Temperature acquisition structure, integrated busbar and battery pack

Abstract

Provided in the present application are a temperature acquisition structure, an integrated busbar and a battery pack. The temperature acquisition structure comprises: a bracket and a fixing seat, wherein the bracket is fixed to a battery cell, and the fixing seat is disposed on the bracket and is provided with a fixing slot; a temperature sensing component mounted in the fixing slot; and a fixing member fixedly connected to the fixing seat. At least a portion of the fixing member covers the temperature sensing component, thereby improving the installation stability of a temperature acquisition component.

Description

Temperature acquisition structure, integrated busbar and battery pack

[0001] This application claims priority to Chinese patent applications filed on November 4, 2024, with application number 202422687623.2, and on October 14, 2024, with application number 202422488415.X, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of battery technology, specifically to a temperature acquisition structure, an integrated busbar, and a battery pack. Background Technology

[0003] To facilitate temperature monitoring of the battery cells, temperature acquisition devices are often installed. In related technologies, these devices are typically attached to the corresponding battery cell location and electrically connected to the circuit board. Invention Overview

[0004] In related technologies, the temperature sensing element is attached to the corresponding battery cell and electrically connected to the circuit board. However, this adhesive connection only limits and fixes one side of the temperature sensing element, resulting in weak constraint and poor installation stability. Consequently, if the connecting harness is pulled or the battery cell expands and shifts, the thermally conductive adhesive on the temperature sensing element will detach, leading to temperature sensing failure.

[0005] Firstly, this application provides a temperature acquisition structure, including:

[0006] The bracket is used to fix the battery cell.

[0007] A mounting base is provided on a bracket, and the mounting base has a mounting groove.

[0008] The temperature sensing element is installed in the fixed slot;

[0009] A fastener is fixedly connected to a mounting base, and at least a portion of the fastener covers the temperature sensing element.

[0010] Secondly, this application provides an integrated busbar, comprising: a temperature acquisition structure, including the aforementioned temperature acquisition structure; a busbar structure, disposed on a support and connected to the electrodes of multiple battery cells; a circuit board, disposed on the support, the circuit board being plate-shaped and connected to the busbar structure; wherein the temperature acquisition structure is disposed on the circuit board and used to detect the temperature of the busbar structure and transmit the detection result to the circuit board; a sealing colloid, disposed between the temperature acquisition structure and the circuit board to seal the gap between the circuit board and the temperature acquisition structure; wherein at least a portion of the sealing colloid is made of a thermally conductive material, and the projection of the temperature acquisition structure onto the sealing colloid is located within the outer periphery of the sealing colloid.

[0011] Thirdly, this application provides a battery pack, including the temperature acquisition structure described above, or including multiple stacked cells and the integrated busbar described above. Beneficial effects

[0012] (1) The temperature acquisition structure provided in this application sets a fixed base and a fixing component, and the fixing component is fixedly connected to the fixed base and covers the temperature detection component. This makes it easy to effectively limit the position of the temperature detection component located in the fixing groove, so as to avoid the temperature detection component from falling out of the fixing groove. This avoids the temperature detection component from being easily affected by external forces and causing positional displacement or even separation from the battery cell, ensuring the installation stability of the temperature detection component. In turn, it makes it easy to ensure that the temperature acquisition component can stably acquire the temperature of the battery cell, and ensure the accuracy of temperature acquisition.

[0013] (2) The integrated busbar provided in this application, in a first aspect, includes the aforementioned temperature acquisition structure, thus the integrated busbar has the beneficial effects of the aforementioned temperature acquisition structure; in a second aspect, the busbar's busbar structure is mounted on a support and connected to the electrodes of multiple battery cells. A circuit board is mounted on the support, the circuit board is plate-shaped and connected to the busbar structure. The temperature acquisition structure is mounted on the circuit board and is used to detect the temperature of the busbar structure and transmit the detection result to the circuit board. A sealing colloid is disposed between the temperature acquisition structure and the circuit board to seal the gap between the circuit board and the temperature acquisition structure. At least a portion of the sealing colloid is made of a thermally conductive material, and the projection of the temperature acquisition structure onto the sealing colloid is located within the outer periphery of the sealing colloid. Thus, the above arrangement enables the integrated busbar to connect to multiple battery cells through the busbar structure, and the temperature acquisition structure mounted on the circuit board enables the acquisition of battery cell temperatures, improving the convenience and accuracy of temperature acquisition, realizing the detection of battery cell temperatures, ensuring the operational reliability and safety performance of the battery cells, and thereby solving the problem of low safety in existing power batteries. Meanwhile, the aforementioned sealing colloid not only achieves the connection between the temperature acquisition structure and the circuit board, ensuring the reliability of the temperature information collected by the temperature acquisition structure, but also eliminates the need for a separate temperature acquisition structure on the integrated busbar, reducing the space occupied by the temperature acquisition structure and improving the space utilization of the battery cell; on the other hand, it allows the staff to simply apply the sealing colloid to achieve the connection between the temperature acquisition structure and the circuit board, making the overall operation very simple and quick, which not only improves the work efficiency of the staff, but also enhances the overall appearance of the battery pack.

[0014] (3) The battery pack provided in this application includes the temperature acquisition structure described above, and thus the battery pack has the beneficial effects of the temperature acquisition structure described above, or the battery pack includes the integrated busbar described above, and thus the battery pack has the beneficial effects of the integrated busbar described above, which will not be elaborated here. Attached Figure Description

[0015] Figure 1 shows a schematic diagram of the temperature acquisition structure provided according to the first embodiment of this application;

[0016] Figure 2 shows an enlarged schematic diagram of a partial structure in Figure 1;

[0017] Figure 3 shows a schematic diagram of the structure of the output bus provided according to the first embodiment of this application;

[0018] Figure 4 shows a schematic diagram of the structure of the bracket provided according to the first embodiment of this application;

[0019] Figure 5 shows a structural schematic diagram of the fixing base provided according to the first embodiment of this application;

[0020] Figure 6 shows a schematic diagram of the overall structure of the integrated busbar according to the second embodiment of this application;

[0021] Figure 7 shows a partial structural schematic diagram of Figure 6;

[0022] Figure 8 shows an enlarged schematic diagram of point A in Figure 6;

[0023] Figure 9 shows an enlarged schematic diagram of point B in Figure 6;

[0024] Figure 10 shows an enlarged view of point C in Figure 6.

