Electronic device comprising antenna

Abstract

An electronic device disclosed herein comprises: a housing including a conductive portion including at least one opening; a substrate including a first substrate surface; and a plurality of antenna elements disposed on the substrate to form a beam pattern. The substrate includes: an antenna module in which the first substrate surface faces the conductive portion so that a part of the beam pattern formed by the plurality of antenna elements extends in a direction passing through the at least one opening; a first wireless communication circuit for transmitting or receiving wireless signals in at least one first frequency band through the antenna module; and a second wireless communication circuit for transmitting or receiving wireless signals in at least one second frequency band through the conductive portion. The first substrate surface of the substrate and the inner surface of the conductive portion may not be parallel to each other.

Description

Electronic device including an antenna

[0001] The embodiments of the present disclosure relate to an electronic device comprising an antenna.

[0002] With the advancement of wireless communication technology, electronic devices (e.g., portable communication devices) are being widely used in daily life, and the use of content is on the rise. Due to this rapid increase in content usage, network capacity is gradually reaching its limits. Following the commercialization of legacy communication systems, mmWave communication systems or new radio (NR) that transmit or receive signals using high-frequency bands (e.g., 3 GHz to 300 GHz band) are being used in conjunction to meet the increasing demand for wireless data traffic. Therefore, efficient placement of legacy communication antennas and mmWave antennas may be required.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] The electronic device may include a substrate and an antenna module (e.g., an antenna structure) comprising a plurality of spaced antenna elements (e.g., conductive patches and / or conductive patterns) disposed on the substrate. Such an antenna module may operate as a mmWave antenna in a frequency band ranging from about 3 GHz to 300 GHz. The antenna module may be positioned to radiate from inside the electronic device to the outside and form a directional beam pattern. For example, the antenna module may be positioned to form a directional beam pattern in the internal space of the electronic device, through the side of the electronic device, and toward the outside of the electronic device.

[0005] The electronic device may include a side member formed of at least a part of the side of the electronic device, formed from a conductive member to reinforce rigidity and form an aesthetic appearance. This side member may include at least one conductive part that is (electronically) segmented through at least one non-conductive part (e.g., a polymer) and electrically connected to a wireless communication circuit. The at least one conductive part may operate as a legacy antenna in a frequency band in the range of about 600 MHz to 6000 MHz.

[0006] To achieve a slimmer and more compact electronic device and efficient placement of electrical structures, a mmWave antenna may be positioned in close proximity to a conductive portion used as a legacy antenna. In this case, a beam pattern formed from the mmWave antenna is formed on the conductive portion, and the beam pattern may be configured to radiate to the outside of the electronic device through at least one opening filled with a non-conductive material (e.g., a polymer). As the mmWave antenna is closer to the conductive portion, the distance from the at least one opening decreases, and radiation efficiency can be improved.

[0007] In such cases, the radiation performance of the legacy antenna may be reduced as the operating frequency band is unintentionally low-shifted due to the proximity of a mmWave antenna containing conductive elements (e.g., ground and / or conductive patches of the substrate).

[0008] Various embodiments of the present disclosure may provide an electronic device comprising an antenna having a placement structure capable of reducing the degradation of radiation performance of a legacy antenna even when a mmWave antenna is in close proximity.

[0009] According to various embodiments, an electronic device including an antenna having a placement structure that can help improve the radiation performance of a mmWave antenna while maintaining the radiation performance of a legacy antenna can be provided.

[0010] However, the problems intended to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0011] According to various embodiments, an electronic device may include a housing comprising a conductive portion that forms at least a portion of a side and includes at least one opening, and an antenna module disposed in the housing. The antenna module comprises a substrate having a first substrate surface and a plurality of antenna elements disposed on the substrate to form a beam pattern in a direction toward which the first substrate surface faces, and the substrate may be disposed such that the first substrate surface faces the conductive portion so that a portion of the beam pattern formed by the plurality of antenna elements extends in a direction through which it passes through the at least one opening. The electronic device may include a first wireless communication circuit configured to transmit and / or receive a wireless signal in at least one first frequency band through the antenna module and a second wireless communication circuit electrically connected to a feed point of the conductive portion and configured to transmit and / or receive a wireless signal in at least one second frequency band through the conductive portion, and the substrate may be tilted with respect to the inner surface of the conductive portion such that the first substrate surface and the inner surface of the conductive portion are not parallel to each other.

[0012] An electronic device according to exemplary embodiments of the present disclosure can help improve the radiation performance of a mmWave antenna while maintaining the radiation performance of a legacy antenna by having a proximity arrangement structure in which the substrate of the mmWave antenna is tilted and positioned so as not to be parallel to a conductive portion formed as part of the side of the electronic device and operating as a legacy antenna.

[0013] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0014] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0015] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure.

[0018] FIG. 3a is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0019] FIG. 3b is a perspective view of the rear of the electronic device of FIG. 3a according to various embodiments of the present disclosure.

[0020] FIG. 3c is an exploded perspective view of the electronic device of FIG. 3b according to various embodiments of the present disclosure.

[0021] FIG. 4 is a perspective view illustrating the arrangement structure of an antenna module and a conductive part according to various embodiments of the present disclosure.

[0022] FIG. 5a is a configuration diagram showing the rear view of an electronic device according to various embodiments of the present disclosure.

[0023] FIG. 5b is an enlarged view of the area 5b of FIG. 5a according to various embodiments of the present disclosure.

[0024] FIG. 5c is a drawing of an electronic device viewed along the 5c-5c direction of FIG. 5b according to various embodiments of the present disclosure.

[0025] FIGS. 6a and 6b are graphs comparing the radiation performance of a second antenna with or without tilting of the antenna module when the antenna module of a first antenna according to various embodiments of the present disclosure is in close proximity to a conductive part.

[0026] FIGS. 7a and 7b are graphs comparing the radiation performance of a second antenna with or without tilting of the antenna module when the antenna module of a first antenna according to various embodiments of the present disclosure is in close proximity to a conductive part.

[0027] FIG. 8a is a partial configuration diagram of an electronic device including a tilted antenna module according to various embodiments of the present disclosure.

[0028] FIG. 8b is a drawing of an electronic device viewed along the direction 8b-8b of FIG. 8a according to various embodiments of the present disclosure.

[0029] FIG. 9a is a partial configuration diagram of an electronic device including a tilted antenna module according to various embodiments of the present disclosure.

[0030] FIG. 9b is a drawing of an electronic device viewed along the direction 9b-9b of FIG. 9a according to various embodiments of the present disclosure.

[0031] FIGS. 10a to 10c are drawings illustrating the arrangement structure of a first antenna and a second antenna according to various embodiments of the present disclosure.

[0032] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0033] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0035] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0036] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0037] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0041] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0042] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0043] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0047] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0049] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), antenna array, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0052] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., an antenna array) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0054] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2 is a block diagram (200) of an electronic device (101) for supporting legacy network communication and 5G network communication according to various embodiments.

[0057] Referring to FIG. 2, the electronic device (101) may include a first communication processor (212), a second communication processor (214), a first radio frequency integrated circuit (RFIC) (222), a second RFIC (224), a third RFIC (226), a fourth RFIC (228), a first radio frequency front end (RFFE) (232), a second RFFE (234), a first antenna module (242), a second antenna module (244), and an antenna (248). The electronic device (101) may further include a processor (120) and a memory (130). The network (199) may include a first network (292) and a second network (294). According to another embodiment, the electronic device (101) may further include at least one of the components described in FIG. 1, and the network (199) may further include at least one other network. According to one embodiment, a first communication processor (212), a second communication processor (214), a first RFIC (222), a second RFIC (224), a fourth RFIC (228), a first RFFE (232), and a second RFFE (234) may form at least a part of a wireless communication module (192). According to another embodiment, the fourth RFIC (228) may be omitted or included as part of a third RFIC (226).

[0058] The first communication processor (212) can establish a communication channel in a band to be used for wireless communication with the first network (292), and support legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor (214) can establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second network (294), and support 5G network communication through the established communication channel. According to various embodiments, the second network (294) may be a 5G network as defined by 3GPP. Additionally, according to one embodiment, the first communication processor (212) or the second communication processor (214) may support the establishment of a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second network (294), and 5G network communication through the established communication channel. According to one embodiment, the first communication processor (212) and the second communication processor (214) may be implemented within a single chip or a single package. According to various embodiments, the first communication processor (212) or the second communication processor (214) may be formed within a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0059] The first RFIC (222) can convert a baseband signal generated by the first communication processor (212) during transmission into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network (292) (e.g., legacy network). During reception, the RF signal is acquired from the first network (292) (e.g., legacy network) through an antenna (e.g., first antenna module (242)) and can be preprocessed through an RFFE (e.g., first RFFE (232)). The first RFIC (222) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor (212).

