Attaching device and electronic component mounting device

Abstract

[Problem]: To provide an attaching device capable of attaching an adhesive tape with high accuracy without being affected by elongation and feeding accuracy of the adhesive tape during conveyance of the adhesive tape, and an electronic component mounting device. [Solution] According to one embodiment, an attaching device is provided with a conveyance unit. Furthermore, the attaching device is provided with a stage unit. Furthermore, the attaching device is provided with an imaging unit. Furthermore, the attaching device is provided with a movement mechanism that moves between an attachment reference position and a retracted position. Furthermore, the attaching device is provided with a cutting unit that moves between the retracted position and a cutting position. Furthermore, the attaching device is provided with a pressing head that moves toward or away from an attachment target and that presses and attaches the adhesive tape to the attachment target. Furthermore, the cutting unit forms a second cut on the basis of the position of a first cut detected by imaging the conveyed adhesive tape.

Description

Adhesive device and electronic component mounting device

[0001] An embodiment of the present invention relates to an adhesive device and an electronic component mounting device.

[0002] When an electronic component such as a driver IC is mounted on a flat panel (display panel) such as liquid crystal or organic electroluminescence used in a display device by a mounting device, for example, an anisotropic conductive member called a tape-shaped ACF (Anisotropic Conducting Film) is attached to the display panel, which is an object to be attached, by an adhesive device, and further, using a pressure bonding device, pressure bonding is performed between the electronic component and the display panel, which is an object to be mounted, through the attached anisotropic conductive member.

[0003] The ACF is attached to the connection electrodes on the display panel, which is the object to be attached. The tape-shaped ACF is adhesively attached to a base film (base material) as an adhesive tape having anisotropic conductivity in a peelable manner and is cut to a required length and attached. Such a tape-shaped member composed of a base film and an adhesive tape is pulled out from a state wound around a reel, and the adhesive tape is cut to a required length by a cutting portion provided at a predetermined position. That is, each time the adhesive tape is fed by a required length with respect to the cutting portion and cut, the adhesive tape is cut to a required length from the cutting portion to the cutting portion.

[0004] Japanese Unexamined Patent Application Publication No. 2020-1894

[0005] When the adhesive tape is cut by the adhesive device, the cutting position of the adhesive tape varies depending on the elongation and feeding accuracy of the tape-shaped member itself. Therefore, the dimensions and attachment positions of the adhesive tape vary due to the conveyance of the tape-shaped member, which is a problem when realizing high-precision attachment of the adhesive tape.

[0006] In recent years, due to the miniaturization of display panels and the like, high-density mounting of electronic components has been required. As a result, high mounting accuracy of electronic components has been required, and improvement of the attachment accuracy of ACF has also been desired. For this reason, there are cases where the conventional allowable attachment accuracy is no longer acceptable.

[0007] Therefore, embodiments of the present invention provide an adhesive tape application device that can apply adhesive tape with high precision without being affected by the elongation of the tape-like member or the feeding accuracy associated with the transport of the tape-like member, and a mounting device that can mount electronic components with high precision.

[0008] According to one embodiment, the adhesive device includes a transport unit. Furthermore, the adhesive device includes a stage unit. Furthermore, the adhesive device includes an imaging unit. Furthermore, the adhesive device includes a moving mechanism. Furthermore, the adhesive device includes a cutting unit that moves between a retracted position, which is moved away when the moving mechanism is positioned at the adhesive reference position, and a cutting position, which forms the second cut in the adhesive tape. Furthermore, the adhesive device includes a pressure head that moves in a direction toward or away from the object to be adhered, and presses the adhesive tape onto the object to be adhered. Furthermore, the cutting unit forms a second cut based on the position of the first cut detected by imaging of the transported adhesive tape.

[0009] According to one embodiment, the electronic component mounting apparatus includes an attachment device for attaching adhesive tape to a mounting object to be attached. Furthermore, the electronic component mounting apparatus includes a temporary crimping device for temporarily crimping the electronic component to the mounting object via the adhesive tape attached by the attachment device. Furthermore, the electronic component mounting apparatus includes a main crimping device for heating and pressurizing the mounting object to which the electronic component has been temporarily crimped by the temporary crimping device, thereby making the adhesive tape electrically conductive and fixing it in place. Furthermore, the electronic component mounting apparatus includes a transport device for transporting the mounting object between the attachment device, the temporary crimping device, and the main crimping device. Furthermore, the attachment device includes a transport unit. Furthermore, the attachment device includes a stage unit. Furthermore, the attachment device includes an imaging unit. Furthermore, the attachment device includes a moving mechanism. Furthermore, the attachment device includes a cutting unit that moves between a retracted position, which is retracted when the moving mechanism is located at the attachment reference position, and a cutting position, which forms the second cut in the adhesive tape. Furthermore, the adhesive device includes a pressure head that moves in a direction toward and away from the object to be adhered, and applies pressure to the object to adhere the adhesive tape. In addition, the cutting unit forms a second cut based on the position of the first cut detected by imaging of the conveyed adhesive tape.

[0010] Embodiments of the present invention enable high-precision application of adhesive tape and high-precision mounting of electronic components.

[0011] This is a block diagram showing an example of the configuration of the mounting device in the first embodiment. This is a diagram showing the schematic configuration of the temporary crimping unit in the first embodiment. This is a diagram showing the schematic configuration of the main crimping unit in the first embodiment. This is a schematic configuration diagram of the adhesive device in the first embodiment. This is a diagram showing the configuration of the panel stage, etc., of the adhesive device in the first embodiment. This is a diagram schematically showing the adhesive process using the adhesive device in the first embodiment. This is a diagram schematically showing the adhesive process using the adhesive device in the comparative example. This is another diagram schematically showing the adhesive process using the adhesive device in the comparative example. This is yet another diagram schematically showing the adhesive process using the adhesive device in the comparative example. This is an example of a block diagram of the control unit in the first embodiment. This is a diagram explaining the adhesive operation of the adhesive device in the first embodiment. This is a diagram explaining the adhesive operation of the adhesive device in the first embodiment. This is a diagram explaining the adhesive operation of the adhesive device in the first embodiment. This is a flowchart of the adhesive process in the first embodiment. This is an example of a block diagram of the control unit in the second embodiment. This is a diagram explaining the determination of the amount of displacement in the second embodiment. This is a flowchart of the adhesive process in the second embodiment.

[0012] Embodiments of this disclosure will be described below with reference to the drawings. These embodiments are not limiting to the present invention. The drawings are schematic or conceptual, and the proportions of each part may not necessarily be the same as those of actual objects. In the specification and drawings, elements similar to those described above with respect to previously shown drawings are denoted by the same reference numerals, and detailed descriptions are omitted as appropriate.

[0013] Furthermore, in this disclosure, the terms "greater than or equal to" and "less than or equal to" may be interpreted as "greater than" and "less than," respectively.

[0014] Furthermore, the X, Y, and Z axes described below represent axes perpendicular to each other, with the direction along the X axis being the X direction, the direction along the Y axis being the Y direction, and the direction along the Z axis being the Z direction. Note that the direction along each axis does not necessarily indicate a parallel direction. The X and Y directions intersect each other and correspond to the horizontal direction perpendicular to the direction of gravity, while the Z direction is the vertical direction intersecting the X and Y directions, i.e., the direction of gravity. However, this does not necessarily indicate that it is parallel to the direction of gravity. Also, the +Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction. The X direction is an example of the first direction, the Y direction is an example of the second direction, and the Z direction is an example of the third direction.

[0015] In this embodiment, as described later, the direction in which the tape-like member 2 is transported at the attachment position is the X direction (first direction). Therefore, the Y direction (second direction) is the direction that intersects the X direction in the horizontal plane, and the direction above and below the attachment position is the Z direction (third direction).

[0016] In this embodiment, the ACF component is an example of an adhesive tape in a tape-like member consisting of an adhesive tape adhered to a base film, which is a base material. In this embodiment, a tape in which the adhesive tape 21, which is the ACF, is adhered to a release tape 22, which is a base film, will be described as the tape-like member 2. In this embodiment, the display panel component is, for example, a component that constitutes a flat panel display, and is an example of the object to which it is attached and the object to which it is mounted. In this embodiment, it will be described as the display panel P. In addition, an electronic component mounted on the display panel P will be described as the electronic component C.

[0017] (First Embodiment) Figure 1 is a block diagram showing an example of the configuration of the mounting device 7 in the first embodiment.

[0018] The above-mentioned attachment and crimping of the ACF display panel is performed by the mounting apparatus 7 shown in Figure 1. The mounting apparatus 7 comprises an attachment device 1, a crimping device consisting of a temporary crimping device 3 and a main crimping device 5, a transport device 9, and a control unit 19. The mounting apparatus 7 is an example of an electronic component mounting apparatus.

[0019] In this embodiment, the mounting apparatus 7 attaches an adhesive tape 21, which is ACF, from a tape-like member 2 to the display panel P to be attached using an attachment device 1. The temporary crimping device 3 aligns and mounts (mounts) the electronic component C to the display panel P via the attached adhesive tape 21, and the main crimping device 5 performs mounting by making the adhesive tape 21 electrically conductive and curing it. The display panel P is transported to each device by a transport device 9, and supplied to and discharged from each device. The control of such transport device 9 is performed by a control unit 19.

[0020] The adhesive device 1 cuts the adhesive tape 21 of the tape-shaped member 2 to a predetermined length (cutting length) L, and attaches the cut adhesive tape to the electrode row of the display panel P. For example, the adhesive device 1 transports the tape-shaped member 2 wound on a reel above the display panel P, presses the tape-shaped member 2 against the display panel P, and attaches the ACF, which is the adhesive tape 21 cut to a predetermined length. The display panel P to which the ACF is to be attached is transported and supplied to the adhesive device 1 by a transport device (not shown), and the display panel P with the ACF attached is transported to the temporary crimping device 3.

[0021] As shown in Figure 1, the adhesive device 1 comprises an adhesive unit 1a and a control unit 19a. The adhesive unit 1a has various drive units, which are controlled by the control unit 19a. The adhesive tape 21 is attached to the display panel P by the control of the control unit 19a. The detailed configuration of these components will be described later.

[0022] The temporary crimping device 3 temporarily crimps the electronic component C onto the display panel P. The temporary crimping device 3 holds the electronic component C in the temporary crimping head 300, aligns the electronic component C with the electrode row of the display panel P to which the ACF is attached, and presses and crimps it. After temporary crimping, the display panel P with the electronic component C temporarily crimped is transported to the main crimping device 5 by the transport device 9.

[0023] In this embodiment, the temporary crimping device 3 is a device that aligns the electrode terminals of the display panel P and the electrode terminals of the electronic component C so that their corresponding terminals match, and then mounts them via adhesive tape 21 (ACF). Therefore, the device uses image recognition to align the alignment marks of the electronic component C with the alignment marks of the display panel P or the electrode terminals (mounting area).

