Laser processing device, laser processing method, program, and non-transitory computer-readable medium

Abstract

A laser processing device (1) includes: a laser device (2) including a conveyance device (3) for conveying a workpiece (W) in the lengthwise direction thereof in a conveyance direction (D), a laser light source (20) that emits laser light (L), and a scanning unit (30) for scanning the laser light (L) emitted from the laser light source (20); and a laser control device (41) that controls the laser device (2). The laser control device (41) controls the laser device (2) so as to repeatedly perform the following in an alternating manner: a first scan in which, while in a state in which the laser light (L) is emitted from the laser light source (20), the irradiation position (K) of the laser light (L) with respect to the workpiece (W) being conveyed is scanned in a direction along the conveyance direction of the workpiece and a laser processing line (100) of a predetermined length is formed on the workpiece (W); and a first movement in which, while in a non-emission state in which the laser light (L) is not emitted from the laser light source (20), a target irradiation position (KT) of the laser light (L) with respect to the workpiece (W) being conveyed is moved in a direction intersecting the conveyance direction of the workpiece (W), and the irradiation position of the laser light (L) is positioned at a start position for the next first scan.

Description

Laser processing apparatus, laser processing method, program, and non-transitory computer-readable medium

[0001] The present disclosure relates to a laser processing apparatus, a laser processing method, a program, and a non-transitory computer-readable medium.

[0002] In recent years, perovskite solar cells using an organic-inorganic perovskite compound having a perovskite structure with lead, tin, etc. as a central metal in a photoelectric conversion layer have attracted attention. Generally, in the production of solar cells, there is a process of cutting a part of an electrode and a photoelectric conversion layer provided on a substrate and patterning the substrate. Patent Document 1 discloses a method of patterning a solar cell by a laser.

[0003] Japanese Patent Application Laid-Open No. 2019-067914

[0004] Perovskite solar cells need to perform several hundred patterning processes. In order to improve productivity, multiple laser processing heads may be arranged for processing, but there is a limit to the number of laser processing heads provided from the perspective of the space of the laser processing machine. Therefore, a method of irradiating a laser multiple times by reciprocating the workpiece has been sometimes adopted. However, the process of reciprocating the workpiece takes time, so there is room for improvement in productivity.

[0005] An object of the present disclosure is to provide a laser processing apparatus, a laser processing method, a program, and a non-transitory computer-readable medium with improved processing efficiency.

[0006] A laser processing apparatus according to one embodiment of the present disclosure is a laser processing apparatus that performs laser processing on a long, strip-shaped workpiece by irradiating the workpiece with laser light while transporting the workpiece in a transport direction along the longitudinal direction of the workpiece, comprising: a transport device for transporting the workpiece in the transport direction; a laser device including a laser light source for emitting laser light and a scanning unit for scanning the laser light emitted from the laser light source; and a control device for controlling the transport device and the laser device, wherein the control device comprises a transport control device for controlling the transport of the transport device and a laser control device for controlling the laser device, the transport control device controls the transport device so that the transport device transports the workpiece continuously in the transport direction oriented in one direction, and the laser control device performs a first scan in which, in the emission state with the laser light emitted from the laser light source, the irradiation position of the laser light on the workpiece during transport is scanned in a direction along the transport direction of the workpiece, thereby forming a laser processing line of a predetermined length on the workpiece. In a non-emitting state in which the laser light source is not emitted, the laser device is controlled to alternately repeat a first movement, which involves moving the target irradiation position of the laser light onto the workpiece being transported in a direction intersecting the transport direction of the workpiece, and positioning the target irradiation position of the laser light at the starting position of the next first scan, thereby forming a first group of laser processing lines of a predetermined length, arranged in a predetermined number of parallel positions in a direction intersecting the transport direction.

[0007] Furthermore, a laser processing method according to one embodiment of the present disclosure is a laser processing method in which a long, strip-shaped workpiece is transported in a transport direction along the longitudinal direction of the workpiece and laser light is irradiated onto the workpiece to perform laser processing, comprising: a first scanning step in which, in an emission state in which the laser light is emitted, the irradiation position of the laser light onto the workpiece being transported is scanned in a direction along the transport direction of the workpiece to form a laser processing line of a predetermined length on the workpiece; and a first moving step in which, in a non-emission state in which the laser light is not emitted, the target irradiation position of the laser light onto the workpiece being transported is moved in a direction intersecting the transport direction of the workpiece to position the target irradiation position of the laser light at the starting position of the next first scanning, wherein the first scanning step and the first moving step are repeated alternately to form a first group of laser processing lines in which a predetermined number of laser processing lines of a predetermined length are arranged in a positional relationship parallel to each other in a direction intersecting the transport direction.