[0025] Figure label:

[0026] 10. Bracket; 11. Positioning groove; 111. First groove segment; 112. Middle groove segment; 113. Second groove segment;

[0027] 50. Circuit board; 55. Body part; 59. First connecting part; 54. Second connecting part;

[0028] 30. Fixing base; 31. Fixing groove; 32. First fixing section; 321. First connecting body; 322. First connecting protrusion; 33. Intermediate connecting section; 331. Hollowed-out part; 34. Second fixing section; 341. Second connecting body; 342. Second connecting protrusion;

[0029] 40. Fasteners;

[0030] 41. First rivet post; 42. Second rivet post;

[0031] 23. First connecting busbar; 24. Second connecting busbar; 25. Output busbar; 251. Busbar body; 252. Separation gap; 253. Output section;

[0032] 80. Voltage acquisition device.

[0033] 10. Bracket; 12. Connecting hole;

[0034] 20. Busbar structure; 21. First busbar component; 211. First connecting section; 212. Second connecting section; 22. Second busbar component;

[0035] 51. Buffer section; 52. Buffer hole; 521. First hole section; 522. Second hole section; 531. First buffer group; 532. Second buffer group;

[0036] 55. Main body plate; 56. Clearance hole; 57. Connecting part; 58. Bending part;

[0037] 80. Voltage acquisition device;

[0038] 90. Temperature acquisition structure;

[0039] 60. Strengthen the structure;

[0040] 70. Connector. Embodiments of the present invention

[0041] Example 1

[0042] As shown in Figures 1 to 5, Embodiment 1 of this application provides a temperature acquisition structure, which includes a bracket 10, a circuit board 50, a mounting base 30, a temperature sensing element, and a fixing member 40. The bracket 10 is used to fix it to the battery cell. The mounting base 30 and the circuit board 50 are both disposed on the bracket 10, and the mounting base 30 is provided with a fixing groove 31. The temperature sensing element is installed in the fixing groove 31 and is connected to the first connecting part 59. The fixing member 40 is fixedly connected to the mounting base 30, and at least a portion of the fixing member 40 covers the temperature sensing element.

[0043] The temperature acquisition structure provided in this embodiment, by providing a fixing base 30 and a fixing member 40, with the fixing member 40 fixedly connected to the fixing base 30 and covering the temperature detection element, effectively limits the position of the temperature detection element located in the fixing groove 31, preventing it from falling out of the fixing groove 31. This avoids the temperature detection element being easily displaced or even detached from the battery cell by external forces, ensuring the installation stability of the temperature detection element. This, in turn, facilitates the stable acquisition of the battery cell temperature by the temperature acquisition element. Therefore, the temperature acquisition structure provided in this embodiment solves the technical problem of poor installation stability of temperature acquisition elements in the prior art.

[0044] Specifically, when the temperature sensing element is a wireless communication sensor, the connection between the temperature sensing element and the circuit board 50 does not need to be considered; only the limiting function of the temperature sensing element needs to be ensured. The temperature sensing element can be a temperature sensor, preferably a surface-mount temperature sensor.

[0045] When the temperature sensor needs to be connected to the circuit board 50 via a wire, the first connecting part 59 of the circuit board 50 is positioned opposite the opening of the fixing groove 31, and the first connecting part 59 is connected to the temperature sensor. This arrangement facilitates connection. The above-mentioned fixing method avoids the situation where the fixing part 40 directly fixes the temperature sensor, avoiding the situation where the installation of the temperature sensor becomes more complicated due to unnecessary connection methods, and also avoids the situation where unnecessary connection may cause certain damage to the temperature sensor, thus effectively protecting the temperature sensor.

[0046] Specifically, at least a portion of the fastener 40 can be made to cover the opening of the fixing groove 31 in order to better limit and fix the temperature sensing element in the fixing groove 31.

[0047] Specifically, the bracket 10 in this embodiment can be made of thermoforming material.

[0048] In this embodiment, the fixing member 40 has a first fixing part and a second fixing part arranged at intervals. The first fixing part is connected to the portion of the fixing seat 30 located on one side of the groove opening, and the second fixing part is connected to the portion of the fixing seat 30 located on the other side of the groove opening. This structural arrangement facilitates improved connection stability between the fixing member 40 and the fixing seat 30, ensuring that at least a portion of the fixing member 40 can stably cover the groove opening, thereby further improving the installation stability of the temperature sensing element.

[0049] Specifically, the first fixing part is a first connecting hole, and the fixing base 30 has a first rivet 41 adapted to the first connecting hole on one side of the slot. This results in a simple structure, reliable connection, and easy connection. Specifically, the first rivet 41 can be fixed by thermal riveting to further improve the stability of the connection.

[0050] Specifically, the second fixing part is a second connecting hole, and a second rivet 42 adapted to the second connecting hole is provided on the other side of the groove of the fixing base 30. The connection method using the connecting hole and the rivet is simple, reliable, and easy to operate. Specifically, the second rivet 42 can be fixed by heat riveting to better improve the stability of the connection.

[0051] In this embodiment, the bracket 10 is provided with a positioning groove 11, the shape of which is adapted to the shape of the fixing seat 30, and the fixing seat 30 is installed in the positioning groove 11. This structural arrangement can improve the positioning stability of the bracket 10 relative to the fixing seat 30, so as to avoid the fixing seat 30 from shifting its position relative to the bracket 10, thereby better ensuring the positioning stability of the temperature detection element.

[0052] In this embodiment, the temperature acquisition structure further includes a first connecting row 23 and a second connecting row 24 fixedly mounted on the bracket 10, with the first connecting row 23 and the second connecting row 24 located on opposite sides of the circuit board 50. The mounting base 30 includes a first fixing section 32, an intermediate connecting section 33, and a second fixing section 34 connected in sequence. Specifically, a fixing groove 31 is disposed on the intermediate connecting section 33, and both the first connecting row 23 and the second connecting row 24 can be aluminum strips.

[0053] Specifically, rivet posts can be used to connect and fix the first connecting row 23 and the second connecting row 24 respectively. For foolproof design purposes, the first connecting row 23 can be connected using multiple rivet posts, and these posts can be asymmetrically arranged; specifically, the first connecting row 23 can be fixedly connected using three rivet posts. Similarly, for foolproof design purposes, the second connecting row 24 can be connected using multiple rivet posts, and these posts can be asymmetrically arranged; specifically, the second connecting row 24 can be fixedly connected using three rivet posts.

[0054] Specifically, the circuit board 50 can be a flexible circuit board, which can be fixed by adhesive backing.

