereby making the phases of the conversion unit 201, the conversion unit 202 and the conversion unit 203 different. For example, the phase of the conversion unit 202 is right-shifted by 120° with respect to the phase of the conversion unit 201, and the phase of the conversion unit 203 is right-shifted by 120° with respect to the phase of the conversion unit 202.

[0124] In some embodiments, the controller 500 is integrated in the same circuit as the controller 250.

[0125] The control circuit of a new energy vehicle includes a large number of rectifiers, inverters, boost circuits and buck circuits and the like, which are all based on power converters, and the power converters usually include power semiconductor devices including various types of controllable and uncontrollable tubes. The uncontrollable tubes include diodes, and the controllable tubes at least include any one of the following: thyristors, metal-oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), silicon carbide tubes and gallium nitride tubes and the like.

[0126] Different types of power semiconductor devices can adapt to different circuit and process requirements. However, the current packaging of power semiconductor devices is usually suitable for specific occasions and has a single packaging type, so that the application of power semiconductor devices is not flexible enough.

[0127] Therefore, some embodiments of the present disclosure also provide a semiconductor device. By separating the power traces and the signal traces in the semiconductor device, the cross-wiring of the power traces and the signal traces and the mutual interference are avoided. The semiconductor device provided by some embodiments of the present disclosure is described below in combination with the drawings.

[0128] Referring to FIG. 10, the semiconductor device 100 provided by some embodiments of the present disclosure includes a substrate, a power circuit, power pins 102 and signal pins 101.

[0129] The power circuit is arranged on the substrate, and the power pins 102 and the signal pins 101 are connected to the power circuit. The signal pins 101 arranged on the same side of the substrate are arranged in groups, and the spacing between different groups of signal pins 101 is greater than the spacing between the power pins 102.

[0130] In some examples, referring to FIG. 10, the signal pins 101 arranged on the same side include a first group Z1 and a second group Z2, the minimum distance between the adjacent two signal pins 101 of the first group Z1 and the second group Z2 is X1, the spacing between the adjacent two power pins 102 is X2, and X1 is greater than X2.

[0131] The semiconductor device 100 provided by some embodiments of the present disclosure can separate the power traces and the signal traces by reasonably arranging the spacing between the adjacent two signal pins 101 and the spacing between the adjacent two power pins 102, avoid the cross-wiring of the power traces and the signal traces, and mutual interference; and avoid the problem that the signal pin side is difficult to wire due to too many pins.

[0132] The grouping of the signal pins 101 is described by taking the first group Z1 including two signal pins 101 and the second group Z2 including three signal pins 101 in the semiconductor device 100 of FIG. 10 as examples, which does not constitute a limitation on the signal pins 101, and in other embodiments, the number of the groups of the signal pins 101 can be three groups, four groups, etc. In addition, the number of the signal pins 101 in each group of the signal pins 101 is only used to exemplify the grouping of the signal pins 101 described in some embodiments of the present disclosure, and does not constitute a limitation on the number of the signal pins 101, and the number of the signal pins 101 in different groups can be set to be the same or different, and the number of the signal pins 101 in each group is set based on requirements.

[0133] In some embodiments, the spacing between the signal pins 101 in the same group can be the same or different, and the minimum spacing between the signal pins 101 in different groups can be the same or different, as long as the minimum spacing between the signal pins 101 in different groups is greater than the spacing between the two adjacent power pins 102.

[0134] In some embodiments, as shown in FIG. 10, the semiconductor device 100 further includes a package 103 encapsulating the substrate and the power circuit. The package 103 is encapsulated around the Direct Bonding Copper (DBC) substrate. In some embodiments, the package 103 can be a plastic material, i.e., a plastic package.

[0135] In some embodiments, the spacing between the signal pins 101 in the same group is less than the spacing between the two adjacent power pins 102. The signal pins 101 in the same group are arranged close to each other to reduce the area of the semiconductor device 100.

[0136] In some embodiments, the power pins 102 are arranged on a first side edge of the substrate, and at least part of the signal pins 101 are arranged on a second side edge of the substrate, and the first side edge and the second side edge are different side edges of the substrate. By distributing the power pins 102 and the signal pins 101 on different side edges of the semiconductor device 100, the power traces and the signal traces in the semiconductor device 100 can be separated in actual applications to avoid the cross-wiring of the power traces and the signal traces and mutual interference, and the problem of difficult wiring on the side of the signal pins due to too many pins can also be avoided. In some examples, the first side edge and the second side edge can also be adjacent edges of the substrate; in some examples, the first side edge and the second side edge can also be opposite edges of the substrate. By distributing the power pins 102 and the signal pins 101 on opposite edges of the semiconductor device 100, the power traces and the signal traces can be separated to the greatest extent.

[0137] In some embodiments, the signal pins 101 arranged on the second side edge are arranged in groups, and the spacing between different groups of signal pins 101 is greater than the spacing between adjacent two power pins 102. In some examples, referring to FIG. 10, the signal pins 101 arranged on the same side edge include a first group Z1 and a second group Z2, the minimum distance between adjacent two signal pins 101 in the first group Z1 and the second group Z2 is X1, the spacing between adjacent two power pins 102 is X2, and X1 is greater than X2.

