MEMS sensor module

Abstract

The MEMS sensor module of the present utility model comprises a side wall enclosing a cavity, a first circuit board, a second circuit board, a partition wall dividing the cavity into two cavity bodies, MEMS sensor assemblies respectively arranged in the two cavity bodies, and two gold finger layers that each surround the two cavity bodies and are between the side wall, the partition wall and the two circuit boards. A gold finger layer at the partition wall is provided with a slot opening connecting the two cavity bodies; an MEMS sensor assembly in one cavity body comprises an ASIC chip fixed to the second circuit board and an MEMS chip stacked and fixed on the ASIC chip, and an MEMS sensor assembly in the other cavity body comprises an ASIC chip fixed to the first circuit board and an MEMS chip fixed to the second circuit board; the side wall is provided with a conductor connecting the two circuit boards; and bonding gold wires are respectively connected between the two MEMS chips and the second circuit board. The MEMS sensor module of the present utility model can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.

Description

MEMS sensor module Technical Field

[0001] This utility model relates to the field of sensors, and in particular to a MEMS sensor module. Background Technology

[0002] The MEMS sensor module of the related technology will have multiple MEMS sensor components built in to realize at least one sensor function, such as pressure sensor, microphone sensor, gas sensor, etc.

[0003] MEMS sensor components include MEMS chips and ASIC chips. However, some MEMS sensor components' ASIC chips generate a lot of heat when they are working. This heat is spread through the thermal movement of air within the circuit board or module, which affects temperature-sensitive MEMS sensor components, causing their performance to degrade and making them unable to work properly. Technical issues

[0004] Therefore, it is necessary to provide a new MEMS sensor module to solve the above-mentioned technical problems. Technical solutions

[0005] The purpose of this invention is to overcome the above-mentioned technical problems and provide a MEMS sensor module that can prevent the large amount of heat generated by the ASIC chip of one MEMS sensor component from affecting the other MEMS sensor component.

[0006] To achieve the above objectives, this utility model provides a MEMS sensor module, including a sidewall forming a cavity, a first circuit board disposed at the top of the sidewall, and a second circuit board disposed at the bottom of the sidewall. The MEMS sensor module further includes a partition wall disposed within the cavity and connected to the sidewall, the partition wall dividing the cavity into a first cavity and a second cavity. A first MEMS sensor assembly is disposed in the first cavity, and a second MEMS sensor assembly is disposed in the second cavity. A first gold finger layer is disposed between the sidewall and the partition wall and the first circuit board, the first gold finger layer surrounding the first cavity and the second cavity respectively. A second gold finger layer is disposed between the sidewall and the partition wall and the second circuit board, the second gold finger layer surrounding... The first cavity and the second cavity, the first gold finger layer and / or the second gold finger layer at the partition wall are provided with slots communicating with the first cavity and the second cavity, the first MEMS sensor assembly includes a first ASIC chip fixed to the second circuit board and a first MEMS chip stacked and fixed to the first ASIC chip, the first MEMS chip and the second circuit board are connected by a first bonding gold wire, the second MEMS sensor assembly includes a second ASIC chip fixed to the first circuit board and a second MEMS chip fixed to the second circuit board, the side wall is provided with a conductor connecting the first circuit board and the second circuit board, and the second MEMS chip and the second circuit board are connected by a second bonding gold wire.

[0007] Preferably, the total area of ​​the slot is less than 6400 μm. 2 .

[0008] Preferably, the first bonding gold wire is disposed at a location other than the location between the first MEMS chip and the partition wall, and the second bonding gold wire is disposed at a location other than the location between the second MEMS chip and the partition wall.

[0009] Preferably, the partition wall has through holes connecting the first cavity and the second cavity, and the total area of ​​the through holes is less than 6400 μm. 2 .

[0010] Preferably, the inner surface of the sidewalls that form the cavity is a metallized surface.

[0011] Preferably, both the first circuit board and the second circuit board are embedded with capacitors and resistors to eliminate high-frequency signal interference.

