Wiring board, electronic component storage package, and electronic module

Abstract

A wiring board according to the present invention comprises a bottom body, a first insulating base, a second insulating base, and at least one signal conductor. The first insulating base has a first upper surface, a first side surface, a first bottom surface, and at least one notch cut out from the first bottom surface to the first side surface. The notch has a top surface below the first upper surface. The second insulating base and the signal conductor are positioned on the first upper surface. The second insulating base is spaced apart from the first side surface. At least part of the first bottom surface is joined to the bottom body. In a plan view, the notch overlaps the bottom body.

Description

Wiring Board, Package for Storing Electronic Components, and Electronic Module

[0001] The present disclosure relates to a wiring board, a package for storing electronic components, and an electronic module.

[0002] For example, in Patent Document 1 and Patent Document 2, a conventional wiring board is disclosed.

[0003] International Publication No. 2013 / 141013, Japanese Patent Application Laid-Open No. 2018-206879

[0004] The first wiring board according to the present disclosure includes a bottom body, a first insulating substrate, a second insulating substrate, and one or more signal conductors. The first insulating substrate has a first upper surface, a first side surface, a first lower surface, and one or more notch portions cut out from the first lower surface to the first side surface. The notch portion has a top surface below the first upper surface. The second insulating substrate and the signal conductors are located on the first upper surface. The second insulating substrate is spaced from the first side surface. At least a part of the first lower surface is joined to the bottom body. In a plan view, the notch portion overlaps the bottom body.

[0005] Furthermore, the first package for storing electronic components according to the present disclosure includes one or more first wiring boards and one or more wall bodies. The wall body constitutes a frame body located on the bottom body together with the first insulating substrate and the second insulating substrate. Each of the first wiring boards is provided in a direction in which the first side surface faces the inside of the frame body.

[0006] 18]] Furthermore, the first electronic module according to the present disclosure includes the first package for storing electronic components, an electronic component, and a lid body. The electronic component is located on the bottom body and is electrically connected to the signal conductor. The lid body is located on the frame body.

[0007] Furthermore, the second wiring board according to the present disclosure comprises an insulating substrate, one or more first signal conductors, and one or more second signal conductors. The insulating substrate has a first side surface, a first upper surface, a first lower surface, a first notch, a second notch, a third notch, and a fourth notch. The first notch is cut out from the first upper surface to the first side surface. The second notch is cut out from the first upper surface to the first side surface, separated from the first notch by a first separation strip. The third notch is cut out from the first lower surface to the first side surface. The fourth notch is cut out from the first lower surface to the first side surface, separated from the third notch by a second separation strip. The first signal conductor is located on the first bottom surface of the first notch. The second signal conductor is located on the second bottom surface of the second notch.

[0008] Furthermore, the second electronic component housing package according to this disclosure comprises a base and a frame. The frame is located on top of the base. The frame has one or more second wiring boards and one or more walls.

[0009] This is a perspective view of the first embodiment of the wiring board. This is a perspective view of another embodiment of the wiring board. This is a perspective view of another embodiment of the wiring board. This is a perspective view of another embodiment of the wiring board. This is a perspective view of another embodiment of the wiring board. This is a plan view of the wiring board shown in Figure 1. This is a plan perspective view of the wiring board shown in Figure 1, showing only the notch, the separation strip, the first lower surface of the first insulating substrate, and the bottom. This is a bottom perspective view of the wiring board shown in Figure 1. This is a perspective view of the first embodiment of the electronic component housing package. This is a perspective view of another embodiment of the electronic component housing package. This is an exploded perspective view of the electronic module. This is a first side view of the second embodiment of the wiring board. This is a second side view of the wiring board shown in Figure 13. This is a bottom view of the wiring board shown in Figure 13. This is a first side view of another embodiment of the wiring board. This is a second side view of the wiring board shown in Figure 16. This is a bottom view of the wiring board shown in Figure 16. This is a first side view of another embodiment of the wiring board. This is a second side view of the wiring board shown in Figure 19. This is a bottom view of the wiring board shown in Figure 19. This is a first side perspective view of another embodiment of the wiring board. This is a second side perspective view of the wiring board shown in Figure 22. This is a bottom view of the wiring board shown in Figure 22. This is a perspective view of a second embodiment of the electronic component housing package. This is a perspective view of another embodiment of the electronic component housing package. This is an exploded perspective view of the electronic module.

[0010] Embodiments of the present disclosure will be described below with reference to the drawings. However, for the sake of clarity, the drawings below are simplified to show only the main components necessary to describe the embodiments. Therefore, embodiments of the present disclosure may include any components not shown in the drawings. Furthermore, the drawings do not necessarily accurately represent the dimensional ratios of the actual components.

[0011] Regarding direction, the direction in which the first upper surface faces is defined as upward, and the opposite direction (the direction in which the first lower surface faces) is defined as downward. Note that the direction in this disclosure does not mean the direction in which the object is actually used. For convenience, each direction is expressed using the Cartesian coordinate system XYZ, where upward is the positive side of the Z direction. Among the directions along the first side surface, the direction perpendicular to the Z direction is defined as the X direction. The direction perpendicular to both the Z direction and the X direction is defined as the Y direction. In this disclosure, "plan view" means viewing from above (the positive side of the Z direction), and includes planar perspective.

[0012] In the following descriptions, expressions such as "constant," "orthogonal," "perpendicular," "parallel," and "same" may be used. These expressions do not necessarily strictly mean "constant," "orthogonal," "perpendicular," "parallel," or "same," respectively, and may allow for deviations such as manufacturing precision or installation precision. Numerical ranges indicated using "~" include the numbers before and after them as the lower and upper limits, respectively.

[0013] In a wiring board equipped with an insulating substrate joined to a base, it is necessary to alleviate the stress applied to the insulating substrate due to the difference in their thermal expansion coefficients.

[0014] The wiring board, electronic component housing package, and electronic module of this disclosure can alleviate stress applied to the insulating substrate.

[0015] 1. First Embodiment [Wiring Board] As shown in Figures 1 to 9, the wiring board 10 comprises a base 11, a first insulating substrate 12, a second insulating substrate 15, and one or more signal conductors 16. The first insulating substrate 12 has a first upper surface 125, a first side surface 121, a first lower surface 126, and one or more notches 13 cut out from the first lower surface 126 to the first side surface 121. The first side surface 121 may be connected to the first upper surface 125 and the first lower surface 126.

[0016] The first insulating substrate 12 may have a second side 122 and a third side 123 that are connected to the first side surface 121 and located on opposite sides. The first insulating substrate 12 may also have a fourth side surface 124 located on the opposite side of the first side surface 121. The fourth side surface 124 may be connected to the second side surface 122 and the third side surface 123. The second side surface 122, the third side surface 123 and the fourth side surface 124 may be connected to the first upper surface 125 and the first lower surface 126, respectively.

[0017] The notch 13 has a top surface 131 below the first upper surface 125. The second insulating substrate 15 and the signal conductor 16 are located on the first upper surface 125. The second insulating substrate 15 may be located above the signal conductor 16. The second insulating substrate 15 is spaced apart from the first side surface 121. The second insulating substrate 15 may also be spaced apart from the fourth side surface 124.

