Display panel and display device

Abstract

Provided in the present disclosure are a display panel and a display device. The display panel comprises an array substrate and a counter substrate, which are arranged opposite each other. The array substrate comprises a sealing region, a first region and a bonding region, the first region being located between the sealing region and the bonding region; in the sealing region, the counter substrate and the array substrate are bonded via a sealing adhesive layer. The array substrate further comprises a protective adhesive layer, a functional film layer and a barrier layer, wherein the protective adhesive layer at least partially covers the first region; at least part of the functional film layer is located between the protective adhesive layer and a base substrate of the display panel; and at least part of the barrier layer is located between the protective adhesive layer and the functional film layer, the compactness of the barrier layer being higher than the compactness of the functional film layer.

Description

Display panel and display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411448374.X, filed in China on October 16, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0004] With the continuous development of display technology, the application range of display products is becoming increasingly wide, and correspondingly, users have increasingly higher requirements for the yield rate of display products. Currently, the more mature display products include liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays. These products all include bonding areas for attaching driver chips, and a protective adhesive layer is formed around the bonding area. However, these protective adhesive layers have weak waterproof capabilities and suffer from uneven coating, allowing moisture to easily penetrate the protective adhesive layer and enter the functional film layer beneath it. This moisture then spreads along the functional film layer to the bonding area, affecting the product's display performance. Summary of the Invention

[0005] The purpose of this disclosure is to provide a display panel and a display device.

[0006] To achieve the above objectives, this disclosure provides the following technical solution:

[0007] A first aspect of this disclosure provides a display panel, comprising: an array substrate and a counter substrate disposed opposite to each other; the array substrate includes a frame region, a first region, and a bonding region, the first region being located between the frame region and the bonding region, wherein the counter substrate and the array substrate are bonded to the frame substrate via a frame adhesive layer in the frame region; the array substrate further includes:

[0008] A protective adhesive layer that at least partially covers the first region;

[0009] A functional film layer, at least a portion of which is located between the protective adhesive layer and the substrate of the display panel;

[0010] A barrier layer, at least a portion of which is located between the protective adhesive layer and the functional film layer, wherein the density of the barrier layer is higher than that of the functional film layer.

[0011] Optionally, the barrier layer includes at least one barrier pattern, the barrier pattern including a first barrier portion and a second barrier portion, the first barrier portion being located on the surface of the functional film layer facing away from the substrate and extending in a direction parallel to the substrate, the second barrier portion extending in a direction perpendicular to the substrate, at least a portion of the second barrier portion being located in a trench formed on the functional film layer, the depth of the trench being less than or equal to the thickness of the functional film layer.

[0012] Optionally, the array substrate further includes:

[0013] A plurality of bonding pins arranged along a first direction, the plurality of bonding pins being located in the bonding region;

[0014] The barrier layer includes at least one set of barrier patterns, the barrier pattern set including a plurality of barrier patterns arranged sequentially along the first direction, with a gap between adjacent barrier patterns.

[0015] Optionally, the width d of the orthographic projection of the barrier pattern onto the substrate along the first direction satisfies: d ≤ 0.05 mm.

[0016] Optionally, the array substrate includes multiple signal transmission lines that extend along a second direction, which intersects with the first direction, and the signal transmission lines are coupled to corresponding bonding pins.

[0017] The orthographic projection of the spacing region on the substrate at least partially overlaps with the orthographic projection of the signal transmission line on the substrate; and / or

[0018] The orthographic projection of the barrier pattern on the substrate at least partially overlaps with the orthographic projection of the signal transmission line on the substrate.

[0019] Optionally, the array substrate further includes:

[0020] A bonding adhesive layer that covers the bonding pin;

[0021] In the group of barrier patterns furthest from the sealing frame region, at least a portion of the first barrier portion of the barrier pattern is located between the bonding adhesive layer and the functional film layer.

[0022] Optionally, in a group of barrier patterns furthest from the sealing frame area, other portions of the first barrier portion in the barrier pattern are located between the protective adhesive layer and the functional film layer, and the other portions are the portions of the first barrier portion other than those located between the bonding adhesive layer and the functional film layer.