[0024] As shown in Figure 1, the temporary crimping device 3 comprises a temporary crimping unit 3a and a control unit 19b. The temporary crimping unit 3a has various drive units, which are controlled by the control unit 19b. Temporary crimping of the electronic component C to the display panel P is achieved by the control of the control unit 19b.

[0025] As shown in Figure 2, the temporary crimping unit 3a includes a temporary crimping head 300, a backup unit 302, and a panel stage 301. The temporary crimping head 300 holds the electronic component C and presses the electronic component C onto the adhesive tape 21 attached to the display panel P to perform temporary crimping. It has XYZθ drive axes (not shown).

[0026] The backup unit 302 is a block that supports the mounting area of ​​the edge of the display panel P. It is fixedly positioned on the temporary crimping unit 3a. The panel stage 301 holds the display panel P to which the adhesive tape 21 is attached and positions it at the mounting position. The upper surface of the panel stage 301 is a holding surface for holding the display panel P. The display panel P is placed on this holding surface and held in place by a suction circuit (not shown). It has XYZθ drive axes (not shown) and positions the display panel P at the mounting position, and places it so that the backup unit 302 supports the mounting area of ​​the edge of the display panel P.

[0027] Similar to the attachment device 1, the mounting area overhangs and the display panel P is held on the panel stage 301, and this mounting area is supported from below by the backup unit 302 at the mounting position. As the panel stage 301 positions the display panel P at the mounting position, alignment marks are captured from above by a camera (not shown) and the position is recognized. The mounting area of ​​the display panel P is corrected and positioned at the mounting position based on this recognized position.

[0028] The electronic component C is held by the temporary crimping head 300, and an alignment mark is captured from below by a camera (not shown) to recognize its position. The position of the electronic component C is corrected and positioned at the mounting location so as to align with the display panel P.

[0029] At the mounting position, the temporary crimping head 300 moves toward the display panel P and presses the held electronic component C to the display panel P via the adhesive tape 21 attached thereto. At this time, the conductive particles contained in the adhesive tape 21 are not crushed, and there is no electrical conductivity between the electrodes of the electronic component C and the display panel P.

[0030] The crimping device 5 performs final crimping on the display panel P and electronic component C, which have been temporarily crimped in the temporary crimping device 3, by pressing them with a crimping head. The display panel P and electronic component C are heated and crimped at a higher temperature and pressure than during the temporary crimping. As a result, the conductive particles of the adhesive tape 21 are crushed, allowing conductivity, while the resin of the adhesive tape 21 hardens and fixes the components in place. The display panel P with the mounted electronic component C is then discharged from the mounting device 7 by the transport device 9.

[0031] In this embodiment, the crimping device 5 is a device that mounts the temporarily crimped electronic component C and the display panel P via adhesive tape 21 (ACF) so that the corresponding terminals of the electrode terminal groups of the electronic component C and the display panel P are electrically connected and fixed.

[0032] The crimping device 5 heats and presses the temporarily crimped electronic component C and display panel P, melting the adhesive tape 21. The conductive particles are then crushed between the electrodes of the electronic component C and the display panel P, creating a conductive state. The device then hardens the tape, thereby completely mounting the electronic component C onto the display panel P.

[0033] As shown in Figure 1, the crimping device 5 comprises a crimping unit 5a and a control unit 19c. The crimping unit 5a has various drive units, which are controlled by the control unit 19c. The crimping of the display panel P and the electronic component C is achieved by the control of the control unit 19c.

[0034] As shown in Figure 3, the crimping unit 5a includes a crimping head 500, a backup unit 502, and a panel stage 501. The crimping head 500 presses and permanently crimps the electronic components C that have been temporarily crimped to the display panel P. It also includes a Z drive shaft and a heating heater (not shown).

[0035] The backup unit 502 is a block that supports the mounting area of ​​the edge of the display panel P. It is fixedly positioned on the crimping unit 5a. The panel stage 501 holds the display panel P, on which the electronic components C have been temporarily crimped, and positions it at the mounting position. The upper surface of the panel stage 501 is a holding surface for holding the display panel P. The display panel P is placed on this holding surface and held in place by a suction circuit (not shown). It has XYZθ drive axes (not shown) and positions the display panel P at the mounting position, and places it so that the backup unit 502 supports the mounting area of ​​the edge of the display panel P.

[0036] Similar to the temporary crimping device 3, the display panel P, with the electronic components C temporarily crimped to the mounting area, is supplied to the panel stage 501 by the transport device 9, overhanging, and held there. This mounting area is supported by a backup. As the panel stage 501 positions the display panel P to the mounting position, alignment marks are captured from above by a camera (not shown) for position recognition. The mounting area of ​​the display panel P is corrected and positioned to the mounting position based on this recognized position.

[0037] At the mounting position, the main crimping head 500 moves toward the display panel P and presses the temporarily crimped electronic component C against the display panel P via the adhesive tape 21 attached to the display panel P. At this time, the conductive particles contained in the adhesive tape 21 are crushed, and electrical conductivity is established between the electrodes of the electronic component C and the display panel P. The adhesive tape 21 is heated to the curing temperature of the substrate and hardens, fixing the electronic component C to the display panel P.

[0038] Let's refer back to Figure 1 for explanation. The aforementioned adhesive device 1, temporary crimping device 3, and main crimping device 5 are each equipped with control units 19a, 19b, and 19c that control their respective drive units. The mounting device 7 is equipped with a control unit 19 that integrates and controls these three control units 19a, 19b, and 19c. For example, after processing is completed in each device, the control unit 19 controls the transport device 9 to transport the processed display panel P.

[0039] Next, the details of the adhesive device 1 in the embodiment will be described.

[0040] Figure 4 shows a schematic configuration diagram of the adhesive device 1 in the first embodiment.

[0041] The adhesive device 1 comprises an adhesive unit 11, a supply unit 12, a recovery unit 13, a transport unit 14, a peeling unit 15, a cutting unit 16, an illumination unit 17, an imaging unit 18, and a control unit 19a. It also comprises a panel stage 101 as shown in Figure 5. The adhesive unit 11, supply unit 12, recovery unit 13, transport unit 14, peeling unit 15, cutting unit 16, illumination unit 17, imaging unit 18, and panel stage 101 together are also called the adhesive unit 1a. In this figure, for the sake of simplicity, some control lines of the control unit 19a are omitted from the description.

[0042] The supply unit 12 holds the tape-shaped member 2 to be used and supplies the tape-shaped member 2 to the attachment unit 11. The transport unit 14 pulls out the tape-shaped member 2 from the supply unit 12 and transports it to the recovery unit 13. During this time, the adhesive tape 21 of the tape-shaped member 2 is cut to a predetermined length by the cutting unit 16. The cut adhesive tape 21 is then photographed by the imaging unit 18 with the cut illuminated by the illumination unit 17, and its position is recognized. At the attachment unit 11, the adhesive tape 21 is attached to the display panel P held on the panel stage 101. The release tape 22 of the tape-shaped member 2 is peeled off the attached adhesive tape 21 and recovered in the recovery unit 13.

[0043] Furthermore, in the adhesive device 1, the path through which the tape-like member 2, pulled out from the supply reel 120 (described later), passes through the fixed roller 121a, movable roller 121b, path roller 122 and path roller 131 of the tension mechanism 121 to the recovery reel 130 is the transport path for the tape-like member 2.

[0044] Hereinafter, in order to explain the positional relationship of each part, the side of the supply unit 12 is also referred to as the upstream side of the tape-shaped member 2, and the side of the recovery unit 13 is also referred to as the downstream side of the tape-shaped member 2. Also, in the conveyance direction in which the tape-shaped member 2 is conveyed from the supply unit 12 to the recovery unit 13, the side of the supply unit 12 is also referred to as the upstream side of the tape-shaped member 2, and the side of the recovery unit 13 is also referred to as the downstream side of the tape-shaped member 2. Further, with respect to the adhesion reference position OP, the downstream side of the tape-shaped member 2 is also referred to as the front, and the upstream side of the tape-shaped member 2 is also referred to as the rear.

[0045] In the present embodiment, the adhesion position is the position where the adhesive tape 21 is adhered to the display panel P. The adhesion reference position OP is the position that serves as a reference for the adhesion position and is a preset design reference position. Also, the adhesion position is also the position where the cut of the adhesive tape 21 described later is positioned. In such an adhesion position, the direction in which the tape-shaped member 2 is conveyed is the X direction (first direction).

[0046] In the example of FIG. 4, the formation position of the half-cut line HC described below is conveyed to the adhesion reference position OP that is the reference position of the adhesion operation, showing a state in which the tape-shaped member 2 is half-cut. In this figure, the leading position of the adhesive tape 21 in the tape-shaped member 2 (hereinafter also referred to as the cut CL) is conveyed further downstream in the conveyance direction of the adhesion reference position OP.

[0047] The control unit 19a controls each part of the adhesion device 1. The control content of the adhesion unit 11, supply unit 12, recovery unit 13, conveyance unit 14, peeling unit 15, cutting unit 16, illumination unit 17, imaging unit 18, and panel stage 101 is programmed in the control unit 19a and is executed by a processing device such as a CPU (Central Processing Unit). Further, it has a storage device (storage unit 199) that stores various information such as programs and operating conditions, a drive circuit that drives each element, an input / output signal circuit, a display for information display and input, a keyboard and a mouse, and a network interface with the outside. Details of the control unit of each part will be described later.

[0048] The adhering part 11 adheres the adhesive tape 21 to the display panel P. The adhering part 11 includes a pressing head 110, a backup part 111, and a moving mechanism 113.

[0049] The pressing head 110 moves up and down (in the Z direction), that is, in the direction of approaching and separating from the display panel P which is the object to be adhered, by a lifting device (not shown), and presses the tape-like member 2 against the display panel P to adhere the ACF which is the adhesive tape 21. Therefore, a heater (not shown) is provided on the pressing head 110, and the contact surface with the tape-like member 2 is heated to a predetermined temperature. Also, in the present embodiment, the pressing head 110 is configured to move not only in the Z direction but also in the X direction, for example, using a ball screw and a motor, in order to position the upstream end at the adhering reference position OP.

[0050] Also, an adhesion prevention member 111a is provided on the surface of the pressing head 110 that contacts the tape-like member 2. The adhesion prevention member 111a is, for example, a sheet formed of an elastic body. The adhesion prevention member 111a is sandwiched between the release tape 22 of the tape-like member 2 and the pressing head 110 during pressing, and prevents the adhesive tape 21 of the tape-like member 2 softened by overheating from adhering to the pressing head 110. That is, in the adhesive tape 21, the direction opposite to the release tape 22 becomes the adhering surface with the display panel P.

[0051] The backup part 111 is a member that supports the display panel P from below when the tape-like member 2 is heated and pressed against the display panel P by the pressing head 110. The backup part 111 has a support surface on its upper surface, which is a flat surface that supports the edge of the adhering area of the display panel P held by the panel stage 101 (see FIG. 5). Also, the backup part 111 is mounted on the moving mechanism 113 described later, and moves in the X direction integrally with the imaging part 18 described later.

