Electronic device comprising antenna

Abstract

This electronic device may comprise: a conductive portion forming a part of a side surface of the electronic device; a wireless communication circuit; a printed circuit board (PCB) on which the wireless communication circuit is disposed; a radio frequency (RF) line structure disposed on a plurality of layers of the PCB and electrically connected to the wireless communication circuit; and a contact member for electrically connecting the RF line structure and the conductive portion. The RF line structure may comprise: a first conductive line disposed on a first layer of the plurality of layers of the PCB; a second conductive line disposed on a second layer; a first conductive via penetrating between the first layer and the second layer and coupled to a first portion of the first conductive line and a second portion of the second conductive line; and a second conductive via penetrating between the first layer and the second layer and coupled to a third portion of the first conductive line and a fourth portion of the second conductive line.

Description

Electronic device including an antenna

[0001] The present disclosure relates to an electronic device comprising an antenna.

[0002] An electronic device may transmit a signal through an antenna or receive a signal through an antenna. For example, the electronic device may include a conductive part. The conductive part may operate as a radiator of an antenna for transmitting and / or receiving a signal.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include: a conductive portion forming at least a portion of the side of the electronic device; a wireless communication circuit; a printed circuit board (PCB) comprising a plurality of layers on which the wireless communication circuit is disposed; a radio frequency (RF) line structure disposed on the plurality of layers of the PCB and electrically connected to the wireless communication circuit; and a contact member disposed on the PCB and for electrically connecting the RF line structure and the conductive portion. The RF line structure may include a first conductive line disposed on a first layer among the plurality of layers of the PCB; a second conductive line disposed on a second layer among the plurality of layers of the PCB; a first conductive via penetrating between the first layer and the second layer and coupled to a first portion of the first conductive line and a second portion of the second conductive line; and a second conductive via penetrating between the first layer and the second layer and coupled to a third portion of the first conductive line and a fourth portion of the second conductive line.

[0005] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include: a conductive portion used as an antenna radiator for a plurality of frequency bands; a printed circuit board (PCB) comprising at least one insulating layer and a plurality of metal layers, wherein the PCB includes an RF line structure for transmitting a radio frequency (RF) signal to the conductive portion; a wireless communication circuit disposed on a ground region in which at least some of the plurality of metal layers of the PCB overlap with the at least one insulating layer; an impedance matching circuit disposed on the PCB and connected to the RF line structure; and a contact member disposed on the PCB for electrically connecting the impedance matching circuit and the conductive portion. The RF line structure may be disposed in a region of the PCB between the ground region and the conductive portion, such that, among the plurality of metal layers, only the RF line structure overlaps with the at least one insulating layer. The RF line structure may include a plurality of conductive lines disposed on the plurality of metal layers of the PCB; and a plurality of conductive vias for connecting each of the conductive lines.

[0006] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include: a conductive portion; a wireless communication circuit; a printed circuit board (PCB) comprising a ground area for the wireless communication circuit and a fill-cut area formed between the ground area and the conductive portion; a radio frequency (RF) line structure formed in the fill-cut area of ​​the PCB and electrically connected to the wireless communication circuit; and a contact member for electrically connecting the RF line structure and the conductive portion. The RF line structure may include conductive lines comprising conductive lines disposed in each of at least two layers of a plurality of layers of the PCB; a first conductive via coupled to each of the conductive lines; and a second conductive via coupled to each of the conductive lines.

[0007] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include: a conductive portion used as an antenna radiator for a plurality of frequency bands; a wireless communication circuit; a printed circuit board (PCB) comprising a first region including a ground for the wireless communication circuit and a second region in which a metal layer is fill-cut at least partially between the first region and the conductive portion; an RF line structure formed in the second region for transmitting a radio frequency (RF) signal to the conductive portion; an impedance matching circuit disposed on the PCB and connected to the RF line structure; and a contact member disposed on the PCB for electrically connecting the impedance matching circuit and the conductive portion. The RF line structure may include conductive lines comprising conductive lines disposed in each layer of a plurality of layers of the PCB; and conductive vias for connecting each of the conductive lines.

[0008] Figure 1 is a block diagram of an electronic device in a network environment.

[0009] Figure 2 shows an example of an electronic device including a conductive part.

[0010] FIG. 3a shows an example of an electronic device comprising conductive lines disposed on multiple layers of a printed circuit board (PCB).

[0011] FIG. 3b shows an example of an electronic device comprising conductive lines disposed on multiple layers of a PCB.

[0012] Figures 4a and 4b show examples of antennas using a multilayer RF (radio frequency) line structure.

[0013] Figure 4c shows an example of a multilayer RF line structure.

[0014] Figure 4d shows an example of the inductance of a multilayer RF line structure.

[0015] Figure 4e shows an example of the performance of an antenna using a multilayer RF line structure.

[0016] Figure 4f shows an example of a Smith chart for an antenna using a multilayer RF line structure.

[0017] Figures 5a and 5b show examples of antennas using a multilayer RF line structure.

[0018] Figures 6a, 6b, 6c, 6d, and 6e show examples of antennas using a multilayer RF line structure.

[0019] Figure 7a shows an example of a conductive pattern of a multilayer RF line structure.

[0020] Figure 7b shows an example of the impedance of a multilayer RF line structure.

[0021] Figures 8a and 8b show examples of the performance of a multilayer RF line structure.

[0022] Figures 9a, 9b, and 9c show examples of the performance of a multilayer RF line structure.

[0023] FIGS. 10a, FIGS. 10b, and FIGS. 10c show examples of contact members having multiple contacts.

[0024] FIG. 11 shows an example of a contact member having multiple contacts.

[0025] FIG. 12 shows an example of the performance of a contact member having multiple contacts.

[0026] FIGS. 13a, FIGS. 13b, FIGS. 14a, and FIGS. 14b illustrate examples of the performance of a contact member having multiple contacts.

[0027] FIGS. 15a, FIGS. 15b, and FIGS. 15c show examples of the performance of antennas using a multilayer RF line structure and a metal-insulator-metal stacked structure.

[0028] Figure 16 shows an example of a flexible printed circuit board (FPCB) using a multilayer RF line structure.

[0029] Figure 17 shows an example of an FPCB using a multilayer RF line structure.

[0030] FIGS. 18a, FIGS. 18b, and FIGS. 18c show examples of foldable-type electronic devices.

[0031] FIGS. 19a, FIGS. 19b, FIGS. 19c, FIGS. 20a, and FIGS. 20b show examples of foldable-type electronic devices.

[0032] Figures 21a and 21b show examples of foldable-type electronic devices.

[0033] FIGS. 22a, FIGS. 22b, FIGS. 22c, FIGS. 23a, and FIGS. 23b show examples of foldable-type electronic devices.

[0034] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0035] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0036] Terms referring to components of an electronic device used in the following description (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), PBA (printed board assembly), module, antenna element, circuit, processor, chip, component, or device), terms referring to components of an antenna (e.g., antenna radiator, radiator, conductive part, conductive line pattern, coil, conductive member, radiating member, radiating material, radiating component, antenna structure, antenna structure, feed part, feed member, RF (radio frequency) line, RF line structure, connecting member, connecting part, or contact member), terms referring to the location of a component (e.g., part, location, region, or point), terms referring to the shape of a component (e.g., structure, structure, support, contact, or flange, or protrusion), terms referring to connections between structures (e.g., connection, connecting part, contact, contact part, support, support part, connecting structure, support structure, contact structure, conductive member, conductive pad, conductive pattern, or assembly), open structure Terms referring to (e.g., slot, slit, or opening), terms referring to circuits (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, or combiner), etc. are examples provided for convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Additionally, terms such as '...part', '...device', '...object', or '...body' used below may refer to at least one shape structure or a unit that processes a function.

[0037] Additionally, in this disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to including at least one of "C" or "D," i.e., {"C", "D", "C" and "D"}.

[0038] Figure 1 is a block diagram of an electronic device in a network environment.

[0039] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0040] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0041] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0042] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0046] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0047] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0048] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0052] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0054] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0057] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0058] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0059] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] FIG. 2 shows an example of an electronic device (e.g., electronic device (101)) including a conductive part.

[0062] Referring to FIG. 2, in one embodiment, the electronic device (101) may include a metal frame (200). For example, the metal frame (200) may include a plurality of conductive parts. For example, the metal frame (200) may include a conductive part (201) and a conductive part (203). A non-conductive part may be disposed between each conductive part (e.g., conductive part (201) or conductive part (203)). The non-conductive part may be visible externally. For example, a non-conductive part (202) may be formed in the space between the conductive part (201) and the conductive part (203). The non-conductive part (202) may be referred to as a segment for separating the two conductive parts. The non-conductive part (202) may be visible externally. According to one embodiment, the conductive part (203) may be used as a radiator for an antenna. The electronic device (101) can transmit or receive a signal through the conductive part (203). In order to use the conductive part (203) as a radiator, a structure for feeding an RF signal (hereinafter referred to as a feeding structure) may be arranged on the conductive part (203).

[0063] The electronic device (101) may include a PCB (250). The PCB (250) may include a plurality of layers. The PCB (250) may include a ground region (251). When the PCB (250) is viewed in one direction (e.g., the (-)z-axis direction), the ground region (251) may represent an area formed with a conductive portion (e.g., a copper portion) to provide ground for one or more electronic components (e.g., a wireless communication circuit (220)) of the electronic device (101). For example, the conductive portion may be configured to be connected to the wireless communication circuit (220) to provide ground. For example, in the ground region (251), at least some of the plurality of layers of the PCB (250) may include a copper layer to provide ground and / or transmit a signal. An insulating layer (e.g., a pre-impregnated (PPG)) may be placed between the copper layers. In the ground area (251), a copper layer and an insulating layer may be laminated together. A circuit corresponding to the copper portion may be formed in the ground area (251) of the PCB (250). For example, a chip, device, and / or component for an electronic device (101) may be placed on the ground area (251). For example, a wireless communication circuit (220) (e.g., a communication module (190)) may be placed on the ground area (251). At least a portion of the wireless communication circuit (220) may be placed in the ground area (251) of the PCB (250). The wireless communication circuit (220) may include, for example, an RF transceiver and / or an RFFE (radio frequency front end) module. A portion of the wireless communication circuit (220) may be referred to as a feed circuit in terms of providing antenna feed. For example, the feed circuit may be referred to as a feed section as a source for antenna feed. As a non-limiting example, the wireless communication circuit (220) may include an RF switching circuit connected to an RFFE module.For example, the output port of the RF switching circuit can be referred to as a feed section as a source of an RF signal. The feed section can provide a signal to a conductive part (203) through a feed structure.

[0064] The PCB (250) may include a signal region (253) for transmitting a signal from a feed portion to a radiator (e.g., a conductive portion (203)). When the PCB (250) is viewed in one direction (e.g., the (-)z-axis direction), the signal region (253) may not overlap with a ground region (251). For example, the signal region (253) may be located outside the ground region (251) that overlaps with the at least one insulating layer and the at least one ground layer. According to one embodiment, the signal region (253) may be a region used to transmit a signal to a metal frame (200) (e.g., a conductive portion (203)). The PCB (250) may include a plurality of layers. The PCB (250) may include at least one insulating layer and a plurality of metal layers (e.g., copper layers). The metal layers include a layer used for transmitting a signal (hereinafter, signal transmission layer) and a layer on which a ground plane is formed (hereinafter, It may include a ground layer. The metal layers may include one or more signal transmission layers and / or one or more ground layers. In the PCB (250), the ground region (251) may represent a portion of the signal transmission layer that overlaps with the at least one insulating layer and the at least one ground layer. In other words, when the circuit board (250) is viewed in one direction (e.g., the (-)z-axis direction), the ground region (251) may represent a region where a conductive portion (e.g., a copper portion) is formed to transmit the ground of one or more electronic components (e.g., a wireless communication circuit (220))) of the electronic device (101). On the other hand, in the circuit board (250), the signal region (253) may represent a region where only the layer for signal transmission (e.g., an RF line structure) overlaps with the at least one insulating layer. In other words, in the signal region (253), the at least one insulating layer may not overlap with the ground layer.In the signal area (253), the at least one insulating layer may not overlap with other parts of the metal layers, excluding the RF line structure. The signal area (253) may be referred to by various terms. In terms of overlapping only with the insulating layer, the signal area (253) may be referred to by non-copper area, non-ground area, clearance area, ground clearance area, ground keep-out area, ground void area, RF clearance area, ground relief area, and / or equivalent technical terms. The signal area (253) may represent an area between the metal frame (200) (e.g., conductive portion (203)) and the ground area (251) of the PCB (250) where the conductive portion of the ground area (251) (e.g., copper portion to provide ground) is removed. In terms of being removed, the signal area (253) may be referred to by fill-cut area, copper removal area, keep-out area, cut-out area, and / or equivalent technical terms. However, the use of these terms is not interpreted as limiting the manufacturing process or implementation method of the circuit board (250). The signal area (253) may not include a metal portion (e.g., a copper portion) for ground. In the signal area (253), the PCB (250) may include insulating layers (e.g., dielectric layers) without the copper portions.

[0065] According to embodiments of the present disclosure, a feed structure may be arranged in the signal area (253) of the PCB (250) to feed an RF signal from a wireless communication circuit (220) on the ground area (251) to a conductive part (203) that functions as an antenna radiator. To efficiently transmit the RF signal to the conductive part (203) (e.g., impedance matching, reduction of signal induction in the signal line, or reduction of loss), a feed structure in the signal area (253) may be utilized. According to embodiments of the present disclosure, the electronic device (101) may include an RF line structure (e.g., RF line structure (231), or RF line structure (235)) as a component of the feed structure. The RF line structure may include conductive lines. For example, when the PCB (250) is viewed in one direction (e.g., the (-)z-axis direction), the signal area (253) may not contain a metal part (e.g., a copper part) other than an RF line structure (e.g., an RF line structure (231), or an RF line structure (235)). In other words, the signal area (253) may substantially not have a copper part other than an RF line structure. The conductive lines may be used for signal transmission in the signal area (253). The conductive lines may be stacked in the direction in which the layers of the PCB (250) are stacked (e.g., the z-axis direction). For example, a plurality of insulating layers may be stacked in the signal area (253), and conductive lines may be placed in some of the regions of the plurality of insulating layers. The RF line structure (e.g., an RF line structure (231) and an RF line structure (235)) may be structurally placed within the PCB (250). The arrangement of the above conductive lines is described through FIGS. 3a and FIGS. 3b.

[0066] According to one embodiment, the electronic device (101) may include an impedance matching circuit (233). An RF line structure (231), an impedance matching circuit (233), and / or an RF line structure (235) may be formed in a signal area (253). The impedance matching circuit (233) may connect the RF line structure (231) and the RF line structure (235). A feed path comprising the RF line structure (231), the impedance matching circuit (233), and the RF line structure (235) may be used for signal transmission. The impedance matching circuit (233) may include one or more lumped elements. For example, the impedance matching circuit (233) may include at least one of an inductor, a capacitor, and / or a resistor. The RF line structure (e.g., RF line structure (231) and / or RF line structure (235)) may provide inductance in the signal path. Each element of the impedance matching circuit (233) can be used for impedance matching together with the RF line structure (e.g., RF line structure (231) and / or RF line structure (235)).

[0067] According to one embodiment, the electronic device (101) may include a contact member (240) (e.g., a C-clip). The contact member (240) may be electrically connected to an RF line structure (235). For example, the contact member (240) may be placed on one side of a PCB (250). The contact member (240) may include an elastic portion. While pressure is applied to the contact member (240), the contact member (240) may be positioned to contact a protrusion (213) of a conductive portion (203) or a component connected to the protrusion (213). Due to this contact, an RF signal may be provided to the conductive portion (203) through the RF line structure (231), the impedance matching circuit (233), and / or the RF line structure (235). The conductive portion (203) may radiate the RF signal.

[0068] As various types of services increase, antenna performance in relatively high frequency bands (e.g., WiFi bands from approximately 5.925 GHz to 7.125 GHz, UWB (ultra-wideband) bands from approximately 6.5 GHz to 8.25 GHz, and UHB (ultra-high band) bands above approximately 3 GHz (e.g., n77, n78, n79 bands)) is becoming a critical factor. High frequency characteristics can degrade RF performance, such as causing antenna mismatch and / or increased losses in transmission lines. While one approach to ensure sufficient antenna performance is to equip a separate antenna for the corresponding frequency band, it may not be easy to place a separate antenna on an electronic device due to spatial constraints. An RF line used as a feed path for RF signals can be understood as an inductor. As the length of the RF line increases, the inductance of the RF line (e.g., series inductance) may increase. Such an increase in inductance can significantly reduce antenna efficiency in high frequency bands and cause mismatch. For example, in high frequency bands, as the length of the RF line increases, the resonance point near 50 ohms on the Smith chart can rotate significantly and move closer to the open point. For example, even if a very small inductance of 1 nH or less is applied in the feed path, the matching characteristics can deteriorate significantly at frequencies above approximately 3 GHz.

[0069] To resolve the aforementioned problem, embodiments of the present disclosure describe a feed structure for securing antenna performance in the high-frequency band by reducing the effects of impedance mismatch in the high-frequency band. Various embodiments of the present invention describe an antenna feed structure for reducing the effects of inductance of an RF line (e.g., RF line structure (231), RF line structure (235)) used as a feed path.

[0070] In FIG. 2, a conductive portion (203) of a metal frame (200) is described as an example of a radiator of an antenna, but embodiments of the present disclosure are not limited thereto. The conductive portion (203) may be a different type of radiator. Any radiator connected to an RF line structure (e.g., RF line structure (231) and / or RF line structure (235))) may be referred to as a conductive portion (203). According to one embodiment, a patch radiator connected to the RF line structure may be understood as a type of conductive portion (203). As another example, a coil radiator connected to the RF line structure may be understood as a type of conductive portion (203).

[0071] In FIG. 2, when the PCB (250) is viewed in one direction (e.g., the (-)z-axis direction), the ground layer in the signal area (253) of the PCB (250) is shown as not having a ground layer, but in a not limited example, the ground layer of the PCB (250) may be positioned sufficiently spaced apart from the RF line structure on the z-axis.

[0072] FIG. 3a illustrates an example of an electronic device (e.g., electronic device (101)) comprising conductive lines disposed on multiple layers of a printed circuit board (PCB). The same reference numerals may be used to denote the same components and / or the same descriptions.

[0073] Referring to FIG. 3a, the electronic device (101) may include a feed circuit (320). The feed circuit (320) may correspond to a source for outputting an RF signal as a component of the wireless communication circuit (220). An RF signal in the communication frequency band may be output through the feed circuit (320). For example, the feed circuit (320) may be referred to as a feed section as a source for antenna feeding. For example, the feed circuit (320) may be a switching circuit for selecting a signal path. The output of the feed circuit (320) may correspond to an output port of the switching circuit. As an example not limited to, the feed circuit (320) may be an RFFE module (e.g., FEM (front end module), PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), or LPAMid (Low noise amplifier PAM including duplexer)), and the output of the feed circuit (320) may correspond to the output port of the RFFE module. For example, at least a portion of the feed circuit (320) may be placed on a first surface of the PCB (250) (e.g., a surface facing the (+)z-axis) in a ground area (e.g., ground area (251)).

[0074] The electronic device (101) may include an RF line structure (231) electrically connected to a power supply circuit (320). The electronic device (101) may supply an RF signal from the power supply circuit (320) to a conductive part (203) through the RF line structure (231), an impedance matching circuit (233), an RF line structure (235), and a contact member (240). The contact member (240) may be positioned to contact a protrusion (213) of the conductive part (203) (or a part connected to the protrusion (213)) while pressure in one direction (e.g., the (-)z-axis direction) is applied to the contact member (240). Due to this contact, an RF signal may be supplied to the conductive part (203) through the path of the RF line structure (231), the impedance matching circuit (233), and / or the RF line structure (235). The conductive portion (203) may be configured to radiate the RF signal. The RF line structure (231) and the RF line structure (235) may be placed in a fill-cut area (e.g., signal area (253)) of the PCB (250). The impedance matching circuit (233) may include at least one element (e.g., inductor, capacitor, or resistor) for impedance matching. For example, the at least one element may be placed on a second surface of the PCB (250) (e.g., a surface facing the (-)z-axis). For example, the impedance matching circuit (233) may be contained within the PCB (250) and implemented with the components of the PCB (250). The impedance matching circuit (233) may be electrically connected to a contact member (240). For example, the contact member (240) may be placed on a second surface of the PCB (250) (e.g., a surface facing the (-)z-axis).

[0075] According to one embodiment, to reduce the effect of the inductor as the length of the RF line increases, the RF line structure according to the embodiments of the present disclosure may include a parallel arrangement of inductors. According to one embodiment, the RF line structure may include a conductive line disposed on at least two layers of the PCB (250) and at least two conductive vias for connecting the conductive lines in parallel. The RF line structure (231) includes conductive lines (330) comprising conductive lines formed on a plurality of layers of the PCB (250), a first conductive via (341) coupled to the conductive lines (330), and a second conductive via (342) coupled to the conductive lines (330). In one embodiment, the conductive lines (330) may include conductive lines formed on each of the at least two layers of the PCB (250). The conductive lines (330) may be stacked in one direction (e.g., the (+)z-axis direction). For example, the conductive lines (330) may overlap when the PCB (250) is viewed in one direction (e.g., the (-)z-axis direction or the (+)z-axis direction). A conductive line connected to a first conductive via (341) and / or a second conductive via (342) may be understood as a signal path through which an RF signal from a wireless communication circuit (220) is transmitted. A conductive line connected to a first conductive via (341) and / or a second conductive via (342) may function as an inductor for the RF signal. The conductive lines stacked in one direction (e.g., the (+)z-axis direction) may be referred to as inductors connected in parallel. Each conductive line of the conductive lines (330) may include a first end closer to the ground area (251) (e.g., wireless communication circuit (220), or power supply circuit (320)) and a second end closer to the conductive part (203) among the ground area (251). The first ends of the conductive lines (330) may be connected to a first conductive via (341).The second ends of the conductive lines (330) may be connected to the second conductive via (342). According to one embodiment, the RF line structure (e.g., RF line structure (231) and RF line structure (235)) may be structurally disposed within the PCB (250). The conductive lines (330) may correspond to parts of the metal layers within the PCB (250). The first conductive via (341) and the second conductive via (342) may be structurally disposed within the PCB (250).

[0076] A single conductive line can be understood as an inductor. Since the inductors are arranged in one direction (e.g., z-axis direction) and the inductors are connected on one side through a first conductive via (341) and the inductors are connected on the other side through a second conductive via (342), the RF line structure (231) can be referred to as a circuit in which inductors are arranged in parallel. Due to the parallel arrangement of inductors, the magnitude of the composite inductance can be smaller than the inductance of a single inductor. Even if they have the same length on one plane (e.g., xy plane), the inductance of a structure in which conductive lines (330) are stacked on one axis (e.g., z-axis) can be smaller than the inductance of a single conductive line. Due to an RF line structure utilizing multiple layers of conductive lines (hereinafter referred to as a multilayer RF line structure), the influence of the inductor can be reduced. Even if the length of the RF line between the feed circuit (320) and the contact member (240) (e.g., the length when viewing the RF line structure (231) in one direction (e.g., the (-)z-axis direction)) increases, the impedance effect caused by the increase in the length of the RF line can be reduced. Relatively small impedance change can facilitate impedance matching for the conductive part (203) for multiple frequency bands. Antenna performance can be improved due to impedance matching.

[0077] FIG. 3b illustrates an example of an electronic device (e.g., electronic device (101)) comprising conductive lines disposed on multiple layers of a PCB. The same reference numerals may be used to denote the same components and / or the same descriptions.