[0018] At least a portion of the first lower surface 126 is joined to the base body 11. The first lower surface 126 and the base body 11 may be joined via a joining material such as metal brazing material. Figure 8 is a plan perspective view of the wiring board 10 shown in Figure 1, showing only the notch 13, the separation strip 14 (described later), the first lower surface 126 of the first insulating substrate 12, and the base body 11, with other components omitted. As shown in Figure 8, in plan view, the notch 13 overlaps with the base body 11.

[0019] Because the first lower surface 126, which is joined to the base 11, is notched by the notch 13, the contact area between the first insulating substrate 12 and the base 11 is reduced compared to the case where the notch 13 does not exist. As a result, even if the first insulating substrate 12 and the base 11 have different coefficients of thermal expansion, the stress applied to the first insulating substrate 12 due to this difference in coefficients of thermal expansion is relieved, making it less likely for cracks to occur.

[0020] As shown in Figure 9, the top surface 131 may be entirely covered with a grounding conductor 17. This grounding conductor 17 can function as a reference GND. Alternatively, the top surface 131 may be entirely exposed. When the top surface 131 is exposed, it means that nothing, including conductors, is placed on the top surface 131. When the bottom body 11 is a conductor, the possibility of a short circuit between the top surface 131 and the bottom body 11 can be reduced. Note that in Figure 9, the bottom body 11, which is shown by a dashed line, is transparent.

[0021] As shown in Figures 1 to 5, the second side surface 122 and the third side surface 123 may each be connected to either of the notches 13. In other words, the second side surface 122 and the third side surface 123 may be notched by the notch 13 extending toward the first side surface 121. This effectively relieves stress at the end where the first side surface 121 and the first upper surface 125 overlap, where stress is easily applied. In particular, stress is effectively relieved at the end where the first upper surface 125, the first side surface 121, and the second side surface 122 or the third side surface 123 overlap.

[0022] As shown in Figures 1 to 3 and Figure 5, when the first insulating substrate 12 has a plurality of notches 13, it may have one or more separation strips 14 located between each of the notches 13. This ensures that the separation strips 14 are joined to the bottom body 11, thereby securing a bonding area between the first insulating substrate 12 and the bottom body 11, and preventing the bonding strength from becoming too low. Furthermore, when forming the first insulating substrate 12 by firing after lamination of raw ceramic substrates, the unpressurized portion that is not supported by the lower raw substrate during lamination can be reduced, thereby reducing the possibility of deformation of the wiring board 10. All of the plurality of notches 13 may have the same shape. In this disclosure, "same" does not mean that the numerical values ​​must be exactly the same, and a manufacturing error of about 100 μm or less is permitted.

[0023] When the first insulating substrate 12 has one or more separation strips 14, as shown in Figure 5, the sum of the widths of one or more separation strips 14 may be greater than the sum of the widths of multiple notches 13. This ensures a larger bonding area between the first insulating substrate 12 and the base 11, making it less likely for the bonding strength to become too low. Furthermore, when forming the first insulating substrate 12 by firing after lamination of raw ceramic substrates, the possibility of deformation of the wiring board 10 can be further reduced. In this disclosure, the "width" of the notches 13 or separation strips 14 refers to the dimension in the X direction.

[0024] As shown in Figures 1 to 3, the width of each notch 13 may be greater than the width of each separation strip 14. This reduces the influence of thermal stress when the first insulating substrate 12 and the bottom body 11 are joined. This reduces the possibility of cracks or other damage occurring in the first insulating substrate 12.

[0025] The first insulating substrate 12 may have one notch 13 that connects to the second side surface 122 and the third side surface 123. In other words, one notch 13 may cut out the first side surface 121 from the second side surface 122 to the third side surface 123. This significantly reduces the contact area between the first insulating substrate 12 and the bottom surface 11, thereby mitigating the effects of thermal stress during the joining of the first insulating substrate 12 and the bottom surface 11. This reduces the possibility of cracks or the like occurring in the first insulating substrate 12.

[0026] The depth of the notch 13 may be less than or equal to the distance from the first side surface 121 to the second insulating substrate 15. This prevents the notch 13 from becoming too large, ensures sufficient bonding area between the first insulating substrate 12 and the bottom body 11, and prevents the bonding strength from becoming too low. Furthermore, when forming the first insulating substrate 12 by firing after lamination of raw ceramic substrates, the possibility of deformation of the wiring board 10 can be reduced. In this disclosure, the distance from the first side surface 121 to the second insulating substrate 15 refers to the distance in the Y direction, and the "depth" of the notch 13 in this disclosure refers to the dimension in the Y direction.

[0027] As shown in Figure 3, the first insulating substrate 12 may have three or more notches 13 and a plurality of separation zones 14 located between each of the notches 13. The presence of multiple separation zones 14 reduces the amount of unpressurized areas during the lamination of raw ceramic substrates when the first insulating substrate 12 is formed by firing after lamination, thereby reducing the possibility of deformation of the insulating substrate. This effect is particularly effective when the wiring board 10 is long in the X direction. In addition, the presence of multiple separation zones 14 ensures a sufficient bonding area between the first insulating substrate 12 and the base 11, making it less likely for the bonding strength to become too low.

[0028] As shown in Figure 2, at least one of the separation strips 14 may extend above the first upper surface 125. This makes it easier to stabilize the shape of the raw substrate when punching out or laminating the raw substrate when forming the separation strip 14 above the first upper surface 125 and the second insulating substrate 15 integrally from a raw ceramic substrate, thereby reducing the possibility of deformation of the wiring board 10.

[0029] As shown in Figure 2, in the separation strip 14 that extends above the first upper surface 125, the width of the separation strip 14 above the first upper surface 125 may be the same as the width of the separation strip 14 between the notches 13. This reduces the amount of unpressurized material when the raw substrates are laminated, thereby further reducing the possibility of deformation of the wiring board 10.

[0030] In a plan view, each notch 13 may be rectangular. Also, the corners of the wall surface 132 of each notch 13 may be rounded (R-shaped). If the corners of the wall surface 132 are rounded (R-shaped), the stress applied to those corners is relieved.

[0031] The materials of the first insulating substrate 12 and the second insulating substrate 15 may be ceramic sintered bodies such as aluminum oxide sintered bodies, aluminum nitride sintered bodies, silicon carbide sintered bodies, mullite sintered bodies, or glass ceramics. Alternatively, the materials of the first insulating substrate 12 and the second insulating substrate 15 may be resins such as epoxy resin, polyimide, or liquid crystal polymer. By using polyimide or liquid crystal polymer as the materials of the first insulating substrate 12 and the second insulating substrate 15, for example, the wiring board 10 can be applied to flexible printed circuit boards (FPCs), printed circuit boards (PCBs), etc. The first insulating substrate 12 and the second insulating substrate 15 may be integrally formed.

[0032] In addition to the signal conductor 16, a ground conductor, a power conductor, and the like may be provided on the first upper surface 125. The material of each conductor may be, for example, a metal such as tungsten, molybdenum, manganese, copper, gold, or silver, or an alloy thereof.

