Handler for electronic component testing

Abstract

The present invention relates to a handler for electronic component testing. A handler for electronic component testing, according to the present invention, comprises: a test table that moves between a placement space and a test space; an indicator that is disposed so as to be fixed to the upper side of the placement space; a moving camera that photographs the indicator while moving together with the test table; and a controller that identifies the position of the test table from an image photographed by the moving camera. According to the present invention, the test table and a test board are precisely matched as a result of the accurately tracking of the position of the test table, thus ensuring test reliability.

Description

electronic component test handler

[0001] The present invention relates to a handler that supports testing of an electronic component by electrically connecting the electronic component and a tester.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, the line width of circuits is becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] Previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Until now, no automated test capable of adequately supporting the testing of electronic components in the dyna HBM state has been proposed. This is because the dies are very thin, making precise contact difficult due to the fine spacing between contact pads, and can easily break or shatter.

[0010] Accordingly, the applicant has proposed Korean published patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0011] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0012] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0013] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.

[0014] The most important factor in testing electronic components is the electrical connection between the electronic component and the tester.

[0015] The electronic components on the test table are electrically connected to the tester by being electrically connected to the test board on the tester side.

[0016] The test table and test board need to be precisely aligned.

[0017] However, defects in alignment between the test table and the test board may occur due to tolerances caused by wear during manufacturing, assembly, or use.

[0018] [Prior Art Literature]

[0019] [Patent Literature]

[0020] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373

[0021] Technology is needed to overcome various tolerances between the test table and the test board.

[0022] A handler for testing electronic components according to a first embodiment of the present invention comprises: a test table on which electronic components are arranged on an upper surface; a moving mechanism for moving the test table between an arrangement space on which electronic components are arranged on the test table and a test space separated from the arrangement space where a test is performed on the electronic components arranged on the test table; a marker positioned so as to be fixed on the upper side of the arrangement space; a moving camera that moves together with the test table by the moving mechanism and can photograph the marker; and a controller for controlling the moving mechanism and the moving camera so that the moving camera photographs the marker; wherein the controller identifies the position of the test table from the image of the marker photographed by the moving camera.

[0023] Test zones corresponding one-to-one with the electronic components arranged on the test table are arranged on the bottom surface of the test board, and each of the test zones has a set of test pins forming a cluster that is electrically connected to the electronic components, and the controller identifies the locations of the test zones by analyzing images taken of the bottom surface of the test board.

[0024] The above moving mechanism includes a rotary moving device that rotates the test table; and a horizontal moving device that moves the test table in a horizontal direction; and the moving camera is moved in a horizontal direction by the horizontal moving device.

[0025] Rotation of the above-mentioned moving camera by the above-mentioned rotary moving device is prohibited.

[0026] The relative positions of the moving camera and the test table on the plane are fixed.

[0027] The above-mentioned moving mechanism further includes a camera elevator that raises and lowers the above-mentioned moving camera.

[0028] The controller identifies the locations of the test zones by analyzing images of the bottom surface of the test board taken while the mobile camera is raised.

[0029] The above indicator is a mirror.

[0030] A handler for testing electronic components according to a second embodiment of the present invention comprises: a test table on which electronic components are arranged on an upper surface; a moving mechanism for moving the test table between an arrangement space on which electronic components are arranged on the test table and a test space separated from the arrangement space where testing of the electronic components arranged on the test table is performed; a moving camera that moves together with the test table by the moving mechanism and is positioned above the test space to photograph the bottom surface of a test board electrically connected to the electronic components arranged on the test table; and a controller for controlling the moving mechanism and the moving camera so that the moving camera photographs the bottom surface of the test board; wherein the moving mechanism comprises a rotary moving device for rotating the test table; and a horizontal moving device for moving the test table and the moving camera in a horizontal direction. It includes, on the bottom surface of the test board, test zones are arranged that correspond one-to-one with the electronic components arranged on the test table, and each of the test zones has a set of test pins forming a cluster that are electrically connected to the electronic components, and the controller identifies the locations of the test zones by analyzing images taken of the bottom surface of the test board.