[0078] Referring to FIG. 3b, the electronic device (101) may include a power supply circuit (320). The power supply circuit (320) may correspond to a source for outputting an RF signal as a component of the wireless communication circuit (220). For the power supply circuit (320), the descriptions of FIG. 3a may be referenced. The electronic device (101) may include an RF line structure (231) electrically connected to the power supply circuit (320). The electronic device (101) may supply the RF signal of the power supply circuit (320) to a conductive part (203) through the RF line structure (231), an impedance matching circuit (233), an RF line structure (235), and a contact member (240). For the RF line structure (231), the impedance matching circuit (233), the RF line structure (235), and / or the contact member (240), the descriptions of FIG. 3a may be referenced. According to one embodiment, the RF line structure (231) and the RF line structure (235) may be placed in a fill-cut area (e.g., a signal area (253)) of the PCB (250). According to one embodiment, the impedance matching circuit (233) may include at least one element (e.g., an inductor, a capacitor, or a resistor) for impedance matching. For example, the at least one element may be placed on a first surface of the PCB (250) (e.g., a surface facing the (+)z-axis). For example, the contact member (240) may be placed on a second surface of the PCB (250) (e.g., a surface facing the (-)z-axis).

[0079] To reduce the effect of inductors as the length of the RF line increases, the RF line structure according to embodiments of the present disclosure may include a parallel arrangement of inductors. For example, the RF line structure (231) may include conductive lines (330) including conductive lines formed on a plurality of layers among a plurality of layers of the PCB (250), a first conductive via (341) coupled to the conductive lines (330), and a second conductive via (342) coupled to the conductive lines (330). For the conductive lines (330), the first conductive via (341), and the second conductive via (342), reference may be made to the descriptions of FIG. 3a. In one embodiment, FIG. 3b, to further reduce the inductance effect caused by the RF line, the RF line structure (235) may also have a multilayer RF line structure. For example, the RF line structure (235) may include conductive lines (350) comprising conductive lines formed on a plurality of layers of the PCB (250), a third conductive via (361) coupled to the conductive lines (350), and a fourth conductive via (362) coupled to the conductive lines (350). The conductive lines (350) may include conductive lines formed on each of the at least two layers of the PCB (250). The conductive lines may be stacked in one direction (e.g., the (+)z-axis direction). A conductive line connected to the third conductive via (361) and / or the fourth conductive via (362) may be understood as a signal path through which an RF signal passing through the impedance matching circuit (233) is transmitted. The RF signal passing through the impedance matching circuit (233) can pass through the signal path of a conductive line connected to the third conductive via (361) and / or the fourth conductive via (362). The conductive line connected to the third conductive via (361) and / or the fourth conductive via (362) can function as an inductor for the RF signal.The conductive lines stacked in one direction (e.g., the (+)z-axis direction) may be referred to as inductors connected in parallel. Each conductive line of the conductive lines (350) may include a first end closer to the ground area (251) (e.g., a wireless communication circuit (220), or a power supply circuit (320)) and a second end closer to the conductive part (203) among the ground area (251) (251). The first ends of the conductive lines (350) may be coupled to a third conductive via (361). The second ends of the conductive lines (350) may be coupled to a fourth conductive via (362).

[0080] Inductance can be reduced due to the parallel arrangement of conductive lines (350) in RF line structure (231) as well as in RF line structure (235). Each conductive line of the conductive lines (350) can be understood as an inductor. Since the inductors are arranged in one direction (e.g., z-axis direction) and the inductors are connected on one side through a third conductive via (361) and the inductors are connected on the other side through a fourth conductive via (362), the RF line structure can be referred to as a circuit in which inductors are arranged in parallel. Due to the parallel arrangement of inductors, the magnitude of the combined inductance can be smaller than the inductance of a single inductor. Even if the length of the RF line connecting the feed circuit (320) and the contact member (240) (e.g., the length when viewing the RF line structure (235) in one direction (e.g., the (-)z-axis direction)) increases, the impedance effect caused by the increase in the length of the RF line can be reduced. Relatively small impedance change can facilitate impedance matching for the conductive part (203) for multiple frequency bands. Antenna performance can be improved due to impedance matching.

[0081] In FIG. 3a and 3b, an RF line structure in which a conductive line is disposed on each layer of a plurality of layers of the PCB (250) is illustrated, but embodiments of the present disclosure are not limited thereto. Any structure in which a conductive line corresponding to an inductor is disposed in parallel can be understood as an embodiment of the present disclosure. For example, a conductive line may be formed on at least two layers among the plurality of layers of the PCB (250). The conductive lines of at least two layers may be combined with a first conductive via (341) and a second conductive via (342). The first conductive via (341) may be disposed vertically from a first surface of the PCB (e.g., a surface facing the (+)z-axis). The first conductive via (341) may be disposed vertically to be connected to all of the at least two layers. The second conductive via (342) may be disposed vertically from a second surface of the PCB (e.g., a surface facing the (-)z-axis). The second conductive via (342) may be vertically positioned to be connected to both of the at least two layers. The conductive lines of the at least two layers may be referred to as inductors placed in parallel through the conductive vias (e.g., the first conductive via (341), the second conductive via (342)). The series inductance of the RF signal lines may be reduced due to the combined impedance.

[0082] In FIG. 3a and 3b, two conductive vias are illustrated for coupling conductive lines in one direction (e.g., z-axis direction) for parallel arrangement of inductors in each RF line structure, but embodiments of the present disclosure are not limited thereto. For example, an electronic device (101) may include three or more conductive vias for coupling conductive lines of an RF line structure in a vertical direction.

[0083] In FIGS. 3a and 3b, an example is illustrated in which the contact member (240) contacts a part of the conductive portion (203) (e.g., a protruding portion (213)), but embodiments of the present disclosure are not limited thereto. The contact member (240) may contact a separate component (e.g., a conductive pad, or a conductive pattern) connected to the conductive portion (203). Through such contact, an RF signal fed through the contact member (240) may be provided to the conductive portion (203). A contact structure using said component is described through FIGS. 4a and 4b.

[0084] In FIGS. 3a and 3b, a parallel arrangement of inductors in an RF line structure according to embodiments of the present disclosure is described to reduce the effect of the inductor as the length of the RF line increases. In FIGS. 3a and 3b, a structure in which conductive lines are stacked in the z-axis direction is described, but embodiments of the present disclosure are not limited thereto. In one embodiment, conductive lines may be arranged in one direction (e.g., x-axis direction) on a layer of the PCB (e.g., xy plane). For the parallel arrangement of the conductive lines, a first end of each conductive line may be connected to each other and a second end of each conductive line may be connected to each other. In the structure, unlike FIGS. 3a and 3b, a conductive via (e.g., a first conductive via (341), or a third conductive via (361)) for parallel arrangement may be omitted.

[0085] FIGS. 4a and 4b illustrate examples of antennas using a multilayer RF (radio frequency) line structure. The same reference numbers may be used to denote the same components and / or the same descriptions.

[0086] Referring to FIG. 4a, example (400a) illustrates a feed structure of an antenna. The electronic device (101) may include a PCB (250). The PCB (250) may include a ground area (251) and a signal area (253). The electronic device (101) may include a feed circuit (320). At least a portion of the feed circuit (320) may be placed on the ground area (251) of the PCB (250). The feed circuit (320) may be electrically connected to a processor (e.g., processor (120)). For example, the feed circuit (320) may include an RF switching circuit connected to a communication module (e.g., communication module (190), or RFFE module). The feed circuit (320) may be connected to an RF line structure (231) formed in the signal area (253) of the PCB (250). According to one embodiment, the electronic device (101) may include an RF line structure (e.g., RF line structure (231)) as a component of the feed structure. A feed path including the RF line structure (231), an impedance matching circuit (233), and the RF line structure (235) may be used for signal transmission. The RF line structure (235) may be connected to a contact member (240). In one embodiment, the electronic device (101) may include a conductive pad (413) coupled to a conductive portion (203) (or a protruding portion (213) of the conductive portion (203). For example, the conductive pad (413) may have an 'L' shape. A first portion of the conductive pad (413) may have a surface parallel to the xz plane. A second portion of the conductive pad (413) may have a surface parallel to the xy plane. A first portion of the conductive pad (413) can be combined with the conductive portion (203). A second portion of the conductive pad (413) can be in contact with the contact member (240). An RF signal transmitted through the power supply path can be provided to the conductive portion (203) through the contact member (240) and the conductive pad (413).

[0087] According to one embodiment, the RF line structure (231) may include conductive lines. In the signal area (253), the conductive lines may be used for signal transmission. The conductive lines may be stacked in the direction in which the layers of the PCB (250) are stacked (e.g., z-axis direction). For example, a plurality of insulating layers may be stacked in the signal area (253), and conductive lines may be placed in some of the regions of the plurality of insulating layers. Each of the conductive lines may correspond to an inductor. For parallel connection of inductors corresponding to the conductive lines, the RF line structure (231) may include a plurality of conductive vias. The plurality of conductive vias (e.g., a first conductive via (341)) may include a first set (431) of conductive vias and a second set (432) of conductive vias, distinguished according to the input and output of the RF line structure. A first set (431) of conductive vias may be positioned closer to the ground region (251) than to the conductive portion (203). A second set (432) of conductive vias may be positioned closer to the conductive portion (203) than to the ground region (251) than to the conductive portion (203). For example, an RF line structure (231) may include a first set (431) of conductive vias. The first set (431) of conductive vias may include a first conductive via (431a), a second conductive via (431b), a third conductive via (431c), and / or a fourth conductive via (431d). For example, an RF line structure (231) may include a second set (432) of conductive vias. The second set of conductive vias (432) may include a fifth conductive via (432a), a sixth conductive via (432b), a seventh conductive via (432c), and / or an eighth conductive via (432d).

[0088] Referring to FIG. 4b, example (400b) shows a view of the antenna feed structure of FIG. 4a in one direction (e.g., the (-)z-axis direction). The electronic device (101) may include an RF line structure (231) electrically connected to a feed circuit (320). The RF signal of the feed circuit (320) may be provided to a conductive part (203) through the RF line structure (231), an impedance matching circuit (233), an RF line structure (235), a contact member (240), and / or a conductive pad (413). In one embodiment, when the PCB (250) is viewed in one direction (e.g., the (-)z-axis direction), the RF line structure (231) may have a length (421) and a width (422). For example, the inductance of a single conductive line having a length (421) and a width (422) may be L1. The inductance of a structure in which single conductive lines having length (421) and width (422) are stacked in one direction (e.g., z-axis direction) may be L2. L2 may be smaller than L1. By efficiently stacking the conductive lines in the limited space of the PCB (250), the influence of the inductance due to the length of the RF line (e.g., length (421)) may be reduced. The description of the RF line structure (231) may be applied to the RF line structure (235) in the same or similar manner.

[0089] FIG. 4c shows an example of a multilayer RF line structure (e.g., RF line structure (231)). The same reference numbers may be used to denote the same components and / or the same descriptions.

[0090] Referring to FIG. 4c, the RF line structure (231) may include conductive lines (330) formed on each layer of a plurality of layers. For example, the conductive lines (330) of the RF line structure (231) may include 12 conductive lines. As an example, the conductive lines (330) may include a first conductive line (441), a second conductive line (442), a third conductive line (443), a fourth conductive line (444), a fifth conductive line (445), a sixth conductive line (446), a seventh conductive line (447), an eighth conductive line (448), a ninth conductive line (449), a tenth conductive line (450), an eleventh conductive line (451), and / or a twelfth conductive line (452).

[0091] According to one embodiment, each conductive line of the RF line structure (e.g., RF line structure (231), or RF line structure (235)) may have substantially the same shape. For example, each conductive line of the conductive lines (330) may have a shape of length (421) and width (422). For example, the length (421) may be about 2 mm. For example, but not limited to, the length (421) may be in the range of about 1.8 mm or more and less than about 2.2 mm. For example, the width (422) may be about 0.15 mm. For example, but not limited to, the width (422) may be in the range of about 0.135 mm or more and less than about 0.165 mm. Each conductive line of the conductive lines (330) may have a thickness (423). For example, the thickness (423) may be about 0.02 mm. As a non-limiting example, the thickness (423) may be in the range of about 0.018 mm or more and about 0.022 mm or less. Two adjacent conductive lines of the conductive lines (330) (e.g., the fifth conductive line (445) and the sixth conductive line (446)) may be spaced apart in one direction (e.g., the z-axis direction).

[0092] The shape of the conductive line may affect the inductance provided by the conductive line. For example, the longer the length of the conductive line, the greater the inductance. For example, the wider the width of the conductive line, the less the inductance. For example, the thicker the thickness of the conductive line, the less the inductance. An RF line structure according to embodiments of the present disclosure (e.g., RF line structure (231), or RF line structure (235)) may include a structure for arranging conductive lines to reduce the total inductance at a specific length of the RF line. If the width of each conductive line is increased, the inductance of each conductive line may decrease. Meanwhile, due to the increase in width, the space for other components or wiring to be placed on the PCB (250) may be reduced. In embodiments of the present disclosure, a feed structure comprising conductive lines stacked in a vertical direction (e.g., z-axis direction) instead of a horizontal direction (e.g., xy plane) may be used to effectively utilize space within the PCB (250) and reduce composite impedance.

[0093] FIG. 4d shows an example of the inductance of a multilayer RF line structure (e.g., RF line structure (231)).

[0094] Referring to FIG. 4d, graph (400d) represents inductance by frequency. The horizontal axis of graph (400d) represents frequency (unit: GHz), and the vertical axis of graph (400d) represents inductance value (unit: nH (nano henry)). Graph (400d) illustrates inductance that varies depending on how many conductive lines, exemplified in FIG. 4c, are stacked. The first line (401) represents the inductance of a single conductive line. The second line (402) represents the inductance of an RF line structure in which three conductive lines are stacked. The third line (403) represents the inductance of an RF line structure in which five conductive lines are stacked. The fourth line (404) represents the inductance of an RF line structure in which seven conductive lines are stacked. The fifth line (405) represents the inductance of an RF line structure in which nine conductive lines are stacked. The 6th line (406) represents the inductance of an RF line structure in which 12 conductive lines are stacked. It can be seen that as a larger number of conductive lines are stacked, the inductance of the RF line structure decreases.

[0095] FIG. 4e shows an example of the performance of an antenna using a multilayer RF line structure. The total efficiency can be used as the performance of the antenna. The total efficiency can represent the ratio of the power actually radiated to the total power transmitted by the antenna.

[0096] Referring to FIG. 4e, graph (400e) represents the overall efficiency by frequency. The horizontal axis of graph (400e) represents frequency (unit: GHz), and the vertical axis of graph (400e) represents the overall efficiency (unit: dB (decibel)). The first line (481) represents the overall efficiency in an ideal feed without RF lines. The second line (482) represents the overall efficiency of an antenna using an RF line structure having a single conductive line in a single layer. The width of each conductive line may be approximately 0.15 mm. The third line (483) represents the overall efficiency of an antenna using an RF line structure in which five conductive lines are stacked. The width of each conductive line may be approximately 0.15 mm. The fourth line (484) represents the overall efficiency of an antenna using an RF line structure in which nine conductive lines are stacked. The width of each conductive line may be approximately 0.15 mm. The 5th line (485) represents the overall efficiency of an antenna using an RF line structure in which 12 conductive lines are stacked, and the width of each of the 12 conductive lines may be approximately 0.15 mm. The 6th line (486) represents the overall efficiency of an antenna using an RF line structure in which 12 conductive lines are stacked, and the width of each of the 12 conductive lines may be approximately 0.5 mm.

[0097] Referring to graph (400e), it can be seen that as the number of stacked conductive lines increases, the overall efficiency of the antenna approaches the overall efficiency of the ideal feed. This is because the inductance corresponding to the length of the RF line decreases due to the stacked structure of the conductive lines. Even with the same RF line length, the change in impedance can be relatively small because the magnitude of the inductance affecting the signal feed path decreases. Additionally, by comparing the fifth line (485) and the sixth line (486) of graph (400e), it can be seen that the overall efficiency of the antenna increases as the width of the conductive line increases. This is because the inductance of the corresponding conductive line decreases as the width of each conductive line increases. The width of the conductive line of the RF line structure can be designed based on the arrangement of components within the PCB (250).

[0098] Figure 4f shows an example of a Smith chart for an antenna using a multilayer RF line structure.

[0099] Referring to FIG. 4f, the Smith chart (400f) represents impedance (in ohms) at different frequencies. The impedance represents a value normalized to 50 ohms and can be used to calculate the reflection coefficient (e.g., S11). Each concentric circle of the Smith chart (400f) may represent points where the real part of the impedance (e.g., the resistance part) is the same. Each line of the Smith chart (400f) represents impedance according to frequency change from a first frequency (490a) (e.g., about 5 GHz) to a second frequency (490b) (e.g., about 14 GHz). The first line (491) represents the impedance in an ideal feed without an RF line. The second line (492) represents the impedance of an antenna using an RF line structure having a single layer of one conductive line. The width of each conductive line may be about 0.15 mm. The third line (493) represents the impedance of an antenna using an RF line structure in which five conductive lines are stacked. The width of each conductive line may be approximately 0.15 mm. The fourth line (494) represents the impedance of an antenna using an RF line structure in which nine conductive lines are stacked. The width of each conductive line may be approximately 0.15 mm. The fifth line (495) represents the impedance of an antenna using an RF line structure in which twelve conductive lines are stacked, and the width of each of the twelve conductive lines may be approximately 0.15 mm. The sixth line (496) represents the impedance of an antenna using an RF line structure in which twelve conductive lines are stacked, and the width of each of the twelve conductive lines may be approximately 0.5 mm.

[0100] Referring to the Smith chart (400f), it can be seen that as the number of stacked conductive lines increases, the change in impedance in the high-frequency band decreases. Additionally, as the number of stacked conductive lines increases, it can be seen that the impedance is formed closer to the center point (499) (e.g., 1 ohm) for impedance matching. Even with the same RF line length, the magnitude of the inductance affecting the signal feed path decreases, so the change in impedance can be relatively small. Furthermore, by comparing the fifth line (495) and the sixth line (496) of the Smith chart (400f), it can be seen that the wider the width of the conductive line, the more the change in impedance decreases. This is because the wider the width of each conductive line, the smaller the inductance of that conductive line becomes. The width of the conductive line of the RF line structure can be designed based on the arrangement of components within the PCB (250).

[0101] FIGS. 5A and 5B illustrate examples of antennas using a multilayer RF line structure. The same reference numbers may be used to denote the same components and / or the same descriptions.

[0102] Referring to FIG. 5a, example (500a) illustrates a feed structure of an antenna. The electronic device (101) may include a PCB (250). The PCB (250) may include a ground area (251) and a signal area (253). The electronic device (101) may include a feed circuit (320). At least a portion of the feed circuit (320) may be placed on the ground area (251) of the PCB (250). The feed circuit (320) may be electrically connected to a processor (e.g., processor (120)). For example, the feed circuit (320) may include an RF switching circuit connected to a communication module (e.g., communication module (190), or RFFE module). The feed circuit (320) may be connected to an RF line structure (231) formed in the signal area (253) of the PCB (250). According to one embodiment, the electronic device (101) may include an RF line structure (231) as a component of the feed structure. A feed path including the RF line structure (231), an impedance matching circuit (233), and an RF line structure (235) may be used for signal transmission. The RF line structure (235) may be connected to a contact member (240). The electronic device (101) may include a conductive pad (413) coupled to a conductive portion (203) (or a protruding portion (213) of the conductive portion (203). For example, the conductive pad (413) may have an 'L' shape. For the conductive pad (413), the descriptions of FIG. 4a may be referenced.

[0103] According to one embodiment, the RF line structure (231) may include conductive lines (e.g., conductive lines (330), or conductive lines (350)). In the signal area (253), the conductive lines may be used for signal transmission of the PCB (250). The conductive lines may be stacked in the direction in which the layers of the PCB (250) are stacked (e.g., z-axis direction). For example, the RF line structure (231) and the RF line structure (235) may be used to reduce inductance in the feed structure. The RF line structure (231) may have a length (521) (e.g., y-axis length), a width (522) (e.g., x-axis length), and a thickness (523) (e.g., z-axis length). The RF line structure (231) may include a plurality of conductive lines (e.g., conductive lines (330)) stacked in one direction (e.g., z-axis direction). As a non-limiting example, to provide a lower inductance than that of the RF line structure (231) of example (400a), the RF line structure (231) of example (500a) may include conductive portions having a wider width (522). For example, the RF line structure (231) may have a width (522) of about 1 mm. As an example, the RF line structure (231) may include conductive lines formed on each of 12 layers. Each conductive line may have a width of about 1 mm. The RF line structure (235) may have a length (571) (e.g., y-axis length), a width (572) (e.g., x-axis length), and a thickness (573) (e.g., z-axis length). The RF line structure (235) may include a plurality of conductive lines (e.g., conductive lines (350)) stacked in one direction (e.g., z-axis direction). For example, the RF line structure (235) may include conductive lines having a width of about 1 mm. The thickness (573) of the RF line structure (235) may be substantially the same as the thickness (523) of the RF line structure (231). For example, the number of conductive lines stacked on the RF line structure (235) may be 12.The number of conductive lines stacked on the RF line structure (231) may be 12. As a non-limiting example, the thickness (573) of the RF line structure (235) may be different from the thickness (523) of the RF line structure (231). The number of conductive lines stacked on the RF line structure (235) may be different from the number of conductive lines stacked on the RF line structure (231).

[0104] Referring to FIG. 5b, example (500b) shows a view of the antenna feed structure of FIG. 5a in one direction (e.g., the (-)z-axis direction). The electronic device (101) may include an RF line structure (231) electrically connected to a feed circuit (320). The RF signal of the feed circuit (320) may be provided to a conductive part (203) through the RF line structure (231), an impedance matching circuit (233), an RF line structure (235), a contact member (240), and a conductive pad (413). When the PCB (250) is viewed in one direction (e.g., the (-)z-axis direction), the RF line structure (231) may have a length (521) and a width (522). For example, the inductance of a single conductive line having a length (521) and a width (522) may be L1. The inductance of a structure in which single conductive lines having length (521) and width (522) are stacked in one direction (e.g., z-axis direction) may be L2. L2 may be smaller than L1. When the PCB (250) is viewed in one direction (e.g., (-)z-axis direction), the RF line structure (235) may have length (571) and width (572). For example, the inductance of a single conductive line having length (571) and width (572) may be L3. The inductance of a structure in which single conductive lines having length (571) and width (572) are stacked in one direction (e.g., z-axis direction) may be L4. L4 may be smaller than L3. By efficiently stacking the conductive lines in the limited space of the PCB (250), the influence of the inductance due to the length of the RF line (e.g., length (521) or length (571)) may be reduced.

[0105] In FIGS. 5a and 5b, a feed structure comprising conductive lines in which both the RF line structure (231) and the RF line structure (235) are stacked is described. However, embodiments of the present disclosure are not limited thereto. According to one embodiment, the impedance matching circuit (233) and the feed circuit (320) are connected through a single layer of conductive lines of the RF line, and the RF line structure (235) between the impedance matching circuit (233) and the contact member (240) may have a multilayer RF line structure.

[0106] FIGS. 6a, FIGS. 6b, FIGS. 6c, FIGS. 6d, and FIGS. 6e illustrate examples of antennas using a multilayer RF line structure. The same reference numbers may be used to denote the same components and / or the same descriptions.

[0107] Referring to FIG. 6a, example (600a) illustrates a feed structure utilizing a multilayer RF line structure. An electronic device (101) may include a feed circuit (320). The feed circuit (320) may be connected to an RF line structure (231) formed in a signal area (253) of a PCB (250). According to one embodiment, the electronic device (101) may include an RF line structure (231) as a component of the feed structure. A feed path comprising an RF line structure (231), an impedance matching circuit (233), and an RF line structure (235) may be used for the transmission of an RF signal. The RF line structure (235) may be connected to a contact member (240). The RF signal may be provided to a conductive part (203) through the contact member (240) and a conductive pad (413). According to one embodiment, the RF line structure (231) may include conductive lines (e.g., conductive lines (330), conductive lines (350)). The conductive lines may be used in the signal area (253) for signal transmission of the PCB (250). The RF line structure (235) may include conductive lines formed on a single layer. For example, the conductive lines of the RF line structure (235) may be placed on a first surface of the PCB (e.g., a surface facing the (+)z-axis). An impedance matching circuit (233) may be placed between the RF line structure (231) and the RF line structure (235). At least one element of the impedance matching circuit (233) may be placed on the first surface of the PCB (250) (e.g., a surface facing the (+)z-axis). The RF line structure (235) may include vias (611). The conductive line of the RF line structure (235) can be connected to the contact member (240) through the via (611).

