Wafer cleaning device and wafer holding and clamping apparatus

Abstract

The present application relates to the field of wafer and chip manufacturing devices, and discloses a wafer cleaning device and a wafer holding and clamping apparatus (100). The wafer holding and clamping apparatus (100) comprises a connecting base plate (1) connected to a process chamber of a cleaning device, a chuck base plate (2) connected to the connecting base plate (1), and a plurality of clamping assemblies (3) connected to the side of the chuck base plate (2) distant from the connecting base plate (1). Each clamping assembly (3) comprises a plurality of clamping portions (31) uniformly connected to the chuck base plate (2) in the circumferential direction of the chuck base plate (2) and used for clamping a wafer. The distance between each clamping portion (31) of the clamping assembly (3) and the center of the chuck base plate (2) is adapted to the radius of the wafer, so that the plurality of clamping assemblies (3) correspond one-to-one to a plurality of different sizes of wafers.

Description

Wafer cleaning equipment and wafer carrier clamping device Technical Field

[0001] This application relates to the field of wafer and chip manufacturing equipment, specifically to a wafer cleaning device and a wafer carrier clamping device. Background Technology

[0002] Third-generation semiconductor SiC (silicon carbide) is experiencing rapid development, becoming a crucial material for next-generation power semiconductor devices due to its superior performance in high-voltage, high-frequency, and high-temperature applications. Currently, 8-inch SiC wafer manufacturing technology has achieved breakthroughs and entered the small-batch production stage. However, due to the higher processing costs and relatively lower yield of 8-inch SiC wafers, the mainstream wafer manufacturing size remains concentrated at 6 inches. Nevertheless, with technological iteration and upgrades, wafer manufacturers are gradually demonstrating a need to simultaneously produce both 6-inch and 8-inch wafers to meet changing market and product demands.

[0003] In the wafer manufacturing process, single-wafer cleaning machines perform high-precision cleaning on individual wafers to ensure the quality of each process. The cleaning process is integrated throughout the entire wafer manufacturing process, including pre-diffusion cleaning, post-etching cleaning, post-ion implantation cleaning, resist removal cleaning, pre / post-film deposition cleaning, and post-mechanical polishing cleaning. These processes are crucial for removing particles, chemical residues, and contaminants generated during processing, ensuring the cleanliness of the wafer surface. For single-wafer cleaning machines, the chuck is a key component, its main function being to fix and hold the wafer, ensuring its stability during cleaning and drying processes, preventing displacement or vibration.

[0004] In some technologies known to the inventor, to meet the production needs of wafers of different sizes (such as 6-inch and 8-inch), the wafer carrier chuck is usually replaced to accommodate wafers of different specifications. However, this method is cumbersome, and frequent chuck replacements not only affect production efficiency but may also introduce contaminants during the replacement process, compromising the cleanliness of the equipment and affecting product yield and the long-term stability of the equipment.

[0005] Furthermore, SiC wafers exhibit stronger particle adhesion compared to traditional single-crystal silicon wafers. This is primarily due to the high hardness and surface energy of SiC material, which allows particles to adhere more firmly, especially tiny particles that are more difficult to remove. This places higher demands on cleaning equipment. During the cleaning process, greater friction is required in the brushing step to effectively remove these adhered particles. This also necessitates a larger clamping force from the wafer-carrying chuck to prevent relative slippage between the wafer and the chuck during brushing. If the chuck cannot provide sufficient clamping force, the wafer may move or vibrate, affecting the cleaning effect. Additionally, the required clamping force varies depending on the wafer thickness. Thicker wafers experience greater friction and inertial forces during rotation or brushing, thus requiring stronger clamping force to prevent displacement.

[0006] However, existing chuck designs typically provide a fixed, non-adjustable clamping force. This means that when processing wafers of different thicknesses or sizes, the chuck cannot flexibly adjust the clamping force according to specific needs, resulting in reduced cleaning efficiency and potentially damaging the wafers. Summary of the Invention

[0007] To address this issue, this application provides a wafer cleaning device and a wafer carrier clamping device to solve the problem that chucks in the prior art are difficult to be compatible with wafers of different sizes.

[0008] To achieve the above objectives, this application provides the following technical solution:

[0009] A wafer carrier clamping device includes a connecting base plate connected to a process chamber of a cleaning equipment, a chuck base plate connected to the connecting base plate, and a plurality of clamping assemblies connected to the side of the chuck base plate away from the connecting base plate. Each clamping assembly includes a plurality of clamping portions uniformly connected to the chuck base plate along the circumferential direction and used for clamping wafers. The distance between the clamping portion of the clamping assembly and the center of the chuck base plate is adapted to the radius of the wafer, so that the plurality of clamping assemblies correspond one-to-one with wafers of various different sizes.

[0010] In some embodiments, the clamping part includes a movable jaw connected to the chuck base plate and a plurality of stationary jaws connected to the chuck base plate. The stationary jaw includes a first support member connected to the chuck base plate and a first limiting block connected to the first support member. The first support member has a first support surface formed on its side away from the chuck base plate for supporting the edge of the wafer, and the first limiting block is connected to the first support surface. A plurality of first limiting blocks of the same clamping assembly form a limiting circle, and the radius of the limiting circle is larger than the radius of the wafer clamped by the clamping assembly. The movable jaw includes a second support member rotatably connected to the chuck base plate and a... A second limiting block is connected to the second support member. The second support member has a second support surface formed on the side away from the chuck base plate, and the second limiting block is connected to the second support surface. The connecting base plate is connected to a drive assembly for driving the second support member to rotate around the axis. The second limiting block is located on one side of the central axis of the axis. The drive assembly is used to drive the second limiting block to rotate around the axis and abut against the side wall of the wafer. Multiple first support surfaces of the same clamping assembly are coplanar. The first limiting block and second limiting block of one of two adjacent clamping assemblies near the center of the chuck base plate are lower than the first support surface of the other.