[0033] The base 11 is, for example, a rectangular plate-shaped member. The material of the base 11 may be a ceramic similar to the first insulating substrate 12 and the second insulating substrate 15, or it may be a metal. Examples of metals include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, iron-nickel-cobalt alloys, etc.

[0034] When the materials of the first insulating substrate 12 and the second insulating substrate 15 are ceramic, and the material of the base 11 is metal, the difference in their thermal expansion coefficients tends to be large, and therefore the effect of this disclosure, which relieves the stress applied to the first insulating substrate 12 due to this difference in thermal expansion coefficients, is easily exhibited.

[0035] The thermal expansion coefficients [μm / (m·K)] for each material are as follows, for example. Note that the thermal expansion coefficient can change with temperature. Ceramics: 7-8 Cu (copper): 16.5 CuMo (copper-molybdenum alloy): 7-10

[0036] Cu has a high thermal conductivity, which is advantageous for heat dissipation, but it has a large difference in thermal expansion coefficient compared to ceramic. Therefore, in a conventional wiring board 10, if the base 11 is made of Cu and the first insulating substrate 12 is made of ceramic, cracks are likely to occur in the first insulating substrate 12. CuMo has a lower thermal conductivity than Cu, so its heat dissipation performance is inferior to Cu, but it has a smaller difference in thermal expansion coefficient compared to ceramic. Therefore, if the base 11 is made of CuMo and the first insulating substrate 12 is made of ceramic, cracks are less likely to occur in the first insulating substrate 12 compared to when the base 11 is made of Cu.

[0037] When the materials for the first insulating substrate 12 and the second insulating substrate 15 are aluminum oxide sintered bodies, and tungsten metallized layers are used as conductors such as the signal conductor 16, the wiring board 10 can be manufactured as follows, for example. First, the raw material powders for the first insulating substrate 12 and the second insulating substrate 15 are kneaded with an organic solvent and an organic binder to form a slurry. The raw material powders for the first insulating substrate 12 and the second insulating substrate 15 mainly consist of aluminum oxide powder and powder such as silicon oxide, which serves as a sintering aid. Next, the slurry is formed into a sheet using a molding method such as the doctor blade method or the lip coater method to form a ceramic green sheet (raw substrate). Also, tungsten powder is mixed with an organic solvent and an organic binder to form a metal paste. The metal paste is printed on the ceramic green sheet at a predetermined position using a screen printing method or the like. If necessary, multiple ceramic green sheets are stacked to form a laminate. After that, this laminate is fired at a temperature of about 1300 to 1600°C. When providing via conductors on the wiring board 10, through holes are made at predetermined positions in the ceramic green sheet prior to printing the metal paste. By filling these through holes with the same metal paste as described above and firing them together with the ceramic green sheet, via conductors can be formed. A nickel film of about 1 to 10 μm and a gold film of about 0.1 to 3 μm may be sequentially formed on the surface of each conductor. This protects the surface and improves adhesion with brazing material, solder, etc. Subsequently, the wiring board 10 of this disclosure is obtained by joining the bottom body 11 to the first lower surface 126 of the first insulating substrate 12.

[0038] [Package for housing electronic components] As shown in Figures 10 and 11, the package for housing electronic components 20 may include one or more wiring boards 10 and one or more walls 23. The wall 23 comprises a frame 22 located on the bottom 11, together with a first insulating base 12 and a second insulating base 15. Each wiring board 10 is provided with its first side surface 121 facing inward towards the frame 22. If the package for housing electronic components 20 has multiple wiring boards 10, the bottom 11 of each wiring board 10 may be integrally formed.

[0039] The frame 22 is a frame-shaped member that surrounds the mounting area of ​​the electronic component 31 in a plan view. The frame 22 may have three or more wiring boards 10. The wall 23 may have holes 231. The holes 231 may be used to pass through light-transmitting members, optical fibers, etc., used for inputting and outputting optical signals.

[0040] The wall 23 may be made of a ceramic similar to the first insulating substrate 12 and the second insulating substrate 15, or it may be made of a metal. Examples of metals include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, iron-nickel-cobalt alloys, etc. The material of the wall 23 may be the same as or different from the material of the base 11.

[0041] The wall 23 may be integrally molded with the first insulating substrate 12 and the second insulating substrate 15, or it may be a separate component from the first insulating substrate 12 and the second insulating substrate 15. If the wall 23 and the first insulating substrate 12 and the second insulating substrate 15 are made of the same material, they are easier to integrally mold. If the wall 23 and the first insulating substrate 12 and the second insulating substrate 15 are separate components, they may be joined together with a bonding material such as metal brazing material.

[0042] As shown in Figure 10, the electronic component housing package 20 may have two wiring boards 10 arranged with their first sides 121 facing each other. As shown in Figure 11, the electronic component housing package 20 may have two wiring boards 10 arranged adjacent to each other.

[0043] The first insulating substrate 12 and the signal conductor 16 may extend in the outer direction of the frame body 22 than the second insulating substrate 15. At this time, as shown in FIGS. 10 and 11, the package 20 for housing electronic components may include an external terminal 24 electrically connected to the signal conductor 16. Note that the phrase "the signal conductor 16 extends" includes the case where the signal conductor 16 extends electrically through the inner layer of the first insulating substrate 12.

[0044] The external terminal 24 is not particularly limited, and may be a lead terminal, may be a terminal of a substrate such as a flexible printed circuit (FPC), a printed circuit board (PCB), a relay substrate, or the like, or may be a bonding wire.

[0045] The bottom body 11 and the frame body 22 may be joined by a joining material such as a metal brazing material. Also, in a plan view, the bottom body 11 may be smaller than the frame body 22, and the outer periphery of the bottom body 11 may be located inside the outer periphery of the frame body 22. Thereby, in the joining of the bottom body 11 and the frame body 22, a fillet of the joining material is likely to be formed, and the joining strength and airtightness between the bottom body 11 and the frame body 22 are further improved.

[0046] [Electronic Module] As shown in FIG. 12, the electronic module 30 may include the package 20 for housing electronic components, an electronic component 31, and a lid body 32 located on the frame body 22. [[ID=ll]]

[0047] The electronic component 31 is located on the bottom body 11 and can be electrically connected to the signal conductor 16. The electronic component 31 may be located on a mounting member provided on the bottom body 11. The electronic component 31 may be electrically connected to the signal conductor 16 via a connecting member such as a bonding wire. Also, the electronic component 31 may be electrically connected to the signal conductor 16 by flip chip mounting.

[0048] The electronic component 31 is a component to which a high-frequency signal related to optical communication (for example, a signal having a frequency band of about 10 GHz or more) is input or output. Specific examples of the electronic component 31 include a light-emitting element, a light-receiving element, and the like.

[0049] The lid 32 may be joined to the frame 22 via a seal ring 33. The seal ring 33 can function as a sealing material when hermetically sealing the electronic component 31 in the electronic component housing package 20 using the lid 32. The seal ring 33 may be formed, for example, by joining a frame-shaped metal plate containing an iron-nickel alloy, an iron-nickel-cobalt alloy, etc., to a frame formed of a conductive paste containing a high-melting-point metal such as tungsten or molybdenum using a brazing material or the like.