[0108] Referring to FIG. 6b, example (600b) illustrates a feed structure utilizing a multilayer RF line structure. An electronic device (101) may include a feed circuit (320). The feed circuit (320) may be connected to an RF line structure (231) formed in a signal area (253) of a PCB (250). According to one embodiment, the electronic device (101) may include an RF line structure (e.g., RF line structure (231), or RF line structure (235)) as a component of the feed structure. A feed path comprising an RF line structure (231), an impedance matching circuit (233), and an RF line structure (235) may be used for the transmission of an RF signal. The RF line structure (235) may be connected to a contact member (240). An RF signal may be provided to a conductive part (203) through the contact member (240) and a conductive pad (413).

[0109] According to one embodiment, the RF line structure (231) may include conductive lines (e.g., conductive lines (330)). Since the signal area (253) does not include a separate copper layer for signal transmission of the PCB (250), the conductive lines may be utilized. The conductive lines may have the same shape. For example, the shape of each conductive line may have a length (621) and a width (622) on a plane (e.g., the xy plane). The conductive lines may be stacked along an axis (e.g., the z-axis direction). As the conductive lines are stacked, the RF line structure (231) may have a thickness (623). According to one embodiment, the RF line structure (235) may include conductive lines. Since the signal area (253) does not include a separate copper layer for signal transmission of the PCB (250), the conductive lines may be utilized. The conductive lines may have the same shape. For example, the shape of each of the conductive lines may have a length (671) and a width (672) on a plane (e.g., the xy plane). The conductive lines may be stacked along an axis (e.g., the z-axis direction). As the conductive lines are stacked, the RF line structure (235) may have a thickness (673). As an example, but not limited to, the length (621), width (622), and / or thickness (623) of the RF line structure (231) may be independent of the length (671), width (672), and / or thickness (673) of the RF line structure (235), respectively.

[0110] According to one embodiment, the conductive lines (e.g., conductive lines (350)) of the RF line structure (235) may further include conductive lines disposed in different regions on a plane (xy plane) as well as conductive portions that are stacked. For example, the RF line structure (235) may include a first set of conductive lines (635a), a second set of conductive lines (635b), and / or a third set of conductive lines (635c). The first set of conductive lines (635a) may include conductive lines stacked in one direction (e.g., z-axis direction) on a first region of a plane (e.g., xy plane). The second set of conductive lines (635b) may include conductive lines stacked in one direction (e.g., z-axis direction) on a second region of a plane (e.g., xy plane). The second region may be different from the first region. The second region may be adjacent to the first region. A third set (635c) of conductive lines may include conductive lines stacked in one direction (e.g., z-axis direction) on a third region of one plane (e.g., xy plane). The third region may be different from the first region and the second region. The third region may be adjacent to the second region. The combined impedance of the conductive lines may be further reduced through parallel connections in the horizontal direction as well as parallel connections in the vertical direction.

[0111] Referring to FIG. 6c, example (600c) illustrates a feed structure utilizing a multilayer RF line structure. An electronic device (101) may include a feed circuit (320). According to one embodiment, the electronic device (101) may include an RF line structure (e.g., RF line structure (231), or RF line structure (235)) as a component of the feed structure. A feed path comprising an RF line structure (231), an impedance matching circuit (233), and an RF line structure (235) may be used for the transmission of an RF signal. The RF line structure (235) may be connected to a contact member (240). An RF signal may be provided to a conductive part (203) through the contact member (240) and a conductive pad (413). Unlike the structure in which each set of stacked conductive lines (e.g., conductive lines (330), conductive lines (350)) of example (600b) is arranged in parallel on the xy plane, in example (600c), each RF line structure may be implemented in block units. To provide a lower impedance than an RF line formed in a single layer as a path for transmitting an RF signal, the RF line structure may have a shape that is thickened in one direction (e.g., z-axis direction). For example, the first RF line structure (231) may include a conductive block having a length (631) and a width (632) on one plane (e.g., xy plane) and a thickness (633) on one axis (e.g., z-axis). For example, the second RF line structure (235) may include a conductive block having a length (681) and a width (682) on one plane (e.g., the xy plane) and a thickness (683) on one axis (e.g., the z-axis). As an example, but not limited to, the length (631), width (632), and / or thickness (633) of the conductive block of the RF line structure (231) may be independent of the length (681), width (682), and / or thickness (683) of the conductive block of the RF line structure (235), respectively.

[0112] Referring to FIG. 6d, example (600d) illustrates a feed structure utilizing a multilayer RF line structure. An electronic device (101) may include a PCB (250). The PCB (250) may include a ground area (251) and a signal area (253). The electronic device (101) may include a feed circuit (320). At least a portion of the feed circuit (320) may be placed on the ground area (251) of the PCB (250). The feed circuit (320) may be electrically connected to a processor (e.g., processor (120)). For example, the feed circuit (320) may be connected to an RF line structure (231) formed in the signal area (253) of the PCB (250). According to one embodiment, the electronic device (101) may include an RF line structure (e.g., RF line structure (231), or RF line structure (235)) as a component of the feed structure. A feed path comprising the RF line structure (231), an impedance matching circuit (233), and the RF line structure (235) may be used for the transmission of an RF signal. The RF line structure (235) may be connected to a contact member (240). The RF signal may be provided to a conductive part (203) through the contact member (240) and a conductive pad (413).

[0113] To provide a lower impedance than an RF line formed in a single layer as a path for transmitting an RF signal, the RF line structure (e.g., RF line structure (231), or RF line structure (235)) may have a shape that is thickened in one direction (e.g., z-axis direction). For example, the first RF line structure (231) may include a conductive block having a width (682d) on one plane (e.g., xy plane) and a plurality of conductive lines stacked on one axis (e.g., z-axis). According to one embodiment, the conductive lines of the RF line structure (231) (e.g., conductive lines (350)) may be formed across other layers (691) of the PCB (250), excluding the top layer (692). The layers (691) are layers placed below the top layer (692), for example, the conductive lines may be placed so as to be embedded within the PCB (250). The RF line structure (231) The top layer (692) may correspond to a wiring structure having a shape that escapes. To prevent and / or mitigate damage caused by external components (e.g., rear plate, rear structure) (e.g., cracks caused by pressing structures, damage caused by external electrical materials) and / or performance degradation (e.g., electromagnetic interference, interference caused by external electrical materials), the conductive lines may be formed in the layers (691). As an example, though not limited to, and not shown in FIG. 6d, the conductive lines may be formed in the layers (691), and a structure for electromagnetic shielding (e.g., a shield can) may be placed in the top layer (692).

[0114] Referring to FIG. 6e, example (600e) illustrates a feed structure utilizing a multilayer RF line structure. An electronic device (101) may include a PCB (250). The PCB (250) may include a ground area (251) and a signal area (253). The electronic device (101) may include a feed circuit (320). At least a portion of the feed circuit (320) may be placed on the ground area (251) of the PCB (250). The feed circuit (320) may be electrically connected to a processor (e.g., processor (120)). For example, the feed circuit (320) may be connected to an RF line structure (231) formed in the signal area (253) of the PCB (250). According to one embodiment, the electronic device (101) may include an RF line structure (e.g., RF line structure (231), or RF line structure (235)) as a component of the feed structure. A feed path comprising the RF line structure (231), an impedance matching circuit (233), and the RF line structure (235) may be used for the transmission of an RF signal. The RF line structure (235) may be connected to a contact member (240). The RF signal may be provided to a conductive part (203) through the contact member (240) and a conductive pad (413).

[0115] To provide a lower impedance than an RF line formed in a single layer as a path for transmitting an RF signal, the RF line structure (e.g., RF line structure (231), or RF line structure (235)) may have a shape that is thickened in one direction (e.g., z-axis direction). According to one embodiment, the first RF line structure (231) may include a conductive block comprising conductive lines having different widths. The conductive lines (693) of the conductive block may be stacked along one axis (e.g., z-axis). For example, the first RF line structure (231) may include conductive lines stacked in a pyramid shape. The width may become progressively wider from the upper layer to the lower layer. For example, the first RF line structure (231) may include a conductive block in which a conductive line corresponding to a first width (682e-1), a conductive line corresponding to a second width (682e-2) wider than the first width (682e-1), a conductive line corresponding to a third width (682e-3) wider than the second width (682e-2), and a conductive line corresponding to a fourth width (682e-4) wider than the third width (682e-3) are sequentially stacked. The width of the conductive line may provide an electrical characteristic (e.g., inductance) corresponding to the width. As the width of the conductive line is designed differently in each layer, the inductance required for the first RF line structure (231) may be provided within a limited space.

[0116] In the RF line structure according to the embodiments of the present disclosure, the composite impedance of the conductive lines can be further reduced through parallel connection in the horizontal direction as well as parallel connection in the vertical direction. For example, to efficiently utilize space within one plane (e.g., the xy plane) within the PCB (250) and to reduce the composite impedance, a feed structure (i.e., a hybrid structure) comprising conductive lines connected in parallel in the horizontal direction (e.g., the xy plane) and stacked in the vertical direction (e.g., the z-axis direction) may be used. For example, the RF line structure may include one conductive line placed on a first layer and two conductive lines placed in parallel on a second layer different from the first layer. Since the conductive lines are all electrically connected in parallel, the total composite impedance may be lower than the individual impedances.

[0117] FIG. 7a illustrates an example of a conductive pattern of a multilayer RF line structure. Identical reference numbers may be used to denote identical components and / or identical descriptions. In the RF line structure, the conductive lines may have various shapes in addition to the shape having a rectangular cross-section exemplified in the drawings described above. For example, as exemplified in FIG. 7a, they may have a shape having a polygon on one plane (e.g., the xy plane). As an example, but not limited to, the polygon may have a curved longitudinal direction on one plane.

[0118] Referring to FIG. 7a, example (700) illustrates a feed structure utilizing a multilayer RF line structure. An electronic device (101) may include a feed circuit (320). The feed circuit (320) may be connected to an RF line structure (231) formed in a fill-cut area (e.g., a signal area (253)) of a PCB (250). A feed path comprising an RF line structure (231), an impedance matching circuit (233), and an RF line structure (235) may be used for the transmission of an RF signal. For example, the impedance matching circuit (233) may include a first element (233a), a second element (233b), and a conductive line (237) for connecting the first element (233a) and the second element (233b). The first element (233a) may be an inductor, a capacitor, or a resistor. The second element (233b) may be an inductor, a capacitor, or a resistor. The first element (233a) may be connected to the RF line structure (231). The second element (233b) may be connected to the RF line structure (235). The RF line structure (235) may be connected to the contact member (240). An RF signal may be provided to the conductive part (203) through the contact member (240) and the conductive pad (413). According to one embodiment, the RF line structure (231) may include conductive lines (e.g., conductive lines (330)).

[0119] The RF line structure (231) may include conductive lines (e.g., conductive lines (330)) stacked in one direction (e.g., z-axis direction). For example, the RF line structure (231) may include a first conductive line (741), a second conductive line (742), a third conductive line (743), a fourth conductive line (744), and a fifth conductive line (745). The conductive lines of the RF line structure (231) may have substantially the same shape. Each of the conductive lines of the RF line structure (231) may include a first end adjacent to the feed circuit (320) and a second end adjacent to the impedance matching circuit (233) among the feed circuit (320) and the impedance matching circuit (233). The first end of the conductive lines of the RF line structure (231) can be coupled to the first conductive via (731). The second end of the conductive lines of the RF line structure (231) can be coupled to the second conductive via (732).

[0120] One conductive line (e.g., first conductive line (741)) can function as an inductor. For example, the shape of the first conductive line (741) may have a length (751), a width (752), and a thickness (753). The length (751), width (752), and thickness (753) can be used to determine the inductance of the first conductive line (741). The inductance may be proportional to the length of the wire, while being inversely proportional to the cross-sectional area. For example, as the length (751) increases, the inductance may increase. As the width (752) decreases, the inductance may increase. As the conductive lines are combined through conductive vias (e.g., first conductive via (731) and second conductive via (732)), the inductances of the inductors can be combined in a parallel connection structure. In a parallel connection structure, the combined inductance becomes smaller than the inductance of individual inductors, so the inductance of the RF line structure can be reduced.

[0121] Figure 7b shows an example of the impedance of a multilayer RF line structure.

[0122] Referring to FIG. 7b, graph (700b) represents inductance by frequency. The horizontal axis of graph (700b) represents frequency (unit: GHz), and the vertical axis of graph (700b) represents inductance value (unit: nH). Graph (700b) illustrates inductance that varies depending on how many conductive lines exemplified in FIG. 7a are stacked. For example, the length (751) of one conductive line may be about 1.3 mm. For example, the width (752) of one conductive line may be about 0.15 mm. For example, the thickness (753) of one conductive line may be about 0.02 mm. For example, when conductive parts are stacked, the width of the conductive via coupled with said conductive parts may be about 0.1 mm. The first line (791) represents the inductance of one conductive line. The second line (792) represents the inductance of an RF line structure in which three conductive lines are stacked. The third line (793) represents the inductance of an RF line structure in which five conductive lines are stacked. The fourth line (794) represents the inductance of an RF line structure in which seven conductive lines are stacked. The fifth line (795) represents the inductance of an RF line structure in which nine conductive lines are stacked. Through the graph (700b), it can be confirmed that the inductance decreases through the stacking of multiple conductive lines.

[0123] FIGS. 8a and 8b illustrate examples of the performance of a multilayer RF line structure. As such performance, the total efficiency of the antenna may be used. Total efficiency may represent the ratio of the power actually radiated to the total power transmitted by the antenna.

[0124] Referring to FIG. 8a, graph (800a) represents the overall efficiency by frequency. The horizontal axis of graph (800a) represents frequency (unit: MHz), and the vertical axis of graph (800a) represents the overall efficiency (unit: dB). The first line (801) represents the overall efficiency of the antenna when both the RF line structure (231) and the RF line structure (235) are single-layer conductive lines. The second line (802) represents the overall efficiency of the antenna using the RF line structure (231) and the RF line structure (235) of the example (500a) of FIG. 5a. Referring to graph (800a), it can be confirmed that the overall efficiency is improved through the RF line structure (231) and the RF line structure (235) in which multiple conductive lines are stacked.

[0125] Referring to FIG. 8b, the Smith chart (800b) represents impedance (in ohms) as a function of frequency. The impedance represents a value normalized to 50 ohms and can be used to calculate the reflection coefficient (e.g., S11). Each concentric circle of the Smith chart (800b) may represent points where the real part of the impedance (e.g., the resistance part) is the same. Each line of the Smith chart (800b) represents impedance as a function of frequency change from a first frequency (850a) (e.g., about 5 GHz) to a second frequency (850b) (e.g., about 14 GHz). The first line (851) represents impedance when both the RF line structure (231) and the RF line structure (235) are single-layer conductive lines. The second line (852) represents the impedance of a feed structure including the RF line structure (231) and RF line structure (235) of the example (500a) of FIG. 5a. Referring to the Smith chart (800b), it can be seen that the impedance is formed close to the center point (899) (e.g., 1 ohm) for impedance matching through the RF line structure (231) and RF line structure (235) in which a plurality of conductive lines are stacked. It can be seen that the change in impedance is relatively small because the magnitude of the inductance affecting the signal feed path is reduced even with the same RF line length.

[0126] RF line structures (e.g., RF line structure (231), or RF line structure (235)) and concentrated elements (e.g., inductors, or capacitors of the impedance matching circuit (233)), and / or contact structure(s) (e.g., contact member (240), or conductive pad (413)) located within a fill-cut area (e.g., signal area (253)) of the PCB (250) may be understood as components of an antenna. To achieve efficient impedance matching of a radiator (e.g., conductive portion (203)) for multiple frequency bands, it may be required to reduce the influence of structurally occurring inductance. To reduce the influence of structurally occurring inductance, the line structures according to embodiments of the present disclosure may include conductive lines stacked to reduce inductance.

[0127] FIGS. 9a, 9b, and 9c illustrate examples of the performance of a multilayer RF line structure. The same reference numbers may be used to denote the same components and / or the same descriptions.

[0128] Referring to FIG. 9a, in example (901), the electronic device (101) may include a power supply circuit (320), a first RF line (931), a second RF line (932), and a contact portion (940) (e.g., a contact member (240)). The first RF line (931) and the second RF line (923) may be formed on one layer of a PCB (e.g., a PCB (250)). The second RF line (923) may be connected to the contact member of the contact portion (940) through a via. The sum of the length of the first RF line (931), the length of the second RF line (923), and the length of the via may be approximately 4.5 mm.

[0129] In example (902) according to one embodiment of the present invention, the electronic device (101) may include a power supply circuit (320), an RF line structure (231), an RF line structure (235), and a contact portion (940) (e.g., a contact member (240)). According to one embodiment, the RF line structure (231) may include conductive lines disposed on at least two of the plurality of layers of the PCB (250) in a signal region (253) between the metal frame (200) and the ground region (251). The conductive lines may be stacked in one direction (e.g., the z-axis direction). Each of the conductive lines may be used as a path through which the RF signal of the power supply circuit (320) is transmitted. The RF signal may be provided to the RF line structure (235) through each conductive line. As a non-limiting example, an RF signal may be provided to an RF line structure (235) via an impedance matching circuit (e.g., an impedance matching circuit (233)). The RF line structure (235) may include conductive lines disposed on at least two of the multiple layers of the PCB (250) in a signal area (253) between the metal frame (200) and the ground area (251). The conductive lines may be stacked in one direction (e.g., z-axis direction). Each of the conductive lines may be used as a path through which the RF signal of the feed circuit (320) is transmitted. An RF signal may be provided to a contact member (240) through each conductive line. The sum of the length of the RF line structure (231) (e.g., length in the xy plane), the length of the RF line structure (235) (e.g., length in the xy plane), and the length of the via may be about 4.5 mm.

[0130] In example (903) according to one embodiment of the present invention, the electronic device (101) may include a power supply circuit (320), an RF line structure (231), an RF line structure (235), and a contact portion (940) (e.g., a contact member (240)). For the RF line structure (231), the RF line structure (235), and the contact portion (940), the descriptions of example (902) may be referenced. In example (903), the RF line structure (231) and the RF line structure (235) illustrated in FIG. 7a may be used. The distance between the power supply portion (e.g., the power supply circuit (320)) and the contact portion (e.g., the contact portion (940)) in example (903) may be shorter than the distance between the power supply portion and the contact portion in example (902). The required length of the RF line may be shortened. For example, the sum of the length of the RF line structure (231) on one plane (e.g., xy plane) and the length of the RF line structure (235) on one plane (e.g., xy plane) in example (903) may be shorter than the sum of the length of the RF line structure (231) on one plane (e.g., xy plane) and the length of the RF line structure (235) on one plane (e.g., xy plane) in example (902). For example, in example (903), the sum of the length of the RF line structure (231) (e.g., length on the xy plane), the length of the RF line structure (235) (e.g., length on the xy plane), and the length of the via may be about 2.9 mm.

[0131] Referring to FIG. 9b, graph (900b) represents the total radiation efficiency by frequency. The horizontal axis of graph (900b) represents frequency (unit: MHz), and the vertical axis of graph (900b) represents the total radiation efficiency (unit: dB). The first line (951) represents the total radiation efficiency in the feed structure of example (901). The second line (952) represents the total radiation efficiency in the feed structure of example (902). The third line (953) represents the total radiation efficiency in the feed structure of example (903). Referring to graph (900b), it can be confirmed that an RF line structure using multiple layers of conductive lines provides a higher total radiation efficiency than a single layer of conductive lines. Referring to graph (900b), it can be seen that the overall radiation efficiency increases as the distance between the feed section (e.g., feed circuit (320)) and the contact section (e.g., contact section (940)) decreases. For example, as the inductance due to the length of the RF line is reduced in the feed structure of example (903), impedance matching can be achieved better in the high frequency band (e.g., frequency band of about 3 GHz or higher) than in other structures (e.g., the feed structure of example (901) and the feed structure of example (902)) (in other words, the matching efficiency can be higher).

[0132] Referring to FIG. 9c, graph (900c) represents the reflection coefficient by frequency. The horizontal axis of graph (900c) represents frequency (unit: MHz), and the vertical axis of graph (900c) represents the reflection coefficient (unit: dB). The first line (971) represents the reflection coefficient in the feed structure of example (901). The second line (972) represents the reflection coefficient in the feed structure of example (902). The third line (973) represents the reflection coefficient in the feed structure of example (903). The lower the reflection coefficient, the less power loss there is and the more power can be transmitted. In other words, the lower the reflection coefficient, the higher the matching efficiency can be. Referring to graph (900c), it can be confirmed that an RF line structure using multiple layers of conductive lines has a lower reflection coefficient than a single layer of conductive lines. Referring to the graph (900c), it can be seen that the reflection coefficient decreases as the distance between the power supply part (e.g., power supply circuit (320)) and the contact part (e.g., contact part (940)) decreases.

[0133] FIGS. 10a, FIGS. 10b, and FIGS. 10c show examples of contact members (e.g., contact member (240)) having multiple contacts.

[0134] Referring to FIG. 10a, a contact member (240) according to one embodiment may include a support portion (1041), an elastic portion (1042), a connecting portion (1043), a first bending portion (1044), and a second bending portion (1045). The support portion (1041) may include a support surface for joining the contact member (240) to one side of a component (e.g., PCB (250)). The elastic portion (1042) may include a material having elasticity. The elastic portion (1042) may be formed by extending from the support portion (1041). The connecting portion (1043) may be connected to the elastic portion (1042) and spaced apart from the support surface of the support portion (1041). The connecting portion (1043) may be formed by extending from the elastic portion (1042). The first bending portion (1044) may be connected to the connecting portion (1043) and have a curved shape. For example, the connecting portion (1043) may be formed in a direction away from the supporting surface of the supporting portion (1041). The first bending portion (1044) may have a curved shape extending from the connecting portion (1043). The curved shape may be formed to face the supporting surface of the supporting portion (1041) after the bend. The second bending portion (1045) may be connected to the first bending portion (1044) and have a curved shape. For example, a part of the first bending portion (1044) may be formed in a direction facing the supporting surface of the supporting portion (1041). The second bend portion (1045) may extend from a portion of the first bend portion (1044) or be combined with a portion of the first bend portion (1044) to have a shape that is bent in a different direction from the said portion of the first bend portion (1044). The second bend portion (1045) may be combined, connected, or in contact with the said portion of the first bend portion (1044) and a portion of the connecting portion (1043). The bent shape may be formed to face the connecting portion (1043) (or the first bend portion (1044)) after the bend.

[0135] Referring to FIG. 10b, the contact member (240) may have multiple contacts when pressure is applied to the contact member (240). According to one embodiment, the first bend portion (1044) may be configured to contact a point of the support portion (1041) (e.g., the first contact (1081)) while pressure is applied to the contact member (240). According to one embodiment, the second bend portion (1045) may be configured to contact a point of the connecting portion (1043) (or the first bend portion (1044)) (e.g., the second contact (1082)) while pressure is applied to the contact member (240).

