Sensing module, sensing method and related apparatus

Abstract

A sensing module (30), comprising: a first piezoelectric part (301), a second piezoelectric part (302) and a third piezoelectric part (300), wherein at least part of the first piezoelectric part (301) and at least part of the third piezoelectric part (303) are arranged on two opposite sides of a piezoelectric material, and / or at least part of the second piezoelectric part (302) and at least part of the third piezoelectric part (300) are arranged on two opposite sides of the piezoelectric material; the first piezoelectric part (301) is used for connecting to a first signal line and outputting a first signal which represents the degree of strain between the first piezoelectric part (301) and the third piezoelectric part (303); the second piezoelectric part (302) is used for connecting to a second signal line and outputting a second signal which represents the degree of strain between the second piezoelectric part (302) and the third piezoelectric part (303); and the third piezoelectric part (303) is used for connecting to a third signal line, the third signal line being grounded. The working state of the sensing module (30) is associated with the intensity relationship between the first signal and the second signal. The sensing capability can be improved, so as to feed back sensor faults in a timely manner. Also provided are a sensing method and a related apparatus.

Description

Perception module, perception method and related device

[0001] The present application claims priority to the Chinese patent application No. 202411368831.4, filed on September 27, 2024, and entitled "Perception module, perception method and related device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of sensors, in particular to a perception module, a perception method and related device. BACKGROUND

[0003] The basic working principle of a structure acoustic sensor (SAS) is that a piezoelectric material (piezoelectric ceramic, piezoelectric crystal, piezoelectric film, etc.) converts mechanical vibration into an electrical signal through the piezoelectric effect. Such a sensor has extremely high detection sensitivity and can detect extremely small vibrations inside and on the surface of a solid, and can be used as the last line of defense for an automated valet parking (AVP) system of a vehicle. When a vehicle collision occurs, the resulting vibration will be transmitted along the vehicle body shell to the sensor, and the sensor will transmit the collected electrical signal to the processor for analysis. When the processor confirms that the received signal is a collision signal, it will quickly issue a braking instruction to avoid secondary collisions.

[0004] Currently, common structure acoustic sensors all adopt a two-wire scheme, i.e., a signal line and a ground line are respectively connected to the upper surface and the lower surface (or the positive electrode and the negative electrode) of the piezoelectric material.

[0005] However, such a wiring scheme has weak perception ability and cannot timely feedback sensor failure. SUMMARY

[0006] The present application provides a perception module, a perception method and related device, which can improve the perception ability and timely feedback the sensor failure.

[0007] In a first aspect, the present application provides a perception module, comprising:

[0008] a first piezoelectric part, a second piezoelectric part, and a third piezoelectric part;

[0009] The first piezoelectric part, the second piezoelectric part, and the third piezoelectric part are mutually insulated, at least part of the first piezoelectric part and at least part of the third piezoelectric part are arranged on opposite sides of a piezoelectric material, and / or at least part of the second piezoelectric part and at least part of the third piezoelectric part are arranged on opposite sides of the piezoelectric material.

[0010] The first piezoelectric part is configured to be connected to a first signal line, the first signal line being configured to output a first signal, the first signal being configured to represent a degree of strain between the first piezoelectric part and the third piezoelectric part;

[0011] The second piezoelectric part is configured to be connected to a second signal line, the second signal line being configured to output a second signal, the second signal being configured to represent a degree of strain between the second piezoelectric part and the third piezoelectric part;

[0012] The third piezoelectric part is configured to be connected to a third signal line, the third signal line being configured to be grounded;

[0013] The working state of the sensing module is associated with an intensity relationship between the first signal and the second signal.

[0014] In the embodiments of the present application, a sensing module is provided, three piezoelectric parts in the sensing module are connected to three signal lines respectively, the third signal line is grounded, the first signal line and the second signal line output a first signal and a second signal respectively, the first signal is configured to represent a degree of strain between the first piezoelectric part and the third piezoelectric part, the second signal is configured to represent a degree of strain between the second piezoelectric part and the third piezoelectric part, and the working state of the sensing module is associated with an intensity relationship between the first signal and the second signal. The sensing module adopts a three-wire scheme, by analyzing the intensity relationship between the first signal and the second signal, the difference in the degree of strain between the piezoelectric parts can be detected, and then whether the sensing module is abnormal can be detected, so as to determine the working state of the sensing module. Compared with the two-wire scheme adopted by the current structural acoustic sensor, which only detects whether it is abnormal according to the signal intensity of the unique signal line, the sensing module in the embodiments of the present application can make the reliability of the fault detection result higher by comparing the intensity relationship between the two signals, so as to improve the sensing capability and timely feedback the sensor fault.

[0015] Optionally, the first signal and / or the second signal can be an electrical signal, such as a voltage value, a current value, a charge value, etc.

[0016] In a possible implementation, when the intensity relationship between the first signal and the second signal is different from a reference threshold value by less than a first threshold value, the sensing module is in a normal state; or,

[0017] When the intensity relationship between the first signal and the second signal is different from the reference threshold value by not less than the first threshold value, the sensing module is in an abnormal state.

[0018] In the embodiment, a possible specific implementation of the working state of the sensing module is provided, and the intensity relationship between the first signal and the second signal is associated. Specifically, when the difference between the intensity relationship between the first signal and the second signal and the reference threshold is less than the first threshold, it indicates that the strain difference between the piezoelectric parts is small, and it is detected that the sensing module is in a normal state. On the contrary, when the difference between the intensity relationship between the first signal and the second signal and the reference threshold is not less than the first threshold, it indicates that the strain difference between the piezoelectric parts is large, and it is detected that the sensing module is in an abnormal state. The sensing module in the embodiment can compare the intensity relationship between the two signals to make the reliability of the fault detection result higher, so as to improve the sensing ability and timely feedback the sensor fault.

[0019] Optionally, the reference threshold and / or the first threshold are configurable, which can be a calibration value determined by a large amount of test data when the sensing module is shipped, or can be adjusted according to different application scenarios, and the embodiment does not limit this.

[0020] Optionally, the intensity relationship between the first signal and the second signal can refer to the intensity ratio of the first signal and the second signal, or can refer to the intensity difference of the first signal and the second signal, and the embodiment does not limit this.

[0021] Optionally, the intensity ratio of the first signal and the second signal can refer to the ratio of the intensity of the first signal to the intensity of the second signal, or can refer to the ratio of the intensity of the second signal to the intensity of the first signal, and the embodiment does not limit this.

[0022] In a possible implementation, when the sensing module is in the abnormal state, the sensing module performs self-calibration, or the vehicle carrying the sensing module exits the automatic guest parking state.

[0023] In the embodiment, when the sensing module is in the abnormal state, the self-calibration of the sensing module can be performed, or the vehicle carrying the sensing module exits the automatic guest parking state, which can be determined according to different application scenarios.

[0024] Optionally, the self-calibration of the sensing module can be an operation performed in a scenario triggered by the vehicle periodically, the self-detection of the sensing module is an operation performed in a scenario triggered by the user, and the abnormal detection is an operation performed in a driving scenario. Accordingly, when the sensing module is in the abnormal state, the corresponding operation will be performed in the above different application scenarios.

[0025] In a possible implementation, the first piezoelectric part includes a part corresponding to a first side of a first piezoelectric sheet, the second piezoelectric part includes a part corresponding to a second side of a second piezoelectric sheet, and the third piezoelectric part includes a part corresponding to a third side of the first piezoelectric sheet and a part corresponding to a fourth side of the second piezoelectric sheet.

[0026] The first side of the first piezoelectric sheet and the third side of the first piezoelectric sheet are located on opposite sides of the first piezoelectric sheet, the second side of the second piezoelectric sheet is on the same side as the first side of the first piezoelectric sheet, the fourth side of the second piezoelectric sheet is on the same side as the third side of the first piezoelectric sheet, and the first side of the first piezoelectric sheet and the second side of the second piezoelectric sheet are insulated from each other.

[0027] In the embodiment, a possible specific implementation of a double piezoelectric sheet is provided. Specifically, the sensing module includes a first piezoelectric sheet and a second piezoelectric sheet. A part corresponding to a first side of the first piezoelectric sheet constitutes the first piezoelectric part, a part corresponding to a second side of the second piezoelectric sheet constitutes the second piezoelectric part, and a part corresponding to a third side of the first piezoelectric sheet and a part corresponding to a fourth side of the second piezoelectric sheet jointly constitute the third piezoelectric part. It can be understood that the part corresponding to the first side of the first piezoelectric sheet is connected to a first signal line for outputting a first signal. The part corresponding to the second side of the second piezoelectric sheet is connected to a second signal line for outputting a second signal. The part corresponding to the third side of the first piezoelectric sheet and the part corresponding to the fourth side of the second piezoelectric sheet are connected to a third signal line for grounding. The first side of the first piezoelectric sheet and the second side of the second piezoelectric sheet are insulated from each other. Through the first piezoelectric sheet and the second piezoelectric sheet in the embodiment, the reliability of the fault detection result can be higher based on the intensity relationship comparison between the first signal and the second signal, so that the sensing capability can be improved and the sensor fault can be timely fed back.

[0028] Optionally, the first piezoelectric sheet and the second piezoelectric sheet can be of different sizes or of the same size, and the embodiment does not limit this.

[0029] Optionally, the part corresponding to the first side of the first piezoelectric sheet constituting the first piezoelectric part is coated with a conductive material (such as conductive silver paste) to have conductive performance and form an electrode. Similarly, the part corresponding to the second side of the second piezoelectric sheet constituting the second piezoelectric part and the part corresponding to the third side of the first piezoelectric sheet and the part corresponding to the fourth side of the second piezoelectric sheet constituting the third piezoelectric part are also coated with a conductive material.

[0030] Optionally, the conductive material can cover the parts of the first piezoelectric part and the parts of the second piezoelectric part to form equipotential surfaces and improve the precision of abnormality detection.

[0031] Optionally, the conductive material can cover part of the first piezoelectric part and part of the second piezoelectric part, in which case, the area of the first piezoelectric part and the second piezoelectric part covered by the conductive material can remain consistent, thereby improving the accuracy of the anomaly detection.

[0032] In one possible implementation, the first piezoelectric part further includes a portion corresponding to the fifth side of the first piezoelectric sheet, and the first piezoelectric part and the third piezoelectric part are insulated from each other.

[0033] In this embodiment, the portion corresponding to the first side of the first piezoelectric sheet and the portion corresponding to the fifth side of the first piezoelectric sheet constitute the first piezoelectric part, and the first piezoelectric part and the third piezoelectric part are insulated from each other, which can make the reliability of the fault detection result higher based on the comparison of the intensity relationship between the first signal and the second signal.

[0034] In one possible implementation, the first piezoelectric part further includes all the portions corresponding to the fifth side of the first piezoelectric sheet and the portions corresponding to the third side of the first piezoelectric sheet, and the first piezoelectric part and the third piezoelectric part are insulated from each other.

[0035] In this embodiment, the portion corresponding to the first side of the first piezoelectric sheet, all the portions corresponding to the fifth side of the first piezoelectric sheet, and the portions corresponding to the third side of the first piezoelectric sheet constitute the first piezoelectric part, and the first piezoelectric part and the third piezoelectric part are insulated from each other, which can make the reliability of the fault detection result higher based on the comparison of the intensity relationship between the first signal and the second signal.

[0036] In one possible implementation, the third side of the first piezoelectric sheet and the fourth side of the second piezoelectric sheet are arranged on a printed circuit board (PCB).

[0037] In this embodiment, the third side of the first piezoelectric sheet and the fourth side of the second piezoelectric sheet are arranged on a printed circuit board (PCB), and it can be understood that the third side of the first piezoelectric sheet and the fourth side of the second piezoelectric sheet are attached to the PCB and are co-located.

[0038] In one possible implementation, the piezoelectric material of the first piezoelectric sheet and the second piezoelectric sheet is the same.

[0039] In this embodiment, the piezoelectric material of the first piezoelectric sheet and the second piezoelectric sheet is the same, which can make the responses of the electrical signals consistent, thereby making the reliability of the fault detection result higher and feeding back the sensor fault in a timely manner.

[0040] Optionally, the piezoelectric materials of the first piezoelectric sheet and the second piezoelectric sheet can also be different. At this time, the sensitivities of the electric signals generated by the first piezoelectric sheet and the second piezoelectric sheet to vibration are inconsistent, and can be affected by factors such as ambient temperature and service life, resulting in inconsistent responses of the electric signals. In this case, the subsequent algorithm can be used to compensate the response electric signals to offset the differences in the sensitivities of the electric signals generated by different piezoelectric materials to vibration, the ambient temperature, and the service life.

[0041] In a possible implementation, the first piezoelectric part includes a first part corresponding to a first side of a third piezoelectric sheet, the second piezoelectric part includes a second part corresponding to the first side of the third piezoelectric sheet, and the third piezoelectric part includes a part corresponding to a second side of the third piezoelectric sheet.

[0042] The first side of the third piezoelectric sheet and the second side of the third piezoelectric sheet are located on opposite sides of the third piezoelectric sheet, and the first part corresponding to the first side of the third piezoelectric sheet and the second part corresponding to the first side of the third piezoelectric sheet are insulated from each other.