[0138] In some embodiments, the power circuit includes at least two power elements, and the signal pins 101 corresponding to different power elements are arranged in different groups. By arranging the signal pins of different power elements in different groups, the signal lines of different power elements can be separated, avoiding the cross connection of the signal lines corresponding to different power elements and mutual interference; and the problem of difficulty in wiring due to too many pins on the side of the signal pins can also be avoided. In addition, in some embodiments, the signal pins 101 corresponding to the same power element can be arranged in the same group.

[0139] In some embodiments, the two power elements are respectively close to two opposite sides of the substrate, and the two groups of signal pins 101 are also respectively close to the two sides of the substrate. In this way, the distance between the signal pins and the power devices can be increased, thereby reducing the parasitic parameters caused by the lead distance, and thus the influence on the control signal can be reduced.

[0140] The semiconductor device provided by some embodiments of the present disclosure can be regarded as a power semiconductor device. In order for those skilled in the art to better understand the technical solutions provided by some embodiments of the present disclosure, the semiconductor device corresponding to a half-bridge circuit is taken as an example for introduction below.

[0141] It should be noted that the application scenarios of the semiconductor device are not limited by some embodiments of the present disclosure. In some examples, the semiconductor device can be applied to a power supply system, for example, a photovoltaic power generation system, a wind power system, or an energy storage system. In some examples, the semiconductor device can be applied to a charging pile of an electric vehicle or a charging machine or a motor driver of an electric vehicle, for example, a charging circuit inside the charging pile; in some examples, the semiconductor device can be applied to a power supply for artificial intelligence (AI).

[0142] Referring to FIG. 11, some embodiments of the present disclosure take a half-bridge circuit including two power elements as an example for introduction, that is, the two power elements are packaged together as a semiconductor device.

[0143] It should be noted that some embodiments of the present disclosure do not limit the number of power elements included in the semiconductor device, for example, the semiconductor device can include one power element, or two power elements, or a larger number of power elements. The number of power elements in the semiconductor device can be set according to the actual application scenario. For example, the semiconductor device can include at least two power elements corresponding to one half-bridge circuit, or can include four power elements corresponding to one full-bridge circuit.

[0144] In addition, some embodiments of the present disclosure take the power element as a power tube for example, but this does not constitute a limitation on the power element; in other embodiments, the power element can be other power elements outside the power tube.

[0145] In some embodiments, referring to FIG. 11, two power tubes (such as a first power tube and a second power tube) are respectively a first MOS tube M1 and a second MOS tube M2.

[0146] The drain of the first MOS tube M1 is connected to the power pin P1, the source of the first MOS tube M1 is connected to the drain of the second MOS tube M2 and the power pin P2, and the source of the second MOS tube M2 is connected to the power pin P3. The gate of the first MOS tube M1 is connected to the signal pin G1, the source of the first MOS tube M1 is connected to the signal pin S1, the gate of the second MOS tube M2 is connected to the signal pin G2, and the source of the second MOS tube M2 is connected to the signal pin S2.

[0147] The gate and source of the first MOS tube M1 are used to receive external driving signals, that is, the conduction state of the first MOS tube M1 depends on the level of the external driving signals received by the signal pin G1 and the signal pin S1; similarly, the conduction state of the second MOS tube M2 depends on the level of the external driving signals received by the signal pin G2 and the signal pin S2.

[0148] For the packaging of the semiconductor device corresponding to the half-bridge circuit, the corresponding pins include: power pins P1, P2 and P3, signal pins G1, S1, G2 and S2.

[0149] It should be noted that the power circuit described in some embodiments of the present disclosure corresponds to the half-bridge circuit shown in FIG. 11, which is used to realize the function of the power semiconductor device. In addition, some embodiments of the present disclosure take two power tubes as an example to describe the semiconductor device 100, which does not constitute a limitation on the semiconductor device 100. In other embodiments, the power circuit includes at least two power tubes, and each power tube includes a corresponding power pin 102 and a signal pin 101, for example, the power circuit includes four power tubes to realize the function of the full-bridge circuit.

[0150] In some embodiments, each of the first power tube and the second power tube can correspond to at least one wafer, and some embodiments of the present disclosure take an example of one power tube corresponding to one wafer. In other embodiments, each power tube can correspond to a plurality of wafers, and the plurality of wafers can be arranged in series or in parallel, which is not limited in the present disclosure.

[0151] In some embodiments, the substrate can be in the form of a direct bonding copper (DBC). It should be noted that the present disclosure does not limit the form of the substrate, and some embodiments of the present disclosure take an example of a DBC substrate for the convenience of description and for the understanding of the implementation scheme by those skilled in the art.

[0152] Since each power tube corresponds to one wafer, the wafer is a conductor, and the substrate is in the form of a direct bonding copper, the copper material is also a conductor, and therefore, in some embodiments, the wafer can be directly soldered to the DBC substrate.

[0153] In some embodiments, the wafers corresponding to the first power tube and the second power tube need to be insulated and isolated by an insulating belt to avoid short circuit between the wafers corresponding to the first power tube and the second power tube.

[0154] Based on the foregoing description, the wafer can be directly soldered to the substrate, that is, the power circuit is arranged on the substrate by soldering; accordingly, the signal pins 101 and the power pins 102 can also be directly soldered to the DBC substrate.