[0052] The moving mechanism 113 is equipped with a backup unit 111 and an imaging unit 18, and moves based on the control of the control unit 19a. For example, when the imaging unit 18 is taking images or attaching the device, the moving mechanism 113 moves in the -X direction from the state shown in Figure 4 to position the imaging unit 18 at the imaging position or the backup unit 111 at the attachment position.

[0053] Furthermore, when the cutting unit 16 cuts the adhesive tape 21, the moving mechanism 113 retracts in the +X direction from the attachment position to avoid interference with the cutting unit 16. Therefore, the position of the moving mechanism 113 shown in Figure 4 is the retracted position (standby position) of the backup unit 111 and the imaging unit 18. In other words, the moving mechanism 113 moves between the attachment position (attachment reference position) and the retracted position. As a result, the moving mechanism 113 moves the backup unit 111 and the imaging unit 18 between the attachment position (attachment reference position) and the retracted position. In addition, the moving mechanism 113 may also be structured to include an illumination unit 17 in addition to the backup unit 111 and the imaging unit 18. The moving mechanism 113 is an example of a first moving mechanism.

[0054] The moving mechanism 113 consists of a support base on which the imaging unit 18 and backup unit 111 are mounted, which is supported by a linear guide or the like, and is movable in the X direction by a drive mechanism such as a servo motor and a ball screw. When the moving mechanism 113 is described as moving, it means that the support base is moving.

[0055] The supply unit 12 supplies the tape-like member 2 to the adhesive unit 11 based on the control of the control unit 19a. The supply unit 12 comprises a supply reel 120, a tension mechanism 121, and a path roller 122. The supply reel 120 is a reel that winds the tape-like member 2 and feeds out the tape-like member 2 by rotation. Therefore, the supply unit 12 can be considered as supplying the adhesive tape 21 of the tape-like member 2. The path roller 122 provided in the supply unit 12 is an example of a first path roller.

[0056] The tension mechanism 121 applies tension to the tape-like member 2. The tension mechanism 121 consists of a pair of rollers spaced apart vertically to remove slack from the tape-like member 2 as it is pulled out from the supply reel 120. One roller is a fixed roller 121a that does not move up and down, and the other roller is a movable roller 121b that can move up and down. The movable roller 121b moves up and down by a lifting mechanism (not shown). The movable roller 121b is a so-called dancer roller; when it moves upward, the tension in the tape-like member 2 is weakened, and when it moves downward, the tension in the tape-like member 2 is strengthened.

[0057] The path roller 122 is a roller that changes the transport direction of the tape-shaped member 2 fed from the tension mechanism 121 and feeds it toward the adhesive section 11. When the tape-shaped member 2 is attached, it is transported so that the surface of the adhesive tape 21 faces downward in the Z direction.

[0058] The recovery unit 13 recovers the release tape 22 that has peeled off the adhesive tape 21 attached to the display panel P in the adhesive unit 11, based on the control of the control unit 19a. The recovery unit 13 includes a recovery reel 130 and a path roller 131.

[0059] The recovery reel 130 is a reel that winds up and recovers the release tape 22. The path roller 131 is a roller that changes the transport direction of the release tape 22, which is transported from the adhesive section 11 side, and sends it to the recovery reel 130. The path roller 131 provided in the recovery section 13 is an example of a second path roller.

[0060] The transport unit 14 is positioned between the adhesive unit 11 and the recovery unit 13, and based on the control of the control unit 19a, it sends the tape-shaped member 2 from the supply unit 12 through the adhesive unit 11 to the recovery unit 13. The transport unit 14 is equipped with a pair of feed rollers 140. The pair of feed rollers 140 hold the release tape 22 and rotate in conjunction with the drive of a feed motor (not shown), feeding the release tape 22 towards the recovery reel 130. In other words, the tape-shaped member 2 is moved and transported from the supply reel 120 side to the recovery reel 130 side. The rotation axis of the feed motor is connected to the feed rollers 140, and the drive of this motor causes the feed rollers 140 to rotate around the rotation axis.

[0061] Furthermore, the transport unit 14 rotates in the reverse direction driven by a feed motor (not shown), feeding the gripped release tape 22 towards the supply reel 120. In other words, the tape-shaped member 2 is transported by moving it from the recovery reel 130 side to the supply reel 120 side.

[0062] In the initial state, the conveying unit 14 has transported the cut section CL to the adhesive reference position OP. This state can also be described as the state after the previous adhesive application has been completed.

[0063] The peeling unit 15 peels the release tape 22 from the adhesive tape 21 attached to the display panel P based on the control of the control unit 19a. The peeling unit 15 has peeling rods 150 and 151. The peeling rods 150 and 151 are, for example, round rods and are members that come into contact with the release tape 22. The peeling rod 150 comes into contact with the surface of the release tape 22, i.e., the surface on the adhesive tape 21 side, and the peeling rod 151 comes into contact with the back surface of the release tape 22. The peeling rods 150 and 151 move horizontally from the downstream side to the upstream side of the attachment unit 11 while the release tape 22 is in contact with them, by a moving mechanism (not shown), thereby peeling the release tape 22 from the adhesive tape 21 that is pressed onto the display panel P. After peeling, the peeling rods 150 and 151 move horizontally from the upstream side to the downstream side and retract from the attachment position.

[0064] The cutting unit 16 cuts only the adhesive tape 21 from the tape-like member 2 based on the control of the control unit 19a. The cutting unit 16 may also make an incision in the release tape 22 to the extent that it does not cut the release tape 22. Cutting only the adhesive tape 21 in the tape-like member 2 in this way is also called a half-cut, and the incision formed in the adhesive tape 21 by the cutting unit 16 is also called a half-cut line HC. The position of this half-cut is also called the half-cut position. When referring to the half-cut position, it includes both the position where the adhesive tape 21 is half-cut and the position where the cutting unit 16 half-cuts the adhesive tape 21.

[0065] As described above, the cut at the leading edge of the adhesive tape 21 in the tape-shaped member 2, that is, the downstream end of the adhesive tape 21 that is attached to the release tape 22, is the cut CL of the tape-shaped member 2. The appropriate half-cut line HC is located upstream of the cut CL of the tape-shaped member 2 by the length L of the adhesive tape 21 in the transport direction. Cut CL is an example of a first cut, and the half-cut line HC is an example of a second cut.

[0066] In Figure 4, as indicated by the dashed line, the cutting section 16 comprises a cutter 160, a backup member 161, and a moving mechanism 162. The cutter 160 is a member that cuts the adhesive tape 21 by making an incision in it. The moving mechanism (not shown) moves the tip blade upward in the Z direction until it passes through and cuts the adhesive tape 21 and contacts the release tape 22. The tip blade of the cutter 160 extends in the width direction (i.e., the Y direction) of the tape-like member 2. The backup member 161 is a rectangular parallelepiped block. The backup member 161 has a flat surface 161a on the lower surface of the block that sandwiches the tape-like member 2 between itself and the cutter 160 and contacts the release tape 22 in the horizontal direction.

[0067] The moving mechanism 162 is equipped with a cutter 160 and moves in the X and Y directions based on the control of the control unit 19a. The moving mechanism 162 comprises an X-direction moving mechanism 162a and a Y-direction moving mechanism 162b, and is structured to be movable in the X and Y directions. For example, the X-direction moving mechanism 162a and the Y-direction moving mechanism 162b are combined so as to be stacked in this order. For example, the X-direction moving mechanism 162a and the Y-direction moving mechanism 162b move on a slide rail using a built-in ball screw and motor, respectively.

[0068] As described above, the cutter 160 is configured to be positioned at the adhesive reference position OP. That is, the cutter 160 interferes with the imaging unit 18 and the backup unit 111 when imaging with the imaging unit 18 or when adhesive is applied. For this reason, when imaging with the imaging unit 18 or when adhesive is applied, the moving mechanism 162 moves in the +Y direction, that is, towards the back of the paper, based on the Y direction position of the tape-like member 2, by the Y direction moving mechanism 162b. As a result, the cutter 160 and the backup unit 161 move away from the vicinity of the adhesive reference position OP to a retracted position. Furthermore, when cutting the adhesive tape 21, the imaging unit 18 and the backup unit 111 are moved away from the vicinity of the adhesive reference position OP to a retracted position by the moving mechanism 113, so as not to interfere with the cutting unit 16.

[0069] When cutting the adhesive tape 21, the moving mechanism 162 moves from the retracted position to the position of the tape-like member 2 by the Y-direction moving mechanism 162b. In other words, the cutter 160 moves from the retracted position in the -Y direction and is positioned directly below the tape-like member 2. To put it another way, the cutting section 16 moves between the cutting position and the retracted position by the moving mechanism 162.

[0070] However, the position of the tape-shaped member 2 transported by the transport unit 14 may shift due to elongation or transport errors (feeding errors). If a shift in position occurs, the position of the moving mechanism 162 after movement will not coincide with the appropriate position for forming the half-cut line HC.

[0071] In this embodiment, the moving mechanism 162 is configured to move a small distance in the X direction in order to fine-tune the formation position of the half-cut line HC. For example, if the formation position of the half-cut line HC on the tape-like member 2 pulled out from the supply unit 12 is misaligned, the control unit 19a moves the cutter 160 in the X direction using the X-direction moving mechanism 162a with respect to the adhesion reference position OP, thereby adjusting the formation position of the half-cut line HC. The moving mechanism 162 having the X-direction moving mechanism 162a and the Y-direction moving mechanism 162b is an example of a second moving mechanism. Hereafter, the formation position of the half-cut line HC will also be referred to as the half-cut position.

[0072] The illumination unit 17, based on the control of the control unit 19a, irradiates light toward the adhesion reference position OP in the vicinity of the adhesion reference position OP. In this embodiment, the illumination unit 17 is located on the adhesive tape 21 side, i.e., the lower side, of the tape-shaped member 2. In Figure 4, the axis of light (optical axis) toward the cut CL is shown by a dotted line. The illumination unit 17 may be mounted on the moving mechanism 113 and move together with the imaging unit 18 and the backup unit 111, or it may be arranged separately and independently.

[0073] The illumination unit 17 has its optical axis directed towards the gap CL and is positioned obliquely to the perpendicular line of the tape-shaped member 2. This perpendicular line intersects the adhesive surface of the adhesive tape 21. The perpendicular line may also be a line perpendicular to the horizontal direction. If the angle between the line perpendicular to the horizontal direction and the optical axis of the illumination unit 17 is θ, then this angle is preferably 60° to 80°. The illumination unit 17 may be positioned upstream or downstream of the adhesive reference position OP. Furthermore, for example, an LED that emits visible light can be used as the illumination unit 17, and among these, a white light or green light LED is preferable.

[0074] Furthermore, the statement that the optical axis of the illumination unit 17 is directed toward the gap CL means that the illumination unit 17 is positioned so as to be able to irradiate light toward the gap CL, which is located at a predetermined distance L downstream from the attachment reference position OP.