[0050] The cover 32 is, for example, a plate-shaped member that can reduce the intrusion of foreign matter such as moisture and fine particles into the interior (cavity) of the electronic module 30. The cover 32 may be made of the same metal material as the seal ring 33, or it may be made from the same material as the bottom body 11 and the wall body 23, processed and formed into a plate shape.

[0051] In recent years, with the increasing complexity of electronic modules, there has been a growing demand for wiring boards that can accommodate a large number of connections.

[0052] The wiring board and electronic component housing package of this disclosure enable a large number of wiring connections.

[0053] 2. Second Embodiment [Wiring Board] As shown in Figure 13, the wiring board 910 includes an insulating substrate 911. The insulating substrate 911 has a first side surface 9111, a first upper surface 9115, a first lower surface 9116, a first notch 9121, a second notch 9122, a third notch 9123, and a fourth notch 9124.

[0054] The first notch 9121 is a notch cut out from the first upper surface 9115 to the first side surface 9111. The second notch 9122 is a notch cut out from the first upper surface 9115 to the first side surface 9111, separated from the first notch 9121 and the first separation strip 9141. The third notch 9123 is a notch cut out from the first lower surface 9116 to the first side surface 9111. The fourth notch 9124 is a notch cut out from the first lower surface 9116 to the first side surface 9111, separated from the third notch 9123 and the second separation strip 9142.

[0055] The first notch 9121 may have a first bottom surface 9121a and a first wall surface 9121b. The second notch 9122 may have a second bottom surface 9122a and a second wall surface 9122b. The third notch 9123 may have a first top surface 9123a and a third wall surface 9123b. The fourth notch 9124 may have a second top surface 9124a and a fourth wall surface 9124b.

[0056] The insulating substrate 911 may have a second side surface 9112 located on the opposite side of the first side surface 9111. The insulating substrate 911 may also have a third side surface 9113 and a fourth side surface 9114 that are connected to the first side surface 9111 and located on opposite sides of each other. In this case, the third side surface 9113 is located on the opposite side of the second notch 9122, with the first notch 9121 in between, and the fourth side surface 9114 is located on the opposite side of the first notch 9121, with the second notch 9122 in between. The third side surface 9113 and the fourth side surface 9114 may be connected to the second side surface 9112. The second side surface 9112, the third side surface 9113 and the fourth side surface 9114 may be connected to the first upper surface 9115 and the first lower surface 9116.

[0057] The wiring board 910 includes one or more first signal conductors 9151 located on the first bottom surface 9121a, and one or more second signal conductors 9152 located on the second bottom surface 9122a.

[0058] The insulating substrate 911 has a first notch 9121 and a second notch 9122, and the signal conductors are positioned in these notches, making it easy to attach the cover 932, seal ring 933, bottom 921, heat dissipation substrate, etc., to the first upper surface 9115 and the first lower surface 9116 of the insulating substrate 911. Furthermore, the presence of at least two notches where the signal conductors are positioned, the first notch 9121 and the second notch 9122, allows for a large number of wires to be connected. In addition, the insulating substrate 911 has a first separation zone 9141 and a second separation zone 9142, which makes it easier to stabilize the shape of the raw ceramic substrates when punching out and stacking the raw substrates when forming the insulating substrate 911 by firing after lamination, and consequently, the shape of the insulating substrate 911 becomes more stable. Furthermore, because the insulating substrate 911 has a third notch 9123 and a fourth notch 9124, when the bottom body 921 is joined below the third notch 9123 and the fourth notch 9124, the joining area between the insulating substrate 911 and the bottom body 921 can be reduced. As a result, when the insulating substrate 911 is joined to the bottom body 921, which has a higher thermal conductivity than the insulating substrate 911, the stress applied to the insulating substrate 911 is reduced.

[0059] As shown in Figure 15, the wiring board 910 may include one or more third signal conductors 9153 located on the first top surface 9123a and one or more fourth signal conductors 9154 located on the second top surface 9124a. This allows for a greater number of connections.

[0060] The width of the first notch 9121 and the width of the second notch 9122 may both be greater than the width of the first separator 9141. This allows for a large number of wires to be routed on the first bottom surface 9121a of the first notch 9121 and the second bottom surface 9122a of the second notch 9122. In this disclosure, the "width" of a notch or separator refers to the dimension in the X direction.

[0061] Similarly, the width of both the third notch 9123 and the fourth notch 9124 may be greater than the width of the second separator 9142. This allows for a large number of wires to be routed on the first top surface 9123a of the third notch 9123 and the second top surface 9124a of the fourth notch 9124.

[0062] The widths of the first notch 9121 and the second notch 9122 may be the same. In other words, if there are only two notches, the first notch 9121 and the second notch 9122, cut out from the first upper surface 9115 to the first side surface 9111, the first separation strip 9141 may be located midway between the end of the first notch 9121 on the third side surface 9113 side and the end of the second notch 9122 on the fourth side surface 9114 side. Similarly, the widths of the third notch 9123 and the fourth notch 9124 may be the same. In other words, if there are only two notches, a third notch 9123 and a fourth notch 9124, cut out from the first lower surface 9116 to the first side surface 9111, the second separator 9142 may be located midway between the end of the third notch 9123 on the third side surface 9113 side and the end of the fourth notch 9124 on the fourth side surface 9114 side. This configuration reduces the possibility of deformation of the insulating substrate 911. In this disclosure, "same" does not mean that the numerical values ​​must be exactly the same, and a manufacturing error of about 100 μm or less is permitted.

[0063] The depth of the first notch 9121 and the depth of the second notch 9122 may be the same. Similarly, the depth of the third notch 9123 and the depth of the fourth notch 9124 may be the same. This makes it easier to unify the length of the signal conductor in the Y direction between each notch, simplifying wiring design. In particular, it simplifies design such as impedance adjustment in high-frequency designs. In this disclosure, "depth" of a notch refers to the dimension in the Y direction.

[0064] In a plan view from above the first upper surface 9115, the entirety of one of the first separation zones 9141 and the second separation zone 9142 may overlap the other separation zone. This reduces the unpressurized portion that is not supported by the lower layer of raw ceramic substrates when the raw ceramic substrates are laminated and then fired to form the insulating substrate 911, thereby reducing the possibility of deformation of the insulating substrate 911.

[0065] In a plan view, the shape, width, and depth of the first separation zone 9141 may be the same as those of the second separation zone 9142. This reduces the amount of unpressurized material during the lamination of the raw ceramic substrates when firing them after lamination to form the insulating substrate 911, thereby further reducing the possibility of deformation of the insulating substrate 911. It also makes it easier to achieve both stabilization of the shape of the insulating substrate 911 and optimization of the size of the wiring board 910. By optimizing the size of the wiring board 910, the wiring board 910 may not become unnecessarily large.