[0136] According to one embodiment, the contact member (240) may be disposed on one side of the PCB (250). The contact member (240) may make contact with a part (e.g., a protruding part (231)) of the conductive part (203) that functions as an antenna radiator of the metal frame (200) or a part connected to the conductive part (203) (e.g., a conductive pad (413)) through a pressing pressure (e.g., pressure in the z-axis direction). For example, a region of the first bend portion (1044) of the contact member (240) may make contact with a part (e.g., a protruding part (231)) of the conductive part (203) or a part connected to the conductive part (203) (e.g., a conductive pad (413)). Due to the contact, the contact member (240) may provide an RF signal to the conductive part (203). Upon contact, the contact member (240) may have multiple contacts. As the contact member (240) has multiple contacts, multiple paths for the RF signal may be formed in the contact member (240). For example, the multiple paths may include a first path (1071) using a support portion (1041), an elastic portion (1042), and a connecting portion (1043). For example, the multiple paths may include a second path (1072) using a support portion (1041) and a first bending portion (1044). Through the first contact (1081), the RF signal may flow directly from the support portion (1041) to the first bending portion (1044). For example, the multiple paths may include a third path (1073) using a support portion (1041) and a second bending portion (1045). Through the first contact (1081) and the second contact (1082), the RF signal can flow from the support portion (1041), through the second bend portion (1045), to the connection portion (1043) and the first bend portion (1044).

[0137] Referring to FIG. 10c, example (1050a) shows the arrangement of each component (e.g., support portion (1041), elastic portion (1042), connecting portion (1043), first bending portion (1044), and second bending portion (1045)) while a pressing pressure is applied to the contact member (240). Example (1050b) shows paths (e.g., first path (1071), second path (1072), or third path (1073)) using multiple contacts (e.g., first contact (1081), second contact (1082)) while a pressing pressure is applied to the contact member (240).

[0138] FIG. 11 illustrates an example of a contact member having multiple contacts. The same reference numerals may be used to denote the same components and / or the same descriptions. In FIG. 11, a contact member having four contacts is described.

[0139] Referring to FIG. 11, example (1100a) shows a contact member (1140). Example (1100a) shows the shape of the contact member (1140) when no pressure (e.g., pressure in the z-axis direction) is applied to the contact member (1140). The contact member (1140) may include a support portion (1041), an elastic portion (1042), a connecting portion (1043), a first bending portion (1044), a second bending portion (1045), and a third bending portion (1046). For the support portion (1041), the elastic portion (1042), the connecting portion (1043), the first bending portion (1044), and the second bending portion (1045), the description of FIG. 10a through FIG. 10c may be referenced. The third bend portion (1146) may be connected to the support portion (1041) and have a curved shape. For example, the third bend portion (1146) may be bent away from the support surface of the support portion (1041) and then bent again towards the support surface. As an example, the third bend portion (1146) may extend from one side of the support portion (1041) (e.g., the side opposite to the side to which the elastic portion (1042) is connected) in a 'C' shape or a 'G' shape. A portion of the third bend portion (1146) may be formed of an elastic material.

[0140] Example (1100b) illustrates the arrangement of each component (e.g., support portion (1041), elastic portion (1042), connecting portion (1043), first bend portion (1044), second bend portion (1045), and third bend portion (1146)) while a pressing pressure is applied to the contact member (1140). According to one embodiment, while a pressing pressure is applied to the contact member (1140), the third bend portion (1146) may come into contact with the support portion (1041). Due to the contact between the third bend portion (1146) and the support portion (1041), a third contact point (1183) may be formed. According to one embodiment, while a pressing pressure is applied to the contact member (1140), the third bend portion (1146) may come into contact with the first bend portion (1044). A fourth contact point (1184) can be formed due to contact between the third bending part (1146) and the first bending part (1044).

[0141] Example (1100c) illustrates paths (e.g., first path (1071), second path (1072), third path (1073), fourth path (1174), or fifth path (1175)) using multiple contacts (e.g., first contact (1081), second contact (1082), third contact (1183), or fourth contact (1184)) while a pressing pressure is applied to the contact member (1140). For the first path (1071), second path (1072), and third path (1073), the descriptions of FIGS. 10a through 10c may be referenced. The fourth path (1174) represents a path of an RF signal transmitted to the first bending part (1044) through the fourth contact (1184) along the third bending part (1146) extending from the support part (1041). The fifth path (1175) represents the path of an RF signal transmitted from the third contact (1183) in the support portion (1041) to the first bend portion (1044) through the fourth contact (1184) along the end of the third bend portion (1146).

[0142] FIG. 12 shows an example of the performance of a contact member having multiple contacts.

[0143] Referring to FIG. 12, graph (1200) represents the inductance by frequency. The horizontal axis of graph (400d) represents frequency (unit: GHz), and the vertical axis of graph (1200) represents the inductance value (unit: nH). Graph (1200) illustrates the inductance according to the structure of the contact member (240). The first line (1201) represents the inductance of the contact member (240) of FIG. 10a to FIG. 10c when the contact member without the second bending structure (1045) is pressed (e.g., when pressure is applied in the z-axis direction). Since there is no second bending structure (1045), only the first contact (1081) may be formed and the second contact (1082) may not be formed. For example, the number of contacts (e.g., first contact (1081)) of the contact member (1140) may be one. The number of paths (e.g., first path (1071), or second path (1072)) of the contact member (1140) may be two. The second line (1202) represents the inductance of the contact member (240) when the contact member (240) of FIGS. 10a to 10c is pressed (e.g., when pressure is applied in the z-axis direction). For example, the number of contacts (e.g., first contact (1081), or second contact (1082)) of the contact member (1140) may be two. The number of paths (e.g., first path (1071), second path (1072), or third path (1073)) of the contact member (1140) may be three. The third line (1203) indicates the inductance of the contact member (1140) when the contact member (1140) of FIG. 11 is pressed (e.g., when pressure is applied in the z-axis direction). For example, the number of contacts (e.g., first contact (1081), second contact (1082), third contact (1183), or fourth contact (1184)) of the contact member (1140) may be four.The number of paths of the contact member (1140) (e.g., first path (1071), second path (1072), third path (1073), fourth path (1174), or fifth path (1175)) may be five.

[0144] Referring to the graph (1200), it can be confirmed that the inductance decreases as the number of contacts increases. Referring to the graph (1200), it can be confirmed that the inductance decreases as the number of paths increases. As more contacts are formed within the contact member, the number of paths for transmitting RF signals can increase. It can be understood that as the number of paths increases, the number of parallel connections of inductors increases. Therefore, when pressure is applied to the contact member, the inductance of the contact member can decrease as the number of contacts increases.

[0145] FIGS. 13a, FIGS. 13b, FIGS. 14a, and FIGS. 14b illustrate examples of the performance of a contact member having multiple contacts (e.g., the contact member (240) of FIGS. 10a to 10c).

[0146] Referring to FIG. 13a, graph (1300a) represents the overall efficiency by frequency. The horizontal axis of graph (1300a) represents frequency (unit: MHz), and the vertical axis of graph (1300a) represents the overall efficiency (unit: dB). The first line (1301) represents the overall efficiency of an antenna using the RF line structure (231) and RF line structure (235) of the example (500a) of FIG. 5a. The second line (1302) represents the overall efficiency of an antenna when the contact member (240) described in FIG. 10a to FIG. 10c is used in the example (500a) of FIG. 5a. Referring to graph (1300a), it can be seen that the overall efficiency is improved due to an additional reduction in inductance through the contact member (240) of FIG. 10a to FIG. 10c.

[0147] Referring to FIG. 13b, the Smith chart (1300b) represents impedance (in ohms) as a function of frequency. The impedance represents a value normalized to 50 ohms and can be used to calculate a reflection coefficient (e.g., S11). Each concentric circle of the Smith chart (1300b) may represent points where the real part of the impedance (e.g., the resistance part) is the same. Each line of the Smith chart (1300b) represents impedance according to frequency change from a first frequency (1350a) (e.g., about 5 GHz) to a second frequency (1350b) (e.g., about 14 GHz). The first line (1351) represents the impedance of a feed structure including an RF line structure (231), an RF line structure (235), and a contact member having one contact point of the example (500a) of FIG. 5a. For example, the contact member having the above-mentioned contact may have a shape without the second bending structure (1045) in the contact member (240) of FIGS. 10a to 10c. The second line (1352) represents the impedance of a feed structure comprising the RF line structure (231), RF line structure (235) of the example (500a) of FIG. 5a, and the contact member (240) having multiple contacts (e.g., first contact (1081), second contact (1082)). Referring to the Smith chart (1300b), it can be confirmed that the impedance change is relatively small due to the magnitude of the low inductance of the contact member (240) having multiple contacts. Additionally, it can be confirmed that the second line (1352) is formed closer to the center point (1399) (e.g., 1 ohm) for impedance matching than the first line (1351).

[0148] Referring to FIG. 14a, graph (1400a) represents the overall efficiency by frequency. The horizontal axis of graph (1400a) represents frequency (unit: MHz), and the vertical axis of graph (1400a) represents the overall efficiency (unit: dB). The first line (1401) represents the overall efficiency of the antenna in an ideal feeding condition without an RF line. The second line (1402) represents the overall efficiency of an antenna using an RF line structure having a single conductive line of a single layer and a connecting member having a single contact. The third line (1403) represents the overall efficiency of an antenna using the RF line structure (231) and RF line structure (235) of the example (500a) of FIG. 5a, and the contact member (240) of FIG. 10a to 10c. Referring to graph (1400a), it can be seen that overall efficiency is improved through the RF line structure stacked over multiple layers and the contact member (240) of FIGS. 10a to 10c. The RF line structure stacked over multiple layers can be used to reduce composite inductance within a limited RF length. The multiple contacts of the contact member (240) of FIGS. 10a to 10c can form as many possible paths within the contact member (240). Through these paths, the inductance of the contact member (240) can be reduced.

[0149] Referring to FIG. 14b, the Smith chart (1400b) represents impedances (in ohms) by frequency. These impedances represent values ​​normalized to 50 ohms and can be used to calculate reflection coefficients (e.g., S11). Each line of the Smith chart (1400b) represents impedances according to frequency changes from a first frequency (1450a) (e.g., about 5 GHz) to a second frequency (1450b) (e.g., about 14 GHz). The first line (1451) represents the impedance in an ideal feed without an RF line. The second line (1452) represents the impedance of a feed structure using an RF line structure having a single conductive line of a single layer and a connecting member having a single contact. The third line (1453) represents the impedance of a feed structure using the RF line structure (231) and RF line structure (235) of the example (500a) of FIG. 5a, and the contact member (240) of FIG. 10a to FIG. 10c. Referring to the Smith chart (1400b), it can be seen that the third line (1453) is formed closer to the first line (1451) than the second line (1452) due to the magnitude of the low inductance. Additionally, it can be seen that the third line (1453) is formed closer to the center point (1499) (e.g., 1 ohm) for impedance matching than the second line (1452).

[0150] FIGS. 15a, 15b, and 15c illustrate examples of the structure and performance of an antenna using a multilayer RF line structure and a metal-insulator-metal stacked structure. The metal-insulator-metal stacked structure may be referred to as an MIM structure.

[0151] Referring to FIG. 15a, the MIM structure may be formed between a feed area (1522) and a contact area (1532). For example, the feed area (1522) may include a point connected to a portion where an RF signal is fed. As an example, but not limited to, an RF signal passing through an RF line structure (231) may be provided to the feed area (1522). The MIM structure may be understood as an example of an RF line structure (235). For example, the contact area (1532) may correspond to a contact member (e.g., contact member (240), or contact member (1140)). The PCB (250) may include a plurality of conductive layers. A non-conductive layer (e.g., an insulating layer, or a dielectric layer) may be disposed between adjacent conductive layers. For example, the PCB (250) may include a first conductive layer (1541), a second conductive layer (1542), a third conductive layer (1543), a fourth conductive layer (1544), a fifth conductive layer (1545), a sixth conductive layer (1546), and / or a seventh conductive layer (1547). As an example, a non-conductive layer (1511) may be disposed between the first conductive layer (1541) and the second conductive layer (1542). A non-conductive layer (1512) may be disposed between the second conductive layer (1542) and the third conductive layer (1543). A non-conductive layer (1513) may be disposed between the third conductive layer (1543) and the fourth conductive layer (1544). A non-conductive layer (1514) may be disposed between the fourth conductive layer (1544) and the fifth conductive layer (1545). A non-conductive layer (1515) may be disposed between the fifth conductive layer (1545) and the sixth conductive layer (1546). A non-conductive layer (1516) may be disposed between the sixth conductive layer (1546) and the seventh conductive layer (1547).

[0152] A plurality of conductive layers of the PCB (250) may be divided into a first set of layers and a second set of layers. For example, the first set of layers may be odd-numbered layers of the PCB (250). For example, the first set of layers may include a first conductive layer (1541), a third conductive layer (1543), a fifth conductive layer (1545), and / or a seventh conductive layer (1547). For example, the second set of layers may be even-numbered layers of the PCB (250). For example, the second set of layers may include a second conductive layer (1542), a fourth conductive layer (1544), and / or a sixth conductive layer (1546). According to one embodiment, the first set of layers and the second set of layers may be arranged alternately. Each layer of the first set of layers of the PCB (250) may include a conductive plate. Each layer of the second set of layers of the PCB (250) may include a conductive plate. The conductive plates of the first set of layers of the PCB (250) may be connected to a first conductive via (1551). When the first conductive via (1551) penetrates the layers of the PCB (250), the first conductive via (1551) may not be connected to the conductive plates of the second set of layers of the PCB (250). The conductive plates of the second set of layers of the PCB (250) may be connected to a second conductive via (1553). When the second conductive via (1553) penetrates the layers of the PCB (250), the second conductive via (1553) may not be connected to the conductive plates of the first set of layers of the PCB (250).

[0153] The conductive plates of the first set of layers can be electrically connected through the first conductive via (1551). The conductive plates of the second set of layers can be electrically connected through the second conductive via (1553). The conductive plates of the first set of layers can be positioned so as not to come into contact with the conductive plates of the second set of layers. At least some of the conductive plates of the second set of layers (e.g., the conductive plate of the second layer (1542)) can be electrically connected to the feed unit (1522). The RF signal of the feed unit (1522) can be provided to each of the conductive plates of the second set of layers. The conductive plates of the second set of layers can be coupled with the conductive plates of the first set of layers. Through said coupling, RF signals can flow to the conductive plates of the first set of layers. RF signals flowing through the conductive plates of the first set of layers can be provided to an antenna radiator (e.g., conductive part (203)) through the contact area (1532).

[0154] Referring to FIG. 15b, graph (1500b) represents the total radiation efficiency by frequency. The horizontal axis of graph (1500b) represents frequency (unit: MHz), and the vertical axis of graph (1500b) represents the total radiation efficiency (unit: dB). The first line (1551) represents the total radiation efficiency of an antenna using an RF line structure (231) including stacked conductive lines and an RF line structure (235) including a single conductive line. The second line (1552) represents the total radiation efficiency of an antenna using an RF line structure (231) including stacked conductive lines and the MIM structure of FIG. 15a. Referring to graph (1500b), it can be confirmed that the total radiation efficiency of the second line (1552) is higher than the total radiation efficiency of the first line (1551). It can be confirmed that the total radiation efficiency is improved by about 1 dB through the MIM structure.

[0155] Referring to FIG. 15c, graph (1500c) represents the reflection coefficient by frequency. The horizontal axis of graph (1500c) represents frequency (unit: MHz), and the vertical axis of graph (1500b) represents the reflection coefficient (unit: dB). The first line (1571) represents the reflection coefficient in a feed structure having an RF line structure (231) including stacked conductive lines and an RF line structure (235) including a single conductive line. The second line (1572) represents the reflection coefficient in a feed structure having an RF line structure (231) including stacked conductive lines and the MIM structure of FIG. 15a. The lower the reflection coefficient, the less power loss there is and the more power can be transmitted. In other words, the lower the reflection coefficient, the higher the matching efficiency can be. Referring to graph (1500c), it can be confirmed that the reflection coefficient is lowered through the MIM structure.

[0156] Figure 16 shows an example of a flexible printed circuit board (FPCB) using a multilayer RF line structure.

[0157] Referring to FIG. 16, the electronic device (101) may include an FPCB (1600). The FPCB (1600) may include a connector portion (1610) connected to a component, a line portion (1620) including signal lines (e.g., strip lines), and a feed portion (1630) connected to a radiator. Referring to region (1640), the FPCB (1600) may include a conductive pattern (1624) in the line portion (1620). The conductive pattern (1624) may include a line for transmitting an RF signal. The FPCB (1600) may include a conductive pattern (1634) in the feed portion (1630). The conductive pattern (1634) may be coupled to a contact member (e.g., contact member (240)) of a radiator (e.g., conductive portion (203)). An increase in inductance due to the length of the RF line in the FPCB (1600) can have a negative effect on impedance matching. The FPCB (1600) may be formed with fewer layers than the number of layers of a rigid PCB (e.g., PCB (250)). For example, the FPCB (1600) may include about 3 to 5 layers. Instead of stacking conductive lines in fewer layers, additional conductive structures may be used. According to one embodiment, a conductive structure (1671) may be placed over the RF line within the conductive pattern (1624). According to one embodiment, a conductive structure (1675) may be placed to reduce the inductance of the line between the conductive pattern (1624) and the conductive pattern (1634). The conductive structure (e.g., conductive structure (1671), or conductive structure (1675)) may be coupled to the RF line through conductive soldering. As the thickness of the RF line increases, the inductance of the RF line may decrease. Due to the reduced inductance, the efficiency of impedance matching may be improved.

[0158] Figure 17 shows an example of an FPCB using a multilayer RF line structure.

[0159] Referring to FIG. 17, the electronic device (101) may include an FPCB (1700). The FPCB (1700) may include a connector portion (1710) connected to a component, a line portion (1720) including signal lines (e.g., strip lines), and a feed portion (1730) connected to a radiator. Referring to region (1740), the FPCB (1700) may include a conductive pattern (1724) and / or a conductive pattern (1734) in the feed portion (1730). The conductive pattern (1734) may be connected to a contact member of the radiator. An increase in inductance due to the length of the RF line in the FPCB (1700) may have a negative effect on impedance matching. To reduce the effect caused by inductance, a conductive structure may be additionally placed to reduce the inductance of the RF line. According to one embodiment, a conductive structure (1771) may be placed over an RF line within a conductive pattern (1724). According to one embodiment, a conductive structure (1775) may be placed over an RF line within a conductive pattern (1734). The conductive structure (e.g., conductive structure (1771), or conductive structure (1775)) may be joined to the RF line through conductor soldering. As the thickness of the RF line increases, the inductance of the RF line may decrease. Due to the reduced inductance, the efficiency of impedance matching may be improved.

[0160] FIGS. 18a, FIGS. 18b, and FIGS. 18c illustrate examples of a foldable-type electronic device (e.g., electronic device (101)). FIG. 18a illustrates an example of an unfolded state of an exemplary foldable electronic device. FIG. 18b illustrates an example of a folded state of an exemplary foldable electronic device. FIG. 18c is an exploded view of an exemplary foldable electronic device.

[0161] Referring to FIGS. 18a, 18b, and 18c, a foldable electronic device (e.g., electronic device (101) of FIG. 1) may include a housing (1801), a flexible display (1830) (e.g., display module (160) of FIG. 1), and at least one camera (1840).

[0162] For example, the housing (1801) can form the exterior of the foldable electronic device (101). For example, the housing (1801) can enclose components that are placed inside the foldable electronic device (101) and are not exposed to the outside, as the physical exterior of the foldable electronic device (101) that is exposed to the outside. For example, the housing (1801) may include a first housing part (1810), a second housing part (1820), and a hinge structure (1850).

[0163] For example, the first housing part (1810) may include a first surface (1811), a second surface (1812) opposite to the first surface (1811), and a first side (1813) covering at least a portion of the first surface (1811) and the second surface (1812). For example, the first surface (1811) may be referred to as the front surface of the first housing part (1810), and the second surface (1812) may be referred to as the rear surface of the first housing part (1810). The first side (1813) may be connected to the periphery of the first surface (1811) and the periphery of the second surface (1812). The first surface (1811), the second surface (1812), and the first side (1813) can form an internal space of the first housing part (1810). For example, at least one component may be placed within the space enclosed by the first surface (1811), the second surface (1812), and the first side (1813).

[0164] For example, the second housing part (1820) may include a third surface (1821), a fourth surface (1822) opposite to the third surface (1821), and a second side (1823) that encloses at least a portion of the third surface (1821) and the fourth surface (1822). For example, the third surface (1821) may be referred to as the front surface of the second housing part (1820), and the fourth surface (1822) may be referred to as the rear surface of the second housing part (1820). The second side (1823) may be connected to the periphery of the third surface (1821) and the periphery of the fourth surface (1822). The third surface (1821), the fourth surface (1822), and the second side (1823) may form an internal space of the second housing part (1820). For example, at least one component may be placed within the space enclosed by the third side (1821), the fourth side (1822), and the second side (1823).

[0165] For example, the flexible display (1830) may be configured to display visual information. For example, the flexible display (1830) may include a display area comprising a plurality of pixels. For example, the active area may be referred to as an active area that displays visual information. For example, the flexible display (1830) may form at least a portion of the front surface of the housing (1801). For example, the flexible display (1830) may at least partially form the first surface (1811) and the third surface (1821).

[0166] For example, the flexible display (1830) may include a first display area (1831) forming at least a portion of a first surface (1811) of a first housing part (1810), a second display area (1832) forming at least a portion of a third surface (1821) of a second housing part (1820), and a third display area (1833) disposed between the first display area (1831) and the second display area (1832). For example, the first display area (1831), the second display area (1832), and the third display area (1833) may at least partially form the front surface of the housing (1801). For example, the foldable electronic device (101) may further include a sub-display (1835) distinct from the flexible display (1830). The sub-display (1835) may be placed on the fourth side (1822) of the second housing part (1820). The sub-display (1835) may be referred to as a cover display.

[0167] For example, at least one camera (1840) may be configured to acquire an image based on receiving light from an object outside the foldable electronic device (101). For example, at least one camera (1840) may include first cameras (1841), a second camera (1842), or a third camera (1843). For example, the first cameras (1841) may be placed within a first housing part (1810). For example, the first housing part (1810) may include at least one opening (1841a) that overlaps the first cameras (1841) when the foldable type electronic device (101) is viewed from above. The first cameras (1841) may acquire an image based on receiving light from outside the foldable electronic device (101) through at least one opening (1841a).

[0168] For example, the second camera (1842) may be disposed within the second housing part (1820). The second housing part (1820) may include at least one opening (1842a) that overlaps the second camera (1842) when the foldable electronic device (101) is viewed from above. The second camera (1842) may acquire an image based on receiving light from outside the foldable electronic device (101) through the at least one opening (1842a).

[0169] For example, the third camera (1843) may be placed within the first housing part (1810). For example, the first display area (1831) of the flexible display (1830) may include at least one opening that overlaps with the third camera (1843) when the flexible display (1830) is viewed from above. The third camera (1843) may acquire an image based on receiving light from outside the flexible display (1830) through at least one opening.

[0170] For example, the second camera (1842) and the third camera (1843) may be positioned below the flexible display (1830) (e.g., in the (+)z-axis direction). For example, the second camera (1842) and / or the third camera (1843) may include an under-display camera (UDC) and / or a punch-hole camera.

[0171] For example, the first housing part (1810) and the second housing part (1820) can be rotatably coupled. For example, the second housing part (1820) can be coupled to the first housing part (1810) so as to be rotatable with respect to the first housing part (1810) through a hinge structure (1850).

[0172] For example, the hinge structure (1850) can rotatably connect the first housing part (1810) and the second housing part (1820). The hinge structure (1850) can be positioned between the first housing part (1810) and the second housing part (1820) of the foldable electronic device (101) so that the foldable electronic device (101) can be folded. The hinge structure (1850) can change the foldable electronic device (101) from an unfolding state to a folding state. The hinge structure (1850) can change the foldable electronic device (101) from a folding state to an unfolding state. The hinge structure (1850) can maintain the foldable electronic device (101) in an intermediate state between the unfolding state and the folding state.