[0023] Optionally, the barrier layer includes at least two sets of barrier patterns arranged along a second direction, which intersects with the first direction;

[0024] In two adjacent groups of barrier patterns, the interval region included in one group of barrier patterns is offset from the interval region included in the other group of barrier patterns along the first direction.

[0025] Optionally, except for the group of barrier patterns furthest from the sealing frame area, the other groups of barrier patterns are located between the protective adhesive layer and the functional film layer.

[0026] Optionally, the functional film layer includes a passivation layer.

[0027] Optionally, the array substrate further includes a conductive layer, wherein the barrier layer is disposed in the same layer and of the same material as the conductive layer.

[0028] Optionally, the conductive layer includes an anode layer, and the barrier layer is disposed in the same layer and made of the same material as the anode layer.

[0029] Optionally, the array substrate includes a gate metal layer, a source / drain metal layer, and an anode layer sequentially stacked along a direction away from the substrate.

[0030] The bonding pins in the array substrate include a first conductive film layer, a second conductive film layer, and a third conductive film layer stacked sequentially in a direction away from the substrate. The first conductive film layer is disposed in the same layer and with the same material as the gate metal layer, the second conductive film layer is disposed in the same layer and with the same material as the source and drain metal layers, and the third conductive film layer is disposed in the same layer and with the same material as the barrier layer. The third conductive film layer is insulated from the barrier layer.

[0031] Optionally, the array substrate further includes:

[0032] An organic protective layer, at least a portion of which is located between the protective adhesive layer and the functional film layer, wherein the orthographic projection of the organic protective layer on the substrate is located between the orthographic projection of the barrier layer on the substrate and the orthographic projection of the sealing adhesive layer on the substrate.

[0033] Based on the above-described display panel technical solution, a second aspect of this disclosure provides a display device including the above-described display panel. Attached Figure Description

[0034] The accompanying drawings, which are included to provide a further understanding of this disclosure and form part of this disclosure, illustrate exemplary embodiments of the present disclosure and are used to explain the disclosure, but do not constitute an undue limitation of the disclosure. In the drawings:

[0035] Figure 1 is a first layout schematic diagram of the peripheral area of ​​the display panel provided in an embodiment of this disclosure;

[0036] Figure 2 is a schematic diagram of the second layout of the peripheral area of ​​the display panel provided in an embodiment of this disclosure;

[0037] Figure 3 is a schematic diagram of the structure of the bonding pins provided in an embodiment of this disclosure;

[0038] Figure 4 is a schematic diagram of the third layout of the peripheral area of ​​the display panel provided in an embodiment of this disclosure;

[0039] Figure 5 is a schematic diagram of the first layout of the groove in the display panel provided in an embodiment of this disclosure;

[0040] Figure 6 is a schematic diagram of the second layout of the groove in the display panel provided in an embodiment of this disclosure. Detailed Implementation

[0041] To further illustrate the display panel and display device provided in the embodiments of this disclosure, a detailed description is provided below with reference to the accompanying drawings.

[0042] Please refer to Figures 1 and 2. This disclosure provides a display panel, including: an array substrate and a counter substrate 20 disposed opposite to each other; the array substrate includes a frame region 11, a first region 12, and a bonding region 13, the first region 12 being located between the frame region 11 and the bonding region 13, and the counter substrate 20 being bonded to the array substrate in the frame region 11 by a frame adhesive layer 110; the array substrate further includes:

[0043] A protective adhesive layer 30, which at least partially covers the first region 12;

[0044] A functional film layer 40, at least a portion of which is located between the protective adhesive layer 30 and the substrate of the display panel;

[0045] A barrier layer 50, at least a portion of which is located between the protective adhesive layer 30 and the functional film layer 40, wherein the density of the barrier layer 50 is higher than that of the functional film layer 40.