[0043] In the present embodiment, a possible specific implementation of a single piezoelectric sheet is provided. Specifically, the sensing module includes a third piezoelectric sheet. The first part corresponding to the first side of the third piezoelectric sheet constitutes the first piezoelectric part, the second part corresponding to the first side of the third piezoelectric sheet constitutes the second piezoelectric part, and the part corresponding to the second side of the third piezoelectric sheet constitutes the third piezoelectric part. It can be understood that the first part corresponding to the first side of the third piezoelectric sheet is connected to the first signal line for outputting the first signal. The second part corresponding to the first side of the third piezoelectric sheet is connected to the second signal line for outputting the second signal. The part corresponding to the second side of the third piezoelectric sheet is connected to the third signal line for grounding. The first part corresponding to the first side of the third piezoelectric sheet and the second part corresponding to the first side of the third piezoelectric sheet are insulated from each other. By using the third piezoelectric sheet in the present embodiment, the reliability of the fault detection result can be higher based on the intensity relationship between the first signal and the second signal, so that the sensing capability can be improved and the sensor fault can be fed back in time.

[0044] Furthermore, compared with the double-piezoelectric-sheet scheme, the single-piezoelectric-sheet scheme used in the present embodiment can significantly reduce the cost of the device, and there is no need to consider the specification difference between the two piezoelectric sheets, which helps to improve the self-checking capability of the sensor.

[0045] Optionally, the first part and the second part corresponding to the first side of the third piezoelectric sheet can be large and small, or the same size. The present embodiment does not limit this.

[0046] In a possible implementation, the second side of the third piezoelectric sheet is arranged on the PCB.

[0047] In the embodiment, the second side of the third piezoelectric sheet is arranged on the PCB, and it can be understood that the second side of the third piezoelectric sheet is attached to the PCB and grounded.

[0048] In a possible implementation, the first piezoelectric part includes a first part corresponding to the first side of the fourth piezoelectric sheet, the second piezoelectric part includes a second part corresponding to the first side of the fourth piezoelectric sheet, and the third piezoelectric part includes a third part corresponding to the first side of the fourth piezoelectric sheet.

[0049] The first part corresponding to the first side of the fourth piezoelectric sheet, the second part corresponding to the first side of the fourth piezoelectric sheet, and the third part corresponding to the first side of the fourth piezoelectric sheet are insulated from each other.

[0050] In the embodiment, a possible specific implementation of single piezoelectric sheet coplanar wiring is provided, specifically, the sensing module includes a fourth piezoelectric sheet, wherein the first part corresponding to the first side of the fourth piezoelectric sheet constitutes the first piezoelectric part, the second part corresponding to the first side of the fourth piezoelectric sheet constitutes the second piezoelectric part, and the third part corresponding to the first side of the fourth piezoelectric sheet constitutes the third piezoelectric part. It can be understood that the first part corresponding to the first side of the fourth piezoelectric sheet is connected to the first signal line for outputting the first signal. The second part corresponding to the first side of the fourth piezoelectric sheet is connected to the second signal line for outputting the second signal. The third part corresponding to the first side of the fourth piezoelectric sheet is connected to the third signal line for grounding. The first part corresponding to the first side of the fourth piezoelectric sheet, the second part corresponding to the first side of the fourth piezoelectric sheet, and the third part corresponding to the first side of the fourth piezoelectric sheet are insulated from each other. Through the fourth piezoelectric sheet in the embodiment, the reliability of the fault detection result is higher based on the intensity relationship comparison between the first signal and the second signal, so that the sensing ability can be improved, and the sensor fault can be fed back in time.

[0051] Moreover, compared with the double-piezoelectric-sheet scheme, the single-piezoelectric-sheet scheme in the embodiment can significantly reduce the cost of the device, and there is no need to consider the specification difference between the two piezoelectric sheets, which helps to improve the self-checking ability of the sensor.

[0052] Moreover, compared with the single-piezoelectric-sheet double-side wiring scheme, the single-piezoelectric-sheet coplanar wiring scheme in the embodiment has the advantage of avoiding the jumper connection between the second side (the side opposite to the first side) of the fourth piezoelectric sheet and the PCB, and integrating the three signal lines on one side of the PCB, thereby improving the stability of the device.

[0053] Optionally, the first part corresponding to the first side of the fourth piezoelectric sheet, the second part corresponding to the first side of the fourth piezoelectric sheet, and the third part corresponding to the first side of the fourth piezoelectric sheet can be different or the same, and the present application does not limit this.

[0054] Optionally, in addition to the first part corresponding to the first side of the fourth piezoelectric sheet, the first piezoelectric part can also include but is not limited to a part corresponding to the second side of the fourth piezoelectric sheet, which is located on the opposite side of the fourth piezoelectric sheet from the first side of the fourth piezoelectric sheet.

[0055] Optionally, in addition to the second part corresponding to the first side of the fourth piezoelectric sheet, the second piezoelectric part can also include but is not limited to a part corresponding to the second side of the fourth piezoelectric sheet, which is located on the opposite side of the fourth piezoelectric sheet from the first side of the fourth piezoelectric sheet.

[0056] In a possible implementation, the first side of the fourth piezoelectric sheet is arranged on the PCB.

[0057] In the present embodiment, the first side of the fourth piezoelectric sheet is arranged on the PCB. It can be understood that the first part corresponding to the first side of the fourth piezoelectric sheet, the second part corresponding to the first side of the fourth piezoelectric sheet, and the third part corresponding to the first side of the fourth piezoelectric sheet are attached to the PCB, and the third part corresponding to the first side of the fourth piezoelectric sheet is grounded. By the present application, the three signal lines are integrated on one side of the PCB, which can avoid the jumper connection between the second side of the fourth piezoelectric sheet (the side opposite to the first side of the fourth piezoelectric sheet) and the PCB, and improve the stability of the device.

[0058] In a possible implementation, the first piezoelectric part includes a part corresponding to the first side of a fifth piezoelectric sheet, the second piezoelectric part includes a part corresponding to the second side of a sixth piezoelectric sheet, and the third piezoelectric part includes a part corresponding to the third side of the fifth piezoelectric sheet and a part corresponding to the fourth side of the sixth piezoelectric sheet.

[0059] The first side of the fifth piezoelectric sheet and the third side of the fifth piezoelectric sheet are located on opposite sides of the fifth piezoelectric sheet, the fourth side of the sixth piezoelectric sheet is on the same side as the first side of the fifth piezoelectric sheet, the second side of the sixth piezoelectric sheet is on the same side as the third side of the fifth piezoelectric sheet, and the fifth piezoelectric sheet and the sixth piezoelectric sheet are insulated from each other.

[0060] In the embodiment, a possible specific implementation of the positive and negative electrode staggered connection of the dual piezoelectric sheets is provided, specifically, the sensing module includes a fifth piezoelectric sheet and a sixth piezoelectric sheet, wherein the first side of the fifth piezoelectric sheet corresponds to the first piezoelectric part, the second side of the sixth piezoelectric sheet corresponds to the second piezoelectric part, and the third side of the fifth piezoelectric sheet and the fourth side of the sixth piezoelectric sheet jointly form the third piezoelectric part. It can be understood that the first side of the fifth piezoelectric sheet is connected to the first signal line for outputting the first signal. The second side of the sixth piezoelectric sheet is connected to the second signal line for outputting the second signal. The third side of the fifth piezoelectric sheet and the fourth side of the sixth piezoelectric sheet are connected to the third signal line for grounding. The first side of the fifth piezoelectric sheet and the second side of the sixth piezoelectric sheet are insulated from each other. Through the fifth piezoelectric sheet and the sixth piezoelectric sheet in the embodiment, the reliability of the fault detection result is higher based on the comparison of the intensity relationship between the first signal and the second signal, so that the sensing capability can be improved and the sensor fault can be fed back in time.

[0061] Optionally, the fifth piezoelectric sheet and the sixth piezoelectric sheet can be different in size or the same in size, and the embodiment does not limit this.

[0062] In addition, the embodiment adopts the double piezoelectric sheet positive and negative electrode staggered connection scheme. For example, under the same pressure, if the voltage difference between the upper and lower surfaces of the piezoelectric material of the fifth piezoelectric sheet is positive, the voltage difference between the upper and lower surfaces of the piezoelectric material of the sixth piezoelectric sheet is negative due to the positive and negative electrode staggered connection. For the same vibration source, the phases of the output first signal and the second signal are always opposite, differential operation can be used to eliminate noise, global noise can be eliminated, the signal-to-noise ratio of the sensor is improved, and the detection capability of the micro signal is enhanced.

[0063] In a possible implementation, the third side of the fifth piezoelectric sheet and the second side of the sixth piezoelectric sheet are arranged on the PCB.

[0064] In the embodiment, the third side of the fifth piezoelectric sheet and the second side of the sixth piezoelectric sheet are arranged on the PCB. It can be understood that the third side of the fifth piezoelectric sheet and the second side of the sixth piezoelectric sheet are attached to the PCB.

[0065] In a possible implementation, the piezoelectric material of the fifth piezoelectric sheet and the sixth piezoelectric sheet is the same.

[0066] In the embodiment, the piezoelectric material of the fifth piezoelectric sheet and the sixth piezoelectric sheet is the same, which can keep the responses of the electrical signals consistent, so that the reliability of the fault detection result is higher and the sensor fault can be fed back in time.

[0067] Optionally, the piezoelectric materials of the fifth piezoelectric sheet and the sixth piezoelectric sheet can also be different. At this time, the sensitivities of the electric signals generated by the fifth piezoelectric sheet and the sixth piezoelectric sheet to vibration are inconsistent, and can be affected by factors such as ambient temperature and service life, resulting in inconsistent responses of the electric signals. In this case, the subsequent algorithm can be used to compensate the response of the electric signal to offset the difference in sensitivity of the electric signals generated by different piezoelectric materials to vibration, the influence of factors such as ambient temperature and service life.

[0068] In a possible implementation, the phase of the first signal and the phase of the second signal are opposite.

[0069] In the embodiment, the positive and negative electrodes of the double piezoelectric sheets are connected alternately. For example, under the same pressure, if the voltage difference between the upper and lower surfaces of the piezoelectric material of the fifth piezoelectric sheet is positive, the voltage difference between the upper and lower surfaces of the piezoelectric material of the sixth piezoelectric sheet is negative due to the alternately connected positive and negative electrodes. For the same vibration source, the phases of the output first signal and second signal are always opposite, and the differential operation can be used to eliminate noise and achieve global noise elimination, thereby improving the signal-to-noise ratio of the sensor and enhancing the detection ability of the micro signal.

[0070] In a possible implementation, the piezoelectric sheet corresponding to the first piezoelectric part is rectangular, circular, triangular, or irregular.

[0071] In the embodiment, the piezoelectric sheet corresponding to the first piezoelectric part is rectangular, circular, triangular, or irregular, and can also be designed as any other shape, which is not limited in the embodiments of the application.

[0072] Optionally, the piezoelectric sheet corresponding to the second piezoelectric part and / or the third piezoelectric part can also be rectangular, circular, triangular, or irregular, and can also be designed as any other shape, which is not limited in the embodiments of the application.

[0073] Optionally, the piezoelectric sheet corresponding to the first piezoelectric part and / or the second piezoelectric part and / or the third piezoelectric part can be determined according to the size of the space inside the sensor to improve the space utilization of the sensor.

[0074] In a possible implementation, the piezoelectric material includes at least one of the following:

[0075] Piezoelectric ceramic, piezoelectric crystal, piezoelectric film.

[0076] In a possible implementation, in the case that the sensing module receives a fixed vibration signal, the first signal and the second signal are used to calibrate the sensing module.

[0077] In the embodiment, a possible implementation of self-calibration of the sensing module is provided, specifically, in the case that the sensing module receives a fixed vibration signal, the sensing module can be calibrated according to a first signal output by a first signal line and a second signal output by a second signal line.

[0078] Optionally, the fixed vibration signal can include but is not limited to, for example, a siren, passing through a deceleration zone at a fixed speed, etc., and the present application does not limit this.

[0079] Optionally, the calibration of the sensing module according to the first signal and the second signal can specifically be feature extraction and fusion of the first signal and the second signal at the algorithm end. The feature extraction can be manual extraction (for example, mean, variance, correlation, entropy, energy, characteristic frequency, etc. of the time-frequency domain signal) or automatic extraction by an algorithm. The fusion can be merging of the original data or fusion of the features. Finally, the fused data and / or features are identified by an algorithm (support vector machine, neural network) to determine the working state of the sensor, and the sensor is calibrated according to the output data to ensure that the sensor can work normally with the same performance under different working conditions.

[0080] In a second aspect, the embodiments of the present application provide a sensing method applied to the sensing module as described in the first aspect and any possible implementation manner; the sensing method comprises:

[0081] obtaining a first signal and a second signal from the sensing module;

[0082] determining a working state of the sensing module based on a strength relationship between the first signal and the second signal.

[0083] In the embodiments of the present application, a sensing method is provided, which is applied to the sensing module as described in the first aspect and any possible implementation manner. By obtaining a first signal and a second signal from the sensing module and based on a strength relationship between the first signal and the second signal, the strain degree difference between each piezoelectric part of the sensing module can be detected, and the working state of the sensing module can be determined. Compared with the current method of detecting whether a fault occurs only according to the signal strength of the signal output by a unique signal line, the strength relationship between the signals output by the two signal lines in the embodiments of the present application can make the reliability of the fault detection result higher, so that the sensing capability can be improved, and the sensor fault can be fed back in time.