[0155] Since some embodiments of the present disclosure take an example of a semiconductor device corresponding to a half-bridge circuit, at least two power elements include the first power tube and the second power tube, the first power tube corresponds to the first MOS tube M1 in FIG. 11, and the second power tube corresponds to the second MOS tube M2 in FIG. 11.

[0156] Some embodiments of the present disclosure take an example of the signal pins 101 corresponding to the same power element being arranged in the same group.

[0157] In some examples, as shown in FIG. 12, the distance between the signal pins 101 corresponding to the same power element is a first distance A1 / A2, that is, the distance between the adjacent two signal pins 101 corresponding to the first MOS tube M1 is the first distance A1, and the distance between the adjacent two signal pins 101 corresponding to the second MOS tube M2 is the first distance A2; the distance between the signal pins 101 corresponding to different power elements is a second distance, that is, the distance between the adjacent two signal pins 101 in different groups is the second distance B1; the distance between the adjacent two power pins is a third distance C. The second distance B1 is greater than the third distance C, and the third distance C is greater than the first distance A1 / A2.

[0158] In some embodiments, the first distances corresponding to different power elements are the same, i.e., the first distance A1 between the two adjacent signal pins 101 corresponding to the first MOS M1 and the first distance A2 between the two adjacent signal pins 101 corresponding to the second MOS M2 are the same. In some embodiments, the first distances corresponding to different power elements are different, i.e., the first distance A1 between the two adjacent signal pins 101 corresponding to the first MOS M1 and the first distance A2 between the two adjacent signal pins 101 corresponding to the second MOS M2 are different. Whether the first distances corresponding to different power elements are the same or not can be set based on whether the power elements are the same. For example, the first distances corresponding to different types of power elements are different, and the first distances corresponding to the same type of power elements are the same.

[0159] Generally, the current flowing through the power pin 102 is greater than the current flowing through the signal pin 101, and thus the current-carrying capacity of the power pin 102 needs to be greater than that of the signal pin 101. Therefore, in some embodiments, the width of the power pin 102 can be set to be greater than that of the signal pin 101.

[0160] If there is no difference in current-carrying capacity between the signal pin 101 and the power pin 102, the width of the power pin 102 can also be set to be equal to that of the signal pin 101.

[0161] In some embodiments, the widths of all the power pins 102 can be the same size, the widths of all the signal pins 101 can be the same size, and the widths of the power pins 102 and the widths of the signal pins 101 can be different sizes.

[0162] Since the width of the pin can be related to the current-carrying capacity of the pin, the widths of different power pins 102 are different; accordingly, the widths of different signal pins 101 can also be different.

[0163] The present disclosure does not limit the width of each pin, for example, the width of the pin can be selected according to the current-carrying capacity of the pin required by the actual application scenario. In addition, the present disclosure also does not limit the spacing between the pins, and the spacing between the pins can be set according to the actual scenario.

[0164] Since the semiconductor device 100 generates heat when working, in order to protect the semiconductor device 100, it is necessary to detect the temperature of the semiconductor device 100. In some embodiments, referring to FIG. 13, the semiconductor device 100 further comprises a detection element 104, which is disposed on the substrate.

[0165] In some embodiments, the detecting element can be a temperature sensor. For example, as shown in FIG. 13, the detecting element 104 is a thermistor 1041, so that the temperature detection can be realized by using the thermistor. For example, the semiconductor device 100 further comprises a thermistor which is welded on the substrate.

[0166] In some embodiments, the thermistor can be welded on the DBC substrate.

[0167] It should be noted that if the semiconductor device 100 comprises the detecting element, the package 103 also encapsulates the detecting element.

[0168] In some embodiments, as shown in FIG. 14, the signal pin 101 comprises a control pin 111 and a detecting pin 121, the detecting pin 121 is connected to the detecting element, i.e. the detecting pin 121 is connected to the terminal of the thermistor, and the control pin 111 is used to receive the driving signal corresponding to the power circuit, i.e. the control pin 111 is the signal pin 101 mentioned in the foregoing content.

[0169] The detecting pin 121 and the power pin 102 are arranged on the same side; or, the detecting pin 121 and the control pin 111 are arranged on the same side; or, the detecting pin 121 and the power pin 102 are arranged on the same side, and the detecting pin 121 and the control pin 111 are arranged on the same side.

[0170] In some examples, the detecting pin 121 can be arranged on the same side as the power pin 102; in some examples, the detecting pin 121 can be arranged on the same side as the control pin 111; in some examples, part of the detecting pin 121 can be arranged on the same side as the power pin 102, and the other part of the detecting pin 121 can be arranged on the same side as the control pin 111.

[0171] The detecting pin 121 is used to detect the performance parameter of the semiconductor device 100, so that the corresponding control parameter can be adjusted by the external device, thereby ensuring that the semiconductor device 100 is in a normal working state.

[0172] In some embodiments, as shown in FIG. 13 and FIG. 14, the detecting pin 121 comprises a first type of detecting pin T1 and a second type of detecting pin T2, the first type of detecting pin T1 and the control pin 111 are arranged on the same side, and the second type of detecting pin T2 and the power pin 102 are arranged on the same side.