[0046] Exemplary examples include liquid crystal display panels and organic light-emitting diode (OLED) display panels, but are not limited to these. In the liquid crystal display panel, the array substrate includes an array of distributed circuit structures, the opposing substrate 20 includes a color filter substrate, and a liquid crystal layer is present between the array substrate and the color filter substrate. In the organic light-emitting diode (OLED) display panel, the array substrate includes an array of distributed sub-pixels, each sub-pixel including a coupled sub-pixel driving circuit and a light-emitting element. The sub-pixel driving circuit drives the light-emitting element to emit light, thereby realizing the display function of the display panel. The specific structure of the sub-pixel driving circuit varies, for example, using a 3T1C (3 transistors and 1 capacitor) circuit structure, but is not limited to this. In the OLED display panel, the opposing substrate 20 may include a color filter substrate or a simple cover plate. A color filter layer may also be fabricated on the array substrate in the OLED display panel, but is not limited to this.

[0047] For example, the array substrate includes a frame region 11, a first region 12, and a bonding region 13. The array substrate also includes a display region, with the frame region 11 surrounding the display region. The opposing substrate 20 is bonded to the array substrate via a frame adhesive layer 110 within the frame region 11. The first region 12 and the bonding region 13 are both located on one side of the frame region 11, but are not limited thereto.

[0048] A protective adhesive layer 30 completely covers the first region 12. Exemplarily, the protective adhesive layer 30 includes, but is not limited to, UV adhesive. Because the protective adhesive layer 30 is fluid during fabrication, the final formed protective adhesive layer 30 will at least partially fill the space between the edges of the opposing substrate 20 and the array substrate.

[0049] For example, the functional film layer 40 includes a passivation layer, but is not limited thereto. The functional film layer 40 can extend to the bonding region 13, the frame region 11, and the display region.

[0050] For example, the density of the barrier layer 50 is higher than that of the functional membrane layer 40, that is, it is more difficult for water vapor to pass through the barrier layer 50 than it is for water vapor to pass through the functional membrane layer 40.

[0051] As can be seen from the specific structure of the display panel described above, in the display panel provided in this embodiment, a barrier layer 50 with higher density is provided between the protective adhesive layer 30 and the functional film layer 40. This barrier layer 50 more effectively blocks moisture from invading the functional film layer 40, increases the external waterproof capability, and thus prevents moisture from spreading along the functional film layer 40 to the bonding area 13, thereby preventing moisture from affecting the display function of the display product.

[0052] Furthermore, for medium and large-sized display panels, when the resolution of the display panel is high, the barrier layer 50 introduced into the display panel can more effectively block moisture from intruding into the functional film layer 40, thereby preventing moisture from spreading along the functional film layer 40 to the bonding area 13 and preventing moisture from affecting the display function of the display product.

[0053] As shown in Figures 1 and 2, in some embodiments, the barrier layer 50 includes at least one barrier pattern 501, the barrier pattern 501 including a first barrier portion 501a and a second barrier portion 501b, the first barrier portion 501a being located on the surface of the functional film layer 40 facing away from the substrate and extending in a direction parallel to the substrate, the second barrier portion 501b extending in a direction perpendicular to the substrate, at least a portion of the second barrier portion 501b being located in a trench formed on the functional film layer 40, the depth of the trench being less than or equal to the thickness of the functional film layer 40.

[0054] For example, the first blocking portion 501a and the second blocking portion 501b are formed as an integral structure, but are not limited thereto.

[0055] For example, a groove is formed on the functional film layer 40 by means of a VIA mask, the depth of which is less than or equal to the thickness of the functional film layer 40.

[0056] For example, Figures 5 and 6 illustrate the boundary diagram of the trench GC. The trench GC formed in Figure 5 is a continuous trench GC extending along the first direction. The trench GC formed in Figure 6 is a small-sized trench GC corresponding to the barrier pattern 501, and the orthographic projection of the small-sized trench GC on the substrate is covered by the orthographic projection of the barrier pattern 501 on the substrate.

[0057] For example, the width of the orthographic projection of the first blocking portion 501a onto the substrate along the first direction is greater than or equal to the width of the orthographic projection of the second blocking portion 501b onto the substrate. For example, the width of the orthographic projection of the first blocking portion 501a onto the substrate along the second direction is greater than the width of the orthographic projection of the second blocking portion 501b onto the substrate. For example, the first direction intersects the second direction, and the bonding region 13, the first region 12, and the sealing frame region 11 are arranged along the second direction.