[0055] Specifically, the first fixed section 32 is sandwiched between the first connecting row 23 and the bracket 10 to facilitate effective positioning of the first fixed section 32 and prevent the position of the first fixed section 32 from easily shifting, thereby facilitating the limiting of the position of the fixed seat 30.

[0056] In this embodiment, the second fixing segment 34 is sandwiched between the second connecting row 24 and the bracket 10 to facilitate effective positioning of the second fixing segment 34 and prevent the position of the second fixing segment 34 from easily shifting, thereby facilitating better positioning of the fixing seat 30.

[0057] Specifically, in this embodiment, the first connecting bar 23 and the second connecting bar 24 can be designed as sheet metal, and both the first connecting bar 23 and the second connecting bar are mounted coplanarly with the voltage acquisition component 80. Specifically, both the first connecting bar 23 and the second connecting bar 24 can be fixed by hot riveting, and the first connecting bar 23 and the second connecting bar 24 achieve the limiting of the embedded mounting base 30, ensuring the limiting stability of the mounting base 30.

[0058] Specifically, at least a portion of the intermediate connecting section 33 is sandwiched between the circuit board 50 and the bracket 10, so as to effectively position the intermediate connecting section 33 and avoid the position of the intermediate connecting section 33 from being easily offset, thereby facilitating further better positioning of the fixing seat 30.

[0059] In this embodiment, the bracket 10 is provided with a positioning groove 11, which has a first groove segment 111, an intermediate groove segment 112, and a second groove segment 113 connected in sequence. The first groove segment 111 is adapted to the first fixing segment 32, which is disposed within the first groove segment 111. The second groove segment 113 is adapted to the second fixing segment 34, which is disposed within the second groove segment 113. The intermediate groove segment 112 is disposed opposite to the intermediate connecting segment 33, which is disposed within the intermediate groove segment 112. With this structural arrangement, the positioning groove 11 can effectively limit the positioning of the fixing seat 30, so that the shape of the positioning groove 11 can better match the shape of the fixing seat 30, thereby better ensuring the installation stability of the temperature detection element.

[0060] Specifically, the first fixing section 32 includes a first connecting body 321 and a first connecting protrusion 322, with the first connecting protrusion 322 protruding from the side of the first connecting body 321 away from the intermediate connecting portion. This allows for the first connecting body 321 to be primarily limited by the first connecting protrusion 322, effectively ensuring the first fixing section 32 is effectively limited while avoiding excessive interference with the fixed installation of the first connecting row 23 due to excessive portion being clamped at it.

[0061] Specifically, the second fixing section 34 includes a second connecting body 341 and a second connecting protrusion 342, with the second connecting protrusion 342 protruding from the side of the second connecting body 341 away from the intermediate connecting portion. This allows for the limiting of the second connecting body 341 primarily by limiting the second connecting protrusion 342, effectively ensuring the effective limiting of the second fixing section 34 while avoiding excessive interference with the fixed installation of the second connecting row 24 due to excessive portion being clamped at it.

[0062] Specifically, the intermediate connecting section 33 is provided with a cutout portion 331. This prevents the fixing seat 30 from avoiding contact with parts of the circuit board 50, and avoids excessive and unnecessary contact between the fixing seat 30 and the circuit board 50. In addition, it can minimize the overall weight of the fixing seat 30 while ensuring its fixing strength.

[0063] In this embodiment, the first connecting strip 23 has an asymmetrical structure, with the number of positioning parts on one side of the first connecting strip 23 differing from the number of positioning parts on the other side. This foolproof design prevents misalignment during installation of the first connecting strip 23, ensuring correct and orderly installation and facilitating efficient installation.

[0064] Specifically, the positioning part of the first connecting row 23 is a positioning hole. Specifically, there is one positioning hole on one side of the first connecting row 23 and two positioning holes on the other side of the first connecting row 23.

[0065] Specifically, the second connecting strip 24 has an asymmetrical structure, with the number of positioning parts on one side of the second connecting strip 24 differing from the number on the other side. This foolproof design prevents misalignment during installation, ensuring correct and orderly installation and facilitating efficient installation.

[0066] Specifically, the positioning part of the second connecting row 24 is a positioning hole. Specifically, there is one positioning hole on one side of the second connecting row 24 and two positioning holes on the other side of the second connecting row 24.

[0067] In this embodiment, the fixing groove 31 is a hollow groove, and the bracket 10 is provided with a connecting hole that communicates with and is opposite to the hollow groove. The temperature detection element is attached to the part of the battery cell located at the connecting hole. This structural arrangement facilitates better detection of the battery cell temperature through the temperature detection element and also helps to ensure the positioning stability of the temperature detection element.

[0068] Specifically, in this embodiment, the hollowed-out groove is adapted to the shape of the temperature acquisition device, and the hollowed-out groove can be a square groove.

[0069] Specifically, the temperature acquisition structure also includes thermally conductive putty, which fills the perforated groove. By using thermally conductive putty as the heat transfer medium, the adhesion stability of the temperature acquisition component is improved, and its service life is also guaranteed. Specifically, the thermally conductive putty is flexible and deformable; compared to traditional cured thermally conductive adhesives, it better avoids the problems of aging and tearing caused by curing adhesives. Specifically, when thermally conductive putty is added to the perforated groove, the temperature detection component can be attached to the periphery of the fixing groove 31, allowing the temperature detection component to contact the thermally conductive putty in the perforated groove for detecting the temperature of the battery cell.

[0070] In this embodiment, the circuit board 50 includes a body portion 55 and a first connecting portion 59 connected to each other. The first connecting portion 59 is disposed opposite to the opening of the fixing groove 31. The temperature sensing element is connected to the first connecting portion 59, and a first hollow gap exists between the first connecting portion 59 and the body portion 55. This reduces the connection strength between the first connecting portion 59 and the body portion 55, preventing the body portion 55 from shifting due to positional shift of the first connecting portion 59 when connecting to other components, thus better ensuring the positional stability of the body portion 55.

[0071] Specifically, the first connecting part 59 is a bent strip, one end of which is connected to the main body 55, and the other end of which is connected to the temperature sensing element; the first cutout gap includes a first gap and a second gap spaced apart on both sides of the bent strip. This structural arrangement effectively reduces the connection strength between the first connecting part 59 and the main body 55, better preventing the positional offset of the first connecting part 59 from significantly affecting the positioning stability of the main body 55, thereby better ensuring the overall stability of the circuit board 50.