[0011] In some embodiments, the line connecting the clamping portions of two adjacent clamping assemblies passes through the center of the chuck base plate, and the multiple clamping portions of the two clamping assemblies correspond one-to-one.

[0012] In some embodiments, the drive assembly includes a motor connected to the connecting base plate, a rotary drive wheel rotatably connected to the output shaft of the motor via a first bearing, a plurality of elastic portions connected between the rotary drive wheel and the chuck base plate for pressing the second limiting block against the sidewall of the wafer by elastic force, and a plurality of drive portions connected between the rotary drive wheel and the chuck base plate for cooperating with the motor to overcome the elastic force of the elastic portions and disengage the second limiting block from the wafer. The chuck base plate is connected to the output shaft of the motor. The connecting base plate is connected to a sealing plate via a plurality of uprights. The sealing plate has clearance through holes that cooperate with the output shaft of the motor. The chuck base plate has a side plate integrally formed and sleeved on the sealing plate. The side plate, the chuck base plate, and the sealing plate form a receiving cavity for accommodating the rotary drive wheel.

[0013] In some embodiments, the first support member is connected to a connecting post, and the chuck base plate has multiple first through holes for the connecting posts to pass through. The end of the connecting post away from the first support member is inserted into the receiving cavity, and the inserted end is threadedly connected to a limiting nut that abuts against the chuck base plate. The multiple connecting posts and multiple first through holes correspond one-to-one. The chuck base plate has multiple second through holes, and the multiple second through holes correspond one-to-one with multiple movable jaws. The driving unit includes two driving members, two first driving plates, and a second driving plate. The two driving members are respectively connected to the movable jaws of two adjacent clamping assemblies, and the driving members pass through the second through holes. The end of the driving member away from the driving member is inserted into the receiving cavity, and the inserted end is rotatably connected to one end of the first driving plate. The two driving members and two first driving plates correspond one-to-one. The two ends of the second driving plate are respectively rotatably connected to the ends of the two first driving plates away from the driving members. The second driving plate is connected to a guide. The guide rod has a second bearing connected to one end away from the second drive plate. The rotary drive wheel has a guide groove, and the outer ring of the second bearing abuts against the groove wall. One end of the guide groove gradually extends from near the center of the rotary drive wheel to near the edge of the rotary drive wheel. The sealing plate has multiple cylinders connected to the side away from the receiving cavity, and the sealing plate has clearance holes that communicate with the receiving cavity and allow the output shaft of the cylinder to extend into the receiving cavity. The rotary drive wheel is connected to multiple limiting parts that cooperate with the output shaft of the cylinder. The limiting parts have limiting holes that cooperate with the output shaft of the cylinder. The multiple cylinders and the multiple limiting parts correspond one-to-one. The elastic part includes an elastic element with one end connected to the chuck base plate and the other end connected to the rotary drive wheel, and a limiting element connected to the rotary drive wheel and abutting against the chuck base plate. The limiting element abuts against the chuck base plate to keep the elastic element in a tensioned state. The second limiting block abuts against the edge of the wafer.

[0014] In some embodiments, the rotary drive wheel is integrally formed with multiple auxiliary components, one end of which extends to the edge of the rotary drive wheel. The side plate is integrally formed with multiple third limiting blocks. The multiple auxiliary components and the multiple third limiting blocks correspond one-to-one. The limiting component is threadedly connected to the part of the auxiliary component that extends out of the rotary drive wheel through a connecting rod. The side of the limiting component away from the connecting rod abuts against the third limiting block.

[0015] In some embodiments, the elastic element is a spring, the auxiliary element is connected to a first magnetic attractor, and the chuck base plate is connected to a second magnetic attractor, so that a magnetic attraction force is generated between the second magnetic attractor and the first magnetic attractor in conjunction with the spring.

[0016] In some embodiments, both the first magnetic attractor and the second magnetic attractor are annular permanent magnets, and their central axes are parallel. When the second limiting block is pressed against the edge of the wafer, the central axis of the second magnetic attractor is located on the side of the central axis of the first magnetic attractor closer to the spring.

[0017] In some embodiments, the driving member includes a bearing connected to the first driving plate and a spindle connected to the bearing. The chuck base plate is connected to a ring sleeve that mates with the second through hole. The second support member has a first connecting member integrally formed on the side away from the second limiting block for passing through the ring sleeve and the second through hole. The second support member has a sleeve plate integrally formed on the side away from the second limiting block. An annular groove for clamping the ring sleeve is formed between the sleeve plate and the first connecting member. The spindle is connected to the first connecting member via a rotating shaft.

[0018] In some embodiments, the mandrel has a threaded hole that passes through it, the first connector has a first receiving groove at the end away from the second support for embedding the end of the mandrel, the bottom of the first receiving groove has a threaded blind hole that matches the threaded hole, and the rotating shaft is a screw that passes through the threaded hole and the threaded blind hole in sequence.

[0019] In some embodiments, the bearing seat has a second receiving groove for accommodating one end of the mandrel, and a receiving hole for accommodating a nut that communicates with the second receiving groove and is used to accommodate the screw is provided on one side of the bearing seat. A first limiting plane that matches the groove wall of the first receiving groove is formed on the outer wall of one end of the mandrel, and a second limiting plane that matches the groove wall of the second receiving groove is formed on the outer wall of the other end of the mandrel.

[0020] In some embodiments, the drive component further includes a positioning sleeve fitted onto the mandrel, the positioning sleeve being connected to two wing plates connected to the chuck base plate by fasteners, and a plurality of third bearings being provided between the inner wall of the positioning sleeve and the outer wall of the mandrel.