[0075] The imaging unit 18, based on the control of the control unit 19a, images the cut CL of the adhesive tape 21 that has been transported for a predetermined length L from the attachment reference position OP. The imaging unit 18 is, for example, a camera. When imaging, the imaging unit 18 is positioned on the adhesive tape 21 side of the tape-shaped member 2 with its optical axis aligned with the cut CL, and images the tape-shaped member 2 while it is illuminated from the adhesive tape 21 side by the illumination unit 17.

[0076] The optical axis of the imaging unit 18 does not have to be perpendicular to the tape-like member 2. For example, the optical axis of the imaging unit 18 may be at an angle of about 15° to the perpendicular to the tape-like member when viewed from the transport direction of the tape-like member 2. Also, the optical axis of the imaging unit 18 does not need to perfectly coincide with the gap CL. It is sufficient that the gap CL can be recognized from the image captured by the imaging unit 18.

[0077] The panel stage 101 holds the display panel P and positions it at the attachment position. The upper surface of the panel stage 101 is a holding surface for holding the display panel P. The display panel P is placed on this holding surface and held in place by a suction circuit (not shown). The backup unit 111 has XYZθ drive axes (not shown) and positions the display panel P at the attachment position, supporting the position where the adhesive tape 21 on the edge of the display panel P is attached, i.e., the attachment area. Therefore, positioning the panel stage 101 at the attachment position means positioning the attachment area on the display panel P at the attachment position. The panel stage 101 is an example of a stage unit on which an object to be attached is placed.

[0078] In this embodiment, the conveying unit 14 transports the tape-like member 2 downstream by the length L of the adhesive tape 21 required for attachment, starting from a state where the cut CL is positioned at the attachment reference position OP. This positions the half-cut position at the attachment reference position OP. However, in this state, the transport of the tape-like member 2 may cause a misalignment between the attachment reference position OP and the position of the cut CL.

[0079] As described above, the imaging unit 18 is mounted on the moving mechanism 113. For imaging, the moving mechanism 113 moves in the X direction so that the optical axis of the imaging unit 18 is at the planned position of the cut CL, which is sent downstream by a length L from the adhesive reference position OP. At this position, the imaging unit 18 images the tape-shaped member 2, including the cut CL of the adhesive tape 21 that is to be cut. The length of the adhesive tape 21 that is to be cut is the length of the tape L that is returned upstream from the cut CL. Therefore, if the position of the cut CL, which is sent from the adhesive reference position OP, is shifted by a length L from the adhesive reference position OP, the position of the length returned upstream by the tape length L from the cut CL will be shifted, and in this case, a shift will occur at the half-cut position. Hereinafter, the imaging of the tape-shaped member 2, including the cut CL of the adhesive tape 21, by the imaging unit 18 will also be referred to as the first imaging.

[0080] Furthermore, after the adhesive tape 21 is imaged by the imaging unit 18, the control unit 19a recognizes the position of the cut CL from the imaged image, and uses the recognized position of the cut CL, the tape length L, and the information of the adhesive reference position OP to calculate the amount of deviation between the adhesive reference position OP and the planned half-cut position. The amount of deviation calculated at this time is also called the first amount of deviation.

[0081] The transport unit 14 works in cooperation with the supply unit 12 to adjust the misalignment between the half-cut position and the adhesive reference position OP according to the first misalignment amount. In other words, if the image analysis of the captured image shows that the half-cut position is shifted downstream of the adhesive reference position OP, the supply unit 12 pulls the tape-like member 2 upstream by the amount of the misalignment. Also, if the image analysis shows that the half-cut position is shifted upstream of the adhesive reference position OP, the transport unit 14 sends the tape-like member 2 downstream by the amount of the misalignment. This adjustment may cause misalignment again, but the movement distance at this time is small, so the error is small. For this reason, the movement error at this time can be ignored.

[0082] After adjusting the half-cut position, the imaging unit 18 takes another image of the cut CL. After imaging, the control unit 19a calculates the amount of deviation between the half-cut position and the adhesive reference position OP again. After adjusting the half-cut position according to the first amount of deviation, imaging the adhesive tape 21 including the cut CL will be referred to as the second imaging below.

[0083] Furthermore, after adjustment and transport, and after the cutting point CL is imaged by the imaging unit 18, the control unit 19a uses the information of the cutting point CL, the tape length L, and the adhesive reference position OP to calculate the amount of deviation between the adhesive reference position OP and the half-cut position. The amount of deviation calculated at this time is also called the second amount of deviation.

[0084] After calculating the second amount of displacement, the cutting unit 16 adjusts the half-cut position according to this amount of displacement. The cutting unit 16 adjusts the half-cut position by moving along the transport direction of the adhesive tape 21 according to the amount of displacement. In this embodiment, the cutting unit 16 adjusts the half-cut position by moving in the +X direction or the -X direction according to the amount of displacement in the X direction between the half-cut position and the adhesive reference position OP. Also, to avoid interference between the cutting unit 16 and the imaging unit 18 when the cutting unit 16 moves to the half-cut position, the moving mechanism 113 retracts in the +X direction. After the cutting unit 16 moves to the half-cut position, the half-cut is performed.

[0085] Furthermore, after the half-cut line HC is formed, in order to attach the adhesive tape 21 to the display panel P, the moving mechanism 113 moves in the -X direction, taking into account the second displacement amount, to position the upstream end of the backup unit 111 in the transport direction at the half-cut line HC. Specifically, in addition to moving to the attachment reference position OP, it is positioned at a position moved in the X direction by the second displacement amount. Also, in order to avoid interference between the cutting unit 16 and the imaging unit 18 or the backup unit 111, the moving mechanism 162 moves in the +Y direction to retract the cutting unit 16. Furthermore, if the pressure head 110 is configured to move in the X direction, the upstream end of the pressure head 110 in the transport direction may be further positioned at the half-cut line HC.

[0086] In this manner, the adhesive device 1 positions the upstream end of the backup unit 111 and the pressure head 110 in the transport direction (X direction) relative to the half-cut line HC based on the second amount of deviation between the adhesive reference position OP and the half-cut position.

[0087] Referring back to Figure 5, after the positioning of the backup unit 111 is complete, the panel stage 101 places the adhesive area on the edge of the held display panel P so that it is supported by the backup unit 111.

[0088] The display panel P is positioned by the panel stage 101 such that the mounting area overhangs and is held by the panel stage 101, and the mounting area is supported from below by a backup at the attachment position. At this time, the panel stage 101 is positioned taking into account a second amount of misalignment. While the panel stage 101 is positioning the display panel P at the attachment position, alignment marks are captured from above by a camera (not shown) and the position is recognized. The attachment area of ​​the display panel P is corrected and positioned at the attachment position based on this recognized position and the position of the half-cut line HC.

[0089] After the display panel P is positioned, the pressure head 110 moves downward and applies pressure to the display panel P using the tape-shaped member 2.

[0090] Figure 6 is a schematic diagram showing the application process using the adhesive device 1 in the first embodiment.

[0091] Figure 6(A) shows the state before application using the application device 1 in the first embodiment, and Figure 6(B) shows the state during application using the application device 1 in the first embodiment.

[0092] As described above, the attachment area of ​​the backup unit 111, the pressure head 110, and the display panel P is positioned at the calculated half-cut line HC of the adhesive tape 21, and attachment is performed in this state. As shown in Figure 6(A), the backup unit 111 and the pressure head 110 are aligned with the half-cut line HC. In this state, as shown in Figure 6(B), the pressure head 110 descends and attaches the portion of the adhesive tape 21 to the display panel P.

[0093] When the adhesive tape is applied repeatedly, the half-cut line HC of the applied adhesive tape 21 becomes the cut line CL, and this cut line CL is positioned near the application reference position OP. For this reason, the operation of feeding the cut line CL to the application reference position OP may be omitted. Through the above operation, after the conveyance is complete, the adhesive tape 21 in this embodiment has a half-cut line HC formed, and the backup section 111 and the pressure head 110 are positioned at the application position.

[0094] Here, as a comparative example, in the case of an adhesive device 1' in which the backup unit 111 is fixedly positioned with respect to the adhesive reference position OP, and the cutting unit 16 that performs a half-cut at a location away from the adhesive reference position OP to avoid interference is fixedly positioned, the state of adhesion will be schematically shown and explained in Figures 7, 8, and 9. Note that the same components as those in adhesive device 1 are denoted by the same reference numerals. In the adhesive device 1' shown in Figures 8 and 9, an example is shown in which adhesive tape 21 cut to the same length as the pressure width (length in the X direction) of the pressure head 110 is attached to the display panel P.

[0095] In this comparative example, the half-cut line HC is positioned at the adhesive reference position OP, the left end in the X direction of the backup unit 111 and the left end in the X direction of the pressure head 110 are positioned, and the cut adhesive tape 21 is attached to the adhesive area of ​​the display panel P. Figure 7(A) shows the state in which the half-cut line HC has been transported to the adhesive reference position OP before attachment, Figure 7(B) shows the state in which the pressure head 110 is descending and pressing the tape-like member 2 during attachment, and Figure 7(C) shows the state in which the pressure head 110 has risen after attachment and the adhesive tape 21 of the tape-like member 2 has been attached.

[0096] In the adhesive device 1' shown in Figures 7, 8, and 9, there is no moving mechanism 162, and the cutting section 16 forms a half-cut line HC at a fixed position in the X direction of the tape-like member 2. After several half-cut lines HC have been formed, the tape-like member 2 is transported by the transport section 14 (not shown in Figures 8 and 9) so that the half-cut lines HC reach the adhesive reference position OP.

[0097] However, the tape-like member 2 generally has a high elastic modulus and undergoes expansion and contraction. Furthermore, when it is pulled out from the supply unit and transported in the transport unit as shown in Figure 4, the expansion and contraction become even larger. In addition, slippage and other issues occur in the transport unit 14. As a result, the transport error of the tape-like member 2 becomes large. In the adhesive device 1' as in the comparative example, the transport error of the tape-like member 2 is not corrected, so adhesion defects are likely to occur. Here, we will explain the adhesion defect that occurs when the positioning of the half-cut line HC to the adhesion reference position OP is misaligned due to the transport error of the tape-like member 2.

[0098] Figure 8 shows a situation where the adhesive tape 21 is not fed enough at the application position. Figure 9 shows a situation where the adhesive tape 21 is fed too far at the application position.

[0099] Figures 8(A) and 9(A) show the state before application, Figures 8(B) and 9(B) show the state during application, and Figures 8(C) and 9(C) show the state after application.

[0100] Figure 8 shows a situation where the adhesive tape 21 is not fed sufficiently at the attachment position. That is, as shown in Figure 8(A), when the pressure head 110 applies pressure to the display panel P with the half-cut line HC shifted upstream of the attachment reference position OP, the adhesive tape 21 protrudes upstream from the area pressed by the pressure head 110. In this case, as shown in Figure 8(B), the protruding portion is not pressed, resulting in a defective attachment where parts are not adhered. If the attachment is completed in this state, as shown in the circled area of ​​Figure 8(C), the protruding portion of the adhesive tape 21 will not adhere and will peel up.