[0173] For the thermistor, one end of the thermistor is connected to the first type of detecting pin T1, the other end of the thermistor is connected to the second type of detecting pin T2, and the other end of the thermistor is connected to the power pin P1 or P2.

[0174] It should be noted that FIG. 13 is used as an example to illustrate that the other end of the thermistor is connected to the power pin P2, which does not constitute a limitation on the thermistor. In other embodiments, if the other end of the thermistor is connected to the power pin P1, the thermistor is connected above the power pin P1.

[0175] FIG. 14 is different from FIG. 11 in that a thermistor is added in FIG. 14. The thermistor is generally a negative temperature coefficient (NTC). By detecting the signal of the detection pin 121 corresponding to the thermistor, the resistance parameter of the thermistor can be obtained, and thus the temperature of the semiconductor device 100 can be obtained.

[0176] Based on the foregoing, the width of the pin is related to the current-carrying capacity of the pin. In some embodiments, the width of the first type of detection pin T1 is less than or equal to the width of the control pin 111. For example, the width of the first type of detection pin T1 is less than the width of the control pin 111. For another example, the width of the first type of detection pin T1 is equal to the width of the control pin 111. In some embodiments, the width of the second type of detection pin T2 is less than or equal to the width of the first type of detection pin T1. For example, the width of the second type of detection pin T2 is less than the width of the first type of detection pin T1. For another example, the width of the second type of detection pin T2 is equal to the width of the first type of detection pin T1. Because the relative width of the power pin 102 is large, the second type of detection pin T2 is set to be small, which can reduce the influence on the arrangement of the power pin 102, so as to not affect the layout of multiple power pins 102 in a limited size, and ensure the creepage distance between the power pins 102.

[0177] In some embodiments, the spacing between the detection pin 121 and the power pin 102 is less than or equal to the spacing between the detection pin 121 and the control pin 111.

[0178] In some examples, referring to FIG. 14, the pin width of the control pin 111 corresponding to the same power tube is F, and the pin spacing is A. The pin width of the first type of detection pin T1 is F, the pin width of the second type of detection pin T2 is H, the first type of detection pin T1 is arranged in the same group as part of the control pin 111, and the spacing between different groups of control pins is L, L=A+B+F, where B is the minimum distance between two adjacent signal pins in different groups of signal pins, and B is greater than A. The pin width of the power pin 102 is G, the pin spacing between different power pins 102 is C, the minimum spacing between the second type of detection pin T2 and the power pin 102 is D, and the maximum spacing is E, C=D+E+H, and E is greater than D.

[0179] For the above example, in some embodiments, B > C > E > A > D, G > F > H can be set. By means of the temperature sensor built-in the semiconductor device 100, the internal power device temperature can be monitored in real time for temperature sampling and protection; and the distance between the two groups of signal pins 101 is increased to reduce the mutual interference of signals between different power tubes; and the problem of difficult wiring on the side of the signal pins due to too many pins is avoided.

[0180] In some embodiments, the signal pins can further include support pins, which can be arranged on the side of the substrate with fewer pins. The support pins serve to support and strengthen to improve the connection strength of the semiconductor device 100 and improve the stress capacity of the semiconductor device 100.

[0181] It should be noted that if the size of the semiconductor device 100 provided in the above embodiments is large enough, in addition to the built-in temperature sensor, other detection elements such as current detection elements can also be integrated to achieve overcurrent protection of the semiconductor device 100. The present disclosure does not limit other detection elements that can be integrated inside the semiconductor device 100, which can be set according to the size of the entire chip.

[0182] For the power pins 102 and the signal pins 101 provided in some embodiments of the present disclosure, the power pins 102 and the signal pins 101 respectively include at least one of the following: small outline package, small outline J-lead package, quad flat package, plastic leadless chip carrier, or straight pin.

[0183] It should be noted that small outline package (SOP): the part has pins on both sides, and the pins are spread out, commonly known as gull-wing pins. Small outline J-lead package (SOJ): the part has pins on both sides, and the pins are bent towards the bottom of the part, i.e. J-shaped pins. Quad flat package (QFP): the part has pins on four sides, and the part pins are spread out. Plastic leadless chip carrier (PLCC): the part has pins on four sides, and the part pins are bent towards the bottom of the part.

[0184] In some embodiments, the packaging form of at least part of the power pins 102 is different, or the packaging form of at least part of the signal pins 101 is different, or the packaging form of at least part of the power pins 102 is different, and the packaging form of at least part of the signal pins 101 is different.

[0185] In some embodiments, the packaging form of all signal pins 101 is the same, the packaging form of all power pins 102 is the same, and the packaging form of all detection pins 121 is the same; the packaging form of the signal pins 101, the power pins 102, and the detection pins 121 can be set to the same packaging form or to different packaging forms.

[0186] In some embodiments, in order to make the packaging form of the semiconductor device 100 more flexible, the form of at least part of the power pins 102 is different from the packaging form of at least part of the signal pins 101. All of the power pins 102 and all of the signal pins 101 can adopt different packaging forms, or part of the power pins 102 and all of the signal pins 101 can adopt the same form, or part of the power pins 102 and part of the signal pins 101 can adopt the same form, and part of the power pins 102 and part of the signal pins 101 can adopt different forms.