[0021] This application also discloses a wafer cleaning apparatus, including the wafer carrier clamping device as described above.

[0022] Compared with the prior art, this application has at least the following beneficial effects:

[0023] The chuck base plate is connected to the process chamber of the cleaning equipment via a connecting base plate. Multiple clamping components on the chuck base plate are evenly distributed along the circumference. The distance between the clamping part and the center of the chuck base plate is adapted to the radius of the wafer, which can flexibly and reliably clamp and fix wafers of different sizes (such as 6-inch and 8-inch wafers), achieving compatibility of wafers of different specifications. This overcomes the cumbersome operation of frequently changing the wafer carrier chuck in the prior art. Since there is no need to change the chuck, the risk of particulate contamination inside the equipment is reduced, and the cleanliness of the equipment is maintained. Attached Figure Description

[0024] To more intuitively illustrate the prior art and this application, several exemplary figures are provided below. It should be understood that the specific shapes and structures shown in the figures should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary figures, those skilled in the art are able to easily make conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, size ratios, etc. of certain units (components).

[0025] Figure 1 is a schematic diagram of a wafer carrier clamping device provided in one or more embodiments for carrying a large-radius wafer;

[0026] Figure 2 is a schematic diagram of the structure of a wafer carrier clamping device for carrying small-radius wafers provided in one or more embodiments;

[0027] Figure 3 is a schematic diagram of the overall structure of the wafer carrier clamping device provided in one or more embodiments;

[0028] Figure 4 is a partial structural diagram of Figure 3;

[0029] Figure 5 is an enlarged view of point A in Figure 4;

[0030] Figure 6 is a top view of Figure 4;

[0031] Figure 7 is an enlarged view of section B in Figure 6;

[0032] Figure 8 is an enlarged view of point C in Figure 6;

[0033] Figure 9 is a partial structural schematic diagram of Figure 4;

[0034] Figure 10 is an enlarged view of point D in Figure 9;

[0035] Figure 11 is an enlarged view of point E in Figure 9;

[0036] Figure 12 is a schematic diagram of the motion state of a portion of the drive section of a wafer carrier clamping device provided in one or more embodiments;

[0037] Figure 13 is a schematic diagram of the rotating drive wheel of a wafer carrier clamping device provided in one or more embodiments;

[0038] Figure 14 is a partial structural schematic diagram of Figure 9;

[0039] Figure 15 is an enlarged view of point F in Figure 14;

[0040] Figure 16 is a partial cross-sectional view of the structure in Figure 3 along the aa direction;

[0041] Figure 17 is an enlarged view of point G in Figure 16;

[0042] Figure 18 is a partial cross-sectional view of the structure in Figure 3 along the bb direction;

[0043] Figure 19 is an enlarged view of section H in Figure 18;

[0044] Figure 20 is a schematic diagram of the chuck base plate of a wafer carrier clamping device provided in one or more embodiments;

[0045] Figure 21 is another perspective view of Figure 20;

[0046] Figure 22 is an exploded view of the drive unit, positioning sleeve, and moving jaw of the wafer carrier clamping device provided in one or more embodiments;

[0047] Figure 23 is a schematic diagram of the second support member of the wafer carrier clamping device provided in one or more embodiments;

[0048] Figure 24 is an exploded view of the drive component of a wafer carrier clamping device provided in one or more embodiments;

[0049] Figure 25 is a diagram showing the relative positions of the magnetic field lines of the first and second magnetic elements of the wafer carrier clamping device provided in one or more embodiments.

[0050] Explanation of reference numerals in the attached drawings: 100, wafer carrier clamping device; 1, connecting base plate; 11, upright; 12, sealing plate; 2, chuck base plate; 21, side plate; 22, first through hole; 23, second through hole; 231, limiting sleeve; 24, third limiting block; 3, clamping assembly; 31, clamping part; 311, moving jaw; 3111, second support member; 3111a, second support surface; 3112, second limiting block; 3113, first connecting member; 3113a, first receiving groove; 3113b, threaded blind hole; 3114, sleeve plate; 3115, annular groove; 3116, limiting ring; 312, stationary jaw; 3121, first support member; 3121a, first support surface; 3122, first limiting block; 3123, Connecting post; 313, Positioning sleeve; 3131, Wing plate; 314, Rotating shaft; 4, Rotary drive wheel; 41, Guide groove; 42, Auxiliary component; 43, Limiting part; 5, Drive part; 51, Drive component; 511, Shaft seat; 5111, Second receiving groove; 512, Mandrel; 5121, First limiting plane; 5122, Second limiting plane; 513, Third bearing; 52, First drive plate; 53, Second drive plate; 531, Guide rod; 532, Second bearing; 6, Elastic part; 61, Elastic component; 611, Support rod; 62, Limiting component; 621, Connecting rod; 63, First magnetic component; 64, Second magnetic component; 7, Motor; 71, First bearing; 8, Cylinder; 9, Wafer. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0052] In the description of this application: unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," "third," etc., in this application are intended to distinguish the objects referred to and do not have any special meaning in terms of technical connotation (e.g., they should not be construed as an emphasis on importance or order). Expressions such as "comprising," "including," and "having" also mean "not limited to" (certain units, components, materials, steps, etc.).

[0053] Referring to Figures 1-3, this application discloses a wafer carrier clamping device 100, including a connecting base plate 1 connected to the process cavity of a cleaning equipment, a chuck base plate 2 connected to the connecting base plate 1, and a plurality of clamping components 3 connected to the side of the chuck base plate 2 away from the connecting base plate 1. The clamping components 3 include a plurality of clamping parts 31 uniformly connected to the chuck base plate 2 along the circumferential direction and used for clamping wafers 9. The distance between the clamping parts 31 of the clamping components 3 and the center of the chuck base plate 2 is adapted to the radius of the wafer 9, so that the plurality of clamping components 3 correspond one-to-one with wafers 9 of various different sizes.