[0072] In this embodiment, the circuit board 50 further includes a body portion 55 and a second connecting portion 54. Both the first connecting portion 59 and the second connecting portion 54 are connected to the body portion 55. The second connecting portion 54 is spaced apart from the first connecting portion 59, and a second slotted gap exists between the second connecting portion 54 and the body portion 55. This structural arrangement facilitates reducing the connection strength between the second connecting portion 54 and the body portion 55, preventing positional shifts in the body portion 55 caused by positional shifts in the second connecting portion 54 when connecting to other components, thus better ensuring the positional stability of the body portion 55. Specifically, the second connecting portion 54 is used to connect to the voltage acquisition component 80, which is connected to either the first connecting bar 23 or the second connecting bar 24.

[0073] Specifically, the temperature acquisition structure also includes an output busbar 25, which comprises a busbar body 251 and an output section 253 connected to each other. The busbar body 251 is mounted on the support 10, and the output section 253 is bent relative to the busbar body 251 and extends out of the support 10. The bent portion of the output section 253 relative to the busbar body 251 forms a bent connecting section. A separation gap 252 is provided on the busbar body 251, and the separation gap 252 is adjacent to the bent connecting section of the output section 253. This structural arrangement avoids the problem of excessive deformation of the outer contour at the bend of the output section 253 relative to the busbar body 251, reducing the impact on the structure of the busbar body 251.

[0074] Specifically, there can be two output busbars 25, which are located at opposite ends of the circuit board 50. Specifically, the thickness of the output busbar 25 is 2mm, with a thickness of 1.5mm at the thinnest point, and it is made of 1060 aluminum with H24 heat treatment.

[0075] In this embodiment, both the bracket 10 and the fixing base 30 are made of insulating material, which facilitates effective insulation and isolation.

[0076] Specifically, the thickness of the fixing seat 30 is greater than the thickness of the bracket 10 to ensure the fixing stability of the fixing seat 30.

[0077] Specifically, the bracket 10 is vacuum-formed, resulting in a thin profile and low cost. The fixing seat 30 serves a positioning function; it is injection-formed and has a greater thickness.

[0078] Embodiment 2 of this application provides a battery pack including the temperature acquisition structure described above. The battery pack also includes multiple battery cells.

[0079] As can be seen from the above description, the above embodiments of this application achieve the following technical effects: accurate temperature acquisition, high structural strength, temperature sensing protection, and high reliability; the use of thermal conductive putty can effectively avoid problems such as adhesive cracking, peeling, and aging of traditional cured thermal conductive adhesives, and has the advantages of easy adhesion, long lifespan, and wide application scenarios; embedding a fixing seat made of plastic material into the bracket made of blister material can make up for the disadvantage of weak structural strength of fixing with a simple bracket compared to fixing with a plastic fixing seat, and improve the overall structural strength of the temperature acquisition structure.

[0080] Example 2

[0081] To address the issue of low safety in existing power batteries, this application provides an integrated busbar and a battery pack incorporating it.

[0082] As shown in Figures 6 and 7, the integrated busbar includes a bracket 10, a bus structure 20, a circuit board 50, a temperature sensing structure 90, and a sealing compound. The bracket 10 is used to mount multiple battery cells. The bus structure 20 is mounted on the bracket 10 and connected to the electrodes of the multiple battery cells. The circuit board 50 is mounted on the bracket 10, is plate-shaped, and connected to the bus structure 20. The temperature sensing structure 90 is mounted on the circuit board 50 and is used to detect the temperature of the bus structure 20 and transmit the detection result to the circuit board 50. The sealing compound is disposed between the temperature sensing structure 90 and the circuit board 50 to seal the gap between the circuit board 50 and the temperature sensing structure 90. At least a portion of the sealing compound is made of a thermally conductive material, and the projection of the temperature sensing structure 90 onto the sealing compound is located within the outer periphery of the sealing compound.

[0083] Using the technical solution of this embodiment, the integrated busbar support 10 is used to mount multiple battery cells. A busbar structure 20 is mounted on the support 10 and connected to the electrodes of the multiple battery cells. A circuit board 50 is mounted on the support 10, the circuit board 50 is plate-shaped and connected to the busbar structure 20. A temperature acquisition structure 90 is mounted on the circuit board 50 and is used to detect the temperature of the busbar structure 20 and transmit the detection result to the circuit board 50. A sealing compound is disposed between the temperature acquisition structure 90 and the circuit board 50 to seal the gap between the circuit board 50 and the temperature acquisition structure 90. At least a portion of the sealing compound is made of a thermally conductive material, and the projection of the temperature acquisition structure 90 onto the sealing compound is located within the outer periphery of the sealing compound. In this way, the above arrangement allows the integrated busbar to be connected to multiple battery cells through the busbar structure 20, and the temperature of the battery cells is acquired through the temperature acquisition structure 90 mounted on the circuit board 50. This improves the convenience and accuracy of the temperature acquisition structure 90, realizes the detection of battery cell temperature, ensures the operational reliability and safety performance of the battery cells, and thus solves the problem of low safety in existing power batteries. Meanwhile, the aforementioned sealing colloid not only achieves the connection between the temperature acquisition structure 90 and the circuit board 50, ensuring the reliability of the temperature information acquired by the temperature acquisition structure 90, but also eliminates the need for a separate temperature acquisition structure 90 on the integrated busbar, reducing the space occupied by the temperature acquisition structure 90 and improving the space utilization of the battery cell; on the other hand, it allows the operator to achieve the connection between the temperature acquisition structure 90 and the circuit board 50 simply by applying the sealing colloid, making the overall operation very simple and quick, which not only improves the work efficiency of the operator, but also enhances the overall appearance of the battery pack.

[0084] In this embodiment, the support 10 is made of polycarbonate. This arrangement serves two purposes: firstly, it enables the support 10 to support the circuit board 50 and the busbar structure 20; secondly, it allows the support 10 to insulate against heat dissipated from the battery cell, ensuring the operational reliability of the circuit board 50 and the busbar structure 20. Furthermore, in the event of thermal runaway in the battery cell, this arrangement prevents the spread of heat during thermal runaway, thereby ensuring the safety of the integrated busbar and, consequently, the operational stability of the integrated busbar.

[0085] Specifically, the support 10 is a PC film, which is bonded to the battery cell with adhesive.

[0086] In this embodiment, the circuit board 50 is a flexible circuit board.

[0087] Specifically, the circuit board 50 is manufactured using a physical process of cutting the circuit board with a die.

[0088] Specifically, the flexible circuit board has an adhesive backing on the side near the bracket 10, and is connected to the bracket 10 by adhesive bonding.