[0187] In addition, some embodiments of the present disclosure also provide a pin design. Referring to FIGS. 15 and 16, the power pins 102 and the signal pins 101 include a first connecting portion 1011, a bending portion 1013, and a second connecting portion 1012. The first end of the first connecting portion is located on the substrate and connected to the power circuit, and the second end of the first connecting portion extends out of the substrate; the first end of the bending portion is connected to the second end of the first connecting portion, the second end of the bending portion is connected to the first end of the second connecting portion, and the bending portion forms a first angle a with the first connecting portion and a second angle β with the second connecting portion. The second end of the second connecting portion is used to connect the circuit board carrying the semiconductor device.

[0188] In some embodiments, the first angle a and the second angle β are respectively any value in the range of 120°-150°, and the second angle β is greater than the first angle a. In some examples, the first angle a and the second angle β are respectively 120°, 130°, 135°, 140°, or 150°. By setting the length of the pin and the angle of the pin, the flatness of the packaging of the semiconductor device 100 can be ensured.

[0189] For example, assuming that the angle of the pin with the circuit board is θ, β = a + θ. In application, the first angle and the second angle can be actually set according to the angle of the pin with the circuit board. In some examples, as shown in FIG. 15, the first angle is 135° and the second angle is 137°, in which case the angle of the pin with the circuit board is 2°; in some examples, the first angle is 139° and the second angle is 140°, in which case the angle of the pin with the circuit board is 1°.

[0190] In some embodiments, as shown in FIG. 16, the first connecting portion has a first length L1, the bending portion has a second length L2, and the second connecting portion has a third length L3; the first length L1 is greater than the third length L3, and the third length L3 is greater than the second length L2. By setting the lengths of the first connecting portion, the second connecting portion, and the bending portion, the packaging flatness of the semiconductor device 100 can be ensured, and the strength of the pins can be increased.

[0191] In summary, according to some embodiments of the present disclosure, by arranging the signal pins and the power pins on different sides of the substrate, and by distributing the power pins and the signal pins on different sides of the semiconductor device, the power traces and the signal traces in the semiconductor device can be separated in actual applications, so as to avoid the cross connection of the power traces and the signal traces and the mutual interference therebetween; and the problem of difficult wiring on the side of the signal pins due to too many pins can be avoided.

[0192] Some embodiments of the present disclosure also provide a vehicle-mounted charger. As shown in FIG. 17, the vehicle-mounted charger 3000 includes the semiconductor device 100. In some examples, the vehicle-mounted charger 3000 includes a circuit having the semiconductor device 100 described above.

[0193] For example, the vehicle-mounted charger 3000 can include a power converter, which can include a rectifier circuit and a direct current-direct current (DC / DC) circuit. The rectifier circuit can include the semiconductor device 100 described in the above embodiments, and the DC / DC circuit can also include the semiconductor device 100 described in the above embodiments.

[0194] In addition, the present disclosure does not limit the implementation form of the rectifier circuit, which can be a half-bridge circuit or a full-bridge circuit.

[0195] When the rectifier circuit is a half-bridge circuit, the semiconductor device 100 corresponding to the half-bridge circuit described in the above embodiments can be used; if the rectifier circuit is a full-bridge circuit, the semiconductor device 100 corresponding to the half-bridge circuit described in the above embodiments can also be used, but the full-bridge circuit needs to use multiple semiconductor devices 100 corresponding to the above half-bridge circuits.

[0196] Since the vehicle-mounted charger provided by some embodiments of the present disclosure includes the semiconductor device 100 provided by the above embodiments, which has a flexible packaging form, the vehicle-mounted charger formed based on the semiconductor device 100 has simple circuit wiring and circuit board design.

[0197] It can be understood that the above AC-DC converter can also use the semiconductor device 100.

[0198] Some embodiments of the present disclosure further provide a vehicle 2000. As shown in FIG. 18 and FIG. 19, the vehicle 2000 includes the semiconductor device 100 described above, or includes the on-vehicle charger 3000 described above. The vehicle provided by some embodiments of the present disclosure can achieve bidirectional power transmission without adapting more driving circuits, thereby reducing circuit area and system complexity.

[0199] The vehicle can be a fuel automobile, a plug-in hybrid electric vehicle, or a new energy vehicle, and the present disclosure does not limit the vehicle.

[0200] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the detailed description of other embodiments above, which will not be described here.

[0201] The above merely provides specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present disclosure, which should be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. An on-board power supply (1000) comprising an AC-DC converter (200), wherein, The AC-DC converter (200) comprises: a first connection port (410) for connecting with a load, and a second connection port (420) for connecting with a battery (260); a power factor correction circuit (220) connected with the first connection port (410); a transformer circuit (230), a primary winding of the transformer circuit (230) being connected with a DC output end of the power factor correction circuit (220), and a secondary winding of the transformer circuit (230) being connected with the second connection port (420); and a freewheeling transistor (Q5), two ends of the freewheeling transistor (Q5) being connected with two ends of the secondary winding respectively and forming a loop, so that the second connection port (420) supplies power to the first connection port (410).