[0084] Optionally, the first signal and / or the second signal can specifically be an electrical signal, such as a voltage value, a current value, a charge value, etc.

[0085] In a possible implementation manner, the determination of the working state of the sensing module comprises:

[0086] determining that the perception module is in a normal state when a difference between the intensity relationship between the first signal and the second signal and the reference threshold is less than a first threshold; or

[0087] determining that the perception module is in an abnormal state when the difference between the intensity relationship between the first signal and the second signal and the reference threshold is not less than the first threshold.

[0088] In the embodiment, a possible specific implementation of determining the working state of the perception module is provided. Specifically, when the difference between the intensity relationship between the first signal and the second signal and the reference threshold is less than the first threshold, it indicates that the difference between the strain degrees of the respective piezoelectric parts is small, and it is detected that the perception module is in a normal state. Conversely, when the difference between the intensity relationship between the first signal and the second signal and the reference threshold is not less than the first threshold, it indicates that the difference between the strain degrees of the respective piezoelectric parts is large, and it is detected that the perception module is in an abnormal state. In the embodiment, the intensity relationship comparison between the signals output by the two signal lines can make the reliability of the fault detection result higher, so as to improve the perception ability and timely feedback the sensor fault.

[0089] Optionally, the reference threshold and / or the first threshold are configurable, which can be a calibration value determined by a large amount of test data when the perception module is shipped, or can be adjusted according to different application scenarios, and the embodiment does not limit this.

[0090] Optionally, the intensity relationship between the first signal and the second signal can refer to the intensity ratio of the first signal and the second signal, or can refer to the intensity difference between the first signal and the second signal, and the embodiment does not limit this.

[0091] Optionally, the intensity ratio of the first signal and the second signal can refer to the ratio of the intensity of the first signal to the intensity of the second signal, or can refer to the ratio of the intensity of the second signal to the intensity of the first signal, and the embodiment does not limit this.

[0092] In a possible implementation, the perception method further includes:

[0093] When it is determined that the perception module is in an abnormal state, a first instruction is issued, the first instruction being used to instruct the perception module to perform self-calibration, or the first instruction being used to instruct a vehicle carrying the perception module to exit an automatic valet parking state.

[0094] In the embodiment, when it is determined that the perception module is in an abnormal state, it indicates that the perception module has a fault, in which case, a first instruction can be issued to instruct the perception module to perform self-calibration, or to instruct the vehicle carrying the perception module to exit the automatic valet parking state. The specific application scenario can be determined according to different application scenarios.

[0095] Optionally, the self-calibration of the perception module can be an operation performed in a scenario where the vehicle is triggered periodically, the self-detection of the perception module is an operation performed in a scenario triggered by the user, and the abnormal detection is an operation performed in a driving scenario. Accordingly, when it is determined that the perception module is in an abnormal state, the corresponding operation will be performed in the above different application scenarios.

[0096] In a possible implementation, the perception method further includes:

[0097] In the case that the perception module receives a fixed vibration signal, the perception module is calibrated based on the first signal and the second signal.

[0098] In the embodiment, a possible specific implementation of calibrating the perception module is provided, specifically, in the case that the perception module receives a fixed vibration signal, the perception module can be calibrated according to the first signal output by the first signal line and the second signal output by the second signal line.

[0099] Optionally, the fixed vibration signal can include but is not limited to, for example, a whistle, passing a deceleration zone at a fixed speed, etc., and the present embodiment does not limit this.

[0100] Optionally, the calibration of the perception module according to the first signal and the second signal can specifically be feature extraction and fusion of the first signal and the second signal at the algorithm end. The feature extraction can be manual extraction (for example, mean, variance, correlation, entropy, energy, characteristic frequency, etc. of the time-frequency domain signal), or automatic extraction by an algorithm. The fusion can be merging of the original data, or fusion of the features. Finally, the fused data and / or features are identified by an algorithm (support vector machine, neural network) to judge the working state of the sensor, and the sensor is calibrated according to the output data to ensure that the sensor can work normally with the same performance under different working conditions.

[0101] In a possible implementation, the perception method further includes:

[0102] In the case that the phase of the first signal and the phase of the second signal are opposite, the first signal and the second signal are denoised.

[0103] In the embodiment, a possible specific implementation of signal noise reduction is provided, specifically, the sensing module adopts a double piezoelectric sheet positive and negative electrode staggered connection scheme, under the same pressure, for example, if the voltage difference between the upper and lower surfaces of the piezoelectric material of one of the two different piezoelectric sheets is positive, due to the positive and negative electrode staggered connection, the voltage difference between the upper and lower surfaces of the piezoelectric material of the other piezoelectric sheet is negative, through the design, for the same vibration source, the phases of the output first signal and the second signal are always opposite, in this case, the noise can be eliminated by using the difference operation, realizing the elimination of global noise, thereby improving the signal-to-noise ratio of the sensor and enhancing the detection ability of the micro signal.

[0104] In a third aspect, the embodiments of the present application provide a sensing device, which comprises units for performing the method according to any one of the second aspect.

[0105] In a possible design, the device comprises:

[0106] The communication unit is configured to acquire a first signal and a second signal from the sensing module.

[0107] The processing unit is configured to determine a working state of the sensing module based on a strength relationship between the first signal and the second signal.

[0108] The processing unit and the communication unit described with respect to the third aspect and any possible implementation can perform the steps as described with respect to the second aspect and the corresponding implementation.

[0109] The technical effects brought by the third aspect and any possible implementation can refer to the introduction of the technical effects of the second aspect and the corresponding implementation.

[0110] Optionally, in the sensing device described in the third aspect and any possible implementation, the sensing device comprises:

[0111] In an implementation, the sensing device is a sensing apparatus. When the sensing device is a sensing apparatus, the communication unit can be a transceiver, or an input / output interface; the processing unit can be at least one processor. Optionally, the transceiver can be a transceiver circuit. Optionally, the input / output interface can be an input / output circuit.

[0112] In another implementation, the sensing device is a chip (system) or circuit used in a sensing apparatus. When the sensing device is a chip (system) or circuit used in a sensing apparatus, the communication unit can be a communication interface (input / output interface), an interface circuit, an output circuit, an input circuit, a pin or related circuit on the chip (system) or circuit; the processing unit can be at least one processor, a processing circuit or a logic circuit, etc.

[0113] In a fourth aspect, an embodiment of the present application provides a perception device, comprising a processor. The processor is coupled with a memory and is configured to execute instructions in the memory to implement the method in the second aspect and any possible implementation thereof. Optionally, the perception device further comprises the memory. Optionally, the perception device further comprises a communication interface, and the processor is coupled with the communication interface.

[0114] In a fifth aspect, an embodiment of the present application provides a chip, comprising: a logic circuit and a communication interface. The communication interface is configured to receive information or send information. The logic circuit is configured to receive information or send information through the communication interface, so that the chip implements the method in the second aspect and any possible implementation thereof.

[0115] In a sixth aspect, an embodiment of the present application provides a computer readable storage medium, configured to store a computer program (which can also be referred to as code or instructions). When the computer program is run on a computer, the method in the second aspect and any possible implementation thereof is implemented.

[0116] In a seventh aspect, an embodiment of the present application provides a computer program product, comprising: a computer program (which can also be referred to as code or instructions). When the computer program is run, the computer executes the method in the second aspect and any possible implementation thereof.

[0117] In an eighth aspect, an embodiment of the present application provides a perception system, comprising: a perception module as described in the first aspect, and a perception device. The perception device is configured to execute the method in the second aspect and any possible implementation thereof.

[0118] In a ninth aspect, an embodiment of the present application provides a movable terminal, comprising at least one of the perception module as described in the first aspect, or the perception device as described in the third aspect, or the perception device as described in the fourth aspect, or the chip as described in the fifth aspect, or the perception system as described in the eighth aspect.

[0119] Optionally, the movable terminal can be a vehicle, for example, a vehicle used in any possible scenario such as a car, a truck, an aircraft, a drone, a slow transport vehicle, a space vehicle, or a ship, and the present application is not limited thereto.

[0120] Optionally, the movable terminal is configured to implement the method described in the second aspect and any possible implementation thereof.

[0121] Further, in the process of executing the method of the second aspect and any possible implementation thereof, the processes of sending information and / or receiving information and the like in the above method can be understood as the process of outputting information by the processor and / or the process of receiving input information by the processor. When outputting information, the processor can output the information to the transceiver (or the communication interface or the sending module) so as to be transmitted by the transceiver. After being output by the processor, the information can also need to be processed further before reaching the transceiver. Similarly, when the processor receives input information, the transceiver (or the communication interface or the sending module) receives the information and inputs the information to the processor. Furthermore, after being received by the transceiver, the information can need to be processed further before being input to the processor.

[0122] For example, the sending information mentioned in the foregoing method can be understood as the output information by the processor. For another example, the receiving information can be understood as the input information received by the processor.

[0123] Optionally, for the transmission, sending and receiving operations and the like involving the processor, if no special description is made, or if it is not contrary to the actual role or inherent logic thereof in the related description, it can be more generally understood as the output and receiving, input operations and the like of the processor.

[0124] Optionally, in the process of executing the method of the second aspect and any possible implementation thereof, the processor can be a processor specially used for executing the method, or can be a processor such as a general processor which executes the method by executing computer instructions in a memory. The memory can be a non-transitory memory such as a read only memory (ROM), which can be integrated on the same chip as the processor, or can be respectively arranged on different chips. The type of the memory and the arrangement mode of the memory and the processor are not limited in the embodiments of the present application.

[0125] In a possible implementation, the at least one memory is located outside the device.

[0126] In another possible implementation, the at least one memory is located inside the device.

[0127] In another possible implementation, part of the at least one memory is located inside the device, and another part of the at least one memory is located outside the device.

[0128] In the present application, the processor and the memory can also be integrated in one device, that is, the processor and the memory can also be integrated together. BRIEF DESCRIPTION OF DRAWINGS

[0129] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0130] Fig. 1 is a schematic diagram of a scene of automatic valet parking provided by the embodiments of the present application;

[0131] Fig. 2 is a schematic diagram of an architecture of a perception system provided by the embodiments of the present application;

[0132] Fig. 3 is a schematic diagram of a structure of a perception module provided by the embodiments of the present application;

[0133] Fig. 4 is a schematic diagram of a cross-section of a perception module provided by the embodiments of the present application;

[0134] Fig. 5 is a three-dimensional structure diagram of a perception module provided by the embodiments of the present application;

[0135] Fig. 6 is a schematic diagram of a cross-section of a perception module provided by the embodiments of the present application;

[0136] Fig. 7 is a schematic diagram of a cross-section of a perception module provided by the embodiments of the present application;

[0137] Fig. 8 is a schematic diagram of a cross-section of another perception module provided by the embodiments of the present application;

[0138] Fig. 9 is a three-dimensional structure diagram of another perception module provided by the embodiments of the present application;

[0139] Fig. 10 is a schematic diagram of a cross-section of still another perception module provided by the embodiments of the present application;

[0140] Fig. 11 is a three-dimensional structure diagram of still another perception module provided by the embodiments of the present application;

[0141] Fig. 12 is a schematic diagram of a cross-section of still another perception module provided by the embodiments of the present application;

[0142] Fig. 13 is a three-dimensional structure diagram of still another perception module provided by the embodiments of the present application;

[0143] Fig. 14 is a schematic diagram of a cross-section of still another perception module provided by the embodiments of the present application;

[0144] Fig. 15 is a schematic diagram of a flow of a perception method provided by the embodiments of the present application;

[0145] Fig. 16 is a schematic diagram of a structure of a perception device provided by the embodiments of the present application;

[0146] FIG. 17 is a structural schematic diagram of an electronic device according to an embodiment of the present application;

[0147] FIG. 18 is a structural schematic diagram of a chip according to an embodiment of the present application. DETAILED DESCRIPTION

[0148] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described below with reference to the drawings.

[0149] The terms "first" and "second" and the like in the specification of the present application, claims, and drawings are used to distinguish different objects, and are not used to describe a particular order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device, etc. including a series of steps or units is not limited to the listed steps or units, but can optionally include other steps or units not listed, or can optionally include other steps or units inherent to the process, method, product, or device, etc.

[0150] In this document, "embodiment" means that the specific features, structures, or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment is referred to, nor does it mean that independent or alternative embodiments are mutually exclusive or alternative to each other. It is explicitly and implicitly understood by those skilled in the art that, unless otherwise specified and logically contradictory, the terms and / or descriptions between various embodiments are consistent and can be mutually referred to, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0151] It should be understood that in the present application, "at least one" means one or more, "multiple" means two or more, "at least two" means two or three and more, and "and / or" is used to describe the association between the associated objects, which means that there can be three relationships, for example, "A and / or B" can mean that there are three cases of only A, only B, and A and B at the same time, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b, or c can mean a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0152] In the description of the present application, the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", "left", "side" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. It should be understood that the Z direction, Y direction and the like mentioned in some embodiments of the present application are with reference to the XYZ rectangular coordinate system to facilitate the description of the features in the present application, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation.