[0060] The second RFIC (224) can convert a baseband signal generated by the first communication processor (212) or the second communication processor (214) into an RF signal of the Sub6 band (e.g., about 6 GHz or less) used in the second network (294) (e.g., 5G network) (hereinafter, 5G Sub6 RF signal). When receiving, the 5G Sub6 RF signal is acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., the second antenna module (244)) and can be preprocessed through an RFFE (e.g., the second RFFE (234)). The second RFIC (224) can convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by the corresponding communication processor among the first communication processor (212) or the second communication processor (214).

[0061] The third RFIC (226) can convert a baseband signal generated by the second communication processor (214) into an RF signal of the 5G Above6 band (e.g., approximately 6 GHz to approximately 60 GHz) to be used in the second network (294) (e.g., 5G network) (hereinafter, 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., antenna (248)) and preprocessed through the third RFFE (236). The third RFIC (226) can convert the preprocessed 5G Above6 RF signal into a baseband signal so that it can be processed by the second communication processor (214). According to one embodiment, the third RFFE (236) may be formed as part of the third RFIC (226).

[0062] According to one embodiment, the electronic device (101) may include a fourth RFIC (228) separately from or at least as part of the third RFIC (226). In this case, the fourth RFIC (228) may convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter referred to as an IF signal) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (226). The third RFIC (226) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network (294) (e.g., a 5G network) through an antenna (e.g., antenna (248)) and converted into an IF signal by the third RFIC (226). The fourth RFIC (228) can convert the IF signal into a baseband signal so that the second communication processor (214) can process it.

[0063] According to one embodiment, the first RFIC (222) and the second RFIC (224) may be implemented as at least part of a single chip or a single package. According to one embodiment, the first RFFE (232) and the second RFFE (234) may be implemented as at least part of a single chip or a single package. According to one embodiment, at least one of the first antenna module (242) or the second antenna module (244) may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

[0064] According to one embodiment, the third RFIC (226) and the antenna (248) may be placed on the same substrate to form a third antenna module (246). For example, a wireless communication module (192) or a processor (120) may be placed on a first substrate (e.g., a main PCB). In this case, the third RFIC (226) may be placed on a portion of a second substrate (e.g., a sub PCB) separate from the first substrate (e.g., a bottom surface), and the antenna (248) may be placed on another portion of a second substrate (e.g., a sub PCB) to form a third antenna module (246). By placing the third RFIC (226) and the antenna (248) on the same substrate, it is possible to reduce the length of the transmission line between them. This can reduce the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G network communication by the transmission line. As a result, the electronic device (101) can improve the quality or speed of communication with the second network (294) (e.g., 5G network).

[0065] According to one embodiment, the antenna (248) may be formed as an antenna array comprising a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC (226) may include a plurality of phase shifters (238) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (236). During transmission, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device (101) (e.g., a base station of a 5G network) through the corresponding antenna element. During reception, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal received from the outside through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device (101) and the outside.

[0066] The second network (294) (e.g., 5G network) may be operated independently of the first network (292) (e.g., legacy network) (e.g., Stand-Alone (SA)) or connected to it (e.g., Non-Stand Alone (NSA)). For example, the 5G network may only have an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device (101) can access the access network of the 5G network and then access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., evolved packed core (EPC)). Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in memory (230) and can be accessed by other parts (e.g., processor (120), first communication processor (212), or second communication processor (214)).

[0067] FIG. 3a is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 3b is a rear perspective view of the electronic device of FIG. 3a according to various embodiments of the present disclosure.

[0068] The electronic device (300) of FIGS. 3a and FIGS. 3b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0069] Referring to FIG. 3a and FIG. 3b, an electronic device (300) according to one embodiment may include a housing (310) comprising a first surface (or front) (310A), a second surface (or rear) (310B), and a side (310C) surrounding the space between the first surface (310A) and the second surface (310B). In another embodiment, the housing (310) may refer to a structure forming some of the first surface (310A), the second surface (310B), and the side (310C). According to one embodiment, the first surface (310A) may be formed by a front plate (302) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (310B) may be formed by a rear plate (311) that is substantially opaque. The rear plate (311) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (310C) may be formed by a side member (or "side bezel structure") (318) comprising metal and / or polymer, which is combined with the front plate (302) and the rear plate (311). In some embodiments, the rear plate (311) and the side member (318) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0070] In the illustrated embodiment, the front plate (302) may include a first region (310D) that curves seamlessly from the first surface (310A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 3b), the rear plate (311) may include a second region (310E) that curves seamlessly from the second surface (310B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (302) or the rear plate (311) may include only one of the first region (310D) or the second region (310E). In some embodiments, the front plate (302) and the rear plate (311) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (310B). In the above embodiments, when viewed from the side of the electronic device, the side member (318) may have a first thickness (or width) on the side side that does not include the first region (310D) or the second region (310E) as above, and may have a second thickness thinner than the first thickness on the side side that includes the first region or the second region.

[0071] According to one embodiment, the electronic device (300) may include at least one of a display (301), an input device (303), an audio output device (307, 314), a sensor module (304, 319), a camera module (305, 312, 313), a key input device (317), an indicator, and a connector (308). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., a key input device (317), or an indicator) or additionally include other components.

[0072] The display (301) may be exposed, for example, through a substantial portion of the front plate (302). In some embodiments, at least a portion of the display (301) may be exposed through the front plate (302) forming the first surface (310A) and the first area (310D) of the side (310C). The display (301) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (304, 319) and / or at least a portion of the key input device (317) may be placed in the first area (310D) and / or the second area (310E).

[0073] The input device (303) may include a microphone. In some embodiments, the input device (303) may include a plurality of microphones positioned to detect the direction of sound. The sound output device (307, 314) may include speakers. The speakers may include an external speaker (307) and a call receiver (314). In some embodiments, the microphone, speakers, and connector (308) may be positioned in the space of the electronic device (300) and may be exposed to the external environment through at least one hole formed in the housing (310). In some embodiments, the hole formed in the housing (310) may be used for both the microphone and the speakers. In some embodiments, the sound output device (307, 314) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (310) excluded. In some embodiments, the electronic device (300) may include a tray member positioned through at least a portion of the side member (318).

[0074] The sensor module (304, 319) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor module (304, 319) may include, for example, a first sensor module (304) (e.g., proximity sensor) and / or a second sensor module (e.g., fingerprint sensor) disposed on a first surface (310A) of the housing (310), and / or a third sensor module (319) (e.g., heart rate monitor (HRM) sensor) disposed on a second surface (310B) of the housing (310). The fingerprint sensor may be disposed on the first surface (310A) of the housing (310). The fingerprint sensor (e.g., ultrasonic or optical fingerprint sensor) may be disposed below the display (301) on the first surface (310A). The electronic device (300) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (304).

[0075] The camera modules (305, 312, 313) may include a first camera module (305) disposed on a first surface (310A) of the electronic device (300), a second camera module (312) disposed on a second surface (310B), and / or a flash (313). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (300).

[0076] A key input device (317) may be placed on the side (310C) of the housing (310). In another embodiment, the electronic device (300) may not include some or all of the aforementioned key input devices (317), and the key input device (317) that is not included may be implemented in other forms, such as soft keys, on the display (301). In another embodiment, the key input device (317) may be implemented using a pressure sensor included in the display (301).

[0077] The indicator may be placed, for example, on the first surface (310A) of the housing (310). The indicator may, for example, provide status information of the electronic device (300) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (305). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0078] The connector hole (308) may include a first connector hole (308) capable of accommodating a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0079] Some of the camera modules (305, 312), some of the sensor modules (304, 319), or indicators may be positioned to be exposed through the display (301). For example, the camera module (305), sensor module (304), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (302) of the display (301) within the internal space of the electronic device (300). In one embodiment, the area where the display (301) and the camera module (305) face each other may be formed as a transparent area having a certain transmittance as part of the area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (305) through which light passes to form an image and generate an image by being formed by an image sensor. For example, the transparent area of ​​the display (301) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (305) may include an under-display camera (UDC). In another embodiment, some sensor modules (304) may be positioned to perform their functions without being visually exposed through the front plate (302) within the internal space of the electronic device. For example, in this case, the perforated opening may be unnecessary for the area of ​​the display (301) facing the sensor modules.

[0080] According to various embodiments, the side member (318) may include a first side (318-1) having a first length along a first direction (e.g., ±y-axis direction), a second side (318-2) extending from one end of the first side (318-1) and having a second length shorter than the first length along a second direction (e.g., ±x-axis direction) perpendicular to the first direction, a third side (318-3) extending parallel to the second side (318-2) from the other end of the first side (318-1) and having a second length, and a fourth side (318-4) connecting the second side (318-2) and the third side (318-3) and having a first length parallel to the first side (318-1). In one embodiment, the side member (318) may be formed of at least a partially conductive member. In one embodiment, the side member (318) may include a conductive portion (410) that is electromagnetically segmented through a non-conductive portion (411) disposed in part of the first side (318-1).