[0058] The first barrier portion 501a is located on the surface of the functional film layer 40 facing away from the substrate and extends in a direction parallel to the substrate. This allows the first barrier portion 501a to effectively prevent moisture from invading the functional film layer 40 from the side where the protective adhesive layer 30 is located, increasing the external waterproof capability. Furthermore, by providing the second barrier portion 501b to extend in a direction perpendicular to the substrate, and with at least a portion of the second barrier portion 501b located within a groove formed on the functional film layer 40, the second barrier portion 501b can effectively prevent moisture from spreading along the functional film layer 40 to the bonding area 13, avoiding any impact of moisture on the display function of the display product.

[0059] As shown in Figures 1 to 4, in some embodiments, the array substrate further includes:

[0060] A plurality of bonding pins 60 arranged along a first direction, the plurality of bonding pins 60 being located in the bonding region 13;

[0061] The barrier layer 50 includes at least one set of barrier pattern groups 50z, the barrier pattern group 50z including a plurality of barrier patterns 501 arranged sequentially along the first direction, and adjacent barrier patterns 501 having a gap region Q1 between them.

[0062] For example, the plurality of bonding pins 60 include a plurality of power signal pins, a plurality of data signal pins, a plurality of sensing signal pins, etc.; the power signal pins are used to transmit power signals; the data signal pins are used to transmit corresponding data signals, which may include data signals provided to red sub-pixels, data signals provided to green sub-pixels, data signals provided to blue sub-pixels, and data signals provided to white sub-pixels; the sensing signal pins are used to transmit sensing signals.

[0063] The aforementioned barrier pattern group 50z includes a plurality of barrier patterns 501 arranged sequentially along the first direction, with a gap Q1 between adjacent barrier patterns 501, such that the length of the orthogonal projection of the barrier pattern 501 on the substrate along the first direction is small, thereby effectively avoiding ESD (electrostatic discharge) problems caused by the barrier pattern 501.

[0064] In some embodiments, the width d of the orthographic projection of the barrier pattern 501 onto the substrate along the first direction satisfies: d ≤ 0.05 mm.

[0065] It should be noted that excessively long metal wires are prone to ESD problems. The lead length in a standard design should be less than 60mm, and when the lead is floating, the length should be as little as 1mm.

[0066] The above setting of d≤0.05mm can reduce the ESD risk generated by the barrier pattern 501 to a very low level, thereby ensuring the reliability of the display panel.

[0067] As shown in Figures 1 to 4, in some embodiments, the array substrate includes multiple signal transmission lines 70, which extend along a second direction that intersects with the first direction, and the signal transmission lines 70 are coupled to corresponding bonding pins 60.

[0068] The orthographic projection of the interval region Q1 on the substrate at least partially overlaps with the orthographic projection of the signal transmission line 70 on the substrate; and / or, the orthographic projection of the barrier pattern 501 on the substrate at least partially overlaps with the orthographic projection of the signal transmission line 70 on the substrate.

[0069] For example, the signal transmission line 70 is coupled to a corresponding bonding pin 60. For instance, the multiple signal transmission lines 70 include multiple data lines (e.g., DataW, DataR, DataG, DataB), multiple power lines (e.g., VDD), and multiple sensing lines (e.g., Sense). The data lines are coupled to corresponding data signal pins and can receive data signals provided by those pins. The power lines are coupled to corresponding power signal pins and can receive power signals provided by those pins. The sensing lines are coupled to corresponding sensing signal pins and can receive sensing signals provided by those pins.

[0070] For example, the signal transmission line 70 is disposed in the same layer and with the same material as the gate metal layer in the display panel, and the signal transmission line 70 can be formed into an integral structure with a conductive film layer included in its corresponding bonding pin 60.

[0071] For example, the signal transmission line 70 can extend sequentially from the binding area 13 to the first area 12, the frame area 11 and the display area, and be coupled to the corresponding structure in the display area.