[0066] As shown in Figure 17, the insulating substrate 911 may have a fifth notch 9125 and a sixth notch 9126. The fifth notch 9125 is a notch cut out from the first upper surface 9115 to the second side surface 9112. The sixth notch 9126 is a notch cut out from the first upper surface 9115 to the second side surface 9112, separated from the fifth notch 9125 by the third separation strip 9143. In Figure 17, the fifth notch 9125 and the sixth notch 9126 have a step 913, but they do not have to have a step 913, similar to the first notch 9121 and the second notch 9122 shown in Figure 16.

[0067] As shown in Figure 17, the fifth notch 9125 may have a third bottom surface 9125a and a fifth wall surface 9125b. The sixth notch 9126 may have a fourth bottom surface 9126a and a sixth wall surface 9126b. In this case, the wiring board 910 may include one or more fifth signal conductors 9155 located on the third bottom surface 9125a and one or more sixth signal conductors 9156 located on the fourth bottom surface 9126a. This makes it possible to connect multiple wires to the third bottom surface 9125a of the fifth notch 9125 and the fourth bottom surface 9126a of the sixth notch 9126.

[0068] The first signal conductor 9151 may be electrically connected to the fifth signal conductor 9155. In this case, the first signal conductor 9151 may extend linearly inside the insulating substrate 911 and be connected to the fifth signal conductor 9155. Alternatively, the first signal conductor 9151 may be connected to the fifth signal conductor 9155 via inner layer wiring located inside the insulating substrate 911. Similarly, the second signal conductor 9152 may be electrically connected to the sixth signal conductor 9156. In this case, the second signal conductor 9152 may extend linearly inside the insulating substrate 911 and be connected to the sixth signal conductor 9156. Alternatively, the second signal conductor 9152 may be connected to the sixth signal conductor 9156 via inner layer wiring located inside the insulating substrate 911.

[0069] As shown in Figure 14, the insulating substrate 911 may have only a fifth notch 9125, which is cut out from the first upper surface 9115 to the second side surface 9112. In this case, the first signal conductor 9151 and the second signal conductor 9152 may be electrically connected to the fifth signal conductor 9155. In this case, the first signal conductor 9151 and the second signal conductor 9152 may each extend linearly inside the insulating substrate 911 and be connected to the fifth signal conductor 9155.

[0070] As shown in Figure 23, the insulating substrate 911 may have a seventh notch 9127 and an eighth notch 9128. The seventh notch 9127 is a notch cut out from the first lower surface 9116 to the second side surface 9112. The eighth notch 9128 is a notch cut out from the first lower surface 9116 to the second side surface 9112, separated from the seventh notch 9127 by the fourth separation strip 9144. By having the seventh notch 9127 and the eighth notch 9128 in the insulating substrate 911, the contact area between the insulating substrate 911 and the bottom body 921 can be reduced when the bottom body 921 is joined below the seventh notch 9127 and the eighth notch 9128. This makes it possible to alleviate the thermal stress applied to the insulating substrate 911 when joining the insulating substrate 911 and the bottom body 921, which have different coefficients of thermal expansion, thereby reducing the possibility of cracks or other damage occurring in the insulating substrate 911.

[0071] In a plan view taken from above the first upper surface 9115, the entirety of one of the third median strips 9143 and the fourth median strip 9144 may overlap the other median strip. Also, in a plan view, the shape, width, and depth of the third median strip 9143 may be the same as the shape, width, and depth of the fourth median strip 9144. Furthermore, the first median strip 9141, the second median strip 9142, the third median strip 9143, and the fourth median strip 9144 may all have the same shape, width, and depth.

[0072] Furthermore, in a plan view taken from above the first upper surface 9115, the third median strip 9143 and the first median strip 9141 may overlap in at least a portion in the X direction. Also, if a fourth median strip 9144 is present, in a plan view taken from above the first upper surface 9115, the fourth median strip 9144 and at least one of the first median strip 9141 and the second median strip 9142 may overlap in at least a portion in the X direction.

[0073] As shown in Figure 23, the seventh notch 9127 may have a third top surface 9127a and a seventh wall surface 9127b. The eighth notch 9128 may have a fourth top surface 9128a and an eighth wall surface 9128b. In this case, as shown in Figure 14, the wiring board 910 may include one or more seventh signal conductors 9157 located on the third top surface 9127a and one or more eighth signal conductors 9158 located on the fourth top surface 9128a. This makes it possible to connect multiple wires to the third top surface 9127a of the seventh notch 9127 and the fourth top surface 9128a of the eighth notch 9128.

[0074] The third signal conductor 9153 may be electrically connected to the seventh signal conductor 9157. In this case, the third signal conductor 9153 may extend linearly inside the insulating substrate 911 and be connected to the seventh signal conductor 9157. Alternatively, the third signal conductor 9153 may be connected to the seventh signal conductor 9157 via inner layer wiring located inside the insulating substrate 911. Similarly, the fourth signal conductor 9154 may be electrically connected to the eighth signal conductor 9158. In this case, the fourth signal conductor 9154 may extend linearly inside the insulating substrate 911 and be connected to the eighth signal conductor 9158. Alternatively, the fourth signal conductor 9154 may be connected to the eighth signal conductor 9158 via inner layer wiring located inside the insulating substrate 911.

[0075] At least one of the first notches 9121, second notch 9122, third notch 9123, and fourth notch 9124 may have a step 913. A signal conductor may also be located in the step 913. This allows for a larger number of wires to be wired at a wider pitch. Specifically, as shown in Figure 22, for example, the first notch 9121 may have a step 913, and the first signal conductor 9151 may be located in the step 913. Also, as shown in Figure 22, for example, the second notch 9122 may have a step 913, and the second signal conductor 9152 may be located in the step 913.

[0076] At least one of the fifth notch 9125, sixth notch 9126, seventh notch 9127, and eighth notch 9128 may have a step 913. A signal conductor may also be located in the step 913. This allows for a larger number of wires to be wired at a wider pitch. Specifically, as shown in Figures 17 and 20, for example, the fifth notch 9125 may have a step 913, and the fifth signal conductor 9155 may be located in the step 913. Also, as shown in Figures 17 and 20, for example, the sixth notch 9126 may have a step 913, and the sixth signal conductor 9156 may be located in the step 913.

[0077] As shown in Figure 13, the first notch 9121 may be spaced apart from the third side surface 9113. In other words, the first notch 9121 does not have to extend over the third side surface 9113. The second notch 9122 may be spaced apart from the fourth side surface 9114. In other words, the second notch 9122 does not have to extend over the fourth side surface 9114. The third notch 9123 may be spaced apart from the third side surface 9113. In other words, the third notch 9123 does not have to extend over the third side surface 9113. The fourth notch 9124 may be spaced apart from the fourth side surface 9114. In other words, the fourth notch 9124 does not have to extend over the fourth side surface 9114. Because each notch does not extend to the third side surface 9113 or the fourth side surface 9114, the area of ​​the first upper surface 9115 and the first lower surface 9116 near the third side surface 9113 and the fourth side surface 9114 is increased. As a result, the insulating substrate 911 can be placed in an electronic component housing package 920 or the like with a stable shape.