[0054] The chuck base plate 2 is connected to the process chamber of the cleaning equipment (not shown in the figure) via the connecting base plate 1. Multiple clamping components 3 on the chuck base plate 2 are evenly distributed along the circumference. The distance between the clamping part 31 and the center of the chuck base plate 2 is adapted to the radius of the wafer 9, which can flexibly and reliably clamp and fix wafers 9 of different sizes (such as 6-inch and 8-inch wafers 9), realizing the compatibility of wafers 9 of different specifications. This overcomes the cumbersome operation of frequently changing the wafer carrier chuck in the prior art. Since there is no need to change the chuck, the risk of particulate contamination inside the equipment is reduced, and the cleanliness of the equipment is maintained.

[0055] It should be noted that the wafer carrier clamping device 100 is suitable for various types of cleaning equipment in the semiconductor manufacturing process. The functions of these cleaning equipment include, but are not limited to, pre-diffusion cleaning, post-etching cleaning, post-ion implantation cleaning, resist removal cleaning, pre / post-film deposition cleaning, and post-mechanical polishing cleaning.

[0056] In some embodiments, the wafer carrier clamping device 100 is not only applicable to SiC wafers, but can also be used for cleaning and processing of wafers made of other materials such as single-crystal silicon wafers, sapphire, gallium nitride, gallium oxide, and quartz plates.

[0057] The cleaning equipment is not shown in the figure. The connection method between the cleaning equipment and the wafer carrier clamping device (connecting base plate 1) is the same as the connection method between the cleaning equipment and the wafer carrier chuck in the prior art.

[0058] Referring to Figures 3-7, the clamping part 31 includes a movable jaw 311 connected to the chuck base plate 2 and a plurality of stationary jaws 312 connected to the chuck base plate 2. The stationary jaw 312 includes a first support member 3121 connected to the chuck base plate 2 and a first limiting block 3122 connected to the first support member 3121. The side of the first support member 3121 away from the chuck base plate 2 is formed with a first support surface 3121a for supporting the edge of the wafer 9, and the first limiting block 3122 is connected to the first support surface 3121a. The plurality of first limiting blocks 3122 of the same clamping component 3 form a limiting circle, and the radius of the limiting circle is larger than the radius of the wafer 9 used by the clamping component 3 to clamp.

[0059] Referring to Figures 22 and 24, the movable gripper 311 includes a second support member 3111 rotatably connected to the chuck base plate 2 and a second limiting block 3112 connected to the second support member 3111. A second support surface 3111a is formed on the side of the second support member 3111 away from the chuck base plate 2, and the second limiting block 3112 is connected to the second support surface 3111a. The connecting base plate 1 is connected to a drive assembly for driving the second support member 3111 to rotate around the rotating shaft 314. The second limiting block 3112 is located on one side of the central axis of the rotating shaft 314. The drive assembly is used to drive the second limiting block 3112 to rotate around the rotating shaft 314 and abut against the sidewall of the wafer 9.

[0060] Multiple first support surfaces 3121a of the same clamping assembly 3 are coplanar, located in the inner and outer rings respectively, and in two adjacent clamping assemblies 3. The first limiting block 3122 and the second limiting block 3112 of one of the clamping assemblies 3, which are closer to the center of the chuck base plate 2, are both lower than the first support surface 3121a of the other. In the same clamping assembly 3, the second support surface 3111a is not higher than the first support surface 3121a.

[0061] When the clamping assembly 3 clamps the wafer 9, the mechanical claws transfer the wafer 9 from the previous station to the cleaning chamber of the cleaning equipment. Based on the radius of the wafer 9, the wafer 9 is placed on the corresponding clamping assembly 3. Specifically, the edge of the wafer 9 rests on the first support surface 3121a of multiple stationary grippers 312 of the same clamping assembly 3, and multiple first limiting blocks 3122 of these stationary grippers 312 form a limiting circle with a radius larger than the radius of the wafer 9. In this way, the multiple first limiting blocks 3122 provide coarse positioning for the wafer 9, meaning the wafer 9 is approximately confined within... Within the range of the limiting circle, it is convenient for the subsequent clamping of the moving gripper 311 and the precise picking and placing of the wafer by the mechanical claw. After the coarse positioning is completed, the drive component drives multiple second support members 3111 located on the same circumference to rotate around the rotating axis 314, so that the second limiting block 3112 rotates and abuts against the side wall of the wafer 9. Through the cooperation of the moving gripper 311 and the stationary gripper 312, the wafer 9 is clamped on the clamping component 3, preventing relative sliding between the wafer 9 and the clamping part 31 during the cleaning process. In particular, it is necessary to ensure the stability of the wafer 9 in the high friction or high speed rotation steps involved in the cleaning process.

[0062] Multiple first support surfaces 3121a of the same clamping assembly 3 are coplanar, providing uniform support force to the wafer 9, dispersing the weight of the wafer 9, preventing stress concentration, and reducing the risk of breakage; in addition, the first limiting block 3122 or the second limiting block 3112 of one of the two adjacent clamping assemblies 3 closest to the center of the chuck base plate 2 is lower than the first support surface 3121a of the other, so as to avoid spatial interference between the inner clamping assembly 3 and the outer clamping assembly 3 clamping the wafer 9; the mechanical gripper is the prior art, and the mechanical gripper clamps the wafer 9 and smoothly feeds it into the clamping assembly 3 in the process cavity.

[0063] In some embodiments, the second support surface 3111a of the same clamping assembly 3 may be lower than the first support surface 3121a; the clamping part 31 may include a movable jaw 311 and two stationary jaws 312, the two stationary jaws 312 are located on both sides of the movable jaw 311, the movable jaw 311 and the two stationary jaws 312 are arranged along the circumferential direction of the chuck base plate 2, the same clamping assembly 3 includes four clamping parts 31, and the included angle between adjacent clamping parts 31 is 90°.