[0012] Preferably, the second circuit board has a through-hole corresponding to the position of the second MEMS chip, and the through-hole connects the second MEMS chip to the outside. Beneficial effects

[0013] In the MEMS sensor module of this invention, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the areas of the first cavity and the second cavity. In addition, the first ASIC chip is fixed to the second circuit board, and the second ASIC chip is fixed to the first circuit board, thereby increasing the spatial distance between the first ASIC chip and the second ASIC chip. This arrangement can avoid the large heat generated by the ASIC chip of one MEMS sensor component during operation from affecting the other MEMS sensor component. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 is a perspective view of the MEMS sensor module of this utility model;

[0016] Figure 2 is an exploded perspective view of the MEMS sensor module of this utility model;

[0017] Figure 3 is an exploded perspective view of the MEMS sensor module of this utility model from another angle;

[0018] Figure 4 is a cross-sectional view of the MEMS sensor module of this utility model. The best embodiment of the present invention

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0020] Please refer to Figures 1-4, which illustrate the MEMS sensor module 100 provided by this invention. The MEMS sensor module 100 includes a sidewall 1 forming a cavity 10, a first circuit board 2 disposed at the top of the sidewall 1, a second circuit board 3 disposed at the bottom of the sidewall 1, a partition wall 4 disposed within the cavity 10 and connected to the sidewall 1, and a first MEMS sensor assembly 5 and a second MEMS sensor assembly 6 disposed within the cavity 10. The first MEMS sensor assembly 5 and the second MEMS sensor assembly 6 can realize at least one sensor function such as a pressure sensor, a microphone sensor, and a gas sensor.

[0021] The partition wall 4 divides the cavity 10 into a first cavity 11 and a second cavity 12. The first cavity 11 houses the first MEMS sensor assembly 5, and the second cavity 12 houses the second MEMS sensor assembly 6. A first gold finger layer 7 is provided between the side wall 1 and the partition wall 4 and the first circuit board 2, surrounding the first cavity 11 and the second cavity 12 respectively. A second gold finger layer 8 is provided between the side wall 1 and the partition wall 4 and the second circuit board 3, surrounding the first cavity 11 and the second cavity 12 respectively. The first gold finger layer 7 and the second gold finger layer 8 divide the areas of the first cavity 11 and the second cavity 12, and the first MEMS sensor assembly 5 and the second MEMS sensor assembly 6 each have their respective areas.

[0022] Alternatively, the first gold finger layer 7 may include a first portion 71 of the first gold finger layer disposed on the sidewall 1 and the partition wall 4, and a second portion 72 of the first gold finger layer disposed on the first circuit board 2. The projections of the first portion 71 and the second portion 72 of the first gold finger layer coincide, and the first portion 71 and the second portion 72 of the first gold finger layer are combined to form the first gold finger layer 7. Of course, the first gold finger layer 7 can also be formed in other feasible ways, and is not limited to including the combination of the two portions.

[0023] Similarly, the second gold finger layer 8 may include a first portion 81 of the second gold finger layer disposed on the sidewall 1 and the partition wall 4, and a second portion 82 of the second gold finger layer disposed on the second circuit board 3. The projections of the first portion 81 and the second portion 82 of the second gold finger layer coincide, and the first portion 81 and the second portion 82 of the second gold finger layer are combined to form the second gold finger layer 8. Of course, the second gold finger layer 8 can also be formed in other feasible ways, and is not limited to including the combination of the two portions.

[0024] In this embodiment, the first gold finger layer 7 at the partition wall 4 is provided with a slot 70 connecting the first cavity 11 and the second cavity 12. The slot 70 can meet the ventilation requirements of the MEMS sensor module 100, reducing the air vent requirements of the sidewall 1, the first circuit board 2, and the second circuit board 3 of the MEMS sensor module 100, facilitating the design of back-end applications and saving costs for back-end applications. It is understood that the slot 70 can be provided in the first part 71 and / or the second part 72 of the first gold finger layer.

[0025] Of course, in other embodiments, the second gold finger layer 8 at the partition wall 4 may also be provided with a slot 70 connecting the first cavity 11 and the second cavity 12. Similarly, the slot 70 may be provided in the first part 81 and / or the second part 82 of the second gold finger layer. In other embodiments, both the first gold finger layer 7 and the second gold finger layer 8 at the partition wall 4 may be provided with a slot 70 connecting the first cavity 11 and the second cavity 12. In different embodiments of the slot 70, the total area of ​​the slot 70 is preferably less than 6400 μm. 2 .

[0026] Furthermore, the partition wall 4 may optionally have a through hole connecting the first cavity 11 and the second cavity 12, and the total area of ​​the through hole is preferably less than 6400 μm. 2 .

[0027] The first MEMS sensor assembly 5 includes a first ASIC chip 51 fixed to the second circuit board 3 and a first MEMS chip 52 stacked and fixed to the first ASIC chip 51. A first bonding gold wire 53 connects the first MEMS chip 52 and the second circuit board 3. The first ASIC chip 51 is preferably mounted to the second circuit board 3 by surface mount technology and achieves electrical conduction with the second circuit board 3.