[0078] At least one of the first notches 9121, second notches 9122, third notches 9123, and fourth notches 9124 may extend across the third side surface 9113 or the fourth side surface 9114. In other words, at least one of the first notches 9121, second notches 9122, third notches 9123, and fourth notches 9124 does not need to be spaced apart from the third side surface 9113 or the fourth side surface 9114. This allows for a wider notch, enabling more wiring. It also reduces stress on the corners of the insulating substrate 911.

[0079] As shown in Figure 16, etc., the first notch 9121, the second notch 9122, the third notch 9123, and the fourth notch 9124 may all extend to the third side surface 9113 or the fourth side surface 9114. This allows for a greater number of wires to be connected.

[0080] In a plan view, each notch may be rectangular. Furthermore, the corners of the wall surface formed by each notch may be rounded (R-shaped). When the corners of the wall surface are rounded (R-shaped), the stress applied to those corners is relieved.

[0081] Each notch may be provided with a grounding conductor 916, a power conductor, or the like, in addition to the signal conductor. For example, as shown in Figure 21, the entire surface of the third top surface 9127a of the seventh notch 9127 and the entire surface of the fourth top surface 9128a of the eighth notch 9128 may be covered with a grounding conductor 916.

[0082] The X-direction dimension (width) of each notch is not particularly limited, but when each notch is spaced apart from the third side surface 9113 and the fourth side surface 9114, the width of each notch is, for example, 5 to 20 mm. When each notch extends across the third side surface 9113 or the fourth side surface 9114, the width of each notch is, for example, 10 to 30 mm.

[0083] The dimensions of the insulating substrate 911 in the X direction are not particularly limited, but when each notch is spaced apart from the third side surface 9113 and the fourth side surface 9114, the dimensions of the insulating substrate 911 in the X direction are, for example, 15 to 45 mm. When each notch extends across the third side surface 9113 or the fourth side surface 9114, the dimensions of the insulating substrate 911 in the X direction are, for example, 30 to 90 mm.

[0084] The insulating substrate 911 may have notches extending from the first upper surface 9115 to the first side surface 9111, in addition to the first notch 9121 and the second notch 9122. The insulating substrate 911 may have notches extending from the first lower surface 9116 to the first side surface 9111, in addition to the third notch 9123 and the fourth notch 9124. The insulating substrate 911 may have notches extending from the first upper surface 9115 to the second side surface 9112, in addition to the fifth notch 9125 and the sixth notch 9126. The insulating substrate 911 may have notches extending from the first lower surface 9116 to the second side surface 9112, in addition to the seventh notch 9127 and the eighth notch 9128.

[0085] The insulating substrate 911 may be made of ceramics such as aluminum oxide sintered body, aluminum nitride sintered body, silicon carbide sintered body, mullite sintered body, or glass ceramics. Alternatively, the insulating substrate 911 may be made of resins such as epoxy resin, polyimide, or liquid crystal polymer. By using polyimide or liquid crystal polymer as the material for the insulating substrate 911, the wiring board 910 can be applied to flexible printed circuit boards (FPCs), printed circuit boards (PCBs), etc.

[0086] The material of each conductor, such as the first signal conductor 9151, is, for example, a metal such as tungsten, molybdenum, manganese, copper, gold, or silver, or an alloy thereof.

[0087] When the insulating substrate 911 is made of an aluminum oxide sintered body and tungsten metallized layers are used as conductors such as the first signal conductor 9151, the wiring board 910 can be manufactured as follows. First, the raw material powder for the insulating substrate 911 is mixed with an organic solvent and an organic binder to form a slurry. The raw material powder for the insulating substrate 911 mainly consists of aluminum oxide powder and powder such as silicon oxide, which is a sintering aid component. Next, the slurry is formed into a sheet using a molding method such as the doctor blade method or the lip coater method to form a ceramic green sheet (raw substrate). Also, tungsten powder is mixed with an organic solvent and an organic binder to form a metal paste. The metal paste is printed on the ceramic green sheet at a predetermined position using a screen printing method or the like. If necessary, multiple ceramic green sheets are stacked to form a laminate. After that, this laminate is fired at a temperature of about 1300 to 1600°C. When providing via conductors on the wiring board 910, through holes are made at predetermined positions in the ceramic green sheet prior to printing the metal paste. By filling these through holes with the same metal paste as described above and firing them together with the ceramic green sheet, via conductors can be formed. A nickel film of about 1 to 10 μm and a gold film of about 0.1 to 3 μm may be sequentially formed on the surface of each conductor. This protects the surface and improves adhesion with brazing material, solder, etc.

[0088] [Package for housing electronic components] As shown in Figures 25 and 26, the package for housing electronic components 920 may include a base 921 and a frame 922 located on top of the base 921. The frame 922 may have one or more wiring boards 910 and one or more walls 923.

[0089] The base 921 is, for example, a rectangular plate-shaped member. The frame 922 is a frame-shaped member that surrounds the mounting area of ​​the electronic component 931 in a plan view. The frame 922 may have three or more wiring boards 910. The wall 923 may have holes 9231. The holes 9231 may be used to pass through light-transmitting members, optical fibers, etc., used for inputting and outputting optical signals.

[0090] The materials of the base 921 and the wall 923 may be ceramics similar to those of the insulating substrate 911, or they may be metals. Examples of metals include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, iron-nickel-cobalt alloys, etc. The materials of the base 921 and the wall 923 may be the same or different.

[0091] The wall 923 may be integrally molded with the insulating base 911 of the wiring board 910, or it may be a separate component from the insulating base 911 of the wiring board 910. If the wall 923 and the insulating base 911 are made of the same material, they are easier to integrally mold. If the wall 923 and the insulating base 911 are separate components, they may be joined together with a bonding material such as metal brazing material.

[0092] As shown in Figure 25, the wiring board 910 may be located on at least two opposite sides of the frame 922. The wiring board 910 may be directly bonded to the planar bottom 921. As shown in Figure 26, multiple wiring boards 910 may be located side by side on one side of the frame 922. The wiring board 910 may be provided with its first side surface 9111 facing outwards from the electronic component housing package 920, or with its first side surface 9111 facing inwards from the electronic component housing package 920.

[0093] As shown in Figures 25 and 26, the electronic component housing package 920 may include a first external terminal 9241 electrically connected to a first signal conductor 9151, and a second external terminal 9242 electrically connected to a second signal conductor 9152. Furthermore, the electronic component housing package 920 may include a third external terminal 9243 electrically connected to a third signal conductor 9153, and a fourth external terminal 9244 electrically connected to a fourth signal conductor 9154.

[0094] The external terminals such as the first external terminal 9241 are not particularly limited and may be lead terminals, terminals on a substrate such as a flexible printed circuit board (FPC), printed circuit board (PCB), or relay board, or bonding wires.

[0095] The base 921 and the frame 922 may be joined by a joining material such as metal brazing material. Also, in a plan view, the base 921 may be smaller than the frame 922, and the outer circumference of the base 921 may be located inward from the outer circumference of the frame 922. This makes it easier to form fillets in the joining material when joining the base 921 and the frame 922, and further improves the joint strength and airtightness between the base 921 and the frame 922.