[0101] Figure 9 shows a situation where the adhesive tape 21 is fed too far at the application position. Specifically, as shown in Figure 9(A), when the position of the half-cut line HC is shifted downstream from the application reference position OP, and as shown in Figure 9(B), the pressure head 110 applies pressure to the display panel P with the tape-like member 2, the pressure head 110 wraps up the adhesive tape 21 to be used for the next application, resulting in poor application. Figure 9(C) shows how the wrapped adhesive tape 21 on the upstream side is torn. Furthermore, on the downstream side, the adhesive tape 21 protrudes downstream from the area pressed by the pressure head 110, and the protruding portion is not pressed and results in poor application.

[0102] Figure 10 is an example of a block diagram of the adhesive device 1 control unit 19a in the first embodiment.

[0103] The control unit 19a can be implemented, for example, by installing a program for the control unit 19a on a PC (Programmable Controller). The CPU within the control unit 19a executes the program for the control unit 19a, thereby realizing the functions of the adhesion control unit 190, tape transport control unit 191, cutting control unit 193, imaging control unit 195, calculation unit 196, movement mechanism control unit 197, correction movement control unit 198, and storage unit 199.

[0104] The adhesion control unit 190 controls the heater, lifting device, and movement in the X direction provided on the adhesion unit 11. The adhesion control unit 190 controls the heater to heat the pressure head 110, controls its movement in the X direction, and controls the lifting device to raise and lower the pressure head 110. The adhesion control unit 190 heats the heater provided on the adhesion unit 11 at a predetermined timing, such as at the start of processing. After the positioning of the pressure head 110, backup unit 111, and display panel P is completed, the adhesion control unit 190 lowers the pressure head 110 to perform adhesion.

[0105] Furthermore, the adhesion control unit 190 controls the moving mechanism provided in the peeling unit 15 and moves the peeling rods 150 and 151 horizontally to peel the release tape 22 from the tape-like member 2. For example, in response to a signal indicating the end of adhesion, the moving mechanism is controlled to move the peeling rods 150 and 151 horizontally from the downstream side to the upstream side of the adhesion unit 11 while the release tape 22 is in contact with it, thereby peeling the release tape 22 from the adhesive tape 21 pressed onto the display panel P. Once the peeling of the release tape 22 is complete, the moving mechanism is returned to the downstream side.

[0106] The tape transport control unit 191 controls the transport unit 14 to transport the tape-shaped member 2 between the supply unit 12 and the collection unit 13. When transporting the tape-shaped member 2 from the supply unit 12 towards the collection unit 13, the roller 140 of the transport unit 14 is rotated to move the release tape 22 of the tape-shaped member 2, which is held by the roller 140, toward the collection unit 13 side (downstream side). At this time, the tension mechanism 121 operates so that a constant tension (tension force) is applied to the tape-shaped member.

[0107] When transporting the tape-shaped member 2 from the recovery unit 13 toward the supply unit 12, the roller 140 of the transport unit 14 is rotated to move the release tape 22 of the tape-shaped member 2, which is held by the roller 140, toward the supply unit 12 side (upstream side). At this time, the tension mechanism 121 operates to apply tension so that the tape-shaped member 2 does not slacken.

[0108] Furthermore, the tape transport control unit 191 controls the transport unit 14 to transport the tape-like member 2 for a predetermined length and to transport it so that the cut line CL and half-cut line HC are positioned at predetermined locations. These transport amounts (feed amounts) can be determined using information stored in the memory unit 199, for example. Transporting the tape-like member 2 for a predetermined length and stopping it at predetermined positions are performed in response to signals from the adhesion control unit 190 indicating the completion of adhesion, signals indicating the completion of peeling of the release tape 22, and signals from the cutting control unit 193 indicating the completion of half-cutting of the adhesive tape 21. In addition, the tape-like member 2 is transported or kept stopped in response to signals from the determination unit 196b.

[0109] The cutting control unit 193 controls the lifting mechanism provided in the cutting unit 16 to raise and lower the cutter 160. For example, when performing a half-cut, the cutting control unit 193 moves the moving mechanism 162 to a predetermined position, and then controls the lifting mechanism to raise the cutter 160 to perform a half-cut. The depth of the half-cut is adjusted by adjusting the amount the cutter 160 is raised based on the information of the tape-shaped member 2 stored in the memory unit 199.

[0110] The imaging control unit 195 controls the imaging of the imaging unit 18. For example, the imaging control unit 195 controls the imaging unit 18 to perform imaging when imaging is performed at the planned position of the cut CL of the adhesive tape 21 that has been sent downstream by a length L from the attachment reference position OP (the first imaging described above), and when imaging is performed at the cut CL of the adhesive tape 21 after adjustment and transport (the second imaging described above). It also controls the on / off of the illumination unit 17. More specifically, when imaging is performed by the imaging unit 18, the illumination unit 17 is turned on towards the cut CL. When imaging is not being performed by the imaging unit 18, the illumination unit 17 can be controlled to remain on or to be turned off.

[0111] The calculation unit 196 detects the break CL from the images captured by the imaging unit 18 in the first and second imaging. The calculation unit 196 may detect this break CL using, for example, the brightness value in the grayscale image. For example, it is conceivable to have the calculation unit 196 detect as a break CL any portion of the imaged tape-like member 2 that has a brightness value equal to or greater than a predetermined brightness value. The calculation unit 196 also calculates a first or second amount of displacement from the information of the position of the break CL, the tape length L, and the adhesive reference position OP. For example, in each imaging, the calculation unit 196 compares the positional relationship between the position returned to the upstream side of the tape length L from the detected break CL position and the adhesive reference position OP, and calculates the amount of displacement.

[0112] The movement mechanism control unit 197 controls the movement of the movement mechanism 113, the movement mechanism 162, and the panel stage 101. For example, when the imaging unit 18 is taking an image, the movement mechanism control unit 197 moves the movement mechanism 113 to position the optical axis of the imaging unit 18 at a position where the cut CL, which has been transported from the initial state, can be imaged. That is, it is positioned at a position downstream of a predetermined length L from the attachment reference position OP. Also, when the cutting unit 16 performs a half-cut, the movement mechanism control unit 197 retracts the movement mechanism 113 and moves the cutting unit 16 to the half-cut position. Furthermore, when attaching, the movement mechanism control unit 197 also controls the movement mechanism 113 to position the upstream end of the backup unit 111 at the attachment reference position OP or the half-cut line HC. Furthermore, the movement mechanism control unit 197 moves the panel stage 101 to position the adhesive area of ​​the display panel P at the adhesive reference position OP or the half-cut line HC, and places the edge of the display panel P on the upper surface of the backup unit 111.

[0113] In this embodiment, the movement mechanism control unit 197 controls the position of the end of the backup unit 111 at the attachment reference position OP or the half-cut line HC during attachment. However, it may also control the position of the backup unit 111 at a position where it can support the attachment area of ​​the display panel P.

[0114] The correction movement control unit 198 controls the correction operation according to the amount of misalignment. It generates a first control signal to control the tape transport control unit 191 and a second control signal to move the movement mechanism 113, the movement mechanism 162, the pressure head 110, and the panel stage 101.

[0115] The correction movement control unit 198 generates a first control signal that causes the supply unit 12 to feed out according to the first amount of displacement calculated by the calculation unit 196. This control signal is for feeding the tape-shaped member 2 by the calculated first amount of displacement and is output to the feed motor of the transport unit 14. The tape transport control unit 191 adjusts the position of the tape-shaped member 2 according to the first control signal.

[0116] Furthermore, the correction movement control unit 198 generates a second control signal to move the movement mechanism 113, the movement mechanism 162, the pressure head 110, and the panel stage 101 according to the second displacement amount calculated by the calculation unit 196. This control signal moves the movement mechanism 113, the movement mechanism 162, the pressure head 110, and the panel stage 101 by the calculated second displacement amount. To adjust the displacement amount, the movement mechanism 162 moves in the X direction based on the second control signal with respect to the adhesive reference position OP, fine-tuning the half-cut position. The movement mechanism 113 and the pressure head 110 also move in the X direction based on the second control signal to adjust the displacement amount and adjust the adhesive position. The panel stage 101 also moves based on the second control signal to adjust the displacement amount of the adhesive area (adhesion position on the panel), adjusting the adhesive position.

[0117] The storage unit 199 stores information necessary for the control of this embodiment. The storage unit 199 stores information such as the adhesive reference position OP, the feed (transport) amount, the movement position of the moving mechanism 113, the movement position of the moving mechanism 162, and the tape length L. The storage unit 199 may also store position data of the display panel P, position data of the area to be adhered, the imaging position of the imaging unit 18, the adhesion position of the backup unit 111, the pressing amount of the pressure head 110, the heating and pressing time, as well as setting information received from the operator. The storage unit 199 can use a storage device consisting of a recording medium such as an HDD (Hard Disk Drive) or semiconductor memory.

[0118] Figures 11 to 14 illustrate the adhesive operation of the adhesive device 1 in the first embodiment.

[0119] In the first embodiment, the attachment is carried out as follows. The adhesive tape 21, which is ACF, is cut to a predetermined length required for attachment and attached to the attachment position (attachment area) of the display panel P. At this time, first, the cut CL, which is the downstream end face of the adhesive tape 21 on the downstream side of the tape-shaped member 2, is positioned near the attachment reference position OP. This is also the state after the previous attachment has been completed (initial state). The cut portion 16 is retracted to the retracted position.

[0120] The tape transport control unit 191 causes the transport unit 14 to feed out the tape-like member 2 from the initial state by a length L required to cut the adhesive tape 21. This positions the planned half-cut position at the adhesive reference position OP. However, in cases such as the second or subsequent application, if the cut CL is positioned near the adhesive reference position OP, the operation of feeding the cut CL to the adhesive reference position OP may be omitted.

[0121] Furthermore, the imaging unit 18 is positioned downstream from the attachment reference position OP, at a distance equal to the length L of the adhesive tape 21 to be attached. In this state, the tape-shaped member 2 is transported for the length L of the adhesive tape to be attached, and the imaging unit 18 captures an image of the cut CL. From the captured image, the position of the cut CL is recognized, and the amount of displacement between the attachment reference position OP and the cut CL is calculated.

[0122] Next, based on the calculated displacement, the half-cut position is calculated so that the distance from the cut CL to the half-cut line HC is equal to the length of the adhesive tape to be applied, i.e., the predetermined length (cutting length) L required for application. The imaging unit 18 is retracted, and the cutting unit 16 is positioned at the cutting position. At this time, the X-direction position of the cutting unit 16 is positioned so that a half-cut can be performed at the calculated half-cut position, and the adhesive tape 21 is half-cut.