[0072] The above-mentioned arrangement of the orthographic projection of the interval region Q1 on the substrate and the orthographic projection of the signal transmission line 70 on the substrate at least partially overlaps, which helps to reduce the short-circuit risk between the signal transmission line 70 and the barrier pattern 501.

[0073] The above-mentioned arrangement ensures that the orthographic projection of the barrier pattern 501 on the substrate and the orthographic projection of the signal transmission line 70 on the substrate at least partially overlap, so that the barrier pattern 501 can be arranged as densely as possible along the first direction to achieve a better water vapor blocking effect.

[0074] As shown in Figures 1 and 2, in some embodiments, the array substrate further includes:

[0075] A bonding adhesive layer 80 covers the bonding pin 60;

[0076] In the group of barrier patterns 50z furthest from the sealing region 11, at least a portion of the first barrier portion 501a in the barrier pattern 501 is located between the bonding adhesive layer 80 and the functional film layer 40.

[0077] For example, the bonding adhesive layer 80 includes ACF adhesive (anisotropic conductive adhesive), but is not limited to this. The flip-chip COF is bonded to the bonding pin 60 via the bonding adhesive layer 80.

[0078] The above configuration allows the barrier pattern 501 to effectively prevent moisture from invading the functional membrane layer 40 from the side where the adhesive layer 80 is located, further enhancing the outer waterproof capability.

[0079] As shown in Figures 1 and 2, in some embodiments, in a group of barrier patterns 50z furthest from the sealing frame region 11, other portions of the first barrier portion 501a in the barrier pattern 501 are located between the protective adhesive layer 30 and the functional film layer 40. The other portions are the portions of the first barrier portion 501a other than the portion located between the bonding adhesive layer 80 and the functional film layer 40.

[0080] The above arrangement allows the group of barrier patterns 50z furthest from the sealing frame area 11 to be located simultaneously between the bonding adhesive layer 80 and the functional film layer 40, as well as between the protective adhesive layer 30 and the functional film layer 40. This effectively prevents moisture from invading the functional film layer 40 at the junction of the bonding adhesive layer 80 and the protective adhesive layer 30, further enhancing the outer waterproof capability.

[0081] As shown in Figures 2 and 4, in some embodiments, the barrier layer 50 includes at least two sets of barrier pattern groups 50z arranged along a second direction, the second direction intersecting the first direction; in two adjacent sets of barrier pattern groups 50z, the interval region Q1 included in one set of barrier pattern groups 50z is offset from the interval region Q1 included in the other set of barrier pattern groups 50z along the first direction.

[0082] The above-described configuration enables the at least two sets of barrier pattern groups 50z to more effectively prevent moisture from penetrating the functional film layer 40, further increasing the external waterproofing capability. Simultaneously, the at least two sets of barrier pattern groups 50z form two barrier structures in the direction from the first region 12 to the bonding region 13. Thus, even if moisture penetrates the functional film layer 40 of the first region 12, the at least two sets of barrier pattern groups 50z can further prevent moisture from spreading along the functional film layer 40 to the bonding region 13, thereby avoiding any impact of moisture on the display function of the display product.

[0083] In addition, by setting the interval region Q1 included in one set of two adjacent sets of barrier pattern groups 50z to be staggered from the interval region Q1 included in the other set of barrier pattern groups 50z along the first direction, not only can the two adjacent sets of barrier pattern groups 50z form an effective barrier structure, but it also helps to further reduce the length of the orthogonal projection of the barrier pattern 501 on the substrate along the first direction, thereby further reducing the risk of ESD generated by the barrier pattern 501.

[0084] As shown in Figure 2, in some embodiments, except for the group of barrier patterns 50z furthest from the sealing frame region 11, the other groups of barrier patterns 50z are located between the protective adhesive layer 30 and the functional film layer 40.

[0085] The above-mentioned arrangement can more effectively prevent moisture from invading the functional film layer 40 on the side where the protective adhesive layer 30 is located, increasing the external waterproof capability, thereby preventing moisture from spreading along the functional film layer 40 to the bonding area 13, and preventing moisture from affecting the display function of the display product.