[0008] This disclosure provides a laser processing apparatus, a laser processing method, a program, and a non-temporary computer-readable medium that improve processing efficiency.

[0009] Figure 1 is a schematic diagram of a laser processing apparatus according to this embodiment. Figure 2 is a diagram showing an example of a scanning unit according to this embodiment. Figure 3 is a diagram showing an example of a workpiece on which a laser-processed line has been formed by the laser processing apparatus according to this embodiment. Figure 4 is a diagram showing the laser processing method by the laser processing apparatus according to this embodiment. Figure 5 is a diagram showing the laser processing method by the laser processing apparatus according to this embodiment. Figure 6 is a diagram showing a workpiece on which a laser-processed line has been formed by the processing method according to the second embodiment. Figure 7 is a diagram showing the laser processing method by a laser processing apparatus according to another embodiment of this disclosure. Figure 8 is a diagram showing the laser processing method by a laser processing apparatus according to another embodiment of this disclosure. Figure 9 is a diagram showing a laser processing apparatus according to another embodiment of this disclosure.

[0010] Embodiments of the present invention will be described below with reference to the drawings. Note that the dimensions of the components shown in these drawings may differ from the actual dimensions of the components for the sake of explanation.

[0011] The laser processing apparatus 1 according to this disclosure will be described with reference to Figures 1 and 2. Figure 1 is a schematic diagram of the laser processing apparatus 1 according to this embodiment. In this embodiment, the laser processing apparatus 1 that performs laser processing on a long, strip-shaped workpiece W will be described. The workpiece W is, for example, a thin film or a thin plate-shaped resin member. The workpiece W is, for example, a single layer film or a plurality of films laminated together. Alternatively, the workpiece W may be a film on which a resin or metal coating has been formed. The film is, for example, a plastic film, and the material can be polyimide or the like. The laser processing apparatus 1 according to this disclosure can be used, for example, in the manufacturing process of a perovskite solar cell, in the process of patterning a long, strip-shaped substrate used for a perovskite solar cell.

[0012] As shown in Figure 1, the laser processing apparatus 1 comprises a laser device 2, a transport device 3, and a control device 4.

[0013] The laser device 2 is a device capable of irradiating laser light L. The laser device 2 includes a laser light source 20 and a scanning unit 30. The laser light source 20 can emit laser light L. The laser light source 20 can emit at least one of a nanosecond laser, a picosecond laser, or a femtosecond laser. The scanning unit 30 can scan the laser light L emitted from the laser light source 20 in any direction on the surface of the workpiece W.

[0014] Figure 2 shows an example of the scanning unit 30 according to this embodiment. In this embodiment, the scanning unit 30 is a galvanometer optical system. The scanning unit 30 can scan the laser light L emitted from the laser light source 20 in any direction. As shown in Figure 2, the scanning unit 30 includes an X-axis galvanometer scanner 31, a Y-axis galvanometer scanner 32, and a focusing lens 33.

[0015] The X-axis galvanometer scanner 31 includes an X-axis galvanometer mirror 31a and an X-axis galvanometer motor 31b. The X-axis galvanometer mirror 31a is fixed to the output shaft of the X-axis galvanometer motor 31b. By driving the X-axis galvanometer motor 31b, the orientation of the X-axis galvanometer mirror 31a changes.

[0016] The Y-axis galvanometer scanner 32 also includes a Y-axis galvanometer mirror 32a and a Y-axis galvanometer motor 32b. The Y-axis galvanometer mirror 32a is fixed to the output shaft of the Y-axis galvanometer motor 32b. By driving the Y-axis galvanometer motor 32b, the orientation of the Y-axis galvanometer mirror 32a changes.

[0017] The laser light L emitted from the laser light source 20 is reflected by the X-axis galvanometer mirror 31a and the Y-axis galvanometer mirror 32a, then focused by the focusing lens 33, and guided to the workpiece W.

[0018] Returning to Figure 1, the conveying device 3 has a pair of rollers 50. As the rollers 50 rotate, the workpiece W is continuously fed from one roller 50 to the other roller 50 along the conveying direction D shown in Figure 1.