[0089] In this embodiment, the busbar structure 20 is an aluminum busbar made of 1060 material.

[0090] In this embodiment, the temperature acquisition structure 90 is a patch temperature sensor.

[0091] In this embodiment, the sealant is a structural adhesive, which is made of a thermally conductive material.

[0092] Specifically, no air bubbles should remain in the structural adhesive to improve the accuracy of temperature acquisition by the structure 90.

[0093] Specifically, the outer periphery of the sealing adhesive and the outer periphery of the temperature acquisition structure 90 have a minimum distance L, the value of which satisfies: 2mm ≤ L ≤ 3mm. This arrangement ensures the reliability of the connection between the temperature acquisition structure 90 and the circuit board 50, improving the acquisition reliability of the temperature acquisition structure 90. Simultaneously, this arrangement allows for more flexible and diverse application of the sealing adhesive by the operator, reducing the difficulty of the operation and improving work efficiency.

[0094] As shown in Figures 6 to 10, the circuit board 50 also includes a body portion 55 and a connecting portion 57. The body portion 55 is mounted on the bracket 10. The connecting portion 57 is mounted on the body portion 55 and is connected to the busbar structure 20 to collect current and temperature information from the busbar structure 20. At least two temperature acquisition structures 90 are provided, each mounted on a connecting portion 57, to acquire the temperature of the busbar structure 20. This arrangement allows the temperature acquisition structures 90 to connect to the busbar structure 20 and the circuit board 50 via the connecting portion 57, improving the convenience and accuracy of temperature acquisition, reducing the space occupied by the temperature acquisition structures 90, and further improving the space utilization of the battery cell. Simultaneously, this arrangement allows for greater flexibility and variety in the number of temperature acquisition structures 90, improving installation flexibility for operators and enhancing the reliability of temperature acquisition.

[0095] In this embodiment, three temperature acquisition structures 90 are set.

[0096] It should be noted that the number of temperature acquisition structures 90 is not limited to this and can be adjusted according to working conditions and usage requirements. Optionally, there may be two, four, five, six, seven or more temperature acquisition structures 90.

[0097] As shown in Figures 6 to 9, the support 10 is plate-shaped, and the busbar structure 20 includes two first busbars 21 and multiple second busbars 22. The two first busbars 21 are respectively disposed at both ends of the support 10. The multiple second busbars 22 are disposed between the two first busbars 21. Each first busbar 21 is used to connect to one battery cell, and each second busbar 22 is used to connect to two adjacent battery cells. The thickness T1 of the first busbar 21 and the thickness T2 of the second busbar 22 satisfy the relationship: T2 ≤ T1. This arrangement, on the one hand, achieves connection between multiple battery cells, ensuring the operational reliability of the battery cells, and thus ensuring the reliability of the integrated busbar; on the other hand, it improves the buffering performance of the busbar structure 20 to avoid damage to the busbar structure 20 when the battery cells expand, thereby improving the reliability of the integrated busbar. Simultaneously, this arrangement ensures the current-carrying area of ​​the busbar structure 20, improves the heat dissipation performance of the battery cells, reduces the temperature of the battery cells, and further improves the operational stability of the battery cells.

[0098] In this embodiment, the first busbar 21 is an output aluminum busbar, and the second busbar 22 is a series aluminum busbar.

[0099] In this embodiment, the bracket 10, the first busbar 21 and the second busbar 22 are each provided with a plurality of through holes. The electrodes of the battery cell corresponding to the first busbar 21 pass through the through holes and are welded to the first busbar 21. The electrodes of the two battery cells corresponding to the second busbar 22 pass through the through holes and are connected to the second busbar 22.

[0100] As shown in Figures 8 and 9, the first busbar 21 includes a first connecting segment 211 and a second connecting segment 212 connected to each other. The first connecting segment 211 is disposed on the bracket 10, and at least a portion of the second connecting segment 212 is located on the outer side of the outer peripheral surface of the bracket 10. The thicknesses T11 of the first connecting segment 211, T12 of the second connecting segment 212, and T2 of the second busbar 22 satisfy the following relationship: T11 < T12, T2 < T12, T11 = T2. This arrangement ensures smooth installation of the first busbar 21 and the second busbar 22, reducing processing difficulty and improving work efficiency. Furthermore, it allows the second busbar 22 to improve the heat dissipation efficiency of the battery cell through the second connecting segment 212, thereby enhancing the operational stability of the battery cell.

[0101] Specifically, the first busbar is manufactured by a thinning process after H24 heat treatment.

[0102] Specifically, the thickness T11 of the first connecting section 211 ranges from 1.3mm to 1.7mm; and / or the thickness T12 of the second connecting section 212 ranges from 2.3mm to 2.7mm. This arrangement makes the thicknesses of the first busbar 21 and the second busbar 22 more suitable, further improving the operational reliability of the battery cell while also ensuring the work efficiency of the staff.

[0103] Specifically, the thickness T11 of the first connecting segment 211 is: T11 = 1.5 mm.

[0104] Specifically, the thickness T12 of the second connecting section 212 is: T12 = 5.5 mm.

[0105] As shown in Figures 6 and 7, the bracket 10 includes multiple connecting holes 12, and the circuit board 50 also includes multiple clearance holes 56. The clearance holes 56 are spaced apart along the length of the circuit board 50, and are arranged in a one-to-one correspondence with the connecting holes 12 to avoid interference with the explosion-proof valve of the battery cell. This arrangement avoids interference between the integrated busbar and the battery cell's explosion-proof valve, ensuring the reliability of the explosion-proof valve's operation and thus improving the safety of the battery cell and the operational reliability of the integrated busbar. Furthermore, this arrangement further enhances the buffering performance of the integrated busbar, further improving its safety.