[0153] In the embodiments of the present application, the "end" appearing in the words "one end", "the other end", "end", "free end", "upper end", "lower end", "connecting end" and the like is not limited to the end, end point or end face, but also includes the part extending an axial distance and / or radial distance from the end, end point or end face on the device or element to which the end, end point or end face belongs.

[0154] It should be noted that in the present application, "indication" can include direct indication, indirect indication, display indication, implicit indication. When describing that certain indication information is used to indicate A, it can be understood that the indication information carries A, directly indicates A, or indirectly indicates A.

[0155] In the present application, the information indicated by the indication information is referred to as the to-be-indicated information. In the specific implementation process, there are many ways to indicate the to-be-indicated information, for example but not limited to, the to-be-indicated information can be directly indicated, such as the to-be-indicated information itself or the index of the to-be-indicated information. The to-be-indicated information can also be indirectly indicated by indicating other information, where the other information and the to-be-indicated information have an association relationship. The to-be-indicated information can also be indicated only by a part, and the other part of the to-be-indicated information is known or agreed in advance. For example, the indication of a specific information can also be achieved by means of the arrangement order of each information agreed in advance (for example, specified by a protocol), thereby reducing the indication overhead to a certain extent. The to-be-indicated information can be sent as a whole, or can be sent separately in multiple sub-information, and the sending period and / or sending opportunity of these sub-information can be the same or different. The specific sending method is not limited by the present application. Among them, the sending period and / or sending opportunity of these sub-information can be predefined, for example, predefined according to a protocol, or can be configured by the transmitting end device by sending configuration information to the receiving end device.

[0156] It should be noted that in this application, "sending" can be understood as "output", and "receiving" can be understood as "input". "Sending information to A" means that A is the destination of information transmission, and "sending information to A" is not limited to direct sending on the air interface. "Sending information to A" includes directly sending information to A, and also includes indirectly sending information to A through a transmitter, so "sending information to A" can also be understood as "outputting information to A". Similarly, "receiving information from A" means that the source of the information is A, which includes directly receiving information from A, and also includes indirectly receiving information from A through a receiver, so "receiving information from A" can also be understood as "inputting information from A".

[0157] The application provides a sensing module, a sensing method and related devices, which are applied to the field of sensor technology, such as a sensing module in a structure acoustic sensor and a corresponding sensing method. In order to better understand the technical solutions of the application, the related terms and concepts that may be involved in the embodiments of the application will be introduced first.

[0158] Automated valet parking (AVP): can autonomously find an idle parking space and then park the vehicle in the idle parking space without a driver. However, during the process of unmanned parking, there is a certain probability of missing detection of visual, radar and other sensors, and there is a risk of colliding with pedestrians. More importantly, the sensors currently equipped on vehicles cannot detect such collisions, and the vehicle will continue to move forward after the first pedestrian collision in the case of unmanned driving, causing secondary injury.

[0159] Structure acoustic sensor (SAS): When a solid structure is touched or hit, acoustic vibration modes that can be transmitted are generated inside and on the surface of the solid structure. Such vibrations can be received by a structure acoustic sensor and converted into an electrical signal. The basic working principle is that piezoelectric materials (piezoelectric ceramics, piezoelectric crystals, piezoelectric films, etc.) convert mechanical vibrations into electrical signals through the piezoelectric effect.

[0160] The structure acoustic sensor has extremely high detection sensitivity and can detect extremely small vibrations inside and on the surface of a solid. It can be used as the last line of defense for an automated valet parking system for a vehicle. When a vehicle collision occurs, the resulting vibrations will be transmitted along the vehicle body shell to the sensor, and the sensor will transmit the collected electrical signals to the processor for analysis. When the processor confirms that the received signal is a collision signal, a braking instruction is quickly issued to avoid secondary collision.

[0161] Specifically, refer to FIG. 1, which is a schematic diagram of an automated valet parking scenario provided by an embodiment of the application.

[0162] As shown in FIG. 1, the vehicle 101 starts the automatic valet parking function, and autonomously finds an empty parking space 102 and intends to park into the empty parking space 102. During the process of the vehicle 101 autonomously finding the parking space and / or the vehicle 101 parking into the empty parking space 102, the pedestrian 103 suddenly enters the area of the empty parking space 102. The sensors such as vision, radar, etc. of the vehicle 101 have a certain probability of missing detection, and there is a risk of colliding with the pedestrian 103.

[0163] The current sensors equipped in the vehicle 101 are difficult to quickly detect such a collision, and after the first collision between the vehicle 101 and the pedestrian 103, the vehicle 101 still continues to park, causing secondary damage to the pedestrian 103.

[0164] The structural acoustic sensor can be used as the last line of defense for the automatic valet parking of the vehicle 101. After the first collision between the vehicle 101 and the pedestrian 103, the vibration generated will be transmitted along the vehicle body shell to the structural acoustic sensor, and the structural acoustic sensor will transmit the collected electrical signals to the processor for analysis. When the processor confirms that the received signal is a collision signal, a brake command is quickly issued to avoid secondary collision with the pedestrian 103.

[0165] At present, the common structural acoustic sensor adopts a two-wire scheme, that is, the signal line and the ground line are respectively connected to the upper surface and the lower surface (or the positive electrode and the negative electrode) of the piezoelectric material.

[0166] However, the sensing ability of this wiring scheme is weak, and it cannot timely feedback the sensor failure. In addition, the wiring scheme has poor robustness to noise and poor accuracy of self-calibration.

[0167] In view of this, the embodiment of the present application provides a sensing module, and based on the sensing module, a new sensing method and sensing system are correspondingly proposed, which are applied to the field of sensor technology, such as the sensing module in the structural acoustic sensor and the corresponding sensing method and sensing system. By adopting a three-wire scheme, the sensing ability can be improved, and the sensor failure can be timely fed back.

[0168] Please refer to FIG. 2, which is an architecture schematic diagram of a sensing system provided by the embodiment of the present application.

[0169] As shown in FIG. 2, the sensing system is applied to the AVP system of the intelligent vehicle. When the AVP is started, the vehicle is in the state of unmanned driving, and the structural acoustic sensor in the sensing system starts to work. When the structural acoustic sensor detects a micro-collision signal, the sensing system issues an instruction to instruct the vehicle to exit the AVP and brake, otherwise the vehicle continues to normally drive.

[0170] The structural acoustic sensor in the perception system adopts a three-wire scheme, that is, three wires are connected at the end of the structural acoustic sensor, which are a first signal line, a second signal line and a ground line. The three wires are respectively connected to three mutually insulated regions on the internal piezoelectric material (for example, piezoelectric ceramic) of the structural acoustic sensor. By analyzing the signals of the three-wire scheme, collision detection, calibration and noise reduction of the structural acoustic sensor and other functions can be realized.

[0171] It can be understood that the perception system in the embodiments of the present application can be applied not only to the AVP system of the intelligent vehicle, but also to other scenarios involving micro-impact detection, such as the sentinel mode of the intelligent vehicle, knock perception, battery pack safety, etc. The embodiments of the present application do not limit this.

[0172] Please refer to FIG. 3, which is a structural schematic diagram of a perception module provided by an embodiment of the present application.

[0173] As shown in FIG. 3, the perception module 30 is applied to a structural acoustic sensor. The perception module 30 specifically includes but is not limited to:

[0174] a first piezoelectric part 301, a second piezoelectric part 302 and a third piezoelectric part 303.

[0175] The first piezoelectric part 301, the second piezoelectric part 302 and the third piezoelectric part 303 are mutually insulated.

[0176] At least part of the first piezoelectric part 301 and at least part of the third piezoelectric part 303 are arranged on opposite sides of the piezoelectric material, and / or at least part of the second piezoelectric part 302 and at least part of the third piezoelectric part 303 are arranged on opposite sides of the piezoelectric material.

[0177] Optionally, the piezoelectric material can include but is not limited to at least one of the following: piezoelectric ceramic, piezoelectric crystal, piezoelectric film.

[0178] The first piezoelectric part 301 is used to connect the first signal line. The first signal line is used to output a first signal. The first signal is used to represent the degree of strain between the first piezoelectric part 301 and the third piezoelectric part 303.

[0179] The second piezoelectric part 302 is used to connect the second signal line. The second signal line is used to output a second signal. The second signal is used to represent the degree of strain between the second piezoelectric part 302 and the third piezoelectric part 303.

[0180] Optionally, after the perception module 30 is subjected to vibration, the first signal line correspondingly outputs the first signal, and the second signal line correspondingly outputs the second signal. The first signal and / or the second signal can be an electrical signal, such as a voltage value, a current value, a charge value, etc.

[0181] The third piezoelectric part 303 is used for connecting a third signal line, and the third signal line is grounded.

[0182] The working state of the sensing module 30 is associated with the intensity relationship between the first signal and the second signal.

[0183] It can be understood that the sensing module 30 adopts a three-wire scheme, and by analyzing the intensity relationship between the first signal and the second signal, the difference in strain degree between the piezoelectric parts can be detected, and then whether the sensing module 30 fails can be detected, so as to determine the working state of the sensing module 30.

[0184] It can be understood that, compared with the double-wire scheme adopted by the current structural acoustic sensor, which only detects whether a failure occurs according to the signal intensity output by a unique signal line, the sensing module 30 in the embodiment of the present application can make the reliability of the failure detection result higher by comparing the intensity relationship between the two signals, so as to realize improving the sensing capability and timely feeding back the sensor failure.

[0185] In a possible embodiment, the working state of the sensing module 30 is associated with the intensity relationship between the first signal and the second signal, which can be specifically divided into the following cases for illustration.

[0186] Case one:

[0187] When the difference between the intensity relationship of the first signal and the second signal and the reference threshold is less than the first threshold, the sensing module 30 is in a normal state.

[0188] It can be understood that when the difference between the intensity relationship of the first signal and the second signal and the reference threshold is less than the first threshold, it indicates that the difference in strain degree between the piezoelectric parts is small, and the sensing module 30 is detected to be in a normal state.

[0189] Case two:

[0190] When the difference between the intensity relationship of the first signal and the second signal and the reference threshold is not less than the first threshold, the sensing module 30 is in an abnormal state.

[0191] It can be understood that when the difference between the intensity relationship of the first signal and the second signal and the reference threshold is not less than the first threshold, it indicates that the difference in strain degree between the piezoelectric parts is large, and the sensing module 30 is detected to be in an abnormal state.

[0192] Optionally, in the case one and the case two, the reference threshold and / or the first threshold are configurable, which can be a calibration value determined by a large amount of test data when the sensing module 30 is shipped, or can be adjusted according to different application scenarios, and the embodiments of the present application do not limit this.

[0193] Optionally, in the case one and the case two, the intensity relationship between the first signal and the second signal can refer to an intensity ratio of the first signal and the second signal, or can refer to an intensity difference of the first signal and the second signal, and the embodiments of the present application do not make any limitation in this regard.

[0194] Optionally, in the case one and the case two, the intensity ratio of the first signal and the second signal can refer to a ratio of the intensity of the first signal to the intensity of the second signal, or can refer to a ratio of the intensity of the second signal to the intensity of the first signal, and the embodiments of the present application do not make any limitation in this regard.

[0195] Exemplarily, the first signal is denoted by a, the second signal is denoted by b, the intensity ratio is denoted by y, the reference threshold is denoted by y0, and the first threshold is denoted by Δ1, and then y = a / b. If |y-y0| < Δ1, it is detected that the perception module 30 is in a normal state; if |y-y0| ≥ Δ1, it is detected that the perception module 30 is in an abnormal state.

[0196] Optionally, when the perception module 30 is in a normal state, ideally, the intensity ratio of the first signal and the second signal is a fixed ratio, that is, y is a fixed value.

[0197] Optionally, when the perception module 30 is in an abnormal state, the perception module 30 can perform self-calibration, or the vehicle carrying the perception module 30 exits the automatic valet parking state.

[0198] It can be understood that when the perception module 30 is in an abnormal state, it indicates that the perception module 30 has a fault, and in this case, self-calibration of the perception module 30 can be performed, or the vehicle carrying the perception module 30 exits the automatic valet parking state, which can be determined according to different application scenarios.

[0199] Optionally, the self-calibration of the perception module 30 can be an operation performed in a scenario triggered by the vehicle periodically, the self-detection of the perception module 30 is an operation performed in a scenario triggered by the user, and the abnormal detection is an operation performed in a driving scenario. Accordingly, when the perception module 30 is in an abnormal state, corresponding operations will be performed in the above different application scenarios.

[0200] In a possible embodiment, in the case that the perception module 30 receives a fixed vibration signal, the first signal and the second signal are used to calibrate the perception module 30.

[0201] Optionally, the fixed vibration signal can include but is not limited to, for example, sounding a horn, passing a deceleration zone at a fixed speed, and the like, and the embodiments of the present application do not make any limitation in this regard.

[0202] Optionally, the perception module is calibrated according to the first signal and the second signal, specifically, the first signal and the second signal can be feature extracted and fused at the algorithm end. The feature extraction can be manual extraction (such as mean, variance, correlation, entropy, energy, characteristic frequency, etc. of the time-frequency domain signal), or automatic extraction by algorithm. The fusion can be a combination of raw data, or a fusion of features. Finally, the fused data and / or features are identified by an algorithm (support vector machine, neural network) to determine the working state of the sensor, and the sensor is calibrated according to the output data to ensure that the sensor can work normally with the same performance under different working conditions.