[0019] The control device 4 controls the laser device 2 and the transport device 3. The control device 4 includes a laser control device 41 capable of controlling the laser device 2 and a transport control device 42 capable of controlling the transport device 3. The laser control device 41 can control the laser light source 20 and the scanning unit 30. More specifically, the laser control device 41 can control the on and off of the emission of laser light L emitted from the laser light source 20. The laser control device 41 can also control the X-axis galvanometer motor 31b and the Y-axis galvanometer motor 32b, and by changing the angles of the X-axis galvanometer mirror 31a and the Y-axis galvanometer mirror 32a, the irradiation position of the laser light L can be changed. The transport control device 42 can control the rotational speed of the rollers 50 in the transport device 3. The transport control device 42 can control the transport speed of the workpiece W by controlling the rotational speed of the rollers 50.

[0020] The control device 4 includes a processor such as an ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array), or general-purpose CPU (Central Processing Unit). Although not shown in the diagram, the laser processing device 1 is also equipped with memory. The memory includes, for example, a ROM (Read Only Memory) in which various control programs are stored, and a RAM (Random Access Memory) in which various control data is temporarily stored. The processor of the control device 4 loads data specified from the various control programs stored in the ROM onto the RAM and controls various operations of the laser processing device 1 in cooperation with the RAM. The ROM contains a program that, when executed by the CPU, performs the laser processing method described in detail below.

[0021] In this embodiment, non-temporary computer-readable media may be used as memory. Non-temporary computer-readable media refers to any type of physical memory (RAM, ROM, etc.) that can store information and data that a processor can read. Non-temporary computer-readable media can store instructions related to execution processes by one or more processors. The term "non-temporary computer-readable media" includes tangible items but excludes carrier waves and temporary signals (i.e., it refers to non-temporary items). Examples of non-temporary computer-readable media include magnetic recording media (e.g., flexible disks, magnetic tapes, hard disk drives), magneto-optical recording media (e.g., magneto-optical disks), CD-ROMs (Read Only Memory), CD-Rs, CD-R / Ws, and semiconductor memories (e.g., mask ROMs, PROMs (Programmable ROMs), EPROMs (Erasable PROMs), flash ROMs).

[0022] <First Embodiment> Next, laser processing by the laser processing apparatus 1 according to the first embodiment will be described with reference to Figures 3 to 5.

[0023] First, the processing lines processed by the laser processing apparatus 1 will be explained using Figure 3. Figure 3 is a diagram showing an example of a workpiece W on which laser processing lines 100 have been formed by the laser processing apparatus 1 according to this embodiment. In the following explanation, the direction that intersects the transport direction D of the workpiece W will be referred to as the width direction H. As shown in Figure 3, in this example, multiple laser processing lines 100 extend along the transport direction D on the workpiece W. These laser processing lines 100 are provided in multiple parallel lines with predetermined intervals in the width direction H. Here, "parallel" includes cases where they are not strictly parallel. For example, two laser processing lines 100 may intersect at an angle of 15 degrees or less. In the example shown in Figure 3, n laser processing lines 100 are provided from one end to the other in the width direction H of the workpiece W, in the order of the first laser processing line 101, the second laser processing line 102, and so on, up to the nth laser processing line 100n. Here, n is any natural number. A group of laser processing lines 1000 is formed by combining the first laser processing lines 101 to the nth laser processing line 100n, which are arranged in the width direction H.

[0024] Next, an example of a method for processing a laser-processed line 100 using the laser processing apparatus 1 according to this disclosure will be described in detail with reference to Figures 4 and 5. In Figures 4 and 5, the processed area is shown as a processed region 150 with hatching. In the example shown in Figures 4 and 5, the workpiece W being laser-processed is shown enlarged for explanatory purposes. The width dimension of the laser-processed line 100 is, for example, 10 μm to 500 μm. Figures 4 and 5 show the workpiece W that is approximately within the irradiable range of the laser beam L by the scanning unit 30 of the laser processing apparatus 1.