[0173] For example, the unfolded state may be referred to as a state where the first direction toward which the first display area (1830a) faces and the second direction toward which the second display area (1830b) faces are the same. For example, the folded state may be referred to as a state where the first direction is opposite to the second direction. When the foldable electronic device (101) is in the folded state, the first housing part (1810) and the second housing part (1820) may be stacked or overlapped.

[0174] For example, when the foldable electronic device (101) is in a folded state and an intermediate state, the first direction and the second direction may be different from each other. For example, when the foldable electronic device (101) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the foldable electronic device (101) is in an intermediate state, the first direction may have an inclination (e.g., an angle between 0 and 180 degrees) with respect to the second direction.

[0175] For example, the foldable electronic device (101) may be rotatable about a folding axis (f). The folding axis (f) may be referred to as an imaginary line extending along a direction parallel to the length direction of the foldable electronic device (101) (e.g., y-axis) or a direction parallel to the width direction of the foldable electronic device (101) (e.g., x-axis).

[0176] For example, the foldable electronic device (101) may include at least one conductive portion (1814a, 1824a) and at least one non-conductive portion (1814b, 1824b) included within the first side (1813) and / or the third side (1823). For example, the at least one conductive portion (1814a, 1824a) may be separated from other conductive portions within the first side (1813) and / or the third side (1823) by contacting the at least one non-conductive portion (1814b, 1824b). The at least one conductive portion (1814a, 1824a) may function as an antenna radiator to be used for communication with an external electronic device.

[0177] Referring to FIG. 18c, the hinge structure (1850) may include a hinge cover (1851), a first hinge plate (1852), a second hinge plate (1853), and a hinge module (1854). The hinge cover (1851) may enclose internal components of the hinge structure (1850) and form the outer surface of the hinge structure (1850). For example, when the foldable electronic device (101) is in a folded state, at least a portion of the hinge cover (1851) may be exposed to the outside of the foldable electronic device (101) through the space between the first housing part (1810) and the second housing part (1820). According to another embodiment, when the foldable electronic device (101) is in an unfolded state, the hinge cover (1851) may be covered by the first housing part (1810) and the second housing part (1820) so as not to be exposed to the outside of the foldable electronic device (101).

[0178] For example, the first hinge plate (1852) and the second hinge plate (1853) can be rotatably connected to the first housing part (1810) and the second housing part (1820) by being operatively coupled to the first housing part (1810) and the second housing part (1820), respectively. For example, the first hinge plate (1852) can be operatively coupled to the first frame (1815) of the first housing part (1810), and the second hinge plate (1853) can be operatively coupled to the second frame (1827) of the second housing part (1820). As the first hinge plate (1852) and the second hinge plate (1853) are operatively coupled to the first frame (1815) and the second frame (1827), respectively, the first housing part (1810) and the second housing part (1820) may be rotatable according to the rotation of the first hinge plate (1852) and the second hinge plate (1853).

[0179] The hinge module (1854) can rotate the first hinge plate (1852) and the second hinge plate (1853). For example, the hinge module (1854) may include gears that are rotatable and mesh with each other to rotate the first hinge plate (1852) and the second hinge plate (1853) about a folding axis (f).

[0180] For example, the first housing part (1810) may include a first frame (1815) and a rear cover (1816). The first frame (1815) may be disposed inside the first housing part (1810) and may support at least one component disposed inside the first housing part (1810). The rear cover (1816) may at least partially form a second surface (1822) of the first housing part (1810). For example, the second housing part (1820) may include a second frame (1827). The second frame (1827) may be disposed inside the second housing part (1820) and may support at least one component disposed inside the second housing part (1820). For example, a sub-display (1835) may be disposed below the second frame (1827) (e.g., in the (+)z-axis direction).

[0181] An exemplary foldable electronic device (101) may include a plurality of electronic components for implementing various functions in addition to the at least one camera (1840) described above. For example, the foldable electronic device (101) may include a first printed circuit board (1861), a second printed circuit board (1862), a connection structure (e.g., a flexible printed circuit board) (1863), and / or a battery (189). The electronic components described above are exemplary and are not limited thereto.

[0182] For example, the first printed circuit board (1861) and the second printed circuit board (1862) can each provide electrical connections between components within the foldable electronic device (101). For example, the first printed circuit board (1861) can be placed within the first housing part (1810), and the second printed circuit board (1862) can be placed within the second housing part (1820). The first printed circuit board (1861) can provide electrical connections between electronic components placed within the first housing part (1810). The second printed circuit board (1862) can provide electrical connections between electronic components placed within the second housing part (1820). A connection structure (1863) can electrically connect the first printed circuit board (1861) and the second printed circuit board (1862). For example, the connection structure (1863) may extend from the first printed circuit board (1861) across the hinge structure (1850) to the second printed circuit board (1862). For example, the connection structure (1863) may overlap at least partially with the hinge structure (1850).

[0183] For example, the battery (189) is a device for supplying power to at least one component of the foldable electronic device (101), and may include, for example, a non-rechargeable primary battery and / or a rechargeable secondary battery.

[0184] For example, the foldable electronic device (101) may include a plurality of antennas (ANT1, ANT2, ANT3, ANT4) to be used for communication with an external electronic device. For example, the foldable electronic device (101) may include a main antenna (ANT1), a sub-antenna (ANT2), an ultra-wide band (UWB) antenna (ANT3), and / or an antenna (ANT4) for short-range wireless communication. However, it is not limited thereto.

[0185] One or more components to be described below with reference to the drawings may be implemented together with the components of the foldable electronic device (101) described with reference to FIG. 18a, FIG. 18b, and FIG. 18c. The same reference numerals are assigned to components identical to those described above, and redundant descriptions may be omitted.

[0186] In the present disclosure, relative terms such as above and under may be used to describe the relative positions between components. For example, if the foldable electronic device (101) illustrated in the drawing is flipped over, above and under may be reversed.

[0187] An RF line structure (e.g., RF line structure (231) and / or RF line structure (235)) in which conductive lines are stacked according to embodiments of the present disclosure may also be applied to a foldable type electronic device (e.g., electronic device (101)) of FIG. 18a, FIG. 18b, and FIG. 18c. According to one embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB (e.g., first printed circuit board (1861)) of a first housing part (1810). A portion of the metal frame of the first housing part (1810) may be connected to the RF line structure and used as an antenna radiator. According to another embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB (e.g., second printed circuit board (1862)) of a second housing part (1820). A portion of the metal frame of the second housing part (1820) may be connected to the RF line structure and used as an antenna radiator.

[0188] FIGS. 19a, FIGS. 19b, FIGS. 19c, FIGS. 20a, and FIGS. 20b illustrate examples of a foldable-type electronic device (e.g., electronic device (101)). FIG. 19a illustrates an example of a first state of the electronic device. FIG. 19b illustrates an example of a second state of the electronic device. FIG. 19c illustrates an example of a third state of the electronic device.

[0189] Referring to FIGS. 19a, 19b, and 19c, the electronic device (1900) may include a housing structure (1901), a flexible display (1940), a first hinge structure (1950), a second hinge structure (1960), and a display (1970). The housing structure (1901) may include a first housing part (1910), a second housing part (1920), and a third housing part (1930).

[0190] The first housing part (1910) can be rotatably coupled to the second housing part (1920) by the first hinge structure (1950). The second housing part (1920) and the first housing part (1910) can be rotated about the first hinge structure (1950). While the first housing part (1910) is rotated about the first hinge structure (1950), the second housing part (1920) can be rotated about the first hinge structure (1950). For example, when the second housing part (1920) and the first housing part (1910) are rotated about the first hinge structure (1950), the angular displacement of the second housing part (1920) may be substantially the same as the angular displacement of the first housing part (1910).

[0191] The third housing part (1930) can be rotatably coupled to the second housing part (1920) by the second hinge structure (1960). The second housing part (1920) and the third housing part (1930) can be rotated about the second hinge structure (1960). While the second housing part (1920) is rotated about the second hinge structure (1960), the third housing part (1930) can be rotated about the second hinge structure (1960). For example, when the second housing part (1920) and the third housing part (1930) are rotated about the second hinge structure (1960), the angular displacement (or angular change) of the second housing part (1920) may be substantially the same as the angular displacement of the third housing part (1930).

[0192] The first hinge structure (1950) and the second hinge structure (1960) can change the state of the electronic device. The first hinge structure (1950) and the second hinge structure (1960) can provide (or enable) a first state (1900a) of the electronic device (1900) (or a first state (1900a) of the housing structure (1901). The first state (1901) of the electronic device (1900) (or a first state (1900a) of the housing structure (1901)) can be described as an unfolded state (or unfolded state) of the electronic device (1900) (or housing structure (1901)). In the first state (1900a), the front of the first housing part (1910), the front of the second housing part (1920), and the front of the third housing part (1930) may define the front of the electronic device (1900). In the first state (1900a), the front of the first housing part (1910), the front of the second housing part (1920), and the front of the third housing part (1930) may face the same direction. In the first state (1900a), the electronic device (1900) may provide the user with a large display area of ​​the flexible display (1940).

[0193] The first hinge structure (1950) and the second hinge structure (1960) can provide a second state (1900b) of the electronic device (1900). The second state (1900b) of the electronic device (1900) can be described as a state in which the electronic device (1900) is partially folded and partially unfolded (or a single folding state or a half folding state). For example, in the second state (1900b), the front of the second housing part (1920) and the front of the third housing part (1930) may face in the same direction, and the front of the first housing part (1910) and the front of the second housing part (1920) may face in opposite directions. For example, in the third state, the first housing part (1910) and the second housing part (1920) may be folded, and the second housing part (1920) and the third housing part (1930) may be unfolded. In the second state (1900b), the electronic device (1900) can convey visual information through a part of the flexible display (1940) (e.g., a third display area (1940c)).

[0194] The electronic device (1900) can change from the first state (1900a) to the third state (1900c) through the second state (1900b). The electronic device (1900) can change from the first state (1900a), which is an unfolded state, to the second state (1900b), which is a partially unfolded state. For example, the electronic device (1900) can change from the first state (1900a), in which the first housing part (1910), the second housing part (1920), and the third housing part (1930) face the same direction, to the second state (1900b), in which the front of the first housing part (1910) faces the front of the second housing part (1920). The electronic device (1900) can change from the second state (1900b), which is a partially unfolded state, to the third state (1900c), which is a folded state. For example, when changing from the second state (1900b) to the third state (1900c), the folded first housing part (1910) and the second housing part (1920) can be placed on the third housing part (1930).

[0195] The first hinge structure (1950) and the second hinge structure (1960) can provide a third state (1900c) of the electronic device (1900) (or a third state (1900c) of the housing structure (1901). The third state (1900c) of the electronic device (1900) (or a third state (1900c) of the housing structure (1901)) can be described as a folded state (or a folded state or a multi-folded state) of the electronic device (1900) (or the housing structure (1901)). In the third state (1900c), the front of the first housing part (1910) and the front of the second housing part (1920) may face in opposite directions, and the front of the second housing part (1920) and the front of the third housing part (1930) may face in opposite directions. In the third state (1900c), the front of the first housing part (1910) and the front of the third housing part (1930) may face each other in the same direction. For example, in the third state (1900c), the front of the second housing part (1920) may face the front of the first housing part (1910), and the front of the third housing part (1930) may face the rear of the first housing part (1910). In the third state (1900c), the rear of the second housing part (1920) may be exposed to the outside. A camera (1975) may be placed on the rear of the second housing part (1920). In the third state (1900c), the rear of the third housing part (1930) may be exposed to the outside. A display (1970) may be placed on the rear of the third housing part (1930). In the third state (1900c), the electronic device (1900) can be folded to improve portability and can provide visual information through a display (1970) placed in the third housing part (1930) of the electronic device (1900) in the third state (1900c).

[0196] The electronic device (1900) may further include a key button (1939). The key button (1939) may be exposed from a structure (e.g., an opening) formed on the side of the third housing part (1930) and may partially protrude outside the electronic device (1900). The key button (1939) may provide physical input to a processing circuit inside the electronic device (1900) by pressure transmitted from the outside. The key button (1939) may not be included in the electronic device and may be implemented in other forms, such as a soft key displayed on a flexible display (1940) or a display (1970).

[0197] The key button (1939) may be positioned on the side of the third housing part (1930) so as to be exposed to the outside in the third state (1900c). The key button positioned in the third housing part (1930) may be moved from the left side of the electronic device (1900) to the right side of the electronic device (1900) as the state of the electronic device (1900) changes from the third state (1900c) to the first state (1900a) by a user looking at the display. For example, referring to FIG. 19a, in the first state (1900a), when looking up at the flexible display (1940), the key button (1939) may be positioned on the right side. Referring to FIG. 19b, in the third state (1900c), when looking up at the display (1970), the key button (1939) may be positioned on the left side.

[0198] The flexible display (1940) may define the appearance of the electronic device (1900) at least partially. The flexible display (1940) may be partially disposed within the housing structure (1901). The flexible display (1940) may define the front of the electronic device (1900). The flexible display (1940) may include a first unbendable portion (1941), a second unbendable portion (1942), a third unbendable portion (1943), a first bendable portion (1944), and a second bendable portion (1945). The first unbendable portion (1941) of the flexible display (1940) may be disposed on the front of the first housing part (1910). A second unbendable portion (1942) of the flexible display (1940) may be placed on the front of the second housing part (1920). A third unbendable portion (1943) of the flexible display (1940) may be placed on the front of the third housing part (1930). A first bendable portion (1944) of the flexible display (1940) may be placed between the first unbendable portion (1941) and the second unbendable portion (1942) of the flexible display (1940). For example, the first bendable portion (1944) of the flexible display (1940) may be placed on a first hinge structure (1950) connecting the first housing part (1910) and the second housing part (1920). A second bendable portion (1945) of the flexible display (1940) may be positioned between a second unbendable portion (1942) and a third unbendable portion (1943) of the flexible display (1940). For example, the second bendable portion (1945) of the flexible display (1940) may be positioned on a second hinge structure (1960) connecting a second housing part (1920) and a third housing part (1930).

[0199] The first hinge structure (1950) and the second hinge structure (1960) may have the first unbendable portion (1941) of the flexible display (1940), the second unbendable portion (1942) of the flexible display (1940), and the third unbendable portion (1943) of the flexible display (1940) oriented substantially in the same direction. In the first state (1900a), the first bendable portion (1944) and the second bendable portion (1945) may be positioned in substantially the same horizontal plane as the first unbendable portion (1941), the second unbendable portion (1942), and the third unbendable portion (1943).

[0200] The first hinge structure (1950) and the second hinge structure (1960) can provide a second state (1900b) of the electronic device (1900). In the second state (1900b), the first unbendable portion (1941) of the flexible display (1940) may face the second unbendable portion (1942) of the flexible display (1940), and the third unbendable portion (1943) of the flexible display (1940) may face the same direction as the second unbendable portion (1942) of the flexible display (1940). For example, the second unbendable portion (1942) and the third unbendable portion (1943) may be positioned substantially on the same horizontal plane.

[0201] In the second state (1900b), the first bendable portion (1944) of the flexible display (1940) is bent by the first hinge structure (1950), so that the first bendable portion (1944) of the flexible display (1940) can be folded such that the first unbendable portion (1941) of the flexible display (1940) and the second unbendable portion (1942) of the flexible display (1940) face in different directions.

[0202] In the second state (1900b), the second bendable portion (1945) of the flexible display (1940) is maintained in an unfolded state by the second hinge structure (1960), so that the second bendable portion (1945) of the flexible display (1940) can be unfolded such that the second unbendable portion (1942) of the flexible display (1940) and the third unbendable portion (1943) of the flexible display (1940) face each other in the same direction.

[0203] The first hinge structure (1950) and the second hinge structure (1960) can provide a third state (1900c) of the electronic device (1900). In the third state (1900c), the second unbendable portion (1942) of the flexible display (1940) faces the first unbendable portion (1941) of the flexible display (1940), and the third unbendable portion (1943) of the flexible display (1940) may face the rear of the first housing part (1910).

[0204] In the third state (1900c), the first bendable portion (1944) of the flexible display (1940) is bent by the first hinge structure (1950), so that the first bendable portion (1944) of the flexible display (1940) can be folded such that the first unbendable portion (1941) of the flexible display (1940) and the second unbendable portion (1942) of the flexible display (1940) face in different directions.

[0205] In the third state (1900c), the second bendable portion (1945) of the flexible display (1940) is bent by the second hinge structure (1960), so that the second bendable portion (1945) of the flexible display (1940) can be folded such that the second unbendable portion (1942) of the flexible display (1940) and the third unbendable portion (1943) of the flexible display (1940) face in different directions. The second bendable portion (1945) may further include a first deformation portion (1945a), a second deformation portion (1945b), and a flat portion (1945c). The first deformation part (1945a) may be positioned between the planar part (1945c) and the second unbendable part (1942), and the second deformation part (1945b) may be positioned between the planar part (1945c) and the third unbendable part (1943). The planar part (1945c) may be positioned between the first deformation part (1945a) and the second deformation part (1945b). The planar part (1945c) may be supported by a support plate (e.g., the support plate (2064) of FIG. 20a) that is distinct from the hinge plates of the second hinge structure (1960) (e.g., the third hinge plate (2062) and the fourth hinge plate (2063) of FIG. 20a). Regardless of the state of the electronic device (1900), the planar part (1945c) may remain flat. The first deformation part (1945a) and the second deformation part (1945b) are unfolded in the first state (1900a) and the second state (1900b), and in the third state (1900c), the first deformation part (1945a) and the second deformation part (1945b) can be folded so that the second unbendable part (1942) and the third unbendable part (1943) face in different directions.

[0206] In the third state (1900c), the first housing part (1910) may be positioned between the second housing part (1920) and the third housing part (1930). In the third state (1900c), the second bendable portion (1945) of the flexible display (1940) positioned on the second hinge structure (1960) may partially face the side (1910c) of the first housing part (1910).

[0207] The display area of ​​the flexible display (1940) may include a first display area (1940a), a second display area (1940b), and a third display area (1940c). The display area represents an area capable of providing visual information from the flexible display (1940). In a first state (1900a), the entire display area of ​​the flexible display (1940) may be visible from the front of the housing structure (1901). For example, in a first state (1900a), the first display area (1940a), the second display area (1940b), and the third display area (1940c) of the flexible display (1940) may be visually exposed. The electronic device (1900) may provide a large display area to the user that includes the first display area (1940a), the second display area (1940b), and the third display area (1940c).

[0208] In the second state (1900b), the display area of ​​the flexible display (1940) may be partially visible from the front of the third housing part (1930). For example, the third unbendable part (1943) may be visually exposed, while the first display area (1940a) and the second display area (1940b) may not be visually exposed.

[0209] In the third state (1900c), the display area of ​​the flexible display (1940) may not be visible. For example, in the third state (1900c), the first display area (1940a), the second display area (1940b), and the third display area (1940c) of the flexible display (1940) may not be visually exposed.

[0210] In a non-limiting example, when the flexible display (1940) is used to display a screen within a first state (1900a) of the electronic device (1900), the first display area (1940a), the second display area (1940b), and the third display area (1940c) of the flexible display (1940) may be activated. In a non-limiting example, when the flexible display (1940) is used to display a screen within a second state (1900b) of the electronic device (1900), the third display area (1940c) may be activated, and the first display area (1940a) and the second display area (1940b) of the flexible display (1940) may be deactivated. As an example not limited to, within a third state (1900c) of the electronic device (1900), the first display area (1940a), the second display area (1940b), and the third display area (1940c) of the flexible display (1940) may be disabled.

[0211] In a non-limiting example, when the flexible display (1940) is used to display a screen within a first state (1900a) of the electronic device (1900), the first display area (1940a), the second display area (1940b), and the third display area (1940c) of the flexible display (1940) may display visual information. In a non-limiting example, when the flexible display (1940) is used to display a screen within a second state (1900b) of the electronic device (1900), the third display area (1940c) may provide visual information, and the first display area (1940a) and the second display area (1940b) of the flexible display (1940) may provide a black image. As an example not limited to, within the third state (1900c), the first display area (1940a), the second display area (1940b), and the third display area (1940c) of the flexible display (1940) may provide a black image.

[0212] FIG. 20a is a top view of an electronic device with the flexible display removed. FIG. 20b is a rear view of an electronic device with the rear cover and display removed.

[0213] Referring to FIG. 20a and FIG. 20b, the electronic device (1900) may include a first hinge structure (1950) and a second hinge structure (1960). The first width (w1) of the first hinge structure (1950) may be narrower than the second width (w2) of the second hinge structure (1960). The difference between the first width (w1) of the first hinge structure (1950) and the second width (w2) of the second hinge structure (1960) may be equal to or greater than the thickness of the first housing part (1910). For example, the second hinge structure (1960) may have a second width (w2) wider than the first width (w1) so that, according to the third state (1900c), the first housing part (1910) is positioned between the second housing part (1920) and the third housing part (1930). The first hinge structure (1950) may be referred to as a narrow hinge structure in that it has a narrower width than the second hinge structure (1960). The second hinge structure (1960) may be referred to as a wide hinge structure in that it has a wider width than the first hinge structure (1950).

[0214] The first hinge structure (1950) may include a first set of gears (2051), a first hinge plate (2052), and a second hinge plate (2053). The first hinge plate (2052) may be coupled to a first support portion (1911) of the first housing part (1910). The second hinge plate (2053) may be coupled to a second support portion (1921) of the second housing part (1920). The gears (g11, g12, g13, g14) included in the first set of gears (2051) may be configured to rotate the first hinge plate (2052) and the second hinge plate (2053). For example, the gears (g11, g12, g13, g14) included in the first set of gears (2051) can rotate the second hinge plate (2053) (or the second housing part (1920)) in conjunction with the rotation of the first hinge plate (2052) (or the first housing part (1910)). When the first hinge plate (2052) (or the first housing part (1910)) rotates, the gears (g11, g12, g13, g14) included in the first set of gears (2051) can rotate according to the rotation of the first hinge plate (2052) (or the first housing part (1910)). The second hinge plate (2053) (or the second housing part (1920)) may be rotated in conjunction with the rotation of the first hinge plate (2052) according to the rotation of the gears (g11, g12, g13, g14) included in the first set of gears (2051). The gears (g11, g12, g13, g14) included in the first set of gears (2051) may include a first gear (g11), a second gear (g12), a third gear (g13), and a fourth gear (g14). The first gear (g11) may be positioned adjacent to the first hinge plate (2052), and the fourth gear (g14) may be positioned adjacent to the second hinge plate (2053). The second gear (g12) and the third gear (g13) can be positioned between the first gear (g11) and the fourth gear (g14).The first gear (g11), the second gear (g12), the third gear (g13), and the fourth gear (g14) can be engaged sequentially. Depending on the first rotational direction (e.g., clockwise) of the first gear (g1), the second gear (g2) engaged with the first gear (g1) can be rotated in a second rotational direction (e.g., counterclockwise) opposite to the first rotational direction. Depending on the second rotational direction of the second gear (g2), the third gear (g3) engaged with the second gear (g2) can be rotated in the first rotational direction. Depending on the first rotational direction of the third gear (g3), the fourth gear (g4) can be rotated in the second rotational direction. As the first gear (g1) and the fourth gear (g4) rotate in different directions, the first housing part (1910) connected to the first hinge plate (2052) and the second housing part (1920) connected to the second hinge plate (2053) can be folded or unfolded.

[0215] The second hinge structure (1960) may include a second set of gears (2061), a third hinge plate (2062), a fourth hinge plate (2063), and a support plate (2064). The third hinge plate (2062) may be coupled to the second support portion (1921) of the second housing part (1920). The fourth hinge plate (2063) may be coupled to the third support portion (1931) of the third housing part (1930). The gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (2061) may be configured to rotate the third hinge plate (2062) and the fourth hinge plate (2063). For example, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (2061) can rotate the fourth hinge plate (2063) (or the third housing part (1930)) in conjunction with the rotation of the third hinge plate (2062) (or the second housing part (1920)). After the third hinge plate (2062) (or the second housing part (1920)) is rotated, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (2061) can be rotated according to the rotation of the third hinge plate (2062) (or the second housing part (1920)). The fourth hinge plate (2063) (or the third housing part (1930)) can be rotated in conjunction with the rotation of the third hinge plate (2062) according to the rotation of the gears (g21, g22, g23, g24, g25, g26) included in the second set (2061) of gears.