[0064] In some embodiments, the number of moving jaws 311 and stationary jaws 312 and the arrangement angle between moving jaws 311 and stationary jaws 312 can be determined according to the specific clamping conditions of the wafer.

[0065] The line connecting the clamping parts 31 of two adjacent clamping assemblies 3 passes through the center of the chuck base plate 2, and the multiple clamping parts 31 of the two clamping assemblies 3 correspond one-to-one. In this way, the lines connecting the corresponding clamping parts 31 of multiple clamping assemblies 3 are collinear and all pass through the center of the chuck base plate 2. The clamping parts 31 of the clamping assemblies 3 are not staggered, so that a gap is formed between adjacent clamping parts 31 of the same clamping assembly 3, which facilitates the mechanical gripper to grasp the wafer 9.

[0066] Referring to Figures 4-15 and 20, the drive assembly includes a motor 7 connected to the connecting base plate 1, a rotary drive wheel 4 rotatably connected to the output shaft of the motor 7 via a first bearing 71, multiple elastic parts 6 connected between the rotary drive wheel 4 and the chuck base plate 2 for pressing the second limiting block 3112 against the side wall of the wafer 9 by elastic force, and multiple drive parts 5 connected between the rotary drive wheel 4 and the chuck base plate 2 for cooperating with the motor 7 to overcome the elastic force of the elastic parts 6 and disengage the second limiting block 3112 from the wafer 9. The chuck base plate 2 is connected to the output shaft of the motor 7. The connecting base plate 1 is connected to a sealing plate 12 via multiple uprights 11. The sealing plate 12 has a clearance through hole for cooperating with the output shaft of the motor 7. The chuck base plate 2 is integrally formed with a side plate 21 sleeved on the sealing plate 12. The side plate 21, the chuck base plate 2, and the sealing plate 12 form a receiving cavity for accommodating the rotary drive wheel 4.

[0067] The elastic part 6 causes multiple second limiting blocks 3112 to press against the side wall of the wafer 9, thereby clamping the wafer 9 with the clamping assembly 3. When the wafer 9 needs to be replaced or removed, the motor 7 drives the drive part 5, causing the second limiting blocks 3112 to overcome the elastic force of the elastic part 6 and disengage from the wafer 9. In this way, the clamping state of the second limiting blocks 3112 against the wafer 9 can be released. In addition, the sealing plate 12, the chuck base plate 2, and the side plate 21 form a receiving cavity for accommodating the rotary drive wheel 4. The receiving cavity is a sealed cavity, which can effectively prevent external particles, liquids, or other contaminants from entering the cavity, ensuring the long-term stable operation of the drive assembly and the rotary drive wheel 4.

[0068] The first support member 3121 is connected to a connecting post 3123. The chuck base plate 2 has multiple first through holes 22 for the connecting post 3123 to pass through. The end of the connecting post 3123 away from the first support member 3121 is inserted into the receiving cavity, and the inserted end is threaded with a limiting nut that abuts against the chuck base plate 2. The multiple connecting posts 3123 and the multiple first through holes 22 correspond one-to-one. The chuck base plate 2 has multiple second through holes 23, and the multiple second through holes 23 correspond one-to-one with the multiple moving jaws 311.

[0069] The driving unit 5 includes two driving members 51, two first driving plates 52, and a second driving plate 53. The two driving members 51 are respectively connected to the movable grippers 311 of two adjacent clamping assemblies 3, and the driving members 51 pass through the second through hole 23. The end of the driving member 51 away from the driving member 51 passes into the receiving cavity, and the passing end is rotatably connected to one end of the first driving plate 52. The two driving members 51 and the two first driving plates 52 correspond one-to-one. The two ends of the second driving plate 53 are respectively rotatably connected to the ends of the two first driving plates 52 away from the driving members 51. The second driving plate 53 is connected to a guide rod 531, which is away from the second driving plate 53. One end of the rotating drive wheel 4 is connected to a second bearing 532. The rotating drive wheel 4 has a guide groove 41. The outer ring of the second bearing 532 abuts against the groove wall of the guide groove 41. One end of the guide groove 41 gradually extends from the center near the rotating drive wheel 4 to the edge near the rotating drive wheel 4. The side of the sealing plate 12 away from the receiving cavity is connected to multiple cylinders 8. The sealing plate 12 has a clearance hole that communicates with the receiving cavity and is used for the output shaft of the cylinder 8 to extend into the receiving cavity. The rotating drive wheel 4 is connected to multiple limiting parts 43 that cooperate with the output shaft of the cylinder 8. The limiting parts 43 have limiting holes that cooperate with the output shaft of the cylinder 8. The multiple cylinders 8 and the multiple limiting parts 43 correspond one-to-one.

[0070] The elastic part 6 includes an elastic member 61 connected at one end to the chuck base plate 2 and at the other end to the rotary drive wheel 4, and a limiting member 62 connected to the rotary drive wheel 4 and abutting against the chuck base plate 2. The limiting member 62 abuts against the chuck base plate 2 so that the elastic member 61 is in a tensioned state, and the second limiting block 3112 abuts against the edge of the wafer 9.