[0203] In a possible embodiment, to achieve the above functions, the first piezoelectric part 301, the second piezoelectric part 302 and the third piezoelectric part 303 in the perception module 30 can be designed in different structures, specifically, but not limited to, the following structure design schemes:

[0204] Structure design scheme one: three-wire connection scheme of double piezoelectric sheets.

[0205] In the structure design scheme one, the perception module 30 includes a first piezoelectric sheet and a second piezoelectric sheet.

[0206] The first piezoelectric part 301 includes a part corresponding to the first side of the first piezoelectric sheet, the second piezoelectric part 302 includes a part corresponding to the second side of the second piezoelectric sheet, and the third piezoelectric part 303 includes a part corresponding to the third side of the first piezoelectric sheet and a part corresponding to the fourth side of the second piezoelectric sheet.

[0207] The first side of the first piezoelectric sheet and the third side of the first piezoelectric sheet are located on opposite sides of the first piezoelectric sheet, the second side of the second piezoelectric sheet is on the same side as the first side of the first piezoelectric sheet, the fourth side of the second piezoelectric sheet is on the same side as the third side of the first piezoelectric sheet, and the first side of the first piezoelectric sheet and the second side of the second piezoelectric sheet are insulated from each other.

[0208] Specifically, refer to FIGS. 4-5, FIG. 4 is a cross-sectional view of a perception module according to an embodiment of the present application, and FIG. 5 is a perspective view of a perception module according to an embodiment of the present application. It can be understood that the cross-sectional view of the perception module shown in FIG. 4 is the cross-sectional view corresponding to the perspective view of the perception module shown in FIG. 5.

[0209] As shown in FIGS. 4 and 5, the perception module 30 includes a first piezoelectric sheet 401 and a second piezoelectric sheet 402.

[0210] The first side 401a of the first piezoelectric sheet 401 corresponds to the first piezoelectric part 301, the second side 402a of the second piezoelectric sheet 402 corresponds to the second piezoelectric part 302, and the third side 401b of the first piezoelectric sheet 401 and the fourth side 402b of the second piezoelectric sheet 402 jointly correspond to the third piezoelectric part 303.

[0211] It can be understood that the first side 401a of the first piezoelectric sheet 401 is connected to the first signal line for outputting the first signal. The second side 402a of the second piezoelectric sheet 402 is connected to the second signal line for outputting the second signal. The third side 401b of the first piezoelectric sheet 401 and the fourth side 402b of the second piezoelectric sheet 402 are connected to the third signal line for grounding. The first side 401a of the first piezoelectric sheet 401 and the second side 402a of the second piezoelectric sheet 402 are mutually insulated.

[0212] Through the first piezoelectric sheet 401 and the second piezoelectric sheet 402 in the structural design scheme one, the reliability of the fault detection result is higher based on the intensity relationship comparison between the first signal and the second signal, so that the sensing ability can be improved, and the sensor fault can be fed back in time.

[0213] Optionally, the first piezoelectric sheet 401 and the second piezoelectric sheet 402 can be large and small, or the same size, and the embodiments of the present application do not limit this.

[0214] Optionally, the first side 401a of the first piezoelectric sheet 401 corresponding to the first piezoelectric part 301 is coated with a conductive material (such as conductive silver paste), so as to have conductive performance and form an electrode. Similarly, the second side 402a of the second piezoelectric sheet 402 corresponding to the second piezoelectric part 302 and the third side 401b of the first piezoelectric sheet 401 and the fourth side 402b of the second piezoelectric sheet 402 corresponding to the third piezoelectric part 303 are also coated with a conductive material.

[0215] Optionally, the conductive material can cover the part of the first piezoelectric part 301 (i.e. the part corresponding to the first side 401a of the first piezoelectric sheet 401) and the part of the second piezoelectric part 302 (i.e. the part corresponding to the second side 402a of the second piezoelectric sheet 402) to form an equipotential surface and improve the accuracy of abnormal detection.

[0216] Optionally, the conductive material can cover part of the part of the first piezoelectric part 301 and the part of the second piezoelectric part 302. In this case, the area of the covered region of the conductive material coating the first piezoelectric part 301 and the second piezoelectric part 302 can be kept consistent to improve the accuracy of abnormal detection.

[0217] Optionally, the first piezoelectric part 301 can include the part corresponding to the fifth side of the first piezoelectric sheet in addition to the part corresponding to the first side of the first piezoelectric sheet. The first piezoelectric part 301 and the third piezoelectric part 303 are insulated from each other.

[0218] Specifically, refer to FIG. 6, which is a cross-sectional view of a sensing module provided by an embodiment of the present application. It can be understood that the cross-sectional view of the sensing module shown in FIG. 6 can be regarded as a reasonable deformation or supplement of the cross-sectional view of the sensing module shown in FIG. 4, or as a separate embodiment, and the present application does not limit this.

[0219] As shown in FIG. 6, the sensing module 30 includes a first piezoelectric sheet 401 and a second piezoelectric sheet 402.

[0220] The part corresponding to the first side 401a of the first piezoelectric sheet 401 and the part corresponding to the fifth side 401c of the first piezoelectric sheet 401 constitute the first piezoelectric part 301, the part corresponding to the second side 402a of the second piezoelectric sheet 402 constitutes the second piezoelectric part 302, and the part corresponding to the third side 401b of the first piezoelectric sheet 401 and the part corresponding to the fourth side 402b of the second piezoelectric sheet 402 jointly constitute the third piezoelectric part 303.

[0221] It can be understood that the part corresponding to the first side 401a of the first piezoelectric sheet 401 and the part corresponding to the fifth side 401c of the first piezoelectric sheet 401 are connected to the first signal line for outputting the first signal. The part corresponding to the second side 402a of the second piezoelectric sheet 402 is connected to the second signal line for outputting the second signal. The part corresponding to the third side 401b of the first piezoelectric sheet 401 and the part corresponding to the fourth side 402b of the second piezoelectric sheet 402 are connected to the third signal line for grounding. The part corresponding to the fifth side 401c of the first piezoelectric sheet 401 and the part corresponding to the third side 401b of the first piezoelectric sheet 401 are insulated from each other.

[0222] Through the first piezoelectric sheet 401 and the second piezoelectric sheet 402, the reliability of the fault detection result is higher based on the intensity relationship comparison between the first signal and the second signal.

[0223] Optionally, the first piezoelectric part 301 can include the entire part corresponding to the fifth side of the first piezoelectric sheet and the part corresponding to the third side of the first piezoelectric sheet in addition to the part corresponding to the first side of the first piezoelectric sheet. The first piezoelectric part 301 and the third piezoelectric part 303 are insulated from each other.

[0224] Specifically, refer to FIG. 7, which is a cross-sectional view of a sensing module according to an embodiment of the present application. It can be understood that the cross-sectional view of the sensing module shown in FIG. 7 can be regarded as a reasonable deformation or supplement of the cross-sectional view of the sensing module shown in FIG. 4, or as a separate embodiment, and the present application does not limit this.

[0225] As shown in FIG. 7, the sensing module 30 includes a first piezoelectric sheet 401 and a second piezoelectric sheet 402.

[0226] The first side 401a of the first piezoelectric sheet 401, all of the fifth side 401c of the first piezoelectric sheet 401, and part of the third side 401b of the first piezoelectric sheet 401 constitute the first piezoelectric part 301, the second side 402a of the second piezoelectric sheet 402 constitutes the second piezoelectric part 302, and part of the third side 401b of the first piezoelectric sheet 401 and the fourth side 402b of the second piezoelectric sheet 402 jointly constitute the third piezoelectric part 303.

[0227] It can be understood that the first side 401a of the first piezoelectric sheet 401, all of the fifth side 401c of the first piezoelectric sheet 401, and part of the third side 401b of the first piezoelectric sheet 401 are connected to a first signal line for outputting a first signal. The second side 402a of the second piezoelectric sheet 402 is connected to a second signal line for outputting a second signal. Part of the third side 401b of the first piezoelectric sheet 401 and the fourth side 402b of the second piezoelectric sheet 402 are connected to a third signal line for grounding. Part of the third side 401b of the first piezoelectric sheet 401 and another part of the third side 401b of the first piezoelectric sheet 401 are insulated from each other.

[0228] Through the first piezoelectric sheet 401 and the second piezoelectric sheet 402, the reliability of the fault detection result is higher based on the intensity relationship comparison between the first signal and the second signal.

[0229] Optionally, in the above structural design scheme one, the third side 401b of the first piezoelectric sheet 401 and the fourth side 402b of the second piezoelectric sheet 402 are arranged on the PCB.

[0230] It can be understood that at this time, the third side 401b of the first piezoelectric sheet 401 and the fourth side 402b of the second piezoelectric sheet 402 are attached to the PCB and are grounded.

[0231] Optionally, in the above structural design scheme one, the piezoelectric material of the first piezoelectric sheet 401 and the second piezoelectric sheet 402 is the same.

[0232] It can be understood that the piezoelectric materials of the first piezoelectric sheet 401 and the second piezoelectric sheet 402 are the same, the responses of the electrical signals of the two can be kept consistent, so that the reliability of the fault detection result is higher, and the sensor fault is fed back in time.

[0233] Alternatively, the piezoelectric materials of the first piezoelectric sheet 401 and the second piezoelectric sheet 402 can also be different, at this time, the sensitivities of the electrical signals generated by the first piezoelectric sheet 401 and the second piezoelectric sheet 402 to vibration are inconsistent, and can be affected by factors such as ambient temperature and service life, resulting in inconsistent responses of the electrical signals. In this case, the subsequent algorithm can be used to compensate the response electrical signals to offset the difference in sensitivity of the electrical signals generated by different piezoelectric materials to vibration, the influence of factors such as ambient temperature and service life.

[0234] The second structural design scheme is a three-wire connection scheme of a single piezoelectric sheet.

[0235] In the second structural design scheme, the sensing module 30 includes a third piezoelectric sheet.

[0236] The first piezoelectric part 301 includes a first part corresponding to a first side of the third piezoelectric sheet, the second piezoelectric part 302 includes a second part corresponding to the first side of the third piezoelectric sheet, and the third piezoelectric part 303 includes a part corresponding to a second side of the third piezoelectric sheet.

[0237] The first side of the third piezoelectric sheet and the second side of the third piezoelectric sheet are located on opposite sides of the third piezoelectric sheet, and the first part corresponding to the first side of the third piezoelectric sheet and the second part corresponding to the first side of the third piezoelectric sheet are insulated from each other.

[0238] For details, refer to FIGS. 8 to 9. FIG. 8 is a cross-sectional view of another sensing module provided by an embodiment of the present application, and FIG. 9 is a perspective view of another sensing module provided by an embodiment of the present application. It can be understood that the cross-sectional view of the sensing module shown in FIG. 8 is the cross-sectional view corresponding to the perspective view of the sensing module shown in FIG. 9.

[0239] As shown in FIGS. 8 and 9, the sensing module 30 includes a third piezoelectric sheet 403.

[0240] The first part corresponding to the first side 403a of the third piezoelectric sheet 403 constitutes the first piezoelectric part 301, the second part corresponding to the first side 403a of the third piezoelectric sheet 403 constitutes the second piezoelectric part 302, and the part corresponding to the second side 403b of the third piezoelectric sheet 403 constitutes the third piezoelectric part 303.

[0241] It can be understood that the first side 403a of the third piezoelectric sheet 403 corresponds to the first part connected to the first signal line for outputting the first signal. The first side 403a of the third piezoelectric sheet 403 corresponds to the second part connected to the second signal line for outputting the second signal. The second side 403b of the third piezoelectric sheet 403 corresponds to the part connected to the third signal line for grounding. The first part corresponding to the first side 403a of the third piezoelectric sheet 403 and the second part corresponding to the first side 403a of the third piezoelectric sheet 403 are insulated from each other.

[0242] Through the third piezoelectric sheet 403 in the second structure design scheme, the reliability of the fault detection result is higher based on the intensity relationship comparison between the first signal and the second signal, so that the sensing ability can be improved, and the sensor fault can be fed back in time.

[0243] Moreover, compared with the three-wire connection scheme of the double piezoelectric sheet (i.e., the first structure design described above), the three-wire connection scheme of the single piezoelectric sheet is adopted in the embodiment of the application, which can significantly reduce the cost of the device, and does not need to consider the specification difference between the two piezoelectric sheets, which helps to improve the self-checking ability of the sensor.

[0244] Optionally, the first part and the second part corresponding to the first side 403a of the third piezoelectric sheet 403 can be large and small, or the same size, which is not limited in the embodiment of the application.

[0245] Optionally, the first part corresponding to the first side 403a of the third piezoelectric sheet 403 of the first piezoelectric part 301 is coated with a conductive material (such as conductive silver paste), so as to have conductive performance and form an electrode. Similarly, the second part corresponding to the first side 403a of the third piezoelectric sheet 403 of the second piezoelectric part 302 and the part corresponding to the second side 403b of the third piezoelectric sheet 403 of the third piezoelectric part 303 are also coated with a conductive material.

[0246] Optionally, the conductive material can cover the part of the first piezoelectric part 301 (i.e., the first part corresponding to the first side 403a of the third piezoelectric sheet 403) and the part of the second piezoelectric part 302 (i.e., the second part corresponding to the first side 403a of the third piezoelectric sheet 403) to form an equipotential surface and improve the accuracy of abnormal detection.