[0081] According to various embodiments, the electronic device (300) may include an antenna module (e.g., antenna module (500) of FIG. 4) positioned in an internal space and configured to form a directional beam (e.g., a beam pattern or a radio signal) to the outside of the electronic device (300) through at least a portion of a first side (318-1). In one embodiment, the antenna module (500) may operate as a first antenna (e.g., first antenna (A1) of FIG. 4) (mmWave antenna) configured to transmit and / or receive a radio signal in a frequency band ranging from about 3 GHz to 300 GHz. In one embodiment, the electronic device (300) may operate as a second antenna (A2) (legacy antenna) configured to transmit and / or receive a radio signal in a frequency band ranging from about 600 MHz to 6000 MHz through a conductive portion (410).

[0082] According to various embodiments, the first antenna (A1) may be positioned to radiate a directional beam to the outside of the electronic device (300) through at least one opening (e.g., the opening array (OPA) of FIG. 4) formed in the conductive portion (410). In one embodiment, the first antenna (A1) may be tilted to be closer than a specific separation distance (e.g., a minimum separation distance that does not affect the radiation performance of the second antenna (A2)) within the internal space of the electronic device (300), thereby improving radiation performance and helping to maintain the radiation performance of the second antenna (A2).

[0083] FIG. 3c is an exploded perspective view of the electronic device of FIG. 3b according to various embodiments of the present disclosure.

[0084] Referring to FIG. 3c, the electronic device (300) may include a side member (318) (e.g., a side bezel structure or a side frame), an extension member (3181) (e.g., a bracket, a support member or a support structure) extending from the side member (318) into the internal space (3101) of the electronic device (300), a front cover (302) (e.g., a front plate, a first plate or a first cover) coupled to one side of the side member (318), and a rear cover (311) (e.g., a rear plate, a second plate or a second cover) coupled to the other side of the side member (318) so as to face in the opposite direction to the front cover (302). In one embodiment, the electronic device (300) may include a housing (e.g., the housing (310) of FIG. 3a) (e.g., a housing structure) formed by combining the side member (318), the front cover (302), and the rear cover (311). In one embodiment, the electronic device (300) may include a display (301) disposed in the internal space (3101) of a housing, a substrate (340) including a camera module (312), a battery (343), a sub-substrate (341) disposed spaced apart from the substrate (340) with the battery (343) in between, and a module assembly (342) electrically connected to the sub-substrate (341) (e.g., a speaker assembly, a microphone assembly, or an interface connector assembly). In some embodiments, the electronic device (300) may omit at least one of the components or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 and FIG. 2 or the electronic device (300) of FIG. 3a, and redundant descriptions are omitted below.

[0085] According to various embodiments, the extension member (3181) may be disposed inside the electronic device (300) and connected to the side member (318) or formed integrally with the side member (318). The extension member (3181) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The extension member (3181) may have a display (301) coupled to a first surface (3181a), and a substrate (340), a sub-substrate (341), a module assembly (342), and a battery (343) coupled to a second surface (3181b) facing in the opposite direction to the first surface (3181a). The electronic device (300) may include a processor, memory, and / or interface disposed on the substrate (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0086] Memory may include, for example, volatile memory or non-volatile memory.

[0087] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0088] The battery (343) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (343) may be positioned side by side so as to be substantially coplanar with, for example, the substrate (340) and the sub-substrate (341). The battery (343) may be embedded inside the electronic device (300). In some embodiments, the battery (343) may be detachably positioned from the electronic device (300).

[0089] According to various embodiments, the electronic device (300) may include at least one electrical connection device (345) for electrically connecting a substrate (340) and a sub-substrate (341). In one embodiment, the at least one electrical connection device (345) may be arranged to connect the substrate (340) and the sub-substrate (341), or to electrically connect the substrate (340) and a module assembly (342).

[0090] According to various embodiments, the electronic device (300) may include an antenna module (e.g., antenna module (500) of FIG. 4) disposed in an internal space (3101) and positioned to form a directional beam to the outside of the electronic device (300) through at least a portion of a first side (318-1). In one embodiment, the antenna module (500) may operate as a first antenna (A1) (mmWave antenna) configured to transmit and / or receive a wireless signal in a frequency band ranging from about 3 GHz to 300 GHz. In one embodiment, the electronic device (300) may operate as a second antenna (A2) (legacy antenna) configured to transmit and / or receive a wireless signal in a frequency band ranging from about 600 MHz to 6000 MHz through a conductive portion (410).

[0091] According to various embodiments, the first antenna (A1) may be positioned to form a directional beam to the outside of the electronic device (300) through at least one opening (OPA) formed in the conductive portion (410) on the first side (318-1). In one embodiment, the first antenna (A1) may be tilted so that one end is closer than a specific separation distance (e.g., a minimum separation distance that does not affect the radiation performance of the second antenna (A2)) within the internal space of the electronic device (300), thereby inducing an improvement in the radiation performance of the first antenna (A1) and helping to maintain the radiation performance of the second antenna (A2).

[0092] FIG. 4 is a perspective view illustrating the arrangement structure of an antenna module and a conductive part according to various embodiments of the present disclosure.

[0093] Referring to FIG. 4, an electronic device (e.g., the electronic device (300) of FIG. 3c) may include an antenna module (500) (e.g., an antenna structure or an antenna device) disposed in an internal space (e.g., the internal space (3101) of FIG. 3c) and positioned to form a directional beam to the outside of the electronic device (300) through at least a portion of a first side (e.g., the first side (318-1) of FIG. 3c). In one embodiment, the antenna module (500) may operate as a first antenna (A1) for the electronic device (300). In one embodiment, the electronic device (e.g., the electronic device (300) of FIG. 3c) may include an electromagnetically segmented conductive portion (410) through a non-conductive portion (411) disposed in at least a portion of the side member (318). In one embodiment, the conductive portion (410) may operate as a second antenna (A2) for the electronic device.

[0094] According to various embodiments, the antenna module (500) may include a substrate (590) (e.g., a printed circuit board) disposed in the internal space (e.g., the internal space (3101) of FIG. 3c) of an electronic device (e.g., the electronic device (300) of FIG. 3c) and a plurality of antenna elements (510, 520, 530, 540, 550) disposed on the substrate and spaced apart from each other. In one embodiment, the substrate (590) may include a first substrate surface (5901) and a second substrate surface (5902) facing in the opposite direction to the first substrate surface (5901). In one embodiment, a plurality of antenna elements (510, 520, 530, 540, 550) may be positioned in the space between the first substrate surface (5901) and the second substrate surface (5902) at a location relatively closer to the first substrate surface (5901) than to the second substrate surface (5902), or may be exposed to the first substrate surface (5901). In one embodiment, each of the plurality of antenna elements (510, 520, 530, 540, 550) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) placed on the second substrate surface (5902) through at least one feed, thereby operating as a first antenna (A1) (e.g., an array antenna). In one embodiment, a plurality of antenna elements (510, 520, 530, 540, 550) may include a conductive patch and / or a conductive pattern disposed on a substrate (590). In some embodiments, the plurality of antenna elements (510, 520, 530, 540, 550) may be replaced with chip antennas comprising a ceramic substrate and a conductive patch disposed on the ceramic substrate, disposed on a first substrate surface (5901) of the substrate (590).

[0095] According to various embodiments, the antenna module (500) may include a wireless communication circuit (595) (e.g., a first wireless communication circuit) that is disposed on a second substrate surface (5902) of a substrate (590) and electrically connected to a plurality of antenna elements (510, 520, 530, 540, 550). In some embodiments, the wireless communication circuit (595) may be disposed on a printed circuit board (PCB) (e.g., a substrate (340) in FIG. 3c) (e.g., a main board or a device board) at a position spaced apart from the substrate (590) in the internal space (e.g., an electronic device (300) in FIG. 3c) of an electronic device (e.g., an electronic device (300) in FIG. 3c)) of FIG. 3c, and may be electrically connected to the substrate (590) through an electrical connection member (e.g., a flexible RF cable, FRC).

[0096] According to various embodiments, the antenna module (500) may include a protective member (596) disposed on a second substrate surface (5902) of the substrate (590) and disposed to at least partially cover the wireless communication circuit (595). In one embodiment, the protective member (596) may include a dielectric that is cured and / or solidified after application as a protective layer disposed to cover the wireless communication circuit (595). In one embodiment, the protective member (596) may include an epoxy resin. In one embodiment, the protective member (596) may be disposed on the second substrate surface (5902) of the substrate (590) to cover all or part of the wireless communication circuit (595). In one embodiment, the antenna module (500) may include a conductive shielding layer (597) laminated on the surface of the protective member (596). According to one embodiment, the conductive shielding layer (597) can shield noise (e.g., DC-DC noise or interference frequency components) generated in the antenna module (500) from being transmitted to the surroundings. In one embodiment, the conductive shielding layer (597) may comprise a conductive material (e.g., conductive paint) applied to the surface of the protective member (596) by a thin film deposition method such as sputtering. In one embodiment, the conductive shielding layer (597) may be electrically connected to the ground of the substrate (590). In another embodiment, the protective member (596) and / or the conductive shielding layer (597) may be replaced by a shield can mounted on the substrate (590).