[0096] [Electronic Module] As shown in Figure 27, the electronic module 930 may include an electronic component housing package 920, an electronic component 931, and a lid 932 located on top of the frame 922.

[0097] The electronic component 931 is located on the base 921 and may be electrically connected to at least one of the first signal conductor 9151 and the second signal conductor 9152. The electronic component 931 may be located on a mounting member provided on the base 921. The electronic component 931 may be electrically connected to at least one of the first signal conductor 9151 and the second signal conductor 9152 via a connecting member, such as a bonding wire. Alternatively, the electronic component 931 may be electrically connected to at least one of the first signal conductor 9151 and the second signal conductor 9152 by flip-chip mounting.

[0098] The electronic component 931 is a component that receives or outputs high-frequency signals related to optical communication (for example, signals with a frequency band of about 10 GHz or higher). Specific examples of the electronic component 931 include light-emitting elements and light-receiving elements.

[0099] The lid 932 may be joined to the frame 922 via a seal ring 933. The seal ring 933 can function as a sealing material when hermetically sealing the electronic component 931 in the electronic component housing package 920 using the lid 932. The seal ring 933 may be formed, for example, by joining a frame-shaped metal plate containing an iron-nickel alloy, an iron-nickel-cobalt alloy, etc., to a frame formed of a conductive paste containing a high-melting-point metal such as tungsten or molybdenum using a brazing material or the like.

[0100] The cover 932 is, for example, a plate-shaped member that can reduce the intrusion of foreign matter such as moisture and fine particles into the interior (cavity) of the electronic module 930. The cover 932 may be made of the same metal material as the seal ring 933, or it may be made from the same material as the bottom body 921 and the wall body 923, processed and formed into a plate shape.

[0101] The following are further examples of embodiments of the wiring board, electronic component housing package, and electronic module relating to this disclosure.

[0102] (1) One embodiment of a wiring board according to the present disclosure comprises a base, a first insulating substrate, a second insulating substrate, and one or more signal conductors, wherein the first insulating substrate has a first upper surface, a first side surface, a first lower surface, and one or more notches cut out from the first lower surface to the first side surface, the notches have a top surface below the first upper surface, the second insulating substrate and the signal conductors are located on the first upper surface, the second insulating substrate is spaced apart from the first side surface, at least a portion of the first lower surface is joined to the base, and in plan view, the notches overlap with the base.

[0103] (2) One embodiment of the wiring board according to the present disclosure is the wiring board according to (1) above, wherein the top surface is entirely covered with a grounding conductor.

[0104] (3) One embodiment of the wiring board relating to the present disclosure is the wiring board of (1) above, wherein the top surface is entirely exposed.

[0105] (4) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (1) to (3) above, wherein the first insulating substrate has a second side surface and a third side surface that are connected to the first side surface and are located on opposite sides to each other, and the second side surface and the third side surface are each connected to any of the notches.

[0106] (5) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (1) to (4) above, wherein the first insulating substrate has a plurality of notches and one or more separation strips located between each of the notches, and the sum of the widths of the one or more separation strips is greater than the sum of the widths of the plurality of notches.

[0107] (6) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (1) to (4) above, wherein the first insulating substrate has a plurality of notches and one or more separation strips located between each of the notches, and the width of each of the notches is greater than the width of each of the separation strips.

[0108] (7) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (1) to (4) above, wherein the first insulating substrate has one notch, and the notch is connected to the second side surface and the third side surface.

[0109] (8) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (1) to (7) above, wherein the depth of the notch is less than or equal to the distance from the first side surface to the second insulating substrate.

[0110] (9) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (1) to (6) and (8) above, wherein the first insulating substrate has three or more notches and a plurality of separation strips located between each of the notches.

[0111] (10) One embodiment of a wiring board according to the present disclosure is a wiring board according to any of (1) to (6), (8) and (9) above, wherein the first insulating substrate has a plurality of notches and one or more separation strips located between each of the notches, and at least one of the separation strips extends above the first upper surface.

[0112] (11) One embodiment of the wiring board according to the present disclosure is the wiring board according to (10) above, wherein in the separation strip that extends above the first upper surface, the width of the separation strip above the first upper surface is the same as the width of the separation strip between the notches, and all of the multiple notches are the same shape.

[0113] (12) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (1) to (11) above, wherein the material of the first insulating substrate and the second insulating substrate is ceramic, and the material of the base is metal.

[0114] (13) One embodiment of the electronic component storage package according to the present disclosure comprises one or more wiring boards according to any of (1) to (12) above, and one or more walls that together form a frame located on the bottom body with the first insulating base and the second insulating base, wherein each of the wiring boards is provided with the first side facing inward towards the frame.

[0115] (14) One embodiment of the electronic component housing package according to the present disclosure is the electronic component housing package according to (13) above, wherein the first insulating substrate and the signal conductor extend outward from the frame beyond the second insulating substrate, and the package includes an external terminal electrically connected to the signal conductor.

[0116] (15) One embodiment of the electronic module according to the present disclosure comprises: an electronic component housing package as described in (13) or (14) above; an electronic component located on the bottom and electrically connected to the signal conductor; and a lid located on the frame.

[0117] (16) One embodiment of a wiring board according to the present disclosure comprises an insulating substrate, one or more first signal conductors, and one or more second signal conductors, wherein the insulating substrate has a first side surface, a first upper surface, a first lower surface, a first notch cut out from the first upper surface to the first side surface, a second notch cut out from the first upper surface to the first side surface separated from the first notch by a first separation strip, a third notch cut out from the first lower surface to the first side surface, and a fourth notch cut out from the first lower surface to the first side surface separated from the third notch by a second separation strip, wherein the first signal conductor is located on the first bottom surface of the first notch, and the second signal conductor is located on the second bottom surface of the second notch.

[0118] (17) One embodiment of the wiring board according to the present disclosure is the wiring board according to (16) above, comprising: one or more third signal conductors located on the first top surface of the third notch; and one or more fourth signal conductors located on the second top surface of the fourth notch.

[0119] (18) One embodiment of the wiring board according to the present disclosure is the wiring board according to (16) or (17) above, wherein the width of the first notch and the width of the second notch are both greater than the width of the first separation strip.

[0120] (19) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (16) to (18) above, wherein the width of the first notch and the width of the second notch are the same, and the width of the third notch and the width of the fourth notch are the same.

[0121] (20) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (16) to (19) above, wherein the depth of the first notch and the depth of the second notch are the same, and the depth of the third notch and the depth of the fourth notch are the same.

[0122] (21) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (16) to (20) above, wherein in a plan view seen from above the first upper surface, the entirety of one of the first separation strip and the second separation strip overlaps the other separation strip.

[0123] (22) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (16) to (21) above, wherein in a plan view, the shape, width and depth of the first separation strip are the same as the shape, width and depth of the second separation strip.

[0124] (23) One embodiment of a wiring board according to the present disclosure is a wiring board according to any of (16) to (22) above, wherein the insulating substrate has a second side surface located opposite to the first side surface, a fifth notch cut out from the first upper surface to the second side surface, and a sixth notch cut out from the first upper surface to the second side surface separated from the fifth notch by a third separation strip, and further comprises one or more fifth signal conductors located on the third bottom surface of the fifth notch, and one or more sixth signal conductors located on the fourth bottom surface of the sixth notch.