[0247] Optionally, the conductive material can cover part of the part of the first piezoelectric part 301 and the part of the second piezoelectric part 302. In this case, the coverage area of the conductive material coating the first piezoelectric part 301 and the second piezoelectric part 302 can remain consistent, improving the accuracy of abnormal detection.

[0248] Optionally, in the second structure design scheme, the second side 403b of the third piezoelectric sheet 403 is arranged on the PCB.

[0249] It can be understood that at this time, the second side 403b of the third piezoelectric sheet 403 is attached to the PCB and grounded.

[0250] Structural design scheme three: three-wire connection scheme of single piezoelectric sheet coplanar wiring.

[0251] In the third structural design scheme, the sensing module 30 includes a fourth piezoelectric sheet.

[0252] The first piezoelectric part 301 includes a first part corresponding to the first side of the fourth piezoelectric sheet, the second piezoelectric part 302 includes a second part corresponding to the first side of the fourth piezoelectric sheet, and the third piezoelectric part 303 includes a third part corresponding to the first side of the fourth piezoelectric sheet.

[0253] The first part corresponding to the first side of the fourth piezoelectric sheet, the second part corresponding to the first side of the fourth piezoelectric sheet, and the third part corresponding to the first side of the fourth piezoelectric sheet are insulated from each other.

[0254] For details, please refer to FIGS. 10-11. FIG. 10 is a cross-sectional view of another sensing module according to an embodiment of the present application, and FIG. 11 is a perspective view of another sensing module according to an embodiment of the present application. It can be understood that the cross-sectional view of the sensing module shown in FIG. 10 corresponds to the cross-sectional view of the perspective structure of the sensing module shown in FIG. 11.

[0255] As shown in FIGS. 10 and 11, the sensing module 30 includes a fourth piezoelectric sheet 404.

[0256] The first part corresponding to the first side 404a of the fourth piezoelectric sheet 404 constitutes the first piezoelectric part 301, the second part corresponding to the first side 404a of the fourth piezoelectric sheet 404 constitutes the second piezoelectric part 302, and the third part corresponding to the first side 404a of the fourth piezoelectric sheet 404 constitutes the third piezoelectric part 303.

[0257] It can be understood that the first part corresponding to the first side 404a of the fourth piezoelectric sheet 404 is connected to the first signal line for outputting the first signal. The second part corresponding to the first side 404a of the fourth piezoelectric sheet 404 is connected to the second signal line for outputting the second signal. The third part corresponding to the first side 404a of the fourth piezoelectric sheet 404 is connected to the third signal line for grounding. The first part corresponding to the first side 404a of the fourth piezoelectric sheet 404, the second part corresponding to the first side 404a of the fourth piezoelectric sheet 404, and the third part corresponding to the first side 404a of the fourth piezoelectric sheet 404 are insulated from each other.

[0258] Through the fourth piezoelectric sheet 404 in the third structural design scheme, the reliability of the fault detection result is higher based on the intensity relationship comparison between the first signal and the second signal, so that the sensing ability can be improved, and the sensor fault can be fed back in time.

[0259] In addition, compared with the three-wire connection scheme of the double piezoelectric sheet (i.e., the first structural design), the three-wire connection scheme of the single piezoelectric sheet is adopted in the embodiment of the application, which can significantly reduce the cost of the device, and does not need to consider the specification difference between the two piezoelectric sheets, and helps to improve the self-checking ability of the sensor.

[0260] In addition, compared with the three-wire connection scheme of the single piezoelectric sheet (i.e., the second structural design), the three-wire connection scheme of the single piezoelectric sheet is adopted in the embodiment of the application, which can significantly reduce the cost of the device, and does not need to consider the specification difference between the two piezoelectric sheets, and helps to improve the self-checking ability of the sensor.

[0261] Optionally, the first side 404a of the fourth piezoelectric sheet 404 corresponds to the first part, the second part and the third part, which can be different or the same, and the embodiment of the application does not limit this.

[0262] Optionally, in addition to the first part corresponding to the first side 404a of the fourth piezoelectric sheet 404, the first piezoelectric part 301 can also include but is not limited to the part corresponding to the second side 404b of the fourth piezoelectric sheet 404, which is located on the opposite side of the fourth piezoelectric sheet 404 with the first side 404a of the fourth piezoelectric sheet 404.

[0263] Optionally, in addition to the second part corresponding to the first side 404a of the fourth piezoelectric sheet 404, the second piezoelectric part 302 can also include but is not limited to the part corresponding to the second side 404b of the fourth piezoelectric sheet 404, which is located on the opposite side of the fourth piezoelectric sheet 404 with the first side 404a of the fourth piezoelectric sheet 404.

[0264] Optionally, the first part corresponding to the first side 404a of the fourth piezoelectric sheet 404 of the first piezoelectric part 301 is coated with a conductive material (such as conductive silver paste), so as to have a conductive property and form an electrode. Similarly, the second part corresponding to the first side 404a of the fourth piezoelectric sheet 404 of the second piezoelectric part 302 and the third part corresponding to the first side 404a of the fourth piezoelectric sheet 404 of the third piezoelectric part 303 are also coated with a conductive material.

[0265] Optionally, the conductive material can cover the part of the first piezoelectric part 301 (i.e. the first part corresponding to the first side 404a of the fourth piezoelectric sheet 404) and the part of the second piezoelectric part 302 (i.e. the second part corresponding to the first side 404a of the fourth piezoelectric sheet 404) to form an equipotential surface and improve the accuracy of anomaly detection.

[0266] Optionally, the conductive material can cover part of the part of the first piezoelectric part 301 and the part of the second piezoelectric part 302. In this case, the area of the covered region of the first piezoelectric part 301 and the second piezoelectric part 302 can be kept consistent, thereby improving the accuracy of anomaly detection.

[0267] Optionally, in the third structure design scheme, the first side 404a of the fourth piezoelectric sheet 404 is arranged on the PCB.

[0268] It can be understood that, at this time, the first part corresponding to the first side 404a of the fourth piezoelectric sheet 404, the second part corresponding to the first side 404a of the fourth piezoelectric sheet 404 and the third part corresponding to the first side 404a of the fourth piezoelectric sheet 404 are attached to the PCB, and the third part corresponding to the first side 404a of the fourth piezoelectric sheet 404 is grounded.

[0269] By integrating the three signal lines (the first signal line, the second signal line and the third signal line) on one side of the PCB, the jumper connection between the second side 404b of the fourth piezoelectric sheet 404 (the side opposite to the first side 404a of the fourth piezoelectric sheet 404) and the PCB can be avoided, thereby improving the stability of the device.

[0270] Structure design scheme four: three-wire connection scheme with the upper and lower surfaces of the double piezoelectric sheets being staggered.

[0271] In the fourth structure design scheme, the sensing module 30 includes a fifth piezoelectric sheet and a sixth piezoelectric sheet.

[0272] The first piezoelectric part 301 includes a part corresponding to the first side of the fifth piezoelectric sheet, the second piezoelectric part 302 includes a part corresponding to the second side of the sixth piezoelectric sheet, and the third piezoelectric part 303 includes a part corresponding to the third side of the fifth piezoelectric sheet and a part corresponding to the fourth side of the sixth piezoelectric sheet.

[0273] The first side of the fifth piezoelectric sheet and the third side of the fifth piezoelectric sheet are located on opposite sides of the fifth piezoelectric sheet, the fourth side of the sixth piezoelectric sheet is on the same side as the first side of the fifth piezoelectric sheet, the second side of the sixth piezoelectric sheet is on the same side as the third side of the fifth piezoelectric sheet, and the fifth piezoelectric sheet and the sixth piezoelectric sheet are insulated from each other.

[0274] Specifically, refer to FIG. 12 and FIG. 13, FIG. 12 is a cross-sectional view of another sensing module provided by the embodiment of the application, and FIG. 13 is a perspective view of another sensing module provided by the embodiment of the application. It can be understood that the cross-sectional view of the sensing module shown in FIG. 12 is the corresponding cross-sectional view of the perspective view of the sensing module shown in FIG. 13.

[0275] As shown in FIG. 12 and FIG. 13, the sensing module 30 includes a fifth piezoelectric sheet 405 and a sixth piezoelectric sheet 406.

[0276] The first side 405a of the fifth piezoelectric sheet 405 corresponds to the first piezoelectric part 301, the second side 406a of the sixth piezoelectric sheet 406 corresponds to the second piezoelectric part 302, and the third side 405b of the fifth piezoelectric sheet 405 and the fourth side 406b of the sixth piezoelectric sheet 406 together correspond to the third piezoelectric part 303.

[0277] It can be understood that the part corresponding to the first side 405a of the fifth piezoelectric sheet 405 is connected to the first signal line for outputting the first signal. The part corresponding to the second side 406a of the sixth piezoelectric sheet 406 is connected to the second signal line for outputting the second signal. The part corresponding to the third side 405b of the fifth piezoelectric sheet 405 and the part corresponding to the fourth side 406b of the sixth piezoelectric sheet 406 are connected to the third signal line for grounding. The first side 405a of the fifth piezoelectric sheet 405 and the second side 406a of the sixth piezoelectric sheet 406 are insulated from each other.

[0278] Through the fifth piezoelectric sheet 405 and the sixth piezoelectric sheet 406 in the fourth structural design scheme, the reliability of the fault detection result is higher based on the intensity relationship comparison between the first signal and the second signal, so that the sensing capability can be improved, and the sensor fault can be fed back in time.

[0279] Optionally, the fifth piezoelectric sheet 405 and the sixth piezoelectric sheet 406 can be large and small, or the same size, and the embodiment of the application does not limit this.

[0280] In addition, the embodiment of the application adopts a three-wire connection scheme in which the upper and lower surfaces of the double piezoelectric sheets are staggered and connected. For example, under the same pressure, if the voltage difference between the upper and lower surfaces of the piezoelectric material of the fifth piezoelectric sheet 405 is positive, the voltage difference between the upper and lower surfaces of the piezoelectric material of the sixth piezoelectric sheet 406 is negative due to the staggered connection of the upper and lower surfaces (i.e., the positive and negative electrodes). For the same vibration source, the phases of the output first signal and the second signal are always opposite, and the noise can be eliminated by using differential operation, achieving global noise elimination, thereby improving the signal-to-noise ratio of the sensor and enhancing the detection capability of the micro signal.

[0281] Optionally, the first side 405a of the fifth piezoelectric sheet 405 corresponding to the part of the first piezoelectric part 301 is coated with a conductive material (such as conductive silver paste) to have conductive properties and form an electrode. Similarly, the second side 406a of the sixth piezoelectric sheet 406 corresponding to the part of the second piezoelectric part 302 and the third side 405b of the fifth piezoelectric sheet 405 corresponding to the part of the third piezoelectric part 303 and the fourth side 406b of the sixth piezoelectric sheet 406 are also coated with a conductive material.

[0282] Optionally, the conductive material can cover the part of the first piezoelectric part 301 (i.e. the part of the first side 405a of the fifth piezoelectric sheet 405) and the part of the second piezoelectric part 302 (i.e. the part of the second side 406a of the sixth piezoelectric sheet 406) to form an equipotential surface and improve the accuracy of anomaly detection.

[0283] Optionally, the conductive material can cover part of the part of the first piezoelectric part 301 and the part of the second piezoelectric part 302. In this case, the area of the covered region of the conductive material coating the first piezoelectric part 301 and the second piezoelectric part 302 can remain consistent to improve the accuracy of anomaly detection.

[0284] Optionally, in the fourth structure design scheme, the third side 405b of the fifth piezoelectric sheet 405 and the second side 406a of the sixth piezoelectric sheet 406 are arranged on the PCB.

[0285] It can be understood that at this time, the third side 405b of the fifth piezoelectric sheet 405 and the second side 406a of the sixth piezoelectric sheet 406 are attached to the PCB.

[0286] Optionally, in the fourth structure design scheme, the piezoelectric material of the fifth piezoelectric sheet 405 and the sixth piezoelectric sheet 406 is the same.

[0287] It can be understood that the piezoelectric material of the fifth piezoelectric sheet 405 and the sixth piezoelectric sheet 406 is the same, which can keep the responses of the electrical signals of the two consistent, making the reliability of the fault detection result higher and the sensor failure feedback timely.

[0288] Optionally, the piezoelectric material of the fifth piezoelectric sheet 405 and the sixth piezoelectric sheet 406 can also be different. At this time, the sensitivity of the electrical signals generated by the fifth piezoelectric sheet 405 and the sixth piezoelectric sheet 406 to vibration is inconsistent and can be affected by factors such as ambient temperature and service life, resulting in inconsistent responses of the electrical signals. In this case, the subsequent algorithm can be used to compensate for the responses of the electrical signals to offset the differences in the sensitivity of the electrical signals generated by different piezoelectric materials to vibration, the influence of ambient temperature, service life and other factors.

[0289] Optionally, in the fourth structural design scheme, the phase of the first signal is opposite to the phase of the second signal.