2. The on-board power supply (1000) according to claim 1, wherein The transformer circuit (230) comprises: a second capacitor (C2), a second end of the second capacitor (C2) being connected with a first end of the secondary winding; and a second inductor (L0), a first end of the second inductor (L0) being connected with a second end of the secondary winding; wherein a first end of the freewheeling transistor (Q5) is connected with a first end of the second capacitor (C2), and a second end of the freewheeling transistor (Q5) is connected with a second end of the secondary winding.

3. The on-board power supply (1000) according to claim 2, wherein The process that the second connection port (420) supplies power to the first connection port (410) comprises a continuous first period and a second period; in the first period, the freewheeling transistor (Q5) is in a conduction state, so that the second inductor (L0) is in a charging state, and the second capacitor (C2) supplies power to a primary of the transformer circuit (230); in the second period, the freewheeling transistor (Q5) is in an off state, so that the second inductor (L0) discharges to the primary of the transformer circuit (230), and the second capacitor (C2) is in a charging state.

4. The on-board power supply (1000) according to claim 3, wherein The process that the second connection port (420) supplies power to the first connection port (410) further comprises a third period continuous with the second period; in the third period, the freewheeling transistor (Q5) is in the off state, and the second capacitor (C2) is in the charging state.

5. The on-board power supply (1000) according to any one of claims 1 to 4, wherein The power factor correction circuit (220) further comprises a first inductor (Li), a first end of the first inductor (Li) being connected with a first end (411) of the first connection port (410); The power factor correction circuit (220) further comprises a first bridge arm and a second bridge arm, the first bridge arm comprising a first transistor (Q1) and a third transistor (Q3), and the second bridge arm comprising a second transistor (Q2) and a fourth transistor (Q4); a first end of the first transistor (Q1) being connected with a second end of the first inductor (Li); a first end of the second transistor (Q2) being connected with a second end (412) of the first connection port (410), and a second end of the second transistor (Q2) being connected with a second end of the first transistor (Q1); a first end of the third transistor (Q3) being connected with the first end (411) of the first connection port (410), and a second end of the third transistor (Q3) being connected with the second end of the first inductor (Li); and a first end of the fourth transistor (Q4) being connected with the second end (412) of the first connection port (410), and a second end of the fourth transistor (Q4) being connected with the second end of the second inductor (L0). A second end of the third transistor (Q3) is connected with a first end of the first transistor (Q1); A first end of the fourth transistor (Q4) is connected with a first end of the third transistor (Q3), and a second end of the fourth transistor (Q4) is connected with a first end of the second transistor (Q2); The first transistor (Q1) to the fourth transistor (Q4) are respectively configured to receive a first control signal, and the first control signal is configured to control a conduction state of the first transistor (Q1) to the fourth transistor (Q4) to supply power to the first connection port (410).

6. The vehicle-mounted power supply (1000) according to claim 5, wherein The transformer circuit (230) comprises: A first capacitor (C1), a first end of the first capacitor (C1) is connected with a second end of the first transistor (Q1); Wherein, a first end of the primary winding is connected with a second end of the first capacitor (C1), and a second end of the primary winding is connected with a first end of the third transistor (Q3).

7. The on-board power supply (1000) according to claim 6, wherein The process that the second connection port (420) supplies power to the first connection port (410) comprises a first time period and a second time period; In the first time period, one transistor in the first bridge arm and one transistor in the second bridge arm are turned on to form a loop to charge the first inductor (Li) by the first capacitor (C1); In the second time period, the one transistor in the first bridge arm and another transistor in the second bridge arm are turned on to form a loop to charge the load by the first inductor (Li).

8. The vehicle-mounted power supply (1000) according to claim 7, wherein, In the first time period, the first transistor (Q1), the fourth transistor (Q4) and the freewheeling transistor (Q5) are in a conduction state, and the second transistor (Q2) and the third transistor (Q3) are in an off state; In the second time period, the first transistor (Q1) is in the conduction state, and the second transistor (Q2), the third transistor (Q3), the fourth transistor (Q4) and the freewheeling transistor (Q5) are in the off state.

9. The on-board power supply (1000) according to claim 8, wherein The process that the second connection port (420) supplies power to the first connection port (410) further comprises a third time period continuous with the second time period; In the third time period, the first transistor (Q1) is in a conduction state, and the second transistor (Q2), the third transistor (Q3), the fourth transistor (Q4) and the freewheeling transistor (Q5) are in the off state.

10. The vehicle-mounted power supply (1000) according to claim 9, wherein, In the first time period, the first capacitor (C1) is in a discharge state to supply power to the first connection port (410) through the first inductor (Li); In the second time period, the first inductor (Li) is in a discharge state to supply power to the first connection port (410), and the first capacitor (C1) is in a charge state; In the third period, the first inductor (Li) is in the discharging state to supply power to the first connection port (410).

11. The on-board power supply (1000) according to claim 6, wherein The process that the second connection port (420) supplies power to the first connection port (410) includes a first period and a second period; In the first period, the second transistor (Q2), the third transistor (Q3) and the freewheeling transistor (Q5) are in the on state, and the first transistor (Q1) and the fourth transistor (Q4) are in the off state; In the second period, the second transistor (Q2) is in the on state, and the first transistor (Q1), the third transistor (Q3), the fourth transistor (Q4) and the freewheeling transistor (Q5) are in the off state.