[0025] Figure 4 shows the processing of the first laser processing line 101 at one end in the width direction H. As shown in Figure 4, the laser processing apparatus 1 processes a laser processing line 100 of a predetermined length P on the workpiece W by scanning the irradiation position K of the laser beam L with respect to the workpiece W. In this example, the scanning direction A of the irradiation position of the laser beam L coincides with the transport direction D of the workpiece W. In this example, the length of the laser processing line 100 is obtained by multiplying the speed difference between the scanning speed of the irradiation position K and the transport speed of the workpiece W by the emission time of the laser beam L. Therefore, the length of the laser processing line 100 is adjusted to a predetermined length P by adjusting the scanning speed, transport speed and emission time. In this example, the scanning speed of the irradiation position K is set to be faster than the transport speed of the workpiece W.

[0026] (First Scanning Step) The laser processing apparatus 1 according to the present disclosure first performs a first scan in which, with the laser beam L emitted, the irradiation position K of the laser beam L on the workpiece W being transported is scanned in a direction along the transport direction D of the workpiece W. By the first scan, the laser processing apparatus 1 processes a laser processing line 100 from an arbitrary starting point S to an ending point E on the workpiece W, thereby forming a first laser processing line 101. The starting point S11 and ending point E11 of the first scan are arbitrarily set within the irradiation range of the irradiation position K of the laser beam L by the scanning unit 30. In this way, a first laser processing line 101 of a predetermined length P from the starting point S11 to the ending point E11 is formed.

[0027] (First Movement Process) Figure 5 shows the state after the first scan is completed. When the first scan is completed, the laser processing apparatus 1 stops emitting the laser beam L and performs a first movement in which the target irradiation position KT is moved in a direction intersecting the transport direction D of the workpiece W. The target irradiation position KT is the position on the workpiece W that would be irradiated by the laser beam L if the laser light source 20 were to emit the laser beam L. In the example shown in Figure 5, as the first movement, the laser processing apparatus 1 moves the target irradiation area KT from the end point E11 of the first laser processing line 101 to the starting point S12 of the second laser processing line 102, while keeping the laser light source 20 in a non-emitting state without emitting the laser beam L.

[0028] The laser processing apparatus 1 alternately repeats the first scanning and the first movement described above to form n laser processing lines 100 of a predetermined length P as shown in Figure 3, thereby forming a group of laser processing lines 1000.

[0029] Note that the starting point S11 of the first laser processing line 101 and the starting point S12 of the second laser processing line 102 do not necessarily have to be at the same position in the transport direction D. Similarly, the ending point E11 of the first laser processing line 101 and the ending point E12 of the second laser processing line 102 do not necessarily have to be at the same position in the transport direction. Also, the lengths of the first laser processing line 101 and the second laser processing line 102 may be different.

[0030] Thin-film solar cells, such as perovskite solar cells, require the processing (patterning) of hundreds of processing lines on the substrate during the manufacturing process. Conventionally, it was known that when performing the above-mentioned processing on a workpiece, multiple processing heads with fixed laser beam irradiation positions were installed in a laser processing device. However, with this method, the number of processing heads required increases as the number of processing lines to be processed on the workpiece increases, and there was a limit to the number of processing heads that could be installed given the size of the device.

[0031] Based on the above background, a device and method have been devised that enables the aforementioned processing while reducing the number of processing heads by winding the workpiece onto a roller and transporting it in a reciprocating motion toward the laser processing machine. However, the process of moving the workpiece back and forth is time-consuming, and the processing device becomes large, making it difficult to integrate into a production line, and there is room for improvement in productivity.

[0032] The laser processing apparatus 1 according to this disclosure repeats the following steps: first scan, in an emission state with laser light L emitted from the laser light source 20, scans the irradiation position K of the laser light L on the workpiece W being transported in a direction along the transport direction D of the workpiece W to form a laser processing line 100 of a predetermined length on the workpiece W; first move, in a non-emission state with no laser light L emitted from the laser light source 20, moves the target irradiation position KT of the laser light L on the workpiece W being transported in a direction intersecting the transport direction D of the workpiece W, and positions the target irradiation position KT of the laser light L at the starting position of the next first scan.

[0033] <Second Embodiment> Up to this point, the laser processing apparatus 1 according to the first embodiment has been described, but the laser processing apparatus 1 according to this disclosure is not limited thereto. For example, the laser processing apparatus 1 may transport the workpiece W after or during processing the n laser processing lines 100 as described above, and process the workpiece so that the laser processing lines 100 are further extended upstream in the transport direction D from the processed laser processing lines 100.