[0290] It can be understood that the fourth structural design scheme adopts a three-wire connection scheme in which the upper and lower surfaces of the dual piezoelectric sheets are connected in an interlaced manner. For example, under the same pressure, if the voltage difference between the upper and lower surfaces of the piezoelectric material of the fifth piezoelectric sheet 405 is positive, the voltage difference between the upper and lower surfaces of the piezoelectric material of the sixth piezoelectric sheet 406 is negative due to the interlaced connection of the upper and lower surfaces (i.e., the positive and negative electrodes). Through this design, for the same vibration source, the phases of the output first signal and second signal are always opposite, and the noise can be eliminated using a differential operation, achieving global noise elimination, thereby improving the signal-to-noise ratio of the sensor and enhancing the detection capability of the micro signal.

[0291] It can be understood that some global noise is generated in the detection, transmission, and amplification of the piezoelectric signal, and is evenly distributed in each channel. Reasonably designing the structure of the sensor can achieve that the phases of the signals received by the two channels (i.e., the first signal and the second signal) are opposite, but the global noise is still the same at this time.

[0292] For example, the first signal a output by the first signal line and the second signal b output by the second signal line are two opposite signals, and the interference noise n received by the two signals is consistent. At this time, the first signal a after being interfered by the noise can be represented as a+n, and the second signal b after being interfered by the noise can be represented as b+n. For such a signal and noise, a differential operation module can be used to eliminate the noise, and the signal a-b after the noise interference is eliminated can be obtained by performing a differential operation on a+n and b+n.

[0293] It should be understood that the above-mentioned structural design schemes one to four are only used to exemplarily illustrate the structural design of the first piezoelectric part 301, the second piezoelectric part 302, and the third piezoelectric part 303 in the sensing module 30, and should not be used to limit the embodiments of the present application.

[0294] It should be understood that the new structural design scheme obtained based on the reasonable deformation, supplement, or combination of the above-mentioned structural design schemes one to four belongs to the protection scope of the embodiments of the present application.

[0295] In a possible embodiment, in addition to being rectangular, each piezoelectric sheet in the above-mentioned structural design schemes one to four can also be circular, triangular, or irregularly shaped.

[0296] Specifically, reference can be made to FIG. 14, which is a cross-sectional schematic diagram of another sensing module provided by the embodiments of the present application.

[0297] As shown in FIG. 14, the above-mentioned sensing module shown in FIG. 9 (i.e., the above-mentioned second structural design scheme) is taken as an example for illustration.

[0298] It can be understood that the third piezoelectric sheet 403 in the sensing module shown in FIG. 9 is changed from a rectangular design to a circular design, and a sensing module shown in FIG. 14 is obtained.

[0299] It can be understood that each piezoelectric sheet in the structural design scheme one to the structural design scheme four can be designed as any shape, and the embodiments of the present application do not limit this.

[0300] Optionally, each piezoelectric sheet in the structural design scheme one to the structural design scheme four can be determined as different shapes according to the size of the space inside the sensor, so as to improve the space utilization rate inside the sensor.

[0301] Correspondingly, based on the sensing system shown in FIG. 2, and the sensing module shown in FIG. 3 to FIG. 14, the present application further provides a new sensing method.

[0302] Please refer to FIG. 15, which is a flowchart of a sensing method provided by the embodiments of the present application. The sensing method can be applied to the sensing system shown in FIG. 2, and the sensing module shown in FIG. 3 to FIG. 14. The description of the sensing system and the sensing module can be referred to the above, and will not be repeated here. Specifically, the sensing method includes but is not limited to the following steps:

[0303] S1501: The sensing device acquires the first signal and the second signal from the sensing module.

[0304] Wherein, the sensing module, the first signal and the second signal can be referred to the corresponding description in the above, and will not be repeated here.

[0305] S1502: The sensing device determines the working state of the sensing module based on the intensity relationship between the first signal and the second signal.

[0306] It can be understood that the sensing device in the embodiments of the present application can be a device carrying a processor / chip that can be used to execute computer execution instructions, or can be a processor / chip that can be used to execute computer execution instructions. Optionally, the sensing device can be an electronic device, or a processor / chip in an electronic device. Optionally, the sensing device can be a microcontroller unit (MCU), a central processing unit (CPU), a system on chip (SOC), etc. The sensing device is used to execute the sensing method in the embodiments of the present application, so as to improve the sensing ability and timely feedback the sensor failure.

[0307] It can be understood that the sensing module adopts a three-wire system, by acquiring the first signal and the second signal from the sensing module, and based on the intensity relationship between the first signal and the second signal, the strain difference between each piezoelectric part of the sensing module can be detected, and then whether the sensing module is abnormal can be detected, so as to determine the working state of the sensing module.

[0308] It can be understood that, compared with the current detection of whether it is abnormal only according to the signal intensity output by the unique signal line, the intensity relationship comparison between the signals output by the two signal lines in the embodiment of the application can make the reliability of the fault detection result higher, so as to realize improving the sensing ability and timely feedback of the sensor fault.

[0309] In a possible embodiment, the above-mentioned determination of the working state of the sensing module can be specifically realized by the following manner:

[0310] Case one:

[0311] In a case where the intensity relationship between the first signal and the second signal and the reference threshold value is less than the first threshold value, it is determined that the sensing module is in a normal state.

[0312] It can be understood that, when the intensity relationship between the first signal and the second signal and the reference threshold value is less than the first threshold value, it indicates that the strain difference between each piezoelectric part is small, and the sensing module is detected to be in a normal state.

[0313] Case two:

[0314] In a case where the intensity relationship between the first signal and the second signal and the reference threshold value is not less than the first threshold value, it is determined that the sensing module is in an abnormal state.

[0315] It can be understood that, when the intensity relationship between the first signal and the second signal and the reference threshold value is not less than the first threshold value, it indicates that the strain difference between each piezoelectric part is large, and the sensing module is detected to be in an abnormal state.

[0316] Optionally, in the above-mentioned case one and case two, the reference threshold value and / or the first threshold value is configurable, which can be a calibration value determined by a large amount of test data when the sensing module is factory-finished, or can be adjusted according to different application scenarios, and the embodiment of the application does not limit this.

[0317] Optionally, in the above-mentioned case one and case two, the intensity relationship between the first signal and the second signal can refer to the intensity ratio of the first signal and the second signal, or can refer to the intensity difference value of the first signal and the second signal, and the embodiment of the application does not limit this.

[0318] Optionally, in the case one and the case two, the intensity ratio of the first signal and the second signal can refer to the ratio of the intensity of the first signal to the intensity of the second signal, or can refer to the ratio of the intensity of the second signal to the intensity of the first signal, and the embodiments of the present application do not make any limitation.

[0319] Exemplarily, the first signal is denoted by a, the second signal is denoted by b, the intensity ratio is denoted by y, the reference threshold is denoted by y0, and the first threshold is denoted by Δ1, and then y=a / b. If |y-y0|<Δ1, it is detected that the perception module is in a normal state; if |y-y0|≥Δ1, it is detected that the perception module is in an abnormal state.

[0320] Optionally, when the perception module is in a normal state, ideally, the intensity ratio of the first signal and the second signal is a fixed ratio, that is, y is a fixed value.

[0321] Optionally, when it is determined that the perception module is in an abnormal state, the perception method in the embodiments of the present application can further perform steps including but not limited to the following steps:

[0322] In the case where it is determined that the perception module is in an abnormal state, a first instruction is issued.

[0323] The first instruction is used to instruct the perception module to perform self-calibration, or the first instruction is used to instruct the vehicle carrying the perception module to exit the automatic valet parking state, which can be determined according to different application scenarios.

[0324] Optionally, the perception module performing self-calibration can be an operation performed in a scenario triggered by the vehicle periodically, the perception module performing self-detection is an operation performed in a scenario triggered by the user, and the abnormal detection is an operation performed in a driving scenario. Accordingly, when it is determined that the perception module is in an abnormal state, the corresponding operation is instructed to be performed in the above different application scenarios.

[0325] In a possible embodiment, the perception method in the embodiments of the present application can further perform steps including but not limited to the following steps:

[0326] In the case where the perception module receives a fixed vibration signal, the perception module is calibrated based on the first signal and the second signal.

[0327] Optionally, the fixed vibration signal can include but is not limited to, for example, sounding a horn, passing a deceleration zone at a fixed speed, and the like, and the embodiments of the present application do not make any limitation.

[0328] Optionally, the perception module is calibrated according to the first signal and the second signal, specifically, the first signal and the second signal can be feature extracted and fused at the algorithm end. The feature extraction can be manual extraction (such as mean, variance, correlation, entropy, energy, characteristic frequency, etc. of the time-frequency domain signal), or automatic extraction by algorithm. The fusion can be a combination of raw data, or a fusion of features. Finally, the fused data and / or features are identified by an algorithm (support vector machine, neural network) to determine the working state of the sensor, and the sensor is calibrated according to the output data to ensure that the sensor can work normally with the same performance under different working conditions.

[0329] In a possible embodiment, the perception method in the embodiment of the application can further perform steps including but not limited to the following steps:

[0330] In the case that the phase of the first signal and the phase of the second signal are opposite, the first signal and the second signal are denoised.

[0331] It can be understood that when the perception module adopts a three-wire connection scheme in which the upper and lower surfaces (i.e. the positive and negative electrodes) of the two piezoelectric sheets are connected in an alternating manner, for example, under the same pressure, if the voltage difference between the upper and lower surfaces of the piezoelectric material of one of the two different piezoelectric sheets is positive, due to the alternating connection of the positive and negative electrodes, the voltage difference between the upper and lower surfaces of the piezoelectric material of the other piezoelectric sheet is negative. With this design, for the same vibration source, the phases of the output first signal and second signal are always opposite. In this case, differential operation can be used to eliminate noise, achieving global noise elimination, thereby improving the signal-to-noise ratio of the sensor and enhancing the detection capability of small signals.

[0332] It can be understood that during the detection, transmission and amplification of the piezoelectric signal, some global noise is uniformly distributed in each channel. Reasonably designing the sensor structure can achieve that the phases of the signals received by the two channels (i.e. the first signal and the second signal) are opposite, but the global noise is still the same at this time.

[0333] For example, the first signal a output by the first signal line and the second signal b output by the second signal line are two anti-phase signals, and the interference noise n received by the two signals is consistent. At this time, the first signal a after being disturbed by the noise can be represented as a+n, and the second signal b after being disturbed by the noise can be represented as b+n. For such signals and noise, a differential operation module can be used to eliminate the noise. The differential operation of a+n and b+n can obtain the signal a-b after the noise disturbance is eliminated.

[0334] The above describes the method of the embodiments of the present application in detail. The following provides an apparatus for implementing any of the methods of the embodiments of the present application, for example, an apparatus including units (or means) for implementing the steps performed by the devices in any of the above methods.

[0335] Please refer to FIG. 16, which is a structural schematic diagram of a sensing device provided by the embodiments of the present application.

[0336] As shown in FIG. 16, the sensing device 160 can include a communication unit 1601 and a processing unit 1602. The communication unit 1601 and the processing unit 1602 can be software, hardware, or a combination of software and hardware.

[0337] The communication unit 1601 can implement a sending function and / or a receiving function, and the communication unit 1601 can also be described as a transceiving unit. The communication unit 1601 can also be a unit integrating an acquisition unit and a sending unit, where the acquisition unit is configured to implement a receiving function, and the sending unit is configured to implement a sending function. Alternatively, the communication unit 1601 can be configured to receive information sent by another apparatus and / or send information to another apparatus.

[0338] In a possible design, the sensing device 160 can correspond to the sensing device in the method embodiments shown in FIG. 15, for example, the sensing device 160 can be an electronic device or a chip in an electronic device. The sensing device 160 can include units for performing operations performed by the sensing device in the method embodiments shown in FIG. 15, and each unit in the sensing device 160 is configured to implement operations performed by the sensing device in the method embodiments shown in FIG. 15. The units are described as follows:

[0339] The communication unit 1601 is configured to acquire the first signal and the second signal from the sensing module.

[0340] The processing unit 1602 is configured to determine the working state of the sensing module based on the intensity relationship between the first signal and the second signal.

[0341] The communication unit 1601 and the processing unit 1602 described in the present design perform steps, which can refer to the implementation corresponding to the sensing device in the method embodiments shown in FIG. 15.

[0342] The implementation of the communication unit 1601 and the processing unit 1602 described in the present design brings about technical effects, which can refer to the introduction of the technical effects of the method embodiments shown in FIG. 15.

[0343] According to the embodiments of the present application, each unit in the apparatus shown in FIG. 16 can be combined into one or several other units respectively or all, or some of the units can be further split into a plurality of units with smaller functions to constitute, which can achieve the same operation without affecting the implementation of the technical effects of the embodiments of the present application. The above units are divided based on logical functions. In actual application, the function of one unit can also be implemented by a plurality of units, or the functions of a plurality of units are implemented by one unit. In other embodiments of the present application, the electronic device can also include other units. In actual application, these functions can also be assisted by other units, and can be implemented by a plurality of units.

[0344] It should be noted that the implementation of each unit can also correspond to the description of the corresponding method embodiments of the method shown in FIG. 15.

[0345] In the perception apparatus 160 described in FIG. 16, by adopting a three-wire scheme, the perception capability can be improved, and the sensor failure can be fed back in time.

[0346] For the case that the above-mentioned perception apparatus 160 can be an electronic device, refer to the structural schematic diagram of the electronic device shown in FIG. 17.