[0106] As shown in Figures 6 and 7, a buffer portion 51 is provided on the circuit board 50. The buffer portion 51 is surrounded by buffer holes 52 formed on the circuit board 50. The buffer holes 52 include a first hole segment 521 and a second hole segment 522 that are interconnected. The first hole segment 521 extends along the length direction of the circuit board 50. One end of the second hole segment 522 is connected to one end of the first hole segment 521, and the other end of the second hole segment 522 extends to the side of the circuit board 50. Multiple buffer portions 51 are provided on the same side of the circuit board 50. The multiple buffer portions 51 are divided into a first buffer group 531 and a second buffer group 532 distributed along the extension direction of the circuit board 50. Both the first buffer group 531 and the second buffer group 532 include multiple buffer portions 51 distributed along the extension direction of the circuit board 50. The second hole segment 522 of each buffer part 51 in the first buffer group 531 is connected to the end of the first hole segment 521 of the buffer part 51 near the second buffer group 532, and the second hole segment 522 of each buffer part 51 in the second buffer group 532 is connected to the end of the first hole segment 521 of the buffer part 51 near the first buffer group 531. In this way, when the battery cell expands, the arrangement of the buffer part 51 increases the range of motion of the circuit board 50 in the length and width directions, thereby buffering the impact force of the battery cell on the circuit board 50, improving the buffering performance of the circuit board 50, and preventing the circuit board 50 from being damaged by the battery cell during expansion. This ensures the operational stability of the circuit board 50, extends its service life, and improves the integrated reliability of the integrated busbar, solving the problem of low reliability of integrated busbars in the prior art.

[0107] Specifically, when multiple cells are arranged side by side, the expansion mainly occurs from the middle cell to the two sides. The arrangement of the first buffer group 531 and the second buffer group 532 further increases the amount of movement of the circuit board 50 along its length, further improves the buffering performance of the circuit board 50, and further ensures the operational stability of the integrated busbar.

[0108] As shown in Figures 6 and 7, a first buffer group 531 and a second buffer group 532 are provided on both opposite sides of the circuit board 50. And / or, the circuit board 50 includes a first buffer segment and a second buffer segment arranged sequentially along its extension direction, with the first buffer group 531 located in the first buffer segment and the second buffer group 532 located in the second buffer segment. This arrangement further improves the buffering performance of the circuit board 50, enhances its operational stability, and consequently improves the reliability of the integrated busbar.

[0109] Specifically, along the length of the circuit board 50, the circuit board 50 is divided into left and right parts, with a first buffer section located on the left part of the circuit board 50 and a second buffer section located on the right part of the circuit board 50.

[0110] As shown in Figures 6 and 7, the circuit board 50 includes a body portion 55 and a buffer portion 51, which is a strip plate. One end of the buffer portion 51 is disposed on the body portion 55, and the other end of the buffer portion 51 is a free end. The buffer portion 51 has an initial state and a buffered state. In the initial state, the extension direction of the buffer portion 51 is parallel to the extension direction of the body portion 55. In the buffered state, the buffer portion 51 is folded relative to the body portion 55. Thus, in the initial state, the buffer portion 51 and the body portion 55 are on the same horizontal plane, reducing the space occupied by the integrated busbar and increasing the energy density of the battery cell. When the battery cell expands, the buffer portion 51 is in the buffered state, folding relative to the body portion 55, and the free end of the buffer portion 51 is raised, further increasing the mobility of the circuit board 50 and further improving the buffering performance of the circuit board 50.

[0111] As shown in Figures 6 to 10, the integrated busbar also includes multiple voltage acquisition components 80. These components are spaced apart along the length or width of the circuit board 50. One end of each component 80 is connected to the busbar structure 20, and the other end is connected to the buffer section 51. This allows the components to acquire the voltage of the busbar structure 20 and transmit the detection result to the circuit board 50. In this way, the voltage acquisition components 80 enable the acquisition of cell voltage information, ensuring the reliability of the integrated busbar. Furthermore, the arrangement of multiple voltage acquisition components 80 improves the acquisition efficiency and accuracy, thereby enhancing cell safety. It also allows for greater flexibility in the number of components, improving installation flexibility for operators. Additionally, the placement of the voltage acquisition components on the buffer section 51 enhances their buffering capacity, further improving the reliability of their acquisition.

[0112] In this embodiment, the voltage acquisition component 80 is a nickel sheet, with one end welded to the bus structure 20 and the other end welded to the buffer portion 51. This arrangement ensures the stability of the voltage acquisition component 80 while reducing the space occupied by the integrated busbar.

[0113] As shown in Figures 6 and 8, the integrated busbar also includes a reinforcing structure 60 and a connector 70. The reinforcing structure 60 is located at the end of the circuit board 50. The connector 70 is located on the side of the reinforcing structure 60 away from the circuit board 50 to monitor the voltage and temperature of the battery cells. Thus, this arrangement, on the one hand, enables the integrated busbar to monitor the voltage and temperature of the battery cells, improving the automation level of the integrated busbar and the safety of the battery cells; on the other hand, it increases the strength of the circuit board 50, improves the connection stability of the connector 70, and further enhances the reliability of the integrated busbar.

[0114] In this embodiment, the reinforcing structure 60 is a reinforcing plate.

[0115] As shown in Figures 6 and 8, the circuit board 50 also includes a body portion 55, and a bent portion 38 is formed by bending the end of the body portion 55, forming an angle with the body portion 55. Multiple reinforcing structures 60 are present, with at least two reinforcing structures 60 respectively disposed on opposite sides of the bent portion 38, and at least one reinforcing structure 60 located between the bent portion 38 and the connector 70. This arrangement improves the space utilization of the integrated busbar, further reducing its footprint; it also protects other components, preventing damage and further enhancing the safety of the integrated busbar.

[0116] In this embodiment, the included angle between the bent portion 38 and the main body portion 55 is set at 90°.

[0117] It should be noted that the included angle between the bent portion 38 and the main body 55 is not limited to this value and can be adjusted according to working conditions and usage requirements. Optionally, the included angle between the bent portion 38 and the main body 55 is 45°, 60°, 75°, 105°, 120°, or 135°.

[0118] According to another aspect of this application, a battery pack is provided, including a plurality of stacked cells and an integrated busbar, wherein the integrated busbar is the aforementioned integrated busbar.

[0119] As can be seen from the above description, the embodiments of this application achieve the following technical effects:

[0120] The integrated busbar's support structure is used to mount multiple battery cells. A busbar structure is mounted on the support structure and connected to the electrodes of the multiple battery cells. A circuit board, plate-shaped, is mounted on the support structure and connected to the busbar structure. A temperature acquisition structure is mounted on the circuit board and used to detect the temperature of the busbar structure, transmitting the detection result to the circuit board. A sealing compound is placed between the temperature acquisition structure and the circuit board to seal the gap between them. At least a portion of the sealing compound is made of a thermally conductive material, and the projection of the temperature acquisition structure onto the sealing compound is located within its outer periphery. This arrangement allows the integrated busbar to connect to multiple battery cells via the busbar structure, and enables the acquisition of battery cell temperatures through the temperature acquisition structure on the circuit board. This improves the convenience and accuracy of temperature acquisition, achieves battery cell temperature detection, ensures the operational reliability and safety performance of the battery cells, and thus solves the problem of low safety in existing power batteries. Meanwhile, the aforementioned sealing colloid not only achieves the connection between the temperature acquisition structure and the circuit board, ensuring the reliability of the temperature information collected by the temperature acquisition structure, but also eliminates the need for a separate temperature acquisition structure on the integrated busbar, reducing the space occupied by the temperature acquisition structure and improving the space utilization of the battery cell; on the other hand, it allows the staff to simply apply the sealing colloid to achieve the connection between the temperature acquisition structure and the circuit board, making the overall operation very simple and quick, which not only improves the work efficiency of the staff, but also enhances the overall appearance of the battery pack.