[0034] This makes it possible to form a laser processing line that is longer in the transport direction D than the irradiation range of the laser beam L by the scanning unit 30. The processing method according to the second embodiment of the present invention will be explained with reference to Figures 6 to 8.

[0035] Figure 6 shows a workpiece W into which a laser-processed line 200 has been processed by the processing method according to the second embodiment. As shown in Figure 6, the workpiece W has a laser-processed line 200 extending in the transport direction D. The length of the laser-processed line 200 in the transport direction D is longer than the length in the direction along the transport direction D within the irradiation range of the laser beam L by the scanning unit 30. In this embodiment, the laser-processed line 200 is divided into m laser-processed lines in the transport direction D and processed. The length of each of the m divided laser-processed lines in the transport direction D is shorter than the length in the direction along the transport direction D within the irradiation range of the laser beam L by the scanning unit 30. Furthermore, each of the m divided laser-processed lines is processed so that adjacent endpoints and starting points in the transport direction are connected.

[0036] In the example shown in Figure 6, the first laser processing line group formed at the downstream end of the transport direction D is denoted as 1001, the second laser processing line group formed upstream of the first laser processing line group 1001 in the transport direction D and extending from the first laser processing line group 1001 is denoted as 1002, and the mth laser processing line group formed is denoted as 1000m.

[0037] First, similar to the first embodiment described above, a first scan and a first movement are performed to form the first laser processing line group 1001. After forming the first laser processing line group 1001, a second scan is performed as shown in Figure 7. Figure 7 shows the process of performing the second scan on the workpiece W after processing the first laser processing line group 1001. For explanatory purposes, in Figures 7 and 8, the areas processed by the laser beam L are shown as processed areas 150 with hatching, and the hatching pattern differs from that shown in Figures 4 and 5.

[0038] (Second scanning step) As shown in Figure 7, the laser processing apparatus 1 performs a second scan by emitting laser light L and scanning the irradiation position K of the laser light L in a direction along the transport direction D of the workpiece W, thereby forming a laser processing line 100 of a predetermined length P on the workpiece W. The second scan is performed upstream of the position where the first group of laser processing lines 1001 was formed on the workpiece W during transport (left side of the paper in Figure 7). This forms the first laser processing line 121 which is included in the second group of laser processing lines 1002.

[0039] Since the workpiece W is continuously transported by the transport device 3, after the first laser processing line group 1001 is formed, the area to be processed by the second laser processing line group 1002 enters the irradiation range of the laser device 2, and the second laser processing line group 1002 becomes processable. When the workpiece W is transported to a position where the second laser processing line group 1002 becomes processable, the laser control device 41 starts the second scan.

[0040] (Second movement step) Next, as shown in Figure 8, the laser processing apparatus 1, in its second movement, with the laser light source 20 in a non-emitting state where it does not emit laser light L, moves the target irradiation position KT of the laser light L on the workpiece W being transported in a direction intersecting the transport direction D of the workpiece W, and positions the target irradiation position KT of the laser light L at the starting position of the next second scan.

[0041] The laser processing apparatus 1 controls the laser device 2 to alternately repeat these second scans and second movements, thereby forming a second group of laser processing lines 1002 in which a predetermined number (n lines) of laser processing lines 100 of a predetermined length L are arranged in a direction (width direction H) that intersects with the transport direction D and are parallel to each other.

[0042] Note that the laser processing apparatus 1 controls at least one of the irradiation position K and the target irradiation position KT of the laser beam L by the laser device 2 such that the end (starting point S11) on the upstream side (left side of the paper surface in FIG. 8) in the conveyance direction D of each laser processing line 101 to 100n included in the first laser processing line group 1001 is connected to the end (ending point E21) on the downstream side (right side of the paper surface) in the conveyance direction D of each laser processing line 121 to 120n included in the second laser processing line group 1002. By repeating the process from the first scan to the second movement in this way, the m-th laser processing line group 1000m including n laser processing lines 100 can be formed from the first laser processing line group 1001 including n laser processing lines 100. Further, since the ending point and the starting point of the laser processing lines 100 adjacent to each other in the conveyance direction D are connected, n laser processing lines 100 that are longer in the conveyance direction D than the irradiation range of the laser beam L by the scanning unit 30 as a whole can be formed.