[0071] When it is necessary to release the constraint of multiple second limiting blocks 3112 on the wafer 9, the control system controls the motor 7 to work. The motor 7 drives the chuck base plate 2 to rotate. Two driving components 51 are respectively connected to two moving jaws 311, and the driving components 51 pass through the second through hole 23. In this way, the rotation of the chuck base plate 2 will drive the two moving jaws 311 to rotate together with the driving components 51. The two driving components 51 are respectively connected to two first driving plates 52, and a second driving plate 53 is rotatably connected between the two first driving plates 52, so that the two first driving plates 52 and the second driving plate 53 form a linkage structure. The second bearing 532, connected to the second drive plate 53, is embedded in the guide groove 41. Since the rotary drive wheel 4 is rotatably connected to the output shaft of the motor 7 via the first bearing 71, the rotary drive wheel 4 does not rotate with the drive of the motor 7. The control system then controls the output shaft of the cylinder 8 to extend and insert into the limiting hole of the limiting part 43, thereby restricting the rotation of the rotary drive wheel 4. In this way, the chuck base plate 2 can rotate relative to the rotary drive wheel 4. One end of the guide groove 41 gradually extends from near the center of the rotary drive wheel 4 to near its edge. When the chuck base plate 2 rotates with the entire connecting rod structure, the first... The second drive plate 53, along with the guide rod 531 and the second bearing 532, also rotates. Due to the directional restriction of the guide rod 531 and the second bearing 532 by the guide groove 41, the second drive plate 53 rotates with the chuck base plate 2, causing it to gradually move from the center near the rotating drive wheel 4 towards its edge. During this process, the motor 7 rotates to overcome the elastic force of the elastic part 6, causing the connecting rod structure to "deform." That is, the second drive plate 53 pushes the two first drive plates 52 and the drive component 51 to rotate around the rotating shaft 314 (the central axis of the second through hole 23), causing the moving clamp... The second limiting block 3112 of the claw 311 disengages from the wafer 9. In Figure 12, the cc direction is the movement direction of the second drive plate 53. The two first drive plates 52 swing and drive the two drive components 51 to rotate. When the motor 7 stops working, the elastic element 61 of the elastic part 6 causes the chuck base plate 2 to rotate (previously, the motor 7 drove the elastic part 6 (spring) to be stretched, that is, the drive part 5 overcame the elastic force of the elastic element 61), and returns to the initial position. The second limiting block 3112 rotates again to press against the wafer 9. At this time, the elastic element 61 and the limiting element 62 form a force balance state, and the wafer 9 is in a clamped state.

[0072] It should be noted that the motor 7 rotates only in one direction. That is, the motor 7 releases the multiple second limit blocks 3112 from restricting the wafer 9 through the drive unit 5. When the motor 7 stops working, the elastic part 6 returns to its initial position, and the multiple second limit blocks 3112 re-clamp the wafer 9. In addition, the control system can be the controller of the cleaning equipment or the controller of the wafer carrier clamping device. The control system can be remotely controlled.

[0073] Referring to Figures 4, 6, 8, 16, 17, 18, and 19, the rotating drive wheel 4 is integrally formed with multiple auxiliary parts 42. One end of the auxiliary part 42 extends to the edge of the rotating drive wheel 4. The side plate 21 is integrally formed with multiple third limiting blocks 24. The multiple auxiliary parts 42 and the multiple third limiting blocks 24 correspond one-to-one. The limiting part 62 is threadedly connected to the part of the auxiliary part 42 that extends out of the rotating drive wheel 4 through the connecting rod 621. The side of the limiting part 62 away from the connecting rod 621 abuts against the third limiting block 24.

[0074] One end of the limiting member 62 is connected to the auxiliary member 42, and the other end abuts against the third limiting block 24, forming a force balance with the elastic member 61. The limiting member 62 is threadedly connected to the auxiliary member 42 through the connecting rod 621. Thus, rotating the limiting member 62 can adjust the distance between the limiting member 62 and the auxiliary member 42, thereby adjusting the elastic force of the elastic member 61 and the relative position between the rotation drive wheel 4 and the chuck base plate 2, causing the connecting rod structure to deform accordingly. This allows for fine adjustment of the degree to which the second limiting block 3112 presses against the wafer 9. Especially for some thicker wafers 9, the degree of pressing against the wafer 9 can be increased, increasing the clamping friction. The greater friction can ensure the stability of the wafer 9 during cleaning or processing, avoiding movement or damage to the wafer 9 due to relative sliding or vibration.

[0075] One end of the elastic element 61 is connected to the support rod 611, and the other end is connected to the auxiliary element 42. The support rod 611 is connected to the chuck base plate 2. The elastic element 61 is not shown in some of the figures.

[0076] The elastic element 61 is a spring, the auxiliary element 42 is connected to the first magnetic element 63, and the chuck base plate 2 is connected to the second magnetic element 64, so that the second magnetic element 64 and the first magnetic element 63 generate a magnetic attraction force that works with the spring.

[0077] Due to the characteristics of springs, the greater the tension, the greater the elastic force, and the change is not linear. This means that when motor 7 overcomes the elastic force of the spring, the resistance of motor 7 will become greater and greater. Therefore, the magnetic attraction force generated between the second magnetic attraction member 64 and the first magnetic attraction member 63 serves as a supplement to the elastic force of the spring. That is, the magnetic attraction force, the elastic force of the spring, and the limiting member 62 together form a state of force equilibrium. The characteristic of the magnetic attraction force is that when the second magnetic attraction member 64 rotates out of the effective magnetic force range of the first magnetic attraction member 63, the magnetic attraction force rapidly decays, thus reducing the load on motor 7 to overcome the spring.

[0078] The first magnetic attractor 63 and the second magnetic attractor 64 are both annular permanent magnets. The central axes of the first magnetic attractor 63 and the second magnetic attractor 64 are parallel. When the second limiting block 3112 is pressed against the edge of the wafer 9, the central axis of the second magnetic attractor 64 is located on the side of the central axis of the first magnetic attractor 63 closer to the spring.