[0031] Rotation of the above-mentioned moving camera by the above-mentioned rotary moving device is prohibited.

[0032] The relative positions of the moving camera and the test table on the plane are fixed.

[0033] The reliability of the test is ensured through precise alignment between the test table and the test board by accurately tracking the position of the test table.

[0034] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to one embodiment of the present invention.

[0035] FIGS. 2 to 11 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0036] Preferred embodiments according to the present invention are described with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0037] <Description of Handlers for Electronic Component Testing>

[0038] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to the present invention.

[0039] The handler (TH) according to the present invention may be divided into a loading section (LU), a relocation section (RP), a connecting section (CP), and a moving section (MP), and includes a transport shuttle (100), a first picker hand (210), a second picker hand (310), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), a mirror (710), a moving camera (720), and a controller (800).

[0040] The unloading unit (LU) supplies electronic components (ED) to be tested or retrieves electronic components (ED) that have completed testing.

[0041] In the relocation section (RP), the positions of the electronic components (ED) to be tested, supplied from the unloading section (LU), are precisely relocated.

[0042] In the connection section (CP), electronic components whose positions have been precisely repositioned in the relocation section (RP) are electrically connected to the tester.

[0043] In the moving section (MF), electronic components can be moved to exchange electronic components (ED) between the unloading section (LU) and the relocation section (RP).

[0044] The moving section (MF) moves electronic components to be tested from the unloading section (LU) to the relocation section (RP), and moves electronic components (ED) that have completed testing from the relocation section (RP) to the unloading section (LU).

[0045] A transport shuttle (100) for carrying electronic components is installed in the moving part (MP).

[0046] When viewed in a planar view, the transport shuttle (100) of the moving part (MP) has a portion of one side (the right side in the drawing) overlapping with the unloading part (LU).

[0047] A transport shuttle (100) is provided to transport electronic components (ED) between the unloading section (LU) and the relocation section (RP).

[0048] The transport shuttle (100) has a movable transport table (110).

[0049] The transport shuttle (100) may have at least one transport table (110).

[0050] The transport table (110) can move back and forth in one direction.

[0051] The transport table (110) can move back and forth in the X-axis direction.

[0052] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0053] The transport table (110) can move between the first area (A1) on the side overlapping with the unloading section (LU) and the second area (A2) on the side of the relocation section (RP).

[0054] Electronic components can be loaded on the transport table (110).

[0055] The transport table (110) has a vacuum structure that fixes electronic components placed on a flat surface by vacuum pressure.

[0056] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0057] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0058] When viewed in a planar view, the vacuum hole (VH) is positioned near the center of the area occupied by the vacuum groove (VG).

[0059] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0060] Since the electronic component can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110).

[0061] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.

[0062] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0063] In the unloading section (LU), electronic components (ED) are supplied to the handler (TH) or recovered from the handler (TH).

[0064] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section (LU).

[0065] Electronic components can be loaded onto a Jetec Tray, Ring Frame, Ring Tray, or other types of customer trays and supplied to or retrieved from the handler (TH).

[0066] The structure of the loading / unloading section (LU) may vary depending on the type of customer tray.

[0067] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first picker hand (210) is provided in the unloading section (LU).

[0068] The first picker hand (210) is provided to load electronic components onto the transport table (110) or to unload them from the transport table (110).

[0069] For unloading operations by the first picker hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0070] The first picker hand (210) loads electronic components to be tested onto a transport table (110) in the first area (A1) or unloads electronic components that have been tested from the transport table (110) in the first area (A1).

[0071] The first picker hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components (ED) by vacuum pressure.

[0072] Preferably, four pickers can be installed in pairs on the first picker hand (210) to improve processing capacity.

[0073] For example, as shown in the conceptual diagram of FIG. 3, the first picker hand (210) may have four pickers (P) arranged in a 2x2 matrix form.

[0074] Depending on the embodiment, the number of pickers (P) provided in the first picker hand (210) may be increased or decreased.