[0216] The gears (g21, g22, g23, g24, g25, g26) included in the second set (2061) of gears may include a first gear (g21), a second gear (g22), a third gear (g23), a fourth gear (g24), a fifth gear (g25), and a sixth gear (g26). The first gear (g21) may be positioned adjacent to the third hinge plate (2062), and the sixth gear (g26) may be positioned adjacent to the fourth hinge plate (2063). The second gear (g22), the third gear (g23), the fourth gear (g24), and the fifth gear (g25) may be positioned between the first gear (g21) and the sixth gear (g26). The first gear (g21), second gear (g22), third gear (g23), fourth gear (g24), fifth gear (g25), and sixth gear (g26) can be engaged sequentially. Depending on the first rotational direction (e.g., clockwise) of the first gear (g21), the second gear (g22) engaged with the first gear (g21) can be rotated in a second rotational direction (e.g., counterclockwise) opposite to the first rotational direction. Depending on the second rotational direction of the second gear (g22), the third gear (g23) engaged with the second gear (g22) can be rotated in the first rotational direction. Depending on the first rotational direction of the third gear (g23), the fourth gear (g24) can be rotated in the second rotational direction. Depending on the rotation of the fourth gear (g24) in the second rotational direction, the fifth gear (g25) engaged with the fourth gear (g24) can be rotated in the first rotational direction. Depending on the rotation of the fifth gear (g25) in the first rotational direction, the sixth gear (g26) engaged with the fifth gear (g25) can be rotated in the second rotational direction. As the first gear (g21) and the sixth gear (g26) rotate in different directions, the second housing part (1920) connected to the third hinge plate (2062) and the third housing part (1930) connected to the fourth hinge plate (2063) can be folded or unfolded.

[0217] The first hinge structure (1950) and the second hinge structure (1960) may further include a spiral structure. The spiral structure may include a spiral groove formed in each hinge plate or a rotating member connected to the hinge plate and a moving member sliding along the spiral groove. The hinge plates connected to the hinge structure may be configured to rotate by substantially the same angular displacement through the spiral structure.

[0218] The electronic device (1900) may include a first printed circuit board (2071), a second printed circuit board (2072), and a third printed circuit board (2073).

[0219] The first printed circuit board (2071) may be placed on the first support portion (1911) of the first housing part (1910). Hardware components within the first housing part (1910) may be mounted on the first printed circuit board (2071).

[0220] A second printed circuit board (2072) may be placed on a second support portion (1921) of a second housing part (1920). Hardware components within the second housing part (1920) may include at least one processor (e.g., application processor, communication processor) including a processing circuit mounted on the second printed circuit board (2072), a memory including one or more storage media, a communication circuit, and a rear camera (1975). The rear camera (1975) may be exposed through a structure (e.g., an opening) on ​​the rear of the second housing part (1920).

[0221] A third printed circuit board (2073) may be placed on a third support portion (1931) of a third housing part (1930). Hardware components within the third housing part (1930) may be mounted on the third printed circuit board (2073). Hardware components placed on the third printed circuit board (2073) may support hardware components placed on the second printed circuit board (2072) or operate independently. Hardware components placed on the third printed circuit board (2073) may include a speaker, a front camera, and / or a display driving circuit.

[0222] Hardware components placed on the first printed circuit board (2071) may support or operate independently of hardware components placed on the second printed circuit board (2072) and / or hardware components placed on the third printed circuit board (2073).

[0223] The electronic device (1900) may further include a sub-printed circuit board (2075) and flexible printed circuit boards (2080, 2090). The sub-printed circuit board (2075) may be placed in at least a portion of the first housing part (1910), the second housing part (1920), and the third housing part (1930). The flexible printed circuit boards (2080, 2090) may include a first flexible printed circuit board (2080) and a second flexible printed circuit board (2090). The first flexible printed circuit board (2080) may electrically connect the printed circuit boards placed in each of the housing parts (1910, 1920, 1930). The second flexible printed circuit board (2090) can connect the printed circuit board (2075) and the sub-printed circuit board (2075) within the housing part in which the sub-printed circuit board (2075) is placed by the second flexible printed circuit board (2090).

[0224] Electronic components within the electronic device (1900) may be connected to at least one processor within the second printed circuit board (2072) via flexible printed circuit boards (2080, 2090). For example, a signal received from an antenna placed in the third housing part (1930) may be transmitted to the second printed circuit board (2072) where at least one processor (e.g., AP or CP) is placed via a signal path (a) provided by the first flexible printed circuit board (2080). A driving circuit for a flexible display (1940) placed in the first housing part (1910) may be connected to the second printed circuit board (2072) where at least one processor (e.g., AP) is placed via a signal path (b) provided by the first flexible printed circuit board (2080). A driving circuit for a display (1970) connected to a sub-printed circuit board (2075) disposed in a first housing part (1910) may be electrically connected to a second printed circuit board (2072) on which at least one processor (e.g., AP) is disposed, through a signal path (c) provided by the sub-printed circuit board (2075), the first flexible printed circuit board (2080), and the second flexible printed circuit board (2090). The electronic device (1900) may further include batteries. Each of the batteries may be attached to support parts (1911, 1921, 1931) included in the housing parts (1910, 1920, 1930). The support parts (1911, 1921, 1931) may support rechargeable batteries.

[0225] The arrangement of hardware components is exemplary, and unlike the above, the rear camera (1975) and the second printed circuit board (2072) may be placed in the third housing part (1930), and the third printed circuit board (2073) may be placed in the second housing part (1920).

[0226] The first housing part (1910) and the third housing part (1930) are shown to rotate in opposite directions relative to the second housing part (1920), but are not limited thereto. For example, while changing from the first state (1900a) to the third state (1900c), the first housing part (1910) may rotate counterclockwise relative to the second housing part (1920), and the third housing part (1930) may rotate counterclockwise relative to the second housing part (1920). As the first housing part (1910) and the third housing part (1930) rotate in the same direction, a portion of the display area of ​​the flexible display (1940) in the second state may be visually exposed.

[0227] An RF line structure (e.g., RF line structure (231) and / or RF line structure (235)) in which conductive lines are stacked according to embodiments of the present disclosure may also be applied to a foldable type electronic device (e.g., electronic device (101)) of FIG. 19a, FIG. 19b, FIG. 19c, FIG. 20a, and FIG. 20b. According to one embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure disposed in a fill-cut area of ​​a PCB (e.g., first printed circuit board (2071)) of a first housing part (1910). In the RF line structure, a plurality of conductive lines may be stacked along the stacking direction of the PCB. The conductive lines may be spaced apart at a certain interval. The conductive lines may be joined through a plurality of vias. A portion of the metal frame of the first housing part (1910) may be used as an antenna radiator for signals fed through the RF line structure. According to another embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB (e.g., second printed circuit board (2072)) of a second housing part (1920). A portion of the metal frame of the second housing part (1920) may be connected to the RF line structure and used as an antenna radiator. According to yet another embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB (e.g., third printed circuit board (2073)) of a third housing part (1930). A portion of the metal frame of the third housing part (1930) may be connected to the RF line structure and used as an antenna radiator.

[0228] FIGS. 21a and FIGS. 21b illustrate examples of foldable-type electronic devices (e.g., electronic device (101)). FIG. 21a illustrates an example of a first state of the electronic device. FIG. 21b illustrates an example of a second state of the electronic device.

[0229] Referring to FIGS. 21a and 21b, the electronic device (2100) may include a housing structure (2101), a flexible display (2140), a first hinge structure (2150), and a second hinge structure (2160). The first housing structure (2101) may include a first housing part (2110), a second housing part (2120), and a third housing part (2130).

[0230] The first housing part (2110) can be rotatably coupled to the second housing part (2120) by the first hinge structure (2150). The first housing part (2110) and the second housing part (2120) can be rotated about the first hinge structure (2150). The first hinge structure (2150) can cause the first housing part (2110) to rotate in conjunction with the rotation of the second housing part (2120). While the first housing part (2110) is rotated about the first hinge structure (2150), the second housing part (2120) can be rotated about the first hinge structure (2150). For example, when the first housing part (2110) and the second housing part (2120) rotate with respect to the first hinge structure (2150), the angular displacement (or angular change) of the first housing part (2110) may be substantially the same as the angular displacement of the second housing part (2120).

[0231] The third housing part (2130) can be rotatably coupled to the second housing part (2120) by the second hinge structure (2160). The second housing part (2120) and the third housing part (2130) can be rotated about the second hinge structure (2160). The second hinge structure (2160) can cause the second housing part (2130) to rotate in conjunction with the rotation of the third housing part (2130). While the third housing part (2130) is rotated about the second hinge structure (2160), the second housing part (2120) can be rotated about the second hinge structure (2160). For example, when the second housing part (2120) and the third housing part (2130) are rotated with respect to the second hinge structure (2160), the angular displacement of the second housing part (2120) may be substantially the same as the angular displacement of the third housing part (2130).

[0232] The first hinge structure (2150) and the second hinge structure (2160) can change the state of the electronic device (2100). The first hinge structure (2150) and the second hinge structure (2160) can provide (or enable) a first state (2100a) of the electronic device (2100) (or a first state (2100a) of the housing structure (2101). The first state (2100a) of the electronic device (2100) (or a first state (2100a)) of the housing structure (2101) can be described as an unfolded state (or unfolded state) of the electronic device (2100) (or housing structure (2101)). In the first state (2100a), the front of the first housing part (2110), the front of the second housing part (2120), and the front of the third housing part (2130) may define the front of the electronic device (2100). In the first state (2100a), the front of the first housing part (2110), the front of the second housing part (2120), and the front of the third housing part (2130) may face the same direction. In the first state (2100a), the electronic device (2100) may provide the user with a large display area of ​​the flexible display (2140).

[0233] The first hinge structure (2150) and the second hinge structure (2160) can provide a second state (2100b) of the electronic device (2100) (or a second state (2100b) of the housing structure (2101). The second state (2100b) of the electronic device (2100) (or a second state (2100b) of the housing structure (2101)) can be described as a folded state (or multi-folding state or folding state) of the electronic device (2100) (or housing structure (2101)). While the state of the electronic device (2100) changes from the first state (2100a) to the second state (2100b), the rotational direction of the first housing part (2110) relative to the second housing part (2120) may be the same as the rotational direction of the third housing part (2130) relative to the second housing part (2120).

[0234] In the second state (2100b), the front of the first housing part (2110) and the front of the second housing part (2120) may face in opposite directions, and the front of the second housing part (2120) and the front of the third housing part (2130) may face in opposite directions. For example, in the second state (2100b), the front of the first housing part (2110) may face the front of the second housing part (2120), and the rear of the second housing part (2120) may face the front of the third housing part (2130). In the second state (2100b), the electronic device (2100) may be folded to improve portability. In the folded state, visual information may be provided through a portion of the display area (e.g., a third display area (2140c)) of a display (2140) placed on the outside of the electronic device (2100).

[0235] The first hinge structure (2150) and the second hinge structure (2160) can provide a third state of the electronic device (2100). The third state of the electronic device (2100) can be described as a state in which the electronic device (2100) is partially folded and partially unfolded (or a single folding state or a half folding state). For example, in the third state, the front of the second housing part (2120) and the front of the third housing part (2130) may face each other in the same direction, and the front of the first housing part (2110) may face the front of the second housing part (2120). For example, in the third state, the first housing part (2110) and the second housing part (2120) may be folded, and the second housing part (2120) and the third housing part (2130) may be unfolded.

[0236] However, not limited thereto, within the third state, the front of the first housing part (2110) and the front of the second housing part (2120) may face each other in the same direction, and the rear of the second housing part (2110) may face the rear of the third housing part (2130). For example, within the third state, the second housing part (2120) and the third housing part (2130) may be folded, and the first housing part (2110) and the second housing part (2120) may be unfolded. The electronic device (2100) may change from the first state (2100a) to the second state (2100b) through the third state. The electronic device (2100) may change from the first state (2100a), which is an unfolded state, to the third state, which is a partially unfolded state. For example, the electronic device (2100) can change from a first state (2100a) in which the first housing part (2110), the second housing part (2120), and the third housing part (2130) face in the same direction to a third state in which the front of the first housing part (2110) faces the front of the second housing part (2120). The electronic device (2100) can change from a third state (2100c) in which it is partially unfolded to a second state (2100b) in which it is folded. For example, when changing from the third state (2100c) to the second state (2100b), the folded first housing part (2110) and the second housing part (2120) can be placed on the third housing part (2130). As the state of the electronic device (2100) changes to a second state (2100b), the rear surface of the second housing part (2120) folded with respect to the first housing part (2110) may face the rear surface of the third housing part (2130).

[0237] The flexible display (2140) may define the appearance of the electronic device (2100) at least partially. The flexible display (2140) may be partially disposed within the housing structure (2101). The flexible display (2140) may define the front of the electronic device (2100). The flexible display (2140) may include a first unbendable portion (2141), a second unbendable portion (2142), a third unbendable portion (2143), a first bendable portion (2144), and a second bendable portion (2145). The first unbendable portion (2141) of the flexible display (2140) may be disposed on the front of the first housing part (2110). A second unbendable portion (2142) of the flexible display (2140) may be placed on the front of the second housing part (2120). A third unbendable portion (2143) of the flexible display (2140) may be placed on the front of the third housing part (2130). A first bendable portion (2144) of the flexible display (2140) may be placed between the first unbendable portion (2141) and the second unbendable portion (2142) of the flexible display (2140). For example, the first bendable portion (2144) of the flexible display (2140) may be placed on a first hinge structure (2150) connecting the first housing part (2110) and the second housing part (2120). The second bendable portion (2145) of the flexible display (2140) may be positioned between the second unbendable portion (2142) and the third unbendable portion (2143) of the flexible display (2140). For example, the second bendable portion (2145) of the flexible display (2140) may be positioned on a second hinge structure (2160) connecting the first housing part (2110) and the second housing part (2120).

[0238] The first hinge structure (2150) and the second hinge structure (2160) may have the first unbendable portion (2141) of the flexible display (2140), the second unbendable portion (2142) of the flexible display (2140), and the third unbendable portion (2143) of the flexible display (2140) oriented substantially in the same direction. In the first state (2100a), the first bendable portion (2144) and the second bendable portion (2145) may be positioned in substantially the same horizontal plane as the first unbendable portion (2141), the second unbendable portion (2142), and the third unbendable portion (2143).

[0239] The first hinge structure (2150) and the second hinge structure (2160) can provide a second state (2100b) of the electronic device (2100). In the second state (2100b), the first unbendable portion (2141) of the flexible display (2140) faces the third unbendable portion (2143) of the flexible display (2140), and the second unbendable portion (2142) of the flexible display (2140) can be seen through the front of the second housing part (2120). In the second state (2100b), the first bendable portion (2144) of the flexible display (2140) can be folded so that the first unbendable portion (2141) of the flexible display (2140) and the second unbendable portion (2142) of the flexible display (2140) face in different directions. In the second state (2100b), the second bendable portion (2145) of the flexible display (2140) can be folded so that the first unbendable portion (2141) of the flexible display (2140) and the third unbendable portion (2143) of the flexible display (2140) face in different directions.

[0240] In the first state (2100a), the entire display area of ​​the flexible display (2140) may be visible from the front of the housing structure (2101). For example, the first display area (2140a), the second display area (2140b), and the third display area (2140c) of the flexible display (2140) may be visually exposed. In the first state (2100a), the electronic device (2100) may provide the user with a large display area including the first display area (2140a), the second display area (2140b), and the third display area (2140c). In the second state (2100b), the display area of ​​the flexible display (2140) may be partially visible. For example, the first display area (2140a) and the second display area (2140b) of the flexible display (2140) may not be visually exposed, and the third display area (2140c) may be visually exposed.

[0241] In a non-limiting example, when the flexible display (2140) is used to display a screen within a first state (2100a) of the electronic device (2100), the first display area (2140a), the second display area (2140b), and the third display area (2140c) of the flexible display (2140) may be activated. In a non-limiting example, when the flexible display (2140) is used to display a screen within a second state of the electronic device (2100), the third display area (2140c) may be activated, and the first display area (2140a) and the second display area (2140b) of the flexible display (2140) may be deactivated.

[0242] In a non-limiting example, when the flexible display (2140) is used to display a screen within a first state (2100a) of the electronic device (2100), the first display area (2140a), the second display area (2140b), and the third display area (2140c) of the flexible display (2140) may display visual information. In a non-limiting example, when the flexible display (2140) of the electronic device (2100) is used to display a screen within a second state (2100b) or a third state, the third display area (2140c) may provide visual information, and the first display area (2140a) and the second display area (2140b) of the flexible display (2140) may provide a black image.

[0243] The second housing part (2120) and the third housing part (2130) are shown to rotate in the same direction relative to the first housing part (2110), but are not limited thereto. For example, while changing from the first state (2100a) to the second state (2100b), the first housing part (2110) may rotate clockwise relative to the second housing part (2120), and the third housing part (2130) may rotate counterclockwise relative to the second housing part (2120). As the first housing part (2110) and the third housing part (2130) rotate in different directions, the display area of ​​the flexible display (2140) in the second state may be disabled and not visually exposed.

[0244] An RF line structure (e.g., RF line structure (231) and / or RF line structure (235)) in which conductive lines are stacked according to embodiments of the present disclosure may also be applied to a foldable type electronic device (e.g., electronic device (101)) of FIGS. 21a and 21b. According to one embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure disposed in a fill-cut area of ​​a PCB of a first housing part (2110). In the RF line structure, a plurality of conductive lines may be stacked along the stacking direction of the PCB. The conductive lines may be spaced apart at a certain interval. The conductive lines may be joined through a plurality of vias. A portion of the metal frame of the first housing part (2110) may be connected to the RF line structure and used as an antenna radiator. According to another embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB of a second housing part (2120). A portion of the metal frame of the second housing part (2120) may be connected to the RF line structure and used as an antenna radiator. According to yet another embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB of a third housing part (2130). A portion of the metal frame of the third housing part (2130) may be connected to the RF line structure and used as an antenna radiator.

[0245] FIGS. 22a, FIGS. 22b, FIGS. 22c, FIGS. 23a, and FIGS. 23b illustrate examples of a foldable-type electronic device (e.g., electronic device (101)). FIG. 22a illustrates an example of a first state of the electronic device. FIG. 22b illustrates an example of a second state of the electronic device. FIG. 22c illustrates an example of a third state of the electronic device.

[0246] Referring to FIGS. 22a, 22b, and 22c, the electronic device (2200) may include a housing structure (2201), a flexible display (2240), a first hinge structure (2250), a second hinge structure (2260), and a display (2270). The first housing structure (2201) may include a first housing part (2210), a second housing part (2220), and a third housing part (2230).

[0247] The first housing part (2210) can be rotatably coupled to the second housing part (2220) by the first hinge structure (2250). The second housing part (2220) and the first housing part (2210) can be rotated about the first hinge structure (2250). While the first housing part (2210) is rotated about the first hinge structure (2250), the second housing part (2220) can be rotated about the first hinge structure (2250). For example, when the second housing part (2220) and the first housing part (2210) are rotated about the first hinge structure (2250), the angular displacement of the second housing part (2220) may be substantially the same as the angular displacement of the first housing part (2210).

[0248] The third housing part (2230) can be rotatably coupled to the second housing part (2220) by the second hinge structure (2260). The second housing part (2220) and the third housing part (2230) can be rotated about the second hinge structure (2260). While the second housing part (2220) is rotated about the second hinge structure (2260), the third housing part (2230) can be rotated about the second hinge structure (2260). For example, when the second housing part (2220) and the third housing part (2230) are rotated about the second hinge structure (2260), the angular displacement (or angular change) of the second housing part (2220) may be substantially the same as the angular displacement of the third housing part (2230).

[0249] The first hinge structure (2250) and the second hinge structure (2260) can change the state of the electronic device. The first hinge structure (2250) and the second hinge structure (2260) can provide (or enable) a first state (2200a) of the electronic device (2200) (or a first state (2200a) of the housing structure (2201). The first state (2201) of the electronic device (2200) (or a first state (2200a)) of the housing structure (2201) can be described as an unfolded state (or unfolded state) of the electronic device (2200) (or housing structure (2201)). In the first state (2200a), the front of the first housing part (2210), the front of the second housing part (2220), and the front of the third housing part (2230) may define the front of the electronic device (2200). In the first state (2200a), the front of the first housing part (2210), the front of the second housing part (2220), and the front of the third housing part (2230) may face the same direction. In the first state (2200a), the electronic device (2200) may provide the user with a large display area of ​​the flexible display (2240).

[0250] The first hinge structure (2250) and the second hinge structure (2260) can provide a second state (2200b) of the electronic device (2200). The second state (2200b) of the electronic device (2200) can be described as a state in which the electronic device (2200) is partially folded and partially unfolded (or a single folding state or a half folding state). For example, within the second state (2200b), the front of the second housing part (2220) and the front of the third housing part (2230) may face in the same direction, and the front of the first housing part (2210) and the front of the second housing part (2220) may face in opposite directions. For example, in the second state (2200b), the first housing part (2210) and the second housing part (2220) may be folded, and the second housing part (2220) and the third housing part (2230) may be unfolded. In the second state (2200b), the electronic device (2200) may provide visual information through a part of the flexible display (2240) (e.g., a third display area (2240c)).

[0251] The electronic device (2200) can change from a first state (2200a) to a third state (2200c) through a second state (2200b). The electronic device (2200) can change from a first state (2200a) which is an unfolded state to a second state (2200b) which is a partially unfolded state. For example, the electronic device (2200) can change from a first state (2200a) in which the first housing part (2210), the second housing part (2220), and the third housing part (2230) face the same direction to a second state (2200b) in which the front of the first housing part (2210) faces the front of the second housing part (2220). The electronic device (2200) can change from a second state (2200b) which is a partially unfolded state to a third state (2200c) which is a folded state. For example, when changing from the second state (2200b) to the third state (2200c), the folded first housing part (2210) and the second housing part (2220) can be placed on the third housing part (2230).

[0252] The first hinge structure (2250) and the second hinge structure (2260) can provide a third state (2200c) of the electronic device (2200) (or a third state (2200c) of the housing structure (2201). The third state (2200c) of the electronic device (2200) (or a third state (2200c) of the housing structure (2201)) can be described as a folded state (or a folded state or a multi-folded state) of the electronic device (2200) (or the housing structure (2201)). In the third state (2200c), the front of the first housing part (2210) and the front of the second housing part (2220) may face in opposite directions, and the front of the second housing part (2220) and the front of the third housing part (2230) may face in opposite directions. In the third state (2200c), the front of the first housing part (2210) and the front of the third housing part (2230) may face each other in the same direction. For example, in the third state (2200c), the front of the second housing part (2220) may face the front of the first housing part (2210), and the front of the third housing part (2230) may face the rear of the first housing part (2210). In the third state (2200c), the rear of the second housing part (2220) may be exposed to the outside. A display (2270) may be placed on the rear of the second housing part (2220). In the third state (2200c), the rear of the third housing part (2230) may be exposed to the outside. A camera (2275) may be placed on the rear of the third housing part (2230). In the third state (2200c), the electronic device (2200) can be folded to improve portability and can provide visual information through a display (2270) positioned on the rear of the second housing (2220).