[0079] When the elastic part is in a state of force equilibrium, the second magnetic attractor 64 and the first magnetic attractor 63 are not aligned, but are offset in position, as shown in Figure 25. The dense magnetic field lines of the second magnetic attractor 64 and the dense magnetic field lines of the first magnetic attractor 63 overlap with each other, and the magnetic attraction force is strongest when set in this way.

[0080] In some embodiments, the first magnetic member 63 and the second magnetic member 64 may be electromagnets.

[0081] Referring to Figures 20-24, the drive component 51 includes a bearing 511 connected to the first drive plate 52 and a spindle 512 connected to the bearing 511. The chuck base plate 2 is connected to a limiting sleeve 231 that mates with the second through hole 23. The second support component 3111 has a first connecting member 3113 integrally formed on the side away from the second limiting block 3112 for passing through the limiting sleeve 231 and the second through hole 23. The second support component 3111 has a sleeve plate 3114 integrally formed on the side away from the second limiting block 3112. An annular groove 3115 for clamping the limiting sleeve 231 is formed between the sleeve plate 3114 and the first connecting member 3113. The spindle 512 is connected to the first connecting member 3113 through the rotating shaft 314. The second drive plate 53 pushes the first drive plate 52 to rotate. The first drive plate 52 rotates together with the bearing seat 511 and the spindle 512. The spindle 512 then drives the second support member 3111 and the second limiting block 3112 to rotate through the rotating shaft 314. The limiting sleeve 231 can restrict the rotation of the spindle 512, thereby avoiding inaccurate positioning or potential damage to the wafer 9 due to unstable rotation.

[0082] The spindle 512 has a threaded hole that passes through it. The first connector 3113 has a first receiving groove 3113a for inserting the end of the spindle 512 at the end away from the second support 3111. The bottom of the first receiving groove 3113a has a threaded blind hole 3113b that matches the threaded hole. The rotating shaft 314 is a screw that passes through the threaded hole and the threaded blind hole 3113b in sequence.

[0083] The screw's screw direction is opposite to the rotation direction of the chuck base plate 2. This prevents the screw from loosening or even falling off due to the reaction force generated by the rotation of the chuck base plate 2 during rotation.

[0084] The bearing seat 511 has a second receiving groove 5111 for accommodating one end of the mandrel 512. One side of the bearing seat 511 has a receiving hole for a nut that connects to the second receiving groove 5111 and is used to accommodate a screw. One end of the outer wall of the mandrel 512 has a first limiting plane 5121 that mates with the groove wall of the first receiving groove 3113a. The other end of the outer wall of the mandrel 512 has a second limiting plane 5122 that mates with the groove wall of the second receiving groove 5111. The first limiting plane 5121 and the second limiting plane 5122 are formed by a milling process, which prevents the mandrel 512 from rotating relative to the bearing seat 511 and the first connecting member 3113.

[0085] The drive component 51 also includes a positioning sleeve 313 sleeved on the spindle 512. The positioning sleeve 313 is connected to two wing plates 3131 that are fastened to the chuck base plate 2. Multiple third bearings 513 are provided between the inner wall of the positioning sleeve 313 and the outer wall of the spindle 512. The third bearings 513 can limit the rotation of the spindle 512, prevent shaking, and improve the control accuracy of the second limit block 3112.

[0086] In some embodiments, the first connector 3113 may also be connected to a limiting ring 3116 abutting against the third bearing 513, which may enable the movement of multiple third bearings 513 in the circumferential direction.

[0087] This application also discloses a wafer cleaning apparatus, including the wafer carrier clamping device 100 as described above.

[0088] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

[0089] The present application has been described in a relatively specific and detailed manner above through general descriptions and specific embodiments. It should be understood that, based on the technical concept of the present application, several conventional adjustments or further innovations can be made to these specific embodiments; however, as long as they do not depart from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the protection scope of the claims of the present application.

Claims

1. A wafer carrier clamping device, characterized in that, The device includes a connecting base plate connected to the process chamber of a cleaning device, a chuck base plate connected to the connecting base plate, and multiple clamping assemblies connected to the side of the chuck base plate away from the connecting base plate. Each clamping assembly includes multiple clamping parts uniformly connected to the chuck base plate along the circumferential direction and used for clamping wafers. The distance between the clamping part of the clamping assembly and the center of the chuck base plate is adapted to the radius of the wafer, so that the multiple clamping assemblies correspond one-to-one with wafers of various different sizes. The clamping part includes a movable jaw connected to the chuck base plate and a plurality of stationary jaws connected to the chuck base plate. The stationary jaw includes a first support member connected to the chuck base plate and a first limiting block connected to the first support member. The first support member has a first support surface formed on the side away from the chuck base plate for supporting the edge of the wafer, and the first limiting block is connected to the first support surface. A plurality of first limiting blocks of the same clamping assembly form a limiting circle, and the radius of the limiting circle is larger than the radius of the wafer clamped by the clamping assembly. The movable gripper includes a second support member rotatably connected to the chuck base plate and a second limiting block connected to the second support member. The second support member has a second support surface formed on the side away from the chuck base plate, and the second limiting block is connected to the second support surface. The connecting base plate is connected to a drive assembly for driving the second support member to rotate around a rotating axis. The second limiting block is located on one side of the central axis of the rotating axis. The drive assembly is used to drive the second limiting block to rotate around the rotating axis and abut against the side wall of the wafer. The multiple first support surfaces of the same clamping assembly are all coplanar, and the first limiting block and the second limiting block of one of two adjacent clamping assemblies that are closer to the center of the chuck base plate are lower than the first support surface of the other.

2. The wafer carrier clamping device according to claim 1, characterized in that, The line connecting the clamping parts of two adjacent clamping assemblies passes through the center of the chuck base plate, and the multiple clamping parts of the two clamping assemblies correspond one-to-one.