[0028] The second MEMS sensor assembly 6 includes a second ASIC chip 61 fixed to the first circuit board 2 and a second MEMS chip 62 fixed to the second circuit board 3. The second ASIC chip 61 is preferably mounted to the first circuit board 2 by surface mount technology and is electrically connected to the first circuit board 2. The sidewall 1 is provided with a conductor 9 connecting the first circuit board 2 and the second circuit board 3 to electrically connect the second ASIC chip 61 to the second circuit board 3. A second bonding gold wire 63 connects the second MEMS chip 62 and the second circuit board 3.

[0029] The first ASIC chip 51 is fixed to the second circuit board 3, and the second ASIC chip 61 is fixed to the first circuit board 2, thereby increasing the spatial distance between the first ASIC chip 51 and the second ASIC chip 61 to reduce mutual interference.

[0030] In this embodiment, the second circuit board 3 has a through-hole 31 corresponding to the position of the second MEMS chip 62, and the through-hole 31 connects the second MEMS chip 62 to the outside. Alternatively, the through-hole 31 can be a sound inlet, and the second MEMS chip 62 can be a MEMS microphone chip.

[0031] The first bonding gold wire 53 is disposed at a location other than the position between the first MEMS chip 52 and the partition wall 4, and the second bonding gold wire 63 is disposed at a location other than the position between the second MEMS chip 62 and the partition wall 4, thereby increasing the spatial distance between the first bonding gold wire 53 and the second bonding gold wire 63 to reduce mutual interference between them.

[0032] Alternatively, the inner surface of the sidewall 1 that forms the cavity 10 is metallized to satisfy the ability of the MEMS sensor module 100 to resist radio frequency interference.

[0033] Alternatively, the first circuit board 2 and the second circuit board 3 may be embedded with capacitors and resistors to eliminate high-frequency signal interference.

[0034] In the MEMS sensor module of this invention, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the areas of the first cavity and the second cavity. In addition, the first ASIC chip is fixed to the second circuit board, and the second ASIC chip is fixed to the first circuit board, thereby increasing the spatial distance between the first ASIC chip and the second ASIC chip. This arrangement can avoid the large heat generated by the ASIC chip of one MEMS sensor component during operation from affecting the other MEMS sensor component.

[0035] The above description is merely an embodiment of this utility model. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this utility model, but these improvements all fall within the protection scope of this utility model.

Claims

1. A MEMS sensor module, comprising a sidewall forming a cavity, a first circuit board disposed on the top of the sidewall, and a second circuit board disposed on the bottom of the sidewall, characterized in that, The MEMS sensor module further includes a partition wall disposed within the cavity and connected to the sidewall, the partition wall dividing the cavity into a first cavity and a second cavity. A first MEMS sensor assembly is disposed in the first cavity, and a second MEMS sensor assembly is disposed in the second cavity. A first gold finger layer is disposed between the sidewall and the partition wall and the first circuit board, the first gold finger layer surrounding the first cavity and the second cavity respectively. A second gold finger layer is disposed between the sidewall and the partition wall and the second circuit board, the second gold finger layer surrounding the first cavity and the second cavity respectively. The first gold finger layer at the partition wall and / or the second gold finger layer at the partition wall are provided with slots communicating with the first cavity and the second cavity. The first MEMS sensor assembly includes a first ASIC chip fixed to the second circuit board and a first MEMS chip stacked and fixed to the first ASIC chip. A first bonding gold wire connects the first MEMS chip and the second circuit board. The second MEMS sensor assembly includes a second ASIC chip fixed to the first circuit board and a second MEMS chip fixed to the second circuit board. A conductor is provided on the sidewall connecting the first circuit board and the second circuit board. A second bonding gold wire connects the second MEMS chip and the second circuit board.

2. The MEMS sensor module according to claim 1, characterized in that, The total area of ​​the slot is less than 6400 μm. 2 .

3. The MEMS sensor module according to claim 1, characterized in that, The first bonding gold wire is disposed at a location other than the location between the first MEMS chip and the partition wall, and the second bonding gold wire is disposed at a location other than the location between the second MEMS chip and the partition wall.

4. The MEMS sensor module according to claim 1, characterized in that, The partition wall has through holes connecting the first cavity and the second cavity, and the total area of ​​the through holes is less than 6400 μm. 2 .

5. The MEMS sensor module according to claim 1, characterized in that, The inner surface of the sidewalls that form the cavity is a metallized surface.

6. The MEMS sensor module according to claim 1, characterized in that, Both the first circuit board and the second circuit board have embedded capacitors and resistors to eliminate high-frequency signal interference.

7. The MEMS sensor module according to claim 1, characterized in that, The second circuit board has a through-hole corresponding to the position of the second MEMS chip, and the through-hole connects the second MEMS chip to the outside.

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