[0253] The electronic device (2200) may further include a key button (2239). The key button (2239) may be exposed from a structure (e.g., an opening) formed on the side of the third housing part (2230) and may partially protrude outside the electronic device (2200). The key button (2239) may provide physical input to a processing circuit inside the electronic device (2200) by pressure transmitted from the outside. The key button (2239) may not be included in the electronic device (2200) and may be implemented in other forms, such as a soft key displayed on a flexible display (2240) or a display (2270).

[0254] The key button (2239) may be positioned on the side of the third housing part (2230) so as to be exposed to the outside in the third state (2200c). As the key button (2239) is positioned on the side of the third housing part (2230), it may be positioned in the direction in which the side of the third housing (2230) faces. Even if the position of the key button (2239) positioned on the side of the third housing (2230) is changed to the first state (2200a) by a user looking at the display (2270) in the third state (2200c), the position of the key button (2239) positioned on the side of the third housing (2230) may not be moved. For example, referring to FIG. 22a, in the first state (2200a), when the flexible display (2240) is viewed from above, the key button (2239) may be positioned on the right side. Referring to FIG. 22b, in the third state (2200c), when viewing the display (2270) from above, the key button (2239) may be positioned on the right.

[0255] The flexible display (2240) may define the appearance of the electronic device (2200) at least partially. The flexible display (2240) may be partially disposed within the housing structure (2201). The flexible display (2240) may define the front of the electronic device (2200). The flexible display (2240) may include a first unbendable portion (2241), a second unbendable portion (2242), a third unbendable portion (2243), a first bendable portion (2244), and a second bendable portion (2245). The first unbendable portion (2241) of the flexible display (2240) may be disposed on the front of the first housing part (2210). A second unbendable portion (2242) of the flexible display (2240) may be placed on the front of the second housing part (2220). A third unbendable portion (2243) of the flexible display (2240) may be placed on the front of the third housing part (2230). A first bendable portion (2244) of the flexible display (2240) may be placed between the first unbendable portion (2241) and the third unbendable portion (2243) of the flexible display (2240). For example, the first bendable portion (2244) of the flexible display (2240) may be placed on a first hinge structure (2250) connecting the first housing part (2210) and the second housing part (2220). The second bendable portion (2245) of the flexible display (2240) may be positioned between the second unbendable portion (2242) and the third unbendable portion (2243) of the flexible display (2240). For example, the second bendable portion (2245) of the flexible display (2240) may be positioned on a second hinge structure (2260) connecting the second housing part (2220) and the third housing part (2230).

[0256] The first hinge structure (2250) and the second hinge structure (2260) may have the first unbendable portion (2241) of the flexible display (2240), the second unbendable portion (2242) of the flexible display (2240), and the third unbendable portion (2243) of the flexible display (2240) oriented substantially in the same direction. In the first state (2200a), the first bendable portion (2244) and the second bendable portion (2245) may be positioned in substantially the same horizontal plane as the first unbendable portion (2241), the second unbendable portion (2242), and the third unbendable portion (2243).

[0257] The first hinge structure (2250) and the second hinge structure (2260) can provide a second state (2200b) of the electronic device (2200). In the second state (2200b), the first unbendable portion (2241) of the flexible display (2240) may face the second unbendable portion (2242) of the flexible display (2240), and the third unbendable portion (2243) of the flexible display (2240) may face the same direction as the second unbendable portion (2242) of the flexible display (2240). For example, the second unbendable portion (2242) and the third unbendable portion (2243) may be positioned substantially on the same horizontal plane.

[0258] In the second state (2200b), the first bendable portion (2244) of the flexible display (2240) is bent by the first hinge structure (2250), so that the first bendable portion (2244) of the flexible display (2240) can be folded such that the first unbendable portion (2241) of the flexible display (2240) and the second unbendable portion (2242) of the flexible display (2240) face in different directions.

[0259] In the second state (2200b), the second bendable portion (2245) of the flexible display (2240) is maintained in an unfolded state by the second hinge structure (2260), so that the second bendable portion (2245) of the flexible display (2240) can be unfolded such that the second unbendable portion (2242) of the flexible display (2240) and the third unbendable portion (2243) of the flexible display (2240) face each other in the same direction.

[0260] The first hinge structure (2250) and the second hinge structure (2260) can provide a third state (2200c) of the electronic device (2200). In the third state (2200c), the second unbendable portion (2242) of the flexible display (2240) faces the first unbendable portion (2241) of the flexible display (2240), and the third unbendable portion (2243) of the flexible display (2240) may face the rear of the first housing part (2210).

[0261] In the third state (2200c), the first bendable portion (2244) of the flexible display (2240) is bent by the first hinge structure (2250), so that the first bendable portion (2244) of the flexible display (2240) can be folded such that the first unbendable portion (2241) of the flexible display (2240) and the second unbendable portion (2242) of the flexible display (2240) face in different directions.

[0262] In the third state (2200c), the second bendable portion (2245) of the flexible display (2240) is bent by the second hinge structure (2260), so that the second bendable portion (2245) of the flexible display (2240) can be folded such that the second unbendable portion (2242) of the flexible display (2240) and the third unbendable portion (2243) of the flexible display (2240) face in different directions. The second bendable portion (2245) may further include a first deformation portion (2245a), a second deformation portion (2245b), and a flat portion (2245c). The first deformation portion (2245a) may be positioned between the planar portion (2245c) and the second unbendable portion (2242), and the second deformation portion (2245b) may be positioned between the planar portion (2245c) and the third unbendable portion (2243). The planar portion (2245c) may be positioned between the first deformation portion (2245a) and the second deformation portion (2245b). The planar portion (2245c) may be supported by a support plate (e.g., the support plate (2364) of FIG. 23a) that is distinct from the hinge plates of the second hinge structure (2260) (e.g., the third hinge plate (2362) and the fourth hinge plate (2363) of FIG. 23a). Regardless of the state of the electronic device (2200), the planar portion (2245c) may remain flat. The first deformation part (2245a) and the second deformation part (2245b) are unfolded in the first state (2200a) and the second state (2200b), and in the third state (2200c), the first deformation part (2245a) and the second deformation part (2245b) can be bent so that the second unbendable part (2242) and the third unbendable part (2243) face in different directions. In the third state (2200c), the first housing part (2210) can be positioned between the second housing part (2220) and the third housing part (2230).In the third state (2200c), the second bendable portion (2245) of the flexible display (2240) placed on the second hinge structure (2260) may partially face the side (2210c) of the first housing part (2210).

[0263] The display area of ​​the flexible display (2240) may include a first display area (2240a), a second display area (2240b), and a third display area (2240c). The display area represents an area capable of providing visual information from the flexible display (2240). In a first state (2200a), the entire display area of ​​the flexible display (2240) may be visible from the front of the housing structure (2201). For example, in a first state (2200a), the first display area (2240a), the second display area (2240b), and the third display area (2240c) of the flexible display (2240) may be visually exposed. The electronic device (2200) may provide a large display area to the user that includes the first display area (2240a), the second display area (2240b), and the third display area (2240c).

[0264] In the second state (2200b), the display area of ​​the flexible display (2240) may be partially visible from the front of the third housing part (2230). For example, the third display area (2240c) may be visually exposed, while the first display area (2240a) and the second display area (2240b) may not be visually exposed.

[0265] In the third state (2200c), the display area of ​​the flexible display (2240) may not be visible. For example, in the third state (2200c), the first display area (2240a), the second display area (2240b), and the third display area (2240c) of the flexible display (2240) may not be visually exposed.

[0266] In a non-limiting example, when the flexible display (2240) is used to display a screen within a first state (2200a) of the electronic device (2200), the first display area (2240a), the second display area (2240b), and the third display area (2240c) of the flexible display (2240) may be activated. In a non-limiting example, within a third state (2200c), the first display area (2240a), the second display area (2240b), and the third display area (2240c) of the flexible display (2240) may be deactivated. In a non-limiting example, within a second state (2200b) of the electronic device (2200), when the flexible display (2240) is used to display a screen, the third display area (2240c) may be activated, and the first display area (2240a) and the second display area (2240b) of the flexible display (2240) may be deactivated.

[0267] In a non-limiting example, when the flexible display (2240) is used to display a screen within a first state (2200a) of the electronic device (2200), the first display area (2240a), the second display area (2240b), and the third display area (2240c) of the flexible display (2240) may display visual information. In a non-limiting example, within a third state (2200c), the first display area (2240a), the second display area (2240b), and the third display area (2240c) of the flexible display (2240) may provide a black image. As a non-limiting example, in a second state (2200b) of the electronic device (2200), when the flexible display (2240) is used to display a screen, the third display area (2240c) may provide visual information, and the first display area (2240a) and the second display area (2240b) of the flexible display (2240) may provide a black image.

[0268] FIG. 23a is a top view of an electronic device with the flexible display removed. FIG. 23b is a rear view of an electronic device with the rear cover and display removed.

[0269] Referring to FIGS. 23a and 23b, the electronic device (2200) may include a first hinge structure (2250) and a second hinge structure (2260). The first width (w1) of the first hinge structure (2250) may be narrower than the second width (w2) of the second hinge structure (2260). The difference between the first width (w1) of the first hinge structure (2250) and the second width (w2) of the second hinge structure (2260) may be equal to or greater than the thickness of the first housing part (2210). For example, the second hinge structure (2260) may have a second width (w2) wider than the first width (w1) so that, according to the third state (2200c), the first housing part (2210) is positioned between the second housing part (2220) and the third housing part (2230). The first hinge structure (2250) may be referred to as a narrow hinge structure in that it has a narrower width than the second hinge structure (2260). The second hinge structure (2260) may be referred to as a wide hinge structure in that it has a wider width than the first hinge structure (2250).

[0270] The first hinge structure (2250) may include a first set of gears (2351), a first hinge plate (2352), and a second hinge plate (2353). The first hinge plate (2352) may be coupled to a first support portion (2211) of a first housing part (2210). The second hinge plate (2354) may be coupled to a second support portion (2221) of a second housing part (2220). The gears (g11, g12, g13, g14) included in the first set of gears (2351) may be configured to rotate the first hinge plate (2352) and the second hinge plate (2353). For example, the gears (g11, g12, g13, g14) included in the first set of gears (2351) can rotate the second hinge plate (2352) (or the second housing part (2220)) in conjunction with the rotation of the first hinge plate (2353) (or the first housing part (2210)). After the first hinge plate (2352) (or the first housing part (2210)) is rotated, the gears (g11, g12, g13, g14) included in the first set of gears (2351) can be rotated according to the rotation of the first hinge plate (2352) (or the first housing part (2210)). The second hinge plate (2353) (or the second housing part (2220)) may be rotated in conjunction with the rotation of the first hinge plate (2352) according to the rotation of the gears included in the first set of gears (2351). The gears (g11, g12, g13, g14) included in the first set of gears (2351) may include a first gear (g11), a second gear (g12), a third gear (g13), and a fourth gear (g14). The first gear (g11) may be positioned adjacent to the first hinge plate (2352), and the fourth gear (g14) may be positioned adjacent to the second hinge plate (2353). The second gear (g12) and the third gear (g13) may be positioned between the first gear (g11) and the fourth gear (g14).The first gear (g11), the second gear (g12), the third gear (g13), and the fourth gear (g14) can be engaged sequentially. Depending on the first rotational direction (e.g., clockwise) of the first gear (g11), the second gear (g12) engaged with the first gear (g11) can be rotated in a second rotational direction (e.g., counterclockwise) opposite to the first rotational direction. Depending on the second rotational direction of the second gear (g2), the third gear (g13) engaged with the second gear (g12) can be rotated in the first rotational direction. Depending on the first rotational direction of the third gear (g13), the fourth gear (g14) can be rotated in the second rotational direction. As the first gear (g11) and the fourth gear (g14) rotate in different directions, the first housing part (2210) connected to the first hinge plate (2352) and the second housing part (2220) connected to the second hinge plate (2353) can be folded or unfolded.

[0271] The second hinge structure (2260) may include a second set of gears (2361), a third hinge plate (2362), a fourth hinge plate (2363), and a support plate (2364). The third hinge plate (2362) may be coupled to the second support portion (2221) of the second housing part (2220). The fourth hinge plate (2363) may be coupled to the third support portion (2231) of the third housing part (2230). The gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (2361) may be configured to rotate the third hinge plate (2362) and the fourth hinge plate (2363). For example, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (2361) can rotate the fourth hinge plate (2363) (or the third housing part (2230)) in conjunction with the rotation of the third hinge plate (2362) (or the second housing part (2220)). After the third hinge plate (2362) (or the second housing part (2220)) is rotated, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (2361) can be rotated according to the rotation of the third hinge plate (2362) (or the second housing part (2220)). The fourth hinge plate (2363) (or the third housing part (2230)) can be rotated in conjunction with the rotation of the third hinge plate (2362) according to the rotation of the gears (g21, g22, g23, g24, g25, g26) included in the second set (2361) of gears.

[0272] The gears (g21, g22, g23, g24, g25, g26) included in the second set (2361) of gears may include a first gear (g21), a second gear (g22), a third gear (g23), a fourth gear (g24), a fifth gear (g25), and a sixth gear (g26). The first gear (g21) may be positioned adjacent to the third hinge plate (2362), and the sixth gear (g26) may be positioned adjacent to the fourth hinge plate (2363). The second gear (g22), the third gear (g23), the fourth gear (g24), and the fifth gear (g25) may be positioned between the first gear (g21) and the sixth gear (g26). The first gear (g21), second gear (g22), third gear (g23), fourth gear (g24), fifth gear (g25), and sixth gear (g26) can be engaged sequentially. Depending on the first rotational direction (e.g., clockwise) of the first gear (g21), the second gear (g22) engaged with the first gear (g21) can be rotated in a second rotational direction (e.g., counterclockwise) opposite to the first rotational direction. Depending on the second rotational direction of the second gear (g22), the third gear (g23) engaged with the second gear (g22) can be rotated in the first rotational direction. Depending on the first rotational direction of the third gear (g23), the fourth gear (g24) can be rotated in the second rotational direction. Depending on the rotation of the fourth gear (g24) in the second rotational direction, the fifth gear (g25) engaged with the fourth gear (g24) can be rotated in the first rotational direction. Depending on the rotation of the fifth gear (g25) in the first rotational direction, the sixth gear (g26) engaged with the fifth gear (g25) can be rotated in the second rotational direction. As the first gear (g21) and the sixth gear (g26) rotate in different directions, the second housing part (2220) connected to the third hinge plate (2362) and the third housing part (2230) connected to the fourth hinge plate (2363) can be folded or unfolded.

[0273] The first hinge structure (2250) and the second hinge structure (2260) may further include a spiral structure. The spiral structure may include a spiral groove formed in each hinge plate or a rotating member connected to the hinge plate and a moving member sliding along the spiral groove. The hinge plates connected to the hinge structure may be configured to rotate by substantially the same angular displacement through the spiral structure.

[0274] The electronic device (2200) may include a first printed circuit board (2371), a second printed circuit board (2372), and a third printed circuit board (2373).

[0275] A first printed circuit board (2371) may be placed on a first support portion (2211) of a first housing part (2210). Hardware components within the first housing part (2210) may be mounted on the first printed circuit board (2371). A second printed circuit board (2372) may be placed on a second support portion (2221) of a second housing part (2220). A third printed circuit board (2373) may be placed on a third support portion (2231) of a third housing part (2230). Hardware components within the third housing part (2230) may be mounted on the third printed circuit board (2373).

[0276] Hardware components placed on the first printed circuit board (2371) may support or operate independently of hardware components placed on the second printed circuit board (2372) and / or hardware components placed on the third printed circuit board (2373).

[0277] Hardware components placed on the second printed circuit board (2372) may support or operate independently of hardware components placed on the first printed circuit board (2371) or the third printed circuit board (2373). Hardware components placed on the second printed circuit board (2372) may include a speaker, a front camera, and / or a display driving circuit.

[0278] Hardware components disposed on the third printed circuit board (2373) may include at least one processor including a processing circuit (e.g., application processor (AP), communication processor (CP)), memory including one or more storage media, communication circuits, and a rear camera (2275). The rear camera (2275) may be exposed through a structure (e.g., an opening) on ​​the rear of the second housing part (2220).

[0279] The electronic device (2200) may further include a sub-printed circuit board (2375) and flexible printed circuit boards (2380, 2390). The sub-printed circuit board (2375) may be disposed in at least some of the first housing part (2210), the second housing part (2220), and the third housing part (2230). The flexible printed circuit boards (2380, 2390) may include a first flexible printed circuit board (2380) and a second flexible printed circuit board (2390). The first flexible printed circuit board (2380) may electrically connect the printed circuit boards disposed in each of the housing parts (2210, 2220, 2230). The second flexible printed circuit board (2390) can connect the printed circuit board and the sub-printed circuit board (2375) within the housing part in which the sub-printed circuit board (2375) is placed by the second flexible printed circuit board (2390).

[0280] Components within the electronic device (2200) may be connected to at least one processor within the third printed circuit board (2373) via flexible printed circuit boards (2380, 2390). For example, a signal received from an antenna placed in the third housing part (2230) may be transmitted to the third printed circuit board (2373) where at least one processor (e.g., AP or CP) is placed via a signal path (a) provided by the first flexible printed circuit board (2380). A driving circuit for a flexible display (2240) placed in the first housing part (2210) may be connected to the third printed circuit board (2373) where at least one processor (e.g., AP) is placed via a sub-printed circuit board (2375) and a signal path (b) provided by the first flexible printed circuit board (2380). A driving circuit for a display (2270) connected to a sub-printed circuit board (2375) placed in a second housing part (2230) can be electrically connected to a third printed circuit board (2373) on which at least one processor (e.g., AP) is placed, through a signal path (c) provided by the sub-printed circuit board (2375), the first flexible printed circuit board (2380), and the second flexible printed circuit board (2390).

[0281] The electronic device (2200) may further include batteries. Each of the batteries may be attached to support parts (2211, 2221, 2231) included in the housing parts (2210, 2220, 2230). The support parts (2211, 2221, 2231) may support rechargeable batteries.

[0282] The arrangement of hardware components is exemplary, and unlike the above, the rear camera (2275) and the second printed circuit board (2372) may be placed in the third housing part (2230), and the third printed circuit board (2373) may be placed in the second housing part (2220).

[0283] The first housing part (2210) and the third housing part (2230) are shown to rotate in opposite directions relative to the second housing part (2220), but are not limited thereto. For example, while changing from the first state (2200a) to the third state (2200c), the first housing part (2210) may rotate counterclockwise relative to the second housing part (2220), and the third housing part (2230) may rotate counterclockwise relative to the second housing part (2220). As the first housing part (2210) and the third housing part (2230) rotate in the same direction, a portion of the display area of ​​the flexible display (2240) in the second state may be visually exposed.

[0284] An RF line structure in which conductive lines are stacked according to embodiments of the present disclosure may also be applied to a foldable type electronic device (e.g., electronic device (101)) of FIG. 22a, FIG. 22b, FIG. 22c, FIG. 23a, and FIG. 23b. According to one embodiment, the foldable type electronic device (e.g., electronic device (101)) may include an RF line structure disposed in a fill-cut area of ​​a PCB (e.g., first printed circuit board (2371)) of a first housing part (2210). In the RF line structure, a plurality of conductive lines may be stacked along the stacking direction of the PCB. The conductive lines may be spaced apart at a certain interval. The conductive lines may be joined through a plurality of vias. A portion of the metal frame of the first housing part (2210) may be connected to the RF line structure and used as an antenna radiator. According to another embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB (e.g., second printed circuit board (2372)) of a second housing part (2220). A portion of the metal frame of the second housing part (2220) may be connected to the RF line structure and used as an antenna radiator. According to yet another embodiment, a foldable type electronic device (e.g., electronic device (101)) may include an RF line structure in which conductive lines are stacked and disposed in a fill-cut area of ​​a PCB (e.g., third printed circuit board (2373)) of a third housing part (2230). A portion of the metal frame of the third housing part (2230) may be connected to the RF line structure and used as an antenna radiator.

[0285] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0286] In the present disclosure, an RF line structure (e.g., RF line structure (231), or RF line structure (235)) according to the embodiments is described in a signal region (e.g., signal region (253)) of a circuit board (e.g., PCB (250)), but the embodiments of the present disclosure are not limited thereto. Any RF line structure comprising conductive lines disposed in a plurality of layers and a first conductive via and a second conductive via connected to said conductive lines may be understood as an embodiment of the present disclosure. For example, an electronic device (101) may include an RF line structure formed across a plurality of layers in a region other than the fill-cut region (e.g., ground region (251)).

[0287] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include: a conductive portion (203) forming at least a portion of the side of the electronic device (101); a wireless communication circuit (220); a printed circuit board (PCB) (250) comprising a plurality of layers on which the wireless communication circuit (220) is disposed; a radio frequency (RF) line structure (231) disposed on a plurality of layers of the PCB (250) and electrically connected to the wireless communication circuit (220); and a contact member disposed on the PCB (250) and for electrically connecting the RF line structure (231) and the conductive portion (203). The RF line structure (231) may include: a first conductive line disposed on a first layer among the plurality of layers of the PCB (250); and a second conductive line disposed on a second layer among the plurality of layers of the PCB (250). It may include a first conductive via penetrating between the first layer and the second layer and coupled to a first portion of the first conductive line and a second portion of the second conductive line; and a second conductive via penetrating between the first layer and the second layer and coupled to a third portion of the first conductive line and a fourth portion of the second conductive line.

[0288] For example, the first portion of the first conductive line may include a first end adjacent to the wireless communication circuit (220) among the wireless communication circuit (220) and the conductive portion (203). The second portion of the second conductive line may include a second end adjacent to the wireless communication circuit (220) among the wireless communication circuit (220) and the conductive portion (203). The third portion of the first conductive line may include a third end adjacent to the conductive portion (203) among the wireless communication circuit (220) and the conductive portion (203). The fourth portion of the second conductive line may include a fourth end adjacent to the conductive portion (203) among the wireless communication circuit (220) and the conductive portion (203).

[0289] For example, the first conductive line and the second conductive line may be used as a signal path between the wireless communication circuit (220) and the contact member. An RF signal from the wireless communication circuit (220) may be fed to the conductive part (203) through the first conductive line, the second conductive line, and the contact member.

[0290] For example, the wireless communication circuit (220) may include a feed circuit for providing an RF signal. An output port of the feed circuit may be connected to the RF line structure (231). A plurality of layers of the PCB (250) may include at least one insulating layer and a plurality of metal layers. The wireless communication circuit (220) may be placed on a ground area of ​​the PCB (250) such that at least some of the plurality of metal layers overlap with the at least one insulating layer. The RF line structure (231) may be placed in an area of ​​the PCB (250) between the ground area and the conductive portion (203) such that, among the plurality of metal layers, only the RF line structure (231) overlaps with only the at least one insulating layer.

[0291] For example, the electronic device (101) may include an impedance matching circuit electrically connected to the RF line structure (231); and a second RF line structure electrically connected to the impedance matching circuit. The impedance matching circuit may be electrically connected to the contact member through the second RF line structure.

[0292] For example, the wireless communication circuit (220) may be placed on a first surface of the PCB (250). The contact member may be placed on a second surface of the PCB (250) opposite to the first surface. The impedance matching circuit may be placed on the second surface. The second RF line structure may include a third conductive line placed on the second surface.

[0293] For example, the wireless communication circuit (220) may be disposed on a first surface of the PCB (250). The contact member may be disposed on a second surface of the PCB (250) opposite to the first surface. The impedance matching circuit may be disposed on the first surface. The second RF line structure may include a third conductive line disposed on the first layer among the plurality of layers of the PCB (250); a fourth conductive line disposed on the second layer among the plurality of layers of the PCB (250); a third conductive via penetrating between the first layer and the second layer and coupled with a fifth portion of the third conductive line and a sixth portion of the fourth conductive line; and a fourth conductive via penetrating between the first layer and the second layer and coupled with a seventh portion of the third conductive line and an eighth portion of the fourth conductive line.