[0075] The first picker hand (210) can pick up four electronic components at once, but since the positions of the electronic components may vary, it is preferable to implement the pickers (P) to pick up one electronic component at a time sequentially through individual lifting and lowering movements.

[0076] In the relocation section (RP), electronic components to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated.

[0077] In the relocation section (RP), a relocation space (RS) is formed for the relocation of electronic components.

[0078] The rearrangement space (RS) is a space where electronic components are arranged on a test table (300), so it may be referred to as an arrangement space.

[0079] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0080] The repositioning part (RP) is equipped with a second picker hand (310).

[0081] The second picker hand (310) takes electronic components to be tested from the transport table (110) or loads electronic components that have been tested onto the transport table (110).

[0082] For unloading operations by the second picker hand (310), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0083] The second picker hand (310) unloads electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0084] The second picker hand (310) can be configured in the same way as the first picker hand (210).

[0085] The number of pickers (P) provided in the second picker hand (310) may be different from the number of pickers (P) provided in the first picker hand (210).

[0086] The second picker hand (310) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation area (RP).

[0087] The second picker hand (310) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0088] In order for electronic components to be tested by the second picker hand (310) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP).

[0089] The test table (300) is provided to load electronic components that are unloaded from the transport table (110) by the second picker hand (310).

[0090] As shown in the schematic excerpt of FIG. 4, the test table (300) is in the shape of a disc and has a flat top surface.

[0091] The test table (300) may be in the shape of a square plate when viewed from a flat plane, and in this case, the top surface is also flat.

[0092] The electronic components are loaded and arranged on the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0093] The test table (300) can be moved in the X-axis, Y-axis and Z-axis directions.

[0094] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0095] Generally, when an electronic component is moved to a test table (300), shock or inertia accompanying the movement occurs.

[0096] Impact or inertia, etc., can disrupt the position of electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where electronic components are loaded on the test table (300).

[0097] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110).

[0098] When an electronic component is placed on the test table (300) by the second picker hand (310), the electronic component can be placed in the same position due to vacuum pressure. In that state, when the second picker hand (310) releases the grip on the electronic component, the electronic component is fixed in the placed position without shifting.

[0099] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0100] The vacuum device (400) can be configured with only a structure that is installed in a factory and distributes vacuum pressure supplied from outside the handler (TH) to each electronic component (ED) through a vacuum circuit.

[0101] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0102] The vacuum holes (h) are implemented to be selectively opened or closed depending on the control of the vacuum circuit. The electronic components may be selectively fixed to the test table (300) or removed from the test table (300).

[0103] The electronic components are electrically connected to the tester while loaded on the test table (300).

[0104] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (TB).

[0105] The test board (TB) has test pins that make electrical contact with electronic components.

[0106] The test board (TB) is fixedly coupled to the handler (TH) at the connection part (CP).

[0107] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) are electrically connected to the test pins of the test board (TB).

[0108] The test board (TB) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0109] The test board (TB) is positioned above the test space (TS). Here, the test space (TS) is a space formed in the connection part (CP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by the raising of the test table (300).

[0110] Once installation is complete, the test board (TB) is fixed in a position that cannot be changed.

[0111] The test board (TB) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.

[0112] The test board (TB) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0113] As shown in the bottom view of FIG. 5, the test board (TB) has test zones (TZ) arranged in a one-to-one correspondence with the electronic components arranged on the test table (300).

[0114] The test zones (TZ) correspond one-to-one with the electronic components (ED) loaded on the test table (300).

[0115] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0116] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).

[0117] When the test board (TB) is a probe card, a set of test pins (t) is densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals on an electronic component (ED). The test pins (t) on the probe card are also commonly referred to as probe pins.

[0118] In the case where the test board (TB) has a structure with a socket module, a set of test pins (t) are installed in one socket module, and one socket module forms one test zone (TZ). Therefore, when one socket module (22) is replaced, one test zone (TZ) is replaced.