[0086] In some embodiments, the array substrate further includes a conductive layer, wherein the barrier layer 50 is disposed in the same layer and of the same material as the conductive layer.

[0087] For example, the conductive layer may be made of a conductive metal material or indium tin oxide, but is not limited to these.

[0088] For example, the density of the conductive layer is higher than that of the functional film layer 40.

[0089] The barrier layer 50 and the conductive layer are made of the same material and in the same layer, so that the barrier layer 50 and the conductive layer can be formed simultaneously in the same patterning process. This avoids the need for additional processes to manufacture the barrier layer 50, effectively simplifies the manufacturing process of the display panel, and reduces the manufacturing cost of the display panel.

[0090] In some embodiments, the conductive layer includes an anode layer, and the barrier layer 50 is disposed in the same layer and of the same material as the anode layer.

[0091] The barrier layer 50 and the anode layer are made of the same material and in the same layer, so that the barrier layer 50 and the anode layer can be formed simultaneously in the same patterning process. This avoids the need for additional processes to make the barrier layer 50, effectively simplifies the manufacturing process of the display panel, and reduces the manufacturing cost of the display panel.

[0092] As shown in Figures 1 to 3, in some embodiments, the array substrate includes a gate metal layer, a source / drain metal layer, and an anode layer sequentially stacked along a direction away from the substrate.

[0093] The bonding pins 60 in the array substrate include a first conductive film layer 601, a second conductive film layer 602, and a third conductive film layer 603, which are sequentially stacked along a direction away from the substrate. The first conductive film layer 601 is disposed in the same layer and with the same material as the gate metal layer, the second conductive film layer 602 is disposed in the same layer and with the same material as the source and drain metal layers, and the third conductive film layer 603 is disposed in the same layer and with the same material as the barrier layer 50. The third conductive film layer 603 is insulated from the barrier layer 50.

[0094] For example, taking an organic light-emitting diode display panel as an example, the driving backplane of the display panel includes, but is not limited to, a light-shielding layer, a buffer layer (BUF), an active layer, a gate insulating layer (GI), a gate layer (GT), an interlayer insulating layer (ILD), a source / drain metal layer (SD), a passivation layer (PVX), a color filter layer, an organic planarization layer, an anode layer, and a pixel delimiting layer, which are sequentially stacked along the direction away from the substrate.

[0095] When the driving backplane includes the above-mentioned film layers, the manufacturing process of the driving backplane includes the following sequence: light-shielding mask, ACT mask, GT mask, CNT mask, ILD mask, SD mask, PVX deposition, color filter layer fabrication, organic planarization layer deposition, organic planarization layer mask, VIA mask, anode layer mask, and pixel boundary layer fabrication.

[0096] As shown in Figure 3, the second conductive film layer 602 is coupled to the first conductive film layer 601 via an ILD via, and the third conductive film layer 603 is coupled to the second conductive film layer 602 via a VIA via. The organic planarization layer and pixel delimiting layer of the entire bonding region 13 are removed.

[0097] The first conductive film layer 601 and the gate metal layer are disposed in the same layer and made of the same material, so that the first conductive film layer 601 and the gate metal layer can be formed simultaneously in the same patterning process; the second conductive film layer 602 and the source / drain metal layer are disposed in the same layer and made of the same material, so that the second conductive film layer 602 and the source / drain metal layer can be formed simultaneously in the same patterning process; the third conductive film layer 603 and the barrier layer 50 are disposed in the same layer and made of the same material, so that the third conductive film layer 603 and the barrier layer 50 can be formed simultaneously in the same patterning process. The above arrangement allows the bonding pin 60 to be formed simultaneously in the manufacturing process of other structures in the display panel, avoiding the need for additional patterning processes to manufacture the bonding pin 60, thereby effectively simplifying the manufacturing process of the display panel and reducing the manufacturing cost of the display panel.

[0098] The above configuration enables the bonding pin 60 to be formed into a structure including three conductive film layers, which ensures the conductivity of the bonding pin 60 and the yield of the bonding pin 60.