[0294] For example, the electronic device (101) may include a conductive pad having an 'L' shape that is coupled to the conductive portion (203). The wireless communication circuit (220) may be disposed on a first surface of the PCB (250). The contact member may be disposed on a second surface of the PCB (250) opposite to the first surface. The conductive pad may include a first surface coupled to a protruding portion of the conductive portion (203) and a second surface in contact with the contact member.

[0295] For example, the conductive portion (203) may be used as an antenna radiator for transmitting signals of multiple frequency bands. The multiple frequency bands may include frequency bands of approximately 3 GHz (gigahertz) or higher. The width of each conductive line of the conductive lines may be approximately 0.135 mm or more and approximately 0.165 mm or less, and the thickness of each conductive line of the conductive lines may be approximately 0.018 mm or more and approximately 0.022 mm or less.

[0296] For example, the contact member may include a support portion having a support surface, an elastic portion connected to the support portion, a connecting portion connected to the elastic portion and spaced apart from the support surface, a first bending portion connected to the connecting portion and having a curved shape, and a second bending portion extending from the first bending portion and having a curved shape. The first bending portion may be configured to contact a point of the support portion while pressure is applied to the contact member. The second bending portion may be configured to contact a point of the connecting portion or the first bending portion while pressure is applied to the contact member.

[0297] For example, the support surface of the support portion may be placed on one side of the PCB (250). The first bend portion may be placed to contact the conductive portion (203) or a component combined with the conductive portion (203).

[0298] For example, the contact member may include a second elastic portion connected to the support portion and a third bending portion connected to the second elastic portion and having a curved shape. The third bending portion may be configured to contact the first bending portion while pressure is applied to the contact member.

[0299] For example, the electronic device (101) may include a radiator; an FPCB (250) (flexible printed circuit board) connected to the radiator, the FPCB (250) may include a line portion including a strip line and a feed portion including a conductive pattern; and a conductive structure disposed on the conductive pattern in the feed portion.

[0300] For example, it may include first conductive plates disposed on a first set of layers among a plurality of layers of the PCB (250); second conductive plates disposed on a second set of layers among a plurality of layers of the PCB (250); a fifth conductive via for electrically connecting the first conductive plates; and a sixth conductive via for electrically connecting the second conductive plates. The first set of layers and the second set of layers may be arranged alternately with each other. The first conductive plates may be connected to the contact member. The second conductive plates may be connected to the RF line structure (231).

[0301] For example, the contact member may be disposed on one side of one of the first conductive plates. The RF line structure (231) may be electrically connected to a feed point formed on one of the second conductive plates.

[0302] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include: a conductive portion (203) used as an antenna radiator for a plurality of frequency bands; a PCB (250) (printed circuit board) comprising at least one insulating layer and a plurality of metal layers, wherein the PCB (250) comprises an RF line structure (231) for transmitting an RF (radio frequency) signal to the conductive portion (203); a wireless communication circuit (220) disposed on a ground area where at least a portion of the plurality of metal layers of the PCB (250) overlaps with the at least one insulating layer; an impedance matching circuit disposed on the PCB (250) and connected to the RF line structure (231); and a contact member disposed on the PCB (250) and electrically connecting the impedance matching circuit and the conductive portion (203). The RF line structure (231) may be disposed in an area of ​​the PCB between the ground area and the conductive portion (203), such that among the plurality of metal layers, only the RF line structure (231) overlaps with the at least one insulating layer. The RF line structure (231) may include a plurality of conductive lines disposed in the plurality of metal layers of the PCB (250); and a plurality of conductive vias for connecting each of the conductive lines.

[0303] For example, the RF line structure (231) may include: a first conductive line disposed on a first layer among the plurality of metal layers of the PCB (250); a second conductive line disposed on a second layer among the plurality of metal layers of the PCB (250); a first conductive via penetrating between the first layer and the second layer and coupled with a first portion of the first conductive line and a second portion of the second conductive line; and a second conductive via penetrating between the first layer and the second layer and coupled with a third portion of the first conductive line and a fourth portion of the second conductive line.

[0304] For example, each of the plurality of conductive lines of the RF line structure (231) can function as an inductor in the signal path between the wireless communication circuit (220) and the contact member. The plurality of frequency bands may include frequency bands of about 3 GHz (gigahertz) or higher.

[0305] For example, the contact member may include a support portion having a support surface, an elastic portion connected to the support portion, a connecting portion connected to the elastic portion and spaced apart from the support surface, a first bending portion connected to the connecting portion and having a curved shape, and a second bending portion extending from the first bending portion and having a curved shape. The first bending portion may be configured to contact a point of the support portion while pressure is applied to the contact member. The second bending portion may be configured to contact a point of the connecting portion or the first bending portion while pressure is applied to the contact member.

[0306] For example, the electronic device (101) may include a hinge assembly; a first housing part rotatably connected to the hinge assembly; and a second housing part rotatably connected to the hinge assembly. The conductive part (203) may be included in the first housing part. The PCB (250), the RF line structure (231), the impedance matching circuit, and the contact member may be disposed in the first housing part.

[0307] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include a conductive portion (203); a wireless communication circuit (220); a printed circuit board (PCB) (250) comprising a ground area (251) for the wireless communication circuit and a fill-cut area (253) formed between the ground area (251) and the conductive portion (203); a radio frequency (RF) line structure (231) formed in the fill-cut area (253) of the PCB and electrically connected to the wireless communication circuit (220); and a contact member (240; 1140) disposed on the PCB (250) and for electrically connecting the RF line structure (231) and the conductive portion (203). The RF line structure (231) may include conductive lines (330) comprising conductive lines disposed in each of at least two layers of a plurality of layers of the PCB (250); It may include a first conductive via (341) coupled to each of the above conductive lines (330); and a second conductive via (342) coupled to each of the above conductive lines (330).

[0308] For example, each of the conductive lines (330) may have the same shape. Each conductive line of the conductive lines (330) may include a first end adjacent to the wireless communication circuit (220) and the conductive part (203) and a second end adjacent to the conductive part (203) among the wireless communication circuit (220) and the conductive part (203). For each conductive line of the conductive lines (330), the first end may be coupled to the first conductive via (341). For each conductive line of the conductive lines (330), the second end may be coupled to the second conductive via (342). Two adjacent conductive lines of the conductive lines (330) may be spaced apart from each other by a predetermined interval in the direction in which the plurality of layers of the PCB (250) are stacked. The above-mentioned predefined spacing can be selected to maintain electrical insulation between adjacent conductive lines.

[0309] For example, each of the conductive lines (330) of the RF line structure (231) can be used as a signal path between the wireless communication circuit and the contact member (240; 1140). An RF signal from the wireless communication circuit can be fed to the conductive part (203) through each conductive line of the conductive lines (330) of the RF line structure (231) and the contact member (240; 1140).

[0310] For example, the wireless communication circuit may include a feed circuit for providing an RF signal. An output port of the feed circuit may be connected to the RF line structure (231). The ground region (251) may include a metal layer having a copper portion. The peel-cut region (253) may be formed so as not to include a copper portion other than the RF line structure (231) in the PCB (250) between the ground region (251) and the conductive portion (203).

[0311] For example, the electronic device (101) may include an impedance matching circuit (233) comprising at least one element connected to the RF line structure (231); and a second RF line structure connected to the impedance matching circuit (233). The impedance matching circuit (233) may be electrically connected to the contact member (240; 1140) through the second RF line structure.

[0312] For example, the wireless communication circuit may be disposed on a first surface of the PCB (250). The contact member (240; 1140) may be disposed on a second surface of the PCB (250) opposite to the first surface. The at least one element may be disposed on the second surface. The second RF line structure may include a conductive line disposed on the second surface.

[0313] For example, the wireless communication circuit may be disposed on a first surface of the PCB (250). The contact member (240; 1140) may be disposed on a second surface of the PCB (250) opposite to the first surface. The at least one element may be disposed on the first surface. The second RF line structure may include second conductive lines (350) formed across at least two of the plurality of layers; a third conductive via (361) connected to the second conductive lines; and a fourth conductive via (362) connected to the second conductive lines (350).

[0314] For example, the electronic device (101) may include a conductive pad having an 'L' shape that is coupled to the conductive portion (203). The wireless communication circuit may be disposed on a first surface of the PCB (250). The contact member (240; 1140) may be disposed on a second surface of the PCB (250) opposite to the first surface. The conductive pad may include a first surface coupled to a protruding portion of the conductive portion (203) and a second surface in contact with the contact member (240; 1140).

[0315] For example, the conductive portion (203) may be used as an antenna radiator for transmitting signals of multiple frequency bands. The multiple frequency bands may include frequency bands of approximately 3 GHz (gigahertz) or higher. The width of each conductive line of the conductive lines (330) may be approximately 0.135 mm or more and approximately 0.165 mm or less, and the thickness of each conductive line of the conductive lines (330) may be approximately 0.018 mm or more and approximately 0.022 mm or less.

[0316] For example, the contact member (240; 1140) may include a support portion having a support surface, an elastic portion connected to the support portion, a connecting portion connected to the elastic portion and spaced apart from the support surface, a first bending portion connected to the connecting portion and having a bent shape, and a second bending portion extending from the first bending portion and having a bent shape. The first bending portion may be configured to contact a point of the support portion while pressure is applied to the contact member (240; 1140). The second bending portion may be configured to contact a point of the connecting portion or the first bending portion while pressure is applied to the contact member (240; 1140).

[0317] For example, the support surface of the support portion may be placed on one side of the PCB (250). The first bend portion may be placed to contact the conductive portion (203) or a component combined with the conductive portion (203).

[0318] For example, the contact member (240; 1140) may include a second elastic portion connected to the support portion and a third bending portion connected to the second elastic portion and having a bent shape. The third bending portion may be configured to contact the first bending portion while pressure is applied to the contact member (240; 1140).

[0319] For example, the electronic device (101) may include a radiator; an FPCB (1600; 1700) (flexible printed circuit board) connected to the radiator, the FPCB (1600; 1700) may include a line portion including a strip line and a feed portion including a conductive pattern; and a conductive structure disposed on the conductive pattern in the feed portion.

[0320] For example, the electronic device (101) may include first conductive plates comprising a conductive plate disposed on each layer of a first set of layers of the PCB (250) in the peel-cut area (253); second conductive plates comprising a conductive plate disposed on each layer of a second set of layers of the PCB (250) in the peel-cut area (253); a first vertical via for electrically connecting the first conductive plates; and a second vertical via for electrically connecting the second conductive plates. The first set of layers and the second set of layers may be arranged alternately with each other. The first conductive plates may be connected to the contact member (240; 1140). The second conductive plates may be connected to the RF line structure (231).

[0321] For example, the contact member (240; 1140) may be disposed on one side of one of the first conductive plates. The RF line structure (231) may be electrically connected to a feed point formed on one of the second conductive plates.

[0322] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) comprises: a conductive portion (203) used as an antenna radiator for a plurality of frequency bands; a wireless communication circuit; a printed circuit board (PCB) (250) comprising a first region (251) including a ground for the wireless communication circuit and a second region (253) in which a metal layer is fill-cut at least partially between the first region (251) and the conductive portion (203), - the PCB (250) comprises an RF line structure (231) formed in the second region (253) for transmitting a radio frequency (RF) signal to the conductive portion -; and an impedance matching circuit (233) disposed on the PCB (250) and connected to the RF line structure (231). and may include a contact member (240; 1140) disposed on the PCB (250) and for electrically connecting the impedance matching circuit (233) and the conductive portion (203). The RF line structure (231) may include conductive lines comprising conductive lines disposed in each layer of a plurality of layers of the PCB (250); and conductive vias for connecting each of the conductive lines (330).

[0323] For example, each of the conductive lines (330) may have the same shape. Two adjacent conductive lines of the conductive lines (330) may be spaced apart from each other by a predetermined interval in the direction in which the plurality of layers of the PCB (250) are stacked. The conductive vias may include a first conductive via (341) adjacent to the wireless communication circuit among the wireless communication circuit (220) and the conductive portion (203), and a second conductive via (342) adjacent to the conductive portion (203) among the wireless communication circuit (220) and the conductive portion (203). The first conductive via (341) may be vertically arranged across the plurality of layers of the PCB (250). The second conductive via (342) may be vertically arranged across the plurality of layers of the PCB (250).

[0324] For example, each of the conductive lines of the RF line structure (231) can function as an inductor in the signal path between the wireless communication circuit and the contact member (240; 1140). The plurality of frequency bands may include frequency bands of about 3 GHz (gigahertz) or higher.

[0325] For example, the contact member (240; 1140) may include a support portion having a support surface, an elastic portion connected to the support portion, a connecting portion connected to the elastic portion and spaced apart from the support surface, a first bending portion connected to the connecting portion and having a bent shape, and a second bending portion extending from the first bending portion and having a bent shape. The first bending portion may be configured to contact a point of the support portion while pressure is applied to the contact member (240; 1140). The second bending portion may be configured to contact a point of the connecting portion or the first bending portion while pressure is applied to the contact member (240; 1140).

[0326] For example, the electronic device (101) may include a hinge assembly; a first housing part rotatably connected to the hinge assembly; and a second housing part rotatably connected to the hinge assembly. The conductive part (203) may be included in the first housing part. The PCB (250), the RF line structure (231), the impedance matching circuit (233), and the contact member (240; 1140) may be disposed in the first housing part.

[0327] For one or more embodiments, at least one of the components described in one or more of the prior art drawings may be configured to perform one or more operations, techniques, processes and / or methods as described in the present disclosure. For example, a processor (e.g., a baseband processor) described in the present disclosure in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described in the present disclosure. As another example, circuits associated with user equipment (UE), a base station, a network element, etc., as described above in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described herein.

[0328] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless otherwise explicitly stated. The foregoing description of one or more embodiments is for illustrative and explanatory purposes only, and is not intended to limit or exhaust the scope of the embodiments in the exact form disclosed. Modifications and variations are possible in light of the foregoing teachings or may be obtained from the practice of various embodiments.

[0329] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0330] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0331] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0332] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0333] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0334] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0335] The present disclosure proposes a multilayer RF line structure within a fill-cut area of ​​a PCB. By distributing conductive lines across at least two PCB layers and interconnecting them via conductive vias, the feed lines function like multiple inductors connected in parallel. Additionally, this design incorporates a contact structure with multiple contacts to ensure a more stable and efficient electrical connection between the RF line structure and the conductive antenna portion. The technical effect of this configuration is that the total inductance is reduced because the parallel-connected inductors reduce the composite impedance. This leads to improved impedance matching and reduces the adverse effects of long wiring lengths, thereby enhancing the antenna performance of advanced electronic devices. The device according to the present disclosure provides a more stable feed structure that supports modern form factors, such as foldable devices, while maintaining robust wireless communication capabilities.

[0336] The aspects of the present invention are as follows:

[0337] 1. An electronic device comprising: a conductive portion; a wireless communication circuit; a printed circuit board (PCB) including a ground area for the wireless communication circuit and a peel-cut area formed between the ground area and the conductive portion; a radio frequency (RF) line structure formed in the peel-cut area of ​​the PCB and electrically connected to the wireless communication circuit; and a contact member disposed on the PCB to electrically connect the RF line structure and the conductive portion. The RF line structure comprises conductive lines including conductive lines disposed on each of at least two of the plurality of layers of the PCB, a first conductive via connected to each conductive line, and a second conductive via connected to each conductive line.

[0338] 2. In the electronic device of the first aspect, the wireless communication circuit includes a feed circuit for providing an RF signal, the output port of the feed circuit is connected to the RF line structure, the ground region includes a metal layer having a copper portion, and the peel-cut region is formed so as not to include a copper portion other than the RF line structure in the PCB between the ground region and the conductive portion. In other words, the peel-cut region has almost no copper portion other than the RF line structure.

[0339] 3. An electronic device comprising: a conductive portion used as a multi-frequency band antenna radiator; a wireless communication circuit; a printed circuit board (PCB) comprising a first region having a ground for the wireless communication circuit and a second region in which at least a portion of a metal layer is peel-cut between the first region and the conductive portion; - the PCB comprises a radio frequency (RF) line structure formed in the second region to transmit an RF signal to the conductive portion -; an impedance matching circuit disposed on the PCB and connected to the RF line structure; and a contact member disposed on the PCB to electrically connect the impedance matching circuit and the conductive portion. The RF line structure comprises: conductive lines comprising conductive lines disposed on each layer of the multiple layers of the PCB, and conductive vias connecting each conductive line.

[0340] 4. In the electronic device of the third aspect, each conductive line has the same shape, and two adjacent conductive lines among the conductive lines are spaced apart from each other at a predetermined interval in the direction in which a plurality of layers of the PCB are stacked, and the conductive vias include a first conductive via adjacent to the wireless communication circuit and the conductive portion among the wireless communication circuit and a second conductive via adjacent to the conductive portion among the wireless communication circuit and the conductive portion, the first conductive via is arranged vertically across a plurality of layers of the first PCB, and the second conductive via is arranged vertically across a plurality of layers of the PCB.

[0341] 5. In the electronic device of the third or fourth aspect, each conductive line of the conductive lines of the RF line structure functions as an inductor in the signal path between the wireless communication circuit and the contact member, and the multiple frequency bands include a frequency band of about 3 GHz or higher.

[0342] 6. In an electronic device according to any one of the third to fifth aspects above, the contact member comprises a support portion having a support side, an elastic portion connected to the support portion, a connection portion connected to the elastic portion and spaced apart from the support side, a first bend portion connected to the connection portion and having a curved shape, and a second bend portion extending from the first bend portion and having a curved shape, wherein the first bend portion is configured to contact a point of the support portion while pressure is applied to the contact member, and the second bend portion is configured to contact a point of the connection portion or the first bend portion while pressure is applied to the contact member.

[0343] 7. An electronic device according to any one of the third to fifth aspects above comprises a hinge assembly, a first housing part rotatably connected to the hinge assembly, and a second housing part rotatably connected to the hinge assembly. The conductive portion is included in the first housing part, and a PCB, an RF line structure, an impedance matching circuit, and a contact member are disposed in the first housing part.

Claims

1. In an electronic device, A conductive part forming at least a portion of the side of the electronic device; Wireless communication circuit; A printed circuit board (PCB) comprising a plurality of layers on which the above-mentioned wireless communication circuit is arranged; RF (radio frequency) line structures disposed on multiple layers of the PCB and electrically connected to the wireless communication circuit; and It includes a contact member disposed on the PCB and for electrically connecting the RF line structure and the conductive portion, The above RF line structure is: A first conductive line disposed on the first layer among the plurality of layers of the PCB; A second conductive line disposed on the second layer among the plurality of layers of the PCB; A first conductive via penetrating between the first layer and the second layer and coupled to a first portion of the first conductive line and a second portion of the second conductive line; and A second conductive via penetrating between the first layer and the second layer and coupled to a third portion of the first conductive line and a fourth portion of the second conductive line, Electronic device.

2. In Claim 1, The first portion of the first conductive line includes the wireless communication circuit and a first end portion adjacent to the wireless communication circuit among the conductive portions, and The second portion of the second conductive line includes the wireless communication circuit and a second end adjacent to the wireless communication circuit among the conductive portions, and The third portion of the first conductive line includes the wireless communication circuit and a third end adjacent to the conductive portion among the conductive portions, and The fourth portion of the second conductive line comprises the wireless communication circuit and a fourth end adjacent to the conductive portion among the conductive portions, Electronic device.

3. In Claim 1, The first conductive line and the second conductive line are used as signal paths between the wireless communication circuit and the contact member, and The RF signal from the above wireless communication circuit is fed to the conductive portion through the first conductive line, the second conductive line, and the contact member. Electronic device.

4. In Claim 1, The above wireless communication circuit includes a feed circuit for providing an RF signal, and The output port of the above-mentioned power supply circuit is connected to the above-mentioned RF line structure, and The plurality of layers of the above PCB include at least one insulating layer and a plurality of metal layers, and The wireless communication circuit is disposed on a ground region of the PCB, wherein at least some of the plurality of metal layers overlap with at least one insulating layer, and The above RF line structure is disposed in an area of ​​the PCB between the ground region and the conductive portion, wherein, among the plurality of metal layers, only the RF line structure overlaps with the at least one insulating layer. Electronic device.

5. In Claim 1, An impedance matching circuit electrically connected to the above RF line structure; and It further includes a second RF line structure electrically connected to the above impedance matching circuit, and The above impedance matching circuit is electrically connected to the contact member through the above second RF line structure, Electronic device.

6. In Claim 5, The above wireless communication circuit is disposed on the first surface of the PCB, and The above contact member is disposed on a second surface opposite to the first surface of the PCB, and The above impedance matching circuit is disposed on the second plane, and The above second RF line structure includes a third conductive line disposed on the above second surface, Electronic device.

7. In Claim 5, The above wireless communication circuit is disposed on the first surface of the PCB, and The above contact member is disposed on a second surface opposite to the first surface of the PCB, and The above impedance matching circuit is disposed on the first surface, and The above second RF line structure is: A third conductive line disposed on the first layer among the plurality of layers of the PCB; A fourth conductive line disposed on the second layer among the plurality of layers of the PCB; A third conductive via penetrating between the first layer and the second layer and coupled to the fifth portion of the third conductive line and the sixth portion of the fourth conductive line; and A fourth conductive via penetrating between the first layer and the second layer and coupled to the seventh portion of the third conductive line and the eighth portion of the fourth conductive line, Electronic device.

8. In Claim 1, It further includes a conductive pad having an 'L' shape that is combined with the above-mentioned conductive part, and The above wireless communication circuit is disposed on the first surface of the PCB, and The above contact member is disposed on a second surface opposite to the first surface of the PCB, and The conductive pad comprises a first surface coupled to a protruding portion of the conductive part and a second surface in contact with the contact member. Electronic device.

9. In Claim 1, The above conductive part is used as an antenna radiator for transmitting signals of multiple frequency bands, and The above multiple frequency bands include frequency bands of approximately 3 GHz (gigahertz) or higher, and The width of each of the above conductive lines is approximately 0.135 mm or more and less than approximately 0.165 mm, and the thickness of each of the above conductive lines is approximately 0.018 mm or more and less than approximately 0.022 mm, Electronic device.

10. In Claim 1, The above contact member comprises a support portion having a support surface, an elastic portion connected to the support portion, a connecting portion connected to the elastic portion and spaced apart from the support surface, a first bending portion connected to the connecting portion and having a curved shape, and a second bending portion extending from the first bending portion and having a curved shape. The first bending portion is configured to contact a point of the support portion while pressure is applied to the contact member, and The second bend portion is configured to contact a point of the connection portion or the first bend portion while pressure is applied to the contact member. Electronic device.

11. In Claim 10, The support surface of the above support portion is disposed on one side of the PCB, and The first bend portion is positioned to contact the conductive portion or a part combined with the conductive portion, Electronic device.

12. In Claim 11, The above contact member further includes a second elastic portion connected to the support portion and a third bending portion connected to the second elastic portion and having a bent shape, and The third bend portion is configured to contact the first bend portion while pressure is applied to the contact member. Electronic device.

13. In Claim 1, Radiator; A flexible printed circuit board (FPCB) connected to the above-mentioned radiator, wherein the FPCB comprises a line portion including a strip line and a feed portion including a conductive pattern; and A conductive structure further comprising a conductive structure disposed on the conductive pattern in the above-mentioned power supply portion, Electronic device.

14. In Claim 1, First conductive plates disposed on a first set of layers among a plurality of layers of the PCB; Second conductive plates disposed on the second set of layers among the plurality of layers of the PCB above; A fifth conductive via for electrically connecting the first conductive plates; and It further includes a sixth conductive via for electrically connecting the second conductive plates, and The layers of the first set and the layers of the second set are arranged alternately with each other, The first conductive plates are connected to the contact member, and The above second conductive plates are connected to the RF line structure, Electronic device.

15. In Claim 14, The above contact member is disposed on one surface of one of the first conductive plates, and The above RF line structure is electrically connected to a feed point formed on one of the second conductive plates, Electronic device.

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