[0119] For reliable testing to be performed, the test zone (TZ) and the electronic components must be aligned.

[0120] In order for the test area (TZ) and the electronic components to be aligned, the positions of the electronic components arranged on the test table (300) must be able to match the test area (TZ).

[0121] If the coordinates of the electronic component on the test table (300) on the XY plane do not match the coordinates of the test zone (TZ), a defect occurs in the electrical connection between the electronic component and the tester.

[0122] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is in an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. To prevent this, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.

[0123] The relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component.

[0124] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second picker hand (310). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second picker hand (310).

[0125] The positions of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (TB) may not coincide with each other.

[0126] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0127] In the present invention, when the second picker hand (310) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0128] The temporary area may not be a set location, but any location where the electronic component (ED) is placed on the test table (300) by the second picker hand (310).

[0129] The temporary area is a location that is not set or fixed by the controller (800) and is arbitrarily determined by the operation of the second picker hand (310).

[0130] For example, when the second picker hand (310) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes a temporary area.

[0131] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0132] All temporary zones (BZ) can have their own positions on the X-axis, Y-axis, and Θ-axis.

[0133] The fixed position zone refers to the location where the electronic component (ED) and the test zone (TZ) coincide. The exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0134] The position zone (RZ) may be pre-set, but it may also be set to match the position and arrangement of the test zones (TZ) on the test board (TB) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0135] The positioning zone (RZ) can be obtained from an image precisely scanned by a separate high-magnification camera attached to the test table (300) before the test operation of the handler (TH).

[0136] In Fig. 8, the temporary zone (BZ) may have errors in the X-axis direction, Y-axis direction, and Θ-axis direction with respect to the fixed zone (RZ).

[0137] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0138] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second picker hand (310) from a temporary zone (BZ) to a fixed zone (RZ).

[0139] According to the present embodiment, the second picker hand (310) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0140] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), and a picker elevator (530).

[0141] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0142] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0143] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0144] The relocation camera (520) is positioned apart from the relocation picker (510).

[0145] The repositioning camera (520) is fixed in position in the horizontal direction, which is the X-axis and Y-axis direction.

[0146] A repositioning camera (520) is provided to photograph electronic components (ED).

[0147] The picker elevator (530) raises the relocation picker (510).

[0148] It is preferable that the picker elevator (530) be equipped with a lifting motor so as to precisely control the lifting speed or lifting distance of the repositioning picker (510).

[0149] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0150] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), or other identifiable objects.

[0151] The relocation picker (510) and the relocation camera (520) are bundled into a single module and fixed. The mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0152] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0153] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0154] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0155] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotary moving mechanism (610), a lifting moving mechanism (620), a first moving mechanism (640), a second moving mechanism (660), and a camera lifting mechanism (680).

[0156] The rotary mover (610) rotates the test table (300) in the Θ-axis direction.

[0157] The test table (300) can be rotated by the rotary mover (610) so that the angular position of the electronic component (ED) in the Θ-axis direction can be adjusted.

[0158] The elevator (620) raises the test table (300).

[0159] The test table (300) is connected to the lifting mechanism (620) via a rotary moving mechanism (610).

[0160] When the test table (300) is raised by the lifting mechanism (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the lifting mechanism (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0161] The first moving device (640) moves the test table (300) in the X-axis direction.

[0162] As the test table (300) is moved in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS).

[0163] The second mover (660) moves the test table (300) in the Y-axis direction.

[0164] The first mover (640) and the second mover (660) move the test table (300) in a horizontal direction, so they can be grouped and named as horizontal movers.

[0165] The camera elevator (680) raises the moving camera (720).

[0166] The above-mentioned moving mechanism (600) basically has three functions.

[0167] The first function is to move the test table (300) and the moving camera (720) between the relocation space (RS) and the test space (TS).

[0168] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0169] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0170] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0171] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED).

[0172] Here, the operation during the relocation of electronic components (ED) is explained.

[0173] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0174] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0175] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the picker elevator (530) operates to lower the relocation picker (510).