[0043] Note that the starting point S in the second scan is set on the upstream side in the conveyance direction D from the ending point E of the laser processing line 100 of the first laser processing line group 1001. In the example shown in FIG. 7, the ending point E21 is set so that the first laser processing line 101 formed in the first scan and the first laser processing line 121 formed in the second scan overlap by a length P1. Note that the starting point S may be set so that a part of the first laser processing line 121 overlaps the first laser processing line 101, and the length P1 of the overlapping part is not particularly limited.

[0044] Here, the method for determining the ending point E in the second scan will be described in detail. In this method, the laser processing apparatus 1 further includes an imaging device 5. The imaging device 5 images the processed area 150 of the workpiece W and outputs imaging data to the control device 4. Note that the imaging range of the imaging device 5 is wider than the area on the workpiece W where the laser device 2 can irradiate the laser beam. In the present embodiment, the imaging device 5 is a camera. Note that the mode of the imaging device 5 is not limited to a camera as long as the processed area 150 in the workpiece W can be discriminated. For example, the imaging device 5 may be a sensor or the like that detects the processed area 150.

[0045] The starting point S in the second scan is determined based on the imaging data acquired by the laser control device 41 from the imaging device 5. During the second scan, the imaging device 5 images the area where the laser device 2 can irradiate the laser beam L and transmits the imaging data to the laser control device 41. The laser control device 41 identifies the starting point S of the corresponding laser processing line 100 in the processing line group located one downstream in the conveying direction D among the processing line groups including the laser processing line 100 to be processed next.

[0046] For example, in the example shown in FIG. 8, while the laser processing device 1 is processing the first laser processing line group 1001, the end point E22 of the second laser processing line 122 included in the second laser processing line group 1002 to be processed next is determined based on the imaging data acquired by the imaging device 5. Specifically, the laser control device 41 identifies the position of the starting point S12 of the second laser processing line 102 included in the first laser processing line group 1001 based on the imaging data. Next, the laser control device 41 sets the end point E22 of the second laser processing line 122 included in the second laser processing line group 1002 downstream of the starting point S12 in the conveying direction D and performs the second scan toward the set end point E22. In the example shown in FIG. 8, the end point E22 of the second laser processing line 122 is set downstream of the starting point S12 of the second laser processing line 102 by a length P2 in the conveying direction D.

[0047] Note that the starting point S where the laser beam L is irradiated in the second scan is obtained by inverse calculation from the position of the end point E and the length of the laser processing line 100 to be processed. For example, in the example shown in FIG. 8, after determining the end point E22 of the second laser processing line 122, the starting point S22 of the second laser processing line 122 may be determined upstream (left side of the paper surface) by a predetermined length P along the conveying direction D from the end point E22.

[0048] According to the above-described configuration, it is possible to process a long laser processing line 200 extending in the conveying direction D on the workpiece W without reciprocating the workpiece W.

[0049] Furthermore, it is preferable that the time required to form a group of laser-processed lines, each consisting of N laser-processed lines 100 of a predetermined length P, by repeating the first scan and the first movement, or by repeating the second scan and the second movement, is shorter than the time required for the transport device 3 to transport the workpiece W by a predetermined length P. In other words, if the predetermined length of the laser-processed line 100 is P, the scanning speed of the laser beam is V1, the number of laser-processed lines 100 in the laser-processed line group is N, and the transport speed of the workpiece W of the transport device 3 is V2, then it is preferable that each parameter is set to satisfy the relationship (P × N) / V1 ≤ P / V2. Rearranging the above inequality gives V1 / V2 ≥ N. In other words, it is preferable that the above parameters are set such that the ratio of the scanning speed V1 to the transport speed V2 is greater than or equal to the value N, which is the number of laser-processed lines 100 (laser-processed lines 200) included in the laser-processed line group 1000.

[0050] Furthermore, in the example described above, the scanning direction of the laser beam L was set to the same direction as the transport direction of the workpiece, but this disclosure is not limited to this. For example, the scanning direction of the laser beam may be set to the opposite direction to the transport direction of the workpiece. In this case, the laser control device 41 identifies the endpoint E of the corresponding laser processing line 100 (laser processing line 200) in the laser processing line group 1000 one step downstream in the transport direction D of the laser processing line group 1000 that includes the laser processing line 100 to be processed next, based on the imaging data acquired from the imaging device 5 during the second scan. The laser control device 41 sets the starting point S of the laser processing line 100 to be processed downstream of the identified endpoint E and starts processing.