[0123] In other words, a half-cut is performed by shifting the position of the cutting section 16, which is positioned at the adhesive reference position OP, in the X direction by the amount of displacement of the cut CL calculated based on the adhesive reference position OP. In this way, the cutting section 16 is moved in the X direction, which is the transport direction of the tape-like member 2, according to the amount of displacement between the adhesive reference position OP and the first cut CL, and the formation position of the second cut, the half-cut line HC, is adjusted. That is, the half-cut position is adjusted by moving in a direction along the transport direction of the adhesive tape.

[0124] After the half-cut is complete, the cutting section 16 retracts, and the pressure head 110 and backup section 111 are positioned at the adhesive reference position OP. Simultaneously, based on the calculated displacement, the panel stage 101 positions the adhesive area of ​​the display panel P at the adhesive position. The lower surface of the adhesive area at the edge of the display panel P is supported by contacting the upper surface of the backup section 111. Then, the pressure head 110 descends, pressing the release tape 22 of the tape-like member 2 and pressing the adhesive tape 21 onto the display panel P, thereby attaching the adhesive tape 21 to the display panel P. The process will be explained in detail below with reference to the drawings.

[0125] Figure 11(A) shows the state in which the adhesive device 1 has started adhesive application in the first embodiment, and Figure 11(B) shows the state in which the imaging unit 18 is imaging the cut CL in the first embodiment. Figure 12(A) shows the state in which the transport unit 14 is cooperating with the supply unit 12 to adjust the misalignment between the adhesive reference position OP and the half-cut position in the first embodiment, and Figure 12(B) shows the state in which the cutting unit 16 is performing a half-cut in the first embodiment. Figure 13(A) shows the state in which the backup unit 111 and the pressure head 110 are positioned at the adhesive application position in the first embodiment. Figure 13(B) shows the state in which the pressure head 110 is performing adhesive application in the first embodiment. Figure 14 shows the state after adhesive application is completed in the first embodiment.

[0126] Figure 11(A) shows the state in which the adhesive device 1 has started to adhere the tape-like member 2. In this state, the half-cut position of the tape-like member 2 has been fed to the adhesive reference position OP, and the upstream end in the transport direction of the pressure head 110 is aligned with the adhesive reference position OP. In this state, the cutting section 16 is retracted in the +Y direction. Furthermore, this state can also be interpreted as showing the state in which the adhesive tape 21 has been attached and the attached display panel P has been discharged from the attachment position.

[0127] Figure 11(B) shows the state in which the imaging unit 18 is imaging the cut CL of the adhesive tape 21. The moving mechanism control unit 197 moves the moving mechanism 113 in the -X direction from the position shown in Figure 11(A) (retracted position) to a position in which the imaging unit 18 can image the cut CL of the adhesive tape 21. This position is a distance of a predetermined length, the cut length L, in the +X direction from the adhesive reference position OP, that is, the position of the cut CL that has been transported from the initial state. After the positioning of the imaging unit 18 is complete, the imaging control unit 195 controls the imaging unit 18 to perform imaging.

[0128] Furthermore, after imaging by the imaging unit 18, the calculation unit 196 calculates a first displacement between the half-cut position and the adhesive reference position OP. The calculation unit 196 calculates the first displacement by, for example, comparing a position obtained by moving back a predetermined length L upstream from the cut CL with the position of the adhesive reference position OP and detecting the displacement between these positions.

[0129] Figure 12(A) shows the state in which the misalignment of the half-cut position is being adjusted. The transport unit 14 works in cooperation with the supply unit 12 to adjust the misalignment between the half-cut position and the adhesive reference position OP based on the first misalignment amount calculated. In other words, if the image analysis of the image captured by the imaging unit 18 shows that the half-cut position is shifted downstream of the adhesive reference position OP, the tape-like member 2 is pulled back upstream by the amount of the misalignment. Also, if the image analysis shows that the half-cut position is shifted upstream of the adhesive reference position, the tape-like member 2 is sent downstream by the amount of the misalignment. This type of transport is also called adjusted transport.

[0130] Furthermore, after adjustment and transport, the imaging unit 18 takes another image of the cut CL of the adhesive tape 21. After imaging, the calculation unit 196 calculates a second amount of deviation between the half-cut position and the adhesive reference position OP.

[0131] Figure 12(B) shows the state in which the cutting unit 16 performs a half-cut, continuing from the state in Figure 12(A). When positioning the cutting unit 16 at the half-cut position, the imaging unit 18 and the backup unit 111 may interfere with each other. Therefore, the movement mechanism control unit 197 moves the movement mechanism 113 in the +X direction to a position where the imaging unit 18 and the backup unit 111 do not interfere with the cutting unit 16, thereby retracting it. This movement position can be, for example, coordinates that have been previously stored in the storage unit 199. This movement position is also called the standby position or retracted position of the movement mechanism 113.

[0132] Furthermore, after the imaging unit 18 and the backup unit 111 have been retracted, the movement mechanism control unit 197 controls the Y-direction movement mechanism 162b of the movement mechanism 162 to move the cutting unit 16 in the -Y direction. The movement position in the -Y direction can be, for example, coordinates that have been stored in the storage unit 199 in advance. This Y position is the Y-direction position (cutting position) where the tape-like member 2 is cut (half-cut), and is directly below the transport path of the tape-like member 2. At this time, the position of the cutting unit 16 in the X direction coincides with the adhesive reference position OP. In other words, the reference position of the cutting unit 16 in the X direction is set to the adhesive reference position OP.

[0133] The movement mechanism control unit 197 moves the movement mechanism 162 in the +X direction or -X direction from the attachment reference position OP according to the second displacement amount calculated by the calculation unit 196. In other words, the movement mechanism control unit 197 moves the X-direction movement mechanism 162a according to the displacement amount, and adjusts the X-direction position of the cutting section 16. This position after movement becomes the half-cut position of the cutting section 16.

[0134] Figure 12(B) shows the cutting section 16 positioned at the actual half-cut location, and the adhesive tape 21 being half-cut. After the moving mechanism 162 is positioned at the half-cut location, the cutting control unit 193 controls the lifting mechanism provided on the cutting section 16 to raise the cutter 160 and perform the half-cut. After the half-cut is complete, the cutting control unit 193 controls the lifting mechanism again to lower the cutter 160.

[0135] After the cutting section 16 performs a half-cut, forming a half-cut line HC on the adhesive tape 21, the movement mechanism control unit 197 moves the movement mechanism 162 in the +Y direction to avoid interference between the imaging unit 18 and the cutting section 16 when positioning the backup unit 111. This causes the cutting section 16 to retract from its cutting position.

[0136] Figure 13(A) shows the state in which the backup unit 111 is positioned at the adhesive reference position OP. The movement mechanism control unit 197 moves the movement mechanism 113 in the -X direction from the position shown in Figure 12(B) (retracted position) to position the upstream end of the backup unit 111 to coincide with the adhesive reference position OP. This moved position may be, for example, a position moved by a second displacement amount in addition to the movement to the adhesive reference position OP, or a position that coincides with the half-cut line HC. The adhesive control unit 190 may also position the upstream end of the pressure head 110 from the adhesive reference position OP to the half-cut line HC according to the second displacement amount.

[0137] Figure 13(B) shows the state in which the adhesive area of ​​the display panel P is positioned at the adhesive position, the pressure head 110 is lowered, and the pressure head 110 performs the adhesive application. After the backup unit 111 and the pressure head 110 are positioned at the position shown in Figure 13(A), similarly, based on the calculated displacement amount, the adhesive position (adhesion area) on the display panel P is positioned at the position corresponding to the half-cut line HC by moving the panel stage 101. This aligns the pressure head 110, the backup unit 111, and the display panel P. At this time, the back surface of the adhesive area of ​​the display panel P is supported by the backup unit 111. Subsequently, the adhesive control unit 190 controls the lifting device and lowers the pressure head 110. The adhesive tape 21 is then applied by pressure from the pressure head 110 via the anti-adhesion member 111a.

[0138] Figure 14 shows the completed state of adhesion. After the adhesive tape 21 is attached to the display panel P, the adhesion control unit 190 controls the lifting device to raise the pressure head 110. After the pressure head 110 is raised, the peeling unit 15 is controlled to move horizontally from the downstream side to the upstream side, thereby peeling the release tape 22 from the adhesive tape 21 that has been pressed onto the display panel P. Once the release tape 22 has been peeled off and the adhesion is complete, the display panel P is moved to an unshown discharge position by moving the panel stage 101 under the control of the moving mechanism control unit 197.

[0139] Figure 15 is a flowchart of the attachment process in the first embodiment.

[0140] This flowchart describes the process of applying the tape, starting from the initial state where the display panel P is placed on the panel stage 101 and the upstream end of the pressure head 110 is positioned at the application reference position OP. In this state, the cut CL of the tape-like member 2 is assumed to be positioned at the application reference position OP. Furthermore, it is assumed that the information necessary for processing, such as the application reference position OP, is loaded from the storage unit 199 when the program of the control unit 19a is executed.

[0141] In step S1, the tape transport control unit 191 moves the tape-shaped member 2, which has a constant tension applied by the tension mechanism 121, in the transport direction using the transport unit 14. At this time, based on the feed amount (transport amount) loaded from the memory unit 199, the tape is moved to the adhesive reference position OP at the planned half-cut position. In step S2, the movement mechanism control unit 197 moves the movement mechanism 113 in the -X direction to position the optical axis of the imaging unit 18 at a position where it can image the cut CL sent from the adhesive reference position OP. After that, the imaging control unit 195 controls the imaging unit 18 to perform the first image.

[0142] In step S3, the calculation unit 196 calculates a first displacement amount from the image captured by the imaging unit 18 in step S2. The correction movement control unit 198 generates a first control signal corresponding to this displacement amount. In step S4, the tape transport control unit 191 controls the transport unit 14 and the supply unit 12 according to the first control signal to adjust the position of the tape-like member 2.

[0143] In step S5, the imaging control unit 195 controls the imaging unit 18 to perform a second image capture. In step S6, the calculation unit 196 calculates a second displacement amount from the image captured by the imaging unit 18 in step S2. The correction movement control unit 198 also generates a second control signal corresponding to this displacement amount.

[0144] In step S7, the moving mechanism control unit 197 controls the moving mechanism 113 to retract the imaging unit 18 and the backup unit 111 in the +X direction, and then controls the moving mechanism 162 to move the cutting unit 16 to the half-cut position. At this time, the moving mechanism control unit 197 adjusts the position of the cutting unit 16 in the X direction by a control signal corresponding to the second amount of displacement. After the positioning of the cutting unit 16 is complete, the cutting control unit 193 controls the lifting mechanism to raise the cutter 160 and perform a half-cut. After the half-cut is complete, the cutting control unit 193 controls the lifting mechanism again to lower the cutter 160.