12. The vehicle-mounted power supply (1000) according to claim 11, wherein The process that the second connection port (420) supplies power to the first connection port (410) further includes a third period continuous with the second period; In the third period, the second transistor (Q2) is in the on state, and the first transistor (Q1), the third transistor (Q3), the fourth transistor (Q4) and the freewheeling transistor (Q5) are in the off state, and the first inductor (Li) forms a loop with the first connection port (410) to charge the first inductor (Li) for the load.

13. The on-board power supply (1000) according to claim 12, wherein In the first period, the first capacitor (C1) is in the discharging state to charge the first inductor (Li) and supply power to the first connection port (410) through the first inductor (Li); In the second period and the third period, the first inductor (Li) is in the discharging state to supply power to the first connection port (410), and the first capacitor (C1) is in the charging state; In the third period, the first inductor (Li) is in the discharging state to supply power to the first connection port (410).

14. The vehicle-mounted power supply (1000) according to claim 6, wherein, The AC-DC converter (200) is further configured to make the first connection port (410) supply power to the second connection port (420), and the first connection port (410) is further configured to be connected with a power supply; The process that the first connection port (410) supplies power to the second connection port (420) includes a first period and a second period continuous with the first period; In the first period, two transistors of the first bridge arm and two transistors of the second bridge arm are turned on to form a loop, and the first capacitor (C1) supplies power to the secondary of the transformer circuit (230); In the second period, one transistor of the first bridge arm and one transistor of the second bridge arm form a loop to discharge the first inductor (Li) to the secondary of the transformer circuit (230).

15. The on-board power supply (1000) according to claim 14, wherein The process that the first connection port (410) supplies power to the second connection port (420) further includes a third period continuous with the second period; In the third period, the one transistor of the first bridge arm and the one transistor of the second bridge arm form a loop, and the first capacitor (C1) is in the charging state.

16. The vehicle-mounted power supply (1000) according to claim 15, wherein in the first time period, the first transistor (Q1) to the fourth transistor (Q4) are in a conducting state, respectively; in the second time period and the third time period, the first transistor (Q1) to the fourth transistor (Q4) are in a non-conducting state, respectively.

17. The vehicle-mounted power supply (1000) according to claim 16, wherein in the first time period, the first inductor (Li) is in a charging state, and the first capacitor (C1) is in a discharging state, to supply power to the secondary of the transformer circuit (230); in the second time period, the first capacitor (C1) is in the charging state, and the first inductor (Li) is in the discharging state, to discharge the secondary of the transformer circuit (230); in the third time period, the first capacitor (C1) is in the charging state.

18. The vehicle-mounted power supply (1000) according to claim 2, wherein, the AC-DC converter (200) is further configured to supply power from the first connection port (410) to the second connection port (420), and the first connection port (410) is further configured to be connected with a power supply; the process of supplying power from the first connection port (410) to the second connection port (420) includes a first time period and a second time period in succession; in the first time period, the second capacitor (C2) is in a discharging state to charge the load, and the second inductor (L0) is in a charging state; in the second time period, the second inductor (L0) is in the discharging state to supply power to the battery (260), and the second capacitor (C2) is in the charging state.

19. The vehicle-mounted power supply (1000) according to claim 18, wherein the AC-DC converter (200) further includes a filter circuit (240) including a filter capacitor (Cdc) connected to the second connection port (420); the process of supplying power from the first connection port (410) to the second connection port (420) further includes a third time period in succession with the second time period; in the third time period, the filter capacitor (Cdc) supplies power to the battery (260), and the second capacitor (C2) is in the charging state.

20. The vehicle-mounted power supply (1000) according to claim 5, wherein, the first bridge arm and the second bridge arm are configured to receive a second control signal, and the second control signal is configured to change the conducting state of the first transistor (Q1) to the fourth transistor (Q4) to control the first bridge arm and the second bridge arm to form a charging loop with the transformer circuit (230).

21. The on-board power supply (1000) according to claim 20, wherein the second control signal is further configured to adjust the ratio of the conducting time length to the non-conducting time length of the first transistor (Q1) to the fourth transistor (Q4) in a period to change the voltage at the second connection port (420); the ratio of the conducting time length to the non-conducting time length and the voltage at the second connection port (420) are in positive correlation.

22. The vehicle-mounted power supply (1000) according to any one of claims 1 to 21, wherein, the AC-DC converter (200) is configured to constitute a multi-path AC-DC converter (300). The multi-path AC-DC converter (300) comprises a plurality of conversion units, a plurality of first connection ports (410) and a second connection port (420); Each of the plurality of conversion units comprises the power factor correction circuit (220), the transformer circuit (230) and the freewheeling transistor (Q5); The power factor correction circuit (220) of each conversion unit is connected to one of the plurality of first connection ports (410); The transformer circuit (230) of each conversion unit is connected to the second connection port (420).

23. The vehicle-mounted power supply (1000) according to claim 22, wherein The plurality of conversion units comprises three conversion units, and the phase difference between any two of the three conversion units is 120 degrees.