[0099] As shown in Figures 1 and 2, in some embodiments, the array substrate further includes:

[0100] An organic protective layer 90, at least a portion of which is located between the protective adhesive layer 30 and the functional film layer 40, wherein the orthographic projection of the organic protective layer 90 on the substrate is located between the orthographic projection of the barrier layer 50 on the substrate and the orthographic projection of the sealing adhesive layer 110 on the substrate.

[0101] For example, the organic protective layer 90 is made of organic insulating material, and the organic protective layer 90 and the organic planarization layer are set in the same layer and with the same material. This arrangement allows the organic protective layer 90 and the organic planarization layer to be formed simultaneously in the same patterning process, which effectively simplifies the manufacturing process and reduces the manufacturing cost of the display panel.

[0102] The organic protective layer 90 is positioned such that at least a portion of it is located between the protective adhesive layer 30 and the functional film layer 40, thereby preventing moisture from penetrating the functional film layer 40 below it. This prevents moisture from spreading along the functional film layer 40 to the bonding area 13 and avoids moisture affecting the display function of the display product.

[0103] The above-mentioned arrangement of the orthographic projection of the organic protective layer 90 on the substrate, located between the orthographic projection of the barrier layer 50 on the substrate and the orthographic projection of the sealing adhesive layer 110 on the substrate, not only ensures that both the organic protective layer 90 and the barrier layer 50 can protect the functional film layer 40 from moisture intrusion below the protective adhesive layer 30, but also ensures that the barrier layer 50 and the sealing area 11 have a certain distance, avoiding short circuits between the barrier layer 50 and the conductive structure of the sealing area 11.

[0104] This disclosure also provides a display device, including the display panel provided in the above embodiments.

[0105] For example, the display device includes a liquid crystal display device, an organic light-emitting diode display device, an active matrix organic light-emitting diode display device, etc., but is not limited thereto. For example, the display device includes medium and large-sized display devices, and the display device may have high resolution, but is not limited thereto.

[0106] It should be noted that the display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes flexible circuit boards, printed circuit boards, and backplanes.

[0107] In the display panel provided in the above embodiments, a barrier layer 50 with higher density is provided between the protective adhesive layer 30 and the functional film layer 40. This barrier layer 50 more effectively prevents moisture from intruding into the functional film layer 40, increasing the external waterproof capability and preventing moisture from spreading along the functional film layer 40 to the bonding area 13, thus avoiding the impact of moisture on the display function of the display product. Therefore, the display device provided in the embodiments of this disclosure, when including the above-described display panel, also has the above-described beneficial effects, which will not be repeated here.

[0108] It should be noted that the signal line extending in a certain direction means that the signal line includes a main part and a secondary part connected to the main part. The main part is a line, line segment, or strip-shaped body. The main part extends in a certain direction, and the length of the main part extending in a certain direction is greater than the length of the secondary part extending in other directions.

[0109] It should be noted that, in the embodiments of this disclosure, "same layer" can refer to film layers located on the same structural layer. Alternatively, for example, film layers located on the same layer can be layer structures formed by using the same film deposition process to form a specific pattern, and then patterning the film layer using the same photomask through a single patterning process. Depending on the specific pattern, the single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0110] In the various method embodiments of this disclosure, the sequence numbers of each step are not intended to limit the order of the steps. For those skilled in the art, any changes in the order of the steps are within the scope of protection of this disclosure without any creative effort.

[0111] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the product embodiments, so the description is relatively simple, and the relevant parts can be referred to the description of the product embodiments.

[0112] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connection,” “coupled,” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0113] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0114] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0115] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, comprising: An array substrate and a facing substrate arranged opposite to each other; The array substrate includes a frame region, a first region, and a bonding region. The first region is located between the frame region and the bonding region. In the frame region, the opposing substrate and the array substrate are bonded together by a frame adhesive layer. The array substrate further includes: A protective adhesive layer that at least partially covers the first region; A functional film layer, at least a portion of which is located between the protective adhesive layer and the substrate of the display panel; A barrier layer, at least a portion of which is located between the protective adhesive layer and the functional film layer, wherein the density of the barrier layer is higher than that of the functional film layer.