[0051] Although other embodiments of the present disclosure have been described above, the configuration of the present disclosure is not limited to the above-described forms. For example, the laser processing apparatus 1 may be configured to irradiate the laser beam L so as to trace the laser-processed line 100 that has been processed once or more times. In other words, the laser processing apparatus 1 may be configured to rewind the workpiece W, which has a laser-processed line 100 formed on it in the transport direction D that is longer than the irradiable range of the laser beam L, onto the roller 50 by repeating the first scanning to second movement process, and then irradiate the processed laser-processed line again so as to trace it, thereby increasing the degree of processing of the laser-processed line 100. With this configuration, a laser-processed line suitable for the film structure of a perovskite solar cell can be formed.

[0052] Furthermore, multiple laser devices may be arranged in a direction intersecting the transport direction D of the workpiece W. Figure 9 shows a laser processing apparatus 1A having multiple laser devices 2A. In the example shown in Figure 9, the laser device 2A has multiple laser devices (first laser device 2A1, second laser device 2A2, third laser device 2A3, and fourth laser device 2A4). The laser processing apparatus 1A is responsible for processing the laser processing line group 1000 that is processed on the workpiece W by the multiple laser devices 2A. In the example shown in Figure 9, the laser processing line group 1000 is divided into four regions along the width direction H of the workpiece W: first group 1000A, second group 1000B, third group 1000C, and fourth group 1000D. The laser processing apparatus 1A can process the first group 1000A with the first laser device 2A1, process the second group 1000B with the second laser device 2A2, process the third group 1000C with the third laser device 2A3, and process the fourth group 1000D with the fourth laser device 2A4.

[0053] With the above configuration, the processing of the laser processing line group 1000 can be shared among multiple laser devices 2A, thus shortening the time required for processing the entire laser processing line group 1000.

[0054] The number of laser devices 2A provided in the above embodiment is not particularly limited. Furthermore, the way in which the processing of the laser processing line group 1000 is divided among the multiple laser devices 2A is not limited to the above configuration.

[0055] While embodiments of this disclosure have been described above, it goes without saying that the technical scope of this disclosure should not be interpreted restrictively by the description of these embodiments. These embodiments are merely examples, and it will be understood by those skilled in the art that various modifications to the embodiments are possible within the scope of the invention described in the claims. The technical scope of this disclosure should be determined based on the scope of the invention described in the claims and the scope of its equivalents.

[0056] This application is based on Japanese Patent Application No. 2024-184084, filed on 18 October 2024, the contents of which are incorporated herein by reference.

Claims

1. A laser processing apparatus for performing laser processing on a long, strip-shaped workpiece by irradiating it with laser light while transporting it in a transport direction along the longitudinal direction of the workpiece, comprising: a transport device for transporting the workpiece in the transport direction; a laser device including a laser light source for emitting laser light and a scanning unit for scanning the laser light emitted from the laser light source; and a control device for controlling the transport device and the laser device, wherein the control device comprises: a transport control device for controlling the transport of the transport device; and a laser control device for controlling the laser device, wherein the transport control device controls the transport device so that the transport device transports the workpiece continuously in the transport direction oriented in one direction; and the laser control device performs a first scan in which, in the emission state with the laser light emitted from the laser light source, the irradiation position of the laser light on the workpiece during transport is scanned in a direction along the transport direction of the workpiece, thereby forming a laser processing line of a predetermined length on the workpiece. A laser processing apparatus that controls the laser device to alternately repeat the following: moving the target irradiation position of the laser beam onto the workpiece being transported in a direction intersecting the transport direction of the workpiece, and moving the target irradiation position of the laser beam to the starting position of the next first scan, in a non-emitting state in which the laser beam is not emitted from the laser light source; and a first movement in which the target irradiation position of the laser beam is positioned, so as to form a first group of laser processing lines of a predetermined length, arranged in a predetermined number of parallel positions in a direction intersecting the transport direction.

2. The laser control device controls the laser device to alternately repeat the following: a second scan in the output state, at a position upstream in the transport direction from the position where the first laser processing line group is formed on the workpiece being transported, to scan the irradiation position of the laser beam in a direction along the transport direction of the workpiece, thereby forming a laser processing line of a predetermined length on the workpiece; and a second move in the non-output state, to move the target irradiation position of the laser beam on the workpiece being transported in a direction intersecting the transport direction of the workpiece, to position the target irradiation position of the laser beam at the starting position of the next second scan, thereby forming a second laser processing line group in which a predetermined number of laser processing lines of a predetermined length are arranged in a positional relationship parallel to each other in a direction intersecting the transport direction, and the laser control device also controls the laser device to alternately repeat the following: The laser processing apparatus according to claim 1, wherein at least one of the irradiation position and the target irradiation position of the laser beam by the laser device is controlled such that the upstream end in the transport direction of each laser processing line included in the first laser processing line group and the downstream end in the transport direction of each laser processing line included in the second laser processing line group are connected.