[0097] According to various embodiments, the side member (318) may include a conductive member (318a) and a non-conductive member (318b) combined with the conductive member (318a). In one embodiment, the non-conductive member (318b) may be combined with the conductive member (318a) through injection. In some embodiments, the non-conductive member (318b) may be structurally combined with the conductive member (318a). In one embodiment, the non-conductive member (318b) may form at least a portion of an extension member (e.g., extension member (3181) of FIG. 3c) (e.g., bracket)) extending from the side member (318) into the internal space (e.g., internal space (3101) of FIG. 3c) of an electronic device (e.g., electronic device (300) of FIG. 3c).

[0098] According to various embodiments, the side member (318) may include a conductive portion (410) that is electromagnetically segmented through a non-conductive portion (411) (e.g., segment, slit, or gap) disposed in at least a portion of the conductive member (318a). In one embodiment, the non-conductive portion (411) may be disposed through an extension of the non-conductive member (318b). In some embodiments, the non-conductive portion (411) may be a dielectric of a material different from that of the non-conductive member (318b). In one embodiment, the conductive portion (318a) may be operated as a second antenna (A2) by being electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) (e.g., the second wireless communication circuit) at at least one point (e.g., the feed point (P1) of FIG. 5b). In one embodiment, the side member (318) may include a plurality of openings (OP1, OP2, OP3, OP4, OP5) (e.g., through holes) (e.g., opening array (OPA)) positioned at a location corresponding to a plurality of antenna elements (510, 520, 530, 540, 550) of the antenna module (500) in the conductive portion (410). In one embodiment, the plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed in such a way that they penetrate from the outer surface (318c) of the side member (318) to the inner surface (318d). In one embodiment, the plurality of openings (OP1, OP2, OP3, OP4, OP5) may be filled with a non-conductive member (318b).In one embodiment, the substrate (590) of the antenna module (500) may be positioned such that, in the internal space (3101) of the electronic device (300), the first antenna element (510) corresponds to the first opening (OP1), the second antenna element (520) corresponds to the second opening (OP2), the third antenna element (530) corresponds to the third opening (OP3), the fourth antenna element (540) corresponds to the fourth opening (OP4), and the fifth antenna element (550) corresponds to the fifth opening (OP5), so that the first substrate surface (5901) faces the inner surface (318d) of the conductive portion (410). In one embodiment, when the side member (318) is viewed from the outside (e.g., when the outer surface (318c) of the side member (318) is viewed from a vertical direction), each of the plurality of openings (OP1, OP2, OP3, OP4, OP5) may be arranged to correspond to overlap at least partially with each of the plurality of antenna elements (510, 520, 530, 540, 550). Accordingly, a directional beam formed from the antenna module (500) may be radiated to the outside of the electronic device (300) through each of the plurality of openings (OP1, OP2, OP3, OP4, OP5).

[0099] In some embodiments, the substrate (590) of the antenna module (500) may be positioned to be tilted through a recess (e.g., a substrate mounting portion) formed to support at least a portion of the substrate (590) in the extension member (3181). In one embodiment, the recess may be formed lower than the surface of the extension member (3181). In some embodiments, the recess may be formed or positioned in the extension member (3181) and may be replaced with an additional support structure for the tilting position of the substrate (590).

[0100] According to an exemplary embodiment of the present disclosure, the substrate (590) of the antenna module (500) may be positioned to be inclined or slanted with respect to the conductive portion (410), wherein the first substrate surface (5901) may be inclined or slanted in the longitudinal direction with respect to the inner surface (318d) of the conductive portion (410). That is, the first substrate surface (5901) is not parallel to the inner surface (318d) of the conductive portion (410) (e.g., side member (318)). That is, the substrate (590) is positioned such that an acute angle is formed between the plane of the first substrate surface (5901) and the plane of the inner surface (318d) of the conductive portion (410). In one embodiment, the substrate (590) of the antenna module (500) operating as the first antenna (A1) may be spaced apart so that a specific point does not affect the radiation performance of the conductive portion (410) operating as the second antenna (A2). In one embodiment, the substrate (590) of the antenna module (500) may be tilted or inclined with respect to the conductive portion (410), and the further the substrate (590) extends from a specific point, the closer it may be to the conductive portion (410). The substrate (590) of the antenna module (500) may be tilted closer to the conductive portion (410) as it moves further away from a specific point. For example, the specific point may include a point that overlaps with the feed point of the conductive portion (410) (e.g., feed point (P1) in FIG. 5c) when the side member (318) is viewed from the outside. Such tilting arrangement of the substrate (590) may lead to an improvement in the radiation performance of the first antenna (A1) and help maintain the radiation performance of the second antenna (A2).

[0101] FIG. 5a is a configuration diagram showing the rear view of an electronic device according to various embodiments of the present disclosure. FIG. 5b is an enlarged view of the area 5b of FIG. 5a according to various embodiments of the present disclosure. FIG. 5c is a drawing of an electronic device viewed along the direction 5c-5c of FIG. 5b according to various embodiments of the present disclosure.

[0102] FIG. 5a is a plan view of the electronic device (300) seen from the rear direction with the rear cover (e.g., the rear cover (311) of FIG. 3c) removed.

[0103] Referring to FIGS. 5a through 5c, the electronic device (300) may include a front cover (e.g., front cover (302) of FIG. 3c) facing in a first direction (e.g., z-axis direction), a rear cover (e.g., rear cover (311) of FIG. 3c) facing in a second direction opposite to the first direction (e.g., -z-axis direction), and a side member (318) surrounding the space (3101) (e.g., internal space of the electronic device (300)) between the front cover (302) and the rear cover (311). In one embodiment, the electronic device (300) may include an extension member (3181) extending from the side member (318) into the space (3101). In one embodiment, the electronic device (300) may include a display (e.g., the display (301) of FIG. 3c) which is positioned to be supported at least partially by an extension member (3181) in space (3101) and is visible from the outside through at least a portion of the front cover (302). In one embodiment, the side member (318) may include a conductive member (318a) (e.g., metal) and a non-conductive member (318b) (e.g., polymer) combined with the conductive member (318a). In one embodiment, the side member (318) may include a first side (318-1) having a first length along a first direction (e.g., ±y axis direction), a second side (318-2) extending from one end of the first side (318-1) and having a second length shorter than the first length along a second direction (e.g., ±x axis direction) perpendicular to the first direction, a third side (318-3) extending parallel to the second side (318-2) from the other end of the first side (318-1) and having a second length, and a fourth side (318-4) connecting the second side (318-2) and the third side (318-3) and having a first length parallel to the first side (318-1). In one embodiment, the side member (318) may include a conductive portion (410) that is electromagnetically segmented through a non-conductive portion (411) disposed in part of the first side (318-1).

[0104] According to various embodiments, the electronic device (300) may include an antenna module (500) positioned in a space (3101) and positioned to form a directional beam to the outside of the electronic device (300) through at least a portion of a first side (318-1). In one embodiment, the antenna module (500) may operate as a first antenna (A1) configured to transmit and / or receive a wireless signal in at least one first frequency band (e.g., about 3 GHz to 300 GHz) through a first wireless communication circuit (595) positioned on a second substrate surface (5902) of the substrate (590).

[0105] According to various embodiments, the conductive portion (410) may be electrically connected at a feeding point (P1) to a second wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) disposed on the substrate (340). Thus, the conductive portion (410) may operate as a second antenna (A2) configured to transmit and / or receive wireless signals in at least one first frequency band and at least one second frequency band different from (e.g., about 600 MHz to 6000 MHz).

[0106] According to various embodiments, the side member (318) may include a plurality of openings (OP1, OP2, OP3, OP4, OP5) (e.g., an opening array (OPA)) positioned at a location corresponding to a plurality of antenna elements (510, 520, 530, 540, 550) of the antenna module (500) in the conductive portion (410). In one embodiment, the substrate (590) may be positioned such that the first substrate surface (5901) faces the conductive portion (410). In one embodiment, the substrate (590) may be positioned in at least a part of the extension member (3181) and / or the side member (318) such that the first substrate surface (5901) is perpendicular to the front cover (302) and / or the rear cover (311). In one embodiment, the substrate (590) may be positioned such that the first substrate surface (5901) is perpendicular to the surface of the display (301).