Claims

1. A temperature acquisition structure, comprising: The bracket (10) is fixed on the battery cell; A fixing seat (30) is provided on the bracket (10), and a fixing groove (31) is provided on the fixing seat (30). A temperature sensing element is installed in the fixing groove (31); The fastener (40) is fixedly connected to the fixing seat (30), and at least part of the fastener (40) covers the temperature sensing element.

2. The temperature harvesting structure of claim 1, wherein, The temperature acquisition structure also includes a circuit board (50) disposed on the bracket (10), the circuit board (50) including a first connecting part (59), the first connecting part (59) being disposed opposite to the opening of the fixing groove (31), the temperature detection element being connected to the first connecting part (59); and / or, at least a portion of the fixing element (40) covering the opening of the fixing groove (31).

3. The temperature harvesting structure of claim 1, wherein, The fastener (40) has a first fixing part and a second fixing part spaced apart. The first fixing part is connected to the part of the fixing seat (30) located on one side of the groove opening of the fixing slot (31), and the second fixing part is connected to the part of the fixing seat (30) located on the other side of the groove opening.

4. The temperature harvesting structure of claim 3, wherein, The first fixing part is a first connecting hole, and the fixing seat (30) is provided with a first rivet (41) adapted to the first connecting hole on one side of the slot; and / or, the second fixing part is a second connecting hole, and the fixing seat (30) is provided with a second rivet (42) adapted to the second connecting hole on the other side of the slot.

5. The temperature harvesting structure of claim 1, wherein, The bracket (10) is provided with a positioning groove (11), the shape of the positioning groove (11) is adapted to the shape of the fixing seat (30), and the fixing seat (30) is installed in the positioning groove (11).

6. The temperature harvesting structure of claim 2, wherein, The temperature acquisition structure further includes a first connecting bar (23) and a second connecting bar (24) fixedly mounted on the bracket (10), the first connecting bar (23) and the second connecting bar (24) being located on both sides of the circuit board (50); the fixing base (30) includes a first fixing section (32), an intermediate connecting section (33), and a second fixing section (34) connected in sequence; wherein, the first fixing section (32) is sandwiched between the first connecting bar (23) and the bracket (10); and / or, The second fixing segment (34) is sandwiched between the second connecting row (24) and the bracket (10); and / or, At least a portion of the intermediate connecting section (33) is sandwiched between the circuit board (50) and the bracket (10).

7. The temperature harvesting structure of claim 6, wherein, The bracket (10) is provided with a positioning groove (11), which has a first groove segment (111), an intermediate groove segment (112), and a second groove segment (113) connected in sequence. The first groove segment (111) is adapted to the first fixing segment (32), and the first fixing segment (32) is disposed in the first groove segment (111). The second groove segment (113) is adapted to the second fixing segment (34), and the second fixing segment (34) is disposed in the second groove segment (113). The intermediate groove segment (112) is disposed opposite to the intermediate connecting segment (33), and the intermediate connecting segment (33) is disposed in the intermediate groove segment (112).

8. The temperature harvesting structure of claim 6, wherein, The first fixed segment (32) includes a first connecting body (321) and a first connecting protrusion (322), the first connecting protrusion (322) protruding from the side of the first connecting body (321) away from the intermediate connecting segment (33); and / or, The second fixing segment (34) includes a second connecting body (341) and a second connecting protrusion (342), the second connecting protrusion (342) protruding from the side of the second connecting body (341) away from the intermediate connecting segment (33); and / or, The intermediate connecting section (33) is provided with a hollow part (331).

9. The temperature harvesting structure of claim 6, wherein, The first connecting row (23) has an asymmetrical structure, and the number of positioning parts on one side of the first connecting row (23) is different from the number of positioning parts on the other side of the first connecting row (23); and / or, The second connecting row (24) has an asymmetrical structure, and the number of positioning parts on one side of the second connecting row (24) is different from the number of positioning parts on the other side of the second connecting row (24).

10. The temperature harvesting structure of claim 1, wherein, The fixing groove (31) is a hollow groove, and the bracket (10) is provided with a connecting hole that communicates with and is opposite to the hollow groove. The temperature detection element is attached to the part of the battery cell located at the connecting hole.

11. The temperature harvesting structure of claim 10, wherein, The temperature acquisition structure also includes: thermally conductive mud, which fills the hollowed-out groove.

12. The temperature harvesting structure of claim 1, wherein, The circuit board (50) includes a body part (55) and a first connecting part (59) connected to each other. The first connecting part (59) is disposed opposite to the slot of the fixing groove (31). The temperature detection element is connected to the first connecting part (59). There is a first hollow gap between the first connecting part (59) and the body part (55).

13. The temperature harvesting structure of claim 12, wherein, The first connecting part (59) is a bent strip, one end of which is connected to the main body part (55), and the other end of which is connected to the temperature detection element; the first hollow space includes a first gap and a second gap that are spaced apart on both sides of the bent strip.

14. The temperature harvesting structure of claim 2, wherein, The circuit board (50) further includes a body portion (55) and a second connecting portion (54), the second connecting portion (54) being connected to the body portion (55), and a second cutout gap being present between the second connecting portion (54) and the body portion (55); and / or, The temperature acquisition structure also includes an output bus (25), which includes a bus body (251) and an output section (253) connected to each other. The bus body (251) is mounted on the bracket (10), and the output section (253) is bent relative to the bus body (251) and extends out of the bracket (10). A separation gap (252) is provided on the bus body (251), and the separation gap (252) is adjacent to the bent connecting section of the output section (253).

15. The temperature acquisition structure according to any one of claims 1 to 13, wherein, The bracket (10) and / or the fixing base (30) are made of insulating material; and / or, The thickness of the fixing seat (30) is greater than the thickness of the bracket (10).