[0176] When the lowered repositioning picker (510) adsorbs and grasps the electronic component (ED) of the test table (300) by vacuum pressure, the picker elevator (530) operates to raise the repositioning picker (510). Afterward, the first mover (640) and the second mover (660) operate to align the center of the position zone (RZ) with the center of the electronic component (ED) grasped by the repositioning picker (510), and the rotary mover (610) operates to align the electronic component (ED) with the position zone (RZ). In this state, the picker elevator (530) operates to lower the repositioning picker (510), thereby allowing the electronic component (ED) grasped by the repositioning picker (510) to settle in the position zone (RZ).

[0177] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the repositioning picker (510) rises and begins repositioning the next electronic component (ED).

[0178] Even if the electronic component (ED) can be accurately aligned with the test area (TZ) by repositioning the electronic component (ED) as described above, alignment of the test table (300) and the test board (TB) is required first.

[0179] Even if the position of the electronic component (ED) can be aligned with the test area (TZ), if the test table (300) and the test board (TB) are not aligned, the electronic component (ED) and the test area (TZ) will ultimately not be aligned. This is why a mirror (710) and a moving camera (720) are needed.

[0180] The mirror (710) is a marker for checking the position of the test table (300).

[0181] It is placed on the upper side of the relocation space (RS) of the mirror (710).

[0182] Since the mirror (710) is a marker for determining the position of the test table (300), its position must be absolutely fixed.

[0183] It may be preferable for the mirror (710) to be secured by being tied together with the repositioning mechanism (500).

[0184] Since the mirror (710) has a high light reflectivity, it can be captured in the image of the moving camera (720) even in very weak light, so it can be preferably adopted as a marker.

[0185] The moving camera (720) photographs the mirror (710).

[0186] The moving camera (720) can be used to track and verify the position of the test table (300) through the mirror (710).

[0187] The controller (800) controls the moving mechanism (600) and the moving camera (720) so that the moving camera (720) photographs the mirror (710).

[0188] The controller (800) can accurately determine the position of the test table (300) by comparing the coordinates of the fixed mirror (710) with the coordinates of the test table (300) tracked by the encoder.

[0189] When the location of the test table (300) is accurately determined in the relocation space (RS), the controller (800) can accurately determine the alignment location between the test table (300) and the test board (TB).

[0190] Once the alignment position is accurately identified, the controller (800) can control the moving mechanism (600) to move the test table (300) to the alignment position.

[0191] The task of determining the location of the test table (300) can be performed at the time when the operation of the handler (TH) begins or at regular operation cycles of the handler (TH).

[0192] The moving camera (720) can be used by the controller (800) to determine the location of test zones (TZ) on the test board (TB).

[0193] The moving camera (720) photographs the bottom surface of the test board (TB).

[0194] When the moving camera (720) photographs the bottom surface of the test board (TB), the controller (800) controls the camera elevator (680) so that the moving camera (720) is raised and the photograph is taken, and it is desirable to adopt the moving camera (720) at a high magnification.

[0195] The controller (800) uses a moving camera (720) to identify a position zone (RZ) corresponding to the location of the identified test zones (TZ) and then relocates the electronic components (ED).

[0196] Referring to FIG. 11, the moving camera (720) is installed to be moved in the X-axis direction and the Y-axis direction by the first moving device (640) and the second moving device (660).

[0197] The relative positions of the moving camera (720) and the test table (300) on the plane must be fixed.

[0198] This is because if the relative positions of the moving camera (720) and the test table (300) vary, an error may occur in the position of the test table (300) confirmed by the moving camera (720).

[0199] The moving camera (720) is installed so that rotation by the rotating moving device (610) is prohibited. Therefore, the location of the test area (TZ) captured by the moving camera (720) can be accurately determined.

[0200] The task of specifying the test zone (TZ) can be performed whenever the operation of the handler (TH) starts or when the test board (TB) is replaced.

[0201] The controller (800) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first picker hand (210), the second picker hand (310), the vacuum (400), the relocation mechanism (500), the moving mechanism (600), and the moving camera (720).