3. The wafer carrier clamping device according to claim 2, characterized in that, The drive assembly includes a motor connected to the connecting base plate, a rotary drive wheel rotatably connected to the output shaft of the motor via a first bearing, a plurality of elastic parts connected between the rotary drive wheel and the chuck base plate for pressing the second limiting block against the side wall of the wafer by elastic force, and a plurality of drive parts connected between the rotary drive wheel and the chuck base plate for cooperating with the motor to overcome the elastic force of the elastic parts and disengage the second limiting block from the wafer. The chuck base plate is connected to the output shaft of the motor. The connecting base plate is connected to a sealing plate via a plurality of uprights. The sealing plate has a clearance through hole that cooperates with the output shaft of the motor. The chuck base plate has an integrally formed side plate sleeved on the sealing plate. The side plate, the chuck base plate, and the sealing plate form a receiving cavity for accommodating the rotary drive wheel.

4. The wafer carrier clamping device according to claim 3, characterized in that, The first support member is connected to a connecting post. The chuck base plate has multiple first through holes for the connecting post to pass through. The end of the connecting post away from the first support member is inserted into the receiving cavity, and the inserted end is threaded with a limiting nut that abuts against the chuck base plate. The multiple connecting posts and the multiple first through holes correspond one-to-one. The chuck base plate has multiple second through holes, and the multiple second through holes correspond one-to-one with the multiple moving jaws. The driving unit includes two driving members, two first driving plates, and a second driving plate. The two driving members are respectively connected to the movable grippers of two adjacent clamping assemblies. Each driving member passes through a second through hole, with one end of the driving member away from the driving member extending into the receiving cavity, and the inserted end rotatably connected to one end of the first driving plate. The two driving members and the two first driving plates correspond one-to-one. Both ends of the second driving plate are rotatably connected to the ends of the two first driving plates away from the driving members. A guide rod is connected to the second driving plate, and the end of the guide rod away from the second driving plate is connected to a first... The second bearing has a guide groove on the rotating drive wheel. The outer ring of the second bearing abuts against the groove wall of the guide groove. One end of the guide groove gradually extends from near the center of the rotating drive wheel to near the edge of the rotating drive wheel. A plurality of cylinders are connected to the side of the sealing plate away from the receiving cavity. The sealing plate has a clearance hole that communicates with the receiving cavity and allows the output shaft of the cylinder to extend into the receiving cavity. The rotating drive wheel is connected to a plurality of limiting parts that cooperate with the output shaft of the cylinder. The limiting parts have limiting holes that cooperate with the output shaft of the cylinder. The plurality of cylinders and the plurality of limiting parts correspond one-to-one. The elastic part includes an elastic element connected at one end to the chuck base plate and at the other end to the rotary drive wheel, and a limiting element connected to the rotary drive wheel and abutting against the chuck base plate. The limiting element abuts against the chuck base plate to keep the elastic element in a tensioned state, and the second limiting block abuts against the edge of the wafer.

5. The wafer carrier clamping device according to claim 4, characterized in that, The rotating drive wheel is integrally formed with multiple auxiliary parts, one end of which extends to the edge of the rotating drive wheel. The side plate is integrally formed with multiple third limiting blocks. The multiple auxiliary parts and the multiple third limiting blocks correspond one-to-one. The limiting parts are threadedly connected to the part of the auxiliary parts that extends out of the rotating drive wheel through connecting rods. The side of the limiting parts away from the connecting rods abuts against the third limiting blocks.

6. The wafer carrier clamping device according to claim 5, characterized in that, The elastic element is a spring, the auxiliary element is connected to a first magnetic attractor, and the chuck base plate is connected to a second magnetic attractor, so that the second magnetic attractor and the first magnetic attractor generate a magnetic attraction force that cooperates with the spring.

7. The wafer carrier clamping device according to claim 6, characterized in that, Both the first magnetic attractor and the second magnetic attractor are annular permanent magnets. The central axes of the first magnetic attractor and the second magnetic attractor are parallel. When the second limiting block is pressed against the edge of the wafer, the central axis of the second magnetic attractor is located on the side of the central axis of the first magnetic attractor closer to the spring.

8. The wafer carrier clamping device according to claim 4, characterized in that, The driving component includes a bearing connected to the first driving plate and a spindle connected to the bearing. The chuck base plate is connected to a ring sleeve that mates with the second through hole. The second support member has a first connecting member integrally formed on the side away from the second limiting block for passing through the ring sleeve and the second through hole. The second support member has a sleeve plate integrally formed on the side away from the second limiting block. An annular groove for clamping the ring sleeve is formed between the sleeve plate and the first connecting member. The spindle is connected to the first connecting member via a rotating shaft.

9. The wafer carrier clamping device according to claim 8, characterized in that, The mandrel has a threaded hole that passes through it. The end of the first connector away from the second support has a first receiving groove for embedding the end of the mandrel. The bottom of the first receiving groove has a threaded blind hole that matches the threaded hole. The rotating shaft is a screw that passes through the threaded hole and the threaded blind hole in sequence.

10. The wafer carrier clamping device according to claim 9, characterized in that, The bearing seat has a second receiving groove for accommodating one end of the mandrel. One side of the bearing seat has a receiving hole that connects to the second receiving groove and is used to accommodate the nut of the screw. One end of the mandrel has a first limiting plane that matches the groove wall of the first receiving groove. The other end of the mandrel has a second limiting plane that matches the groove wall of the second receiving groove.

11. The wafer carrier clamping device according to claim 8, characterized in that, The drive component also includes a positioning sleeve fitted onto the spindle. The positioning sleeve is connected to two wing plates that are fastened to the chuck base plate. Multiple third bearings are provided between the inner wall of the positioning sleeve and the outer wall of the spindle.

12. A wafer cleaning device, characterized in that, Includes the wafer carrier clamping device according to any one of claims 1-8.

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