[0107] According to various embodiments, the substrate (590) of the antenna module (500) may be positioned such that the first substrate surface (5901) is tilted so as not to be parallel to the conductive portion (410) in the longitudinal direction (e.g., ±y-axis direction) or is inclined in the longitudinal direction (e.g., ±y-axis direction) relative to the conductive portion 410. In one embodiment, when the front cover (302) and / or the rear cover (311) is viewed from above, the substrate (590) and the conductive portion (410) may be positioned so as not to be parallel in the longitudinal direction (e.g., ±y-axis direction). In one embodiment, when the surface of the display (301) is viewed from above, the substrate (590) and the conductive portion (410) may be positioned so as not to be parallel in the longitudinal direction (e.g., ±y-axis direction). In one embodiment, the substrate (590) may be tilted so that the point of the conductive portion (410) located at the shortest distance from the substrate (590) becomes closer to the conductive portion (410) as it moves further away from the feed point (P1). In one embodiment, the feed point (P1) may include a feed point electrically connected to a wireless communication circuit (F) (e.g., the wireless communication module (192) of FIG. 1) disposed on the printed circuit board (340) of the electronic device (300). In one embodiment, the conductive portion (410) may have a ground point (P2) spaced apart from the feed point (P1) electrically connected to the ground (G) of the printed circuit board (340). In one embodiment, the operating frequency band of the second antenna (A2) may be determined according to the location of the ground point (P2). In one embodiment, the substrate (590) may be positioned to have a maximum separation distance from the power supply point (P1) and may be tilted so as to be closer to the conductive portion (410) as it moves from the power supply point (P1) toward the ground point (P2). For example, the substrate (590) may be positioned so that the point of the conductive portion (410) located at the shortest distance from the substrate (590) is closer to the conductive portion (410) as it moves further away from the power supply point (P1).

[0108] In some embodiments, the substrate (590) may be tilted such that the first distance between the feed point (P1) of the conductive portion (410) and the substrate (590) is greater than the second distance between the ground point (P2) of the conductive portion (410) and the substrate (590). In this case, the first distance may be set to be greater than about 2 mm.

[0109] According to various embodiments, the substrate (590) may be tilted so that the maximum proximity distance (d1) between the antenna element (550) closest to the conductive portion (410) among the plurality of antenna elements (510, 520, 530, 540, 550) and the conductive portion (410) is in the range of about 0.05 mm to 0.3 mm. In some embodiments, the substrate (590) may be tilted so that the maximum proximity distance between the ground (e.g., ground layer) of the substrate (590) and the conductive portion (410) is in the range of 0.05 mm to 0.3 mm. In one embodiment, the substrate (590) may be set such that the distance (d2) between the antenna element (510) furthest from the conductive portion (410) among the plurality of antenna elements (510, 520, 530, 540, 550) and the conductive portion (410) is about 2.5 mm or more. This distance (d2) may include a minimum distance that does not affect the radiation performance of the second antenna (A2) by the arrangement of the first antenna (A1). In some embodiments, the substrate (590) may be determined such that the distance between the ground (e.g., ground layer) of the substrate (590) and the conductive portion (410) is located in the range of about 2.5 mm to 2.6 mm.

[0110] Table 1 below shows the cumulative distribution function (CDF) of the first antenna (A1) in sections for an exemplary embodiment of the present disclosure in which the substrate (590) is tilted relative to the conductive portion (410) in the N261 band (e.g., about 28 GHz) (e.g., tilted so that the maximum distance between the substrate (590) and the conductive portion (410) is about 2.5 mm and the minimum distance between the substrate (590) and the conductive portion (410) is about 0.3 mm), and for a comparative example in which the substrate (590) is arranged parallel to the conductive portion (410).

[0111] Referring to below, it can be seen that the first antenna (A1) exhibits relatively superior radiation performance in the N261 band when the substrate (590) is tilted so as to gradually get closer to the conductive portion (410), compared to when the substrate (590) is positioned parallel to the conductive portion (410).

[0112] N261 Simulation Results low(dB) mid(dB) high(dB) CDF 20% 50% Peak 20% 50% Peak 20% 50% Peak Parallel Placement - 1.6 2.9 9 8.1 - 1.3 8 2.9 7 8.65 - 1.3 5 3.1 9.04 Tilting Placement - 1.1 2 3.1 8.4 3 - 1.0 3 3.3 4 8.8 4 - 1.0 6 3.4 8 9.24

[0113] Table 2 below shows the cumulative distribution function (CDF) of the first antenna (A1) in sections for an exemplary embodiment of the present disclosure in which the substrate (590) is tilted relative to the conductive portion (410) in the N260 band (e.g., about 39 GHz) (e.g., tilted so that the maximum distance between the substrate (590) and the conductive portion (410) is about 2.5 mm and the minimum distance between the substrate (590) and the conductive portion (410) is about 0.3 mm), and for a comparative example in which the substrate (590) is arranged parallel to the conductive portion (410).

[0114] Referring to below, it can be seen that the first antenna (A1) exhibits relatively superior radiation performance in the N260 band when the substrate (590) is tilted so that it gradually approaches the conductive portion (410), compared to when the substrate (590) is positioned parallel to the conductive portion (410).

[0115] N260 Simulation Results low(dB) mid(dB) high(dB) CDF 20% 50% Peak 20% 50% Peak 20% 50% Peak Parallel Placement - 2.9 1.8 2 10.6 8 - 3.3 5 2.2 3 10.0 8 - 3.6 8 2.3 7 9.0 2 Tilting Placement - 2.3 9 2.8 4 10.9 5 - 2.6 1 3.1 3 10.9 - 3.1 4 2.6 1 10.3 7

[0116] FIGS. 6a and 6b are graphs comparing the radiation performance of a second antenna with or without tilting of the antenna module when the antenna module of a first antenna according to various embodiments of the present disclosure is in close proximity to a conductive part.

[0117] Referring to FIG. 6a, in a comparative example where the substrate (590) is positioned parallel to the conductive portion (410), it can be seen that the radiation performance of the first antenna (A1) is degraded by the operating frequency band of the first antenna (A1) being unintentionally and gradually low-shifted from the first antenna (A1) to the second antenna (A2) when the substrate (590) is separated from the conductive portion (410) by a specific distance (e.g., graph 601) so as not to affect the radiation performance of the second antenna (A2) operating in a specific frequency band (e.g., about 2.4 GHz), when the substrate (590) is moved by 0.3 mm in the direction of the conductive portion (410) (e.g., graph 602), and when it is moved relatively closer by 0.5 mm (e.g., graph 603).

[0118] Referring to FIG. 6b, in an exemplary embodiment of the present disclosure in which the substrate (590) is tilted relative to the conductive portion (410), so as not to affect the radiation performance of the second antenna (A2) operating in a specific frequency band (e.g., about 2.4 GHz), when the substrate (590) is separated from the conductive portion (410) by a specific distance (e.g., graph 604), when one point of the substrate (590) is tilted so that it is 0.3 mm closer to the conductive portion (410) (e.g., graph 605), and when it is tilted so that it is relatively closer by 0.5 mm (e.g., graph 606), it can be seen that the operating frequency band of the first antenna (A1) operates in the same frequency band.

[0119] This means that when the substrate (590) is tilted so as to gradually approach the conductive portion (410), it can help to achieve excellent radiation performance of the first antenna (A1) without reducing the radiation performance of the second antenna (A2).

[0120] FIGS. 7a and 7b are graphs comparing the radiation performance of a second antenna with or without tilting of the antenna module when the antenna module of a first antenna according to various embodiments of the present disclosure is in close proximity to a conductive part.

[0121] Referring to FIG. 7a, in a comparative example where the substrate (590) is positioned parallel to the conductive portion (410), it can be seen that the radiation performance of the first antenna (A1) deteriorates as the radiation efficiency (e.g., gain) of the first antenna (A1) is gradually reduced when the substrate (590) is moved 0.3 mm in the direction of the conductive portion (410) (e.g., graph 612) and when it is moved relatively closer by 0.5 mm (e.g., graph 613), so that the first antenna (A1) does not affect the radiation performance of the second antenna (A2) operating in a specific frequency band (e.g., about 2.4 GHz), from when the substrate (590) is separated from the conductive portion (410) by a specific separation distance (e.g., graph 611).

[0122] Referring to FIG. 7b, in an exemplary embodiment of the present disclosure in which the substrate (590) is tilted relative to the conductive portion (410), it can be seen that the reduction in the radiation efficiency of the first antenna (A1) is relatively small when the substrate (590) is separated from the conductive portion (410) by a specific distance (e.g., graph 614) so ​​as not to affect the radiation performance of the second antenna (A2) operating in a specific frequency band (e.g., about 2.4 GHz), when the substrate (590) is tilted so that a point of the substrate (590) is 0.3 mm closer to the conductive portion (410) (e.g., graph 615), and when it is tilted relatively closer by 0.5 mm (e.g., graph 616).

[0123] This means that when the substrate (590) is tilted so as to gradually approach the conductive portion (410), it can help to achieve excellent radiation performance of the first antenna (A1) without reducing the radiation performance of the second antenna (A2).