24. The vehicle-mounted power supply (1000) according to any one of claims 1 to 23, further comprising: a controller (250) configured to provide a control signal to change the charge-discharge state of the transformer circuit (230) of the AC-DC converter (200) to form a charge-discharge loop between the transformer circuit (230) of the AC-DC converter (200) and the power factor correction circuit (220) of the AC-DC converter (200).

25. An on-board charger (3000) comprising a semiconductor device (100), wherein, The semiconductor device (100) comprises: a substrate; a power circuit disposed on the substrate; and a plurality of power pins (102) and a plurality of signal pins (101) connected to the power circuit; wherein at least part of the plurality of signal pins (101) disposed on the same side of the substrate are grouped to form a plurality of groups of signal pins, and the distance between adjacent signal pins (101) in different groups of the plurality of groups of signal pins is greater than the distance between adjacent power pins (102) in the plurality of power pins (102).

26. The vehicle charger (3000) of claim 25, wherein, The distance between adjacent signal pins (101) in the same group of the plurality of groups of signal pins is less than the distance between the adjacent power pins (102).

27. The vehicle-mounted charger (3000) according to claim 25 or 26, wherein, The plurality of power pins (102) are disposed on a first side of the substrate, and the at least part of the plurality of signal pins (101) are disposed on a second side of the substrate, the first side and the second side being different sides of the substrate.

28. The vehicle-mounted charger (3000) of claim 27, wherein, The first side and the second side are opposite sides of the substrate.

29. The vehicle-mounted charger (3000) according to claim 27 or 28, wherein, The at least part of the plurality of signal pins (101) disposed on the second side are grouped, and the distance between adjacent signal pins (101) in different groups is greater than the distance between the adjacent power pins (102).

30. The vehicle-mounted charger (3000) according to any one of claims 25 to 29, wherein, The power circuit comprises at least two power elements, and the signal pins (101) corresponding to different power elements of the at least two power elements are disposed in different groups.

31. The vehicle-mounted charger (3000) according to any one of claims 25 to 30, wherein, The width of any one of the plurality of power pins (102) is greater than the width of any one of the plurality of signal pins (101).

32. The vehicle-mounted charger (3000) of claim 31, wherein, The widths of different power pins (102) in the plurality of power pins (102) are different.

33. The on-board charger (3000) according to any one of claims 25 to 32, further comprising a detection element (104), the plurality of signal pins (101) comprising a control pin (111) and a detection pin (121); the detection pin (121) is connected to the detection element (104), and the control pin (111) is configured to receive a driving signal corresponding to the power circuit; wherein the semiconductor device (100) satisfies at least one of: the detection pin (121) and the power pin (102) are arranged on the same side; and the detection pin (121) and the control pin (111) are arranged on the same side.

34. The vehicle charger (3000) of claim 33, wherein, the detection pin (121) comprises a first type of detection pin (T1) and a second type of detection pin (T2); the first type of detection pin (T1) and the control pin (111) are arranged on the same side; the second type of detection pin (T2) and the power pin (102) are arranged on the same side.

35. The vehicle-mounted charger (3000) of claim 34, wherein, a width of the second type of detection pin (T2) is less than or equal to a width of the control pin (111).

36. The vehicle-mounted charger (3000) of claim 34 or 35, wherein, a width of the second type of detection pin (T2) is less than or equal to a width of the first type of detection pin (T1).

37. The vehicle-mounted charger (3000) according to any one of claims 33 to 36, wherein, a spacing between the detection pin (121) and the power pin (102) is less than or equal to a spacing between the detection pin (121) and the control pin (111).

38. The vehicle-mounted charger (3000) according to any one of claims 25 to 37, wherein, a package form of the signal pin (101) and the power pin (102) comprises at least one of: a small outline package, a J-lead small outline package, a quad flat package, a plastic chip carrier with leads, or a straight pin package.

39. The on-board charger (3000) according to claim 38, satisfying at least one of: a package form of at least some of the plurality of signal pins (101) is different; and a package form of the plurality of power pins (102) is different.

40. The vehicle-mounted charger (3000) according to any one of claims 25 to 39, wherein, at least one of the plurality of signal pins (101) and the plurality of power pins (102) comprises: a first connecting portion (1011) having a first end on the substrate and connected to the power circuit, and a second end extending out of the substrate; a bending portion (1013) having a first end connected to the second end of the first connecting portion (1011), a second end connected to a first end of a second connecting portion (1012), and a first angle with the first connecting portion (1011) and a second angle with the second connecting portion (1012); and the second connecting portion (1012) having a second end configured to be connected to a circuit board carrying the semiconductor device (100).

41. The vehicle-mounted charger (3000) of claim 40, wherein, the first angle and the second angle are respectively any value in a range of 120° to 150°, and the second angle is greater than the first angle.

42. The vehicle-mounted charger (3000) of claim 40 or 41, wherein, The first connecting part (1011) has a first length, the bending part (1013) has a second length, and the second connecting part (1012) has a third length; wherein the first length is greater than the third length, and the third length is greater than the second length.

43. A vehicle (2000) comprising: a battery (260) and a vehicle power supply (1000) according to any one of claims 1 to 24, the vehicle power supply (1000) comprising the second connecting port (420); the battery (260) being connected to the second connecting port (420) of the vehicle power supply (1000); or a vehicle charger (3000) according to any one of claims 25 to 42.

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