[0125] (24) One embodiment of a wiring board according to the present disclosure is a wiring board according to any of (16) to (23) above, wherein the insulating substrate has a second side surface located opposite to the first side surface, a seventh notch cut out from the first lower surface to the second side surface, and an eighth notch cut out from the first lower surface to the second side surface, separated from the seventh notch by a fourth separation strip.

[0126] (25) One embodiment of the wiring board according to the present disclosure is a wiring board according to any of (16) to (24) above, wherein at least one of the first notch, the second notch, the third notch and the fourth notch has a step.

[0127] (26) One embodiment of a wiring board according to the present disclosure is a wiring board according to any of (16) to (25) above, wherein the insulating substrate has a third side and a fourth side that are connected to the first side and located on opposite sides of each other, the third side is located on the opposite side of the second notch with respect to the first notch, the fourth side is located on the opposite side of the first notch with respect to the second notch, the first notch is spaced apart from the third side, and the second notch is spaced apart from the fourth side.

[0128] (27) One embodiment of a wiring board according to the present disclosure is a wiring board according to any of (16) to (25) above, wherein the insulating substrate has a third side and a fourth side that are connected to the first side and located on opposite sides, and at least one of the first notch, the second notch, the third notch and the fourth notch extends to the third side or the fourth side.

[0129] (28) One embodiment of an electronic component storage package according to the present disclosure is an electronic component storage package comprising a base body and a frame body located on the base body, wherein the frame body has one or more wiring boards according to any of (16) to (27) above and one or more walls.

[0130] (29) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (28) above, wherein the frame has a plurality of wiring boards, and the wiring boards are located on at least two opposite sides of the frame.

[0131] (30) One embodiment of the electronic component housing package according to the present disclosure is the electronic component housing package according to (28) or (29) above, comprising: a first external terminal electrically connected to the first signal conductor; and a second external terminal electrically connected to the second signal conductor.

[0132] Furthermore, details shown in the embodiments described above may be modified as appropriate without departing from the spirit of this disclosure. The scope of this disclosure includes the scope of the invention as described in the claims and its equivalents. Various combinations of each embodiment are not limited to the examples of embodiments described above. Combinations of each embodiment are also possible.

[0133] 10 Wiring board 11 Bottom 12 First insulating substrate 121 First side 122 Second side 123 Third side 124 Fourth side 125 First top 126 First bottom 13 Notch 131 Top surface 132 Wall surface 14 Separation strip 15 Second insulating substrate 16 Signal conductor 17 Ground conductor 20 Electronic component housing package 22 Frame 23 Wall 231 Hole 24 External terminal 30 Electronic module 31 Electronic component 32 Cover 33 Seal ring 910 Wiring board 911 Insulating substrate 9111 First side 9112 Second side 9113 Third side 9114 Fourth side 9115 First top surface 9116 First bottom surface 9121 First notch 9121a First bottom surface 9121b First wall surface 9122 Second notch 9122a Second bottom surface 9122b Second wall surface 9123 Third notch 9123a First top surface 9123b Third wall surface 9124 Fourth notch 9124a Second top surface 9124b Fourth wall surface 9125 Fifth notch 9125a Third bottom surface 9125b Fifth wall surface 9126 Sixth notch 9126a Fourth bottom surface 9126b Sixth wall surface 9127 Seventh notch 9127a Third top surface 9127b Seventh wall surface 9128 Eighth notch 9128a Fourth top surface 9128b Eighth wall surface 913 Step 9141 First separation zone 9142 Second separation zone 9143 Third separation zone 9144 Fourth separation zone 9151 First signal conductor 9152 Second signal conductor 9153 Third signal conductor 9154 Fourth signal conductor 9155 Fifth signal conductor 9156 Sixth signal conductor 9157 Seventh signal conductor 9158 Eighth signal conductor 916 Ground conductor 920 Package for housing electronic components 921 Base 922 Frame 923 Wall 9231 Hole 9241 First external terminal 9242 Second external terminal 9243 Third external terminal 9244 Fourth external terminal 930 Electronic module 931 Electronic component 932 Cover 933 Seal ring

Claims

1. A wiring board comprising a base, a first insulating substrate, a second insulating substrate, and one or more signal conductors, wherein the first insulating substrate has a first upper surface, a first side surface, a first lower surface, and one or more notches cut out from the first lower surface to the first side surface, the notches having a top surface below the first upper surface, the second insulating substrate and the signal conductors are located on the first upper surface, the second insulating substrate is spaced apart from the first side surface, at least a portion of the first lower surface is joined to the base, and in a plan view, the notches overlap with the base.

2. The wiring board according to claim 1, wherein the top surface is entirely covered with a grounding conductor.

3. The wiring board according to claim 1, wherein the top surface is entirely exposed.

4. The wiring board according to any one of claims 1 to 3, wherein the first insulating substrate has a second side surface and a third side surface that are connected to the first side surface and are located on opposite sides of each other, and the second side surface and the third side surface are each connected to one of the notches.

5. The wiring board according to any one of claims 1 to 4, wherein the first insulating substrate has a plurality of notches and one or more separation strips located between each of the notches, and the sum of the widths of the one or more separation strips is greater than the sum of the widths of the plurality of notches.

6. The wiring board according to any one of claims 1 to 4, wherein the first insulating substrate has a plurality of notches and one or more separation strips located between each of the notches, and the width of each notch is greater than the width of each of the separation strips.

7. The wiring board according to any one of claims 1 to 4, wherein the first insulating substrate has one notch, and the notch is connected to the second side surface and the third side surface.

8. The wiring board according to any one of claims 1 to 7, wherein the depth of the notch is less than or equal to the distance from the first side surface to the second insulating substrate.

9. The wiring board according to any one of claims 1 to 6 and 8, wherein the first insulating substrate has three or more notches and a plurality of separation strips located between each of the notches.

10. The wiring board according to any one of claims 1 to 6, 8 and 9, wherein the first insulating substrate has a plurality of notches and one or more separation strips located between each of the notches, and at least one of the separation strips extends above the first upper surface.

11. In the separation strip extending above the first upper surface, the width of the separation strip above the first upper surface is the same as the width of the separation strip between the notches, and all of the multiple notches are the same shape, as described in claim 10.

12. The wiring board according to any one of claims 1 to 11, wherein the material of the first insulating substrate and the second insulating substrate is ceramic, and the material of the base is metal.

13. An electronic component housing package comprising one or more wiring boards according to any one of claims 1 to 12, and one or more wall bodies that together form a frame located on the bottom body with the first insulating base and the second insulating base, wherein each wiring board is provided with its first side facing inward towards the frame.

14. The electronic component housing package according to claim 13, wherein the first insulating substrate and the signal conductor extend outward from the frame beyond the second insulating substrate, and the package includes an external terminal electrically connected to the signal conductor.

15. An electronic module comprising: an electronic component housing package according to claim 13 or 14; an electronic component located on the bottom and electrically connected to the signal conductor; and a lid located on the frame.

Images