3. The laser processing apparatus according to claim 2, wherein the transport device is controlled by the transport control device and the laser device is controlled by the laser control device so that the formation of the second laser processing line group is repeated.

4. The laser processing apparatus according to any one of claims 1 to 3, wherein the scanning unit includes a galvanometer optical system having a galvanometer mirror.

5. The laser processing apparatus according to any one of claims 1 to 4, wherein the laser light source is capable of irradiating at least one of a nanosecond laser, a picosecond laser, or a femtosecond laser.

6. The laser processing apparatus according to any one of claims 1 to 5, wherein the scanning speed V1 for scanning the irradiation position of the laser beam in a direction along the transport direction of the workpiece, the transport speed V2 of the workpiece by the transport device, and the number N of laser processing lines arranged in a direction intersecting the transport direction of the workpiece are set to satisfy the inequality V1 / V2 ≥ N.

7. The laser processing apparatus according to any one of claims 1 to 6, wherein a plurality of laser devices are arranged in a direction intersecting the transport direction of the workpiece.

8. A laser processing apparatus according to any one of claims 1 to 7, comprising a camera capable of imaging at least a region on the workpiece that can be irradiated with the laser light.

9. The laser processing apparatus according to claim 8, wherein, based on image data captured by the camera, the starting point of the irradiation position of the laser beam on the workpiece where scanning of the laser beam begins, or the ending point of the irradiation position of the laser beam on the workpiece where scanning of the laser beam ends, is set.

10. A laser processing method for performing laser processing on a long, strip-shaped workpiece by irradiating it with laser light while transporting it in a transport direction along the longitudinal direction of the workpiece, comprising: a first scanning step in which, in an emission state in which the laser light is emitted, the irradiation position of the laser light on the workpiece being transported is scanned in a direction along the transport direction of the workpiece to form a laser processing line of a predetermined length on the workpiece; and a first moving step in which, in a non-emission state in which the laser light is not emitted, the target irradiation position of the laser light on the workpiece being transported is moved in a direction intersecting the transport direction of the workpiece to position the target irradiation position of the laser light at the starting position of the next first scanning step, wherein the first scanning step and the first moving step are repeated alternately to form a first group of laser processing lines in which a predetermined number of laser processing lines of a predetermined length are arranged in a positional relationship parallel to each other in a direction intersecting the transport direction.

11. The laser processing method comprises: a second scanning step in which, in the emission state, the irradiation position of the laser beam is scanned in a direction along the transport direction of the workpiece at a position upstream in the transport direction of the workpiece from the position where the first laser processing line group is formed on the workpiece while it is being transported, thereby forming a laser processing line of a predetermined length on the workpiece; and a second moving step in which, in the non-emission state, the target irradiation position of the laser beam on the workpiece while it is being transported is moved in a direction intersecting the transport direction of the workpiece, thereby positioning the target irradiation position of the laser beam at the starting position of the next second scanning step, wherein the second scanning step and the second moving step are repeated alternately to form a second laser processing line group in which a predetermined number of laser processing lines of a predetermined length are arranged in a positional relationship parallel to each other in a direction intersecting the transport direction. The laser processing method according to claim 10, wherein at least one of the irradiation position and the target irradiation position of the laser beam is controlled such that the upstream end in the transport direction of each laser processing line included in the first laser processing line group and the downstream end in the transport direction of each laser processing line included in the second laser processing line group are connected.

12. The laser processing method according to claim 11, wherein the formation of the second laser processing line group is repeatedly performed on the workpiece.

13. The laser processing method according to claim 12, further comprising performing the processing method according to claim 12 once or more times on each of the laser processing lines formed on the workpiece by the laser processing method according to claim 12, so as to trace each of the laser processing lines.

14. A program that causes a control device to execute the laser processing method according to any one of claims 10 to 13.

15. A non-temporary computer-readable medium on which the program described in claim 14 is recorded.

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