[0124] FIG. 8a is a partial configuration diagram of an electronic device including a tilted antenna module according to various embodiments of the present disclosure. FIG. 8b is a diagram of an electronic device viewed along the direction 8b-8b of FIG. 8a according to various embodiments of the present disclosure.

[0125] In describing the electronic device (300) of FIGS. 8a and 8b, the same reference numerals have been used for components that are substantially identical to those of the electronic device (300) of FIGS. 5b and 5c, and detailed descriptions thereof may be omitted.

[0126] Referring to FIGS. 8a and 8b, the electronic device (300) may include a side member (318) that includes a conductive portion (410) segmented through a non-conductive portion (411) and including a plurality of spaced openings (OP1, OP2, OP3, OP4, OP5). In one embodiment, the electronic device (300) may include an antenna module (500) that includes a substrate (590) disposed in an internal space (3101) and positioned in a tilting manner with respect to the conductive portion (410), and a plurality of antenna elements (510, 520, 530, 540, 550) disposed in the substrate (590) at least partially corresponding to each of the plurality of openings (OP1, OP2, OP3, OP4, OP5). In one embodiment, the antenna module (500) is operated as a first antenna (A1), and the conductive part (410) can be operated as a second antenna (A2).

[0127] According to various embodiments, a plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed to have a relatively smaller size as they move further away from the power supply point (P1). In one embodiment, a plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed to have a relatively smaller opening ratio as they move further away from the power supply point (P1). In one embodiment, a plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed to have a larger size as they move closer to the power supply point (P1). In this case, the thickness of the second partition wall (422) between the second opening (OP2) and the third opening (OP3) may be formed to be thicker than the thickness of the first partition wall (421) between the first opening (OP1) and the second opening (OP2). Likewise, the thickness of the third partition (423) between the third opening (OP3) and the fourth opening (OP4) can be formed to be thicker than the thickness of the second partition (422) between the second opening (OP2) and the third opening (OP3). Likewise, the thickness of the fourth partition (424) between the fourth opening (OP4) and the fifth opening (OP5) can be formed to be thicker than the thickness of the third partition (423) between the third opening (OP3) and the fourth opening (OP4). For example, as the multiple openings (OP1, OP2, OP3, OP4, OP5) are formed with smaller sizes as they move further away from the power supply point (P1), the partitions (421, 422, 423, 424) between the openings (OP1, OP2, OP3, OP4, OP5) have relatively thicker thicknesses as they move further away from the power supply point (P1), thereby helping to reinforce the rigidity of the electronic device (300).

[0128] Table 3 below shows the cumulative distribution function (CDF) of the first antenna (A1) in sections in the N261 band (e.g., about 28 GHz), in the case of a comparative example where the substrate (590) is arranged parallel to the conductive portion (410), in the case where the substrate (590) is tilted with respect to the conductive portion (410) which includes a plurality of openings having the same size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 5c), and in the case where the substrate (590) is tilted with respect to the conductive portion (410) which includes a plurality of openings having different sizes according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 8a).

[0129] Referring to Table 3 below, it can be seen that the first antenna (A1) exhibits relatively superior radiation performance in the N261 band when the substrate (590) is positioned parallel to the conductive portion (410) and when the substrate (590) is tilted toward the conductive portion (410) which includes a plurality of openings of a different size according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings of a different size according to FIG. 8a (OP1, OP2, OP3, OP4, OP5)), compared to when the substrate (590) is tilted toward the conductive portion (410) which includes a plurality of openings of the same size (e.g., a plurality of openings of a plurality of openings of a plurality of openings of a different size according to FIG. 5c).

[0130] This means that the multiple openings (e.g., the multiple openings of FIG. 8a (OP1, OP2, OP3, OP4, OP5)) can help improve the radiation performance of the first antenna (A1) by setting the aperture ratio relatively larger as they get closer to the feed point (P1) of the conductive part (410).

[0131] N261 Simulation Results low(dB) mid(dB) high(dB) CDF 20% 50% Peak 20% 50% Peak 20% 50% Peak Parallel Placement - 1.6 2.9 98.1 - 1.3 8 2.9 78.65 - 1.3 5 3.19.04 Tilting Placement - 1.1 2 3.18.4 3 - 1.0 3 3.3 48.84 - 1.0 6 3.4 89.24 Tilting Placement Opening Change - 0.5 5 3.4 78.48 - 0.7 3 3.4 59.12 - 0.5 9 3.8 79.39

[0132] Table 4 below shows the cumulative distribution function (CDF) of the first antenna (A1) in sections in the N260 band (e.g., about 39 GHz), in the case of a comparative example where the substrate (590) is arranged parallel to the conductive portion (410), in the case where the substrate (590) is tilted with respect to the conductive portion (410) which includes a plurality of openings having the same size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 5c), and in the case where the substrate (590) is tilted with respect to the conductive portion (410) which includes a plurality of openings having different sizes according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 8a).

[0133] Referring to Table 4 below, it can be seen that the first antenna (A1) exhibits relatively superior radiation performance in the N260 band when the substrate (590) is positioned parallel to the conductive portion (410) and when the substrate (590) is tilted toward the conductive portion (410) which includes a plurality of openings of a different size according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings of a different size according to FIG. 8a (OP1, OP2, OP3, OP4, OP5)), compared to when the substrate (590) is tilted toward the conductive portion (410) which includes a plurality of openings of the same size (e.g., a plurality of openings of a plurality of openings of a plurality of openings of a different size according to FIG. 5c).

[0134] This means that the multiple openings (e.g., the multiple openings of FIG. 8a (OP1, OP2, OP3, OP4, OP5)) can help improve the radiation performance of the first antenna (A1) by setting the aperture ratio relatively larger as they get closer to the feed point (P1) of the conductive part (410).

[0135] N260 Simulation Results low(dB) mid(dB) high(dB) CDF 20% 50% Peak 20% 50% Peak 20% 50% Peak Parallel Placement - 2.9 1.8 2 10.6 8 - 3.3 5 2.2 3 10.0 8 - 3.6 8 2.3 7 9.0 2 Tilting Placement - 2.3 9 2.8 4 10.9 5 - 2.6 1 3.1 3 10.9 - 3.1 4 2.6 1 10.3 7 Tilting Placement Opening Change - 1.9 7 2.8 7 10.9 7 - 2.1 1 3.5 8 11.0 1 - 2.5 7 2.7 7 10.5 8

[0136] 9a is a partial configuration diagram of an electronic device including a tilted antenna module according to various embodiments of the present disclosure. FIG. 9b is a diagram of an electronic device viewed along the direction 9b-9b of FIG. 9a according to various embodiments of the present disclosure.

[0137] In describing the electronic device (300) of FIGS. 9a and 9b, the same reference numerals have been assigned to components that are substantially identical to those of the electronic device (300) of FIGS. 8a and 8b, and detailed descriptions thereof may be omitted.

[0138] Referring to FIGS. 9a and 9b, the electronic device (300) may include a side member (318) that includes a conductive portion (410) segmented through a non-conductive portion (411) and including a plurality of spaced openings (OP1, OP2, OP3, OP4, OP5). In one embodiment, the electronic device (300) may include an antenna module (500) that includes a substrate (590) disposed in an internal space (3101) and tilted with respect to the conductive portion (410), and a plurality of antenna elements (510, 520, 530, 540, 550) disposed in the substrate (590) to correspond at least partially to each of the plurality of openings (OP1, OP2, OP3, OP4, OP5). In one embodiment, the antenna module (500) is operated as a first antenna (A1), and the conductive part (410) can be operated as a second antenna (A2).

[0139] According to various embodiments, a plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed to have a relatively smaller size as they move further away from the power supply point (P1). In one embodiment, a plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed to have a relatively smaller opening ratio as they move further away from the power supply point (P1). In one embodiment, a plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed to have a larger size as they move closer to the power supply point (P1). In this case, the partitions (421, 422, 423, 424) between the openings (OP1, OP2, OP3, OP4, OP5) may have a relatively thicker thickness as they move further away from the power supply point (P1), thereby helping to reinforce the rigidity of the electronic device (300).