[0145] In step S8, the movement mechanism control unit 197 moves the movement mechanism 113 in the -X direction so that the upstream end of the backup unit 111 is at the half-cut line HC. This movement can be, for example, the distance to the adhesive reference position OP stored in the memory unit 199 plus a second displacement amount. Alternatively, depending on the second displacement amount, the adhesive control unit 190 may position the upstream end of the pressure head 110 from the adhesive reference position OP to the half-cut line HC. Based on the calculated displacement amount, the adhesive position (adhesion area) on the display panel P is positioned at the position corresponding to the half-cut line HC by moving the panel stage 101. At this time, the back surface of the adhesive area of ​​the display panel P is supported by the backup unit 111. After the positioning of the backup unit 111 and the pressure head 110 and the positioning of the display panel P are completed, the adhesive control unit 190 controls the lifting device to lower the pressure head 110 and perform the adhesion (step S9).

[0146] In step S10, the adhesion control unit 190 controls the moving mechanism provided in the peeling unit 15 to move the peeling rods 150 and 151 horizontally, peeling the release tape 22 from the tape-like member 2. This completes the adhesion of the adhesive tape 21 to the display panel P. After the release tape 22 is peeled off, the display panel P is transported to the discharge unit by moving the panel stage 101 under the control of the moving mechanism control unit 197.

[0147] In this embodiment, the adhesive device 1 adjusts and conveys the tape-like member 2 according to the calculated first displacement amount, and then moves the cutting section 16 according to the calculated second displacement amount to adjust the cutting position and perform a half-cut. However, the adhesive device 1 may adjust the position of the cutting section 16 according to this first displacement amount without performing adjustment conveying. In this operation, the adhesive device 1 does not need to perform the operation of positioning the upstream end of the pressure head 110 from the adhesive reference position OP to the half-cut line HC according to the first displacement amount.

[0148] The adhesive device 1 may perform adjustment transport according to the calculated first displacement amount, and assuming that the half-cut position is positioned at the adhesive reference position OP by the transport, it may perform a half-cut at this position by the cutting unit 16, ignoring the movement error associated with the adjustment transport. Similarly, the adhesive device 1 may perform adhesive by aligning the backup unit 111, the pressure head 110, and the upstream end of the adhesive area of ​​the display panel P with the adhesive reference position OP.

[0149] According to this embodiment, the adhesive device 1 takes into account the amount of deviation between the half-cut position and the adhesive reference position OP, and moves the moving mechanism 162 to perform a half-cut of the tape-like member 2 to a predetermined length L. As a result, even if the tape-like member 2 stretches or there are transport errors, a half-cut can be performed to a predetermined length, enabling highly accurate adhesive application.

[0150] Furthermore, according to this embodiment, the adhesive device 1 performs a half-cut on the tape-like member 2 after transport is complete, aligns the position of the display panel P with this cut position, and then adheres it. As a result, the adhesive device 1 is not affected by the stretching or feeding accuracy of the tape-like member 2 and can adhere the tape-like member 2 to the desired adhesion position, thereby ensuring high adhesion accuracy.

[0151] Furthermore, according to this embodiment, after the half-cut line HC is formed, the tape-like member 2 is attached without being moved. This eliminates positional displacement caused by the feeding of the tape-like member 2 in the attachment device 1.

[0152] The adhesive tape 21, which is attached with high precision by the attachment device 1 having the features of the embodiment described above, allows for high-precision temporary and permanent crimping of the electrode terminals of the electronic component C. This enables high-density mounting by the mounting device 7.

[0153] (Second Embodiment) Figure 16 is an example of a block diagram of the control unit 19a in the second embodiment.

[0154] In this embodiment, the configuration of the adhesive device 1 is the same as in Figure 4, so its description is omitted. Below, we will mainly describe the parts that differ from the embodiment described above.

[0155] Before positioning the half-cut position at the adhesive reference position OP, errors in the feed amount may occur due to the stretching and transport of the tape-like member 2 when the cut end CL of the adhesive tape 21 to be attached is positioned at the adhesive reference position OP. Furthermore, as the transport of the tape-like member 2 is repeated, the errors may accumulate and become larger.

[0156] In the first embodiment, the tape-like member 2 was adjusted and transported according to the amount of misalignment between the cut CL and the adhesive reference position OP. In this embodiment, an allowable range is provided for the amount of misalignment between the cut CL and the adhesive reference position OP, and if this allowable range is exceeded, the tape-like member 2 is adjusted and transported to position the cut CL at a position where the amount of misalignment is within the allowable range. This ensures that the cut CL can be reliably imaged by the imaging unit 18. This avoids the adhesive device 1 stopping due to inability to image, and prevents a decrease in productivity.

[0157] In this embodiment, the imaging unit 18 performs imaging when the cut CL of the tape-like member 2 has been advanced by a predetermined length (cut length) L required for attachment from the attachment reference position OP, before performing the first and second imaging. The movement mechanism control unit 197 controls the movement mechanism 113 to move the imaging unit 18 in the -X direction so that its optical axis is at the attachment reference position OP. After the movement is complete, the imaging control unit 195 controls the imaging unit 18 to image the cut CL.

[0158] Furthermore, in this embodiment, the control unit 19a shown in Figure 10 has a determination unit 196b that makes a determination regarding the allowable range of the displacement amount calculated by the calculation unit 196. In other words, in the control unit 19a of this embodiment, the calculation unit 196 includes a displacement amount calculation unit 196a and a determination unit 196b.

[0159] The displacement amount calculation unit 196a detects the break CL based on the image of the tape-shaped member 2 obtained by the first imaging. The displacement amount calculation unit 196a also calculates the first displacement amount from the detected break CL. For example, the displacement amount calculation unit 196a compares the positional relationship between the position of the detected break CL and the adhesive reference position OP and calculates the positional displacement amount.

[0160] The determination unit 196b determines whether the first displacement amount calculated by the displacement amount calculation unit 196a is within the allowable range. The allowable value used for the determination can be information stored in the storage unit 199 in advance. This allowable value can be determined by the field of view of the imaging unit 18 and transport experiments, etc. For example, since the gap CL must be imaged, the allowable value must be smaller than the imaging field of view. Based on the average displacement amount obtained from transport experiments, etc., it can be set to a distance that does not go outside the field of view in the next transport.

[0161] If it is determined that the amount of displacement is not within the allowable range, the tape-like member 2 is adjusted and transported once again. The determination unit 196b calculates the amount of displacement by setting the adhesive reference position OP as the zero point, subtracting the displacement on the upstream side and adding the displacement on the downstream side. This makes it possible to recognize whether the displacement CL has exceeded the allowable value on the upstream side or the allowable value on the downstream side relative to the adhesive reference position OP.

[0162] The corrective movement control unit 198 generates a first control signal according to the determination result of the determination unit 196b. For example, if the determination unit 196b determines that the first misalignment is within the acceptable range, the corrective movement control unit 198 does not generate a second control signal. On the other hand, if the determination unit 196b determines that the first misalignment is not within the acceptable range, the corrective movement control unit 198 generates a second control signal that drives the feed motor of the transport unit 14 according to the misalignment amount calculated by the misalignment amount calculation unit 196a. This control signal is for transporting the tape-shaped member 2 so that the calculated misalignment amount is within the acceptable range, and is output to the feed motor. The tape transport control unit 191 feeds out or pulls back the tape-shaped member 2 according to the second control signal. This movement (transportation) causes misalignment again, but since the distance of this movement is smaller compared to the initial feed, the error is smaller.

[0163] Furthermore, after the tape-shaped member 2 has been adjusted and transported, the imaging unit 18 takes another image of the cut CL. After that, the position of the cut CL is moved until the amount of displacement falls within the allowable range.

[0164] Figure 17 illustrates the determination of the amount of displacement in the second embodiment.

[0165] Figure 17(A) shows an example in the second embodiment where the amount of displacement is within the allowable range, and Figure 17(B) shows an example in the second embodiment where the amount of displacement is not within the allowable range.

[0166] In this embodiment, when the determination unit 196b determines the amount of displacement, it sets an allowable range of σ in both the upstream and downstream directions, centered on the adhesive reference position OP. Figure 17(A) shows that the cut CL is shifted upstream of the adhesive reference position OP, and this displacement is smaller than σ. In this case, the determination unit 196b determines that the displacement is within the allowable range. On the other hand, Figure 17(B) shows that the cut CL is shifted downstream of the adhesive reference position OP, and this displacement is larger than σ. In this case, the determination unit 196b determines that the displacement is not within the allowable range on the downstream side. Also, in Figures 17(A) and 17(B), the position a predetermined cutting length L away from the adhesive reference position OP is indicated by a dashed line.

[0167] As shown in the example in Figure 17(B), if the determination unit 196b determines that the amount of displacement is not within the allowable range, the tape-shaped member 2 is transported again, targeting a position a predetermined cutting length L away from the attachment reference position OP of the cut CL. At this time, whether to transport it upstream or downstream depends on the determination of which side it was displaced to. Also, there is a possibility that displacement may occur again due to this movement. Therefore, after the tape-shaped member 2 has been transported, the imaging unit 18 takes another image of the cut CL, and the displacement amount calculation unit 196a calculates the amount of displacement. In this way, the transport for position adjustment is carried out until the amount of displacement is within the allowable range.

[0168] Furthermore, during the initial imaging by the imaging unit 18, the gap CL may not be within the field of view of the imaging unit 18. In such cases, the movement mechanism control unit 197 may move the movement mechanism 113 in the X direction. The movement mechanism control unit 197 moves the imaging unit 18 in the X direction by a predetermined distance from a state in which the optical axis of the imaging unit 18 is positioned at the attachment reference position OP, and then the imaging control unit 195 controls the imaging unit 18 to repeat the imaging. At this time, if the gap CL is not within the field of view of the imaging unit 18, the movement mechanism control unit 197 repeats the movement of the movement mechanism 113 and imaging by the imaging unit 18 until the gap is within the field of view. Limits may be set for the movement distance and the number of imaging cycles. For example, if the movement distance or the number of imaging cycles exceeds the limit, the displacement amount calculation unit 196a may output an error message.

[0169] Retaking the image is performed, for example, by moving the moving mechanism 113 by a predetermined distance in the +X or -X direction relative to the attachment reference position OP. When repeating the image, the movement distance may be gradually increased.

[0170] If a break line CL is captured due to a re-imaging, the correction movement control unit 198 generates a control signal, taking into account the distance the imaging unit 18 moves from the attachment reference position OP and the deviation between the center of the imaging unit 18 and the break line CL. Based on this, the break line CL is sent to the attachment reference position OP.

[0171] Figure 18 is a flowchart of the attachment process in the second embodiment.

[0172] This flowchart describes the process of attachment, starting from the initial state where the attachment area of ​​the display panel P is placed on the backup unit 111 and the upstream end of the pressure head 110 is positioned at the attachment reference position OP. Furthermore, it is assumed that information necessary for the process, such as the attachment reference position OP and the allowable value of the misalignment, is loaded from the storage unit 199 when the program of the control unit 19a is executed. This flowchart also primarily describes aspects that differ from the embodiment described above.