16. An integrated busbar, comprising: Temperature acquisition structure (90), the temperature acquisition structure includes the temperature acquisition structure according to claim 1; A busbar structure (20) is disposed on the bracket (10) and connected to the electrodes of the plurality of battery cells; A circuit board (50) is disposed on the bracket (10), the circuit board (50) is plate-shaped and connected to the busbar structure (20); The temperature acquisition structure (90) is disposed on the circuit board (50) and configured to detect the temperature of the busbar structure (20) and transmit the detection result to the circuit board (50); and A sealing colloid is disposed between the temperature acquisition structure (90) and the circuit board (50) to seal the gap between the circuit board (50) and the temperature acquisition structure (90); In this embodiment, at least a portion of the sealing colloid is made of a thermally conductive material, and the projection of the temperature acquisition structure (90) onto the sealing colloid is located within the outer periphery of the sealing colloid.

17. The integrated busbar of claim 16, wherein, The outer periphery of the sealing colloid and the outer periphery of the temperature acquisition structure (90) have a minimum distance L, and the value of the minimum distance L satisfies: 2mm≤L≤3mm.

18. The integrated busbar of claim 16, wherein, The circuit board (50) also includes: The main body (55) is mounted on the bracket (10); A connecting part (57) is provided on the main body (55), and the connecting part (57) is connected to the bus structure (20) to collect the current and temperature information of the bus structure (20); There are multiple temperature acquisition structures (90), and each temperature acquisition structure (90) is respectively disposed on a connection part (57) to acquire the temperature of the busbar structure (20).

19. The integrated busbar of claim 16, wherein, The support (10) is plate-shaped, and the busbar structure (20) includes: Two first busbars (21) are respectively disposed at both ends of the bracket (10); Multiple second busbars (22) are disposed between two first busbars (21); each first busbar (21) is connected to one of the battery cells, and each second busbar (22) is connected to two adjacent battery cells; The relationship between the thickness T1 of the first busbar (21) and the thickness T2 of the second busbar (22) satisfies: T2≤T1.

20. The integrated busbar of claim 19, wherein, The first busbar (21) includes a first connecting segment (211) and a second connecting segment (212) that are connected to each other. The first connecting segment (211) is disposed on the bracket (10), and at least a portion of the second connecting segment (212) is located on the outer side of the outer peripheral surface of the bracket (10); The relationship between the thickness T11 of the first connecting segment (211), the thickness T12 of the second connecting segment (212), and the thickness T2 of the second busbar (22) satisfies: T11 < T12, T2 < T12, T11 = T2.

21. The integrated busbar of claim 20, wherein, The thickness T11 of the first connecting segment (211) is in the range of 1.3mm≤T11≤1.7mm; and / or the thickness T12 of the second connecting segment (212) is in the range of 2.3mm≤T12≤2.7mm.

22. The integrated busbar of any of claims 16-19, wherein, The bracket (10) includes multiple connecting holes (12), and the circuit board (50) also includes multiple clearance holes (56). The multiple clearance holes (56) are spaced apart along the length direction of the circuit board (50). The multiple clearance holes (56) are arranged opposite to the multiple connecting holes (12) in a one-to-one correspondence, so as to avoid the explosion-proof valve of the battery cell through the clearance holes (56) and the connecting holes (12).

23. The integrated busbar of claim 16, wherein, A buffer portion (51) is provided on the circuit board (50). The buffer portion (51) includes a buffer hole (52) formed on the circuit board (50). The buffer hole (52) includes a first hole segment (521) and a second hole segment (522) that are connected to each other. The first hole segment (521) extends along the length direction of the circuit board (50). One end of the second hole segment (522) is connected to one end of the first hole segment (521). The other end of the second hole segment (522) extends to the side of the circuit board (50). Multiple buffer portions (51) are provided on the same side of the circuit board (50). The multiple buffer portions (51) are divided into a first buffer group (531) and a second buffer group (532) distributed along the extension direction of the circuit board (50). The first buffer group (531) and the second buffer group (532) both include multiple buffer portions (51) distributed along the extension direction of the circuit board (50). The second hole segment (522) of each buffer part (51) in the first buffer group (531) is connected to the end of the first hole segment (521) of the buffer part (51) near the second buffer group (532), and the second hole segment (522) of each buffer part (51) in the second buffer group (532) is connected to the end of the first hole segment (521) of the buffer part (51) near the first buffer group (531).

24. The integrated busbar of claim 23, wherein, The circuit board (50) is provided with the first buffer group (531) and the second buffer group (532) on both opposite sides; and / or, The circuit board (50) includes a first buffer section and a second buffer section arranged sequentially along its extension direction, the first buffer group (531) is arranged in the first buffer section, and the second buffer group (532) is arranged in the second buffer section.

25. The integrated busbar of claim 24, wherein, The circuit board (50) includes a body portion (55). The buffer section (51) is a strip plate, one end of the buffer section (51) is disposed on the main body (55), and the other end of the buffer section (51) is a free end; The buffer portion (51) has an initial state and a buffer state. When the buffer portion (51) is in the initial state, the extension direction of the buffer portion (51) is parallel to the extension direction of the main body portion (55). When the buffer portion (51) is in the buffer state, the buffer portion (51) is folded relative to the main body portion (55).

26. The integrated busbar of any of claims 23-25, wherein, The integrated busbar also includes: Multiple voltage acquisition devices (80) are spaced apart along the length or width of the circuit board (50). One end of each voltage acquisition device (80) is connected to the bus structure (20), and the other end is connected to the buffer (51) to acquire the voltage of the bus structure (20) and transmit the detection result to the circuit board (50).

27. The integrated busbar of any of claims 16-18, wherein, The integrated busbar also includes: A reinforcing structure (60) is provided at the end of the circuit board (50); A connector (70) is disposed on the side of the reinforcing structure (60) away from the circuit board (50) to monitor the voltage and temperature of the battery cell.

28. The integrated busbar of claim 27, wherein, The circuit board (50) also includes a body portion (55) and a bent portion (38), the bent portion (38) being formed by bending the end of the body portion (55), and the bent portion (38) being set at an angle to the body portion (55); There are multiple reinforcing structures (60), with at least two reinforcing structures (60) respectively disposed on opposite sides of the bending portion (38), and at least one of the reinforcing structures (60) located between the bending portion (38) and the connector (70).

29. A battery pack comprising a temperature acquisition structure as described in any one of claims 1 to 15, or comprising a plurality of stacked battery cells and an integrated busbar as described in any one of claims 16 to 28.

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