[0140] According to various embodiments, the inner surface of each of the plurality of openings (OP1, OP2, OP3, OP4, OP5) may be formed as an inclined surface (431, 432, 433, 434, 435, 436, 437, 438, 439, 440) (e.g., inner surface) inclined at an angle corresponding to an imaginary line (L1, L2, L3, L4, L5, L6, L7, L8, L9, L10) extended perpendicularly to the first substrate surface (5901) (e.g., with respect to an imaginary line). For example, the first opening (OP1) may include a first inclined surface (431) and a second inclined surface (432) having angles corresponding to an imaginary first line (L1) and a second line (L2), respectively, extended perpendicularly from a corresponding position of the first substrate surface (5901). In one embodiment, the second opening (OP2) may include a third inclined surface (433) and a fourth inclined surface (434) having angles corresponding to a virtual third line (L3) and a fourth line (L4), respectively, which are extended vertically from a corresponding position of the first substrate surface (5901). In one embodiment, the third opening (OP3) may include a fifth inclined surface (435) and a sixth inclined surface (436) having angles corresponding to a virtual fifth line (L5) and a sixth line (L6), respectively, which are extended vertically from a corresponding position of the first substrate surface (5901). In one embodiment, the fourth opening (OP4) may include a seventh inclined surface (437) and an eighth inclined surface (438) having angles corresponding to a virtual seventh line (L7) and an eighth line (L8), respectively, which are extended vertically from a corresponding position of the first substrate surface (5901). In one embodiment, the fifth opening (OP5) may include a ninth inclined surface (439) and a tenth inclined surface (440) having angles corresponding to a virtual ninth line (L9) and a tenth line (L10) that are vertically extended from a corresponding position of the first substrate surface (5901).

[0141] For example, the inner surfaces of the plurality of openings (OP1, OP2, OP3, OP4, OP5) corresponding to the plurality of antenna elements (510, 520, 530, 540, 550) are formed with inclined surfaces (431, 432, 433, 434, 435, 436, 437, 438, 439, 440) that correspond to virtual lines (L1, L2, L3, L4, L5, L6, L7, L8, L9, L10) perpendicular to the first substrate surface (5901), thereby reducing unnecessary reflection of the beam pattern and helping to improve radiation performance.

[0142] Table 5 below describes a comparative example in which, in the N261 band (e.g., about 28 GHz), the substrate (590) is positioned parallel to the conductive portion (410); when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having the same size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 5c); when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having different sizes (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 8a); and when the substrate (590) has different sizes and inclined surfaces (431–440) corresponding to each of the imaginary lines (L1–L10) perpendicular to the first substrate surface (5901), according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 9a). When tilted with respect to the conductive part (410) including OP2, OP3, OP4, OP5), the cumulative distribution function (CDF) of the first antenna (A1) is shown for each section.

[0143] Referring to below, the first antenna (A1) has a different size than when the substrate (590) is positioned parallel to the conductive portion (410) in the N261 band, when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having the same size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 5c), and when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having a different size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 8a), and has inclined surfaces (431 to 440) corresponding to each of the imaginary lines (L1 to L10) perpendicular to the first substrate surface (5901) according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 9a). When tilted with respect to the conductive portion (410) including OP2, OP3, OP4, OP5), it can be confirmed that relatively excellent radiation performance is exhibited.

[0144] This means that the multiple openings (e.g., the multiple openings of FIG. 9a (OP1, OP2, OP3, OP4, OP5)) have a relatively larger aperture ratio as they get closer to the feed point (P1) of the conductive part (410), and have inclined surfaces (431 to 440) that correspond to each of the virtual lines (L1 to L10) perpendicular to the first substrate surface (5901), thereby helping to improve the radiation performance of the first antenna (A1).

[0145] N261 Simulation Result low(dB) mid(dB) high(dB) CDF 20% 50% Peak 20% 50% Peak 20% 50% Peak Parallel Placement - 1.6 2.9 98.1 - 1.3 8 2.9 78.65 - 1.3 5 3.19.04 Tilting Placement - 1.1 2 3.18.43 - 1.0 3 3.3 48.84 - 1.0 6 3.4 89.24 Tilting Placement Opening Change - 0.5 5 3.4 78.48 - 0.7 3 3.4 59.12 - 0.5 9 3.8 79.39 Tilting Placement Opening Change Inclined Surface Formation - 0.5 1 3.8 18.5 7 0.1 1 3.7 99.2 5 0.6 7 3.8 99.45

[0146] Table 6 below describes a comparative example in which, in the N260 band (e.g., about 39 GHz), the substrate (590) is positioned parallel to the conductive portion (410); when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having the same size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 5c); when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having different sizes (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 8a); and when the substrate (590) has different sizes and inclined surfaces (431–440) corresponding to each of the imaginary lines (L1–L10) perpendicular to the first substrate surface (5901), according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 9a). When tilted with respect to the conductive part (410) including OP2, OP3, OP4, OP5), the cumulative distribution function (CDF) of the first antenna (A1) is shown for each section.

[0147] Referring to below, the first antenna (A1) has a different size than when the substrate (590) is positioned parallel to the conductive portion (410) in the N261 band, when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having the same size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 5c), and when the substrate (590) is tilted relative to the conductive portion (410) which includes a plurality of openings having a different size (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 8a), and has inclined surfaces (431 to 440) corresponding to each of the imaginary lines (L1 to L10) perpendicular to the first substrate surface (5901) according to an exemplary embodiment of the present disclosure (e.g., a plurality of openings (OP1, OP2, OP3, OP4, OP5) of FIG. 9a). When tilted with respect to the conductive portion (410) including OP2, OP3, OP4, OP5), it can be confirmed that relatively excellent radiation performance is exhibited.

[0148] This means that the multiple openings (e.g., the multiple openings of FIG. 9a (OP1, OP2, OP3, OP4, OP5)) have a relatively larger aperture ratio as they get closer to the feed point (P1) of the conductive part (410), and have inclined surfaces (431 to 440) that correspond to each of the virtual lines (L1 to L10) perpendicular to the first substrate surface (5901), thereby helping to improve the radiation performance of the first antenna (A1).

[0149] N260 Simulation Result low(dB) mid(dB) high(dB) CDF 20% 50% Peak 20% 50% Peak 20% 50% Peak Parallel Placement - 2.9 1.8 2 10.6 8 - 3.3 5 2.2 3 10.0 8 - 3.6 8 2.3 7 9.0 2 Tilting Placement - 2.3 9 2.8 4 10.9 5 - 2.6 1 3.1 3 10.9 - 3.1 4 2.6 1 10.3 7 Tilting Placement Opening Change - 1.9 7 2.8 7 10.9 7 - 2.1 1 3.5 8 11.0 1 - 2.5 7 2.7 10.5 8 Tilting Placement Opening Change Inclined Surface Formation 0.3 3 3.0 8 11.5 4 - 0.3 1 3.9 8 12.7 0.3 1 3.2 4 10.9

[0150] FIGS. 10a to 10c are drawings illustrating the arrangement structure of a first antenna and a second antenna according to various embodiments of the present disclosure.

[0151] In describing the electronic device (300) of FIGS. 10a to 10c, the same reference numerals have been assigned to components that are substantially identical to those of the electronic device (300) of FIG. 5c, and a detailed description thereof may be omitted.

[0152] Referring to FIGS. 10a through 10c, the electronic device (300) may include a side member (318) comprising a conductive portion (410) comprising at least one opening (OP-1, OPA-1, OPA-2). In one embodiment, the electronic device (300) may include an antenna module (500) comprising a substrate (590) disposed in an internal space (3101) and positioned in a tilting manner relative to the conductive portion (410), and a plurality of antenna elements (510, 520, 530, 540, 550) disposed in the substrate (590) at least partially corresponding to at least one opening (OP-1, OPA-1, OPA-2). In one embodiment, the antenna module (500) may operate as a first antenna (A1), and the conductive portion (410) may operate as a second antenna (A2).

[0153] Referring to FIG. 10a, when the side member (318) is viewed from the outside (e.g., when the side member (318) is viewed from the outside in a vertical direction), at least one opening (OP-1) may be positioned to overlap with a plurality of antenna elements (510, 520, 530, 540, 550). According to one embodiment, at least one opening (OP-1) may include one opening (OP-1) positioned to overlap with all of the plurality of antenna elements (510, 520, 530, 540, 550).

[0154] Referring to FIG. 10b, when the side member (318) is viewed from the outside (e.g., when the side member (318) is viewed from the outside in a vertical direction), at least one opening (OPA-1) may be positioned to overlap with a plurality of antenna elements (510, 520, 530, 540, 550). According to one embodiment, at least one opening (OPA-1) may include a first opening (OP-2) positioned to overlap with the first antenna element (510) and the second antenna element (520) among the plurality of antenna elements (510, 520, 530, 540, 550), and a second opening (OP-2) positioned to overlap with the third antenna element (530), the fourth antenna element (540), and the fifth antenna element (550).

[0155] Referring to FIG. 10c, when the side member (318) is viewed from the outside (e.g., when the side member (318) is viewed from the outside in a vertical direction), at least one opening (OPA-2) may be positioned to overlap with a plurality of antenna elements (510, 520, 530, 540, 550). According to one embodiment, at least one opening (OPA-2) may include a first opening (OP-4) and a second opening (OP-5) overlapped with the first antenna element (510) among a plurality of antenna elements (510, 520, 530, 540, 550), a third opening (OP-6) and a fourth opening (OP-7) overlapped with the second antenna element (520), a fifth opening (OP-8) and a sixth opening (OP-9) overlapped with the third antenna element (530), a seventh opening (OP-10) and an eighth opening (OP-11) overlapped with the fourth antenna element (540), and a ninth opening (OP-12) and a tenth opening (OP-13) overlapped with the fifth antenna element (550).