2. The display panel according to claim 1, wherein, The barrier layer includes at least one barrier pattern, the barrier pattern including a first barrier portion and a second barrier portion, the first barrier portion being located on the surface of the functional film layer facing away from the substrate and extending in a direction parallel to the substrate, the second barrier portion extending in a direction perpendicular to the substrate, at least a portion of the second barrier portion being located in a trench formed on the functional film layer, the depth of the trench being less than or equal to the thickness of the functional film layer.

3. The display panel according to claim 2, wherein, The array substrate further includes: A plurality of bonding pins arranged along a first direction, the plurality of bonding pins being located in the bonding region; The barrier layer includes at least one set of barrier patterns, the barrier pattern set including a plurality of barrier patterns arranged sequentially along the first direction, with a gap between adjacent barrier patterns.

4. The display panel according to claim 3, wherein, The width d of the orthographic projection of the barrier pattern onto the substrate along the first direction satisfies: d ≤ 0.05 mm.

5. The display panel according to claim 3, wherein, The array substrate includes multiple signal transmission lines, which extend along a second direction that intersects with the first direction, and the signal transmission lines are coupled to corresponding bonding pins. The orthographic projection of the spacing region on the substrate at least partially overlaps with the orthographic projection of the signal transmission line on the substrate; And / or, The orthographic projection of the barrier pattern on the substrate at least partially overlaps with the orthographic projection of the signal transmission line on the substrate.

6. The display panel according to claim 3, wherein, The array substrate further includes: A bonding adhesive layer that covers the bonding pin; In the group of barrier patterns furthest from the sealing frame region, at least a portion of the first barrier portion of the barrier pattern is located between the bonding adhesive layer and the functional film layer.

7. The display panel according to claim 6, wherein, In the group of barrier patterns furthest from the sealing frame area, other portions of the first barrier portion of the barrier pattern are located between the protective adhesive layer and the functional film layer. These other portions are the portions of the first barrier portion other than those located between the bonding adhesive layer and the functional film layer.

8. The display panel according to claim 3, wherein, The barrier layer includes at least two sets of barrier patterns arranged along a second direction, which intersects with the first direction; In two adjacent groups of barrier patterns, the interval region included in one group of barrier patterns is offset from the interval region included in the other group of barrier patterns along the first direction.

9. The display panel according to claim 8, wherein, Except for the group of barrier patterns furthest from the sealing area, the other groups of barrier patterns are located between the protective adhesive layer and the functional film layer.

10. The display panel according to any one of claims 1 to 9, wherein, The functional film layer includes a passivation layer.

11. The display panel according to any one of claims 1 to 9, wherein, The array substrate further includes a conductive layer, wherein the barrier layer is disposed in the same layer and of the same material as the conductive layer.

12. The display panel according to claim 11, wherein, The conductive layer includes an anode layer, and the barrier layer is made of the same material as the anode layer.

13. The display panel according to claim 12, wherein, The array substrate includes a gate metal layer, a source / drain metal layer, and an anode layer sequentially stacked along a direction away from the substrate. The bonding pins in the array substrate include a first conductive film layer, a second conductive film layer, and a third conductive film layer stacked sequentially in a direction away from the substrate. The first conductive film layer is disposed in the same layer and with the same material as the gate metal layer, the second conductive film layer is disposed in the same layer and with the same material as the source and drain metal layers, and the third conductive film layer is disposed in the same layer and with the same material as the barrier layer. The third conductive film layer is insulated from the barrier layer.

14. The display panel according to any one of claims 1 to 9, wherein, The array substrate further includes: An organic protective layer, at least a portion of which is located between the protective adhesive layer and the functional film layer, wherein the orthographic projection of the organic protective layer on the substrate is located between the orthographic projection of the barrier layer on the substrate and the orthographic projection of the sealing adhesive layer on the substrate.

15. A display device comprising a display panel as claimed in any one of claims 1 to 14.

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