[0173] In step S21, the tape transport control unit 191 moves the tape-shaped member 2 in the transport direction (+X direction) using the transport unit 14 from a position where the cut CL of the tape-shaped member 2, which is in its initial state, is located near the attachment reference position OP. At this time, the tape-shaped member 2 is moved to the attachment reference position OP based on the feed amount loaded from the storage unit 199. That is, it is transported for the length (cut length) L required for attachment. In step S22, the moving mechanism control unit 197 moves the moving mechanism 113 in the -X direction until the imaging unit 18 is in a position where it can image the cut CL. In other words, the imaging unit 18 is moved with a target position downstream of the attachment reference position OP by the cut length L. After that, the imaging control unit 195 controls the imaging unit 18 and performs imaging.

[0174] In step S23, the displacement amount calculation unit 196a detects the tear CL from the image captured by the imaging unit 18 in step S22 and recognizes its position. It then calculates the displacement between the recognized tear CL and the position downstream of the adhesive reference position OP by a length L. This calculated value corresponds to the first displacement amount. In step S24, the determination unit 196b determines whether the displacement between the tear CL and the position downstream of the adhesive reference position OP by a length L is within the acceptable range.

[0175] If it is determined that the amount of displacement is not within the acceptable range (NO in step S24), in step S25, the corrective movement control unit 198 generates a control signal to drive the transport unit 14 according to the displacement direction and amount of displacement calculated by the displacement amount calculation unit 196a. Based on this control signal, the transport unit 14 is driven to move the tape-shaped member 2.

[0176] After step S25, the process returns to step S22, and the imaging unit 18 takes an image of the gap CL. The flow from step S22 to step S25 is repeated until the determination unit 196b determines that the amount of displacement is within the acceptable range.

[0177] If the amount of misalignment is determined to be within the acceptable range (YES in step S24), it is determined that the planned half-cut position of the tape-like member 2 has been positioned at the adhesive reference position OP. In other words, no further adjustment conveying according to the first amount of misalignment is performed.

[0178] From here on, the half-cut is performed in the same flow as in steps S6 to S7. The imaging control unit 195 does not perform a second imaging and uses the image captured in the final step S23. In step S26, the calculation unit 196 calculates the second displacement amount from the image captured in step S23. In step S27, the movement mechanism control unit 197 controls the movement mechanism 113 to retract the imaging unit 18 and the backup unit 111 in the +X direction, and then controls the movement mechanism 162 to move the cutting unit 16 to the half-cut position. At this time, the movement mechanism control unit 197 adjusts the position of the cutting unit 16 in the X direction by a control signal corresponding to the second displacement amount. After the positioning of the cutting unit 16 is completed, the cutting control unit 193 controls the lifting mechanism to raise the cutter 160 and perform the half-cut. After the half-cut is completed, the cutting control unit 193 controls the lifting mechanism again to lower the cutter 160.

[0179] The operations in steps S28 to S30 are the same as those in steps S8 to S10, so their explanation is omitted. After the release tape 22 is peeled off, the display panel P is transported to the discharge section by moving the panel stage 101 under the control of the moving mechanism control unit 197.

[0180] The adhesive device 1 may perform adjustment transport according to the calculated first displacement amount, and assuming that the half-cut position is positioned at the adhesive reference position OP by the transport, it may perform a half-cut at this position by the cutting unit 16, ignoring the movement error associated with the adjustment transport. Similarly, the adhesive device 1 may perform adhesive by aligning the backup unit 111, the pressure head 110, and the upstream end of the adhesive area of ​​the display panel P with the adhesive reference position OP.

[0181] In the embodiments described above, the backup unit 111 and the imaging unit 18 were mounted on the moving mechanism 113, but this is not the only configuration. The backup unit 111 and the imaging unit 18 may be mounted on separate moving mechanisms and moved independently.

[0182] According to this embodiment, the adhesive device 1 does not perform adjustment transport of the tape-like member 2 if the amount of misalignment between the adhesive reference position OP and the cut CL is within the allowable range. Therefore, since adjustment transport is not performed when it does not affect the adhesive accuracy, productivity can be increased without compromising adhesive accuracy.

[0183] According to this embodiment, the adhesive device 1 readjusts the position of the cut CL until the amount of misalignment between the adhesive reference position OP and the cut CL is within an acceptable range. As a result, the adhesive device 1 can position the adhesive tape 21 at the adhesive position with high positioning accuracy, and variations in the length and adhesive position of the adhesive tape 21 can be suppressed.

[0184] Furthermore, according to this embodiment, since the variation in the cutting position is reduced by readjusting the position of the adhesive device 1, it is not necessary to increase the range of movement of the moving mechanism 162 on which the cutting unit 16 is mounted, thereby suppressing the enlargement of the adhesive device 1 and the increase in power consumption.

[0185] Furthermore, according to this embodiment, since the variation in the cutting position is reduced by readjusting the position, a high-magnification, narrow-field-of-view imaging unit 18 can be used when imaging the cut line CL, thereby improving the accuracy of position recognition.

[0186] Furthermore, according to this embodiment, if the cut CL is not within the field of view of the imaging unit 18, the attachment device 1 repeatedly moves the moving mechanism 113 to retake the image. This allows the cut CL to be imaged even if there is a large deviation of the cut CL from the attachment reference position OP, and the adhesive tape 21 to be reliably positioned at the attachment location.

[0187] In each of the embodiments described above, the backup unit 111 is positioned together with the pressure head 110 at the position of the half-cut line HC. However, the backup unit 111 does not necessarily have to be aligned with the detected half-cut line HC. The backup unit 111 only needs to be able to support the adhesion area of ​​the display panel P, and its upstream end face does not need to be aligned with the position of the half-cut line HC. This eliminates the time required to accurately align the backup unit 111 with the half-cut line HC, thereby shortening the cycle time.

[0188] The adhesive tape 21, which is attached with high precision by the attachment device 1 having the features of the embodiment described above, allows for high-precision temporary and permanent crimping of the electrode terminals of the electronic component C. This enables high-density mounting by the mounting device 7.

[0189] In the embodiments described above, the mounting device 7 was described as comprising one adhesive device 1, one temporary crimping device 3, and one main crimping device 5, but these devices may be provided in any number as needed.

[0190] Although several embodiments have been described above, these embodiments are presented only as examples and are not intended to limit the scope of the invention. The novel adhesive device 1 described herein can be implemented in a variety of other forms. Furthermore, various omissions, substitutions, modifications, and combinations can be made to the embodiments of the adhesive device 1 described herein without departing from the spirit of the invention. The appended claims and equivalents are intended to include such embodiments and modifications included in the scope and spirit of the invention.

[0191] 1: Adhesion device, 1': Adhesion device, 1a: Adhesion unit, 2: Tape-shaped member, 3: Temporary crimping device, 3a: Temporary crimping unit, 5: Main crimping device, 5a: Main crimping unit, 7: Mounting device, 9: Conveying device, 11: Adhesion section, 12: Supply section, 13: Recovery section, 14: Conveying section, 15: Peeling section, 16: Cutting section, 17: Illumination section, 18: Imaging section, 19, 19a, 19b, 19c: Control section, 21: Adhesive tape, 22: Release tape, 101: Panel stage, 110: Pressure head, 111: Backup section, 111a: Anti-adhesion member, 113: Moving mechanism, 121: Tension mechanism, 121a: Fixed roller, 121b: Movable roller, 122: Path roller, 131: Path roller, 140: Feed roller, 150: Peeling rod, 151: Peeling rod, 160: Cutter, 161: Backup member, 161a: Flat surface, 162: Moving mechanism, 162a: X-direction moving mechanism, 162b: Y-direction moving mechanism, 190: Adhesion control unit, 191: Tape transport control unit, 192: Peeling control unit, 193: Cutting control unit, 195: Imaging control unit, 196: Calculation unit, 196a: Shift amount calculation unit, 196b: Determination unit, 197: Moving mechanism control unit, 198: Correction moving control unit, 199: Memory unit, 300: Temporary crimping head, 301: Panel stage, 303: Backup unit, 500: Main crimping head, 501: Panel stage, 503: Backup unit C: Electronic component, P: Display panel, OP: Adhesion reference position, CL: Cut, HC: Half-cut line

Claims

1. An adhesive tape application device for applying adhesive tape to an object to be applied, comprising: a conveying unit that conveys the position where the second cut is formed toward an application reference position which serves as the basis for application when forming a second cut upstream of the first cut, which is the leading position of the adhesive tape, in the conveying direction; a stage unit on which the object to be applied is placed; an imaging unit that images the adhesive tape; a moving mechanism on which the imaging unit is mounted and which moves between the application reference position and a retracted position which is retracted from the application reference position along the direction in which the adhesive tape is conveyed; a cutting unit which moves between a retracted position which is retracted from the application reference position when the moving mechanism is located at the application reference position and a cutting position which forms the second cut in the adhesive tape at the application reference position; and a pressure head which moves in a direction toward and away from the object to be applied, and applies pressure to the object to be applied. The adhesive device is characterized in that the cutting section moves to the position of the first cut detected by imaging of the conveyed adhesive tape, and forms the second cut.

2. The adhesive device according to claim 1, characterized in that the imaging unit images the first cut at a position downstream in the transport direction equal to the length of the adhesive tape to be attached from the attachment reference position.

3. The adhesive device according to claim 1, characterized in that the pressure head moves further along the direction in which the adhesive tape is transported, and moves to the adhesive position based on the position of the first cut detected by the imaging.

4. The adhesive device according to claim 1, characterized in that the transport unit adjusts the position of the adhesive tape according to a first displacement amount calculated from the position of the first cut after transport, the length of the adhesive tape, and the reference position for adhesion.

5. The adhesive device according to claim 4, characterized in that the cutting portion moves along the direction in which the adhesive tape is transported, in accordance with the position of the first cut after the position of the adhesive tape, the length of the adhesive tape, and a second amount of displacement calculated from the reference position for adhesion, thereby adjusting the position in which the second cut is formed.

6. The attachment device according to claim 1, wherein the moving mechanism is further equipped with a backup unit that supports the attachment area of ​​the object to be attached to which the adhesive tape is attached, and moves in the direction of transporting the adhesive tape based on the position of the first cut detected by the imaging, and adjusts the position of the backup unit.

7. The adhesive device according to claim 1, characterized in that if the first deviation amount between the downstream position in the transport direction equal to the length of the adhesive tape applied from the adhesive reference position and the detected first cut is not within an acceptable range, the adhesive tape is further adjusted and transported so that the first deviation amount is within an acceptable range.

8. An electronic component mounting apparatus comprising: an attachment device according to any one of claims 1 to 7; a temporary crimping device for temporarily crimping an electronic component to a mounting object via the adhesive tape attached by the attachment device; a main crimping device for heating and pressurizing the mounting object to which the electronic component has been temporarily crimped by the temporary crimping device to make the adhesive tape electrically conductive and fix it in place; and a transport device for transporting the mounting object between the attachment device, the temporary crimping device, and the main crimping device.

Images