[0156] According to various embodiments, the electronic device comprises a housing (e.g., housing (310) of FIG. 3a) comprising a conductive portion (e.g., conductive portion (410) of FIG. 4) that forms at least a portion of a side (e.g., first side (318-1) of FIG. 3c) and includes at least one opening (e.g., openings (OPA) of FIG. 4), a substrate (e.g., substrate (590) of FIG. 4) disposed in the housing and including a first substrate surface (e.g., first substrate surface (5901) of FIG. 4), and a plurality of antenna elements (e.g., antenna elements (510, 520, 530, 540, 550) of FIG. 4) disposed on the substrate to form a beam pattern in a direction toward which the first substrate surface faces, wherein the substrate comprises an antenna module in which the first substrate surface faces the conductive portion so as to extend a portion of the beam pattern formed by the plurality of antenna elements in a direction toward which the at least one opening passes, and A first wireless communication circuit (e.g., wireless communication circuit (595) of FIG. 4) configured to transmit and / or receive a wireless signal in at least one first frequency band through an antenna module, and a second wireless communication circuit electrically connected to a feed point of the conductive part and configured to transmit and / or receive a wireless signal in at least one second frequency band through the conductive part, wherein the substrate may be tilted so as not to be parallel with the inner surface of the conductive part (e.g., inner surface (318d) of FIG. 4).

[0157] According to various embodiments, the substrate may be tilted such that the first distance between the feed point of the conductive portion and the substrate is greater than the second distance between the ground point (P2) of the conductive portion and the substrate.

[0158] According to various embodiments, the first distance may be set to be greater than 2 mm.

[0159] According to various embodiments, the maximum proximity distance between the antenna element closest to the conductive part among the plurality of antenna elements and the conductive part (e.g., distance (d1) in FIG. 5b) can be determined in the range of 0.05 mm to 0.3 mm.

[0160] According to various embodiments, the distance between the antenna element furthest from the conductive part among the plurality of antenna elements and the conductive part (e.g., distance (d2) in FIG. 5b) may be 2.5 mm or more.

[0161] According to various embodiments, the housing comprises a front cover (e.g., front cover (302) of FIG. 3c), a rear cover facing away from the front cover (e.g., rear cover (311) of FIG. 3c), and a side member disposed between the front cover and the rear cover (e.g., side member (318) of FIG. 3c), and the conductive portion may be included in at least a portion of the side member.

[0162] According to various embodiments, the substrate may be positioned such that the first substrate surface is positioned perpendicular to the front cover and / or the rear cover.

[0163] According to various embodiments, the side member includes an extension member (e.g., the extension member (3181) of FIG. 3c) extending into the interior of the housing, and the extension member includes a recess for receiving at least a portion of the substrate, and the substrate can be tilted by the recess.

[0164] According to various embodiments, the at least one opening may include a first opening and a second opening arranged to partially overlap with the plurality of antenna elements when viewed in a direction perpendicular to the side.

[0165] According to various embodiments, the first opening (e.g., the first opening (OP1) of FIG. 8a) and the second opening (e.g., the fifth opening (OP5) of FIG. 8a) may have different opening sizes such that the first opening closest to the power supply point is larger than the second opening furthest from the power supply point.

[0166] According to various embodiments, each of the plurality of openings (e.g., the openings of FIG. 9a (OP1, OP2, OP3, OP4, OP5)) may include an inner surface (e.g., the inclined surfaces of FIG. 9a (431 to 440)) inclined at an angle with respect to a virtual line extending perpendicularly to the first substrate surface.

[0167] According to various embodiments, the at least one opening may include one opening (e.g., the opening (OP-1) of FIG. 10a) arranged so that the plurality of antenna elements overlap when the side is viewed from the outside.

[0168] According to various embodiments, the at least one opening may be arranged so that when the side is viewed from the outside, at least two of the plurality of antenna elements overlap with one opening (e.g., the openings of FIG. 10b (OPA-1)).

[0169] According to various embodiments, the at least one opening may include a plurality of openings spaced apart to overlap with one of the antenna elements when the side is viewed from the outside (e.g., the openings of FIG. 10c (OPA-2)).

[0170] According to various embodiments, the at least one opening may be filled with a non-conductive member (e.g., the non-conductive member (318b) of FIG. 4).

[0171] According to various embodiments, the housing includes a conductive side member, the conductive part is electrically segmented through at least one non-conductive part (e.g., non-conductive part (411) of FIG. 4), and the at least one non-conductive part may be formed through an extension of the non-conductive member.

[0172] According to various embodiments, the substrate includes a second substrate surface facing in the opposite direction to the first substrate surface (e.g., the second substrate surface (5902) of FIG. 4), and the first wireless communication circuit may be disposed on the second substrate surface.

[0173] According to various embodiments, the at least one antenna element may include a plurality of spaced-apart conductive patches exposed inside the substrate or on the first substrate surface.

[0174] According to various embodiments, the housing includes a printed circuit board (e.g., the printed circuit board (340) of FIG. 5a) disposed in the internal space of the housing, and the second wireless communication circuit may be disposed on the printed circuit board.

[0175] According to various embodiments, the conductive portion may be electrically connected to the ground of the printed circuit board (e.g., ground (G) in FIG. 5b) through a ground point spaced apart from the power supply point (e.g., ground point (P2) in FIG. 5b).

[0176] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

In electronic devices, A housing (310) comprising a conductive portion (410) that forms at least a portion of the side (318-1) and includes at least one opening (OPA); As an antenna module (500) placed in the above housing, A substrate (590) including a first substrate surface (5901); and The above substrate includes a plurality of antenna elements (510, 520, 530, 540, 550) arranged to form a beam pattern in the direction in which the first substrate surface faces, and The above substrate is an antenna module in which the first substrate surface is positioned toward the conductive portion so that a portion of the beam pattern formed by the plurality of antenna elements extends in a direction passing through the at least one opening; A first wireless communication circuit (595) configured to transmit and / or receive a wireless signal in at least one first frequency band through the antenna module above; and It includes a second wireless communication circuit electrically connected to a power supply point of the conductive part and configured to transmit and / or receive a wireless signal in at least one second frequency band through the conductive part, The above substrate is an electronic device tilted with respect to the inner surface of the conductive portion such that the first substrate surface (5901) and the inner surface (318d) of the conductive portion are not parallel to each other. In paragraph 1, The above substrate is an electronic device tilted such that the first distance between the feed point of the conductive portion and the substrate is greater than the second distance between the ground point (P2) of the conductive portion and the substrate. In paragraph 2, The above first distance is an electronic device larger than 2mm. In paragraph 1, An electronic device in which the maximum proximity distance (d1) between the antenna element closest to the conductive part among the plurality of antenna elements and the conductive part is in the range of 0.05 mm to 0.3 mm. In paragraph 1, An electronic device in which the distance (d2) between the antenna element furthest from the conductive part among the plurality of antenna elements and the conductive part is 2.5 mm or more. In paragraph 1, The above housing is, Front cover (302); A rear cover (311) facing in the opposite direction to the front cover; and It includes a side member (318) between the front cover and the rear cover, and The above conductive portion is an electronic device included in at least a part of the above side member. In paragraph 6, The above substrate is an electronic device in which the first substrate surface is positioned perpendicularly to at least one of the front cover or the rear cover. In paragraph 6, The above-mentioned side member includes an extension member extending into the interior of the housing, and The extension member includes a recess for accommodating at least a portion of the substrate, and The above substrate is an electronic device tilted by the above recess. In paragraph 1, An electronic device comprising at least one opening, which, when viewed in a direction perpendicular to the side, has a first opening and a second opening that partially overlap with the plurality of antenna elements. In Paragraph 9, An electronic device in which the first opening (OP1) is closest to the power supply point and has a first size, and the second opening (OP5) is farthest from the power supply point and has a second size smaller than the first size. In Paragraph 9, An electronic device in which each of the first opening (OP1) and the second opening (OP2) includes an inner surface inclined at an angle to a virtual line extending perpendicularly to the first substrate surface. In paragraph 1, The electronic device, wherein at least one opening comprises one opening (OP-1) in which the plurality of antenna elements overlap when the side is viewed from the outside. In paragraph 1, The electronic device comprising at least one opening, wherein the opening (OPA-1) overlaps with at least two of the plurality of antenna elements when the side is viewed from the outside. In paragraph 1, The electronic device comprising at least one opening, which is spaced apart from each other and overlaps with one of the antenna elements when the side is viewed from the outside, and a plurality of openings (OPA-2). In paragraph 1, The above housing is an electronic device comprising a non-conductive member (318b) that fills the at least one opening.

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