[0202] Next, the method of operation of the handler (TH) according to the present invention will be explained based on the logistics of electronic components (ED).

[0203] When power is turned on to the handler (TH), the controller (800) controls the moving mechanism (600) and the moving camera (720) to identify the test area (TZ) and the location of the test table (300). Accordingly, the alignment location between the test table (300) and the test board (TB) is determined. Once this preliminary work is completed, the logistics of the electronic components (ED) begin.

[0204] In the unloading section (LU), the first picker hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0205] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0206] The second picker hand (310) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) are temporary zones (BZ).

[0207] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0208] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS). Afterwards, the lifting mechanism (620) operates to raise the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester.

[0209] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second picker hand (310) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first picker hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0210] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0211] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. A test table on which electronic components are arranged on the upper surface; A moving mechanism for moving the test table between an array space where electronic components are arranged on the test table and a test space separated from the array space where tests on the electronic components arranged on the test table are performed; A marker positioned so as to be fixed on the upper side of the above array space; A mobile camera capable of moving together with the test table by the above-mentioned moving mechanism and capturing the marker; and A controller that controls the moving mechanism and the moving camera so that the moving camera photographs the marker; comprising The controller determines the position of the test table from the image captured by the mobile camera of the marker. Handler for testing electronic components.

2. In Paragraph 1, Test zones corresponding one-to-one with the electronic components arranged on the test table are arranged on the bottom surface of the above test board, and Each of the above test zones has a set of test pins forming a cluster that is electrically connected to an electronic component, and The above controller analyzes images of the bottom surface of the test board to identify the locations of the test zones. Handler for testing electronic components.

3. In Paragraph 1, The above moving mechanism is A rotary mover that rotates the above test table; and A horizontal mover that moves the above test table in a horizontal direction; comprising, The above-mentioned moving camera is moved horizontally by the above-mentioned horizontal moving device. Handler for testing electronic components.

4. In Paragraph 3, The above-mentioned moving camera is prohibited from being rotated by the above-mentioned rotary moving device. Handler for testing electronic components.

5. In Paragraph 3, The relative positions of the moving camera and the test table on a plane are fixed. Handler for testing electronic components.

6. In Paragraph 3, The above-mentioned moving mechanism further includes a camera elevator for raising and lowering the moving camera. Handler for testing electronic components.

7. In Paragraph 6, Test zones corresponding one-to-one with the electronic components arranged on the test table are arranged on the bottom surface of the above test board, and Each of the above test zones has a set of test pins forming a cluster that is electrically connected to an electronic component, and The controller analyzes images of the bottom surface of the test board taken while the mobile camera is raised to identify the locations of the test areas. Handler for testing electronic components.

8. In Paragraph 1, The above marker is a mirror Handler for testing electronic components.

9. A test table on which electronic components are arranged on the upper surface; A moving mechanism for moving the test table between an array space where electronic components are arranged on the test table and a test space separated from the array space where tests on the electronic components arranged on the test table are performed; A moving camera capable of photographing the bottom surface of a test board that moves together with the test table by means of the moving mechanism and is positioned above the test space and electrically connected to electronic components arranged on the test table; and A controller that controls the moving mechanism and the moving camera so that the moving camera photographs the bottom surface of the test board; comprising The above moving mechanism is A rotary mover that rotates the above test table; and A horizontal mover that moves the above test table and the above moving camera in a horizontal direction; comprising, Test zones corresponding one-to-one with the electronic components arranged on the test table are arranged on the bottom surface of the above test board, and Each of the above test zones has a set of test pins forming a cluster that is electrically connected to an electronic component, and The above controller analyzes images of the bottom surface of the test board to identify the locations of the test zones. Handler for testing electronic components.

10. In Paragraph 9, The above-mentioned moving camera is prohibited from being rotated by the above-mentioned rotary moving device. Handler for testing electronic components.

11. In Paragraph 10, The relative positions of the moving camera and the test table on a plane are fixed. Handler for testing electronic components.

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