[0347] It should be understood that the electronic device 170 shown in FIG. 17 is only an example. The electronic device of the embodiments of the present application can also include other components, or include components similar in function to the components in FIG. 17, or not include all the components in FIG. 17.

[0348] The electronic device 170 includes a transceiver interface 1701 and at least one processor 1702.

[0349] The electronic device 170 can correspond to the perception apparatus. The transceiver interface 1701 is configured to transceive signals, and the at least one processor 1702 executes program instructions, so that the electronic device 170 implements the corresponding processes of the method performed by the corresponding device in the above-mentioned method embodiments.

[0350] In a possible design, the electronic device 170 can correspond to the perception apparatus in the method embodiments shown in FIG. 15. For example, the electronic device 170 can be a perception apparatus, or a chip in a perception apparatus. The electronic device 170 can include components for performing the operations performed by the perception apparatus in the above-mentioned method embodiments, and each component in the electronic device 170 is respectively for implementing the operations performed by the perception apparatus in the above-mentioned method embodiments. The specific steps can be as follows:

[0351] Obtaining a first signal and a second signal from a perception module;

[0352] Determine the working state of the perception module based on the intensity relationship between the first signal and the second signal.

[0353] The steps performed by the transceiver interface 1701 and the at least one processor 1702 described in the present design can refer to the implementation of the perception device corresponding to the method embodiment shown in FIG. 15.

[0354] The technical effects brought by the implementation of the transceiver interface 1701 and the at least one processor 1702 described in the present design can refer to the introduction of the technical effects of the method embodiment shown in FIG. 15.

[0355] In the electronic device 170 described in FIG. 17, by adopting a three-wire scheme, the sensing capability can be improved, and the sensor failure can be timely fed back.

[0356] For the case that the perception device 160 is a chip or a chip system, refer to the structural schematic diagram of the chip shown in FIG. 18.

[0357] As shown in FIG. 18, the chip 180 includes a processor 1801 and an interface 1802. The number of the processor 1801 can be one or more, and the number of the interface 1802 can be multiple. It should be noted that the functions of the processor 1801 and the interface 1802 can be realized by hardware design, software design, or a combination of software and hardware, which is not limited here.

[0358] Optionally, the chip 180 can further include a memory 1803, which is used to store necessary program instructions and data.

[0359] In the present application, the processor 1801 can be used to call the implementation program of the perception method provided by one or more embodiments of the present application in the perception device from the memory 1803, and execute the instructions included in the program. The interface 1802 can be used to output the execution result of the processor 1801. In the present application, the interface 1802 can be specifically used to output various messages or information of the processor 1801.

[0360] The perception method provided by one or more embodiments of the present application can refer to the foregoing various embodiments shown in FIG. 15, which will not be repeated here.

[0361] The processor in the embodiments of the present application can be a central processing unit (CPU), and can also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field programmable gate arrays (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.

[0362] The memory in the embodiments of the present application is used to provide a storage space, and the storage space can store data such as an operating system and a computer program. The memory includes but is not limited to a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), or a compact disc read-only memory (CD-ROM).

[0363] According to the method provided in the embodiments of the present application, the embodiments of the present application further provide a computer readable storage medium, and the computer readable storage medium stores a computer program. When the computer program runs on one or more processors, the method shown in FIG. 15 can be implemented.

[0364] According to the method provided in the embodiments of the present application, the embodiments of the present application further provide a computer program product, and the computer program product includes a computer program. When the computer program runs on a processor, the method shown in FIG. 15 can be implemented.

[0365] The embodiments of the present application further provide a perception system, which includes the perception module shown in any one of FIGS. 3 to 14, and the perception device shown in FIG. 16.

[0366] The embodiments of the present application further provide an intelligent driving vehicle, which includes at least one of the perception module shown in any one of FIGS. 3 to 14, or the perception device 160, or the electronic device 170, or the chip 180, or the perception system.

[0367] The embodiment of the present application further provides a processing device, comprising a processor and an interface; the processor is used for executing the method in any of the method embodiments.

[0368] It should be understood that the processing device described above can be a chip. The units in the various device embodiments and the electronic devices in the method embodiments correspond completely, and the corresponding steps are performed by the corresponding modules or units, for example, the communication unit (transceiver) performs the steps of receiving or sending in the method embodiments, and the other steps except sending and receiving can be performed by the processing unit (processor). The functions of the specific units can refer to the corresponding method embodiments. The processor can be one or more.

[0369] It can be understood that the electronic device in the embodiment of the present application can perform part or all of the steps in the embodiment of the present application, and these steps or operations are only examples, and the embodiment of the present application can also perform other operations or various modifications of the operations. In addition, each step can be executed in a different order from the embodiment of the present application, and it is possible that not all operations in the embodiment of the present application are executed.

[0370] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented by other means. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units or components shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or other forms.

[0371] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment of the present application.

[0372] In addition, each functional unit in each embodiment of the present application can be integrated in a processing unit, or each unit can exist physically, or two or more units can be integrated in one unit.

[0373] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the parts that make contributions or parts of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory ROM, a random access memory RAM, a magnetic disk or an optical disk, and various media that can store program codes.

[0374] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application.

Claims

1. A perception module, comprising: Comprising: a first piezoelectric part, a second piezoelectric part, and a third piezoelectric part; the first piezoelectric part, the second piezoelectric part, and the third piezoelectric part are mutually insulated, at least part of the first piezoelectric part and at least part of the third piezoelectric part are arranged on opposite sides of a piezoelectric material, and / or at least part of the second piezoelectric part and at least part of the third piezoelectric part are arranged on opposite sides of the piezoelectric material; the first piezoelectric part is used to connect a first signal line, the first signal line is used to output a first signal, the first signal is used to represent the degree of strain between the first piezoelectric part and the third piezoelectric part; the second piezoelectric part is used to connect a second signal line, the second signal line is used to output a second signal, the second signal is used to represent the degree of strain between the second piezoelectric part and the third piezoelectric part; the third piezoelectric part is used to connect a third signal line, the third signal line is grounded; wherein the working state of the sensing module is associated with the intensity relationship between the first signal and the second signal.

2. The perception module of claim 1, wherein, When the intensity relationship between the first signal and the second signal deviates from the reference threshold value by less than a first threshold value, the sensing module is in a normal state; or, When the intensity relationship between the first signal and the second signal deviates from the reference threshold value by not less than the first threshold value, the sensing module is in an abnormal state.

3. The perception module of claim 2, wherein, When the sensing module is in the abnormal state, the sensing module performs self-calibration, or the vehicle carrying the sensing module exits the automatic valet parking state.

4. The perception module of any one of claims 1-3, wherein, The first piezoelectric part includes a part corresponding to the first side of a first piezoelectric sheet, the second piezoelectric part includes a part corresponding to the second side of a second piezoelectric sheet, and the third piezoelectric part includes a part corresponding to the third side of the first piezoelectric sheet and a part corresponding to the fourth side of the second piezoelectric sheet; wherein the first side of the first piezoelectric sheet and the third side of the first piezoelectric sheet are located on opposite sides of the first piezoelectric sheet, the second side of the second piezoelectric sheet is the same side as the first side of the first piezoelectric sheet, the fourth side of the second piezoelectric sheet is the same side as the third side of the first piezoelectric sheet, and the first side of the first piezoelectric sheet and the second side of the second piezoelectric sheet are mutually insulated.

5. The perception module of claim 4, wherein, The first piezoelectric part further includes a part corresponding to the fifth side of the first piezoelectric sheet, and the first piezoelectric part and the third piezoelectric part are mutually insulated.

6. The perception module of claim 4, wherein, The first piezoelectric part further includes a part corresponding to the fifth side of the first piezoelectric sheet and a part corresponding to the third side of the first piezoelectric sheet, and the first piezoelectric part and the third piezoelectric part are mutually insulated.

7. The perception module of any one of claims 4-6, wherein, The third side of the first piezoelectric sheet and the fourth side of the second piezoelectric sheet are arranged on a printed circuit board (PCB).

8. The perception module of any one of claims 4-7, wherein, The piezoelectric materials of the first piezoelectric sheet and the second piezoelectric sheet are the same.

9. The perception module of any one of claims 1-3, wherein, The first piezoelectric part includes a first part corresponding to the first side of a third piezoelectric sheet, the second piezoelectric part includes a second part corresponding to the first side of the third piezoelectric sheet, and the third piezoelectric part includes a part corresponding to the second side of the third piezoelectric sheet; The first side of the third piezoelectric sheet and the second side of the third piezoelectric sheet are located on opposite sides of the third piezoelectric sheet, and the first side of the third piezoelectric sheet corresponds to the first part and the second part of the first side of the third piezoelectric sheet.

10. The perception module of claim 9, wherein, The second side of the third piezoelectric sheet is arranged on the PCB.

11. The perception module of any one of claims 1-3, wherein, The first piezoelectric part includes the first part corresponding to the first side of the fourth piezoelectric sheet, the second piezoelectric part includes the second part corresponding to the first side of the fourth piezoelectric sheet, and the third piezoelectric part includes the third part corresponding to the first side of the fourth piezoelectric sheet. The first part corresponding to the first side of the fourth piezoelectric sheet, the second part corresponding to the first side of the fourth piezoelectric sheet, and the third part corresponding to the first side of the fourth piezoelectric sheet are mutually insulated.

12. The perception module of claim 11, wherein, The first side of the fourth piezoelectric sheet is arranged on the PCB.

13. The perception module of any one of claims 1-3, wherein, The first piezoelectric part includes the first part corresponding to the first side of the fifth piezoelectric sheet, the second piezoelectric part includes the second part corresponding to the second side of the sixth piezoelectric sheet, and the third piezoelectric part includes the third part corresponding to the third side of the fifth piezoelectric sheet and the fourth part corresponding to the fourth side of the sixth piezoelectric sheet. The first side of the fifth piezoelectric sheet and the third side of the fifth piezoelectric sheet are located on opposite sides of the fifth piezoelectric sheet, the fourth side of the sixth piezoelectric sheet is on the same side as the first side of the fifth piezoelectric sheet, the second side of the sixth piezoelectric sheet is on the same side as the third side of the fifth piezoelectric sheet, and the fifth piezoelectric sheet and the sixth piezoelectric sheet are mutually insulated.

14. The perception module of claim 13, wherein, The third side of the fifth piezoelectric sheet and the second side of the sixth piezoelectric sheet are arranged on the PCB.

15. The perception module of claim 13 or 14, wherein, The piezoelectric material of the fifth piezoelectric sheet and the sixth piezoelectric sheet is the same.

16. The perception module of any one of claims 13-15, wherein, The phase of the first signal and the phase of the second signal are opposite.

17. The perception module of any one of claims 4-16, wherein, The piezoelectric sheet corresponding to the first piezoelectric part is rectangular, circular, triangular, or irregular.

18. The perception module of any one of claims 1-17, wherein, The piezoelectric material includes at least one of the following: piezoelectric ceramic, piezoelectric crystal, piezoelectric film.

19. The perception module of any one of claims 1-18, wherein, In the case that the sensing module receives a fixed vibration signal, the first signal and the second signal are used to calibrate the sensing module.

20. A perception method comprising: The sensing method comprises: obtaining the first signal and the second signal from the sensing module; determining the working state of the sensing module based on the intensity relationship between the first signal and the second signal.

21. The perception method of claim 20, wherein, The determination of the working state of the sensing module comprises: in the case that the difference between the intensity relationship of the first signal and the second signal and the reference threshold is less than a first threshold, it is determined that the sensing module is in a normal state; or in the case that the difference between the intensity relationship of the first signal and the second signal and the reference threshold is not less than the first threshold, it is determined that the sensing module is in an abnormal state.

22. The perception method of claim 21, wherein, The sensing method further comprises: in the case that it is determined that the sensing module is in an abnormal state, a first instruction is issued, the first instruction is used to instruct the sensing module to perform self-calibration, or the first instruction is used to instruct the vehicle carrying the sensing module to exit the automatic valet parking state.

23. The perception method of any one of claims 20-22, wherein, The sensing method further comprises: In a case that the sensing module receives the fixed vibration signal, the sensing module is calibrated based on the first signal and the second signal.

24. The perception method of any one of claims 20-23, wherein, The sensing method further comprises: In a case that the phase of the first signal and the phase of the second signal are opposite, the first signal and the second signal are de-noised.

25. A sensing device, comprising: comprising means for performing the method of any one of claims 20 to 24.

26. A sensing device, comprising: comprising a processor configured to perform the method of any one of claims 20 to 24.

27. A chip, characterized by comprising a logic circuit and an interface, the logic circuit and the interface being coupled; the interface is configured to input and / or output information, and the logic circuit is configured to perform the method of any one of claims 20 to 24.

28. A perception system, comprising: comprising the sensing module of any one of claims 1 to 19, and the sensing device of claim 25, or the sensing device of claim 26, or the chip of claim 27.

29. A mobile terminal, characterized by comprising the sensing module of any one of claims 1 to 19, or the sensing device of claim 25, or the sensing device of claim 26, or the chip of claim 27, or the sensing system of claim 28.

30. A computer-readable storage medium, characterized in that, The computer readable storage medium is configured to store a computer program, the computer program being executed to perform the method of any one of claims 20 to 24.

31. A computer program product, characterised in that, The computer program product comprises a computer program, the computer program being executed to perform the method of any one of claims 20 to 24.

Images